Electronic device and electrode included in the electronic device

Abstract

An electronic device is provided. The electronic device includes: a housing; a display visible through at least a portion of the front surface of the housing; a rear cover disposed on the rear surface of the housing; a first electrode disposed on a side surface of the housing; and a second electrode and a third electrode disposed at different locations on the rear cover. The first electrode, the second electrode, and the third electrode may comprise a conductive material, which is a compound comprising titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N).

Description

Technical Field

[0001] This disclosure relates to an electronic device and electrodes included in the electronic device. Background Technology

[0002] With increasing interest in health, electronic devices are being developed to provide the ability to measure a user's biometric information. For example, wearable electronic devices are equipped with various sensors capable of measuring a user's biometric information.

[0003] A user's biometric information can be measured by identifying electrical signals flowing through the user's body or by applying electrical signals to the user's body. To identify or apply electrical signals, electronic devices may include electrodes that contact the user's body. Summary of the Invention

[0004] Technical issues

[0005] Electrodes included in electronic devices may be directly exposed to the external environment. Therefore, electrodes should be able to withstand changes in the external environment (e.g., changes in temperature, humidity, or light).

[0006] To remove noise generated during the measurement of bioelectrical signals, filters such as high-pass filters (HPF) and low-pass filters (LPF) are used, but there may be limitations in removing such noise. To improve the quality of the measured biosignals, electrodes with a constant surface potential resistance distribution and low resistance are required.

[0007] Furthermore, electrodes, including those in electronic devices, are likely to be damaged when exposed to the external environment. If the electrodes are damaged, the quality of biosignal measurements may be degraded.

[0008] The above information is presented as background information only to aid in understanding this disclosure. No determination or assertion is made regarding whether any of the above content can be applied to this disclosure as prior art.

[0009] Solution to the problem

[0010] The aspects of this disclosure at least address the problems and / or disadvantages mentioned above and at least provide the advantages described below. Therefore, one aspect of this disclosure is to provide an electrode that satisfies desired surface resistance and durability, and an electronic device including the electrode.

[0011] Additional aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of the presented embodiments.

[0012] According to one aspect of this disclosure, an electronic device is provided. The electronic device includes: a housing; a display visible through at least a portion of the front surface of the housing; a rear cover disposed on the rear surface of the housing; a first electrode disposed on a side surface of the housing; and a second electrode and a third electrode disposed at different positions on the rear cover. The first electrode, the second electrode, and the third electrode may comprise a conductive material, which is a compound comprising titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N).

[0013] According to another aspect of this disclosure, an electrode for an electronic device is provided. The electrode includes a first electrode disposed on a portion of a housing of the electronic device, and second and third electrodes disposed at different locations on a rear cover disposed on a rear surface of the housing. The first, second, and third electrodes may comprise a conductive material, which is a compound comprising titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N).

[0014] Beneficial effects of the invention

[0015] According to various embodiments of this disclosure, electrodes with excellent durability and high conductivity resulting from low surface resistance can be provided. These electrodes not only maintain their properties for extended periods even when exposed to the outside of electronic devices due to their excellent durability, but also enable accurate measurement of biosignals due to their low resistance.

[0016] Other aspects, advantages and salient features of this disclosure will become apparent to those skilled in the art from the following detailed description, which discloses various embodiments of the disclosure in conjunction with the accompanying drawings. Attached Figure Description

[0017] The above and other aspects, features, and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure;

[0019] Figure 2 This is a front perspective view showing a mobile electronic device according to an embodiment of the present disclosure;

[0020] Figure 3 This illustrates an embodiment according to the present disclosure. Figure 2 Rear perspective view of the electronic device;

[0021] Figure 4 This illustrates an embodiment according to the present disclosure. Figure 2 An exploded perspective view of an electronic device;

[0022] Figure 5A An electrocardiogram waveform according to an embodiment of the present disclosure is shown;

[0023] Figure 5B It is a graph showing an electrocardiogram waveform measured by an electronic device according to an embodiment of the present disclosure;

[0024] Figure 6A This is a diagram illustrating the composition of the conductive material included in an electrode according to an embodiment of the present disclosure;

[0025] Figure 6B It is a graph showing the electrical properties of a conductive material according to an embodiment of the present disclosure;

[0026] Figure 7A , Figure 7B and Figure 7C This is a perspective view showing the buttons of an electronic device according to various embodiments of the present disclosure;

[0027] Figure 8A This is a perspective view showing the state in which the printed circuit board, coil for wireless charging, and back cover of an electronic device are assembled according to an embodiment of the present disclosure;

[0028] Figure 8B According to an embodiment of this disclosure, along Figure 8A A cross-sectional view taken from line AA in the diagram;

[0029] Figure 9A This is a plan view showing a rear cover according to an embodiment of the present disclosure; and

[0030] Figure 9B According to an embodiment of this disclosure, along Figure 9A The cross-sectional view taken from line BB in the diagram.

[0031] In all the accompanying drawings, the same reference numerals are used to denote the same elements. Detailed Implementation

[0032] The following description, provided with reference to the accompanying drawings, is intended to aid in a comprehensive understanding of the various embodiments of this disclosure as defined by the claims and their equivalents. It includes various specific details to aid this understanding, but these will be considered exemplary only. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of this disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and structures may be omitted.

[0033] The terms and words used in the following description and claims are not limited to their documentary meaning, but are merely used by the inventors to enable a clear and consistent understanding of this disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this disclosure is provided for illustrative purposes only and is not intended to limit the purpose of this disclosure as defined by the appended claims and their equivalents.

[0034] It will be understood that the singular forms “a,” “an,” and “the” include plural indicators unless the context clearly indicates otherwise. Thus, for example, referring to “a component surface” includes referring to one or more such surfaces.

[0035] It will be understood that the singular form of a noun corresponding to an item may include one or more of that thing, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” may include any one or all possible combinations of the items listed together in the corresponding phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used simply to distinguish one part from another without otherwise limiting the parts (e.g., importance or order). It will be understood that if an element (e.g., the first element) is referred to as being “connected” to, “linked to”, “connected to”, or “attached to” another element (e.g., the second element), regardless of whether the terms “operationally” or “communically” are used, this means that the element can be connected to the other element directly (e.g., wired), wirelessly, or via a third element.

[0036] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment of the present disclosure.

[0037] Reference Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0038] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0039] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0040] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134. Non-volatile memory 134 may include internal memory 136 and external memory 138.

[0041] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0042] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0043] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0044] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0045] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0046] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0047] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0048] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0049] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0050] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0051] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0052] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0053] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0054] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0055] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0056] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0057] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0058] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0059] Figure 2 This is a front perspective view showing a mobile electronic device according to an embodiment of the present disclosure.

[0060] Figure 3 This illustrates an embodiment according to the present disclosure. Figure 2 Rear perspective view of the electronic device.

[0061] Figure 4 This illustrates an embodiment according to the present disclosure. Figure 2 An exploded perspective view of an electronic device.

[0062] Reference Figure 2 and Figure 3 Electronic device 200 (e.g., Figure 1 The electronic device 200 may include a housing 210 having a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. Furthermore, the electronic device 200 may include fastening members 250 and 260 connected to at least a portion of the housing 210 and configured to detachably attach the electronic device 200 to a user body part (e.g., wrist, ankle, etc.). According to another embodiment of this disclosure (not shown), the housing may refer to a structure forming some of the first surface 210A, the second surface 210B, and the side surface 210C. The first surface 210A may be formed at least partially of a substantially transparent front panel 201 (e.g., a polymer panel or glass panel including various coatings). The second surface 210B may be formed of a substantially opaque rear cover 207. The rear cover 207 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 210C may be formed of a side frame structure 206 (or “side member”) bonded to the front panel 201 and the rear cover 207 and having a metallic and / or polymeric composition. The rear cover 207 and the side frame structure 206 may be integrally formed with each other and have the same material (e.g., a metallic material such as aluminum), although other arrangements are possible. Fastening members 250 and 260 may be formed of various materials and shapes. For example, fastening members 250 and 260 may be integrally formed of fabric, leather, rubber, polyurethane, metal, ceramic, or any combination thereof, or formed of multiple unit links that are flexible to each other.

[0063] Electronic device 200 may include display 220 (see Figure 4 The electronic device 200 may include at least one of the following components: audio modules 205 and 208, sensor module 211, key input devices 202 and 290, and connector hole 209. At least one of these components (e.g., key input devices 202 and 290, connector hole 209, or sensor module 211) may be omitted. The electronic device 200 may also include other components not shown.

[0064] Display 220 may be exposed through a portion of front panel 201. Display 220 may have a shape corresponding to the shape of front panel 201 and may have various shapes, such as circular, elliptical, or polygonal. Display 220 may be adjacent to or combined with touch sensing circuitry, a pressure sensor capable of measuring touch intensity (or pressure), and / or a fingerprint sensor.

[0065] Audio modules 205 and 208 may include a microphone hole 205 and a speaker hole 208. The microphone hole 205 may contain a microphone for acquiring external sound, and may contain multiple microphones to detect the direction of sound. The speaker hole 208 may be used for an external speaker and a call receiver. The speaker hole 208 and microphone hole 205 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without a speaker hole 208.

[0066] Sensor module 211 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 200. Sensor module 211 may include a biometric sensor module 211 (e.g., a heart rate monitor (HRM) sensor) disposed on the second surface 210B of housing 210. Electronic device 200 may also include any other sensor modules (not shown), such as gesture sensors, gyroscope sensors, atmospheric pressure sensors, magnetic sensors, accelerometers, grip sensors, color sensors, infrared (IR) sensors, biometric sensors, temperature sensors, humidity sensors, and / or illuminance sensors.

[0067] Key input devices 202 and 290 may include a wheel key 202 disposed on a first surface 210A of housing 210 and rotatable in at least one direction, and / or a side key button 290 disposed on a side surface 210C of housing 210. The wheel key may have a shape corresponding to the shape of the front panel 201. One or both of the aforementioned key input devices 202 and 290 may be omitted; the omitted key input device may be implemented in another form, such as soft keys on display 220. Connector hole 209 is capable of accommodating a connector (e.g., a USB connector) for transmitting and / or receiving power and / or data to and from an external electronic device, and may include another connector hole (not shown) capable of accommodating a connector for transmitting and / or receiving audio signals to and from an external electronic device. Electronic device 200 may also include a connector cover (not shown) that covers at least a portion of connector hole 209 to prevent external foreign matter from flowing into the connector hole.

[0068] Fastening members 250 and 260 can be attached to and detached from at least a portion of housing 210 via locking members 251 and 261. Fastening members 250 and 260 may have a band or strip shape and may include one or more of a fixing member 252, a fixing member insertion hole 253, a band guide member 254, and a band support ring 255.

[0069] The fixing member 252 can be inserted into one of the fixing member insertion holes 253 to secure the housing 210 and the fastening members 250 and 260 to a part of the user's body (e.g., wrist, ankle, etc.). The guide member 254 can limit the range of motion of the fixing member 252 inserted into the fixing member insertion hole 253, allowing the fastening members 250 and 260 to maintain close contact with a part of the user's body. With the fixing member 252 inserted into the fixing member insertion hole 253, the support ring 255 can limit the range of motion of the fastening members 250 and 260.

[0070] Reference Figure 4 The electronic device 400 may include a side bezel structure 410, a wheel key 420, a front panel 201, a display 220, a first antenna 450, a support member 460 (e.g., a bracket), a battery 470, a first printed circuit board (PCB) 480, a sealing member 490, a rear panel 493, and fastening members 495 and 497. Some components of the electronic device 400 may be compatible with... Figure 2 or Figure 3 The components of the electronic device 200 shown are identical or similar, therefore their description is omitted below. A support member 460 is disposed within the electronic device 400 and may be connected to or integrated with the side bezel structure 410. The support member 460 may be formed of, for example, metallic and / or non-metallic (e.g., polymer) materials. The support member 460 may be coupled to the display 220 on one side and to the first PCB 480 on the other side. A processor, memory, and / or interface may be mounted on the first PCB 480. The processor may include one or more of a CPU, application processor (AP), graphics processing unit (GPU), sensor processor, or communication processor (CP).

[0071] The memory may include volatile or non-volatile memory. The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, and / or an audio interface. The interface can electrically or physically connect the electronic device 400 to an external electronic device and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0072] Battery 470 is a device for supplying power to at least one component of electronic device 400, and may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 470 may be disposed on a plane substantially the same as the first PCB 480. Battery 470 may be integrally disposed within electronic device 400, or may be detachably disposed from electronic device 400.

[0073] The first antenna 450 may be disposed between the display 220 and the support member 460. The first antenna 450 may include a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. For example, the first antenna 450 may perform short-range communication with external devices, wirelessly send and receive power required for charging, or transmit short-range communication signals or magnetic-based signals (including payment data). The antenna structure may also be formed by a portion or combination of the side bezel structure 410 and / or the support member 460.

[0074] The sealing member 490 may be located between the side frame structure 410 and the rear panel 493. The sealing member 490 may be configured to prevent moisture and foreign matter from flowing into the space surrounded by the side frame structure 410 and the rear panel 493 from the outside.

[0075] A second PCB 520 (e.g., a PCB, a flexible PCB (FPCB), or a rigid-flex PCB (RFPCB)) and a coil 530 for wireless charging can be disposed between a rear plate 493 and a rear cover 207. The second PCB 520 can be electrically connected to the first PCB 480 through holes formed in the rear plate 493. The wireless charging coil 530 can be configured to surround the outer periphery of the second PCB 520.

[0076] Electronic devices (e.g., Figure 1 Electronic device 101 in Figure 2 The electronic device 200 may include a housing 210, a display 220 visible through at least a portion of a first surface 210A (or front surface) of the housing 210, and a rear cover 207 disposed on a second surface 210B (or rear surface) of the housing 210.

[0077] Electronic devices may include multiple electrodes exposed to the outside, thus coming into contact with a user's body. For example, the electrodes may include a first electrode 281, a second electrode 282, and a third electrode 283. The number of electrodes included in an electronic device can vary widely. Hereinafter, a total of three electrodes will be described for the electronic device, but the number of electrodes included in the electronic device may be one, two, four, or more.

[0078] At least one of the electrodes 281, 282 and 283 of the electronic device 200 may be located at at least one of the following positions: key input device 202 or 290, side frame structure 206, display 220 or housing 210.

[0079] For example, the first electrode 281 can be disposed on the side surface 210C of the electronic device housing 210. Figure 2As shown, the first electrode 281 may be formed on at least one of the buttons 290 disposed on the side surface 210C of the housing 210. The buttons 290 disposed on the side surface 210C of the housing 210 may be physical buttons that are pressed by a user's body and move forward and backward relative to the housing 210, or touch buttons that recognize contact with the user's body. The buttons 290 may be formed of a conductive material, and the first electrode 281 may be formed on the buttons 290.

[0080] like Figure 3 As shown, the second electrode 282 and the third electrode 283 can be disposed on the rear cover 207 forming the rear surface 210B of the electronic device housing 210. The second electrode 282 and the third electrode 283 can be disposed at different positions on the rear cover 207. The second electrode 282 and the third electrode 283 can be electrically isolated from each other on the rear cover 207.

[0081] At least one of the first electrode 281, the second electrode 282, and the third electrode 283 may be an electrode that contacts the user's skin and is capable of measuring electrical signals based on the user's bodily activities. For example, at least one of the first electrode 281, the second electrode 282, and the third electrode 283 may contact the user's skin and measure electrical signals based on the user's heartbeat.

[0082] Figure 5A The electrocardiogram waveform is shown. Figure 5B It is a graph showing the electrocardiogram waveform measured by an electronic device according to various embodiments of the present disclosure.

[0083] Reference Figure 5A and Figure 5B Electrodes (e.g., Figure 2 and Figure 3 The first electrode 281, second electrode 282, or third electrode 283 can come into contact with the user's body and detect the user's bioelectrical signals. Electronic devices (e.g., Figure 4 The electronic device 400 can obtain information about the user's body from bioelectrical signals measured via electrodes. The bodily information measured by the electrodes can be information related to the heartbeat. For example, the electrodes can measure the user's electrocardiogram (ECG) signal. The heartbeat can be identified by electrical signals. When the myocardium contracts or relaxes, the action potential generated by the heartbeat propagates from the heart to the whole body. When electrodes are attached to different body parts, the potential difference of the current caused by the contraction or relaxation of the myocardium can be obtained. For example, when the myocardium is depolarized with each heartbeat, ECG measurements can be performed by detecting microscopic bioelectrical signals from the skin. The ECG signal can be plotted as a potential difference curve changing over time. Figure 5AAs shown, an ECG signal can be represented as an ECG waveform. An ECG waveform consists of P, Q, R, S, and T waves. The P wave represents the onset of atrial depolarization, the QRS complex represents ventricular depolarization, and the T wave represents normal ventricular repolarization. Figure 5A This shows the ideal ECG waveform per unit heart rate. Figure 5B It could be a graph showing the actual potential difference over time as measured by continuous heartbeats.

[0084] Since ECG signals are recorded by measuring the potential difference that changes over time, the quality of the ECG signal can be determined based on how well the potential difference follows the electrical signals of myocardial contraction and relaxation. The potential difference can be affected by differences in the materials used to form the electrodes that come into contact with the user's body. Each electrode material has a unique redox potential (or equilibrium redox potential). The redox potential is the potential value used to maintain an equilibrium state where no redox reaction occurs due to the same oxidation and reduction rates. If the electrodes used for ECG measurements at different sites on the user's body are made of different materials, the differences in redox potentials can be reflected in the ECG signal as is. Potential differences due to differences in the materials used to form the electrodes can be primarily reflected in the low-potential-difference portion of the ECG signal (e.g., ...). Figure 5B The potential difference is measured in the 0–0.2 mV range. Furthermore, when calculating the potential difference using electrodes placed at different locations on the user's body, the user's body acts as a resistor, and this resistance value is reflected in the ECG signal. Therefore, to reduce the resistance caused by the user's body, the signal transmission path of the electrodes can be made short. Additionally, to accurately measure the potential difference based on the bioelectrical signal, the electrodes should be able to measure sensitive changes in the bioelectrical signal, which may be related to the electrode's conductivity.

[0085] In order to measure ECG signals of a specific mass through electrodes included in an electronic device, multiple electrodes in contact with the user's body can be formed from the same material with high electrical conductivity.

[0086] When the electronic device according to various embodiments of this disclosure is a wrist-worn electronic device, the rear cover 207 disposed on the rear surface 210B of the housing 210 can contact the user's wrist when the electronic device is worn. The second electrode 282 and the third electrode 283 can be disposed on the rear cover 207 such that when the user wears the electronic device, the second electrode 282 and the third electrode 283 can contact the user's wrist. In this case, the fingers of the hand without the electronic device can contact the first electrode 281 disposed on the side surface 210C of the electronic device housing 210. For example, when wearing the electronic device, the first electrode 281 can contact the fingers of one hand, and the second electrode 282 and the third electrode 283 can contact the wrist of the other hand. Therefore, the ECG signal can be measured by the potential difference between electrodes disposed on different parts of the body.

[0087] The first electrode 281, the second electrode 282, and the third electrode 283 may comprise the same conductive material. As described above, when the same conductive material is used for the electrodes, the potential difference of the material itself decreases, thus allowing for the measurement of ECG signals of a specific quality. The conductive material included in the electrodes can have high conductivity, thereby effectively detecting minute changes in current in the skin. Electrodes included in electronic devices should not alter their properties, even when affected by external factors such as temperature, humidity, and light, and should be resistant to impact or corrosion due to exposure to the outside of the electronic device. Furthermore, electrodes in contact with the user's body can be formed from hypoallergenic materials with low skin irritation. For example, the conductive material for electrodes used in electronic devices can have high conductivity and high durability. For example, electrodes included in electronic devices can be electrodes with a Mohs hardness (MOHS) of 5 or greater.

[0088] Figure 6A This is a diagram illustrating the composition of the conductive material included in an electrode according to an embodiment of the present disclosure.

[0089] Reference Figure 6A The first electrode 281, the second electrode 282 and the third electrode 283 may include at least one material having high durability and high conductivity.

[0090] The first electrode 281, the second electrode 282, and the third electrode 283 may comprise at least one of oxide-based materials, nitride-based materials, and / or carbide-based materials. For example, oxide-based materials may include transparent materials such as indium tin oxide (ITO), tin oxide (SnO), zinc oxide (ZnO), and fluorine-doped tin oxide (FTO) and / or opaque materials such as titanium dioxide (TiO2). Nitride-based materials may include chromium nitride (CrN), chromium carbonitride (CrCN), chromium silicon carbonitride (CrSiCN), titanium nitride (TiN), titanium carbonitride (TiCN), chromium boron carbonitride (CrBCN), chromium boron silicon carbonitride (CrBSiCN), chromium titanium carbonitride (CrTiCN), chromium titanium silicon carbonitride (CrTiSiCN), chromium aluminum carbonitride (CrAlCN), and chromium aluminum silicon carbonitride (CrAlSiCN). Carbide-based materials may include tungsten carbide (WC) and titanium carbide (TiC).

[0091] The first electrode 281, the second electrode 282, and the third electrode 283 may use TiAlCrSiCN (hereinafter referred to as the "conductive material"), which is a compound containing titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N) as conductive materials. This conductive material can exhibit high durability and high electrical conductivity. The CrSiCN material containing chromium, silicon, carbon, and nitrogen has high electrical conductivity and high durability, thus it can be advantageous for surface coating. Adding titanium to the CrSiCN material improves electrical properties (e.g., electrical conductivity), and adding aluminum improves heat resistance, thereby improving durability.

[0092] Reference Figure 6A The composition of the conductive material according to various embodiments of this disclosure may include about 1% to 7% by weight of titanium (Ti), about 1% to 7% by weight of aluminum (Al), about 15% to 35% by weight of chromium (Cr), about 3% to 15% by weight of silicon (Si), about 8% to 25% by weight of carbon (C), and about 15% to 35% by weight of nitrogen (N). This composition may be that of a conductive material taking into account high electrical conductivity (e.g., surface resistance within 500 ohms) and high durability (e.g., Mohs hardness of 5 or higher). Figure 6A The components shown and described above do not limit the composition of the conductive material of this disclosure, and various modifications can be made within the scope apparent to those skilled in the art. The components of the electrodes (e.g., the first electrode 281, the second electrode 282, and the third electrode 283) may be different.

[0093] The above components can be adjusted according to the electrode placement location. For example, the composition of electrodes placed in locations with continuous contact with the user's body can be adjusted to increase durability, while the composition of electrodes placed in locations with intermittent contact with the user's body can be adjusted to increase conductivity. Increasing the titanium content can increase the conductivity of the conductive material, but may decrease its strength and hardness, and increase surface friction. The titanium content can be approximately 1% to 7% by weight. Increasing the aluminum content darkens the color and enhances heat resistance. However, if the aluminum content exceeds a certain threshold, the conductive material may have a reddish hue. The aluminum content can be approximately 1% to 7% by weight. Chromium can improve the corrosion resistance of the conductive material, but may increase its reflectivity. The chromium content can be approximately 15% to 35% by weight. Silicon can improve the hardness of the conductive material by smoothing the surface, but if the silicon content exceeds a certain threshold, the strength of the conductive material may decrease. The silicon content can be approximately 3% to 15% by weight. Carbon can darken the color of the conductive material. The carbon content can be approximately 8% to 25% by weight. Conductive materials containing a specific proportion of nitrogen can have improved hardness. The nitrogen content can be from approximately 15% to 35% by weight.

[0094] The composition of the conductive material can be adjusted by regulating several parameters in the deposition apparatus. Sputtering or electron beam deposition can be used. Typically, since the number of targets in the deposition apparatus chamber is limited, targets can be formed by using several materials individually or in combination, and the composition ratio can be adjusted by regulating several parameters in each chamber.

[0095] Titanium (Ti), aluminum (Al), chromium (Cr), and silicon (Si) can be used alone or in combination to form targets. For example, when titanium and aluminum are mixed to form a target, the composition ratio of the target (i.e., the titanium to aluminum ratio) can be from about 30-50% to about 50-70%. Chromium and silicon can be used alone or in combination to form targets. When chromium and silicon are mixed to form a target, the chromium to silicon ratio can be from about 40-60% to about 40-60%. Carbon can be used alone to form targets. Gaseous carbon can also be used. In this case, carbon can be obtained from acetylene (C₂H₂). In the case of nitrogen, gaseous nitrogen can be used.

[0096] The composition of the conductive material can be adjusted by the power of the target. For example, the target power can be approximately 2 to 5 kW for titanium or aluminum, approximately 1 to 6 kW for chromium, and approximately 2 to 8 kW for silicon. When the target is formed from a mixture of chromium and silicon, a power of approximately 4 to 8 kW can be used. When the target is formed from carbon, a power of approximately 3 to 6 kW can be used. When using gaseous carbon, the gas flow rate can be approximately 10 to 60 sccm, and when using gaseous nitrogen, the gas flow rate can be 30 to 400 sccm. Here, sccm is a unit of gas flow rate, an abbreviation for standard cubic centimeters per minute, which can represent the amount of gas contained in 1 cc of volume per minute under standard temperature and pressure (STP) conditions.

[0097] [Table 1]

[0098]

[0099] Table 1 shows a comparison of surface resistivity, resistance fluctuation, and surface hardness between TiAlCrSiCN containing titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N) and CrSiCN containing chromium (Cr), silicon (Si), carbon (C), and nitrogen (N).

[0100] In Table 1, the first material is a compound consisting of approximately 35% chromium, approximately 15% silicon, approximately 10% carbon, and approximately 40% nitrogen. The second material is a compound consisting of approximately 3% titanium, approximately 5% aluminum, approximately 35% chromium, approximately 11% silicon, approximately 12% carbon, and approximately 34% nitrogen. The third material is a compound consisting of approximately 6% titanium, approximately 4% aluminum, approximately 34% chromium, approximately 15% silicon, approximately 9% carbon, and approximately 32% nitrogen. The second and third materials can be understood as the conductive materials disclosed herein.

[0101] When measuring electrical signals caused by a user's physiological activities in contact with the user's skin, electrodes with low surface resistance and low resistance fluctuation are preferred. Comparing the first material with the second and third materials, it can be seen that the surface resistance and resistance fluctuation of the second and third materials are lower than those of the first material. Therefore, the second and third materials are advantageous for measuring biosignals compared to the first material. Furthermore, it can be seen that the surface hardness of the second and third materials is 5 on the Mohs scale, the same as the surface hardness of the first material.

[0102] Figure 6B This is a graph showing the electrical properties of a conductive material according to an embodiment of the present disclosure.

[0103] Reference Figure 6BGraph (a) shows the electrical properties of a compound according to the related art, which is composed of chromium (Cr), silicon (Si), carbon (C), and nitrogen (N) (hereinafter referred to as "the material according to the related art"). Figure 6B In the diagram, graph (b) shows the electrical properties of the conductive materials composed of titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N). These graphs show the changes in resistance, reactance, and phase of each material with frequency.

[0104] Reference Figure 6B As can be seen, the resistance of the conductive material is lower than that of the material according to related technologies across the entire frequency range. Since a higher quality signal can be received using a material with lower resistance, the conductive material is more advantageous than the material according to related technologies in receiving higher quality signals. Furthermore, it can be seen that the resistance of the material varies with frequency, while the resistance of the conductive material remains constant even as the frequency changes. Therefore, the conductive material can perform more stable measurements.

[0105] In the case of the aforementioned conductive material, it can be observed that the phase changes of current and voltage at different frequencies are small, and therefore the change in reactance is also small. On the other hand, in the case of this material, it can be observed that, according to related technologies, the phase changes of current and voltage at different frequencies are large, and the change in reactance is also relatively large. Compared to materials with large phase changes according to related technologies, conductive materials with small phase changes of current and voltage even in different frequency ranges can more stably measure electrical signals.

[0106] Figures 7A-7B This is a perspective view showing the buttons of an electronic device according to various embodiments of the present disclosure.

[0107] Reference Figure 7A According to various embodiments, the first electrode 281 may be formed on the button 290 (e.g., Figure 2 Button 290 is located on the housing of the electronic device (e.g., Figure 2 and Figure 3 The side surface of the housing 210 in the middle (e.g., Figure 2On the side surface 210C of the housing. Button 290 may be formed to insert into a hole formed in the housing. Button 290 may include a conductive material. To prevent button 290 from detaching from the housing, button 290 may have grooves 740 and 750 or recesses into which O-rings and E-rings are inserted. At least a portion of the outer surface 710 of button 290 may include a non-conductive material. For example, a portion of the outer surface 710 of button 290 may be formed of an organic material, a ceramic material, or a combination thereof. When a portion of the side surface 210C where button 290 is located includes a conductive material, at least a portion of the outer surface 710 of button 290 that contacts the conductive material of the side surface 210C may include a non-conductive material. Figure 7A As shown, the upper surface 720 and lower surface 730 of button 290 may not include non-conductive material.

[0108] Reference Figure 7B and Figure 7C The upper surface 720 of button 290 may be the part that contacts the user's body (e.g., the user's finger), and the lower surface 730 of button 290 may be the part that contacts the PCB (e.g., Figure 4 The terminal contact portion on the FPCB 520 (in which). At least one of the upper surface 720 and lower surface 730 of the button 290 may include the aforementioned conductive material (TiAlCrSiCN). For example, as Figure 7B As shown, the upper surface 720 of button 290 may include a conductive material, or as... Figure 7C As shown, both the upper surface 720 and the lower surface 730 of the button 290 can comprise conductive material. The upper surface 720 of the button 290, including the first electrode 281, can be exposed to the outside of the electronic device. If the exposed upper surface 720 comprises conductive material, the characteristic changes of the first electrode 281 due to external environmental factors can be reduced, because the conductive material has excellent durability and corrosion resistance. If the lower surface 730 of the button 290, which is in continuous contact with the terminals of the PCB 520, comprises conductive material with excellent durability, fatigue deterioration due to repeated contact can be reduced.

[0109] Figure 8A This is a perspective view showing the state in which the printed circuit board, the coil for wireless charging, and the back cover of an electronic device according to an embodiment of the present disclosure are combined.

[0110] Figure 8B According to an embodiment of this disclosure, along Figure 8A The cross-sectional view taken from line AA in the diagram.

[0111] Reference Figure 8AAt least a portion of the back cover 207 may be formed of a light-transmitting material. The back cover 207 may have a first surface 207A that substantially faces the PCB 520 and a second surface 207B that is opposite to the first surface 207A.

[0112] Reference Figure 8B At least a portion of the second electrode 282 and the third electrode 283 may be substantially disposed on the second surface 207B of the back cover 207. The second surface 207B of the back cover 207 may be a surface that comes into contact with the user's skin when the user wears the electronic device. When the user wears the electronic device, the second electrode 282 and the third electrode 283 disposed on at least a portion of the second surface 207B of the back cover 207 may come into contact with the user's skin. At least a portion of the second electrode 282 and the third electrode 283 may be deposited on the second surface 207B of the back cover 207 by various methods. For example, methods such as printing, sputtering deposition, or chemical vapor deposition (CVD) may be used to deposit at least a portion of the second electrode 282 and the third electrode 283 on the second surface 207B of the back cover 207. In one embodiment, the second electrode 282 and the third electrode 283 may comprise the aforementioned conductive material (TiAlCrSiCN).

[0113] The first connecting electrode 284-1 and the second connecting electrode 284-2 can be substantially disposed on the first surface 207A of the back cover 207. According to one embodiment of this disclosure, the first connecting electrode 284-1 and the second connecting electrode 284-2 may include the aforementioned conductive material (TiAlCrSiCN). According to another embodiment of this disclosure, since the first surface 207A of the back cover 207 is not exposed to the outside of the electronic device, the weight given to durability can be low when selecting the materials for the first connecting electrode 284-1 and the second connecting electrode 284-2 disposed on the first surface 207A. For example, the proportion of durability-considered materials (e.g., aluminum, chromium) contained in the conductive material can be low. The first connecting electrode 284-1 and the second connecting electrode 284-2 may include at least one of, for example, conductive paste (e.g., silver paste, conductive carbon paste), conductive film, and conductive polymer. For example, conductive paste has the advantages of high conductivity and low processing difficulty during surface mounting. The first connecting electrode 284-1 may be electrically connected to the second electrode 282, and the second connecting electrode 284-2 may be electrically connected to the third electrode 283. Such connections can be made in areas not exposed to the external environment after assembly. For example, refer to... Figure 8BThe connections can be made on the outer peripheral surface of the rear cover 207. In another example, each of the second electrode 282 and the third electrode 283 can extend along the outer peripheral surface of the rear cover 207 from the first surface 207A of the rear cover 207 to a portion of the second surface 207B of the rear cover 207, and then be electrically connected to each of the first connecting electrode 284-1 and the second connecting electrode 284-2 disposed on the second surface 207B of the rear cover 207.

[0114] The first connecting electrode 284-1 and the second connecting electrode 284-2 can be electrically connected to the first contact portion 560-1 and the second contact portion 560-2 respectively disposed on the PCB 520. The first contact portion 560-1 and the second contact portion 560-2 can be, for example, a washer, a C-clamp, a spring pin, or a connector. One end of the first contact portion 560-1 can be disposed on the PCB 520, and the other end of the first contact portion 560-1 can contact the first connecting electrode 284-1. Similarly, one end of the second contact portion 560-2 can be disposed on the PCB 520, and the other end of the second contact portion 560-2 can contact the second connecting electrode 284-2. (Refer to...) Figure 8B The first contact portion 560-1 and the second contact portion 560-2 can be formed in the direction from PCB 520 to rear cover 207 (e.g., in...). Figure 8B Extending in the -Y direction. The second electrode 282 and the third electrode 283 are electrically connected to the first connecting electrode 284-1 and the second connecting electrode 284-2, respectively, and the first connecting electrode 284-1 and the second connecting electrode 284-2 are electrically connected to the PCB 520 through the first contact portion 560-1 and the second contact portion 560-2, respectively. As a result, the second electrode 282 and the third electrode 283 can be electrically connected to the PCB 520. The signal processor 570 disposed on the PCB 520 can receive the bioelectrical signals measured by the second electrode 282 and the third electrode 283.

[0115] Figure 9A This is a plan view showing a rear cover according to an embodiment of the present disclosure.

[0116] Figure 9B According to an embodiment of this disclosure, along Figure 9A The cross-sectional view taken from line BB in the diagram.

[0117] Reference Figure 9A and Figure 9B For clarity, Figure 9BThe thickness of the second electrode 282 and the third electrode 283 shown is magnified. The second electrode 282 and the third electrode 283 are very thin, so the operational differences caused by the second electrode 282 and the third electrode 283 are not visible to the naked eye. For example, the thickness of the second electrode 282 and the third electrode 283 can be from about 1 μm to 100 μm.

[0118] Reference Figure 9A and Figure 9B At least a portion of the first connecting electrode 284-1 and the second connecting electrode 284-2 may be disposed in at least a portion of the first surface 207A of the rear cover 207. The first connecting electrode 284-1 and the second connecting electrode 284-2 may be disposed on the rear cover 207 so as to be connected to the second electrode 282 and the third electrode 283, respectively. Figure 9A The shapes of the first connecting electrode 284-1 and the second connecting electrode 284-2 shown are not considered limited and can be varied. At least a portion 1010 of the first surface 207A of the back cover 207 can be formed of a material with low transmittance to prevent the internal components of the electronic device from being visible through the back cover 207 formed of a light-transmitting material. At least a portion of the first connecting electrode 284-1 and the second connecting electrode 284-2 can be at least partially disposed on the portion 1010 of the first surface 207A of the back cover 207 formed of a material with low transmittance.

[0119] Reference Figure 9B The second electrode 282, which is substantially disposed on the second surface 207B of the back cover 207, may comprise two layers, 282-1 and 282-2. For example, the first layer 282-1 of the second electrode 282 may comprise the aforementioned conductive material (TiAlCrSiCN), and the second layer 282-2 may comprise a conductive material different from the first layer 282-1. The second layer 282-2 may be disposed between the first layer 282-1 and the second surface 207B of the back cover 207. Compared to the first layer 282-1, the second layer 282-2, which is not exposed to the outside, can be considered with less weight for durability or corrosion resistance. The second layer 282-2 may be formed of a metal or conductive paste with excellent electrical conductivity.

[0120] The second layer 282-2 of the second electrode 282 can extend along the outer peripheral surface of the rear cover 207 from the second surface 207B of the rear cover 207 to at least a portion of the first surface 207A of the rear cover 207. The second layer 282-2 of the second electrode 282 can then be electrically connected to the first connecting electrode 284-1 disposed on the first surface 207A of the rear cover 207.

[0121] The third electrode 283 may also include two layers 283-1 and 283-2. The first layer 283-1 and the second layer 283-2 of the third electrode 283 may have the same arrangement as the first layer 282-1 and the second layer 282-2 of the second electrode 282.

[0122] The second layer 283-2 of the third electrode 283 can extend along the outer peripheral surface of the rear cover 207 from the second surface 207B of the rear cover 207 to at least a portion of the first surface 207A of the rear cover 207. The second layer 283-2 of the third electrode 283 can then be electrically connected to the second connecting electrode 284-2 disposed on the first surface 207A of the rear cover 207.

[0123] According to various embodiments of this disclosure, an electronic device may include a housing, a display visible through at least a portion of the front surface of the housing, a rear cover disposed on the rear surface of the housing, a first electrode disposed on a side surface of the housing, and second and third electrodes disposed at different locations on the rear cover. The first, second, and third electrodes may include a conductive material, which is a compound comprising titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N).

[0124] At least one of the first electrode, the second electrode, and the third electrode may be an electrode that comes into contact with the user's skin and measures electrical signals based on the user's bioactivity.

[0125] The conductive material may include about 1% to 7% by weight of titanium (Ti), about 1% to 7% by weight of aluminum (Al), about 15% to 35% by weight of chromium (Cr), about 3% to 15% by weight of silicon (Si), about 8% to 25% by weight of carbon (C) and about 15% to 35% by weight of nitrogen (N).

[0126] The first electrode can be formed on the button mounted on the side surface of the housing and is made of a conductive material.

[0127] The button may include at least a portion of non-conductive material and at least another portion of the conductive material.

[0128] The back cover may have a first surface facing the printed circuit board and a second surface opposite to the first surface, and the second electrode and the third electrode may be substantially disposed on the second surface of the back cover. Furthermore, the electronic device may also include a first connection electrode substantially disposed on the first surface of the back cover and electrically connecting the second electrode to the printed circuit board, and a second connection electrode substantially disposed on the first surface of the back cover and electrically connecting the third electrode to the printed circuit board.

[0129] The second electrode and the first connecting electrode can be electrically connected to each other on the outer peripheral surface of the back cover, and the third electrode and the second connecting electrode can be electrically connected to each other on the outer peripheral surface of the back cover.

[0130] The first and second connecting electrodes may comprise materials or conductive pastes formed from chromium (Cr), titanium (Ti), gold (Au), silver (Ag), or combinations thereof.

[0131] The second electrode may include multiple layers of different conductive materials, and the third electrode may include multiple layers of different conductive materials.

[0132] Each of the second and third electrodes may include a stack of a first layer having the conductive material and a second layer having a conductive material different from the conductive material.

[0133] According to various embodiments of this disclosure, the electrodes of an electronic device may include a first electrode disposed on at least a portion of the housing of the electronic device and second and third electrodes disposed at different locations on a rear cover disposed on the rear surface of the housing. The first, second, and third electrodes may include a conductive material, which is a compound comprising titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N).

[0134] Furthermore, the back cover may have a first surface facing the printed circuit board of the electronic device and a second surface opposite to the first surface, and the second electrode and the third electrode may be substantially disposed on the second surface of the back cover. Additionally, the electrodes may include a first connection electrode substantially disposed on the first surface of the back cover and electrically connecting the second electrode to the printed circuit board, and a second connection electrode substantially disposed on the first surface of the back cover and electrically connecting the third electrode to the printed circuit board.

[0135] Although this disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device comprising: case; The display is visible through at least a portion of the front surface of the housing; A rear cover is disposed on the rear surface of the housing; The first electrode is disposed on the side surface of the housing; as well as The second and third electrodes are disposed at different positions on the rear cover. The first electrode, the second electrode, and the third electrode comprise conductive materials, wherein the conductive materials are compounds containing titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N), and The conductive material comprises 15% to 35% chromium (Cr) by weight, 3% to 15% silicon (Si) by weight, 8% to 25% carbon (C) by weight, and 15% to 35% nitrogen (N) by weight. At least one of the first electrode, the second electrode, and the third electrode is an electrode that comes into contact with the user's skin and measures electrical signals based on the user's bioactivity.

2. The electronic device of claim 1, wherein the conductive material further comprises 1% to 7% by weight of titanium (Ti) and 1% to 7% by weight of aluminum (Al).

3. The electronic device of claim 1, wherein the first electrode is formed on a button mounted on the side surface of the housing and is formed of a conductive material.

4. The electronic device of claim 3, wherein the button comprises a first portion of non-conductive material and a second portion of conductive material.

5. The electronic device according to claim 1, The back cover has a first surface facing the printed circuit board and a second surface opposite to the first surface. The second electrode and the third electrode are disposed on the second surface of the rear cover, and The electronic device further includes: A first connecting electrode is disposed on the first surface of the rear cover and electrically connects the second electrode to the printed circuit board. A second connecting electrode is disposed on the first surface of the rear cover and electrically connects the third electrode to the printed circuit board.

6. The electronic device according to claim 5, The second electrode and the first connecting electrode are electrically connected to each other on the outer peripheral surface of the rear cover, and The third electrode and the second connecting electrode are electrically connected to each other on the outer peripheral surface of the rear cover.

7. The electronic device of claim 5, wherein the first connection electrode and the second connection electrode comprise a material formed of chromium (Cr), titanium (Ti), gold (Au), silver (Ag), or a combination thereof.

8. The electronic device of claim 5, wherein the first connecting electrode and the second connecting electrode comprise a conductive paste formed of chromium (Cr), titanium (Ti), gold (Au), silver (Ag), or a combination thereof.

9. The electronic device according to claim 5, The second electrode comprises multiple layers with different conductive materials, and The third electrode comprises multiple layers of different conductive materials.

10. The electronic device of claim 5, wherein each of the second electrode and the third electrode comprises a stack having a first layer of the conductive material and a second layer of a conductive material different from the conductive material.

11. An electrode of an electronic device, comprising: The first electrode is disposed on a portion of the housing of the electronic device; and The second and third electrodes are disposed at different positions on the rear cover, which is located on the rear surface of the housing. The first electrode, the second electrode, and the third electrode comprise conductive materials, which are compounds containing titanium (Ti), aluminum (Al), chromium (Cr), silicon (Si), carbon (C), and nitrogen (N). At least one of the first electrode, the second electrode, and the third electrode is an electrode that comes into contact with the user's skin and measures electrical signals based on the user's bioactivity. The conductive material comprises 15% to 35% chromium (Cr) by weight, 3% to 15% silicon (Si) by weight, 8% to 25% carbon (C) by weight, and 15% to 35% nitrogen (N) by weight.

12. The electrode of claim 11, wherein the conductive material further comprises 1% to 7% by weight of titanium (Ti) and 1% to 7% by weight of aluminum (Al).

13. The electrode according to claim 11, The second electrode and the third electrode are disposed on the second surface of the rear cover of the electronic device, and The electrode further includes: A first connecting electrode is disposed on a first surface of the rear cover opposite to the second surface, and the second electrode is electrically connected to a printed circuit board facing the first surface. A second connecting electrode is disposed on the first surface of the rear cover and electrically connects the third electrode to the printed circuit board. The first connecting electrode and the second connecting electrode comprise materials formed from chromium (Cr), titanium (Ti), gold (Au), silver (Ag), or combinations thereof.

14. The electrode according to claim 11, The second electrode and the third electrode are disposed on the second surface of the rear cover of the electronic device, and The electrode further includes: A first connecting electrode is disposed on a first surface of the rear cover opposite to the second surface, and the second electrode is electrically connected to a printed circuit board facing the first surface. A second connecting electrode is disposed on the first surface of the rear cover and electrically connects the third electrode to the printed circuit board. The first connecting electrode and the second connecting electrode comprise conductive paste formed from chromium (Cr), titanium (Ti), gold (Au), silver (Ag), or a combination thereof.

15. The electrode according to claim 13, The second electrode comprises multiple layers with different conductive materials. The third electrode comprises multiple layers with different conductive materials, and Each of the second electrode and the third electrode comprises a stack of a first layer having the conductive material and a second layer having a conductive material different from the conductive material.

16. The electrode of claim 13, wherein the respective components of the first electrode, the second electrode, and the third electrode are selected according to the position of each electrode on the electronic device.

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