Camera module and electronic device

Abstract

The application discloses a camera module and electronic equipment, and belongs to the technical field of communication equipment. The camera module comprises a base frame, a photosensitive chip, a first substrate, a second substrate, a first guide column, a second guide column, a first driving mechanism and a second driving mechanism. The first guide column is arranged on the base frame. The first substrate is movably connected with the first guide column and moves along the extension direction of the first guide column. The second guide column is arranged on the first substrate. The second substrate is movably connected with the second guide column and moves along the extension direction of the second guide column. The photosensitive chip is arranged on the second substrate. The first driving mechanism is connected with the first substrate. The first driving mechanism drives the photosensitive chip to move through the first substrate and the second substrate. The second driving mechanism is connected with the second substrate. The second driving mechanism drives the photosensitive chip to move through the second substrate. The above scheme can solve the problem of poor image shooting quality of the electronic equipment.

Description

Technical Field

[0001] This application belongs to the field of communication equipment technology, specifically relating to a camera module and electronic device. Background Technology

[0002] With technological advancements, electronic devices (such as mobile phones and tablets) have developed significantly. As powerful tools, electronic devices have greatly facilitated users' lives and work. Camera functionality is a fundamental feature of electronic devices, fulfilling users' shooting needs. Camera functionality is typically achieved through the camera module of the electronic device.

[0003] In the process of realizing this invention, the inventors discovered the following problems with the related technology: users usually hold electronic devices to take pictures, and due to shaking during hand-held shooting, the image quality of the electronic device is poor. Summary of the Invention

[0004] The purpose of this application is to provide a camera module and electronic device that can solve the problem of poor image capture quality in electronic devices.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application provides a camera module, including a base frame, a photosensitive chip, a first substrate, a second substrate, a first guide post, a second guide post, a first driving mechanism, and a second driving mechanism;

[0007] The first guide post is disposed on the base frame, the first substrate is movably connected to the first guide post, and the first substrate moves along the extension direction of the first guide post;

[0008] The second guide post is disposed on the first substrate, the second substrate is movably connected to the second guide post, and the second substrate moves along the extension direction of the second guide post; the photosensitive chip is disposed on the second substrate.

[0009] The first driving mechanism is connected to the first substrate, and the first driving mechanism drives the photosensitive chip to move through the first substrate and the second substrate;

[0010] The second driving mechanism is connected to the second substrate, and the second driving mechanism drives the photosensitive chip to move through the second substrate.

[0011] This application also provides an electronic device, including the camera module described above.

[0012] In this embodiment, a first guide post is disposed on a base frame, and a first substrate is movably connected to the first guide post. Therefore, the first substrate can move relative to the base frame along the extension direction of the first guide post. Additionally, a second guide post is disposed on the first substrate, and the second substrate is movably connected to the second guide post. Therefore, the second substrate can move relative to the first substrate along the extension direction of the second guide post. A chip is disposed on the second substrate. Since the second substrate is movably connected to the first substrate via the second guide post, when the first substrate moves, it can drive the second substrate and the photosensitive chip to move together. Furthermore, since the second substrate is movably connected to the second guide post, the second substrate and the first substrate can also move relative to each other. Therefore, the second substrate can also independently drive the photosensitive chip to move. In this scheme, both the first and second substrates can drive the photosensitive chip to move, thereby compensating for the shake of the camera module and achieving image stabilization to improve the image capture quality of the electronic device. Attached Figure Description

[0013] Figure 1 This is an exploded view of the camera module disclosed in the embodiments of this application;

[0014] Figure 2 and Figure 3 This is a schematic diagram of the structure of the camera module disclosed in the embodiments of this application;

[0015] Figure 4 This is a top view of the camera module disclosed in the embodiments of this application.

[0016] Explanation of reference numerals in the attached figures:

[0017] 100-Base frame, 200-Photosensitive chip, 300-First substrate, 310-First clamping part, 320-First guide hole, 330-First clearance hole, 340-First mounting hole, 410-First magnet, 420-First coil, 430-Second magnet, 440-Second coil, 500-First guide post, 600-Second substrate, 610-Second clamping part, 620-Second guide hole, 630-Second mounting hole, 700-Second guide post, 800-Circuit board. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0020] The camera module provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0021] Please refer to Figures 1-4 This application discloses a camera module, which includes a base frame 100, a lens, a photosensitive chip 200, a first substrate 300, a second substrate 600, a first guide post 500, a second guide post 700, a first driving mechanism, and a second driving mechanism.

[0022] The base frame 100 provides a mounting base for other components of the camera module. A first guide post 500 is disposed on the base frame 100, and is fixed to the base frame 100. A first substrate 300 is movably connected to the first guide post 500, and the first substrate 300 moves along the extending direction of the first guide post 500; that is, the first substrate 300 moves relative to the base frame 100 along the extending direction of the first guide post 500.

[0023] The second guide post 700 is disposed on the first substrate 300, that is, the second guide post 700 is fixed on the first substrate 300. The second substrate 600 is movably connected to the second guide post 700, and the second substrate 600 moves along the extending direction of the second guide post 700. That is, the second substrate 600 moves relative to the first substrate 300 along the extending direction of the second guide post 700.

[0024] The photosensitive chip 200 is disposed on the second substrate 600. Optionally, the photosensitive chip 200 can be bonded to the second substrate 600; other methods of connection are also possible, which are not limited herein. The lens is disposed on the base frame 100, with the photosensitive chip 200 facing the lens. The photosensitive chip 200 can be electrically connected to the motherboard of the electronic device via a flexible circuit board. At this time, external light passes through the lens and enters the photosensitive chip 200. The photosensitive chip 200 converts the light signal into an electrical signal and transmits it to the motherboard of the electronic device, thereby realizing the shooting function of the camera module.

[0025] The first driving mechanism is connected to the first substrate 300, and drives the photosensitive chip 200 to move through the first substrate 300 and the second substrate 600. The second driving mechanism is connected to the second substrate 600, and drives the photosensitive chip 200 to move through the second substrate 600.

[0026] In the embodiments disclosed in this application, since the second substrate 600 is movably connected to the first substrate 300 via the second guide post 700, when the first driving mechanism drives the first substrate 300 to move, the first substrate 300 can drive the second substrate 600 and the photosensitive chip 200 to move together. Furthermore, since the second substrate 600 is movably connected to the second guide post 700, the second substrate 600 and the first substrate 300 can also move relative to each other. Therefore, when the second driving mechanism drives the second substrate 600 to move, the second substrate 600 can also independently drive the photosensitive chip 200 to move. Both the first substrate 300 and the second substrate 600 can drive the photosensitive chip 200 to move, thereby compensating for the shake of the camera module and achieving image stabilization to improve the image capture quality of the electronic device.

[0027] In addition, the first guide post 500 guides the first substrate 300, and the second guide post 700 guides the second substrate 600. Therefore, the first guide post 500 and the second guide post 700 can guide and limit the movement direction of the photosensitive chip 200, thereby improving the movement accuracy of the photosensitive chip 200 and preventing the photosensitive chip 200 from tilting or shifting during movement, thus making the image stabilization performance of the camera module better.

[0028] Furthermore, both the first substrate 300 and the second substrate 600 are movable, so the first substrate 300 and the second substrate 600 are not likely to affect each other, thereby enabling independent movement in two directions, which in turn enables the camera module to achieve compensation in two directions, thereby improving the image stabilization compensation range of the camera module.

[0029] In the embodiments disclosed in this application, the first substrate 300 and the second substrate 600 are connected by guide posts, so the first substrate 300 and the second substrate 600 can be stacked on each other, thereby making the camera module smaller and facilitating the miniaturization of the camera module.

[0030] In the specific image stabilization process of the aforementioned camera module, when the electronic device or the gyroscope inside the camera module detects that the camera module is tilted, the gyroscope will transmit the tilt angle and other data of the camera module to the control chip. The control chip will input the corresponding angle compensation amount, and the control chip will control the first substrate 300 and the second substrate 600 to move through the first drive mechanism and the second drive mechanism. The first substrate 300 and the second substrate 600 will drive the photosensitive chip 200 to move to achieve angle compensation, thereby realizing the image stabilization function of the camera module.

[0031] In the above embodiment, the first guide post 500 can be welded to the base frame 100. Of course, the first guide post 500 can also be connected to the base frame 100 in other ways, which is not limited herein. The connection method between the second guide post 700 and the first substrate 300 can be the same as the connection method between the first guide post 500 and the base frame 100.

[0032] Optionally, the extension direction of the first guide post 500 and the extension direction of the second guide post 700 can be parallel, that is, the moving direction of the first substrate 300 and the moving direction of the second substrate 600 are the same, thus increasing the compensation range of the jitter amount of the photosensitive chip 200 in the same direction.

[0033] Of course, the extension direction of the first guide post 500 can intersect the extension direction of the second guide post 700. In this case, the extension direction of at least one of the first guide post 500 and the second guide post 700 can be along the length or width direction of the photosensitive chip 200, and the extension direction of the other can be along the thickness direction of the photosensitive chip 200. That is, the extension direction of the other can be perpendicular to the photosensitive surface of the photosensitive chip 200. In this case, the guide post perpendicular to the photosensitive surface of the photosensitive chip 200 is used to realize the focusing function of the photosensitive chip 200.

[0034] In another alternative embodiment, the extending direction of the first guide post 500 may intersect the extending direction of the second guide post 700, and the plane containing the first guide post 500 and the second guide post 700 may be parallel to the plane containing the photosensitive chip 200. In this scheme, the photosensitive chip 200 can move along its plane, thus enabling the photosensitive chip 200 to move in two different directions, further improving the image stabilization range of the photosensitive chip 200.

[0035] Furthermore, the extending directions of the first guide post 500 and the second guide post 700 can be perpendicular. In this case, the extending direction of the first guide post 500 can be parallel to the length direction of the photosensitive chip 200, and the extending direction of the second guide post 700 can be parallel to the width direction of the photosensitive chip 200.

[0036] To further improve the image stabilization performance of the camera module, in another optional embodiment, the number of first guide posts 500 can be at least two. These at least two first guide posts 500 can be located on opposite sides of the first substrate 300, and their extending directions are parallel. In this solution, first guide posts 500 are provided on both sides of the first substrate 300. Therefore, the first guide posts 500 on both sides can uniformly support the first substrate 300, thereby preventing the first substrate 300 from tilting to one side during movement, and further improving the image stabilization performance of the camera module.

[0037] In the above embodiments, the first substrate 300 may have a first side and a second side arranged opposite to each other. The first side and the second side may have through guide holes. When the first substrate 300 is matched with the guide post, the first substrate 300 needs to be first fitted into the guide holes of the first side and the second side, and then the first guide post 500 and the base frame 100 are connected. Therefore, when the guide post and the base frame 100 are connected, the first substrate 300 is prone to interference with the base frame 100, which makes the installation difficult.

[0038] Based on this, in another optional embodiment, a first clamping part 310 can be provided on the first side, and a first guide hole 320 can be provided on the second side, extending along the extension direction of the first guide post 500. One first guide post 500 is clamped and connected to the first clamping part 310, and the other first guide post 500 can be fitted into the first guide hole 320. In this solution, the first clamping part 310 has an open structure, so it can be directly clamped onto the first guide post 500. In the specific assembly process, one of the first guide posts 500 can be fitted into the first guide hole 320 first, and then after the other components on the base frame 100 and the first guide post 500 are installed, the first guide post 500 on the other side is clamped into the first clamping part 310, so that the first substrate 300 will not affect the installation of other components of the base frame 100, thereby making the installation of the camera module easier.

[0039] Furthermore, the first clamping portion 310 can be a protruding structure extending from the first substrate 300. Therefore, the volume of the first clamping portion 310 is small, thereby reducing the overall volume of the first substrate 300 and optimizing the layout of the camera module. The second clamping portion 610 described below can also be a protruding structure, which will not be elaborated further.

[0040] In another optional embodiment, the number of second guide posts 700 can be at least two, and the at least two second guide posts 700 can be located on opposite sides of the second substrate 600, with the extension directions of the at least two second guide posts 700 being parallel. In this solution, second guide posts 700 are provided on both sides of the second substrate 600, so the second guide posts 700 on both sides can provide uniform support for the second substrate 600, thereby preventing the second substrate 600 from tilting to one side during movement, and further improving the image stabilization performance of the camera module.

[0041] In another alternative embodiment, the second substrate 600 may have a third side and a fourth side disposed opposite to each other. The third side may be provided with a second clamping part 610, and the fourth side may have a second guide hole 620 extending through the second guide post 700. One second guide post 700 may be clamped and connected to the second clamping part 610, and the other second guide post 700 may be fitted into the second guide hole 620.

[0042] In this design, the second clamping part 610 has an open structure, allowing it to be directly clamped onto the second guide post 700. During assembly, one of the second guide posts 700 can be first fitted into the second guide hole 620. Then, after all other components on the first substrate 300 and the second guide post 700 are installed, the other second guide post 700 is clamped into the second clamping part 610. This ensures that the second substrate 600 does not interfere with the installation of other components on the first substrate 300, thus reducing the difficulty of installing the camera module.

[0043] In another alternative embodiment, the first substrate 300 may have a first clearance hole 330, and at least a portion of the second substrate 600 may be located within the first clearance hole 330. In this solution, at least a portion of the second substrate 600 can be hidden within the first clearance hole 330, thereby reducing the stacking thickness of the first substrate 300 and the second substrate 600, and further reducing the size of the camera module.

[0044] In another optional embodiment, the first driving mechanism may include a first magnet 410 and a first coil 420, which may be disposed opposite to the first magnet 410. One of the first magnet 410 and the first coil 420 may be disposed on the base 100, and the other on the first substrate 300. The first coil 420 and the first magnet 410 can drive the first substrate 300 to move. The energized first coil 420 can generate an Ampere force in the magnetic field generated by the first magnet 410, and the Ampere force generated by the first coil 420 and the first magnet 410 can drive the first substrate 300 to move. In this scheme, when the direction of the current flowing through the first coil 420 is changed, the direction of the Ampere force changes, thereby making the photosensitive chip 200 more flexible in commutation and improving image stabilization performance.

[0045] In addition, compared to using components such as electric motors to drive the first substrate 300, the first coil 420 and the second coil 440 are smaller in size and have a simpler structure.

[0046] In another alternative embodiment, the second driving mechanism may include a second magnet 430 and a second coil 440, with the second coil 440 disposed opposite to the second magnet 430. One of the second magnet 430 and the second coil 440 may be disposed on the base frame 100, and the other may be disposed on the second substrate 600. The second coil 440 and the second magnet 430 can drive the second substrate 600 to move. This solution achieves the same effect as the solutions described above, and therefore will not be elaborated further.

[0047] In another alternative embodiment, the first driving mechanism can be a first driving motor, and the second driving mechanism can be a second driving motor. The first driving motor is disposed on the base frame 100, and the second driving motor is disposed on the first substrate 300. In this case, when the first driving motor drives the first substrate 300 to move, it is also necessary to drive the second driving motor to move. Of course, the first driving mechanism and the second driving mechanism can also be other power structures, which are not limited herein.

[0048] In another alternative embodiment, the first substrate 300 may have a first mounting hole 340, and the first magnet 410 or the first coil 420 may be located within the first mounting hole 340. The second substrate 600 may have a second mounting hole 630, and the second magnet 430 or the second coil 440 may be located within the second mounting hole 630. This embodiment can further reduce the size of the camera module, thereby further improving the slim and lightweight performance of the camera module.

[0049] In another optional embodiment, the camera module further includes a circuit board 800 disposed on the base frame 100. The first coil 420 and the second coil 440 can both be disposed on the circuit board 800. The first magnet 410 can be disposed on the first substrate 300, and the second magnet 430 can be disposed on the second substrate 600. In this solution, the circuit board 800 can be used to fix the first coil 420 and the second coil 440, and also to provide power to the first coil 420 and the second coil 440, thereby optimizing the circuit layout of the camera module.

[0050] Furthermore, since both the first substrate 300 and the second substrate 600 are movable components, when the first coil 420 and the second coil 440 are mounted on movable components, it is easy for the first coil 420 and the second coil 440 to be pulled along with their connected circuitry, which could easily lead to breakage of the first coil 420 and the second coil 440 and their connected circuitry. Therefore, both the first coil 420 and the second coil 440 are mounted on the base frame 100. With the base frame 100 stationary, the first coil 420 and the second coil 440 also remain stationary, thus reducing the likelihood of pulling on the first coil 420 and the second coil 440 and their connected circuitry, and consequently reducing the likelihood of breakage of the first coil 420 and the second coil 440 and their connected circuitry.

[0051] In another optional embodiment, the camera module disclosed in this application may further include at least one detection element. This detection element may be disposed on and electrically connected to the circuit board 800. The detection element can be used to detect the offset angle of the lens relative to the photosensitive chip 200. In this scheme, the detection element can measure the offset angle of the photosensitive chip 200 in real time, thereby ensuring the image stabilization effect of the camera module. The detection element may be a Hall effect chip, but other types of chips are also possible and are not limited herein.

[0052] In the specific operation process, when the photosensitive chip 200 moves, the detection element can detect the offset angle of the photosensitive chip 200, and the detection signal can be fed back to the control chip to correct the offset position of the photosensitive chip 200.

[0053] In the embodiments disclosed in this application, the base frame 100 may include a base and a top plate. Figure 1 Only part of the base frame 100 is shown, that is, the base plate. The top plate is not shown. The circuit board 800 mentioned above can be set on the top plate.

[0054] In another alternative embodiment, the second substrate 600 may have a second clearance hole, and at least a portion of the photosensitive chip 200 may be located within the second clearance hole, thereby further reducing the size of the camera module.

[0055] Based on the camera module disclosed in the embodiments of this application, the embodiments of this application also disclose an electronic device, which includes the camera module described in any of the embodiments above.

[0056] The electronic devices disclosed in this application can be smartphones, tablets, e-book readers, wearable devices (such as smartwatches), video game consoles, etc. This application does not limit the specific types of electronic devices.

[0057] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A camera module, characterized in that, It includes a base frame, a photosensitive chip, a first substrate, a second substrate, a first guide post, a second guide post, a circuit board, a first driving mechanism, and a second driving mechanism; The first guide post is disposed on the base frame, the first substrate is movably connected to the first guide post, and the first substrate moves along the extension direction of the first guide post; The second guide post is disposed on the first substrate, the second substrate is movably connected to the second guide post, and the second substrate moves along the extension direction of the second guide post; the photosensitive chip is disposed on the second substrate. The first driving mechanism is connected to the first substrate, and the first driving mechanism drives the photosensitive chip to move through the first substrate and the second substrate; The second driving mechanism is connected to the second substrate, and the second driving mechanism drives the photosensitive chip to move through the second substrate; The first driving mechanism includes a first magnet and a first coil. The first coil is disposed opposite to the first magnet. The first substrate has a first mounting hole. The first magnet is embedded in the first mounting hole. The first coil and the first magnet drive the first substrate to move. The second driving mechanism includes a second magnet and a second coil, the second coil and the second magnet are disposed opposite to each other, the second substrate has a second mounting hole, the second magnet is embedded in the second mounting hole, and the second coil and the second magnet drive the second substrate to move. The circuit board is disposed on the base frame, and both the first coil and the second coil are disposed on the circuit board.

2. The camera module according to claim 1, characterized in that, The extension direction of the first guide post intersects the extension direction of the second guide post, and the plane containing the first guide post and the second guide post is parallel to the plane containing the photosensitive chip.

3. The camera module according to claim 1, characterized in that, The number of the first guide posts is at least two, and the at least two first guide posts are respectively located on opposite sides of the first substrate, and the extension directions of the at least two first guide posts are parallel.

4. The camera module according to claim 3, characterized in that, The first substrate has a first side and a second side disposed opposite to each other. The first side is provided with a first clamping part, and the second side is provided with a first guide hole extending through the first guide post. One of the first guide posts is clamped and connected to the first clamping part, and the other first guide post is fitted into the first guide hole.

5. The camera module according to claim 1, characterized in that, The number of the second guide posts is at least two, and the at least two second guide posts are respectively located on opposite sides of the second substrate, and the extension directions of the at least two second guide posts are parallel.

6. The camera module according to claim 5, characterized in that, The second substrate has a third side and a fourth side disposed opposite to each other. The third side is provided with a second clamping part, and the fourth side is provided with a second guide hole that extends through the second guide post along the extension direction. One second guide post is clamped and connected to the second clamping part, and the other second guide post is fitted into the second guide hole.

7. The camera module according to claim 1, characterized in that, The first substrate has a first clearance hole, and at least a portion of the second substrate is located within the first clearance hole.

8. An electronic device, characterized in that, Includes the camera module according to any one of claims 1 to 7.

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