A high-temperature-resistant and disassembly-adjustable anaerobic adhesive and its preparation method and application

Abstract

The present invention belongs to the field of polymer adhesive synthesis, and discloses a high-temperature resistant and disassembly-adjustable anaerobic adhesive, as well as its preparation method and application. The anaerobic adhesive is composed of the following components by weight: 100 to 150 parts of anaerobic acrylate monomer, 0.2 to 1 part of metal chelating agent, 0.01 to 3 parts of polymerization inhibitor, 4 to 30 parts of modified bismaleimide heat-resistant resin, 1 to 10 parts of accelerator, 1 to 10 parts of co-accelerator, and 5 to 15 parts of initiator. The anaerobic adhesive of the present invention contains modified bismaleimide resin, and after high-temperature curing, the strength does not decrease significantly. By adding different proportions of modified bismaleimide resin, the disassembly aspect can be adjusted according to demand. The anaerobic adhesive still has good bonding properties at 200°C to 250°C, and can be used in anaerobic curing bonding fields such as preventing bolts from loosening, fixing mutually embedded shafts, threaded pipe joints, and sealing flange surfaces.

Description

Technical Field

[0001] The invention belongs to the field of polymer adhesive synthesis, and particularly relates to a high-temperature-resistant and disassembly-adjustable anaerobic adhesive, a preparation method and application thereof. Background Art

[0002] Anaerobic adhesives (or anaerobic adhesives for short) are single-component sealing adhesives made by utilizing the principle of oxygen's inhibition of free radicals. When the applied surface is isolated from air and catalyzed, they rapidly polymerize and cure at room temperature. They are used for sealing, holding, and bonding applications. Anaerobic adhesives have become indispensable liquid tools in the machinery industry, enjoying widespread application in aerospace, military, automotive, machinery, electronics, and electrical industries. Traditional high-temperature-resistant structural anaerobic adhesives, however, are primarily threadlockers. These threadlockers are primarily designed for thread sealing and locking, but they exhibit low bond strength to flat surfaces, poor flexibility, and low impact strength. While typical anaerobic structural adhesives offer good bond strength, they suffer from less than ideal heat resistance. This is primarily reflected in a significant drop in bond strength at operating temperatures of 150°C or above, making them difficult to meet the high-temperature bonding requirements of industries such as metal machinery and electronics. Research on the heat resistance of anaerobic adhesives primarily focuses on adding heat-resistant modifiers. For example, CN104152086B adds bismaleimide, which improves the heat resistance of the anaerobic adhesive. However, because the added bismaleimide lacks reactive groups, it cannot achieve the same chemical blending effect. Furthermore, this physical blend is prone to phase separation, posing a potential risk to the material's heat resistance. In addition to heat resistance, further improvements are needed in terms of disassembly and adjustment under different requirements. Summary of the Invention

[0003] In order to solve the problems of poor temperature resistance and non-adjustable disassembly of traditional anaerobic adhesives, the primary purpose of the present invention is to provide an anaerobic adhesive that is resistant to high temperatures and can be adjusted for disassembly.

[0004] Another object of the present invention is to provide a method for preparing a high-temperature resistant and disassembly-adjustable anaerobic adhesive.

[0005] Another object of the present invention is to provide an application of the above-mentioned high-temperature resistant and disassembly-adjustable anaerobic adhesive.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] A high-temperature resistant and disassembly-adjustable anaerobic adhesive, the anaerobic adhesive comprising the following components in parts by weight:

[0008]

[0009] Preferably, the anaerobic adhesive is composed of the following components in parts by weight:

[0010]

[0011]

[0012] Preferably, the modified bismaleimide heat-resistant resin is prepared by reacting bismaleimide with diallyl bisphenol A, followed by a nucleophilic ring-opening substitution reaction of the product with glycidyl methacrylate.

[0013] Preferably, the preparation method of the modified bismaleimide heat-resistant resin is as follows: diallyl bisphenol A (DABPA) and bismaleimide (BMI) are mixed, stirred, heated to 140-180°C for addition reaction, and continued stirring. When the reaction product appears as a reddish-brown transparent liquid (BMI-DABPA), the reaction is stopped, cooled, a solvent is added, and the temperature is raised to 60-80°C. After the reaction product is completely dissolved, a catalyst is added, and after stirring evenly, glycidyl methacrylate (GMA) is added. The temperature is raised to 90-110°C for nucleophilic substitution reaction for 2-3 hours, and the solvent is removed to obtain a modified bismaleimide heat-resistant resin;

[0014] The molar ratio of the diallyl bisphenol A to bismaleimide is 1:1 to 1:2, and the molar ratio of the glycidyl methacrylate to diallyl bisphenol A is 0.1 to 0.2:1.

[0015] Preferably, the amount of the catalyst added is 3-5 wt% of the total mass of the reaction product BMI-DABPA and the solvent.

[0016] Preferably, the structural formula of the modified bismaleimide heat-resistant resin is as follows:

[0017]

[0018] The solvent is one of acetone, butanone, toluene, and dimethylformamide, more preferably butanone;

[0019] The catalyst is one of triethylamine, tri-n-propylamine, diisopropylamine, pyridine, dimethylamine, and ethylenediamine, and more preferably tri-n-propylamine.

[0020] Preferably, the anaerobic acrylate monomer is bisphenol A epoxy acrylate, triethylene glycol di(meth)acrylate, ethylene glycol (meth)acrylate, polyethylene glycol di(meth)acrylate, alkyl (meth)acrylate, monomethylolphenol monoacrylate, polyurethane (meth)acrylate, dimethylolphenol diacrylate, tetraethylene glycol di(meth)acrylate, (meth)acrylate containing allyloxybenzene, isobornyl methacrylate, trimethylolpropane triacrylate, hydroxypropyl methacrylate, methyltetrahydrofuran acrylate, 1,6-hexanediol diacrylate, silicone acrylate, ethoxylated bisphenol A di(meth)acrylate diester or a mixture of more thereof.

[0021] Preferably, the metal chelating agent is one or both of ethylenediaminetetraacetic acid tetrasodium salt and ethylenediaminetetraacetic acid disodium salt;

[0022] The polymerization inhibitor is one or a mixture of several of oxalic acid, maleic acid, p-tert-butylphenol, ethylenediaminetetraacetic acid, hydroquinone, o-aminophenol, p-benzoquinone, methoxyhydroquinone, p-methoxyphenol, m-cresol, p-cresol, 2,6-di-tert-butyl-p-cresol, naphthoquinone and anthraquinone polymerization inhibitors.

[0023] Preferably, the accelerator is one or a mixture of acetylphenylhydrazine, ascorbic acid, benzoylhydrazine, triethylamine, tri-n-butylamine, N,N-dimethyl-p-toluidine, and N,N-diethyl-p-toluidine.

[0024] The auxiliary accelerator is one or a mixture of o-sulfonylbenzamide, o-sulfonylbenzamide, phthalimide, succinimide, formimide and N-ethylacetimide;

[0025] The initiator is one or a mixture of tert-butyl hydroperoxide, diisopropylbenzene peroxide, isopropylbenzene hydroperoxide, cyclohexanone peroxide, and methyl ethyl ketone peroxide.

[0026] A method for preparing the above-mentioned high-temperature resistant and disassembly-adjustable anaerobic adhesive comprises the following steps:

[0027] (1) Add anaerobic acrylate monomer according to weight, stir, heat to 75-85° C., add metal chelating agent, polymerization inhibitor, modified bismaleimide heat-resistant resin, accelerator, and co-accelerator, stir evenly until completely dissolved, and continue stirring to obtain mixed solution A;

[0028] (2) Cooling the mixed solution A to 45-50° C., adding an initiator, and stirring evenly to obtain a modified bismaleimide anaerobic adhesive that is resistant to high temperatures and can be disassembled and adjusted.

[0029] The above-mentioned anaerobic adhesives are used in preventing bolts from loosening, fixing shafts, sealing, and filling micropores.

[0030] More preferably, it is used in anaerobic curing adhesive fields such as preventing bolts from loosening, fixing mutually embedded shafts, sealing threaded pipe joints and threaded plugs, sealing flange joints, and filling micropores.

[0031] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0032] The anaerobic adhesive of the present invention contains a modified bismaleimide resin. After high-temperature curing, the strength does not show a significant decrease. By adding different proportions of the modified bismaleimide resin, the disassembly performance can be adjusted according to demand. In addition, the introduction of the modified bismaleimide resin further improves the heat resistance of the anaerobic adhesive, so that the anaerobic adhesive still has good bonding performance at 200°C to 250°C. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is the synthesis route diagram of modified bismaleimide heat-resistant resin.

[0034] Figure 2 These are the infrared spectra of bismaleimide (BMI), diallyl bisphenol A (DABPA) and the intermediate reaction product (BMI-DABPA). From top to bottom, 2a, 2b, and 2c are the infrared spectrum of BMI, the infrared spectrum of DABPA, and the infrared spectrum of BMI-DABPA, respectively.

[0035] Figure 3 These are the infrared spectra of glycidyl methacrylate (GMA), BMI-DABPA and modified bismaleimide heat-resistant resin. From top to bottom, 3a, 3b, and 3c are the infrared spectra of GMA, BMI-DABPA, and modified bismaleimide heat-resistant resin, respectively. DETAILED DESCRIPTION

[0036] The present invention will be described in further detail below with reference to specific examples, but the embodiments of the present invention are not limited thereto. For process parameters not particularly noted, conventional techniques may be used.

[0037] Example 1

[0038] The preparation method of modified bismaleimide heat-resistant resin is as follows:

[0039] Add diallyl bisphenol A (DABPA) to the reactor and heat it to 110°C and stir. Then add bismaleimide (BMI), raise the temperature to 140°C, continue stirring, and stop the reaction when the reaction product becomes a reddish-brown transparent liquid (BMI-DABPA). Cool to room temperature, add butanone, raise the temperature to 60°C, wait for complete dissolution, then add the catalyst tri-n-propylamine, stir evenly, add glycidyl methacrylate (GMA), raise the temperature to 90°C and react for two hours. Then distill under reduced pressure to remove the solvent butanone to obtain a modified bismaleimide heat-resistant resin. Among them, the molar ratio of DABPA and BMI is 1:1, the amount of butanone is 3:1 (mass ratio, butanone: BMI-DABPA), the amount of tri-n-propylamine added is 3% of the sum of the mass of BMI-DABPA and butanone, and the molar ratio of GMA and DABPA is 0.18:1. The specific synthesis path is as follows Figure 1 , infrared spectrum such as Figure 2 , 3.

[0040] like Figure 1 Characteristic peak of raw material bismaleimide: at 1710 cm -1 The characteristic absorption of C=O is shown at all locations, and the aromatic C=C absorption appears at 1500 cm -1 830cm -1 and 690cm -1 The peak at is the characteristic peak of the CH bending vibration of the maleimide group. The characteristic peak of the raw material diallyl bisphenol: wave number 3500cm -1 The large absorption peak at 3050cm is the unique absorption peak of phenolic hydroxyl group. -1 The left and right peaks are the stretching vibration peaks of C=CH, 2900 cm -1 The CH stretching vibration peak of -CH2- and -CH3 is 1640cm-, which is the stretching vibration absorption peak of -CH=CH2, 1510cm -1 and 1010cm-benzene ring characteristic absorption peak, 830cm -1 and 690cm -1 It is the CH deformation vibration peak on -C=CH. When the molar ratio of BMI to DABPA is 1:1, the 3500cm -1 There is a large characteristic absorption peak at 3050cm, indicating that the product contains phenolic hydroxyl structure. In addition, the infrared spectra of BMI, DABPA and the product are compared. -1 There is a C=CH stretching vibration peak around the left and right sides, and DABPA is at 3000cm -1 There is a C=CH stretching vibration peak around 3000cm in the infrared spectrum of the product BMI-DABPA. -1 to 3100cm -1The absorption peak of BMI and DABPA is weak; in addition, it can be noted that the absorption peak of BMI and DABPA is at 825cm -1 and 689cm -1 A strong stretching vibration peak of =CH can be observed at , but the peak is weakened in the infrared spectrum of BMI-DABPA. This indicates that the double bond next to the carbonyl group of BMI reacts with the allyl group of DABPA to produce the product BMI-DABPA. Figure 2 , raw material GMA at 912cm -1 The characteristic infrared peak of epoxy group can be observed, and the peak at 3500 cm-1 can be observed in the product BMI-DABPA synthesized with a molar ratio of BMI to DABPA. -1 The characteristic absorption peak of phenolic hydroxyl group was observed at 3500 cm -1 The large absorption peak at 912 cm-1 disappears, and only a small absorption peak remains. -1 The absorption intensity of the epoxy group is weakened, which can confirm that the phenolic hydroxyl group reacts with epoxy, the phenolic hydroxyl group of the original structure disappears, and a secondary hydroxyl group is generated.

[0041] Example 2

[0042] A method for preparing a modified bismaleimide high-temperature resistant and disassembly-adjustable anaerobic adhesive is carried out according to the following steps:

[0043] 1. Add 100 parts by weight of triethylene glycol di(meth)acrylate to a reactor and stir for 20 minutes, and heat the reactor to 75°C.

[0044] 2. To the reactor from step 1, add 0.2 parts disodium ethylenediaminetetraacetic acid, 1.5 parts hydroquinone, 8 parts modified bismaleimide heat-resistant resin, 6 parts acetophenylhydrazine, and 6 parts o-sulfonylbenzeneimide. Stir at 75°C until completely dissolved. Continue heating and stirring for one hour to obtain Mixture A.

[0045] 3. Cool the mixed solution A obtained in step 2 to 45°C, add 8 parts of cumene hydroperoxide, and stir evenly to obtain a modified bismaleimide anaerobic adhesive with high temperature resistance and adjustable disassembly.

[0046] Example 3

[0047] A method for preparing a modified bismaleimide high-temperature resistant and disassembly-adjustable anaerobic adhesive is carried out according to the following steps:

[0048] 1. Add 100 parts by weight of triethylene glycol di(meth)acrylate to a reactor and stir for 20 minutes, and heat the reactor to 75°C.

[0049] 2. To the reactor from step 1, add 0.2 parts disodium ethylenediaminetetraacetic acid, 1.5 parts hydroquinone, 12 parts modified bismaleimide heat-resistant resin, 6 parts acetophenylhydrazine, and 6 parts o-sulfonylbenzeneimide. Stir at 75°C until completely dissolved. Continue heating and stirring for one hour to obtain Mixture A.

[0050] 3. Cool the mixed solution A obtained in step 2 to 45°C, add 8 parts of cumene hydroperoxide, and stir evenly to obtain a modified bismaleimide anaerobic adhesive with high temperature resistance and adjustable disassembly.

[0051] Example 4

[0052] A method for preparing a modified bismaleimide high-temperature resistant and disassembly-adjustable anaerobic adhesive is carried out according to the following steps:

[0053] 1. Add 100 parts by weight of triethylene glycol di(meth)acrylate to a reactor and stir for 20 minutes, and heat the reactor to 75°C.

[0054] 2. To the reactor from step 1, add 0.2 parts disodium ethylenediaminetetraacetic acid, 1.5 parts hydroquinone, 16 parts modified bismaleimide heat-resistant resin, 6 parts acetophenylhydrazine, and 6 parts o-sulfonylbenzeneimide. Stir at 75°C until completely dissolved. Continue heating and stirring for one hour to obtain Mixture A.

[0055] 3. Cool the mixed solution A obtained in step 2 to 45°C, add 8 parts of cumene hydroperoxide, and stir evenly to obtain a modified bismaleimide anaerobic adhesive with high temperature resistance and adjustable disassembly.

[0056] Example 5

[0057] A method for preparing a modified bismaleimide high-temperature resistant and disassembly-adjustable anaerobic adhesive is carried out according to the following steps:

[0058] 1. Add 100 parts by weight of triethylene glycol di(meth)acrylate to a reactor and stir for 20 minutes, and heat the reactor to 75°C.

[0059] 2. To the reactor from step 1, add 0.2 parts disodium ethylenediaminetetraacetic acid, 1.5 parts hydroquinone, 20 parts modified bismaleimide heat-resistant resin, 6 parts acetophenylhydrazine, and 6 parts o-sulfonylbenzeneimide. Stir at 75°C until completely dissolved. Continue heating and stirring for one hour to obtain Mixture A.

[0060] 3. Cool the mixed solution A obtained in step 2 to 45°C, add 8 parts of cumene hydroperoxide, and stir evenly to obtain a modified bismaleimide anaerobic adhesive with high temperature resistance and adjustable disassembly.

[0061] Example 6

[0062] A method for preparing a modified bismaleimide high-temperature resistant and disassembly-adjustable anaerobic adhesive is carried out according to the following steps:

[0063] 1. Add 100 parts by weight of triethylene glycol di(meth)acrylate to a reactor and stir for 20 minutes, and heat the reactor to 75°C.

[0064] 2. To the reactor from step 1, add 0.2 parts disodium ethylenediaminetetraacetic acid, 1.5 parts hydroquinone, 24 parts modified bismaleimide heat-resistant resin, 6 parts acetophenylhydrazine, and 6 parts o-sulfonylbenzeneimide. Stir at 75°C until completely dissolved. Continue heating and stirring for one hour to obtain Mixture A.

[0065] 3. Cool the mixed solution A obtained in step 2 to 45°C, add 8 parts of cumene hydroperoxide, and stir evenly to obtain a modified bismaleimide anaerobic adhesive with high temperature resistance and adjustable disassembly.

[0066] Comparative Example 1

[0067] A method for preparing an anaerobic adhesive is carried out according to the following steps:

[0068] 1. Add 100 parts by weight of triethylene glycol di(meth)acrylate to a reactor and stir for 20 minutes, and heat the reactor to 75°C.

[0069] 2. Add 0.2 parts of disodium ethylenediaminetetraacetic acid, 1.5 parts of hydroquinone, 6 parts of acetophenylhydrazine, and 6 parts of o-sulfonylbenzene imide to the reaction kettle obtained in step 1. Stir at 75°C until completely dissolved. Continue heating and stirring for one hour to obtain a mixed solution A.

[0070] 3. Cool the mixed solution A obtained in step 2 to 45°C, add 8 parts of cumene hydroperoxide, and stir evenly to obtain a modified bismaleimide anaerobic adhesive with high temperature resistance and adjustable disassembly.

[0071] Comparative Example 2

[0072] A method for preparing a bismaleimide high-temperature-resistant and disassembly-adjustable anaerobic adhesive is carried out according to the following steps:

[0073] 1. Add 100 parts by weight of triethylene glycol di(meth)acrylate to a reactor and stir for 20 minutes, and heat the reactor to 75°C.

[0074] 2. To the reactor from step 1, add 0.2 parts disodium ethylenediaminetetraacetic acid, 1.5 parts hydroquinone, 8 parts unmodified bismaleimide heat-resistant resin N,N'-4,4'-diphenylmethane bismaleimide, 6 parts acetophenylhydrazine, and 6 parts o-sulfonylbenzene imide. Stir at 75°C until completely dissolved. Continue heating and stirring for one hour to obtain Mixture A.

[0075] 3. Cool the mixed solution A obtained in step 2 to 45°C, add 8 parts of cumene hydroperoxide, and stir evenly to obtain a modified bismaleimide anaerobic adhesive with high temperature resistance and adjustable disassembly.

[0076] The anaerobic adhesives obtained in Example 2, Example 3, Example 4, Example 5, Example 6, Comparative Example 1, and Comparative Example 2 were respectively labeled as Anaerobic Adhesive No. 1, Anaerobic Adhesive No. 2, Anaerobic Adhesive No. 3, Anaerobic Adhesive No. 4, Anaerobic Adhesive No. 5, Anaerobic Adhesive No. 6, and Anaerobic Adhesive No. 7. Anaerobic Adhesive No. 1, Anaerobic Adhesive No. 2, Anaerobic Adhesive No. 3, Anaerobic Adhesive No. 4, Anaerobic Adhesive No. 5, Anaerobic Adhesive No. 6, and Anaerobic Adhesive No. 7 were cured for 24 hours. The threaded parts used for the test were commercially available steel M10 bolts and nuts. The tightening torque was tested in accordance with HB5315-1993. The test results of the torque strength of the anaerobic adhesives obtained in Example 2, Example 3, Example 4, Example 5, Example 6, Comparative Example 1, and Comparative Example 2 at different temperatures and at room temperature after post-treatment at different temperatures are shown in Table 1.

[0077] Table 1

[0078]

[0079] In Table 1, Tb (Nm) represents the breaking torque, and Tp (Nm) represents the disassembly torque. As shown in Table 1, the torque value of anaerobic adhesive No. 6 drops sharply after heat treatment at 200°C. Anaerobic adhesive No. 1, No. 2, No. 3, No. 4, and No. 5 maintain strong torque values ​​after heat treatment at 200°C and 250°C, respectively. Furthermore, the Tb / Tp value can be adjusted by adjusting the amount of heat-resistant resin added according to disassembly requirements (when Tb / Tp is greater than 1, disassembly is difficult; when Tb / Tp is less than 1, disassembly is easy). Comprehensive analysis shows that the modified bismaleimide anaerobic adhesive with high-temperature resistance and adjustable disassembly has high-temperature performance that is superior to bismaleimide anaerobic adhesives, with a temperature range of 200°C-250°C and adjustable disassembly strength.

[0080] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be considered as equivalent replacement methods and are included in the scope of protection of the present invention.

Claims

1. A high temperature resistant and disassembly adjustable anaerobic adhesive, characterized in that: The anaerobic adhesive is composed of the following components in parts by weight: Anaerobic acrylate monomer 100~150 parts 0.2-1 part of metal chelating agent 0.01~3 parts of polymerization inhibitor 4-30 parts of modified bismaleimide heat-resistant resin 1 to 10 parts of accelerator 1 to 10 parts of accelerator 5-15 parts of initiator; The modified bismaleimide heat-resistant resin is prepared by subjecting bismaleimide to an addition reaction with diallyl bisphenol A, and then subjecting the product to a nucleophilic ring-opening substitution reaction with glycidyl methacrylate.

2. The high temperature resistant and disassembly adjustable anaerobic adhesive according to claim 1, characterized in that: The anaerobic adhesive is composed of the following components in parts by weight: 100 parts of anaerobic acrylate monomer 0.5-1 part of metal chelating agent 1 to 3 parts of polymerization inhibitor 10-30 parts of modified bismaleimide heat-resistant resin 5-10 parts of accelerator 5-10 parts of accelerator 8 to 15 parts of initiator.

3. The high temperature resistant and disassembly adjustable anaerobic adhesive according to claim 1, characterized in that: The preparation method of the modified bismaleimide heat-resistant resin is as follows: diallyl bisphenol A and bismaleimide are mixed, stirred, heated to 140-180° C. for addition reaction, and continued stirring. The reaction is stopped when the reaction product becomes a reddish-brown transparent liquid, cooled, a solvent is added, and the temperature is raised to 60-80° C. until the reaction product is completely dissolved. A catalyst is then added, stirred evenly, and glycidyl methacrylate is added. The temperature is raised to 90-110° C. for nucleophilic substitution reaction for 2-3 hours, and the solvent is removed to obtain the modified bismaleimide heat-resistant resin. The molar ratio of the diallyl bisphenol A to bismaleimide is 1:1-1:2, and the molar ratio of the glycidyl methacrylate to diallyl bisphenol A is 0.1-0.2:

1.

4. The high temperature resistant and disassembly adjustable anaerobic adhesive according to claim 3, characterized in that: The structural formula of the modified bismaleimide heat-resistant resin is as follows: ； The solvent is one of acetone, butanone, toluene and dimethylformamide, and the catalyst is one of triethylamine, tri-n-propylamine, diisopropylamine, pyridine, dimethylamine and ethylenediamine.

5. The high temperature resistant and disassembly adjustable anaerobic adhesive according to claim 1, characterized in that: The anaerobic acrylate monomer is one or a mixture of bisphenol A epoxy acrylate, triethylene glycol di(meth)acrylate, ethylene glycol (meth)acrylate, polyethylene glycol di(meth)acrylate, alkyl (meth)acrylate, polyurethane (meth)acrylate, dihydroxymethylphenol diacrylate, tetraethylene glycol di(meth)acrylate, allyloxybenzene-containing (meth)acrylate, trimethylolpropane triacrylate, hydroxypropyl methacrylate, methyltetrahydrofuran acrylate, 1,6-hexanediol diacrylate, silicone acrylate, and ethoxylated bisphenol A di(meth)acrylate diester.

6. The high temperature resistant and disassembly adjustable anaerobic adhesive according to claim 1, characterized in that: The metal chelating agent is one or both of ethylenediaminetetraacetic acid tetrasodium salt and ethylenediaminetetraacetic acid disodium salt; The polymerization inhibitor is one or a mixture of oxalic acid, maleic acid, p-tert-butylphenol, ethylenediaminetetraacetic acid, hydroquinone, o-aminophenol, p-benzoquinone, methoxyhydroquinone, p-methoxyphenol, m-cresol, p-cresol, 2,6-di-tert-butyl-p-cresol, naphthoquinone and anthraquinone polymerization inhibitors.

7. The high temperature resistant and disassembly adjustable anaerobic adhesive according to claim 1, characterized in that: The accelerator is one or a mixture of acetylphenylhydrazine, ascorbic acid, benzoylhydrazine, triethylamine, tri-n-butylamine, N,N-dimethyl-p-toluidine, N,N-diethyl-p-toluidine; The auxiliary accelerator is one or a mixture of o-sulfonylbenzamide, phthalimide, succinimide, formimide and N-ethylacetimide; The initiator is one or a mixture of tert-butyl hydroperoxide, diisopropylbenzene peroxide, isopropylbenzene hydroperoxide, cyclohexanone peroxide, and methyl ethyl ketone peroxide.

8. A method for preparing the high temperature resistant and disassembly adjustable anaerobic adhesive according to any one of claims 1 to 7, characterized in that: The following steps are involved: (1) Add anaerobic acrylate monomer according to weight, stir, heat to 75~85℃, add metal chelating agent, polymerization inhibitor, modified bismaleimide heat-resistant resin, accelerator, co-accelerator, stir evenly until completely dissolved, and continue stirring to obtain mixed solution A; (2) Cool the mixed solution A to 45-50°C, add the initiator, and stir evenly to obtain a modified bismaleimide anaerobic adhesive that is resistant to high temperatures and can be disassembled and adjusted.

9. Use of the high-temperature-resistant and disassembly-adjustable anaerobic adhesive according to any one of claims 1 to 7 in preventing bolts from loosening, fixing shafts, sealing, and filling micropores.

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