Display panel, preparation method thereof, and display device

Abstract

The present application discloses a display panel, a preparation method thereof, and a display device. The preparation method of the display panel includes providing a prefabricated encapsulation substrate; transferring a plurality of Micro-LED chips on a transfer substrate to the prefabricated encapsulation substrate; bonding the prefabricated encapsulation substrate provided with the plurality of Micro-LED chips to a driving substrate, so that the plurality of Micro-LED chips are electrically connected to the driving substrate. Through the above preparation method, it is possible to transfer the Micro-LED chips to the driving substrate and electrically connect the Micro-LED chips to the driving substrate without providing a buffer adhesive layer with a conductive function on the driving substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of traditional flat-panel displays and micro-projection display technologies, Micro-LED inorganic light-emitting diode technology, a promising future mainstream core display technology, has shown remarkable performance and is attracting increasing attention for its advantages. Micro-LEDs, which can be viewed as miniaturized LEDs that can be individually illuminated, offer advantages such as low power consumption, high brightness, high definition, and long life. In the future, they will become a new display technology that will rival AMOLED displays.

[0003] In Micro-LED, laser transfer technology is often used to transfer Micro-LED chips to a driver substrate with metal circuits. A buffer adhesive layer is required on the driver substrate to support the Micro-LED chip. The material of this buffer adhesive layer is still in the development stage and is difficult to develop. Summary of the Invention

[0004] The display panel, its preparation method, and display device provided in this application solve the technical problem of the difficulty in developing a buffer adhesive layer during the laser transfer of Micro-LED chips in the prior art.

[0005] In order to solve the above technical problems, the first technical solution provided in this application is: providing a method for preparing a display panel, including: providing a prefabricated packaging substrate; transferring multiple Micro-LED chips on the transfer substrate to the prefabricated packaging substrate; bonding the prefabricated packaging substrate provided with multiple Micro-LED chips to a driving substrate, so that the multiple Micro-LED chips are electrically connected to the driving substrate.

[0006] The step of providing a prefabricated packaging substrate specifically includes: obtaining a packaging substrate, wherein a plurality of pits are provided on one side of the packaging substrate; filling a buffering adhesive into the pits to obtain the prefabricated packaging substrate;

[0007] The step of transferring the plurality of Micro-LED chips on the transfer substrate to the prefabricated packaging substrate specifically includes: transferring the plurality of Micro-LED chips on the transfer substrate to the buffer adhesive by using a laser transfer method.

[0008] Before the step of bonding the prefabricated packaging substrate provided with the plurality of Micro-LED chips to the driving substrate, the method further includes:

[0009] Encapsulate multiple of the Micro-LED chips to form an encapsulation layer; the encapsulation layer is located on the side of the multiple Micro-LED chips away from the prefabricated encapsulation substrate;

[0010] Expose the electrodes of the multiple Micro-LED chips.

[0011] Wherein, after the step of exposing the electrodes of the multiple Micro-LED chips, the method further includes:

[0012] Prepare electrode extension lines on the side of the encapsulation layer away from the prefabricated encapsulation substrate, and the electrode extension lines are electrically connected to the electrodes of the multiple Micro-LED chips.

[0013] Wherein, before the step of bonding the prefabricated encapsulation substrate provided with the multiple Micro-LED chips to the driving substrate, the method further includes:

[0014] Provide an adhesive layer on one side of the encapsulation layer and / or the driving substrate.

[0015] Wherein, the encapsulation substrate is a rigid film material or a flexible film material.

[0016] To solve the above technical problems, the second technical solution provided by the present application is: provide a display panel, including: a driving substrate, a prefabricated encapsulation substrate, and multiple Micro-LED chips; the prefabricated encapsulation substrate is disposed opposite to the driving substrate; the multiple Micro-LED chips are fixed on the side of the prefabricated encapsulation substrate facing the driving substrate; the multiple Micro-LED chips are electrically connected to the driving substrate.

[0017] Wherein, the prefabricated encapsulation substrate includes an encapsulation substrate and a buffer adhesive material, and a plurality of pits are provided on one side of the encapsulation substrate, and the buffer adhesive material is filled in the pits;

[0018] The multiple Micro-LED chips are fixed to the encapsulation substrate through the buffer adhesive material.

[0019] To solve the above technical problems, the third technical solution provided by the present application is: provide a display panel, including a driving substrate, a prefabricated encapsulation substrate, and multiple Micro-LED chips; the prefabricated encapsulation substrate is disposed opposite to the driving substrate; the multiple Micro-LED chips are disposed between the driving substrate and the prefabricated encapsulation substrate, and there is no conductive buffer adhesive layer between the multiple Micro-LED chips and the driving substrate; the multiple Micro-LED chips are electrically connected to the driving substrate.

[0020] To solve the above technical problems, the fourth technical solution provided by this application is: to provide a display device, including the display panel described in any one of the above.

[0021] The display panel, its manufacturing method, and the display device provided by this application. The manufacturing method of the display panel includes providing a prefabricated encapsulation substrate; transferring a plurality of Micro-LED chips on the transfer substrate to the prefabricated encapsulation substrate; bonding the prefabricated encapsulation substrate with the plurality of Micro-LED chips to the driving substrate, so that the plurality of Micro-LED chips are electrically connected to the driving substrate. Through the above manufacturing method, it is possible to transfer the Micro-LED chips to the driving substrate and electrically connect the Micro-LED chips to the driving substrate without setting a buffer adhesive layer with a conductive function on the driving substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0023] Figure 1 is a schematic structural diagram of laser transfer of Micro-LED chips in the prior art;

[0024] Figure 2 is a schematic flowchart of the first embodiment of the manufacturing method of the display panel provided by this application;

[0025] Figure 3 is Figure 2 a schematic flowchart of step S1 in the manufacturing method of the display panel provided;

[0026] Figure 4 is Figure 2 a schematic structural diagram of step S11 in the manufacturing method of the display panel provided;

[0027] Figure 5 is Figure 2 a schematic structural diagram of step S12 in the manufacturing method of the display panel provided;

[0028] Figure 6 is Figure 2 a schematic structural diagram of step S2 in the manufacturing method of the display panel provided;

[0029] Figure 7 is Figure 2 a schematic structural diagram of step S3 in the manufacturing method of the display panel provided;

[0030] Figure 8It is a schematic flowchart of the second embodiment of the display panel manufacturing method provided by this application;

[0031] Figure 9 It is Figure 8 a schematic structural diagram of step S3A in the display panel manufacturing method provided;

[0032] Figure 10 It is Figure 8 a schematic structural diagram of step S4A in the display panel manufacturing method provided;

[0033] Figure 11 It is Figure 8 a schematic structural diagram of step S5A in the display panel manufacturing method provided;

[0034] Figure 12 It is a schematic flowchart of the third embodiment of the display panel manufacturing method provided by this application;

[0035] Figure 13 It is Figure 12 a schematic structural diagram of step S5B in the display panel manufacturing method provided;

[0036] Figure 14 It is Figure 12 a schematic structural diagram of step S6B in the display panel manufacturing method provided;

[0037] Figure 15 It is a schematic flowchart of the fourth embodiment of the display panel manufacturing method provided by this application;

[0038] Figure 16 It is Figure 15 a schematic structural diagram of step S6C in the display panel manufacturing method provided;

[0039] Figure 17 It is Figure 15 a schematic structural diagram of step S7C in the display panel manufacturing method provided;

[0040] Figure 18 It is a schematic structural diagram of the display panel provided by the embodiments of this application. Detailed Description of the Embodiments

[0041] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0042] In the following description, specific details such as specific system architectures, interfaces, technologies, etc. are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the present application.

[0043] The terms "first", "second", "third" in the present application are only for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", "third" may explicitly or implicitly include at least one of the said features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly. The terms "comprising" and "having" in the embodiments of the present application and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or components inherent to these processes, methods, products or devices.

[0044] Referring to "embodiments" herein means that specific features, structures or characteristics described in connection with the embodiments may be included in at least one embodiment of the present application. The phrase appearing in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0045] The present application will be described in detail below with reference to the drawings and embodiments.

[0046] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of a laser transfer Micro-LED chip in the prior art.

[0047] Laser transfer technology refers to the technology in which, after laser irradiation, the adhesive layer 3 between the chip 1 and the donor substrate 2 reacts, and the chip 1 falls from the donor substrate 2 onto the receiving substrate 4. When transferring Micro-LED chips onto the driving substrate, the receiving substrate 4 is the driving substrate with metal circuits, a photosensitive adhesive layer is provided between the chip 1 and the donor substrate 2 as the adhesive layer 3, and a buffer adhesive layer 5 is provided on one side of the receiving substrate 4. The laser irradiates the donor substrate 2 from the side facing away from the chip 1, the adhesive layer between the donor substrate 2 and the chip 1 reacts, and the chip 1 falls from the donor substrate 2 onto the receiving substrate 4 and is bonded and fixed by the buffer adhesive layer 5 on one side of the receiving substrate 4. Among them, the buffer adhesive layer 5 needs to have a certain thickness for buffering to avoid the impact of the falling chip 1 on the receiving substrate 4; the buffer adhesive layer 5 also needs to have a conductive function to ensure the electrical connection between the electrodes of the chip 1 and the receiving substrate 4 (driving substrate). Therefore, the requirements for the buffer adhesive layer 5 are relatively high, and the materials for such buffer adhesive layers 5 are still in the development stage and are difficult to develop.

[0048] Please refer to Figure 2 , Figure 2 which is a schematic flow chart of the first embodiment of the display panel manufacturing method provided by this application.

[0049] In the first embodiment of the display panel manufacturing method of this application, the steps specifically include:

[0050] Step S1: Provide a prefabricated packaging substrate.

[0051] Please refer to Figures 3 - 5 , Figure 3 which is Figure 2 a schematic flow chart of step S1 in the display panel manufacturing method provided by Figure 4 which is Figure 2 a schematic structural diagram of step S11 in the display panel manufacturing method provided by Figure 5 which is Figure 2 a schematic structural diagram of step S12 in the display panel manufacturing method provided by. In this embodiment, the specific steps of providing the prefabricated packaging substrate 11 include:

[0052] Step S11: Obtain a packaging substrate, and a plurality of pits are provided on one side of the packaging substrate.

[0053] Among them, the packaging substrate 111 can be a hard film material or a flexible film material. When the packaging substrate 111 is a hard film material, it can be a PCB board, glass, etc.; when the packaging substrate 111 is a flexible film material, it can be a PI glue material. A plurality of pits 1111 are provided on one side of the packaging substrate 111, and the spacing between adjacent pits 1111 matches the pitch value of the Micro-LED display screen. In this embodiment, the shape of the pit 1111 is set to an arc, and the shape of the pit 1111 can be designed as needed. By setting the pit 1111, the Micro-LED chip 12 to be transferred thereto can be limited, which is also conducive to controlling the light-emitting light type of the Micro-LED chip 12 transferred thereto.

[0054] Step S12: Filling the recess with a buffering adhesive to obtain a prefabricated packaging substrate.

[0055] The cushioning adhesive 112 has both cushioning and adhesive properties. The cushioning adhesive 112 can completely fill the recess 1111, completely fill the recess 1111 and overflow onto the surface of the package substrate 111, or partially fill the recess 1111. The specific design is determined based on needs, as long as it can accommodate the Micro-LED chip 12 and accurately position the Micro-LED chip 12 when it falls onto the package substrate 111. In this embodiment, the refractive index of the cushioning adhesive 112 meets the light emission design of the Micro-LED chip 12, facilitating light emission from the Micro-LED chip 12 and improving the light emission effect. Specifically, the cushioning adhesive 112 can be epoxy resin.

[0056] In another embodiment, it is not necessary to set the pit 1111 on the packaging substrate 111, that is, the surface of the packaging substrate 111 is flat; the buffer adhesive 112 can be set on the entire surface of the packaging substrate 111, or can be set at intervals on the surface of the packaging substrate 111, as long as it can accommodate the Micro-LED chip 12.

[0057] Since the pits 1111 are provided on the packaging substrate 111, it is beneficial to control the light pattern of the Micro-LED chip 12 transferred thereon. The following describes the method for preparing the display panel based on the packaging substrate 111 of this structure.

[0058] Step S2: Transfer the multiple Micro-LED chips on the transfer substrate to the prefabricated packaging substrate. Figure 6 , Figure 6 yes Figure 2 A schematic structural diagram of step S2 in the display panel manufacturing method is provided.

[0059] Specifically, a laser transfer method is adopted to transfer multiple Micro-LED chips 12 to the prefabricated packaging substrate 11, that is, a laser transfer method is adopted to transfer multiple Micro-LED chips 12 to the side of the buffer adhesive 112 away from the packaging substrate 111. The Micro-LED chips 12 are fixed to the packaging substrate 111 through the buffer adhesive 112.

[0060] Among them, multiple Micro-LED chips 12 are placed on one side of the transfer substrate 13. The surface of the transfer substrate 13 for placing the Micro-LED chips 12 is provided with an adhesive layer 14. The Micro-LED chips 12 are fixed to the transfer substrate 13 through the adhesive layer 14. The adhesive layer 14 reacts under the action of laser, causing the Micro-LED chips 12 to fall off the transfer substrate 13.

[0061] The transfer substrate 13 provided with multiple Micro-LED chips 12 is disposed opposite to the prefabricated packaging substrate 11. The side of the transfer substrate 13 opposite to the Micro-LED chips 12 is irradiated with laser, causing the Micro-LED chips 12 to fall onto the buffer adhesive 112, that is, arranging the RGB three-color chip arrays on the prefabricated packaging substrate 11. Among them, as Figure 6 shown, the non-electrode side of the Micro-LED chip 12 falls and adheres to the buffer adhesive 112, that is, the planar structure side of the Micro-LED chip 12 adheres to the buffer adhesive 112, and the electrode 121 end of the Micro-LED chip 12 faces away from the prefabricated packaging substrate 11.

[0062] Step S3: Bond the prefabricated packaging substrate provided with multiple Micro-LED chips to the driving substrate, so that the multiple Micro-LED chips are electrically connected to the driving substrate. Please refer to Figure 7 , Figure 7 is Figure 2 a schematic structural diagram of step S3 in the display panel manufacturing method provided.

[0063] In this embodiment, the Micro-LED chips 12 are bonded to the driving substrate 16 through solder 15, so that the multiple Micro-LED chips 12 are electrically connected to the driving substrate 16. Among them, the solder 15 can be provided on the side of the driving substrate 16, or on the side of the prefabricated packaging substrate 11, or both on the side of the driving substrate 16 and the side of the prefabricated packaging substrate 11. Specifically, the electrode 121 of the Micro-LED chip 12 is electrically connected to the corresponding electrode 161 on the driving substrate 16 through the solder 15.

[0064] It can be understood that since the driving substrate 16 is rigid, when the packaging substrate 111 is made of a flexible film material, it is easier to operate when bonding the pre-packaging substrate 11 with the Micro-LED chip 12 to the driving substrate 16. For example, a roller method can be used for operation.

[0065] In the first embodiment of the display panel manufacturing method provided by the present application, through the laser transfer technology, the horizontal structure side of the Micro-LED chip 12 is adhered to the pre-packaging substrate 11, and then the above structure is bonded to the driving substrate 16 at one time, solving the problem of developing the conductive buffer adhesive layer for receiving the Micro-LED chip 12 transferred by laser on the driving substrate 16, and the light output pattern can be controlled and the light output effect can be improved. Among them, the pre-packaging substrate 11 not only serves as the carrier substrate during the laser transfer of the Micro-LED chip 12, but also can serve as the packaging structure, and there is no need to provide a cover plate in the prior art. Compared with the prior art of transferring the Micro-LED chip to the driving substrate, which requires a buffer adhesive material, the present application realizes the transfer of the Micro-LED chip 12 by aligning and bonding the pre-packaging substrate 11 with the driving substrate 16, and there is no need to provide a buffer adhesive material.

[0066] Please refer to Figure 8 , Figure 8 which is a schematic flowchart of the second embodiment of the display panel manufacturing method provided by the present application.

[0067] In the second embodiment of the display panel manufacturing method of the present application, the steps specifically include:

[0068] Step S1A: Provide a pre-packaging substrate.

[0069] Step S1A in the second embodiment of the display panel manufacturing method is the same as step S1 in the first embodiment of the display panel manufacturing method, and will not be described in detail.

[0070] Step S2A: Transfer a plurality of Micro-LED chips on the transfer substrate to the pre-packaging substrate.

[0071] Step S2A in the second embodiment of the display panel manufacturing method is the same as step S2 in the first embodiment of the display panel manufacturing method, and will not be described in detail.

[0072] Step S3A: Package a plurality of Micro-LED chips to form a packaging layer; the packaging layer is located on the side of the plurality of Micro-LED chips away from the pre-packaging substrate.

[0073] Please refer to Figure 9 , Figure 9 is Figure 8A schematic diagram of step S3A in the display panel manufacturing method is provided. Specifically, multiple Micro-LED chips 12 on a prefabricated packaging substrate 11 are encapsulated to achieve flatness on the side of the Micro-LED chips 12 facing away from the prefabricated packaging substrate 11. By encapsulating the multiple Micro-LED chips 12, optical interference between the multiple Micro-LED chips 12 can be prevented. The encapsulation layer 17 can be a single-layer structure or a multi-layer structure, depending on the needs. For example, vinyl is used for encapsulation.

[0074] Step S4A: Exposing the electrodes of the plurality of Micro-LED chips.

[0075] See also Figure 10 , Figure 10 yes Figure 8 A schematic diagram of step S4A in the display panel manufacturing method is provided. Specifically, the encapsulation layer 17 is etched to expose the electrodes 121 of the multiple Micro-LED chips 12 so as to be electrically connected to the electrodes 161 on the driving substrate 16.

[0076] Step S5A: Bonding the prefabricated packaging substrate provided with a plurality of Micro-LED chips to the driving substrate, so that the plurality of Micro-LED chips are electrically connected to the driving substrate.

[0077] See also Figure 11 , Figure 11 yes Figure 8 The schematic diagram of step S5A in the method for manufacturing a display panel is provided. Step S5A in the second embodiment of the method for manufacturing a display panel is the same as step S3 in the first embodiment of the method for manufacturing a display panel, and will not be described in detail.

[0078] The second embodiment of the display panel manufacturing method provided in this application uses laser transfer technology to adhere the horizontal structural side of the Micro-LED chip 12 to the prefabricated packaging substrate 11. Multiple Micro-LED chips 12 are then packaged to further secure them, improving the structural stability of the display panel. The above structure is then bonded to the driver substrate 16, solving the problem of developing a conductive buffer layer on the driver substrate 16 to receive the laser-transferred Micro-LED chips 12. This also allows for control of the light output pattern and improved light output. The prefabricated packaging substrate 11 not only serves as a carrier substrate during the laser transfer of the Micro-LED chips 12, but also as a packaging structure, eliminating the need for a cover plate as in the prior art.

[0079] See also Figure 12 , Figure 12It is a schematic flowchart of the third embodiment of the display panel manufacturing method provided by this application.

[0080] Step S1B: Provide a prefabricated packaging substrate.

[0081] Step S1B in the third embodiment of the display panel manufacturing method is the same as Step S1 in the first embodiment of the display panel manufacturing method, and will not be elaborated here.

[0082] Step S2B: Transfer multiple Micro-LED chips on the transfer substrate to the prefabricated packaging substrate.

[0083] Step S2B in the third embodiment of the display panel manufacturing method is the same as Step S2 in the first embodiment of the display panel manufacturing method, and will not be elaborated here.

[0084] Step S3B: Package multiple Micro-LED chips to form a packaging layer; the packaging layer is located on the side of the multiple Micro-LED chips away from the prefabricated packaging substrate.

[0085] Step S3B in the third embodiment of the display panel manufacturing method is the same as Step S3A in the second embodiment of the display panel manufacturing method, and will not be elaborated here.

[0086] Step S4B: Expose the electrodes of multiple Micro-LED chips.

[0087] Step S4B in the third embodiment of the display panel manufacturing method is the same as Step S4A in the second embodiment of the display panel manufacturing method, and will not be elaborated here.

[0088] Step S5B: Prepare electrode extension lines on the side of the packaging layer away from the prefabricated packaging substrate, and the electrode extension lines are electrically connected to the electrodes of multiple Micro-LED chips.

[0089] Please refer to Figure 13 , Figure 13 is Figure 12 a schematic structural diagram of Step S5B in the display panel manufacturing method provided. Specifically, electrode extension lines 18 are prepared on the side of the packaging layer 17 away from the prefabricated packaging substrate 11. The electrode extension lines 18 are arranged on the surface of the packaging layer 17 facing away from the prefabricated packaging substrate 11. One end of the electrode extension line 18 is electrically connected to the electrode of the Micro-LED chip 12 exposed from the packaging layer 17. By providing the electrode extension lines 18, the alignment accuracy between the subsequent Micro-LED chips 12 and the driving substrate 16 can be increased, the alignment difficulty is reduced, and the yield is beneficial to be improved.

[0090] Step S6B: Bond the prefabricated packaging substrate provided with multiple Micro-LED chips to the driving substrate, so that the multiple Micro-LED chips are electrically connected to the driving substrate.

[0091] Please refer to Figure 14 , Figure 14 which Figure 12 is a schematic structural diagram of step S6B in the display panel manufacturing method provided

[0092] Step S6B in the third embodiment of the display panel manufacturing method is the same as step S3 in the first embodiment of the display panel manufacturing method, and will not be described in detail

[0093] In the third embodiment of the display panel manufacturing method provided by the present application, through the laser transfer technology, the horizontal structure side of the Micro-LED chip 12 is adhered to the prefabricated packaging substrate 11; then, multiple Micro-LED chips 12 are encapsulated, further fixing the multiple Micro-LED chips 12 and improving the structural stability of the display panel; and an electrode extension line 18 is designed on the side of the encapsulation layer 17 away from the prefabricated packaging substrate 11 to increase the alignment accuracy; then, the above structure is bonded to the driving substrate 16 at one time, solving the problem of developing the conductive buffer adhesive layer for receiving the Micro-LED chips 12 transferred by laser on the driving substrate 16, and the light emission pattern can be controlled and the light emission effect can be improved. Among them, the prefabricated packaging substrate 11 not only serves as a carrier substrate during the process of laser transferring Micro-LED chips 12, but also can serve as an encapsulation structure, eliminating the need for a cover plate in the prior art

[0094] Please refer to Figure 15 , Figure 15 which

[0095] is a schematic flow diagram of the fourth embodiment of the display panel manufacturing method provided by the present application

[0096] Step S1C: Provide a prefabricated packaging substrate

[0097] Step S1C in the fourth embodiment of the display panel manufacturing method is the same as step S1 in the first embodiment of the display panel manufacturing method, and will not be described in detail

[0097] Step S2C: Transfer multiple Micro-LED chips on the transfer substrate to the prefabricated packaging substrate

[0098] Step S2C in the fourth embodiment of the display panel manufacturing method is the same as step S2 in the first embodiment of the display panel manufacturing method, and will not be described in detail

[0099] Step S3C: Encapsulate multiple Micro-LED chips to form an encapsulation layer; the encapsulation layer is located on the side of the multiple Micro-LED chips away from the prefabricated packaging substrate

[0100] Step S3C in the fourth embodiment of the display panel manufacturing method is the same as step S3A in the second embodiment of the display panel manufacturing method, and will not be described in detail

[0101] Step S4C: Expose the electrodes of multiple Micro-LED chips.

[0102] Step S4C in the fourth embodiment of the display panel manufacturing method is the same as Step S4A in the second embodiment of the display panel manufacturing method, and will not be elaborated here.

[0103] Step S5C: Prepare electrode extension lines on the side of the encapsulation layer away from the prefabricated encapsulation substrate, and the electrode extension lines are electrically connected to the electrodes of multiple Micro-LED chips.

[0104] Step S5C in the fourth embodiment of the display panel manufacturing method is the same as Step S5B in the third embodiment of the display panel manufacturing method, and will not be elaborated here.

[0105] Step S6C: Provide an adhesive layer on one side of the encapsulation layer and / or the driving substrate.

[0106] Please refer to Figure 16 , Figure 16 is Figure 15 a schematic structural diagram of Step S6C in the provided display panel manufacturing method. Specifically, the adhesive layer 19 is provided on the side of the encapsulation layer 17 away from the prefabricated encapsulation substrate 11; or, the adhesive layer 19 is provided on the side of the driving substrate 16 where the electrode 161 is provided (as shown in Figure 16 ); or, the adhesive layer 19 is provided on both the side of the encapsulation layer 17 away from the prefabricated encapsulation substrate 11 and the side of the driving substrate 16 where the electrode 161 is provided. By providing the adhesive layer 19 between the encapsulation layer 17 and the driving substrate 16, the prefabricated encapsulation substrate 11 with the encapsulation layer 17 is easily bonded to the driving substrate 16, improving the structural stability of the display panel and having no pores therebetween.

[0107] Step S7C: Bond the prefabricated encapsulation substrate with multiple Micro-LED chips to the driving substrate, so that multiple Micro-LED chips are electrically connected to the driving substrate.

[0108] Please refer to Figure 17 , Figure 17 is Figure 15 a schematic structural diagram of Step S7C in the provided display panel manufacturing method.

[0109] Step S7C in the fourth embodiment of the display panel manufacturing method is the same as Step S3 in the first embodiment of the display panel manufacturing method, and will not be elaborated here.

[0110] The fourth embodiment of the display panel manufacturing method provided by this application uses a laser transfer technology to adhere the horizontal structure side of the Micro-LED chip 12 to the prefabricated packaging substrate 11. Then, multiple Micro-LED chips 12 are encapsulated, further fixing the multiple Micro-LED chips 12 and improving the structural stability of the display panel. An electrode extension line 18 is designed on the side of the encapsulation layer 17 away from the prefabricated packaging substrate 11 to increase the alignment accuracy. Then, the above structure is bonded to the driving substrate 16 provided with an adhesive layer 19 at one time, solving the problem of developing a conductive buffer adhesive layer for the Micro-LED chips 12 received by the driving substrate 16 during laser transfer, and enabling control of the light emission pattern and improvement of the light emission effect. Among them, the prefabricated packaging substrate 11 not only serves as a carrier substrate during the laser transfer of the Micro-LED chips 12 but also can serve as an encapsulation structure, eliminating the need for a cover plate in the prior art.

[0111] Please refer to Figure 18 , Figure 18 which is a schematic structural diagram of the display panel provided by the embodiment of this application.

[0112] The display panel provided by the embodiment of this application can be manufactured by any one of the above display panel manufacturing method embodiments. When manufacturing a display panel using any one of the above display panel manufacturing method embodiments, the display panel includes a prefabricated packaging substrate 11, a driving substrate 16, and multiple Micro-LED chips 12. The prefabricated packaging substrate 11 and the driving substrate 16 are arranged opposite to each other, and the multiple Micro-LED chips 12 are arranged between the driving substrate 16 and the prefabricated packaging substrate 11, and there is no conductive buffer adhesive layer between the multiple Micro-LED chips 12 and the driving substrate 16; the multiple Micro-LED chips 12 are electrically connected to the driving substrate 16. Among them, the multiple Micro-LED chips 12 are fixed on the side of the prefabricated packaging substrate 11 facing the driving substrate 16.

[0113] Taking the fourth embodiment of the display panel manufacturing method as an example to manufacture a display panel, the structure of the display panel will be introduced.

[0114] The prefabricated packaging substrate 11 includes a packaging substrate 111 and a buffer adhesive material 112. A plurality of pits 1111 are provided on one side of the packaging substrate 111, and the buffer adhesive material 112 is filled in the pits 1111; a plurality of Micro-LED chips 12 are fixed to the packaging substrate 111 through the buffer adhesive material 112. The pits 1111 are conducive to controlling the light emission pattern of the Micro-LED chips 12 disposed thereon. The refractive index of the buffer adhesive material 112 meets the light extraction design of the Micro-LED chips 12, which is conducive to the light extraction of the Micro-LED chips 12 and improves the light extraction effect. Among them, the packaging substrate 111 can be a rigid film material or a flexible film material. When the packaging substrate 111 is a rigid film material, it can be a PCB board, glass, etc.; when the packaging substrate 111 is a flexible film material, it can be a PI adhesive material. It can be understood that since the driving substrate 16 is rigid, when the packaging substrate 111 is selected as a flexible film material, it is easier to operate when the prefabricated packaging substrate 11 provided with the Micro-LED chips 12 is attached to the driving substrate 16. For example, a roller method can be used for operation.

[0115] The display panel further includes a packaging layer 17. The packaging layer 17 covers the side of the plurality of Micro-LED chips 12 away from the prefabricated packaging substrate 11 and fills the gaps between the plurality of Micro-LED chips 12. The electrodes 121 of the plurality of Micro-LED chips 12 are exposed on one side of the packaging layer 17. By encapsulating the plurality of Micro-LED chips 12, light interference between the plurality of Micro-LED chips 12 can be prevented, and it is also conducive to improving the structural stability of the display panel.

[0116] The display panel further includes an electrode extension line 18. The electrode extension line 18 is disposed on the side of the packaging layer 17 away from the prefabricated packaging substrate 11 and is electrically connected to the electrodes 121 of the plurality of Micro-LED chips 12 through solder 15, without a conductive buffer layer. By providing the electrode extension line 18, the alignment accuracy between the subsequent Micro-LED chips 12 and the driving substrate 16 can be increased, the alignment difficulty can be reduced, and it is conducive to improving the yield.

[0117] The display panel further includes an adhesive layer 19. The adhesive layer 19 is disposed between the packaging layer 17 and the driving substrate 16. By providing the adhesive layer 19 between the packaging layer 17 and the driving substrate 16, the prefabricated packaging substrate 11 with the packaging layer 17 is easily bonded to the driving substrate 16, improving the structural stability of the display panel, and there are no pores between them.

[0118] It can be understood that the packaging layer 17, the electrode extension line 18, and the adhesive layer 19 in the display panel are optional structures and can be selected according to needs.

[0119] It can be understood that the display panel provided in the present application can be applied to display device fields such as desktop computers, laptop computers, personal digital assistants (PDAs), mobile phones, and televisions.

[0120] The above are only the implementation manners of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present application.

Claims

1. A method for preparing a display panel, characterized in that, Comprising: Obtain a packaged substrate, on one side of which there are a plurality of pits; Fill the pits with a buffer adhesive material to obtain a prefabricated packaged substrate; Transfer the Micro-LED chips on the transfer substrate to the buffer adhesive material by means of laser transfer; Bond the prefabricated packaged substrate provided with a plurality of the Micro-LED chips to the driving substrate, so that a plurality of the Micro-LED chips are electrically connected to the driving substrate; Wherein, before the step of bonding the prefabricated packaged substrate provided with a plurality of the Micro-LED chips to the driving substrate, further comprising: Encapsulate a plurality of the Micro-LED chips to form an encapsulation layer; the encapsulation layer is located on the side of a plurality of the Micro-LED chips away from the prefabricated packaged substrate; Expose the electrodes of a plurality of the Micro-LED chips; After the step of exposing the electrodes of a plurality of the Micro-LED chips, further comprising: Prepare electrode extension lines on the side of the encapsulation layer away from the prefabricated packaged substrate, and the electrode extension lines are electrically connected to the electrodes of a plurality of the Micro-LED chips; Before the step of bonding the prefabricated packaged substrate provided with a plurality of the Micro-LED chips to the driving substrate, further comprising: Provide an adhesive layer on one side of the encapsulation layer and / or the driving substrate.

2. The preparation method according to claim 1, wherein The packaged substrate is a rigid film material or a flexible film material.

3. A display panel prepared by using the method for preparing a display panel according to claim 1 or 2, characterized in that, Comprising: A driving substrate; A prefabricated packaged substrate, disposed opposite to the driving substrate; A plurality of Micro-LED chips, fixed on the side of the prefabricated packaged substrate facing the driving substrate; a plurality of the Micro-LED chips are electrically connected to the driving substrate; There is no conductive buffer adhesive layer between a plurality of the Micro-LED chips and the driving substrate.

4. The display panel according to claim 3, wherein The prefabricated packaged substrate includes a packaged substrate and a buffer adhesive material, on one side of the packaged substrate there are a plurality of pits, and the buffer adhesive material is filled in the pits; A plurality of the Micro-LED chips are fixed to the packaged substrate through the buffer adhesive material.

5. A display device, characterized in that, Comprising the display panel according to any one of claims 3-4.

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