Laminating device
By designing a bonding device containing multiple modules, automatic tearing and bonding during workpiece bonding is achieved, solving the problems of low efficiency and low accuracy in the traditional method, and improving processing efficiency and accuracy.
Patent Information
- Application Number
- CN202080096989.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-10-30
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2040-10-30
AI Technical Summary
In the process of workpiece bonding, traditional methods require manual tearing of film and bonding, resulting in low efficiency and low accuracy.
A bonding device including a feeding module, a material taking module, a driving module, a first peeling module, a second peeling module, a vehicle module and a conveying line module is designed to automatically tear and bond the parts to be bonded through an automated process.
The automated operation of the parts to be fitted is realized, the processing efficiency and accuracy are improved, and the need for manual intervention is reduced.
Smart Images

Figure CN116194298B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a bonding device, and in particular to a bonding device capable of automatically tearing off a film and bonding parts to be bonded. Background Art
[0002] At present, when a workpiece is bonded to a part to be bonded, such as a graphite sheet, it is necessary to first tear off the release paper on the adhesive side of the graphite sheet, then bond the graphite sheet to the workpiece, and finally tear off the protective film on the non-adhesive side of the graphite sheet. During the assembly process, the traditional operation method is to manually tear off the film, bond, etc., which has the problems of low efficiency and low precision. Summary of the invention
[0003] In view of this, it is necessary to provide a bonding device that can automatically tear off the film and bond the part to be bonded to the workpiece.
[0004] In one embodiment of the present application, a bonding device is provided, including a base plate, a feeding module, a picking module, a driving module, a first stripping module, a second stripping module, a carrier module and a conveyor line module, wherein the base plate is used for carrying. The feeding module is used for storing the parts to be bonded. The picking module is used for adsorbing the parts to be bonded. The first stripping module is used for clamping and stripping the first film layer of the parts to be bonded. The second stripping module is fixed to the picking module, and is used for clamping and stripping the second film layer of the parts to be bonded. The carrier module is used for positioning the workpiece. The conveyor line module is arranged above the carrier module, and the conveyor line module is used for conveying the workpiece to the carrier module. The feeding module, the first stripping module, the driving module, the carrier module and the conveyor line module are arranged on the base plate. The driving module is used to drive the material picking module to adsorb the workpiece to be bonded and move it to the first stripping module, the first stripping module is used to clamp the first film layer of the workpiece to be bonded, and the driving module cooperates with the first stripping module to strip the first film layer; the driving module is used to further drive the material picking module to move to the workpiece on the carrier module, and drive the material picking module to press the workpiece to be bonded on the workpiece, the second stripping module is used to clamp the second film layer of the workpiece to be bonded, and the driving module cooperates with the second stripping module to strip the second film layer.
[0005] Furthermore, in some embodiments, the bonding device also includes a rolling module, which is arranged between the material picking module and the second stripping module, and the rolling module is used to press the part to be bonded onto the workpiece; the rolling module includes a roller and a lifting cylinder, and the roller is used to press the part to be bonded onto the workpiece under the drive of the lifting cylinder.
[0006] Further, in some embodiments, the first stripping module is fixedly connected to the base plate, and includes a clamping cylinder, a first clamping jaw and a second clamping jaw, the first clamping jaw and the second clamping jaw are used to clamp the first film layer, and the clamping cylinder is fixedly connected to the base plate, and the clamping cylinder is used to drive the first clamping jaw and the second clamping jaw to move closer or farther to clamp or release the first film layer.
[0007] Further, in some embodiments, the first stripping module is rotatably connected to the base plate, and includes a clamping cylinder, a first clamping jaw, a second clamping jaw, a square cylinder, an arc slide rail, a connecting piece, a connecting rod and a bearing. One end of the connecting piece is fixedly connected to the square cylinder, and the other end is connected to one end of the connecting rod. The other end of the connecting rod is connected to the bearing, and the bearing is installed in the arc slide rail. The clamping cylinder is connected to the connecting rod, and the square cylinder is used to drive the connecting piece to move, so that the connecting piece drives the connecting rod to rotate, and then drives the clamping cylinder, the first clamping jaw and the second clamping jaw to rotate together.
[0008] Furthermore, in some embodiments, a first connecting hole and a second connecting hole are opened on the bottom plate, the first connecting hole is used to collect the first film layer torn off by the first stripping module, the second connecting hole is located on one side of the first stripping module and close to the conveying line module, and the second connecting hole is used to collect the second film layer torn off by the second stripping module.
[0009] Furthermore, in some embodiments, the first connecting hole and the second connecting hole are simultaneously connected to a collection box, and the first film layer torn off by the first stripping module and the second film layer torn off by the second stripping module both fall into the collection box.
[0010] Furthermore, in some embodiments, the material picking module includes a fixed plate, an adsorption plate, an elastic member and a guide member, the fixed plate is installed on the driving module, and the adsorption plate is placed under the fixed plate; one end of the guide member is installed on the adsorption plate, and the other end is slidably passed through the fixed plate; the two ends of the elastic member are respectively connected to the fixed plate and the adsorption plate, and elastically push the adsorption plate downward; the adsorption plate is provided with a plurality of adsorption holes for adsorbing the parts to be bonded.
[0011] Further, in some embodiments, the second stripping module includes a supporting member, an adsorption member, a propulsion cylinder, a linkage mechanism and a pressing member, the supporting member is mounted on the driving module, the adsorption member and the propulsion cylinder are arranged on the supporting member; the adsorption member is provided with an adsorption hole, and the adsorption hole is used to adsorb the second film layer; the pressing member is connected to the propulsion cylinder through the linkage mechanism, and the propulsion cylinder is used to drive the pressing member to press the adsorption member so that the adsorption member and the pressing member clamp the second film layer.
[0012] Further, in some embodiments, the linkage mechanism includes a guide rod, a push block and a connecting rod, the guide rod is installed on the supporting member, the push block is slidably connected to the guide rod, the push block is provided with a sliding portion, the pressing member is provided with a receiving groove, the sliding portion is slidably placed in the receiving groove, the pressing member is connected to the supporting member through a connecting rod, and after the thrust cylinder drives the push block to move along the guide rod, the sliding portion is used to drive the pressing member to swing so as to press or move away from the adsorption member.
[0013] Further, in some embodiments, the carrier module includes a substrate, at least two first centering blocks, at least two second centering blocks, a cylinder, a first guide rail, a second guide rail and a connecting rod mechanism, the substrate is used to carry the workpiece, the first guide rail and the second guide rail are respectively arranged along the first direction and the second direction; the first centering block and the second centering block are respectively slidably arranged on the substrate through the first guide rail and the second guide rail, and are respectively used to clamp the workpiece to be bonded; the cylinder is installed on the substrate, and drives the first centering block and the second centering block to move closer or farther away at the same time through the connecting rod mechanism to clamp or release the workpiece to be bonded.
[0014] Further, in some embodiments, the connecting rod mechanism includes a slider, a first connecting rod, a second connecting rod and a guide column, the slider is connected to the cylinder and is passed through the guide column, and the guide column is arranged along the first direction to guide the slider; the first connecting rod is rotatably mounted on the substrate, and its two ends are respectively connected to the slider and the first centering block on one side, and the first centering block on the other side is fixedly connected to the slider, and the two ends of the second connecting rod are respectively connected to the slider and a second centering block, and the slider moves along the first direction to drive the first centering blocks and the second centering blocks on the opposite sides to approach each other to clamp the parts to be bonded.
[0015] Furthermore, in some embodiments, the conveyor line module includes two parallel belts, a top support guide wheel, a bottom support guide wheel, a side support guide wheel and a belt lifting motor, the belt is used to convey the workpiece, the bottom support guide wheel, the side support guide wheel and the bottom support guide wheel are used to support the belt, and the belt lifting motor is connected to the top support guide wheel and is used to lift or lower the top support guide wheel to lift or lower the belt.
[0016] In one embodiment of the present application, a bonding device is provided, including a feeding module, a picking module, a driving module, a first stripping module, a second stripping module, a carrier module and a conveyor line module. The feeding module is used to store the parts to be bonded including an upper film and a lower film. The picking module is used to adsorb and press the parts to be bonded. The driving module and the picking module are arranged on the driving module, and the driving module is used to drive the picking module to move along the first direction and the second direction. The carrier module is used to position the workpiece. The conveyor line module is arranged above the carrier module, and the conveyor line module is arranged along a third direction, and the conveyor line module is used to convey the workpiece to the carrier module along the third direction. The driving module is used to drive the material picking module to move along the first direction to the feeding module to adsorb the part to be bonded, and move to the first stripping module. The first stripping module and the driving module cooperate to complete the operation of tearing off the film on the part to be bonded. The driving module further drives the material picking module along the second direction to press the part to be bonded onto the workpiece. The driving module and the second stripping module cooperate to complete the operation of tearing off the film on the part to be bonded.
[0017] Furthermore, in some embodiments, the bonding device also includes a rolling module, which is arranged between the material picking module and the second stripping module, and the rolling module is used to press the part to be bonded onto the workpiece; the rolling module includes a roller and a lifting cylinder, and the roller is used to press the part to be bonded onto the workpiece under the drive of the lifting cylinder.
[0018] Further, in some embodiments, the first stripping module includes a clamping cylinder, a first clamping jaw and a second clamping jaw, the first clamping jaw and the second clamping jaw are used to clamp the upper film, and the clamping cylinder is used to drive the first clamping jaw and the second clamping jaw to move closer or farther to clamp or release the upper film.
[0019] Further, in some embodiments, the first stripping module includes a clamping cylinder, a first clamping jaw, a second clamping jaw, a square cylinder, an arc slide rail, a connecting piece, a connecting rod and a bearing, one end of the connecting piece is fixedly connected to the square cylinder, and the other end is connected to one end of the connecting rod, the other end of the connecting rod is connected to the bearing, and the bearing is installed in the arc slide rail, the clamping cylinder is connected to the connecting rod, and the square cylinder is used to drive the connecting piece to move, so that the connecting piece drives the connecting rod to rotate, and then drives the clamping cylinder, the first clamping jaw and the second clamping jaw to rotate together.
[0020] Further, in some embodiments, the second stripping module includes a supporting member, an adsorption member, a propulsion cylinder, a linkage mechanism and a pressing member, the supporting member is mounted on the driving module, the adsorption member and the propulsion cylinder are arranged on the supporting member; the adsorption member is used to adsorb the lower film; the pressing member is connected to the propulsion cylinder through the linkage mechanism, and the propulsion cylinder is used to drive the pressing member to press the adsorption member to clamp the lower film.
[0021] Furthermore, in some embodiments, the bonding device also includes a base plate for supporting the feeding module, the first stripping module, the driving module, the carrier module and the conveying line module, and a first connecting hole and a second connecting hole are provided on the base plate, and the second connecting hole is located on one side of the first stripping module and close to the conveying line module, and the first connecting hole and the second connecting hole are simultaneously connected to a collecting box, and the collecting box is used to collect the upper film and the lower film torn off by the first stripping module and the second stripping module.
[0022] The above-mentioned bonding device firstly takes material from the feeding module through the material taking module, then tears off the first film layer through the first stripping module, and then drives the material taking module to bond the part to be bonded to the surface of the workpiece through the driving module, and finally drives the second stripping module to tear off the second film layer through the driving module, thereby achieving the purpose of automatically bonding the part to be bonded to the workpiece and improving the processing efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a three-dimensional schematic diagram of a bonding device in one embodiment of the present application.
[0024] Figure 2 for Figure 1 A three-dimensional schematic diagram of the middle material taking module, the rolling module and the second stripping module.
[0025] Figure 3 It is a three-dimensional schematic diagram of a feeding module in one embodiment of the present application.
[0026] Figure 4 It is a three-dimensional schematic diagram of a material taking module in one embodiment of the present application.
[0027] Figure 5 for Figure 4 Schematic diagram of the bottom of the middle feeding module.
[0028] Figure 6 It is a three-dimensional schematic diagram of the first stripping module and the bottom plate in one embodiment of the present application.
[0029] Figure 7 for Figure 6 A three-dimensional schematic diagram of the first stripping module.
[0030] Figure 8 for Figure 7 Exploded view of the first stripping module.
[0031] Fig. 9 It is a three-dimensional schematic diagram of a first stripping module in another embodiment of the present application.
[0032] Fig.10 It is a three-dimensional schematic diagram of a second stripping module in one embodiment of the present application.
[0033] Fig.11 for Fig.10 A three-dimensional schematic diagram of another state of the second stripping module.
[0034] Fig.12 It is a three-dimensional schematic diagram of a rolling module in one embodiment of the present application.
[0035] Fig.13 for Figure 1 Side view of the middle rolling module, the material taking module and the second stripping module.
[0036] Fig.14 for Fig.13 A side view of the middle rolling module, the material taking module and the second stripping module in another state.
[0037] Fig.15 for Fig.14 A side view of the middle rolling module, the material taking module and the second stripping module in another state.
[0038] Fig.16 It is a three-dimensional schematic diagram of a carrier module in one embodiment of the present application.
[0039] Fig.17 for Fig.16 A three-dimensional diagram of the bottom of the medium vehicle module.
[0040] Fig.18A A side view of the conveyor line module lifting the workpiece from the carrier module.
[0041] Fig.18B A side view of the conveyor line module dropping the workpiece onto the carrier module.
[0042] Fig.19 It is a side view of a conveyor line module in one embodiment of the present application.
[0043] Fig. 20 It is a three-dimensional schematic diagram of a conveyor line module in one embodiment of the present application. DETAILED DESCRIPTION
[0044] The technical solution of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.
[0045] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.
[0047] In one embodiment of the present application, a bonding device is provided, including a base plate, a feeding module, a picking module, a driving module, a first stripping module, a second stripping module, a carrier module and a conveyor line module, wherein the base plate is used for carrying. The feeding module is used for storing the parts to be bonded. The picking module is used for adsorbing the parts to be bonded. The first stripping module is used for clamping and stripping the first film layer of the parts to be bonded. The second stripping module is fixed to the picking module, and is used for clamping and stripping the second film layer of the parts to be bonded. The carrier module is used for positioning the workpiece. The conveyor line module is arranged above the carrier module, and the conveyor line module is used for conveying the workpiece to the carrier module. The feeding module, the first stripping module, the driving module, the carrier module and the conveyor line module are arranged on the base plate. The driving module is used to drive the material picking module to adsorb the workpiece to be bonded and move it to the first stripping module, the first stripping module is used to clamp the first film layer of the workpiece to be bonded, and the driving module cooperates with the first stripping module to strip the first film layer; the driving module is used to further drive the material picking module to move to the workpiece on the carrier module, and drive the material picking module to press the workpiece to be bonded on the workpiece, the second stripping module is used to clamp the second film layer of the workpiece to be bonded, and the driving module cooperates with the second stripping module to strip the second film layer.
[0048] In one embodiment of the present application, a bonding device is also provided, including a feeding module, a material taking module, a driving module, a first stripping module, a second stripping module, a carrier module and a conveyor line module. The feeding module is used to store the parts to be bonded including an upper film and a lower film. The material taking module is used to adsorb and press the parts to be bonded. The driving module and the material taking module are arranged on the driving module, and the driving module is used to drive the material taking module to move along the first direction and the second direction. The carrier module is used to position the workpiece. The conveyor line module is arranged above the carrier module, and the conveyor line module is arranged along a third direction, and the conveyor line module is used to convey the workpiece to the carrier module along the third direction. The driving module is used to drive the material picking module to move along the first direction to the feeding module to adsorb the part to be bonded, and move to the first stripping module. The first stripping module and the driving module cooperate to complete the operation of tearing off the film on the part to be bonded. The driving module further drives the material picking module along the second direction to press the part to be bonded onto the workpiece. The driving module and the second stripping module cooperate to complete the operation of tearing off the film on the part to be bonded.
[0049] The above-mentioned bonding device firstly takes material from the feeding module through the material taking module, then tears off the first film layer through the first stripping module, and then drives the material taking module to bond the part to be bonded to the surface of the workpiece through the driving module, and finally drives the second stripping module to tear off the second film layer through the driving module, thereby achieving the purpose of automatically bonding the part to be bonded to the workpiece and improving the processing efficiency and accuracy.
[0050] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0051] Figure 1 1 is a three-dimensional schematic diagram of a laminating device 100 in one embodiment of the present application. The laminating device 100 is used to laminat e a piece 200 to be laminat e to a workpiece. The laminating device 100 comprises a base plate 100a and a feeding module 10, a material taking module 20, a driving module 30, a first stripping module 40, a second stripping module 50, a rolling module 60, a carrier module 70 and a conveyor line module 80 arranged on the base plate 100a. The feeding module 10 is used to store a plurality of pieces 200 to be laminat e. The piece 200 to be laminat e comprises a first film layer and a second film layer respectively arranged on opposite sides. Specifically, in the present embodiment, the first film layer of the piece 200 to be laminat e is a lower film having a release paper affixed to its adhesive surface, and the second film layer of the piece 200 to be laminat e is an upper film having a protective film affixed to its non-adhesive surface. In order to facilitate grasping, the area of the release paper is larger than the area of the piece 200 to be laminat e.
[0052] The material taking module 20, the second stripping module 50 and the rolling module 60 are fixed together on the driving module 30. The driving module 30 is used to drive the material taking module 20 to move together with the second stripping module 50 and the rolling module 60 to the feeding module 10 to allow the material taking module 20 to take materials. The driving module 30 further drives the material taking module 20 carrying the to-be-bonded piece 200 to move to the first stripping module 40, so that the first stripping module 40 can strip the release paper on the to-be-bonded piece 200 to expose the adhesive surface of the to-be-bonded piece 200. The driving module 30 then drives the material taking module 20 carrying the to-be-bonded piece 200 with the stripped release paper back to the top of the conveyor line module 80. The conveyor line module 80 carries multiple workpieces in real time. When one of the workpieces moves to the top of the carrier module 70, the conveyor line module 80 moves down, and the workpiece falls onto the carrier module 70 and automatically achieves positioning to wait for the piece 200 to be bonded. The drive module 30 then drives the material taking module 20 to move down to bond the piece 200 to be bonded to the workpiece. After bonding, the drive module 30 drives the material taking module 20, the rolling module 60 and the second stripping module 50 to rise to a preset position together. The rolling module 60 further moves downward relative to the material taking module 20 to press the workpiece with the piece 200 to be bonded. After rolling, the rolling module 60 is reset, and the second stripping module 50 can move downward relative to the rolling module 60 to further strip the protective film on the non-adhesive surface of the piece 200 to be bonded. The conveyor module 80 lifts the bonded workpiece to make it leave the carrier module 70, and the conveyor module 80 further drives the bonded workpiece to move to the next workstation. The drive module 30 further drives the material taking module 20 to move to the next material taking position, and repeats the above steps. The bonding device 100 realizes the process of automatically taking materials, tearing off the film, bonding, pressing and tearing off the film.
[0053] Figure 3 for Figure 1Schematic diagram of the feeding module 10 in FIG. The feeding module 10 is mounted on the bottom plate 100a, and includes a base 10a and a lifting mechanism 11. The base 10a is fixed on the bottom plate 100a. In order to accurately position the piece 200 to be bonded, two positioning holes are preset on the piece 200 to be bonded, and two positioning rods 10b are provided on the base 10a. The relative positions of the positioning rods 10b correspond to the positions of the two positioning holes on the piece 200 to be bonded, so as to allow the positioning rods 10b to be inserted into the positioning holes and then guide the movement of the piece 200 to be bonded. In the present embodiment, the piece 200 to be bonded is a graphite sheet, which is in the form of a sheet and is arranged on the positioning rods 10b in the form of multiple sheets stacked. The lifting mechanism 11 is used to lift the piece 200 to be bonded below when the material taking module 20 sequentially takes away the piece 200 to be bonded above the feeding module 10, so as to move the piece 200 to be bonded below to the top. In order to prevent the material taking module 20 from interfering with the positioning rod 10b, after the material taking module 20 takes away the lower piece to be bonded 200, the lifting mechanism 11 should promptly lift the next piece to be bonded 200. In one embodiment, the gap between the positioning rod 10b and the positioning hole is between 0 and 0.03 mm to ensure the loading accuracy.
[0054] See also Figure 3 In one embodiment, the lifting mechanism 11 includes a lifting rail 12, a lifting seat 13, a motor 14, a screw 15, a guide rod 16, a fixing member 17 and a moving seat 18. The lifting rail 12 is placed at the bottom of the base 10a. The lifting seat 13 is slidably placed on the lifting rail 12 and can be lifted and lowered in the vertical direction. The motor 14 is placed at the bottom of the lifting seat 13 and is connected to the screw 15. The fixing member 17 is fixedly mounted on the base 10a. The top of the screw 15 is threadedly penetrated by the fixing member 17. Two guide rods 16 are respectively placed on both sides of the screw 15 and slidably penetrate the base 10a. The moving seat 18 is placed above the base 10a and is connected to the top of the guide rod 16. The moving seat 18 is used to carry the stacked pieces 200 to be bonded. The motor 14 can drive the screw 15 to rotate forward or reverse, so that the screw 15 rises or falls under the action of the fixing member 17, drives the lifting seat 13 to rise or fall along the lifting rail 12, and then drives the moving seat 18 to rise or fall. When the material taking module 20 takes away the upper pieces to be bonded 200 in sequence, the moving seat 18 rises to transfer the lower pieces to be bonded 200 to the upper side, so that the material taking module 20 can take away the lower pieces to be bonded 200.
[0055] Specifically, in one embodiment, the base 10a of the feeding module 10 is further provided with a beam-type optical fiber sensor (not shown), which is placed on both sides of the workpiece 200 to be bonded, and is used to sense the position of the workpiece 200 to be bonded, so as to ensure that the material taking module 20 takes the material stably and accurately. A material-free alarm (not shown) is added to the bottom of the base 10a, which alarms after the workpiece 200 to be bonded is used up, and reminds to replenish the workpiece 200 to be bonded.
[0056] Please refer to Figure 2 The material taking module 20 together with the second stripping module 50 and the rolling module 60 are fixed on the driving module 30. When taking materials, the material taking module 20 together with the second stripping module 50 and the rolling module 60 move to the feeding module 10 to allow the material taking module 20 to take materials. Figure 4 , the material taking module 20 includes a fixed plate 21, an adsorption plate 22, a plurality of elastic members 23 and a plurality of guide members 24. The fixed plate 21 is mounted on the driving module 30, and is used to fix the material taking module 20 to the driving module 30. The adsorption plate 22 is placed below the fixed plate 21 for adsorbing the workpiece 200 to be bonded. One end of the guide member 24 is mounted on the adsorption plate 22, and the other end is slidably penetrated through the fixed plate 21, and is used to guide the movement of the adsorption plate 22. The elastic member 23 is placed between the fixed plate 21 and the adsorption plate 22, and the two ends are respectively connected to the fixed plate 21 and the adsorption plate 22, and elastically pushes the adsorption plate 22 downward so as to press the workpiece 200 to be bonded onto the workpiece. The adsorption plate 22 is provided with a plurality of adsorption holes, and each adsorption hole is connected to a negative pressure member through a plurality of pipes 22a, and the negative pressure member is used to generate a vacuum negative pressure to adsorb the workpiece 200 to be bonded. In one embodiment, the material taking module 20 includes four guide members 24 and two elastic members 23. A connecting plate 24a is connected between each of two guide members 24 passing through one end of the fixing plate 21. A stopper 25 is fixedly mounted on the connecting plate 24a to limit the upward movement of the adsorption plate 22.
[0057] In order to ensure the positioning accuracy, the positioning rod 10b (such as Figure 3 As shown in the figure, the distance between the positioning hole and the bonding piece 200 will be very close, resulting in the friction between the bonding piece 200 and the positioning rod 10b when picking up the material, which may cause the material to be picked up unsuccessfully. Therefore, the number and position of the multiple adsorption holes of the adsorption plate 22 are arranged according to the needs to strengthen the local suction force and improve the success rate of picking up the material. Please refer to Figure 5 In one embodiment, seven adsorption holes are provided at the bottom of the adsorption plate 22. The first adsorption hole A is located at the position of tearing off the release paper. When tearing off the release paper, the torque at this place is relatively large, which is used to prevent the material from falling off when tearing off the release paper. The second adsorption hole B is used to absorb the rear area of the part to be bonded, which plays an auxiliary stabilizing role. The third adsorption hole C is located around a positioning rod 10b. Since there is a large friction force in this area, the third adsorption hole C can reduce the material picking arm and increase the success rate of material picking. The fourth adsorption hole D is used to absorb the rear area of the part to be bonded, which plays an auxiliary stabilizing role. The fifth adsorption hole E is close to the position of tearing off the release paper to prevent the material from falling off. The sixth adsorption hole F is balanced with the third adsorption hole C in force to achieve the best material picking state. The seventh adsorption hole G is located around another positioning rod 10b. Since there is a large friction force in this area, the seventh adsorption hole G can reduce the material picking arm and increase the success rate of material picking. In other embodiments, the adsorption plate 22 may also be provided with other adsorption holes with different numbers and positions.
[0058] The first stripping module 40 is mounted on the bottom plate 100a of the laminating device 100 and is located on one side of the feeding module 10. Figure 6 , a shielding wall 40a is provided on the upper surface of the bottom plate 100a, a collecting box 40b is provided on the lower surface of the bottom plate 100a, and a first connecting hole 100b is opened on the bottom plate 100a, and the first connecting hole 100b connects the cavity formed by the shielding wall 40a and the collecting box 40b. The first stripping module 40 is used to tear off the release paper of the to-be-bonded piece 200 above the shielding wall 40a. After the first stripping module 40 releases the release paper, the release paper falls freely into the first connecting hole 100b in the shielding wall 40a by gravity. The shielding wall 40a is used to ensure that the release paper passes through the first connecting hole 100b and enters the collecting box 40b during the process of the release paper falling. The collecting box 40b is used to collect a plurality of dropped release papers so as to recycle the release papers.
[0059] The bottom plate 100a is also provided with a second connecting hole 100c, which is located on one side of the first stripping module 40 and is arranged close to the conveying line module 80. The second connecting hole 100c is also connected to the collection box 40b. After the second stripping module 50 tears off the protective film of the to-be-bonded piece 200, the driving module 30 drives the second stripping module 50 together with the protective film to move above the second connecting hole 100c. After the second stripping module 50 releases the protective film, the protective film falls into the collection box 40b through the second connecting hole 100c by gravity, so as to recover the protective film.
[0060] Please refer to Figure 7 and Figure 8 In one embodiment, the first stripping module 40 is fixed on the bottom plate 100a. The first stripping module 40 includes a clamping cylinder 41, a first clamping jaw 42 and a second clamping jaw 43. In order to facilitate clamping, the area of the release paper 400 needs to be larger than the area of the part to be bonded 200, so the first clamping jaw 42 and the second clamping jaw 43 can clamp the part of the release paper 400 extending out of the part to be bonded 200, and the clamping position is located at the front end of the release paper 400 in the moving direction of the part to be bonded 200, so that the release paper 400 gradually separates from the part to be bonded 200 during the process of the material taking module 20 driving the part to be bonded 200 to move forward. The clamping cylinder 41 is fixed on the bottom plate 100a, and is used to drive the first clamping jaw 42 and the second clamping jaw 43 to move closer or farther away, so as to clamp or release the release paper 400.
[0061] The first clamping jaw 42 is provided with an inclined surface 42a on the side facing the to-be-bonded piece 200. The inclined surface 42a is used to form an escape space on the side facing the to-be-bonded piece 200, so that the material taking module 20 can drive the to-be-bonded piece 200 to continue to move forward and upward, and then peel off the release paper 400. The second clamping jaw 43 is provided with a plurality of suction holes 43a on the side holding the release paper 400. The suction holes 43a are connected inside the second clamping jaw 43, and are connected to a vacuum negative pressure device through an interface 43b on the side of the second clamping jaw 43. The vacuum negative pressure device absorbs the release paper 400 through the suction holes 43a to prevent the release paper 400 from separating from the first clamping jaw 42 and the second clamping jaw 43.
[0062] See also Fig. 9 In another embodiment, the first stripping module 40 is rotatably connected to the bottom plate 100a to assist in tearing off the release paper 400, so as to improve the efficiency of tearing off the release paper 400. In this embodiment, in addition to the clamping jaw cylinder 41, the first clamping jaw 42 and the second clamping jaw 43 in the first embodiment, the first stripping module 40 also includes a square cylinder 44, an arc slide 45, a connecting member 46, a connecting rod 47 and two bearings 48. The arc slide 45 is fixed on the bottom plate 100a, and an arc groove 45a is provided on the arc slide 45, and the arc of the arc groove 45a is 90 degrees. The square cylinder 44 is installed at the bottom of the arc slide 45. One end of the connecting member 46 is fixedly connected to the square cylinder 44, and the other end is rotatably connected to the upper end of the connecting rod 47. The two ends of the connecting rod 47 are rotatably connected to the bearings 48, and the two bearings 48 are respectively slidably and rotatably installed in the arc groove 45a. At the same time, the bottom of the clamping jaw cylinder 41 is fixedly mounted on the connecting rod 47. After the first clamping jaw 42 and the second clamping jaw 43 clamp the release paper 400, the square cylinder 44 retracts, driving the connecting member 46 to move straightly and obliquely downward, and then the connecting member 46 drives the connecting rod 47 to move downward, and because the two ends of the connecting rod 47 are placed in the arc groove 45a through the bearing 48, the linear movement of the connecting member 46 will be converted into the counterclockwise rotation and oblique downward movement of the connecting rod 47, thereby enabling the release paper 400 to be more efficiently separated from the to-be-bonded piece 200. In other embodiments, the arc of the arc groove 45a can also be at other angles, such as 120 degrees.
[0063] See also Figure 1 The driving module 30 includes a slide rail 31, a slide rail motor 33 and a lifter 32. The slide rail 31 is horizontally arranged and perpendicular to the conveying direction of the conveyor line module 80. The lifter 32 is slidably mounted on the slide rail 31, and the slide rail motor 33 is used to drive the lifter 32 to reciprocate along the slide rail 31 along the X-axis to approach or move away from the conveyor line module 80. The conveyor line module 80 conveys the workpiece along the Y-axis direction, and the material picking module 20 is mounted on the lifter 32. The lifter 32 is used to drive the material picking module 20 to rise and fall along the Z-axis to absorb or bond the workpiece to be bonded.
[0064] Specifically, see Figure 1 , one end of the slide rail 31 is close to the conveyor line module 80 and is placed above the conveyor line module 80. The feeding module 10 is located at the end of the slide rail 31 away from the conveyor line module 80, and the first stripping module 40 is located between the feeding module 10 and the conveyor line module 80, so that after the material taking module 20 obtains the to-be-bonded part from the feeding module 10, it moves to the first stripping module 40 to strip the release paper 400, and then moves to the conveyor line module 80 to bond the to-be-bonded part 200.
[0065] Fig.10 It is a three-dimensional schematic diagram of the second stripping module 50 in one embodiment of the present application. The second stripping module 50 includes a bearing member 51, an adsorbing member 52, a propulsion cylinder 53, a linkage mechanism 54, a pressing member 55, a connecting member 56, a lifting cylinder 57 and a sliding column 58. The bearing member 51 is connected to the driving module 30. The adsorbing member 52 and the propulsion cylinder 53 are arranged on the bearing member 51. An adsorption hole (not shown) is provided at the bottom of the adsorbing member 52, and the adsorption hole is connected to a negative pressure member for adsorbing the part of the protective film 500 extending out of the part to be bonded 200. The pressing member 55 is connected to the propulsion cylinder 53 through the linkage mechanism 54. The propulsion cylinder 53 is used to drive the pressing member 55 to press the bottom of the adsorbing member 52, so that the adsorbing member 52 and the pressing member 55 clamp the protective film 500, and then the protective film 500 can be peeled off. The connecting member 56 is installed on the rolling module 60 by screws to fix the second stripping module 50 to the rolling module 60, and then connect the material taking module 20, so that the second stripping module 50 moves with the material taking module 20. The sliding column 58 is installed on the supporting member 51 and passes through the connecting member 56 to guide the supporting member 51. The lifting cylinder 57 is installed on the connecting member 56 to drive the supporting member 51 to rise and fall, so as to absorb or lift the protective film 500. In one embodiment, the part of the protective film 500 extending out of the to-be-bonded member 200 is a rectangular surface, and a pressing piece 55a is provided at one end of the pressing member 55 close to the adsorbing member 52. After the adsorbing member 52 adsorbs the rectangular surface of the protective film 500, the lifting cylinder 57 lifts it a certain distance, so that the pressing member 55 can drive the pressing piece 55a to move to the bottom of the rectangular surface and press the rectangular surface upward to prevent the rectangular surface from falling off during the peeling process of the protective film 500.
[0066] Please combine Fig.10 and Fig.11 , Fig.10 The pressing member 55 is away from the adsorption member 52. Fig.11The state in which the pressing member 55 is close to the adsorption member 52. In one embodiment, the linkage mechanism 54 includes a guide rod 54a, a push block 54b and four connecting rods 54c. The guide rod 54a is horizontally arranged and mounted on the supporting member 51. The push block 54b is slidably connected to the guide rod 54a and can slide along the guide rod 54a. The push block 54b is provided with a sliding portion 54d, and the sliding portion 54d is a roller to reduce friction. A receiving groove 55b is provided at one end of the pressing member 55 close to the guide rod 54a, and the receiving groove 55b is vertically arranged. The sliding portion 54d is slidably placed in the receiving groove 55b, and is used to push the groove wall of the receiving groove 55b to drive the pressing member 55 to move. The pressing member 55 is connected to the supporting member 51 through four connecting rods 54c, and every two connecting rods are placed on opposite sides of the pressing member 55 and are arranged parallel to each other to form a parallelogram structure. After the propulsion cylinder 53 drives the push block 54b to move along the guide rod 54a, the sliding portion 54d can push against the groove wall of the receiving groove 55b, thereby driving the pressing member 55 to swing to press or move away from the adsorption member 52, thereby clamping or releasing the protective film 500.
[0067] See also Fig.12 The rolling module 60 includes a roller 61, a moving block 62, a fixed block 63, an elastic member 64, a lifting cylinder 65, a straight rod 66 and a mounting plate 67. The mounting plate 67 is fixedly mounted on the fixed plate 21 so that the rolling module 60 is fixedly connected to the material taking module 20 to move with the material taking module 20. The lifting cylinder 65 is mounted on the top of the mounting plate 67, and the bottom passes through the mounting plate 67 to connect the fixed block 63. The bottom of the straight rod 66 is fixedly connected to the fixed block 63, and the top passes through the mounting plate 67 to guide the movement of the fixed block 63. Both ends of the roller 61 are installed at the bottom of the moving block 62. The roller 61 is used to press the workpiece to be bonded onto the workpiece under the drive of the lifting cylinder 65, and the driving module 30 drives the rolling module 60 to move back and forth to drive the roller 61 to press the workpiece to be bonded 200.
[0068] See also Fig.13 and Fig.14 When the material taking module 20 absorbs the piece to be bonded 200, the horizontal height of the adsorption plate 22 relative to the bottom plate 100a is below the rolling module 60 and the second stripping module 50. After the piece to be bonded 200 is bonded to the workpiece, the lifting cylinder 65 of the rolling module 60 drives the fixed block 63 to move downward, so that the roller 61 is lower than the horizontal height of the adsorption plate 22, until the roller 61 presses down the piece to be bonded 200, and then the slide rail motor 33 of the driving module 30 drives the material taking module 20 to reciprocate, thereby driving the rolling module 60 to reciprocate to press the piece to be bonded 200.
[0069] See also Fig.15After the roller 61 has finished rolling the to-be-bonded piece 200, the lifting cylinder 57 of the second stripping module 50 drives the supporting member 51 to move downward, so that the adsorption member 52 is lower than the horizontal height of the adsorption plate 22 to adsorb the protective film. Then the lifting cylinder 57 lifts the adsorption member 52 for a certain distance, so that the pressing member 55 can drive the pressing sheet 55a to move to the bottom of the protective film and press the protective film upward. Finally, the driving module 30 drives the material taking module 20 together with the second stripping module 50 to move toward the second connecting hole 100c, so as to drive the second stripping module 50 to strip the protective film, and it is collected in the collecting box 40b.
[0070] Please refer to Figure 1 , Fig.16 and Fig.17 , the carrier module 70 is arranged below the conveyor line module 80, and is used to position the workpiece 300 to be bonded. The carrier module 70 includes a substrate 70a, at least two first centering blocks 71, at least two second centering blocks 72, a cylinder 73, a first guide rail 74, a second guide rail 75 and a connecting rod mechanism 76. The substrate 70a is used to carry the workpiece 300. The first guide rail 74 and the second guide rail 75 are respectively arranged along the first direction and the second direction, and the second direction is perpendicular to the first direction. The first centering block 71 and the second centering block 72 are respectively slidably arranged on the substrate 70a through the first guide rail 74 and the second guide rail 75, and are respectively used to symmetrically clamp the workpiece 300 along the first direction and the second direction. The cylinder 73 is mounted on the base plate 70a and can drive the connecting rod mechanism 76 to drive the first centering block 71 and the second centering block 72 to move closer or farther at the same time to clamp or release the workpiece 300, and symmetrically position the workpiece 300 on two perpendicular midlines of the base plate 70a.
[0071] In one embodiment, the link mechanism 76 includes a slider 76a, a first link 76b, a second link 76c and a guide post 76d. The slider 76a is connected to the cylinder 73 and is inserted into the guide post 76d. The guide post 76d is arranged along the first direction and is used to guide the slider 76a. Each first link 76b is rotatably mounted on the base plate 70a at a position between the two ends, and the two ends are respectively connected to the slider 76a and the first centering block 71 on one side, and the first centering block 71 on the other side is fixedly connected to the slider 76a and moves with the slider 76a. Each second link 76c is respectively connected to the slider 76a and a second centering block 72 at the two ends, so that after the slider 76a moves along the first direction, it can drive the first centering block 71 and the second centering block 72 on both sides to approach to clamp the workpiece 300.
[0072] In one embodiment, there are two first centering blocks 71 on each side of the workpiece and they are symmetrically arranged. There is one second centering block 72 on each side of the workpiece and they are symmetrically arranged. The two first centering blocks 71 on one side are connected to the bottom of the slider 76a through a connecting plate 71a. A suction cup 70b is provided on the base plate 70a, and the suction cup 70b is used to absorb the workpiece after the workpiece is centered to prevent the workpiece from tilting.
[0073] Please refer to Figure 1 , Fig.18A and Fig.18B , the carrier module 70 is arranged below the conveyor module 80, which is used to position the workpiece 300 to be bonded. The conveyor module 80 includes two parallel belts 81, the workpiece is placed on the belts 81, and the belts 81 move to convey the workpiece 300. The carrier module 70 is placed below the belts 81, and the belts 81 can rise or fall relative to the carrier module 70. When the workpiece 300 moves above the carrier module 70, the belt 81 descends, and the workpiece 300 falls onto the carrier module 70, so that the carrier module 70 positions the workpiece 300; after the workpiece 300 is bonded, the belt 81 rises, and the workpiece 300 moves away from the carrier module 70, so that the belt 81 continues to convey the workpiece.
[0074] See also Fig.19 In order to realize the transmission of the workpiece 300 and the lifting and lowering of the belt 81, the conveyor line module 80 also includes two groups of top support guide wheels 82, two groups of bottom support guide wheels 83, two groups of side support guide wheels 84 and two belt lifting motors 85. The belt 81 is used to transport the workpiece. Each group of bottom support guide wheels 83 is installed on the bottom plate 100a of the laminating device 100, and is used to support and guide the bottom of a belt 81 respectively. Each group of side support guide wheels 84 is used to support and guide the two ends of a belt 81 respectively. Each group of top support guide wheels 82 is used to support and guide the top of a belt 81 respectively. The belt lifting motor 85 is arranged on the bottom plate 100a and is connected to each corresponding group of top support guide wheels 82. The belt lifting motor 85 is used to lift or drop the top support guide wheel 82 to lift or drop the belt 81, thereby lifting or lowering the workpiece. When the workpiece is moved, the belt lifting motor 85 lifts the workpiece. When the workpiece moves to the top of the carrier module 70, the belt lifting motor 85 lowers the belt 81 to make the workpiece fall onto the carrier module 70, thereby centering the workpiece on the carrier module 70. After the workpiece is bonded, the belt lifting motor 85 lifts the workpiece through the supporting guide wheel 82, so that the conveyor line module 80 continues to convey the bonded workpiece to the next station.
[0075] See also Fig. 20In order to stop the workpiece, in one embodiment, the conveyor line module 80 further includes a first stopper block 86, a first stopper cylinder 87, a first bracket 88, a second stopper block 89, a second stopper cylinder 89a and a second bracket 89b. The first bracket 88 is mounted on the bottom plate 100a, the first stopper cylinder 87 is mounted on the first bracket 88, and the first stopper block 86 is connected to the first stopper cylinder 87. The first stopper cylinder 87 is used to drive the first stopper block 86 to rise or fall. When rising, it is used to contact the workpiece and stop the advancement of the next workpiece, so that the workpiece is located at a designated position above the carrier module 70 to prevent the workpiece from moving excessively; when descending, it can continue to move the workpiece after the bonding process is completed with the belt 81. The second bracket 89b is mounted on the bottom plate 100a, the second stopper cylinder 89a is mounted on the second bracket 89b, and the second stopper block 89 is connected to the second stopper cylinder 89a. The second material stopping cylinder 89a is used to drive the second material stopping block 89 to rise or fall. When rising, it is used to stop the workpiece at the rear to prevent the workpiece at the rear from interfering with the workpiece at the front; when descending, it can enable the workpiece to be bonded at the rear to move with the belt 81 to the specified position above the carrier module 70.
[0076] The bonding process of the bonding device 100 is as follows: the slide rail motor 33 drives the material taking module 20, the second stripping module 50 and the rolling module 60 to move along the slide rail 31 to the top of the feeding module 10, the motor 14 drives the screw 15 to rotate, the screw 15 drives the lifting seat 13 to rise along the lifting rail 12, and then drives the moving seat 18 to rise, and then moves the lower part to be bonded 200 to the upper part; the lifter 32 drives the adsorption plate 22 to descend, at this time, as shown in FIG. Fig.13As shown, the rolling module 60 and the second stripping module 50 are higher than the adsorption plate 22; the adsorption plate 22 adsorbs the to-be-bonded piece 200 through a plurality of adsorption holes; after adsorbing the to-be-bonded piece 200, the lifter 32 drives the material taking module 20, the rolling module 60 and the second stripping module 50 to rise together, and the slide rail motor 33 drives the material taking module 20 to move along the slide rail 31 to above the first stripping module 40; the clamping jaw cylinder 41 drives the first clamping jaw 42 and the second clamping jaw 43 to approach each other to clamp the part of the release paper 400 extending out of the to-be-bonded piece 200; the slide rail motor 33 drives the material taking module 20 to move along the slide rail 31, and during the movement, the release paper 400 gradually falls off from the to-be-bonded piece 200, and after falling off, the clamping jaw cylinder 41 drives the first clamping jaw 42 and the second clamping jaw 43 to move away from each other to loosen the release paper 400, The release paper 400 automatically falls into the collection box 40b; the slide rail motor 33 drives the material picking module 20 to move along the slide rail 31 to the top of the carrier module 70, and the belt lifting motor 85 drops the workpiece. At the same time, the cylinder 73 of the carrier module 70 drives the first centering block 71 and the second centering block 72 to clamp the workpiece respectively at the same time, and symmetrically position the workpiece on two midlines perpendicular to the substrate 70a; the lifter 32 drives the material picking module 20 to descend until the adhesive surface of the piece 200 to be bonded is bonded to the workpiece; the adsorption plate 22 of the material picking module 20 stops adsorption, and the lifter 32 drives the material picking module 20, the rolling module 60 and the second stripping module 50 to rise together; after the material picking module 20 rises, the lifting cylinder 65 drives the fixed block 63 to move downward, so that the roller 61 is lower than the horizontal height of the adsorption plate 22, such as Fig.14 As shown, until the roller 61 is pressed down onto the piece to be bonded 200. Then the slide rail motor 33 of the driving module 30 drives the material taking module 20 to move once or reciprocate, thereby driving the rolling module 60 to reciprocate to press the piece to be bonded 200 onto the workpiece; after rolling, the lifting cylinder 65 drives the fixing block 63 to rise and reset; the lifting cylinder 57 of the second stripping module 50 drives the bearing member 51 to move downward until the piece to be bonded 200 is as shown. Fig.15As shown, the bearing member 51 is lower than the rolling module 60 and the material taking module 20, so that the portion of the protective film 500 extending out of the workpiece 200 to be bonded is placed under the adsorption member 52; while the adsorption member 52 adsorbs the protective film 500, the propulsion cylinder 53 drives the push block 54b to move backward along the guide rod 54a, and the sliding portion 54d pushes the groove wall of the receiving groove 55b to drive it to move backward, and the pressing member 55 swings under the constraint of the connecting rod 54c until it presses the adsorption member 52, thereby clamping the protective film 500; the slide rail motor 33 drives the material taking module 20 to move backward, driving the protective film 500 to gradually separate from the workpiece 200 to be bonded; the slide rail motor 33 drives the second peeling module 20 to move backward. After the group 50 moves together with the protective film 500 to above the shielding wall 40a, the propulsion cylinder 53 drives the push block 54b to move forward and reset along the guide rod 54a, so that the pressing part 55 releases the protective film 500, and at the same time the adsorption part 52 stops adsorbing the protective film 500, so that the protective film 500 falls into the collecting box 40b through the second connecting hole 100c; after the workpiece 200 to be bonded is completed, the belt lifting motor 85 lifts the workpiece again to allow the conveyor line module 80 to continue to convey the workpiece; finally, the slide rail motor 33 drives the material picking module 20 to move again along the slide rail 31 to above the feeding module 10, and repeats the above steps to bond the new workpiece 200 to be bonded.
[0077] In one embodiment of the present application, a film laminating operation line (not shown) is further provided, and the film laminating operation line includes the above-mentioned laminating device 100.
[0078] It is understandable that, in other embodiments, the driving module 30 may also add a driving direction, such as the same direction as the conveyor line module 80, so as to drive the rolling module 60 to press the workpiece to be bonded.
[0079] The above-mentioned bonding device 100 firstly takes material from the feeding module 10 through the material taking module 20, then tears off the release paper through the first stripping module 40, and then drives the material taking module 20 through the driving module 30 to bond the part to be bonded to the surface of the workpiece, and finally drives the second stripping module 50 through the driving module 30 to tear off the protective film, thereby achieving the purpose of automatically bonding the part to be bonded to the workpiece and improving the processing efficiency and accuracy.
[0080] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.
Claims
1. A laminating device, characterized in that: include: A feeding module, the feeding module is used to store the parts to be bonded; A material taking module, used for absorbing the parts to be bonded; A first stripping module; A second stripping module is fixed on the material taking module; A carrier module, wherein the carrier module is used to position a workpiece; A conveyor line module is arranged above the carrier module, and the conveyor line module is used to convey the workpiece to the carrier module; A driving module, the material taking module and the second stripping module are arranged on the driving module; A bottom plate, used for carrying the feeding module, the first stripping module, the driving module, the carrier module and the conveying line module; The driving module is used to drive the material taking module to absorb the workpiece to be bonded and move it to the first stripping module, the first stripping module is used to clamp the first film layer of the workpiece to be bonded, and the driving module cooperates with the first stripping module to strip the first film layer; the driving module is used to further drive the material taking module to move to the workpiece on the carrier module, and drive the material taking module to press the workpiece to be bonded on the workpiece, the second stripping module is used to clamp the second film layer of the workpiece to be bonded, and the driving module cooperates with the second stripping module to strip the second film layer; The first film layer is a lower film, and the second film layer is an upper film.
2. The laminating device according to claim 1, characterized in that: The bonding device also includes a rolling module, which is arranged between the material picking module and the second stripping module, and is used to press the part to be bonded onto the workpiece; the rolling module includes a roller and a lifting cylinder, and the roller is used to press the part to be bonded onto the workpiece under the drive of the lifting cylinder.
3. The laminating device according to claim 1, characterized in that: The first stripping module is fixedly connected to the base plate, and includes a clamping cylinder, a first clamping jaw and a second clamping jaw. The first clamping jaw and the second clamping jaw are used to clamp the first film layer. The clamping cylinder is fixedly connected to the base plate, and the clamping cylinder is used to drive the first clamping jaw and the second clamping jaw to move closer or farther away to clamp or release the first film layer.
4. The laminating device according to claim 1, characterized in that: The first stripping module is rotatably connected to the base plate, and includes a clamping cylinder, a first clamping jaw, a second clamping jaw, a square cylinder, an arc slide rail, a connecting piece, a connecting rod and a bearing. One end of the connecting piece is fixedly connected to the square cylinder, and the other end is connected to one end of the connecting rod. The other end of the connecting rod is connected to the bearing, and the bearing is installed in the arc slide rail. The clamping cylinder is connected to the connecting rod, and the square cylinder is used to drive the connecting piece to move, so that the connecting piece drives the connecting rod to rotate, and then drives the clamping cylinder, the first clamping jaw and the second clamping jaw to rotate together.
5. The laminating device according to claim 1, characterized in that: The bottom plate is provided with a first connecting hole and a second connecting hole, the first connecting hole is used to collect the first film layer torn off by the first stripping module, the second connecting hole is located on one side of the first stripping module and is close to the conveying line module, the second connecting hole is used to collect the second film layer torn off by the second stripping module.
6. The laminating device according to claim 5, characterized in that: The first connecting hole and the second connecting hole are connected to a collection box at the same time, and the first film layer torn off by the first stripping module and the second film layer torn off by the second stripping module both fall into the collection box.
7. The laminating device according to claim 1, characterized in that: The material picking module includes a fixed plate, an adsorption plate, an elastic member and a guide member, wherein the fixed plate is mounted on the driving module, and the adsorption plate is placed under the fixed plate; one end of the guide member is mounted on the adsorption plate, and the other end is slidably penetrated through the fixed plate; the two ends of the elastic member are respectively connected to the fixed plate and the adsorption plate, and elastically push the adsorption plate downward; the adsorption plate is provided with a plurality of adsorption holes for adsorbing the parts to be bonded.
8. The laminating device according to claim 1, characterized in that: The second stripping module includes a supporting member, an adsorption member, a propulsion cylinder, a linkage mechanism and a pressing member, the supporting member is mounted on the driving module, the adsorption member and the propulsion cylinder are arranged on the supporting member; the adsorption member is provided with an adsorption hole, and the adsorption hole is used to adsorb the second film layer; the pressing member is connected to the propulsion cylinder through the linkage mechanism, and the propulsion cylinder is used to drive the pressing member to press the adsorption member so that the adsorption member and the pressing member clamp the second film layer.
9. The laminating device according to claim 8, characterized in that: The linkage mechanism includes a guide rod, a push block and a connecting rod. The guide rod is installed on the supporting member. The push block is slidably connected to the guide rod. The push block is provided with a sliding portion. The pressing member is provided with a receiving groove. The sliding portion is slidably placed in the receiving groove. The pressing member is connected to the supporting member through a connecting rod. After the propulsion cylinder drives the push block to move along the guide rod, the sliding portion is used to drive the pressing member to swing so as to press or move away from the adsorption member.
10. The laminating device according to claim 1, characterized in that: The carrier module includes a base plate, at least two first centering blocks, at least two second centering blocks, a cylinder, a first guide rail, a second guide rail and a connecting rod mechanism. The base plate is used to carry the workpiece, and the first guide rail and the second guide rail are respectively arranged along the first direction and the second direction; the first centering block and the second centering block are respectively slidably arranged on the base plate through the first guide rail and the second guide rail, and are respectively used to clamp the workpiece to be bonded; the cylinder is installed on the base plate, and drives the first centering block and the second centering block to move closer or farther at the same time through the connecting rod mechanism to clamp or release the workpiece to be bonded.
11. The laminating device according to claim 10, characterized in that: The connecting rod mechanism includes a slider, a first connecting rod, a second connecting rod and a guide column. The slider is connected to the cylinder and is passed through the guide column. The guide column is arranged along the first direction to guide the slider. The first connecting rod is rotatably mounted on the base plate, and its two ends are respectively connected to the slider and the first centering block on one side, and the first centering block on the other side is fixedly connected to the slider. The two ends of the second connecting rod are respectively connected to the slider and one of the second centering blocks. The slider moves along the first direction to drive the first centering blocks and the second centering blocks on the opposite sides to approach each other so as to clamp the parts to be bonded.
12. The laminating device according to claim 1, characterized in that: The conveyor line module includes two parallel belts, a top support guide wheel, a bottom support guide wheel, a side support guide wheel and a belt lifting motor. The belt is used to convey the workpiece. The bottom support guide wheel, the side support guide wheel and the bottom support guide wheel are used to support the belt. The belt lifting motor is connected to the top support guide wheel and is used to lift or lower the top support guide wheel to lift or lower the belt.
Citation Information
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