Display device and method of manufacturing the same

Abstract

A display device and a manufacturing method thereof are provided. The display device includes a substrate, a transistor over the substrate, the transistor having a semiconductor layer, and a light-emitting structure over the transistor, the light-emitting structure having a first electrode, a second electrode, and an organic layer provided between the first electrode and the second electrode, wherein the substrate includes a hole passing through the substrate and a plurality of grooves surrounding the hole, and wherein the organic layer is discontinuous at the plurality of grooves.

Description

[0001] This application is a divisional application of the invention patent application "Display device and manufacturing method thereof" filed on August 23, 2018, with application number 201810966628.5. Technical Field

[0002] Embodiments of the invention relate to a display device and a method of manufacturing the display device. Background Technology

[0003] Among various types of display devices, organic light-emitting devices have attracted much attention as the next generation of display devices due to their desired characteristics (such as wide viewing angle, high contrast and fast response speed).

[0004] Typically, organic light-emitting display devices include organic light-emitting diodes (OLEDs) and thin-film transistors (TFTs) located on a substrate for self-illumination. Such organic light-emitting display devices can be used as display units in small electronic devices such as mobile phones or in large electronic devices such as televisions.

[0005] Specifically, with increasing interest in flexible display devices, active research is underway into flexible display devices within organic light-emitting displays. To realize flexible display devices, flexible substrates made of materials such as synthetic resins are used instead of traditional glass substrates. Summary of the Invention

[0006] However, because flexible substrates are flexible, handling them in manufacturing processes is not easy. Therefore, flexible substrates can be formed on a support substrate that is sufficiently rigid for various processes, and then separated from the support substrate to efficiently handle the flexible substrate in the manufacturing process.

[0007] Embodiments of the invention provide a display device that prevents moisture from flowing into the display area.

[0008] According to an embodiment of the invention, a display device is provided, the display device comprising: an insulating substrate, wherein a through-hole is defined in the insulating substrate to penetrate the insulating substrate; and an organic layer covering the insulating substrate. In such an embodiment, a blocking region surrounding the through-hole is defined in the insulating substrate, and an interruption portion of the organic layer is disposed in the blocking region.

[0009] In one embodiment, the groove may be defined on an insulating substrate within the blocking area.

[0010] In an embodiment, the groove may include a first sidewall and a second sidewall spaced apart from each other, and the interrupted portion may be defined by the first sidewall.

[0011] In an embodiment, the slope of the first sidewall and the slope of the second sidewall can be substantially the same as each other.

[0012] In an embodiment, the display device may further include electrodes covered with an organic layer, wherein the electrodes may be interrupted at an interruption portion.

[0013] In one embodiment, the electrode may contact the first sidewall, and the electrode may not contact the second sidewall.

[0014] In an embodiment, the display area for displaying the image and the non-display area disposed outside the display area can be defined in an insulating substrate, and the via can be defined in the display area.

[0015] In an embodiment, the insulating substrate may include a first substrate, an inorganic layer, and a second substrate stacked sequentially on top of each other, with the groove defined in the second substrate.

[0016] In one embodiment, the planar shape of the groove can be an annular shape surrounding the through hole.

[0017] In one embodiment, the dam region surrounding the blocking region may be defined in an insulating substrate outside the blocking region, and the dam may be disposed on the insulating substrate within the dam region.

[0018] In the embodiments, multiple dams may be provided, and the dams may include a first dam and a second dam spaced apart from the first dam.

[0019] In an embodiment, the display area for displaying the image and the non-display area disposed outside the display area can be defined in an insulating substrate, and the via can be defined in the display area.

[0020] In an embodiment, the display area may include a first electrode and a second electrode opposite to the first electrode, and an organic layer may be disposed between the first electrode and the second electrode.

[0021] In an embodiment, the organic layer may include an organic light-emitting layer.

[0022] In an embodiment, the display area for displaying the image and the non-display area disposed outside the display area can be defined in an insulating substrate, and the via can be defined in the non-display area.

[0023] According to another embodiment of the present invention, a method of manufacturing a display device includes: forming a dam on a first region of an insulating substrate, wherein the insulating substrate is disposed on a carrier substrate, and the first region, a second region, and a third region are defined in the insulating substrate; forming a laser-cut portion by irradiating a laser beam into the third region along a first direction; forming a groove in the insulating substrate by irradiating a laser beam into the second region in a second direction different from the first direction; and forming an organic layer on the insulating substrate to at least partially cover the groove, wherein an interruption portion where the organic layer is located is formed in the second region.

[0024] In an embodiment, the method may further include: separating the carrier substrate from the insulating substrate; and attaching a protective film to the lower surface of the insulating substrate.

[0025] In an embodiment, the method may further include forming a through hole by removing a portion of the protective film corresponding to the third region.

[0026] In an embodiment, the groove may include a first sidewall and a second sidewall spaced apart from each other, and the interrupted portion may be defined by the first sidewall.

[0027] In an embodiment, the method may further include setting electrodes on an insulating substrate to cover an organic layer. Attached Figure Description

[0028] These and / or other features of the invention will become apparent and more readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 This is a schematic plan view of a display device according to an embodiment;

[0030] Figure 2 yes Figure 1 A magnified view of part 'A';

[0031] Figure 3 It is along Figure 2 A sectional view taken by line I-I';

[0032] Figure 4 It is along Figure 2 A sectional view taken from line II-II';

[0033] Figure 5 yes Figure 3 A magnified view of a portion;

[0034] Figure 6 This is an enlarged view of a portion of a display device according to an optional embodiment;

[0035] Figure 7 This is a cross-sectional view of a display device according to another alternative embodiment;

[0036] Figure 8 This is a schematic plan view of a display device according to another alternative embodiment;

[0037] Figure 9 yes Figure 8 A magnified view of part 'B';

[0038] Figure 10 It is along Figure 9 A sectional view taken from line III-III';

[0039] Figure 11 This is a schematic plan view of a display device according to another alternative embodiment;

[0040] Figure 12 yes Figure 11 A magnified view of part 'C';

[0041] Figures 13 to 19 A diagram illustrating a method of manufacturing a display device according to an embodiment; and

[0042] Figure 20 This is a plan view illustrating a method for manufacturing a display device according to an embodiment. Detailed Implementation

[0043] The invention will now be described more fully below with reference to the accompanying drawings, which illustrate various embodiments. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals throughout indicate the same elements.

[0044] What will be understood is that when an element is referred to as being "on" another element, it can be directly on said other element, or there can be intermediate elements in between. Conversely, when an element is referred to as being "directly" on another element, there are no intermediate elements.

[0045] It will be understood that while the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teaching herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0046] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “the” (including “at least one”) are intended to include the plural forms. “Or” means “and / or”. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that when the terms “comprising” and variations thereof and / or “including” and variations thereof are used in this specification, it indicates the presence of the stated features, regions, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, regions, integrals, steps, operations, elements, components, and / or groups thereof.

[0047] Furthermore, relative terms such as “below” or “bottom” and “above” or “top” may be used here to describe the relationship between one element and another (other) element as shown in the accompanying drawings. It will be understood that relative terms are intended to encompass different orientations of the device other than those depicted in the drawings. For example, if the device in one of the drawings is flipped, an element described as being “below” the other element will subsequently be oriented to be “above” the other element. Thus, depending on the specific orientation of the drawing, the exemplary term “below” can encompass both “below” and “above” orientations. Similarly, if the device in one of the drawings is flipped, an element described as being “below” or “under” the other element will subsequently be oriented to be “above” the other element. Thus, the exemplary terms “below” or “under” can encompass both “above” and “below” orientations.

[0048] As used herein, “about” or “approximate” includes stated values ​​and means that, taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), the values ​​are within an acceptable range of deviation from the particular values ​​as determined by one of ordinary skill in the art.

[0049] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that, unless expressly defined herein, terms (such as those defined in a general dictionary) shall be interpreted as having the same meaning as they have in the relevant field and in the context of this disclosure, and shall not be interpreted in an idealized or overly formalized sense.

[0050] Exemplary embodiments are described herein with reference to cross-sectional views as schematic representations of idealized embodiments. Thus, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances will be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the areas shown herein, but rather include, for example, deviations in shape caused by manufacturing processes. For example, areas shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, acute angles shown may be rounded. Therefore, the areas shown in the figures are purely schematic, and their shapes are not intended to represent the precise shapes of the areas, nor are they intended to limit the scope of the claims.

[0051] In the following description, embodiments of the invention will be illustrated with reference to the accompanying drawings.

[0052] Figure 1 This is a schematic plan view of a display device according to an embodiment. Figure 2 yes Figure 1 A magnified view of part 'A'. Figure 3 It is along Figure 2 A sectional view taken from line I-I'. Figure 4 It is along Figure 2 The sectional view taken from line II-II'. Figure 5 yes Figure 3 A magnified view of a portion of it.

[0053] Reference Figures 1 to 5 An embodiment of the display device includes an insulating substrate 500 and an organic layer EL covering the insulating substrate 500, wherein a through-hole H is defined to pass through the insulating substrate 500.

[0054] The insulating substrate 500 may include a first substrate 501 and a second substrate 502. In embodiments, the first substrate 501 and / or the second substrate 502 may include at least one of polyimide, polyethylene terephthalate (“PET”), polycarbonate, polyethylene naphthalate, polyarylate (“PAR”), and polyetherimide, or may be made of at least one of polyimide, polyethylene terephthalate (“PET”), polycarbonate, polyethylene naphthalate, polyarylate (“PAR”), and polyetherimide. However, the materials of the first substrate 501 and the second substrate 502 are not limited thereto.

[0055] In an alternative embodiment, the insulating substrate 500 may include a material such as metal or glass.

[0056] In one embodiment, the insulating substrate 500 may be a flexible substrate. In such an embodiment, the insulating substrate 500 may be a flexible substrate capable of being bent, rolled, or folded.

[0057] In an embodiment, the insulating substrate 500 may include a first substrate 501, an inorganic layer 400, and a second substrate 502 stacked sequentially on top of each other (see [link to embodiment]). Figure 3 ).

[0058] In embodiments where the insulating substrate 500 is a flexible substrate, the first substrate 501 and the second substrate 502 may include polyimide (“PI”).

[0059] In this embodiment, the inorganic layer 400 may include silicon oxide (SiO2). x ), silicon nitride (SiN) x ) and silicon oxynitride (SiON) x At least one of the following.

[0060] The display area DA and the non-display area NDA can be defined within an insulating substrate 500. The display area DA is the area where the image is displayed, and the non-display area NDA is the area located outside the display area DA. Various signal lines and power lines are arranged in the non-display area NDA to display the image in the display area DA.

[0061] Multiple pixels (not shown) can be defined in the display area DA, and thin-film transistors and organic light-emitting diodes can be disposed in each pixel. This will be described in more detail later.

[0062] The driver integrated circuit IC can be disposed on one side of the non-display area NDA. In one embodiment, for example, the driver integrated circuit IC can be directly mounted on the insulating substrate 500. Although Figure 1 A single driver integrated circuit IC is shown, but the number of driver integrated circuit ICs is not limited to this. In an alternative embodiment, multiple driver integrated circuit ICs may be disposed on the non-display area NDA.

[0063] The driver integrated circuit IC can generate multiple scan signals and / or multiple data signals, and provide the scan signals and / or data signals to the pixels of the display area DA. In such an embodiment, multiple signal lines (not shown) for electrically connecting the driver integrated circuit IC to the pixels can be disposed on the insulating substrate 500.

[0064] In an embodiment of the display device, the through-hole H may be defined to pass through the insulating substrate 500.

[0065] In such an embodiment, the through-hole H can be formed as an opening extending from the upper surface to the lower surface of the insulating substrate 500.

[0066] In an embodiment, when viewed from a plan view in the thickness direction of the display device, the through-hole H can be disposed inside the display area DA. Reference will now be made to... Figure 2 Describe the through hole H and the element located adjacent to the through hole H.

[0067] The aperture region HA (which is the area occupied by the through-hole H) is defined in the display device. In an embodiment, as... Figure 1 and Figure 2 As shown, the planar shape of the through-hole H can be circular. In an alternative embodiment, the planar shape of the through-hole H can be polygonal or elliptical. In another embodiment, the planar shape of the through-hole H can include both straight lines and curves.

[0068] The blocking region BA can be defined as the area surrounding the through hole H. In embodiments where the planar shape of the through hole H is circular, the outer boundary of the blocking region BA can be circular. In such embodiments, the outer boundary of the blocking region BA can be concentric with the outer boundary of the through hole H.

[0069] In such an embodiment, the groove can be provided in the blocking area BA.

[0070] In one embodiment, the first groove GR1, the second groove GR2, and the third groove GR3 may be defined within the blocking region BA of the insulating substrate 500. The first groove GR1, the second groove GR2, and the third groove GR3 may be arranged to surround the through-hole H. In such an embodiment, the planar shape of the first groove GR1, the second groove GR2, and the third groove GR3 may be an annular shape surrounding the through-hole H.

[0071] In an embodiment, such as Figure 2 As shown, three grooves (i.e., the first groove GR1, the second groove GR2, and the third groove GR3) are arranged in the blocking area BA. However, the number of grooves is not limited to three. In alternative embodiments, the number of grooves can be modified in various ways, such as four or more.

[0072] In one embodiment, the first groove GR1, the second groove GR2, and the third groove GR3 may be arranged sequentially on the outside of the through hole H. In an embodiment where the through hole H is circular, when viewed from a plan view, the first groove GR1, the second groove GR2, and the third groove GR3 may have a concentric circle shape with the center of the through hole H as its center.

[0073] The dam area D can be defined as the area surrounding the blocking area BA. In an embodiment, multiple dams can be arranged within the dam area D. In an embodiment, such as... Figure 2 As shown, the first dam D1 and the second dam D2 can be located in the dam area D, but the number of dams is not limited to two. In an alternative embodiment, the number of dams can be one or three or more.

[0074] In one embodiment, as described above, the through-hole H can be disposed inside the display area DA. In such an embodiment where the through-hole H is disposed inside the display area DA, the display area DA can be disposed outside the dam area D.

[0075] Now refer to Figure 3 and Figure 4 The cross-sectional shape of an embodiment of the display device is described in more detail.

[0076] In an embodiment, as described above, the insulating substrate 500 may be a flexible substrate. In an embodiment, the insulating substrate 500 may include a first substrate 501, an inorganic layer 400, and a second substrate 502 stacked sequentially on top of each other, and the first substrate 501 and the second substrate 502 may include PI.

[0077] A buffer layer 100 may be disposed on the second substrate 502. In an embodiment, the buffer layer 100 may be disposed in the display area DA and the dam area D. The buffer layer 100 may not be disposed in the hole area HA. ​​The buffer layer 100 may be partially disposed in the blocking area BA, or may not be disposed in the blocking area BA.

[0078] The buffer layer 100 can effectively prevent impurities that penetrate through the second substrate 502 from penetrating into the layer above the buffer layer 100, and can flatten the upper surface of the second substrate 502.

[0079] In an embodiment, the buffer layer 100 may include at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, and titanium nitride.

[0080] In an embodiment, the buffer layer 100 may include at least one of polyimide, polyester, and acrylic acid.

[0081] In an embodiment, such as Figure 3 As shown, the buffer layer 100 may have a single-layer structure. However, the structure of the buffer layer 100 is not limited to a single-layer structure. In an alternative embodiment, the buffer layer 100 may have a multilayer structure comprising a stack of multiple functional films.

[0082] A semiconductor pattern layer 700 may be disposed on the buffer layer 100. In one embodiment, the semiconductor pattern layer 700 may include an inorganic semiconductor such as amorphous silicon or polycrystalline silicon. In an alternative embodiment, the semiconductor pattern layer 700 may include an organic semiconductor or an oxide semiconductor.

[0083] In an embodiment, the semiconductor patterned layer 700 may include a source region (not shown) and a drain region (not shown). The source electrode SE, which will be described later, may be electrically connected to the source region of the semiconductor patterned layer 700, and the drain electrode DE, which will be described later, may be electrically connected to the drain region of the semiconductor patterned layer 700.

[0084] The gate insulating film GI can be disposed on the semiconductor patterned layer 700. The gate insulating film GI can be disposed in the display area DA and the dam area D. The gate insulating film GI may not be disposed in the via area HA. ​​The gate insulating film GI may be partially disposed in the blocking area BA, or may not be disposed in the blocking area BA.

[0085] In one embodiment, the ends of the gate insulating film GI and the ends of the buffer layer 100 can be aligned with each other. In such an embodiment, as... Figure 3 As shown, the sidewalls of the gate insulating film GI and the sidewalls of the buffer layer 100 can be aligned with each other.

[0086] In an embodiment, the gate insulating film GI may include at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0087] The gate electrode GE can be disposed on the gate insulating film GI. The gate electrode GE may include at least one of aluminum alloy containing aluminum (Al)-based metal, silver alloy containing silver (Ag)-based metal, copper alloy containing copper (Cu)-based metal, molybdenum alloy containing molybdenum (Mo)-based metal, chromium (Cr), titanium (Ti), and tantalum (Ta).

[0088] An interlayer insulating film (ILD) can be disposed on the gate electrode GE to cover the gate electrode GE. The interlayer insulating film (ILD) can be disposed in the display area DA and the dam area D. The interlayer insulating film (ILD) may not be disposed in the via area HA. ​​The interlayer insulating film (ILD) may be partially disposed in the blocking area BA or may not be disposed in the blocking area BA.

[0089] In one embodiment, the ends of the interlayer insulating film (ILD) and the ends of the gate insulating film (GI) can be aligned with each other. In another embodiment, the sidewalls of the interlayer insulating film (ILD) and the sidewalls of the gate insulating film (GI) can be aligned with each other. In yet another embodiment, the sidewalls of the interlayer insulating film (ILD), the sidewalls of the gate insulating film (GI), and the sidewalls of the buffer layer 100 can be aligned with each other.

[0090] In an embodiment, such as Figure 3 and Figure 4 As shown, the interlayer insulating film (ILD) is a single film. However, the interlayer insulating film (ILD) is not necessarily a single film. In an alternative embodiment, the interlayer insulating film (ILD) can be a stack of two or more functional layers.

[0091] The source electrode SE and drain electrode DE are disposed on the interlayer insulating film ILD. In an embodiment, the interlayer insulating film ILD may expose the source and drain regions of the semiconductor patterned layer 700, and the source electrode SE and drain electrode DE may contact the semiconductor patterned layer 700 through the exposed source and drain regions. Therefore, each of the source electrode SE and drain electrode DE may be electrically connected to the semiconductor patterned layer 700.

[0092] In the embodiments, the gate electrode GE, the source electrode SE, and the drain electrode DE can collectively define a thin-film transistor.

[0093] Thin-film transistors can be driving transistors used to drive organic light-emitting diodes.

[0094] In an embodiment, such as Figure 3 The diagram illustrates a top-gate display device with the gate electrode GE disposed on the semiconductor patterning layer 700. However, the display device is not limited to a top-gate display device. In an alternative embodiment, the display device may employ a bottom-gate design with the gate electrode GE disposed below the semiconductor patterning layer 700.

[0095] A passivation film 600 may be disposed on the source electrode SE, the drain electrode DE, and the interlayer insulating film ILD. The passivation film 600 may partially cover the interlayer insulating film ILD. In such an embodiment, the passivation film 600 may partially expose the drain electrode DE.

[0096] The first electrode 201, the organic layer EL, and the second electrode 202 can be disposed on the passivation film 600. The first electrode 201, the organic layer EL, and the second electrode 202 can together define an organic light-emitting diode.

[0097] In one embodiment, the first electrode 201 may be an anode. The first electrode 201 may be disposed on the passivation film 600 and may contact the drain electrode DE exposed through the passivation film 600. In such an embodiment, the first electrode 201 may be electrically connected to the drain electrode DE.

[0098] In one embodiment, the first electrode 201 may be a reflective electrode. In such an embodiment, the reflective electrode may include a reflective film and a transparent or translucent electrode disposed on the reflective film, wherein the reflective film includes at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, and Cr.

[0099] The transparent or semi-transparent electrode may include at least one of indium tin oxide (“ITO”), indium zinc oxide (“IZO”), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (“IGO”), and aluminum zinc oxide (“AZO”).

[0100] A pixel defining layer (PDL) including insulating material may be disposed on the first electrode 201. The pixel defining layer (PDL) may expose at least a portion of the first electrode 201.

[0101] The organic layer EL can be disposed on the pixel-defining layer PDL and the first electrode 201. The organic layer EL may include an organic light-emitting layer containing low molecular weight organic materials or high molecular weight organic materials.

[0102] In an embodiment, the organic light-emitting layer can emit light in one of the following colors: red, green, and blue.

[0103] In such embodiments, the organic layer EL may further include at least one of a hole transport layer (“HTL”), a hole injection layer (“HIL”), an electron transport layer (“ETL”), and an electron injection layer (“EIL”).

[0104] In one embodiment, the organic layer EL may cover at least a portion of the insulating substrate 500. In such an embodiment, the organic layer EL may at least partially cover the display area DA, the dam area D, and the blocking area BA.

[0105] The second electrode 202 can be disposed on the organic layer EL. In an embodiment, the second electrode 202 can be a cathode.

[0106] In an embodiment, the second electrode 202 may be a full-surface electrode covering the entire surface of the insulating substrate 500.

[0107] The second electrode 202 may cover the organic layer EL. In an embodiment where the organic layer EL covers the display area DA, the non-display area NDA, the dam area D, and the blocking area BA, the second electrode 202 may cover the display area DA, the non-display area NDA, the dam area D, and the blocking area BA.

[0108] In an embodiment, the second electrode 202 may be a transparent electrode or a semi-transparent electrode. In an embodiment, the second electrode 202 may include at least one of Li, Ca, LiF / Ca, LiF / Al, Al, Ag, and Mg. In an embodiment, the second electrode 202 may include a metal thin film with low work function or be made of a metal thin film with low work function.

[0109] In the embodiments, the transparent or semi-transparent electrode may include at least one of ITO, IZO, zinc oxide (ZnO), indium oxide (In2O3), IGO, and AZO.

[0110] In an embodiment, the display device may be a top-emission type display device in which light generated by the organic layer EL is emitted toward the second electrode 202.

[0111] In an alternative embodiment, the display device may be a bottom-emission type display device in which light generated by the organic layer EL is emitted toward the first electrode 201. In such an embodiment, the second electrode 202 may be a reflective electrode, and the first electrode 201 may be a transparent electrode or a translucent electrode.

[0112] In another alternative embodiment, the display device may be a dual-emission type display device in which light generated by the organic layer EL is emitted toward the first electrode 201 and the second electrode 202.

[0113] The encapsulation film 300 may be disposed on the second electrode 202. In an embodiment, the encapsulation film 300 may include a first inorganic film 301, a first organic film 302, and a second inorganic film 303.

[0114] The first inorganic membrane 301 may include silicon oxide (SiO2). x ), silicon nitride (SiN) x ) and silicon oxynitride (SiON) x At least one of the following.

[0115] In an embodiment, such as Figure 3 and Figure 4 As shown, the first inorganic membrane 301 may have a single-layer structure. However, the structure of the first inorganic membrane 301 is not limited to a single-layer structure. In an alternative embodiment, the first inorganic membrane 301 may have a multilayer structure comprising a stack of multiple functional membranes.

[0116] In this embodiment, the first inorganic film 301 may be made of silicon oxide (SiO2). x The film made of silicon nitride (SiN) and the film made of silicon nitride (SiN) x The membranes are made by alternating stacking of membranes. A first organic membrane 302 may be disposed on a first inorganic membrane 301. The first organic membrane 302 may be disposed on a first inorganic membrane 301 and may have a sufficiently large thickness (e.g., approximately 30,000 angstroms). (thickness) to flatten the steps formed by the pixel-defined layer PDL.

[0117] In an embodiment, the first organic film 302 may include at least one of epoxy resin, acrylate and polyurethane acrylate.

[0118] The second inorganic film 303 can be disposed on the first organic film 302. The second inorganic film 303 may include silicon oxide (SiO2). x ), silicon nitride (SiN) x ) and silicon oxynitride (SiON) x At least one of the following.

[0119] exist Figure 3In this embodiment, the second inorganic membrane 303 may have a single-layer structure. However, the structure of the second inorganic membrane 303 is not limited to a single-layer structure. In an alternative embodiment, the second inorganic membrane 303 may have a multilayer structure comprising a stack of multiple functional membranes. In an embodiment, the second inorganic membrane 303 may be made of silicon oxide (SiO2). x The film made of silicon nitride (SiN) and the film made of silicon nitride (SiN) x A membrane made by stacking membranes alternately on top of each other.

[0120] Next, we will describe dam area D in detail.

[0121] The buffer layer 100, the gate insulating film GI, and the interlayer insulating film ILD can be disposed in the dam region D. In an embodiment, as shown... Figure 3 As shown, an inorganic film consisting of three layers (i.e., buffer layer 100, gate insulating film GI, and interlayer insulating film ILD) is disposed in the dam region D. However, the inorganic film formed in the dam region D is not limited to this. In an alternative embodiment, an inorganic film consisting of at least one layer may be disposed in the dam region D, said at least one layer being made of the same material as one of the buffer layer 100, gate insulating film GI, and interlayer insulating film ILD.

[0122] The first dam D1 and the second dam D2 can be set on the interlayer insulating film ILD. The first dam D1 is spaced apart from the through hole H.

[0123] In one embodiment, the first dam D1 may define a blocking region BA. In such an embodiment, the blocking region BA may be defined as the area between the first dam D1 and the through hole H.

[0124] In one embodiment, the first dam D1 may comprise or be made of the same material as the pixel defining layer PDL of the display area DA. In such an embodiment, the first dam D1 may be disposed on the same layer as the pixel defining layer PDL. In such an embodiment, the first dam D1 may be formed during the same process as the pixel defining layer PDL. However, the invention is not limited to this. In an alternative embodiment, the first dam D1 may be formed independently of the pixel defining layer PDL.

[0125] The second dam D2 can be spaced apart from the first dam D1. The second dam D2 can be positioned between the display area DA and the first dam D1. The height of the second dam D2 can differ from the height of the first dam D1. The height of the second dam D2 can be smaller than the height of the first dam D1. However, the invention is not limited thereto. In an alternative embodiment, the height of the second dam D2 can be substantially the same as the height of the first dam D1.

[0126] In one embodiment, the second dam D2 may be made of the same material as the passivation film 600 of the display area DA. In such an embodiment, the second dam D2 may be formed during the same process as the passivation film 600. However, the invention is not limited thereto. In an alternative embodiment, the second dam D2 may be formed independently of the passivation film 600.

[0127] The encapsulation film 300 can be set on the first dam D1 and the second dam D2.

[0128] The first inorganic membrane 301, the first organic membrane 302, and the second inorganic membrane 303 can be installed on the second dam D2.

[0129] In this embodiment, only the first inorganic membrane 301 and the second inorganic membrane 303 may be disposed on the first dam D1, while the first organic membrane 302 may not be disposed on the first dam D1.

[0130] In such an embodiment, when the upper surface of the second dam D2 is stacked with the first organic membrane 302, the upper surface of the first dam D1 may not be stacked with the first organic membrane 302.

[0131] In such an embodiment, the first inorganic membrane 301 and the second inorganic membrane 303 can be in direct contact with each other on the first dam D1.

[0132] Next, the blocking area BA will be described in detail.

[0133] In this embodiment, the inorganic membrane may be removed from the blocking region BA or may be partially present in the blocking region BA.

[0134] In an embodiment, the blocking area BA may include a first groove GR1, a second groove GR2, and a third groove GR3.

[0135] As shown above (refer to the reference) Figure 2 The outer circumferences of the first groove GR1, the second groove GR2, and the third groove GR3 can have the shape of concentric circles with different diameters. The first groove GR1, the second groove GR2, and the third groove GR3 can have substantially the same cross-sectional shape as each other.

[0136] In an embodiment, such as Figure 3 and Figure 4 As shown, the first groove GR1, the second groove GR2, and the third groove GR3 have substantially the same width. However, the invention is not limited thereto. In an alternative embodiment, the first groove GR1, the second groove GR2, and the third groove GR3 may have different widths.

[0137] Next, the pore region HA will be described in detail.

[0138] In an embodiment, as described above, the through-hole H can be defined within the hole region HA. In an embodiment, the two sidewalls defining the through-hole H can be tapered. In such an embodiment, as... Figure 4 As shown, the cross-section of the through hole H can narrow from the upper surface of the insulating substrate 500 to the lower surface of the insulating substrate 500.

[0139] Now refer to Figure 5 The cross-sectional shape of the first groove GR1 is described in more detail.

[0140] Figure 5 yes Figure 3 A magnified view of a portion of it.

[0141] Reference Figure 5 The first groove GR1 may include a first sidewall SW1, a bottom surface BS, and a second sidewall SW2.

[0142] The bottom surface BS can be set between the first sidewall SW1 and the second sidewall SW2.

[0143] In one embodiment, the bottom surface BS can be defined by the upper surface of the inorganic layer 400. In such an embodiment, the first groove GR1 can pass through the second substrate 502, but may not pass through the inorganic layer 400 and the first substrate 501. In such an embodiment, the bottom surface BS can be defined by the inorganic layer 400, and the first sidewall SW1 and the second sidewall SW2 can be defined by the sidewalls of the second substrate 502.

[0144] In an embodiment, the height of the first groove GR1 (i.e., the distance from the upper surface of the second substrate 502 to the lower surface BS) may be 5.8 micrometers (μm) or greater.

[0145] In this embodiment, the first sidewall SW1 can form a first angle θ1 with the bottom surface BS. Here, the first angle θ1 can be an acute angle. When the first angle θ1 is an acute angle, the first sidewall SW1 extending from the upper surface of the second base 502 can be steeply inclined.

[0146] The second sidewall SW2 can form a second angle θ2 with the bottom surface BS. In an embodiment, the sum of the second angle θ2 and the first angle θ1 can be approximately 180 degrees.

[0147] In such an embodiment, the second sidewall SW2 and the first sidewall SW1 may extend parallel to each other.

[0148] This will be described later as a slope. The slope of the sidewall can be defined in the cross-section. In an embodiment, the slope can be defined as the slope obtained by... Figure 5The value is obtained by dividing the change in the y-axis direction by the change in the x-axis direction in the planar coordinate system formed by the x-axis and y-axis shown in the figure. Here, slope refers to the degree to which the plane or line is tilted relative to the x-axis.

[0149] In such an embodiment, each of the first sidewall SW1 and the second sidewall SW2 may have a positive or negative slope. In such an embodiment, the first sidewall SW1 and the second sidewall SW2 may have substantially the same slope as each other.

[0150] In an embodiment, such as Figure 5 As shown, each of the first sidewall SW1 and the second sidewall SW2 has a positive slope. In an alternative embodiment, as... Figure 6 As shown, each of the first sidewall SW1 and the second sidewall SW2 has a negative slope.

[0151] The organic layer EL can be disposed on the second substrate 502 and the first groove GR1. The organic layer EL disposed on the insulating substrate 500 may become a path for moisture flow, so moisture generated around the through hole H may flow into the display area DA through the organic layer EL, thereby causing display defects.

[0152] In this embodiment, the organic layer EL is configured to be interrupted to prevent moisture from flowing into the display area DA through the organic layer EL. Here, the term "interruption" can be used to break the continuity of a continuous element. That is, if a continuous element is interrupted, it can become discontinuous, such that the element is divided into multiple parts that are disconnected from each other.

[0153] The organic layer EL, due to its high coverage, cannot be effectively interrupted when formed on a structure with a gentle slope. When the first sidewall SW1 has a steep slope, the organic layer EL can be effectively interrupted, thereby preventing moisture from flowing into the display area DA through the organic layer EL.

[0154] Therefore, in the embodiment, the interrupted portion of the organic layer EL can be located in the blocking region BA.

[0155] In an embodiment, such as Figure 3 and Figure 4 As shown, the first interruption portion CP1, the second interruption portion CP2, and the third interruption portion CP3 are defined in the blocking region BA to correspond to the first groove GR1, the second groove GR2, and the third groove GR3, respectively, but are not limited thereto. Optionally, the number of interruption portions corresponding to the grooves can be modified in various ways based on the number of grooves provided in the interruption portions.

[0156] In the following text, reference will be made to Figure 5The first interrupt section CP1 is described in detail. Since the second interrupt section CP2 and the third interrupt section CP3 are essentially the same as the first interrupt section CP1, any repeated detailed descriptions will be omitted for the sake of convenience.

[0157] In an embodiment, such as Figure 5 As shown, the first interruption portion CP1 can be defined by the first sidewall SW1.

[0158] The first interrupted portion CP1 of the interrupted organic layer EL can have the following structure: a portion of the first sidewall SW1 can contact the organic layer EL, the remaining portion of the first sidewall SW1 can not contact the organic layer EL, and the entire bottom surface BS and the entire second sidewall SW2 can contact the organic layer EL.

[0159] The second electrode 202 can be disposed on the organic layer EL. In an embodiment, the second electrode 202 can be interrupted at the first interruption portion CP1. Therefore, the second electrode 202 can be in direct contact with the first sidewall SW1. The bottom surface BS and the second sidewall SW2 can be in non-direct contact with the second electrode 202 due to the organic layer EL.

[0160] In such an embodiment, the organic layer EL may not cover a portion of the first sidewall SW1, thereby exposing said portion of the first sidewall SW1.

[0161] The first inorganic membrane 301 can be disposed on the second electrode 202. In an embodiment, the first inorganic membrane 301 can be in direct contact with the portion of the first sidewall SW1 exposed by the second electrode 202 and the organic layer EL.

[0162] The second inorganic membrane 303 can be disposed on the first inorganic membrane 301. In such an embodiment, the first inorganic membrane 301 and the second inorganic membrane 303 can be in direct contact with each other in the blocking region BA.

[0163] The second groove GR2 and the third groove GR3 may have substantially the same shape as the first groove GR1. Therefore, any repeated detailed descriptions of the second groove GR2 and the third groove GR3 will be omitted.

[0164] Return to reference Figure 4 The through-hole H can be located inside the blocking region BA. The through-hole H can completely penetrate the insulating substrate 500 to define the area. Therefore, an empty space can be defined in the hole region HA.

[0165] Hereinafter, alternative embodiments of the display device will be described in detail. In the following, elements of such embodiments identical to those described above will be indicated by the same reference numerals, and any repeated detailed descriptions will be omitted or simplified.

[0166] Figure 6 This is a partially enlarged view of a display device according to an optional embodiment. (Refer to...) Figure 6 In this embodiment, within the first groove GR1_1, the first sidewall SW1_1 forms a first angle θ1 with the bottom surface BS1, and the second sidewall SW2_1 forms a second angle θ2 with the bottom surface BS1. Except that the second angle θ2 formed by the second sidewall SW2_1 and the bottom surface BS1 is an acute angle, Figure 6 The embodiments shown are similar to Figure 5 The embodiments shown are essentially the same.

[0167] In such an embodiment, the first angle θ1 formed by the first sidewall SW1_1 and the bottom surface BS1 can be an obtuse angle, and the second angle θ2 formed by the second sidewall SW2_1 and the bottom surface BS1 can be an acute angle.

[0168] In such an embodiment, the first interruption portion CP1_1 may be defined at the second sidewall SW2_1. In such an embodiment, the organic layer EL may be interrupted. Therefore, a portion of the second sidewall SW2_1 may contact the organic layer EL, and the remainder of the second sidewall SW2_1 may not contact the organic layer EL. In such an embodiment, the entire bottom surface BS1 and the entire first sidewall SW1_1 may contact the organic layer EL.

[0169] The second electrode 202 can be disposed on the organic layer EL. In an embodiment, the second electrode 202 can be interrupted at the first interruption portion CP1_1. Therefore, the second electrode 202 can be in direct contact with the second sidewall SW2_1. The bottom surface BS1 and the first sidewall SW1_1 can be kept out of direct contact with the second electrode 202 due to the organic layer EL.

[0170] In such an embodiment, the organic layer EL may not cover a portion of the second sidewall SW2_1, thereby exposing said portion of the second sidewall SW2_1.

[0171] The first inorganic membrane 301 can be disposed on the second electrode 202. In an embodiment, the first inorganic membrane 301 can be in direct contact with the portion of the second sidewall SW2_1 exposed by the second electrode 202 and the organic layer EL.

[0172] Figure 7 This is a cross-sectional view of a display device according to another alternative embodiment.

[0173] Reference Figure 7 The insulating film can be disposed in the undefined groove portion of the blocking area BA.

[0174] In an embodiment, the buffer layer 100, the gate insulating film GI, and the interlayer insulating film ILD may be disposed in portions of the undefined first groove GR1, second groove GR2, and third groove GR3 of the blocking region BA.

[0175] In an embodiment, such as Figure 7 As shown, all the buffer layers 100, gate insulating film GI, and interlayer insulating film ILD are disposed in portions of the undefined first groove GR1, second groove GR2, and third groove GR3 of the blocking region BA. However, the invention is not limited to this configuration.

[0176] In an alternative embodiment, at least one of the buffer layer 100, the gate insulating film GI, and the interlayer insulating film ILD may be disposed in portions of the undefined first groove GR1, second groove GR2, and third groove GR3 of the blocking region BA. In such an embodiment, at least one of the buffer layer 100, the gate insulating film GI, and the interlayer insulating film ILD may be omitted.

[0177] Figure 8 This is a schematic plan view of a display device according to an optional embodiment. Figure 9 yes Figure 8 A magnified view of part 'B'. Figure 10 It is along Figure 9 The sectional view taken from line III-III'.

[0178] Reference Figures 8 to 10 In this embodiment, the through hole H1 can be located in the non-display area NDA.

[0179] Reference Figures 8 to 10 The via H1 can be defined to pass through the insulating substrate 500 in the non-display area NDA. A blocking region BA and a dam region D can be provided around the hole area HA occupied by the via H1. In such an embodiment, the blocking region BA and the dam region D are as described above. Figure 2 The descriptions of the blocking area BA and the dam area D are essentially the same, and any repeated detailed descriptions will be omitted.

[0180] The non-display area NDA can be located outside the dam area D. (See reference...) Figure 10 The first insulating film 801, the second insulating film 802 and the third insulating film 803 can be formed on the second substrate 502 in the non-display area NDA and the dam area D.

[0181] In an embodiment, the first insulating film 801 may include or be made of the same material as the buffer layer 100 of the display area DA, the second insulating film 802 may include or be made of the same material as the gate insulating film GI of the display area DA, and the third insulating film 803 may include or be made of the same material as the passivation film 600 of the display area DA.

[0182] In an embodiment, such as Figure 10 As shown, an insulating film consisting of three layers is disposed in the non-display area NDA and the dam area D. However, the structure of the insulating film is not limited to this. The insulating film can have a single-layer structure or a multilayer structure including four or more stacked layers.

[0183] The first inorganic film 301 and the second inorganic film 303 can be disposed on the third insulating film 803 in the non-display area NDA. In such an embodiment, the first inorganic film 301 and the second inorganic film 303 can be in direct contact with each other in the non-display area NDA.

[0184] However, the invention is not limited to this case. In an alternative embodiment, the first organic membrane 302 may be disposed between the first inorganic membrane 301 and the second inorganic membrane 303 (see [link to original text]). Figure 3 ).

[0185] The first dam D1 and the second dam D2 can be installed on the third insulating film 803 within the dam area D. Since the first dam D1 and the second dam D2 are related to the above reference... Figure 3 The descriptions of the first dam D1 and the second dam D2 are essentially the same, so any repeated detailed descriptions will be omitted.

[0186] Figure 11 This is a schematic plan view of a display device according to another alternative embodiment. Figure 12 yes Figure 11 A magnified view of part 'C'.

[0187] Reference Figure 11 In one embodiment, the through-hole H2 may have a quadrilateral shape. However, in other embodiments of the invention, the shape of the through-hole H2 is not limited to the quadrilateral shape described above.

[0188] Reference Figure 12In an embodiment where the through-hole H2 has a quadrilateral shape, the first groove GR1_2, the second groove GR2_2, and the third groove GR3_2 surrounding the through-hole H2 can also have a quadrilateral shape. In such an embodiment, the planar shape of the through-hole H2 can be similar to the planar shape of the first groove GR1_2, the second groove GR2_2, and the third groove GR3_2.

[0189] In such an embodiment where the through-hole H2 has a quadrilateral shape, the planar shape of each of the first dam D1_2 and the second dam D2_2 can be quadrilateral. The planar shape of the through-hole H2 can be similar to the planar shapes of the first dam D1_2 and the second dam D2_2.

[0190] In an embodiment, such as Figure 12 As shown, the first groove GR1_2, the second groove GR2_2, the third groove GR3_2, the first dam D1_2, and the second dam D2_2 have quadrilateral shapes, and the through hole H2 also has a quadrilateral shape. However, the planar shapes of the first groove GR1_2, the second groove GR2_2, the third groove GR3_2, the first dam D1_2, and the second dam D2_2 are not limited to this.

[0191] In an optional embodiment, the through hole H2 can have a quadrilateral shape, and the planar shapes of the first groove GR1_2, the second groove GR2_2, the third groove GR3_2, the first dam D1_2, and the second dam D2_2 can be as follows: Figure 2 The circular shape in the middle.

[0192] In the following sections, embodiments of methods for manufacturing a display device will be described. Some elements described below may be the same as or similar to those in the embodiments of the display device described above, and therefore any repeated detailed descriptions of the same or similar elements will be omitted.

[0193] Figures 13 to 19 This is a diagram illustrating a method for manufacturing a display device according to an embodiment. Figure 20 This is a plan view illustrating a method of manufacturing a display device according to an embodiment. (Refer to...) Figures 13 to 20 An embodiment of the method for manufacturing a display device includes: providing one or more dams D1 and D2 on a first region A1 of an insulating substrate 500 disposed on a carrier substrate G, wherein the first region A1, a second region A2, and a third region A3 are defined in the insulating substrate 500; forming a laser-cut portion LC by irradiating the third region A3 with a laser beam along a first direction; forming one or more grooves in the insulating substrate 500 by irradiating the second region A2 with a laser beam along a second direction different from the first direction; and providing an organic layer EL on the insulating substrate 500 to partially cover the grooves.

[0194] Reference Figure 13One or more dams D1 and D2 are provided on the first region A1 of the insulating substrate 500 which defines the first region A1, the second region A2 and the third region A3.

[0195] An insulating substrate 500 may be disposed on a carrier substrate G. The carrier substrate G may include glass.

[0196] In one embodiment, the planar shape of the third region A3 can be circular. In such an embodiment, a through-hole H can be formed in the third region A3 in a subsequent process.

[0197] In such an embodiment, the third region A3 can be... Figure 2 or Figure 12 The pore region HA corresponds to.

[0198] In such an embodiment, the first region A1 can be... Figure 2 or Figure 12 The dam area D corresponds to the second area A2, which can be associated with... Figure 2 or Figure 12 The blocking area BA corresponds to.

[0199] In this embodiment, one or more insulating films may be provided in the first region A1. The insulating films may include one or more of a first insulating film 801, a second insulating film 802, and a third insulating film 803.

[0200] In such an embodiment, the insulating film may not be provided in the second region A2 and the third region A3. In another embodiment, the insulating film may be provided on the entire surface of the insulating substrate 500, and then the portions of the insulating film corresponding to the second region A2 and the third region A3 may be removed. In an alternative embodiment, a mask may be used to form the insulating film only in the first region A1.

[0201] In an embodiment, such as Figure 13 As shown, no insulating film is provided in the second region A2 and the third region A3. However, the invention is not limited thereto. In alternative embodiments, one or more of the first insulating film 801, the second insulating film 802, and the third insulating film 803 may be provided in the second region A2 and the third region A3, as in the first region A1.

[0202] In such an embodiment, the structure obtained by such a process, which will be described later, can be as follows: Figure 7 The structure shown.

[0203] A first dam D1 and / or a second dam D2 can be formed on the third insulating film 803 in the first region A1.

[0204] In one embodiment, the first dam D1 may be formed in the same process as the pixel defining layer PDL of the display area DA, but is not limited thereto. In such an embodiment, the second dam D2 may be formed in the same process as the passivation film 600 of the display area DA (see...). Figure 3 ).

[0205] Reference Figure 14 The laser-cut portion LC can be formed by irradiating a laser beam into the third region A3 of the insulating substrate 500 along the first direction.

[0206] In one embodiment, the first direction can be the thickness direction of the insulating substrate 500, i.e., the direction perpendicular to the insulating substrate 500. A first laser beam L1 irradiating along the first direction can completely penetrate the insulating substrate 500. In such an embodiment, the first laser beam L1 can form a laser-cut portion LC that completely penetrates the first substrate 501, the inorganic layer 400, and the second substrate 502.

[0207] In the embodiment, the laser-cut portion LC can be shaped as follows: Figure 15 The ring shown. In an alternative embodiment, the laser-cut portion LC can be shaped into a frame.

[0208] When the laser-cut portion LC is formed into a ring shape, an island pattern 50 can be formed on the inner side of the laser-cut portion LC. The island pattern 50 can then be removed.

[0209] Reference Figure 16 By irradiating a laser beam into the second region A2 along a second direction different from the first direction, one or more grooves GR1 to GR3 are formed in the insulating substrate 500 through the second substrate 502. Each of the one or more grooves GR1 to GR3 has a first sidewall SW1, a second sidewall SW2, and a bottom surface BS.

[0210] The second direction may differ from the first direction. A reference plane RL is defined to describe the second direction. The reference plane RL may be an imaginary plane parallel to the upper surface of the insulating substrate 500.

[0211] The second direction, which serves as the irradiation direction of the second laser beam L2, can form a third angle θ3 with the reference plane RL. In an embodiment, the third angle θ3 can be substantially the same as the first angle θ1 formed by the first sidewall SW1 and the bottom surface BS.

[0212] In such an embodiment, the first angle θ1 and the third angle θ3 can be acute angles.

[0213] The second laser beam L2, which irradiates the insulating substrate 500, can penetrate the second substrate 502. However, because the inorganic layer 400 acts as a barrier layer, the second laser beam L2 may not penetrate the inorganic layer 400 and the first substrate 501.

[0214] The first groove GR1, the second groove GR2, and the third groove GR3 formed by the second laser beam L2 are referenced above. Figure 5 or Figure 6 The first groove GR1, the second groove GR2, and the third groove GR3 are substantially the same. Therefore, any repeated detailed descriptions of the first groove GR1, the second groove GR2, and the third groove GR3 will be omitted.

[0215] In this embodiment, multiple second laser beams L2 may be provided. In this embodiment, such as... Figure 16 As shown, the number of second laser beams L2 is three. However, the number of second laser beams L2 is not limited to three. In alternative embodiments, the number of second laser beams L2 can be one or four or more.

[0216] Reference Figure 17 An embodiment of the method for manufacturing a display device may further include providing an organic layer EL on an insulating substrate 500, providing a second electrode 202 on the organic layer EL, and providing an encapsulation film 300 on the second electrode 202.

[0217] In one embodiment, for example, the organic layer EL can be formed by chemical vapor deposition or inkjet printing, but is not limited thereto.

[0218] An organic layer EL can be formed or disposed on the insulating substrate 500. (See above reference.) Figure 4 As described, the interrupted portions CP1 to CP3 of the interrupted organic layer EL can be defined by forming one or more grooves in the second region A2.

[0219] In this embodiment, chemical vapor deposition can be used to form the second electrode 202.

[0220] The second electrode 202 may have the same characteristics as... Figure 3 The structure of the second electrode 202 is basically the same as that of the second electrode 202.

[0221] An encapsulation film 300 can be disposed or formed on the second electrode 202. The encapsulation film 300 may include a first inorganic film 301, a first organic film 302, and a second inorganic film 303. The encapsulation film 300 can be combined with… Figure 3 The encapsulation film 300 is basically the same.

[0222] Reference Figure 18 An embodiment of the method for manufacturing a display device may further include separating the carrier glass G from the insulating substrate 500 and attaching a protective film PF to the insulating substrate 500.

[0223] In the separating carrier glass G, the island pattern 50 can be removed, or it can be as follows: Figure 18The island pattern 50 is retained as shown. However, even if the island pattern 50 is retained, it will be removed during subsequent processes of cutting the protective film PF.

[0224] The protective film PF can be attached to the lower surface of the insulating substrate 500 to ensure stability in subsequent processes after the separation of the carrier glass G.

[0225] Reference Figure 19 and Figure 20 Embodiments of the method for manufacturing a display device may further include cutting a protective film PF.

[0226] In this embodiment, the portion of the protective film PF corresponding to the third region A3 can be removed. When cutting the protective film PF, the remaining island pattern 50 located in the third region A3 and on the protective film PF can be removed. Therefore, a through-hole H can be formed in the third region A3. The protective film PF can be cut along the laser-cut portion LC. As a result, a structure such as... Figure 20 The through-hole H shown is without island pattern 50.

[0227] In embodiments of the invention, moisture is effectively prevented from penetrating the display area, thereby effectively preventing the occurrence of display defects.

[0228] However, the effects of the embodiments are not limited to those described herein. The above and other effects of the embodiments will become more apparent to those skilled in the art upon reference to the claims.

[0229] While the invention has been specifically shown and described with reference to exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the claims. Exemplary embodiments should be considered descriptive only and not for limiting purposes.

Claims

1. A display device, the display device comprising: Base; A transistor having a semiconductor layer on the substrate; as well as A light-emitting structure is provided on the transistor, the light-emitting structure having a first electrode, a second electrode, and an organic layer disposed between the first electrode and the second electrode. The substrate includes a hole passing through it and a plurality of grooves surrounding the hole. The organic layer is discontinuous at the plurality of grooves.

2. The display device according to claim 1, wherein, The plurality of grooves are embedded below the surface of the substrate and exposed by the surface of the substrate.

3. The display device according to claim 1, wherein, The substrate comprises a first organic layer, a first inorganic layer, a second organic layer, and a second inorganic layer stacked sequentially on top of each other.

4. The display device according to claim 3, wherein, Each of the plurality of grooves has a sidewall below the upper surface of the second organic layer and a bottom exposed by the upper surface of the second organic layer.

5. The display device according to claim 4, wherein, The organic layer has a first portion on the upper surface of the second organic layer and a second portion on the bottom, wherein the first portion and the second portion are spaced apart from each other.

6. The display device according to claim 1, wherein, The plurality of grooves are spaced apart from each other and each has an annular shape in the plan view.

7. The display device according to claim 1, wherein the display device includes a display area surrounding the plurality of recesses, and the transistor is disposed in the display area.

8. The display device according to claim 7, further comprising a dam structure disposed in a plan view between the display area and the plurality of grooves.

9. The display device according to claim 8, further comprising an encapsulation film disposed on the second electrode, wherein, The encapsulation film includes a first inorganic film, a first organic film disposed on the first inorganic film, and a second inorganic film disposed on the first organic film.

10. The display device according to claim 9, wherein, The first inorganic membrane and the second inorganic membrane are in contact with each other on the dam structure.

11. The display device according to claim 10, wherein, At least one of the first inorganic membrane and the second inorganic membrane is continuous at the plurality of grooves.

12. A display device, the display device comprising: The substrate includes a first organic layer and a second organic layer stacked on the first organic layer; A transistor having a semiconductor layer on the substrate; as well as A light-emitting structure is present on the transistor and includes a first electrode, a second electrode, and an organic layer disposed between the first electrode and the second electrode. The substrate includes a hole passing through it and a plurality of grooves surrounding the hole. The organic layer is discontinuous at the plurality of grooves.

13. The display device according to claim 12, wherein, The plurality of grooves are defined by the second organic layer.

14. The display device according to claim 13, wherein, The substrate further includes a first inorganic layer on the first organic layer and a second inorganic layer on the second organic layer.

15. The display device according to claim 12, wherein, Each of the plurality of grooves includes a first sidewall and a second sidewall, and the organic layer is discontinuous at one of the first sidewall and the second sidewall.

16. The display device according to claim 12, further comprising an encapsulation film disposed on the second electrode, wherein, The encapsulation film includes a first inorganic film, a first organic film disposed on the first inorganic film, and a second inorganic film disposed on the first organic film.

17. The display device according to claim 16, wherein, At least one of the first inorganic membrane and the second inorganic membrane is continuous at the plurality of grooves.

18. The display device of claim 12, further comprising a dam structure disposed around the plurality of recesses and between the plurality of recesses and the transistor in a plan view.

19. A display device, the display device comprising: First base; A second substrate is disposed on the first substrate; A through-hole passes through the first substrate and the second substrate; Multiple grooves are provided around the through hole; as well as An organic layer covering the second substrate. The plurality of grooves are defined by the second substrate, and The organic layer includes a first portion within the plurality of grooves and a second portion outside the plurality of grooves, wherein the first portion and the second portion are spaced apart from each other.

20. The display device according to claim 19, wherein, The organic layer includes an organic light-emitting layer.

21. The display device according to claim 19, further comprising a first electrode and a second electrode opposite to the first electrode, and The second portion of the organic layer is disposed between the first electrode and the second electrode.

22. The display device according to claim 21, further comprising an encapsulation film disposed on the second electrode, wherein, The encapsulation film includes a first inorganic film, a first organic film disposed on the first inorganic film, and a second inorganic film disposed on the first inorganic film.

23. The display device according to claim 22, further comprising a dam located on the outer side of the plurality of recesses and the through holes. in, The dam is not stacked with the first organic membrane, but is stacked with the first inorganic membrane and the second inorganic membrane.

24. The display device according to claim 23, wherein the first inorganic film and the second inorganic film are in direct contact with each other on the dam.

25. The display device according to claim 19, wherein, The plurality of grooves have the same planar shape.

26. The display device according to claim 25, wherein, The planar shape of the plurality of grooves is an annular shape surrounding the through hole.

27. The display device according to claim 19, wherein, Each of the plurality of grooves includes a first sidewall and a second sidewall spaced apart from each other.

28. The display device according to claim 27, wherein, The slopes of the first sidewall and the second sidewall are the same.

29. The display device according to claim 19, wherein, The display area for displaying the image and the non-display area disposed outside the display area are defined on the first substrate and the second substrate, and The through-hole is defined in the display area.

30. The display device according to claim 19, wherein the display device further comprises an inorganic layer disposed between the first substrate and the second substrate.

31. The display device according to claim 19, wherein, The first substrate and the second substrate comprise at least one of polyimide, polyethylene terephthalate, polycarbonate, polyethylene naphthalate, polyarylate, and polyetherimide.

32. A display device, the display device comprising: An insulating substrate, wherein a through-hole is defined through the insulating substrate; A semiconductor layer on the insulating substrate; and An organic layer covering the insulating substrate. The blocking region surrounding the through-hole includes an interruption portion that interrupts the organic layer, and The interrupted portion is defined by the insulating substrate.

33. The display device according to claim 32, wherein, The groove is defined by the insulating substrate in the blocking area.

34. The display device according to claim 33, wherein, The groove includes a first sidewall and a second sidewall spaced apart from each other, and The interrupted portion is defined by the first sidewall.

35. The display device according to claim 34, wherein, The slopes of the first sidewall and the second sidewall are the same.

36. The display device according to claim 34, further comprising electrodes covering the organic layer. in, The electrode is interrupted at the interrupted portion.

37. The display device according to claim 36, wherein, The electrode is in contact with the first sidewall but not with the second sidewall.

38. The display device according to claim 33, wherein, The display area for displaying the image and the non-display area disposed outside the display area are defined on the insulating substrate, and The through-hole is defined in the display area.

39. The display device according to claim 33, wherein, The insulating substrate comprises a first substrate, an inorganic layer, and a second substrate stacked sequentially on top of each other, and The groove is defined by the second substrate.

40. The display device according to claim 33, wherein, The planar shape of the groove is an annular shape surrounding the through hole.

41. The display device according to claim 32, wherein, The dam region surrounding the barrier region is defined on the insulating substrate outside the barrier region, and The dam is set on the insulating substrate in the dam area.

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