A method and device for detecting multiple power supply chips, an electronic device and a medium

Abstract

The application provides a kind of method, device, electronic equipment and medium for detecting multiple power supply chips, the method comprises: obtaining the working voltage generated by multiple power supply chips under rated load, amplifying the working voltage and calculating voltage error precision according to the amplified working voltage, judging the product quality of power supply chip based on voltage error precision and preset voltage error precision range, obtaining working current according to working voltage, obtaining the comprehensive evaluation result of multiple power supply chips according to the voltage error precision corresponding to the load resistance value, product quality and working current of power supply chip.The application obtains working voltage, processes working voltage, obtains multiple related parameters, simplifies the data acquisition method of power supply chip, reduces the high dependence on complex hardware, reduces the detection cost, realizes the comprehensive evaluation of multiple power supply chips according to the weighted calculation of multiple related parameters, overcomes the subjective evaluation of manual operation, and obtains an objective evaluation result.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit testing, in particular to a method and device for detecting multiple power supply chips, an electronic device and a medium. BACKGROUND

[0002] In an integrated circuit, power supply stability is a prerequisite for the normal operation of the circuit, and multiple parameters of the power supply chip will be tested before use. In related technologies, testing multiple power supply chips at the same time increases the testing cost and requires a large number of hardware circuits to cooperate; therefore, a manual testing method is generally used, which has certain subjective judgment and affects the testing results; with the rapid iteration and update of chips and the increasing demand of enterprises, manual testing faces problems such as long working hours, labor shortage and difficulty in finding workers.

[0003] Therefore, when multiple power supply chips are measured at the same time, how to objectively evaluate the power supply chips and solve the problem of high cost of automatic detection is a technical problem that needs to be solved at present.

[0004] Comparative document 1 (CN110556594A) is a battery monitoring management system, which includes: a main control module connected to a battery monitoring management module and a display module, used for monitoring the load, interacting with the charger, receiving and analyzing the data of the battery monitoring management module, and distributing the charge and discharge current of each parallel sub-battery group; the battery monitoring management module is used for monitoring the voltage of all batteries in the parallel sub-battery group, the battery temperature of the key node, passive balancing, estimating the remaining capacity SOC of the battery group, PWM regulating the battery group charge and discharge current, and generating corresponding data transmission to the main control module. Comparative document 1 does not analyze the collected data, only collects, transmits and displays the data of the battery group, and cannot realize low-cost detection of the battery.

[0005] Comparative document 2 (CN114815946B) discloses a current output device, method, apparatus, system and medium, wherein the multi-channel detection module is connected with multiple single-phase power supply chips, and the current temperature value and the current current value of the chip are transmitted; the system control module is connected with the multi-channel detection module at one end, and the current current value is adjusted by obtaining the constraint condition according to the related parameters obtained in advance. The current compensation module is connected with the system control module at the other end, and the output current value of each chip is obtained and the current is output. The technical scheme of comparative document 2 only collects the current current value and the current temperature of multiple single-phase power supply chips, adjusts the current current value according to the preset condition, outputs multiple adjusted currents through the current compensation module, and does not realize detection and analysis of multiple power supply chips. Only the adjusted current is output, and comprehensive analysis cannot be realized. SUMMARY

[0006] In view of the above-mentioned defects of the prior art, the present application provides a method and device for detecting multiple power supply chips, electronic equipment and a medium to solve the above technical problems.

[0007] To achieve the above object and other related objects, the technical solutions of the present application are as follows.

[0008] A method for detecting multiple power supply chips, the method comprising:

[0009] obtaining multiple working voltages, the working voltages being voltages generated by the power supply chips under rated loads;

[0010] amplifying the working voltages and calculating voltage error precisions based on the amplified working voltages, and determining the product quality of the power supply chips according to the voltage error precisions and a preset voltage error precision range;

[0011] performing voltage-current conversion on the working voltages to obtain multiple working currents;

[0012] obtaining comprehensive evaluation results of the multiple power supply chips through the load resistance values of the power supply chips, the voltage error precisions corresponding to the product quality, and the working currents.

[0013] In the technical solutions provided in the embodiments of the present application, the voltage error precisions are calculated according to the amplified working voltages, which comprises: obtaining multiple rated voltages corresponding to the amplified working voltages; and performing subtraction proportional operation on the amplified multiple working voltages and the corresponding rated voltages to obtain multiple voltage error precisions.

[0014] In the technical solutions provided in the embodiments of the present application, the determination of the product quality of the power supply chips according to the voltage error precisions and the preset voltage error precision range comprises: when the voltage error precisions are within the preset voltage error precision range, the product quality of a single power supply chip is a genuine product; and when the voltage error precisions are outside the preset voltage error precision range, the product quality of a single power supply chip is a waste product.

[0015] In the technical solutions provided in the embodiments of the present application, after obtaining the working currents, the method further comprises: grouping the multiple working currents into an array; and sorting the multiple working currents according to a preset sorting condition, so that the sorted working currents are used for comprehensive evaluation of the power supply chips.

[0016] In the technical solutions provided in the embodiments of the present application, the obtaining of the comprehensive evaluation results of the multiple power supply chips comprises: performing weighted operation on the load resistance values of the power supply chips, the voltage error precisions corresponding to the product quality, and the working currents according to a preset weight proportion, to obtain the comprehensive evaluation results of the multiple power supply chips.

[0017] In the technical scheme provided by the embodiment of the present application, the method further comprises: storing the working current, the voltage error precision, the product quality and the working voltage.

[0018] In the technical scheme provided by the embodiment of the present application, the device for detecting multiple power supply chips comprises: a collection module, configured to acquire multiple working voltages, the working voltages being voltages generated by the power supply chips under rated loads; a voltage processing module, configured to amplify the working voltages and calculate voltage error precisions according to the amplified working voltages, and determine product qualities of the power supply chips according to the voltage error precisions and a preset voltage error precision range; a current acquisition module, configured to perform voltage-current conversion on the working voltages to obtain multiple working currents; and a comprehensive evaluation module, configured to obtain comprehensive evaluation results of the multiple power supply chips by using the load resistances of the power supply chips, the voltage error precisions corresponding to the product qualities and the working currents.

[0019] In the technical scheme provided by the embodiment of the present application, the voltage processing module comprises: a data processing unit, configured to perform subtraction proportional operation on the amplified multiple working voltages and corresponding rated voltages to obtain multiple voltage error precisions; and a product quality determination unit, configured to compare the voltage error precisions with the preset voltage error precision range, when the voltage error precisions are within the preset voltage error precision range, the product quality of a single power supply chip is a genuine product, and when the voltage error precisions are outside the preset voltage error precision range, the product quality of a single power supply chip is a waste product.

[0020] In the technical scheme provided by the embodiment of the present application, an electronic device is provided, comprising: one or more processors; and a storage device, configured to store one or more programs, when the one or more programs are executed by the one or more processors, the electronic device implements the method for detecting multiple power supply chips as described above.

[0021] In the technical scheme provided by the embodiment of the present application, a computer-readable storage medium is provided, and the computer-readable storage medium stores computer-readable instructions, when the computer-readable instructions are executed by a processor of a computer, the computer executes the method for detecting multiple power supply chips as described above.

[0022] The application provides a method and device for detecting multiple power supply chips, electronic equipment and a medium, the method comprising: obtaining working voltages generated by the multiple power supply chips under a rated load, amplifying the working voltages and calculating voltage error precision according to the amplified working voltages, judging product quality of the power supply chips based on the voltage error precision and a preset voltage error precision range, converting the working voltages to obtain working currents, and performing weighted calculation on the load resistance of the power supply chips, the voltage error precision corresponding to the product quality and the working currents to obtain a comprehensive evaluation result. The working voltages of the power supply chips are obtained, the working voltages are processed to obtain multiple related parameters, the data acquisition method of the power supply chips is simplified, the high dependence on complex hardware is reduced, the detection cost is reduced, the comprehensive evaluation of the multiple power supply chips is realized according to the weighted calculation of the multiple related parameters, the subjective evaluation of manual operation is overcome, and an objective evaluation result is obtained.

[0023] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory and are not restrictive of the application. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and serve to explain the principles of the application. It is clear that the drawings in the following description are only some embodiments of the application, and those skilled in the art can obtain other drawings from these drawings without creative labor. In the drawings:

[0025] Figure 1 is a flow chart of a method for detecting multiple power supply chips according to an exemplary embodiment of the application;

[0026] Figure 2 is a test structure schematic diagram of a method for detecting multiple power supply chips according to an exemplary embodiment of the application;

[0027] Figure 3 is Figure 2 a circuit structure schematic diagram of a detection circuit according to an exemplary embodiment of the application;

[0028] Figure 4 is a block diagram of a device for detecting multiple power supply chips according to an exemplary embodiment of the application;

[0029] Figure 5 shows a structure schematic diagram of a computer system of electronic equipment suitable for realizing embodiments of the application. DETAILED DESCRIPTION

[0030] Other advantages and benefits of the present application will become apparent to those skilled in the art upon consideration of the disclosure or can be learned by practice of the application. The advantages and benefits of the present application can be realized and attained by practical performance or use of various embodiments of the method and apparatus disclosed herein with or without reference to the following examples. It is to be understood that the foregoing description is by way of example only and is not intended to limit the scope of the application as defined by the appended claims.

[0031] It is to be understood that the above-mentioned arrangements are merely illustrative for the principles of the present application and that numerous modifications and adaptions thereof are possible without departing from the spirit and scope of the present application.

[0032] In the following description, numerous specific details are discussed in order to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to one skilled in the art that the embodiments of the present application can be practiced without these specific details. In other instances, well-known structures and devices are not described in detail in order to avoid obscuring the embodiments of the present application.

[0033] The inventor has found that in an integrated circuit, only stable power supply can make the circuit work normally, and generally, the power supply chip is tested before use to judge the stability of the power supply capacity of the power supply chip, and when the stability of the power supply chip is within a certain range, the normal operation of the circuit can be ensured. In the related art, automatic testing of multiple power supply chips requires the combination of a test method and a large amount of hardware, and the test cost is increased, so that simultaneous measurement of multiple power supply chips is realized. Therefore, enterprises generally use manual testing, but the manual testing method has subjective judgment factors, which affects the test results. Because of the hot chip market, the testing demand increases, and manual testing faces problems such as long working hours, labor difficulty and labor shortage.

[0034] To solve the above problems, the present application provides a method and device for detecting multiple power supply chips, electronic equipment and medium. The working voltage of the power supply chip under rated load is collected, the working voltage is amplified, and the voltage error precision is calculated according to the amplified working voltage. The product quality of a single power supply chip is judged by comparing the voltage error precision with the preset voltage error precision range. The working voltage is converted to obtain the working current. The comprehensive evaluation result of the multiple power supply chips is obtained according to the load resistance value of the power supply chip, the voltage error precision corresponding to the product quality and the working current.

[0035] As Figure 1As shown, in an example embodiment of the present application, the method for detecting multiple power supply chips at least includes the steps of:

[0036] S110, obtaining multiple working voltages, the working voltage being a voltage generated by the power supply chip when connected to a rated load;

[0037] S120, amplifying the working voltage and calculating the voltage error accuracy based on the amplified working voltage, and determining the product quality of the power supply chip according to the voltage error accuracy and the preset voltage error accuracy range;

[0038] S130, voltage-current conversion is performed on the working voltage to obtain multiple working currents;

[0039] S140, obtaining the comprehensive evaluation result of the multiple power supply chips through the load resistance of the power supply chip, the voltage error accuracy corresponding to the product quality, and the working current.

[0040] In detail, in step S110, multiple working voltages are obtained, and the working voltage is a voltage generated by the power supply chip when connected to a rated load; for example, Figure 2 As shown, the method supplies power to multiple power supply chips through a power supply, the multiple power supply chips are connected to a rated load, the multiple power supply chips generate working voltages, and the multiple power supply chips are connected to corresponding detection circuits, for example, Figure 3 As shown, the detection circuit is a subtraction amplifier circuit, the working voltage output by a single power supply chip is collected through the resistor R5 in the detection amplifier circuit, the working voltage is the voltage across the resistor R5, that is, ΔV = V1-V2; after obtaining the working voltage, the comprehensive evaluation result of the multiple power supply chips is obtained through the calculation of the related parameters of the working voltage.

[0041] Because the working voltage value of the power supply chip collected is relatively small, in order to ensure that the calculated parameters are more accurate, for example, Figure 3 As shown, the working voltage is amplified through the subtraction amplifier circuit to obtain multiple amplified working voltages V0, and the amplified value of the amplified working voltage V0 is shown in expression (1):

[0042]

[0043] Wherein, V0 is the amplified working voltage, V1 is the voltage at the positive input end of the subtraction amplifier circuit, V2 is the voltage at the negative input end of the subtraction amplifier circuit, and resistor R1, resistor R2, resistor R3, and resistor R4 are resistors in the subtraction amplifier circuit.

[0044] In detail, in an example embodiment of the present application, the voltage error precision is calculated according to the amplified working voltage, including: acquiring the rated voltage corresponding to the plurality of amplified working voltages; performing subtraction proportional operation on the plurality of amplified working voltages and the corresponding rated voltages to obtain a plurality of voltage error precisions. It should be noted that the rated voltage corresponding to the plurality of amplified working voltages is also amplified by the corresponding multiple because the measured working voltage is amplified. The voltage error precision is obtained by performing subtraction proportional operation on the amplified working voltage V0 and the corresponding rated working voltage Vi, and the calculation expression of the voltage error precision is shown as (2):

[0045]

[0046] Wherein, V0 is the amplified working voltage, and Vi is the rated voltage corresponding to the amplified working voltage.

[0047] In step S120, the product quality of the power chip is judged according to the voltage error precision and the preset voltage error precision range, including:

[0048] In detail, in an example embodiment of the present application, the product quality of the power chip is judged according to the voltage error precision and the preset voltage error precision range, including: when the voltage error precision is within the preset voltage error precision range, the product quality of the single power chip is a genuine product; when the voltage error precision is outside the preset voltage error precision range, the product quality of the single power chip is a waste product. Wherein, the preset voltage error precision range is set to

[0049] ± 2%, when the voltage error precision is + 1.8% or the voltage error precision is - 1.9%, the voltage error precision is within the preset voltage error precision range, and the product quality of the single power chip is a genuine product; when the voltage error precision is + 2.5%

[0050] Or -2.3%, the voltage error precision is outside the preset voltage error precision range, and the product quality of the single power chip is a waste product.

[0051] In step S130, the working voltage is converted into voltage-current to obtain a plurality of working currents; the working voltage is converted into voltage-current, as shown in Figure 3 The current value flowing through the resistor R5 is collected, which is the working current, and after obtaining a plurality of working currents, the working current should also be processed.

[0052] In detail, in the example embodiment of the present application, after obtaining the working currents, the method further comprises: grouping the working currents into an array; and sorting the working currents according to a preset sorting condition, so that the sorted working currents are used for comprehensive evaluation of the power supply chips. The working currents of the plurality of power supply chips are grouped into an array, for example, the working currents of 5 power supply chips are 1A, 0.5A, 2A, 3.5A and 2.3A, and the working currents of the 5 power supply chips are grouped into an array A [1A, 0.5A, 2A, 3.5A, 2.3A]. The adjacent two working currents in the array A are compared, the preset sorting condition includes ascending order and descending order, if the preset sorting condition is ascending order, the first working current 1A in the array A is compared with the second working current 0.5A, the first working current 1A is greater than the second working current 0.5A, the first working current 1A and the second working current 0.5A are exchanged, if the previous working current is equal to or less than the next working current, the position is unchanged, the first working current is compared with other currents in turn, the adjacent two working currents are compared, until the previous working current is less than or equal to the next working current, and finally an array in ascending order is obtained

[0053] B [0.5A, 1A, 2A, 2.3A, 3.5A]; if the preset sorting condition is descending order, the first working current 1A in the array A is compared with the second working current 0.5A, the first working current 1A is greater than the second working current 0.5A, the first working current 1A and the second working current 0.5A are not exchanged, the second working current 0.5A is compared with the third working current 2A, the third working current 2A is greater than the second working current 0.5A, the third working current 2A and the second working current 0.5A are exchanged, until the previous working current is greater than or equal to the next working current, and finally an array C [3.5A, 2.3A, 2A, 1A, 0.5A] in ascending order is obtained.

[0054] In step S140, the comprehensive evaluation results of the plurality of power supply chips are obtained by the load resistance of the power supply chip, the voltage error accuracy corresponding to the product quality and the working current. The comprehensive evaluation results of the power supply chip are obtained by a plurality of parameters related to the power supply chip.

[0055] In detail, in the example embodiment of the present application, the step of obtaining the comprehensive evaluation result of the plurality of power supply chips comprises: performing weighted operation on the load resistance value of the power supply chip, the voltage error precision corresponding to the product quality and the working current according to the preset weight proportion, to obtain the comprehensive evaluation result of the plurality of power supply chips. The load resistance value of the power supply chip is a value specified in the power supply chip manual. For example, the weight proportion of each parameter is 20% for the load resistance value, 50% for the voltage error precision corresponding to the product quality and 30% for the working current, and the comprehensive evaluation result of the plurality of power supply chips is obtained by weighted calculation.

[0056] In detail, in the example embodiment of the present application, the method further comprises: storing the working current, the voltage error precision, the product quality and the working voltage, so as to facilitate subsequent data searching.

[0057] As shown in the example of detecting a plurality of power supply chips, the device comprises: Figure 4

[0058] The acquisition module 410 is configured to acquire a plurality of working voltages, the working voltage being a voltage generated by the power supply chip under rated load.

[0059] The voltage processing module 420 is configured to amplify the working voltage and calculate the voltage error precision according to the amplified working voltage, and determine the product quality of the power supply chip according to the voltage error precision and the preset voltage error precision range.

[0060] The current acquisition module 430 is configured to perform voltage-current conversion on the working voltage to obtain a plurality of working currents.

[0061] The comprehensive evaluation module 440 is configured to obtain the comprehensive evaluation result of the plurality of power supply chips by the load resistance value of the power supply chip, the voltage error precision corresponding to the product quality and the working current.

[0062] In detail, in another example embodiment, the voltage processing module 420 further comprises:

[0063] The data processing unit is configured to perform subtraction proportional operation on the amplified plurality of working voltages and the corresponding rated voltages to obtain a plurality of voltage error precisions.

[0064] The product quality determination unit is configured to compare the voltage error precision with the preset voltage error precision range. When the voltage error precision is within the preset voltage error precision range, the product quality of the single power supply chip is a genuine product. When the voltage error precision is outside the preset voltage error precision range, the product quality of the single power supply chip is a waste product.

[0065] ​The application provides a method and device for detecting multiple power supply chips, an electronic device and a medium. The method comprises the following steps: obtaining working voltages generated by multiple power supply chips under a rated load, amplifying the working voltages and calculating voltage error precision according to the amplified working voltages, judging the product quality of the power supply chips based on the voltage error precision and a preset voltage error precision range, obtaining working currents through the working voltages, comprehensively evaluating the multiple power supply chips based on the load resistance values of the power supply chips, the voltage error precision corresponding to the product quality and the working currents, and obtaining a comprehensive evaluation result. The working voltages are obtained, the working voltages are processed, multiple related parameters are obtained, the data acquisition mode of the power supply chips is simplified, the high dependence on complex hardware is reduced, the detection cost is reduced, the comprehensive evaluation of the multiple power supply chips is realized according to the weighted calculation of the multiple related parameters, the subjective evaluation of manual operation is overcome, and an objective evaluation result is obtained.

[0066] It should be noted that the device for detecting multiple power supply chips provided in the above embodiment and the method for detecting multiple power supply chips provided in the above embodiment belong to the same concept, wherein the specific manner in which each module and unit performs operations has been described in detail in the method embodiment, and will not be described here. The device for detecting multiple power supply chips provided in the above embodiment can allocate the above functions to different functional modules according to needs in actual application, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above, and this is not limited herein.

[0067] Embodiments of the application also provide an electronic device, comprising: one or more processors; a storage device configured to store one or more programs, when the one or more programs are executed by the one or more processors, the electronic device implements the method for detecting multiple power supply chips provided in each of the above embodiments.

[0068] Figure 5 The structure schematic diagram of the computer system of the electronic device suitable for realizing the embodiments of the application is shown. It should be noted that, Figure 5 The computer system 500 of the electronic device shown is only an example, and should not limit the functions and use range of the embodiments of the application.

[0069] As Figure 5As shown, the computer system 500 includes a central processing unit (CPU) 501 which can perform various appropriate actions and processes in accordance with a program stored in a read-only memory (ROM) 502 or a program loaded from a storage section 508 into a random access memory (RAM) 503, such as performing the methods described in the above embodiments. In the RAM 503, various programs and data required for the operation of the system are also stored. The CPU 501, the ROM 502, and the RAM 503 are connected to each other through a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0070] Connected to the I / O interface 505 are an input section 506 including a keyboard, a mouse, etc.; an output section 507 including a display such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), etc., and a speaker, etc.; a storage section 508 including a hard disk, etc.; and a communication section 509 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 509 performs communication processing via a network such as the Internet. A drive 510 is also connected to the I / O interface 505 as necessary. A removable recording medium 511 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc. is attached to the drive 510 as necessary, so that a computer program read therefrom is installed into the storage section 508 as necessary.

[0071] In particular, according to the embodiments of the present application, the processes described above with reference to the flowcharts can be implemented as a computer software program. For example, the embodiments of the present application include a computer program product including a computer program carried on a computer-readable medium, the computer program containing a computer program for executing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network by the communication section 509, and / or installed from the removable recording medium 511. When the computer program is executed by the central processing unit (CPU) 501, various functions defined in the system of the present application are performed.

[0072] Another aspect of the present application also provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor of a computer, causes the computer to perform the method of detecting a plurality of power supply chips as described above. The computer-readable storage medium can be included in the electronic device described in the above embodiments, or can exist separately without being assembled into the electronic device.

[0073] Note that the computer readable medium shown in the embodiments of the present application can be a computer readable signal medium or a computer readable storage medium or any combination of the two. The computer readable storage medium may, for example, be an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any combination of the above. More specific examples of the computer readable storage medium can include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, the computer readable signal medium can include a data signal propagated in a baseband or propagated as a carrier wave in a propagated data signal, in which the computer readable computer program is carried. Such a propagated data signal can take on many forms, including but not limited to an electromagnetic signal, an optical signal, or any suitable combination of the above. The computer readable signal medium can also be any computer readable medium other than the computer readable storage medium, which can send, propagate, or transmit the program for use by or in connection with an instruction execution system, apparatus, or device. The computer program contained in the computer readable medium can be transmitted by any suitable medium, including but not limited to wireless, wired, or the like, or any suitable combination of the above.

[0074] The flowcharts and block diagrams in the drawings illustrate the possible architectures, functionality, and operations of systems, methods, and computer program products according to various embodiments of the present application. Each block in the flowcharts or block diagrams can represent a module, a program segment, or a portion of code, which includes one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks noted in succession can in fact be executed substantially concurrently or in the reverse order, depending on the functionality involved. It will also be noted that each block in the flowcharts or block diagrams, and combinations of blocks in the flowcharts or block diagrams, can be implemented by special purpose hardware-based systems that perform the specified functions or operations, or combinations of special purpose hardware and computer instructions.

[0075] The units described in the embodiments of the present application can be implemented in the form of software, or can be implemented in the form of hardware, and the described units can also be arranged in a processor. In some cases, the names of the units do not constitute a limitation on the units themselves.

[0076] Another aspect of the present application also provides a computer program product or computer program, which includes computer instructions stored in a computer readable storage medium. The processor of the computer device reads the computer instructions from the computer readable storage medium, and the processor executes the computer instructions, so that the computer device executes the method for detecting a plurality of power chips provided in the various embodiments.

[0077] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed by the present application should be covered by the claims of the present application.

Claims

1. A method for detecting multiple power chips, characterized in that: The method comprises: Acquire multiple operating voltages, where the operating voltage is the voltage generated by the power chip when connected to a rated load; amplifying the operating voltage and calculating a voltage error accuracy based on the amplified operating voltage, and judging the product quality of the power chip according to the voltage error accuracy and a preset voltage error accuracy range; Performing voltage-current conversion on the operating voltage to obtain multiple operating currents; A comprehensive evaluation result of the plurality of power chips is obtained through the load resistance of the power chip, the voltage error accuracy corresponding to the product quality, and the operating current.

2. The method for detecting multiple power chips according to claim 1, characterized in that: Calculate the voltage error accuracy based on the amplified working voltage, including: Obtaining a plurality of rated voltages corresponding to the amplified operating voltages; A subtraction proportional operation is performed on the amplified multiple operating voltages and the corresponding rated voltages to obtain multiple voltage error accuracies.

3. The method for detecting multiple power chips according to claim 1, wherein: Judging the product quality of the power chip according to the voltage error accuracy and a preset voltage error accuracy range includes: When the voltage error accuracy is within the preset voltage error accuracy range, the product quality of the single power chip is authentic; When the voltage error accuracy is outside the preset voltage error accuracy range, the product quality of the single power chip is scrap.

4. The method for detecting multiple power chips according to claim 1, wherein: After obtaining the working current, the method further includes: Grouping a plurality of the working currents into an array; The plurality of operating currents are sorted according to a preset sorting condition, so that the sorted operating currents are used for comprehensive evaluation of the power supply chips.

5. The method for detecting multiple power chips according to claim 1, wherein: The comprehensive evaluation results of the plurality of power chips are obtained, including: The load resistance of the power chip, the voltage error accuracy corresponding to the product quality, and the working current are weighted according to the preset weight ratio to obtain a comprehensive evaluation result of the multiple power chips.

6. The method for detecting multiple power chips according to claim 1, wherein: The method further includes storing the operating current, the voltage error accuracy, the product quality, and the operating voltage.

7. A device for detecting multiple power chips, characterized in that: The device comprises: An acquisition module, configured to acquire a plurality of operating voltages, wherein the operating voltage is a voltage generated by the power chip when connected to a rated load; a voltage processing module, configured to amplify the operating voltage and calculate a voltage error accuracy based on the amplified operating voltage, and determine the product quality of the power chip based on the voltage error accuracy and a preset voltage error accuracy range; a current acquisition module, configured to perform voltage-to-current conversion on the operating voltage to obtain a plurality of operating currents; The comprehensive evaluation module is used to obtain a comprehensive evaluation result of multiple power chips through the load resistance of the power chip, the voltage error accuracy corresponding to the product quality and the working current.

8. The device for detecting multiple power chips according to claim 7, characterized in that: The voltage processing module includes: a data processing unit, configured to perform a subtraction proportional operation on the amplified plurality of operating voltages and corresponding rated voltages to obtain a plurality of voltage error accuracies; The product quality judgment unit is used to compare the voltage error accuracy with the preset voltage error accuracy range. When the voltage error accuracy is within the preset voltage error accuracy range, the product quality of the single power chip is genuine; when the voltage error accuracy is outside the preset voltage error accuracy range, the product quality of the single power chip is scrap.

9. An electronic device, characterized in that: The electronic device comprises: one or more processors; A storage device for storing one or more programs, which, when executed by the one or more processors, enables the electronic device to implement the method for detecting multiple power chips as described in any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that A computer program is stored thereon, and when the computer program is executed by a processor of a computer, the computer is caused to execute the method for detecting a plurality of power chips according to any one of claims 1 to 6.

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