Double-sided waxing apparatus and double-sided waxing method thereof

Abstract

The present application relates to double-sided wax sticking equipment and double-sided wax sticking method thereof, wherein the double-sided wax sticking equipment comprises a base, the base comprises a first surface, the first surface is provided with a transmission mechanism, and a first bearing table, a second bearing table, a wax spraying mechanism and a wax pressing mechanism are arranged around the periphery of the transmission mechanism; the transmission mechanism comprises a displacement mechanism arranged on the first surface, a plurality of connecting rods are arranged on the displacement mechanism, and a suction cup is arranged on the connecting rod; the wax spraying mechanism comprises a supporting part and a wax spraying head arranged on the supporting part; the wax pressing mechanism comprises a clamping part arranged on a support, and an upper suction part and a lower suction part capable of being opened and closed relative to the support, and the upper suction part and the lower suction part are located on the upper and lower sides of the clamping part. The present application provides a double-sided wax sticking equipment and double-sided wax sticking method thereof, which can stick two samples on the front and back surfaces of a ceramic disc, and improves the convenience and operation simplicity of double-sided wax sticking.

Description

Technical Field

[0001] This invention relates to the field of machining, specifically to a device for double-sided wax application and a method for double-sided wax application. Background Technology

[0002] In the existing technology, it is not convenient to bond the wafer to both sides of the substrate, i.e., the ceramic plate, during wafer processing. Manual bonding is inefficient and not convenient. In existing technologies, the combination of substrate and wafer is also achieved through a multi-stage operation. For example, existing patent, patent number: CN201710681479.3, patent title: Surface Mount Method for Fixing Wafers and SMT Wafer Fixing Device; discloses a surface mount method for fixing wafers to a substrate, including the following steps: printing solder paste in a primary solder paste printing area on the substrate to form a primary solder paste layer; heating the substrate to evaporate the flux in the primary solder paste layer and cooling the primary solder paste layer; pressing the cooled primary solder paste layer to make the top of the primary solder paste layer horizontal; printing solder paste in a secondary solder paste printing area on the pressed primary solder paste layer to form a secondary solder paste layer, the area of ​​the secondary solder paste layer being smaller than that of the primary solder paste layer; attaching the wafer to the substrate through the secondary solder paste layer; and reflow soldering the substrate with the attached wafer to fix the wafer to the substrate.

[0003] Existing technologies typically employ a single-sided lamination method. If double-sided lamination is required, the lamination is usually performed on one side first, followed by the lamination on the other side. This lamination operation is not convenient and is inefficient. Therefore, it is necessary to develop a device that can achieve double-sided wax lamination. Summary of the Invention

[0004] This invention overcomes the shortcomings of the prior art and provides a double-sided wax application device that can apply wafers to both sides of a substrate, thereby improving the ease of assembly between the substrate and the wafer and increasing the chip application efficiency.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: a double-sided waxing device, comprising:

[0006] The base includes a first surface, on which a transmission mechanism is provided, and a first support platform, a second support platform, a wax spraying mechanism, and a wax pressing mechanism are arranged around the outer periphery of the transmission mechanism. The transmission mechanism includes a displacement mechanism driven on the first surface, on which a plurality of connecting rods are driven, and suction cups for adsorbing and conveying a plurality of products are arranged on the connecting rods. The wax spraying mechanism includes a support part and a wax spraying head arranged on the support part. The wax pressing mechanism includes a bracket, a clamping part connected to the bracket, and an upper adsorption part and a lower adsorption part arranged on the base that can be opened and closed relative to each other, and the upper adsorption part and the lower adsorption part are respectively located on the upper and lower sides of the clamping part.

[0007] In a preferred embodiment of the present invention, the displacement mechanism includes at least two intersecting guide rails parallel to the first surface, a rotating shaft perpendicular to the first surface that can slide along the guide rails, a connecting rod connected to the rotating shaft and rotatable about the rotating shaft, and a tumbler connected to the connecting rod.

[0008] Specifically, the guide rails are cross-shaped, king-shaped, dry-shaped, or earth-shaped.

[0009] In a preferred embodiment of the present invention, the product includes at least one substrate supported by a first support stage; and at least two wafers supported by a second support stage; an upper adsorption portion and a lower adsorption portion are used to adsorb the wafers respectively; a clamping portion is used to fix the substrate so that the substrate is located between the two adsorbed wafers; and a suction cup is used to adsorb the substrate or wafers.

[0010] In a preferred embodiment of the present invention, one end of the support is connected to the base and the other end is connected to the wax spray head, which faces the first surface and is used to spray wax onto the substrate located on the suction cup.

[0011] In a preferred embodiment of the present invention, the upper adsorption part includes an upper adsorption head and an upper cylinder. The upper cylinder connects the upper adsorption head and the support. The upper cylinder drives the upper adsorption head to move along a direction perpendicular to the first surface and provides suction to the upper adsorption head.

[0012] In a preferred embodiment of the present invention, the lower adsorption part includes a lower adsorption head and a lower cylinder. The lower cylinder connects the lower adsorption head and the base. The lower cylinder drives the lower adsorption head to move along a direction perpendicular to the first surface and provides suction to the lower adsorption head.

[0013] In a preferred embodiment of the present invention, a heating plate for heating a substrate is provided on the first support platform.

[0014] In a preferred embodiment of the present invention, the suction cup includes a first suction cup and a second suction cup. The first suction cup is a disk and the second suction cup is a ring. The ring is used to adsorb the substrate and the disk is used to adsorb the wafer.

[0015] In a preferred embodiment of the present invention, a rotating component is provided between the suction cup and the connecting rod, and the rotation of the rotating component causes the suction cup to flip; or / and, the rotating shaft is a liftable rotating shaft; or / and, both the disc and the ring are provided with multiple suction holes, and the suction holes are connected to a vacuum adsorption mechanism.

[0016] In a preferred embodiment of the present invention, a double-sided waxing method is implemented using the double-sided waxing equipment disclosed in the present invention, comprising: selecting a substrate and transporting it to a wax spraying mechanism; spraying wax onto the first side of the substrate with the wax spraying nozzle of the wax spraying mechanism, flipping the substrate so that the wax spraying nozzle sprays wax onto the second side of the substrate; transporting the wax-sprayed substrate to a wax pressing mechanism, where a clamping part fixes the substrate; selecting a first wafer and transporting it to the wax pressing mechanism, where an upper adsorption part adsorbs the first wafer; selecting a second wafer and transporting it to the wax pressing mechanism, where a lower adsorption part adsorbs the second wafer; pressing the upper and lower adsorption parts together to bond the first and second wafers to the substrate.

[0017] This invention addresses the shortcomings of the prior art, and its beneficial effects are as follows:

[0018] This invention provides a double-sided wax coating device and method, which can coat two samples on opposite sides of a substrate to achieve double-sided wax coating. A transfer mechanism can transfer products from a first and second carrier platform to a wax spraying mechanism and a wax pressing mechanism. The substrate is held by a clamping part in the wax pressing mechanism, and upper and lower adsorption parts on the upper and lower sides of the clamping part, which can open and close relative to the clamping part, are used to bond the product wafer to both sides of the substrate. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the axial view structure of a preferred embodiment of the present invention;

[0020] Figure 2 This is a side view of a preferred embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of the wax pressing mechanism in a preferred embodiment of the present invention, showing the positional relationship between the upper and lower adsorption parts and the substrate and wafer during the pressing of the substrate and wafer.

[0022] Among them, 1-base, 10-first surface, 2-first support platform, 21-heating plate, 3-second support platform, 4-wax spraying mechanism, 41-support part, 42-wax spraying head, 5-wax pressing mechanism, 51-bracket, 52-upper adsorption part, 521-upper cylinder, 522-upper adsorption pressure head, 53-lower adsorption part, 531-lower cylinder, 532-lower adsorption pressure head, 54-clamping part, 541-gripper, 6-transfer mechanism, 61-displacement mechanism, 611-guide rail, 62-rotating shaft, 63-connecting rod, 64-suction cup, 641-rotating component, 642-first suction cup, 643-second suction cup, 644-suction hole, 7-substrate, 71-wax layer, 8-wax wafer. Implementation

[0023] The present invention will now be further described in detail with reference to the accompanying drawings and embodiments. These drawings are all simplified schematic diagrams, only showing the basic structure of the present invention in a schematic manner, so they only show the components related to the present invention. Embodiment

[0024] As Figure 1 、 Figure 2 shown, a double-sided waxing device includes: a base 1, the base 1 includes a first surface 10, a transmission mechanism 6 is provided on the first surface 10, and a first carrier 2, a second carrier, a wax spraying mechanism 4, and a wax pressing mechanism 5 are arranged around the outer periphery of the transmission mechanism 6 and arranged in the transmission direction.

[0025] Specifically, as Figure 1 shown, the transmission mechanism 6 includes a displacement mechanism 61 driven to be arranged on the first surface 10. The displacement mechanism 61 includes at least two intersecting guide rails 611 parallel to the first surface 10, a rotating shaft 62 perpendicular to the first surface 10 and slidable along the guide rails 611, a connecting rod 63 connected to the rotating shaft 62 and rotatable around the rotating shaft 62, and a suction cup 6 connected to the connecting rod 63 and capable of flipping.

[0026] Further, as Figure 1 shown, the guide rails 611 include an X-axis displacement guide rail and a Y-axis displacement guide rail arranged crosswise. The Y-axis displacement guide rail is slidably arranged on the X-axis displacement guide rail. The X-axis displacement guide rail and the Y-axis displacement guide rail are assembled to form a cross shape, a king shape, a dry shape or a soil shape. In this embodiment, a Y-axis displacement guide rail is slidably arranged across a pair of parallel X-axis displacement guide rails. A sliding seat is driven on the Y-axis displacement guide rail, a driving seat is arranged on the sliding seat, and a rotating shaft 62 is drivingly connected to the driving seat. The Y-axis displacement guide rail is displaced on the X-axis displacement guide rail by a driving mechanism one, and the driving seat on the Y-axis displacement guide rail drives the rotating shaft to be displaced relative to the Y-axis displacement guide rail by a driving mechanism two, realizing planar displacement on the first surface 10. However, it is not limited to this. In other embodiments, the assembly relationship and driving structure of the guide rails 611 can be adjusted according to the actual use requirements and the driving mechanism of the guide rails 611 in the prior art. Further, the rotating shaft is a liftable rotating shaft, and the lifting structure of the liftable rotating shaft adopts a longitudinal linear lifting mechanism in the prior art. The top of the rotating shaft 62 is drivingly provided with a connecting rod 63 extending outward. And the connecting rod 63 can be longitudinally displaced relative to the guide rails 611 or the first surface 10 under the drive of the longitudinal linear lifting mechanism. In this embodiment, four connecting rods 63 extending outward are evenly distributed around the outer periphery of the rotating shaft 62. However, it is not limited to this. In other embodiments, the number of the connecting rods 63 and the included angle between adjacent connecting rods 63 can be adjusted according to the actual production requirements.

[0027] Further, as Figure 1As shown, a rotating component 641 is provided between the suction cup 6 and the connecting rod 63. The rotation of the rotating component 641 causes the suction cup 6 to flip. The suction cup 6 includes a first suction cup 642 and a second suction cup 643. The first suction cup 642 is a disk, and the second suction cup 643 is an annulus. Both the disk and the annulus have multiple suction holes 644, which are connected to a vacuum adsorption mechanism (not shown). The vacuum adsorption mechanism can be a vacuum adsorption device in the prior art, which mainly provides negative pressure to the suction holes 644 to assist the suction cup 6 in achieving the adsorption operation. The types of equipment that can be used are not listed here. The suction cup 6 is used to adsorb several kinds of products to be assembled. The several kinds of products include at least one substrate 7 supported by the first support platform 2; and at least two wafers 8 supported by the second support platform. The annulus is used to adsorb the substrate 7, and the disk is used to adsorb the wafers 8. The annulus corresponds to the edge of the substrate 7, and the disk avoids the device area of ​​the wafer 8.

[0028] Specifically, such as Figure 1 As shown, a heating plate 321 is provided on the first support platform 2, which is used to heat the substrate 7 it supports.

[0029] Specifically, such as Figure 1 , Figure 2 As shown, the wax spraying mechanism 4 includes a support part 41 and a wax spraying head 42 disposed on the support part 41; one end of the support part is connected to the base 1 and the other end is connected to the wax spraying head 42, the wax spraying head 42 faces the first surface 10 and is used to spray wax onto the substrate 7 located on the suction cup 6.

[0030] Specifically, such as Figure 1 , Figure 2 As shown, the wax pressing mechanism 5 includes a support 51, a clamping part 54 connected to the support 51, and an upper adsorption part 52 and a lower adsorption part 53 connected to the support 51 and capable of opening and closing relative to each other. The upper adsorption part 52 and the lower adsorption part 53 are located on the upper and lower sides of the clamping part 54. The upper adsorption part 52 includes an upper adsorption pressure head 522 and an upper cylinder 521. The upper cylinder 521 connects the upper adsorption pressure head 522 and the support 51. The upper cylinder 521 drives the upper adsorption pressure head 522 to move in a direction perpendicular to the first surface 10 and provides suction to the upper adsorption pressure head 522. The lower adsorption part 53 includes a lower adsorption pressure head 532 and a lower cylinder 531. The lower cylinder 531 connects the lower adsorption pressure head 532 and the base 1. The lower cylinder 531 drives the lower adsorption pressure head 532 to move in a direction perpendicular to the first surface 10 and provides suction to the lower adsorption pressure head 532. Figure 2 , Figure 3As shown, the upper adsorption part 52 and the lower adsorption part 53 are used to adsorb the wafers 8, and the clamping part 54 is used to fix the substrate 7 so that the substrate 7 is located between the two adsorbed wafers 8. Further, this embodiment uses three sets of clamping parts 54, each clamping part 54 including a telescopic drive part and a gripper 541 drivenly connected to the telescopic drive part. In this embodiment, the gripper 541 is used, and the gripper 541 clamps vertically and corresponds to the substrate 7. The three sets of clamping parts 54 define the substrate 7 within a specified planar area. However, this is not limited to this; in other embodiments, limiting abutments can also be used, with abutment grooves provided in the limiting abutments on the three sets of clamping parts 54 that match the shape of the substrate 7. The abutment grooves define the longitudinal position of the substrate 7, and the three sets of clamping parts 54 define the position of the substrate 7 from three directions. The side of the wax pressing mechanism 5 closest to the transmission mechanism 6 is the feeding side. The clamping parts 54 are positioned away from the feeding side. Each clamping part 54 is equipped with a gripper 541 extending from the outside inwards, and the gripper 541 is positioned away from the area where the upper suction part 52 and the lower suction part 53 are pressed together. More specifically, as... Figure 3 As shown, before pressing, the clamping part 54 of the wax pressing mechanism 5 defines the position of the substrate 7. The upper adsorption part 52 and the lower adsorption part 53 located on the upper and lower sides of the clamping part 54 are used to adsorb the two wafers 8, that is, the two wafers 8 are located above and below the substrate 7 defined by the clamping part 54, respectively. The wax layers 71 formed by wax spraying on both sides of the substrate 7 correspond to the wafers 8 to be pressed. The positional arrangement of the substrate 7 and the wafers 8 on both sides during pressing is as follows: Figure 3 As shown. Example

[0031] like Figure 1 , Figure 2 As shown, the double-sided waxing method for the equipment used for double-sided waxing includes the following steps:

[0032] Select substrate 7 and transport it to wax spraying unit 4.

[0033] The wax spraying nozzle of the wax spraying mechanism 4 sprays wax onto the first side of the substrate 7 and forms a wax flake layer 71 on the first side of the substrate 7; the substrate 7 is flipped over and the wax spraying nozzle sprays wax onto the second side of the substrate 7 and forms a wax flake layer 71 on the second side of the substrate 7.

[0034] The wax-coated substrate 7 is transported to the wax pressing mechanism 5, and the clamping part 54 fixes the substrate 7; a first wafer is selected and transported to the wax pressing mechanism 5, and the upper adsorption part 52 adsorbs the first wafer; a second wafer is selected and transported to the wax pressing mechanism 5, and the lower adsorption part 53 adsorbs the second wafer.

[0035] The upper adsorption part 52 and the lower adsorption part 53 are pressed together to bond the first wafer and the second wafer to the substrate 7. Example

[0036] like Figure 1 , Figure 2 As shown, the double-sided waxing method of the double-sided waxing equipment includes the following steps:

[0037] Substrate 7 is selected and transported to the wax spraying mechanism 4. Substrate 7 is a ceramic disc. Specifically, a ceramic disc with a TTV < 2µm is selected. First, the selected substrate 7 is placed on the heating plate 321 of the first support stage 2, and the substrate 7 is heated by the heating plate 321. The second suction cup 643 of the transfer mechanism 6 picks up the substrate 7, and the second suction cup 643 is moved to the wax spraying mechanism 4 by rotating the rotating shaft 62.

[0038] The wax spraying nozzle of the wax spraying mechanism 4 sprays wax onto the first side of the substrate 7 and forms a wax flake layer 71 on the first side of the substrate 7; the substrate 7 is flipped over and the wax spraying nozzle sprays wax onto the second side of the substrate 7 and forms a wax flake layer 71 on the second side of the substrate 7.

[0039] The wax-coated substrate 7 is transported to the wax pressing mechanism 5, and the clamping part 54 fixes the substrate 7.

[0040] At least two wafers 8 are placed on the second support platform. First, the first wafer is picked up by the first suction cup 642 of the transfer mechanism 6 and transported to the wax pressing mechanism 5. The first suction cup 642 is flipped so that the first wafer corresponds to the upper suction part 52 and the upper suction part 52 adsorbs the first wafer. The second wafer is selected by the other first suction cup 642 of the transfer mechanism 6 and transported to the wax pressing mechanism 5. The second wafer corresponds to the lower suction part 53 and the lower suction part 53 adsorbs the second wafer.

[0041] The upper adsorption part 52 and the lower adsorption part 53 are pressed together, and the first wafer and the second wafer are bonded to the substrate 7 through the wax layer 71 on both sides of the substrate 7.

[0042] Working principle:

[0043] like Figure 1 , Figure 2As shown, the double-sided waxing equipment and method of the present invention can apply wax to both sides of a substrate 7, thereby improving the ease of assembly between the substrate 7 and the wafer 8 and increasing the chip placement efficiency. This also helps to improve the efficiency of subsequent wafer 8 processing. When the double-sided waxing equipment is working, a substrate 7 is selected and transported to the wax spraying mechanism 4. The substrate 7 is selected according to production requirements; it is a ceramic disk. Specifically, a ceramic disk with a TTV < 2µm is selected. The substrate 7 is placed on a heating plate 321 on the first support platform 2, and heated by the heating plate 321. The drive shaft 62 rotates, and the suction cup 6, which is to receive the substrate 7, transfers the suction cup 6 to the wax spraying mechanism 4. The wax spraying nozzle of the wax spraying mechanism 4 sprays wax onto the first side of the substrate 7, then flips the substrate 7 so that the wax spraying nozzle sprays wax onto the second side of the substrate 7. The wax-sprayed substrate 7 is then transported to the wax pressing mechanism 5, where the clamping part 54 fixes the substrate 7. The first wafer, received by the second support platform, is selected and transported to the wax pressing mechanism 5, where the upper adsorption part 52 adsorbs the first wafer. The second wafer, also received by the second support platform, is selected and transported to the wax pressing mechanism 5, where the lower adsorption part 53 adsorbs the second wafer. The upper and lower adsorption parts 52 and 53 are pressed together to bond the first and second wafers to the substrate 7. The lower adsorption head 532 and the upper adsorption head 522 are driven to press inwards, pressing the first and second wafers on the lower and upper adsorption heads 532 and 522 respectively onto the side panels of the substrate 7, firmly pressing them onto the middle substrate 7. After the substrate 7 with the wafers 8 bonded is cooled, it is removed and transferred to the next process.

[0044] Based on the preferred embodiments of the present invention described above, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A double-sided waxing device, characterized in that, include: The base (1) includes a first surface (10), the first surface (10) is provided with a transmission mechanism (6) and a first support platform (2), a second support platform (3), a wax spraying mechanism (4), and a wax pressing mechanism (5) arranged around the outer periphery of the transmission mechanism (6); The transmission mechanism (6) includes a displacement mechanism (61) driven to be disposed on the first surface (10), a plurality of connecting rods (63) driven to be disposed on the displacement mechanism (61), and a suction cup (64) disposed on the connecting rods (63) for adsorbing and conveying a plurality of products. The wax spraying mechanism (4) includes a support (41) and a wax spraying head (42) disposed on the support (41). The wax pressing mechanism (5) includes a bracket (51), a clamping part (54) connected to the bracket (51), and an upper adsorption part (52) and a lower adsorption part (53) that can be opened and closed relative to each other on the base (1), and the upper adsorption part (52) and the lower adsorption part (53) are respectively located on the upper and lower sides of the clamping part (54). The displacement mechanism (61) includes at least two intersecting guide rails (611) parallel to the first surface (10), a rotating shaft (62) perpendicular to the first surface (10) and slidable along the guide rails (611), a connecting rod (63) connected to the rotating shaft (62) and rotatable about the rotating shaft (62), and a flip-up suction cup (64) connected to the connecting rod (63). The product includes at least one substrate (7) held by the first support platform (2); and at least two wafers (8) held by the second support platform (3); the upper adsorption part (52) and the lower adsorption part (53) are used to adsorb the wafers (8) respectively, the clamping part (54) is used to fix the substrate (7) so that the substrate (7) is located between the two adsorbed wafers (8); the suction cup (64) is used to adsorb the substrate (7) or the wafers (8).

2. The double-sided waxing equipment according to claim 1, characterized in that: One end of the support part (41) is connected to the base (1), and the other end is connected to the wax spray head (42). The wax spray head (42) faces the first surface (10) and is used to spray wax onto the substrate (7) located on the suction cup (64).

3. The double-sided waxing equipment according to claim 2, characterized in that: The first support platform (2) is provided with a heating plate (21) for heating the substrate (7).

4. The double-sided waxing equipment according to claim 3, characterized in that: The suction cup (64) includes a first suction cup (642) and a second suction cup (643). The first suction cup (642) is a disk, and the second suction cup (643) is a ring. The ring is used to adsorb the substrate (7), and the disk is used to adsorb the wafer (8).

5. The double-sided waxing equipment according to claim 4, characterized in that: A rotating component is provided between the suction cup (64) and the connecting rod (63), and the rotating component rotates to cause the suction cup (64) to flip. Or / and, the rotating shaft is a height-adjustable rotating shaft; Or / and, both the disk and the ring are provided with a plurality of suction holes (644), and the suction holes (644) are connected to a vacuum adsorption mechanism.

6. The double-sided waxing equipment according to claim 1, characterized in that: The upper adsorption part (52) includes an upper adsorption head (522) and an upper cylinder (521). The upper cylinder (521) connects the upper adsorption head (522) and the bracket (51). The upper cylinder (521) drives the upper adsorption head (522) to move in a direction perpendicular to the first surface (10) and provides suction to the upper adsorption head (522).

7. The double-sided waxing equipment according to claim 1, characterized in that: The lower adsorption part (53) includes a lower adsorption head (532) and a lower cylinder (531). The lower cylinder (531) connects the lower adsorption head (532) to the base (1). The lower cylinder (531) drives the lower adsorption head (532) to move in a direction perpendicular to the first surface (10) and provides suction to the lower adsorption head (532).

8. A method for applying wax to both sides, characterized in that, The double-sided waxing equipment as described in any one of claims 1-7 includes: Select the substrate (1) and transport it to the wax spraying mechanism (4); The wax spraying nozzle of the wax spraying mechanism (4) sprays wax onto the first side of the substrate (1), and when the substrate (1) is flipped over, the wax spraying nozzle sprays wax onto the second side of the substrate (1). The wax-sprayed substrate (1) is transported to the wax pressing mechanism (5), and the clamping part (54) fixes the substrate (1). Select the first wafer and transport it to the wax pressing mechanism (5), where the upper adsorption part (52) adsorbs the first wafer; Select a second wafer and transport it to the wax pressing mechanism (5), where the lower adsorption part (53) adsorbs the second wafer; The upper adsorption part (52) and the lower adsorption part (53) are pressed together to bond the first wafer and the second wafer to the substrate (7).

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