Heat dissipation structure

Abstract

The present application relates to a heat dissipation structure. The heat dissipation structure includes a metal layer, a heat dissipation protective layer, and a first adhesive layer. The heat dissipation protective layer is disposed on the metal layer, and includes a stack structure of a polymer material layer and a heat dissipation coating. The first adhesive layer is disposed between the metal layer and the heat dissipation protective layer. The heat dissipation coating includes a filler and a binder, and the filler is mixed in the binder. The filler includes graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof. The present application can quickly dissipate the heat generated by the heat source to the outside, thereby improving the heat dissipation efficiency of the electronic device.

Description

Technical Field

[0001] This invention relates to a heat dissipation structure, and more particularly to a heat dissipation structure with good heat dissipation effect and thin profile, as well as an electronic device having the heat dissipation structure. Background Technology

[0002] With the advancement of technology, the design and development of electronic devices invariably prioritize thinness and high efficiency. To meet the demands of high-speed operation and slim design, electronic components inevitably generate more heat than ever before. Therefore, heat dissipation has become an indispensable functional requirement for these components and devices. This is especially true for high-power components, where the significantly increased heat generated during operation causes the temperature of electronic products to rise rapidly. Excessive heat can lead to permanent damage to components or a substantial reduction in their lifespan.

[0003] Most known technologies utilize heat sinks, fans, or heat dissipation components (such as heat pipes) mounted on components or devices to conduct away waste heat generated during operation. These heat sinks typically have a certain thickness and are made of metals with high thermal conductivity or by doping them with inorganic materials that also have high thermal conductivity. However, while metals offer excellent thermal conductivity, their high density increases the overall weight and thickness of the heat sink. Furthermore, polymer composite materials doped with inorganic materials have poor structural strength and may be unsuitable for certain products.

[0004] Therefore, developing a heat dissipation structure that is more suitable for the needs of high-power components or devices and can be applied to different product fields to meet the requirements of thinness has been one of the goals that relevant manufacturers have been continuously pursuing. Summary of the Invention

[0005] In view of the above, the object of the present invention is to provide a heat dissipation structure and an electronic device using the heat dissipation structure, which can quickly conduct and dissipate the waste heat generated by the operation of electronic components to the outside, thereby improving the heat dissipation efficiency of the electronic device. The present invention can be applied to different product fields to achieve the requirement of thinner designs.

[0006] This invention proposes a heat dissipation structure comprising a metal layer, a heat dissipation protective layer, and a first adhesive layer. The heat dissipation protective layer is disposed on the metal layer and comprises a laminated structure of a polymer material layer and a heat dissipation coating layer. The first adhesive layer is disposed between the metal layer and the heat dissipation protective layer. The heat dissipation coating layer comprises a filler and an adhesive, with the filler mixed in the adhesive. The filler includes graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof.

[0007] In one embodiment, the material of the metal layer includes copper, aluminum, copper alloys, aluminum alloys, or combinations thereof.

[0008] In one embodiment, the first adhesive layer is double-sided tape or thermally conductive double-sided tape.

[0009] In one embodiment, the thickness of the heat dissipation coating is between 5 micrometers and 100 micrometers.

[0010] In one embodiment, the polymer material layer is located between the heat-dissipating coating and the first adhesive layer.

[0011] In one embodiment, the heat-dissipating coating is located between the polymer material layer and the first adhesive layer.

[0012] In one embodiment, the adhesive material includes acrylic, epoxy resin, polyurethane, or a combination thereof.

[0013] In one embodiment, the heat dissipation structure further includes a thermally conductive coating disposed on the surface of the metal layer facing or away from the first adhesive layer, the material of the thermally conductive coating including graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, or a combination thereof.

[0014] In one embodiment, the heat dissipation structure further includes a second adhesive layer disposed on the side of the metal layer away from the heat dissipation protective layer.

[0015] The present invention also provides a heat dissipation structure, which includes a heat-conducting component and a heat-dissipating coating. The heat-conducting component has a surface. The heat-dissipating coating is disposed on the surface of the heat-conducting component; wherein, the material of the heat-dissipating coating includes a filler and a binder, the filler being mixed in the binder, and the filler including graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof.

[0016] In one embodiment, the surface of the heat-conducting element includes a plurality of protrusions, and a heat-dissipating coating covers these protrusions and both sides of the heat-conducting element.

[0017] In one embodiment, the material of the heat-conducting element includes copper, aluminum, copper alloys, aluminum alloys, or combinations thereof.

[0018] The present invention also provides an electronic device, which includes electronic components and a heat dissipation structure as described in the foregoing embodiments. The electronic components generate waste heat during operation, and the heat dissipation structure is in contact with the electronic components.

[0019] In one embodiment, the electronic components include a battery, a chip, an image processor, memory, a motherboard, a graphics card, a display panel, a light-emitting element, a light-emitting module, or a lighting module.

[0020] As described above, in the heat dissipation structure of the present invention, a heat dissipation protective layer is disposed on the metal layer, and the heat dissipation protective layer includes a laminated structure of a polymer material layer and a heat dissipation coating layer; a first adhesive layer is disposed between the metal layer and the heat dissipation protective layer; wherein, the heat dissipation coating layer includes a filler and an adhesive, the filler being mixed in the adhesive, and the filler including graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof; or, the heat dissipation coating layer is disposed on the surface of a heat-conducting component; wherein, the material of the heat dissipation coating layer includes a filler and an adhesive, the filler being mixed in the adhesive, and the filler including graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof. Through the above structural design, when the heat dissipation structure comes into contact with electronic components that generate waste heat during operation, the waste heat generated by the electronic components can be quickly and effectively conducted and dissipated to the outside, thereby improving the heat dissipation efficiency of the electronic device. In some embodiments, even in some enclosed and high-temperature environments, the heat dissipation structure still has good heat dissipation effect. Furthermore, the heat dissipation structure of the present invention can be applied to different product fields to meet the requirements of thinner electronic devices. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a heat dissipation structure according to an embodiment of the present invention.

[0022] Figures 2A to 2F These are schematic diagrams of heat dissipation structures according to different embodiments of the present invention.

[0023] Figure 3A and Figure 3B These are schematic diagrams of heat dissipation structures according to different embodiments of the present invention.

[0024] Figure 4 This is a schematic diagram of an electronic device according to an embodiment of the present invention. Detailed Implementation

[0025] The following description, with reference to the accompanying drawings, illustrates heat dissipation structures and electronic devices according to some embodiments of the present invention, wherein the same components will be described using the same reference numerals. The components appearing in the following embodiments are only for illustrating their relative relationships and do not represent the actual proportions or dimensions of the components.

[0026] The heat dissipation structure of this invention can be applied to various product fields to meet the requirements of thinness, while improving the heat dissipation efficiency of electronic devices. Electronic devices, such as mobile phones, tablets, laptops, light-emitting devices, or lighting devices, generate waste heat from their internal electronic components during operation. Electronic components may include batteries, control chips (e.g., central control unit (CPU)), driver chips, image processors, memory (e.g., but not limited to SSDs, solid-state drives), motherboards, graphics cards, display panels, light-emitting elements (e.g., LEDs), light-emitting modules or lighting modules, or other components, units, or modules that generate heat, and are not limited thereto.

[0027] Figure 1 This is a schematic diagram of a heat dissipation structure according to an embodiment of the present invention. Figure 1 As shown, the heat dissipation structure 1 in this embodiment includes a metal layer 11, a heat dissipation protection layer 12, and a first adhesive layer 13.

[0028] The metal layer 11 includes a metal sheet, metal foil, metal layer, or metal film with high thermal conductivity, and its material may include, for example, but not limited to, copper, aluminum, copper alloys (alloys of copper and other metals), aluminum alloys (alloys of aluminum and other metals), or combinations thereof. In this embodiment, the metal layer 11 is an example of aluminum foil.

[0029] A heat dissipation protection layer 12 is disposed on the metal layer 11. The heat dissipation protection layer 12 can protect the metal layer 11 and at the same time enhance heat radiation and heat exchange, thereby increasing the heat dissipation effect. The heat dissipation protection layer 12 includes a laminated structure of a polymer material layer 121 and a heat dissipation coating layer 122. The polymer material layer 121 may be, for example, but not limited to, a film layer made of polyimide (PI), polyethylene terephthalate (PET), polypropylene (PP), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), or combinations thereof, or a film layer made of other polymer materials.

[0030] The heat dissipation coating 122 can be an aqueous or oil-based formulation and may include a filler 1221 and a binder 1222, with the filler 1221 mixed in the binder 1222. The filler 1221 may include, for example, graphene, carbon nanotubes, boron nitride (BN), silicon carbide (SiC), aluminum nitride (AlN), ceramic nitride, or combinations thereof. By mixing fillers 1221 of different dimensions (i.e., graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, or ceramic nitride), synergistic effects and different morphologies and particle sizes can be achieved, stacking a complete three-dimensional (3D) thermally conductive network to enhance heat radiation and heat exchange, thereby increasing heat dissipation efficiency. In some embodiments, a preferred material combination (and its proportion) of the filler 1221 is: graphene (20–60%), boron nitride and / or carbon black (20–40%), and carbon nanotubes (20–40%). The graphene sheet diameter (D50) can be, for example, between 1 micrometer (μm) and 30 μm, and the thickness can be, for example, between 1 nanometer (nm) and 70 nm; the boron nitride or carbon black particle size (D50) can be, for example, between 0.01 μm and 0.5 μm; the single-walled or multi-walled carbon nanotube diameter can be, for example, between 5 nm and 30 nm, and the length can be, for example, between 5 μm and 30 μm.

[0031] The adhesive 1222 may be a resin, for example, and the material may include one or a combination of acrylic, epoxy resin, and polyurethane. Furthermore, a hardener and other materials may be added to the thermal coating 122. The hardener, for example, is melamine resin or isocyanate, which can increase the crosslinking density to improve the adhesion, hardness, and chemical resistance of the thermal coating 122.

[0032] The thickness of the heat dissipation coating 122 can be, for example, between 5 μm and 100 μm. In some embodiments, the heat dissipation coating 122 can be formed by, for example, a coating process, depositing a slurry containing materials such as filler 1221, binder 1222, and hardener onto the polymer material layer 121, and then baking and curing it to form a heat dissipation protective layer 12. The coating process can be, for example, but not limited to, spray coating, spin coating, or precision coating. In some embodiments, a preferred material combination for the heat dissipation coating 122 may be, for example, 20% to 30% of the binder 1222 (such as resin), 0.5% to 1.5% of the filler 1221, 0.5% to 1% of the neutralizer (pH adjuster), 0.1% to 0.5% of the defoamer, 0.1% to 0.5% of the leveling agent, <0.5% of the adhesion promoter, <0.1% of the acid catalyst, <0.1% of the thickener, 0.5% to 1.5% of the retarder, and 5% to 10% of the hardener, etc.

[0033] The first adhesive layer 13 is disposed between the metal layer 11 and the heat dissipation protective layer 12. In this embodiment, the heat dissipation coating 122 is disposed on the surface of the polymer material layer 121 away from the first adhesive layer 13, such that the polymer material layer 121 is located between the heat dissipation coating 122 and the first adhesive layer 13, and the heat dissipation protective layer 12 is adhered to the metal layer 11 through the first adhesive layer 13. The first adhesive layer 13 can be double-sided adhesive or thermally conductive double-sided adhesive. Thermally conductive double-sided adhesive may include an adhesive material and a thermally conductive material, with the thermally conductive material mixed in the adhesive material. In addition to its adhesive properties, the thermally conductive double-sided adhesive can also assist in the conduction of heat energy through the thermally conductive material. Thermally conductive materials may include, for example, graphene, reduced graphene oxide, ceramic materials, or combinations thereof. Ceramic materials are, for example, but not limited to, boron nitride, alumina, aluminum nitride, silicon carbide, and other ceramic materials with high thermal conductivity, or combinations thereof, and are not limited thereto. Furthermore, the adhesive material may be, for example but not limited to, pressure-sensitive adhesive (PSA), and its material may include, for example, rubber, acrylic, silicone, or combinations thereof; while its chemical composition may be rubber-based, acrylic, silicone, or combinations thereof. In some embodiments, the thermally conductive double-sided adhesive is, for example, graphene double-sided adhesive.

[0034] In some embodiments, the heat dissipation structure may further include two release layers (not shown), which are respectively disposed on the upper and lower sides of the heat dissipation structure (e.g., Figure 1 The lower surface of the metal layer 11 and the upper surface of the heat dissipation coating 122 are both present. When the heat dissipation structure is to be used, these two release layers can be removed, and the heat dissipation structure can be attached to and in contact with the heat source (electronic component) using double-sided adhesive or thermally conductive double-sided adhesive. The material of the release layer can be, for example, but not limited to, paper, cloth, polyester (e.g., polyethylene terephthalate, PET) or combinations thereof, and is not limited thereto. It should be noted that the appearance of release layers on the upper and lower surfaces of the heat dissipation structure can also be applied to other embodiments of the present invention.

[0035] like Figures 2A to 2F The figures shown are schematic diagrams of heat dissipation structures in different embodiments of the present invention.

[0036] like Figure 2A As shown, the heat dissipation structure 1a of this embodiment has roughly the same component composition and connection relationship as the heat dissipation structure 1 of the aforementioned embodiment. The difference is that the heat dissipation coating 122 of the heat dissipation structure 1a of this embodiment is located between the polymer material layer 121 and the first adhesive layer 13. The feature that the heat dissipation coating 122 is located between the polymer material layer 121 and the first adhesive layer 13 can also be applied to other embodiments of the present invention.

[0037] In addition, such as Figure 2B and Figure 2CAs shown, the heat dissipation structures 1b and 1c of this embodiment are largely the same as the heat dissipation structure 1 of the aforementioned embodiment in terms of component composition and connection relationships. The difference lies in that the heat dissipation structures 1b and 1c of this embodiment may further include a thermally conductive coating 14, which is disposed on the surface of the metal layer 11 facing or away from the first adhesive layer 13. Figure 2B The thermally conductive coating 14 is exemplified by being disposed on the surface of the metal layer 11 facing the first adhesive layer 13 (the thermally conductive coating 14 is located between the metal layer 11 and the first adhesive layer 13). Figure 2C The thermally conductive coating 14 is exemplified by being disposed on the surface of the metal layer 11 away from the first adhesive layer 13 (the metal layer 11 is located between the thermally conductive coating 14 and the first adhesive layer 13). The thermally conductive coating 14 may include fillers, adhesives, hardeners, and other materials. The fillers may include graphene, carbon nanotubes, ceramic materials (e.g., boron nitride, silicon carbide, aluminum nitride), or combinations thereof, and are disposed on the metal layer 11 by a coating process, and then connected to the heat dissipation protection layer 12 via the first adhesive layer 13. Here, the laminated structure of the metal layer 11 and the thermally conductive coating 14 is collectively referred to as a thermally conductive composite layer.

[0038] In addition, such as Figure 2D As shown, the heat dissipation structure 1d of this embodiment has roughly the same component composition and connection relationship as the heat dissipation structure 1a of the aforementioned embodiment. The difference is that the heat dissipation structure 1d of this embodiment may further include a thermally conductive coating 14, which is located between the first adhesive layer 13 and the metal layer 11, and a heat dissipation coating 122 is located between the polymer material layer 121 and the first adhesive layer 13.

[0039] In addition, such as Figure 2E As shown, the heat dissipation structure 1e of this embodiment has roughly the same component composition and connection relationship as the heat dissipation structure 1 of the aforementioned embodiment. The difference lies in that the heat dissipation structure 1e of this embodiment further includes a second adhesive layer 15, which is disposed on the side of the metal layer 11 away from the heat dissipation protective layer 12. The second adhesive layer 15 is used to connect the heat source of the electronic device. The second adhesive layer 15 can be the same as the first adhesive layer 13, and can be double-sided adhesive or thermally conductive double-sided adhesive. The second adhesive layer 15 can be applied in other embodiments of the present invention.

[0040] In addition, such as Figure 2F As shown, the heat dissipation structure 1f of this embodiment has roughly the same component composition and connection relationship as the heat dissipation structure 1b of the aforementioned embodiment. The difference is that the heat dissipation structure 1f of this embodiment further includes a second adhesive layer 15, which is disposed on the side of the metal layer 11 away from the heat dissipation protection layer 12. The second adhesive layer 15 can be used to connect the heat source of the electronic device.

[0041] Figure 3A and Figure 3BThese are schematic diagrams of heat dissipation structures according to different embodiments of the present invention. Figure 3A As shown, the heat dissipation structure 2a includes a heat-conducting element 21 and a heat-dissipating coating 22. The heat-conducting element 21 has a surface 211. Here, the surface 211 may be the upper surface of the heat-conducting element 21 and may be a flat surface. The heat-dissipating coating 22 may be applied to the surface 211 of the heat-conducting element 21 by, for example, spraying. The heat-conducting element 21 may be a heat-conducting substrate, the material of which includes, but is not limited to, copper, aluminum, copper alloys, aluminum alloys, or combinations thereof, but is not limited thereto. In some embodiments, the heat-conducting element 21 may also be other types of heat-conducting / heat-dissipating structures, such as a heat-conducting film or a heat-dissipating film. The heat-dissipating coating 22 includes at least a filler 221 and an adhesive 222, with the filler 221 mixed in the adhesive 222. The heat-dissipating coating 22 may have the same technical content as the heat-dissipating coating 122 described above, and specific details can be found in the above description, which will not be elaborated further.

[0042] In some embodiments, the thickness of the heat dissipation coating 22 may be between 5 micrometers and 100 micrometers. In some embodiments, in addition to being disposed on the upper surface (surface 211) of the heat-conducting element 21, the heat dissipation coating 22 may also be disposed on both side surfaces of the heat-conducting element 21 to increase heat radiation efficiency. In some embodiments, the surface of the heat-conducting element 21 away from the heat dissipation coating 22 (i.e., Figure 3A The lower surface of the heat-conducting element 21 can be connected to electronic components (heat sources) to conduct waste heat generated by the electronic components and dissipate it to the outside. The heat dissipation coating 22 can be applied, for example, to the surface of the heat-conducting element 21 of any shape away from the heat source to increase thermal radiation efficiency and improve cooling effect.

[0043] In addition, such as Figure 3B As shown, the heat dissipation structure 2b of this embodiment has roughly the same component composition and connection relationship as the heat dissipation structure 2a of the aforementioned embodiment. The difference is that the surface 211 of the heat-conducting element 21 of the heat dissipation structure 2b of this embodiment includes multiple protrusions P, and the heat dissipation coating 22 covers these protrusions P, the surface between the protrusions P, and both sides of the heat-conducting element 21. In some embodiments, the protrusions P can be, for example, heat dissipation fins to increase the heat dissipation area, and the heat dissipation coating 22 can further increase heat radiation and heat exchange, thereby improving the cooling effect.

[0044] In some test cases, the heat dissipation structure 2 or 2b described above still exhibits good heat dissipation performance under sealed, high ambient temperatures. In some applications, the heat dissipation structure 2 or 2b can be used for heat dissipation of components (heat sources), such as light source modules or lighting modules for light-emitting diodes, or for heat dissipation of high-temperature electronic components (such as CPUs, SSDs), modules, or devices.

[0045] Figure 4 This is a schematic diagram of an electronic device according to an embodiment of the present invention. Figure 4As shown, the present invention also provides an electronic device 3, which includes an electronic component 31 and a heat dissipation structure 32. The electronic component generates waste heat during operation, and the heat dissipation structure 32 is in contact with and connected to the electronic component 31. In some embodiments, the heat dissipation structure 32 can be connected to the electronic component 31 via an adhesive layer 33 (e.g., double-sided tape or thermally conductive double-sided tape). Here, the heat dissipation structure 32 can be one of the heat dissipation structures 1, 1a to 1f, 2a or 2b described above, or a combination thereof. The specific technical details of the heat dissipation structures 1, 1a to 1f, 2a, 2b have been described in detail above and will not be repeated here. It is understood that if the heat dissipation structure 32 itself has the second adhesive layer described above, then the adhesive layer 33 is not required.

[0046] Electronic device 3 may be, for example, but not limited to, a flat panel display, a light-emitting device, or an illumination device, such as, but not limited to, a mobile phone, a laptop computer, a tablet computer, a television, a monitor, a backlight module, a light-emitting or illumination device, or other electronic devices. The heat source may be the electronic device's battery, control chip (e.g., a central control unit (CPU)), driver chip, image processor, memory (e.g., but not limited to, an SSD), motherboard, graphics card, display panel, a light-emitting or illumination module with light-emitting diodes, or other components, modules, or units that generate high heat, without limitation. In some embodiments, when electronic device 3 is a flat panel display, such as, but not limited to, a light-emitting diode (LED) display, an organic light-emitting diode (OLED) display, or a liquid crystal display (LCD), then electronic component 31 may be a display panel with a display surface, and heat dissipation structure 32 may be directly or indirectly attached to the surface opposite the display surface, thereby assisting in heat conduction and dissipation and improving the heat dissipation efficiency of the flat panel display. In other embodiments, when the electronic device 3 is a light-emitting device or lighting device, such as, but not limited to, a backlight module, an LED lighting module or an OLED lighting module, the electronic component 31 may be a light-emitting element including an LED or OLED and have a light-emitting surface. The heat dissipation structure 32 may be directly or indirectly attached to the surface opposite the light-emitting surface, thereby assisting in heat conduction and heat dissipation and improving heat dissipation efficiency.

[0047] Additionally, please refer to Table 1 for the same heat source and the same dimensions of the heat dissipation structure (e.g., 12mm). In the case of a 26mm diameter structure, cooling experiments were conducted using three different heat dissipation structures. #1 is a heat dissipation structure of one embodiment, while #2 and #3 are heat dissipation structures proposed in this invention. Table 1 demonstrates that this invention, by placing the heat dissipation protective layer on the metal layer, and the heat dissipation protective layer comprising a laminated structure of a polymer material layer and a heat dissipation coating, can effectively and rapidly conduct and dissipate the waste heat generated by electronic components to the outside environment. Moreover, compared to the heat dissipation structure of #1, it can further improve the cooling effect by 3 to 3.5 degrees Celsius. If the size of the heat dissipation structure is increased to, for example, 18mm... With a thickness of 29mm, its cooling effect can be improved by 7-8 degrees Celsius.

[0048] Table 1

[0049]

[0050] Additionally, please refer to Table 2 for the same heat source and the same dimensions of the heat dissipation structure (e.g., 12mm). In the case of 26mm, cooling experiments were conducted using three different heat dissipation structures. #1 is a heat dissipation structure of one embodiment, while #2 and #3 are heat dissipation structures with a thermally conductive composite layer (metal layer, thermally conductive coating layer) proposed in this invention. Table 2 demonstrates that, compared to #1, the heat dissipation structure of this invention with its thermally conductive composite layer and thermally conductive coating layer can indeed further improve the cooling effect by 1 to 1.7 degrees Celsius.

[0051] Table 2

[0052]

[0053] Additionally, please refer to Table 3 for the same heat source (e.g., SSD) and the same heat dissipation structure size (e.g., 20mm). In the case of 68mm, cooling experiments were conducted using five different heat dissipation structures. #1 is a heat dissipation structure of one embodiment, while #2 to #5 are the heat dissipation structures proposed in this invention (the graphene composite material is the aforementioned thermally conductive composite layer). Table 3 also demonstrates that, compared to #1, the heat dissipation structures of different embodiments proposed in this invention can indeed further improve the cooling effect by 0.2 to 1.3 degrees Celsius.

[0054] Table 3

[0055]

[0056] Additionally, please refer to Table 4 for heat dissipation experiments conducted using four different heat-dissipating coatings with different fillers under the same heat source. Table 4 also demonstrates that, compared to the pure aluminum plate of #1, the heat-dissipating coatings with different fillers proposed in this invention can indeed further improve the cooling effect by 8.0–10.1 degrees Celsius.

[0057] Table 4

[0058]

[0059] Furthermore, please refer to Table 5, which shows the heat dissipation experiments conducted on three heat sources at different temperatures in the heat dissipation structure 2b with the protrusion P described above. The heat source temperatures were set at 80°C, 90°C, and 100°C, respectively. However, the actual measured temperatures after heat dissipation by the heat dissipation structure 2b were 68.3°C, 79.3°C, and 88°C, respectively. This demonstrates that by covering the protrusion and its two side surfaces of the heat-conducting component with a thermally conductive coating, the present invention can indeed improve the cooling effect by 10.7–12 degrees Celsius.

[0060] Table 5

[0061]

[0062] Additionally, please refer to Table 6, which shows the heat dissipation experiment conducted on LED lamps with heat dissipation structures 2b having protrusions P in a sealed oven at a high temperature (thermal equilibrium 60°C). Here, "blank lamp" refers to an LED lamp without heat dissipation structure 2b; "anodizing" refers to anodizing the heat-conducting component 21 (including multiple protrusions P) of the LED lamp with heat dissipation structure 2b (for protection and rust prevention); and "spraying" refers to spraying a heat dissipation coating 22 onto the heat-conducting component 21 (including multiple protrusions P) of the LED lamp with heat dissipation structure 2b in addition to anodizing. Table 6 demonstrates that even when the LED lamp is in a high-temperature environment (e.g., 60°C), the heat dissipation structure 2b in this case can indeed significantly improve the cooling effect (up to 18.4°C).

[0063] Table 6

[0064]

[0065] Additionally, please refer to Table 7, which shows the heat dissipation experiment conducted on LED lamps with the heat dissipation structure 2b having the protrusion P in a sealed oven at a high temperature (thermal equilibrium 80°C). Table 7 demonstrates that even when the LED lamp is in a high-temperature environment (e.g., 80°C), the heat dissipation structure 2b of this invention can indeed significantly improve the cooling effect (up to a maximum temperature reduction of 14.9°C).

[0066] Table 7

[0067]

[0068] In summary, in the heat dissipation structure of the present invention, a heat dissipation protective layer is disposed on the metal layer, and the heat dissipation protective layer includes a laminated structure of a polymer material layer and a heat dissipation coating layer; a first adhesive layer is disposed between the metal layer and the heat dissipation protective layer; wherein, the heat dissipation coating layer includes a filler and an adhesive, the filler being mixed in the adhesive, and the filler including graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof; or, the heat dissipation coating layer is disposed on the surface of a heat-conducting component; wherein, the material of the heat dissipation coating layer includes a filler and an adhesive, the filler being mixed in the adhesive, and the filler including a structural design of graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof. When the heat dissipation structure comes into contact with electronic components that generate waste heat during operation, the waste heat generated by the electronic components can be quickly and effectively conducted and dissipated to the outside, thereby improving the heat dissipation efficiency of the electronic device. In some embodiments, even in some enclosed and high-temperature environments, the heat dissipation structure still has a good heat dissipation effect. In addition, the heat dissipation structure of the present invention can be applied to different product fields to meet the requirements of thinner electronic devices.

[0069] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this invention should be included in the appended claims.

Claims

1. A heat dissipation structure, comprising: Metal layer; A heat dissipation protection layer is disposed on the metal layer, the heat dissipation protection layer comprising a laminated structure of a polymer material layer and a heat dissipation coating layer; A first adhesive layer is disposed between the metal layer and the heat dissipation protective layer; as well as A thermally conductive coating is disposed on the surface of the metal layer facing or away from the first adhesive layer; The heat dissipation coating includes a filler and an adhesive, wherein the filler is mixed in the adhesive, and the filler includes graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof; The polymer material layer is located between the heat dissipation coating and the first adhesive layer; or, the heat dissipation coating is located between the polymer material layer and the first adhesive layer.

2. The heat dissipation structure according to claim 1, wherein the material of the metal layer includes copper, aluminum, copper alloy, aluminum alloy or a combination thereof.

3. The heat dissipation structure according to claim 1, wherein the first adhesive layer is double-sided tape or thermally conductive double-sided tape.

4. The heat dissipation structure according to claim 1, wherein the thickness of the heat dissipation coating is between 5 and 100 micrometers.

5. The heat dissipation structure according to claim 1, wherein the material of the adhesive comprises acrylic, epoxy resin, polyurethane, or a combination thereof.

6. The heat dissipation structure according to claim 1, wherein the material of the thermally conductive coating includes graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, or a combination thereof.

7. The heat dissipation structure according to claim 1, further comprising: A second adhesive layer is disposed on the side of the metal layer away from the heat dissipation protective layer.

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