A vibration sensor

Abstract

A vibration sensor comprising: a vibration receiver comprising a housing and a vibration unit, the housing forming an acoustic cavity, the vibration unit being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein: the housing is configured to generate vibrations based on an external vibration signal, the vibration unit is vibrated in response to the vibrations of the housing and transmits the vibrations through the first acoustic cavity to the acoustic transducer to generate an electrical signal, the vibration unit comprises a mass element and a spring element, the vibration unit comprises a mass element and a spring element; the mass element and the spring element form an additional resonant system, a resonance frequency of a resonance peak of the additional resonant system being smaller than a resonance frequency of the acoustic transducer.

Description

[0001] Cross-referencing

[0002] This application claims priority to international application No. PCT / CN2020 / 140180, filed on December 28, 2020, and Chinese application No. 202110445739.3, filed on April 23, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of acoustics, and more particularly to a vibration sensor. Background Technology

[0004] A vibration sensor is an energy conversion device that converts vibration signals into electrical signals. When used as a bone conduction microphone, the vibration sensor detects the vibration signals transmitted through the skin when a person speaks and converts these signals into electrical signals, thus transmitting sound. The sensitivity of the vibration sensor affects the quality of the transmitted sound, and current vibration sensors generally have low sensitivity. Therefore, there is a need to provide a vibration sensor with improved sensitivity. Summary of the Invention

[0005] This specification provides a vibration sensor, comprising: a vibration receiver including a housing and a vibration unit, the housing forming an acoustic cavity, the vibration unit located within the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer acoustically connected to the first acoustic cavity, wherein: the housing is configured to generate vibration based on an external vibration signal, the vibration unit vibrates in response to the vibration of the housing and transmits the vibration through the first acoustic cavity to the acoustic transducer to generate an electrical signal, the vibration unit including a mass element and an elastic element, and the deviation between the cross-sectional area of ​​the mass element and the first acoustic cavity in a direction perpendicular to the vibration direction of the mass element is less than 25%.

[0006] In some embodiments, the sensitivity of the vibration sensor is greater than or equal to -40dB in the frequency range of less than 1000 Hz.

[0007] In some embodiments, the vibration amplitude of the mass element is inversely proportional to the square of the resonant frequency of the vibration sensor.

[0008] In some embodiments, the sensitivity of the vibration sensor is proportional to: the ratio of the pressure change of the first acoustic cavity to the initial pressure of the first acoustic cavity, or the ratio of the volume change of the first acoustic cavity to the initial volume of the first acoustic cavity, or the ratio of the product of the vibration amplitude of the mass element and the cross-sectional area of ​​the first acoustic cavity perpendicular to the vibration direction of the mass element to the initial volume of the first acoustic cavity, wherein the sensitivity is greater than a threshold by setting at least one of the initial volume of the first acoustic cavity, the area of ​​the first acoustic cavity, and the resonant frequency.

[0009] In some embodiments, the acoustic transducer includes at least one air inlet, and the initial volume of the first acoustic cavity includes the volume of the at least one air inlet.

[0010] In some embodiments, the elastic element is surrounding and connected to the sidewall of the mass element, and the elastic element extends toward and is directly or indirectly connected to the acoustic transducer.

[0011] In some embodiments, the width of the elastic element from the side closest to the mass element to the side furthest from the mass element is 10-500 μm.

[0012] In some embodiments, the width of the elastic element varies from one side closer to the mass element to the other side farther from the mass element, and the amount of variation is less than or equal to 300 μm.

[0013] In some embodiments, the housing is connected to the acoustic transducer, and one end of the elastic element extending toward the acoustic transducer is directly connected to the acoustic transducer.

[0014] In some embodiments, the vibration receiver further includes a substrate disposed on the acoustic transducer, and one end of the elastic element extending toward the acoustic transducer is connected to the substrate.

[0015] In some embodiments, the substrate includes a base plate and a sidewall, the base plate being connected to the acoustic transducer, and the inner surface of the sidewall being connected to the elastic element.

[0016] In some embodiments, the thickness of the base plate is 50-150 μm, and the length of the sidewall in the direction away from the base plate is 20-200 μm.

[0017] In some embodiments, the resonant frequency of the vibration sensor is 1000 Hz to 5000 Hz.

[0018] In some embodiments, the resonant frequency of the vibration sensor is 1000 Hz to 4000 Hz.

[0019] In some embodiments, the resonant frequency of the vibration sensor is 2000 Hz to 3500 Hz.

[0020] In some embodiments, the elastic element is in direct contact with the housing or is spaced apart.

[0021] In some embodiments, the elastic element includes a first elastic portion and a second elastic portion, the two ends of the first elastic portion being connected to the sidewall of the mass element and the second elastic portion, respectively, and the second elastic portion extending toward the acoustic transducer and being directly or indirectly connected to the acoustic transducer.

[0022] In some embodiments, the material of the elastic element includes at least one of silicone rubber, silicone gel, and silicone sealant.

[0023] In some embodiments, the Shore hardness of the elastic element is 1-50 HA.

[0024] In some embodiments, the surface of the elastic element away from the acoustic transducer is lower than the surface of the mass element away from the acoustic transducer.

[0025] In some embodiments, at least one of the housing and the mass element is provided with at least one pressure relief hole.

[0026] In some embodiments, the volume of the first acoustic cavity is smaller than the volume of the second acoustic cavity.

[0027] In some embodiments, along the vibration direction of the mass element, the height of the first acoustic cavity is 1-100 μm, and the height of the second acoustic cavity is 50-200 μm.

[0028] In some embodiments, the thickness of the mass element is 50-1000 μm along the vibration direction of the mass element. Attached Figure Description

[0029] This application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0030] Figure 1 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this application;

[0031] Figure 2 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this application;

[0032] Figure 3This is a schematic diagram illustrating the connection method of the mass element and the elastic element according to some embodiments of this application;

[0033] Figure 4A This is a schematic diagram of a vibration unit according to some embodiments of this application;

[0034] Figure 4B This is a schematic diagram of a vibration unit according to other embodiments of this application;

[0035] Figure 4C This is a schematic diagram of a vibration unit according to other embodiments of this application;

[0036] Figure 5 This is a schematic diagram of a vibration receiver according to some embodiments of this application;

[0037] Figure 6 This is a simplified structural schematic diagram of a vibration system according to some embodiments of this application;

[0038] Figure 7 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this application;

[0039] Figure 8 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this application;

[0040] Figure 9 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this application;

[0041] Figure 10 This is a frequency response curve of a vibration sensor according to some embodiments of this application;

[0042] Figure 11 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this application;

[0043] Figure 12 This is a structural schematic diagram of a vibration sensor according to some embodiments of this application. Detailed Implementation

[0044] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0045] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0046] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0047] Flowcharts are used in this application to illustrate the operations performed by the system according to embodiments of this application. It should be understood that the preceding or following operations are not necessarily performed precisely in sequence. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.

[0048] This specification provides a vibration sensor in its embodiments. The vibration sensor may include a vibration receiver and an acoustic transducer. The vibration receiver may include a housing and a vibration unit. The housing may form an acoustic cavity. The vibration unit may be located within the acoustic cavity, dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically connected to the first acoustic cavity. The housing may be configured to vibrate based on external vibration signals (e.g., signals generated by vibrations of bones, skin, etc., when a user speaks). The vibration unit may vibrate in response to the vibration of the housing and transmit this vibration through the first acoustic cavity to the acoustic transducer to generate an electrical signal. The vibration unit may include a mass element and an elastic element. The deviation between the cross-sectional areas of the mass element and the first acoustic cavity perpendicular to the vibration direction of the mass element is less than 25%, which increases the air volume compression ratio within the first acoustic cavity during vibration of the vibration unit, thereby improving the sensitivity of the vibration sensor.

[0049] In some embodiments, the elastic element may surround the sidewalls connected to the mass element and extend toward the acoustic transducer to directly or indirectly connect to the acoustic transducer, thereby causing shear deformation of the elastic element during vibration of the vibration unit. Compared to tensile and compressive deformation, shear deformation reduces the spring constant of the elastic element, which lowers the resonant frequency of the vibration sensor, thereby increasing the vibration amplitude of the mass element during vibration of the vibration unit and improving the sensitivity of the vibration sensor.

[0050] Figure 1 This is a structural schematic diagram of the vibration sensor 100 according to some embodiments of this specification. For example... Figure 1As shown, the vibration sensor 100 may include a vibration receiver 110 and an acoustic transducer 120. In some embodiments, the vibration receiver 110 and the acoustic transducer 120 may be physically connected. The physical connection in this specification may include welding, snap-fitting, gluing, or integral molding, or any combination thereof.

[0051] In some embodiments, the vibration sensor 100 can be used as a bone conduction microphone. When used as a bone conduction microphone, the vibration sensor 100 can receive vibration signals from tissues such as bones and skin generated when a user speaks, and convert these vibration signals into electrical signals containing sound information. Because it collects almost no sound (or vibration) in the air, the vibration sensor 100 is relatively unaffected by ambient noise (e.g., the voices of others speaking nearby, noise from passing vehicles), making it suitable for use in noisy environments to collect speech signals from a user. By way of example only, noisy environments can include noisy restaurants, meeting rooms, streets, roadsides, fire scenes, etc. In some embodiments, the vibration sensor 100 can be applied to headphones (e.g., air conduction headphones and bone conduction headphones), hearing aids, assistive hearing devices, glasses, helmets, augmented reality (AR) devices, virtual reality (VR) devices, etc., or any combination thereof. For example, the vibration sensor 100 can be used as a bone conduction microphone in headphones.

[0052] Vibration receiver 110 can be configured to receive and transmit vibration signals. In some embodiments, vibration receiver 110 includes a housing and a vibration unit. The housing may be a hollow structure, and some components of the vibration sensor 100 (e.g., the vibration unit) may be located within the housing. For example, the housing may form an acoustic cavity, and the vibration unit may be located within the acoustic cavity. In some embodiments, the housing may be a regular or irregular three-dimensional structure such as a cuboid, cylinder, or frustum. In some embodiments, the material of the housing may include metal (e.g., copper, stainless steel), alloy, plastic, or any combination thereof. In some embodiments, the housing may have a certain thickness to ensure sufficient strength, thereby better protecting the components of the vibration sensor 100 (e.g., the vibration unit) disposed within the housing. In some embodiments, the vibration unit may divide the acoustic cavity formed by the housing into a first acoustic cavity and a second acoustic cavity. The first acoustic cavity may be acoustically connected to the acoustic transducer 120. The acoustic connection may be a connection method capable of transmitting sound pressure, sound waves, or vibration signals.

[0053] Acoustic transducer 120 can receive vibration signals and convert the received vibration signals into electrical signals containing sound information. In some embodiments, the vibration signal can be received via vibration receiver 110 and transmitted to a first acoustic cavity, which can transmit the vibration signal to acoustic transducer 120 via acoustic communication. In some embodiments, when vibration sensor 100 is operating, the housing can vibrate based on external vibration signals (e.g., signals generated by the vibration of bones, skin, etc., when a user speaks). Vibration unit can vibrate in response to the vibration of the housing and transmit the vibration to acoustic transducer 120 through the first acoustic cavity. For example, the vibration of the vibration unit can cause a volume change in the first acoustic cavity, thereby causing a change in the air pressure inside the first acoustic cavity, and converting the change in air pressure inside the cavity into a change in sound pressure inside the cavity. Acoustic transducer 120 can detect the change in sound pressure in the first acoustic cavity and generate an electrical signal based on it. For example, the acoustic transducer 120 may include a diaphragm. Changes in sound pressure within the first acoustic cavity act on the diaphragm, causing it to vibrate (or deform). The acoustic transducer 120 converts the diaphragm's vibration into an electrical signal. A detailed description of the vibration sensor 100 can be found in [reference needed]. Figures 2-12 A detailed description.

[0054] It should be noted that the above description of the vibration sensor 100 and its components is for illustrative purposes only and does not limit the scope of this specification. Those skilled in the art can make various modifications and changes to the vibration sensor 100 under the guidance of this specification. In some embodiments, the vibration sensor 100 may also include other components, such as a power supply to provide electrical power to the acoustic transducer 120. These modifications and changes are still within the scope of this specification.

[0055] Figure 2 This is a structural schematic diagram of the vibration sensor 200 according to some embodiments of this specification. For example... Figure 2 As shown, the vibration sensor 200 may include a vibration receiver 210 and an acoustic transducer 220. The vibration receiver 210 may include a housing 211 and a vibration unit 212. In some embodiments, the housing 211 may be connected to the acoustic transducer 220 to form a structure having an acoustic cavity 213. The connection between the housing 211 and the acoustic transducer 220 may be a physical connection. In some embodiments, the vibration unit 212 may be located within the acoustic cavity 213. In some embodiments, the vibration unit 212 may divide the acoustic cavity 213 into a first acoustic cavity 2131 and a second acoustic cavity 2132. For example, the vibration unit 212 may form the second acoustic cavity 2132 with the housing 211; the vibration unit 212 may form the first acoustic cavity 2131 with the acoustic transducer 220.

[0056] In some embodiments, the first acoustic cavity 2131 may be acoustically connected to the acoustic transducer 220. By way of example only, the first acoustic cavity 2131 may include an air inlet 221, through which the acoustic transducer 220 may be acoustically connected to the first acoustic cavity 2131. It should be noted that, as Figure 2 The description of the single air inlet 221 shown is for illustrative purposes only and is not intended to limit the scope of the invention. It should be understood that the vibration sensor 200 may include more than one air inlet. For example, the vibration sensor 200 may include multiple air inlets arranged in an array.

[0057] In some embodiments, along the vibration direction of the vibration unit 212 (e.g. Figure 2 As shown, the height H1 of the first acoustic cavity 2131 is 1-500 μm, and the height H1 of the first acoustic cavity 2132 refers to the distance between the surface of the mass element 2121 near the acoustic transducer 220 and the surface of the housing 211 near the acoustic transducer 220 (or the substrate). Preferably, along the vibration direction of the vibration unit 212, the height H1 of the first acoustic cavity 2131 is 1-450 μm. More preferably, along the vibration direction of the vibration unit 212, the height H1 of the first acoustic cavity 2131 is 1-400 μm. More preferably, along the vibration direction of the vibration unit 212, the height H1 of the first acoustic cavity 2131 is 1-350 μm. More preferably, along the vibration direction of the vibration unit 212, the height H1 of the first acoustic cavity 2131 is 1-300 μm. More preferably, along the vibration direction of the vibration unit 212, the height H1 of the first acoustic cavity 2131 is 1-250 μm. More preferably, the height H1 of the first acoustic cavity 2131 along the vibration direction of the vibrating unit 212 is 1-200 μm. More preferably, the height H1 of the first acoustic cavity 2131 along the vibration direction of the vibrating unit 212 is 1-150 μm. More preferably, the height H1 of the first acoustic cavity 2131 along the vibration direction of the vibrating unit 212 is 1-100 μm. More preferably, the height H1 of the first acoustic cavity 2131 along the vibration direction of the vibrating unit 212 is 1-80 μm. More preferably, the height H1 of the first acoustic cavity 2131 along the vibration direction of the vibrating unit 212 is 1-60 μm. More preferably, the height H1 of the first acoustic cavity 2131 along the vibration direction of the vibrating unit 212 is 1-40 μm. More preferably, the height H1 of the first acoustic cavity 2131 along the vibration direction of the vibrating unit 212 is 1-20 μm.

[0058] In some embodiments, the second acoustic cavity 2132 may have an open structure, i.e., directly connected to the outside. For example, the second acoustic cavity 2132 may be connected to the outside through a hole structure or opening structure provided on the housing 211. In this case, the air pressure change of the second acoustic cavity 2132 has almost no effect on the vibration of the vibration unit 212; however, airborne sound in the environment may affect the performance of the vibration sensor 200. To reduce the influence of airborne sound in the environment, in some embodiments, the second acoustic cavity 2132 may be a sealed cavity structure. In some embodiments, the volume of the second acoustic cavity 2132 may be larger than the volume of the first acoustic cavity 2131 to reduce the influence of the air pressure change of the second acoustic cavity 2132 on the vibration of the vibration unit 212 during vibration. In some embodiments, along the vibration direction of the vibrating unit 212, the height H2 of the second acoustic cavity 2132 can be 1-2000 μm. The height H2 of the second acoustic cavity 2132 refers to the distance between the surface of the mass element 2121 away from the acoustic transducer 220 and the inner surface of the housing 211 parallel to the mass element 2121. Preferably, along the vibration direction of the vibrating unit 212, the height H2 of the second acoustic cavity 2132 can be 1-1000 μm. Preferably, along the vibration direction of the vibrating unit 212, the height H2 of the second acoustic cavity 2132 can be 1-500 μm. Preferably, along the vibration direction of the vibrating unit 212, the height H2 of the second acoustic cavity 2132 can be 1-450 μm. More preferably, along the vibration direction of the vibrating unit 212, the height H2 of the second acoustic cavity 2132 can be 1-400 μm. More preferably, along the vibration direction of the vibrating unit 212, the height H2 of the second acoustic cavity 2132 can be 1-350 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 1-300 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 1-250 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 1-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 10-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 20-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 30-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 40-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 can be 50-200 μm along the vibration direction of the vibration unit 212.More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 60-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 70-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 80-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 90-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 100-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 120-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibrating unit 212 can be 140-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibration unit 212 can be 160-200 μm. More preferably, the height H2 of the second acoustic cavity 2132 along the vibration direction of the vibration unit 212 can be 180-200 μm.

[0059] In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 10:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 9:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 8:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 8:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 7:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 6:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 5:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 4:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 3:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 2:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 1.5:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 2.5:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 3.5:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 4.5:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 5.5:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 6.5:1.In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 7.5:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 8.5:1. In some embodiments, along the vibration direction of the vibration unit 212, the ratio of the height H2 of the second acoustic cavity 2132 to the height H1 of the first acoustic cavity 2131 can be 9.5:1.

[0060] In some embodiments, the vibration unit 212 may include a mass element 2121 and an elastic element 2122. In some embodiments, the mass element 2121 and the elastic element 2122 may be physically connected, for example, by adhesive bonding. As an example only, the elastic element 2122 may be a material with a certain degree of viscosity, directly bonded to the mass element 2121. In some embodiments, the elastic element 2122 may be a high-temperature resistant material, allowing the elastic element 2122 to maintain its performance during the manufacturing process of the vibration sensor 200. In some embodiments, when the elastic element 2122 is in an environment of 200°C to 300°C, its Young's modulus and shear modulus do not change or change very little (e.g., the change is within 5%), wherein the Young's modulus can be used to characterize the deformation capacity of the elastic element 2122 under tension or compression, and the shear modulus can be used to characterize the deformation capacity of the elastic element 2122 under shear. In some embodiments, the elastic element 2122 may be a material with good elasticity (i.e., prone to elastic deformation), allowing the vibration unit 212 to vibrate in response to the vibration of the housing 211. By way of example only, the material of the elastic element 2122 may include silicone rubber, silicone gel, silicone sealant, or any combination thereof. In some embodiments, the Shore hardness of the elastic element 2122 may be 1-50 HA. Preferably, the Shore hardness of the elastic element 2122 may be 1-45 HA. More preferably, the Shore hardness of the elastic element 2122 may be 1-40 HA. More preferably, the Shore hardness of the elastic element 2122 may be 1-35 HA. More preferably, the Shore hardness of the elastic element 2122 may be 1-30 HA. More preferably, the Shore hardness of the elastic element 2122 may be 1-25 HA. More preferably, the Shore hardness of the elastic element 2122 may be 1-20 HA. More preferably, the Shore hardness of the elastic element 2122 may be 1-15 HA. More preferably, the Shore hardness of the elastic element 2122 may be 1-10 HA. More preferably, the Shore hardness of the elastic element 2122 may be 1-5 HA. More preferably, the Shore hardness of the elastic element 2122 can be 15HA.

[0061] Mass element 2121 may also be referred to as mass block. In some embodiments, the material of mass element 2121 may have a density greater than a certain density threshold (e.g., 6 g / cm³). 3 The material of the mass element 2121 may be, for example, metal. By way of example only, the material of the mass element 2121 may include lead, copper, silver, tin, stainless steel, alloys, or any combination thereof. Since a higher density of the material of the mass element 2121 results in a smaller size, using a material with a density greater than a certain density threshold to make the mass element 2121 can reduce the size of the vibration sensor 200 to some extent. In some embodiments, the material density of the mass element 2121 has a significant impact on the resonance peak and sensitivity of the frequency response curve of the vibration sensor 200. For the same volume, a higher density of the mass element 2121 results in a larger mass, causing the resonance peak of the vibration sensor 200 to shift to lower frequencies and increasing sensitivity. In some embodiments, the material density of the mass element 2121 is 6~20 g / cm³. 3 Preferably, the material density of the mass element 2121 is 6~15 g / cm³. 3 More preferably, the material density of the mass element 2121 is 6~10 g / cm³. 3 More preferably, the material density of the mass element 2121 is 6~8 g / cm³. 3 In some embodiments, the mass element 2121 and the elastic element 2122 may be composed of different materials and then assembled (e.g., glued) together to form the vibration unit 212. In some embodiments, the mass element 2121 and the elastic element 2122 may also be composed of the same material and formed into the vibration unit 212 by integral molding.

[0062] In some embodiments, the thickness of the mass element 2121 along its vibration direction can be 50-1000 μm. Preferably, the thickness of the mass element 2121 along its vibration direction can be 60-900 μm. More preferably, the thickness of the mass element 2121 along its vibration direction can be 70-800 μm. More preferably, the thickness of the mass element 2121 along its vibration direction can be 80-700 μm. More preferably, the thickness of the mass element 2121 along its vibration direction can be 90-600 μm. More preferably, the thickness of the mass element 2121 along its vibration direction can be 100-500 μm. More preferably, the thickness of the mass element 2121 along its vibration direction can be 100-400 μm. More preferably, the thickness of the mass element 2121 along its vibration direction can be 100-300 μm. More preferably, the thickness of the mass element 2121 along its vibration direction can be 100-200 μm. More preferably, the thickness of the mass element 2121 along its vibration direction can be 100-150 μm.

[0063] In some embodiments, the elastic element 2122 may surround the sidewall connected to the mass element 2121. Figure 3 This is a schematic diagram illustrating the connection method of the mass element 2121 and the elastic element 2122 according to some embodiments of this specification. Figure 2 As shown in Figure 4, the inner side 2124 of the elastic element 2122 is connected to the sidewall of the mass element 2121. The inner side 2124 of the elastic element 2122 can refer to the side of the space surrounded by the elastic element 2122. The sidewall of the mass element 2121 can refer to the side of the mass element 2121 that is parallel to the vibration direction. The upper and lower surfaces of the mass element 2121 are approximately perpendicular to the vibration direction and are used to define the second acoustic cavity 2132 and the first acoustic cavity 2131, respectively. Since the elastic element 2122 surrounds and is connected to the sidewall of the mass element 2121, during the vibration of the vibrating unit 212 along the vibration direction, the momentum of the mass element 2121 is converted into a force on the elastic element 2122, causing the elastic element 2122 to undergo shear deformation. Compared to tensile and compressive deformation, shear deformation reduces the spring coefficient of the elastic element 2122, which reduces the resonant frequency of the vibration sensor 200, thereby increasing the vibration amplitude of the mass element 2121 during the vibration of the vibration unit 212 and improving the sensitivity of the vibration sensor 200.

[0064] In some embodiments, the mass element 2121 and elastic element 2122 in the vibration unit 212 can be considered as an additional resonant system besides the resonant system of the acoustic transducer 220. In some embodiments, the additional resonant system can adjust the original vibration characteristics of the vibration sensor 200 (i.e., the vibration characteristics under the action of the original resonant system of the acoustic transducer 220), causing a change in the original resonant frequency of the vibration sensor 200 (i.e., the resonant frequency under the action of the original resonant system of the acoustic transducer 220). This setting can also be considered as introducing a new resonant system into the original resonant system of the vibration sensor 200, thereby introducing a new resonant peak. The resonant frequency of the new resonant peak is lower than the resonant frequency of the acoustic transducer 220, resulting in higher sensitivity of the sensing device 200. A detailed description of the sensitivity of the sensing device 200 can be found in [reference needed]. Figures 6-8 A detailed description.

[0065] In some embodiments, the resonant frequency of the vibration sensor 200 can be from 1000 Hz to 5000 Hz. Preferably, the resonant frequency of the vibration sensor 200 can be from 1500 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 2000 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 2500 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 3000 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 3500 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 4000 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 4500 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 1000 Hz to 4500 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 1000 Hz to 4000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 1500 Hz to 4500 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 2000 Hz to 4000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 2000 Hz to 3500 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 2000 Hz to 3000 Hz. More preferably, the resonant frequency of the vibration sensor 200 can be from 2000 Hz to 2500 Hz. In some embodiments, the resonant frequency of the vibration sensor 200 can be determined by the parameters of the mass element 2121 and the elastic element 2122. In some embodiments, the parameters used to determine the resonant frequency may include, but are not limited to, the mass of the mass element 2121, the mass of the elastic element 2122, the stiffness of the elastic element 2122, the Young's modulus of the elastic element 2122, the shear modulus of the elastic element 2122, the equivalent stiffness of the elastic element 2122, or the spring constant of the elastic element 2122. In some embodiments, the vibration sensor 200 can have different resonant frequencies by adjusting the parameters of the mass element 2121 and the elastic element 2122. For example, when the mass of the mass element 2121 remains constant, the smaller the spring constant of the elastic element 2122, the lower the resonant frequency of the vibration sensor 200.

[0066] In some embodiments, the shape of the elastic element 2122 may be adapted to the shape of the mass element 2121. For example, the elastic element 2122 may be a tubular structure, the open end of which has the same cross-sectional shape as the mass element 2121 in a section perpendicular to the vibration direction of the mass element 2121. The open end of the elastic element 2122 may be the end connected to the mass element 2121. Figure 3 As shown, the mass element 2121 has a quadrilateral shape in a cross-section perpendicular to the vibration direction of the mass element 2121, and the area surrounded by the elastic element 2122 is tubular, which has a quadrilateral hole in a cross-section perpendicular to the vibration direction of the mass element 2121. As an example only, the shape of the mass element 2121 in a cross-section perpendicular to the vibration direction of the mass element 2121 can also include regular shapes (e.g., circular, elliptical, sector-shaped, rounded rectangle, polygonal) and irregular shapes. Correspondingly, the shape of the tubular shape surrounded by the elastic element 2122 in a cross-section perpendicular to the vibration direction of the mass element 2121 can include a tubular shape with a regular or irregular shaped aperture. This specification does not limit the shape of the outer side 2125 of the tubular elastic element 2122. The outer side 2125 of the elastic element 2122 can be the side opposite to the inner side 2124 of the elastic element 2122. For example, the outer shape of the tubular elastic element 2122 may include a cylindrical shape, an elliptical cylindrical shape, a conical shape, a rounded rectangular cylinder, a rectangular cylinder, a polygonal cylinder, an irregular columnar shape, or any combination thereof. Figure 3 As shown, the outer shape of the tubular elastic element 2122 can be quadrilateral.

[0067] In some embodiments, such as Figure 3 As shown, the width W of the elastic element 2122 surrounding the sidewall connected to the mass element 2121, from the side closest to the mass element 2121 to the side furthest from the mass element 2121, can be 10-500 μm. Preferably, the width W of the elastic element 2122 from the side closest to the mass element 2121 to the side furthest from the mass element 2121 can be 20-450 μm. More preferably, the width W of the elastic element 2122 from the side closest to the mass element 2121 to the side furthest from the mass element 2121 can be 30-400 μm. More preferably, the width W of the elastic element 2122 from the side closest to the mass element 2121 to the side furthest from the mass element 2121 can be 40-350 μm. More preferably, the width W of the elastic element 2122 from the side closest to the mass element 2121 to the side furthest from the mass element 2121 can be 50-300 μm. More preferably, the width W of the elastic element 2122 from the side closest to the mass element 2121 to the side furthest from the mass element 2121 can be 60-250 μm. More preferably, the width W of the elastic element 2122 from the side closest to the mass element 2121 to the side furthest from the mass element 2121 can be 70-200 μm. More preferably, the width W of the elastic element 2122 from the side closest to the mass element 2121 to the side furthest from the mass element 2121 can be 80-150 μm. More preferably, the width W of the elastic element 2122 from the side closest to the mass element 2121 to the side furthest from the mass element 2121 can be 90-100 μm.

[0068] In some embodiments, the width W of the elastic element 2122 varies along the vibration direction from the side closest to the mass element 2121 to the side furthest from the mass element 2121. That is, the elastic element 2122 may include multiple cross-sections perpendicular to the vibration direction, each cross-section corresponding to a width of the elastic element 2122 equal to its length along a direction perpendicular to the boundary of the elastic element 2122 within that cross-section. The width of the elastic element 2122 may differ in the multiple cross-sections. Figures 4A-4B As shown, the elastic element 2122 may bulge outward and / or inward relative to the mass element 2121. As described herein, the outward bulging of the elastic element 2122 relative to the mass element 2121 means that the distance between at least a portion of the outer side 2125 of the elastic element 2122 and the axis of the first acoustic cavity 2131 (Z-axis as shown in the figure) gradually increases along the direction from the mass element 2121 to the acoustic transducer; the inward bulging of the elastic element 2122 relative to the mass element 2121 means that the distance between at least a portion of the inner side 2124 of the elastic element 2122 and the axis of the first acoustic cavity 2131 gradually decreases along the direction from the mass element 2121 to the acoustic transducer. The axis of the first acoustic cavity 2131 (Z-axis as shown in the figure) may refer to the geometric center line of the first acoustic cavity 2131 parallel to the direction of vibration. This outward and / or inward bulging can cause the width W of the elastic element 2122 to vary along the vibration direction of the mass element 2121 from the side closer to the mass element 2121 to the side farther away from the mass element 2121. For example, as Figure 4B As shown, due to the inward bulge, the width of the portion of the elastic element 2122 away from the mass element 2121 is greater than the width of the portion closer to the mass element 2121. The amount of change in width can be represented as the difference between the minimum and maximum width values. In some embodiments, the amount of change in width can be less than or equal to 300 μm. In some embodiments, the amount of change in width can be less than or equal to 250 μm. In some embodiments, the amount of change in width can be less than or equal to 200 μm. In some embodiments, the amount of change in width can be less than or equal to 150 μm. In some embodiments, the amount of change in width can be less than or equal to 100 μm. In some embodiments, the amount of change in width can be less than or equal to 50 μm. In some embodiments, the amount of change in width can be less than or equal to 30 μm. In some embodiments, the width can also remain constant, i.e., the amount of change in width can be 0. In some embodiments, see... Figure 4CThe elastic element 2122 may be concave outward and / or inward relative to the mass element 2121. As described herein, the outward concavity of the elastic element 2122 relative to the mass element 2121 means that the distance between at least a portion of the inner side 2124 of the elastic element 2122 and the axis of the first acoustic cavity 2131 (Z-axis as shown in the figure) gradually decreases and then gradually increases along the direction from the mass element 2121 to the acoustic transducer; the inward concavity of the elastic element 2122 relative to the mass element 2121 means that the distance between at least a portion of the outer side 2125 of the elastic element 2122 and the axis of the first acoustic cavity 2131 gradually decreases and then gradually increases along the direction from the mass element 2121 to the acoustic transducer. For example, the outer side 2125 of the elastic element 2122 may be concave inward, and the inner side 2124 of the elastic element 2122 may be concave outward. For example, the outer side 2125 of the elastic element 2122 can be recessed inward, and the inner side 2124 of the elastic element 2122 can also bulge inward.

[0069] In some embodiments, such as Figure 2 As shown, the surface A of the elastic element 2122 away from the acoustic transducer 220 (i.e., the upper surface of the elastic element 2122, which is the surface of the elastic element 2122 away from the acoustic transducer 220) can be lower than the surface B of the mass element 2121 away from the acoustic transducer 220 (i.e., the upper surface of the mass element 2121, which is the surface of the mass element 2121 away from the acoustic transducer 220). Typically, since the elastic element 2122 is an elastic colloid, during the fabrication of the vibration unit 212, due to operational reasons, the elastic element 2122 may overflow onto the surface B of the mass element 2121. This may affect the encapsulation of the housing 211 (or even render the housing 211 unencapsulate), leading to a change in the volume of the second acoustic cavity 2132 and an increase in the equivalent stiffness of the elastic element 2122, thereby reducing the performance (e.g., sensitivity) of the vibration sensor 200. The equivalent stiffness of the elastic element 2122 can be a parameter that reflects the properties of the total deformation of the elastic element 2122 (e.g., including tensile, compressive, and shear deformation). In some embodiments, the height difference between the surface A of the elastic element 2122 away from the acoustic transducer 220 and the surface B of the mass element 2121 away from the acoustic transducer 220 can be less than 2 / 3 of the thickness of the mass element 2121. Preferably, the height difference between the surface A of the elastic element 2122 away from the acoustic transducer 220 and the surface B of the mass element 2121 away from the acoustic transducer 220 can be less than 1 / 2 of the thickness of the mass element 2121. More preferably, the height difference between the surface A of the elastic element 2122 away from the acoustic transducer 220 and the surface B of the mass element 2121 away from the acoustic transducer 220 can be less than 1 / 3 of the thickness of the mass element 2121.

[0070] In some embodiments, the elastic element 2122 may extend toward and be directly or indirectly connected to the acoustic transducer 220. For example, as Figure 2 As shown, one end of the elastic element 2122 extending towards the acoustic transducer 220 can be directly connected to the acoustic transducer 220. The connection between the elastic element 2122 and the acoustic transducer 220 can be a physical connection, such as adhesive bonding. In some embodiments, the elastic element 2122 and the housing 211 can be in direct contact or separated. For example, as... Figure 2 As shown, a gap may exist between the elastic element 2122 and the housing 211. The size of this gap can be adjusted by the designer according to the size of the vibration sensor 200. For example, Figure 5 This is a schematic diagram of a vibration receiver 210 according to some embodiments of this specification. For example... Figure 5 As shown, the elastic element 2122 can directly contact the housing 211. This reduces the flow of the elastic element 2122 during the fabrication of the vibration receiver 212, allowing for better control of its size and shape. It also reduces the size of the vibration sensor 200. While a gap between the elastic element 2122 and the housing 211 might increase the size of the vibration sensor 200 compared to direct contact, it reduces the equivalent stiffness of the elastic element 2122 and increases its elasticity. This improves the vibration amplitude of the mass element 2121 during the vibration of the vibration unit 212, which lowers the resonant frequency of the vibration sensor 200 and increases its sensitivity.

[0071] In some embodiments, at least one of the housing 211 and the mass element 2121 may be provided with at least one pressure relief hole. For example... Figure 2 and Figure 5 As shown, the housing 211 may be provided with at least one pressure relief hole 2111. The pressure relief hole 2111 may penetrate the housing 211. Figures 2-5As shown, the mass element 2121 may be provided with at least one pressure relief hole 2123. The pressure relief hole 2123 may penetrate the mass element 2121. The pressure relief hole 2123 allows gas to flow between the first acoustic cavity 2131 and the second acoustic cavity 2132, while the pressure relief hole 2111 allows gas to flow between the second acoustic cavity 2132 and the outside environment. This balances the pressure changes inside the first acoustic cavity 2131 and the second acoustic cavity 2132 caused by temperature changes during the fabrication process of the vibration sensor 200 (e.g., during reflow soldering), reducing or preventing damage to the components of the vibration sensor 200 caused by these pressure changes, such as cracking or deformation. In some embodiments, the housing 211 may be provided with at least one pressure relief hole 2111. When the mass element 2121 vibrates, the pressure relief hole 2111 can be used to reduce the damping generated by the gas inside the second acoustic cavity 2332.

[0072] In some embodiments, pressure relief holes 2111 and / or 2123 can be single holes. In some embodiments, the diameter of the single hole can be 1-50 μm. Preferably, the diameter of the single hole can be 2-45 μm. More preferably, the diameter of the single hole can be 3-40 μm. More preferably, the diameter of the single hole can be 4-35 μm. More preferably, the diameter of the single hole can be 5-30 μm. More preferably, the diameter of the single hole can be 5-25 μm. More preferably, the diameter of the single hole can be 5-20 μm. More preferably, the diameter of the single hole can be 6-15 μm. More preferably, the diameter of the single hole can be 7-10 μm. In some embodiments, pressure relief holes 2111 and / or 2123 can be an array of a certain number of micropores. By way of example only, the number of micropores can be 2-10. In some embodiments, the diameter of each micropore can be 0.1-25 μm. Preferably, the diameter of each micropore can be 0.5-20 μm. More preferably, the diameter of each micropore can be 0.5-25 μm. More preferably, the diameter of each micropore can be 0.5-20 μm. More preferably, the diameter of each micropore can be 0.5-15 μm. More preferably, the diameter of each micropore can be 0.5-10 μm. More preferably, the diameter of each micropore can be 0.5-5 μm. More preferably, the diameter of each micropore can be 0.5-4 μm. More preferably, the diameter of each micropore can be 0.5-3 μm. More preferably, the diameter of each micropore can be 0.5-2 μm. More preferably, the diameter of each micropore can be 0.5-1 μm.

[0073] In some embodiments, ambient airborne noise may affect the performance of the vibration sensor 200. To reduce the impact of ambient airborne noise, after the vibration sensor 200 is manufactured, for example after reflow soldering, at least one pressure relief hole 2111 on the housing 211 can be sealed with a sealing material. By way of example only, the sealing material may include epoxy resin, silicone sealant, or any combination thereof.

[0074] In some embodiments, pressure relief holes may not be provided in the housing 211 and the mass element 2121. In some embodiments, when pressure relief holes are not provided in the housing 211 and the mass element 2121, the components of the vibration sensor 200 can be prevented from being damaged by air pressure changes inside the first acoustic cavity 2131 and the second acoustic cavity 2332 by increasing the connection strength between the components of the vibration sensor 200 (e.g., increasing the connection strength of the glue connecting the components).

[0075] Vibration sensor 200 can convert external vibration signals into electrical signals. As an example only, external vibration signals may include vibrations from a person speaking, vibrations from skin moving with the body or from other devices (e.g., speakers) operating near the skin, vibrations from objects in contact with the vibration sensor 200, or vibrations from the air, or any combination thereof. When vibration sensor 200 is operating, external vibration signals can be transmitted through housing 211 to vibration unit 212. The mass element 2121 of vibration unit 212 vibrates in response to the vibration of housing 211 under the action of elastic element 2122. The vibration of mass element 2121 can cause a volume change in first acoustic cavity 2131, which in turn causes a change in air pressure within the first acoustic cavity 2131, converting the change in air pressure into a change in sound pressure within the cavity. Acoustic transducer 220 can detect the change in sound pressure in the first acoustic cavity 2131 and convert it into an electrical signal. For example, the acoustic transducer 220 may include an air inlet 221. Changes in sound pressure within the first acoustic cavity 2131 can act on the diaphragm of the acoustic transducer 220 through the air inlet 221, causing the diaphragm to vibrate (or deform) to generate an electrical signal. Furthermore, the electrical signal generated by the acoustic transducer 220 can be transmitted to external electronic devices. This is merely an example. Figure 2As shown, the acoustic transducer 220 may include an interface 222. The interface 222 may be wired (e.g., electrically connected) or wirelessly connected to internal components (e.g., a processor) of an external electronic device. Electrical signals generated by the acoustic transducer 220 may be transmitted to the external electronic device via the interface 222 in a wired or wireless manner. In some embodiments, the external electronic device may include a mobile device, a wearable device, a virtual reality device, an augmented reality device, etc., or any combination thereof. In some embodiments, the mobile device may include a smartphone, a tablet, a personal digital assistant (PDA), a gaming device, a navigation device, etc., or any combination thereof. In some embodiments, the wearable device may include a smart bracelet, headphones, a hearing aid, a smart helmet, a smartwatch, smart clothing, a smart backpack, smart accessories, etc., or any combination thereof. In some embodiments, the virtual reality device and / or the augmented reality device may include a virtual reality helmet, virtual reality glasses, a virtual reality patch, an augmented reality helmet, augmented reality glasses, an augmented reality patch, etc., or any combination thereof. For example, virtual reality devices and / or augmented reality devices may include Google Glass, Oculus Rift, HoloLens, Gear VR, etc.

[0076] It should be noted that the above description of the vibration sensor 200 and its components is for illustrative purposes only and does not limit the scope of this specification. Those skilled in the art can make various modifications and alterations to the vibration sensor 200 under the guidance of this specification. In some embodiments, the elastic element 2122 may be provided with at least one pressure relief hole. This pressure relief hole may extend through the elastic element 2122. These modifications and alterations are still within the scope of this specification.

[0077] Figure 6 This is a simplified structural schematic diagram of a vibration system 600 according to some embodiments of this specification. Figures 1-5 The vibration receiver shown can be described by a vibration system 600. For example... Figure 6 As shown, the vibration system 600 may include a housing 611 forming a closed cavity and a vibration unit 612 located within the closed cavity. The vibration unit 612 may include a mass element 6121 and an elastic element 6122. The elastic element 6122 may be connected between the mass element 6121 and the housing 611. In some embodiments, the elastic element 6122 may be a spring. For ease of description, the mass of the housing 611 may be expressed as m, and the mass of the mass element 6121 may be expressed as... The mass of the elastic element 6122 can be expressed as The damping of the system can be expressed as .

[0078] Assume the displacement of shell 611 during vibration. It can be represented as:

[0079] (1),

[0080] in, It is the vibration amplitude when the shell 611 vibrates. It is the imaginary unit. It is the vibration frequency of the shell 611 when it vibrates. This is the vibration time of the shell 611. The equation of motion for the mass element 6121 can be expressed as:

[0081] (2),

[0082] in, It is the displacement of mass element 6121 during vibration.

[0083] The relative displacement between the mass element 6121 and the housing 611 for Then the magnitude of the relative displacement It can be represented as:

[0084] (3),

[0085] in, The acceleration amplitude and force resistance modulus of the housing 611 are given. resist , It is an absolute value function.

[0086] The amplitude of vibration of mass element 6121 relative to housing 611 under unit acceleration It can be represented as:

[0087] (4).

[0088] make ,in, Given the resonant frequency of the 600-degree vibration system, we can obtain:

[0089] (5).

[0090] Regarding the sensitivity of vibration system 600 in the flat region of the frequency response curve. And for ease of calculation, take Then the vibration amplitude of mass element 6121 in the low-frequency range (e.g., the flat region of the frequency response curve) can be expressed as:

[0091] (6).

[0092] In practical applications of the vibration system 600 Therefore, in the practical application of the vibration system 600, the vibration amplitude of the mass element 6121 in the low-frequency range can be expressed as:

[0093] (7).

[0094] Quality factor Substituting into formula (7), the vibration amplitude of mass element 6121 in the low-frequency range can be expressed as:

[0095] (8).

[0096] The sensitivity of the vibration system 600 in the flat region of the frequency response curve is mainly related to the resonant frequency of the vibration system 600. Related to, affected by quality factor The influence is low and can be almost ignored. Therefore, the vibration amplitude of the mass element 6121 relative to the shell 611 at low frequencies (e.g., in the flat region of the frequency response curve) under unit acceleration can be expressed as:

[0097] (9).

[0098] As can be seen from formula (9), the vibration amplitude of the mass element 6121 is inversely proportional to the square of the resonant frequency of the vibration system 600. Applied to other embodiments of this specification, for example, Figure 2 For the vibration sensor 200 shown, the vibration amplitude of the mass element 2121 is inversely proportional to the square of the resonant frequency of the vibration sensor 200. Furthermore, according to formula (9), for a mechanical system (e.g., vibration sensor 100, vibration sensor 200, vibration system 600), the lower its resonant frequency, the greater the vibration amplitude of the center of gravity of its mass element (e.g., mass element 2121, mass element 6121) in the low-frequency range (e.g., the flat region of the frequency response curve of the mechanical system), and the higher its sensitivity. In some embodiments, the low frequency can be a frequency band less than 2000 Hz, less than 1000 Hz, less than 800 Hz, less than 600 Hz, or less than 500 Hz. Similarly, the greater the vibration amplitude of the center of gravity of the mass element of the mechanical system in the low-frequency range (e.g., the flat region of the frequency response curve of the mechanical system), the lower the resonant frequency of the mechanical system, and the higher its sensitivity.

[0099] Therefore, in this specification, according to Figure 2As described, an elastic element (e.g., elastic element 2122) is connected to the sidewall of a mass element (e.g., mass element 2121). During the vibration of the vibration unit (e.g., vibration unit 212), the elastic element undergoes shear deformation. Compared to tensile and compressive deformation, shear deformation reduces the spring constant of the elastic element, lowers the resonant frequency of the vibration sensor (e.g., vibration sensor 200), thereby increasing the vibration amplitude of the mass element during the vibration of the vibration unit and improving the sensitivity of the vibration sensor.

[0100] Furthermore, in this specification, according to Figure 2 As described in the text, there is a gap between the elastic element and the housing (e.g., housing 211), which can reduce the stiffness of the elastic element and increase its elasticity, thereby increasing the vibration amplitude of the mass element during the vibration of the vibration unit, thus reducing the resonant frequency of the vibration sensor and increasing the sensitivity of the vibration sensor.

[0101] The resonant frequency of the vibration system 600 can be determined by the mass of the mass element 6121. The mass of elastic element 6122 and the system's damping Determine, among which, the system's damping The mass of mass element 6121 is positively correlated with the resonant frequency of vibration system 600. and the mass of elastic element 6122 The sum is negatively correlated with the resonant frequency of the vibration system 600. Furthermore, as shown in formula (9), for mechanical systems with the same resonant frequency (e.g., vibration sensor 100, vibration sensor 200, vibration system 600), the vibration amplitudes of their mass elements (e.g., mass element 2121, mass element 6121) at low frequencies (e.g., the flat region of the frequency response curve of the mechanical system) are approximately the same. Regarding mechanical systems where the vibration amplitudes of the mass elements at low frequencies are approximately the same, how to improve the sensitivity of the mechanical system by setting the structure and / or parameters of each component is detailed below. Figures 7-8 Introduction.

[0102] Figure 7 This is a structural schematic diagram of a vibration sensor 700 according to some embodiments of this specification. For example... Figure 7As shown, the vibration sensor 700 may include a vibration receiver 710 and an acoustic transducer 720. The vibration receiver 710 may include a housing 711 and a vibration unit 712. The housing 711 may be connected to the acoustic transducer 720 to form an encapsulation structure having an acoustic cavity 713. The vibration unit 712 may be located within the acoustic cavity 713 of the encapsulation structure and divide the acoustic cavity 713 into a first acoustic cavity 7131 and a second acoustic cavity 7132. The vibration unit 712 may include a mass element 7121, an elastic diaphragm 7122, and a support member 7123. Figure 7 As shown, the mass element 7121 can be disposed on the upper surface of the elastic film 7122. In some embodiments, the material of the elastic film 7122 may include a polymeric elastic film such as polytetrafluoroethylene (PTFE) film or polydimethylsiloxane (PDMS) film, or a composite film (e.g., a film formed by combining plastic films (such as polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), and polyester (PET)), cellophane, paper, and / or metal foil AL). The support portion 7123 can be used to support the elastic film 7122. Figure 7 As shown, the elastic diaphragm 7122 is fixed to one end face of the support member 450. The other end face of the support member 450 is connected to the acoustic transducer 720.

[0103] It is important to note that, such as Figure 7 As shown, the mass element 7121 is disposed above the first acoustic cavity 7131 via an elastic film 7122, and the cross-sectional area of ​​the mass element 7121 perpendicular to its vibration direction is smaller than the cross-sectional area of ​​the first acoustic cavity 7131 perpendicular to the vibration direction of the mass element 7121. As an example only, the cross-sectional area of ​​the mass element 7121 perpendicular to its vibration direction is less than or equal to 2 / 3 of the cross-sectional area of ​​the first acoustic cavity 7131 perpendicular to the vibration direction of the mass element 7121. For another example, the cross-sectional area of ​​the mass element 7121 perpendicular to its vibration direction is less than or equal to 1 / 3 of the cross-sectional area of ​​the first acoustic cavity 7131 perpendicular to the vibration direction of the mass element 7121.

[0104] The sensitivity of the vibration sensor 700 can be proportional to the ratio of the air pressure change in the first acoustic cavity 7131 to the initial air pressure of the first acoustic cavity 7131, or the ratio of the volume change in the first acoustic cavity 7131 to the initial volume of the first acoustic cavity 7131. In other words, the sensitivity of the vibration sensor 700 can be expressed as:

[0105] (10)

[0106] in, For the air pressure changes in the first acoustic cavity 7131, The initial air pressure of the first acoustic cavity 7131 For the volume change of the first acoustic cavity 7131, The initial volume of the first acoustic cavity 7131. In some embodiments, the acoustic transducer 720 may include at least one air inlet 721, and the initial volume of the first acoustic cavity 7131. The volume includes at least one air inlet 721.

[0107] like Figure 7 As shown, since the cross-sectional area of ​​the mass element 7121 perpendicular to its vibration direction is smaller than the cross-sectional area of ​​the first acoustic cavity 7131 perpendicular to the vibration direction of the mass element 7121, the up-and-down vibration of the mass element 7121 along its vibration direction will cause the elastic diaphragm 7122 to deform, thereby causing a change in the volume of the first acoustic cavity 7131. Since the shape of the change in volume of the first acoustic cavity 7131 caused by the deformation of the elastic diaphragm 7122 can be approximated as a frustum, the volume change of the first acoustic cavity 7131... It can be represented as:

[0108] (11),

[0109] in, The vibration amplitude of mass element 7121 Let be the cross-sectional area of ​​the mass element 7121 perpendicular to its vibration direction. It is the cross-sectional area of ​​the first acoustic cavity 7131 in the vibration direction perpendicular to the mass element 7121.

[0110] Furthermore, according to formulas (10) and (11), the sensitivity of the vibration sensor 700 can be expressed as:

[0111] (12).

[0112] Figure 8 This is a structural schematic diagram of a vibration sensor 800 according to some embodiments of this specification. For example... Figure 8 As shown, the vibration sensor 800 may include a vibration receiver 810 and an acoustic transducer 820. The vibration receiver 810 may include a housing 811 and a vibration unit 812. The housing 811 may be connected to the acoustic transducer 820 to form an encapsulation structure having an acoustic cavity 813. The vibration unit 812 may be located within the acoustic cavity 813 of the encapsulation structure. The vibration unit 812 may divide the acoustic cavity 813 into a first acoustic cavity 8131 and a second acoustic cavity 8132. The vibration unit 812 may include a mass element 8121 and an elastic element 8122. The elastic element 8122 may surround a sidewall connected to the mass element 8121 and extend toward and directly connect to the acoustic transducer 820. The structure and components of the vibration sensor 800 are similar to those of the other components. Figure 2 The structure and components of the vibration sensor 200 described herein are the same or similar; for details, please refer to [link / reference]. Figures 2-5 The description in the text will not be repeated here.

[0113] It is important to note that, such as Figure 8 As shown, since the elastic element 8122 surrounds the sidewall of the mass element 8121, the cross-sectional area of ​​the mass element 8121 perpendicular to its vibration direction is approximately equal to the cross-sectional area of ​​the first acoustic cavity 8131 perpendicular to the vibration direction of the mass element 8121. In some embodiments, the deviation between the cross-sectional areas of the mass element 8121 and the first acoustic cavity 8131 perpendicular to the vibration direction of the mass element 8121 can be less than 25%. In some embodiments, this deviation refers to the ratio of the absolute value of the difference between the cross-sectional areas of the mass element 8121 and the first acoustic cavity 8131 perpendicular to the vibration direction of the mass element 8121 to the cross-sectional area of ​​the mass element 8121 perpendicular to the vibration direction of the mass element 8121. For example, the cross-sectional area of ​​the mass element 8121 perpendicular to its vibration direction is 3 / 4 to 5 / 4 of the cross-sectional area of ​​the first acoustic cavity 8131 perpendicular to the vibration direction of the mass element 8121. In some embodiments, the cross-sectional area of ​​the first acoustic cavity 8131 in the vibration direction perpendicular to the mass element 8121 may be the area of ​​the cross-section of the first acoustic cavity 8131 near the mass element 8121. Here, "near" may mean that the distance between the cross-section and the lower surface of the mass element 8121 is less than the distance between the cross-section and the upper surface of the acoustic transducer 820. In some embodiments, the lower surface of the mass element 8121 refers to the surface of the mass element 8121 near the acoustic transducer 820, and the upper surface of the acoustic transducer 820 refers to the surface of the acoustic transducer 820 near the mass element 8121. In some embodiments, the cross-sectional area of ​​the first acoustic cavity 8131 in the vibration direction perpendicular to the mass element 8121 may be the average area of ​​all cross-sections of the first acoustic cavity 8131 in the vibration direction perpendicular to the vibration direction. In some embodiments, the cross-sectional area of ​​the mass element 8121 in the vibration direction perpendicular to the mass element 8121 may be the area of ​​the lower surface of the mass element 8121. In some embodiments, the cross-sectional area of ​​the mass element 8121 perpendicular to the vibration direction of the mass element 8121 may also be the average area of ​​all cross-sections of the mass element 8121 perpendicular to the vibration direction. In some embodiments, the cross-sectional area of ​​the mass element 8121 perpendicular to the vibration direction of the mass element 8121 may also be the area of ​​the upper surface of the mass element 8121. In some embodiments, the upper surface of the mass element 8121 refers to the surface of the mass element 8121 that is away from the acoustic transducer 820.

[0114] like Figure 8As shown, since the cross-sectional area of ​​the mass element 8121 perpendicular to its vibration direction is approximately equal to the cross-sectional area of ​​the first acoustic cavity 8131 perpendicular to its vibration direction, the up-and-down vibration of the mass element 8121 along its vibration direction causes a change in the volume of the first acoustic cavity 8131. Since the shape of the volume change in the first acoustic cavity 8131 caused by the mass element 8121 can be approximated as cylindrical (or cuboid), the volume change of the first acoustic cavity 8131... It can be represented as:

[0115] (13)

[0116] in, The vibration amplitude of mass element 8121 It is the cross-sectional area of ​​the first acoustic cavity 8131 in the vibration direction perpendicular to the mass element 8121.

[0117] Furthermore, according to formulas (10) and (13), the sensitivity of the vibration sensor 800 can be expressed as:

[0118] (14)

[0119] in, For the air pressure changes in the first acoustic cavity 8131, The initial air pressure of the first acoustic cavity 8131, The initial volume of the first acoustic cavity 8131. In some embodiments, the acoustic transducer 820 may include at least one air inlet 821, and the initial volume of the first acoustic cavity 8131. The volume includes at least one air inlet 821.

[0120] As can be seen from formula (14), the sensitivity of the vibration sensor 800 is proportional to the vibration amplitude of the mass element 8121. The cross-sectional area of ​​the first acoustic cavity 8131 in the direction perpendicular to the vibration direction of the mass element 8121 The product of the product and the initial volume of the first acoustic cavity 8131 The ratio. In some embodiments, the sensitivity of the vibration sensor 800 can be increased by designing the structural parameters of the vibration sensor 800. Greater than the threshold. For example, according to the above formula (9), the resonant frequency of the vibration sensor 800 can be designed by designing the structural parameters of the vibration sensor 800. This affects the vibration amplitude of the mass element 8121. This is to ensure that the sensitivity of the vibration sensor 800 meets the requirements. In some embodiments, this can be achieved by setting the initial volume of the first acoustic cavity 8131. and / or the cross-sectional area of ​​the first acoustic cavity 8131 in the direction perpendicular to the vibration of the mass element 8121 Increase the sensitivity of vibration sensor 800 It exceeds the threshold. This threshold can be adjusted by the designer according to actual needs.

[0121] From formulas (12) and (14), it can be seen that the initial volume of the first acoustic cavity (e.g., first acoustic cavity 7131, first acoustic cavity 8131) is... Cross-sectional area perpendicular to the vibration direction of the mass element (e.g., mass element 7121, mass element 8121). and the vibration amplitude of the mass element Under certain conditions, when the cross-sectional area of ​​the mass element perpendicular to its vibration direction... Smaller than the cross-sectional area of ​​the first acoustic cavity in the direction perpendicular to the vibration of the mass element. At the same resonant frequency (i.e. same), ,Right now Figure 8 The sensitivity of the vibration sensor 800 shown is greater than Figure 7 The sensitivity of the vibration sensor shown is given.

[0122] In summary, in this specification, the sensitivity of a vibration sensor (e.g., vibration sensor 800) can be improved by setting the cross-sectional area of ​​a mass element (e.g., mass element 8121) perpendicular to its vibration direction to be approximately equal to the cross-sectional area of ​​a first acoustic cavity (e.g., first acoustic cavity 8131) perpendicular to the vibration direction of the mass element.

[0123] In some embodiments, the vibration sensor 200 has a sensitivity greater than or equal to -40 dB in the frequency range of 100 Hz to 1000 Hz. Preferably, the vibration sensor 200 has a sensitivity greater than or equal to -38 dB in the frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -36 dB in the frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -34 dB in the frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -32 dB in the frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -30 dB in the frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -28 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -27 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -26 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -24 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -22 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -20 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -18 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -16 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -14 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to 12 dB within a frequency range of 100 Hz to 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -10 dB within a frequency range of 100 Hz to 1000 Hz.

[0124] It should be noted that the above Figures 6-8 The description of the vibration sensor and its components is for illustrative purposes only and does not limit the scope of this specification. Those skilled in the art can make various modifications and alterations to the vibration sensor under the guidance of this specification. These modifications and alterations remain within the scope of this specification.

[0125] Figure 9 This is a structural schematic diagram of a vibration sensor 900 according to some embodiments of this specification. For example... Figure 9 As shown, the vibration sensor 900 may include a vibration receiver 910 and an acoustic transducer 920. The vibration receiver 910 may include a housing 911 and a vibration unit 912. The housing 911 may form an acoustic cavity 913. The vibration unit 912 may be located within the acoustic cavity 913 and divide the acoustic cavity 913 into a first acoustic cavity 9131 and a second acoustic cavity 9132. The vibration unit 912 may include a mass element 9121 and an elastic element 9122. The elastic element 9122 may surround a sidewall connected to the mass element 9121 and extend toward and indirectly connect to the acoustic transducer 920. The structure and components of the vibration sensor 900 are similar to those of the other components. Figure 2 The structure and components of the vibration sensor 200 described herein are the same or similar; for details, please refer to [link / reference]. Figures 2-5 The description in the text will not be repeated here.

[0126] In some embodiments, the vibration receiver 910 may further include a substrate 914. The substrate 914 can be used to fix and / or support other components of the vibration sensor 900. For example, a housing 911 can be physically connected to the substrate 914 to form an acoustic cavity 913. The substrate 914 can be disposed on the acoustic transducer 920. One end of an elastic element 9122 extending toward the acoustic transducer 920 can be connected to the substrate 914, allowing the substrate to be used to fix and support the vibration unit 912. The substrate arrangement allows the vibration receiver 910 to be processed, manufactured, and sold as a separate component. The vibration receiver 910 with the substrate can be directly physically connected (e.g., glued) to an existing acoustic transducer 920 to obtain the vibration sensor 900, which simplifies the manufacturing process of the vibration sensor 900 and improves the process flexibility in producing the vibration sensor 900. In some embodiments, the thickness of the substrate can be 10 μm to 300 μm. Preferably, the thickness of the substrate can be 20 μm to 250 μm. More preferably, the thickness of the substrate can be 30 μm to 200 μm. More preferably, the thickness of the substrate can be 40µm to 150µm. More preferably, the thickness of the substrate can be 50µm to 150µm. More preferably, the thickness of the substrate can be 60µm to 130µm. More preferably, the thickness of the substrate can be 70µm to 110µm. More preferably, the thickness of the substrate can be 80µm to 90µm. In some embodiments, the material of the substrate may include metals (e.g., iron, copper, stainless steel, etc.), alloys, non-metals (plastics, rubber, resin), etc., or any combination thereof.

[0127] In some embodiments, the substrate 914 may include an air outlet 9141. The projections of the air outlet 9141 and the air inlet 921 of the acoustic transducer 920 on the connection surface of the substrate 914 and the acoustic transducer 920 overlap or partially overlap, such that changes in sound pressure within the first acoustic cavity 9131 can act on the acoustic transducer 920 through the air outlet 9141 and the air inlet 921 to generate an electrical signal.

[0128] In some embodiments, the resonant frequency of the vibration sensor 900 can be 2500 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 900 can be 3000 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 900 can be 3500 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 900 can be 4000 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 900 can be 4500 Hz to 5000 Hz. More preferably, the resonant frequency of the vibration sensor 900 can be 2500 Hz to 4500 Hz. More preferably, the resonant frequency of the vibration sensor 900 can be 2500 Hz to 4000 Hz. More preferably, the resonant frequency of the vibration sensor 900 can be 2500 Hz to 3500 Hz. More preferably, the resonant frequency of the vibration sensor 900 can be 2500 Hz to 3000 Hz. In some embodiments, the vibration sensor 900 has a sensitivity greater than or equal to -27 dB in a frequency range less than 1000 Hz. Preferably, the vibration sensor 200 has a sensitivity greater than or equal to -26 dB in a frequency range less than 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -24 dB in a frequency range less than 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -22 dB in a frequency range less than 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -20 dB in a frequency range less than 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -18 dB in a frequency range less than 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -16 dB in a frequency range less than 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -14 dB in a frequency range less than 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to 12 dB in a frequency range less than 1000 Hz. More preferably, the vibration sensor 200 has a sensitivity greater than or equal to -10 dB in a frequency range less than 1000 Hz.

[0129] Figure 10This is a frequency response curve of a vibration sensor 900 shown according to some embodiments of this specification. For example... Figure 10 As shown, the resonant frequency of vibration sensor 900 is approximately 4500 Hz, and the sensitivity of vibration sensor 200 is around -18dB in the frequency range of less than 1000 Hz.

[0130] It should be noted that the above Figures 9-10 The description of the vibration sensor 900 and its components is for illustrative purposes only and does not limit the scope of this specification. Those skilled in the art can make various modifications and alterations to the vibration sensor 900 under the guidance of this specification. For example, the elastic element 9122 may be in direct contact with the housing 911 or there may be a gap between them. These modifications and alterations are still within the scope of this specification.

[0131] Figure 11 This is a structural schematic diagram of the vibration sensor 1100 according to some embodiments shown in this specification. For example... Figure 11 As shown, the vibration sensor 1100 may include a vibration receiver 1110 and an acoustic transducer 1120. The vibration receiver 1110 may include a housing 1111, a vibration unit 1112, and a substrate 1114. The housing 1111 may be connected to the substrate 1114 to form an encapsulation structure having an acoustic cavity 1113. The vibration unit 1112 may be located within the acoustic cavity 1113. The vibration unit 1112 may divide the acoustic cavity 1113 into a first acoustic cavity 11131 and a second acoustic cavity 11132. The vibration unit 1112 may include a mass element 11121 and an elastic element 11122. The elastic element 11122 may surround a sidewall connected to the mass element 11121, extend toward the acoustic transducer 1120, and be directly connected to the substrate 1114. The vibration receiver 1110 may be disposed on the acoustic transducer 1120. The structure and components of the vibration sensor 1100 are similar to those of the other two types of vibration sensors. Figure 2 The structure and components of the vibration sensor 200 described herein are the same or similar; for details, please refer to [link / reference]. Figures 2-5 The description in the text will not be repeated here.

[0132] In some embodiments, such as Figure 11As shown, the substrate 1114 may include a base plate 11142 and a sidewall 11143. The base plate 11142 may be connected to the acoustic transducer 1120. The inner surface of the sidewall 11143 may be connected to the elastic element 11122. In some embodiments, the outer surface of the sidewall 11143 may be in close contact with the housing 1111 to achieve encapsulation with the housing 1111. In some embodiments, the outer surface of the sidewall 11143 may not be in contact with the housing 1111, and the base plate 11142 of the substrate 1114 may extend to the housing 1111 and form an encapsulation by being in close contact with the housing 1111. The arrangement of the sidewall 11143 can reduce the flow of the elastic element 11122 during the fabrication of the vibration sensor 1100, facilitating better control of the shape and position of the elastic element 11122. In some embodiments, the thickness of the base plate 11142 is 50-150 μm. Preferably, the thickness of the base plate 11142 is 60-140 μm. More preferably, the thickness of the base plate 11142 is 70-130 μm. More preferably, the thickness of the base plate 11142 is 80-120 μm. More preferably, the thickness of the base plate 11142 is 90-110 μm. More preferably, the thickness of the base plate 11142 is 95-105 μm. In some embodiments, the length of the sidewall 11143 in the direction away from the base plate 11142 is 20-200 μm. Preferably, the length of the sidewall 11143 in the direction away from the base plate 11142 is 30-180 μm. More preferably, the length of the sidewall 11143 in the direction away from the base plate 11142 is 40-160 μm. More preferably, the length of the sidewall 11143 in the direction away from the base plate 11142 is 50-140 μm. More preferably, the length of the sidewall 11143 in the direction away from the base plate 11142 is 60-120 μm. More preferably, the length of the sidewall 11143 in the direction away from the base plate 11142 is 70-110 μm. More preferably, the length of the sidewall 11143 in the direction away from the base plate 11142 is 80-100 μm. More preferably, the length of the sidewall 11143 in the direction away from the base plate 11142 is 85-95 μm.

[0133] It should be noted that the above Figure 11 The description of the vibration sensor 1100 and its components is for illustrative purposes only and does not limit the scope of this specification. Various modifications and alterations to the vibration sensor 1100 can be made by those skilled in the art under the guidance of this specification. For example, the housing 1111 may be in contact (e.g., physically connected) with the acoustic transducer 1120 or there may be a gap. These modifications and alterations are still within the scope of this specification.

[0134] Figure 12 This is a structural schematic diagram of a vibration sensor 900 according to some embodiments of this specification. For example... Figure 12As shown, the vibration sensor 1200 may include a vibration receiver 1210 and an acoustic transducer 1220. The vibration receiver 1210 may include a housing 1211 and a vibration unit 1212. The housing 1211 may be connected to the acoustic transducer 1220 to form an encapsulation structure having an acoustic cavity 1213. The vibration unit 1212 may be located within the acoustic cavity 1213 of the encapsulation structure. The vibration unit 1212 may divide the acoustic cavity 1213 into a first acoustic cavity 12131 and a second acoustic cavity 12132. The vibration unit 1212 may include a mass element 12121 and an elastic element 12122. The elastic element 12122 may surround a sidewall connected to the mass element 12121 and extend toward and directly or indirectly connect to the acoustic transducer 1220. The structure and components of the vibration sensor 1200 are similar to those of the other components. Figure 2 The structure and components of the vibration sensor 200 described herein are the same or similar; for details, please refer to [link / reference]. Figures 2-5 The description in the text will not be repeated here.

[0135] In some embodiments, the elastic element 12122 may include a first elastic portion 122A and a second elastic portion 122B. The two ends of the first elastic portion 122A are respectively connected to the sidewall of the mass element 12121 and the second elastic portion 122B. The second elastic portion 122B extends toward and is directly or indirectly connected to the acoustic transducer 1220. For example, one end of the second elastic portion 122B extending toward the acoustic transducer 1220 may be directly physically connected (e.g., glued) to the acoustic transducer 1220. As another example, the vibration receiver 1210 may include a substrate, and one end of the second elastic portion 122B extending toward the acoustic transducer 1220 may be connected to the acoustic transducer 1220 via the substrate. The substrate and... Figure 9 and Figure 10 The substrates 914 and 1114 described herein are the same or similar; for details, please refer to [reference needed]. Figure 9 and Figure 10The description in the previous section will not be repeated here. In this embodiment, the first elastic part 122A is not connected to / in contact with the acoustic transducer 1220 or the substrate. This can effectively reduce the stiffness of the elastic element 12122, thereby increasing the vibration amplitude of the mass element 12121 during the vibration of the vibration unit 1212. This reduces the resonant frequency of the vibration sensor 1200 and increases the sensitivity of the vibration sensor 1200. In some embodiments, the resonant frequency of the vibration sensor 1200 can be 1000 Hz to 4000 Hz. Preferably, the resonant frequency of the vibration sensor 1200 can be 1000 Hz to 3500 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 1000 Hz to 3000 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 1000 Hz to 2500 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 1000 Hz to 2000 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 1000 Hz to 1500 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 1500 Hz to 4000 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 2000 Hz to 4000 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 2500 Hz to 4000 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 3000 Hz to 4000 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 3500 Hz to 4000 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 2000 Hz to 3500 Hz. More preferably, the resonant frequency of the vibration sensor 1200 can be 2500 Hz to 3000 Hz.

[0136] In some embodiments, the first elastic portion 122A and the second elastic portion 122B can be made of the same or different materials. As an example only, the materials of the first elastic portion 122A and the second elastic portion 122B may include silicone rubber, silicone gel, silicone sealant, or any combination thereof. In some embodiments, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 0.1-100 HA. Preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 0.2-95 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 0.3-90 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 0.4-85 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 0.5-80 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 0.6-75 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 0.7-70 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 0.8-65 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 0.9-60 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-55 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-50 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-45 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-40 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-35 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-30 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-25 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-20 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-15 HA. More preferably, the Shore hardness of the first elastic portion 122A and the second elastic portion 122B can be 1-10 HA.

[0137] In some embodiments, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 10-300 μm. Preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 20-280 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 30-260 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 40-240 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 50-240 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 50-220 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 50-200 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 60-180 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 70-160 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 80-140 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 90-120 μm. More preferably, the thickness of the first elastic portion 122A along the vibration direction of the mass element 12121 is 100-110 μm.

[0138] In some embodiments, the length of the first elastic portion 122A in the direction perpendicular to the vibration direction of the mass element 12121 (i.e., the width from one side near the mass element 12121 to the other side away from the mass element 12121) is 10-300 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 20-280 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 30-260 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 40-240 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 50-240 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 50-220 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 50-200 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 60-180 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 70-160 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 80-140 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 90-120 μm. In some embodiments, the width of the first elastic portion 122A from one side near the mass element 12121 to the other side away from the mass element 12121 is 100-110 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 20-280 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 30-260 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 40-240 μm.In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 50-240 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 50-220 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 50-200 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 60-180 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 70-160 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 80-140 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 90-120 μm. In some embodiments, the width of the second elastic portion 122B from one side near the mass element 12121 to the other side away from the mass element 12121 is 100-110 μm.

[0139] It should be noted that the above Figure 11 The description of the vibration sensor 1200 and its components is for illustrative purposes only and does not limit the scope of this specification. Various modifications and alterations to the vibration sensor 1200 can be made by those skilled in the art under the guidance of this specification. For example, the housing 1211 may be in contact (e.g., physically connected) with the acoustic transducer 1220 or there may be a gap. These modifications and alterations are still within the scope of this specification.

[0140] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0141] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0142] Furthermore, those skilled in the art will understand that aspects of this application can be described and illustrated through several patentable types or situations, including any new and useful combination of processes, machines, products, or substances, or any new and useful improvements thereof. Accordingly, aspects of this application can be implemented entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. All of the above hardware or software may be referred to as a “data block,” “module,” “engine,” “unit,” “component,” or “system.” Furthermore, aspects of this application may manifest as a computer product located on one or more computer-readable media, the product including computer-readable program code.

[0143] Computer storage media may contain a propagated data signal containing computer program code, for example, on baseband or as part of a carrier wave. This propagated signal may take various forms, including electromagnetic, optical, and suitable combinations thereof. Computer storage media can be any computer-readable medium other than a computer-readable storage medium, which can be connected to an instruction execution system, apparatus, or device to enable communication, propagation, or transmission of a program for use. The program code located on the computer storage medium can be propagated through any suitable medium, including radio, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0144] The computer program code required for the operation of each part of this application can be written in any one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., conventional procedural programming languages ​​such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages ​​such as Python, Ruby, and Groovy, or other programming languages. This program code can run entirely on the user's computer, or as a standalone software package on the user's computer, or partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer can be connected to the user's computer through any network, such as a local area network (LAN) or wide area network (WAN), or connected to an external computer (e.g., via the Internet), or in a cloud computing environment, or used as a service such as Software as a Service (SaaS).

[0145] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this application are not intended to limit the order of the processes and methods of this application. Although the foregoing disclosure has discussed some currently considered useful embodiments of the invention through various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, while the system components described above can be implemented using hardware devices, they can also be implemented solely through software solutions, such as installing the described system on existing servers or mobile devices.

[0146] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0147] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0148] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that material are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this application, as well as documents that limit the broadest scope of the claims in this application (currently or subsequently appended to this application). It should be noted that if there is any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0149] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.

Claims

1. A vibration sensor, characterized in that, include: A vibration receiver includes a housing and a vibration unit, the housing forming an acoustic cavity, the vibration unit being located within the acoustic cavity, and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; as well as An acoustic transducer is acoustically connected to the first acoustic cavity, wherein: The housing is configured to generate vibration based on an external vibration signal. The vibration unit vibrates in response to the vibration of the housing and transmits the vibration through the first acoustic cavity to the acoustic transducer to generate an electrical signal. The vibration unit includes a mass element and an elastic element; the mass element and the elastic element form an additional resonant system, and the resonant frequency of the resonant peak of the additional resonant system is lower than the resonant frequency of the acoustic transducer. The elastic element is connected to the sidewall of the mass element, and extends toward the acoustic transducer and is directly or indirectly connected to the acoustic transducer.

2. The vibration sensor according to claim 1, characterized in that, Within a frequency range of less than 1000 Hz, the sensitivity of the vibration sensor is greater than or equal to -40 dB.

3. The vibration sensor according to claim 1, characterized in that, The vibration amplitude of the mass element is inversely proportional to the square of the resonant frequency of the vibration sensor.

4. The vibration sensor according to claim 3, characterized in that, The sensitivity of the vibration sensor is proportional to: The ratio of the pressure change in the first acoustic cavity to the initial pressure of the first acoustic cavity, or The ratio of the volume change of the first acoustic cavity to the initial volume of the first acoustic cavity, or The ratio of the product of the vibration amplitude of the mass element and the cross-sectional area of ​​the first acoustic cavity perpendicular to the vibration direction of the mass element to the initial volume of the first acoustic cavity, wherein the sensitivity is greater than a threshold by setting at least one of the initial volume of the first acoustic cavity, the area of ​​the first acoustic cavity, and the resonant frequency.

5. The vibration sensor according to claim 4, characterized in that, The acoustic transducer includes at least one air inlet, and the initial volume of the first acoustic cavity includes the volume of the at least one air inlet.

6. The vibration sensor according to claim 1, characterized in that, The width of the elastic element from the side closest to the mass element to the side furthest from the mass element is 10-500 μm.

7. The vibration sensor according to claim 1, characterized in that, The width of the elastic element varies from the side closest to the mass element to the side furthest from the mass element, and the amount of variation is less than or equal to 300 μm.

8. The vibration sensor according to claim 1, characterized in that, The housing is connected to the acoustic transducer, and one end of the elastic element extending toward the acoustic transducer is directly connected to the acoustic transducer.

9. The vibration sensor according to claim 1, characterized in that, The vibration receiver further includes a substrate disposed on the acoustic transducer, and one end of the elastic element extending toward the acoustic transducer is connected to the substrate.

10. The vibration sensor according to claim 9, characterized in that, The substrate includes a base plate and a sidewall, the base plate being connected to the acoustic transducer, and the inner surface of the sidewall being connected to the elastic element.

11. The vibration sensor according to claim 10, characterized in that, The thickness of the base plate is 50-150 μm, and the length of the sidewall in the direction away from the base plate is 20-200 μm.

12. The vibration sensor according to claim 1, characterized in that, The resonant frequency of the vibration sensor is 1000 Hz to 5000 Hz.

13. The vibration sensor according to claim 1, characterized in that, The resonant frequency of the vibration sensor is 1000 Hz to 4000 Hz.

14. The vibration sensor according to claim 1, characterized in that, The resonant frequency of the vibration sensor is 2000 Hz to 3500 Hz.

15. The vibration sensor according to claim 1, characterized in that, The elastic element is either in direct contact with the housing or there is a gap between them.

16. The vibration sensor according to claim 1, characterized in that, The elastic element includes a first elastic part and a second elastic part. The two ends of the first elastic part are respectively connected to the sidewall of the mass element and the second elastic part. The second elastic part extends toward the acoustic transducer and is directly or indirectly connected to the acoustic transducer.

17. The vibration sensor according to claim 1, characterized in that, The material of the elastic element includes at least one of silicone rubber, silicone gel, and silicone sealant.

18. The vibration sensor according to claim 1, characterized in that, The Shore hardness of the elastic element is 1-50 HA.

19. The vibration sensor according to claim 1, characterized in that, The surface of the elastic element away from the acoustic transducer is lower than the surface of the mass element away from the acoustic transducer.

20. The vibration sensor according to claim 1, characterized in that, At least one of the housing and the mass element is provided with at least one pressure relief hole.

21. The vibration sensor according to claim 1, characterized in that, The volume of the first acoustic cavity is smaller than the volume of the second acoustic cavity.

22. The vibration sensor according to claim 1, characterized in that, Along the vibration direction of the mass element, the height of the first acoustic cavity is 1-100 μm, and the height of the second acoustic cavity is 50-200 μm.

23. The vibration sensor according to claim 1, characterized in that, Along the vibration direction of the mass element, the thickness of the mass element is 50-1000 μm.

Images