Display device

Abstract

A display device is disclosed that can achieve a narrow bezel by making the radius of curvature of the curved portion smaller, and strengthen the rigidity of the display panel by providing a reinforcing member in the curved portion.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0169938, filed on December 1, 2021, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] This disclosure relates to display devices, and more particularly to a display device capable of achieving a narrow bezel by reducing the non-active area of ​​the display device and increasing the stiffness of the curved portion. Background Technology

[0004] Display devices that display images in televisions, monitors, smartphones, tablet PCs, laptops, etc., utilize various methods and adopt various shapes.

[0005] Among display devices utilizing various methods, liquid crystal displays (LCDs) have been in use to this day, while the application scope and range of organic light-emitting diode (OLED) displays are rapidly expanding.

[0006] Since the display device includes a display panel having multiple light-emitting elements or liquid crystals for realizing images and driving transistors for controlling the operation of each light-emitting element or liquid crystal, the display device employs multiple light-emitting elements or liquid crystals to display images as intended.

[0007] In such devices, the liquid crystal display does not employ a self-emissive method; therefore, it requires a light source, such as a backlight, to emit light from its rear surface. Backlighting increases the thickness of the liquid crystal display and limits the implementation of various designs, such as flexible designs.

[0008] Because organic light-emitting display devices with self-emissive elements can be thinner than display devices with internal light sources and do not require a separate light source, organic light-emitting display devices can be implemented in various designs, such as flexible designs.

[0009] Organic light-emitting display devices include flexible display panels. The flexible display panel may include an active region for displaying images, an active region surrounding the active region, and a bendable portion extending from the active region. On one side of the bend, pads may be provided for electrically connecting additional components, such as flexible printed circuit boards or drivers for driving pixels. Summary of the Invention

[0010] The curved section refers to the portion extending downwards from one side of the displayed image. The thicker the display device, the larger the radius of curvature, resulting in an increase in the non-active area. If the non-active area increases, the overall size of the product, including the display device, will increase, reducing portability, and such thickness will become a design flaw. Furthermore, there is a possibility that users' attention may shift away from the active area and towards the non-active area.

[0011] If the radius of curvature is reduced to decrease the non-active area, the compressive and tensile forces applied to the bent portion increase, and the display panel may crack or break.

[0012] Furthermore, since the curved portion is located at the outermost edge of the display device, it may be susceptible to external impacts. If such an external impact is applied to the curved portion, it may deform and develop cracks or breakage.

[0013] In this context, the present disclosure can reduce the non-active region by making the radius of curvature of the curved portion smaller.

[0014] In addition, this disclosure provides additional reinforcing structures to prevent the bending portion with a small radius of curvature from easily deforming, thereby preventing cracks or fractures.

[0015] The technical problem according to this disclosure is to reduce the non-active area and to provide a display device with improved bending stiffness.

[0016] The technical problems of implementing the present disclosure are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description.

[0017] One embodiment is a display device, comprising: a display panel including a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion; and a first plate, a buffer plate, and a second plate configured to be disposed between the front portion and the pad portion.

[0018] In addition, the buffer plate includes a first adhesive layer, a buffer layer and a heat dissipation layer; and a portion of the pad portion is configured to contact the first adhesive layer, and another portion of the pad portion is configured to be disposed below the second plate, thereby making the radius of curvature of the bent portion smaller and reducing the non-active area of ​​the display device.

[0019] Another embodiment is a display device, including: a display panel including a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion; and a first plate, a buffer plate, and a second plate configured to be disposed between the front portion and the pad portion.

[0020] Furthermore, the buffer plate includes a first adhesive layer, a buffer layer, and a heat dissipation layer; and the first adhesive layer may be formed to protrude further toward the bending region or toward the side of the bending portion compared to the buffer layer, the heat dissipation layer, and the second plate. Therefore, the distance between the pad portion and the front portion becomes shorter toward the side of the bending portion, and thus the radius of curvature of the bending portion becomes smaller, resulting in a reduction in the non-active area of ​​the display device.

[0021] In addition, a first reinforcing member is provided on the outer surface of the bend; and a second reinforcing member is provided on the inner surface of the bend, thereby preventing cracks or fractures that may occur in the bend.

[0022] Another embodiment is a display device, comprising: a display panel including a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion; and a first adhesive layer and a porous substrate configured to be disposed between the front portion and the pad portion.

[0023] The porous substrate includes a second region and a first region. The second region is configured to be disposed above the pad portion, and the first region is configured to protrude further toward the curved portion or the side of the curved portion compared to the second region. Therefore, the non-active area of ​​the display device can be reduced.

[0024] Another embodiment is a display device, comprising: a display panel including a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion; and a first plate, a buffer plate, and a second plate configured to be disposed between the front portion and the pad portion.

[0025] The buffer plate includes a first adhesive layer and a porous substrate; the porous substrate includes a first region and a second region; and the second region is configured to be disposed on the upper part of the second plate, and the first adhesive layer and the first region are configured to protrude further toward the side of the bend compared to the second plate and the second region.

[0026] Further details of the implementation methods are included in the detailed embodiments and the accompanying drawings.

[0027] According to embodiments of the present disclosure, the non-active area of ​​the display device can be reduced, thereby making the overall size of the display device smaller and improving the portability and design of the display device.

[0028] Furthermore, by additionally providing reinforcing members in the bend, cracks and fractures that may occur in the bend can be prevented.

[0029] The beneficial effects of this disclosure are not limited to those mentioned above, and those skilled in the art can clearly understand other unmentioned effects through the following description. Attached Figure Description

[0030] Figure 1a This is a plan view showing the front surface of a display device according to an embodiment of the present disclosure.

[0031] Figure 1b This is a plan view showing the rear surface of the display device.

[0032] Figure 2 It is along Figure 1a The cross-sectional view taken from line I-I'.

[0033] Figure 3 This is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0034] Figure 4a This is a cross-sectional view of an embodiment with reinforcing members provided according to the present disclosure.

[0035] Figure 4b yes Figure 4a An enlarged cross-sectional view of region "A" shows another embodiment of the reinforcing member according to this disclosure.

[0036] Figure 4c yes Figure 4a An enlarged cross-sectional view of region "A" shows another embodiment of the reinforcing member according to this disclosure.

[0037] Figure 5 This is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0038] Figure 6 This is a cross-sectional view of the first adhesive layer according to the present disclosure.

[0039] Figure 7 This is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0040] Figure 8 This is a cross-sectional view of a display device according to another embodiment of the present disclosure. Detailed Implementation

[0041] The details illustrating this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below and can be implemented in various different forms. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art, and the claims are not limited to the embodiments of this disclosure.

[0042] It should be understood that this disclosure is not limited to the accompanying drawings, as shapes, dimensions, scales, angles, counts, etc., are merely examples to explain embodiments. Throughout the specification, the same reference numerals denote the same elements. Furthermore, in describing this disclosure, descriptions of such techniques will be omitted if they are deemed unnecessary to obscure the essence of this disclosure. When the terms "comprising," "having," and "implementing," etc., are used in this disclosure, other objects not mentioned herein may be added unless these terms are used in conjunction with the term "only." Unless the context clearly indicates otherwise, the singular forms expressed herein are intended to include the plural forms as well.

[0043] Unless otherwise expressly stated, components are to be interpreted as including tolerance ranges.

[0044] When describing location, for example, when using terms such as “in the middle of”, “above”, “below”, “beside” to describe the positional relationship between two parts, one or more intermediate parts may be set between the two parts, unless these terms are used with the terms “immediately following” or “directly”.

[0045] When one element or layer is disposed "on" another element or layer, other elements or layers may be disposed directly on or between that other element or layer.

[0046] Although terms such as "first" or "second" are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned in the following description may be a second component in the technical concept of this disclosure.

[0047] Throughout the specification, the same reference numerals denote the same elements.

[0048] The dimensions and thicknesses shown in the accompanying drawings were chosen for the convenience of describing the specification; therefore, this disclosure is not limited to the dimensions and thicknesses shown in the drawings.

[0049] Features of various aspects of this disclosure may be connected or combined with each other in part or in whole, and may be interlocked and operated in various technical ways fully understood by those skilled in the art, and implementation methods may be carried out independently or in combination.

[0050] The display device disclosed herein can be applied to organic light-emitting display devices, but is not limited thereto, and can be applied to various display devices such as LED display devices or quantum dot display devices.

[0051] In the following, a display device according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0052] Figure 1a It is a plan view showing the front surface of the display device, and Figure 1b This is a plan view showing the rear surface of the display device.

[0053] Figure 1a The front surface where the active area (AA) in the display device 10 is located is shown, and Figure 1b The rear surface of the display device 10, in which the driver 160 and the flexible printed circuit board 500 are mounted, is shown.

[0054] Reference Figure 1a and Figure 1b The display device 10 may include a cover member 20 and a display panel 100 attached below the cover member 20 (-Z axis). The display device 10 may include a first plate, a buffer plate, a connecting member, and a second plate configured to be disposed below the front portion of the display panel 100.

[0055] The cover member 20 is configured to cover the front of the display panel 100, thereby protecting the display panel 100 from external impacts. The cover member 20 may be formed of cover glass, tempered glass, reinforced plastic, etc., but is not limited to these.

[0056] The edge of the cover member 20 may have a curved surface or curvature point configured to bend in the rearward direction (-Z direction) of the display device 10.

[0057] Since the cover member 20 can be configured to cover the side area of ​​the display device 10 located below the cover member 20, the cover member 20 can protect the side area of ​​the display panel 100 and the front of the display device 10 from external impacts.

[0058] The cover member 20 can be formed of a transparent material, allowing it to overlap with the area displaying the image. For example, the cover member 20 can be formed of transparent plastic or a cover glass made of transparent glass that can transmit images, but is not limited thereto.

[0059] Below the cover member 20, a front portion (FP) of the display panel 100 may be provided. In the front portion (FP), pixel array units are provided to display images, and the pixel array units include multiple pixels having light-emitting elements and thin-film transistors, as well as signal wiring for transmitting drive signals. The front portion (FP) may include an active region (AA) for displaying images and a non-active region (NA) outside the active region (AA). The non-active region (NA) may be formed at the edge surrounding the active region (AA). The non-active region (NA) may include a curved portion (BND) of the display panel 100. Furthermore, the curved portion (BND) of the display panel 100 is visible from the top surface direction (Z-axis) of the display device 10, and since no image is displayed there, the curved portion (BND) of the display panel 100 is referred to as the non-active region (NA) of the curved portion (BND).

[0060] The division of active region (AA) and non-active region (NA) can be the same in cover member 20. In cover member 20, the region that transmits the image can be the active region (AA), and the region that surrounds the active region (AA) and cannot transmit the image can be the non-active region (NA).

[0061] The display panel 100 disposed below the cover member 20 may include a curved portion extending from one side of the front and bending.

[0062] Since the curved portion is located at the outermost edge of the display device 10, it may be susceptible to external impacts. Therefore, if subjected to such an external impact, the curved portion may easily deform and develop cracks or breakage.

[0063] Figure 2 It is along Figure 1a The cross-sectional view taken from line I-I'.

[0064] Reference Figure 2 The display device 10 may include a cover member 20 positioned on the top surface and a display panel 100 disposed below the cover member 20.

[0065] A first connecting member 150 may be provided between the cover member 20 and the display panel 100. The first connecting member 150 may connect or couple the cover member 20 and the display panel 100.

[0066] Because the first connecting member 150 can overlap with the active area (AA), a material that can transmit images through the display panel 100 can be used. For example, the first connecting member 150 can be formed of optically clear adhesive (OCA), optically clear resin (OCR), or pressure-sensitive adhesive (PSA), or a material that may include one of the above materials, but is not limited thereto.

[0067] The light-shielding unit 21 can be disposed at the edge of the non-active area (NA) below the cover member 20.

[0068] The light-shielding unit 21 can prevent various circuits, wiring and structures located in the non-active area (NA) of the display panel 100 from being visible to the user.

[0069] The light-shielding unit 21 can be configured to at least correspond to the non-active area (NA) of the display panel 120. The light-shielding unit 21 can be formed of a material capable of absorbing light. For example, the light-shielding unit 21 can be formed of a black matrix and can be formed by printing black ink, but is not limited thereto.

[0070] The display panel 100 disposed below the cover member 20 may include a front portion (FP), a bent portion (BND), and a pad portion (PAD) based on the display substrate 110.

[0071] The front portion (FP) of the display panel 100 may be located below the first connecting member 150. For example, the front portion (FP) may be an area for displaying images and may include a display substrate 110, a pixel array unit 120, an encapsulation layer 130, and an optical plate 140.

[0072] The bent portion (BND) of the display panel 100 can refer to the portion that extends from one side of the front portion (FP) and bends downward (in the -Z direction) and then bends again in the planar direction (Y direction). The bent portion (BND) may include the display substrate 110 and signal wiring.

[0073] The pad portion (PAD) of the display panel 100 can extend from the bend portion (BND) and is disposed below the front portion (FP). The pad portion (PAD) may include a display substrate 110, signal wiring, and pad electrodes connected to the signal wiring. A flexible printed circuit board 500 or a driver 160 for driving pixels may be mounted in the pad electrodes.

[0074] The optical plate 140 can be disposed on the front (FP). Furthermore, a functional layer can be disposed between the first connecting member 150 and the optical plate 140 to improve the display performance of the display device 10.

[0075] The optical plate 140 can improve the outdoor visibility and contrast of the image displayed in the display panel 100 by preventing the reflection of external light.

[0076] A display substrate 110 may be disposed at the bottom of the display panel 100. The display substrate 110 may be present in the front portion (FP), the bent portion (BND), and the pad portion (PAD). The display substrate 110 may be formed of a flexible plastic material, thus allowing it to be flexible. The display substrate 110 may be formed by including polyimide, or it may be formed of a thin, flexible glass material.

[0077] Pixel array units 120 can be provided in the display substrate 110. Pixel array units 120 can display images. The portion where pixel array units 120 are provided can be an active region (AA). Therefore, based on the cover member 20, the region corresponding to the pixel array unit 120 can be an active region (AA), while the remaining regions other than the active region (AA) can be non-active regions (NA).

[0078] The pixel array unit 120 may include a light-emitting element, a thin-film transistor for driving the light-emitting element, data lines and gate lines disposed in the display substrate 110, and signal wiring such as power lines for driving the pixels.

[0079] The pixel array unit 120 may include pixels that display an image based on signals provided to signal wiring, and each pixel may include a light-emitting element and a thin-film transistor. The light-emitting element may include an anode electrode electrically connected to the thin-film transistor, a light-emitting layer formed in the anode electrode, and a cathode electrode that provides a common voltage.

[0080] Thin-film transistors (TFTs) may include a gate electrode, a semiconductor layer, a source electrode, a drain electrode, etc. The semiconductor layer of a TFT may include silicon, such as a-Si, polycrystalline silicon, low-temperature polycrystalline silicon, etc., or oxides such as indium gallium zinc oxide (IGZO), but is not limited to these.

[0081] The anode electrode can be disposed in each pixel region to correspond to an opening region arranged according to the pattern of the pixel, and can be electrically connected to a thin-film transistor.

[0082] The light-emitting element may include a light-emitting layer formed between an anode electrode and a cathode electrode. The light-emitting layer may be configured to emit the same color of light, such as white light, for each pixel, or to emit different colors of light, such as red, green, or blue, for each pixel.

[0083] The encapsulation layer 130 can be disposed in the display substrate 110 to cover the pixel array unit 120. The encapsulation layer 130 can prevent oxygen, moisture or other foreign matter from penetrating into the light-emitting element layer of the pixel array unit 120. The encapsulation layer 130 can be formed as a stacked structure of alternating organic material layers and inorganic material layers, but is not limited thereto.

[0084] The front portion (FP) of the display panel 100 includes a display substrate 110, a pixel array unit 120, and an encapsulation layer 130, and can be formed to be flat except for its edges. A first plate 210 can be connected or coupled to the front portion (FP) to maintain flatness and improve rigidity.

[0085] The bent portion (BND) of the display panel 100 is a portion that can be easily bent in a desired direction by a user, and can be formed by including signal wiring and a display substrate 110, wherein the pixel array unit 120, the encapsulation layer 130 and the first board 210 are not provided.

[0086] The pad portion (PAD) of the display panel 100 may be an area without the pixel array unit 120 and the encapsulation layer 130. The pad portion (PAD) may be connected or coupled to the second board 220 to maintain a flat state and improve rigidity.

[0087] In other words, based on the form of the display panel 100 before bending, the first plate 210 disposed at the lower part of the front portion (FP) of the display panel 100 and the second plate 220 disposed at the lower part of the pad portion (PAD) can be coupled at the lower part of the display substrate 110 to enhance the rigidity of the display substrate 110 and maintain the flatness of the front portion (FP).

[0088] The first plate 210 and the second plate 220 can be formed to have a certain rigidity and thickness to enhance the rigidity of the display substrate 110, and can be not formed in the bending portion (BND) region where the bending portion (BND) is located.

[0089] Based on the form of the display panel 100 before bending, the first plate 210 and the second plate 220 can be disposed below the display substrate 110 and can be spaced apart from each other.

[0090] Based on the bent form of the display panel 100, the first board 210 is disposed below the front (FP) and the second board 220 is disposed above the pad portion (PAD).

[0091] The first plate 210 and the second plate 220 may be back plates configured to be disposed on the rear surface of the display substrate 110. The first plate 210 and the second plate 220 may be formed of a rigid thin-film plastic. For example, the first plate 210 and the second plate 220 may be formed of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), etc., but are not limited thereto. The first plate 210 and the second plate 220 may be formed of the same material having the same thickness, but are not limited thereto.

[0092] Based on the bent form of the display panel 100, a buffer plate 300 can be provided between the first plate 210 and the second plate 220. The buffer plate 300 can be formed of multiple layers or a single layer with buffering and heat dissipation properties, and is not limited by its terminology.

[0093] The buffer plate 300 may include one or more layers of a heat dissipation layer 310, an anti-warping layer 320, a buffer layer 330, and a first adhesive layer 340. For example, the buffer plate 300 may be in the form of the first adhesive layer 340, the buffer layer 330, the anti-warping layer 320, and the heat dissipation layer 310 stacked from top to bottom (in the -Z direction).

[0094] The heat dissipation layer 310 can be configured to correspond to components that generate high temperatures and can include a material with high thermal conductivity. Heat generated in the driver 160 or the display panel 100 can be dissipated through the heat dissipation layer 310.

[0095] For example, the heat dissipation layer 310 may include, but is not limited to, a metal with high thermal conductivity, such as copper (Cu) and aluminum (Al), or graphite. Furthermore, the heat dissipation layer 310 is conductive, and therefore may have grounding properties, properties that protect the rear surface of the display substrate 110, and heat dissipation properties.

[0096] An anti-warping layer 320 can be provided on the heat dissipation layer 310.

[0097] The anti-warping layer 320 can be formed of a flexible material such as a polyimide film, but is not limited to this.

[0098] An anti-warping layer 320 can be provided to prevent the buffer plate 300 from warping when the side of the cover member 20 is bent.

[0099] Due to its flexibility, the anti-warping layer 320 can minimize warping that may occur when curvature points are formed in the cover member 20.

[0100] A buffer layer 330 is disposed on the anti-warping layer 320 and may include a cushioning material, such as foam strips or foam pads. The buffer layer 330 can absorb impacts applied to various parts that may come into contact with the buffer plate 300.

[0101] The buffer layer 330, which has shock absorption properties, can enhance the rigidity of the buffer plate 300.

[0102] The first adhesive layer 340 may be disposed on the buffer layer 330 and may include an uneven structure configured to be formed on the surface of the first adhesive layer 340. Since the uneven structure of the first adhesive layer 340 can prevent air bubbles from forming between the first plate 210 and the buffer plate 300 when the buffer plate 300 is attached to the first plate 210, the process of removing air bubbles present between the first plate 210 and the buffer plate 300 can be omitted.

[0103] The first adhesive layer 340 includes an adhesive substance and can secure the buffer plate 300 to the first plate 210 by direct contact with the first plate 210.

[0104] Below the buffer plate 300, a second connecting member 400 and a second plate 220 may be provided.

[0105] The second connecting member 400 can be disposed between the buffer plate 300 and the pad portion (PAD), or between the buffer plate 300 and the second plate 220. The second connecting member 400 can be used to fix the curved display panel 100 to maintain its curved shape. The second connecting member 400 can be formed to have a certain thickness in the thickness direction, thereby maintaining a constant curvature of the bent portion (BND). The second connecting member 400 can be a double-sided adhesive tape that can fix the second plate 220 and the heat dissipation layer 310 of the buffer plate 300, but is not limited thereto. To further improve the shock absorption characteristics, the second connecting member 400 can be formed of adhesive foam tape or adhesive foam pad.

[0106] A second plate 220 may be provided below the second connecting member 400. In order to provide and fix the second plate 220 below the second connecting member 400, the second plate 220 may be connected to or attached to the lower part of the pad portion (PAD) of the display panel 100, and the second plate 220 may be attached or fixed to the lower part of the second connecting member 400 by bending the bending portion (BND).

[0107] With the second plate 220 fixed to the second connecting member 400, the second plate 220 can be disposed on the pad portion (PAD). In other words, the second connecting member 400 and the second plate 220 can be disposed between the heat dissipation layer 310 of the buffer plate 300 and the pad portion (PAD).

[0108] When the second plate 220 is fixed to the second connecting member 400, the outer body, which is the top surface of the bend (BND), is exposed to the outside, and the rear surface of the bend (BND), which is the inner surface, can be set to face the side of the buffer plate 300 and the side of the second connecting member 400.

[0109] A first reinforcing member 600 may be provided on the top surface of the outer body of the curved portion (BND) of the display panel 100. The first reinforcing member 600 covers the curved portion (BND) and may extend to cover at least a portion of the front portion (FP) and the pad portion (PAD).

[0110] The first reinforcing member 600 may include a resin. For example, the first reinforcing member 600 may include an ultraviolet (UV) cured acrylic resin or a thermosetting resin, and various materials may be used as the first reinforcing member 600 and are not limited thereto.

[0111] The first reinforcing member 600 can be formed from a resin-cured product that has undergone a curing process after resin application. If a UV-curable resin is used, curing can be achieved by UV light irradiation. If a thermosetting resin is used, the resin is hardened by heating. The first reinforcing member 600 can be a micro cover layer (MCL).

[0112] The first reinforcing member 600 can cover various signal wirings arranged between the pad portion (PAD) and the encapsulation layer 130 of the display panel 100, thereby preventing the signal wirings from being penetrated by moisture and protecting the signal wirings from external impacts.

[0113] In the bend (BND), the stiffness is reduced because some components other than the display substrate 110 and signal wiring may be omitted to improve the flexibility of the display panel 100. The first reinforcing member 600 can strengthen the bend (BND) to compensate for the reduction in stiffness caused by the omission of some components.

[0114] The bend (BND) is a portion disposed between the front portion (FP) and the pad portion (PAD), and it can be bent so that the front portion (FP) and the pad portion (PAD) can connect to each other, and the pad portion (PAD) can be disposed below the front portion (FP). The greater the degree of bending of the bend (BND), the greater the compressive and tensile forces applied to the signal wiring disposed in the bend (BND). If the bend is deformed due to external impact, cracks or breaks may occur in the bend, including the signal wiring and the display substrate 110.

[0115] In other words, if the bend (BND) is folded or bent sharply, the signal wiring within it may be damaged. Therefore, the bend (BND) can be bent at a certain curvature. The curvature of the bend (BND) can be represented by the radius of curvature (R1), and a larger radius of curvature (R1) results in a larger bend (BND), and a smaller radius of curvature (R1) results in a smaller bend (BND). A larger radius of curvature in the bend (BND) results in a larger non-active area, and a smaller radius of curvature (R1) results in a narrower non-active area.

[0116] If the bend is folded or bent into a shape with a high angle and fixed in such a state as to reduce the non-active area of ​​the bend (BND), instead of bending it into a circular shape with a certain radius of curvature, the folding occurs at the point where the front (FP) connects to the bend (BND) or the point where the bend (BND) connects to the pad (PAD), which can cause cracks or damage to the signal wiring.

[0117] Therefore, in order to prevent breakage of the display panel 100 or signal wiring, the bend (BND) can be formed to bend into a specific radius of curvature that depends on the distance between the front part (FP) and the pad part (PAD).

[0118] For example, the bend (BND) can be configured to bend by forming a radius of curvature (R1) by half the length of the distance or thickness (T) between the front part (FP) and the pad part (PAD).

[0119] When the radius of curvature (Rl) of the bend (BND) is formed to be equal to or greater than half the distance or thickness (T) between the front portion (FP) and the pad portion (PAD), the bend (BND) may be positioned further upward than the front portion (FP) or further downward than the pad portion (PAD), and interference with other parts may occur. Furthermore, the non-active area of ​​the bend (BND) may increase.

[0120] When the radius of curvature (Rl) of the bend (BND) is formed by half the thickness (T) or distance between the front part (FP) and the pad part (PAD), it is difficult to reduce the non-active area because the radius of curvature (Rl) of the bend (BND) and the non-active area can be determined by the distance between the front part (FP) and the pad part (PAD).

[0121] Figure 3 This is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0122] Reference Figure 3 The display device 10 is an embodiment that can reduce the radius of curvature (R2) of the curved portion (BND) and reduce the non-active area without adding or removing components.

[0123] The display device 10 may include a cover member 20 and a display panel 100 attached below the cover member 20 in a downward direction (-Z axis). The display device 10 may include a first plate 210, a buffer plate 300, a second connecting member 400, and a second plate 220 disposed below the front portion (FP) of the display panel 100.

[0124] The buffer plate 300 may include at least one or more layers selected from the following: a heat dissipation layer 310, an anti-warping layer 320, a buffer layer 330, and a first adhesive layer 340. For example, the buffer plate 300 may be in the form of the first adhesive layer 340, the buffer layer 330, and the heat dissipation layer 310 stacked from top to bottom (-Z axis).

[0125] The first plate 210 and the first adhesive layer 340 may be formed to protrude further toward the bending region or toward the side of the bending portion compared to the buffer layer 330, the heat dissipation layer 310, and the second plate 220. Alternatively, the buffer layer 330, the heat dissipation layer 310, and the second plate 220 may be formed by retracting in the opposite direction to the bending region or the side of the bending portion compared to the first plate 210 and the first adhesive layer 340.

[0126] When the first plate 210 and the first adhesive layer 340 are formed to protrude further, the buffer plate 300 may have a stepped portion, and as it approaches the bend region or one side of the bend, the thickness or distance between the pad portion (PAD) and the front portion (FP) becomes shorter.

[0127] If the first plate 210 and the first adhesive layer 340 are formed to protrude further, a portion of the pad portion (PAD) of the display panel 100 can be connected to or in contact with the first adhesive layer 340, while another portion of the pad portion (PAD) can be disposed below the second plate 220. The pad portion (PAD) can have a portion extending in a diagonal direction, such that the portion of the pad portion (PAD) disposed below the first adhesive layer 340 and the other portion of the pad portion (PAD) disposed below the second plate 220 can be connected to each other. Since the pad portion (PAD) can be folded by the portion extending in a diagonal direction, by forming the first plate 210 and the first adhesive layer 340 to protrude more than the buffer layer 330 or the second plate 220, the angle of the portion extending in the diagonal direction can be reduced, and the occurrence of folding can be reduced.

[0128] The curved portion (BND) of the display panel 100 can be supported by the top surface of the first plate 210 and the bottom surface of the first adhesive layer 340, and can then be bent. The radius of curvature (R2) of the curved portion (BND) can be formed as half the length of the thickness of the first plate 210 and the first adhesive layer 340.

[0129] According to the embodiments of this disclosure, the radius of curvature (R2) of the bent portion (BND) is half the length of the thickness of the first plate 210 and the first adhesive layer 340, and according to Figure 2In the embodiment, the radius of curvature (R1) of the bent portion (BND) is half the length of the thickness of the first plate 210, the buffer plate 300, the second connecting member 400, and the second plate 220. Therefore, the radius of curvature (R2) of the embodiment according to this disclosure is smaller than that of the embodiment according to this disclosure. Figure 2 The radius of curvature (R1) of the implementation method. Therefore, based on the reduced radius of curvature of the bend (BND), the non-active region can also be reduced.

[0130] When a step is formed on the buffer plate 300 to reduce the non-active area of ​​the bend (BND), a portion of the pad portion (PAD) of the display panel 100 contacts or is fixed to the first adhesive layer 340, and another portion of the pad portion (PAD) may be disposed below the second plate 220. Adhesive or tape for fixing may be disposed between the second plate 220 and the other portion of the pad portion (PAD). The fixing of the pad portion (PAD) can be achieved in various ways and is not limited to a particular method.

[0131] The smaller the radius of curvature of the bend (BND), the greater the tensile and compressive forces applied to it. Therefore, it is necessary to adjust the radius of curvature of the bend (BND) by taking into account the size of the non-active area of ​​the bend and the forces applied to it. Regarding the adjustment of the radius of curvature, it can be increased by adjusting the steps formed on the buffer plate 300.

[0132] Since the buffer plate 300 can be formed by stacking multiple layers, the thickness of the step can be changed and the radius of curvature of the bend (BND) can be changed by retracting some of the multiple layers in the direction opposite to one side of the bend region or bend (BND).

[0133] For example, when the anti-warping layer 320 and heat dissipation layer 310 of the buffer plate 300 are retracted in a direction opposite to one side of the bend region or bend (BND), the radius of curvature of the bend (BND) is formed to be half the length of the thickness of the first plate 210, the first adhesive layer 340, and the buffer layer 330, thus the radius of curvature becomes greater than Figure 3 The radius of curvature of the implementation method can reduce the tensile and compressive forces applied to the bent portion (BND).

[0134] The second connecting member 400 and the second plate 220, which are located below the buffer plate 300, also retract in the opposite direction to the side of the bend region or bend (BND) together with the anti-warping layer 320 and the heat dissipation layer 310. Therefore, the angle of the portion extending in the diagonal direction of the pad portion (PAD) becomes smaller, and the occurrence of folding of the pad portion (PAD) can also be reduced.

[0135] In order to make the radius of curvature of the bend (BND) larger, the second connecting member 400 or the second plate 220 can retract in the opposite direction to the bend region or one side of the bend (BND) without forming a step on the buffer plate 300.

[0136] Figure 4a This is a cross-sectional view of an embodiment with reinforcing members provided according to the present disclosure.

[0137] Reference Figure 4a A higher tensile force is applied to the outer surface of the bend (BND), whose radius of curvature is smaller than before, and a higher compressive force is applied to the inner surface of the bend (BND), compared to the previous compressive force. When deformation occurs in the bend (BND) due to an external impact applied to it with high compressive and tensile forces, cracks or breaks may occur in the display substrate 100 and signal wiring of the bend (BND). Therefore, a first reinforcing member 600 may be provided on the top surface of the bend (BND), which is the outer surface of the bend (BND).

[0138] Furthermore, a second reinforcing member 700 may be disposed on the bottom surface inside the bend (BND). The second reinforcing member 700 covers the bend (BND) and may extend to at least some portions of the pad portion (PAD) and the front portion (FP).

[0139] The second reinforcing member 700 may include a resin. For example, the second reinforcing member 700 may include a UV-curable acrylic resin or a thermosetting resin, but is not limited thereto.

[0140] The second reinforcing member 700 can be formed from a resin-cured product obtained by applying a soft resin followed by a curing process. After curing, the resin hardens, and the bent shape of the bend (BND) can be maintained, and the resin can protect the bend from external impacts. Even when subjected to external impacts, the bent shape of the bend (BND) will not change, thus preventing damage to the display substrate 110 or signal wiring of the bend (BND).

[0141] When using UV-curable acrylic resin, the UV rays are partially blocked by the first plate 210 located in the upper region of the display panel 100 and the second plate 220 located in the lower region of the display panel 100, making it difficult for the resin to cure fully. Therefore, after irradiation with UV rays, additional wet curing can be performed to fully harden the resin. Wet curing can be performed by exposing the resin to an environment with 40% to 60% humidity and 20° to 26° temperature for 7 days.

[0142] In other words, when UV-curable acrylic resin is used as the second reinforcing member 700, UV curing and wet curing can be carried out in parallel to fully harden and form a firmly hardened second reinforcing member 700.

[0143] The first reinforcing portion 600 can be formed by applying and curing resin in the state of bending (BND) after the display panel 100 is bent. However, in the case of the second reinforcing member 700, since it is located inside the display panel 100, it may be difficult to apply and cure resin in the state of bending (BND) after the display panel 100 is bent.

[0144] To form the second reinforcing member 700, a method can be used in which resin is applied before bending the display panel 100 to form the bent portion (BND), and then the resin is cured after bending the display panel 100.

[0145] Before curing, the resin should remain soft to allow the display panel 100 to bend, and after curing, the resin should remain hardened to maintain the bent shape of the bend (BND) to prevent external impacts.

[0146] Resin in a soft state before curing is fluid, so if the resin is applied to the bend (BND) and the display panel 100 is bent, it may flow downwards. Therefore, the resin can be prevented from flowing downwards by additionally installing a dam at the end of this area to apply the resin. The first plate 210 or the second plate 220 provided on the front (FP) and pad (PAD) portions can be used as dams. That is, when the resin is applied to the display panel 100 between the first plate 210 and the second plate 220, the resin can be fixed by the first plate 210 and the second plate 220 and not flow, and then a second reinforcing member 700 with a certain thickness can be formed.

[0147] Figure 4b yes Figure 4a An enlarged cross-sectional view of region "A" shows another embodiment of the reinforcing member according to this disclosure.

[0148] Reference Figure 4b The second reinforcing member 700 has a structure that is thinned from top to bottom. One end of the second reinforcing member 700 is in contact with the first plate 210, and the other end is not in contact with any component.

[0149] The resin used to form the second reinforcing member 700 is fluid before it cures, so malfunctions may occur if the resin seeps into other components. Therefore, dams can be formed at one end and the other end of the resin to prevent the resin from seeping into other components before curing. Alternatively, resin flow can be prevented by the first plate 210—the first plate 210, as in the case of the first plate 210… Figure 4b The area shown is used as a dam, allowing for increased resin thickness. While the other end does not have a configuration to block resin flow, the resin can be formed thinner to reduce fluidity and prevent resin from penetrating into other components.

[0150] Depending on the purpose and effect, the second reinforcing member 700 may be formed to have a thickness that varies depending on the position from the first plate 210 to the first adhesive layer 340.

[0151] Figure 4c yes Figure 4a An enlarged cross-sectional view of region "A" shows another embodiment of the reinforcing member according to this disclosure.

[0152] Reference Figure 4c The second reinforcing member 700 can be formed to fill the space between the bend (BND), the first plate 210, and the first adhesive layer 340. If the second reinforcing member 700 is applied more to the bend (BND), the second reinforcing member 700 can strengthen the stiffness of the bend (BND). Therefore, the stiffness of the bend (BND) can be increased by fully filling the space between the bend (BND), the first plate 210, and the first adhesive layer 340 with resin and curing the filled resin.

[0153] To increase the amount of resin applied to form the second reinforcing member 700, the first adhesive layer 340 disposed beneath the first plate 210 may be formed to have a shorter length than the first plate 210, allowing the end surfaces of the first plate 210 to be exposed. Furthermore, the resin forming the second reinforcing member 700 may be applied to cover some areas of the sides and bottom of the ends of the first plate 210. That is, the second reinforcing member 700 may contact at least a portion of the sides and bottom of the first plate 210.

[0154] That is, the first plate 210 can be configured to protrude further toward the side of the bend (BND) or the bend region where the bend (BND) is located compared to the first adhesive layer 340, and the second reinforcing member 700 can be configured to contact at least some areas of the side surface and bottom surface of the first plate 210.

[0155] The method for forming the second reinforcing member 700 according to an embodiment of the present disclosure is to apply a high-viscosity resin to the bending portion (BND), temporarily cure the resin to make it remain non-flowing, bend the bending portion (BND), and then actually cure the resin to form the second reinforcing member 700. Various methods exist for forming the second reinforcing member 700, and these methods are not limited to any particular method.

[0156] If a second reinforcing member 700 is formed, the second reinforcing member 700 can support the recessed or concave pattern in the display substrate 110, which is formed to facilitate bending of the bend (BND). Therefore, the first plate 210 for supporting the pattern formed in the display substrate 110 is not required, and the length of the first plate 210 positioned toward the bend (BND) region can be reduced.

[0157] Figure 5 This is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0158] Figure 5 An embodiment is shown in which the radius of curvature is adjusted because the compressive and tensile forces applied to the bending portion (BND) increase when the radius of curvature of the bending portion (BND) is small.

[0159] The radius of curvature of the bent portion (BND) can be changed by adjusting the distance between the front portion (FP) and the pad portion (PAD), and the distance between the front portion (FP) and the pad portion (PAD) can be changed by changing the thickness of the first plate 210, the buffer plate 300, the second connecting member 400 to the second plate 220 located between the front portion (FP) and the pad portion (PAD).

[0160] Figure 5 The embodiment shows a case where the radius of curvature (R3) is formed to be larger by increasing the thickness of the first adhesive layer 340 of the buffer plate 300.

[0161] Figure 6 It shows the basis Figure 5 The figure shows the first adhesive layer 340 of the embodiment, and the first adhesive layer 340 may include a first base material 341, a first layer 342a and a second layer 342b, the first layer 342a and the second layer 342b being disposed on two opposite surfaces or opposite sides of the first base material 341, respectively.

[0162] The first layer 342a of the first adhesive layer 340 may have an embossed layer 342e, wherein a plurality of embossings are formed as an uneven structure. For example, the embossed layer 342e may be an embossed pattern or an embossed pattern layer, and is not limited by the terminology.

[0163] At least one or more of the first layer 342a, the second layer 342b, and the embossed layer 342e may be formed of a material having an adhesive substance. For example, the first layer 342a, the second layer 342b, and the embossed layer 342e may all be formed of a material having an adhesive substance.

[0164] The first layer 342a of the first adhesive layer 340 may be the surface in contact with the first plate 210, and if the first layer 342a has an embossed layer 342e, the process of removing air bubbles can be omitted, as air bubbles can be prevented from appearing between the first plate 210 and the buffer plate 300.

[0165] The first substrate material 341 can be used to maintain the shape of the first adhesive layer 340, and can be formed of a material having sufficient stiffness and hardness to maintain the shape of the first substrate material 341. For example, the first substrate material 341 can be formed of a material such as polyethylene terephthalate (PET), but is not limited thereto.

[0166] The first layer 342a and the second layer 342b are materials with an adhesive substance and can be compressed downwards by external force. Therefore, if the thickness of the first layer 342a and the second layer 342b is increased, the compression may be intensified and the first adhesive layer 340 may deform.

[0167] Therefore, the thickness of the first base material 341 can be increased to increase the thickness of the first adhesive layer 340. By doing so, the thickness of the first adhesive layer 340 can be increased without extrusion.

[0168] The second layer 342b can contact the buffer layer 330. For example, the second layer 342b can adhere the buffer layer 330 to the first adhesive layer 340 and fix them in place.

[0169] Since the first base material 341 of the first adhesive layer 340 can be used to maintain the shape of the buffer layer 330 and the shape of the first adhesive layer 340, the properties of maintaining the shape of the buffer layer can be improved.

[0170] To change the radius of curvature of the bend (BND), a component can be added between the front (FP) and the pad (PAD).

[0171] Figure 7 This is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0172] Reference Figure 7 By adding a second base material 342 and a second adhesive layer 344 between the front part (FP) and the pad part (PAD), the distance between the front part (FP) and the pad part (PAD) is increased and a large radius of curvature (R3) is formed.

[0173] The second substrate material 342 and the second adhesive layer 344 can be formed in a structure similar to the first adhesive layer 340. The second substrate material 342 can be bonded or attached to the lower part of the first adhesive layer 340. The second adhesive layer 344 is formed of a material having an adhesive substance, the second adhesive layer 344 is disposed below the second substrate material 342, and the second adhesive layer 344 can bond or attach the second substrate material 342 to the buffer layer 330.

[0174] The second substrate material 342 can be used to maintain the shape of the first adhesive layer 340 and the second adhesive layer 344, and can be formed of a material with a certain rigidity and hardness so that the shape of the second substrate material 342 can be maintained. For example, the second substrate material 342 can be formed of polyethylene terephthalate (PET) or the like, but is not limited thereto.

[0175] In the case of a structure with the addition of a second base material 342 and a second adhesive layer 344, the stiffness can be increased compared to a structure in which only the thickness of the first adhesive layer 340 is increased due to the stacking of multiple layers.

[0176] Figure 8 This is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0177] Reference Figure 8 The buffer plate 300 may include a first adhesive layer 340 and a porous substrate 350, and may include a first plate 210, a first adhesive layer 340, a porous substrate 350 and a second plate 220 between the front portion (FP) and the pad portion (PAD) of the display panel 100.

[0178] A first adhesive layer 340 of a certain thickness can be stacked on the top surface of the porous substrate 350 and can be configured to protrude further toward the side of the bend region or bend (BND) compared to the second plate 220.

[0179] The first adhesive layer 340 includes an adhesive substance and can fix the porous substrate 350 to the first plate 210.

[0180] The porous substrate 350 can be a porous metal structure including a conductive metal and multiple pores arranged inside the conductive metal.

[0181] Since the conductive metal of the porous substrate 350 is formed of a metal with excellent thermal conductivity, excellent heat dissipation characteristics can be provided through the porous substrate 350. Because the porous substrate 350 has a shape with a metal structure containing multiple holes, it can also provide good cushioning characteristics.

[0182] Furthermore, since the porous substrate 350 is a conductive metal containing multiple holes inside, the total surface area can be increased, and excellent heat dissipation characteristics can be provided solely through the porous substrate.

[0183] Therefore, the buffer plate 300 according to the embodiments of the present disclosure can have efficient heat dissipation and buffering characteristics solely through the porous substrate 350, without the need to form a heat dissipation layer for heat dissipation and a buffering layer for buffering.

[0184] The porous substrate 350 can be manufactured by sintering a metal foam precursor including metal powder, and the porous substrate 350 can be manufactured into a desired shape by changing the shape of the frame used for production.

[0185] The porous substrate 350 according to embodiments of the present disclosure may include: a second region 352 as the lower part of the porous substrate 350; and a first region 354 that protrudes further toward the side of the bend region or bend (BND) compared to the second region 352, and the porous substrate 350 may be formed to have a stepped portion.

[0186] In other words, the buffer plate 300 according to the embodiments of the present disclosure is the same in overall shape as the buffer plate according to another embodiment, but the difference is that a heat dissipation layer or a buffer layer is incorporated into the buffer plate 300.

[0187] The pad portion (PAD) of the display panel 100 can be disposed below the porous substrate 350 along the step, and a portion of the pad portion (PAD) can be fixed to a portion of the first region 354 of the porous substrate 350, and another portion of the pad portion (PAD) can be fixed to the lower part of the second board 220.

[0188] To secure the pads (PADs), adhesives or tapes can be used. Various methods can be used to secure the pads (PADs) to the buffer plate 300 or the second plate 220, and these methods are not limited to those described above.

[0189] Because of the steps formed in the porous substrate 350, the radius of curvature (R3) of the bend (BND) can be adjusted, and the non-active area of ​​the bend (BND) can be reduced.

[0190] Similar to other embodiments, the first reinforcing member 600 and the second reinforcing member 700 can be formed in the bend (BND), thereby increasing the stiffness of the bend (BND).

[0191] The display device according to this disclosure can be explained as follows.

[0192] The display device according to this disclosure may include: a display panel including a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion; and a first plate, a buffer plate, and a second plate configured to be disposed between the front portion and the pad portion, wherein the buffer plate includes a first adhesive layer, a buffer layer, and a heat dissipation layer, and wherein a portion of the pad portion is configured to contact the first adhesive layer, and another portion of the pad portion is configured to be disposed below the second plate.

[0193] The display device according to this disclosure may include: a display panel including a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion; and a first plate, a buffer plate, and a second plate configured to be disposed between the front portion and the pad portion, wherein the buffer plate includes a first adhesive layer, a buffer layer, and a heat dissipation layer, wherein the first adhesive layer protrudes further toward the curved portion region where the curved portion is located compared to the buffer layer, the heat dissipation layer, and the second plate, and wherein the distance between the pad portion and the front portion is configured to become shorter toward the curved portion region.

[0194] The display device according to this disclosure may further include: a first reinforcing member configured to be disposed on the outer surface of the curved portion; and a second reinforcing member configured to be disposed on the inner surface of the curved portion, wherein the second reinforcing member has a uniform thickness.

[0195] The display device according to some embodiments of the present disclosure may further include: a first reinforcing member configured to be disposed on the outer surface of the bend; and a second reinforcing member configured to be disposed on the inner surface of the bend, wherein the thickness of the second reinforcing member is configured to vary according to its position from the first plate to the first adhesive layer.

[0196] The display device according to some embodiments of the present disclosure may further include: a first reinforcing member configured to be disposed on the outer surface of the bend; and a second reinforcing member configured to be disposed on the inner surface of the bend, wherein the length of the first adhesive layer is shorter than the length of the first plate, and wherein the second reinforcing member is configured to contact at least a portion of the side surface and bottom surface of the first plate.

[0197] According to some embodiments of this disclosure, the first adhesive layer may include: a first base material; a second layer configured to be disposed below the first base material; and a first layer configured to be disposed on the first base material, wherein the top surface of the first layer has an embossed pattern.

[0198] According to some embodiments of this disclosure, the display device may further include a third plate and a second adhesive layer, which are configured to be disposed between the first adhesive layer and the buffer layer.

[0199] A display device according to some embodiments of the present disclosure may include: a display panel including a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion; and a first adhesive layer and a porous substrate configured to be disposed between the front portion and the pad portion, wherein the porous substrate includes a second region and a first region, the second region being configured to be disposed above the pad portion, and the first region being configured to protrude further toward the curved portion compared to the second region.

[0200] According to some embodiments of this disclosure, a portion of the pad portion is configured to connect to a portion of a first region of the porous substrate, and wherein another portion of the pad portion is configured to connect to a second region below the porous substrate.

[0201] A display device according to some embodiments of the present disclosure may include: a display panel including a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion; and a first plate, a buffer plate, and a second plate configured to be disposed between the front portion and the pad portion, wherein the buffer plate includes a first adhesive layer and a porous substrate, wherein the porous substrate includes a first region and a second region, and wherein the second region is configured to be disposed on the upper portion of the second plate, and the first adhesive layer and the first region are configured to protrude further toward the curved portion compared to the second plate and the second region.

[0202] The above description is a detailed description of embodiments of the present disclosure with reference to the accompanying drawings. However, it should be understood that the present disclosure is not limited to the embodiments described herein and can be implemented in many different forms without departing from its technical concept. Therefore, the embodiments described above are examples illustrating the technical concept and not limiting the scope of the technical concept of the present disclosure. Thus, it should be understood that the embodiments described above are exemplary and not restrictive. The scope of protection of the present disclosure should be understood based on the appended claims, and all technical concepts within the equivalent scope of the claims should be understood to fall within the scope of the present disclosure.

[0203] Figure Labels

[0204] 10: Display device; 20: Cover component

[0205] 21: Light-shielding unit; 100: Display panel

[0206] 110: Display substrate; 120: Pixel array unit

[0207] 130: Encapsulation layer; 140: Optical plate

[0208] 150: First connecting member; 160: Driver

[0209] 210: First board 220: Second board

[0210] 300: Buffer plate; 310: Heat dissipation layer

[0211] 320: Anti-warping layer; 330: Buffer layer

[0212] 340: First adhesive layer; 350: Porous substrate

[0213] 352: Second Zone 354: First Zone

[0214] 400: Second connecting member; 500: Flexible printed circuit board

[0215] 600: First reinforcing member; 700: Second reinforcing member

[0216] AA: Active region; NA: Non-active region

[0217] FP: Front section; BND: Curved section

[0218] PAD: Pad area

Claims

1. A display device, comprising: The display panel includes a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion. as well as A first plate, a buffer plate, and a second plate are configured to be disposed between the front portion and the pad portion. The buffer plate includes a first adhesive layer, a buffer layer, and a heat dissipation layer. A portion of the solder pad is configured to contact the first adhesive layer, and another portion of the solder pad is configured to be disposed below the second board. A step difference is formed between a portion of the pad portion configured to contact the first adhesive layer and another portion of the pad portion configured to be disposed below the second board.

2. The display device according to claim 1, further comprising: A first reinforcing member is configured to be disposed on the outer surface of the curved portion; as well as A second reinforcing member is configured to be disposed on the inner surface of the bend. The second reinforcing member has a uniform thickness.

3. The display device according to claim 1, further comprising: A first reinforcing member is configured to be disposed on the outer surface of the curved portion; as well as A second reinforcing member is configured to be disposed on the inner surface of the bend. The thickness of the second reinforcing member is configured to vary depending on its position from the first plate to the first adhesive layer.

4. The display device according to claim 1, further comprising: A first reinforcing member is configured to be disposed on the outer surface of the curved portion; as well as A second reinforcing member is configured to be disposed on the inner surface of the bend. Wherein, the length of the first adhesive layer is shorter than the length of the first board, and The second reinforcing member is configured to contact at least a portion of the side surface and bottom surface of the first plate.

5. The display device according to claim 1, wherein, The first adhesive layer includes: First substrate material; The second layer is configured to be disposed beneath the first substrate material; and A first layer is configured to be disposed on the first substrate material, wherein the top surface of the first layer has an embossed pattern.

6. The display device according to claim 1, further comprising: A third plate and a second adhesive layer are configured to be disposed between the first adhesive layer and the buffer layer.

7. A display device, comprising: The display panel includes a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion. as well as A first plate, a buffer plate, and a second plate are configured to be disposed between the front portion and the pad portion. The buffer plate includes a first adhesive layer, a buffer layer, and a heat dissipation layer. The first adhesive layer protrudes further toward the bent portion compared to the buffer layer, the heat dissipation layer, and the second plate. The distance between the pad portion and the front portion is configured to be shorter on the side facing the bend.

8. The display device according to claim 7, further comprising: A first reinforcing member is configured to be disposed on the outer surface of the curved portion; as well as A second reinforcing member is configured to be disposed on the inner surface of the bend. The second reinforcing member has a uniform thickness.

9. The display device according to claim 7, further comprising: A first reinforcing member is configured to be disposed on the outer surface of the curved portion; as well as A second reinforcing member is configured to be disposed on the inner surface of the bend. The thickness of the second reinforcing member is configured to vary depending on its position from the first plate to the first adhesive layer.

10. The display device according to claim 7, further comprising: A first reinforcing member is configured to be disposed on the outer surface of the curved portion; as well as A second reinforcing member is configured to be disposed on the inner surface of the bend. Wherein, the length of the first adhesive layer is shorter than the length of the first board, and The second reinforcing member is configured to contact at least a portion of the side surface and bottom surface of the first plate.

11. The display device according to claim 7, wherein, The first adhesive layer includes: First substrate material; The second layer is configured to be disposed beneath the first substrate material; and A first layer is configured to be disposed on the first substrate material, wherein the top surface of the first layer has an embossed pattern.

12. The display device according to claim 7, further comprising: A third plate and a second adhesive layer are configured to be disposed between the first adhesive layer and the buffer layer.

13. A display device, comprising: The display panel includes a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion. as well as A first adhesive layer and a porous substrate are configured to be disposed between the front portion and the pad portion. The porous substrate includes a second region and a first region. The second region is configured to be located on the upper part of the pad portion, and the first region is configured to protrude further toward the side of the curved portion compared to the second region.

14. The display device according to claim 13, wherein, A portion of the pad is configured to connect to a portion of the first region of the porous substrate, and Another portion of the pad portion is configured to be connected below the second region of the porous substrate.

15. A display device, comprising: The display panel includes a front portion configured to display an image, a curved portion configured to extend and bend from the front portion, and a pad portion configured to extend from the curved portion and disposed below the front portion. as well as A first plate, a buffer plate, and a second plate are configured to be disposed between the front portion and the pad portion. The buffer plate includes a first adhesive layer and a porous substrate. The porous substrate includes a first region and a second region, and The second region is configured to be located on the upper part of the second plate, and the first adhesive layer and the first region are configured to protrude further toward the side of the bend compared to the second plate and the second region.

16. The display device according to claim 15, wherein, A portion of the pad is configured to connect to a portion of the first region of the porous substrate, and Another portion of the pad portion is configured to be connected below the second region of the porous substrate.

Images