Circuit board and electronic package using the same

Abstract

The present invention provides a circuit board and an electronic package using the same. The circuit board includes a rigid board body, at least one flexible extension, a plurality of connectors, and a plurality of shields. The rigid board body includes a plurality of conductive layers and a plurality of dielectric layers between the conductive layers. Each extension is connected to a side edge of the rigid board body, is formed by extending a plurality of layers from the conductive layers and at least one layer from the dielectric layers out of the rigid board body, and has a connection end at a distal end thereof. Each connector is disposed on a surface of the connection end and electrically connected to a signal layer from the conductive layers. Each shield is disposed on the surface of the connection end and electrically connected to a ground layer from the conductive layers, wherein each shield surrounds a corresponding connector, the connector and the shield protrude from the surface of the connection end, and a height of the shield is lower than a height of the connector.

Description

Technical Field

[0001] This invention relates to an electronic assembly. Background Technology

[0002] In recent years, high-speed signal transmission technology has developed rapidly. Wired high-speed transmission I / O interfaces, such as SD8.0 for data and audio / video storage, Ethernet CAT8 for network communication, USB4 and Thunderbolt4 compatible for charging / data / audio / video transmission, and HDMI 2.0 and DisplayPort 2.1 for audio / video transmission, all utilize faster rise time or lower voltage level technologies to achieve high-speed transmission. However, due to limitations in the existing specifications and characteristics of electronic components, such as main control chips, connectors, cables, and circuit boards, the transmission speed and performance of these interfaces are restricted.

[0003] In particular, as the processing speed of the main control chip continues to increase, components such as connectors and cables, limited by inherent structural defects and the requirements of conventional products, suffer from problems such as high reflection loss and impedance mismatch between components. This necessitates downgrading the overall electronic assembly, making it difficult to achieve true high-speed specifications. Therefore, to achieve the goal of high-speed transmission, it is necessary to optimize the electronic components used in the signal transmission path through material and structural improvements, as well as impedance matching. Summary of the Invention

[0004] This invention provides a circuit board that can reduce reflection loss and characteristic impedance mismatch in known electronic components, thereby achieving high-speed transmission with low reflection loss.

[0005] The circuit board of the present invention includes a rigid board body, at least one flexible extension, a plurality of connectors, and a plurality of shielding members. The rigid board body includes a plurality of conductive layers and a plurality of dielectric layers located between the conductive layers. Each extension connects to a side of the rigid board body and is formed by extending multiple layers of the conductive layers and at least one layer of the dielectric layers beyond the rigid board body, with each extension having a connection end at its end. The plurality of connectors are disposed on the surface of the connection end and are electrically connected to signal layers in the multiple conductive layers. The plurality of shielding members are disposed on the surface of the connection end and are electrically connected to ground layers in the multiple conductive layers, wherein each shielding member is disposed around a corresponding connector, the plurality of connectors and the plurality of shielding members protrude from the surface of the connection end, and the height of the plurality of shielding members is lower than the height of the plurality of connectors.

[0006] The present invention further proposes an electronic device for achieving high-speed transmission with low reflection loss using the aforementioned circuit board, wherein the rigid body of the circuit board is, for example, a motherboard, and the electronic device further includes a first electronic component bonded to the rigid body, and a second electronic component bonded to the connection terminal and electrically connected to the plurality of connectors.

[0007] The present invention further proposes a circuit board including a rigid board body, at least one flexible extension, and a plurality of connectors. The rigid board body includes a plurality of conductive layers and a plurality of dielectric layers located between the conductive layers. Each extension connects to a side of the rigid board body and is formed by extending multiple layers of the conductive layers and at least one layer of the dielectric layers beyond the rigid board body, with each extension having a connection end at its end. The plurality of connectors are disposed on the surface of the connection end and electrically connect to a signal layer among the multiple conductive layers. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of a circuit board according to one embodiment of this application;

[0009] Figure 2 This is a schematic diagram of the connection terminals of a circuit board according to an embodiment of this application;

[0010] Figure 3 This is a schematic diagram of the connection terminals of a circuit board according to another embodiment of this application;

[0011] Figure 4 This is a schematic diagram of a possible circuit configuration of a rigid board body according to an embodiment of this application;

[0012] Figure 5 and Figure 6 for Figure 4 The circuit configuration of the rigid board body is shown in the schematic diagram of the possible circuit configurations of the connection terminals.

[0013] Figure 7 and Figure 8 These are partial cross-sectional views of the connection ends in different embodiments of this application;

[0014] Figures 9-11 These are schematic diagrams showing the planar configuration of the connectors and shielding members according to different embodiments of this application;

[0015] Figure 12 and Figure 13 These are partial cross-sectional views of the connection ends in different embodiments of this application;

[0016] Figure 14 and Figure 15 These are partial cross-sectional views of the connection ends in different embodiments of this application;

[0017] Figure 16 This is a schematic diagram of an electronic device according to an embodiment of this application;

[0018] Figure 17 This is a schematic diagram of an electronic device according to another embodiment of this application. Detailed Implementation

[0019] The technical solutions of this application are illustrated below through multiple embodiments. Identical or similar parts in each embodiment will not be described repeatedly. Those skilled in the art can refer to the descriptions of the various embodiments to understand the spirit of this application and implement it accordingly. Wherever possible, the same element symbols are used in the drawings and description to represent the same or similar parts.

[0020] Figure 1 The illustration depicts a circuit board 100 according to an embodiment of this application, including a rigid board body 110, which is, for example, a multilayer circuit board formed by overlapping multiple conductive layers 112 and multiple dielectric layers 114, wherein some of the conductive layers 112 and some of the dielectric layers 114 extend beyond the rigid board body 110, and an extended portion 120 is formed on the side of the rigid board body 110. A connection end 130 is formed at the end of the extension 120, and multiple connectors 142, such as multiple solder balls, are provided on the surface of the connection end 130 for external connection to other electronic components. Specifically, this embodiment illustrates one or more (two as shown in the illustration) extensions 120 formed on the same side of the rigid board body 110, with the surfaces of the connection ends 130 of the two extensions 120 facing each other, and their outer surfaces covered, for example, by a possible housing (not shown), forming a connector for external electronic components to be plugged in. The space between the two connecting ends 130 forms a socket 132, so that when an external electronic component is inserted, it forms an electrical path with the connector 142 in the socket 132.

[0021] In this embodiment, the extension 120 can be located at any suitable position on the side of the rigid plate body 110, and the number is not limited. For example, Figure 1 The two extensions 120 shown are located on the same plane on the side of the rigid board body 110. The plane referred to here is a position parallel to the surface of the rigid board body 110. In other words, the two extensions 120 extend outward from the same position on the side of the rigid board body 110 and are formed by different layers of the plurality of conductive layers 112 and dielectric layers 114, respectively. Because the extensions 120 consist of only a portion of the conductive layers 112 and dielectric layers 114, they are thinner, and suitable materials can be selected to fabricate the dielectric layers 114, giving the extensions 120 an overall bendable characteristic, providing a bridging function similar to cables in known electronic devices.

[0022] Furthermore, the composition of the extension 120 and the connection terminal 130 can vary depending on the number of circuit layers in the rigid board body 110. For example, if the rigid board body 110 is an 8-layer board, then... Figure 1 Each extension 120 and its connecting end 130 shown includes at most four conductive layers; if the rigid board body 110 is a 16-layer board, then Figure 1 Each extension 120 and its connecting end 130 shown includes up to eight conductive layers. The number of conductive layers in each extension 120 and its connecting end 130 may be the same or different, depending on the requirements.

[0023] Figure 2 and Figure 3 These are schematic diagrams of the connection ends according to different embodiments of this application. Figure 2 The connection end 200 shown has, for example, four or fewer conductive layers (three layers are shown in the illustration). Considering the relatively thin thickness, a support substrate 210 (e.g., a two-layer substrate) can be added to the back side of the connection end 200 to improve its rigidity. Furthermore, Figure 3 The connector 300 shown has, for example, more than four conductive layers (eight layers in the illustration), and may have conductive channels 320 inside, such as vias, plating through holes (PTH), or coaxial vias 320 as shown in the illustration, so that the connector 310 can be connected to the lower signal layer through the conductive channels 320. The specific circuit structure of the connector will be described in the embodiments below.

[0024] On the other hand, the actual circuit configuration of the connection terminal of the circuit board in this application is related to the circuit configuration of the rigid board body. Figure 4 The diagram illustrates a possible circuit configuration of a rigid board body according to one embodiment of this application. Figure 5 and Figure 6 according to Figure 4 The circuit configuration of the rigid board body is shown, illustrating the possible circuit configurations at the connection points. For example... Figure 4 As shown, the rigid board body 400 is, for example, a 14-layer board, and its L1 to L14 layers are configured as shown in the figure above, including 6 signal layers Signal_1 to Signal_6, 4 ground layers GND, and 4 power supply layers Vcc1 to Vcc4. Correspondingly, the connection terminals can be combinations of the aforementioned multiple conductive layers.

[0025] For example, Figure 5The connection terminal 500 shown is a microstrip line structure, where the signal layer 510 is located on the upper layer and electrically connected to one of the six signal layers Signal_1 to Signal_6 (such as the signal layer Signal_1 of L1), and the ground layer 520 is located on the lower layer and electrically connected to one of the four ground layers GND (such as the ground layer GND of L2). In other words, the conductive layer of the connection terminal 500 is Signal_1 / GND of L1 to L2. Alternatively, in other embodiments not shown, if it is a three-layer line structure, Signal_1 / GND / Signal_2 of L1 to L3, or Signal_2 / GND / Signal_3 of L3 to L5, or other possible combinations can be selected as the conductive layer of the connection terminal 500.

[0026] For example, Figure 6 The connection terminal 600 shown is a stripline structure, where the signal layer 610 is located between two ground layers 620 and 630 and is electrically connected to one of the six signal layers Signal_1 to Signal_6 (such as Signal_2 of L3). The ground layers 620 and 630 are electrically connected to one of the four ground layers GND (such as GND of L2 and GND of L4). In other words, the conductive layer of the connection terminal 600 is GND / Signal_2 / GND of L2 to L4. Alternatively, in other embodiments not shown, GND / Signal_3 / Vcc1 of L4 to L6, or other possible combinations, can be selected as the conductive layer of the connection terminal 600.

[0027] Furthermore, to reduce signal interference, this application may also provide a shielding element on the surface of the connection end, so that it and the aforementioned connection element used for signal transmission are both located within the socket of the formed connector, and the shielding element surrounds the connection element to shield against possible signal interference. The following embodiments also use... Figure 4 Taking the rigid board body 400 as an example, we will explain the possible circuit structure of the connection terminal corresponding to this rigid board body 400.

[0028] Figure 7 The illustration shows a partial cross-sectional view of a connection terminal 700 according to an embodiment of the present application, wherein the connection terminal 700 has a three-layer circuit structure, for example corresponding to... Figure 4The rigid board body 400 has conductive layers L1 to L3, namely Signal_1 / GND / Signal_2, and the connection terminal 700 has a solder mask layer 702 covering the conductive layer L1 with a first pad 712 and a second pad 722. The connector 710 is, for example, a plurality of solder balls formed on the first pad 712, and the shield 720 is, for example, a plurality of solder blocks formed on the second pad 722. Both the connector 710 and the shield 720 protrude from the surface of the solder mask layer 702, and the height of the shield 720 is lower than the height of the connector 710. Since the conductive layer L1 serves as the signal layer Signal_1, the connector 710 can be connected to a signal source via the first pad 712 for signal transmission. Furthermore, the second pad 722 is independent of the signal layer Signal_1, allowing the shield 720 to be electrically connected to the underlying ground layer L2 via the second pad 722 and a via 724.

[0029] Figure 8 A partial cross-sectional view of a connection end according to another embodiment of this application is shown. The connection end 800 of this embodiment is... Figure 7 The connector 700 shown is similar, also having a 3-layer circuit structure, for example, corresponding to Figure 4 The rigid board body 400 has conductive layers L1 to L3, namely Signal_1 / GND / Signal_2. The main difference between the two is that in this embodiment, the connector 810 is connected to the underlying conductive layer L3, namely Signal_2, through the first pad 812 and the through hole 814 for signal transmission.

[0030] In the planar direction, the shielding component of this application surrounds the connector to achieve the effect of shielding signal interference. Specifically, Figures 9-11 Several possible planar configurations of connectors and shielding components are listed, among which... Figure 9 The shielding element 920 shown is a closed annular wall surrounding the connector 910. Figure 10 The shielding element 1020 shown is an open arc-shaped wall surrounding the connector 1010. Figure 11 The shielding element 1120 shown is, for example, a plurality of columns arranged around the connector 1110.

[0031] Figure 12 and Figure 13 Partial cross-sectional views of the connection ends according to other embodiments of this application are shown respectively. Figure 12 Connection terminal 1200 and Figure 13 The connection end 1300 is respectively with Figure 7 Connection terminal 700 and Figure 11 The connector 1100 has a similar circuit structure; the main difference is that... Figure 12 Connection terminal 1200 and Figure 13The connecting end 1300 uses spring plates as connectors 1210 and 1310.

[0032] Figure 14 A partial cross-sectional view of a connection terminal according to another embodiment of this application is shown. The connection terminal 1400 has an 8-layer circuit structure, including conductive layers L1 to L8, namely Signal_1 / GND / Signal_2…Signal_3 / GND / Signal_4. A connector 1410 is located on a first pad 1412 and is connected to the lowest conductive layer L8, i.e., Signal_4, through a plating through hole (PTH) 1414, independent of conductive layers L2 to L7, for signal transmission. A shield 1420 located on a second pad 1422 is electrically connected to the lower ground layer L2 through a via 1424. In this embodiment, the plating through hole (PTH) 1414 can also be a coaxial via or other possible types of conductive channel to achieve anti-interference or other effects.

[0033] Figure 15 A partial cross-sectional view of the connection end according to another embodiment of this application is shown. Figure 15 Connection terminal 1500 and Figure 14 The 1400 connector has a similar circuit structure; the main difference is... Figure 15 The connecting end 1500 uses a spring sheet as the connecting part 1510.

[0034] Based on the above embodiments, this application extends the conductive and dielectric layers within the rigid board body from the side outwards to form an extension, which can replace the cables in known electronic devices. The extension has the same material properties as the rigid board body, avoiding the problem of characteristic impedance mismatch. Furthermore, the end of the extension serves as a connection terminal for external connection, replacing the connectors in known electronic devices and avoiding reflection losses caused by connectors. The connection terminal is provided with solder balls or spring contacts equivalent to connector pins, and a shield is provided around the connection to reduce reflected signal interference.

[0035] Of course, the foregoing embodiments are merely illustrative examples. Those skilled in the art should understand that, depending on the circuit configuration of the rigid board body or actual wiring requirements, the circuit structure of the extension and connection ends of the circuit board of this application can have various possible changes, and these changes can be implemented according to the technical level at the time of application.

[0036] Figure 16Further illustration shows an electronic device according to one embodiment of this application, which can utilize the circuit board of this application to achieve high-speed transmission with low reflection loss. For example... Figure 16 As shown, the electronic device 1600 of this embodiment is used, for example, in a high-speed network communication architecture. The rigid board body 1610 of the circuit board serves as a host board, carrying a first electronic component (such as a network signal transmitter or IC chip) 1612. A bendable extension 1620 extends outward from the side of the rigid board body 1610, with its end forming a connection terminal 1630 having a socket 1632. Furthermore, an external component 1640 having a second electronic component (such as a network signal receiver or IC chip) 1642 can be inserted into the socket 1632 of the connection terminal 1630, electrically connected to a connector 1634 within the socket 1632, and electrically connected to the rigid board body 1610 (serving as the host board) via the connection terminal 1630 and the extension 1620, thereby achieving high-speed transmission of network signals.

[0037] Figure 17 An electronic device according to another embodiment of this application is illustrated. The electronic device 1700 of this embodiment is... Figure 16 The electronic devices 1600 shown are all used for high-speed network communication architectures. The difference lies in that the rigid board body 1710 of the circuit board in this embodiment is a bus board, which can be attached to an external motherboard 1750. The motherboard 1750 has a first electronic component (such as a network signal transmitter or IC chip) 1752. A flexible extension 1720 extends outward from the side of the rigid board body 1710, and its end forms a connection terminal 1730 with a socket 1732. In addition, an external component 1740 with a second electronic component (such as a network signal receiver or IC chip) 1742 can be inserted into the socket 1732 of the connection terminal 1730, electrically connected to the connector 1734 in the socket 1732, and electrically connected to the motherboard 1750 through the connection terminal 1730, the extension 1720 and the rigid board body 1710, realizing high-speed transmission of network signals. Compared to Figure 16 In the embodiment shown, the rigid board body 1710 serves as an adapter board, and the extension 1720 and connection end 1730 formed therein are not limited by the specifications of the motherboard 1750, providing more flexible options for the components and configuration of the electronic device 1700.

[0038] In summary, the circuit board proposed in this application can use the rigid board body as an adapter board in electronic assembly or even directly as a main board. The extension can replace the cables in known electronic assemblies, providing good characteristic impedance matching. The connection end at the end of the extension can replace the connector in known electronic assemblies, avoiding reflection loss. Furthermore, this application can further provide shielding around the connector to reduce signal interference. Thus, the electronic assembly for high-speed transmission has undergone structural improvements and characteristic impedance matching optimizations to achieve the goal of high-speed transmission.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit board, characterized in that, include: The rigid board body includes multiple conductive layers and multiple dielectric layers located between the multiple conductive layers; At least one flexible extension, the extension being connected to the side of the rigid board body, is formed by multiple layers of the plurality of conductive layers and at least one layer of the plurality of dielectric layers extending beyond the rigid board body, and the end of the extension is a connection end; Multiple connectors are disposed on the surface of the connection end and electrically connected to the signal layer in the multiple conductive layers; as well as Multiple shielding elements are disposed on the surface of the connection end and electrically connected to a ground layer in the multiple conductive layers, wherein each shielding element is arranged around a corresponding connector, the multiple connectors and the multiple shielding elements protrude from the surface of the connection end, and the height of the multiple shielding elements is lower than the height of the multiple connectors. The at least one extension includes two extensions on the same side of the rigid plate body, the connecting end surfaces of the two extensions are arranged facing each other to form a connector socket, and the plurality of connectors and the plurality of shields are located within the socket.

2. The circuit board according to claim 1, characterized in that, The two extensions are located on the same plane on the side of the rigid plate body, and are formed by different layers of the plurality of conductive layers and the plurality of dielectric layers, respectively.

3. The circuit board according to claim 2, characterized in that, The two extensions have the same number of conductive layers.

4. The circuit board according to claim 1, characterized in that, The connection end includes a solder mask layer that covers the outermost layer of the plurality of conductive layers and exposes a plurality of first pads and a plurality of second pads of the outermost conductive layer. The plurality of connectors and the plurality of shielding members are respectively located on the plurality of first pads and the plurality of second pads and protrude from the surface of the solder mask layer.

5. The circuit board according to claim 4, characterized in that, The outermost conductive layer is the signal layer, used to transmit signals to the plurality of connectors, and the plurality of shields are electrically connected to the ground layer below through a plurality of through holes.

6. The circuit board according to claim 4, characterized in that, The outermost conductive layer is the ground layer, and the plurality of connectors are electrically connected to the signal layer below through a plurality of vias.

7. The circuit board according to claim 4, characterized in that, The plurality of connectors and the plurality of shields are electrically connected to the lower signal layer and the ground layer through a plurality of through holes.

8. The circuit board according to claim 1, characterized in that, The plurality of connectors includes a plurality of solder balls or a plurality of spring plates.

9. The circuit board according to claim 1, characterized in that, The plurality of shielding components include a plurality of solder blocks.

10. The circuit board according to claim 1, characterized in that, Each shielding element includes a closed annular wall surrounding the corresponding connector.

11. The circuit board according to claim 1, characterized in that, Each shielding element includes an open arc-shaped wall surrounding the corresponding connector.

12. The circuit board according to claim 1, characterized in that, Each shielding element includes a plurality of pillars arranged around the corresponding connector.

13. The circuit board according to claim 1, characterized in that, The rigid board body is the motherboard.

14. The circuit board according to claim 1, characterized in that, The rigid plate body is an adapter plate.

15. An electronic device, characterized in that, include: The circuit board as described in any one of claims 1 to 14, wherein the rigid board body is a motherboard; The first electronic component is electrically connected to the rigid board body; as well as The second electronic component is electrically connected to the plurality of connectors at the connection end.

16. The electronic device according to claim 15, characterized in that, The first electronic component and the second electronic component are each other’s network signal transmitter and network signal receiver.

17. An electronic device, characterized in that, include: The circuit board as described in any one of claims 1 to 14, wherein the rigid board body is an adapter board; Motherboard, the rigid board body is electrically connected to the motherboard; The first electronic component is electrically connected to the mainboard; as well as The second electronic component is electrically connected to the plurality of connectors at the connection end.

18. The electronic device according to claim 17, characterized in that, The first electronic component and the second electronic component are each other’s network signal transmitter and network signal receiver.

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