Display panel and display device

Abstract

A display panel and a display device. The display panel has a display area (AA) and a bonding area (BOD). The display panel includes a color filter substrate (3) and an array substrate (1). The color filter substrate (3) includes a near-field communication antenna (32). The near-field communication antenna (32) includes a coil structure (35). The coil structure (35) is at least partially located in the display area (AA). The array substrate (1) includes a first substrate (101), a channel region (1061), and a non-channel region. The orthographic projection of the coil structure (35) on the first substrate (101) is located within the orthographic projection of the non-channel region on the first substrate (101). The electromagnetic interference generated by the near-field communication antenna (32) on the thin-film transistor during operation is reduced, and the display effect of the display panel is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and more particularly, to a display panel and a display device including the display panel. Background Art

[0002] Near Field Communication (NFC) is a contactless identification and interconnection technology that uses near-field magnetic fields for communication. It has advantages such as low cost, high bandwidth, fast response speed, and good security. It can perform short-range wireless communication between mobile devices and consumer electronics products and has been widely used in fields such as mobile payment, electronic tickets, access control, and anti-counterfeiting.

[0003] However, for current mobile devices and consumer electronics products equipped with near-field communication antennas, the near-field communication antennas cause significant interference to the mobile devices and consumer electronics products.

[0004] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present disclosure. Therefore, it may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0005] An object of the present disclosure is to overcome the deficiencies of the above prior art and provide a display panel and a display device including the display panel.

[0006] According to one aspect of the present disclosure, there is provided a display panel having a display area and a bonding area, the display panel comprising:

[0007] A color filter substrate including a near-field communication antenna, the near-field communication antenna including a coil structure, and at least a part of the coil structure is located in the display area;

[0008] An array substrate including a first substrate, a channel region, and a non-channel region, and a positive projection of the coil structure on the first substrate is located within a positive projection of the non-channel region on the first substrate.

[0009] In an exemplary embodiment of the present disclosure, the coil structure is provided as a metal mesh structure.

[0010] In an exemplary embodiment of the present disclosure, the coil structure includes a plurality of first wires and a plurality of second wires. The first wires extend in a first direction, the second wires extend in a second direction, the first direction intersects the second direction, and the plurality of first wires and the plurality of second wires are connected to form a metal mesh structure.

[0011] In an exemplary embodiment of the present disclosure, the first wire is provided with a notch portion, and the positive projection of the channel region on the first substrate is located within the positive projection of the notch portion on the first substrate, or the positive projection of the channel region on the first substrate coincides with the positive projection of the notch portion on the first substrate.

[0012] In an exemplary embodiment of the present disclosure, the first wire includes:

[0013] A plurality of annular wires, the notch portion is provided on the annular wire, and the notch portion is closed;

[0014] A plurality of connecting wires, connected between two adjacent annular wires in the first direction;

[0015] The second wire is connected between two adjacent annular wires in the second direction.

[0016] In an exemplary embodiment of the present disclosure, the array substrate further includes a gate line and a data line, the gate line extends in the first direction, the data line extends in the second direction, and the positive projection of the first wire on the first substrate is located within the positive projection of the gate line on the first substrate, or the positive projection of the first wire on the first substrate coincides with the positive projection of the gate line on the first substrate.

[0017] In an exemplary embodiment of the present disclosure, the positive projection of the second wire on the first substrate is located within the positive projection of the data line on the first substrate, or the positive projection of the second wire on the first substrate coincides with the positive projection of the data line on the first substrate.

[0018] In an exemplary embodiment of the present disclosure, the display panel further includes a touch pattern, the touch pattern includes a plurality of touch wires, the touch wires extend in the second direction, and the positive projection of the second wire on the first substrate is located within the positive projection of the touch wire on the first substrate, or the positive projection of the second wire on the first substrate coincides with the positive projection of the touch wire on the first substrate.

[0019] In an exemplary embodiment of the present disclosure, the coil structure includes a plurality of conductive sheets, the conductive sheets are provided as integral sheets, and the plurality of conductive sheets surround to form a coil, and the material of the coil structure is a transparent conductive material.

[0020] In an exemplary embodiment of the present disclosure, the coil structure includes:

[0021] At least one coil portion;

[0022] At least two lead-out terminals, which are respectively connected to the head connection end and the tail connection end of the coil part.

[0023] In an exemplary embodiment of the present disclosure, the coil part is a multi-turn spiral coil.

[0024] In an exemplary embodiment of the present disclosure, the head connection end of the multi-turn spiral coil is located inside the multi-turn spiral coil, the tail connection end of the multi-turn spiral coil is located outside the multi-turn spiral coil, the tail connection end is connected to the lead-out terminal, and the head connection end is connected to the lead-out terminal in a bridging manner.

[0025] In an exemplary embodiment of the present disclosure, the near-field communication antenna includes:

[0026] A first metal layer including a bridging strip;

[0027] A second metal layer including a multi-turn spiral coil, a first lead-out terminal and a second lead-out terminal, the first lead-out terminal is connected to the tail connection end of the multi-turn spiral coil, and the second lead-out terminal is connected to the head connection end of the multi-turn spiral coil through the bridging strip; the second metal layer is farther away from the array substrate than the first metal layer.

[0028] A second insulating layer is disposed between the first metal layer and the second metal layer. A first via hole and a second via hole are provided on the second insulating layer. One end of the bridging strip is connected to the second lead-out terminal through the first via hole, and the other end of the bridging strip is connected to the head connection end through the second via hole.

[0029] In an exemplary embodiment of the present disclosure, the coil part includes a plurality of nested single-turn coils. The single-turn coil has an opening, a head connection end and a tail connection end. The plurality of openings are located on the same side of the multi-turn coil, and the openings of the single-turn coils gradually decrease from the outer circle to the inner circle.

[0030] In an exemplary embodiment of the present disclosure, the lead-out terminal is disposed in the bonding area.

[0031] In an exemplary embodiment of the present disclosure, the lead-out terminal is disposed in the display area, and the near-field communication antenna further includes:

[0032] At least two connection lines, one end of each connection line is correspondingly connected to the lead-out terminal, and the other end of each connection line is connected to the bonding area.

[0033] In an exemplary embodiment of the present disclosure, the array substrate further includes gate lines and data lines. The connection line includes one or both of a first portion and a second portion. The first portion extends in a first direction, and the second portion extends in a second direction. The orthographic projection of the first portion on the first substrate is located within the orthographic projection of the gate line on the first substrate, or the orthographic projection of the first portion on the first substrate coincides with the orthographic projection of the gate line on the first substrate. The orthographic projection of the second portion on the first substrate is located within the orthographic projection of the data line on the first substrate, or the orthographic projection of the second portion on the first substrate coincides with the orthographic projection of the data line on the first substrate.

[0034] In an exemplary embodiment of the present disclosure, the color filter substrate further includes:

[0035] A second substrate;

[0036] A color filter layer disposed on a side of the second substrate close to the array substrate, and the near-field communication antenna is disposed on a side of the second substrate away from the color filter layer; or, the near-field communication antenna is disposed between the second substrate and the color filter layer; or, the near-field communication antenna is disposed on a side of the color filter layer away from the second substrate;

[0037] The color filter layer includes a black matrix, and the orthographic projection of the metal grid structure on the first substrate is located within the orthographic projection of the black matrix on the first substrate.

[0038] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0039] A first flexible circuit board bonded to the near-field communication antenna in the bonding area;

[0040] A near-field communication chip disposed on the first flexible circuit board.

[0041] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0042] Bonding pins disposed on a side of the first substrate or the second substrate away from the near-field communication antenna;

[0043] A conductive film connected between the near-field communication antenna and the bonding pins and partially covering an end face of the first substrate or the second substrate in the bonding area;

[0044] A protective layer covering a side of the conductive film away from the first substrate or the second substrate.

[0045] In an exemplary embodiment of the present disclosure, chamfers are provided on the edges of the end faces of the first substrate or the second substrate that cover the conductive film.

[0046] In an exemplary embodiment of the present disclosure, the display panel further includes:

[0047] An antireflection layer provided on a side of the color filter substrate away from the array substrate.

[0048] According to another aspect of the present disclosure, a display device is provided, including: the display panel according to any one of the above.

[0049] In the display panel of the present disclosure, the color filter substrate includes a near-field communication antenna. The near-field communication antenna includes a coil structure. At least a part of the coil structure is located in the display area. Moreover, by arranging the near-field communication antenna on the color filter substrate away from the array substrate, electromagnetic interference generated by the near-field communication antenna during operation on the display signal can be greatly reduced, and the normal operation of other modules or electronic components of the display panel can be ensured; the orthographic projection of the coil structure on the first substrate is located within the orthographic projection of the non-channel region on the first substrate, that is, there is no overlap between the orthographic projection of the channel region on the first substrate and the orthographic projection of the coil structure on the first substrate, further reducing the electromagnetic interference generated by the near-field communication antenna during operation on the thin-film transistor and improving the display effect of the display panel; integrating the near-field communication antenna on the color filter substrate is beneficial to the thinning of the display panel; the near-field communication antenna does not need to be arranged within the border on the periphery of the display area. Therefore, the display panel will not cause an increase in the width of the border due to the need to have a near-field communication function, which is beneficial to reducing the width of the border of the display panel, and further can increase the proportion of the display area of the electronic device, and can improve the user experience.

[0050] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the following drawings are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0052] Figure 1 It is a schematic structural diagram of the first exemplary embodiment of the display panel of the present disclosure.

[0053] Figure 2 It is a schematic structural diagram of the second exemplary embodiment of the display panel of the present disclosure.

[0054] Figure 3 Schematic diagram of the structure of the third exemplary embodiment of the display panel of the present disclosure.

[0055] Figure 4 Schematic diagram of the structure of the fourth exemplary embodiment of the display panel of the present disclosure.

[0056] Figure 5 is Figure 1 Partial schematic diagram of the structure where the near - field communication antenna is a metal grid structure.

[0057] Figure 6 is Figure 5 Partial enlarged schematic diagram of the part indicated by I in

[0058] Figure 7 Schematic diagram of the structure of the fifth exemplary embodiment of the display panel of the present disclosure.

[0059] Figure 8 Schematic diagram of the light path structure for human eyes to view.

[0060] Figure 9 is a curve graph of visual contrast sensitivity CSF (contrast sensitivity function).

[0061] Figure 10 is Figure 1 Partial schematic diagram of the conductive sheet of the near - field communication antenna in

[0062] Figure 11 Top - view schematic diagram of the near - field communication antenna set as a single - turn coil.

[0063] Figure 12 Top - view schematic diagram of the near - field communication antenna set as multiple single - turn coils.

[0064] Figure 13 Top - view schematic diagram of an exemplary embodiment of the near - field communication antenna set as a multi - turn spiral coil.

[0065] Figure 14 Schematic diagram of the structure of the sixth exemplary embodiment of the display panel of the present disclosure.

[0066] Figure 15 Schematic diagram of the structure of the seventh exemplary embodiment of the display panel of the present disclosure.

[0067] Figure 16 Schematic diagram of the structure where the near - field communication antenna includes multiple coil structures.

[0068] Figure 17 Three - dimensional schematic diagram of the side - binding structure of the display panel of the present disclosure.

[0069] Figure 18 isFigure 17 Cross-sectional schematic diagram.

[0070] Figures 19 to 22 Structural schematic diagrams of the respective steps for forming the side binding structure.

[0071] Description of reference numerals:

[0072] 1. Array substrate; 101. First substrate; 102. Buffer layer; 103. Gate; 104. Gate line; 105. Gate insulating layer; 106. Active layer; 1061. Channel region; 1062. Conductor region; 107. Pixel electrode; 108. Source electrode; 109. Drain electrode; 110. Data line; 111. First insulating layer; 112. Common electrode; 113. Touch control wire;

[0073] 2. Liquid crystal layer;

[0074] 3. Color filter substrate; 31. Second substrate;

[0075] 32. Near-field communication antenna; 321. First wire; 3211. Loop wire; 3212. Connecting wire; 322. Second wire; 3221. First sub-wire; 3222. Second sub-wire; 32a. First metal layer; 32a1. Bridging strip; 32b. Second metal layer; 32b1. Multi-turn spiral coil; 32b2. First lead-out end; 32b3. Second lead-out end; 32b4. Single-turn coil; 32b5. Third lead-out end; 32b6. Fourth lead-out end; 32b7. Connecting line; 32b71. First part; 32b72. Second part; 32b8. First connection end; 32b9. Tail connection end; 32c. Second insulating layer; 32c1. First via; 32c2. Second via;

[0076] 33. Filter layer; 331. Filter part; 332. Black matrix; 34. Third insulating layer; 35. Coil structure; 351. Coil part; 352. Lead-out end;

[0077] 4. Anti-reflection layer; 5. Binding pin 9; 6. Conductive film; 7. Protective layer; 8. Connecting pin; 9. Binding pin material layer;

[0078] AA. Display area; BOD. Binding area. Detailed implementation manners

[0079] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0080] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the directions of the examples described in the drawings. It can be understood that if the device of the icon is turned upside down, the component described as "upper" will become the component described as "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" disposed on another structure, or that a structure is "indirectly" disposed on another structure through another structure.

[0081] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used to mean an open inclusion and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second", "third", etc. are used only as labels and are not a limitation on the quantity of their objects.

[0082] Near field communication technology requires the installation of a near field communication antenna 32 on a device for receiving and transmitting electromagnetic wave signals, and the near field communication antenna 32 requires a relatively large space. Most of the existing electronic devices using near field communication technology are configured by externally disposing an independent near field communication module on the main board of the electronic device. Therefore, a relatively large space is required, which is not conducive to the thin and light design of the electronic device.

[0083] Example embodiments of the present disclosure provide a display panel. Referring to Figures 1 - 15 as shown, the display panel has a display area AA and a bonding area BOD. The display panel may include a color filter substrate 3 and an array substrate 1; the color filter substrate 3 may include a near field communication antenna 32, and the near field communication antenna 32 includes a coil structure 35, and at least a part of the coil structure 35 is located in the display area AA; the array substrate 1 may include a first substrate 101, a channel region 1061 and a non-channel region, and the orthographic projection of the coil structure 35 on the first substrate 101 is located within the orthographic projection of the non-channel region on the first substrate 101.

[0084] In the display panel of the present disclosure, the near-field communication antenna 32 does not affect the display of the display area AA, and the near-field communication antenna 32 is far away from the array substrate 1, which can greatly reduce the electromagnetic interference generated by the near-field communication antenna 32 on the display signal during operation, and can ensure the normal operation of other modules or electronic components of the display panel; the positive projection of the coil structure 35 on the first substrate 101 is located within the positive projection of the non-channel region on the first substrate 101, that is, there is no overlap between the positive projection of the channel region 1061 on the first substrate 101 and the positive projection of the coil structure 35 on the first substrate 101, further reducing the electromagnetic interference generated by the near-field communication antenna 32 on the thin-film transistor during operation, and improving the display effect of the display panel; integrating the near-field communication antenna 32 on the color filter substrate 3 is beneficial to the thinning of the display panel; the near-field communication antenna 32 does not need to be arranged within the frame on the periphery of the display area AA, so the display panel will not increase the width of the frame due to the need to have the near-field communication function, which is beneficial to reducing the width of the display panel frame, and further can increase the area ratio of the display area AA of the electronic device, and can improve the user experience.

[0085] In the present exemplary embodiment, the array substrate 1 may further include a first substrate 101. The first substrate 101 may be a rigid substrate, for example, it may be a glass substrate; the first substrate 101 may be a flexible substrate, for example, it may be a PI (Polyimide) substrate.

[0086] A buffer layer 102 is provided on one side of the first substrate 101.

[0087] A gate pattern is provided on the side of the buffer layer 102 away from the first substrate 101. The gate pattern may include a gate 103 and gate lines 104, and the gate lines 104 extend in the first direction.

[0088] A gate insulating layer 105 is provided on the side of the gate pattern away from the first substrate 101. An active layer 106 is provided on the side of the gate insulating layer 105 away from the first substrate 101. The active layer 106 may include a channel region 1061 and two conductor regions 1062 located on both sides of the channel region 1061. The channel region 1061 refers to the region where the current mainly flows. The channel region 1061 is disposed opposite to the gate 103, and the conduction of the channel region 1061 is controlled by inputting current or voltage to the gate 103.

[0089] A pixel electrode 107 is provided on the side of the gate insulating layer 105 away from the first substrate 101. The pixel electrode 107 is separated from the active layer 106, that is, there is a gap between the pixel electrode 107 and the active layer 106. The material of the pixel electrode 107 may be ITO.

[0090] An active drain 109 pattern is provided on a side of the active layer 106 away from the first substrate 101. The source-drain 109 pattern may include a data line 110, a source electrode 108, and a drain electrode 109. The source electrode 108 and the drain electrode 109 are respectively connected to two conductor regions 1062 of the active layer 106. The data line 110 is connected to the source electrode 108, and the pixel electrode 107 is connected to the drain electrode 109. In cases such as when using thin-film transistors with opposite polarities or when the current direction changes during circuit operation, the functions of the "source electrode 108" and the "drain electrode 109" sometimes swap with each other. Therefore, in this specification, the "source electrode 108" and the "drain electrode 109" can swap with each other.

[0091] Referring to Figure 2 As shown, the data line 110 extends in a second direction, and the first direction intersects the second direction.

[0092] It should be noted that the gate 103, the active layer 106, the source electrode 108, and the drain electrode 109 form a thin-film transistor, and multiple thin-film transistors are arranged in an array on one side of the first substrate 101. The thin-film transistor described above is a bottom-gate type thin-film transistor. In other exemplary embodiments of the present disclosure, the thin-film transistor may also be a top-gate type thin-film transistor or a double-gate type thin-film transistor, which will not be described in detail here.

[0093] A first insulating layer 111 is provided on a side of the source-drain 109 pattern away from the first substrate 101.

[0094] A common electrode 112 is provided on a side of the first insulating layer 111 away from the first substrate 101. The material of the common electrode 112 may be ITO.

[0095] In addition, in other exemplary embodiments of the present disclosure, the common electrode 112 may also be provided on a side of the pixel electrode 107 close to the first substrate 101, and the pixel electrode 107 may be connected to the source electrode 108 or the drain through a via provided on the first insulating layer 111.

[0096] In some other exemplary embodiments of the present disclosure, referring to Figure 3As shown, the display panel can be a TDDI (Touch and Display Driver Integration) product, that is, a touch pattern is also provided on the array substrate 1. The touch pattern can include touch leads, and the touch leads can be arranged on the same layer and made of the same material as the data lines 110, that is, the touch leads and the data lines 110 can be formed through the same lithography process. The touch leads extend in the second direction, that is, the extending direction of the touch leads is the same as that of the data lines 110. In this case, the common electrode 112 can be reused as a touch electrode, vias can be provided on the first insulating layer 111, and the touch electrode can be connected to the touch leads through the vias to transmit the touch signal to the touch chip.

[0097] In some further exemplary embodiments of the present disclosure, the display panel can be an OLED (Organic Light-Emitting Diode) display panel. The thin-film transistors of the OLED display panel can be the thin-film transistors of the above structure, which will not be elaborated here.

[0098] The OLED display panel can further include a planarization layer, a first electrode, a pixel definition layer, a light-emitting layer, and a second electrode. The planarization layer is provided on the side of the source-drain electrode 109 pattern of the thin-film transistor away from the substrate. A third via is provided on the planarization layer, and the third via communicates with the source electrode 108 or the drain electrode; the first electrode is provided on the side of the planarization layer away from the substrate. The first electrode can be an anode, and the first electrode is connected to the source electrode 108 or the drain electrode through the third via on the planarization layer; the pixel definition layer is provided on the side of the first electrode away from the substrate, and a fourth via is also provided on the pixel definition layer, and the fourth via communicates with the first electrode; the light-emitting layer is provided in the fourth via, and the light-emitting layer is in contact with the first electrode. The thin-film transistor can control the light-emitting brightness of the light-emitting layer through the first electrode; the second electrode is provided on the side of the light-emitting layer away from the substrate, and the second electrode can be a cathode.

[0099] When the display panel is a liquid crystal display panel, a liquid crystal layer 2 is provided between the array substrate 1 and the color filter substrate 3.

[0100] In this exemplary embodiment, please continue to refer to Figure 1 As shown, the color filter substrate 3 can include a second substrate 31. The second substrate 31 can be a rigid substrate, for example, it can be a glass substrate; the second substrate 31 can be a flexible substrate, for example, it can be a PI (Polyimide) substrate.

[0101] A filter layer 33 is provided on one side of the second substrate 31 close to the array substrate 1, and a near-field communication antenna 32 is provided on the side of the second substrate 31 away from the array substrate 1. That is, the near-field communication antenna 32 and the filter layer 33 are provided on opposite sides of the second substrate 31. From the side close to the array substrate 1, they are the filter layer 33, the second substrate 31, and the near-field communication antenna 32 in sequence. Since the array substrate 1 needs to be powered on and operated, and the near-field communication antenna 32 also needs to be powered on and operated, signal interference will occur when both are powered on simultaneously. Setting the near-field communication antenna 32 on the side of the second substrate 31 away from the array substrate 1 can further avoid electromagnetic interference of the signal of the near-field communication antenna 32 on the array substrate 1.

[0102] The filter layer 33 may include a plurality of filter portions 331 and a black matrix 332. The plurality of filter portions 331 are arranged in an array on one side of the first base layer; the plurality of filter portions 331 may include a red filter portion 331, a blue filter portion 331, and a green filter portion 331, and a black matrix 332 is provided between two adjacent filter portions 331.

[0103] Of course, in other exemplary embodiments of the present disclosure, the filter layer 33 may be provided between the second substrate 31 and the near-field communication antenna 32. From the side close to the array substrate 1, they are the near-field communication antenna 32, the filter layer 33, and the second substrate 31 in sequence; the filter layer 33 may also be provided on the side of the near-field communication antenna 32 away from the second substrate 31. As shown in Figure 4 From the side close to the array substrate 1, they are the filter layer 33, the near-field communication antenna 32, and the second substrate 31 in sequence.

[0104] It should be noted that when the near-field communication antenna 32 and the filter layer 33 are adjacent, a third insulating layer 34 may be provided between the near-field communication antenna 32 and the filter layer 33 to isolate the near-field communication antenna 32 and the filter layer 33 through the third insulating layer 34.

[0105] The specific structure of the near-field communication antenna 32 will be described in detail below.

[0106] The near-field communication antenna 32 may include a coil structure 35, and at least part of the coil structure 35 is located in the display area AA.

[0107] Referring to Figure 5 and Figure 6As shown, the coil structure 35 can be set as a metal mesh structure, and its material can be conductive metals such as copper and aluminum. Specifically, the coil structure 35 can include multiple first wires 321 and multiple second wires 322. The first wires 321 extend in the first direction, and the second wires 322 extend in the second direction. The first direction intersects with the second direction. The multiple first wires 321 and the multiple second wires are connected to form a metal mesh structure. The coil structure 35 of the metal mesh structure can be light-transmissive and does not affect the display of the display area AA. The metal mesh structure can greatly reduce the resistance of the near-field communication antenna 32, which is beneficial to improving the sensitivity and communication distance of the near-field communication antenna 32.

[0108] The orthographic projection of the first wire 321 on the first substrate 101 is located within the orthographic projection of the gate line 104 on the first substrate 101, or the orthographic projection of the first wire 321 on the first substrate 101 coincides with the orthographic projection of the gate line 104 on the first substrate 101, so that the width of the first wire 321 is less than or equal to the width of the gate line 104. The orthographic projection of the second wire 322 on the first substrate 101 can be located within the orthographic projection of the data line 110 on the first substrate 101, or the orthographic projection of the second wire 322 on the first substrate 101 can coincide with the orthographic projection of the data line 110 on the first substrate 101, so that the width of the second wire 322 is less than or equal to the width of the data line 110.

[0109] Specifically, the first wire 321 can include multiple annular wires 3211 and multiple connecting wires 3212. The annular wires 3211 are arranged opposite to the thin-film transistors. The orthographic projection of the annular wires 3211 on the first substrate 101 forms an annular shadow, which has an inner ring and an outer ring. The inner ring and the outer ring enclose the orthographic projection of the annular wires 3211. The part within the inner ring does not belong to the orthographic projection of the annular wires 3211, and the part outside the outer ring does not belong to the orthographic projection of the annular wires 3211 either; the orthographic projection of the channel region 1061 on the first substrate 101 is located within the inner ring of the orthographic projection of the annular wires 3211 on the first substrate 101, so that the orthographic projection of the channel region 1061 on the first substrate 101 has no overlap with the orthographic projection of the coil structure 35 on the first substrate 101; thereby further reducing the electromagnetic interference generated by the near-field communication antenna 32 on the thin-film transistors during operation and improving the display effect of the display panel.

[0110] Multiple connecting wires 3212 are connected between two adjacent annular wires 3211 in the first direction. The second wire 322 is connected between two adjacent annular wires 3211 in the second direction.

[0111] A closed notch is formed inside the annular wire 3211.

[0112] In some other exemplary embodiments of the present disclosure, an open notch portion may be provided. For example, a portion of the first wire 321 may be set as a bent wire, and an open notch portion is formed inside the bent wire. The orthographic projection of the channel region 1061 on the first substrate 101 is located within the orthographic projection of the notch portion on the first substrate 101, or the orthographic projection of the channel region 1061 on the first substrate 101 coincides with the orthographic projection of the notch portion on the first substrate 101.

[0113] To adapt to the data line 110, the second wire 322 may be set as a broken line. Specifically, the second wire 322 may include a first sub-wire 3221 and a second sub-wire 3222, and the included angle between the first sub-wire 3221 and the second sub-wire 3222 is greater than 90 degrees and less than or equal to 180 degrees; a sharp corner structure may be provided at the connection between the first sub-wire 3221 and the second sub-wire 3222.

[0114] Referring to Figure 3 As shown, when a touch pattern is provided on the array substrate 1, the orthographic projection of the second wire 322 on the first substrate 101 may also be located within the orthographic projection of the touch wire 113 on the first substrate 101, or the orthographic projection of the second wire 322 on the first substrate 101 may also coincide with the orthographic projection of the touch wire 113 on the first substrate 101, so that the width of the second wire 322 is less than or equal to the width of the touch wire 113; of course, referring to Figure 7 As shown, when a touch pattern is provided on the array substrate 1, the orthographic projection of the second wire 322 on the first substrate 101 may also be located within the orthographic projection of the data line 110 on the first substrate 101.

[0115] The first wire 321 and the second wire 322 are arranged such that the orthographic projections of the first wire 321 and the second wire 322 on the first substrate 101 are both located within the orthographic projection of the black matrix 332 on the first substrate 101. Since the first wire 321 and the second wire 322 are light-impermeable, it is possible to prevent the first wire 321 and the second wire 322 from affecting the aperture ratio of the display panel.

[0116] However, since the near-field communication antenna 32 may be provided on the light-emitting side of the second substrate 31, the periods of the first wire 321 and the second wire 322 need to be set to a period that cannot be recognized by the human eye. Referring to Figure 8 the schematic diagram of the human eye viewing optical path structure shown in Figure 9The shown visual contrast sensitivity CSF (Contrast Sensitivity Function) curve graph, when the abscissa (Frequency) is around 10, the human eye has the strongest ability to distinguish blurred objects, and the ordinate CSFValue (CSF value) can reach 0.99; as the abscissa increases, the human eye's ability to distinguish blurred objects gradually weakens. Therefore, it is necessary to set the abscissa to a relatively large value to achieve the effect that the human eye cannot recognize the first wire 321 and the second wire 322.

[0117] Visual contrast sensitivity function CSF formula:

[0118]

[0119] In the formula, D is the viewing distance of the human eye; L is the width that the human eye can see within a viewing angle of one degree; the period is the sum of the line pitch and the line width of two adjacent first wires 321 or the sum of the line pitch and the line width of two adjacent second wires 322; X is the frequency, representing the abscissa of the visual contrast sensitivity CSF curve graph.

[0120] It can be obtained from the above formula that to make the abscissa value of the calculated visual contrast sensitivity CSF curve graph larger, it is necessary to make the line pitch of the first wire 321 or the line pitch of the second wire 322 smaller.

[0121] Of course, in some exemplary embodiments of the present disclosure, referring to Figure 10 As shown, the coil structure 35 can also include a plurality of conductive sheets. The conductive sheets can be set as a whole sheet, that is, the conductive sheets are not a grid structure but a whole sheet structure. The plurality of conductive sheets are connected and wound around to form a coil structure; in this case, the material of the coil structure 35 is a transparent conductive material. For example, it can be ITO (indium tin oxide), AZO (aluminum-doped zinc oxide), etc. ITO and AZO have a large band gap and only absorb ultraviolet light and do not absorb visible light. Even if the conductive sheets cover the pixels, it will not affect the display. The coil structure 35 arranged in this way can greatly reduce the resistance of the near-field communication antenna 32, which is beneficial to improving the sensitivity and communication distance of the near-field communication antenna 32, and can achieve a larger communication distance with a smaller coil area.

[0122] The coil structure 35 can include at least one coil portion 351 and at least two lead-out ends 352. When there are multiple coil portions 351, the multiple coil portions 351 are arranged in an array on one side of the second substrate 31.

[0123] Referring to Figure 11As shown, the coil part 351 may be a single-turn coil 32b4. There are two lead-out terminals 352, namely the first lead-out terminal 32b2 and the second lead-out terminal 32b3 respectively. The first lead-out terminal 32b2 and the second lead-out terminal 32b3 are respectively connected to the head connection end 32b8 and the tail connection end 32b9 of the coil part of the wire 32b7, that is, the first lead-out terminal 32b2 is connected to the head connection end 32b8 of the single-turn coil 32b4, and the second lead-out terminal 32b3 is connected to the tail connection end 32b9 of the single-turn coil 32b4. The near-field communication antenna 32 of the single-turn coil 32b4 can be used for functions such as mobile payment, electronic tickets, and access control.

[0124] The coil part 351 may be a multi-turn coil, and the number of turns of the multi-turn coil is at least two turns. For example, referring to Figure 12 As shown, the coil part 351 may be a double-turn coil. The double-turn coil may include two nested single-turn coils 32b4, namely an inner-turn coil and an outer-turn coil, and the inner-turn coil and the outer-turn coil form a figure-eight shape. If the double-turn coil is not connected in the display area AA, then four lead-out terminals 352 need to be provided, namely the first lead-out terminal 32b2, the second lead-out terminal 32b3, the third lead-out terminal 32b5, and the fourth lead-out terminal 32b6. The first lead-out terminal 32b2 and the second lead-out terminal 32b3 are respectively connected to the head connection end 32b8 and the tail connection end 32b9 of the inner-turn coil, and the third lead-out terminal 32b5 and the fourth lead-out terminal 32b6 are respectively connected to the head connection end 32b8 and the tail connection end 32b9 of the outer-turn coil. The near-field communication antenna 32 of the multi-turn coil can be used for functions such as positioning.

[0125] Each single-turn coil 32b4 has an opening, a head connection end 32b8, and a tail connection end 32b9. Then, the two single-turn coils 32b4 have two openings. The two openings are on the same side of the double-turn coil, and the openings of the single-turn coils 32b4 decrease in sequence from the outer circle to the inner circle, so that the inner-turn coil and the outer-turn coil can be connected to their respective lead-out terminals 352 without crossing each other, making the circuit arrangement simpler, improving production efficiency, and reducing costs.

[0126] In some exemplary embodiments of the present disclosure, the coil part 351 may also be a triple-turn coil. The triple-turn coil may include three single-turn coils 32b4. Each single-turn coil 32b4 has an opening, a head connection end 32b8, and a tail connection end 32b9. One single-turn coil 32b4 needs to be provided with two lead-out terminals 352. Therefore, the number of lead-out terminals 352 is twice the number of single-turn coils 32b4. The three openings are on the same side of the triple-turn coil, and the openings of the single-turn coils 32b4 decrease in sequence from the outer circle to the inner circle. The specific number will not be elaborated.

[0127] It should be noted that the second lead terminal 32b3 can be connected to the third lead terminal 32b5 or the second lead terminal 32b3 can be connected to the fourth lead terminal 32b6 by providing a connection structure on the first flexible circuit board, that is, the inner turn coil and the outer turn coil are connected into a single coil through the connection structure on the first flexible circuit board.

[0128] In terms of the cross-sectional view, referring to Figures 1 - 4 and Figure 11 and Figure 12 as shown, the near-field communication antenna 32 can include a second metal layer 32b and an insulating layer that are sequentially stacked; the second metal layer 32b can include a single-turn coil 32b4, a double-turn coil or a multi-turn coil, and the second metal layer 32b can further include at least two lead terminals 352, and the lead terminals 352 are directly connected to the single-turn coil 32b4. That is, the single-turn coil 32b4, the double-turn coil or the multi-turn coil and the lead terminals 352 are formed by the same patterning process.

[0129] Referring to Figure 13 as shown, the coil portion 351 can be a double-turn coil, and the double-turn coil is a spiral structure. The double-turn coil has two connection ends, namely a head connection end 32b8 and a tail connection end 32b9. The head connection end 32b8 of the double-turn coil is located inside the coil, and the tail connection end 32b9 is located outside the double-turn coil. The tail connection end 32b9 located outside the double-turn coil is directly connected to the first lead terminal 32b2, and the head connection end 32b8 located inside the double-turn coil is connected to the second lead terminal 32b3 through a bridging structure.

[0130] Specifically, in terms of the cross-sectional view, referring to Figure 14 and Figure 15As shown, the near-field communication antenna 32 may include a first metal layer 32a, a second insulating layer 32c, and a second metal layer 32b that are sequentially stacked. The second metal layer 32b may include a double-turn spiral coil, a first lead-out end 32b2, and a second lead-out end 32b3. The first lead-out end 32b2 is directly connected to the tail connection end 32b9 of the double-turn spiral coil as a single entity. The second lead-out end 32b3 is spaced from the double-turn spiral coil and the first lead-out end 32b2, that is, there is no connection between the second lead-out end 32b3 and the double-turn coil and the first lead-out end 32b2. A plurality of first vias 32c1 and a plurality of second vias 32c2 are provided on the second insulating layer 32c. The plurality of first vias 32c1 communicate with the second lead-out end 32b3, and the plurality of second vias 32c2 communicate with the head connection end 32b8 of the double-turn coil. The first metal layer 32a includes a bridging strip 32a1. One end of the bridging strip 32a1 is connected to the second lead-out end 32b3 through a plurality of first vias 32c1, and the other end of the bridging strip 32a1 is connected to the head connection end 32b8 of the double-turn coil through a plurality of second vias 32c2, so that the second lead-out end 32b3 and the head connection end 32b8 in the double-turn coil are connected through the bridging strip 32a1.

[0131] The area of the second metal layer 32b is larger, causing greater interference to the battery of the array substrate 1. The area of the first metal layer 32a is smaller, causing less interference to the battery of the array substrate 1. The second metal layer 32b is farther from the array substrate 1 than the first metal layer 32a, such that the near-field communication antenna 32 causes less interference to the battery of the array substrate 1.

[0132] It should be noted that the coil portion 351 may also be a multi-turn spiral coil 32b1. When the multi-turn coil is set as the spiral coil portion 351, there are only two connection ends, namely the head connection end 32b8 and the tail connection end 32b9. The connection structure between the two connection ends of the multi-turn spiral coil 32b1 and the first lead-out end 32b2 and the second lead-out end 32b3 is the same as the connection structure between the two connection ends of the double-turn coil, and will not be elaborated here.

[0133] When the number of coil portions 351 is small, the lead-out end 352 may be arranged in the bonding area BOD, and the lead-out end 352 is directly bonded to the flexible circuit board, that is, the lead-out end 352 can be used as the bonding pin 5.

[0134] Refer to Figure 16As shown. When there are more coil parts 351, the multiple coil parts 351 are arranged in an array on one side of the second substrate 31. The second substrate 31 can be evenly divided into several induction areas of equal size, and a coil structure 35 is designed in each induction area. The induction distances of the multiple coil structures 35 are the same. The area and shape of the coil structure 35 can be optimized by simulation according to parameters such as the resistance and length of the coil to ensure that the induction distances of the coil structures 35 in each induction area are equal. The multiple coil structures 35 can be independent of each other. For example, in the application of game console function card recognition, the function card activates a specific function by sensing the NFC antenna in a specific induction area.

[0135] The lead-out ends 352 of the multiple coil parts 351 cannot all be arranged in the bonding area BOD and need to be connected to the bonding area BOD through the connecting lines 32b7. In this case, in order to reduce the number of connecting lines 32b7, the coil part 351 can be a single-turn coil 32b4, a double-turn spiral coil or a multi-turn spiral coil 32b1. In this way, one coil part 351 has only two lead-out ends 352, and one coil part 351 only needs to be led out through two connecting lines 32b7. The two connecting lines 32b7 are respectively the first connecting line 32b7 and the second connecting line 32b7. One end of the first connecting line 32b7 is connected to the first lead-out end 32b2, and the other end of the first connecting line 32b7 is connected to the bonding area BOD; one end of the second connecting line 32b7 is connected to the second lead-out end 32b3, and the other end of the second connecting line 32b7 is connected to the bonding area BOD.

[0136] The connecting line 32b7 can include a first part 32b71 and a second part 32b72. The first part 32b71 extends in the first direction, and the second part 32b72 extends in the second direction. The orthographic projection of the first part 32b71 on the first substrate 101 is located within the orthographic projection of the gate line 104 on the first substrate 101, or the orthographic projection of the first part 32b71 on the first substrate 101 coincides with the orthographic projection of the gate line 104 on the first substrate 101; the orthographic projection of the second part 32b72 on the first substrate 101 is located within the orthographic projection of the data line 110 on the first substrate 101, or the orthographic projection of the second part 32b72 on the first substrate 101 coincides with the orthographic projection of the data line 110 on the first substrate 101; so that the orthographic projection of the first part 32b71 on the first substrate 101 and the orthographic projection of the second part 32b72 on the first substrate 101 are both located within the orthographic projection of the black matrix 332 on the first substrate 101. Since the first part 32b71 and the second part 32b72 are opaque, it is possible to prevent the first part 32b71 and the second part 32b72 from affecting the aperture ratio of the display panel. The number of the first parts 32b71 and the number of the second parts 32b72 can also be set as required.

[0137] As needed, the connection line 32b7 may only include the first part 32b71, and the number of the first parts 32b71 may also be set as needed; the connection line 32b7 may only include the second part 32b72, and the number of the second parts 32b72 may also be set as needed. As long as the lead-out end 352 of the coil part 351 can be connected to the bonding area BOD.

[0138] It should be noted that the connection line 32b7 may be arranged on the same layer and made of the same material as the double-turn spiral coil, the first lead-out end 32b2, and the second lead-out end 32b3. That is, the second metal layer 32b may further include the connection line 32b7, and the connection line 32b7 may be directly connected to the first lead-out end 32b2 or the second lead-out end 32b3, making the circuit arrangement simpler, improving production efficiency, and reducing costs.

[0139] In the above descriptions, the bonding area BOD is arranged on the lower side of the display panel. As needed, the position of the bonding area BOD may also be arranged on the upper side, left side, right side, etc. of the display panel.

[0140] In some exemplary embodiments of the present disclosure, the display panel may further include a first flexible circuit board and a near-field communication chip (not shown in the figure). The first flexible circuit board is bonded to the bonding area BOD of the near-field communication antenna 32 in the non-display area AA; the near-field communication chip is disposed on the first flexible circuit board, and the near-field communication antenna 32 can be controlled to work or not through the near-field communication chip, and the signal generated by the near-field communication chip can be transmitted through the near-field communication antenna 32.

[0141] When the display panel is a liquid crystal display panel and the near-field communication antenna 32 is arranged on the side of the second substrate 31 close to the array substrate 1, the lead-out end 352 or the connection line 32b7 of the near-field communication antenna 32 can be connected to the side of the second substrate 31 away from the array substrate 1 through a side bonding structure, which is convenient for bonding the first flexible circuit board to the near-field communication antenna 32.

[0142] Specifically, referring to Figure 17 and Figure 18 as shown, one end of the connection line 32b7 or the lead-out end 352 may be used as the connection pin 8 of the near-field communication antenna 32, and the bonding pin 5 is arranged in the bonding area BOD on the side of the second substrate 31 away from the near-field communication antenna 32. The bonding pin 5 and the connection pin 8 are in one-to-one correspondence, and the orthographic projection of the bonding pin 5 on the second substrate 31 coincides with the orthographic projection of the connection pin 8 on the second substrate 31.

[0143] A conductive film 6 is covered on the side of the connection pin 8 and the bonding pin 5 that is away from the second substrate 31, and a part of the conductive film 6 also wraps around the end face of the second substrate 31 in the bonding area BOD; the conductive film 6 can be an anisotropic conductive adhesive, so that the connection pin 8 and the bonding pin 5 are connected through the conductive film 6; after the first flexible circuit board is bonded to the bonding pin 5, signals can be transmitted between the near-field communication chip and the near-field communication antenna 32.

[0144] The array substrate 1 can be bonded to the second flexible circuit board. The specific bonding process will not be elaborated here.

[0145] Of course, when the position where the near-field communication antenna 32 is set is convenient for bonding, the side bonding structure can be not set, and one end of the connection line 32b7 or the lead-out end 352 can be directly bonded to the first flexible circuit board.

[0146] In addition, chamfers are provided on the edges of the end face of the second substrate 31 that wraps the conductive film 6. The chamfers can be round chamfers or bevel chamfers. This can make the thickness of the conductive film 6 uniform everywhere, and avoid the edges of the second substrate 31 rubbing against the conductive film 6 during subsequent use, resulting in the disconnection of the conductive film 6.

[0147] Refer to Figure 19 As shown, a bonding pin material layer 9 is formed on the side of the second substrate 31 that is away from the near-field communication antenna 32 by magnetron sputtering; refer to Figure 20 As shown, chamfering treatment is performed on the end face of one end of the second substrate 31 where the bonding pin 5 is provided; refer to Figure 21 As shown, a conductive film 6 is coated on one end of the second substrate 31 where the bonding pin 5 is provided. The conductive film 6 connects the bonding pin material layer 9 and the connection pin 8; refer to Figure 22 As shown, the bonding pin material layer 9 is etched by laser etching technology to form the bonding pin 5; refer to Figure 18 As shown, a protective layer 7 is formed on the side of the conductive film 6 away from the second substrate 31. The material of the protective layer 7 can be ink, which can prevent oxidation, external force damage, etc.

[0148] When the display panel is an OLED (Organic Electroluminescence Display) display panel, the lead-out end 352 or the connection line 32b7 of the near-field communication antenna 32 can be connected to the side of the first substrate 101 that is away from the near-field communication antenna 32 through the side bonding structure, which is convenient for the bonding of the first flexible circuit board with the near-field communication antenna 32 and the array substrate 1.

[0149] Specifically, one end of the connection line 32b7 or the lead-out end 352 can be used as the connection pin 8 of the near-field communication antenna 32. The bonding pin 5 is arranged in the bonding area BOD on the side of the first substrate 101 away from the near-field communication antenna 32. The bonding pin 5 and the connection pin 8 are in one-to-one correspondence, and the orthographic projection of the bonding pin 5 on the first substrate 101 coincides with the orthographic projection of the connection pin 8 on the first substrate 101.

[0150] A conductive film 6 is covered on the side of the connection pin 8 and the bonding pin 5 away from the first substrate 101, and a part of the conductive film 6 also covers the end face of the first substrate 101 in the bonding area BOD; the conductive film 6 can be an anisotropic conductive adhesive, so that the connection pin 8 and the bonding pin 5 are connected through the conductive film 6; after the first flexible circuit board is bonded to the bonding pin 5, signals can be transmitted between the near-field communication chip and the near-field communication antenna 32.

[0151] In addition, a chamfer is provided on the edge of the end face of the first substrate 101 covering the conductive film 6. The chamfer can be a round chamfer or an inclined chamfer. This can make the thickness of the conductive film 6 uniform everywhere, and avoid the edge of the first substrate 101 rubbing against the conductive film 6 during subsequent use, resulting in the disconnection of the conductive film 6.

[0152] In some exemplary embodiments of the present disclosure, the display panel may further include an anti-reflection layer 4, and the anti-reflection layer 4 is provided on the side of the color filter substrate 3 away from the array substrate 1. The anti-reflection layer 4 can be a composite film, including a high refractive index film layer and a low refractive index film layer, and the high refractive index film layer and the low refractive index film layer are alternately stacked. Such a setting can cause interference of the light reflected by the metal layer of the near-field communication antenna 32, thereby reducing the emission of the reflected light. The anti-reflection layer 4 can prevent the metal layer of the near-field communication antenna 32 from reflecting light and affecting the display effect of the display screen.

[0153] Based on the same inventive concept, the exemplary embodiments of the present disclosure further provide a display device, and the display device may include the display panel described in any one of the above. The specific structure of the display panel has been described in detail above, so it will not be repeated here.

[0154] The specific type of the display device is not particularly limited, and any common display device type in the art can be used, specifically, for example, mobile devices such as mobile phones, wearable devices such as watches, VR devices, etc. Those skilled in the art can make corresponding selections according to the specific use of the display device, which will not be repeated here.

[0155] It should be noted that, in addition to the display panel, the display device also includes other necessary components and compositions. Taking a display as an example, specifically, such as a housing, a circuit board, a power cord, etc. Those skilled in the art can make corresponding supplements according to the specific usage requirements of the display device, which will not be elaborated here.

[0156] Compared with the prior art, the beneficial effects of the display device provided by the exemplary embodiments of the present invention are the same as those of the display panel provided by the above exemplary embodiments, which will not be elaborated here.

[0157] After considering the specification and practicing the invention disclosed herein, those skilled in the art will readily conceive of other embodiments of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed herein. The specification and examples are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the appended claims.

Claims

1. A display panel having a display area and a bonding area, wherein, The display panel includes: A color filter substrate including a near - field communication antenna. The near - field communication antenna includes a coil structure. At least part of the coil structure is located in the display area, and the coil structure is arranged as a metal mesh structure. An array substrate including a first substrate, a channel region, and a non - channel region. The orthographic projection of the coil structure on the first substrate is located within the orthographic projection of the non - channel region on the first substrate. The coil structure includes a plurality of first wires. The first wires extend in a first direction. The first wires are provided with notch portions, and the notch portions are closed - type notch portions or open - type notch portions. The orthographic projection of the channel region on the first substrate is located within the orthographic projection of the notch portion on the first substrate, or the orthographic projection of the channel region on the first substrate coincides with the orthographic projection of the notch portion on the first substrate. The coil structure further includes a plurality of second wires. The second wires extend in a second direction. The first direction intersects the second direction, and the plurality of first wires and the plurality of second wires are connected to form a metal mesh structure.

2. The display panel according to claim 1, wherein, The first wire includes: A plurality of circular wires. The notch portion is provided in the circular wire, and the notch portion is a closed - type notch portion. A plurality of connecting wires connected between two adjacent circular wires in the first direction. The second wire is connected between two adjacent circular wires in the second direction.

3. The display panel according to claim 1, wherein, The array substrate further includes gate lines and data lines. The gate lines extend in the first direction, and the data lines extend in the second direction. The orthographic projection of the first wire on the first substrate is located within the orthographic projection of the gate line on the first substrate, or the orthographic projection of the first wire on the first substrate coincides with the orthographic projection of the gate line on the first substrate.

4. The display panel according to claim 3, wherein, The orthographic projection of the second wire on the first substrate is located within the orthographic projection of the data line on the first substrate, or the orthographic projection of the second wire on the first substrate coincides with the orthographic projection of the data line on the first substrate.

5. The display panel according to claim 3, wherein, The display panel further includes a touch pattern. The touch pattern includes a plurality of touch wires. The touch wires extend in the second direction. The orthographic projection of the second wire on the first substrate is located within the orthographic projection of the touch wire on the first substrate, or the orthographic projection of the second wire on the first substrate coincides with the orthographic projection of the touch wire on the first substrate.

6. The display panel according to any one of claims 1-5, wherein, The coil structure includes: At least one coil portion; At least two lead - out ends respectively connected to the head connection end and the tail connection end of the coil portion.

7. The display panel according to claim 6, wherein, The coil portion is a multi - turn spiral coil.

8. The display panel according to claim 7, wherein, The head connection end of the multi - turn spiral coil is located inside the multi - turn spiral coil, and the tail connection end of the multi - turn spiral coil is located outside the multi - turn spiral coil. The tail connection end is connected to the lead - out end, and the head connection end is bridge - connected to the lead - out end.

9. The display panel according to claim 8, wherein, The near - field communication antenna includes: A first metal layer including a bridging strip; The second metal layer includes a multi-turn spiral coil, a first lead-out end, and a second lead-out end. The first lead-out end is connected to the tail connection end of the multi-turn spiral coil, and the second lead-out end is connected to the head connection end of the multi-turn spiral coil through the bridging bar. The second metal layer is farther from the array substrate than the first metal layer. The second insulating layer is disposed between the first metal layer and the second metal layer. A first via hole and a second via hole are provided on the second insulating layer. One end of the bridging bar is connected to the second lead-out end through the first via hole, and the other end of the bridging bar is connected to the head connection end through the second via hole.

10. The display panel according to claim 6, wherein, The coil portion includes a plurality of nested single-turn coils. Each single-turn coil has an opening, a head connection end, and a tail connection end. The plurality of openings are located on the same side of the multi-turn coil, and the openings of the single-turn coils decrease in sequence from the outer circle to the inner circle.

11. The display panel according to claim 6, wherein, The lead-out end is disposed in the bonding region.

12. The display panel according to claim 6, wherein, The lead-out end is disposed in the display region. The near-field communication antenna further includes: At least two connection lines. One end of each connection line is correspondingly connected to the lead-out end, and the other end of each connection line is connected to the bonding region.

13. The display panel according to claim 12, wherein, The array substrate further includes a gate line and a data line. The connection line includes one or both of a first portion and a second portion. The first portion extends in a first direction, and the second portion extends in a second direction. The orthographic projection of the first portion on the first substrate is located within the orthographic projection of the gate line on the first substrate, or the orthographic projection of the first portion on the first substrate coincides with the orthographic projection of the gate line on the first substrate. The orthographic projection of the second portion on the first substrate is located within the orthographic projection of the data line on the first substrate, or the orthographic projection of the second portion on the first substrate coincides with the orthographic projection of the data line on the first substrate.

14. The display panel according to claim 1, wherein, The color filter substrate further includes: A second substrate; A light filtering layer disposed on a side of the second substrate close to the array substrate. The near-field communication antenna is disposed on a side of the second substrate far from the light filtering layer; or, the near-field communication antenna is disposed between the second substrate and the light filtering layer; or, the near-field communication antenna is disposed on a side of the light filtering layer far from the second substrate. The light filtering layer includes a black matrix, and the orthographic projection of the metal mesh structure on the first substrate is located within the orthographic projection of the black matrix on the first substrate.

15. The display panel according to claim 1 or 14, wherein, The display panel further includes: A first flexible circuit board bonded to the near-field communication antenna in the bonding region; A near-field communication chip disposed on the first flexible circuit board.

16. The display panel according to claim 14, wherein, The display panel further includes: Bonding pins disposed on a side of the first substrate or the second substrate far from the near-field communication antenna; A conductive film connected between the near-field communication antenna and the bonding pins, and partially covering the end face of the first substrate or the second substrate in the bonding region. A protective layer is coated on a side of the conductive film away from the first substrate or the second substrate.

17. The display panel according to claim 16, wherein, Edges of end faces of the first substrate or the second substrate that coat the conductive film are provided with chamfers.

18. The display panel according to claim 1, wherein, The display panel further includes: An anti-reflection layer is disposed on a side of the color filter substrate away from the array substrate.

19. A display device, wherein, Comprising: The display panel according to any one of claims 1 to 18.

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