Display module and display device

Abstract

The application discloses a display module and a display device, and relates to the technical field of display modules, and discloses the display module, which comprises a display function layer, a first buffer layer comprising at least one buffer groove, and a sensor which is attached to a side of a light-out surface away from the display function layer through the first buffer layer, wherein the buffer groove is arranged to at least partially surround the sensor. According to the technical scheme, when the display module is subjected to an impact force, the buffer groove can serve as a stress release point, and stress at the overlapping position of the sensor and the first buffer layer can be absorbed into the buffer groove around the sensor, so that the sensor can be prevented from being damaged by a large impact, and the service life and reliability of the display module can be improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the development of display technology, more and more display modules are equipped with under-display fingerprint sensors, which can increase the screen ratio and increase the display area, thereby achieving better visual effects.

[0003] Currently, fingerprint sensors are integrated under the display module, typically by directly attaching the sensor to the underside of the metal support plate. However, because the metal support plate is quite rigid and lacks cushioning, and fingerprint sensors are usually glass-based, they are easily damaged and fail when the display module is subjected to impact. This affects the reliability of the fingerprint sensor, and consequently, the lifespan and reliability of the display module. Summary of the Invention

[0004] This invention provides a display module and a display device to overcome the deficiencies in the prior art, improve the reliability of sensors, and thus help to improve the service life and reliability of the display module.

[0005] In a first aspect, the present invention provides a display module, comprising:

[0006] Display functional layer;

[0007] The first buffer layer includes at least one buffer groove;

[0008] The sensor is attached to the side of the light-emitting surface opposite to the display functional layer via the first buffer layer; the buffer groove is at least partially arranged around the sensor.

[0009] In a second aspect, the present invention provides a display device, comprising: the display module described in the first aspect of the present invention.

[0010] The technical solution of this invention involves attaching the sensor to the side of the display functional layer opposite to the light-emitting surface via a first buffer layer. When subjected to external impact, the first buffer layer deforms under stress, thus buffering the stress and reducing the stress acting on the sensor. Simultaneously, at least one buffer groove is provided in the first buffer layer so that when the display module is subjected to external impact, the first buffer layer deforms under stress. Due to the presence of the buffer groove, other locations on the first buffer layer deform towards the location of the buffer groove, allowing the buffer groove to act as a stress release point. Therefore, by having the buffer groove at least partially surround the sensor, the stress at the point where the sensor is attached to the first buffer layer can be released to the location of the buffer groove, thereby reducing the stress at the point where the sensor is attached to the first buffer layer. This reduces the impact on the sensor, preventing damage from large external impacts, improving the sensor's reliability, and consequently improving the reliability of the display module and extending its service life.

[0011] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of a display module in the prior art;

[0014] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention;

[0015] Figure 3 This is a bottom view diagram of a display module provided in an embodiment of the present invention;

[0016] Figure 4 This is a schematic diagram of the structure of a display function layer provided in an embodiment of the present invention;

[0017] Figure 5 and Figure 6 These are schematic diagrams of two other display modules provided in embodiments of the present invention;

[0018] Figure 7 This is a schematic diagram of the structure of another display module provided in an embodiment of the present invention;

[0019] Figure 8 This is a schematic diagram of the structure of another display module provided in an embodiment of the present invention;

[0020] Figure 9 This is a bottom-view structural diagram of another display module provided in an embodiment of the present invention;

[0021] Figure 10 This is a schematic diagram of the structure of another display module provided in an embodiment of the present invention;

[0022] Figure 11 This is a bottom-view structural diagram of another display module provided in an embodiment of the present invention;

[0023] Figure 12 This is a schematic diagram of the structure of another display module provided in an embodiment of the present invention;

[0024] Figure 13 This is a schematic diagram of the structure of another display module provided in an embodiment of the present invention;

[0025] Figure 14 This is a schematic diagram of the structure of another display module provided in an embodiment of the present invention;

[0026] Figure 15 This is a bottom view diagram of a display module provided in an embodiment of the present invention;

[0027] Figure 16 This is a schematic diagram of the structure of another display module provided in an embodiment of the present invention;

[0028] Figure 17 This is a schematic diagram of the structure of another display module provided in an embodiment of the present invention;

[0029] Figure 18 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0030] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0031] Figure 1 This is a schematic diagram of the structure of a display module in the prior art, such as... Figure 1As shown, the display module 001 includes a display functional layer 01, a support plate 02, and a sensor 03. The sensor 03 is bonded to the side of the support plate 02 opposite to the display functional layer 01 via a bonding assembly 04. However, since the sensor 03 is typically a glass-based sensor, when the display module 001 is subjected to impact, the bonding assembly 04 and the support plate 02 cannot provide sufficient cushioning, causing the sensor 03 to be damaged by the large impact force. This affects the reliability of the sensor 03, and consequently, the reliability and service life of the display module 001.

[0032] To address the aforementioned issues, this invention provides a display module comprising: a display functional layer; a first buffer layer including at least one buffer groove; and a sensor attached to a side of the light-emitting surface of the display functional layer away from the first buffer layer; the buffer groove being at least partially surrounding the sensor.

[0033] By adopting the above technical solution, the sensor is attached to the side of the display functional layer away from the light-emitting surface via the first buffer layer. When subjected to external impact, the first buffer layer deforms under stress, thus buffering the stress and reducing the stress acting on the sensor. Simultaneously, at least one buffer groove is provided in the first buffer layer so that when the display module is subjected to external impact, the first buffer layer deforms under stress. Due to the presence of the buffer groove, other parts of the first buffer layer deform towards the location of the buffer groove, making the buffer groove a stress release point. Therefore, by having the buffer groove at least partially surround the sensor, the stress at the point where the sensor is attached to the first buffer layer can be released to the location of the buffer groove, thereby reducing the stress at the point where the sensor is attached to the first buffer layer. This reduces the impact on the sensor, preventing damage to the sensor from large external impacts, improving the sensor's reliability, and consequently improving the reliability of the display module and extending its service life.

[0034] The above is the core idea of ​​this invention. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this invention. The technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0035] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. Figure 3 This is a bottom view structural diagram of a display module provided in an embodiment of the present invention, in conjunction with reference to the reference. Figure 2 and Figure 3As shown, the display module 100 provided in this embodiment of the invention includes a display functional layer 10, a first buffer layer 20 and a sensor 30; the first buffer layer 20 includes at least one buffer groove 21; the sensor 30 is attached to the side of the light-emitting surface away from the display functional layer 10 through the first buffer layer 20; the buffer groove 21 is at least partially arranged around the sensor 30.

[0036] Figure 4 This is a schematic diagram of the structure of a display functional layer provided in an embodiment of the present invention, such as... Figure 4 As shown, the display functional layer 10 includes a display panel 102. Specifically, the display panel may include a substrate 1021, a driving circuit layer 1022 located on one side of the substrate 1021, and a light-emitting element 1023 located on the side of the driving circuit layer 1022 facing away from the substrate 1021. In this case, the side of the light-emitting element 1023 facing away from the substrate 1021 is the light-emitting surface side of the display functional layer 10. The light-emitting element 1023 may include one of OLED, micro-LED, and mini-LED. Figure 4 This example illustrates a case where the light-emitting element 1023 is an OLED; the driving circuit layer 1022 may include a driving circuit S, which is electrically connected to the light-emitting element 1023 and is capable of driving the light-emitting element 1023 to emit light. It should be noted that... Figure 4 The diagram only exemplifies the structure of the driving circuit S represented by a single transistor. In this embodiment, the driving circuit S may include active and passive devices. Active devices include transistors, and passive devices include capacitors and resistors. This embodiment does not specifically limit the specific devices. The substrate 1021 may be a rigid substrate or a flexible substrate. A rigid substrate may include rigid substrates such as glass or ceramics. A flexible substrate may include flexible film layers such as polyethylene phthalate (PET) film, polyethylene naphthalate (PEN) film, polyimide (PI) film, and ultra-thin glass film. When the substrate 1021 is a flexible substrate, the display functional layer 10 may be a flexible display functional layer, which can realize the bending and rolling of the display module.

[0037] Understandable, Figure 4 The accompanying drawings are merely exemplary embodiments of the present invention. Figure 4 The structure of the display function layer is illustrated in the example. However, in the embodiments of the present invention, the structure of the display function layer is not limited thereto. Provided that the core inventive points of the embodiments of the present invention can be achieved, the embodiments of the present invention do not specifically limit the structure of the display function layer.

[0038] Continue to refer to Figure 2The sensor 30 may include, but is not limited to, a fingerprint sensor, an image acquisition sensor, a temperature detection sensor, etc. The sensor 30 can receive sensor control signals provided by the system motherboard, and can also send sensor identification signals to the system motherboard, thereby realizing functions such as fingerprint recognition, image acquisition, and temperature detection. At this time, the sensor 30 needs to be connected to the system motherboard. In this embodiment, the sensor 30 can be bound to the system motherboard through a flexible printed circuit board 31 (FPC). The FPC can be set at the position of the sensor 30 near the lower edge of the display module, or it can be set at the position of the sensor 30 near the side edge of the display module. This embodiment does not make any special limitation on this.

[0039] When sensor 30 is a fingerprint sensor, it may include, but is not limited to, ultrasonic fingerprint sensors, optical fingerprint sensors, etc. If sensor 30 is an ultrasonic fingerprint sensor, when a finger is pressed in the sensing area of ​​sensor 30, the ultrasonic waves emitted by sensor 30 pass through the first buffer layer 20 and the display function layer 10, are reflected by the finger, and then pass through the display function layer 10 and the first buffer layer 20 in sequence, and are finally received by sensor 30. Sensor 30 converts the received ultrasonic signal into an electrical signal and transmits it to the system motherboard through FPC. The system motherboard then processes and analyzes the signal to determine whether it is a specific fingerprint. Similarly, when sensor 30 is an optical sensor, the light signal reflected by the finger will also propagate through the display function layer 10 and the first buffer layer 20 to the location of sensor 30, be received by sensor 30, be converted into an electrical signal by sensor 30, and then be transmitted to the system motherboard through FPC.

[0040] Continue to refer to Figure 2 As shown, the sensor 30 is attached to the side of the display functional layer 10 away from the light-emitting surface via the first buffer layer 20. At this time, adhesive layers can be provided on both sides of the first buffer layer 20, with one adhesive layer attached to the side of the display functional layer 10 away from the light-emitting surface, and the other adhesive layer attached to the sensor 30. The first buffer layer 20 can deform and release stress when subjected to external impact, thereby buffering the external impact. The first buffer layer 20 can include any film layer with buffering function. Provided that the first buffer layer 20 can play a buffering role, this embodiment of the invention does not limit the specific film layer included in the first buffer layer 20.

[0041] In an optional embodiment, the elongation at break of the first buffer layer is greater than 10%. The elongation at break of the first buffer layer 20 is the percentage of its elongation relative to its original length when it breaks under external force. By limiting the elongation at break of the first buffer layer 20 to greater than 10%, the first buffer layer 20 has a sufficiently large deformation capacity, thus providing sufficient buffering capacity when the display module is subjected to external impact, thereby preventing damage to the sensor 30 from the impact.

[0042] In other alternative embodiments, the first buffer layer 20 not only has a cushioning function but should also have a certain degree of rigidity to provide sufficient support for the contact sensor 30. For example, the elastic modulus of the first buffer layer 20 is greater than 1 g / cm³, and / or the density of the first buffer layer 20 is greater than 1.5 g / cm³. 3 The elastic modulus of the first buffer layer 20 is the proportionality coefficient between the stress and strain experienced by the first buffer layer 20 during the elastic deformation stage. The larger the elastic modulus of the first buffer layer 20, the greater the stress required for the first buffer layer 20 to undergo a certain elastic deformation, that is, the greater the stiffness of the first buffer layer 20. Therefore, by limiting the elastic modulus of the first buffer layer 20 to be greater than 1g / cm3, the first buffer layer 20 can have sufficiently high hardness, thereby enabling the first buffer layer 20 to provide sufficient support for the sensor. Correspondingly, by limiting the density of the first buffer layer 20 to be greater than 1.5g / cm3, the first buffer layer 20 per unit volume can provide sufficient support.

[0043] Continue to refer to Figure 2 The first buffer layer 20 is further provided with at least one buffer groove 21. When the first buffer layer 20 is deformed under stress, the first buffer layer 20 at the location of the buffer groove 21 has a smaller thickness, which allows the surrounding first buffer layer 20 to deform towards the buffer groove 21. That is, the surrounding first buffer layer 20 compresses the buffer groove 21, causing the buffer groove 21 to undergo a larger deformation. In other words, the buffer groove 21 can collect the stress at the location of the surrounding first buffer layer 20, thus making the buffer groove 21 a stress relief point for the surrounding first buffer layer 20. Since the buffer groove 21 is at least partially arranged around the sensor 30, it can serve as a stress relief point at the location where the sensor 30 is in contact with the first buffer layer 20, thereby reducing the stress on the sensor 30 at the location where the sensor 30 is in contact with the first buffer layer 20, thus reducing the stress on the sensor 30 and preventing the sensor 30 from being damaged due to excessive stress, which would affect the use of the sensor 30.

[0044] In this embodiment, by attaching the sensor to the side of the display functional layer opposite to the light-emitting surface via the first buffer layer, the first buffer layer deforms under stress when subjected to external impact, thus providing stress buffering and reducing the stress acting on the sensor. Simultaneously, at least one buffer groove is provided in the first buffer layer so that when the display module is subjected to external impact, the first buffer layer deforms under stress. Due to the presence of the buffer groove, other locations on the first buffer layer deform towards the location of the buffer groove, allowing the buffer groove to act as a stress release point. Therefore, by having the buffer groove at least partially surround the sensor, the stress at the point where the sensor is attached to the first buffer layer can be released to the location of the buffer groove, thereby reducing the stress at the point where the sensor is attached to the first buffer layer. This reduces the impact on the sensor, preventing damage to the sensor from large external impacts, improving the sensor's reliability, and consequently improving the reliability of the display module and extending its service life.

[0045] In an alternative embodiment, reference continues. Figure 2 In the cross-sectional structural diagram of the display module, the cross-section of the buffer groove 21 can be rectangular, and in this case, the shape of the buffer groove 21 can be a cuboid. In other optional embodiments, in the cross-sectional structural diagram of the display module, the cross-section of the buffer groove 21 can also be other regular or irregular shapes, and the embodiments of the present invention do not specifically limit this. For example, Figure 5 As shown, the cross-section of the buffer groove 21 can also be semi-circular, in which case the shape of the buffer groove 21 can be hemispherical; or, as shown... Figure 6 As shown, the cross-section of the buffer groove 21 can also be triangular. In this case, the shape of the buffer groove 21 can be conical or rhomboid, etc. Provided that the inventive points of this embodiment can be achieved, this embodiment does not specifically limit the shape of the buffer groove 21. For ease of description, this embodiment uses a rectangular buffer groove 21 as an example for illustrative purposes.

[0046] It is understood that the buffer groove 21 provided in the first buffer layer 20 can be located on the surface of the first buffer layer 20 near the display function layer 10, or it can be located on the surface of the first buffer layer 20 near the sensor 30. Provided that the buffer groove 21 can achieve stress relief, the embodiment of the present invention does not limit the location of the buffer groove. Specifically, when the buffer groove 21 is located on the surface of the first buffer layer 20 near the sensor 30, it facilitates stress relief on the side of the first buffer layer 20 near the sensor 30, thereby providing good protection for the sensor 30.

[0047] For ease of description, in the embodiments of the present invention, the buffer groove 21 is located on the surface of the first buffer layer 20 close to the sensor 30 as an example to illustrate the technical solutions of the embodiments of the present invention by way of example.

[0048] In an optional embodiment, the thickness of the first buffer layer 20 is T; the value range of the depth H of the buffer groove 21 in the thickness direction of the display module is: 0 μm < H < 80%T.

[0049] Specifically, the greater the depth of the buffer groove 21 in the thickness direction of the display module, the stronger the deformation ability generated by extrusion per unit area, and the better the buffering effect; correspondingly, the smaller the thickness of the first buffer layer 20 at the position of the buffer groove 21, the smaller the supporting effect of the first buffer layer 20. By setting the value range of the depth H of the buffer groove 21 in the thickness direction of the display module to be 0 μm < H < 80%T, while the first buffer layer 20 has sufficient buffering effect, it also has a certain supporting effect, meeting the dual functions of supporting and stress release of the first buffer layer 20 at the buffer groove 21.

[0050] It can be understood that in the embodiments of the present invention, at least one buffer groove 21 is provided in the first buffer layer 20, that is, the first buffer layer 20 may include one buffer groove 21, or may include two or more buffer grooves 21; when the first buffer layer 20 includes one buffer groove 21, the buffer groove 21 may be provided on one side of the sensor 30, or may partially or completely surround the sensor 30; when the first buffer layer 20 includes multiple buffer grooves 21, each buffer groove 21 may be respectively provided on different sides of the sensor 30 to partially or completely surround the sensor 30. Exemplarily, as Figure 3 shown, the first buffer layer 20 includes three buffer grooves 21, and each buffer groove 21 is respectively provided on different sides of the sensor 30 to surround the sensor 30.

[0051] Optionally, Figure 7 is a schematic structural diagram of another display module provided by the embodiments of the present invention, as Figure 7As shown, when the display module 100 is a flexible display module, the display module 100 may include a non-bending area 020 and a bending area 010. In this case, the buffer groove 21 and the sensor 30 may both be located in the non-bending area 020. The buffer groove 21 includes at least one first groove 211 and at least one second groove 212. The first groove 211 is located on the side of the sensor 30 closer to the bending area 010, and the second groove 212 is located on the side of the sensor 30 away from the bending area 010. Thus, the first groove 211 can release stress between the first groove 211 and the second groove 212, and on the side of the first groove 211 closer to the bending area 010; the second groove 212 can release stress between the first groove 211 and the second groove 212, and on the side of the second groove 212 away from the bending area 010.

[0052] It is understandable that when the display module is bent, its bending area 010 will be in a bent arc shape. When the bending area 010 bends, it will pull on the film layers of the display module in its non-bending area 020. Because the bending area 010 is bent, the direction of the force on each film layer of the display module is from the non-bending area 020 to the bending area 010, i.e., the first direction. The non-bending area 020 that is closer to the bending area 010 will experience greater stress. At this time, by changing the shape and / or size of the first groove 211, the first groove 211 can have a higher stress release capability.

[0053] In an alternative embodiment, Figure 8 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 9 This is a bottom-view structural diagram of another display module provided in an embodiment of the present invention. (Referring to the reference...) Figure 8 and Figure 9 As shown, the area of ​​the first groove 211 is larger than the area of ​​the second groove 212.

[0054] Specifically, the larger the area of ​​the buffer groove 21, the larger its stress-bearing surface, making it more capable of withstanding stress deformation and thus releasing more stress. Since the area closer to the bending zone 010 experiences greater stress when the display module bends, by setting the area of ​​the first groove 211 to be larger than the area of ​​the second groove 212, the first groove 211 can release more stress. This balances the stress on the sensor 30 relative to its sides when the display module bends, further protecting the sensor 30.

[0055] In another alternative embodiment, Figure 10 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 11 This is a bottom view structural diagram of another display module provided in an embodiment of the present invention, in conjunction with reference to the reference. Figure 10 and Figure 11 As shown, the number of first grooves 211 is greater than the number of second grooves 212.

[0056] Specifically, since each first groove 211 can serve as a stress relief point, when there are a large number of first grooves 211, the sensor 30 can have a relatively large number of stress relief points on the side near the bending area 010. Thus, when the display module 100 bends, the stress on the sensor 30 relative to both sides can be balanced, providing good protection for the sensor 30.

[0057] Wherein, when the number of first grooves 211 is greater than the number of second grooves 212, the size of each first groove 211 in the first direction can be greater than or equal to the size of the second groove 212 in the first direction, and the first grooves 211 are arranged sequentially along the first direction; the first direction is the arrangement direction of the non-bending area 020 and the bending area 010.

[0058] Specifically, the size of each first groove 211 in the first direction can be greater than or equal to the size of the second groove 212 in the first direction. In this way, the total area of ​​each first groove 211 can be greater than the total area of ​​the second groove 212, so that the first groove 211 can release more stress. This can balance the stress on both sides of the sensor 30 when the display module is bent, thereby further protecting the sensor 30.

[0059] In yet another alternative embodiment, Figure 12 This is a schematic diagram of another display module provided in an embodiment of the present invention, with reference to... Figure 12 As shown, the depth H1 of the first groove 211 in the thickness direction of the display module is greater than the depth H2 of the second groove 212 in the thickness direction of the display module.

[0060] It is understandable that when the size of the buffer groove 21 is the same, the greater its depth, the greater its deformation capacity, allowing it to release more stress. Therefore, by limiting the depth H1 of the first groove 211 in the thickness direction of the display module to be greater than the depth H2 of the second groove 212 in the thickness direction of the display module, the first groove 211 can release more stress. This balances the stress on both sides of the sensor 30 when the display module bends, thus protecting the sensor 30.

[0061] It is understood that the above description only exemplarily illustrates the shape and size of the buffer groove, and the embodiment of the present invention does not specifically limit the shape and size of the buffer groove, provided that the core inventive points of the embodiment of the present invention can be achieved. For ease of description, the following uses the example of providing the same number of buffer grooves on opposite sides of the sensor to illustrate the technical solution of the embodiment of the present invention.

[0062] Optional, Figure 13 This is a schematic diagram of another display module provided in an embodiment of the present invention, with reference to... Figure 13 As shown, based on the above embodiment, the display module 100 also includes a support plate 40, which is located on the side of the first buffer layer 20 away from the display functional layer 10; the support plate 40 includes a sensor opening 41; and the sensor 30 is located inside the sensor opening 41.

[0063] The support plate 40 can be any material with a supporting function, that is, the support plate 40 can have a large rigidity. For example, the support plate 40 can include materials such as metal or hard organic materials. When the support plate 40 is made of metal, the metal material includes, but is not limited to, stainless steel (SUS); when the support plate 40 is made of hard organic material, the hard organic material includes, but is not limited to, polyethylene terephthalate (PET). The support plate 40 is located on the side of the first buffer layer 20 away from the display function layer 10 and is used to support and fix the display module.

[0064] It is understandable that, such as Figure 1 In the prior art shown, sensor 03 is directly attached to the side of support plate 02 away from display functional layer 03 via bonding component 04, so that the thickness of display module 001 is at least the sum of the thickness of sensor 03, bonding component 04, support plate 02, and display functional layer 01. In this case, sensor 03 protrudes from the side of support plate 02 away from display functional layer 01, resulting in a large thickness of display module. At the same time, when sensor 03 is an acoustic sensor, the ultrasonic waves emitted by the acoustic sensor will inevitably cause acoustic wave loss when propagating in display module. The more film layers the ultrasonic waves pass through, the more severe the acoustic wave loss, affecting the detection accuracy and sensitivity of sensor 03. Similarly, when sensor 03 is an optical sensor, when light signal propagates between film layers, light signal loss will also occur because the light transmittance of each film layer is not 100%, thus affecting the detection accuracy and sensitivity of sensor 03.

[0065] like Figure 13As shown, in the embodiment of the present invention, the support plate 40 is provided with a sensor opening 41, and the sensor 30 is disposed in the sensor opening 41, so that the sensor 30 does not protrude entirely from the side of the support plate 40 facing away from the display functional layer 10, thereby reducing the overall thickness of the display module and facilitating the thinning of the display module. At the same time, since the sensor 30 directly adheres to the first buffer layer between the support plate 40 and the display functional layer 10 across the support plate 40, the sensing signal (such as an ultrasonic signal or an optical signal) of the sensor 30 does not need to pass through the support plate 40, thus reducing the loss of the sensing signal during propagation and further facilitating the improvement of the detection sensitivity and accuracy of the sensor.

[0066] Optionally, continue to refer to Figure 13 As shown, the thickness T of the first buffer layer 20 is less than the thickness T' of the support plate 40.

[0067] Specifically, the support plate 40 is used to support and fix other film layers of the display module. The support plate 40 usually needs to have a large supporting effect, so the support plate 40 is usually set to have a relatively thick thickness; while the function of the first buffer layer 20 is buffering and stress release. At this time, on the premise that the first buffer layer 20 has sufficient buffering and stress release capabilities, the thickness of the first buffer layer 20 can be minimized as much as possible to make the thickness of the display module small enough, which is beneficial to the thinning of the display module. At the same time, since the sensor 30 directly adheres to the first buffer layer between the support plate 40 and the display functional layer 10 across the support plate 40, the sensing signal of the sensor 30 needs to pass through the first buffer layer 20 instead of passing through the support plate 40. Therefore, by setting the thickness of the first buffer layer 20 to be small, it is beneficial to reduce the signal loss and further improve the detection sensitivity and accuracy of the sensor.

[0068] In an optional embodiment, continue to refer to [[ID=I2]] Figure 13 As shown, the value range of the thickness T of the first buffer layer 20 is: 0μm < T < 20μm.

[0069] Among them, the greater the thickness T of the first buffer layer 20, the stronger its stress dispersion ability, and thus it can have a higher buffering effect. However, when the thickness T of the first buffer layer 20 increases infinitely, the thickness of the display module will also increase accordingly, which is not conducive to the thinning of the display module. Therefore, on the premise of meeting the buffering effect, the thickness T of the first buffer layer 20 should be small enough. By setting the value range of the thickness T of the first buffer layer 20 to be 0μm < T < 20μm, on the one hand, the first buffer layer 20 can have sufficient buffering effect, and on the other hand, the thickness of the display module can be small enough, which is beneficial to the thinning of the display module.

[0070] Optionally, continue to refer to Figure 13There is a gap 42 between the sensor 30 and the sidewall of the sensor opening 41; the size of the gap 42 is greater than 0 μm.

[0071] Specifically, the assembly sequence of the sensor 30 and the support plate 40 in the display module 100 can be as follows: first, the support plate 40 is placed on the side of the first buffer layer 20 away from the display functional layer, and then the sensor 30 is inserted through the sensor opening 41 and attached to the first buffer layer 10. At this time, there is a gap 42 between the sensor 30 and the side wall of the sensor opening 41, so that the size of the sensor opening 41 is larger than the size of the sensor 30. When the sensor 30 is inserted through the sensor opening 41 and attached to the first buffer layer 10, the sensor opening 41 will not jam the sensor 30, thus facilitating the assembly of the sensor 30. Similarly, when the sensor 30 is attached to the first buffer layer 10 first, and then the support plate 40 is placed on the side of the first buffer layer 20 away from the display functional layer, the assembly of the support plate 40 is also facilitated because the size of the sensor opening 41 is larger than the size of the sensor 30. The larger the gap 42 between the sensor 30 and the side wall of the sensor opening 41, the greater the size difference between the size of the sensor opening 41 and the size of the sensor 30, the easier it is to assemble the sensor 30 and the support plate 40, which helps to improve the production efficiency of the display module.

[0072] Optional, Figure 14 This is a schematic diagram of another display module provided in an embodiment of the present invention, with reference to... Figure 14 As shown, based on the above embodiment, the display module further includes a sealant 50, which fills at least a portion of the gap 42.

[0073] It is understood that at least some gaps 42 are filled with sealant 50, that is, all gaps 42 are filled with sealant 50, or only some gaps 42 are filled with sealant 50. This embodiment of the invention does not specifically limit this. The sealant 50 can be, but is not limited to, polyurethane adhesive, silicone adhesive, epoxy resin adhesive, etc. After the fluid adhesive is filled into the gap 42 between the sidewall of the sensor opening 41 and the sensor 30, the adhesive can be cured at room temperature or under heating conditions to form sealant 50.

[0074] In this embodiment, by filling the gap 42 with sealant 50, after the sensor 30 and support plate 40 are bonded to the first buffer layer 20, the sealant 50 can seal and fix the sensor 30. The sealing function is mainly manifested in that the sealant 50 has a certain effect of blocking water and oxygen, thereby preventing the sensor 30 from being easily damaged by water vapor and oxygen corrosion; the fixing function is mainly manifested in that after the sealant 50 fills the gap 42, it can lock the sensor 30 into the sensor opening 41, thereby fixing the sensor 30 in the sensor opening 41 and preventing the sensor 30 from shaking during transportation and use, which would affect the signal transmission; in addition, since the sealant 50 is elastic, when subjected to external impact, the sealant 50 can also act as a stress relief part, protecting the sensor 30 from external impact and preventing damage to the sensor 30.

[0075] In an alternative embodiment, Figure 15 This is a bottom view structural diagram of a display module provided in an embodiment of the present invention, with reference to... Figure 15 As shown, when the gap 42 surrounds the sensor 30, that is, there is a gap between the sensor 30 and the sensor opening, if the flexible printed circuit board 31 (FPC) connecting the sensor 30 and the system motherboard extends towards one side of the display module, then no sealant needs to be provided in the gap 42 spanned by the FPC, to prevent the presence of sealant from causing the FPC to bulge and bend at the overlapping position of the gap 42. In other embodiments, all gaps 42 can also be filled with sealant 50. In this case, it is necessary to ensure that the height of the sealant 50 on the side where the sensor 30 is mounted on the FPC is less than or equal to the depth of the gap 42, so as to prevent bending near the position where the FPC is bound to the sensor 30, which could easily damage the internal circuitry of the FPC.

[0076] Optional, Figure 16 This is a schematic diagram of another display module provided in an embodiment of the present invention, in conjunction with reference to the reference. Figure 15 and 16 As shown, when the display module 100 is a flexible display module and the display module 100 includes a bending area 010 and a non-bending area 020, the sensor opening 41 can be located in the non-bending area 020; at this time, the width of the sealant 50 on the side of the sensor 30 near the bending area 010 in the first direction is W1; the width of the sealant 50 on the side of the sensor 30 away from the bending area 010 in the first direction is W2; the first direction is the arrangement direction of the non-bending area 020 and the bending area 010; wherein, W1>W2.

[0077] When the display module is a flexible display module, its non-bending area 020 can remain flat, while the bending area 010 usually deforms into a bent arc shape, so that the stress on each film layer of the display module 100 is greater closer to the bending apex of the bending area 010.

[0078] Specifically, when the sensor opening 41 is located in the non-bending area 020, both the sensor 30 and the sealant 50 filling the gap 42 are located in the non-bending area 020. Since the area closer to the bending area 010 experiences greater stress when the display module bends, by setting the width W1 of the sealant 50 on the side of the sensor 30 near the bending area 010 in the first direction to be greater than the width of the sealant 50 on the side of the sensor 30 away from the bending area 010 in the first direction, the sealant 50 on the side of the sensor 30 near the bending area 010 can be dispersed in the first direction, achieving stress relief. This prevents the sealant 50 from losing its sealing and fixing effect due to excessive stress, thus affecting the reliability of the sensor 30 and further protecting the sensor 30, thereby improving its reliability.

[0079] Understandably, in addition to providing the basic structure for display light emission, the display functional layer of a display module may also include an underlayer for support. Furthermore, the display functional layer may also include a buffer layer to provide buffering and stress relief, preventing damage to the display devices within the display functional layer from external impacts.

[0080] Optional, Figure 17 This is a schematic diagram of another display module provided in an embodiment of the present invention, with reference to... Figure 17 As shown, when the sensor 30 includes an ultrasonic sensor, the sensor 30 may include a substrate, and the substrate is bonded to the first buffer layer 20; the display functional layer 10 includes a second buffer layer 104; the first buffer layer 20 is bonded to the second buffer layer 104; the acoustic impedance of the substrate is K1, the acoustic impedance of the first buffer layer 20 is K2, and the acoustic impedance of the second buffer layer is K3; wherein,

[0081] The second buffer layer 104 may include, but is not limited to, foam, for its cushioning and shock absorption function. The substrate of the sensor 30 is typically a substrate or encapsulation substrate for fabricating other structures in the sensor 30, and may include, but is not limited to, a glass substrate.

[0082] Specifically, the substrate of sensor 30 is bonded to the first buffer layer 20, and the first buffer layer 20 is bonded to the second buffer layer. The acoustic impedance K1 of the substrate, the acoustic impedance K2 of the first buffer layer 20, and the acoustic impedance K3 of the second buffer layer satisfy the following relationship: Thus, the acoustic impedance K1 of the substrate, the acoustic impedance K2 of the first buffer layer 20, and the acoustic impedance K3 of the second buffer layer can be mutually matched, thereby reducing the acoustic wave loss when ultrasonic waves propagate at the interfaces between layers, which is beneficial to improving the detection sensitivity and accuracy of the sensor.

[0083] In an exemplary embodiment, the acoustic impedance K1 of the substrate, the acoustic impedance K2 of the first buffer layer 20, and the acoustic impedance K3 of the second buffer layer may satisfy: K1 < K2 < K3, so that when acoustic waves propagate in each film layer, the transducer requirements can be met, thereby further reducing the loss amount when ultrasonic waves propagate at the interfaces of each film layer, which is beneficial to further improving the sensitivity and accuracy of acoustic wave recognition.

[0084] It should be noted that, in addition to the above structure, the display function layer 10 may further include a cover plate assembly 101, a display panel 102, a lower film 103, etc.; the cover plate assembly 101 is located on the light-emitting surface side of the display panel 102, mainly for protecting the display panel 102 and preventing the display module 100 from being damaged by an external impact force to the display device in the display panel 102. The display panel is used for displaying light, and it can be a flexible display panel or an ordinary display panel. The lower film 103 is located on one side of the substrate of the display panel 102 and is used for supporting the display panel 102.

[0085] Based on the same inventive concept, the embodiments of the present invention further provide a display device, and this display device includes the display panel 100 provided by the embodiments of the present invention. Therefore, this display device has the technical features of the display panel provided by the embodiments of the present invention and can achieve the beneficial effects of the display panel provided by the embodiments of the present invention. The same parts can refer to the description of the display panel provided by the embodiments of the present invention above and will not be elaborated here.

[0086] Exemplarily, Figure 18 is a schematic structural diagram of a display device provided by an embodiment of the present invention. As Figure 18 shown, this display device 200 includes the display module 100 provided by the embodiments of the present invention. The display device 200 provided by the embodiments of the present invention includes but is not limited to the following categories: mobile phones, laptop computers, desktop monitors, tablet computers, wearable display devices, etc., and the embodiments of the present invention do not make special limitations thereto.

[0087] It should be understood that various forms of the processes shown above can be used, reordering, adding or deleting steps. For example, the steps described in the present invention can be executed in parallel, sequentially, or in different orders, as long as the desired results of the technical solutions of the present invention can be achieved, and no limitations will be made herein.

[0088] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display module, characterized in that, include: Display functional layer; The first buffer layer includes at least one buffer groove; The sensor is attached to the side of the light-emitting surface that is away from the display functional layer through the first buffer layer; the buffer groove is at least partially arranged around the sensor, so that the buffer groove serves as a stress release point, releasing the stress on the sensor at the attachment position with the first buffer layer to the location of the buffer groove. The thickness of the first buffer layer is T, and the depth H of the buffer groove in the thickness direction of the display module satisfies: 0 μm. <H<80%T。 2. The display module according to claim 1, characterized in that, Also includes: A support plate is located on the side of the first buffer layer opposite to the display functional layer; the support plate includes a sensor opening; the sensor is located within the sensor opening.

3. The display module according to claim 2, characterized in that, There is a gap between the sensor and the sidewall of the sensor opening; the gap size is greater than 0 μm.

4. The display module according to claim 3, characterized in that, Also includes: Sealant is applied to fill at least a portion of the gap.

5. The display module according to claim 4, characterized in that, Also includes: The sensor opening is located in the non-bending area, with a bent area and a non-bending area. The width of the sealant located on the side of the sensor near the bending area in the first direction is W1; The width of the sealant located on the side of the sensor away from the bending area in the first direction is W2; the first direction is the arrangement direction of the non-bending area and the bending area; wherein, W1>W2.

6. The display module according to claim 2, characterized in that, The thickness of the first buffer layer is less than the thickness of the support plate.

7. The display module according to claim 2, characterized in that, The sensor includes an ultrasonic sensor; The sensor includes a substrate; the substrate is bonded to the first buffer layer; the display functional layer includes a second buffer layer; the first buffer layer and the second buffer layer are bonded together. The acoustic impedance of the substrate is K1, the acoustic impedance of the first buffer layer is K2, and the acoustic impedance of the second buffer layer is K3; wherein, K2 = .

8. The display module according to claim 7, characterized in that, K1 <K2<K3。 9. The display module according to claim 1, characterized in that, The thickness T of the first buffer layer ranges from 0 μm. <T<20μm。 10. The display module according to claim 1, characterized in that, The elongation after fracture of the first buffer layer is greater than 10%.

11. The display module according to claim 1, characterized in that, The elastic modulus of the first buffer layer is greater than 1GP.

12. The display module according to claim 1, characterized in that, The density of the first buffer layer is greater than 1.5 g / cm3.

13. The display module according to claim 1, characterized in that, The buffer groove is located on the side surface of the first buffer layer closest to the sensor.

14. The display module according to claim 1, characterized in that, include: Non-bending area and bending area; the buffer groove and the sensor are both located in the non-bending area; The buffer groove includes at least one first groove and at least one second groove; The first groove is located on the side of the sensor closer to the bending area, and the second groove is located on the side of the sensor away from the bending area.

15. The display module according to claim 14, characterized in that, The area of ​​the first groove is greater than the area of ​​the second groove.

16. The display module according to claim 14, characterized in that, The number of the first grooves is greater than the number of the second grooves.

17. The display module according to claim 16, characterized in that, The dimension of each of the first grooves in the first direction is greater than or equal to the dimension of the second groove in the first direction; Each of the first grooves is arranged sequentially along the first direction; The first direction is the arrangement direction of the non-bending area and the bending area.

18. The display module according to claim 14, characterized in that, The depth of the first groove in the thickness direction of the display module is greater than the depth of the second groove in the thickness direction of the display module.

19. A display device, characterized in that, include: The display module according to any one of claims 1-18.

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