Display panel and manufacturing method thereof, and display device

Abstract

The present application provides a display panel and a method for preparing the same, and a display device. The display panel includes a display substrate, and the display substrate includes a first surface and a second surface disposed opposite to each other, and a side surface; the second surface is used to connect to a backlight source through a connecting layer, and the side surface is covered with a light-shielding adhesive, and a chamfer is provided at the junction of the second surface and the side surface, and the orthographic projection of the chamfer on the backlight source is located within the orthographic projection of the connecting layer on the backlight source, and the chamfer is configured to allow light inside the display substrate to be projected from the chamfered surface to the connecting layer, and is used to allow the light-shielding adhesive to overflow onto the chamfered surface. The present application solves the problem that the narrow frame design of the existing display device cannot simultaneously meet the requirements of no light leakage from the side and no overflow of the black glue to the back of the display substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] With the development of display technology, the frame design of display devices has gradually developed towards the trend of narrow frame. At present, the mainstream design to achieve narrow frame is to super-stick the upper polarizer of the display substrate and coat the side of the display substrate with black glue to replace the original backlight panel and the frame of the whole machine, so as to achieve the purpose of reducing the frame of the display device. However, when the black glue is actually applied to the side of the display substrate, considering the coating tolerance, there may be a certain proportion of the side of the lower substrate that cannot be completely covered with black glue for light shielding, so that part of the light emitted by the backlight source is totally reflected inside the lower substrate and then emitted from the side of the lower substrate, resulting in light leakage from the side of the display device; if it is to be ensured that the side of the display substrate is completely covered with black glue, then the black glue may overflow to the back of the display substrate and affect the assembly of the whole machine. Summary of the invention

[0003] The embodiments of the present application provide a display panel and a method for preparing the same, and a display device. By setting a chamfer at the junction of the second surface and the side of the display substrate, light inside the display substrate is emitted from the chamfered surface to the connecting layer, and at the same time, the light-shielding glue can overflow to the chamfered surface, thereby solving the problem that the narrow frame design of the existing display device cannot simultaneously meet the requirements of preventing light leakage from the side and preventing the black glue from overflowing to the back of the display substrate.

[0004] The present invention is implemented as follows: a display panel includes a display substrate, the display substrate includes a first surface and a second surface arranged back to back, and a side surface connected between the first surface and the second surface; the second surface is used to connect to a backlight source through a connecting layer, the side surface is covered with a light-shielding glue, a chamfer is provided at the junction of the second surface and the side surface, and the orthographic projection of the chamfer on the backlight source is located within the orthographic projection of the connecting layer on the backlight source, the chamfer is configured to allow light inside the display substrate to be projected from the chamfered surface to the connecting layer, and is used to allow the light-shielding glue to overflow onto the chamfered surface.

[0005] In one embodiment, the display substrate includes a first substrate and a second substrate arranged in a box, and the chamfer is located on the second substrate; along the thickness direction of the second substrate, the height of the chamfer is less than or equal to half of the thickness of the second substrate.

[0006] In one of the embodiments, an angle formed between the chamfered surface and a surface of the connection layer close to the second substrate is 30°-60°.

[0007] In one of the embodiments, along the thickness direction of the second substrate, the height of the chamfer is greater than or equal to the height of a portion of the light-shielding glue overflowing from the side surface.

[0008] In one embodiment, the chamfered surface is a plane.

[0009] In one embodiment, the chamfered surface is an arc surface convex in a direction away from the second substrate.

[0010] In one of the embodiments, in the thickness direction of the second substrate, the edge of the connection layer is flush with the side surface.

[0011] In one of the embodiments, the edge of the connecting layer protrudes from the side surface.

[0012] In one embodiment, the connecting layer is black foam adhesive, and the black foam adhesive is used to absorb light.

[0013] In one of the embodiments, a groove is provided on a surface of the connecting layer on a side away from the backlight source at a position opposite to the chamfer, and the groove includes a reflective surface configured to reflect light emitted from the chamfered surface to the connecting layer to the display substrate.

[0014] The beneficial effect of the display panel provided by the present application is that: compared with the prior art, the present application sets a chamfer at the junction of the second surface and the side of the display substrate, and the orthographic projection of the chamfer on the backlight source is located within the orthographic projection of the connecting layer on the backlight source, and the chamfer is configured to allow the light inside the display substrate to be projected from the chamfered surface to the connecting layer, so that the light inside the display substrate will not leak out from the side of the display device; in addition, through the setting of the chamfer, the light-shielding glue set on the side of the display substrate can overflow onto the chamfered surface, thereby not overflowing to the back of the display substrate and not affecting the assembly of the whole machine.

[0015] The present application also provides a method for preparing a display panel, including:

[0016] Prepare a display substrate, wherein the display substrate comprises a first surface and a second surface disposed opposite to each other, and a side surface connected between the first surface and the second surface;

[0017] Setting a chamfer at the junction of the second surface and the side surface;

[0018] Applying light-shielding glue on the side surface, wherein the light-shielding glue overflows onto the chamfered surface;

[0019] The second surface is connected to the light emitting side of the backlight source through a connecting layer, so that the orthographic projection of the chamfer on the backlight source is located within the orthographic projection of the connecting layer on the backlight source.

[0020] The beneficial effect of the method for preparing the display panel provided by the present application is that: compared with the prior art, the present application sets a chamfer at the junction of the second surface and the side of the display substrate, and the orthographic projection of the chamfer on the backlight source is located within the orthographic projection of the connecting layer on the backlight source, and the chamfer is configured to allow the light inside the display substrate to be projected from the chamfered surface to the connecting layer, so that the light inside the display substrate will not leak out from the side of the display device; in addition, through the setting of the chamfer, the light-shielding glue set on the side of the display substrate can overflow onto the chamfered surface when it overflows, so as not to overflow to the back of the display substrate and not affect the assembly of the whole machine.

[0021] An embodiment of the present application also provides a display device, comprising a shell, a backlight source, and a display panel as described in any of the above embodiments, wherein the backlight source and the display panel are both arranged in the shell, and the second surface is connected to the light-emitting side of the backlight source through a connecting layer.

[0022] The beneficial effect of the display device provided by the present application is that: compared with the prior art, the present application sets a chamfer at the junction of the second surface and the side of the display substrate, and the orthographic projection of the chamfer on the backlight source is located within the orthographic projection of the connecting layer on the backlight source, and the chamfer is configured to allow the light inside the display substrate to be projected from the chamfered surface to the connecting layer, so that the light inside the display substrate will not leak out from the side of the display device; in addition, the setting of the chamfer can make the light-shielding glue set on the side of the display substrate overflow and overflow onto the chamfered surface, so as not to overflow to the back of the display substrate, and will not affect the assembly of the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of the structure of a display panel provided in Embodiment 1 of the present application;

[0024] Figure 2 yes Figure 1 The enlarged view of point I in the middle;

[0025] Figure 3 This is a schematic diagram of the structure in which the light shielding glue in the display panel provided in the first embodiment of the present application overflows onto the chamfered surface. Figure 1 ;

[0026] Figure 4 This is a schematic diagram of the structure in which the light shielding glue in the display panel provided in the first embodiment of the present application overflows onto the chamfered surface. Figure 2 ;

[0027] Figure 5 This is a structural schematic diagram of a connection layer in a display panel provided in Embodiment 1 of the present application;

[0028] Figure 6 yes Figure 5 The enlarged view of II in the middle;

[0029] Figure 7 is a schematic flow chart of a method for preparing a display panel provided in Embodiment 2 of the present application;

[0030] Figure 8 It is a schematic diagram of the process of preparing a display panel with a polarizer according to the method for preparing a display panel provided in Example 2 of the present application;

[0031] Fig. 9 It is a schematic diagram of the structure of the display device provided in Example 3 of the present application.

[0032] Reference numerals: 1, backlight source;

[0033] 2. Display substrate; 201. First surface; 202. Second surface; 203. Side surface; 21. First substrate; 22. Second substrate;

[0034] 3. The first polarizer; 4. The second polarizer;

[0035] 5. connecting layer; 51. groove; 510. reflecting surface;

[0036] 6. Shading glue; 7. Chamfering;

[0037] 100. Housing; 200. Display panel. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0040] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0042] It should also be noted that, in the embodiments of the present application, the same figure mark is used to represent the same component or the same part. For the same parts in the embodiments of the present application, the figure may only mark one of the parts or components as an example. It should be understood that the figure mark also applies to other identical parts or components.

[0043] The embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, which solve the problem that the narrow frame design of the existing display device cannot simultaneously meet the requirements of preventing light leakage from the side and preventing black glue from overflowing to the back of the display substrate.

[0044] Embodiment 1

[0045] refer to Figure 1 The display panel provided in the first embodiment of the present application includes a display substrate 2, and the display substrate 2 includes a first substrate 21 and a second substrate 22 arranged in a box. For example, in a liquid crystal display device, the first substrate 21 of the display substrate 2 can be a color film substrate, and the second substrate 22 can be an array substrate.

[0046] The display substrate 2 includes a first surface 201 and a second surface 202 which are arranged opposite to each other, and a side surface 203 connected between the first surface 201 and the second surface 202; wherein, a first polarizer 3 whose edge exceeds the edge of the first surface 201 may be arranged on the first surface 201, and a second polarizer 4 may be arranged on the second surface 202, and the second surface 202 is used to connect the backlight source 1 through the connecting layer 5. That is, the first substrate 21 is provided with a first polarizer 3 which exceeds the edge of the first substrate 21, and the second substrate 22 is provided with a second polarizer 4. Since the second substrate 22 is connected to the backlight source 1 through the connecting layer 5, the second polarizer 4 does not completely cover the second surface 202, but is arranged at the same layer and spaced apart from the connecting layer 5, so that the normal working performance of the second polarizer 4 can be guaranteed, and the second substrate 22 can be stably connected to the backlight source 1.

[0047] In order to achieve a narrow frame of the display device, the present application sets the first polarizer 3 to extend beyond the edge of the first substrate 21, and the side 203 of the display substrate 2 is covered with a light-shielding glue 6, which can replace the existing outer frame, and the light-shielding glue 6 can prevent the light in the display substrate 2 from being emitted from the side 203 and causing light leakage. The portion of the first polarizer 3 that extends beyond the first substrate 21 can also block a portion of the light emitted to the upper side, so that there is no light leakage when observed by the human eye. While achieving a narrow frame, the problem of light leakage on the side 203 is also solved.

[0048] In the embodiment of the present application, when the display panel is assembled, the display substrate 2, the first polarizer 3 and the second polarizer 4 are assembled first, and then the side 203 of the display substrate 2 is coated with the light shielding glue 6. Generally, the color of the light shielding glue 6 is black. Finally, the display substrate 2 and the backlight source 1 are assembled together through the connecting layer 5. In this process, since the light shielding glue 6 is coated on the side 203 and the light shielding glue 6 has a certain fluidity, the coating range of the light shielding glue 6 has a certain process fluctuation. The specific ways of coating the light shielding glue 6 are as follows: the light shielding glue 6 just covers the side 203 after coating; the light shielding glue 6 coating range is upper, and there is a part of the side 203 of the lower substrate that is not covered by the light shielding glue 6, and the light in the lower substrate will be emitted from this part, causing light leakage from the side 203; the light shielding glue 6 coating range is lower, and the light shielding glue 6 will overflow to the back of the lower substrate, that is, the second surface 202, so that when the backlight source 1 is connected, it will affect the flat assembly between the display substrate 2 and the backlight source 1, thereby affecting the assembly effect of the whole machine.

[0049] refer to Figure 1-Figure 2 In the first embodiment of the present application, a chamfer 7 is provided at the junction of the second surface 202 and the side surface 203, and the orthographic projection of the chamfer 7 on the backlight source 1 is located within the orthographic projection of the connecting layer 5 on the backlight source 1. The chamfer 7 is configured to allow light inside the display substrate 2 to be projected from the surface of the chamfer 7 to the connecting layer 5, and to allow the shading glue 6 to overflow onto the surface of the chamfer 7.

[0050] It should be noted that when the light inside the display substrate 2 is emitted from the surface of the chamfer 7 to the connection layer 5 , the connection layer 5 can absorb the light or reflect the light to the display substrate 2 .

[0051] By setting the chamfer 7, the surface of the chamfer 7 is inclined relative to the side 203, so that the light in the display substrate 2 emitted from the surface of the chamfer 7 will change the direction of the light path, so that the light is emitted to the side and downward, and in the present application, the orthographic projection of the chamfer 7 on the backlight source 1 is set to be located within the orthographic projection of the connecting layer 5 on the backlight source 1, so that the light emitted from the surface of the chamfer 7 can be irradiated on the connecting layer 5, thereby being absorbed by the connecting layer 5 or reflected back to the display substrate 2, so that no light will leak from the side 203. In addition, when the light-shielding glue 6 is coated on the side 203 of the display substrate 2, if the light-shielding glue 6 overflows, it will overflow onto the surface of the chamfer 7, which is equivalent to the chamfer 7 and the connecting layer 5 forming a space for accommodating the light-shielding glue 6 overflowing from the side 203, so that the light-shielding glue 6 can be prevented from overflowing to the back of the display substrate 2 and affecting the assembly effect of the whole machine.

[0052] It should be noted that the color of the light shielding glue 6 in the embodiment of the present application can be black, so that the light shielding glue 6 coated on the side 203 can better block the light inside the display substrate 2, and prevent the light inside the display substrate 2 from being emitted from the side 203 of the display substrate 2 and causing light leakage on the side of the display device. Specifically, the light shielding glue 6 is coated in the following manner: the first substrate 21 and the second substrate 22 are arranged on the box to form the display substrate 2, and on this basis, the display substrate 2 does not need to be moved, and the light shielding glue 6 can be directly coated on the side 203 of the display substrate 2 using a glue coating device.

[0053] In the embodiment of the present application, as long as the chamfer 7 can change the irradiation direction of the light in the display substrate 2 and can accommodate the light shielding glue 6 overflowing from the side 203, the specific shape of the chamfer 7 is not specifically limited in the embodiment of the present application.

[0054] In some embodiments, reference Figure 2 The surface of the chamfer 7 can be set as a plane. This can simplify the manufacturing steps of the chamfer 7 and make it easier to calculate the height of the chamfer 7 and the angle A formed between the surface of the chamfer 7 and the surface of the connecting layer 5 close to the second substrate 22.

[0055] Specifically, when making the chamfer 7, a cutting device is directly used to cut the junction between the second surface 202 and the side surface 203 of the display substrate 2 to form the chamfer 7. The entire manufacturing process is simple and fast, which is conducive to improving the manufacturing efficiency of the display device.

[0056] In some embodiments, the surface of the chamfer 7 may also be configured as an arc surface that bulges away from the second substrate 22. In this way, the surface of the chamfer 7 not only changes the emission direction of the light emitted from the display substrate 2, but also facilitates the light shielding glue 6 overflowing from the side 203 to flow more smoothly to the surface of the chamfer 7 without dripping onto the connection layer 5.

[0057] It should be noted that when the height and angle of the chamfer 7 are the same, compared with a plane surface of the chamfer 7, a circular arc surface of the chamfer 7 can make the flow path of the light-shielding glue 6 overflowing from the side 203 longer on the surface of the chamfer 7, which can further prevent the light-shielding glue 6 from flowing to the back of the second substrate 22.

[0058] In some embodiments, the chamfer 7 is located on the second substrate 22; along the thickness direction Z of the second substrate 22, the height of the chamfer 7 is less than or equal to half of the thickness of the second substrate 22. In this way, not only can the light path direction of the light emitted to the side 203 be changed to avoid light leakage caused by emitting from the side 203, but also the setting of the chamfer 7 will not affect the overall strength of the second substrate 22, thereby ensuring the overall strength performance of the display substrate 2.

[0059] It should be noted that when the display device is assembled, the second substrate 22 and the backlight source 1 are connected together through the connecting layer 5, that is, the second substrate 22 is closer to the backlight source 1 than the first substrate 21, so the intensity of the light in the second substrate 22 will also be stronger than the intensity of the light in the first substrate 21. When light leakage occurs in the display device, most of the light is leaked from the side 203 of the second substrate 22. Even if there is light leakage from the side 203 of the first substrate 21, the light is too weak to be perceived by the human eye. Therefore, the present application sets a chamfer 7 on the second substrate 22 to change the direction of the light path of the light in the second substrate 22 when it is irradiated to the side 203, so that the light in the second substrate 22 is irradiated from the surface of the chamfer 7 to the connecting layer 5, and the light is absorbed by the connecting layer 5. In this way, the light in the second substrate 22 can be effectively prevented from being emitted from the side 203 of the display substrate 2, causing light leakage in the display device.

[0060] In the embodiment of the present application, the overall strength of the display substrate 2 needs to be considered when the chamfer 7 is set. For example, the thickness of the first substrate 21 and the second substrate 22 is the same, set to T. At this time, when the chamfer 7 is set on the second substrate 22, it is necessary to make the height of the chamfer 7 in the thickness direction Z of the second substrate 22 less than or equal to half of the thickness of the second substrate 22, that is, the height of the chamfer 7 is less than T / 2.

[0061] In some embodiments, reference Figure 2 The angle A formed between the surface of the chamfer 7 and the surface of the connecting layer 5 close to the second substrate 22 is 30°-60°. In this way, the light emitted from the surface of the chamfer 7 can be irradiated onto the connecting layer 5, ensuring that the light emitted from the second substrate 22 is absorbed by the connecting layer 5, and no light leakage occurs.

[0062] It should be noted that the chamfer 7 is set in the embodiment of the present application to change the direction of the optical path of the light in the second substrate 22 emitted to the side 203, so that the light in the second substrate 22 is refracted on the surface of the chamfer 7 and enters the connecting layer 5, thereby being absorbed by the connecting layer 5. Therefore, the angle of the chamfer 7 is particularly important. If the angle of the chamfer 7 is set too small, the volume of the space formed between the chamfer 7 and the connecting layer 5 is very small. When the side 203 of the display substrate 2 is coated with the light-shielding glue 6, the light-shielding glue 6 may overflow onto the surface of the chamfer 7 and overflow onto the back of the second substrate 22, affecting the flatness of the assembly of the display substrate 2 and the backlight source 1. If the angle of the chamfer 7 is set too large, the surface of the chamfer 7 is almost parallel to the side 203, so that the light in the second substrate 22 emitted from the surface of the chamfer 7 is almost equivalent to being emitted from the side 203 of the second substrate 22, which is easy to cause light leakage. Therefore, in the embodiment of the present application, the angle of the chamfer 7 is set to 30°-60°, so that all the light emitted from the surface of the chamfer 7 can be emitted to the connecting layer 5, thereby being absorbed by the connecting layer 5, ensuring that the side 203 of the display device does not leak light. At the same time, the space formed between the surface of the chamfer 7 and the connecting layer 5 is also sufficient to accommodate the light-shielding glue 6 overflowing from the side 203 of the display substrate 2, so that the light-shielding glue 6 will not overflow to the back of the display substrate 2, and will not affect the flatness of the connection between the display substrate 2 and the backlight source 1.

[0063] For example, the angle A formed between the surface of the chamfer 7 and the surface of the connection layer 5 close to the second substrate 22 can be set to 45°.

[0064] In some embodiments, reference Figure 3-Figure 4 , along the thickness direction Z of the second substrate 22, the height of the chamfer 7 is greater than or equal to the height of the portion of the light shielding glue 6 overflowing from the side 203. This ensures that the light shielding glue 6 overflowing from the side 203 is completely contained in the space between the chamfer 7 and the connecting layer 5, and does not overflow to the back of the second substrate 22.

[0065] It should be noted that the height of the portion of the light-shielding glue 6 that overflows from the side 203 can be determined in the following manner: after the display substrate 2 is manufactured, there is no need to set the chamfer 7 on the display substrate 2, and the light-shielding glue 6 can be directly coated on the side 203 of the display substrate 2. After the light-shielding glue 6 is cured, the height of the light-shielding glue 6 that overflows from the side 203 to the back of the display substrate 2 in the thickness direction Z of the display substrate 2 is measured.

[0066] When the light-shielding glue 6 is coated on the side 203 of the display substrate 2, due to the fluctuation of the glue coating process, the glue coating range will be biased towards the upper limit or the lower limit. When the glue coating range is biased towards the upper limit, although the light-shielding glue 6 will not overflow from the side 203, there will be a part of the side 203 that is not covered by the light-shielding glue 6, and a chamfer 7 will be set at the position of the side 203 that is not covered by the light-shielding glue 6, so that the direction of the light emitted to the side 203 can be changed, thereby avoiding the light in the display substrate 2 from being emitted from the side 203 and causing light leakage. When the glue coating range is biased towards the lower limit, the shading glue 6 may overflow from the side 203. However, due to the setting of the chamfer 7, a holding space is formed between the surface of the chamfer 7 and the connecting layer 5, so that the shading glue 6 overflowing from the side 203 can overflow into the holding space and will not flow to the back of the second substrate 22, and will not affect the smooth assembly of the second substrate 22 and the backlight source 1. It should be noted that the height of the chamfer 7 needs to be greater than or equal to the glue coating process fluctuation value. Different glue coating equipment has different glue coating process fluctuation values. Therefore, before use, it is necessary to use the glue coating equipment to perform an experimental glue coating operation in order to determine the glue coating process fluctuation value, so that the height of the chamfer 7 can be set more accurately according to the glue coating process fluctuation value.

[0067] In the embodiment of the present application, in order to ensure that the light emitted from the surface of the chamfer 7 hits the connecting layer 5, not only the angle of the chamfer 7 but also the size of the connecting layer 5 are required.

[0068] In some embodiments, in the thickness direction Z of the second substrate 22, the edge of the connection layer 5 is flush with the side surface 203. In this way, the edge of the orthographic projection of the chamfer 7 on the backlight source 1 coincides with the edge of the orthographic projection of the connection layer 5 on the backlight source 1, thereby ensuring that the size of the connection layer 5 in the thickness direction Z perpendicular to the display substrate 2 is sufficient to receive the light emitted from the surface of the chamfer 7, ensuring that the light emitted from the second substrate 22 is absorbed by the connection layer 5, and no light leakage occurs.

[0069] In some embodiments, reference Figure 1-Figure 2 , the edge of the connecting layer 5 protrudes from the side surface 203. In this way, the area of ​​the connecting layer 5 for receiving the light emitted from the chamfered surface 7 is larger, thereby ensuring that all the light emitted from the second substrate 22 can be absorbed by the connecting layer 5, and no light leakage occurs.

[0070] In some embodiments, the connection layer 5 is a black foam adhesive, which is used to absorb light, so that all the light emitted from the surface of the chamfer 7 will be absorbed by the connection layer 5, so that the side surface 203 of the display substrate 2 will not leak light.

[0071] It should be noted that the use of black foam glue to make the connecting layer 5 can be formed into a rectangular connecting layer 5 in one step, so that the surface of the connecting layer 5 close to the second substrate 22 is flat, which not only allows the connecting layer 5 to be made more quickly, but also enables the second substrate 22 and the backlight source 1 to be connected more smoothly through the connecting layer 5.

[0072] In some embodiments, reference Figure 5-Figure 6 A groove 51 is provided on the surface of the side of the connection layer 5 away from the backlight source 1 at a position directly opposite to the chamfer 7. The groove 51 includes a reflective surface 510. The reflective surface 510 is configured to reflect the light emitted from the surface of the chamfer 7 to the connection layer 5 to the display substrate 2. In this way, all the light emitted from the surface of the chamfer 7 can be emitted to the reflective surface 510, and the light can be reflected back to the display substrate 2 through the reflective surface 510, thereby ensuring that no light is emitted from the side 203 of the display substrate 2, and no light leakage from the side 203 occurs.

[0073] It should be noted that the connecting layer 5 is used to connect the second substrate 22 and the backlight source 1, so the connecting layer 5 needs to have a certain degree of viscosity. At least except for the part opposite to the chamfer 7, other parts need to be made of black foam glue. In the embodiment of the present application, the rectangular connecting layer 5 can be made of black foam glue first. After the second substrate 22 and the backlight source 1 are connected by the connecting layer 5, a groove 51 can be opened at the position of the connecting layer 5 opposite to the chamfer 7, and a reflective layer can be set on the surface of the groove 51. The surface of the reflective layer is the reflective surface 510.

[0074] The shape of the groove 51 can be a triangle or a cone, and the embodiment of the present application does not make any specific limitation thereto, as long as it ensures that the light emitted from the surface of the chamfer 7 can hit the reflective surface 510 .

[0075] Embodiment 2

[0076] refer to Figure 7 , Embodiment 2 of the present application provides a method for preparing a display panel, comprising the following steps:

[0077] S201 , preparing a display substrate 2 , wherein the display substrate 2 includes a first surface 201 and a second surface 202 disposed opposite to each other, and a side surface 203 connected between the first surface 201 and the second surface 202 .

[0078] S202 , setting a chamfer 7 at the junction of the second surface 202 and the side surface 203 .

[0079] S203 , applying light shielding glue 6 on the side surface 203 , and the light shielding glue 6 overflows to the surface of the chamfer 7 .

[0080] S204 , connecting the second surface 202 to the light-emitting side of the backlight source 1 through the connecting layer 5 , so that the orthographic projection of the chamfer 7 on the backlight source 1 is located within the orthographic projection of the connecting layer 5 on the backlight source 1 .

[0081] The connection layer 5 is used to absorb light or reflect light to the display substrate 2 .

[0082] refer to Figure 8 In some embodiments, a polarizer is further provided on the surface of the display substrate. In this case, the method for preparing the display panel includes the following steps:

[0083] S301 , preparing a display substrate 2 , wherein the display substrate 2 includes a first surface 201 and a second surface 202 disposed opposite to each other, and a side surface 203 connected between the first surface 201 and the second surface 202 .

[0084] S302 , disposing a first polarizer 3 on the first surface 201 , with an edge of the first polarizer 3 exceeding an edge of the first surface 201 .

[0085] S303 , disposing a second polarizer 4 on the second surface 202 .

[0086] S304 , setting a chamfer 7 at the junction of the second surface 202 and the side surface 203 .

[0087] S305 , applying light shielding glue 6 on the side surface 203 , and the light shielding glue 6 overflows to the surface of the chamfer 7 .

[0088] S306 , connecting the second surface 202 to the light-emitting side of the backlight source 1 through the connecting layer 5 , so that the orthographic projection of the chamfer 7 on the backlight source 1 is located within the orthographic projection of the connecting layer 5 on the backlight source 1 .

[0089] The display panel is prepared by the above steps. The first polarizer 3 arranged beyond the edge of the first surface 201 and the light shielding glue 6 coated on the side 203 together form the frame of the display panel. Compared with the frame of the traditional display device, the frame width can be greatly reduced, so that the display device can achieve a narrow frame design effect. In addition, the setting of the chamfer 7 can change the light path direction of the light in the display substrate 2, so that all the light in the display substrate 2 directed to the side 203 is projected from the surface of the chamfer 7 to the connecting layer 5, and the light is absorbed or reflected back into the display substrate 2 by the connecting layer 5, so as to avoid light leakage from the side 203 of the display panel; after the chamfer 7 is set, the light shielding glue 6 overflowing from the side 203 will flow to the surface of the chamfer 7, thereby preventing the light shielding glue 6 from overflowing to the back of the display substrate 2 and affecting the assembly flatness of the display substrate 2 and the backlight source 1.

[0090] Embodiment 3

[0091] refer to Fig. 9Embodiment 3 of the present application provides a display device, including a housing 100, a backlight source 1, and a display panel 200 as in any of the above embodiments, wherein the backlight source 1 and the display panel 200 are both disposed in the housing 100, and the second surface 202 is connected to the light-emitting side of the backlight source 1 through a connecting layer 5.

[0092] The detailed structure of the display panel 200 can be referred to the above-mentioned embodiment 1 and will not be repeated here; it can be understood that since the above-mentioned display panel 200 is used in the display device of the present application, the embodiment of the display device of the present application includes all technical solutions of all embodiments of the above-mentioned display panel 200, and can achieve the technical effects achieved by the above-mentioned technical solutions.

[0093] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A display panel, comprising a display substrate (2), the display substrate (2) comprising a first surface (201) and a second surface (202) arranged opposite to each other, and a side surface (203) connected between the first surface (201) and the second surface (202); the second surface (202) is used to connect to a backlight source (1) through a connecting layer (5), the side surface (203) is covered with a light shielding glue (6), and is characterized in that: A chamfer (7) is provided at the junction of the second surface (202) and the side surface (203), and the orthographic projection of the chamfer (7) on the backlight source (1) is located within the orthographic projection of the connection layer (5) on the backlight source (1); The chamfer (7) is configured to allow light inside the display substrate (2) to be emitted from the surface of the chamfer (7) to the connection layer (5), and to allow the light shielding glue (6) to overflow onto the surface of the chamfer (7); A groove (51) is provided on a surface of a side of the connection layer (5) away from the backlight source (1) at a position directly opposite to the chamfer (7), and the groove (51) comprises a reflection surface (510), and the reflection surface (510) is configured to reflect light emitted from the surface of the chamfer (7) to the connection layer (5) to the display substrate (2).

2. The display panel according to claim 1, characterized in that: The display substrate (2) comprises a first substrate (21) and a second substrate (22) arranged in a box, and the chamfer (7) is located on the second substrate (22); Along the thickness direction (Z) of the second substrate (22), the height of the chamfer (7) is less than or equal to half the thickness of the second substrate (22).

3. The display panel according to claim 2, characterized in that: The angle (A) formed between the surface of the chamfer (7) and the surface of one side of the connecting layer (5) close to the second substrate (22) is 30°-60°.

4. The display panel according to claim 3, characterized in that: Along the thickness direction (Z) of the second substrate (22), the height of the chamfer (7) is greater than or equal to the height of a portion of the light-shielding glue (6) overflowing from the side surface (203).

5. The display panel according to any one of claims 1 to 4, characterized in that: The surface of the chamfer (7) is a plane; Alternatively, the surface of the chamfer (7) is an arc surface that bulges in a direction away from the second substrate (22).

6. The display panel according to claim 5, characterized in that: In the thickness direction (Z) of the second substrate (22), the edge of the connecting layer (5) is flush with the side surface (203); Alternatively, the edge of the connecting layer (5) protrudes from the side surface (203).

7. The display panel according to claim 5, characterized in that: The connecting layer (5) is black foam glue, and the black foam glue is used to absorb light.

8. A method for preparing a display panel, characterized in that: include: A display substrate (2) is prepared, wherein the display substrate (2) comprises a first surface (201) and a second surface (202) disposed opposite to each other, and a side surface (203) connected between the first surface (201) and the second surface (202); A chamfer (7) is provided at the junction of the second surface (202) and the side surface (203); Applying light shielding glue (6) on the side surface (203), wherein the light shielding glue (6) overflows onto the surface of the chamfer (7); The second surface (202) is connected to the light-emitting side of the backlight source (1) via a connecting layer (5), so that the orthographic projection of the chamfer (7) on the backlight source (1) is located within the orthographic projection of the connecting layer (5) on the backlight source (1); A groove (51) is provided on a surface of a side of the connection layer (5) away from the backlight source (1) at a position directly opposite to the chamfer (7), and the groove (51) comprises a reflection surface (510), and the reflection surface (510) is configured to reflect light emitted from the surface of the chamfer (7) to the connection layer (5) to the display substrate (2).

9. A display device, characterized in that: include: Housing (100); A backlight source (1) is arranged in the housing (100); The display panel (200) according to any one of claims 1 to 7 is arranged in the housing (100), and the second surface (202) is connected to the light-emitting side of the backlight source (1) through a connecting layer (5).

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