Method for producing a ceramic copper clad substrate with leads using a support tooling

Abstract

The present application relates to a kind of methods for producing ceramic copper clad substrate with pin using support tool, comprising the following steps: SA, make several unit copper clad substrates;SB, the surface of pin copper foil is oxidized, and oxide layer is formed on the surface;SC, unit copper clad substrate is placed on printing support tool, the surface of pin copper foil with oxide layer is adhered to unit ceramic substrate, then co-sintering is carried out, and ceramic copper clad substrate with pin is obtained after cooling, pin copper foil is greater than unit ceramic substrate, so that pin copper foil protrudes from ceramic substrate and forms pin;SD, ceramic copper clad substrate with pin is placed on printing support tool, printing support tool has liftable support part, the part of pin copper foil protruding from unit copper clad substrate is supported by support part, pin is supported and not deformed when film sticking, exposure and development, and then ceramic copper clad substrate with pin can be produced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of copper-clad substrate production, in particular to a method for producing a ceramic copper-clad substrate with pins using a support tool. BACKGROUND

[0002] Ceramic copper-clad substrate is also called ceramic copper-clad plate and Centrotherm DBC (Direct Bonding Copper). The ceramic material includes aluminum nitride / aluminum oxide / ZTA ceramic plate. The ceramic copper-clad plate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, low expansion, etc. of ceramic, and also has the high electrical conductivity and excellent welding performance of oxygen-free copper, and can be etched into various patterns like a PCB circuit board. After being made, pins need to be set on the ceramic copper-clad substrate, which is time-consuming and laborious, and poor setting will cause damage to the ceramic copper-clad substrate, directly causing loss. SUMMARY

[0003] In order to overcome the technical defects of the prior art, the present application provides a method for producing a ceramic copper-clad substrate with pins using a support tool, which can produce a ceramic copper-clad substrate with pins.

[0004] The technical solution adopted by the present application is as follows:

[0005] The method for producing a ceramic copper-clad substrate with pins using a support tool comprises the following steps:

[0006] SA, a plurality of unit copper-clad substrates are made;

[0007] SB, one surface of the pin copper foil is oxidized to form an oxide layer on the surface;

[0008] SC, the unit copper-clad substrate is placed on the printing support tool, one surface of the pin copper foil with the oxide layer is attached to the unit ceramic substrate, and then co-sintering is performed, and after cooling, a ceramic copper-clad substrate with pins is obtained;

[0009] SD, the ceramic copper-clad substrate with pins is placed on the printing support tool, the printing support tool has a liftable support part, the part of the pin copper foil protruding from the unit copper-clad substrate is supported by the support part, the pin copper foil side of the ceramic copper-clad substrate with pins is subjected to film attachment, exposure, and development treatment, and then etching is performed using an etching liquid to form a circuit pattern, and the ceramic copper-clad substrate with pins is obtained.

[0010] Preferably, the SA comprises the following steps:

[0011] SAA, one surface of the base copper foil is oxidized to form an oxide layer on the surface;

[0012] SAB, bonding one surface of the base copper foil with an oxidation layer to a ceramic substrate, then co-sintering, and obtaining the ceramic copper-clad substrate with the base copper foil after cooling;

[0013] SAC, performing film bonding, exposure, and development treatment on one side of the base copper foil of the ceramic copper-clad substrate, then etching using an etching solution to form a circuit pattern, and obtaining the ceramic copper-clad substrate.

[0014] SAD, processing a breaking mark on the ceramic copper-clad substrate, the breaking mark passing through the etching area, and breaking the ceramic copper-clad substrate into a plurality of unit copper-clad substrates.

[0015] Preferably, the step of oxidizing one surface of the pin copper foil comprises: placing one side of the pin copper foil on a ceramic backing plate, and then placing the whole into a mesh belt sintering furnace for oxidation; the ceramic backing plate is an aluminum nitride ceramic sheet.

[0016] Preferably, the printing support tooling comprises a tooling body and a support device, the tooling body comprises a ceramic support surface, an avoidance area, and a support inclined surface, the support device slides along the support inclined surface to change the height of the support device, and the support device forms a support part.

[0017] Preferably, the support inclined surface has a sliding groove, and the support device slides along the sliding groove.

[0018] Preferably, the support device comprises oppositely arranged first and second sliding blocks, and the support inclined surface comprises first and second inclined surface areas, and the first and second sliding blocks slide along the first and second inclined surface areas, respectively.

[0019] Preferably, the ends of the first and second inclined surfaces are provided with stoppers.

[0020] Preferably, in step SC, the temperature of co-sintering is 1081-1085℃.

[0021] Preferably, in step SD, the etching solution comprises 1%-5% alkali, 2%-8% hydrogen peroxide, and the rest is water, and the alkali is sodium hydroxide or potassium hydroxide.

[0022] Preferably, in step SD, the etching is performed under ultrasonic conditions, and the temperature is controlled to be ≤25℃, and the etching time is 20min-45min; when the second etching solution is used for etching, the etching is performed under ultrasonic conditions, and the temperature is controlled to be ≤25℃, and the etching time is 3min-15min.

[0023] The beneficial effects of the present application are:

[0024] The method for producing a pin ceramic copper-clad substrate using a support tooling comprises the following steps:

[0025] SA, make several unit copper clad substrates;

[0026] SB, oxidize one surface of the pin copper foil to form an oxide layer on the surface;

[0027] SC, place the unit copper clad substrate on the printing support tool, adhere the surface of the pin copper foil with the oxide layer to the unit ceramic substrate, and then co-sinter to obtain a ceramic copper clad substrate with pins after cooling, the pin copper foil is larger than the unit ceramic substrate, so that the pin copper foil protrudes from the ceramic substrate to form a pin;

[0028] SD, place the ceramic copper clad substrate with pins on the printing support tool, the printing support tool has a liftable support part, the part of the pin copper foil protruding from the unit copper clad substrate is supported by the support part, the pin is supported and will not be deformed during film sticking, exposure and development, during sintering, the support part is lowered, so that the pin copper foil is separated from contact with the copper clad substrate, the pin copper foil side of the ceramic copper clad substrate with pins is subjected to film sticking, exposure, development treatment, and then etching is performed using an etching liquid to form a circuit pattern, to obtain the copper clad substrate with pins, and further to produce a ceramic copper clad substrate with pins. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a schematic diagram of the structure of the ceramic copper clad substrate before etching.

[0030] Figure 2 It is a schematic diagram of the structure of the ceramic copper clad substrate after etching.

[0031] Figure 3 It is a schematic diagram of the structure of the ceramic copper clad substrate after processing the breaking mark.

[0032] Figure 4 It is a schematic diagram of the structure of the unit copper clad substrate.

[0033] Figure 5 It is a schematic diagram of the structure of the printing support tool sintering the unit copper clad substrate and the pin copper foil.

[0034] Figure 6 It is a schematic diagram of the state of the printing support tool when sticking film on the pin copper foil.

[0035] Figure 7 It is a schematic diagram of the structure of the printing support tool when the support device is at the lowest position.

[0036] Figure 8 It is a schematic diagram of the structure of the tool body.

[0037] Figure 9 It is a schematic diagram of the structure of the printing support tool when the support device is at the highest position.

[0038] REFERENCE SIGNS

[0039] 1. ceramic copper clad substrate; 11. base copper foil; 12. ceramic substrate; 13. breaking mark;

[0040] 2. pin copper foil;

[0041] 3. printing support tool; 31. tool body; 311. ceramic support surface; 312. avoiding area; 313. support inclined surface; 3131. sliding groove; 3132. first inclined surface area; 3133. second inclined surface area; 314. stopper; 32. support device; 321. first sliding block; 322. second sliding block;

[0042] 4. unit copper clad substrate. DETAILED DESCRIPTION

[0043] The application will be further described below in conjunction with the drawings:

[0044] As shown in the drawings, the embodiment provides a method for producing a ceramic copper clad substrate with pins by using a support tool, comprising the following steps:

[0045] SA. producing a plurality of unit copper clad substrates 4; SA comprises the following steps:

[0046] SAA. oxidizing one surface of the base copper foil 11, the thickness of the base copper foil 11 being 0.2 mm, to form an oxide layer on the surface;

[0047] SAB. adhering the surface of the base copper foil 11 with the oxide layer to the ceramic substrate 12, and then co-sintering, to obtain the ceramic copper clad substrate 1 with the base copper foil 11 on the surface after cooling;

[0048] SAC. performing film adhering, exposure, and development processing on one side of the base copper foil 11 of the ceramic copper clad substrate 1, and then etching by using an etching solution to form a circuit pattern, to obtain the ceramic copper clad substrate 1;

[0049] SAD. processing the breaking mark 13 on the ceramic copper clad substrate 1, the breaking mark 13 being a linearly distributed blind hole processed by laser, and the breaking mark 13 passing through the etching area to break the ceramic copper clad substrate into a plurality of unit copper clad substrates 4; since the size of the base copper foil 11 and the ceramic copper clad substrate 1 is large, the method of breaking after etching can be used to produce a small-size copper clad substrate, i.e. the unit copper clad substrate 4;

[0050] SB. oxidizing one surface of the pin copper foil 2 to form an oxide layer on the surface, the thickness of the aluminum oxide ceramic substrate being 0.1 mm;

[0051] SC, placing the unit copper clad substrate 4 on the printing support tool 3, and bonding the pin copper foil 2 with the one surface having the oxidation layer to the unit ceramic substrate 4, and then co-sintering, the co-sintering temperature is 1081℃, and after cooling, the ceramic copper clad substrate 1 with pins is obtained, the pin copper foil 2 is larger than the unit ceramic substrate 4, so that the pin copper foil 2 protrudes from the unit ceramic substrate 4 to form the pin;

[0052] SD, placing the ceramic copper clad substrate 1 with pins on the printing support tool 3, the printing support tool 3 has a liftable support part, the part of the pin copper foil 2 protruding from the unit copper clad substrate 4 is supported by the support part, the pin is supported and will not be deformed during the film sticking, exposure and development, during sintering, the support part is lowered, so that the pin copper foil 2 is out of contact with the printing support tool 3, the pin copper foil 2 side of the ceramic copper clad substrate 1 with pins is subjected to film sticking, exposure, development treatment, and then etching is performed using an etching liquid to form a circuit pattern, and the ceramic copper clad substrate with pins is obtained, the etching liquid includes 1% alkali, 2% hydrogen peroxide and the balance of water, the alkali is sodium hydroxide or potassium hydroxide, the etching is performed under ultrasonic conditions, and the temperature is controlled at 22℃, and the etching time is 20min; the second etching liquid is used for etching, which is performed under ultrasonic conditions, the temperature is controlled at 22℃, and the etching time is 3min.

[0053] The step of oxidizing one surface of the pin copper foil 2 includes: placing one side of the pin copper foil 2 on a ceramic backing plate, and then placing the whole into a mesh belt sintering furnace for oxidation; the ceramic backing plate is an aluminum nitride ceramic sheet, and the pin copper foil 2 and the ceramic backing plate will not be bonded during sintering, at this time, the ceramic substrate 12 can be used as a tool for oxidizing the pin copper foil 2, and the ceramic substrate 12 is the raw material for producing the copper clad substrate, so that a tool for oxidizing the pin copper foil 2 does not need to be prepared separately, and the oxidation cost is saved.

[0054] The printing support tool 3 includes a tool body 31 and a support device 32, the tool body 31 includes a ceramic support surface 311, an avoidance area 312 and a support inclined surface 313, the support device 32 slides along the support inclined surface 313 to change the height of the support device 32, the support device 32 forms a support part, and the support device 32 is used to support the pin during printing and film sticking to prevent the pin from being deformed, during sintering, the support part is lowered, so that the pin copper foil 2 is out of contact with the copper clad substrate, since the tool body 31 and the support device 32 are both made of ceramic, the support part is lowered during sintering, so that the pin copper foil 2 and the tool body 31 made of ceramic will not be bonded.

[0055] The support slope 313 has a sliding groove 3131 along which the support device 32 slides, the support device 32 comprises a first sliding block 321 and a second sliding block 322 arranged oppositely, the support slope 313 comprises a first slope area 3132 and a second slope area 3133, the first sliding block 321 and the second sliding block 322 slide along the first slope area 3132 and the second slope area 3133 respectively, the end of the first slope area 3132 and the second slope area 3133 is provided with a stopper 314, the stopper 314 can prevent the first sliding block 321 and the second sliding block 322 from being separated from the first slope area 3132 and the second slope area 3133 respectively, the top of the first slope area 3132 and the second slope area 3133 is lower than the highest part of the tool body 31, so that when the first sliding block 321 and the second sliding block 322 slide to the lowest part along the first slope area 3132 and the second slope area 3133 respectively, the first slope area 3132 and the second slope area 3133 will not be in contact with the pin copper foil 2, the inclination angle of the first slope area 3132 and the second slope area 3133 relative to the horizontal plane is 2 degrees, so that when the first sliding block 321 and the second sliding block 322 are on the first slope area 3132 and the second slope area 3133 respectively, the first sliding block 321 and the second sliding block 322 can be raised or lowered along the slope, and the first sliding block 321 and the second sliding block 322 can also be prevented from sliding down due to the influence of the pin copper foil 2 and their own gravity.

[0056] Example 2

[0057] The difference between this embodiment and the embodiment is that the thickness of the base copper foil 11 is 0.3 mm, the thickness of the alumina ceramic substrate is 1 mm, one surface of the pin copper foil 2 with an oxidation layer is attached to the unit ceramic substrate 4, and then co-sintering is performed, the co-sintering temperature is 1083°C; the pin copper foil 2 of the pin-equipped ceramic copper-clad substrate 1 is subjected to film attaching, exposure, and development processing on one side, and then etching is performed using an etching solution to form a circuit pattern, thereby obtaining a pin-equipped copper-clad substrate, the etching solution comprises 3% alkali, 5% hydrogen peroxide, and the balance of water, the alkali is sodium hydroxide or potassium hydroxide, the etching is performed under ultrasonic conditions with temperature control at 23°C, and the etching time is 30 min; when the second etching solution is used for etching, the etching is performed under ultrasonic conditions with temperature control at 23°C, and the etching time is 10 min; the inclination angle of the first slope area 3132 and the second slope area 3133 relative to the horizontal plane is 3 degrees.

[0058] Example 3

[0059] The embodiment is different from the embodiment only in that the thickness of the base copper foil 11 is 0.4 mm, the thickness of the alumina ceramic substrate is 1.5 mm, one surface of the pin copper foil 2 with an oxidation layer is attached to the unit ceramic substrate 4, and then co-sintering is performed, the co-sintering temperature is 1085℃; the pin copper foil 2 of the pin ceramic copper-clad substrate 1 is subjected to film attaching, exposure, and development processes on one side, and then etching is performed using an etching liquid to form a circuit pattern, thereby obtaining a pin ceramic copper-clad substrate, the etching liquid includes 5% alkali, 8% hydrogen peroxide, and the balance of water, the alkali is sodium hydroxide or potassium hydroxide, the etching is performed under ultrasonic conditions, and the temperature is controlled at 25℃, the etching time is 45 min; the second etching liquid is used for etching, the etching is performed under ultrasonic conditions, the temperature is controlled at 25℃, and the etching time is 15 min; the first inclined surface area 3132 and the second inclined surface 3133 have an inclination angle of 4 degrees with respect to the horizontal plane.

[0060] The basic principle and main features of the present application and the advantages of the present application are shown and described above, and those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and the description in the specification are only to illustrate the principle of the present application, and various changes and improvements can be made to the present application without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the present application, and the scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A method for producing a ceramic copper clad substrate with leads using a support tool, characterized by, The method comprises the following steps: SA, manufacturing a plurality of unit copper-clad substrates; SB, oxidizing one surface of the pin copper foil to form an oxide layer on the surface; SC, placing the unit copper-clad substrate on a printing support tool, bonding the surface of the pin copper foil with the oxide layer to the unit ceramic substrate, and then co-sintering to obtain a ceramic copper-clad substrate with pins after cooling; SD, placing the ceramic copper-clad substrate with pins on a printing support tool, the printing support tool having a liftable support part, the part of the pin copper foil protruding from the unit copper-clad substrate being supported by the support part, performing film bonding, exposure, and development processing on the pin copper foil side of the ceramic copper-clad substrate with pins, and then performing etching using an etching solution to form a circuit pattern, thereby obtaining the ceramic copper-clad substrate with pins, the printing support tool comprising a tool body and a support device, the tool body comprising a ceramic support surface, an avoidance area, and a support inclined surface, the support device sliding along the support inclined surface to change the height of the support device, the support device forming the support part, the support inclined surface having a sliding groove, the support device sliding along the sliding groove, the support device comprising oppositely arranged first and second sliding blocks, the support inclined surface comprising first and second inclined surface areas, the first and second sliding blocks sliding along the first and second inclined surface areas, respectively, and the ends of the first and second inclined surface areas being provided with stoppers.

2. The method of producing a ceramic copper clad substrate with leads using a support tool according to claim 1, wherein, The SA comprises the following steps: SAA, oxidizing one surface of the base copper foil to form an oxide layer on the surface; SAB, bonding the surface of the base copper foil with the oxide layer to the ceramic substrate, and then co-sintering to obtain a ceramic copper-clad substrate with the base copper foil on the surface after cooling; SAC, performing film bonding, exposure, and development processing on the base copper foil side of the ceramic copper-clad substrate, and then performing etching using an etching solution to form a circuit pattern, thereby obtaining the ceramic copper-clad substrate; SAD, processing a breaking mark on the ceramic copper-clad substrate, the breaking mark passing through the etching area, and breaking the ceramic copper-clad substrate into a plurality of unit copper-clad substrates.

3. The method of producing a ceramic copper clad substrate with leads using a supporting tool according to claim 1, wherein The step of oxidizing one surface of the pin copper foil comprises: placing one side of the pin copper foil on a ceramic backing plate, and then placing the whole in a mesh belt sintering furnace for oxidation; the ceramic backing plate is an aluminum nitride ceramic sheet.

4. The method of producing a ceramic copper clad substrate with leads using a supporting tool according to claim 1, wherein In step SC, the co-sintering temperature is 1081-1085°C.

5. The method of producing a ceramic copper clad substrate with leads using a supporting tool according to claim 1, wherein In step SD, the etching solution comprises 1%-5% alkali, 2%-8% hydrogen peroxide, and the rest water, and the alkali is sodium hydroxide or potassium hydroxide.

6. The method of producing a ceramic copper clad substrate with leads using a supporting tool according to claim 1, wherein In step SD, the etching is performed under ultrasonic conditions with a temperature control of ≤25°C, and the etching time is 20min-45min; when the etching solution is used for etching, the etching is performed under ultrasonic conditions with a temperature control of ≤25°C, and the etching time is 3min-15min.

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