Lens drive assembly and camera module

Abstract

This invention discloses a lens driving assembly and a camera module. The lens driving assembly includes a lens focusing outer frame, a lens focusing inner frame, a lens image stabilization carrier, a lens focusing driving unit, and a lens image stabilization driving unit. The lens focusing inner frame is suspended to the side of the lens focusing outer frame, and the lens image stabilization carrier is suspended below the lens image stabilization inner frame. The lens focusing driving unit includes a lens focusing magnet and a lens focusing coil. The lens focusing magnet is disposed on the lens focusing outer frame, and the lens focusing coil is disposed on the lens focusing inner frame, with the lens focusing magnet and the lens focusing coil corresponding to each other. The lens image stabilization driving unit includes a lens image stabilization magnet and a lens image stabilization coil. The lens image stabilization magnet is disposed on the lens image stabilization carrier, and the lens image stabilization coil is disposed on the lens image stabilization inner frame, with the lens image stabilization magnet and the lens image stabilization coil corresponding to each other.

Description

Technical Field

[0001] This invention relates to optical imaging devices, and more particularly to a lens driving assembly and a camera module. Background Technology

[0002] With the widespread adoption of mobile electronic devices, the technology related to camera modules used in these devices to help users capture images has developed and progressed rapidly. Currently, consumers in the market have increasingly higher and more diverse requirements for the functions of camera modules configured in mobile electronic devices (e.g., smartphones), such as demanding image stabilization to achieve better imaging results.

[0003] When using mobile electronic devices for video recording, the natural physiological tremors of the human body and the shaking caused by movement can lead to a decrease in video quality. This is especially true for ordinary consumers who lack professional training and are more prone to shaking, and the shaking can be more pronounced. Therefore, mobile electronic devices are usually equipped with image stabilization motors (i.e., drive components) to move the optical lens and achieve image stabilization.

[0004] As the image quality requirements of camera modules become increasingly demanding, the size and weight of optical lenses are also increasing, placing higher demands on the driving force of the drive components. The space occupied by the image stabilization motor increases accordingly with the lens size. Furthermore, the current trend towards thinner and lighter mobile electronic devices significantly limits the size of camera modules, making them increasingly unable to meet the configuration needs of electronic devices. In other words, while optical lenses are becoming larger and heavier, the driving force provided by the drive components cannot be increased accordingly. With limited driving force, the heavier the lens, the shorter the stroke the drive components can take to move the optical lens, affecting image stabilization capabilities. Additionally, the heavier the optical lens, the slower the speed at which the drive components can move it, and the longer it takes for the optical lens to reach the predetermined compensation position, which also affects the image stabilization effect. Summary of the Invention

[0005] One object of the present invention is to provide a lens driving assembly and a camera module, wherein the lens driving assembly enables the camera module to focus and stabilize.

[0006] One object of the present invention is to provide a lens driving assembly and a camera module, wherein the lens driving assembly is capable of driving an optical lens of the camera module to translate, and the chip driving assembly is capable of driving a photosensitive component of the camera module to translate and / or rotate, thereby improving the image stabilization effect of the camera module.

[0007] One object of the present invention is to provide a lens driving assembly and a camera module, wherein while the lens driving assembly drives the optical lens to translate, the chip driving assembly can drive the photosensitive assembly to move and / or rotate, thereby significantly improving the image stabilization effect of the camera module.

[0008] One object of the present invention is to provide a lens driving assembly and a camera module, wherein the lens driving assembly and the chip driving assembly are magnetically isolated, thereby avoiding magnetic interference between the two and ensuring the reliability and stability of the camera module.

[0009] According to one aspect of the present invention, a lens driving assembly is provided, comprising:

[0010] One lens focuses on the outer frame;

[0011] A lens focusing inner frame, wherein the lens focusing inner frame is suspended to the side of the lens focusing outer frame;

[0012] A lens stabilization carrier, wherein the lens stabilization carrier is suspended below the inner frame of the lens stabilization;

[0013] A lens focusing drive unit, wherein the lens focusing drive unit includes at least one lens focusing magnet and at least one lens focusing coil, each lens focusing magnet being disposed on the outer lens focusing frame, and each lens focusing coil being disposed on the inner lens focusing frame, and the positions of the lens focusing magnet and the lens focusing coil corresponding to each other; and

[0014] A lens stabilization drive unit, wherein the lens stabilization drive unit includes at least one lens stabilization magnet and at least one lens stabilization coil, each lens stabilization magnet is disposed on the lens stabilization carrier, each lens stabilization coil is disposed on the lens stabilization inner frame, and the positions of the lens stabilization magnet and the positions of the lens stabilization coil correspond to each other.

[0015] According to one embodiment of the present invention, the lens driving assembly further includes at least one lens focusing magnetic unit and a lens focusing support unit, wherein the lens focusing magnetic unit is disposed in the inner lens focusing frame, and the position of the lens focusing magnetic unit corresponds to the position of the lens focusing magnet, so as to generate a horizontal magnetic attraction between the two, wherein the lens focusing support unit is disposed between the outer lens focusing frame and the side of the inner lens focusing frame of the inner lens focusing frame, thereby suspending the inner lens focusing frame to the side of the outer lens focusing frame.

[0016] According to one embodiment of the present invention, the height dimension of the lens focusing magnetic unit is greater than or equal to the height dimension of the lens focusing magnet.

[0017] According to one embodiment of the present invention, during the process of the lens focusing drive unit driving the inner lens focusing frame to move relative to the outer lens focusing frame in the height direction, the lens focusing magnetic unit always covers the lens focusing magnet in the height direction.

[0018] According to one embodiment of the present invention, the lens drive assembly further includes at least one lens focusing yoke unit, wherein the lens focusing yoke unit at least blocks the side of the lens focusing magnet away from the lens focusing coil.

[0019] According to one embodiment of the present invention, the lens focusing magnetic yoke unit further includes a magnetic yoke plate, an upper magnetic yoke arm, and a lower magnetic yoke arm. The upper magnetic yoke arm and the lower magnetic yoke arm extend integrally from the upper and lower sides of the magnetic yoke plate, respectively, to form a magnetic yoke space between the magnetic yoke plate, the upper magnetic yoke arm, and the lower magnetic yoke arm. The lens focusing magnet is disposed in the magnetic yoke space of the lens focusing magnetic yoke unit, and the side of the lens focusing magnetic yoke unit away from the lens focusing coil is attached to the magnetic yoke plate. The upper magnetic yoke arm and the lower magnetic yoke arm respectively block at least a portion of the upper and lower sides of the lens focusing magnet.

[0020] According to one embodiment of the present invention, the magnetically shielding upper wall and the magnetically shielding lower arm of the lens focusing magnetic yoke unit are respectively attached to the upper and lower sides of the lens focusing magnet.

[0021] According to one embodiment of the present invention, the lens driving assembly further includes at least one lens stabilization magnetic unit and one lens stabilization support unit, wherein the lens stabilization magnetic unit is disposed on the top of the inner lens stabilization frame of the inner lens stabilization frame, and the lens stabilization magnetic unit and the lens stabilization magnet correspond to each other to generate a magnetic attraction force in the height direction between them, wherein the lens stabilization support unit is disposed between the lens stabilization carrier and the top of the inner lens focusing frame of the inner lens focusing frame, thereby suspending the lens stabilization carrier below the inner lens focusing frame.

[0022] According to one embodiment of the present invention, the lens driving assembly further includes a lens focusing circuit board, wherein the lens focusing circuit board includes a mounting portion and a connecting portion, the mounting portion is mounted to the lens focusing outer frame, the connecting portion extends integrally from the mounting portion, and the connecting portion is electrically connected to the lens image stabilization magnetic unit, the lens image stabilization magnetic unit is electrically connected to the lens focusing magnetic unit, and the lens focusing coil is electrically connected to the lens focusing magnetic unit.

[0023] According to one embodiment of the present invention, the number of lens focusing coils and the number of lens focusing magnets are both two, and the two lens focusing coils are formed by winding a conductive wire.

[0024] According to one embodiment of the present invention, the lens drive assembly further includes a lens stabilization circuit board, wherein each of the lens stabilization coils is respectively mounted on the lens stabilization circuit board, the lens stabilization circuit board is disposed on the top of the lens focusing inner frame, and the lens stabilization circuit board is electrically connected to the lens stabilization magnetic unit.

[0025] According to one embodiment of the present invention, the lens driving assembly further includes a lens focusing sensing unit, wherein the lens focusing sensing unit includes a lens focusing sensing magnet and a lens focusing position sensing element, the lens focusing sensing magnet is fixed to the inner lens focusing frame, the lens focusing position sensing element is mounted on the mounting portion of the lens focusing circuit board, and the position of the lens focusing sensing magnet corresponds to the position of the lens focusing position sensing element.

[0026] According to one embodiment of the present invention, the lens driving assembly further includes a lens focusing sensing unit, wherein the lens focusing sensing unit includes a lens focusing sensing magnet and a lens focusing position sensing element, the lens focusing sensing magnet is fixed to the lens focusing outer frame, the lens focusing position sensing element is attached to the lens focusing magnetic unit, and the position of the lens focusing sensing magnet corresponds to the position of the lens focusing position sensing element.

[0027] According to one embodiment of the present invention, the lens drive assembly further includes at least one lens stabilization position sensing element, wherein the lens stabilization position sensing element is mounted on the lens stabilization circuit board, and the lens stabilization position sensing element and the lens stabilization coil are respectively located on opposite sides of the lens stabilization circuit board.

[0028] According to one embodiment of the present invention, the lens focusing support unit includes at least two lens focusing tracks and at least two lens focusing movable elements, wherein each lens focusing track includes an inner groove track and an outer groove track, the inner groove track being formed on the side of the inner lens focusing frame, the outer groove track being formed on the outer lens focusing frame, the inner groove track and the outer groove track corresponding to each other and extending in the same direction, wherein the interior and exterior of the lens focusing movable element are respectively movably held in the inner groove track and the outer groove track, and the lens focusing movable element is a ball bearing, thereby the interior and exterior of the lens focusing movable element are respectively rollably held in the inner groove track and the outer groove track.

[0029] According to one embodiment of the present invention, the lens focusing support unit includes four lens focusing movable elements, and each lens focusing track is provided with two lens focusing movable elements.

[0030] According to one embodiment of the present invention, the lens stabilization support unit includes at least three lens stabilization tracks and at least three lens stabilization movable elements, wherein each lens stabilization track includes a lower groove track and an upper groove track, the lower groove track is formed on the top surface of the lens stabilization carrier, the upper groove track is formed on the bottom surface of the inner frame of the lens focusing inner frame, the lower groove track and the upper groove track correspond to each other and their extension directions are perpendicular to each other, wherein the bottom and top of the lens stabilization ball are respectively movably held in the lower groove track and the upper groove track, thereby the bottom and top of the lens stabilization movable element are respectively rollably held in the lower groove track and the upper groove track.

[0031] According to another aspect of the present invention, the present invention further provides a camera module comprising:

[0032] One photosensitive component;

[0033] An optical lens, wherein the optical lens is positioned within the light-sensitive path of the photosensitive element; and

[0034] A lens driving assembly, wherein the lens driving assembly further includes:

[0035] One lens focuses on the outer frame;

[0036] A lens focusing inner frame, wherein the lens focusing inner frame is suspended to the side of the lens focusing outer frame;

[0037] A lens stabilization carrier, wherein the lens stabilization carrier is suspended below the inner frame of the lens stabilization;

[0038] A lens focusing drive unit, wherein the lens focusing drive unit includes at least one lens focusing magnet and at least one lens focusing coil, each lens focusing magnet being disposed on the outer lens focusing frame, and each lens focusing coil being disposed on the inner lens focusing frame, and the positions of the lens focusing magnet and the lens focusing coil corresponding to each other; and

[0039] A lens stabilization drive unit includes at least one lens stabilization magnet and at least one lens stabilization coil. Each lens stabilization magnet is disposed on the lens stabilization carrier, and each lens stabilization coil is disposed on the inner frame of the lens stabilization. The positions of the lens stabilization magnet and the lens stabilization coil correspond to the positions of the lens stabilization coil. The lens stabilization carrier has a carrier channel, and the optical lens is disposed in the carrier channel of the lens stabilization carrier.

[0040] According to one embodiment of the present invention, the lens driving assembly further includes a lens driving base and a lens driving housing, the lens driving housing being mounted on the lens driving base to form an accommodating space between the lens driving housing and the lens driving base, wherein the lens focusing outer frame is disposed on the lens driving base, and the lens focusing outer frame, the lens focusing inner frame and the lens image stabilization carrier are all located in the accommodating space.

[0041] According to one embodiment of the present invention, the camera module further includes a chip driving component, the photosensitive component being drivably disposed on the chip driving component, wherein the chip driving component is located below the lens driving component.

[0042] According to one embodiment of the present invention, the chip driver assembly further includes:

[0043] At least one chip-based anti-shake magnetic component;

[0044] A chip image stabilization fixing part, wherein the chip image stabilization fixing part has a receiving cavity and a top opening communicating with the receiving cavity;

[0045] A chip stabilization movable part, wherein the chip stabilization movable part is suspended in the receiving cavity of the chip stabilization fixing part; and

[0046] A chip stabilization driving unit, wherein the chip stabilization driving unit includes a plurality of chip stabilization magnets and a plurality of chip stabilization coils arranged opposite to each other. The chip stabilization magnets are respectively disposed on the chip stabilization fixing part, and the chip stabilization coils are respectively disposed on the chip stabilization movable part. The chip stabilization magnetic guiding component is covered on the stabilization magnets.

[0047] According to one embodiment of the present invention, the chip anti-shake magnetic guide component is disposed on the chip anti-shake fixing part, and the chip anti-shake magnet is disposed on the chip anti-shake magnetic guide component, so that the chip anti-shake magnet is disposed on the chip anti-shake fixing part through the chip anti-shake magnetic guide component.

[0048] According to one embodiment of the present invention, the chip anti-shake fixing part includes a base and a top cover, the base and the top cover being snapped together, wherein the chip magnetic conductive member is disposed on the top cover, and the chip anti-shake magnet is disposed on the chip anti-shake magnetic conductive member.

[0049] According to one embodiment of the present invention, the lens drive base is attached to the upper cover, and at least a portion of the lens drive base is made of a magnetically conductive material. Attached Figure Description

[0050] Figure 1A This is a perspective view of a camera module according to a preferred embodiment of the present invention.

[0051] Figure 1B A cross-sectional view of the camera module is shown.

[0052] Figure 2 A perspective view of a lens driving component of the camera module is shown.

[0053] Figure 3A and Figure 3B Exploded views of the lens drive assembly of the camera module from different perspectives are shown.

[0054] Figure 4 yes Figure 3B A magnified diagram of a local location.

[0055] Figure 5 A cross-sectional view of the first position of the lens drive assembly of the camera module is shown.

[0056] Figure 6A and Figure 6B They are Figure 5 Enlarged diagrams of different positions.

[0057] Figure 7 A cross-sectional view of the lens drive assembly of the camera module at a second location is shown.

[0058] Figure 8 yes Figure 7 An enlarged diagram of one of the locations.

[0059] Figure 9 A cross-sectional view of the lens drive assembly of the camera module at a third location is shown.

[0060] Figure 10 yes Figure 9 An enlarged diagram of one of the locations.

[0061] Figure 11 A cross-sectional view of the lens drive assembly of the camera module at a fourth position is shown.

[0062] Figure 12 yes Figure 11 An enlarged diagram of one of the locations.

[0063] Figure 13 A perspective view of a partial structure of the lens drive assembly of the camera module is shown.

[0064] Figure 14 A perspective view of a chip driver component of the camera module is shown.

[0065] Figure 15 An exploded view of the chip driver assembly of the camera module is shown.

[0066] Figure 16A and Figure 16B Cross-sectional views of different locations of the chip driver component of the camera module are shown.

[0067] Figure 17 A perspective view of a partial structure of the chip driver assembly of the camera module is shown.

[0068] Figure 18 A top view of a partial structure of the chip driver assembly of the camera module is shown.

[0069] Figure 19 A top view of a partial structure of a modified example of the chip driver assembly of the camera module is shown. Detailed Implementation

[0070] Before detailing any embodiment of the invention, it should be understood that the invention is not limited in its application to the details of the construction and arrangement of the components set forth in the following description or illustrated in the following figures. The invention can have other embodiments and can be practiced or carried out in various ways. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes and should not be considered limiting. The use of “comprising,” “including,” or “having,” and variations thereof is intended to cover the items set forth below and their equivalents, as well as any additional items. Unless otherwise specified or limited, the terms “installation,” “connection,” “support,” and “linkage,” and variations thereof are used broadly and cover both direct and indirect installation, connection, support, and linking. Moreover, “connection” and “linkage” are not limited to physical or mechanical connections or links.

[0071] Furthermore, firstly, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting this invention. Secondly, the term "a" should be understood as "at least one" or "one or more," that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be construed as a limitation on the quantity.

[0072] According to the accompanying drawings of the present invention Figures 1A to 18 A preferred embodiment of the present invention will be disclosed and described in the following description, wherein the camera module includes a lens assembly 20, a photosensitive assembly 30, and a lens driving assembly 40. The lens assembly 20 includes an optical lens 21, which is disposed in the photosensitive path of the photosensitive assembly 30. The lens driving assembly 40 is configured to drive the optical lens 21 to translate in order to achieve image stabilization of the camera module, and to drive the optical lens 21 to move along the optical axis of the camera module to achieve focusing of the camera module.

[0073] Preferably, refer to the appendix Figure 1A , Figure 1B and Figure 14 The camera module further includes a chip driving component 10, wherein the photosensitive component 30 is drivably disposed on the chip driving component 10 so that the photosensitive component 30 is driven to move by the chip driving component 10 to achieve image stabilization of the camera module.

[0074] In other words, in this specific example of the camera module of the present invention, the chip driving component 10 is configured to drive the photosensitive component 30 to move, and the lens driving component 40 is configured to drive the optical lens 21 to move, thereby greatly improving the image stabilization effect of the camera module.

[0075] Reference Appendix Figure 3A and Figure 3BThe lens driving assembly 40 includes a lens stabilization carrier 410, a lens focusing inner frame 420, and a lens focusing outer frame 430. The optical lens 21 is disposed on the lens stabilization carrier 410. The lens stabilization carrier 410 is drivably connected to the lens focusing inner frame 420. The lens focusing inner frame 420 is drivably connected to the lens focusing outer frame 430. The lens focusing outer frame 430 can be directly or indirectly disposed on the photosensitive component 30 so that the lens driving assembly 40 maintains the light-sensing path of the optical lens 21 on the photosensitive component 30. Alternatively, the lens focusing outer frame 430 can be directly or indirectly disposed on the chip driving assembly 10 so that the lens driving assembly 40 maintains the light-sensing path of the optical lens 21 on the photosensitive component 30.

[0076] When the inner focusing frame 420 remains stationary and the lens stabilization carrier 410 is driven to move relative to the inner focusing frame 420, the lens stabilization carrier 410 can drive the optical lens 21 to move relative to the photosensitive element 30 in a direction perpendicular to the optical axis of the camera module, thereby achieving image stabilization of the camera module; that is, the optical lens 21 can be translated. In other words, the lens stabilization carrier 410 can form a movable part of a lens stabilization section 41 of the lens drive assembly 40, thus forming a lens stabilization movable unit 411 of the lens stabilization section 41. Correspondingly, the inner focusing frame 420 can form a fixed part of the lens stabilization section 41 of the lens drive assembly 40, thus forming a lens stabilization fixed unit 412 of the lens stabilization section 41.

[0077] When the outer focusing frame 430 remains stationary and the inner focusing frame 420 is driven to move relative to the outer focusing frame 430, the inner focusing frame 420 drives the optical lens 21 to move along the optical axis of the camera module via the lens image stabilization carrier 410, thereby achieving focusing of the camera module. In other words, the inner focusing frame 420 can form a movable part of the lens focusing section 42 of the lens drive assembly 40, thus forming a movable lens focusing unit 421 of the lens focusing section 42. Correspondingly, the outer focusing frame 430 can form a fixed part of the lens focusing section 42, thus forming a fixed lens focusing unit 422 of the lens focusing section 42.

[0078] In other words, the lens driving assembly 40 includes a lens stabilization unit 41 and a lens focusing unit 42. The lens stabilization unit 41 includes a movable lens stabilization unit 411 and a fixed lens stabilization unit 412. The optical lens 21 is disposed on the movable lens stabilization unit 411. When the movable lens stabilization unit 411 is driven to move relative to the fixed lens stabilization unit 412 in a direction perpendicular to the optical axis of the camera module, the camera module achieves image stabilization. The lens focusing unit 42 includes a movable lens focusing unit 421 and a fixed lens focusing unit 422. When the movable lens focusing unit 421 is driven to move relative to the fixed lens focusing unit 422 in a direction perpendicular to the optical axis of the camera module, the camera module achieves focusing.

[0079] Reference Appendix Figure 3A , Figure 3B , Figures 7 to 12 The lens stabilization movable unit 411 includes the lens stabilization carrier 410, the lens stabilization fixing unit 412 includes the lens focusing inner frame 420, the lens focusing movable unit 421 includes the lens focusing inner frame 420, and the lens focusing fixing unit 422 includes the lens focusing outer frame 430. That is, the lens focusing inner frame 420 serves as part of both the lens stabilization part 41 and the lens focusing part 42. Thus, the lens drive assembly 40 has a compact structure, which helps to reduce the overall size of the camera module.

[0080] Continue to refer to the appendix Figure 3A , Figure 3B , Figures 7 to 12 The lens stabilization unit 41 further includes a lens stabilization drive unit 413, wherein the lens stabilization drive unit 413 includes at least one lens stabilization magnet 4131 and at least one lens stabilization coil 4132. The lens stabilization magnet 4131 is disposed on the lens stabilization carrier 410, and the lens stabilization coil 4132 is disposed on the lens focusing inner frame 420. The positions of the lens stabilization magnet 4131 and the lens stabilization coil 4132 correspond to each other. When current is passed through the lens stabilization coil 4132 to generate a magnetic field, the magnetic field of the lens stabilization coil 4132 and the magnetic field of the lens stabilization magnet 4131 interact to drive the lens stabilization carrier 410 to move the optical lens 21 along a direction perpendicular to the optical axis of the camera module, thereby achieving image stabilization of the camera module.

[0081] It is worth mentioning that the lens stabilization carrier 410 needs to be repositioned both during the image stabilization process and the focusing process of the camera module. Conversely, the lens focusing inner frame 420 only needs to be repositioned during the focusing process; it remains stationary during image stabilization. Therefore, by placing the lens stabilization magnet 4131 on the lens stabilization carrier 410 and the lens stabilization coil 4132 on the lens focusing inner frame 420, the camera module of the present invention simplifies the circuit design and ensures the reliability of the camera module during use.

[0082] Nevertheless, in other examples of the camera module of the present invention, the lens stabilization magnet 4131 of the lens stabilization drive unit 413 may be disposed in the lens focusing inner frame 420, and correspondingly, the lens stabilization coil 4132 may be disposed in the lens stabilization carrier 410.

[0083] Furthermore, the lens stabilization carrier 410 has a carrier top surface 4101, a carrier bottom surface 4102 opposite to the carrier top surface 4101, and a carrier channel 4103 extending from the carrier top surface 4101 to the carrier bottom surface 4102, wherein the lens stabilization carrier 410 surrounds the optical lens 21 to allow the optical lens 21 to be disposed in the carrier channel 4103 of the lens stabilization carrier 410. Preferably, the outer wall of the optical lens 21 and the inner wall of the lens stabilization carrier 410 for forming the carrier channel 4103 are attached to fix the optical lens 21 to the lens stabilization carrier 410.

[0084] The lens focusing inner frame 420 includes a lens focusing inner frame top 4201, wherein the lens focusing inner frame top 4201 has an inner frame top surface 42011, an inner frame bottom surface 42012 opposite to the inner frame top surface 42011, and an inner frame channel 42013 extending from the inner frame top surface 42011 to the inner frame bottom surface 42012. The lens image stabilization carrier 410 is suspended at the bottom of the lens focusing inner frame 420 in such a manner that the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 and the carrier top surface 4101 of the lens image stabilization carrier 410 correspond to each other, and the lens image stabilization carrier 410 is driven to move relative to the lens focusing inner frame top 4201. The optical lens 21 is movably held in the inner frame channel 42013 of the top of the inner lens focusing frame 4201, such that the top of the inner lens focusing frame 4201 surrounds the optical lens 21.

[0085] It is understood that there is a gap between the inner wall of the top 4201 of the lens focusing inner frame that defines the inner frame channel 42013 and the outer wall of the optical lens 21, so as to allow the optical lens 21 to translate and achieve image stabilization of the camera module.

[0086] The lens stabilization magnet 4131 of the lens stabilization drive unit 413 is disposed on the top surface 4101 of the lens stabilization carrier 410, and the lens stabilization coil 4132 is disposed on the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame. Thus, the lens stabilization magnet 4131 and the lens stabilization coil 4132 are adjacent, ensuring that the magnetic field generated by the lens stabilization coil 4132 when energized and the magnetic field of the lens stabilization magnet 4131 can interact, thereby increasing sufficient driving force to drive the lens stabilization carrier 410 to move the optical lens 21 vertically. The image is translated in a direction perpendicular to the optical axis of the camera module to achieve image stabilization of the camera module; on the other hand, the lens stabilization magnet 4131 and the lens stabilization coil 4132 can be held between the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame, so that the lens stabilization magnet 4131 and the lens stabilization coil 4132 are far away from the photosensitive component 30 and / or the chip driving component 10, thereby reducing the magnetic interference of the magnetic field overflowing from the lens stabilization magnet 4131 towards the photosensitive component 30 on the circuit board, photosensitive element and chip driving component 10 of the photosensitive component 30.

[0087] Preferably, the lens stabilization carrier 410 further has at least one stabilization magnet groove 4104, which extends from the top surface 4101 of the carrier to the bottom surface 4102 of the carrier. The lens stabilization magnet 4131 is embedded in the stabilization magnet groove 4104 of the lens stabilization carrier 410. This arrangement of the lens stabilization magnet 4131 within the lens stabilization carrier 410 further reduces the height of the lens stabilization magnet 4131, thereby facilitating a reduction in the overall height of the lens drive assembly 40.

[0088] It is worth mentioning that, by embedding the lens stabilization magnet 4131 into the stabilization magnet groove 4104 of the lens stabilization carrier 410, the top surface of the lens stabilization magnet 4131 can be lower than the carrier top surface 4101 of the lens stabilization carrier 410, or the top surface of the lens stabilization magnet 4131 can be flush with the carrier top surface 4101 of the lens stabilization carrier 410. It is understood that, by embedding the lens stabilization magnet 4131 into the stabilization magnet groove 4104 of the lens stabilization carrier 410, the top surface of the lens stabilization magnet 4131 can be higher than the carrier top surface 4101 of the lens stabilization carrier 410.

[0089] Optionally, in other examples of the camera module of the present invention, the lens stabilization magnet 4131 may be directly attached to the top surface 4101 of the lens stabilization carrier 410.

[0090] The lens stabilization drive unit 413 includes four lens stabilization magnets 4131 and four lens stabilization coils 4132. Each lens stabilization magnet 4131 is disposed on the top surface 4101 of the lens stabilization carrier 410, and each lens stabilization coil 4132 is disposed on the bottom surface 42012 of the inner frame of the lens focusing inner frame top 4201 of the lens focusing inner frame 420. The positions of each lens stabilization magnet 4131 and each lens stabilization coil 4132 are respectively opposite to each other.

[0091] For ease of description and understanding, the four lens stabilization magnets 4131 of the lens stabilization drive unit 413 are defined as a first stabilization magnet 4131a, a second stabilization magnet 4131b, a third stabilization magnet 4131c, and a fourth stabilization magnet 4131d, wherein the first stabilization magnet 4131a, the second stabilization magnet 4131b, the third stabilization magnet 4131c, and the fourth stabilization magnet 4131d are respectively fixed to the lens stabilization carrier 410. Accordingly, the four image stabilization coils 4132 of the lens stabilization drive unit 413 are defined as a first image stabilization coil 4132a, a second image stabilization coil 4132b, a third image stabilization coil 4132c, and a fourth image stabilization coil 4132d, wherein the first image stabilization coil 4132a, the second image stabilization coil 4132b, the third image stabilization coil 4132c, and the fourth image stabilization coil 4132d are respectively fixed to the lens focusing inner frame 420.

[0092] The position of the first stabilizing magnet 4131a corresponds to the position of the first stabilizing coil 4132a; the position of the second stabilizing magnet 4131b corresponds to the position of the second stabilizing coil 4132b; the position of the third stabilizing magnet 4131c corresponds to the position of the third stabilizing coil 4132c; and the position of the fourth stabilizing magnet 4131d corresponds to the position of the fourth stabilizing coil 4132d. Thus, when the first stabilizing coil 4132a, the second stabilizing coil 4132b, the third stabilizing coil 4132c, and the fourth stabilizing coil 4132d are aligned... When coils 4132d are energized to generate magnetic fields, the magnetic fields of the first image stabilization coil 4132a, the second image stabilization coil 4132b, the third image stabilization coil 4132c, and the fourth image stabilization coil 4132d interact with the magnetic fields of the first image stabilization magnet 4131a, the second image stabilization magnet 4131b, the third image stabilization magnet 4131c, and the fourth image stabilization magnet 4131d, respectively, to drive the lens stabilization carrier 410 to move the optical lens 21 in a plane perpendicular to the optical axis of the camera module, thereby achieving image stabilization of the camera module.

[0093] Preferably, the top surface 4101 of the lens image stabilization carrier 410 is provided with four image stabilization magnet grooves 4104, which are respectively used to accommodate the first image stabilization magnet 4131a, the second image stabilization magnet 4131b, the third image stabilization magnet 4131c and the fourth image stabilization magnet 4131d. Based on the positions of the first image stabilizing magnet 4131a, the second image stabilizing magnet 4131b, the third image stabilizing magnet 4131c, and the fourth image stabilizing magnet 4131d, the four image stabilizing magnet grooves 4104 are sequentially defined as a first magnet groove 4104a, a second magnet groove 4104b, a third magnet groove 4104c, and a fourth magnet groove 4104d. The first image stabilizing magnet 4131a is housed in the first magnet groove 4104a of the lens stabilizing carrier 410, the second image stabilizing magnet 4131b is housed in the second magnet groove 4104b of the lens stabilizing carrier 410, the third image stabilizing magnet 4131c is housed in the third magnet groove 4104c of the lens stabilizing carrier 410, and the fourth image stabilizing magnet 4131d is housed in the fourth magnet groove 4104d of the lens stabilizing carrier 410.

[0094] The lens stabilization carrier 410 has a near side 41001, a far side 41002, and two side sides 41003. The near side 41001 and the far side 41002 correspond to each other, and the two side sides 41003 correspond to each other. The opposite ends of the two side sides 41003 extend to be connected to the ends of the near side 41001 and the far side 41002, respectively. The side of the lens stabilization carrier 410 closest to the lens focusing frame 430 is defined as the near side 41001. Correspondingly, the side of the lens stabilization carrier 410 furthest from the lens focusing frame 430 is defined as the far side 41002. The other two sides of the lens stabilization carrier 410 are defined as the side sides 41003.

[0095] The second magnetic groove 4104b and the third magnetic groove 4104c are disposed side-by-side on the distal side 41002 of the lens stabilization carrier 410, the first magnetic groove 4104a is disposed on one side 41003 of the lens stabilization carrier 410, and the fourth magnetic groove 4104d is disposed on the other side 41003 of the lens stabilization carrier 410, and the first magnetic groove 4104a and the second magnetic groove 4104b are parallel to each other. The second image stabilizing magnet 4131b and the third image stabilizing magnet 4131c are disposed side-by-side on the distal side 41002 of the lens image stabilization carrier 410, the first image stabilizing magnet 4131a is disposed on one side 41003 of the lens image stabilization carrier 410, and the fourth image stabilizing magnet 4131d is disposed on the other side 41003 of the lens image stabilization carrier 410, and the first image stabilizing magnet 4131a and the fourth image stabilizing magnet 4131d are parallel to each other. It can be understood that the first image stabilizing magnet 4131a and the second image stabilizing magnet 4131b are disposed adjacent to each other, and the third image stabilizing magnet 4131c and the fourth image stabilizing magnet 4131d are disposed adjacent to each other.

[0096] Preferably, the extension direction of the first anti-shake magnet 4131a is perpendicular to the extension direction of the second anti-shake magnet 4131b, the extension direction of the third anti-shake magnet 4131c is perpendicular to the extension direction of the fourth anti-shake magnet 4131d, and the first anti-shake magnet 4131a and the fourth anti-shake magnet 4131d are arranged axially symmetrically, while the second anti-shake magnet 4131b and the third anti-shake magnet 4131c are arranged axially symmetrically.

[0097] Preferably, the second image stabilizing magnet 4131b and the third image stabilizing magnet 4131c are smaller than the first image stabilizing magnet 4131a and the fourth image stabilizing magnet 4131d. This helps to reduce the lateral dimension of the lens image stabilizing carrier 410, thereby reducing the lateral dimension of the lens drive assembly 40.

[0098] Optionally, in other examples of the camera module of the present invention, the distal side 41002 of the lens stabilization carrier 410 may be provided with a stabilization magnet groove 4104 and a lens stabilization magnet 4131. In this case, the size of the lens stabilization magnet 4131 disposed on the distal side 41002 of the lens stabilization carrier 410 is the same as the size of the lens stabilization magnet 4131 disposed on the side 41003 of the lens stabilization carrier 410. It is understood that in this embodiment, the lens stabilization drive unit 413 includes three lens stabilization magnets 4131 and three lens stabilization coils 4132.

[0099] Optionally, in other examples of the camera module of the present invention, each of the two sides 41003 of the lens stabilization carrier 410 is provided with a lens stabilization magnet 4131, or each of the two sides 41003 of the lens stabilization carrier 410 is provided with two lens stabilization magnets 4131, while no lens stabilization magnet 4131 is provided on the far side 41002 of the lens stabilization carrier 410.

[0100] Reference Appendix Figure 5 and Figure 6B The lens stabilization unit 41 further includes at least one lens stabilization magnetic guiding unit 419, wherein the lens stabilization magnetic guiding unit 419 is formed in the lens stabilization carrier 410 by insert injection molding, and the position of the lens stabilization magnetic guiding unit 419 corresponds to the position of the lens stabilization magnet 4131. Thus, on the one hand, the lens stabilization magnet 4131 and the lens stabilization magnetic guiding unit 419 can be magnetically attracted to each other to increase the stability of the combination relationship between the lens stabilization magnet 4131 and the lens stabilization carrier 410; on the other hand, the lens stabilization magnetic guiding unit 419 can constrain the magnetic field of the lens stabilization magnet 4131.

[0101] Optionally, the surface of the lens image stabilization magnetic guiding unit 419 may be exposed in the image stabilization magnet groove 4104 of the lens image stabilization carrier 410, so that the lens image stabilization magnet 4131 and the lens image stabilization magnetic guiding unit 419 can be in direct contact.

[0102] The lens stabilization unit 41 further includes a lens stabilization circuit board 414. The lens stabilization coil 4132 is fixed and electrically connected to the lens stabilization circuit board 414. The lens stabilization circuit board 414 is fixed to the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame. Thus, the lens stabilization coil 4132 is disposed in the lens focusing inner frame 420 through the lens stabilization circuit board 414. The camera module supplies power to the lens stabilization coil 4132 through the lens stabilization circuit board 414, causing it to generate a magnetic field. Thus, the magnetic field of the lens stabilization coil 4132 and the magnetic field of the lens stabilization magnet 4131 interact to drive the lens stabilization carrier 410 to translate, thereby achieving image stabilization of the camera module.

[0103] For example, in this specific example of the camera module of the present invention, the lens anti-shake circuit board 414 is in a "C" shape, which is fixed to the inner frame bottom surface 42012 of the top of the lens focusing inner frame 4201 and surrounds the inner frame channel 42013 of the top of the lens focusing inner frame 4201. Among them, the first anti-shake coil 4132a, the second anti-shake coil 4132b, the third anti-shake coil 4132c, and the fourth anti-shake coil 4132d are all fixed to the inner frame bottom surface 42012 of the top of the lens focusing inner frame 420 of the lens focusing inner frame 420 through the lens anti-shake circuit board 414. For example, the first anti-shake coil 4132a, the second anti-shake coil 4132b, the third anti-shake coil 4132c, and the fourth anti-shake coil 4132d are respectively mounted on the lens anti-shake circuit board 414, and the lens anti-shake circuit board 414 is fixed to the inner frame bottom surface 42012 of the top of the lens focusing inner frame 420 of the lens focusing inner frame 420. In this way, the first anti-shake coil 4132a, the second anti-shake coil 4132b, the third anti-shake coil 4132c, and the fourth anti-shake coil 4132d are all fixed to the inner frame bottom surface 42012 of the top of the lens focusing inner frame 420 of the lens focusing inner frame 420 through the lens anti-shake circuit board 414.

[0104] Preferably, the lens anti-shake circuit board 414 is a flexible printed circuit board (FPC). In this way, the lens anti-shake circuit board 414 has a relatively thin thickness dimension, which is beneficial to reducing the overall height dimension of the lens driving component 40.

[0105] The lens anti-shake part 41 further includes at least one lens anti-shake position sensing element 415. The lens anti-shake position sensing element 415 is mounted on the lens anti-shake circuit board 414, and the position of the lens anti-shake position sensing element 415 corresponds to the position of the lens anti-shake magnet 4131. In this way, the lens anti-shake position sensing element 415 senses the translation direction and distance of the lens anti-shake carrier 410 driving the optical lens 21 by sensing the position of the lens anti-shake magnet 4131.

[0106] It is worth mentioning that the type of the lens anti-shake position sensing element 415 is not limited in the camera module of the present invention. For example, the lens anti-shake position sensing element 415 can be, but is not limited to, a Hall element.

[0107] Preferably, the lens stabilization position sensing element 415 and the lens stabilization coil 4132 are respectively located on opposite sides of the lens stabilization circuit board 414, wherein the top 4201 of the lens focusing inner frame further has at least one sensing element receiving cavity 42014 for accommodating the lens stabilization position sensing element 415. More preferably, the sensing element receiving cavity 42014 of the top 4201 of the lens focusing inner frame is a through hole. It is understood that by setting the lens stabilization position sensing element 415 and the lens stabilization coil 4132 on opposite sides of the lens stabilization circuit board 414, the camera module eliminates the need to consider how to arrange the lens stabilization position sensing element 415 during the design of the lens stabilization coil 4132, thus the setting of the lens stabilization position sensing element 415 does not occupy the length and width dimensions, which helps to reduce the length and width dimensions of the camera module. Meanwhile, the top 4201 of the lens focusing inner frame is provided with the sensing element receiving cavity 42014 to accommodate the lens stabilization position sensing element 415, so that the setting of the lens stabilization position sensing element 415 does not need to occupy the dimension in the height direction.

[0108] Preferably, in this specific example of the camera module of the present invention, the top 4201 of the lens focusing inner frame has two sensing element receiving cavities 42014, one of which corresponds to the distal side 41002 of the lens stabilization carrier 410, such that the lens stabilization position sensing element 415 held in this sensing element receiving cavity 42014 corresponds to the second stabilization coil 4132b or the third stabilization coil 4132c, for sensing the second stabilization magnet 4131b or the third stabilization magnet 4132c. When the position of the third stabilizing magnet 4131c changes, another sensing element receiving cavity 42014 corresponds to one of the sides 41003 of the lens stabilizing carrier 410, so that the lens stabilizing position sensing element 415 held in this sensing element receiving cavity 42014 corresponds to the first stabilizing coil 4132a or the fourth stabilizing coil 4132d, for sensing the position change of the first stabilizing magnet 4131a or the fourth stabilizing magnet 4131d, thereby obtaining the position of the lens stabilizing carrier 410.

[0109] The lens stabilization unit 41 further includes at least one lens stabilization magnetic unit 416 and one lens stabilization support unit 417. The lens stabilization magnetic unit 416 is disposed on the top 4201 of the inner lens focusing frame of the lens focusing inner frame 420, and the lens stabilization magnet 4131 of the lens stabilization drive unit 413 corresponds to the lens stabilization magnetic unit 416. Thus, the lens stabilization magnetic unit 416 and the lens stabilization magnet 4131 attract each other due to magnetic attraction, so that the lens stabilization carrier 410 and the top 4201 of the inner lens focusing frame of the lens focusing inner frame 420 tend to move closer to each other. The lens stabilization support unit 417 is disposed between the top surface 4101 of the lens stabilization carrier 410 and the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame, to prevent the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame 420 from fitting together. With this structure, the lens stabilization carrier 410 is suspended in the receiving cavity 4203 of the lens focusing inner frame 420.

[0110] In this specific example of the camera module of the present invention, the lens stabilization magnetic unit 416 surrounds the inner frame channel 42013 of the top 4201 of the lens focusing inner frame. The first stabilization magnet 4131a, the second stabilization magnet 4131b, the third stabilization magnet 4131c, and the fourth stabilization magnet 4131d correspond to different positions of the lens stabilization magnetic unit 416, so that when the lens stabilization carrier 410 is driven to translate relative to the lens focusing inner frame 420, the lens stabilization carrier 410 can be prevented from tilting.

[0111] Preferably, the lens stabilization magnetic unit 416 is enclosed inside the top 4201 of the inner lens focusing frame of the inner lens focusing frame 420. For example, the lens stabilization magnetic unit 416 can be enclosed inside the top 4201 of the inner lens focusing frame 420 by injection molding.

[0112] Furthermore, the lens stabilization support unit 417 includes at least three lens stabilization tracks 4171 and at least three lens stabilization moving elements 4173. Each lens stabilization track 4171 includes a lower groove track 41711 and an upper groove track 41712, wherein the lower groove track 41711 is formed on the top surface 4101 of the lens stabilization carrier 410, and the upper groove track 41712 is formed on the bottom surface 42012 of the inner frame of the lens focusing inner frame top 4201 of the lens focusing inner frame 420. The positions of the lower groove track 41711 and the upper groove track 41712 correspond to each other, and the extension direction of the lower groove track 41711 and the extension direction of the upper groove track 41712 are perpendicular to each other, forming a cross shape. The bottom and top of the lens stabilization movable element 4173 are respectively housed in the lower groove track 41711 and the upper groove track 41712 of the lens stabilization rail 4171, and are allowed to move along the lower groove track 41711 and the upper groove track 41712, respectively. Thus, the lens stabilization movable element 4173 is movably held between the lens stabilization carrier 410 and the top of the lens focusing inner frame 4201, preventing the lens stabilization carrier 410 and the top of the lens focusing inner frame 4201 from fitting together, thereby suspending the lens stabilization carrier 410 at the bottom of the lens focusing inner frame 420. Furthermore, by allowing the extension directions of the lower groove track 41711 and the upper groove track 41712 to be perpendicular to each other, interference can be avoided when the lens stabilization carrier 410 is driven to translate by the lens stabilization drive unit 413.

[0113] For example, in this specific example of the camera module of the present invention, the lens stabilization active element 4173 may be a ball bearing, thereby allowing the lens stabilization active element 4173 to roll along the lower groove track 41711 and the upper groove track 41712, such that the lens stabilization active element 4173 is rotatably held between the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame to prevent the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame 420 from fitting together, thereby suspending the lens stabilization carrier 410 in the receiving cavity 4203 of the lens focusing inner frame 420. Optionally, in other examples of the camera module of the present invention, the lens stabilization active element 4173 may be a slider, thereby allowing the lens stabilization active element 4173 to slide along the lower groove track 41711 and the upper groove track 41712, such that the lens stabilization active element 4173 is slidably held between the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame to prevent the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame 420 from adhering to each other, thereby suspending the lens stabilization carrier 410 at the bottom of the lens focusing inner frame 420.

[0114] Preferably, in embodiments where the lens stabilization active element 4173 is implemented as a ball bearing, the diameters of these lens stabilization active elements 4173 of the lens stabilization support unit 417 are the same, thus ensuring the flatness of the top surface 4101 of the lens stabilization carrier 410 and the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame.

[0115] In this specific example of the camera module of the present invention, the lens stabilization support unit 417 includes four lens stabilization rails 4171 and four lens stabilization movable elements 4173, wherein the lower groove rails 41711 of the four lens stabilization rails 4171 are respectively formed at the four corners of the lens stabilization carrier 410, and the upper groove rails 41712 of the four lens stabilization rails 4171 are respectively formed at the four corners of the top 4201 of the lens focusing inner frame, so that the four lens stabilization movable elements 4173 are respectively held between the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame at the four corners of the lens stabilization carrier 410. That is, these lens stabilization active elements 4173 can be spaced around the optical lens 21 at intervals, so that: on the one hand, the lens stabilization drive unit 413 can smoothly drive the lens stabilization carrier 410 to move the optical lens 21 in a translational motion relative to the lens focusing inner frame 420; on the other hand, during the movement of the lens stabilization carrier 410 and the optical lens 21, the tilting of the lens stabilization carrier 410 and the optical lens 21 can be avoided.

[0116] Continue to refer to the appendix Figures 3A to 6A The inner lens focusing frame 420 includes a peripheral portion 4202 of the inner lens focusing frame, and the peripheral portion 4202 of the inner lens focusing frame further includes a side portion 42023 of the inner lens focusing frame. The side portion 42023 of the inner lens focusing frame extends downward integrally from the top 4201 of the inner lens focusing frame, and the outer lens focusing frame 430 is disposed adjacent to the side portion 42023 of the inner lens focusing frame 420.

[0117] The lens focusing unit 42 further includes a lens focusing drive unit 423. The lens focusing drive unit 423 includes at least one lens focusing magnet 4231 and at least one lens focusing coil 4232. Each lens focusing magnet 4231 is respectively disposed on the lens focusing outer frame 430, and each lens focusing coil 4232 is respectively disposed on the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420. The positions of the lens focusing magnets 4231 and... The positions of the lens focusing coils 4232 are corresponding. When an electric current is passed through each lens focusing coil 4232 to generate a magnetic field, the magnetic field of each lens focusing coil 4232 and the magnetic field of each lens focusing magnet 4231 interact to drive the lens focusing inner frame 420 to move the lens image stabilization carrier 410 and the optical lens 21 along the optical axis of the camera module, thereby achieving focusing of the camera module.

[0118] Optionally, in other examples of the camera module of the present invention, each of the lens focusing magnets 4231 of the lens focusing drive unit 423 may be disposed on the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420, and each of the lens focusing coils 4232 may be disposed on the lens focusing outer frame 430.

[0119] Specifically, in this particular example of the camera module of the present invention, the lens focusing drive unit 423 has two lens focusing magnets 4231 and two lens focusing coils 4232. The two lens focusing magnets 4231 are respectively fixedly disposed at the two ends of the lens focusing outer frame 430. Correspondingly, the two lens focusing coils 4232 are respectively fixed at the two ends of the same side of the lens focusing inner frame side portion 42023, so that the two lens focusing coils 4232 and the two lens focusing magnets 4231 correspond to each other.

[0120] More specifically, the lens focusing frame 430 has an outer frame 4301, an inner frame 4302 opposite to the outer frame 4301, and two focusing magnet grooves 4305. The two focusing magnet grooves 4305 are axially symmetrical and extend from the inner frame 4302 to the outer frame 4301 at opposite ends of the lens focusing frame 430. Each lens focusing magnet 4231 is embedded in the focusing magnet groove 4305 of the lens focusing frame 430, thus fixing each lens focusing magnet 4231 in the lens focusing frame 430. Furthermore, by embedding each lens focusing magnet 4231 in the focusing magnet groove 4305 of the lens focusing frame 430, the length and width dimensions of the lens drive assembly 40 can be reduced.

[0121] It is worth mentioning that, by embedding each of the lens focusing magnets 4231 into the focusing magnet grooves 4305 of the lens focusing outer frame 430, the lens focusing magnets 4231 can protrude from the inner side 4302 of the outer frame of the lens focusing outer frame 430, or the lens focusing magnets 4231 can be flush with the inner side 4302 of the outer frame of the lens focusing outer frame 430, or the lens focusing magnets 4231 can be recessed into the inner side 4302 of the outer frame of the lens focusing outer frame 430.

[0122] Alternatively, in other examples of the camera module of the present invention, each of the lens focusing magnets 4231 may be directly attached to the surface of the inner side 4302 of the outer frame of the lens focusing frame 430.

[0123] The lens focusing unit 42 includes a lens focusing circuit board 424, which further includes a mounting portion 4241 and a connecting portion 4242 integrally extending from the mounting portion 4241. The mounting portion 4241 is mounted on the outer side 4301 of the lens focusing outer frame 430. The connecting portion 4242 is electrically connected to the lens image stabilization magnetic unit 416. Each lens focusing coil 4232 is electrically connected to the lens image stabilization magnetic unit 416. Thus, current can be sequentially provided to each lens focusing coil 4232 via the mounting portion 4241 and the connecting portion 4242 of the lens focusing circuit board 424, and the lens image stabilization magnetic unit 416. Preferably, two lens focusing coils 4232 are connected in series to facilitate electrical connection to the lens focusing circuit board 424 via the lens image stabilization magnetic unit 416. More preferably, the two lens focusing coils 4232 can be formed by winding a single conductive wire, thereby connecting the two lens focusing coils 4232 in series.

[0124] The lens focusing unit 42 further includes at least one lens focusing magnetic unit 426. The lens focusing magnetic unit 426 is disposed on the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420. Each lens focusing magnet 4231 of the lens focusing drive unit 423 corresponds to the lens focusing magnetic unit 426. Thus, the lens focusing magnetic unit 426 and the lens focusing magnet 4231 attract each other due to magnetic attraction, so that the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420 and the lens focusing outer frame 430 tend to move closer to each other.

[0125] Preferably, the lens focusing magnetic unit 426 is partially or entirely enclosed within the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420, wherein the lens focusing coil 4232 is located between the lens focusing magnet 4231 and the lens focusing magnetic unit 426. For example, the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420 can be used to enclose part or all of the lens focusing magnetic unit 426 by insert injection molding.

[0126] For example, in one specific example of the camera module of the present invention, the lens focusing magnetic unit 426 is completely enclosed inside the lens focusing inner frame side portion 4203 of the lens focusing inner frame 420. In this case, the lens focusing coil 4232 is attached to the surface of the lens focusing inner frame side portion 4203. In another specific example of the camera module of the present invention, the lens focusing magnetic unit 426 is partially enclosed inside the lens focusing inner frame side portion 4203 of the lens focusing inner frame 420, leaving the surface of the lens focusing magnetic unit 426 exposed. The lens focusing coil 4232 is attached to the surface of the lens focusing inner frame side portion 4203 and electrically connected to the lens focusing magnetic unit 426, for example, by welding the end of the lens focusing coil 4232 to the surface of the lens focusing magnetic unit 426.

[0127] The lens focusing circuit board 424 is a flexible printed circuit board (FPC), which helps to reduce the length and width of the lens drive assembly 40.

[0128] The connecting portion 4242 of the lens focusing circuit board 424 is bent and extended, and the lens focusing circuit board 424 is a flexible circuit board (FPC). The connecting portion 4242 of the lens focusing circuit board 424 and the lens stabilization magnetic unit 416 are electrically connected to the side of the inner lens focusing frame 420 away from the outer lens focusing frame 430. In this way, the length of the connecting portion 4242 can be increased, and correspondingly, the deformation range of the connecting portion 4242 can be increased. Thus, the lens focusing drive unit 423 can smoothly drive the inner lens focusing frame 420 to move the lens stabilization carrier 410 and the optical lens 21 along the optical axis of the camera module.

[0129] In other words, when the lens focusing drive unit 423 drives the inner lens focusing frame 420 to move relative to the outer lens focusing frame 430 along the optical axis of the camera module, the inner lens focusing frame 420 can cause the connecting portion 4242 of the lens focusing circuit board 424 to deform. By allowing the connecting portion 4242 to bend and extend, and by allowing the connecting portion 4242 and the lens image stabilization magnetic unit 416 to be electrically connected to the side of the inner lens focusing frame 420 away from the outer lens focusing frame 430, on the one hand, the influence of the lens focusing circuit board 424 on the movement amplitude of the inner lens focusing frame 420 can be reduced, and on the other hand, the impact on the circuit design and reliability of the lens focusing circuit board 424 can be reduced.

[0130] The connecting portion 4242 of the lens focusing circuit board 424 is distributed along the four sides of the top surface 42011 of the inner frame of the lens focusing inner frame 420, and is distributed in a circular manner around the inner frame channel 42013 of the lens focusing inner frame 420.

[0131] Furthermore, the connecting portion 4242 of the lens focusing circuit board 424 includes a movable electrical connection portion 42421 and four deformable electrical connection portions 42422. The movable electrical connection portion 42421 is fixed to the inner lens focusing frame 420 and electrically connected to the lens image stabilization magnetic unit 416. The four deformable electrical connection portions 42422 are electrically connected to the mounting portion 4241 and the movable electrical connection portion 42421. When the inner lens focusing frame 420 is driven to move relative to the outer lens focusing frame 430 along the optical axis of the camera module, the four deformable electrical connection portions 42422 can reduce the resistance of the lens focusing circuit board 424 to the movement of the inner lens focusing frame 420, thereby allowing the inner lens focusing frame 420 to be driven smoothly.

[0132] Specifically, the four deformable electrical connections 42422 are sequentially defined as a first connection 42422a, a second connection 42422b, a third connection 42422c, and a fourth connection 42422d. The first connection 42422a and the third connection 42422c are arranged symmetrically, as are the second connection 42422b and the fourth connection 42422d. The first connection 42422a and the second connection 42422b are connected and used to conduct electricity between the mounting portion 4241 and the movable electrical connection 42421. Correspondingly, the third connection 42422c and the fourth connection 42422d are connected and used to conduct electricity between the mounting portion 4241 and the movable electrical connection 42421.

[0133] Reference Appendix Figure 13The lens focusing magnetic unit 426 has two components, with one lens focusing coil 4232 electrically connected to one lens focusing magnetic unit 426 and the other lens focusing coil 4232 electrically connected to the other lens focusing magnetic unit 426. The lens image stabilization magnetic unit 416 includes a first conductive magnetic element 4162 and a second conductive magnetic element 4163. The first conductive magnetic element 4162 extends integrally from one lens focusing magnetic unit 426 to the movable electrical connection portion 42421 of the connection portion 4242 of the lens focusing circuit board 424, allowing one lens focusing coil 4232 to be electrically connected to the lens focusing circuit board 424 sequentially through the lens focusing magnetic unit 426 and the first conductive magnetic element 4162. Different positions of the first conductive magnetic element 4162 correspond to the first image stabilization magnetic element 4163. The second image stabilizing magnet 4131a and the second image stabilizing magnet 4131b are wherein the second conductive magnetic attraction element 4163 extends integrally from another lens focusing magnetic attraction unit 426 to the movable electrical connection portion 42421 of the connection portion 4242 of the lens focusing circuit board 424, so as to allow another lens focusing coil 4232 to be electrically connected to the lens focusing circuit board 424 in sequence through the lens focusing magnetic attraction unit 426 and the second conductive magnetic attraction element 4163, and different positions of the second conductive magnetic attraction element 4163 correspond to the third image stabilizing magnet 4131c and the fourth image stabilizing magnet 4131d, respectively.

[0134] Continue to refer to the appendix Figure 13 The lens image stabilization magnetic unit 416 further includes a pair of first conductors 4164 and a pair of second conductors 4165, wherein the opposite ends of the pair of first conductors 4164 are respectively electrically connected to the movable electrical connection portion 42421 of the connection portion 4242 of the lens focusing circuit board 424 and the lens image stabilization circuit board 414, and different positions of the pair of first conductors 4164 correspond to the first image stabilization magnet 4131a and the second image stabilization magnet 4131b, respectively. The two ends of the second conductor 4165 are respectively electrically connected to the movable electrical connection portion 42421 of the connection portion 4242 of the lens focusing circuit board 424 and the lens image stabilization circuit board 414, and different positions of the pair of second conductors 4165 correspond to the third image stabilization magnet 4131c and the fourth image stabilization magnet 4131d, so that the lens image stabilization circuit board 414 and the lens focusing circuit board 424 are electrically connected through the lens image stabilization magnetic unit 416.

[0135] The lens focusing unit 42 further includes a lens focusing sensing unit 425, wherein the lens focusing sensing unit 425 includes a lens focusing sensing magnet 4251 and a lens focusing position sensing element 4252. The lens focusing sensing magnet 4251 is fixed to the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420. The lens focusing position sensing element 4252 is fixed to and electrically connected to the mounting portion 4241 of the lens focusing circuit board 424, and the lens focusing position sensing element 4252 corresponds to the lens focusing sensing magnet 4251. The lens focusing position sensing element 4252 is adapted to obtain the position of the lens focusing inner frame 420 by sensing the position change of the lens focusing sensing magnet 4251.

[0136] It is worth noting that the type of the lens focus position sensing element 4252 is not limited in the camera module of the present invention. For example, in one alternative example, the lens focus position sensing element 4252 may be a Hall element. In another alternative example, the lens focus position sensing element 4252 may be a focus drive chip adapted to control the current of the lens focus coil 4232 while acquiring the position change of the lens focus sensing magnet 4251.

[0137] It is worth mentioning that, in other examples of the camera module of the present invention, the lens focus sensing magnet 4251 can be disposed on the lens focus outer frame 430, and the lens focus position sensing element 4252 can be electrically connected to the lens focus magnetic unit 426.

[0138] Specifically, the lens focusing inner frame 4202 of the lens focusing inner frame 420 further has a sensing magnet groove 42025, which is formed in the middle of the side portion 42023 of the lens focusing inner frame and between the two lens focusing coils 4232. The lens focusing sensing magnet 4251 is embedded in the sensing magnet groove 42025 of the lens focusing inner frame 420. The lens focusing outer frame 430 has a sensing element through hole 4304, which extends from the outer side 4301 to the inner side 4302 of the outer frame in the middle of the lens focusing outer frame 430. The lens focusing position sensing element 4252 is mounted on the mounting portion 4241 of the lens focusing circuit board 424, and the lens focusing position sensing element 4252 is held in the sensing element through hole 4304 of the lens focusing outer frame 430.

[0139] The lens focusing unit 42 further includes a lens focusing support unit 427, which is disposed between the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420 and the lens focusing outer frame 430 to prevent the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420 and the lens focusing outer frame 430 from fitting together. With such a structure as described above, the lens focusing inner frame 420 is suspended on the side portion of the lens focusing outer frame 430.

[0140] Further, the lens focusing support unit 427 includes at least two lens focusing tracks 4271 and at least three lens focusing movable elements 4273. Each of the lens focusing tracks 4271 respectively includes an inner groove track 42711 and an outer groove track 42712. The inner groove track 42711 is formed on the lens focusing inner frame side portion 42023 and is located outside the lens focusing magnet 4231. The outer groove track 42712 is formed on the inner side 4302 of the outer frame of the lens focusing outer frame 430 and is located outside the lens focusing coil 4232. And the inner groove track 42711 and the outer groove track 42712 respectively extend along the height direction of the imaging module, forming an "I" shape, that is, the inner groove track 42711 and the outer groove track 42712 respectively extend along the Z-axis direction. The inner and outer parts of the lens focusing movable element 4273 are respectively accommodated in the inner groove track 42711 and the outer groove track 42712 of the lens focusing track 4271. Thus, the lens focusing movable element 4273 is movably held between the lens focusing inner frame side portion 42023 and the lens focusing outer frame 430 to prevent the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420 and the lens focusing outer frame 430 from fitting together, thereby suspending the lens focusing inner frame 420 on the side portion of the lens focusing outer frame 430. And by allowing the inner groove track 42711 and the outer groove track 42712 to respectively extend along the height direction of the imaging module, the lens focusing inner frame 420 is allowed to move relative to the lens focusing outer frame 430 along the height direction of the imaging module.

[0141] Preferably, in this specific example of the imaging module of the present invention, the lens focusing movable element 4273 is a ball, so that the lens focusing movable element 4273 is rollably held between the lens focusing inner frame side portion 42023 and the lens focusing outer frame 430 to prevent the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420 and the lens focusing outer frame 430 from fitting together, thereby suspending the lens focusing inner frame 420 on the side portion of the lens focusing outer frame 430.

[0142] Optionally, in another specific example of the camera module of the present invention, the lens focusing active element 4273 is a slider, so that the lens focusing active element 4273 is slidably held between the lens focusing inner frame side portion 42023 and the lens focusing outer frame 430 to prevent the lens focusing inner frame side portion 42023 and the lens focusing outer frame 430 from fitting together, thereby suspending the lens focusing inner frame 420 on the side of the lens focusing outer frame 430.

[0143] Preferably, the lens focusing support unit 427 includes two lens focusing tracks 4271 and four lens focusing moving elements 4273 implemented as ball bearings. The two lens focusing tracks 4271 are arranged axially symmetrically, and each lens focusing track 4271 accommodates two lens focusing moving elements 4273. This helps to ensure that the lens focusing drive unit 423 smoothly drives the inner lens focusing frame 420 to move relative to the outer lens focusing frame 430 along the height direction of the camera module.

[0144] Preferably, the diameters of the lens focusing moving elements 4273, which are implemented as ball bearings in the lens focusing support unit 427, are the same, so as to ensure the flatness of the inner lens focusing frame side 42023 of the inner lens focusing frame 420 and the inner side 4302 of the outer lens focusing frame 430.

[0145] The lens focusing track 4271 includes at least one partition 42713, which is disposed in the middle of the inner groove track 42711 to separate the two lens focusing active elements 4273, thereby reducing interference between the two lens focusing active elements 4273 disposed in the same lens focusing track 4271, so as to ensure the reliability and stability of the lens drive assembly 40.

[0146] Optionally, in other examples of the camera module of the present invention, the partition 42713 may be disposed in the middle of the outer groove track 42712 to separate the two lens focusing active elements 4273. Alternatively, a partition 42713 may be disposed in the middle of the inner groove track 42711 and the middle of the outer groove track 42712 of the lens focusing track 4271 to separate the two lens focusing active elements 4273.

[0147] Optionally, in other examples of the camera module of the present invention, the lens focusing active element 4273 may be glued or welded to the inner groove track 42711 of the lens focusing track 4271, or the lens focusing active element 4273 may be glued or welded to the outer groove track 42712 of the lens focusing track 4271.

[0148] Furthermore, in some examples of the camera module of the present invention, the size of the lens focusing active element 4273 of the lens focusing support unit 427 may be smaller than or equal to the size of the lens stabilization active element 4173 of the lens stabilization support unit 417. It is understood that reducing the size of the lens focusing active element 4273 can reduce the size of the lens focusing track 4271, thereby reducing the length and width dimensions (i.e., the lateral dimension) of the lens drive assembly 40. For example, in a specific example of the camera module of the present invention, the diameter of the lens focusing active element 4273 of the lens focusing support unit 427 is 0.7 mm, and the diameter of the lens stabilization active element 4173 of the lens stabilization support unit 417 is 0.8 mm.

[0149] In some other examples of the camera module of the present invention, the size of the lens focusing active element 4273 of the lens focusing support unit 427 can be larger than the size of the lens stabilization active element 4173 of the lens stabilization support unit 417. Reducing the size of the lens stabilization active element 4173 is beneficial to reducing the height dimension (i.e., the longitudinal dimension) of the lens drive assembly 40.

[0150] In addition, the height position of the lens stabilization active element 4173 of the lens stabilization support unit 417 is between the two lens focusing active elements 4273 of the lens focusing support unit 427 located on the same lens focusing track 4271. In this way, the height position of the lens stabilization carrier 410 can be lowered, which helps to reduce the height of the lens drive assembly 40.

[0151] Reference Appendix Figure 5 and Figure 6AThe height of the lens focusing magnetic unit 426 is greater than or equal to the height of the lens focusing magnet 4231. This prevents a diagonal pulling force between the lens focusing magnetic unit 426 and the lens focusing magnet 4231 when the inner lens focusing frame 420 moves relative to the outer lens focusing frame 430 in the height direction during autofocusing of the camera module. It is understood that if a diagonal pulling force is generated between the lens focusing magnetic unit 426 and the lens focusing magnet 4231, the component of this diagonal pulling force in the height direction (optical axis direction) will cancel out the driving force generated by the lens focusing magnet 4231 and the lens focusing coil 4232, thus hindering the movement of the inner lens focusing frame 420 in the height direction. In other words, by making the height of the lens focusing magnetic unit 426 greater than or equal to the height of the lens focusing magnet 4231, the lens focusing magnet 4231 and the lens focusing coil 4232 can cooperate with each other to smoothly drive the inner lens focusing frame 420 to move relative to the outer lens focusing frame 430 in the height direction, so as to achieve focusing of the camera module.

[0152] Preferably, during the focusing process of the camera module, the lens focusing magnetic unit 426 always covers the lens focusing magnet 4231 in the height direction. That is, the lower side of the lens focusing magnet 4231 is always higher than the lower side of the lens focusing magnetic unit 426 and the upper side of the lens focusing magnet 4231 is always lower than the upper side of the lens focusing magnetic unit 426. As a result, the magnetic attraction force of the lens focusing magnet 4231 and the lens focusing magnetic unit 426 in the height direction is further reduced, so as to reduce the impact on the movement of the lens focusing inner frame 420 in the height direction.

[0153] The lens focusing and fixing unit 422 further includes a lens driving base 440 and a lens driving housing 450. The lens driving base 440 has a base channel 441, and the lens driving housing 450 has a housing channel 451. The lens driving housing 450 is mounted on the lens driving base 440 to form an accommodating space 460 between the lens driving housing 450 and the lens driving base 440. The base channel 441 of the lens driving base 440 and the housing channel 451 of the lens driving housing 450 correspond to each other and are respectively connected to the accommodating space 460. The lens focusing frame 430 is fixed to the lens drive base 440 by bonding or integral injection molding, and is located in the accommodating space 460. The two openings of the carrier channel 4103 of the lens image stabilization carrier 410 correspond to the base channel 441 of the lens drive base 440 and the housing channel 451 of the lens drive housing 450, respectively. This allows the light-emitting side and the light-receiving side of the optical lens 21 to correspond to the base channel 441 of the lens drive base 440 and the housing channel 451 of the lens drive housing 450, respectively.

[0154] Preferably, the lens drive base 440 is made of a magnetically conductive material. This reduces the magnetic field overflowing from the lens stabilizing magnet 4131 towards the photosensitive component 30, thereby reducing magnetic interference on the photosensitive component 30 and the chip drive assembly 10. For example, the material used to fabricate the lens drive base 440 can be iron, magnetically conductive stainless steel, or other materials with magnetic properties. Optionally, the lens drive base 440 can be a plastic part with a magnetically conductive portion embedded inside. The position of the magnetically conductive portion corresponds to the position of the lens stabilizing magnet 4131 to reduce the magnetic field overflowing from the lens stabilizing magnet 4131 towards the photosensitive component 30, thereby reducing magnetic interference on the photosensitive component 30 and the chip drive assembly 10. For example, the material used to fabricate the magnetically conductive portion can be iron, magnetically conductive stainless steel, or other materials with magnetic properties. Furthermore, in this specific example of the camera module of the present invention, the lens focusing drive unit 423, by setting the lens stabilization magnet 4131 on the lens focusing outer frame 430, can minimize the impact of the magnetic attraction between the lens focusing magnet 4231 and the lens drive base 440 or the chip drive assembly 10 on the lens focusing function. Consequently, it is not necessary to set the position of the lens focusing magnet 4231 too high, which would result in an excessively high height of the lens drive assembly 40, thereby helping to reduce the height of the camera module.

[0155] Specifically, during the focusing process, the lens driving assembly 40 reduces the impact of the magnetic attraction between the lens focusing magnet 4231 and the lens driving base 440 or the chip driving assembly 10 on the movement of the lens focusing inner frame 420 by fixing the position of the lens focusing magnet 4231 and moving the position of the lens focusing coil 4232 along the height direction with the lens focusing inner frame 420. This reduces the impact on the focusing process of the lens driving assembly 40.

[0156] Preferably, the lens drive housing 450 is made of non-magnetic stainless steel, which gives it high strength and a thin profile, thus providing better protection. Furthermore, by using non-magnetic stainless steel, the lens drive housing 450 prevents mutual magnetic attraction between itself and the lens stabilization magnet 4131, and also prevents mutual magnetic attraction between itself and the lens focusing magnet 4231. Additionally, the lens drive housing 450 provides metallic shielding for both the lens stabilization magnet 4131 and the lens focusing magnet 4231.

[0157] Preferably, the lens drive housing 450 has a housing notch 452 on one side, and the lens focusing magnetic unit 426 can be accommodated in the housing notch 452 of the lens drive housing 450, thereby helping to reduce the length and width dimensions (i.e., the lateral dimension) of the lens drive assembly 40.

[0158] The lens stabilization unit 41 further includes a plurality of lens stabilization and anti-collision units 418, which are disposed on the outer wall of the lens stabilization carrier 410 and the bottom surface 4102 of the carrier, to cooperate with the lens drive base 440, the lens drive housing 450 and the lens focusing inner frame 420 to limit the movement range of the lens stabilization carrier 410 and protect the lens stabilization carrier 410. Preferably, each outer wall of the lens stabilization carrier 410 is provided with two lens stabilization and anti-collision units 418.

[0159] The lens focusing unit 42 further includes at least one lens focusing anti-collision unit 428, which is disposed on the top surface 42011 of the inner frame of the lens focusing inner frame 420 to cooperate with the lens drive housing 450 to limit the movement range of the lens focusing inner frame 420 and protect the lens focusing inner frame 420. Preferably, the number of lens focusing anti-collision units 428 is two or more. For example, in this specific example of the camera module of the present invention, the number of lens focusing anti-collision units 428 is four, which are respectively protrudingly disposed at each corner of the top surface 42011 of the inner frame of the lens focusing inner frame 420.

[0160] The lens focusing unit 42 further includes at least one lens focusing yoke unit 429. The lens focusing yoke unit 429 at least shields the side of the lens focusing magnet 4231 away from the lens focusing coil 4232 to reduce the magnetic field leaking out of the lens focusing magnet 4231.

[0161] Specifically, the lens focusing yoke unit 429 includes a yoke plate 4291, a yoke upper arm 4292, and a yoke lower arm 4293. The yoke upper arm 4292 and the yoke lower arm 4293 respectively extend integrally from the upper side and the lower side of the yoke plate 4291 to form a yoke space 4294 with a side opening between the yoke plate 4291, the yoke upper arm 4292, and the yoke lower arm 4293, so that the lens focusing yoke unit 429 is in a "C" shape. The lens focusing magnet 4231 is disposed in the yoke space 4294 of the lens focusing yoke unit 429, and the side of the lens focusing magnet 4231 away from the lens focusing coil 4232 abuts against the yoke plate 4291. The yoke upper arm 4292 and the yoke lower arm 4293 respectively shield at least a part of the upper side and the lower side of the lens focusing magnet 4231. In this way, the lens focusing yoke unit 429 can isolate the magnetic field of the lens focusing magnet 4231, thereby reducing the magnetic interference of the lens focusing magnet 4231 on components such as the circuit board and the photosensitive element of the photosensitive component 30 located below the lens driving component 40, and preventing the lens focusing magnet 4231 from being attracted by magnetic components located below the lens driving component 40, which may reduce the lens focusing effect.

[0162] Preferably, the yoke lower arm 4293 of the lens focusing yoke unit 429 shields at least three-quarters of the area of the lower side of the lens focusing magnet 4231 to enhance the magnetic field constraint effect on the lens focusing magnet 4231 and reduce the influence of the lens focusing magnet 4231 on the lens focusing process.

[0163] Preferably, the yoke upper arm 4292 and the yoke lower arm 4293 of the lens focusing yoke unit 429 respectively abut against the upper side and the lower side of the lens focusing magnet 4231 to respectively shield at least a part of the upper side and the lower side of the lens focusing magnet 4231.

[0164] Continue to refer to 14 to Figure 18The chip driving assembly 10 includes a chip stabilization fixing part 11, a chip stabilization movable part 12, and a chip stabilization driving part 13. The chip stabilization fixing part 11 has a receiving cavity 1101 and a top opening 1102 communicating with the receiving cavity 1101. The photosensitive component 30 is disposed in the chip stabilization movable part 12, the chip stabilization movable part 12 is suspended in the receiving cavity 1101 of the chip stabilization fixing part 11, and the top opening 1102 of the chip stabilization fixing part 11 corresponds to the photosensitive component 30. The chip stabilization driving part 13 is used to drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11, so as to realize translational and / or rotational stabilization of the camera module. Furthermore, the chip stabilization fixing part 11 includes a base 111 and a top cover 112, the top opening 1102 is formed in the top cover 112, the base 111 and the top cover 112 are snapped together to form the receiving cavity 1101 between the base 111 and the top cover 112, such that the receiving cavity 1101 formed between the base 111 and the top cover 112 communicates with the top opening 1102 formed in the top cover 112.

[0165] The movable chip stabilization part 12 and the driving chip stabilization part 13 are respectively housed in the receiving cavity 1101 of the fixed chip stabilization part 11, so that the fixed chip stabilization part 11 forms the appearance of the chip driving assembly 10. In this way, on the one hand, the fixed chip stabilization part 11 can prevent the movable chip stabilization part 12 and the driving chip stabilization part 13 from being collided, thereby protecting the movable chip stabilization part 12 and the driving chip stabilization part 13. On the other hand, the base 111 and the top cover 112 of the fixed chip stabilization part 11 cooperate with each other to form a sealed receiving cavity 1101, so as to prevent dust and other contaminants from entering the receiving cavity 1101 of the fixed chip stabilization part 11 and contaminating the photosensitive element 32 and reducing stray light.

[0166] Preferably, the base 111 and the top cover 112 of the chip stabilization fixing part 11 are made of metal to ensure the strength of the chip driving assembly 10. For example, the base 111 and the top cover 112 of the chip stabilization fixing part 11 can be made of non-magnetic stainless steel.

[0167] It is understood that when the camera module implements the image stabilization function, the base 111 and the top cover 112 of the chip image stabilization fixing part 11 remain stationary so that the chip image stabilization fixing part 11 forms a stator.

[0168] Continue to refer to the appendix Figures 14 to 18The photosensitive component 30 includes a circuit board 31 and a photosensitive element 32 connected to the circuit board 31, wherein the circuit board 31 is disposed on the chip stabilization movable part 12 to dispose the photosensitive component 30 on the chip stabilization movable part 12.

[0169] The photosensitive component 30 further includes a series of electronic components 33, which may be, but are not limited to, passive components such as resistors, capacitors, and processors, wherein these electronic components 33 are mounted on the circuit board 31.

[0170] Additionally, the photosensitive component 30 may also include a filter, such as an infrared cut-off filter, which is held in the photosensitive path of the photosensitive element 32.

[0171] Reference Appendix Figures 14 to 18 The circuit board 31 has two extension arms 311. These two extension arms 311 extend from opposite sides of the circuit board 31 through the connection point between the base 111 and the top cover 112 to the outside of the chip stabilization fixing part 11 and further upwards. This ensures stability and reduces resistance when the chip stabilization movable part 12 is driven by the chip stabilization driving part 13 to perform translational and / or rotational movements within the receiving cavity 1101 of the chip stabilization fixing part 11. Optionally, the two extension arms 311 can extend from adjacent sides of the circuit board 31 through the connection point between the base 111 and the top cover 112 to the outside of the chip stabilization fixing part 11 and further upwards.

[0172] Continue to refer to the appendix Figures 14 to 18 The chip stabilization movable part 12 includes a chip stabilization movable carrier 121 and a set of chip stabilization balls 122. The set of chip stabilization balls 122 is rotatably disposed between the chip stabilization movable carrier 121 and the upper cover 112, so that the chip stabilization movable part 12 and the chip stabilization fixed part 11 make point friction contact, thereby ensuring that the chip stabilization driving part 13 smoothly drives the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixed part 11.

[0173] Specifically, the chip stabilization movable carrier 121 has a carrier front side 1211, a carrier back side 1212 opposite to the carrier front side 1211, and a carrier opening 1213 extending from the carrier front side 1211 to the carrier back side 1212. The circuit board 31 of the photosensitive component 30 is disposed on the carrier back side 1212 of the chip stabilization movable carrier 121, and the photosensitive element 32 of the photosensitive component 30 corresponds to the carrier opening 1213 of the chip stabilization movable carrier 121, so that incident light is allowed to pass through the carrier opening 1213 of the chip stabilization movable carrier 121 to reach the photosensitive element 32.

[0174] There is a gap between the circuit board 31 of the photosensitive component 30 and the base 111 of the chip stabilization fixing part 11. A set of chip stabilization balls 122 are rotatably disposed between the carrier front 1211 of the chip stabilization movable carrier 121 and the inner wall of the upper cover 112, so that the chip stabilization movable part 12 and the chip stabilization fixing part 11 make point friction contact, so that the chip stabilization driving part 13 smoothly drives the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11.

[0175] Optionally, in some specific examples of the camera module of the present invention, the photosensitive component 30 can be embedded in the carrier opening 1213 of the chip image stabilization movable carrier 121, which helps to reduce the height of the camera module. In other words, the chip image stabilization movable carrier 121 is arranged around the photosensitive component 30. At this time, on the one hand, there is a gap between the back surface 1212 of the chip stabilization movable carrier 121 and the base 111 of the chip stabilization fixing part 11. On the other hand, a set of rolling chip stabilization balls 122 are provided between the front surface 1211 of the chip stabilization movable carrier 121 and the inner wall of the upper cover 112 of the chip stabilization fixing part 11, thereby suspending the chip stabilization movable part 12 in the receiving cavity 1101 of the chip stabilization fixing part 11, so as to ensure that the chip stabilization driving part 13 can smoothly drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11.

[0176] Optionally, in some specific examples of the camera module of the present invention, the circuit board 31 of the photosensitive component 30 is mounted on the front side 1211 of the carrier of the chip image stabilization movable carrier 121. At this time, on the one hand, there is a gap between the back surface 1212 of the chip stabilization movable carrier 121 and the base 111 of the chip stabilization fixing part 11. On the other hand, a set of rolling chip stabilization balls 122 is provided between the front surface 1211 of the chip stabilization movable carrier 121 and the inner wall of the upper cover 112 of the chip stabilization fixing part 11. The set of chip stabilization balls 122 ensures that there is a gap between the photosensitive component 30 and the upper cover 112, thereby suspending the chip stabilization movable part 12 in the receiving cavity 1101 of the chip stabilization fixing part 11, so as to ensure that the chip stabilization driving part 13 can smoothly drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11. It is understood that in these examples where the circuit board 31 of the photosensitive component 30 is mounted on the front side 1211 of the chip image stabilization movable carrier 121, the chip image stabilization movable carrier 121 may not need to have the carrier opening 1213.

[0177] Continue to refer to the appendix Figures 14 to 18 The chip stabilization driving unit 13 includes a plurality of chip stabilization magnets 131 and a plurality of chip stabilization coils 132. The chip stabilization magnets 131 are respectively disposed on the chip stabilization fixing part 11, and the chip stabilization coils 132 are respectively disposed on the chip stabilization movable part 12. The chip stabilization magnets 131 and the chip stabilization coils 132 correspond to each other. The magnetic field generated by the chip stabilization coils 132 after being energized can interact with the magnetic field of the chip stabilization magnets 131 to drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11, thereby realizing translational and / or rotational stabilization of the camera module. For example, the chip stabilization magnets 131 and the chip stabilization coils 132 of the chip stabilization drive unit 13 can interact to drive the chip stabilization movable part 12 to perform translational motion relative to the chip stabilization fixed part 11 along the X-axis and / or Y-axis directions, thereby achieving translational stabilization of the camera module. The chip stabilization magnets 131 and the chip stabilization coils 132 of the chip stabilization drive unit 13 can also interact to drive the chip stabilization movable part 12 to perform rotational motion relative to the chip stabilization fixed part 11 about the Z-axis direction, thereby achieving rotational stabilization of the camera module.

[0178] Preferably, in the appendix Figures 14 to 18In the camera module shown, the chip stabilization magnets 131 of the chip stabilization drive unit 13 are respectively disposed on the upper cover 112 of the chip stabilization fixing unit 11. Correspondingly, the chip stabilization coils 132 of the chip stabilization drive unit 13 are respectively disposed on the chip stabilization movable part 12, and each chip stabilization magnet 131 corresponds to each chip stabilization coil 132. For example, from the attached... Figure 14 From the direction shown, the chip stabilization magnet 131 is located above the chip stabilization coil 132, that is, the chip stabilization magnet 131 and the chip stabilization coil 132 are arranged vertically.

[0179] Furthermore, the chip driving assembly 10 includes at least one chip stabilization magnetic guide member 14, which is disposed above the chip stabilization magnet 131. In this way, on the one hand, the chip stabilization magnetic guide member 14 can strengthen the magnetic field intensity downward (i.e., in the direction where the chip stabilization coil 132 is located), so that the chip stabilization driving part 13 has sufficient driving force to drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixed part 11. On the other hand, the chip stabilization magnetic guide member 14 can prevent magnetic leakage in the direction towards the lens driving assembly 40, thereby avoiding interference with the magnetic field of the lens driving assembly 40.

[0180] Specifically, the chip-based image stabilization magnetic guide member 14 is disposed on the upper cover 112 of the chip-based image stabilization fixing part 11, and the chip-based image stabilization magnet 131 is disposed on the chip-based image stabilization magnetic guide member 14. That is, the chip-based image stabilization magnet 131 is disposed on the upper cover 112 by being disposed on the chip-based image stabilization magnetic guide member 14, thus keeping the chip-based image stabilization magnetic guide member 14 between the chip-based image stabilization magnet 131 and the upper cover 112. With this structural design, the chip-based image stabilization magnetic guide member 14 allows the magnetic lines of force of the chip-based image stabilization magnet 131 to concentrate towards the direction of the chip-based image stabilization coil 132, thereby increasing the magnetic field strength of the chip-based image stabilization driving part 13 and reducing the magnetic field strength overflowing to the lens driving assembly 40, thereby avoiding magnetic interference to the lens driving assembly 40.

[0181] More specifically, looking at the plane along one side of the optical axis of the camera module, the chip-based image stabilization magnetic guide member 14 has a quadrilateral structure. The area of ​​the chip-based image stabilization magnetic guide member 14 is greater than or equal to the area of ​​the chip-based image stabilization magnet 131, and the chip-based image stabilization magnetic guide member 14 completely covers the chip-based image stabilization magnet 131. In this way, the chip-based image stabilization magnetic guide member 14 can effectively prevent the magnetic force of the chip-based image stabilization magnet 131 from leaking out. In other words, the chip-based image stabilization magnetic guide member 14 covers the surface of the chip-based image stabilization magnet 131 facing the lens drive assembly 40. For example, in a specific example of the camera module of the present invention, the shape of the chip-based image stabilization magnetic guide member 14 is the same as the shape of the chip-based image stabilization magnet 131, that is, the chip-based image stabilization magnetic guide member 14 is a square plate that is placed over the chip-based image stabilization magnet 131 and completely covers the upper surface of the chip-based image stabilization magnet 131.

[0182] Preferably, in the appendix Figures 14 to 18 In this specific example of the camera module of the present invention shown, the shape of the chip stabilization magnetic guide member 14 is different from the shape of the chip stabilization magnet 131. For example, the chip stabilization magnetic guide member 14 is a "U" shape with an opening, which can not only cover the upper surface of the chip stabilization magnet 131, but also wrap at least a portion of the two opposite sides of the chip stabilization magnet 131, so that the magnetic lines of force of the chip stabilization magnet 131 are concentrated in the direction of the chip stabilization coil 132.

[0183] It is worth mentioning that the correspondence between the number of the chip image stabilization magnetic conductive components 14 and the number of the chip image stabilization magnets 131 is not limited in the camera module of the present invention. For example, in the attached... Figures 14 to 18 In this specific example of the camera module of the present invention, the number of the chip stabilization magnetic guide members 14 is the same as the number of the chip stabilization magnets 131. Thus, one chip stabilization magnetic guide member 14 can be respectively placed over each chip stabilization magnet 131, and the chip stabilization magnetic guide member 14 and the chip stabilization magnet 131 can correspond one-to-one. Optionally, in other examples of the camera module of the present invention, the number of chip stabilization magnetic guide members 14 is less than the number of chip stabilization magnets 131, so that one chip stabilization magnetic guide member 14 can be placed over at least two chip stabilization magnets 131.

[0184] Those skilled in the art will understand that, with reference to the appendix Figure 11 and Figure 12The photosensitive element 32 of the photosensitive assembly 30 is rectangular and has four sides. For ease of description and understanding, the four sides of the photosensitive element 32 are defined sequentially in a clockwise direction as a first chip side 321, a second chip side 322, a third chip side 323, and a fourth chip side 324. A coordinate system is established with the center point of the photosensitive element 32 as the origin, the direction parallel to the first chip side 321 and the third chip side 323 as the X-axis, the direction parallel to the second chip side 322 and the fourth chip side 324 as the Y-axis, and the direction perpendicular to the photosensitive surface of the photosensitive element 32 as the Z-axis.

[0185] Based on the arrangement of the chip stabilization coils 132 in the chip stabilization drive unit 13, these chip stabilization coils 132 form a first coil group 133, a second coil group 134, and a third coil group 135. In the plane containing the X and Y axes, the first coil group 133 is arranged along the Y-axis, while the second coil group 134 and the third coil group 135 are arranged along the X-axis. The second coil group 134 and the third coil group 135 are located on opposite sides of the photosensitive element 32, thus surrounding the photosensitive element 32 of the photosensitive assembly 30. Preferably, the second coil group 134 and the third coil group 135 are symmetrical with respect to the Y-axis. It can be understood that the second coil group 134 and the third coil group 135 are located on opposite sides of the top opening 1102 of the chip stabilization fixing part 11.

[0186] The number of chip image stabilization coils 132 constituting the first coil group 133 is at least one, the number of chip image stabilization coils 132 constituting the second coil group 134 is at least two, and the number of chip image stabilization coils 132 constituting the third coil group 135 is at least two. Preferably, in the attached... Figures 14 to 18 In this specific example of the camera module shown, the number of chip stabilization coils 132 that make up the first coil group 133, the second coil group 134 and the third coil group 135 are all two.

[0187] Specifically, the two chip stabilization coils 132 constituting the first coil group 133 are defined as a first coil 1321 and a second coil 1322, respectively, and the first coil 1321 and the second coil 1322 are arranged opposite to each other and parallel along the Y-axis direction; the two chip stabilization coils 132 constituting the second coil group 134 are defined as a third coil 1323 and a fourth coil 1324, respectively, and the third coil 1323 and the fourth coil 1324 are arranged opposite to each other and parallel along the X-axis direction; the two chip stabilization coils 132 constituting the third coil group 135 are defined as a fifth coil 1325 and a sixth coil 1326, respectively, and the fifth coil 1325 and the sixth coil 1326 are arranged opposite to each other and parallel.

[0188] In other words, the first coil 1321 and the second coil 1322 are respectively disposed on the fourth chip side 324 and the second chip side 322 of the photosensitive element 32, and the first coil 1321 and the second coil 1322 are respectively parallel to the fourth chip side 324 and the second chip side 322 of the photosensitive element 32. The third coil 1323 and the fifth coil 1325 are respectively disposed on the first chip side 321 of the photosensitive element 32, and the third coil 1323 and the fifth coil 1325 are respectively parallel to the first chip side 321 of the photosensitive element 32. The fourth coil 1324 and the sixth coil 1326 are respectively disposed on the third chip side 324 of the photosensitive element 32, and the fourth coil 1324 and the sixth coil 1326 are respectively parallel to the third chip side 323 of the photosensitive element 32.

[0189] In the appendix Figures 14 to 18In this specific example of the camera module of the present invention, the first coil 1321 and the second coil 1322, which constitute the first coil group 133, are respectively disposed on two opposite sides of the photosensitive element 32 along the Y-axis direction. The third coil 1323 and the fourth coil 1324, which constitute the second coil group 134, and the fifth coil 1325 and the sixth coil 1326, which constitute the third coil group 135, are respectively disposed at the four corners of the photosensitive element 32 along the X-axis direction. For example, the first coil 1321 is disposed adjacent to the third coil 1323 and the fourth coil 1324, and the first coil 1321 is perpendicular to the third coil 1323 and the fourth coil 1324, respectively. Correspondingly, the second coil 1322 is disposed adjacent to the fifth coil 1325 and the sixth coil 1326, and the second coil 1322 is perpendicular to the fifth coil 1325 and the sixth coil 1326, respectively. In other words, the distance between the second coil group 134 and the third coil group 135 and the center of the photosensitive element 32 is greater than the distance between the first coil group 133 and the center of the photosensitive element 32, and the torque is greater. Thus, the second coil group 134 and the third coil group 135 cooperate more easily to drive the chip stabilization movable part 12 to rotate relative to the chip stabilization fixed part 11, so as to achieve rotational stabilization.

[0190] Specifically, the first coil 1321 and the second coil 1322 constituting the first coil group 133 are of the same size; the third coil 1323 and the fourth coil 1324 constituting the second coil group 134, and the fifth coil 1325 and the sixth coil 1326 constituting the third coil group 135 are of the same size; and the size of the first coil 1321 and the second coil 1322 is larger than the size of the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326. The first coil 1321 and the second coil 1322 cooperate to drive the movable chip stabilization part 12 to translate relative to the fixed chip stabilization part 11 along the X-axis. The third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 cooperate to drive the movable chip stabilization part 12 to translate relative to the fixed chip stabilization part 11 along the Y-axis and / or drive the movable chip stabilization part 12 to rotate relative to the fixed chip stabilization part 11 around the Z-axis. It is understood that the first coil 1321 and the second coil 1322 have relatively large dimensions to ensure they have a large thrust to drive the movable chip stabilization part 12 to translate relative to the fixed chip stabilization part 11 along the X-axis.

[0191] Optionally, in other examples of the camera module of the present invention, the first coil 1321 and the second coil 1322 constituting the first coil group 133, the third coil 1323 and the fourth coil 1324 constituting the second coil group 134, and the fifth coil 1325 and the sixth coil 1326 constituting the third coil group 135 may have the same size.

[0192] Preferably, the geometric centers of the first coil 1321 and the second coil 1322 constituting the first coil group 133 are aligned with the center of the chip image stabilization drive unit 13. That is, the distance between the center of the first coil 1321 and the center of the photosensitive element 32 (the origin of the coordinate axis) is the same as the distance between the center of the second coil 1322 and the center of the photosensitive element 32. This ensures that the resultant force generated by the first coil 1321 and the second coil 1322 is still located at the center of the chip image stabilization drive unit 13, thereby avoiding unnecessary torque generated by the first coil 1321 and the second coil 1322.

[0193] For example, in a specific example of the camera module of the present invention, when viewed along one side of the optical axis of the camera module, the center of the first coil 1321 and the center of the second coil 1322 are aligned, such that the line connecting the center of the first coil 1321 and the center of the second coil 1322 passes through the center of the photosensitive element 32 and is parallel to the X-axis direction.

[0194] In another specific example of the camera module of the present invention, looking at its plane along one side of the optical axis of the camera module, the center of the first coil 1321 and the center of the second coil 1322 are somewhat off-center. The off-center direction of the center of the first coil 1321 and the center of the second coil 1322 can be either the positive direction of the Y-axis or the negative direction of the Y-axis. The line connecting the center of the first coil 1321 and the center of the second coil 1322 passes through the center of the photosensitive element 32 and intersects the X-axis direction. That is, in this embodiment of the camera module of the present invention, the center of the first coil 1321 can be off-center in the positive direction of the Y-axis, and correspondingly, the center of the second coil 1322 can be off-center in the negative direction of the Y-axis. The distance from the center of the first coil 1321 to the X-axis is the same as the distance from the center of the second coil 1322 to the X-axis. This ensures that the resultant force generated by the first coil 1321 and the second coil 1322 is located at the center of the chip image stabilization drive unit 13. Alternatively, the center of the first coil 1321 can be biased towards the negative direction of the Y-axis, and correspondingly, the center of the second coil 1322 can be biased towards the positive direction of the Y-axis. Furthermore, the distance from the center of the first coil 1321 to the X-axis is the same as the distance from the center of the second coil 1322 to the X-axis. This ensures that the resultant force generated by the first coil 1321 and the second coil 1322 is located at the center of the chip anti-shake drive unit 13.

[0195] Furthermore, the chip stabilization coils 132 of the chip stabilization drive unit 13 are all hollow planar coils, forming a coil plane 13201 and a coil space 13202. Preferably, the coil planes 13201 of the first coil 1321, the second coil 1322, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are flush, so that the chip stabilization drive unit 13 can drive the chip stabilization movable part 12 to translate within the plane XOY formed by the X-axis and Y-axis.

[0196] Furthermore, the movable carrier 121 for chip stabilization has a plurality of mounting positions 1210, the number of mounting positions 1210 being the same as the number of chip stabilization coils 132, and each mounting position 1210 being used to mount each chip stabilization coil 132.

[0197] Based on the placement positions 1210, these placement positions 1210 form a first position group 12101, a second position group 12102, and a third position group 12103, wherein each placement position 1210 constituting the first position group 12101 is respectively disposed on two opposite sides along the Y-axis direction, and each placement position 1210 constituting the second position group 12102 and the third position group 12103 is respectively disposed at four corners along the X-axis direction.

[0198] Further, each of the placement positions 1210 constituting the first position group 12101 is arranged along the Y-axis direction, each of the placement positions 1210 constituting the second position group 12102 is arranged along the X-axis direction, and each of the placement positions 1210 constituting the third position group 12103 is arranged along the X-axis direction. Furthermore, each of the placement positions 1210 constituting the second position group 12102 is arranged opposite to each other along the Y-axis direction, and each of the placement positions 1210 constituting the third position group 12103 is arranged opposite to each other along the Y-axis direction. Preferably, each of the placement positions 1210 constituting the second position group 12102 is symmetrical with respect to the Y-axis, and each of the placement positions 1210 constituting the third position group 12103 is symmetrical with respect to the Y-axis.

[0199] The shape of the mounting position 1210 is the same as that of the chip image stabilization coil 132, so as to facilitate the mounting of the chip image stabilization coil 132 on the mounting position 1210. Viewed from the optical axis side of the camera module, the mounting position 1210 is rectangular or approximately rectangular in structure. The long side of each mounting position 1210 forming the first position group 12101 is parallel to the Y-axis direction, while the long sides of each mounting position 1210 forming the second position group 12102 and the third position group 12103 are parallel to the X-axis direction. Furthermore, the long side of each mounting position 1210 forming the first position group 12101 is perpendicular to the long side of each mounting position 1210 forming the second position group 12102 and the third position group 12103, respectively.

[0200] In some examples of the camera module of the present invention, the mounting position 1210 may be a planar mounting position, such that the chip image stabilization coil 132 can be directly disposed on the surface of the mounting position 1210. In other examples of the camera module of the present invention, the mounting position 1210 may be a recessed mounting position, such that the chip image stabilization coil 132 can be embedded in the mounting position 1210 to reduce the height of the chip driving assembly 10. In still other examples of the camera module of the present invention, the mounting position 1210 may be a through-hole mounting position, such that the chip image stabilization coil 132 can be embedded in the mounting position 1210 to reduce the height of the chip driving assembly 10.

[0201] Based on the arrangement of the chip stabilization magnets 131 in the chip stabilization drive unit 13, these chip stabilization magnets 131 form a first magnet group 136, a second magnet group 137, and a third magnet group 138. In the plane containing the X and Y axes, the first magnet group 136 is arranged along the Y-axis, while the second magnet group 137 and the third magnet group 138 are respectively arranged along the X-axis. The second magnet group 137 and the third magnet group 138 are located on opposite sides of the photosensitive element 32, thus surrounding the photosensitive element 32 of the photosensitive assembly 30. Preferably, the second magnet group 137 and the third magnet group 138 are symmetrical with respect to the Y-axis.

[0202] The number of chip anti-shake magnets 131 constituting the first magnet group 136 is at least one, the number of chip anti-shake magnets 131 constituting the second magnet group 137 is at least two, and the number of chip anti-shake magnets 131 constituting the third magnet group 138 is at least two. Preferably, in the attached... Figures 14 to 18 In this specific example of the camera module shown, the number of chip anti-shake magnets 131 that make up the first magnet group 136, the second magnet group 137, and the third magnet group 138 are all two.

[0203] Specifically, the two chip-mounted image stabilization magnets 131 constituting the first magnet group 136 are defined as a first magnet 1311 and a second magnet 1312, respectively. The first magnet 1311 and the second magnet 1312 are arranged opposite to each other and parallel along the Y-axis direction, and the first magnet 1311 is arranged opposite to the first coil 1321, while the second magnet 1312 is arranged opposite to the second coil 1322. The two chip-mounted image stabilization magnets 131 constituting the second magnet group 137 are defined as a third magnet 1313 and a fourth magnet 1314, respectively. The third magnet 1313 and the fourth magnet 1314 are arranged opposite to each other and parallel along the X-axis direction, and the third magnet 1313 is arranged opposite to the third coil 1323, while the fourth magnet 1314 is arranged opposite to the fourth coil 1324. The two chip anti-shake magnets 131 that make up the third magnet group 138 are defined as a fifth magnet 1315 and a sixth magnet 1316, respectively. The fifth magnet 1315 and the sixth magnet 1316 are arranged opposite to each other and parallel to each other along the X-axis direction. The fifth magnet 1315 is arranged opposite to the fifth coil 1325, and the sixth magnet 1316 is arranged opposite to the sixth coil 1326.

[0204] In other words, the first magnet 1311 and the second magnet 1312 are respectively disposed on the fourth chip side 324 and the second chip side 322 of the photosensitive element 32, and the first magnet 1311 and the second magnet 1312 are respectively parallel to the fourth chip side 324 and the second chip side 322 of the photosensitive element 32. The third magnet 1313 and the fifth magnet 1315 are respectively disposed on the first chip side 321 of the photosensitive element 32, and the third magnet 1313 and the fifth magnet 1315 are respectively parallel to the first chip side 321 of the photosensitive element 32. The fourth magnet 1314 and the sixth magnet 1316 are respectively disposed on the third chip side 323 of the photosensitive element 32, and the fourth magnet 1314 and the sixth magnet 1316 are respectively parallel to the third chip side 323 of the photosensitive element 32.

[0205] In the appendix Figures 14 to 18In this specific example of the camera module of the present invention shown, the first magnet 1311 and the second magnet 1312 constituting the first magnet group 136 are respectively disposed on two opposite sides of the photosensitive element 32 along the Y-axis direction, and the third magnet 1313 and the fourth magnet 1314 constituting the second magnet group 137 and the fifth magnet 1315 and the sixth magnet 1316 constituting the third magnet group 138 are respectively disposed at the four corners of the photosensitive element 32 along the X-axis direction. For example, the first magnet 1311 is arranged adjacent to the third magnet 1313 and the fourth magnet 1314 respectively, and the first magnet 1311 is perpendicular to the third magnet 1313 and the fourth magnet 1314 respectively. Correspondingly, the second magnet 1312 is arranged adjacent to the fifth magnet 1315 and the sixth magnet 1316 respectively, and the second magnet 1312 is perpendicular to the fifth magnet 1315 and the sixth magnet 1316 respectively.

[0206] Specifically, the first magnet 1311 and the second magnet 1312 constituting the first magnet group 136 are of the same size; the third magnet 1313 and the fourth magnet 1314 constituting the second magnet group 137 and the fifth magnet 1315 and the sixth magnet 1316 constituting the third magnet group 138 are of the same size; and the size of the first magnet 1311 and the second magnet 1312 is larger than the size of the third magnet 1313, the fourth magnet 1314, the fifth magnet 1315, and the sixth magnet 1316. The first magnet 1311 and the second magnet 1312 cooperate to drive the chip stabilization driving part 13 to translate relative to the chip stabilization fixing part 11 along the X-axis. The third magnet 1313, the fourth magnet 1314, the fifth magnet 1315, and the sixth magnet 1316 cooperate to drive the chip stabilization driving part 13 to translate relative to the chip stabilization fixing part 11 along the Y-axis or to rotate relative to the chip stabilization fixing part 11 around the Z-axis. It is understood that the first magnet 1311 and the second magnet 1312 have large dimensions to ensure they have a large thrust to drive the chip stabilization movable part 12 to translate relative to the chip stabilization fixing part 11 along the X-axis.

[0207] Optionally, in other examples of the camera module of the present invention, the first magnet 1311 and the second magnet 1312 constituting the first magnet group 136, the third magnet 1313 and the fourth magnet 1314 constituting the second magnet group 137, and the fifth magnet 1315 and the sixth magnet 1316 constituting the third magnet group 138 may have the same size.

[0208] In a specific example of the camera module of the present invention, the chip stabilization magnet 131 of the chip stabilization drive unit 13 is a unipolar magnet having one N pole and one S pole, the N pole and S pole being arranged horizontally and facing the chip stabilization coil 132. Optionally, in some other examples of the camera module of the present invention, the chip stabilization magnet 131 of the chip stabilization drive unit 13 is a bipolar magnet having two N poles and two S poles. The N poles and S poles in the first set of magnetic poles are arranged horizontally and facing the chip stabilization coil 132. The S pole in the second set of magnetic poles is located at the bottom of the N pole in the first set of magnetic poles, and the N pole in the second set of magnetic poles is located at the bottom of the S pole in the first set of magnetic poles. Thus, the S poles and N poles in the second set of magnetic poles are arranged horizontally and away from the chip stabilization coil 132.

[0209] It should be noted that, in this specific example of the camera module of the present invention, the first coil 1321 and the second coil 1322 constituting the first coil group 133 correspond to the first magnet 1311 and the second magnet 1312 constituting the first magnet group 136, respectively. Thus, when the first coil 1321 and the second coil 1322 are energized, the magnetic field generated by the first coil 1321 and the magnetic field of the first magnet 1311 cooperate with each other, and the magnetic field generated by the second coil 1322 and the magnetic field of the second magnet 1312 cooperate with each other to drive the chip anti-shake movable part 12 to translate in the X-axis direction, so as to realize translational anti-shake in the X-axis direction. The third coil 1323 and the fourth coil 1324 constituting the second coil group 134 correspond to the third magnet 1313 and the fourth magnet 1314 constituting the second magnet group 137, respectively. The fifth coil 1325 and the sixth coil 1326 constituting the third coil group 135 correspond to the fifth magnet 1315 and the sixth magnet 1316 constituting the third magnet group 138, respectively. Thus, when the second coil group 134 and the third coil group 135 are supplied with currents of the same direction and magnitude, the second coil group 134 and the... The second magnet group 137 cooperates with the third coil group 135 and the third magnet group 138 to drive the chip anti-shake movable part 12 to translate in the Y-axis direction, thereby achieving translational anti-shake along the Y-axis. When the second coil group 134 and the third coil group 135 are energized with currents of opposite directions but the same value, the second coil group 134 and the second magnet group 137 cooperate with the third coil group 135 and the third magnet group 138 to drive the chip anti-shake movable part 12 to rotate around the Z-axis, thereby achieving rotational anti-shake around the Z-axis.

[0210] Preferably, the chip anti-shake drive unit 13 has a translational stroke of ±235μm in the X and Y axis directions and a rotational stroke of ±1° around the Z axis.

[0211] Continue to refer to the appendix Figures 14 to 18 The movable chip stabilization part 12 further includes a chip stabilization electrical connection part 123, wherein the chip stabilization coils 132 of the chip stabilization driving part 13 are respectively connected to the chip stabilization electrical connection part 123 to supply power to the chip stabilization coils 132 through the chip stabilization electrical connection part 123. Preferably, the chip stabilization electrical connection part 123 is electrically connected to the circuit board 31 of the photosensitive component 30.

[0212] Preferably, the chip stabilization electrical connection 123 is a frame-shaped structure forming a connection opening 1231, wherein the chip stabilization electrical connection 123 is attached to the back surface 1212 of the chip stabilization movable carrier 121, and the connection opening 1231 of the chip stabilization electrical connection 123 and the carrier opening 1213 of the chip stabilization movable carrier 121 correspond to and communicate with each other, wherein the circuit board 31 of the photosensitive component 30 is fixed to the chip stabilization electrical connection 123, so that incident light is allowed to reach the photosensitive element 32 through the carrier opening 1213 of the chip stabilization movable carrier 121 and the connection opening 1231 of the chip stabilization electrical connection 123.

[0213] Optionally, in some other examples of the camera module of the present invention, the chip stabilization movable part 12 may not have the chip stabilization electrical connection part 123. In this case, the chip stabilization coils 132 of the chip stabilization driving part 13 are respectively mounted on the circuit board 31 of the photosensitive component 30 so that power is supplied to the chip stabilization coils 132 through the circuit board 31. At this time, the circuit board 31 of the photosensitive component 30 can be directly mounted on the back surface 1212 of the chip stabilization movable carrier 121.

[0214] Continue to refer to the appendix Figures 14 to 18 The movable carrier 121 for chip stabilization has multiple carrier notches 1214 extending from the front side 1211 to the back side 1212. The chip stabilization coils 132 of the chip stabilization drive unit 13 are held in these carrier notches 1214. Thus, with the chip stabilization electrical connection 123 attached to the back side 1212 of the movable carrier 121, the chip stabilization coils 132 of the chip stabilization drive unit 13 can extend through the multiple carrier notches 1214 toward the chip stabilization magnet 131. In other words, these carrier notches 1214 of the movable carrier 121 can form mounting positions 1210 for mounting the chip stabilization coils 132.

[0215] It is worth mentioning that the shape of the carrier notch 1214 of the chip image stabilization movable carrier 121 is not limited in the camera module of the present invention.

[0216] Preferably, in this embodiment of the camera module of the present invention, the chip stabilization coils 132 of the chip stabilization drive unit 13 are respectively attached to the chip stabilization electrical connection part 123. By attaching the chip stabilization electrical connection part 123 to the back surface 1212 of the chip stabilization movable carrier 121, the chip stabilization coils 132 can be respectively held in the carrier notches 1214 of the chip stabilization movable carrier 121.

[0217] Optionally, in other examples of the camera module of the present invention, the chip stabilization coils 132 of the chip stabilization drive unit 13 are respectively fixed to the chip stabilization movable carrier 121, and the chip stabilization coils 132 can be connected to the chip stabilization electrical connection unit 123 or to the circuit board 31 via connecting wires. In this case, the chip stabilization movable carrier 121 may not have the carrier notch 1214 provided.

[0218] Continue to refer to the appendix Figures 14 to 18 The chip driving assembly 10 further includes at least one chip anti-shake magnetic member 15, wherein the chip anti-shake magnetic member 15 is disposed on the chip anti-shake movable part 12, and the position of the chip anti-shake magnetic member 15 corresponds to the position of the chip anti-shake magnet 131 of the chip anti-shake driving part 13, so that the chip anti-shake magnetic member 15 and the chip anti-shake magnet 131 can cooperate with each other to generate a magnetic attraction force in the Z-axis direction to suspend the chip anti-shake movable part 12 in the receiving cavity 1101 of the chip anti-shake fixing part 11.

[0219] In other words, the magnetic attraction force generated in the Z-axis direction by the chip stabilization magnetic attraction component 15 and the chip stabilization magnet 131 of the chip stabilization drive unit 13 can ensure that a set of chip stabilization balls 122 of the chip stabilization movable part 12 is always in close contact with the upper cover 112 of the chip stabilization fixing part 11. Since a set of rollable chip stabilization balls 122 is provided between the carrier front 1211 of the chip stabilization movable carrier 121 and the inner wall of the upper cover 112, the chip stabilization movable part 12 and the chip stabilization fixing part 11 are in point friction contact. In this way, the chip stabilization drive unit 13 can smoothly drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11, so as to realize the translational and / or rotational stabilization of the camera module.

[0220] Preferably, the movable chip stabilization carrier 121 has a set of retaining grooves 1215 formed on the carrier front 1211 of the movable chip stabilization carrier 121, wherein the chip stabilization ball 122 is rotatably held in the retaining grooves 1215 of the movable chip stabilization carrier 121. In this way, when the chip stabilization driving part 13 drives the movable chip stabilization part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11, the chip stabilization ball 122 can be prevented from detaching from the movable chip stabilization carrier 121 and the upper cover 112, thereby ensuring the reliability and stability of the camera module. Specifically, when the chip stabilization driving unit 13 drives the chip stabilization movable carrier 121 of the chip stabilization movable unit 12 to perform translational and / or rotational movements relative to the chip stabilization fixing unit 11, the movement trajectory of the chip stabilization ball 122 can be restricted within the retaining groove 1215 of the chip stabilization movable carrier 121, so that the chip stabilization ball 122 always supports the chip stabilization movable carrier 121 and the upper cover 112 of the chip stabilization fixing unit 11.

[0221] In other words, the retaining groove 1215 and the chip stabilization balls 122 of the movable chip stabilization carrier 121 can form a chip stabilization support 17 of the chip driving assembly 10. That is, the chip stabilization support 17 includes a set of chip stabilization balls 122 and a set of retaining grooves 1215, wherein the set of retaining grooves 1215 are respectively formed on the carrier front 1211 of the movable chip stabilization carrier 121, and the set of chip stabilization balls 122 are respectively rotatably held in the retaining grooves 1215 and located between the movable chip stabilization carrier 121 and the upper cover 112. Thus, the chip stabilization support 17 can support the movable chip stabilization carrier 121 and the upper cover 112. The chip stabilization balls 122 can move along the plane formed by the X-axis and Y-axis within the retaining grooves 1215 to provide movement space for the movement of the movable chip stabilization part 12.

[0222] Furthermore, the movable chip stabilization carrier 121 has at least one extension post 1216, and the retaining groove 1215 is formed in the extension post 1216, with the opening of the retaining groove 1215 facing the upper cover 112 of the chip stabilization fixing part 11. The depth of the retaining groove 1215 is less than or equal to the diameter of the chip stabilization ball 122, such that at least a portion of the chip stabilization ball 122 can protrude from the retaining groove 1215, and the height of the chip stabilization ball 122 is greater than the height of the chip stabilization coil 132, so that the chip stabilization ball 122 can make point frictional contact with the extension post 1216 and the upper cover 112 of the movable chip stabilization carrier 121, respectively.

[0223] Understandably, with the above structural design, the upper part of the chip stabilization ball 122 faces the plane formed by the inner wall of the upper cover 112, and the lower part of the chip stabilization ball 122 faces the groove formed by the retaining groove 1215. Thus, on the one hand, the chip stabilization ball 122 can roll between the chip stabilization movable carrier 121 and the upper cover 112; on the other hand, the retaining groove 1215 can limit the chip stabilization ball 122 to prevent it from falling off, thereby ensuring the reliability of the camera module.

[0224] It is understood that the chip stabilization ball 122 creates a gap between the chip stabilization magnet 131 and the chip stabilization coil 132 to prevent direct contact between them. Preferably, the gap between the chip stabilization magnet 131 and the chip stabilization coil 132 is between 0.05 mm and 0.5 mm to ensure good electromagnetic induction between them.

[0225] Furthermore, the chip driving assembly 10 includes at least three chip stabilization support portions 17 to ensure smooth translation of the chip stabilization movable portion 12 along the X-axis and Y-axis and rotation around the Z-axis. That is, the chip stabilization movable portion 12 includes at least three chip stabilization balls 122, and the chip stabilization movable carrier 121 has at least three retaining grooves 1215.

[0226] Preferably, in the appendix Figures 14 to 18In this specific example of the camera module shown, the chip driving assembly 10 includes four chip stabilization support portions 17, which are respectively disposed between the first position group 12101 and the second position group 12102, and between the second position group 12102 and the third position group 12103. That is, the four chip stabilization support portions 17 of the chip driving assembly 10 are respectively located at the four corners of the chip stabilization movable portion 12, providing more stable support for the chip stabilization movable portion 12, while making full use of the internal space of the chip driving assembly 10 to make the structure of the chip driving assembly 10 more compact. Optionally, in other examples of the camera module of the present invention, the chip stabilization support portion 17 of the chip driving assembly 10 can be a slider, which is slidably held between the chip stabilization movable carrier 121 and the upper cover 112 for stable support of the chip stabilization movable portion 12. (Continue referring to the appendix...) Figures 14 to 18 The chip driving assembly 10 includes four chip stabilization magnetic components 15, each of which is disposed at each corner of the chip stabilization movable part 12. This ensures the flatness of the chip stabilization movable part 12 and allows the optical axis of the camera module to be perpendicular to the photosensitive surface of the photosensitive element 32 of the photosensitive assembly 30.

[0227] Continue to refer to the appendix Figures 14 to 18 In this specific example of the camera module of the present invention, the chip stabilization magnetic member 15 is disposed on the chip stabilization electrical connection portion 123 to optimize the structure of the camera module. Optionally, in other examples of the camera module of the present invention, the chip stabilization magnetic member 15 may be disposed on the chip stabilization movable carrier 121, or the chip stabilization magnetic member 15 may be disposed on the circuit board 31 of the photosensitive component 30, or the chip stabilization magnetic member 15 may be disposed between the chip stabilization movable carrier 121 and the chip stabilization electrical connection portion 123, or the chip stabilization magnetic member 15 may be disposed between the chip stabilization electrical connection portion 123 and the circuit board 31.

[0228] In some examples of the camera module of the present invention, the chip stabilization magnetic member 15 and the chip stabilization magnet 131 of the chip stabilization drive unit 13 can be perfectly aligned, that is, the chip stabilization magnetic member 15 can be located directly below the chip stabilization magnet 131 of the chip stabilization drive unit 13. In other examples of the camera module of the present invention, the chip stabilization magnetic member 15 and the chip stabilization magnet 131 of the chip stabilization drive unit 13 may not be perfectly aligned, and there may be some deviation between them.

[0229] It is understood that when the chip stabilization driving unit 13 drives the chip stabilization movable unit 12 to perform translational and / or rotational movements relative to the chip stabilization fixed unit 11, the chip stabilization magnetic attraction member 15 will synchronously generate translational and / or rotational movements relative to the chip stabilization fixed unit 11. At this time, some deviations will also occur between the chip stabilization magnetic attraction member 15 and the chip stabilization magnet 131. However, the plane where the chip stabilization magnetic attraction member 15 is located and the plane where the chip stabilization magnet 131 is located are always parallel, that is, the plane where the chip stabilization magnetic attraction member 15 is located and the plane where the chip stabilization magnet 131 is located are always orthogonal to the Z-axis. Therefore, the ability of the chip stabilization magnetic attraction member 15 and the chip stabilization magnet 131 to cooperate with each other and generate magnetic attraction in the Z-axis direction refers to the magnetic attraction between the plane where the chip stabilization magnetic attraction member 15 is located and the plane where the chip stabilization magnet 131 is located, including but not limited to the magnetic attraction in the vertical direction and the tilting magnetic attraction that deviates from the vertical direction.

[0230] Continue to refer to the appendix Figures 14 to 18 The chip driving component 10 further includes at least three chip stabilization position sensing elements 16, which respectively sense the position information of the chip stabilization movable part 12 in the X-axis direction translation, Y-axis direction translation, and Z-axis direction rotation by sensing the position information of the first magnet group 136, the second magnet group 137, and the third magnet group 138.

[0231] Preferably, the three chip stabilization position sensing elements 16 are defined as a first sensing element 161, a second sensing element 162, and a third sensing element 163, respectively. The first sensing element 161 is disposed in the coil space 13202 of the first coil 1321, corresponding to the first magnet 1311, wherein the first sensing element 161 is used to sense changes in the magnetic field during translation in the X-axis direction. The second sensing element 162 is disposed in the coil space 13202 of the fourth coil 1324, corresponding to the fourth magnet 1314, wherein the second sensing element 162 is used to sense changes in the magnetic field during translation in the Y-axis direction. The third sensing element 163 is disposed in the coil space 13202 of the fifth coil 1325, corresponding to the fifth magnet 1315, wherein the second sensing element 162 and the third sensing element 163 are used to sense changes in the magnetic field during rotation in the Z-axis direction.

[0232] Preferably, the chip anti-shake position sensing element 16 is mounted on the chip anti-shake electrical connection portion 123.

[0233] In the camera module of the present invention, the first coil group 133, the second coil group 134 and the third coil group 135 of the chip image stabilization drive unit 13 are independently controlled coil groups. Therefore, only three chip image stabilization position sensing elements 16 need to be set. This not only reduces the number of components in the chip drive assembly 10, but also helps to reduce the size of the chip drive assembly 10 by using fewer interfaces to realize translational image stabilization and / or rotational image stabilization sensing. Furthermore, it makes full use of the internal space of the chip drive assembly 10, making the structure of the chip drive assembly 10 compact.

[0234] It is worth mentioning that, in some embodiments of the camera module of the present invention, the chip stabilization position sensing element 16 may be a Hall element. In other embodiments of the camera module of the present invention, the chip stabilization position sensing element 16 may be a driver IC, which is adapted to control the current of the chip stabilization coil 132 while acquiring the position change of the chip stabilization magnet 131. Specifically, when the camera module activates the image stabilization function, the chip image stabilization position sensing element 16 can sense the current positions of the first magnet group 136, the second magnet group 137, and the third magnet group 138, and drive the chip image stabilization movable part 12 to move to the sensed center position by controlling the current of the first coil group 133, the second coil group 134, and the third coil group 135. When the camera module deactivates the image stabilization function, the chip image stabilization movable part 12 returns to its initial position through the counterforce of the circuit board 31 of the photosensitive component 30 (i.e., the elastic force accumulated by the circuit board 31 due to elastic deformation when the chip image stabilization movable part 12 is translated and / or rotated).

[0235] Appendix Figure 19 A modified example of the camera module of the present invention is shown, in conjunction with Figures 1 to 12. Figure 18 Unlike the camera module shown, the attached... Figure 19In this modified example of the camera module shown, the first coil group 133 includes four image stabilization coils 132, wherein two of the image stabilization coils 132 constituting the first coil group 133 are symmetrically arranged at one end of the second chip side 322 and the fourth chip side 324 of the photosensitive element 32, and the other two image stabilization coils 132 are symmetrically arranged at the other end of the second chip side 322 and the fourth chip side 324 of the photosensitive element 32. The four retaining grooves 1215 of the chip stabilization movable carrier 121 are respectively formed in the middle of the first chip side 321, the second chip side 322, the third chip side 323 and the fourth chip side 324 of the photosensitive element 32, so that the four ball bearings 122 are rotatably held between the carrier front 1211 and the inner wall of the upper cover 112 of the chip stabilization movable carrier 121 in the middle of the first chip side 321, the second chip side 322, the third chip side 323 and the fourth chip side 324 of the photosensitive element 32.

[0236] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and any variations or modifications may be made to the implementation of the present invention without departing from the stated principles.

Claims

1. A lens driving assembly, characterized by, The lens driving assembly comprises: a lens focusing outer frame; a lens focusing inner frame, wherein the lens focusing inner frame is suspended to the side of the lens focusing outer frame; a lens anti-shake carrier, wherein the lens anti-shake carrier is suspended below the lens focusing inner frame; a lens focusing driving unit, wherein the lens focusing driving unit comprises at least one lens focusing magnet and at least one lens focusing coil, each lens focusing magnet is arranged on the lens focusing outer frame, each lens focusing coil is arranged on the lens focusing inner frame, and the position of the lens focusing magnet corresponds to the position of the lens focusing coil; a lens anti-shake driving unit, wherein the lens anti-shake driving unit comprises at least one lens anti-shake magnet and at least one lens anti-shake coil, each lens anti-shake magnet is arranged on the lens anti-shake carrier, each lens anti-shake coil is arranged on the lens focusing inner frame, and the position of the lens anti-shake magnet corresponds to the position of the lens anti-shake coil; at least one lens focusing magnetic attraction unit, wherein the lens focusing magnetic attraction unit is arranged on the lens focusing inner frame, and the position of the lens focusing magnetic attraction unit corresponds to the position of the lens focusing magnet, so that the horizontal magnetic attraction force is generated between the lens focusing magnetic attraction unit and the lens focusing magnet, and the lens focusing coil is electrically connected to the corresponding lens focusing magnetic attraction unit; and at least one lens anti-shake magnetic attraction unit, wherein the lens anti-shake magnetic attraction unit is arranged on the top of the lens focusing inner frame of the lens focusing inner frame, and the lens anti-shake magnetic attraction unit corresponds to the lens anti-shake magnet, so that the vertical magnetic attraction force is generated between the lens anti-shake magnetic attraction unit and the lens anti-shake magnet, and at least a part of the lens anti-shake magnetic attraction unit is integrally extended from the lens focusing magnetic attraction unit.

2. The lens driving assembly according to claim 1, further comprising a lens focusing support unit, wherein the lens focusing support unit is arranged between the lens focusing outer frame and the side of the lens focusing inner frame of the lens focusing inner frame, so that the lens focusing inner frame is suspended to the side of the lens focusing outer frame.

3. The lens driving assembly according to claim 2, wherein the height dimension of the lens focusing magnetic attraction unit is greater than or equal to the height dimension of the lens focusing magnet.

4. The lens driving assembly according to claim 2, wherein the lens focusing magnetic attraction unit always covers the lens focusing magnet in the height direction during the process that the lens focusing driving unit drives the lens focusing inner frame to move relative to the lens focusing outer frame in the height direction.

5. The lens driving assembly according to claim 1, further comprising at least one lens focusing magnetic yoke unit, wherein the lens focusing magnetic yoke unit at least shields the side of the lens focusing magnet away from the lens focusing coil. ​ 6. The lens driving assembly of claim 5, wherein the lens focusing magnetic yoke unit further comprises a magnetic yoke plate, a magnetic yoke upper arm and a magnetic yoke lower arm, the magnetic yoke upper arm and the magnetic yoke lower arm integrally extend on the upper side and the lower side of the magnetic yoke plate respectively to form a magnetic yoke space between the magnetic yoke plate, the magnetic yoke upper arm and the magnetic yoke lower arm, wherein the lens focusing magnet is disposed in the magnetic yoke space of the lens focusing magnetic yoke unit, and the side of the lens focusing magnetic yoke unit away from the lens focusing coil is attached to the magnetic yoke plate, the magnetic yoke upper arm and the magnetic yoke lower arm shield at least a portion of the upper side and the lower side of the lens focusing magnet respectively.

7. The lens driving assembly of claim 6, wherein the magnetic yoke upper arm and the magnetic yoke lower arm of the lens focusing magnetic yoke unit are attached to the upper side and the lower side of the lens focusing magnet respectively.

8. The lens driving assembly of claim 1, further comprising a lens OIS support unit, wherein the lens OIS support unit is disposed between the lens OIS carrier and the lens focusing inner frame top of the lens focusing inner frame to suspend the lens OIS carrier below the lens focusing inner frame.

9. The lens driving assembly of claim 2, further comprising a lens OIS support unit, wherein the lens OIS support unit is disposed between the lens OIS carrier and the lens focusing inner frame top of the lens focusing inner frame to suspend the lens OIS carrier below the lens focusing inner frame.

10. The lens driving assembly of claim 9, further comprising a lens focusing PCB, wherein the lens focusing PCB comprises a mounting portion and a connecting portion, the mounting portion is mounted on the lens focusing outer frame, the connecting portion integrally extends from the mounting portion, and the connecting portion is electrically connected to the lens OIS magnetic attraction unit, the lens OIS magnetic attraction unit is electrically connected to the lens focusing magnetic attraction unit, and the lens focusing coil is electrically connected to the lens focusing magnetic attraction unit.

11. The lens driving assembly of claim 10, wherein the number of the lens focusing coil and the number of the lens focusing magnet are both two, and the two lens focusing coils are formed by winding one conductive wire.

12. The lens driving assembly of claim 10, further comprising a lens OIS PCB, wherein each of the lens OIS coils is mounted on the lens OIS PCB, the lens OIS PCB is disposed on the lens focusing inner frame top, and the lens OIS PCB is electrically connected to the lens OIS magnetic attraction unit.

13. The lens driving assembly of claim 10, further comprising a lens focus sensing unit, wherein the lens focus sensing unit comprises a lens focus sensing magnet fixed to the lens focus inner frame and a lens focus position sensing element mounted to the mounting portion of the lens focus circuit board, and the position of the lens focus sensing magnet corresponds to the position of the lens focus position sensing element.

14. The lens driving assembly of claim 9, further comprising a lens focus sensing unit, wherein the lens focus sensing unit comprises a lens focus sensing magnet fixed to the lens focus outer frame and a lens focus position sensing element mounted to the lens focus inner frame, and the position of the lens focus sensing magnet corresponds to the position of the lens focus position sensing element.

15. The lens driving assembly of claim 12, further comprising at least one lens anti-shake position sensing element, wherein the lens anti-shake position sensing element is mounted to the lens anti-shake circuit board, and the lens anti-shake position sensing element and the lens anti-shake coil are respectively located on opposite sides of the lens anti-shake circuit board.

16. The lens driving assembly of any one of claims 2 to 4, 9 to 15, wherein the lens focus support unit comprises at least two lens focus rails and at least two lens focus movable elements, wherein each of the lens focus rails comprises an inner groove rail formed on the lens focus inner frame side portion of the lens focus inner frame and an outer groove rail formed on the lens focus outer frame, the inner groove rail and the outer groove rail correspond to each other and have the same extending direction, and the inner portion and the outer portion of the lens focus movable element are movably held in the inner groove rail and the outer groove rail, respectively, and the lens focus movable element is a ball, so that the inner portion and the outer portion of the lens focus movable element are rollably held in the inner groove rail and the outer groove rail, respectively.

17. The lens driving assembly of claim 16, wherein the lens focus support unit comprises four lens focus movable elements, and each of the lens focus rails is provided with two lens focus movable elements.

18. The lens driving assembly according to any one of claims 9-15, wherein the lens anti-shake support unit comprises at least three lens anti-shake tracks and at least three lens anti-shake movable elements, wherein each of the lens anti-shake tracks comprises a lower groove track formed on a carrier top surface of the lens anti-shake carrier and an upper groove track formed on an inner frame bottom surface of the lens focusing inner frame, the lower groove track and the upper groove track correspond to each other and the extending directions of the two are perpendicular to each other, wherein the bottom and top of the lens anti-shake balls are movably held in the lower groove track and the upper groove track respectively, wherein the lens anti-shake movable elements are balls, so that the bottom and top of the lens anti-shake movable elements are rollably held in the lower groove track and the upper groove track respectively.

19. A camera module, characterized by comprises: a photosensitive component; an optical lens, wherein the optical lens is held in a photosensitive path of the photosensitive component; and a lens driving assembly according to any one of claims 1-18, wherein the lens anti-shake carrier has a carrier passage, and the optical lens is arranged in the carrier passage of the lens anti-shake carrier.

20. The camera module according to claim 19, wherein the lens driving assembly further comprises a lens driving base and a lens driving housing, the lens driving housing is mounted on the lens driving base to form a containing space between the lens driving housing and the lens driving base, wherein the lens focusing outer frame is arranged on the lens driving base, and the lens focusing outer frame, the lens focusing inner frame and the lens anti-shake carrier are all located in the containing space.

21. The camera module according to claim 20, further comprising a chip driving assembly, the photosensitive component is drivably arranged on the chip driving assembly, wherein the chip driving assembly is located below the lens driving assembly.

22. The camera module according to claim 21, wherein the chip driving assembly further comprises: at least one chip anti-shake magnetic guide member; a chip anti-shake fixed part, wherein the chip anti-shake fixed part has a receiving cavity and a top opening communicating with the receiving cavity; a chip anti-shake movable part, wherein the chip anti-shake movable part is suspended in the receiving cavity of the chip anti-shake fixed part; and a chip anti-shake driving part, wherein the chip anti-shake driving part comprises a plurality of oppositely arranged chip anti-shake magnets and a plurality of chip anti-shake coils, the chip anti-shake magnets are arranged on the chip anti-shake fixed part respectively, and the chip anti-shake coils are arranged on the chip anti-shake movable part respectively, wherein the chip anti-shake magnetic guide member is covered on the anti-shake magnets.

23. The camera module according to claim 22, wherein the chip anti-shake magnetic guide member is arranged on the chip anti-shake fixed part, and the chip anti-shake magnets are arranged on the chip anti-shake magnetic guide member, so that the chip anti-shake magnets are arranged on the chip anti-shake fixed part through the chip anti-shake magnetic guide member. ​ ​ 24. The camera module of claim 23, wherein the chip anti-shake fixing portion comprises a base and an upper cover, the base and the upper cover being snap-fit mounted, wherein the chip anti-shake magnetic guide member is disposed on the upper cover, and the chip anti-shake magnet is disposed on the chip anti-shake magnetic guide member.

25. The camera module of claim 24, wherein the lens driving base is attached to the upper cover, and at least a portion of the lens driving base is made of a magnetic conductive material.

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