Display panel, preparation method thereof and display device

Abstract

The embodiments of the present disclosure disclose a display panel, a preparation method thereof and a display device. In a specific embodiment, the display panel comprises a display area, an opening area and an isolation area between the display area and the opening area, the isolation area comprising: a substrate; an insulating layer on the substrate; a metal isolation column on the insulating layer, wherein the metal isolation column is provided with a groove penetrating through the metal isolation column from a side surface away from the insulating layer to a side surface close to the insulating layer; a light-emitting layer and a cathode layer which are sequentially arranged on the metal isolation column and the exposed insulating layer, the light-emitting layer and the cathode layer being disconnected at the end of the metal isolation column close to and / or away from the opening area. The embodiment can cut off the current channel of the cathode layer in the isolation area on the basis of cutting off the light-emitting layer in the isolation area to block the water and oxygen invasion channel, thereby improving the black spot defect and improving the display effect.

Description

Technical Field

[0001] This disclosure relates to the field of display technology. More specifically, it relates to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] In existing Organic Light-Emitting Diode (OLED) display devices, holes (Hole in Active Area, HIAA) are often made in the screen to house devices such as cameras and sensors. However, these holes easily expose the OLED film layers, necessitating the use of insulating pillars to block water and oxygen intrusion channels formed in the electro-luminescence (EL) layer. The inventors discovered that the aforementioned existing structures suffer from growing dark spots at the HIAA (GDSH). Summary of the Invention

[0003] The purpose of this disclosure is to provide a display panel and a method for manufacturing the same, as well as a display device, to solve at least one of the problems existing in the prior art.

[0004] To achieve the above objectives, the present disclosure adopts the following technical solution:

[0005] A first aspect of this disclosure provides a display panel, including a display area, an opening area, and an isolation area located between the display area and the opening area, the isolation area comprising:

[0006] Substrate;

[0007] An insulating layer located on the substrate;

[0008] A metal isolation post located on the insulating layer, wherein the metal isolation post has a groove extending from a surface away from the insulating layer to a surface close to the insulating layer through the metal isolation post;

[0009] A light-emitting layer and a cathode layer are sequentially stacked on the metal isolation pillar and the exposed insulating layer, respectively forming a break at the ends of the metal isolation pillar near and / or away from the opening area.

[0010] Optionally, the metal isolation pillar surrounds the opening area and the groove surrounds the opening area.

[0011] Optionally, the length of the groove in the first direction is 2μm-10μm, where the first direction is the direction from the opening area to the display area.

[0012] Optionally, the groove is formed at the center of the metal isolation post in a first direction, where the opening area points towards the display area.

[0013] Optionally, the metal isolation pillar includes a first metal layer, a second metal layer and a third metal layer stacked in sequence, wherein the surface of the second metal layer near and / or away from the opening area forms an inward recess.

[0014] Optionally, the display area includes a substrate, a driving circuit layer on the substrate, and a planarization layer on the driving circuit layer, wherein the insulating layer is disposed on the same layer as the planarization layer.

[0015] Optionally, the display area further includes an anode located on the planarization layer, and the driving circuit layer includes a source / drain metal layer, wherein at least one of the first metal layer, the second metal layer, and the third metal layer is disposed on the same layer as the source / drain metal layer.

[0016] Optionally, the isolation region may further include an encapsulation layer located on the cathode layer.

[0017] A second aspect of this disclosure provides a display device, including the display panel provided in the first aspect of this disclosure.

[0018] This disclosure provides a third aspect of a method for manufacturing a display panel, the display panel including a display area, an aperture area, and an isolation area located between the display area and the aperture area, the manufacturing method comprising:

[0019] Provide substrate;

[0020] An insulating layer is formed on the substrate;

[0021] Metal isolation pillars are formed on the insulating layer;

[0022] A groove is formed on the metal isolation post, extending from the side surface away from the insulating layer to the side surface near the insulating layer, penetrating the metal isolation post;

[0023] A light-emitting layer and a cathode layer are sequentially formed on the metal isolation pillar and the exposed insulating layer, wherein the light-emitting layer and the cathode layer are respectively disconnected at the ends of the metal isolation pillar near and / or away from the opening area.

[0024] The beneficial effects of this disclosure are as follows:

[0025] The technical solution described in this disclosure can cut off the current channel of the cathode layer in the isolation zone by blocking the water and oxygen intrusion channel by isolating the light-emitting layer in the isolation zone, thereby improving black spot defects and enhancing the display effect. Attached Figure Description

[0026] The specific embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0027] Figure 1 This shows a top view of the existing display panel.

[0028] Figure 2 A cross-sectional schematic diagram of the isolation area of ​​an existing display panel is shown.

[0029] Figure 3 A top view of the display panel provided in an embodiment of this disclosure is shown.

[0030] Figure 4 A cross-sectional schematic diagram of the isolation area of ​​a display panel provided in an embodiment of this disclosure is shown.

[0031] Figures 5-9 The diagram shows cross-sectional schematics of each stage in the fabrication process of the array substrate provided in the embodiments of this disclosure. Detailed Implementation

[0032] The terms “on”, “formed on”, and “set on” used in this disclosure can indicate that one layer is directly formed or set on another layer, or that one layer is indirectly formed or set on another layer, meaning that there are other layers between the two layers.

[0033] It should be noted that although the terms "first," "second," etc., may be used herein to describe various components, members, elements, regions, layers, and / or parts, these components, members, elements, regions, layers, and / or parts should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer, and / or part from another. Thus, for example, the first component, first member, first element, first region, first layer, and / or first part discussed below may be referred to as a second component, second member, second element, second region, second layer, and / or second part without departing from the teachings of this disclosure.

[0034] In this disclosure, unless otherwise stated, the term "co-layer arrangement" means that two layers, components, members, elements, or portions can be formed by the same fabrication process (e.g., patterning process), and that the two layers, components, members, elements, or portions are generally formed of the same material. For example, co-layer arrangement of two or more functional layers means that these co-layer functional layers can be formed using the same material layers and the same fabrication process, thereby simplifying the fabrication process of the display substrate.

[0035] In this disclosure, unless otherwise stated, the term "patterning process" generally includes steps such as photoresist coating, exposure, development, etching, and photoresist stripping. The term "one-step patterning process" refers to a process that uses a photomask to form patterned layers, components, or parts.

[0036] In existing HIAA-structured OLED display devices, because openings in the screen can easily expose the OLED film layer, isolation pillars are needed to block the water and oxygen intrusion channels formed in the light-emitting layer. For example... Figure 1 The display panel 100 shown includes a display area 110, an opening area 130, and an isolation area 120 located between the display area 110 and the opening area 130. See also... Figure 2 , Figure 2 for Figure 1 The BB cross-sectional view shows that the isolation zone 120 includes:

[0037] Substrate 101, wherein, for example, isolation region 120 and display region 110 share the same substrate 101;

[0038] Insulating layer 102 located on substrate 101;

[0039] Metal isolation pillar 103 located on insulation layer 102;

[0040] A light-emitting layer 104 and a cathode layer 105 are sequentially stacked on the metal isolation pillar 103 and the exposed insulating layer 102, respectively. The light-emitting layer 104 and the cathode layer 105 are disconnected at the ends of the metal isolation pillar 103 near and far from the hole area 130.

[0041] In the display panel 100, to prevent water and oxygen from intruding into the display area 110 from the opening area 130, a metal isolation pillar 103 is provided in the isolation area 120 to cut off the water and oxygen intrusion channel. To achieve a break between the light-emitting layer 104 and the cathode layer 105 at the ends of the metal isolation pillar 103 near and far from the opening area 130, for example... Figure 2 As shown, the metal isolation pillar 103 includes a first metal layer 1031, a second metal layer 1032, and a third metal layer 1033 stacked sequentially. For example, the first metal layer 1031 and the third metal layer 1033 are made of titanium (Ti), and the second metal layer 1032 is made of aluminum (Al). The second metal layer 1032 has a surface near the opening region 130 and a surface away from the opening region 130 (i.e.,...) Figure 2 The left and right surfaces of the metal layer form inward recesses, a structure that can be achieved through lateral etching. This can be achieved by etching a portion of the second metal layer 1032, which serves as the intermediate metal layer. For example, a mixture of nitric acid, acetic acid, and phosphoric acid can be used for etching. This solution only etches aluminum (Al) and not titanium (Ti). Therefore, based on... Figure 2When the light-emitting layer 104 is formed by, for example, a vapor deposition process, the metal isolation pillar 103 shown can be interrupted at the ends of the metal isolation pillar 103 near and far from the hole region 130, thereby blocking the light-emitting layer 104 through the metal isolation pillar 103 to block the water and oxygen intrusion channel.

[0042] Similar to the light-emitting layer 104, the cathode layer 105 also has a break at the ends of the metal isolation pillar 103 near and far from the hole region 130. For example, the material of the cathode layer 105 is silver (Ag), aluminum (Al), magnesium-silver alloy (Mg-Ag), calcium (Ca), etc.

[0043] The inventors discovered that the existing structure described above would suffer from black spot defects. After research, the inventors found that the cause of the black spot defects is that, since the display panel 100 needs to be designed for anti-static purposes, the openings in the opening area 130 are usually filled with conductive adhesive and grounded to release static electricity. In this way, the contact between the conductive adhesive and the metal isolation pillar 103 and / or the cathode layer 105 of the metal isolation pillar 103 near the opening area 130 will cause a voltage difference to be formed between the cathode layer 105 and the conductive adhesive when the display panel 100 is lit (for example, the voltage of the conductive adhesive is 0V, and the voltage of the cathode layer 105 is -4.6V when lit). In the existing display panel 100, although the cathode layer 105 is disconnected at the ends of the metal isolation pillar 103 near and far from the hole area 130, since both the cathode layer 105 and the metal isolation pillar 103 are made of metal or alloy materials, the cathode layer 105 and the metal isolation pillar 103 can be electrically connected to form a current channel. When the display panel 100 is lit, the voltage difference between the cathode layer 105 and the conductive adhesive will generate current, causing metal ions such as silver (Ag) to migrate, resulting in water and oxygen intrusion, encapsulation failure, and black spot defects.

[0044] In view of this, embodiments of this disclosure provide a display panel, such as an OLED display panel, for example... Figure 3 As shown, the display panel 300 provided in this embodiment includes a display area 310, an opening area 330, and an isolation area 320 located between the display area 310 and the opening area 330. See also Figure 4 , Figure 4 for Figure 3 CC section diagram, such as Figure 4 As shown, the isolation area 320 in the display panel 300 includes:

[0045] Substrate 301, wherein, for example, isolation region 320 and display region 310 share the same substrate 301;

[0046] Insulating layer 302 located on substrate 301;

[0047] A metal isolation post 303 is located on the insulating layer 302, wherein the metal isolation post 303 has a groove extending from the side surface away from the insulating layer 302 to the side surface near the insulating layer 302, that is, in Figure 4 In the middle, the groove runs through the metal isolation column 303 from top to bottom;

[0048] A light-emitting layer 304 and a cathode layer 305 are sequentially stacked on the metal isolation pillar 303 and the exposed insulating layer 302, respectively. The light-emitting layer 304 and the cathode layer 305 are disconnected at the ends of the metal isolation pillar 303 near and far from the hole area 330.

[0049] In the display panel 300 provided in this embodiment, the light-emitting layer 304 is disconnected at the ends of the metal isolation pillar 303 near and far from the hole area 330, so as to block the water and oxygen intrusion channel by isolating the light-emitting layer 304 through the metal isolation pillar 303. Furthermore, by creating a through groove in the metal isolation pillar 303, for example, etching the metal isolation pillar 303 to the insulating layer 302 or etching the metal isolation pillar 303 to form a groove exposing the insulating layer 302, the metal isolation pillar 303 is formed in the direction from the hole area 330 to the display area 310 (e.g., Figure 4 The first direction (X) is disconnected. In this way, even if the cathode layer 305 can be electrically connected to both sides of the metal isolation pillar 303 when the metal isolation pillar 303 itself is disconnected, the current path of the cathode layer 305 is cut off because the metal isolation pillar 303 itself has been disconnected. Therefore, the voltage difference formed between the cathode layer 305 and the conductive adhesive when the display panel 300 is lit cannot generate current, which can effectively improve black spot defects and improve the display effect.

[0050] It should be noted that since the groove penetrates the metal isolation post 303, the metal isolation post 303 can be understood as including the two parts separated by the groove, for example... Figure 4 The image shows the first portion on the left side near the opening area 330 and the second portion on the right side far away from the opening area 330.

[0051] In one possible implementation, a metal isolation pillar 303 surrounds the opening area 330 and a groove surrounds the opening area 330.

[0052] In a specific example, such as Figure 3 As shown, the opening area 330 is circular. Therefore, the isolation area 320 located between the display area 310 and the opening area 330 is annular, surrounding the opening area 330. To ensure the effectiveness of blocking water and oxygen intrusion channels and current channels, the metal isolation pillar 303 is annular, and the groove is also annular, surrounding the opening area 330. It is understandable that... Figure 4 The opening area 330 in the middle points in the direction of the display area 310, that is... Figure 4The first direction X shown is from left to right, as reflected in... Figure 3 The middle direction is also from left to right because... Figure 4 for Figure 3 The CC cross-section diagram is a cut-out of... Figure 3 The right center of the central ring isolation zone 320, for Figure 3 At different positions of the central annular isolation zone 320, the direction in which the opening area 330 points to the display area 310 is different; for example, for... Figure 3 The opening area 330 is located at the center left side of the central ring isolation zone 320, pointing towards the display area 310 in the first direction. Figure 3 The middle direction is from right to left. Figure 3 At the upper center of the central annular isolation zone 320, the opening area 330 points towards the display area 310 (first direction). Figure 3 The middle direction is from bottom to top.

[0053] In one possible implementation, the length of the groove in the first direction is 2μm-10μm. This ensures the interruption of the current path in the cathode layer 305.

[0054] It should be noted that, Figure 4 As shown, the groove cross-section is an inverted trapezoid, but this embodiment is not limited to this. For example, the groove cross-section can also be rectangular or other shapes, as long as it can form a break in the direction of the metal isolation column from the opening area to the display area.

[0055] In one possible implementation, such as Figure 4 As shown, the groove is located at the center of the metal isolation post 303 in the first direction.

[0056] In one possible implementation, such as Figure 4 As shown, the metal isolation pillar 303 includes a first metal layer 3031, a second metal layer 3032 and a third metal layer 3033 stacked in sequence, and the two side surfaces of the second metal layer 3032, which are close to and far from the hole area 330, form inward recesses.

[0057] To achieve the separation of the light-emitting layer 304 and the cathode layer 305 at the ends of the metal isolation pillar 303 near and far from the aperture region 330, respectively, as follows: Figure 4 As shown, the metal isolation pillar 303 includes a first metal layer 3031, a second metal layer 3032, and a third metal layer 3033 stacked sequentially. For example, the first metal layer 3031 and the third metal layer 3033 are made of titanium (Ti), and the second metal layer 3032 is made of aluminum (Al), i.e., the metal isolation pillar 303 has a Ti-Al-Ti structure. The second metal layer 3032 has a surface near the opening region 330 and a surface away from the opening region 330 (i.e.,...) Figure 4 The left and right surfaces of the metal layer form inward recesses, a structure that can be achieved through lateral etching. This can be achieved by etching a portion of the second metal layer 3032, which serves as the intermediate metal layer. For example, a mixture of nitric acid, acetic acid, and phosphoric acid can be used for etching. This solution only etches aluminum (Al) and not titanium (Ti). Therefore, based on... Figure 3 When the light-emitting layer 304 is formed by, for example, a vapor deposition process, the metal isolation pillar 303 shown can be interrupted at the ends of the metal isolation pillar 103 near and far from the hole region 130, thereby blocking the light-emitting layer 304 through the metal isolation pillar 303 to block the water and oxygen intrusion channel.

[0058] In a specific example, the thickness of the first metal layer 3031 and the third metal layer 3033, for instance, are made of titanium (Ti). For example, the thickness of the second metal layer 3032, made of aluminum (Al), is... It should be noted that, Figure 4 The thickness of each membrane layer in the isolation zone 320 shown is only schematic and does not represent the actual thickness value or relative proportion.

[0059] Understandably, the second metal layer, which is the intermediate metal layer, can form an inward depression on the side surface near the opening area or on the side surface far away from the opening area. This can achieve the breaking of the light-emitting layer at the end of the metal isolation pillar near or far from the opening area. In this way, the light-emitting layer can also be isolated by the metal isolation pillar to block the water and oxygen intrusion channel.

[0060] In one possible implementation, the display area 310 includes a substrate 301, a driving circuit layer on the substrate 301, and a planarization layer on the driving circuit layer, with an insulating layer 302 disposed on the same layer as the planarization layer. This simplifies the manufacturing process of the display panel.

[0061] In one possible implementation, the driving circuit layer includes a source / drain metal layer, and at least one of a first metal layer 3031, a second metal layer 3032, and a third metal layer 3033 is disposed on the same layer as the source / drain metal layer. This simplifies the manufacturing process of the display panel.

[0062] In a specific example, the substrate 301 can be made of materials such as glass or quartz. The display panel 300 provided in this embodiment also includes a barrier layer and a buffer layer located between the substrate 301 and the driving circuit layer. For example, the barrier layer and the buffer layer can be formed on the entire surface of the substrate 301. For example, the barrier layer can be made of inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride, and the buffer layer can also be made of inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride. The barrier layer helps to prevent water and oxygen from entering the OLED from the bottom. The buffer layer helps to improve the quality of subsequent material deposition.

[0063] The driving circuit layer, also known as the thin-film transistor (TFT) layer, includes an active layer formed on the buffer layer using a patterning process; a gate insulating layer (GI) formed on the active layer by deposition or other methods; the gate of the TFT formed on the gate insulating layer using a patterning process; a dielectric layer (ILD) formed on the gate by deposition or other methods; and a source / drain metal layer formed on the dielectric layer. The source / drain metal layer forms the source and drain of the TFT. For example, the source is electrically connected to the active layer through a via in the dielectric layer. The active layer can be made of materials such as polysilicon and metal oxides, while the gate insulating layer and dielectric layer can be made of inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride. The gate material includes metals or alloys such as aluminum, titanium, and cobalt.

[0064] The planarization layer (PLN) and the insulating layer 302 disposed on the same layer (the insulating layer 302 can be regarded as the part of the planarization layer extending to the isolation region 320) are, for example, organic materials with a thickness of, for example, about 1μm to 3μm. Through-holes are formed, for example, metal oxides such as ITO and IZO or metals such as Ag, Al, Mo or their alloys. The anode is electrically connected to the drain through the planarization layer through the through-holes.

[0065] For example, the display area also includes a light-emitting layer and a cathode. The light-emitting layer 304 of the isolation area 320 is disposed on the same layer as the light-emitting layer of the display area, and the cathode layer 305 of the isolation area 320 is disposed on the same layer as the cathode of the display area.

[0066] In one possible implementation, such as Figure 4 As shown, the isolation region 320 also includes a packaging layer (TFE) 306 located on the cathode layer 305.

[0067] Furthermore, such as Figure 4 As shown, the encapsulation layer 306 includes, for example, a first inorganic encapsulation layer 3061, an organic encapsulation layer 3062, and a second inorganic encapsulation layer 3063, which are stacked sequentially.

[0068] For example, the first inorganic encapsulation layer 3061 and the second inorganic encapsulation layer 3062 are formed by deposition or other methods. The first inorganic encapsulation layer 3061 can be referred to as CVD1, and the second inorganic encapsulation layer 3062 can be referred to as CVD2. The organic encapsulation layer 3062 is formed by inkjet printing. The organic encapsulation layer 3062 can be referred to as IJP.

[0069] For example, the first inorganic encapsulation layer 3061 and the second inorganic encapsulation layer 3062 can be formed using inorganic materials such as silicon nitride, silicon oxide, and silicon oxynitride, while the organic encapsulation layer 3062 can be formed using organic materials such as polyimide (PI) and epoxy resin. Thus, the first inorganic encapsulation layer 3061, the organic encapsulation layer 3062, and the second inorganic encapsulation layer 3063 form a composite encapsulation layer 306. This composite encapsulation layer 306 provides multiple layers of protection for the functional structure of the display panel 300, resulting in better encapsulation performance.

[0070] It is understandable that in the display panel 300, the encapsulation layer 306 extends to the display area 310, or in other words, the encapsulation layer 306 covers the display area 310 and the isolation area 320.

[0071] In addition, the display panel 300 provided in this embodiment may also include other film layers such as a touch layer and a transparent cover plate disposed on the side of the encapsulation layer away from the substrate, which will not be described in detail here.

[0072] Another embodiment of this disclosure provides a method for manufacturing a display panel, the display panel including a display area, an aperture area, and an isolation area located between the display area and the aperture area, the manufacturing method including:

[0073] Provide substrate;

[0074] An insulating layer is formed on the substrate;

[0075] Metal isolation pillars are formed on the insulating layer;

[0076] A groove is formed on the metal isolation post, extending from the side surface away from the insulating layer to the side surface near the insulating layer, penetrating the metal isolation post;

[0077] A light-emitting layer and a cathode layer are sequentially formed on the metal isolation pillar and the exposed insulating layer, wherein the light-emitting layer and the cathode layer are respectively disconnected at the ends of the metal isolation pillar near and / or away from the opening area.

[0078] The sample prepared in this embodiment is as follows: Figure 3 Taking the display panel 300 shown as an example, for the display panel 300 as... Figure 4 The preparation process for the isolation zone 320 shown is as follows:

[0079] An insulating layer 302 is formed on substrate 301 using, for example, a deposition process, to obtain... Figure 5 The structure shown;

[0080] The metal isolation pillar body is formed on the insulating layer 302 using a patterning process, resulting in... Figure 6 The structure shown;

[0081] A groove is made through the metal isolation post body to form a metal isolation post 303 with the groove, resulting in... Figure 7 The structure shown;

[0082] The light-emitting layer 304 is formed using, for example, a vapor deposition process, to obtain... Figure 8 The structure shown has a light-emitting layer 304 that is broken at the ends of the metal isolation pillar 303 near and far from the aperture region 330.

[0083] The cathode layer 305 is formed using, for example, a deposition process, to obtain... Figure 9 The structure shown has a cathode layer 305 that is broken at the ends of the metal isolation pillar 303 near and far from the hole region 330, and the cathode layer 305 in the groove is blocked by the light-emitting layer 304 and cannot be electrically connected to the metal isolation pillar 303.

[0084] Forming encapsulation layer 306, resulting in... Figure 4 The structure shown.

[0085] Another embodiment of this disclosure provides a display device, including the display panel provided in the above embodiments. The display device can be any product or component with display functionality, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator; this embodiment does not limit this to any particular type.

[0086] Obviously, the above embodiments of this disclosure are merely examples for clearly illustrating this disclosure, and are not intended to limit the implementation of this disclosure. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all implementation methods here. Any obvious variations or modifications derived from the technical solutions of this disclosure are still within the protection scope of this disclosure.

Claims

1. A display panel, characterized in that, It includes a display area, an opening area, and an isolation area located between the display area and the opening area, the isolation area including: Substrate; An insulating layer located on the substrate; A metal isolation post located on the insulating layer, wherein the metal isolation post has a groove extending from a surface away from the insulating layer to a surface close to the insulating layer through the metal isolation post; A light-emitting layer and a cathode layer are sequentially stacked on the metal isolation pillar and the exposed insulating layer, wherein the light-emitting layer and the cathode layer are respectively disconnected at the ends of the metal isolation pillar near and / or away from the opening area; The metal isolation pillar surrounds the opening area and the groove surrounds the opening area, cutting off the current path of the cathode layer of the isolation area.

2. The display panel according to claim 1, characterized in that, The length of the groove is 2μm-10μm in a first direction, which is the direction from the opening area to the display area.

3. The display panel according to claim 1, characterized in that, The groove is formed at the center of the metal isolation post in a first direction, which is the direction from the opening area to the display area.

4. The display panel according to claim 1, characterized in that, The metal isolation pillar includes a first metal layer, a second metal layer and a third metal layer stacked in sequence, wherein the surface of the second metal layer near and / or away from the opening area forms an inward recess.

5. The display panel according to claim 4, characterized in that, The display area includes a substrate, a driving circuit layer on the substrate, and a planarization layer on the driving circuit layer, wherein the insulating layer is disposed on the same layer as the planarization layer.

6. The display panel according to claim 5, characterized in that, The driving circuit layer includes a source / drain metal layer, and at least one of the first metal layer, the second metal layer, and the third metal layer is disposed on the same layer as the source / drain metal layer.

7. The display panel according to claim 1, characterized in that, The isolation region also includes an encapsulation layer located on the cathode layer.

8. A display device, characterized in that, Includes the display panel as described in any one of claims 1-7.

9. A method for manufacturing a display panel as described in any one of claims 1-7, characterized in that, The display panel includes a display area, an opening area, and an isolation area located between the display area and the opening area; the manufacturing method includes: Provide substrate; An insulating layer is formed on the substrate; Metal isolation pillars are formed on the insulating layer; A groove is formed on the metal isolation post, extending from the side surface away from the insulating layer to the side surface near the insulating layer, penetrating the metal isolation post; A light-emitting layer and a cathode layer are sequentially formed on the metal isolation pillar and the exposed insulating layer, wherein the light-emitting layer and the cathode layer are respectively disconnected at the ends of the metal isolation pillar near and / or away from the opening area.

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