PCB patch manufacturing method and device

Abstract

This application provides a PCB surface mount technology (SMT) manufacturing method and apparatus. The method includes: acquiring work order information; comparing the specification information in any two BOM files; merging at least two BOM files whose specification information similarity is greater than a preset threshold, merging the corresponding PNP files of the BOM files, and merging the corresponding Gerber files of the BOM files to obtain a target group; and generating a target file based on the target group; and generating a PCB surface mount technology (SMT) manufacturing program based on the target file and a benchmark program. This application solves the problem of wasted manpower due to the need for extensive manual programming in the PCB surface mount technology (SMT) manufacturing process, thereby achieving automated PCB surface mount technology (SMT) manufacturing.

Description

Technical Field

[0001] This application relates to the field of PCBA electronic manufacturing, and more specifically, to a PCB surface mount manufacturing method, apparatus, computer-readable storage medium, and electronic device. Background Technology

[0002] In the PCBA electronics manufacturing industry, the development of intelligent manufacturing is accelerating, labor costs are rising, and the increasing market demand for small-batch, high-variety, rapidly changing, and customized products leads to frequent production line changes. This necessitates a large workforce to create programs for pick-and-place machines, a tedious and complex process. Currently, the following problems exist: program creation is cumbersome, involving 31 steps and taking 5-6 hours to complete, requiring a significant number of personnel; programmers are prone to errors, leading to quality issues; program merging relies on manual intervention, resulting in low merging rates and a high risk of defective components (wrong, missing, or extra parts); and the learning curve is steep, hindering technology transfer, with training a programmer typically taking six months to a year.

[0003] Therefore, there is an urgent need for a method to solve the problem of wasted manpower caused by the large amount of manpower required to write programs during PCBA surface mount technology (SMT) manufacturing. Summary of the Invention

[0004] This application provides a PCB surface mount manufacturing method, apparatus, computer-readable storage medium, and electronic device to at least solve the problem of wasted manpower caused by the need for a large amount of human resources to participate in programming during the PCB surface mount manufacturing process in related technologies.

[0005] According to one embodiment of this application, a PCB surface mount technology (SMT) manufacturing method is provided, comprising: obtaining work order information, wherein the work order information includes a BOM file, a PNP file, and a Gerber file, wherein the BOM file corresponds one-to-one with the PNP file and the Gerber file, the content of the BOM file includes at least the specification information of multiple components corresponding to a component type required in the PCB surface mount technology (SMT) manufacturing process, the specification information includes at least the component model and performance parameters, the PNP file includes at least component mounting information, and the Gerber file includes at least PCB substrate information; comparing the specification information in any two BOM files, merging at least two BOM files whose specification information similarity is greater than a preset threshold, merging the PNP files corresponding to the BOM files, and merging the Gerber files corresponding to the BOM files. The .er files are merged to obtain a target group, and a target file is generated based on the target group. The target group includes at least one merged BOM file, one PNP file corresponding to the merged BOM file, and one Gerber file corresponding to the merged BOM file. The content of the target file includes PCB surface mount manufacturing information, which includes at least the component type, the PCB substrate information, and the component mounting information. The PCB substrate information includes at least the zero-point coordinates and thickness of the PCB substrate, and the component mounting information includes at least the component mounting coordinates and the component mounting angle. Based on the target file and the reference program, a PCB surface mount manufacturing program is generated, where the reference program is the program corresponding to all steps of the PCB surface mount manufacturing process. The PCB surface mount manufacturing program is used to create the PCB surface mount program.

[0006] In an exemplary embodiment, merging at least two BOM files whose similarity to the specification information is greater than a preset threshold, merging the PNP files corresponding to the BOM files, and merging the Gerber files corresponding to the BOM files to obtain a target group includes: merging at least two BOM files whose similarity to the specification information is greater than a preset threshold, merging the PNP files corresponding to the BOM files, and merging the Gerber files corresponding to the BOM files, and obtaining the component attribute information corresponding to the specification information in the merged BOM files to obtain the target group. The component attribute information includes at least one of component quality grade, component moisture resistance data, component temperature resistance data, and component reference point. The merged BOM files in the target group correspond one-to-one with the merged PNP files and the merged Gerber files.

[0007] In one exemplary embodiment, merging at least two BOM files whose specification information similarity is greater than a preset threshold, merging the PNP files corresponding to the BOM files, and merging the Gerber files corresponding to the BOM files to obtain a target group further includes: merging multiple BOM files, multiple PNP files corresponding to the BOM files, and multiple Gerber files corresponding to the BOM files to obtain a target group when the similarity of specification information between any two BOM files in the multiple BOM files is greater than a preset threshold.

[0008] In one exemplary embodiment, generating a target file based on the target group includes: obtaining PCB patch manufacturing information based on the PNP file and Gerber file corresponding to the target group; determining whether the PCB patch manufacturing information is the same as the information in the BOM file, the PNP file, and the Gerber file before merging; if they are the same, outputting the PCB patch manufacturing information to a file recognizable by the patch manufacturing equipment to obtain the target file.

[0009] In an exemplary embodiment, generating a PCB assembly fabrication program based on the target file and the benchmark program includes: inputting the target file into the benchmark program to generate the PCB assembly fabrication program; after generating the PCB assembly fabrication program based on the target file and the benchmark program, the method further includes: generating a loading operation instruction and a PCB assembly diagram based on the PCB assembly fabrication program, wherein the loading operation instruction includes material information required for PCB assembly fabrication and fabrication information of the PCB assembly, and the PCB assembly diagram shows a PCB board and multiple components on the PCB board, wherein the multiple components are distributed according to the fabrication information.

[0010] In an exemplary embodiment, inputting the target file into a benchmark program to generate a PCB surface mount fabrication program includes: inputting the target file into the benchmark program to generate a preliminary PCB surface mount fabrication program; calculating the distance between the mounting coordinates of each component and the zero-point coordinates of the PCB substrate based on the PCB surface mount fabrication information in the target file to obtain multiple target distances; comparing the magnitudes of the multiple target distances and sorting the components according to the order of the target distances from smallest to largest to obtain a fabrication order; optimizing the preliminary PCB surface mount fabrication program according to the fabrication order to obtain the PCB surface mount fabrication program, wherein the order in which the multiple components are fabricated in the PCB surface mount fabrication program is the fabrication order.

[0011] In an exemplary embodiment, a material issuance sheet and a work order QR code are generated based on the material loading operation instruction and the work order information. The work order QR code includes the component type and the work order number, wherein the work order number represents the work order information. The work order QR code is then sent to the management system.

[0012] In one exemplary embodiment, obtaining work order information includes: automatically downloading work order information from an SAP system, wherein the SAP system is used to manage the work order information, and system administrators need to maintain the SAP system in advance to ensure the integrity of the work order information.

[0013] According to another embodiment of this application, a PCB surface mount technology (SMT) fabrication apparatus is provided, comprising: an acquisition module for acquiring work order information, wherein the work order information includes a BOM file, a PNP file, and a Gerber file, wherein the BOM file corresponds one-to-one with the PNP file and the Gerber file, the content of the BOM file includes at least the specification information of multiple components corresponding to a component type required in the PCB surface mount technology (SMT) fabrication process, the specification information includes at least the component model and performance parameters, the PNP file includes at least component mounting information, and the Gerber file includes at least PCB substrate information; and a first generation module for comparing the specification information in any two BOM files, merging at least two BOM files whose specification information similarity is greater than a preset threshold, merging the PNP files corresponding to the BOM files, and merging the PNP files corresponding to the BOM files. Gerber files are merged to obtain a target group, and a target file is generated based on the target group. The target group includes at least one merged BOM file, a PNP file corresponding to the merged BOM file, and a Gerber file corresponding to the merged BOM file. The target file contains PCB surface mount manufacturing information, which includes at least the component type, the PCB substrate information, and the component mounting information. The PCB substrate information includes at least the zero-point coordinates and thickness of the PCB substrate, and the component mounting information includes at least the component mounting coordinates and the component mounting angle. A second generation module is used to generate a PCB surface mount manufacturing program based on the target file and a reference program. The reference program is the program corresponding to all steps of the PCB surface mount manufacturing process, and the PCB surface mount manufacturing program is used to create the PCB surface mount program.

[0014] According to yet another embodiment of this application, a computer-readable storage medium is also provided, wherein a computer program is stored therein, and the computer program is configured to perform the steps in any of the above method embodiments when it is run.

[0015] According to yet another embodiment of this application, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0016] This application achieves a solution by merging BOM files with a similarity greater than a preset threshold, merging corresponding PNP files, and merging corresponding Gerber files based on the similarity of the specification information contained in the BOM files in the work order information. PCB manufacturing information is obtained from these merged files, thereby merging the manufacturing information of components with similar specifications. Then, based on the PCB manufacturing information and a baseline program, a PCB assembly program is generated. The PCB assembly program is then automatically generated, eliminating the need for manual writing and merging of PCB assembly programs. This solves the problem of wasted manpower due to the large amount of human intervention required for programming in the PCB assembly process, achieving the effect of automated PCB assembly. Attached Figure Description

[0017] Figure 1 This is a hardware structure block diagram of a mobile terminal according to a PCB surface mount manufacturing method according to an embodiment of this application;

[0018] Figure 2 This is a flowchart of a PCB surface mount manufacturing method according to an embodiment of this application;

[0019] Figure 3 This is a flowchart of a method for obtaining work order information in a PCB surface mount manufacturing method according to an embodiment of this application;

[0020] Figure 4 This is a flowchart of a method for merging BOM files in a PCB surface mount manufacturing method according to an embodiment of this application;

[0021] Figure 5 This is a flowchart of a method for merging BOM files in another PCB surface mount manufacturing method according to an embodiment of this application;

[0022] Figure 6 This is a flowchart of a method for providing PCB assembly manufacturing information in a PCB assembly manufacturing method according to an embodiment of this application;

[0023] Figure 7 This is a flowchart of a method for generating a target file in a PCB surface mount manufacturing method according to an embodiment of this application;

[0024] Figure 8This is a flowchart of a PCB surface mount manufacturing process optimization method according to an embodiment of this application;

[0025] Figure 9 This is a flowchart of a method for generating a material release sheet and a work order QR code in a PCB surface mount manufacturing method according to an embodiment of this application;

[0026] Figure 10 This is a schematic diagram of a PCB surface mount fabrication apparatus according to an embodiment of this application;

[0027] The above figures include the following reference numerals:

[0028] 102. Processor; 104. Memory; 106. Transmission device; 108. Input / output device. Detailed Implementation

[0029] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0031] The methods and embodiments provided in this application can be executed on a mobile terminal, a computer terminal, or a similar computing device. Taking running on a mobile terminal as an example, Figure 1 This is a hardware structure block diagram of a mobile terminal based on a PCB surface mount fabrication method according to an embodiment of this application. For example... Figure 1 As shown, a mobile terminal may include one or more ( Figure 1 Only one is shown in the diagram. A processor 102 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 104 for storing data are also shown. The mobile terminal may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the mobile terminal described above. For example, the mobile terminal may also include components that are more... Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0032] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the PCB surface mount manufacturing method in this embodiment. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thus implementing the above-described method. The memory 104 may include high-speed random access memory and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to a mobile terminal via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0033] The transmission device 106 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by the mobile terminal's communication provider. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0034] For ease of description, the following explains some of the nouns or terms used in the embodiments of this application:

[0035] PCB: Printed Circuit Board, abbreviated as PCB;

[0036] PCBA: The English name is Printed Circuit Board Assembly, abbreviated as PCBA. It refers to the entire process of a bare PCB board going through SMT component mounting or DIP insertion.

[0037] SAP: The software name for enterprise management solutions, its English name is System of Applications, and its abbreviation is SAP;

[0038] BOM file: Bill of Material, abbreviated as BOM, is a file that describes the structure of a product in a data format. It is a computer-readable product structure data file that contains information such as the types, specifications, models, brands and quantities of required components.

[0039] PNP file: coordinate file;

[0040] Gerber file: A file that describes the circuitry of a PCB substrate.

[0041] This embodiment provides a PCB surface mount fabrication method for the aforementioned mobile terminal. Figure 2 This is a flowchart of a PCB surface mount fabrication method according to an embodiment of this application, such as... Figure 2 As shown, the process includes the following steps:

[0042] Step S202: Obtain work order information, wherein the work order information includes BOM file, PNP file and Gerber file. The BOM file corresponds one-to-one with the PNP file and the Gerber file. The content of the BOM file includes at least the specification information of multiple components corresponding to one type of component required in the PCB surface mount manufacturing process. The specification information includes at least the component model and performance parameters. The PNP file includes at least the component mounting information. The Gerber file includes at least the PCB substrate information.

[0043] Specifically, the aforementioned work order information refers to processing order information from customers. This information includes a BOM (Bill of Materials) file (the list of materials required for PCB surface mount technology), a PNP (Component Components) file (the coordinates and other installation information of the components), and a Gerber file (the PCB substrate information). The BOM file contains information such as the type, model, brand, specifications, and quantity of the required components. In traditional PCB surface mount technology manufacturing, workers typically write the necessary programs for each step based on the aforementioned work order information. These programs are then manually combined, and finally, the PCB surface mount technology is manufactured.

[0044] Step S204: Compare the specification information in any two of the above BOM files, merge at least two of the above BOM files whose specification information similarity is greater than a preset threshold, merge the PNP files corresponding to the above BOM files, and merge the Gerber files corresponding to the above BOM files to obtain a target group, and generate a target file based on the above target group. The target group includes at least one merged BOM file, one PNP file corresponding to the merged BOM file, and one Gerber file corresponding to the merged BOM file. The content of the target file includes PCB surface mount manufacturing information. The manufacturing information includes at least the component type, the PCB substrate information, and the component mounting information. The PCB substrate information includes at least the zero-point coordinates and thickness of the PCB substrate, and the component mounting information includes at least the component mounting coordinates and the component mounting angle.

[0045] Specifically, each type of component corresponds to a BOM file, and components of the same type have different specifications. Specification information refers to component size and performance parameters, etc. For example, if the component type is an inductor, inductor components have different sizes and performance parameters, etc. This application automatically merges the information of components with the same specification information and manufacturing information to generate target files, eliminating the need for manual programming and program merging based on the manufacturing information of each component.

[0046] Step S206: Based on the target file and the benchmark program, generate a PCB assembly program, wherein the benchmark program is the program corresponding to all steps of the PCB assembly process, and the PCB assembly program is used to create the PCB assembly program.

[0047] Specifically, by inputting the automatically merged production information, i.e., the target file, into the baseline program, the PCB assembly production program can be automatically generated. The assembly equipment automatically produces the PCB assembly program according to the above PCB assembly production program. Therefore, a fully automated PCB assembly production process is realized, avoiding the waste of human resources caused by manual program writing and merging.

[0048] Through the above steps, based on the similarity of the specification information contained in the BOM files in the work order information, BOM files with a similarity greater than a preset threshold are merged, as are the corresponding PNP files and Gerber files. Based on the merged files, PCB manufacturing information is obtained, thereby merging the manufacturing information of components with similar specification information. Then, based on the above PCB manufacturing information and the baseline program, a PCB assembly manufacturing program is generated. The PCB assembly program is automatically generated based on the above PCB assembly manufacturing program, eliminating the need for manual PCB assembly program writing and merging. Instead, the PCB assembly manufacturing program is automatically generated, solving the problem of wasted manpower caused by the need for a large amount of manpower to write programs in the PCB assembly manufacturing process. This achieves the effect of automatic PCB assembly manufacturing and improves the efficiency of PCB assembly manufacturing.

[0049] The entities performing the above steps can be printers, reflow soldering machines, SPI, and AOI, but are not limited to these.

[0050] In some embodiments, merging at least two BOM files with a similarity greater than a preset threshold, merging the corresponding PNP files, and merging the corresponding Gerber files to obtain a target group includes: merging at least two BOM files with a similarity greater than a preset threshold, merging the corresponding PNP files, and merging the corresponding Gerber files, and obtaining the component attribute information corresponding to the specification information in the merged BOM file to obtain the target group. The component attribute information includes at least one of component quality grade, component moisture resistance data, component temperature resistance data, and component reference point. The merged BOM file in the target group corresponds one-to-one with the merged PNP file and the merged Gerber file. Through the above steps, manufacturing information with a similarity greater than a preset threshold is merged, and the attribute information corresponding to the components of the corresponding specifications is obtained to obtain the target group. This allows for batch manufacturing of PCB components according to the specification information.

[0051] Specifically, since the BOM file contains a list of components needed for PCB assembly, including information such as component type, model, specifications, brand, and quantity, the downloaded BOM files are first grouped by component type. This means that BOM files in the same group contain components of the same type. Then, the component specifications within the BOM files of the same component type are compared. Component specifications can include component dimensions and performance parameters. For example, setting a preset threshold of 75%, the specifications of inductors in two BOM files are compared. If the identical portion of the specifications in the two inductor BOM files exceeds the preset threshold of 75%, the two BOM files are merged. The corresponding PNP files and Gerber files are also merged. The merged BOM file, PNP file, and Gerber file maintain a one-to-one correspondence. Then, the component attribute information corresponding to the specifications in the merged BOM file is obtained, such as component quality grade, humidity resistance data, temperature resistance data, and reference point. Each component specification has corresponding attribute information, which can be obtained from the downloaded work order information. The merged BOM file, the component attribute information corresponding to the specifications in the merged BOM file, the merged PNP file, and the merged Gerber file are used to generate a target group. Since the BOM file is a bill of materials, the PNP file is a coordinate file, and the Gerber file contains information such as the circuitry of the PCB substrate, the above steps merge the PCB assembly information for components with similar specifications. This allows subsequent steps to perform PCB assembly according to the merged assembly information, thus achieving batch production of PCBs. It should be noted that the preset threshold value can be set according to the actual application scenario; that is, this application does not limit the specific value of the preset threshold.

[0052] Of course, in practical applications, when the similarity of the specification information in any two BOM files is less than the preset threshold, the BOM files will not be merged, and the existing PCB surface mount manufacturing method will still be used for manufacturing.

[0053] In some embodiments, merging at least two BOM files whose specification information similarity is greater than a preset threshold, merging the PNP files corresponding to the BOM files, and merging the Gerber files corresponding to the BOM files to obtain a target group further includes: merging multiple BOM files, multiple PNP files corresponding to the BOM files, and multiple Gerber files corresponding to the BOM files to obtain a target group when the similarity of specification information between any two of the multiple BOM files is greater than a preset threshold. Through the above steps, multiple BOM files with similar specification information can be merged, expanding the application scenarios of this application.

[0054] Specifically, for example, if there are five BOM files for inductor types numbered 1, 2, 3, 4, and 5, and the specifications in file 1 are compared with those in files 2, 3, 4, and 5 respectively, the similarity is greater than 75%, indicating that the similarity of the specifications in any two of the above five files is greater than 75%. In this case, the above five BOM files, the corresponding PNP files of the above five BOM files, and the corresponding Gerber files of the above five BOM files should be merged.

[0055] To ensure the accuracy of PCB surface mount technology (SMT) fabrication information, in some embodiments, a target file is generated based on the aforementioned target group. This includes: obtaining the PCB surface mount fabrication information from the PNP file and Gerber file corresponding to the target group; determining whether the PCB surface mount fabrication information is identical to the information in the pre-merged BOM file, PNP file, and Gerber file; and if identical, outputting the PCB surface mount fabrication information to a file recognizable by the surface mount fabrication equipment to obtain the target file. These steps ensure the accuracy of the PCB surface mount fabrication information and output it to guide the surface mount fabrication equipment in the fabrication process.

[0056] Specifically, since the PCB assembly information is derived from the Bill of Materials (BOM) information, the coordinate information from the PNP file, and the PCB substrate information from the Gerber file within the target group, comparing this PCB assembly information with the original BOM, PNP, and Gerber files can determine the accuracy of the PCB assembly information. After confirming the correctness of the PCB assembly information, since the formats of the BOM, PNP, and Gerber files cannot be directly recognized by the assembly equipment, these unrecognizable files need to be converted to a format that the assembly equipment can recognize, such as a CRB format file, thus obtaining the target file. The assembly equipment can then perform the assembly process based on this target file.

[0057] In some embodiments, generating a PCB assembly fabrication program based on the aforementioned target file and benchmark program includes: inputting the aforementioned target file into the benchmark program to generate the PCB assembly fabrication program; to guide the fabrication of the PCB assembly and further verify the correctness of the fabricated PCB assembly, after generating the PCB assembly fabrication program based on the aforementioned target file and benchmark program, the method further includes: generating a loading operation instruction and a PCB assembly diagram based on the PCB assembly fabrication program, wherein the loading operation instruction includes material information required for PCB assembly fabrication and fabrication information for the PCB assembly, and the PCB assembly diagram shows a PCB board and multiple components on the PCB board, with the multiple components distributed according to the fabrication information. Through the above steps, an automatic PCB assembly fabrication program can be generated, thereby automatically fabricating the PCB assembly, and further guiding the fabrication of the PCB assembly through the loading operation instruction and PCB assembly diagram.

[0058] Specifically, the surface mount technology (SMT) fabrication equipment is equipped with a baseline program. The target file, which is recognizable by the SMT fabrication equipment, is input into the baseline program, generating the final PCB surface mount fabrication program. Based on this program, the SMT fabrication equipment can automatically fabricate the PCB surface mount components. Furthermore, the material loading instructions generated based on the PCB surface mount fabrication program are provided to staff and the materials department for material preparation. After the PCB surface mount components are fabricated, the PCB surface mount diagram is used for verification to ensure the correctness of the finished PCB surface mount components.

[0059] To ensure the orderly and efficient placement of components required in the PCB surface mount technology (SMT) fabrication process, in some embodiments, the aforementioned target file is input into a benchmark program to generate a PCB surface mount fabrication program. This includes: inputting the target file into the benchmark program to generate a preliminary PCB surface mount fabrication program; calculating the distance between the mounting coordinates of each component and the zero-point coordinates of the PCB substrate based on the PCB surface mount fabrication information in the target file, obtaining multiple target distances; comparing the magnitudes of these target distances; and sorting the components according to the ascending order of the target distances to obtain the fabrication order; optimizing the preliminary PCB surface mount fabrication program based on the fabrication order to obtain the final PCB surface mount fabrication program, where the order in which the components are fabricated is the final fabrication order. Through these steps, components are placed according to the principle of proximity to the zero-point coordinates of the PCB substrate (i.e., the target distance), thus avoiding a chaotic fabrication order and ensuring an orderly and efficient surface mount fabrication process.

[0060] Specifically, after the target file is input into the benchmark program, the benchmark program contains the PCB placement information from the target file, thus generating a preliminary PCB placement program. During PCB placement, placement is generally performed according to the principle of increasing distance between the placement component's coordinates and the zero-point coordinates of the PCB substrate. Therefore, the preliminary PCB placement program needs to be optimized so that the placement equipment follows this principle of increasing target distance. For example, if the zero-point coordinates of the PCB substrate are (0,0,), and the coordinates of the components required for PCB placement are A(1,3), B(5,2), C(3,4), and D(2,3), then the calculated distances between each component and the zero-point coordinates of the PCB substrate are: component A is approximately 3.16, component B is approximately 5.39, component C is 5, and component D is approximately 3.61. Arranged in ascending order of target distance, these are A, D, C, B. Therefore, the components on the PCB substrate are placed in this order. In practical applications, the manufacturing order can also be arranged according to the size of the components; that is, this application does not limit the specific method of the above manufacturing order.

[0061] To facilitate management between departments, in some embodiments, a material issuance sheet and a work order QR code are generated based on the material loading operation instructions and the aforementioned work order information. The work order QR code contains the aforementioned component type and work order number, whereby the work order number represents the aforementioned work order information. The work order QR code is then sent to the management system. Through the above steps, the material information required for PCB assembly in the material loading operation instructions is checked against the work order information to ensure the accuracy of the material information. A material issuance sheet is generated for the material issuance department to issue materials, and a work order QR code is generated and sent to the management system for traceability in case of incorrect material issuance, facilitating cooperation and management between departments.

[0062] Specifically, after generating the material loading operation instruction, a material issuance list and a work order QR code are simultaneously generated based on the material information required for PCB surface mount technology (SMT) fabrication contained in the instruction. The material issuance list is then automatically sent to the material issuance department's management system. The department prepares and issues materials according to the issuance list, and simultaneously scans the work order QR code to upload the material issuance information to the management system, creating an issuance record to indicate that the materials required for PCB SMT fabrication have been issued. Errors in material issuance can be traced back through the issuance records in the management system.

[0063] In some embodiments, obtaining work order information includes: automatically downloading work order information from the SAP system, wherein the SAP system is used to manage the work order information, and system administrators need to maintain the SAP system in advance to ensure the integrity of the work order information. Through the above steps, customer work order information can be obtained conveniently and accurately.

[0064] Specifically, companies typically have an order management software system. Through this system, they can receive customer order information. Production managers need to check and maintain the work order information in the SAP system daily to ensure its integrity.

[0065] To enable those skilled in the art to better understand the technical solution of this application, the implementation process of the PCB surface mount manufacturing method of this application will be described in detail below with reference to specific embodiments.

[0066] This embodiment relates to a specific PCB surface mount technology (SMT) fabrication method, such as... Figures 3 to 9 As shown, it includes the following steps:

[0067] Step S1: As Figure 3 As shown, production management (system management) personnel complete the production work orders for the day in advance, and automatically retrieve data from SAP in batches through an intelligent, unmanned, one-click programming plug-in device (PCB surface mount technology program), obtaining the BOM file, PNP data (PNP file) and Gerber file (Gerber file) corresponding to the work order information for the day.

[0068] Step S2: As Figure 4 and Figure 5As shown, production management (system management) personnel should maintain the MSD (Medium Dimensions) and heavy-duty component information database (component moisture resistance data) for each part number (specification information) in advance, maintain the temperature resistance data (component temperature resistance data) for each part number, and maintain the component marker (component reference point) for each part number in advance. If applicable, the system should automatically import the component quality grade, heavy-duty component information, component temperature resistance data, and component marker (component attribute information) corresponding to the part number, review the BOM file, and automatically compare the batch-downloaded BOM files with the original BOM file to ensure accuracy. Based on the similarity of specification information in the work order information, the batch-downloaded BOMs are organized, and then the individual unit BOMs are output according to the format required by the device. This involves determining the similarity of specification information in multiple BOM files. If the similarity is greater than or equal to 75%, the BOM files meet the merging criteria, and the individual unit (type) BOM files that meet the similarity criteria are merged (those that do not meet the criteria are not merged). Finally, a new merged BOM file and a list of unmerged BOM files are output to obtain the target group. This step can be summarized in the following four parts: 1. Automatically read and process BOMs: Data from... 1. Automatic processing: Retrieves relevant information from the database and generates a BOM file for each model (type); 2. Sets group priority conditions (similarity preset threshold): Adjusts the merging rules (similarity preset threshold) according to production needs and current production status; 3. Automatically generates group details: Compares BOM files according to the set merging rules and generates a combination detail that meets the requirements (merged BOM file, PNP file corresponding to the merged BOM file, Gerber file corresponding to the merged BOM file); 4. Generates a group list: Stores the merged details in a fixed location for use in subsequent program creation;

[0069] Step S3: As Figure 6As shown, after outputting the new merged BOM file and the list of unmerged BOM files, the system automatically prioritizes the BOMs based on the organized machine type (type) and performs automatic Gerber processing, automatic machine format conversion, automatic program optimization, and output. It also automatically generates a material release sheet and a work order barcode sheet (work order QR code) through automatic work order fitting and automatically uploads them to the MES (Management System) (based on the chronological order of the placement process by the placement equipment). This process involves the following steps: Automatic Gerber processing is performed based on the Gerber file containing the organized machine type (type) BOM and the PNP file containing the organized machine type BOM. This involves merging the Gerber files corresponding to the merged BOM file and merging the PNP files corresponding to the merged BOM file. Then, the PCB information (Mark coordinates, thickness, panel coordinates, etc.) and component coordinates, angles, etc. (PCB placement information) corresponding to the machine type (type) are output.

[0070] Step S4: As Figure 7 As shown, after outputting the PCB information (Mark coordinates, thickness, panel coordinates, etc.) and component coordinates, angles, etc. (PCB surface mount manufacturing information) corresponding to the machine type (type), it is necessary to verify the component coordinates and PCB substrate information against the downloaded original BOM file, corresponding PNP file, and corresponding Gerber file. After verifying that the PCB manufacturing information is correct, the PCB information (PCB surface mount manufacturing information) is automatically converted into the format required by the machine (surface mount manufacturing equipment), that is, the component (component) coordinates, angles, and PCB substrate information are output to a file that the surface mount manufacturing equipment can recognize.

[0071] Step S5: As Figure 8 As shown, after the PCB manufacturing information is output to a file in the format required by the machine (SMT assembly equipment), the machine program is automatically converted and generated. That is, the target file is input into the base program of the SMT assembly equipment to generate the PCB assembly program. The PCB assembly program is automatically optimized according to the principle of increasing the distance between each component and the zero point coordinate of the PCB substrate. Then the machine program is automatically output for machine (SMT assembly equipment) production use. At the same time, a material loading instruction is automatically generated for personnel to use in material preparation.

[0072] Step S6: As Figure 9As shown, after automatically generating the material loading instruction, the PCB assembly information in the material loading instruction is fitted and verified according to the work order information to ensure the accuracy of the PCB assembly information in the material loading instruction. Then, a material issuance sheet is automatically generated for the material department to issue materials. A work order barcode sheet (work order QR code) is automatically generated and uploaded to the MSE system (management system) to prevent incorrect material issuance and to facilitate traceability.

[0073] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0074] This embodiment also provides a PCB surface mount fabrication apparatus for implementing the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can refer to a combination of software and / or hardware that performs a predetermined function. Although the apparatus described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0075] Figure 10 This is a structural block diagram of a PCB surface mount fabrication apparatus according to an embodiment of this application, such as... Figure 10 As shown, the device includes:

[0076] The acquisition module 22 is used to acquire work order information, wherein the work order information includes BOM file, PNP file and Gerber file. The BOM file corresponds one-to-one with the PNP file and the Gerber file. The content of the BOM file includes at least the specification information of multiple components corresponding to one type of component required in the PCB surface mount manufacturing process. The specification information includes at least the model and performance parameters of the component. The PNP file includes at least the component mounting information. The Gerber file includes at least the PCB substrate information.

[0077] The first generation module 24 is used to compare the specification information in any two of the above BOM files, merge at least two of the above BOM files whose specification information similarity is greater than a preset threshold, merge the PNP files corresponding to the above BOM files, and merge the Gerber files corresponding to the above BOM files to obtain a target group, and generate a target file based on the above target group. The target group includes at least one merged BOM file, one PNP file corresponding to the merged BOM file, and one Gerber file corresponding to the merged BOM file. The content of the target file includes PCB surface mount manufacturing information. The manufacturing information includes at least the component type, the PCB substrate information, and the component mounting information. The PCB substrate information includes at least the zero-point coordinates and thickness of the PCB substrate. The component mounting information includes at least the component mounting coordinates and the component mounting angle.

[0078] The second generation module 26 is used to generate a PCB assembly manufacturing program based on the target file and the benchmark program, wherein the benchmark program is the program corresponding to all the devices for PCB assembly manufacturing, and the PCB assembly manufacturing program is used to create the PCB assembly program.

[0079] Through the aforementioned device, the first generation module merges BOM files with a similarity greater than a preset threshold, merges corresponding PNP files, and merges corresponding Gerber files based on the similarity of the specification information contained in the BOM files in the work order information. Based on the merged files, PCB manufacturing information is obtained, thereby merging the manufacturing information of components with similar specification information. Then, the second generation module generates a PCB assembly manufacturing program based on the aforementioned PCB manufacturing information and a baseline program. The PCB assembly program is then automatically generated, eliminating the need for manual writing and merging of PCB assembly programs. This solves the problem of wasted manpower due to the large amount of manpower required for programming in the PCB assembly process, achieving automated PCB assembly and improving PCB assembly efficiency.

[0080] In some embodiments, the first generation module includes a first merging submodule, configured to merge at least two BOM files whose similarity to the aforementioned specification information exceeds a preset threshold, merge the PNP files corresponding to the aforementioned BOM files, and merge the Gerber files corresponding to the aforementioned BOM files, and obtain component attribute information corresponding to the specification information in the merged BOM files to obtain a target group. The component attribute information includes at least one of component quality grade, component moisture resistance data, component temperature resistance data, and component reference point. The merged BOM files in the target group correspond one-to-one with the merged PNP files and the merged Gerber files. Through the above apparatus, manufacturing information with similarity to the aforementioned specification information exceeding a preset threshold is merged, and the attribute information corresponding to the components of the corresponding specifications is obtained to obtain a target group. This allows for batch manufacturing of PCB components according to the specification information.

[0081] Specifically, since the BOM file contains a list of components needed for PCB assembly, including information such as component type, model, specifications, brand, and quantity, the downloaded BOM files are first grouped by component type. This means that BOM files in the same group contain components of the same type. Then, the component specifications within the BOM files of the same component type are compared. Component specifications can include component dimensions and performance parameters. For example, setting a preset threshold of 75%, the specifications of inductors in two BOM files are compared. If the identical portion of the specifications in the two inductor BOM files exceeds the preset threshold of 75%, the two BOM files are merged. The corresponding PNP files and Gerber files are also merged. The merged BOM file, PNP file, and Gerber file maintain a one-to-one correspondence. Then, the component attribute information corresponding to the specifications in the merged BOM file is obtained, such as component quality grade, humidity resistance data, temperature resistance data, and reference point. Each component specification has corresponding attribute information, which can be obtained from the downloaded work order information. The merged BOM file, the component attribute information corresponding to the specifications in the merged BOM file, the merged PNP file, and the merged Gerber file are used to generate a target group. Since the BOM file is a bill of materials, the PNP file is a coordinate file, and the Gerber file contains information such as the circuitry of the PCB substrate, the aforementioned device merges the PCB assembly fabrication information for components with similar specifications. This allows subsequent devices to fabricate PCBs according to the merged fabrication information, thus achieving batch production of PCBs. It should be noted that the preset threshold value can be set according to the actual application scenario; that is, this application does not limit the specific value of the preset threshold.

[0082] Of course, in practical applications, when the similarity of the specification information in any two BOM files is less than a preset threshold, the BOM files will not be merged, and the existing PCB assembly equipment will still be used for manufacturing.

[0083] In some embodiments, the first generation module further includes a second merging submodule, configured to merge multiple BOM files, multiple PNP files corresponding to the BOM files, and multiple Gerber files corresponding to the BOM files to obtain a target group when the similarity of specification information between any two of the multiple BOM files is greater than a preset threshold. The above apparatus allows for the merging of multiple BOM files with similar specification information, expanding the application scenarios of this application.

[0084] Specifically, for example, if there are five BOM files for inductor types numbered 1, 2, 3, 4, and 5, and the specifications in file 1 are compared with those in files 2, 3, 4, and 5 respectively, the similarity is greater than 75%, indicating that the similarity of the specifications in any two of the above five files is greater than 75%. In this case, the above five BOM files, the corresponding PNP files of the above five BOM files, and the corresponding Gerber files of the above five BOM files should be merged.

[0085] To ensure the accuracy of PCB assembly manufacturing information, in some embodiments, the first generation module further includes a first acquisition submodule and a first output submodule. The first acquisition submodule is used to acquire the PCB assembly manufacturing information based on the PNP file and Gerber file corresponding to the target group. The first output submodule is used to determine whether the PCB assembly manufacturing information is the same as the information in the pre-merged BOM file, pre-merged PNP file, and pre-merged Gerber file. If they are the same, the PCB assembly manufacturing information is output to a file recognizable by the assembly equipment to obtain the target file. This device ensures the accuracy of the PCB assembly manufacturing information and outputs it to guide the assembly equipment in assembly.

[0086] Specifically, since the PCB assembly information is derived from the Bill of Materials (BOM) information, the coordinate information from the PNP file, and the PCB substrate information from the Gerber file within the target group, comparing this PCB assembly information with the original BOM, PNP, and Gerber files can determine the accuracy of the PCB assembly information. After confirming the correctness of the PCB assembly information, since the formats of the BOM, PNP, and Gerber files cannot be directly recognized by the assembly equipment, these unrecognizable files need to be converted to a format that the assembly equipment can recognize, such as a .chv file, thus obtaining the target file. The assembly equipment can then perform the assembly process based on this target file.

[0087] In some embodiments, the second generation module includes a first generation submodule and a second generation submodule. The first generation submodule is used to input the target file into a benchmark program to generate a PCB assembly fabrication program. To guide the fabrication of the PCB assembly and further verify the correctness of the PCB assembly after fabrication, the device further includes a second generation submodule, used to generate a loading operation instruction and a PCB assembly diagram based on the PCB assembly fabrication program. The loading operation instruction includes material information required for PCB assembly fabrication and fabrication information for the PCB assembly. The PCB assembly diagram shows a PCB board and multiple components on the PCB board, with the multiple components distributed according to the fabrication information. Through the device, an automatic PCB assembly fabrication program can be generated, thereby automatically fabricating the PCB assembly, and further guiding the fabrication of the PCB assembly through the loading operation instruction and the PCB assembly diagram.

[0088] Specifically, the surface mount technology (SMT) fabrication equipment is equipped with a baseline program. The target file, which is recognizable by the SMT fabrication equipment, is input into the baseline program, generating the final PCB surface mount fabrication program. Based on this program, the SMT fabrication equipment can automatically fabricate the PCB surface mount components. Furthermore, the material loading instructions generated based on the PCB surface mount fabrication program are provided to staff and the materials department for material preparation. After the PCB surface mount components are fabricated, the PCB surface mount diagram is used for verification to ensure the correctness of the finished PCB surface mount components.

[0089] To ensure the orderly and efficient placement of components required in the PCB surface mount technology (SMT) fabrication process, in some embodiments, the second generation module further includes: a third generation submodule, a first calculation submodule, and a first optimization submodule. The third generation submodule is used to input the target file into a baseline program to generate a preliminary PCB surface mount fabrication program. The first calculation submodule is used to calculate the distance between the mounting coordinates of each component and the zero-point coordinates of the PCB substrate based on the PCB surface mount fabrication information in the target file, obtaining multiple target distances. The magnitudes of these target distances are compared, and the components are ordered according to the ascending order of the target distances to obtain the fabrication sequence. The first optimization submodule is used to optimize the preliminary PCB surface mount fabrication program based on the fabrication sequence to obtain the PCB surface mount fabrication program, where the order in which the components are fabricated is the fabrication sequence. Through this device, components are placed according to the principle of increasing distance from the zero-point coordinates of the PCB substrate, i.e., the target distance, thus avoiding a chaotic fabrication sequence and ensuring an orderly and efficient surface mount fabrication process.

[0090] Specifically, after the target file is input into the benchmark program, the benchmark program contains the PCB placement information from the target file, thus generating a preliminary PCB placement program. During PCB placement, placement is generally performed according to the principle of increasing distance between the placement component's coordinates and the zero-point coordinates of the PCB substrate. Therefore, the preliminary PCB placement program needs to be optimized so that the placement equipment follows this principle of increasing target distance. For example, if the zero-point coordinates of the PCB substrate are (0,0,), and the coordinates of the components required for PCB placement are A(1,3), B(5,2), C(3,4), and D(2,3), then the calculated distances between each component and the zero-point coordinates of the PCB substrate are: component A is approximately 3.16, component B is approximately 5.39, component C is 5, and component D is approximately 3.61. Arranged in ascending order of target distance, these are A, D, C, B. Therefore, the components on the PCB substrate are placed in this order. In practical applications, the manufacturing order can also be arranged according to the size of the components; that is, this application does not limit the specific method of the above manufacturing order.

[0091] To facilitate management between departments, in some embodiments, the above-mentioned device further includes a third generation module and a sending module. The third generation module is used to generate a material issuance table and a work order QR code based on the material loading operation instructions and the aforementioned work order information. The work order QR code includes the component type and work order number, whereby the work order number represents the aforementioned work order information. The sending module is used to send the work order QR code to the management system. Through this device, the material information required for PCB assembly in the material loading operation instructions is checked against the work order information to ensure the accuracy of the material information. A material issuance table is generated for the material issuance department to issue materials, and a work order QR code is generated and sent to the management system for traceability in case of incorrect material issuance, facilitating cooperation and management between departments.

[0092] Specifically, after generating the material loading operation instruction, a material issuance list and a work order QR code are simultaneously generated based on the material information required for PCB surface mount technology (SMT) fabrication contained in the instruction. The material issuance list is then automatically sent to the material issuance department's management system. The department prepares and issues materials according to the issuance list, and simultaneously scans the work order QR code to upload the material issuance information to the management system, creating an issuance record to indicate that the materials required for PCB SMT fabrication have been issued. Errors in material issuance can be traced back through the issuance records in the management system.

[0093] In some embodiments, the apparatus further includes an acquisition module for acquiring work order information, including automatically downloading work order information from an SAP system. The SAP system is used to manage the work order information, and system administrators need to maintain the SAP system in advance to ensure the integrity of the work order information. Through this apparatus, customer work order information can be obtained conveniently and accurately.

[0094] Specifically, enterprises typically have an order management software system. Through this system, they can receive customer order information. Production managers need to check and maintain the work order information in the SAP system daily to ensure its integrity. It should be noted that the above modules can be implemented using software or hardware. For the latter, implementation can be achieved in the following ways, but is not limited to: all modules can reside on the same processor; or, the modules can be located on different processors in any combination.

[0095] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when run.

[0096] In some embodiments, the computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0097] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0098] In some embodiments, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0099] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0100] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0101] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A method for manufacturing PCB components, characterized in that, include: Obtain work order information, wherein the work order information includes BOM file, PNP file and Gerber file, the BOM file corresponds one-to-one with the PNP file and the Gerber file, the content of the BOM file includes at least the specification information of multiple components corresponding to one type of component required in the PCB surface mount manufacturing process, the specification information includes at least the component model and performance parameters, the PNP file includes at least the component mounting information, and the Gerber file includes at least the PCB substrate information; The specification information in any two BOM files is compared. At least two BOM files whose specification information similarity is greater than a preset threshold are merged, the corresponding PNP files of the BOM files are merged, and the corresponding Gerber files of the BOM files are merged to obtain a target group. Based on the target group, a target file is generated. The target group includes at least one merged BOM file, a corresponding PNP file of the merged BOM file, and a corresponding Gerber file of the merged BOM file. The content of the target file includes PCB surface mount manufacturing information. The manufacturing information includes at least the component type, the PCB substrate information, and the component mounting information. The PCB substrate information includes at least the zero-point coordinates and thickness of the PCB substrate. The component mounting information includes at least the component mounting coordinates and the component mounting angle. Based on the target file and the benchmark program, a PCB assembly fabrication program is generated, wherein the benchmark program is the program corresponding to all steps of the PCB assembly fabrication, and the PCB assembly fabrication program is used to create the PCB assembly program. Merging at least two BOM files whose specification information similarity is greater than a preset threshold, merging the corresponding PNP files of the BOM files, and merging the corresponding Gerber files of the BOM files to obtain a target group includes: merging at least two BOM files whose specification information similarity is greater than a preset threshold, merging the corresponding PNP files of the BOM files, and merging the corresponding Gerber files of the BOM files, and obtaining the component attribute information corresponding to the specification information in the merged BOM files to obtain the target group. The component attribute information includes at least one of component quality grade, component moisture resistance data, component temperature resistance data, and component reference point. The merged BOM files in the target group correspond one-to-one with the merged PNP files and the merged Gerber files.

2. The manufacturing method according to claim 1, characterized in that, Merging at least two BOM files whose similarity to the specification information is greater than a preset threshold, merging the PNP files corresponding to the BOM files, and merging the Gerber files corresponding to the BOM files to obtain a target group, further includes: If the similarity of the specification information between any two BOM files is greater than a preset threshold, the multiple BOM files, the multiple PNP files corresponding to the BOM files, and the multiple Gerber files corresponding to the BOM files are merged to obtain the target group.

3. The manufacturing method according to claim 1, characterized in that, Based on the target group, generate target files, including: Based on the PNP file and Gerber file corresponding to the target group, obtain the PCB patch manufacturing information; Determine whether the PCB patch manufacturing information is the same as the information in the BOM file, PNP file, and Gerber file before merging. If they are the same, output the PCB patch manufacturing information to a file that the patch manufacturing equipment can recognize to obtain the target file.

4. The manufacturing method according to claim 1, characterized in that, Based on the target file and the benchmark program, a PCB assembly program is generated, including: inputting the target file into the benchmark program to generate the PCB assembly program; After generating a PCB assembly fabrication program based on the target file and benchmark program, the method further includes: generating a loading operation instruction and a PCB assembly diagram based on the PCB assembly fabrication program, wherein the loading operation instruction includes material information required for PCB assembly fabrication and fabrication information of the PCB assembly, and the PCB assembly diagram shows a PCB board and multiple components on the PCB board, wherein the multiple components are distributed according to the fabrication information.

5. The patch fabrication method according to claim 4, characterized in that, The target file is input into the benchmark program to generate a PCB assembly program, including: The target file is input into the benchmark program to generate a preliminary PCB assembly program. Based on the PCB surface mount fabrication information in the target file, the distance between the mounting coordinates of each component and the zero-point coordinates of the PCB substrate is calculated to obtain multiple target distances. The magnitudes of the multiple target distances are compared, and the components are sorted according to the order of the target distances from smallest to largest to obtain the fabrication order. The pre-PCB assembly process is optimized according to the manufacturing sequence to obtain the PCB assembly process, wherein the order in which multiple components are manufactured in the PCB assembly process is the manufacturing sequence.

6. The patch fabrication method according to claim 5, characterized in that, Also includes: Based on the material loading operation instructions and the work order information, a material issuance sheet and a work order QR code are generated. The work order QR code contains the component type and the work order number, wherein the work order number represents the work order information. Send the work order QR code to the management system.

7. The patch manufacturing method according to any one of claims 1 to 6, characterized in that, Obtain work order information, including: Work order information is automatically downloaded from the SAP system, which is used to manage the work order information. System administrators need to maintain the SAP system in advance to ensure the integrity of the work order information.

8. A PCB surface mount fabrication apparatus, characterized in that, include: The acquisition module is used to acquire work order information, wherein the work order information includes a BOM file, a PNP file, and a Gerber file. The BOM file corresponds one-to-one with the PNP file and the Gerber file. The content of the BOM file includes at least the specification information of multiple components corresponding to one type of component required in the PCB surface mount manufacturing process. The specification information includes at least the component model and performance parameters. The PNP file includes at least the component mounting information. The Gerber file includes at least the PCB substrate information. The first generation module is used to compare the specification information in any two BOM files, merge at least two BOM files whose specification information similarity is greater than a preset threshold, merge the PNP files corresponding to the BOM files, and merge the Gerber files corresponding to the BOM files to obtain a target group, and generate a target file based on the target group. The target group includes at least one merged BOM file, one PNP file corresponding to the merged BOM file, and one Gerber file corresponding to the merged BOM file. The content of the target file includes PCB surface mount manufacturing information. The manufacturing information includes at least the component type, the PCB substrate information, and the component mounting information. The PCB substrate information includes at least the zero-point coordinates and thickness of the PCB substrate, and the component mounting information includes at least the component mounting coordinates and the component mounting angle. The second generation module is used to generate a PCB assembly program based on the target file and the benchmark program, wherein the benchmark program is the program corresponding to all steps of the PCB assembly process, and the PCB assembly program is used to generate the PCB assembly program. The first generation module includes: a first merging submodule, used to merge at least two BOM files whose similarity to the specification information is greater than a preset threshold, merge the PNP files corresponding to the BOM files, and merge the Gerber files corresponding to the BOM files, and obtain the component attribute information corresponding to the specification information in the merged BOM files to obtain a target group, wherein the component attribute information includes at least one of component quality grade, component moisture resistance data, component temperature resistance data, and component reference point, and the merged BOM files in the target group correspond one-to-one with the merged PNP files and the merged Gerber files.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the method described in any one of claims 1 to 7.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method described in any one of claims 1 to 7.

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