Magnetic position sensor devices, methods, and systems with error detection

Abstract

This invention describes a magnetic position sensor device, method, and system with error detection. The position sensor device includes two or more magnetic sensors (S1, S2) and processing circuitry. The two or more magnetic sensors (S1, S2) are capable of measuring one, two, or three orthogonal magnetic field components (Bx, By, Bz) at different sensor positions. The processing circuitry is used to determine a first difference, a second difference, and a third difference (ΔBx12, ΔBz12, ΔBy12) between two corresponding components, and to determine a first ratio (R1) between the first difference and the second difference (ΔBx12, ΔBz12), and to determine and output a first angle (θ) based on this first ratio (R1). 主要 ); and a second ratio (R2) for determining the first difference and the third difference (ΔBx12, ΔBy12), for optionally determining the second angle (θ). 辅助 ), optionally compare two angles or two ratios; and output at least one of the following: a second angle, two ratios, and a diagnostic signal based on the comparison of angles or ratios.

Description

Technical Field

[0001] This invention relates generally to the field of magnetic position sensor systems, devices, and methods, and more specifically to linear magnetic position and angular magnetic position sensor systems and devices with error detection capabilities, and methods for determining linear or angular positions and detecting whether an error has occurred. Background Technology

[0002] Magnetic sensor systems, particularly linear or angular position sensor systems, are known in the art. They offer the advantage of measuring linear or angular position without physical contact, thus avoiding problems such as mechanical wear, scratches, and friction.

[0003] There are many variations of position sensor systems that address one or more of the following requirements: use of simple or inexpensive magnetic structures, use of simple or inexpensive sensor devices, ability to measure over a relatively large range, ability to measure with high accuracy, requiring only simple arithmetic, ability to measure at high speed, high robustness to installation errors, high robustness to external interference fields, provision of redundancy, ability to detect errors, ability to detect and correct errors, and good signal-to-noise ratio (SNR), etc.

[0004] Often, two or more of these requirements conflict with each other, thus requiring a trade-off.

[0005] EP3783316(A1) discloses a magnetic position sensor system comprising a magnet or magnetic structure and a sensor device movably mounted relative to said magnet or magnetic structure. However, the system described in this document does not have error detection capability.

[0006] There is always room for improvement or replacement. Summary of the Invention

[0007] The purpose of embodiments of the present invention is to provide a magnetic position sensor system capable of determining the position of a sensor device relative to a magnet or magnetic structure and capable of detecting errors (e.g., errors associated with defective sensors or transducers).

[0008] The purpose of embodiments of the present invention is also to provide sensor devices specifically suited for such systems.

[0009] The purpose of embodiments of the present invention is also to provide a method for determining the position of a sensor device relative to a magnet or magnetic structure, and to provide additional information indicating errors, and / or to allow another processor connected to the sensor device to detect errors.

[0010] The purpose of embodiments of the present invention is to provide systems, devices and methods in which position is determined in a manner highly insensitive to external interference fields (also known as "spurious fields"), and where error detection is also highly insensitive to external interference fields.

[0011] The purpose of embodiments of the present invention is to provide a sensor device that takes the form of an integrated circuit with a silicon substrate having a reduced area (i.e., a smaller size of the silicon chip) without compromising the accuracy of the measured position.

[0012] The purpose of certain embodiments of the present invention is to provide such sensor devices as integrated circuits having a silicon substrate with a reduced number of sensor elements.

[0013] These and other objectives are achieved through embodiments of the present invention.

[0014] According to a first aspect, the present invention provides a position sensor device, comprising: a substrate including a first magnetic sensor and a second magnetic sensor (e.g., S1, S2) spaced apart in a first direction (e.g., X), each magnetic sensor being capable of measuring three orthogonal magnetic field components (e.g., Bx, By, Bz), including a first magnetic field component (e.g., Bx) oriented in the first direction (e.g., X), a second magnetic field component (e.g., Bz) oriented in a second direction (e.g., Z) perpendicular to the first direction, and a third magnetic field component (e.g., By) oriented in a third direction (e.g., Y) perpendicular to both the first and second directions; and a processing circuit connected to the first and second magnetic sensors and configured to: a) measure the first magnetic field component (e.g., Bx) oriented in the first direction (e.g., X) by each of the first and second sensors (e.g., S1, S2). 1) Bx1, Bx2), and a second magnetic field component oriented in a second direction (e.g., Z), and a third magnetic field component oriented in a third direction (e.g., Y) (e.g., By1, By2); b) determining (e.g., calculating) a first difference (e.g., ΔBx12) between the first magnetic field components (e.g., Bx1, Bx2), a second difference (e.g., ΔBz12) between the second magnetic field components (e.g., Bz1, Bz2), and a third difference (e.g., ΔBy12; ΔBc12) between the third magnetic field components (e.g., By1, By2 or, for example, Bc1, Bc2); c) (e.g., determining a first ratio (e.g., R1) of the first difference (e.g., ΔBx12) to the second difference (e.g., ΔBz12) according to the formula R1 = ΔBx12 / ΔBz12), and determining a first angle (e.g., θ) based on the first ratio (e.g., R1). 主要 ), and output the first angle (e.g., θ) 主要d) Determine a second ratio (e.g., R2) of the first difference (e.g., ΔBx12) to the third difference (ΔBy12, ΔBc12), or determine a second ratio (e.g., R2) of the linear combination (in the denominator) of the first difference (ΔBx12) (in the numerator) to the third difference (e.g., ΔBy12) and the second difference (e.g., ΔBz12); e) Optionally determine a second angle (e.g., θ) based on the second ratio (e.g., R2). 辅助 ); optionally, the first angle (e.g., θ) 主要 ) and the second angle (e.g., θ) 辅助 The first ratio (e.g., R1) is compared with the second ratio (e.g., R2) to produce a second result; and at least one of the following is output: a second angle (e.g., θ) 辅助 (e.g., R1, R2), first ratio and second ratio, diagnostic signals based on the first result and / or the second result.

[0015] The main advantage of this embodiment is that both the first angle (also referred to herein as the "primary angle") and the second angle (also referred to herein as the "auxiliary angle") are calculated based on difference signals (or gradients), because these difference signals are highly robust to external magnetic interference fields. The same applies to the first and second ratios themselves.

[0016] The main advantage of this embodiment is that the first angle is calculated based on the ratio of the two difference signals (or gradients), because this ratio is highly robust to temperature changes, demagnetization effects, and the distance between the magnet and the sensor device.

[0017] The main advantage of this embodiment is that it provides the ability to detect errors without doubling the number of magnetic sensor elements, and therefore without doubling the footprint occupied by these sensor elements.

[0018] The main advantage of embodiments in which the sensor includes an integrated magnetic concentrator is that the space occupied by the IMC does not double, but only increases by 50%, because doubling the space could negatively impact the method of manufacturing such equipment, specifically the time required for electroplating and / or the yield.

[0019] The linear combination of step d) can be calculated using the following formula: (a*ΔBz12-b*ΔBy12), where a and b are constants, and b is not zero. For example, the second ratio could be R2 = ΔBx12 / ΔBy12, or R2 = ΔBx12 / (ΔBz12-ΔBy12), or R2 = ΔBx12 / (a*ΔBz12-b*ΔBy12).

[0020] Each of the first and second sensors is a "3D magnetic pixel".

[0021] In one embodiment, the second magnetic field component is oriented parallel to the substrate, and the third magnetic field component is oriented perpendicular to the substrate.

[0022] In another embodiment, the third magnetic field component is oriented parallel to the substrate, and the second magnetic field component is oriented perpendicular to the substrate.

[0023] In an embodiment, step d) includes: determining a second ratio (e.g., R2) between the first difference (e.g., ΔBx12) and the third difference (e.g., ΔBy12); and step e) includes: determining a second angle (e.g., θ) based on the second ratio (e.g., R2). 辅助 ); and output at least one of the following: the second angle (e.g., θ) 辅助 Based on a first angle (e.g., θ) 主要 ) and the second angle (e.g., θ) 辅助 The diagnostic signals compared to those of )

[0024] In this embodiment, the sensor device calculates two angles, compares them (internally), and outputs a diagnostic signal indicating an error based on the angle comparison.

[0025] In an embodiment, step d) includes: determining a second ratio (e.g., R2) between a first difference (e.g., ΔBx12) and a third difference (e.g., ΔBy12); and step e) includes: outputting at least one of the following: the first ratio and the second ratio (e.g., R1, R2), and a diagnostic signal based on the comparison of the first ratio (e.g., R1) and the second ratio (e.g., R2).

[0026] In an embodiment, step d) includes: determining a second ratio (e.g., R2) of a linear combination of a first difference (e.g., ΔBx12) in the numerator and a third difference (e.g., ΔBy12) and a second difference (e.g., ΔBz12) in the denominator; and step e) includes: determining a second angle (e.g., θ) based on the second ratio (e.g., R2). 辅助 ); and output at least one of the following: the second angle (e.g., θ) 辅助 Based on a first angle (e.g., θ) 主要 ) and the second angle (e.g., θ) 辅助 The diagnostic signals compared to those of )

[0027] In an embodiment, step d) includes: determining a second ratio (e.g., R2) of a linear combination of a first difference (e.g., ΔBx12) in the numerator and a third difference (e.g., ΔBy12) and a second difference (e.g., ΔBz12) in the denominator; and step e) includes: outputting at least one of the following: the first ratio and the second ratio (e.g., R1, R2), and a diagnostic signal based on a comparison of the first ratio (e.g., R1) and the second ratio (e.g., R2).

[0028] In this embodiment, the position sensor device includes only two magnetic sensors.

[0029] The advantage of this embodiment is that it requires only two sensor locations, thus requiring less substrate area (e.g., silicon area) compared to sensor devices that include three or more sensors spaced apart in the X direction. In other words, the advantage of this embodiment is that the distance between the two sensors (for a given silicon area) can be greater than the distance between sensors in existing sensors with more than two sensor locations, thus the differential signal (or gradient) typically has a larger amplitude and / or a higher signal-to-noise ratio.

[0030] According to a second aspect, the present invention also provides a position sensor device, comprising: a substrate, including a plurality of magnetic sensors among at least three or at least four magnetic sensors spaced apart in a first direction (e.g., X), each magnetic sensor (e.g., S1, S2, S3) capable of measuring at least two orthogonal magnetic field components, including a first magnetic field component (e.g., Bx) oriented in the first direction (e.g., X), a second magnetic field component (e.g., Bz) oriented in a second direction (e.g., Z) perpendicular to the first direction and perpendicular to the substrate, and a third magnetic field component (e.g., Y) oriented in a third direction (e.g., Y) perpendicular to the first direction and parallel to the substrate, and both of these components; and a processing circuit connected to the at least three magnetic sensors and configured to: a) measure, via a first pair of the sensors (e.g., S1, S2), the first magnetic field component (e.g., Bx1, Bx2) oriented in the first direction (e.g., X) and the third magnetic field component (e.g., By) oriented in a second direction (e.g., Z) perpendicular to the first direction and perpendicular to the substrate, and a third magnetic field component (e.g., By) oriented in a third direction (e.g., Y) perpendicular to the first direction and parallel ... For example, (a) the second magnetic field component oriented in the first direction (e.g., Bz1, Bz2); (b) the first magnetic field component oriented in the first direction (e.g., X) and the third magnetic field component oriented in the third direction (e.g., Y) (e.g., By3, By2) are measured by a second pair of sensors (e.g., S3, S2); (c) the first difference (e.g., ΔBx12) between the first magnetic field components (e.g., Bx1, Bx2) of the first pair and the second difference (e.g., ΔBz12) between the second magnetic field components (e.g., Bz1, Bz2) of the first pair are determined (e.g., calculated); (d) the first ratio (e.g., R1) of the first difference (e.g., ΔBx12) and the second difference (e.g., ΔBz12) (in the first numerator) and the second difference (e.g., ΔBz12) (in the first denominator) is determined (e.g., R1) according to the formula R1 = ΔBx12 / ΔBz12, and the first angle (e.g., θ) is determined based on the first ratio (e.g., R1). 主要 ), and output the first angle (e.g., θ) 主要 e) Determine (e.g., calculate) the third difference (e.g., ΔBx32) between the first magnetic field components (e.g., Bx3, Bx2) of the second pair, and the fourth difference (e.g., ΔBy32) between the third magnetic field components (e.g., By3, By2) of the second pair; f) Determine the second ratio (e.g., R2) between the third difference (e.g., ΔBx32) and the fourth difference (ΔBy32); g) Optionally determine the second angle (e.g., θ) based on the second ratio (e.g., R2). 辅助 ), optionally, the first angle (e.g., θ) 主要 ) and the second angle (e.g., θ) 辅助 The first ratio (e.g., R1) is compared with the second ratio (e.g., R2) to produce a second result; and at least one of the following is output: a second angle (e.g., θ)辅助 (e.g., R1, R2), first ratio and second ratio, diagnostic signals based on the first result and / or the second result.

[0031] The main advantage of this embodiment is that both the first angle (also referred to herein as the "primary angle") and the second angle (also referred to herein as the "auxiliary angle") are calculated based on difference signals (or gradients), because these difference signals are highly robust to external magnetic interference fields. The same applies to the first and second ratios themselves.

[0032] The main advantage of this embodiment is that the first angle is calculated based on the ratio of the two difference signals (or gradients), because this ratio is highly robust to temperature changes, demagnetization effects, and the distance between the magnet and the sensor device.

[0033] The main advantage of this embodiment is that it provides the ability to detect errors without doubling the number of magnetic sensor elements, and therefore without doubling the space occupied by these sensor elements.

[0034] The main advantage of embodiments in which the sensor includes an integrated magnetic concentrator is that the space occupied by the IMC does not double, but only increases by 50%, because doubling the space could negatively impact the method of producing such equipment, specifically the time required for electroplating and / or the yield.

[0035] In this embodiment, not every sensor needs to be a "3D magnetic pixel". For example, in an embodiment with only three magnetic sensors, one sensor may be a 2D magnetic pixel sensitive in the X and Z directions, another sensor may be a 2D magnetic pixel sensitive in the X and Y directions, and the third sensor may be a 3D magnetic pixel sensitive in the X, Y, and Z directions. As another example, in an embodiment with only four magnetic sensors, two of the sensors (e.g., the two outer sensors) may be 2D magnetic pixels sensitive in the X and Z directions, and two of the sensors (e.g., the two inner sensors) may be 2D magnetic pixels sensitive in the X and Y directions.

[0036] In the embodiments of the first and second aspects, the first angle can be calculated according to the following formula: θ 主要 =atan2(ΔBx13,ΔBz13), where θ 主要 The first angle is ΔBx13, which is the first difference, and ΔBz13 is the second difference.

[0037] In this embodiment, the position sensor device includes only three magnetic sensors: the first magnetic sensor, the second magnetic sensor, and the third magnetic sensor (S1, S2, S3).

[0038] The advantage of this embodiment is that it requires only three sensor locations, thus requiring less substrate area (e.g., silicon area) compared to sensor devices that include four sensors spaced apart in the X direction.

[0039] In this embodiment, the at least three sensors are located in a straight line.

[0040] In one embodiment, the at least three sensors are located at the corners of a triangle or trapezoid.

[0041] In an embodiment, the first sensor, the second sensor, and the third sensor are located in a straight line, and the first sensor (e.g., S1) and the second sensor (e.g., S2) are spaced apart by 1.0 mm to 3.0 mm, or 1.25 mm to 2.75 mm, or 1.5 mm to 2.5 mm; and the third sensor (e.g., S3) is positioned between the first sensor (e.g., S1) and the second sensor (e.g., S2).

[0042] The third sensor may be located at a distance of at least 0.3 mm or at least 0.4 mm from the first and second sensors.

[0043] As an example, the first sensor may be located at X1 = 0.0 mm, the third sensor at X2 = 0.4 mm, and the second sensor at X3 = 2.5 mm. Surprisingly, the distance between the locations of the first and second sensors can be as small as 0.3 mm, especially if each of these sensors includes an integrated magnetic concentrator (IMC) with a diameter of approximately 150 to 250 micrometers, which causes the field lines near the IMC to bend.

[0044] In one embodiment, the first, second, or third sensor is located at a corner of a triangle. In a particular embodiment, the triangle has a base and a height perpendicular to the base, and the height-to-base ratio (H / B) is less than 20%. In another embodiment or further embodiment, the base has a length in the range of 1.0 mm to 3.0 mm, or 1.25 mm to 2.75 mm, or 1.5 mm to 2.5 mm; and a height less than 0.5 mm, or less than 0.4 mm, or less than 0.3 mm; and the first and second sensors (S1, S2) are located on the base, while the third sensor is located on the "top".

[0045] In this embodiment, the substrate is a semiconductor substrate. Preferably, the first sensor, the second sensor, and the third sensor are integrated in the semiconductor substrate.

[0046] In the embodiment (of the second aspect), each magnetic sensor is a (hardware-by-hardware) 3D magnetic pixel, but the readout circuitry is configured to read out only some (not all) of the magnetic field components of one or more of the magnetic sensors. This provides the advantage of being able to (re)use existing hardware (e.g., layout). It also provides the advantage that the sensors can be read out faster (at a higher frequency).

[0047] In the embodiment (of the second aspect), each magnetic sensor is a (hardware-by-hardware) 3D magnetic pixel, and the readout circuitry is configured to read out all magnetic field components, but the processing software uses only some (not all) of these components. This provides the advantage of being able to (re)use existing hardware (e.g., layout) and readout schemes while taking advantage of the beneficial effects of the invention.

[0048] In an embodiment, the position sensor device includes only three sensors (e.g., S1, S2, S3), and these sensors are located in a straight line, with one of the sensors (e.g., S3) positioned midway between the other two sensors (e.g., S1, S2).

[0049] The advantage of this embodiment is that it provides the same accuracy (for the principal angle) as a position sensor device with only the first and second sensors and no third sensor in between; however, it additionally provides the benefit of error detection. Specifically, this embodiment allows the three angles to be calculated in a stray field-immune manner, and the principal angle (with high accuracy) should be equal to the average of the two other angles (with slightly lower accuracy due to the reduced distance Δx). However, it should be noted that the invention will still work if the third sensor is not located exactly in the middle between the first and second sensors.

[0050] In an embodiment, one or more of the sensors, or each sensor, includes an integrated magnetic concentrator (IMC) and two (or only two) horizontal Hall elements arranged on opposite sides of the IMC.

[0051] In an embodiment, one or more of the sensors, or each sensor, includes an integrated magnetic concentrator (IMC) and three (or only three) horizontal Hall elements spaced apart at multiples of 90°.

[0052] In an embodiment, one or more of the sensors, or each sensor, includes an integrated magnetic concentrator (IMC) and four (or only four) horizontal Hall elements spaced apart at multiples of 90°.

[0053] In an embodiment, one or more sensors in the sensor include a horizontal Hall element and a single vertical Hall element, or a pair of two vertical Hall elements located on opposite sides of the horizontal Hall element.

[0054] In one embodiment, one or more sensors in the sensor include two vertical Hall elements that have a maximum sensitivity direction perpendicular to each other.

[0055] In an embodiment, each sensor includes an integrated magnetic concentrator (IMC) and four horizontal Hall elements spaced at multiples of 90°. These four horizontal Hall elements consist of a first Hall element and a second Hall element (e.g., H1, H2) spaced apart along a first direction (e.g., X), and a third Hall element and a fourth Hall element (e.g., H3, H4) spaced apart in a direction perpendicular to the first direction (e.g., X) (e.g., Y). The first angle is calculated based on signals obtained from the first Hall element and the second Hall element (e.g., H1, H2). The sensor device is further configured to determine a first sum (e.g., sum1) as the sum of signals obtained from the first Hall element and the second Hall element, and to calculate a second sum (e.g., sum2) as the sum of signals obtained from the third Hall element and the fourth Hall element, and to take into account the matching of the first sum and the second sum when determining a diagnostic signal.

[0056] Or, to put it simply, in this embodiment, a first sum of signals from the Hall element located on the X-axis is compared with a second sum from the Hall element located on the Y-axis, and a mismatch between the first sum and the second sum is considered an indication of error detection.

[0057] According to a third aspect, the present invention also provides a position sensor system comprising: a substrate including a first magnetic sensor (e.g., S1) and a second magnetic sensor (e.g., S2) spaced apart along a first axis (e.g., X) extending in a first direction, wherein each magnetic sensor (e.g., S1, S2) includes an integrated magnetic concentrator (IMC) and only three horizontal Hall elements, the three horizontal Hall elements including a first horizontal Hall element (e.g., H1), a second horizontal Hall element (e.g., H2), and a third horizontal Hall element (e.g., H3; H4), the first horizontal Hall element and the second horizontal Hall element The first and second magnetic sensors (e.g., H1, H2) are located on the first axis, and the third horizontal Hall elements (e.g., H3; H4) are spaced apart at a 90° angle from the first and second horizontal Hall elements; a processing circuit is connected to the first and second magnetic sensors and is configured to: a) measure, via each of the first and second sensors (e.g., S1, S2), a first magnetic field component (e.g., Bx1, Bx2) oriented in a first direction (e.g., X) as a signal obtained from the first and second Hall elements (e.g., H1, H2). The difference between (e.g., h1, h2); and the sum of signals (e.g., h1, h2) obtained from the first Hall element and the second Hall element (e.g., H1, H2) measured by each of the first and second sensors (e.g., S1, S2) in a second direction (e.g., Z) perpendicular to the first direction; and the sum of signals (e.g., h1, h2) obtained from the third Hall element (e.g., H3) measured by each of the first and second sensors (e.g., S1, S2). a) Obtain the signal (e.g., h3); b) Determine (e.g., calculate) a first difference (e.g., ΔBx12) between the first magnetic field components (e.g., Bx1, Bx2), a second difference (e.g., ΔBz12) between the second magnetic field components (e.g., Bz1, Bz2), and a third difference (e.g., ΔBc12) between the third values ​​(e.g., Bc1, Bc2); c) Determine a first ratio (e.g., R1) between the first difference (e.g., ΔBx12) and the second difference (e.g., ΔBz12), and determine a first angle (e.g., θ) based on the first ratio (e.g., R1). 主要 ), and output the first angle (e.g., θ) 主要 d) Determine a second ratio (e.g., R2) between the first difference (e.g., ΔBx12) and the third difference (e.g., ΔBc12); e) Optionally determine a second angle (e.g., θ) based on the second ratio (e.g., R2). 辅助 ), optionally, the first angle (e.g., θ) 主要 ) and the second angle (e.g., θ) 辅助f) compare the first ratio (e.g., R1) with the second ratio (e.g., R2) to produce a second result; f) output at least one of the following: a second angle (e.g., θ) 辅助 (e.g., R1, R2), first ratio and second ratio, diagnostic signals based on the first result and / or the second result.

[0058] According to a fourth aspect, the present invention also provides a magnetic position sensor system, comprising: a magnetic source for generating a magnetic field having at least two poles; and a position sensor device according to a first, second, or third aspect, movable relative to the magnetic source, or vice versa.

[0059] In one embodiment, the magnetic source is a permanent magnet that can rotate about a rotation axis; and the position sensor device is mounted at a non-zero radial distance (e.g., Rs) from the rotation axis and oriented such that a first direction (e.g., X) is tangent to an imaginary circle having a center on the rotation axis.

[0060] Such position sensor systems are often referred to as "angular position sensor systems".

[0061] The magnet may be an axially or diametrically or radially magnetized toroidal or disk-shaped magnets, more specifically, a bipolar toroidal or disk-shaped magnet with axial or radial magnetization, or an axially or radially magnetized toroidal or disk-shaped magnet with more than two poles, such as at least four poles, at least six poles, or at least eight poles.

[0062] The magnet can be an axially magnetized bipolar ring or disk magnet.

[0063] The magnet may be an axially magnetized ring or disk magnet having at least four, six, or eight poles.

[0064] In one embodiment, the substrate of the sensor device is oriented perpendicular to the axis of rotation, and the magnet has an outer diameter (e.g., Ro), and the sensor device is located at a radial position smaller than the outer diameter and at an axial position above the top surface of the magnet or below the bottom surface of the magnet.

[0065] In one embodiment, the substrate of the sensor device is oriented parallel to the axis of rotation, and the magnet has an outer diameter (e.g., Ro), and the sensor device is located at a radial position smaller than the outer diameter and at an axial position above the top surface of the magnet or below the bottom surface of the magnet.

[0066] In one embodiment, the substrate of the sensor device is oriented perpendicular to the axis of rotation, and the magnet has an outer diameter (e.g., Ro), and the sensor device is located at a radial position greater than the outer diameter and at an axial position above the top surface of the magnet or below the bottom surface of the magnet.

[0067] In one embodiment, the substrate of the sensor device is oriented parallel to the axis of rotation, and the magnet has an outer diameter (e.g., Ro), and the sensor device is located at a radial position greater than the outer diameter and at an axial position above the top surface of the magnet or below the bottom surface of the magnet.

[0068] In one embodiment, the substrate of the sensor device is oriented perpendicular to the axis of rotation, and the magnet has an outer diameter (e.g., Ro), and the sensor device is located at a radial position greater than the outer diameter and at an axial position between the bottom and top surfaces.

[0069] In one embodiment, the substrate of the sensor device is oriented parallel to the axis of rotation, and the magnet has an outer diameter (e.g., Ro), and the sensor device is located at a radial position greater than the outer diameter and at an axial position between the bottom and top surfaces.

[0070] In an embodiment, the magnetic source is a bipolar magnet, or an elongated structure extending in the longitudinal direction and including at least two pairs of alternating magnetic poles; and the position sensor device is movable in the longitudinal direction at a non-zero distance from the magnetic source.

[0071] Preferably, the distance is substantially constant. Preferably, the sensor device is oriented such that its first direction (X) is parallel to the longitudinal direction of the magnetic source.

[0072] Such position sensor systems are commonly referred to as "linear position sensor systems". Preferably, in this case, the position sensor device is further configured to convert a first angle θ1 into a first linear position in a manner known in the art.

[0073] Preferably, the magnetic position sensor is located in a virtual plane offset from the plane of symmetry of the magnetic structure in the Y direction. (Reference) Figure 12 The offset in the Y direction is preferably selected such that the amplitude of the By component generated by the magnetic field (as can be measured by the sensor device) is at least 25% of the amplitude of the Bz component of the magnetic field and at least 25% of the amplitude of the Bx component of the magnetic field. The actual offset value depends on the size of the magnetic structure and the distance between the sensor element and the magnetic structure (“air gap”), and can be determined by simulation.

[0074] In this embodiment, the substrate of the sensor device is orthogonally oriented to the orientation of the residual magnetic field within the magnetic source, for example, as... Figure 13B As shown in .

[0075] In an embodiment, the substrate of the sensor device is oriented parallel to the orientation of the residual magnetic field within the magnetic source, for example, as... Figure 13C As shown in .

[0076] In an embodiment, the magnetic position sensor system further includes a second processor (e.g., an ECU) communicatively connected to the position sensor device and configured to perform one of the following: i) receiving a first angle (e.g., θ). 主要 ) ; ii) Receive one or more of the following: second angle (e.g., θ) 辅助 The first ratio (e.g., R1) and the second ratio (e.g., R2) are diagnostic signals indicating errors.

[0077] In this embodiment, the first and second processors can cooperate to detect whether an error has occurred and / or take appropriate action at the system level. The probability of error detection can be further improved by executing certain functions on two different processors.

[0078] The second processor can be configured to compare a first angle with a second angle (if the latter is provided), and / or compare a first ratio with a second ratio (if the ratio is provided).

[0079] According to a fifth aspect, the present invention also provides a method for determining a linear position or angular position based on signals obtained from a first sensor and a second sensor (e.g., S1, S2), the first sensor and the second sensor (e.g., S1, S2) being spaced apart in a first direction (e.g., X), each capable of measuring three orthogonal magnetic field components (e.g., Bx, By, Bz); the method includes the steps of: a) measuring, by each of the first sensor and the second sensor (e.g., S1, S2), a first magnetic field component oriented in the first direction (e.g., X), a second magnetic field component oriented in a second direction (e.g., Z) perpendicular to the first direction (e.g., X), and a third magnetic field component oriented in a second direction (e.g., Z) perpendicular to the first direction (e.g., X), and a third magnetic field component oriented in a second direction (e.g., Z), and a third magnetic field component oriented in a second direction (e.g., Z) perpendicular to the first direction (e.g., X), the first magnetic field component oriented in the first direction (e.g., X), and a third magnetic field component oriented in a second direction (e.g., Z), the second magnetic field component oriented in the second direction (e.g., Z), and a third magnetic field component oriented in the second direction (e.g., Z), the second magnetic field component oriented in the second direction (e.g., Z), the third magnetic field component oriented in the second direction (e.g., Z), and the third magnetic field component oriented in the second direction (e.g., Z), the second magnetic field component oriented in the second direction (e.g., Z), the third magnetic field component oriented in the second direction (e.g., Z), the second magnetic field component oriented in the second direction (e.g., Z), and the third magnetic field component oriented in the second direction (e.g., Z), the second magnetic field component oriented in the second direction (e.g., Z), the third a) oriented a third magnetic field component (e.g., By1, By2) in a third direction (e.g., Y) of the second direction (e.g., X, Z); b) determining (e.g., calculating) a first difference (e.g., ΔBx12) between the first magnetic field components (e.g., Bx1, Bx2), a second difference (e.g., ΔBz12) between the second magnetic field components (e.g., Bz1, Bz2), and a third difference (e.g., ΔBy12) between the third magnetic field components (e.g., By1, By2); c) determining a first ratio (e.g., R1) between the first difference (e.g., ΔBx12) and the second difference (e.g., ΔBz12) (e.g., according to the formula R1 = ΔBx12 / ΔBz12), and determining a first angle (e.g., θ) based on the first ratio (e.g., R1). 主要 ), and output the first angle (e.g., θ) 主要d) Determine a second ratio (e.g., R2) of the first difference (e.g., ΔBx12) and the third difference (e.g., ΔBy12, ΔBc12); or determine a second ratio (e.g., R2) of the linear combination (in the denominator) of the first difference (ΔBx12) (in the numerator) with the third difference (e.g., ΔBy12) and the second difference (e.g., ΔBz12); e) Optionally determine a second angle (e.g., θ) based on the second ratio (e.g., R2). 辅助 ), optionally, the first angle (e.g., θ) 主要 ) and the second angle (e.g., θ) 辅助 The first ratio (e.g., R1) is compared with the second ratio (e.g., R2) to produce a second result; and at least one of the following is output: a second angle (e.g., θ) 辅助 (e.g., R1, R2), first ratio and second ratio, diagnostic signals based on the first result and / or the second result.

[0080] Specific and preferred aspects of the invention are set forth in the appended independent and dependent claims. Features from the dependent claims may be suitably combined with features of the independent claims and other dependent claims, and not merely as expressly set forth in the claims.

[0081] These and other aspects of the invention will become apparent from the embodiments described herein, and are illustrated with reference to these embodiments. Attached Figure Description

[0082] Figure 1 This is a schematic block diagram of a sensor structure that can be used in embodiments of the present invention. The sensor structure includes a first sensor at a first sensor position X1 and a second sensor at a second sensor position X2, spaced apart along the X-axis. Each sensor includes an integrated magnetic concentrator (IMC) and a pair of horizontal Hall elements arranged on opposite sides of the IMC. Each sensor is a 2D magnetic pixel capable of measuring a first magnetic field component Bx oriented in the X-direction and a second magnetic field component Bz perpendicular to the X-axis.

[0083] Figure 2A This is a schematic block diagram of another sensor structure that can be used in embodiments of the present invention.

[0084] Figure 2B This is a schematic block diagram of another sensor structure that can be used in embodiments of the present invention.

[0085] Figure 2C This is a schematic block diagram of another sensor structure that can be used in embodiments of the present invention.

[0086] Figure 3 This is a schematic block diagram of a sensor structure that can be used in embodiments of the present invention. The sensor structure includes two sensors, each having an integrated magnetic concentrator (IMC) and four horizontal Hall elements arranged near the outer periphery of the IMC and spaced apart at multiples of 90°. Each sensor is a 3D magnetic pixel.

[0087] Figure 4 This is a schematic block diagram of another sensor structure that can be used in embodiments of the present invention. The sensor structure includes two sensors, each having a horizontal Hall element and two vertically oriented Hall elements. Each sensor is a 3D magnetic pixel.

[0088] Figure 5 (a) shows an angular position sensor system 500, which includes a cylindrical magnet 501 rotatable about a rotation axis and a sensor device 502 mounted at a radial distance Rs from the rotation axis. The sensor device 502 includes a substrate oriented perpendicular to the rotation axis. A coordinate system having three orthogonal axes X, Y, and Z is connected to the substrate such that X and Y are parallel to the substrate and Z is perpendicular to the substrate, and the X-axis is tangent to a virtual circle having a center located at the rotation axis. Figure 5 (b) shows that it can be obtained from Figure 5 (a) The magnetic field components (Bx, By, Bz) measured by the sensor device are compared with the axial direction (B) of the magnetic field generated by the magnet. 轴向 ), radial (B 径向 ) and tangential (B 切向 How are the magnetic field components related?

[0089] Figure 5 (c) shows an angular position sensor system 550, which includes a cylindrical magnet 551 rotatable about a rotation axis and a sensor device 552 mounted at a radial distance Rs from the rotation axis. The sensor device 552 includes a substrate oriented parallel to the rotation axis. A coordinate system with three orthogonal axes X, Y, and Z is connected to the substrate such that X and Y are parallel to the substrate and Z is perpendicular to the substrate, and the X-axis is tangent to a virtual circle having a center located at the rotation axis. Figure 5 (d) shows that it can be obtained by Figure 5 (c) The magnetic field components (Bx, By, Bz) measured by the sensor device are related to the axis (B) of the magnetic field generated by the magnet. 轴向 ), radial (B 径向 ) and tangential (B 切向 How are the magnetic field components related?

[0090] Figure 6 (a) and Figure 6 (b) An angular position sensor system according to an embodiment of the present invention is shown. The system includes a cylindrical magnet and a magnetic sensor device mounted in an "off-axis position," such as... Figure 5 As shown in (a). Figure 6 (c) to Figure 6 (f) The diagram illustrates the sensor structure and formula, which can be derived from... Figure 6 The sensor device in (a) is used to determine angular position and to detect errors. This sensor device has two magnetic sensors, each of which is a 3D magnetic pixel.

[0091] Figure 7 (a) to Figure 7 (f) illustrates an angular position sensor system according to an embodiment of the present invention, which can be considered as an angular position sensor system. Figure 6 (a) to Figure 6 A variant of (f). The sensor device has two magnetic sensors, each of which is a 3D magnetic pixel.

[0092] Figure 8 (a) to Figure 8 (f) illustrates an angular position sensor system according to an embodiment of the present invention, which can be considered as an angular position sensor system. Figure 7 (a) to Figure 7 A variant of (f) in which each sensor includes an IMC and only three horizontal Hall elements.

[0093] Figure 9 (a) to Figure 9 (f) illustrates an angular position sensor system according to an embodiment of the present invention, which can be considered as an angular position sensor system. Figure 6 (a) to Figure 6 A variant of (f). The system includes a cylindrical magnet and a magnetic sensor device mounted in an "off-axis position," such as... Figure 5 As shown in (a). This sensor device has three magnetic sensors, each of which is a 3D magnetic pixel.

[0094] Figure 10 (a) to Figure 10 (f) illustrates an angular position sensor system according to an embodiment of the present invention, which can be considered as an angular position sensor system. Figure 9 (a) to Figure 9 A variant of (f). The system includes a cylindrical magnet and a magnetic sensor device mounted in an "off-axis position," such as... Figure 5 As illustrated in (a), this sensor device has three magnetic sensors, some of which are 2D magnetic pixels and some are 3D magnetic pixels.

[0095] Figure 11(a) to Figure 11 (d) illustrates an angular position sensor system according to an embodiment of the present invention, which can be considered as an angular position sensor system. Figure 6 (a) to Figure 6 A variant of (d). The system includes a cylindrical magnet and a magnetic sensor device. The sensor device has four magnetic sensors, some of which are 2D magnetic pixels, and some of which are 3D magnetic pixels but are used as 2D magnetic pixels.

[0096] Figure 12 (a) illustrates a linear position sensor system comprising an elongated magnetic structure having multiple alternating magnetic poles and a magnetic sensor device including a substrate movable relative to the magnetic structure. The sensor device has a substrate perpendicular to a residual magnetic field within the magnetic structure. The sensor device is not positioned in the plane of symmetry of the magnetic structure, but rather offset in the Y direction.

[0097] Figure 12 (b) to Figure 12 (f) The sensor structure shown in the figure can be derived from... Figure 12 (a) The sensor device is used to determine the linear position and to detect errors.

[0098] Figures 13A to 13C Illustration Figure 12 (a) to Figure 12 (f) is a variant of the linear position sensor system, in which the magnet is a bipolar magnet.

[0099] Figure 14 This invention is proposed and can be made by Figure 6 (a) or Figure 7 (a) or Figure 8 (a) or Figure 9 (a) or Figure 12 (a) is a flowchart of a method performed by a sensor device. Variations of this method may be derived from... Figure 10 (a) and Figure 11 (a) Sensor device applications.

[0100] Figure 15 An electrical block diagram of a circuit that can be used in the position sensor device described above is shown.

[0101] These figures are illustrative and not restrictive. In the figures, some elements may be enlarged and not drawn to scale for illustrative purposes. No reference numerals in the claims should be construed as limiting. In different figures, the same reference numerals refer to the same or similar elements. Detailed Implementation

[0102] The invention will be described with reference to specific embodiments and particular drawings, but the invention is not limited thereto but is defined only by the claims.

[0103] The terms "first," "second," etc., used in the specification and claims are used to distinguish between similar elements and are not necessarily used to describe a temporal, spatial, hierarchical, or any other order. It should be understood that such terms are interchangeable where appropriate, and embodiments of the invention described herein can be operated in other orders than those described or illustrated herein.

[0104] The terms "top," "below," etc., used in the specification and claims are for descriptive purposes and are not necessarily used to describe relative positions. It should be understood that such terms are interchangeable where appropriate, and the embodiments of the invention described herein can operate in other orientations than those described or illustrated herein.

[0105] It should be noted that the term "comprising" as used in the claims should not be construed as limiting oneself to the means listed thereafter; it does not exclude other elements or steps. Therefore, the term should be interpreted as specifying the presence of the features, integers, steps, or components stated as mentioned, but does not exclude the presence or addition of one or more other features, integers, steps, or components, or groups thereof. Thus, the scope of the expression "device comprising means A and B" should not be limited to a device consisting solely of components A and B. It means that for the purposes of this invention, the only relevant components of the device are A and B.

[0106] Throughout this specification, the reference to "an embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. Therefore, the phrases "in an embodiment" or "in an embodiment" appearing in various places throughout this specification do not necessarily refer to the same embodiment, although they may refer to the same embodiment. Furthermore, in one or more embodiments, as will be obvious to those skilled in the art from this disclosure, particular features, structures, or characteristics can be combined in any suitable manner.

[0107] Similarly, it should be understood that in the description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, drawing, or description for the purpose of streamlining the disclosure and aiding in the understanding of one or more inventive aspects. However, this approach to the disclosure should not be construed as reflecting an intention to claim more features than are expressly recited in each claim. Rather, as reflected in the appended claims, inventive aspects exist in fewer features than all the features of a single foregoing disclosed embodiment. Therefore, the claims appended to the Specific Embodiments are thus explicitly incorporated into this Specific Embodiments, wherein each claim itself represents a separate embodiment of the invention.

[0108] Furthermore, although some embodiments described herein include some features included in other embodiments but not in other embodiments, combinations of features from different embodiments are intended to fall within the scope of the invention and form different embodiments as will be understood by those skilled in the art. For example, any embodiment of the claimed embodiments in the appended claims may be used in any combination.

[0109] Numerous specific details are set forth in the description provided herein. However, it should be understood that embodiments of the invention may be practiced without these specific details. In other instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this description.

[0110] In this document, unless otherwise expressly stated, the term "magnetic sensor device" or "sensor device" refers to a device comprising at least one "magnetic sensor" or at least one "magnetic sensor element," which is preferably integrated in a semiconductor substrate. The sensor device may be included in a package (also referred to as a "chip"), although this is not strictly necessary. The sensor device preferably comprises a semiconductor substrate.

[0111] In this document, the terms “sensor element” or “magnetic sensor element” or “magnetic sensor” can refer to a component or group of components or subcircuit or structure capable of measuring magnetic quantities, such as, for example, a magnetoresistive (MR) element, a GMR element, an XMR element, a horizontal Hall plate, a vertical Hall plate, a Wheatstone bridge containing at least one (but preferably four) magnetoresistive elements, or combinations thereof.

[0112] In some embodiments of the present invention, the term "magnetic sensor" or "magnetic sensor structure" may refer to an arrangement comprising one or more integrated magnetic concentrators (IMCs) (also called integrated flux concentrators) and one or more horizontal Hall elements arranged near the periphery of the IMC, for example, a disk-shaped IMC having two horizontal Hall elements spaced 180° apart from each other (e.g., such as...). Figure 1 (as shown), or an IMC with four horizontal Hall elements spaced 90° apart (e.g., as shown). Figure 3 ).

[0113] In this document, the terms "in-plane component of the magnetic field vector" and "projection of the magnetic field vector onto the sensor plane" have the same meaning. If the sensor device is or includes a substrate, this also means "the magnetic field component is parallel to the substrate".

[0114] In this document, the terms "out-of-plane component of a vector", "Z-component of a vector", and "projection of a vector onto an axis perpendicular to the sensor plane" have the same meaning.

[0115] Embodiments of the present invention are typically described using an orthogonal coordinate system fixed to the sensor device and having three axes X, Y, and Z, wherein the X and Y axes are parallel to the substrate, and the Z axis is perpendicular to the substrate. Furthermore, in the case of a linear position sensor, the X axis is preferably oriented "parallel to the direction of relative movement," or in the case of a curved movement trajectory, it is preferably oriented "tangential to the movement trajectory," or in the case of an angular position sensor system including a rotatable magnet, it is preferably oriented "circumferentially" (i.e., tangential to an imaginary circle having a center located on the axis of rotation). In the case of an angular position sensor system, one of the other axes (Y or Z) is preferably oriented parallel to the axis of rotation of the magnet.

[0116] In this document, the terms "spatial derivative," "derivative," "spatial gradient," or "gradient" are used as synonyms. In the context of this invention, the gradient is generally defined as the difference between two values ​​measured at two locations spaced apart in the X-direction. Theoretically, the gradient is calculated as the difference between two values ​​divided by the distance "dx" between the sensor locations; however, in practice, the division by "dx" is usually omitted because the measured signal needs to be scaled regardless. Therefore, in the context of this invention, the magnetic field difference (ΔBx) and the magnetic field gradient dBx / dx are used interchangeably.

[0117] In this document, the term “amplitude of magnetic field component By” means “the maximum absolute value of the By signal over the entire 360° (electric) rotation of the magnet”, and the same applies to “amplitude of Bx” and “amplitude of Bz”.

[0118] In this application, horizontal Hall plates are typically represented by H1, H2, etc., and signals from these horizontal Hall plates are typically represented by h1, h2, etc.; vertical Hall plates are typically represented by V1, V2, etc.; and signals from these vertical Hall plates are typically represented by v1, v2, etc.

[0119] In the context of this invention, the formulas arctan(x / y), atan2(x,y), and arccot(y / x) are considered equivalent.

[0120] In this application, the statement "the sensor device is located in an axial position and a radial position" actually means that the center position of the sensor of the device is located in the axial and radial positions.

[0121] In this document, the notation ΔBx12 is used to indicate the difference between the Bx signals obtained from sensors S1 and S2. If only two sensors are present, this can also be written as ΔBx without explicitly referring to sensors S1 and S2. This also applies to other differences, such as ΔBy12 and ΔBz12.

[0122] In this document, the symbol “A≈B” is used to indicate “A is approximately equal to B”, using predefined matching criteria, such as by subtracting the values ​​of A and B and comparing the difference to a predefined appropriate threshold; or by dividing the values ​​of A and B and comparing the ratio to an appropriate range (e.g., 100% ± 5%), but other matching criteria may be used.

[0123] This invention generally relates to linear and angular magnetic position sensor systems, which include sensor devices and magnetic sources, such as permanent magnets, such as annular or disk magnets magnetized axially, diametrically, or radially, such as bipolar annular or disk magnets magnetized axially or diametrically, or annular or disk magnets magnetized axially or radially with more than two poles, such as at least four poles, at least six poles, or at least eight poles. The invention also relates to linear position sensor systems, which include sensor devices and magnetic sources in the form of bipolar magnets or elongated magnetic structures comprising multiple alternating magnetic poles.

[0124] More specifically, the present invention relates to magnetic sensor devices, methods, and systems that are robust to external disturbance fields and have error detection capabilities.

[0125] Please refer to the attached diagram.

[0126] Figure 1A sensor structure is shown, comprising a first sensor S1 located at a first position X1 on the X-axis and a second sensor S2 located at a second position X2 on the X-axis, spaced apart from X1. Each of the first sensor S1 and the second sensor S2 includes a disk-shaped integrated magnetic concentrator (IMC) and two horizontal Hall elements arranged on opposite sides of the IMC on the X-axis. The first sensor S1 includes a first horizontal Hall element H1 configured to provide a first signal h1 and a second horizontal Hall element H2 configured to provide a second signal h2. The second sensor S2 includes a third horizontal Hall element H3 configured to provide a third signal h3 and a fourth horizontal Hall element H4 configured to provide a fourth signal h4.

[0127] To understand this invention, it is sufficient to know that signals h1 and h2 of the first sensor S1 can be combined to determine the in-plane magnetic field component Bx1 (parallel to the sensor substrate) and the out-of-plane magnetic field component Bz1 (perpendicular to the sensor substrate). More specifically, the in-plane magnetic field component Bx1 can be calculated by subtracting the signals, and the out-of-plane magnetic field component Bz1 can be calculated by summing the signals. This can be expressed mathematically as follows:

[0128] Bx1=(h2-h1)[1]

[0129] Bz1=(h2+h1)[2]

[0130] Similarly, the in-plane magnetic field component Bx2 and the out-of-plane magnetic field component Bz2 at the second sensor position X2 can be determined, for example, according to the following formula:

[0131] Bx2=(h4-h3)[3]

[0132] Bz2=(h4+h3)[4]

[0133] Furthermore, from these values, the in-plane magnetic field gradient ΔBx and the out-of-plane magnetic field gradient ΔBz can be determined, for example, according to the following formula:

[0134] ΔBx=Bx2-Bx1[5]

[0135] ΔBz=Bz2-Bz1[6]

[0136] The value ΔBx can also be referred to as dBx / dx, and the value ΔBz can also be referred to as dBz / dx. As mentioned above, the scaling factor "dx" is usually omitted because it is constant, and the value obtained from the sensor element needs to be scaled anyway. For this reason, in this application, the terms "magnetic field gradient" and "magnetic field difference" have the same meaning.

[0137] It is known that the gradient signals ΔBx and ΔBz are highly insensitive to external disturbance fields.

[0138] Figure 2A This is a schematic block diagram of another sensor structure that can be used in embodiments of the present invention, or that is similar in structure to that used in embodiments of the present invention. The sensor structure includes a first sensor at a first sensor position X1 and a second sensor at a second sensor position X2, the first and second sensors being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. The first sensor S1 includes a horizontal Hall element H1 and a vertical Hall element V1, and is capable of measuring two orthogonal magnetic field components Bx1 and Bz1. The second sensor S2 includes a horizontal Hall element H2 and a vertical Hall element V2, and is capable of measuring two orthogonal magnetic field components Bx2 and Bz2. The vertical Hall elements V1 and V2 have axes of maximum sensitivity oriented in the X direction. The horizontal Hall elements H1 and H2 have directions of maximum sensitivity oriented in the Z direction. If the sensor elements are integrated in a semiconductor substrate, the magnetic field components Bx1 and Bx2 are parallel to the substrate, while the magnetic field components Bz1 and Bz2 are perpendicular to the substrate. Two differences or gradients can be derived from these signals, namely ΔBx = Bx2 - Bx1 and ΔBz = Bz2 - Bz1.

[0139] Figure 2B This is a schematic block diagram of another sensor structure that can be used in embodiments of the present invention, or has a structure similar to that used in embodiments of the present invention. The sensor structure includes a first sensor S1 at a first sensor position X1 and a second sensor S2 at a second sensor position X2, the first sensor S1 and the second sensor S2 being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. The first sensor S1 includes a horizontal Hall element H1 and two vertical Hall elements V1, V2, which are located on opposite sides of the horizontal Hall element H1 and have an axis oriented in the X-direction for maximum sensitivity. Similarly, the second sensor S2 includes a horizontal Hall element H2 and two vertical Hall elements V3, V4, which are located on opposite sides of the horizontal Hall element H2 and have an axis oriented in the X-direction for maximum sensitivity. The sum or average of the signals v1 and v2 obtained from the vertical Hall elements V1 and V2 is proportional to the magnetic field component Bx1 at the first sensor position X1. The signal h1 obtained from the horizontal Hall element H1 is proportional to the magnetic field component Bz1 at the position of the first sensor. Similarly, Bx2 = (v3 + v4) and Bz2 = h2. Two differences or gradients can be derived from these signals: ΔBx = Bx2 - Bx1 and ΔBz = Bz2 - Bz1.

[0140] Figure 2C This is a schematic block diagram of another sensor structure that can be used in embodiments of the present invention, or that is similar in structure to that used in embodiments of the present invention. The sensor structure includes a first sensor S1 at a first sensor position X1 and a second sensor S2 at a second sensor position X2, the first sensor S1 and the second sensor S2 being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. The first sensor S1 includes a horizontal Hall element H1 and two vertical Hall elements V1, V2, located on opposite sides of the horizontal Hall element H1 and having an axis oriented in the Y-direction, perpendicular to the X-axis but parallel to the substrate in which the sensor element is implemented, for maximum sensitivity. Similarly, the second sensor S2 includes a horizontal Hall element H2 and two vertical Hall elements V3, V4, located on opposite sides of the horizontal Hall element H2 and having an axis oriented in the Y-direction for maximum sensitivity. Two magnetic field components, By1 and Bz1, can be measured using the first sensor S1, namely By1 = (v1 + v2) and Bz1 = h1. Similarly, By2 = (v3 + v4) and Bz2 = h2. Two differences or gradients can be derived from these signals, namely ΔBy = By2 - By1 and ΔBz = Bz2 - Bz1.

[0141] Figures 1 to 2C Each of the sensors in sensors S1 and S2 is called a “2D magnetic pixel” because they are capable of measuring the values ​​of two orthogonal magnetic field components.

[0142] Figure 3 This is a schematic block diagram of a sensor structure that can be used in embodiments of the present invention, or a structure similar to that used in embodiments of the present invention. The sensor structure includes a first sensor S1 at a first sensor position X1 and a second sensor S2 at a second sensor position X2, the first sensor S1 and the second sensor S2 being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. Each sensor includes an integrated magnetic flux concentrator (IMC) and four horizontal Hall elements located near the outer periphery of the IMC and spaced apart in multiples of 90°. Two of these horizontal Hall elements are located on the X-axis. Each sensor is a 3D magnetic pixel capable of measuring three orthogonal magnetic field components Bx, By, and Bz at the corresponding sensor position. Three differences or gradients can be derived from these signals: Bx = Bx2 - Bx1, ΔBy = By2 - By1, and ΔBz = Bz2 - Bz1.

[0143] Figure 4This is a schematic block diagram of another sensor structure that can be used in embodiments of the present invention, or that is similar in structure to that used in embodiments of the present invention. The sensor structure includes a first sensor at a first sensor position X1 and a second sensor at a second sensor position X2, the first and second sensors being spaced apart along the X-axis by a distance Δx, for example, in the range of 1.0 mm to 3.0 mm, preferably in the range of 1.5 mm to 2.5 mm. Each sensor includes horizontal Hall elements H1, H2 and two vertical Hall elements having axes of maximum sensitivity oriented in the vertical direction, i.e., an axis of maximum sensitivity in the X direction and an axis of maximum sensitivity in the Y direction. Each sensor is a 3D magnetic pixel capable of measuring three orthogonal magnetic field components Bx, By, and Bz. Three differences or gradients can be derived from these signals, namely Bx = Bx2 - Bx1, ΔBy = By2 - By1, and ΔBz = Bz2 - Bz1.

[0144] exist Figure 4 In the variant, each sensor has one horizontal Hall element and two pairs of vertical Hall elements, one pair having the following characteristics: Figure 2B The axes shown are oriented in the X direction for maximum sensitivity, a pair having, as... Figure 2C The axis shown is oriented in the Y direction for maximum sensitivity. Functionally, this variant also features two 3D magnetic pixels and is capable of measuring the same signal, but the signal-to-noise ratio (SNR) of the Bx and By signals is higher than that of the other two. Figure 4 The signal-to-noise ratio of the Bx and By signals is better.

[0145] Figure 5 (a) An angular position sensor system 500 is shown, comprising a cylindrical magnet 501 rotatable about a rotation axis 503, and a sensor device 502 mounted at a radial distance Rs from the rotation axis 503. The magnet 501 may be an axially magnetized, diametrically magnetized, or radially magnetized annular or disk magnet (e.g., a bipolar annular or disk magnet with axial or diametrical magnetization), or an axially or radially magnetized annular or disk magnet having more than two poles (e.g., at least four, at least six, or at least eight poles). The sensor device 502 includes a substrate oriented perpendicular to the rotation axis 503. A coordinate system having three orthogonal axes X, Y, and Z is connected to the substrate of the sensor device such that X and Y are parallel to the substrate, and Z is perpendicular to the substrate, and the X-axis is tangent to a virtual circle centered at the rotation axis 503, and Z is parallel to the rotation axis 503.

[0146] Figure 5 (b) shows that it can be obtained from Figure 5(a) The magnetic field components (Bx, By, Bz) measured by the sensor device and the axial component B of the magnetic field generated by the magnet. 轴向 Radial component B 径向 and tangential component B 切向 How relevant.

[0147] Figure 5 (c) An angular position sensor system 550 is shown, comprising a cylindrical magnet 551 rotatable about a rotation axis 553, and a sensor device 552 mounted at a radial distance Rs from the rotation axis 553. The magnet 551 may be an axially magnetized, diametrically magnetized, or radially magnetized annular or disk magnet, for example, a bipolar annular or disk magnet with more than two poles (e.g., at least four, six, or eight poles). The sensor device 552 includes a substrate oriented parallel to the rotation axis. A coordinate system with three orthogonal axes X, Y, and Z is connected to the substrate of the sensor device, such that X and Y are parallel to the substrate, and Z is perpendicular to the substrate, and the X-axis is tangent to a virtual circle centered at the rotation axis, and Y is parallel to the rotation axis 553.

[0148] Figure 5 (d) shows that it can be obtained by Figure 5 (c) The magnetic field components (Bx, By, Bz) measured by the sensor device and the axial component B of the magnetic field generated by the magnet. 轴向 Radial component B 径向 and tangential component B 切向 How relevant.

[0149] Figure 5 (a) The magnet 501 is a cylindrical magnet having a top surface 511 and a bottom surface 512. The sensor device 502 is mounted at a distance “g” (also referred to as the “air gap”) above the top surface 511 or below the bottom surface 512 of the magnet. The distance “g” can be a value ranging from 0.5 mm to 5.0 mm. The sensor device 502 is mounted at a radial distance “Rs” from the axis of rotation 503 of the magnet. The radial distance Rs is preferably less than the outer diameter Ro plus 20 mm (Rs ≤ Ro + 20 mm). The magnet can have an outer diameter ranging from 4.0 mm to 30 mm and a height ranging from 4 mm to 20 mm, but the invention is not limited thereto.

[0150] In embodiments of the invention, the sensor device is preferably positioned around a magnet, wherein the amplitudes of the three magnetic field components Bx, By, and Bz are "sufficiently high," or the amplitudes of the three magnetic field gradients dBx / dx, dBy / dx, and dBz / dx are "sufficiently high." "Sufficiently high" means that the ratio of one of the amplitudes is at least 10% (or at least 15%, or at least 20%, or at least 25%) of the other two amplitudes.

[0151] For example, if the magnet is axially magnetized and the sensor device 502 is located "above the magnet," components Bx and Bz typically have relatively large amplitudes, while component By typically has relatively small amplitudes. In a preferred embodiment of the invention, the sensor device is preferably located where the amplitude of By is at least 10% (or at least 15%, or at least 20%, or at least 25%) of the amplitude of Bx and at least 10% (or at least 15%, or at least 20%, or at least 25%) of the amplitude of Bz (as the magnet rotates about its axis). For Rs, which is approximately equal to 50% of Ro (in Figure 5 (a) Between “Region 1” and “Region 2”, this condition is usually not met.

[0152] As another example, if the magnet is radially or diametrically magnetized, and the sensor device is oriented perpendicular to the axis of rotation via its substrate and positioned "near the equator," that is, at an axial position essentially midway between the top and bottom surfaces of the magnet, and at a radial position, for example, Rs = Ro + 10 mm, then the amplitudes of signals By and Bx are typically relatively large, but signal B... 轴向 The amplitude is typically relatively low. In a preferred embodiment of the invention, the sensor device is preferably located where the amplitude of Bz is at least 10% (or at least 15%, or at least 20%, or at least 25%) of the amplitude of By and at least 10% (or at least 15%, or at least 20%, or at least 25%) of the amplitude of Bx (as the magnet rotates about its axis). This condition is generally not met near the "equator," but is met at an axial location closer to or above the top surface.

[0153] Although this can be explained using components Bx, By, and Bz that can be measured by sensor device 502, the appropriate location where "the amplitudes of the three magnetic field components Bx, By, and Bz, or the amplitudes of the three magnetic field gradients dBx / dx, dBy / dx, and dBz / dx are sufficiently high" is actually a property of the magnet, not a property of the sensor device. For any given geometry of a disk-shaped or toroidal magnet, such a location can be easily found through computer simulation, but to the inventors' knowledge, there is no analytical formula describing this region.

[0154] For the purpose of describing and understanding the present invention, suitable positions are assumed as follows: Figure 5 (a) The gray "area 1" and gray "area 2" are indicated schematically. It is not necessary to know the exact boundaries of these areas to understand the principles of the invention.

[0155] The same reasoning applies Figure 5 (c) Angle sensor system. Depending on the specific magnet, there will be potential sensor locations where the amplitude of one of the magnetic field components Bx, By, or Bz is less than 10% (or less than 15%, or less than 20%, or less than 25%) of the other two amplitudes, or where the amplitude of one of the magnetic field gradients dBx / dx, dBy / dx, and dBz / dx is less than 10% (or less than 15%, or less than 20%, or less than 25%) of the other two amplitudes, which is undesirable. Similarly, in a preferred embodiment of the invention, the sensor device is preferably located relative to the magnet at a location where the amplitudes of all three magnetic field components or all three magnetic field gradients are "sufficiently large". For the purpose of describing and understanding the invention, suitable locations are assumed to be as follows: Figure 5 (c) The gray “Area 1” and gray “Area 2” are indicated schematically. The exact locations of the first and second areas depend on the size of the magnet, but these locations can be easily found for any particular magnet by those skilled in the art through measurement in a test setup or by performing a computer simulation.

[0156] Another fundamental principle of this invention is that components Bz and By can be either "in phase" (0° phase shift) or "out of phase" (180° phase shift). In both cases, a first angle can be determined from signals Bx and Bz, and a second angle can be determined from signals Bx and By. Errors can be detected by testing the consistency between the first and second angles. To avoid overcomplicating the description, the aforementioned 180° phase shift is not described in further detail, but it can be readily understood by those skilled in the art who benefit from this disclosure.

[0157] Figure 6 (a) and Figure 6 (b) An angular position sensor system 600 is shown in both the front and top views. The angle sensor system 600 includes a cylindrical magnet 601 and a magnetic sensor device 602 mounted in an "off-axis position". The magnet 601 can be a ring magnet or a disk magnet. The sensor device 602 can use, for example, a... Figure 6 (c) The sensor shown or using, for example Figure 6 This is achieved using the sensor shown in (d).

[0158] The magnet is a permanent magnet. It has a cylindrical shape with a bottom surface 612 and a top surface 611. The magnet is rotatable about an axis of rotation 603. The magnet can be radially or diametrically magnetized, or an annular or disk-shaped magnet with at least four pole pairs (also called quadrupoles), at least six pole pairs, or at least eight pole pairs, and is axially magnetized. The magnet has an outer diameter Do, an outer radius Ro, and a height H. If the magnet is an annular magnet, it also has an inner radius Ri.

[0159] Sensor device 602 has a substrate, such as a semiconductor substrate. An orthogonal coordinate system with three axes X, Y, and Z is fixed to the sensor device. Axes X and Y are parallel to the substrate. Axe Z is perpendicular to the substrate. Direction X is tangent to an imaginary circle having a center located on axis of rotation 603.

[0160] The sensor device 602 is mounted in an "off-axis" position relative to the magnet and is oriented such that the substrate is oriented perpendicular to the rotation axis 603 of the magnet.

[0161] The sensor device 602 includes two magnetic sensors: a first sensor S1 and a second sensor S2.

[0162] Sensor device 602 is positioned relative to magnet 601 such that first sensor S1 and second sensor S2 are located at an axial distance “g” from the magnet (in this example: above the top surface 611) and a radial distance “Rs” from the axis of rotation 603. The radial distance Rs is preferably located within the “first region” or “second region” as described above, wherein “the amplitudes of the three magnetic field components Bx, By, Bz or the amplitudes of the three magnetic field gradients dBx / dx, dBy / dx, dBz / dx are sufficiently high”, as explained above.

[0163] Figure 6 (c) and Figure 6 (d) shows two illustrative sensor structures that can be implemented in sensor device 602, but the invention is not limited thereto, and other sensor elements, such as MR (magnetoresistive) elements, can also be used.

[0164] Each magnetic sensor S1 and S2 of the sensor device 602 is capable of measuring three orthogonal magnetic field components: a first magnetic field component Bx oriented in the first direction X, a second magnetic field component Bz oriented in the second direction Z, and a third magnetic field component By.

[0165] exist Figure 6 In (c), the six magnetic field components can be determined as follows:

[0166] Using signals from S1: Bx1 = (h2 - h1); Bz1 = (h2 + h1); By1 = (h3 - h4);

[0167] Using signals from S2: Bx2 = (h4 - h2); Bz2 = (h4 + h2); By2 = (h7 - h8);

[0168] Sensor device 602 further includes processing circuitry that can be configured to perform the following steps:

[0169] b) Determine 1402 (e.g., calculate) the first difference ΔBx12 between the first magnetic field components Bx1 and Bx2 provided by the first sensor S1 and the second sensor S2; and use for

[0170] - Determine the second difference ΔBz12 between the second magnetic field components Bz1 and Bz2 provided by the first sensor S1 and the second sensor S2; and for...

[0171] - Determine the third difference ΔBy12 between the third magnetic field components By1 and By2 provided by the first sensor S1 and the second sensor S2; and for...

[0172] c) (For example, using the formula R1 = ΔBx12 / ΔBz12) determine the first ratio R1 of the first difference ΔBx12 and the second difference ΔBz12 of 1403, and (for example, using the formula: θ) 主要 =atan2(ΔBx12,K1*ΔBz12), where K1 is a predefined constant), and determine the first angle θ based on the first ratio R1. 主要 and output the first angle (θ) 主要 );

[0173] d) (For example, using the formula: R2 = ΔBx12 / ΔBy12) to determine the second ratio R2 of the first difference ΔBx12 and the third difference ΔBy12 of 1404;

[0174] e)(For example, using formula θ 辅助 1 = atan2(ΔBx12, K2*ΔBy12), where K2 is a predefined constant) determines the second angle θ based on the second ratio R2. 辅助 1. Set the first angle θ 主要 With the second angle θ 辅助 1. Compare them to verify whether they match according to predefined matching criteria, and output a diagnostic signal based on the comparison to indicate whether an error has been detected.

[0175] Many variations are possible, for example:

[0176] - The sensor device can optionally output a second angle θ 辅助 1;

[0177] - The sensor device may optionally output a first ratio R1 and a second ratio R2;

[0178] - Instead of calculating the second angle and comparing the first angle with the second angle, the sensor device can compare the first ratio R1 with the second ratio R2 (optionally multiplying each ratio by a predefined constant);

[0179] - The sensor device may not perform the comparison itself, but instead output a first angle and a second angle to allow an external processor (e.g., an ECU, see example) to perform the comparison. Figure 14 Perform the comparison;

[0180] - The sensor device may not perform the comparison itself, but instead output a first ratio R1 and a second ratio R2 to allow an external processor (e.g., an ECU, see example) to perform the comparison. Figure 14 Perform the comparison;

[0181] If the sensor includes an IMC and four horizontal Hall elements, additional tests can be performed to increase the probability of finding errors. In practice, component Bz1 can be calculated as (h1+h2) or (h3+h4), which should (under normal circumstances) provide approximately the same result. Therefore, by testing whether (h1+h2) is approximately equal to (h3+h4), an error associated with one of the Hall elements H1 to H4 can be detected. In this paper, this test is referred to as the "Bz test". A similar test can also be performed on the second sensor S2 by testing whether (h5+h6) is approximately equal to (h7+h8).

[0182] And combinations of these.

[0183] The angle θ can be calculated using the arctangent function of the ratio. 主要 and θ 辅助 1. An angle can also be determined using a lookup table with interpolation.

[0184] Steps (b) to (d) can be summarized as: "Calculate the first angle θ based on ΔBx12 and ΔBz12". 主要 And the second angle θ is calculated based on ΔBx12 and ΔBy12. 辅助 1”. The first angle (also known as the “primary angle”) is the angle to be measured; the second angle (also known as the “auxiliary angle”) can be used to detect errors. Error detection can be performed by the sensor device itself or externally to the sensor device (e.g., in the ECU).

[0185] The values ​​of K1 and K2 can be determined by performing a calibration test and can be stored in the non-volatile memory of the sensor device (see example). Figure 15The value of K1 can be determined as the ratio of the magnitudes of Bx and Bz at the radial position Rs; and the value of K2 can be determined as the ratio of the magnitudes of Bx and By at the radial position Rs. For completeness, note that the use of factors K1 and K2 can be useful, but not absolutely necessary, when comparing the first ratio with the second ratio, for example, in the case of a post-processing step in which the values ​​determined by the arctangent function are adjusted by a piecewise linear approximation.

[0186] In this embodiment, the sensor device may determine and output a diagnostic signal, and optionally also determine and output a second angle θ. 辅助 1. In another embodiment, the sensor device itself does not perform error detection and only outputs a first angle θ. 主要 Second angle θ 辅助 1. Instead of outputting diagnostic signals.

[0187] It is important to note that both ratios (and / or both angles) are calculated based on the magnetic field difference (or gradient), and therefore are highly sensitive to external disturbance fields.

[0188] In a preferred embodiment, the distance “dx” between the two sensors S1 and S2 is a value in the range of 1.0 mm to 3.0 mm, or from 1.5 mm to 2.5 mm, for example, equal to about 2.2 mm.

[0189] So far, the main descriptions have included features such as Figure 6 Embodiments of the sensor device with the sensor structure depicted in (c) are available, but the invention is not limited thereto, and devices with the sensor structure described in (c) may also be used. Figure 6 The sensor device with the sensor structure shown in (d) above. The above concerns sensor devices with the sensor structure shown in (d). Figure 6 Anything mentioned in the embodiment of the sensor structure shown in (c) also applies here, the only difference being that the magnetic field components are measured in a different manner. Figure 6 In (d), the six magnetic field components can be determined as follows:

[0190] Using signals from S1: Bx1 = v1; Bz1 = h1; By1 = v2;

[0191] Using signals from S2: Bx2 = v3; Bz2 = h2; By2 = v4;

[0192] However, the same formula for the difference, as described above, can be used here. For example:

[0193] ΔBx12=Bx2-Bx1;

[0194] ΔBz12=Bz2-Bz1;

[0195] ΔBy12=By2-By1;

[0196] And as described above, for the main angle θ 主要 and for auxiliary angle θ 辅助 The same formula as in 1 can also be applied. Figure 5 (d) Sensor structure.

[0197] exist Figure 6 In a variant of the angle sensor system shown in (a) (not shown), sensor device 602 is oriented such that its substrate is parallel to the axis of rotation of the magnet. As in 6(c) and Figure 6 The same sensor structure shown in (d), and as shown in Figure 6 (e) and Figure 6 The same formula shown in (f) can be used to determine angular position, but the values ​​of K1 and K2 (if used) can be different.

[0198] Figure 7 (a) to Figure 7 (f) shows an angular position sensor system 700, which can be considered as... Figure 6 (a) to Figure 6 (f) A variant of sensor system 600. Angular position sensor system 700 includes a cylindrical magnet 701 and a magnetic sensor device 702 mounted in an "off-axis position". Sensor device 702 can use, for example... Figure 7 (c) The sensor shown or using such Figure 7 This is achieved using the sensor shown in (d).

[0199] Sensor devices 702a and 702b can use the same sensor structure as sensor devices 602a and 602b, but instead of calculating θ, they use a different sensor structure. 辅助 1, or additional to the calculation of θ 辅助 1. The sensor device is configured (or further configured) to calculate the auxiliary angle θ. 辅助2a = atan2(ΔBx12, K3*ΔBc12), where ΔBc12 = (Bc2 - Bc1), and Bc1 = Bz1 - By1, and Bc2 = Bz2 - By2. This is particularly useful when the sensor device is located at position Rs where signals Bz and By are out of phase. The underlying idea of ​​this embodiment is that the value of Bc1 = (Bz1 - By1) is larger (absolute value) and based on the combination of the two measurements, and can have an improved signal-to-noise ratio (SNR) compared to either By1 or Bz1. Similarly, the value Bc2 can have an improved SNR compared to either Bz2 or By2. But more importantly, the SNR of ΔBc12 can be better than the SNR of either ΔBz12 or ΔBy12. When using more accurate signals, the matching comparison can also be more accurate, and therefore the possibility of detecting errors (and / or avoiding false mismatches) can also be improved.

[0200] When the sensor device is located at a radial position Rs where signals Bz and By are "out of phase", the auxiliary angle θ can be calculated using the following formula. 辅助 2b: θ 辅助 2b = atan2(ΔBx12, K4*ΔBd12), where ΔBd12 = (Bd2 - Bd1), and Bd1 = Bz1 + By1, and Bd2 = Bz2 + By2. The main advantage is that the value of Bd1 = (Bz1 + By1) is greater than both By1 and Bz1, and similarly, the value of Bd2 = (Bz2 + By2) is greater than both By2 and Bz2, therefore the value of ΔBd12 can be more accurate than either ΔBz12 or ΔBy12.

[0201] In this embodiment, the sensor device can calculate the principal angle θ. 主要 (based on ΔBx and ΔBz), and auxiliary angle θ 辅助 1 (based on ΔBx and ΔBy), and auxiliary angle θ 辅助 2a (based on ΔBx and ΔBc) and θ 辅助 2b (based on ΔBx and ΔBd) or both. Similarly, it is not actually required to calculate the angle values ​​to detect error; comparing the ratios derived from them is sufficient. Therefore, to detect error, one or more of the following tests can be used: testing whether θ 主要 ≈(θ 辅助2), and / or test whether (K1*ΔBz12)≈(K3*ΔBc12), and / or test whether (K1*ΔBz12)≈(K4*ΔBd12), where K1, K3, and K4 are predefined constants that can be determined through simulation or during calibration and can be stored in non-volatile memory. Alternatively, instead of using the values ​​K1, K3, and K4, a piecewise linear approximation is used to post-process the values ​​provided by the arctangent function.

[0202] exist Figure 7 In a variant of the angle sensor system shown in (a) (not shown), sensor device 702 is oriented such that its substrate is parallel to the axis of rotation of the magnet. As in 7(c) and Figure 7 The same sensor structure shown in (d), and as shown in Figure 7 (e) and Figure 7 The same formula shown in (f) can be used to determine angular position.

[0203] Figure 8 (a) to Figure 8 (d) shows an angle sensor system 800, which can be considered as... Figure 7 (a) to Figure 7 (f) A variant of the angle sensor system 700. The angle sensor system 800 includes a cylindrical magnet 801 and a magnetic sensor device 802 in "off-axis position". The sensor device 802 can use, for example... Figure 8 (c) The sensor shown or using such Figure 8 This is achieved using the sensor shown in (d).

[0204] The main difference is that the sensor in device 802a includes an IMC and only three horizontal Hall elements, instead of... Figure 7 (c) shows the IMC and four horizontal Hall elements. The inventors discovered that it is not actually necessary to measure Bz1 and By1, or to determine Bc1 by subtracting Bz1 and By1 (as shown in the image). Figure 7 (c) is performed, but the value of Bc1 (or a value proportional to it) can actually be measured directly by the horizontal Hall element H4, such as Figure 8 The process described in (c) is as follows. Therefore, sensor element H3 can be omitted. Surprisingly, sensor S1, with only three Hall elements, can provide signals Bx1, Bz1, and Bc1. Similarly, Figure 7 (c) The sensor element H7 can be omitted, and the sensor S2 with only three Hall elements can provide signals Bx2, Bz2 and Bc2. Figure 7 (e) to Figure 7 The same formula (f) can be applied. Therefore, sensor device 802a is able to determine the first angle θ. 主要(based on ΔBx and ΔBz), and auxiliary angle θ 辅助 1 (based on ΔBx and ΔBy), and auxiliary angle θ 辅助 2a (based on ΔBx and ΔBc). Device 802a offers the same advantages mentioned above: measuring the first angle in a highly sensitive manner to external interference fields, and detecting errors in an equally highly sensitive manner to external interference fields, but with the added advantage that device 802a requires only six horizontal Hall elements, thus requiring less bias, less readout, less digitization, and less processing. Sensor device 802a is ideally suited for installation at locations where signals Bz and By are “out of phase.”

[0205] Device 802b is very similar to device 802a and also contains two sensors, each with an IMC and only three horizontal Hall elements. Device 802b can be considered as... Figure 7 (d) A variant of device 702b, wherein sensor elements H4 and H8 are omitted. Sensor device 802a is capable of determining the first angle θ. 主要 (based on ΔBx and ΔBz), and auxiliary angle θ 辅助 1 (based on ΔBx and ΔBy), and auxiliary angle θ 辅助 2b (based on ΔBx and ΔBd). Device 802a can provide the same advantages as described above: measuring the first angle θ in a manner highly sensitive to external disturbance fields. 主要 And it detects errors in the same highly sensitive manner to external interference fields, but offers the added advantage that device 802a requires only six horizontal Hall elements, thus requiring less bias, less readout, less ADC, and less processing. Sensor device 802b is ideally suited for installation where signals Bz and By are “out of phase.”

[0206] exist Figure 8 In a variant of the angle sensor system shown in (a) (not shown), sensor device 802 is oriented such that its substrate is parallel to the axis of rotation of the magnet. As in 8(c) and Figure 8 The same sensor structure shown in (d), and as shown in Figure 8 (e) and Figure 8 The same formula shown in (f) can be used to determine angular position.

[0207] Figure 9 (a) to Figure 9 (f) shows an angular position sensor system 900, which can be considered as... Figure 6 (a) to Figure 6(f) A variant of sensor system 600. System 900 also includes a cylindrical magnet 901 and a magnetic sensor device 902 mounted in an "off-axis position". Sensor device 902 can use, for example... Figure 9 (c) The sensor shown or using such Figure 9 The sensor shown in (d) is used to implement this. The main difference between sensor device 902 and sensor device 602 is that sensor device 902 includes three magnetic sensors S1, S2, and S3, each of which is a 3D magnetic pixel.

[0208] The three sensors can be located in a straight line, but this is not absolutely necessary. The three sensors can be spaced equidistantly, but this is also not absolutely necessary.

[0209] In an alternative embodiment, three sensors are located at the corners of a triangle (not shown). In a particular embodiment, the triangle has a base (B) and a height (H) perpendicular to the base, and the ratio of height to base (H / B) is less than 20%. In another embodiment or further embodiment, the base has a length in the range of 1.0 mm to 3.0 mm, or in the range of 1.25 mm to 2.75 mm, or in the range of 1.5 mm to 2.5 mm; and has a height less than 0.5 mm, or less than 0.4 mm, or less than 0.3 mm; and the first sensor S1 and the second sensor S2 are located on the base, and the third sensor is located on the "top". The triangle can be an isosceles triangle, but this is not absolutely necessary.

[0210] exist Figure 6 (a) to Figure 7 The formula described above, which applies to two sensors in (f), can also be applied to... Figure 9 In device (a), but applied three times: for S1 and S2 (also known as "external sensors"), for S1 and S3, and for S2 and S3. For example Figure 9 As can be seen, this leads to a large number of tests that can be performed to detect errors.

[0211] In this respect, it should be noted that the differential signals ΔBx12 and ΔBz12 are preferably used to calculate the principal angle (which is output), and the differential signals ΔBx12 and ΔBz12 are obtained from the two external sensors S1 and S2 that are furthest apart.

[0212] It should be understood, for example, that the angle (e.g., θ) is derived from the signals obtained from sensors S1 and S3. 辅助 13a or θ 辅助 13b) The angle (e.g., θ) derived from the signals obtained from sensors S2 and S3. 辅助 32a or θ 辅助32b) Slight offset, and will deviate slightly from the principal angle. However, if the three sensors are located in a straight line and equidistant, such that S3 is positioned midway between S1 and S2, then θ 辅助 13a and θ 辅助 The average of 32a usually does not deviate relative to the principal angle.

[0213] In a particular embodiment where three sensors are located in a straight line and the third sensor S3 is positioned midway between the first and second sensors, an auxiliary angle θ, not yet described above, is used. 辅助 4 can be calculated using the following formula:

[0214] θ 辅助 4 = atan2[(ΔBx32-ΔBx13), K10*(ΔBz32-ΔBz13)], and another angle θ 辅助 5 can be calculated using the following formula: θ 辅助 5 = atan2[(ΔBx32-ΔBx13), K11*(ΔBy32-ΔBy13)], where K10 and K11 are predefined constants that can be determined through simulation or calibration, but are not absolutely necessary as described above. These angles θ 辅助 4 and θ 辅助 5. Should be provided with respect to the principal angle θ 主要 Same result, but without offset.

[0215] exist Figure 9 In a variant of the angle sensor system shown in (a) (not shown), sensor device 902 is oriented such that its substrate is parallel to the axis of rotation of the magnet. As in 9(c) and Figure 9 The same sensor structure shown in (d), and as shown in Figure 9 (e) and Figure 9 The same formula shown in (f) can be used to determine angular position.

[0216] Figure 10 (a) to Figure 10 (f) shows an angular position sensor system 1000, which can be considered as... Figure 9 (a) to Figure 9 (f) variant. The angular position sensor system 1000 includes a cylindrical magnet 1001 and a magnetic sensor device 1002 mounted in an "off-axis position". The sensor device 1002 can use, for example... Figure 10 (c) The sensor shown or using such Figure 10The sensor shown in (d) is used to implement this. The main difference between sensor device 1002 and sensor device 902 is that sensor device 1002 has three magnetic sensors, but some of the magnetic sensors are 2D magnetic pixels while others are 3D magnetic pixels.

[0217] In the example shown, the principal angle θ is determined based on the difference signals ΔBx12 and ΔBz12 derived from the signals provided by the first sensor S1 and the second sensor S2. 主要 Furthermore, the auxiliary angle θ is determined based on the difference signals ΔBx23 and ΔBy23 provided by the second sensor S2 and the third sensor S3. 辅助 As mentioned above, it is not actually necessary to calculate the angle to detect the error; it is sufficient to compare the first ratio with the second ratio.

[0218] Figure 10 (c) The sensor device 1002a has one 2D magnetic pixel and two 3D magnetic pixels. Figure 10 (d) The sensor device 1002b has two 2D magnetic pixels and one 3D magnetic pixel.

[0219] exist Figure 10 In a variant of the angle sensor system shown in (a) (not shown), sensor device 1002 is oriented such that its substrate is parallel to the axis of rotation of the magnet. As in 10(c) and Figure 10 The same sensor structure shown in (d), and as shown in Figure 10 (e) and Figure 10 The same formula shown in (f) can be used to determine angular position.

[0220] Figure 11 (a) to Figure 11 (d) shows an angular position sensor system 1100, which can be considered as... Figure 9 (a) to Figure 9 Another variation of the sensor system in (f). The angular position sensor system 1100 includes a cylindrical magnet 1101 and a magnetic sensor device 1102 mounted in an "off-axis position". The sensor device 1102 can use, for example... Figure 11 (c) The sensor shown or using, for example Figure 11 The sensor shown in (d) is used to implement this. The main difference between sensor device 1102 and sensor device 902 is that sensor device 1102 has four magnetic sensors S1 to S4, which can be 2D magnetic pixels or 3D magnetic pixels or a combination thereof. Figure 11 (c) The sensor device 1102a has two 2D magnetic pixels and two 3D magnetic pixels. Figure 11(d) Sensor device 1102b has four 2D magnetic pixels. The same or similar formulas described above, with necessary modifications, also apply here. Device 1102 is capable of determining angular position and detecting errors, or providing signals to allow an external processor to detect errors.

[0221] exist Figure 11 In a variant of the angle sensor system shown in (a) (not shown), sensor device 1102 is oriented such that its substrate is parallel to the axis of rotation of the magnet. Figure 11 (c) and Figure 11 The same sensor structure shown in (d) can be used to determine angular position.

[0222] Figure 12 (a) illustrates a linear sensor system 1200 including an elongated magnetic structure 1201 and a magnetic sensor device 1202. The elongated magnetic structure 1201 includes a plurality of alternating magnetic poles, and the magnetic sensor device 1202 includes a substrate movable relative to the magnetic structure. The sensor device 1202 has a substrate oriented perpendicular to a residual magnetic field within the magnetic structure.

[0223] The sensor device 1102 is preferably positioned at a lateral location (in the Y direction) offset from the center of the magnetic structure. Preferably, the lateral offset is at least 0.5 mm or at least 1.0 mm, but the offset is in the range of 0.5 mm to 5.0 mm, or in the range of 1.0 mm to 4.0 mm.

[0224] exist Figure 6 (a) to Figure 11 The same sensor structure and the same formula described above in (d) can be used. In addition to determining the angular position, the processing circuitry of the linear sensor device 1202 is typically configured to further convert the angular position into a linear position in a known manner, such as by using a multiplication factor, and, in the case of a magnet with multiple poles, by taking into account the pole spacing.

[0225] Figure 13A The figure illustrates a linear position sensor system 1300, which can be considered as... Figure 12 A special case or variant of the linear position sensor system 1200, wherein the magnet 1301 is a bipolar magnet, rather than a magnetic structure comprising multiple alternating magnetic poles.

[0226] Figure 13B A linear position sensor system 1320 is shown, which can be considered as... Figure 12 (a) Another variant of the linear position sensor system 1200.

[0227] Figure 13CA linear position sensor system 1340 is shown, which can be considered as... Figure 12 (a) is another variant of the linear position sensor system 1200.

[0228] exist Figures 13A to 13C In all embodiments, the sensor device can move relative to the magnet in the X direction, or the magnet can move relative to the sensor device along the X direction, and the sensor device can determine a linear position in a manner highly sensitive to external disturbance fields and can detect errors.

[0229] Figure 14 A flowchart of method 1400 is shown, which can be performed by position sensor device 602 of angular position sensor system 600 or a variant thereof. Sensor device 602 includes a substrate having two sensors S1, S2 spaced apart in the X direction. Each of these sensors is capable of measuring three orthogonal magnetic field components Bx, By, and Bz. The method includes the following steps:

[0230] a) Measure the first magnetic field components Bx1 and Bx2 oriented in the first direction X, the second magnetic field components Bz1 and Bz2 oriented in the second direction Z perpendicular to the first direction X, and the third magnetic field components By1 and By2 oriented in the third direction Y perpendicular to the first and second directions X and Z by each of the first and second sensors S1 and S2.

[0231] b) Determine the first difference ΔBx12 between the first magnetic field components Bx1 and Bx2 of 1402; and determine the second difference ΔBz12 between the second magnetic field components Bz1 and Bz2; and determine the third difference ΔBy12 between the third magnetic field components By1 and By2;

[0232] c) Determine the first ratio R1 between the first difference ΔBx12 and the second difference ΔBz12 of 1403, and determine the first angle θ based on the first ratio R1. 主要 and output the first angle θ 主要 ;

[0233] d) Determine the second ratio R2 between the first difference ΔBx12 and the third difference ΔBy12 of 1404;

[0234] e) Optionally determine the second angle θ based on the second ratio R2. 辅助 ;

[0235] Optionally, the first angle θ 主要 With the second angle θ 辅助 Comparisons are made to produce a first result;

[0236] Optionally, the first ratio R1 is compared with the second ratio R2 to produce a second result;

[0237] Output at least one of the following: second angle θ 辅助 A first ratio R1 and a second ratio R2, and a diagnostic signal based on the first result and / or the second result.

[0238] As mentioned above, especially Figure 6 (a) to Figure 11 In (d), many variations of the method are possible.

[0239] Figure 15 An electrical block diagram of a circuit that can be used in the above-described position sensor device is shown, but the invention is not limited thereto, and other block diagrams may also be used.

[0240] Circuit 1510 includes multiple magnetic sensor elements, a processing unit 1530, and a non-volatile memory 1531. This block diagram can be used, for example, with magnetic sensor elements such as... Figure 6 In a sensor device with a sensor structure like that in (c), the sensor device includes eight horizontal Hall elements H1 to H8, but the invention is not limited thereto. For example, in a sensor device having a structure like... Figure 6 In the case of a sensor structure like (d), the sensor device will include two horizontal Hall elements and four vertical Hall elements. When the sensor device has a structure like... Figure 8 (c) or Figure 8 In the case of a sensor structure like (d), the sensor device will only include six horizontal Hall elements. When the sensor device has a structure like... Figure 9 In the case of a sensor structure like that in (c), the sensor device will include twelve horizontal Hall elements, etc. Furthermore, as mentioned above, it is also possible to use magnetoresistive (MR) elements.

[0241] Processing unit 1530 can be configured to perform method 1400 or variations thereof as described above. Sensor device 1510 can be connected to second processor 1540, for example to electronic control unit 1540, via one or more wired or wireless means (e.g., via radio frequency link RF or infrared link IR).

[0242] The sensor device outputs at least one principal angle θ 主要 Depending on which method is implemented, sensor device 1510 may also output one or more of the following values ​​as described above: θ 辅助 12, θ 辅助 23, θ 辅助 12 and θ 辅助 23 average, θ 辅助3. Sensor devices can perform matching or conformance checks internally and provide test results as diagnostic signals, but this is not absolutely necessary, and it is also possible to have an external processor 1540 perform the comparison or conformance checks.

[0243] Processing unit 1530 may include a digital processor, which may optionally include or be connected to non-volatile memory 1531. This memory may be configured to store one or more constants (e.g., one or more of threshold offset values ​​ε12, ε23) for determining whether the angle matches or deviates excessively from one or more of the K factors described above. The digital processor may be, for example, an 8-bit processor or a 16-bit processor.

[0244] Although not explicitly shown, circuit 1510 may further include one or more components or sub-circuits selected from the group consisting of: bias sources (e.g., current sources, voltage sources), amplifiers, differential amplifiers, analog-to-digital converters (ADCs), etc. The ADC may have a resolution of at least 8 bits, at least 10 bits, at least 12 bits, at least 14 bits, or at least 16 bits. These components are well known in the art and therefore do not require further description here.

Claims

1. A position sensor device, comprising: The substrate includes a first magnetic sensor and a second magnetic sensor spaced apart in a first direction, each magnetic sensor being capable of measuring three orthogonal magnetic field components, the three orthogonal magnetic field components including a first magnetic field component oriented in the first direction, a second magnetic field component oriented in a second direction perpendicular to the first direction, and a third magnetic field component oriented in a third direction perpendicular to both the first and second directions. A processing circuit, connected to the first magnetic sensor and the second magnetic sensor, and configured to: a) Measure a first magnetic field component oriented in the first direction, a second magnetic field component oriented in the second direction, and a third magnetic field component oriented in the third direction using each of the first and second magnetic sensors; b) Determine the first difference between the first magnetic field components, the second difference between the second magnetic field components, and the third difference between the third magnetic field components; c) Determine a first ratio between the first difference and the second difference, and determine a first angle based on the first ratio, and output the first angle; d) Determine a second ratio of the first difference to the third difference; or determine a second ratio of the first difference to a linear combination of the third difference and the second difference; e) Perform at least one of the following: i) Output the first ratio and the second ratio; ii) Output a diagnostic signal based on a comparison between the first ratio and the second ratio; iii) Determine the second angle based on the second ratio, and output the second angle; iv) Determine the second angle based on the second ratio, and output a diagnostic signal based on the comparison between the first angle and the second angle.

2. The position sensor device as described in claim 1, Step d) includes: Determine a second ratio between the first difference and the third difference; and Step e) includes: determining the second angle based on the second ratio; And output at least one of the following: the second angle, a diagnostic signal based on the comparison between the first angle and the second angle.

3. The position sensor device as described in claim 1, Step d) includes: Determine a second ratio between the first difference and the third difference; and Step e) includes: outputting at least one of the following: the first ratio and the second ratio, and a diagnostic signal based on the comparison of the first ratio and the second ratio.

4. The position sensor device as described in claim 1, Step d) includes: Determine a second ratio between the first difference and the linear combination of the third difference and the second difference; Step e) includes: determining the second angle based on the second ratio; And output at least one of the following: the second angle, a diagnostic signal based on the comparison between the first angle and the second angle.

5. The position sensor device as described in claim 1, Step d) includes: Determine a second ratio between the first difference and the linear combination of the third difference and the second difference; Step e) includes: outputting at least one of the following: the first ratio and the second ratio, and a diagnostic signal based on the comparison of the first ratio and the second ratio.

6. A position sensor device, comprising: A substrate comprising at least three magnetic sensors spaced apart in a first direction. Each magnetic sensor is capable of measuring at least two orthogonal magnetic field components, the at least two orthogonal magnetic field components including a first magnetic field component oriented in the first direction and one or both of the following: a second magnetic field component oriented in a second direction perpendicular to the first direction and perpendicular to the substrate, and a third magnetic field component oriented in a third direction perpendicular to the first direction and parallel to the substrate. A processing circuit, connected to the at least three magnetic sensors, and configured to: a) Measure the first magnetic field component (Bx1, Bx2) oriented in the first direction and the second magnetic field component (Bz1, Bz2) oriented in the second direction (Z) by means of the first pair of magnetic sensors; b) Measure the first magnetic field component oriented in the first direction and the third magnetic field component oriented in the third direction by means of a second pair of magnetic sensors that are different from the first pair; c) Determine the first difference between the first magnetic field components of the first pair and the second difference between the second magnetic field components of the first pair; d) Determine a first ratio between the first difference and the second difference, and determine a first angle based on the first ratio, and output the first angle; e) Determine the third difference between the first magnetic field components of the second pair, and the fourth difference between the third magnetic field components of the second pair; f) Determine a second ratio between the third difference and the fourth difference; g) Perform at least one of the following: i) Output the first ratio and the second ratio; ii) Output a diagnostic signal based on a comparison between the first ratio and the second ratio; iii) Determine the second angle based on the second ratio, and output the second angle; iv) Determine the second angle based on the second ratio, and output a diagnostic signal based on the comparison between the first angle and the second angle.

7. The position sensor device as described in claim 6, The at least three magnetic sensors are located in a straight line; Or, wherein the at least three magnetic sensors are located at the corners of the triangle.

8. The position sensor device as described in any one of claims 6 or 7, The magnetic sensors, one or more of them, or each magnetic sensor, include an integrated magnetic collector (IMC) and two horizontal Hall elements arranged on opposite sides of the IMC. Alternatively, one or more of the magnetic sensors or each magnetic sensor may include an integrated magnetic concentrator (IMC) and three horizontal Hall elements spaced apart at multiples of 90°. Alternatively, one or more of the magnetic sensors or each magnetic sensor may include an integrated magnetic concentrator (IMC) and four horizontal Hall elements spaced at multiples of 90°. Alternatively, one or more of the magnetic sensors described herein may include a horizontal Hall element and a single vertical Hall element, or a pair of two vertical Hall elements located on opposite sides of the horizontal Hall element. Alternatively, one or more of the magnetic sensors described herein may include two vertical Hall elements having maximum sensitivity directions perpendicular to each other.

9. The position sensor device as described in claim 6, Each magnetic sensor includes an integrated magnetic concentrator (IMC) and four horizontal Hall elements spaced apart at multiples of 90°. The four horizontal Hall elements consist of a first horizontal Hall element and a second horizontal Hall element spaced apart along the first direction, and a third horizontal Hall element and a fourth horizontal Hall element spaced apart in a direction perpendicular to the first direction. The first angle is calculated based on signals obtained from the first horizontal Hall element and the second horizontal Hall element; Furthermore, the sensor device is configured to determine a first sum as the sum of signals obtained from the first horizontal Hall element and the second horizontal Hall element, and to calculate a second sum as the sum of signals obtained from the third horizontal Hall element and the fourth horizontal Hall element, and to consider the matching of the first sum and the second sum when determining the diagnostic signal.

10. A position sensor device, comprising: The substrate includes a first magnetic sensor and a second magnetic sensor spaced apart along a first axis extending in a first direction, wherein each magnetic sensor includes an integrated magnetic concentrator (IMC) and only three horizontal Hall elements, the three horizontal Hall elements including a first horizontal Hall element, a second horizontal Hall element, and a third horizontal Hall element, the first horizontal Hall element and the second horizontal Hall element being located on the first axis, the third horizontal Hall element being located on a second axis, the second axis forming a 90° angle with respect to the first axis; A processing circuit, connected to the first magnetic sensor and the second magnetic sensor, and configured to: a) Measure a first magnetic field component oriented in a first direction using each of the first magnetic sensor and the second magnetic sensor, as the difference between the signals obtained from the first horizontal Hall element and the second horizontal Hall element; And by measuring a second magnetic field component oriented in a second direction perpendicular to the first direction using each of the first magnetic sensor and the second magnetic sensor, as the sum of signals obtained from the first horizontal Hall element and the second horizontal Hall element; And a third value is measured by each of the first magnetic sensor and the second magnetic sensor, as a signal obtained from the third level Hall element; b) Determine the first difference between the first magnetic field components, the second difference between the second magnetic field components, and the third difference between the third values; c) Determine a first ratio between the first difference and the second difference, and determine a first angle based on the first ratio, and output the first angle; d) Determine a second ratio between the first difference and the third difference; e) Perform at least one of the following: i) Output the first ratio and the second ratio; ii) Output a diagnostic signal based on a comparison between the first ratio and the second ratio; iii) Determine the second angle based on the second ratio, and output the second angle; iv) Determine the second angle based on the second ratio, and output a diagnostic signal based on the comparison between the first angle and the second angle.

11. A magnetic position sensor system, comprising: - A magnetic source, said magnetic source being used to generate a magnetic field having at least two magnetic poles; - A position sensor device as described in any of the preceding claims, wherein the position sensor device is movable relative to the magnetic source, or the magnetic source is movable relative to the position sensor device.

12. The magnetic position sensor system as described in claim 11, The magnetic source is a permanent magnet capable of rotating about a rotation axis; and The position sensor device is mounted at a non-zero radial distance from the axis of rotation and is oriented such that the first direction is tangent to an imaginary circle having a center on the axis of rotation.

13. The magnetic position sensor system as described in claim 11, The magnetic source is a bipolar magnet, or an elongated structure extending in the longitudinal direction and comprising at least two alternating pairs of magnetic poles; and The position sensor device is capable of moving in the longitudinal direction at a non-zero distance from the magnetic source.

14. The magnetic position sensor system as described in any one of claims 11 to 13, The device further includes a second processor, which is communicatively connected to the position sensor device and configured to perform one of the following operations: i) Receive the first angle; ii) Receive one or more of the following: the second angle, the first ratio and the second ratio, and a diagnostic signal indicating error.

15. A method for determining a linear or angular position based on signals obtained from a first magnetic sensor and a second magnetic sensor, the first and second magnetic sensors being spaced apart in a first direction, each capable of measuring three orthogonal magnetic field components; The method includes the following steps: a) Measure a first magnetic field component oriented in a first direction, a second magnetic field component oriented in a second direction perpendicular to the first direction, and a third magnetic field component oriented in a third direction perpendicular to both the first and second directions using each of the first and second magnetic sensors. b) Determine the first difference between the first magnetic field components, the second difference between the second magnetic field components, and the third difference between the third magnetic field components; c) Determine a first ratio between the first difference and the second difference, and determine a first angle based on the first ratio, and output the first angle; d) Determine a second ratio of the first difference to the third difference; or determine a second ratio of the first difference to a linear combination of the third difference and the second difference; e) Perform at least one of the following: i) Output the first ratio and the second ratio; ii) Output a diagnostic signal based on a comparison between the first ratio and the second ratio; iii) Determine the second angle based on the second ratio, and output the second angle; iv) Determine the second angle based on the second ratio, and output a diagnostic signal based on the comparison between the first angle and the second angle.

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