A platinum resistance wire winding and bonding device for a laser tester

Abstract

The present application relates to a kind of platinum resistance wire winding and laminating device for laser tester, belong to laser energy measurement technical field, solve the problem that the platinum resistance wire in the existing high-energy laser energy meter is difficult to be simultaneously implemented in the surface of heat conversion matrix uniform arrangement and with heat conversion matrix laminating arrangement and lead to the problem of big processing difficulty.The platinum resistance wire winding and laminating device for laser tester of the present application, including base, support frame and pressure plate, base can place the heat conversion matrix to be assembled, support frame is set on base, platinum resistance wire can be uniformly wound on support frame, first cavity is equipped on the body of support frame, pressure plate can pass through first cavity and press the platinum resistance wire on support frame to heat conversion matrix and be glued.The platinum resistance wire winding and laminating device for laser tester provided in the present application makes platinum resistance wire and heat conversion matrix laminating arrangement and uniformly distributed on heat conversion matrix, reduce processing difficulty, simplify operation step.

Description

Technical Field

[0001] This invention relates to the field of laser energy measurement technology, and in particular to a platinum resistance wire winding and bonding device for laser testing instruments. Background Technology

[0002] With the development of the international situation and the national economy, the application of high-energy lasers in various fields of military and civilian use in China is becoming increasingly important. How to detect the accurate energy value of high-energy lasers is related to the scope of application and the depth of application in corresponding fields.

[0003] Currently, high-energy laser energy meters are commonly used for energy detection. The working principle of existing high-energy laser energy meters is as follows: the heat conversion matrix on the laser energy meter probe receives the incident laser and converts it into heat energy, causing the heat conversion matrix to heat up. The temperature sensor located on the heat conversion matrix detects the temperature of the heat conversion matrix, thereby obtaining the temperature change curve of the heat conversion matrix. Then, the laser energy is calculated from the mass of the heat conversion matrix and related components and the specific heat of the material at different temperatures.

[0004] Existing high-energy laser energy meters typically use platinum resistance thermometers to measure the temperature of the heat conversion matrix. To ensure the thermoelectric conversion efficiency between the heat conversion matrix and the platinum resistance wire, the platinum resistance wire needs to be uniformly arranged and fixed to the heat conversion matrix. However, existing high-energy laser energy meters usually process the heat conversion matrix by enclosing the platinum resistance wire within it, ensuring the winding of the platinum resistance wire. This method places stringent requirements on the material of the heat conversion matrix itself, and the processing technology is complex, difficult, and costly, making it unfavorable for product assembly and adjustment.

[0005] Therefore, to address the problem of high processing difficulty caused by the difficulty in simultaneously achieving uniform arrangement of platinum resistance wires on the surface of the thermal conversion substrate and bonding them to the thermal conversion substrate in existing high-energy laser energy meters, a platinum resistance wire winding and bonding device for laser testing instruments is needed. Summary of the Invention

[0006] Based on the above analysis, the present invention aims to provide a platinum resistance wire winding and bonding device for laser testing instruments, which solves the existing problems.

[0007] The objective of this invention is mainly achieved through the following technical solutions:

[0008] The present invention provides a platinum resistance wire winding and bonding device for a laser tester, comprising a base, a support frame and a pressure plate. The base can hold the heat conversion substrate to be assembled. The support frame is disposed on the base. The platinum resistance wire can be evenly wound on the support frame. The support frame has a first cavity. The pressure plate can pass through the first cavity and press the platinum resistance wire on the support frame onto the heat conversion substrate for bonding.

[0009] Furthermore, the base includes a motherboard and four connecting blocks, which are respectively located at the four corners of the motherboard.

[0010] Furthermore, the motherboard body has a first groove, and the heat conversion substrate is placed in the first groove.

[0011] Furthermore, the connecting block has a second groove on its body, and the support frame can be inserted into the second groove.

[0012] Furthermore, the support frame includes a main frame and a plug. The main frame has a first cavity, and the plug is located on the main frame and can be inserted into a second groove.

[0013] Furthermore, the main frame is characterized in that the two ends of the main body are respectively the first support rod and the second support rod, and the support frame also includes a plurality of first pressing columns and a plurality of second pressing columns. The first pressing columns are evenly arranged on the first support rod, the second pressing columns are evenly arranged on the second support rod, and the platinum resistance wire is evenly wound on the first pressing columns and the second pressing columns.

[0014] Furthermore, it also includes a locking assembly that can secure the support frame to the base.

[0015] Furthermore, the connecting block body is also provided with a second cavity, which communicates with the second groove, and the engaging component is located in the second cavity.

[0016] Furthermore, the engaging assembly includes a spring and a first locking head, with one end of the spring located at the bottom of the second cavity and the other end connected to the first locking head.

[0017] Furthermore, the pressure plate includes a pressure plate body and a handle, with the handle located on the pressure plate body. The pressure plate body can pass through the first cavity and press the platinum resistance wire against the heat conversion substrate.

[0018] Compared with the prior art, the present invention can achieve at least the following beneficial effects:

[0019] The present invention relates to a platinum resistance wire winding and bonding device for a laser tester. A base is used to place the heat conversion substrate to be assembled. A support frame is connected to the base and can press against the heat conversion substrate. The platinum resistance wire for measuring temperature is uniformly wound on the support frame. The pressure plate can press the platinum resistance wire on the support frame and bond it to the heat conversion substrate, thereby achieving uniform arrangement and bonding of the platinum resistance wire on the heat conversion substrate at the same time. This is beneficial to improving the heat conversion efficiency between the heat conversion substrate and the platinum resistance wire, reducing assembly costs, and simplifying assembly steps.

[0020] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the specification or be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained from the content specifically pointed out in the text and accompanying drawings. Attached Figure Description

[0021] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0022] Figure 1 This is a schematic diagram of the platinum resistance wire winding and bonding device for a laser tester according to Embodiment 1 of the present invention;

[0023] Figure 2 This is a diagram showing the connection relationship between the support frame and the base of the platinum resistance wire winding and bonding device for a laser tester according to Embodiment 1 of the present invention.

[0024] Figure 3 This is a schematic diagram of the base of the platinum resistance wire winding and bonding device for a laser tester according to Embodiment 1 of the present invention;

[0025] Figure 4 This is a schematic diagram of the support frame of the platinum resistance wire winding and bonding device for a laser tester according to Embodiment 1 of the present invention;

[0026] Figure 5 This is a schematic diagram of the locking assembly of the platinum resistance wire winding and bonding device for a laser tester according to Embodiment 1 of the present invention;

[0027] Figure 6 This is a front view of a platinum resistance wire winding and bonding device for a laser tester with an adjustment component according to Embodiment 2 of the present invention.

[0028] Figure 7 This is a schematic diagram of the structure of the platinum resistance wire winding and bonding device for a laser tester with adjustment components according to Embodiment 2 of the present invention.

[0029] Figure 8 This is a schematic diagram of the moving component of the platinum resistance wire winding and bonding device for a laser tester with an adjustment component according to Embodiment 2 of the present invention.

[0030] Figure 9 This is a schematic diagram of the moving rod of the moving component of the platinum resistance wire winding and bonding device for a laser tester with an adjustment component according to Embodiment 2 of the present invention.

[0031] Figure label:

[0032] 1-Base; 11-Main board; 111-First groove; 12-Connecting block; 121-Second groove; 122-Second cavity; 2-Support frame; 21-Main frame; 211-First cavity; 212-First support rod; 213-Second support rod; 214-Ninth support rod; 215-Tenth support rod; 2151-Fourth through hole; 22-Insertion block; 221-First slot; 23-First pressing post; 24-Second pressing post; 3-Pressure plate; 31-Pressure plate body; 311-Third cavity; 32-Handle; 4-Clamping assembly; 41-Spring; 42-First clamping head; 5-Adjusting assembly; 51-Lifting assembly; 511-Screw; 512-Connecting plate; 5121-First support plate; 5122-Second support plate 52-Plate; 521-Moving assembly; 522-Connecting rod; 523-Intermediate ring; 523-Moving rod; 5231-Moving rod body; 5231A-Second through hole; 5232-Sliding end; 5232A-Third through hole; 524-Angled rod; 525-Limiting rod; 5251-Seventh support rod; 5252-Eighth support rod; 526-First limiting plate; 5261-Third plane; 5262-Third inclined surface; 527-Second limiting plate; 5271-Fourth plane; 5272-Fourth inclined surface; 53-First inclined surface body; 531-First plane; 532-First inclined surface; 54-Second inclined surface body; 541-Second plane; 542-Second inclined surface; 6-Support base; 61-Support column; 62-Base plate. Detailed Implementation

[0033] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0034] The embodiments of the present invention are combined with the appendix Figures 1-9 The specific description is as follows:

[0035] The platinum resistance wire winding and bonding device for laser testing instruments provided in this embodiment, such as Figure 1 As shown, the assembly includes a base 1, a support frame 2, and a pressure plate 3. The base 1 is used to place the heat conversion substrate to be assembled. The support frame 2 is connected to the base 1 and can press against the heat conversion substrate. The platinum resistance wire used for temperature measurement is evenly wound on the support frame 2. The pressure plate 3 can press the platinum resistance wire on the support frame 2 and adhere it to the heat conversion substrate, so that the platinum resistance wire can be evenly distributed and adhered to the heat conversion substrate at the same time. This is beneficial to improve the heat conversion efficiency between the heat conversion substrate and the platinum resistance wire, reduce assembly costs, and simplify assembly steps.

[0036] See Figure 3The base 1 includes a main board 11 and four connecting blocks 12. The main board 11 is a square plate, and the four connecting blocks 12 are respectively located at the four corners of the main board 11. The main board 11 has a first groove 111, and the heat conversion substrate can be placed at the bottom of the first groove 111. The bottom of the connecting block 12 is located on the main board 11, and the top of the connecting block 12 has a second groove 121, and the support frame 2 can be inserted into the second groove 121, thereby realizing the connection between the support frame 2 and the base 1.

[0037] See Figure 2 and Figure 4 The support frame 2 includes a main frame 21, insert blocks 22, and multiple first pressing columns 23 and multiple second pressing columns 24. The main frame 21 is a square frame with a square first cavity 211 on its body. The pressing plate 3 can pass through the first cavity 211 and press against the heat conversion substrate located in the first groove 111. Insert blocks 22 are provided at the four corners of the main frame 21. The insert blocks 22 can be inserted into the second groove 121 to install the support frame 2 on the base 1. In order to ensure the stability of the support frame 2 on the base 1, the outer surface of the insert block 22 is in contact with the inner wall of the second groove 121.

[0038] The main frame 21 has a first support rod 212 and a second support rod 213 at its two ends. The first support rod 212 is provided with a plurality of first pressing columns 23, which are evenly arranged on the first support rod 212. The second support rod 213 is provided with a plurality of second pressing columns 24, which are evenly arranged on the second support rod 213. The first pressing columns 23 and the second pressing columns 24 are arranged opposite to each other and are staggered, so that the platinum resistance wire can be wound back and forth in the order of the first pressing columns 23 and the second pressing columns 24. Thus, the platinum resistance wire is evenly arranged on the support frame 2 through the first pressing columns 23 and the second pressing columns 24.

[0039] See Figure 5The base 1 is provided with a locking assembly 4, which can fix the support frame 2 to the base 1. The connecting block 12 has a second cavity 122 on its body. The port of the second cavity 122 is located on the inner wall of the second groove 121, so that the second cavity 122 communicates with the second groove 121. The locking assembly 4 is provided in the second cavity 122. The locking assembly 4 includes a spring 41 and a first locking head 42. One end of the spring 41 is located at the bottom of the second cavity 122, and the other end is connected to the spherical first locking head 42, so that a part of the first locking head 42 protrudes from the port of the second cavity 122. Furthermore, the insert 22 has a hemispherical first locking groove 221 on the surface facing the port of the second cavity 122. When the insert 22 is located at the bottom of the second groove 121, the first locking groove 221 is opposite to the port of the second cavity 122, so that the first locking head 42... The clip 42 is inserted into the first slot 221 under the elastic force of the spring 41, thereby automatically fixing the insert 22 into the second groove 121, which helps to enhance the stability of the support frame 2 on the base 1. When disassembling the support frame 2, the support frame 2 is moved so that the first slot 221 moves relative to the second cavity 122. During the movement, the insert 22 pushes the first clip 42 into the second cavity 122, so that the first clip 42 is disengaged from the first slot 221, thereby releasing the lock on the support frame 2. This makes it easier for the operator to flip the support frame 2 so that the first pressing post 23 and the second pressing post 24 face upwards. This makes it easier for the operator to evenly wind the platinum resistance wire around the first pressing post 23 and the second pressing post 24 before flipping it and engaging it with the base 1, so that the first pressing post 23 and the second pressing post 24 press against the heat conversion substrate.

[0040] See Figure 1 The pressure plate 3 includes a pressure plate body 31 and two handles 32. The pressure plate body 31 has a third cavity 311 penetrating the main body. The handles 32 are located at both ends of the pressure plate body 31. The pressure plate body 31 can pass through the first cavity 211 and press the platinum resistance wire against the heat conversion substrate located in the first groove 111. The handles 32 include a third support rod and a fourth support rod. One end of the third support rod is connected to the pressure plate body 31, and the other end is perpendicularly connected to the fourth support rod. In use, the pressure plate body 31 can be driven through the first cavity 211 by the handles 32, so that the pressure plate body 31 is in contact with the platinum resistance wire wound on the first pressure post 23 and the second pressure post 24. The platinum resistance wire is brought into contact with and pressed as a whole, causing the platinum resistance wire to move onto the heat conversion substrate and adhere to it. Then, thermally conductive adhesive is applied to the platinum resistance wire through the third cavity 311, fixing the platinum resistance wire to the surface of the heat conversion substrate. After the thermally conductive adhesive on the platinum resistance wire in the third cavity 311 dries, the pressing plate 3 is pulled out from the third cavity 311, and the support frame 2 is removed from the base 1. Then, the un-adhesive platinum resistance wire portion is glued and fixed, thereby achieving uniform distribution of the platinum resistance wire on the heat conversion substrate and simultaneously achieving adhesion between the heat conversion substrate and the platinum resistance wire.

[0041] Example 2

[0042] See Figure 6 This embodiment adds an adjustment component 5 and a support base 6 to the embodiment 1, and removes the handle 32.

[0043] An adjustment component 5 is provided on the main board 11 of the base 1. The adjustment component 5 allows the pressure plate 31 to move within the first cavity 211, thereby pressing the platinum resistance wire wound on the support frame 2 against the heat conversion substrate, so that the platinum resistance wire is evenly distributed and in contact with the heat conversion substrate. Furthermore, when the pressure plate 3 presses against the platinum resistance wire and moves toward the heat conversion substrate, the adjustment component 5 can further enhance the stability of the support frame 2 on the base 1. When the pressure plate 3 moves in the opposite direction, the adjustment component 5 can unlock the relative fixation between the support frame 2 and the base 1, allowing the support frame 2 to detach from the base 1, thereby realizing the automatic disassembly of the support frame 2.

[0044] The other two ends of the main frame 21 are the ninth support rod 214 and the tenth support rod 215, respectively. The first support rod 212 and the second support rod 213 are both vertically arranged between the ninth support rod 214 and the tenth support rod 215, so that the first support rod 212, the second support rod 213, the ninth support rod 214 and the tenth support rod 215 form a square first cavity 211.

[0045] Adjustment component 5 includes lifting component 51, moving component 52, first inclined body 53 and second inclined body 54, see [link / reference] Figure 7 The lifting assembly 51 includes a lead screw 511 and a connecting plate 512. The connecting plate 512 includes a first support plate 5121 and a second support plate 5122. One end of the first support plate 5121 is mounted on the ninth support rod 214, and the other end is perpendicularly connected to the second support plate 5122. The second support plate 5122 has a first through hole with an internal thread. One end of the lead screw 511 passes through the first through hole and is rotatably connected to the pressure plate 31. The lead screw 511 and the first through hole are threaded together. Tightening the lead screw 511 can cause it to drive the pressure plate 31 through the first cavity 211 and press the platinum resistance wire against the heat conversion substrate for adhesive bonding. Tightening the lead screw 511 in the opposite direction can cause it to drive the pressure plate 31 away from the heat conversion substrate and return to the first cavity 211, thereby realizing the relative position adjustment between the pressure plate 31 and the main frame 21.

[0046] See Figure 8The movable component 52 includes a connecting rod 521, an intermediate ring 522, a moving rod 523, a diagonal rod 524, a limiting rod 525, a first limiting plate 526, and a second limiting plate 527. One end of the connecting rod 521 is vertically disposed on the pressing plate 31, and the other end is vertically connected to the intermediate ring 522. The tenth support plate 215 has a fourth through hole 2151. One end of the moving rod 523 is sleeved on the intermediate ring 522 and can move on the intermediate ring 522. The end passes through the fourth through hole 2151 and is sleeved on the inclined rod 524 and can move along the inclined rod 524. The inclined rod 524 is connected to the limiting rod 525. The first limiting plate 526 and the second limiting plate 527 are respectively provided at both ends of the limiting rod 525. One end of the inclined rod 524 is provided at the bottom of the main frame 21 and forms a certain angle with the main frame 21 in the vertical direction, so that the end of the inclined rod 524 connected to the main frame 21 is the first high end and the other end is the first low end.

[0047] The intermediate ring 522 is a square ring. The two opposite ends of the intermediate ring 522 are the fifth support rod 5221 and the sixth support rod 5222, respectively. One end of the connecting rod 521 is perpendicularly connected to the pressure plate 31, and the other end is perpendicularly connected to the fifth support rod 5221. (See attached image) Figure 9 The movable rod 523 includes a movable rod body 5231 and a sliding end 5232. The first end of the movable rod body 5231 is provided with a second through hole 5231A. The sixth support rod 5222 is disposed in the second through hole 5231A and can move within the second through hole 5231A. In order to prevent the sixth support rod 5222 from shifting or flipping within the second through hole 5231A, the cross section of the sixth support rod 5222 is square, making the sixth support rod 5222 a square rod. The second through hole 5231A is a square hole, and the surface of the sixth support rod 5222 is in contact with the inner wall of the second through hole 5231A. This not only allows the sixth support rod 5222 to move stably within the second through hole 5231A, but also allows the sixth support rod 5222 to be set perpendicular to the movable rod body 5231, thereby making the movable rod body 5231 vertical.

[0048] The sliding end 5232 is located at the second end of the moving rod body 5231. The moving rod body 5231 passes through the fourth through hole 2151 and can move horizontally within the fourth through hole 2151, so that the tenth support rod 215 is located between the sliding end 5232 and the intermediate ring 522. Furthermore, there is a certain angle between the sliding end 5232 and the moving rod body 5231. The sliding end 5232 is cylindrical. The sliding end 5232 body is provided with a third through hole 5232A. The inclined rod 524 is located within the third through hole 5232A and can slide within the third through hole 5232A. In order for the sliding end 5232 to move stably along the inclined rod 524, the inclined rod 524 is fitted against the inner wall of the third through hole 5232A.

[0049] The limiting rod 525 includes a seventh rod 5251 and an eighth rod 5252. One end of the seventh rod 5251 is connected to the sliding end 5232, and the other end is located in the middle of the eighth rod 5252. The eighth rod 5252 is set perpendicular to the moving rod body 5231, so that the eighth rod 5252 is set horizontally. The eighth rod 5252 can be moved by the seventh rod 5251 through the movement of the sliding end 5232 along the inclined rod 524. The first limiting plate 526 and the second limiting plate 527 are respectively set at both ends of the eighth rod 5252, so that the first limiting plate 526 and the second limiting plate 527 are positioned opposite each other. The first limiting plate 526 and the second limiting plate 527 can be moved horizontally simultaneously by the eighth rod 5252.

[0050] The eighth support rod 5252 has a second and a third locking head in the shape of a convex shape at both ends. The first limiting plate 526 has a second locking groove on the side facing the second limiting plate 527, and the second limiting plate 527 has a third locking groove on the side facing the first limiting plate 526. Both the second and third locking grooves are convex shapes. The second locking head can be inserted into and move within the second locking groove, and the third locking head can be inserted into and move within the third locking groove. When the first limiting plate 526 and the second limiting plate 5252... When the 7 are on the same plane, during the movement of the sliding end 5232 driving the eighth support rod 5252, the second clamping head moves vertically in the second clamping groove while driving the first limiting plate 526 to move horizontally. At the same time, the third clamping head moves vertically in the third clamping groove while driving the second limiting plate 527 to move horizontally. Furthermore, the second limiting plate 527 and the first limiting plate 526 move horizontally in the same direction, thereby realizing that the eighth support rod 5252 can simultaneously drive the first limiting plate 526 and the second limiting plate 527 to move horizontally.

[0051] The first inclined surface 53 is located at the bottom of the main frame 21, and the second inclined surface 54 is located at the top of the main board 11, so that the first inclined surface 53 and the second inclined surface 54 are both located between the base 1 and the support frame 2, and the moving component 52 is located between the first inclined surface 53 and the second inclined surface 54.

[0052] The top of the first inclined body 53 is the first plane 531, and the surface facing the second inclined body 54 is the first inclined surface 532. The first plane 531 is located on the main frame 21. One end of the first inclined surface 532 located on the support frame 2 is the second high end, and the other end away from the support frame 2 is the second low end. The bottom of the second inclined body 54 is the second plane 541, and the surface facing the first inclined body 53 is the second inclined surface 542. The second plane 541 is located on the main board 11. One end of the second inclined surface 542 located on the base 1 is the third low end, and the other end away from the base 1 is the third high end.

[0053] The bottom end of the first limiting plate 526 is the third plane 5261, and the top end is the third inclined surface 5262. The bottom end of the second limiting plate 527 is the fourth plane 5271, and the top end is the fourth inclined surface 5272. When the support frame 2 is engaged in the second cavity 122 and the pressing plate 31 is located in the first cavity 211, one end of the inclined rod 524 is connected to the main frame 21, and the other end is in contact with the main board 11. The first limiting plate 526 and the second limiting plate 527 press against the main board 11 under the action of gravity. At this time, the third plane 5261 and the fourth plane 5271 are simultaneously in contact with the surface of the main board 11, so that the third plane 5261 and the fourth plane 5271 are on the same plane. Furthermore, the sliding end 5232 is located in the middle part of the inclined rod 524. The third inclined surface 5262 can fit with the first inclined surface 532, and the fourth inclined surface 5272 can fit with the second inclined surface 542.

[0054] Tightening the lead screw 511 causes the pressure plate 31 to move towards the heat conversion substrate. During this process, the connecting rod 521 drives the intermediate ring 522 to move synchronously, thus changing the distance between the intermediate ring 522 and the inclined rod 524. Under the pressure of the moving rod body 5231, the sliding end 5232 moves along the inclined rod 524 towards the second inclined surface 54. When the second inclined surface 542 and the fourth inclined surface 5272 are in contact, the sliding end 5232 stops moving. At this time, the platinum resistance wire is in contact with the heat conversion substrate, realizing the relative engagement of the moving component 52 and the base 1, which facilitates the operator to move the pressure plate 31 towards the third inclined surface 54. The platinum resistance wire inside cavity 311 is glued, which helps to ensure the relative stability between the pressure plate 31 and the heat conversion matrix, and can further enhance the relative stability between the support frame 2 and the base 1, realizing the double fixation of the support frame 2 and the base 1. As the sliding end 5232 moves toward the second inclined body 54, it drives the limiting rod 525 to move synchronously, so that the second clamping head moves vertically downward in the second clamping slot and the third clamping head moves vertically downward in the third clamping slot, thereby ensuring that the eighth support rod 5252 simultaneously drives the first limiting plate 526 and the second limiting plate 527 to move horizontally toward the second inclined body 54.

[0055] Tightening the screw 511 in the reverse direction causes the pressure plate 31 to move away from the heat conversion substrate. During this process, the connecting rod 521 drives the intermediate ring 522 to move synchronously, thereby changing the distance between the intermediate ring 522 and the inclined rod 524. The sliding end 5232 moves along the inclined rod 524 towards the first inclined surface 53 under the action of the moving rod body 5231. When the third inclined surface 5262 is in contact with the first inclined surface 532 and applies sufficient pressure to the first inclined surface 532, the locking assembly 4 will release the locking and fixing of the support frame 2, thus realizing the release of the pressure plate 31 from the heat conversion substrate and simultaneously unlocking the locking and fixing of the base 1 to the support frame 2. The automatic disassembly of the support frame 2 facilitates the operator's gluing of the remaining platinum resistance wire, which helps reduce operation steps and saves operation time. After the support frame 2 is unlocked, the sliding end 5232 stops moving. During the movement of the sliding end 5232 toward the first inclined body 53, it drives the limiting rod 525 to move synchronously, so that the second clamping head moves vertically upward in the second clamping slot, and the third clamping head moves vertically upward in the third clamping slot. This causes the eighth support rod 5252 to simultaneously drive the first limiting plate 526 and the second limiting plate 527 to move horizontally toward the first inclined body 53, while the moving rod body 5231 moves horizontally along the sixth support rod 5222.

[0056] Because the operator needs to evenly wind the resistance wire onto the first pressing post 23 and the second pressing post 24 on the support frame 2, the support frame 2 needs to be flipped up during operation so that the first pressing post 23 and the second pressing post 24 face upwards. To prevent the support frame 2 from tilting, support seats 6 are provided on the first support rod 212 and the second support rod 213 of the support frame 2, and the plane of the support seat 6 is opposite to the plane of the first pressing post 23 and the second pressing post 24. The support seat 6 includes two support posts 61 and a base plate 62. The base plate 62 is a flat plate, and the two support posts 61 are respectively located at both ends of the base plate 62. One end of the support post 61 is vertically connected to the main frame 21, and the other end is vertically connected to the base plate 62. Furthermore, the length of the support post 61 is greater than the maximum length of the moving component 52 protruding from the main frame 21, thereby preventing the moving component 52 from contacting the operating table after flipping, which would lead to a decrease in equipment accuracy. The setting of the support seat 6 helps the operator reduce the offset of the support frame 2 when winding the resistance wire on the flipped support frame 2, which is beneficial to improving assembly accuracy.

[0057] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A platinum resistance wire winding and bonding device for a laser testing instrument, characterized in that, The assembly includes a base, a support frame, a pressure plate, and an adjustment component. The base holds the heat conversion substrate to be assembled. The support frame is mounted on the base, and platinum resistance wire is evenly wound around the support frame. The support frame has a first cavity, and the pressure plate passes through the first cavity to press the platinum resistance wire on the support frame onto the heat conversion substrate for adhesive bonding. The base includes a main board; the support frame includes a main frame; and the pressure plate includes a pressure plate body. The adjustment assembly includes a lifting assembly, a moving assembly, a first inclined plane, and a second inclined plane. The lifting assembly includes a lead screw and a connecting plate. One end of the lead screw passes through a first through hole on the connecting plate and is rotatably connected to the pressure plate. The lead screw and the first through hole are threaded together. The moving assembly includes a connecting rod, an intermediate ring, a moving rod, an inclined rod, a limiting rod, a first limiting plate, and a second limiting plate. One end of the connecting rod is vertically mounted on the pressure plate, and the other end is vertically connected to the intermediate ring. One end of the moving rod is sleeved on the intermediate ring and can move on the intermediate ring, while the other end is sleeved on... It is mounted on an inclined rod and can move along the inclined rod; the inclined rod is connected to a limiting rod; a first limiting plate and a second limiting plate are respectively located at both ends of the limiting rod; one end of the inclined rod is located at the bottom of the main frame and forms a certain angle with the main frame in the vertical direction; a first inclined surface is located at the bottom of the main frame and a second inclined surface is located at the top of the main plate; the screw is turned and it drives the pressure plate to move toward the heat conversion matrix, the platinum resistance wire is in contact with the heat conversion matrix, realizing the relative engagement of the moving component and the base, ensuring the relative stability between the pressure plate and the heat conversion matrix; The main frame has a first support rod and a second support rod at opposite ends. The support frame also includes a plurality of first pressure columns and a plurality of second pressure columns. The first pressure columns are evenly arranged on the first support rod, and the second pressure columns are evenly arranged on the second support rod. The first pressure columns and the second pressure columns are arranged opposite to each other and are staggered, so that the platinum resistance wire can be wound back and forth in the order of the first pressure columns and the second pressure columns. The platinum resistance wire is evenly arranged in the support frame through the first pressure columns and the second pressure columns.

2. The platinum resistance wire winding and bonding device for a laser testing instrument according to claim 1, characterized in that, The base also includes four connecting blocks, which are respectively located at the four corners of the motherboard.

3. The platinum resistance wire winding and bonding device for a laser testing instrument according to claim 2, characterized in that, The motherboard body has a first groove, and the heat conversion substrate is placed in the first groove.

4. The platinum resistance wire winding and bonding device for a laser testing instrument according to claim 3, characterized in that, The connecting block has a second groove on its body, and the support frame can be inserted into the second groove.

5. The platinum resistance wire winding and bonding device for a laser testing instrument according to claim 4, characterized in that, The support frame also includes a plug, the main frame body is provided with the first cavity, the plug is provided on the main frame, and the plug can be inserted into the second groove.

6. The platinum resistance wire winding and bonding device for a laser testing instrument according to claim 5, characterized in that, It also includes a locking assembly that can secure the support frame to the base.

7. The platinum resistance wire winding and bonding device for a laser testing instrument according to claim 6, characterized in that, The main body of the connecting block is also provided with a second cavity, which communicates with the second groove, and the engaging component is disposed in the second cavity.

8. The platinum resistance wire winding and bonding device for a laser testing instrument according to claim 7, characterized in that, The engaging assembly includes a spring and a first locking head. One end of the spring is located at the bottom of the second cavity, and the other end is connected to the first locking head.

9. The platinum resistance wire winding and bonding device for a laser testing instrument according to claim 8, characterized in that, The pressure plate also includes a handle, which is disposed on the pressure plate body. The pressure plate body can pass through the first cavity and press the platinum resistance wire against the heat conversion substrate.

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