A plasma etching device and etching process for PCB boards

Abstract

The application discloses a kind of plasma etching device and etching process for PCB board, including plasma etching machine body and feeding frame, the center of four around inner wall of feeding frame is welded with support column, and the shaft center of feeding frame is provided with the fixed connection of support column and placing disc, the inside of placing disc is rotatably connected with the bearing of carousel, and the top of carousel is equipped with the vortex groove of equidistance annular structure distribution.This application first motor drives driving gear to mesh with gear ring to rotate, gear ring drives carousel to rotate in the inside of placing disc by connecting block, the process of carousel rotation Column rod can be concentrated or away along vortex groove, so that column rod can drive sliding block to slide along sliding groove, and sliding block drives clamping block to clamp and position PCB board, so as to improve the stability in the process of PCB board etching, solve the complexity of conventional fixture in prior art for PCB board fixing or dismounting operation process.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board etching technology, and more specifically to a plasma etching apparatus and etching process for PCB boards. Background Technology

[0002] Printed circuit boards (PCBs) serve as the support for the arrangement and interconnection of various electronic components within electronic devices. Traditionally, PCBs were created on an insulating substrate using printed etched resists to form circuit lines and patterns. However, as various electronic devices have gradually shrunk in size to achieve portability, the size of PCBs must also be reduced accordingly. This has made the traditional method of using printed etched resists no longer suitable for small-size manufacturing. Therefore, modern PCBs are now manufactured using lamination or coating methods, combined with lithography and etching processes.

[0003] For example, CN102082064A discloses a pressure-applying fixture for silicon wafers in a plasma etching machine, which includes a fixture body, column screws, a return spring, a pressure plate, a tightening nut, and a CNC torque wrench. The lower ends of the two column screws are fixed on the fixture body, and the upper sections of the two column screws are threaded. The return spring is fitted on the upper section of the column screws, and the pressure plate is fitted on the two column screws and tightened by the tightening nut. The tightening nut is tightened by the CNC torque wrench with a set torque.

[0004] As mentioned above and in the prior art, PCB boards need to be fixed with clamps before etching. Currently, PCB board clamps are generally clamped by rotating bolts or by using cylinders to push the clamping plates. This not only makes the fixing and disassembly process cumbersome, but also reduces the etching efficiency of the PCB board. Summary of the Invention

[0005] The purpose of this invention is to provide a plasma etching apparatus and etching process for PCB boards, so as to overcome the above-mentioned shortcomings in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A plasma etching apparatus for PCB boards includes a plasma etching machine body and a feeding rack. Support columns are welded to the center of the inner walls of the feeding rack, and a placement plate fixedly connected to the support columns is located at the axis of the feeding rack. A turntable is movably connected to the inside of the placement plate via bearings. The top of the turntable has equidistantly spaced annularly distributed vortex grooves. A column rod is slidably connected inside the vortex grooves. Equidistantly spaced annularly distributed connecting blocks are welded to the outer wall of the turntable. A toothed ring is welded to the end of each connecting block away from the turntable. The top of the placement plate has equidistantly spaced annularly distributed sliding grooves. A slider fixedly connected to the column rod is slidably connected inside the sliding grooves, and a clamping block is welded to the top of the slider. A connecting groove is located on the side of the placement plate near the support columns, and a rectangular groove is located on the end of the support columns near the connecting groove. A first motor is fixedly mounted on the top of the support columns, and a drive gear is keyed to the output end of the first motor. One side of the drive gear extends into the connecting groove and meshes with the toothed ring.

[0008] Furthermore, a limiting groove is provided at the center of the inner wall on both sides of the slide, and a limiting block that is slidably connected inside the limiting groove is welded to both sides of the slider.

[0009] Furthermore, the plasma etching machine body has bases bolted to all four sides of its bottom outer wall, and anti-slip pads are adhered to the bottom outer wall of the bases.

[0010] Furthermore, an etching chamber is provided at the center of one side of the plasma etching machine body, and a feed rack is movably connected inside the etching chamber.

[0011] Furthermore, a fitting groove is provided at one end of the inner sidewall of the etching chamber, and a fitting plate that fits into the fitting groove is fixed at one end of the feeding rack.

[0012] Furthermore, a main groove is formed at the center of the bottom inner wall of the etching chamber, and a toothed plate is welded on the bottom inner wall of the main groove. A transmission groove is formed near the bottom of the main groove of the support column, and a drive gear is movably connected inside the transmission groove through a bearing.

[0013] Furthermore, the support column is welded with an ear seat near the bottom of the main groove, and the inside of the ear seat is movably connected with a driven gear that meshes with the driving gear through a bearing. The driven gear meshes with the gear plate, and a second motor that is connected to the driving gear is fixed on one side of the support column.

[0014] Furthermore, guide grooves are provided on both sides of the etching cavity, and guide blocks that are slidably connected inside the guide grooves are welded on both sides of the feeding rack. Positioning grooves are provided on the top and bottom of the guide blocks, and positioning blocks that are slidably connected inside the positioning grooves are welded on the top and bottom of the guide grooves.

[0015] Furthermore, wheel grooves are provided on both sides of the bottom inner wall of the etching chamber, and pulleys that are rolled and connected inside the wheel grooves are provided on both sides of the bottom of the feeding rack.

[0016] A plasma etching process for PCB boards includes the following steps:

[0017] S1. The processing personnel place the PCB board that needs to be etched on the placement tray 8. At this time, the first motor 16 starts.

[0018] S2. The first motor 16 drives the drive gear 18 to mesh with the gear ring 20 to rotate. The gear ring 20 drives the turntable 9 to rotate inside the placement plate 8 through the connecting block 19. During the rotation of the turntable 9, the column rod 22 is concentrated or moved away along the vortex groove 21.

[0019] S3. The column rod 22 drives the slider 11 to slide along the slide groove 10, and the slider 11 drives the clamping block 12 to clamp and position the PCB board, thereby improving the stability of the PCB board etching process.

[0020] S4. Subsequently, the second motor 29 starts, and the second motor 29 drives the driving gear 34 to mesh with the driven gear 32 to rotate;

[0021] S5. During the rotation of the driven gear 32 meshing with the toothed plate 31, the feeding rack 5 is moved into or out of the etching chamber 3, which facilitates the feeding of the PCB board into the etching chamber 3 for etching, and also facilitates the feeding of the etched PCB board out of the etching chamber 3 for removal, which greatly improves the automation level of PCB board etching process.

[0022] S6. During the process of the feeder 5 moving into or out of the etching chamber 3, the feeder 5 drives the pulley 28 to roll along the wheel groove 27, which greatly improves the smoothness of the feeder 5 during movement.

[0023] S7. The feeding rack 5 simultaneously drives the guide block 24 to slide along the guide groove 23, while the positioning block 26 slides along the positioning groove 25, which greatly improves the stability of the feeding rack 5 during movement.

[0024] In the above technical solution, the present invention provides a plasma etching device and etching process for PCB boards. (1) By setting a first motor, the first motor drives the drive gear to mesh with the toothed ring to rotate. The toothed ring drives the turntable to rotate inside the placement plate through the connecting block. During the rotation of the turntable, the column rod is concentrated or moved away along the vortex groove, so that the column rod can drive the slider to slide along the slide groove. The slider drives the clamping block to clamp and position the PCB board, thereby improving the stability of the PCB board etching process and solving the cumbersome operation process of fixing or disassembling the PCB board using conventional fixtures in the prior art. (2) By setting a second motor, the second motor drives the active gear to mesh with the driven gear to rotate. During the rotation of the driven gear meshing with the toothed plate, the feeding rack moves into or out of the etching cavity, which is convenient for the PCB board to be fed into the etching cavity for etching and also convenient for the etched PCB board to be sent out of the etching cavity for removal, which greatly improves the automation level of PCB board etching processing. (3) By setting up the feeding rack, during the process of the feeding rack moving into or out of the etching cavity, the feeding rack drives the pulley to roll along the wheel groove, which greatly improves the smoothness of the feeding rack movement. At the same time, the feeding rack drives the guide block to slide along the guide groove, while the positioning block slides along the positioning groove, which greatly improves the stability of the feeding rack movement. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0026] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of a plasma etching apparatus and etching process for PCB boards according to the present invention.

[0027] Figure 2 This is a schematic diagram of the feeding rack structure provided in an embodiment of a plasma etching apparatus and etching process for PCB boards according to the present invention.

[0028] Figure 3 This is a schematic diagram of the placement disk structure provided in an embodiment of a plasma etching apparatus and etching process for PCB boards according to the present invention.

[0029] Figure 4 This is a partially enlarged structural diagram of the connecting groove provided in an embodiment of a plasma etching apparatus and etching process for PCB boards according to the present invention.

[0030] Figure 5 This is a schematic diagram of a turntable structure provided in an embodiment of a plasma etching apparatus and etching process for PCB boards according to the present invention.

[0031] Figure 6 This is a schematic diagram of the guide groove structure provided in an embodiment of a plasma etching apparatus and etching process for PCB boards according to the present invention.

[0032] Figure 7 This is a schematic diagram of the main groove structure provided in an embodiment of a plasma etching apparatus and etching process for PCB boards according to the present invention.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1. Plasma etching machine body; 2. Base; 3. Etching chamber; 4. Fitting groove; 5. Feed rack; 6. Fitting plate; 7. Support column; 8. Placement tray; 9. Turntable; 10. Slide groove; 11. Slider; 12. Clamping block; 13. Limiting groove; 14. Limiting block; 15. Connecting groove; 16. First motor; 17. Rectangular groove; 18. Drive gear; 19. Connecting block; 20. Gear ring; 21. Vortex groove; 22. Column rod; 23. Guide groove; 24. Guide block; 25. Positioning groove; 26. Positioning block; 27. Wheel groove; 28. Pulley; 29. ​​Second motor; 30. Main groove; 31. Gear plate; 32. Driven gear; 33. Transmission groove; 34. Drive gear; 35. Ear seat. Detailed Implementation

[0035] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0036] like Figure 1-7As shown, the present invention provides a plasma etching apparatus for PCB boards, comprising a plasma etching machine body 1 and a feeding rack 5. Support columns 7 are welded to the center of the inner walls of the feeding rack 5, and a placement plate 8 fixedly connected to the support columns 7 is provided at the axis of the feeding rack 5. A turntable 9 is movably connected to the inside of the placement plate 8 via bearings. The top of the turntable 9 has equidistant annularly distributed vortex grooves 21. A column rod 22 is slidably connected inside the vortex grooves 21. Connecting blocks 19, equidistantly distributed in annular structures, are welded to the outer wall of the turntable 9. A toothed ring 20 is welded to the end of the connecting block 19 away from the turntable 9. The top of the placement plate 8 has equidistant annularly distributed sliding grooves 10. A slider 11 fixedly connected to the column rod 22 is slidably connected inside the sliding grooves 10, and a clamping block 12 is welded to the top of the slider 11. The placement plate 8 is close to the support column 7. A connecting groove 15 is provided on one side of the column 7, and a rectangular groove 17 is provided at the end of the support column 7 near the connecting groove 15. A first motor 16 is fixedly installed on the top of the support column 7, and a drive gear 18 is connected to the output end of the first motor 16 via a key. One side of the drive gear 18 extends into the interior of the connecting groove 15 and meshes with the gear ring 20. The first motor 16 drives the drive gear 18 to mesh with the gear ring 20 and rotate. The gear ring 20 drives the turntable 9 to rotate inside the placement plate 8 through the connecting block 19. During the rotation of the turntable 9, the column rod 22 moves towards or away from the vortex groove 21. The column rod 22 drives the slider 11 to slide along the slide groove 10, and the slider 11 drives the clamping block 12 to clamp and position the PCB board, thereby improving the stability of the PCB board etching process and solving the cumbersome operation process of fixing or disassembling the PCB board using conventional clamps in the prior art.

[0037] In another embodiment provided by the present invention, such as Figure 3 and Figure 4 As shown, a limiting groove 13 is provided at the center of the inner wall on both sides of the slide groove 10, and a limiting block 14 is welded to both sides of the slider 11 and is slidably connected inside the limiting groove 13. When the slider 11 slides along the slide groove 10, it drives the limiting block 14 to slide along the limiting groove 13, which greatly improves the stability of the slider 11 when sliding inside the slide groove 10.

[0038] In another embodiment provided by the present invention, such as Figure 1 As shown, the plasma etching machine body 1 has a base 2 installed around its bottom outer wall by bolts, and the bottom outer wall of the base 2 is covered with an anti-slip pad. The base 2 provides good support for the plasma etching machine body 1, thereby improving the stability of the plasma etching machine body 1.

[0039] In another embodiment provided by the present invention, such as Figure 1As shown, an etching chamber 3 is provided at the center of one side of the plasma etching machine body 1, and a feed rack 5 is movably connected inside the etching chamber 3. A fitting groove 4 is provided at one end of the inner wall of the etching chamber 3, and a fitting plate 6 that fits inside the fitting groove 4 is fixed at one end of the feed rack 5. A window is provided on one side of the fitting plate 6 to facilitate the observation of the plasma etching process of the PCB board by the processing personnel. At the same time, the fitting plate 6 fits inside the fitting groove 4, which ensures the sealing of the etching chamber 3.

[0040] In another embodiment provided by the present invention, such as Figure 2 and Figure 7 As shown, a main groove 30 is formed at the center of the bottom inner wall of the etching chamber 3, and a toothed plate 31 is welded to the bottom inner wall of the main groove 30. A transmission groove 33 is formed near the bottom of the main groove 30, and a drive gear 34 is movably connected to the inside of the transmission groove 33 through a bearing. An ear seat 35 is welded to the bottom of the support column 7 near the bottom of the main groove 30, and a driven gear 32 that meshes with the drive gear 34 is movably connected to the inside of the ear seat 35 through a bearing. The driven gear 32 meshes with the toothed plate 31, and a second motor 29 that is connected to the drive gear 34 is fixed on one side of the support column 7. When the second motor 29 is started, it drives the drive gear 34 to mesh with the driven gear 32 and rotate. During the rotation of the driven gear 32 meshing with the toothed plate 31, the feeding rack 5 moves into or out of the etching chamber 3, which facilitates the feeding of the PCB board into the etching chamber 3 for etching and also facilitates the feeding of the etched PCB board out of the etching chamber 3 for removal, which greatly improves the automation level of the PCB board etching process.

[0041] In another embodiment provided by the present invention, such as Figure 1 and Figure 6 As shown, guide grooves 23 are provided on both sides of the etching cavity 3, and guide blocks 24 that are slidably connected inside the guide grooves 23 are welded to both sides of the feeding rack 5. Positioning grooves 25 are provided on the top and bottom of the guide blocks 24, and positioning blocks 26 that are slidably connected inside the positioning grooves 25 are welded to the top and bottom of the guide grooves 23. Wheel grooves 27 are provided on both sides of the bottom inner wall of the etching cavity 3, and pulleys 28 that are slidably connected inside the wheel grooves 27 are provided on both sides of the bottom of the feeding rack 5. During the process of the feeding rack 5 moving into or out of the etching cavity 3, the feeding rack 5 drives the pulleys 28 to roll along the wheel grooves 27, which greatly improves the smoothness of the feeding rack 5 during movement. At the same time, the feeding rack 5 drives the guide blocks 24 to slide along the guide grooves 23, while the positioning blocks 26 slide along the positioning grooves 25, which greatly improves the stability of the feeding rack 5 during movement.

[0042] Working principle: During use, the operator places the PCB board to be etched on the placement tray 8. At this time, the first motor 16 starts; the first motor 16 drives the drive gear 18 to mesh with the gear ring 20 to rotate. The gear ring 20 drives the turntable 9 to rotate inside the placement tray 8 through the connecting block 19. During the rotation of the turntable 9, the column rod 22 moves towards or away from the volute groove 21; the column rod 22 drives the slider 11 to slide along the slide groove 10, and the slider 11 drives the clamping block 12 to clamp and position the PCB board, thereby improving the stability of the PCB board etching process; subsequently, the second motor 29 starts, and the second motor 29 drives the drive gear 34 to mesh with the drive gear 18 to rotate. The driven gear 32 rotates; during the rotation of the driven gear 32 meshing with the toothed plate 31, the feeder 5 moves into or out of the etching chamber 3, which facilitates the feeding of the PCB board into the etching chamber 3 for etching, and also facilitates the removal of the etched PCB board from the etching chamber 3, greatly improving the automation level of the PCB board etching process; during the process of the feeder 5 moving into or out of the etching chamber 3, the feeder 5 drives the pulley 28 to roll along the wheel groove 27, which greatly improves the smoothness of the feeder 5 during movement; at the same time, the feeder 5 drives the guide block 24 to slide along the guide groove 23, while the positioning block 26 slides along the positioning groove 25, which greatly improves the stability of the feeder 5 during movement.

[0043] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A plasma etching apparatus for PCB boards, comprising a plasma etching machine body (1) and a feed rack (5), characterized in that, Support columns (7) are welded to the center of the inner walls of the feeding rack (5), and a placement plate (8) is fixedly connected to the support columns (7) at the axis of the feeding rack (5). A turntable (9) is movably connected to the inside of the placement plate (8) through bearings, and the top of the turntable (9) is provided with volute grooves (21) distributed in an annular structure at equal intervals. A column rod (22) is slidably connected inside the volute grooves (21), and connecting blocks (19) are welded to the outer wall of the turntable (9) in an annular structure at equal intervals. A toothed ring (20) is welded to the end of the connecting block (19) away from the turntable (9), and the top of the placement plate (8) is provided with volute grooves (21) distributed in an annular structure at equal intervals. A ring-shaped groove (10) is provided. Inside the groove (10), a slider (11) is slidably connected to a column rod (22). A clamping block (12) is welded to the top of the slider (11). A connecting groove (15) is provided on the side of the placement plate (8) near the support column (7). A rectangular groove (17) is provided at the end of the support column (7) near the connecting groove (15). A first motor (16) is fixedly installed on the top of the support column (7). A drive gear (18) is connected to the output end of the first motor (16) by a key. One side of the drive gear (18) extends into the interior of the connecting groove (15) and meshes with the gear ring (20).

2. The plasma etching apparatus for PCB boards according to claim 1, characterized in that, Limiting grooves (13) are provided at the center of the inner walls on both sides of the slide (10), and limiting blocks (14) that are slidably connected inside the limiting grooves (13) are welded to both sides of the slider (11).

3. The plasma etching apparatus for PCB boards according to claim 1, characterized in that, The plasma etching machine body (1) has a base (2) installed around its bottom outer wall by bolts, and an anti-slip pad is attached to the bottom outer wall of the base (2).

4. The plasma etching apparatus for PCB boards according to claim 1, characterized in that, An etching chamber (3) is provided at the center of one side of the plasma etching machine body (1), and a feeding rack (5) is movably connected inside the etching chamber (3).

5. The plasma etching apparatus for PCB boards according to claim 4, characterized in that, The etching cavity (3) has a fitting groove (4) at one end of its inner wall, and the feeding rack (5) has a fitting plate (6) that fits into the fitting groove (4) at one end.

6. The plasma etching apparatus for PCB boards according to claim 4, characterized in that, The etching cavity (3) has a main groove (30) at the center of the bottom inner wall, and a toothed plate (31) is welded on the bottom inner wall of the main groove (30). The support column (7) has a transmission groove (33) near the bottom of the main groove (30), and the transmission groove (33) is movably connected to the drive gear (34) through a bearing.

7. The plasma etching apparatus for PCB boards according to claim 6, characterized in that, The support column (7) has an ear seat (35) welded to the bottom of the main groove (30), and the ear seat (35) is connected to the driven gear (32) that meshes with the driving gear (34) through a bearing. The driven gear (32) meshes with the tooth plate (31), and a second motor (29) that is connected to the driving gear (34) is fixed on one side of the support column (7).

8. The plasma etching apparatus for PCB boards according to claim 4, characterized in that, The etching cavity (3) has guide grooves (23) on both sides, and the feed rack (5) has guide blocks (24) that are slidably connected inside the guide grooves (23) on both sides. The guide blocks (24) have positioning grooves (25) on the top and bottom, and the guide grooves (23) have positioning blocks (26) that are slidably connected inside the positioning grooves (25) on the top and bottom.

9. A plasma etching apparatus for PCB boards according to claim 4, characterized in that, The bottom inner wall of the etching chamber (3) is provided with wheel grooves (27) on both sides, and the bottom of the feeding rack (5) is provided with pulleys (28) that are rolled and connected inside the wheel grooves (27) on both sides.

10. A plasma etching process for PCB boards, characterized in that, Includes the following steps: S1. The processing personnel place the PCB board that needs to be etched on the placement tray (8), at which time the first motor (16) starts; S2. The first motor (16) drives the drive gear (18) to mesh with the gear ring (20) to rotate. The gear ring (20) drives the turntable (9) to rotate inside the placement plate (8) through the connecting block (19). During the rotation of the turntable (9), the column rod (22) is concentrated or moved away along the vortex groove (21). S3. The column rod (22) drives the slider (11) to slide along the groove (10), and the slider (11) drives the clamping block (12) to clamp and position the PCB board, thereby improving the stability of the PCB board etching process; S4. Subsequently, the second motor (29) starts, and the second motor (29) drives the driving gear (34) to mesh with the driven gear (32) to rotate; S5. During the rotation of the driven gear (32) meshing with the toothed plate (31), the feeder (5) is moved into or out of the etching chamber (3), which makes it convenient for the PCB board to be fed into the etching chamber (3) for etching, and also makes it convenient for the etched PCB board to be sent out of the etching chamber (3) for removal, which greatly improves the automation level of PCB board etching process. S6. During the process of the feeder (5) moving into or out of the etching chamber (3), the feeder (5) drives the pulley (28) to roll along the wheel groove (27), which greatly improves the smoothness of the feeder (5) during the movement. S7. The feeding rack (5) simultaneously drives the guide block (24) to slide along the guide groove (23), while the positioning block (26) slides along the positioning groove (25), which greatly improves the stability of the feeding rack (5) during movement.

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