Headphones and terminal devices
By setting multiple sound-generating units and independent sound output channels within the earphone cavity structure, combined with microelectromechanical system units and vent holes, the problem of internal space limitations in wireless earphones is solved, achieving full-band coverage and improved sound quality, while avoiding ear canal pressure discomfort.
Patent Information
- Application Number
- CN202111661986.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-12-30
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2041-12-30
AI Technical Summary
The limited internal space of wireless headphones makes it difficult to simultaneously install multiple sound units to meet the frequency range requirement of 20Hz-20kHz, resulting in insufficient sound quality.
The earphone's cavity structure houses a first sound unit, a second sound unit, and a microelectromechanical system (MEMS) unit. Different frequency sound waves, namely low-frequency, mid-frequency, and high-frequency sound waves, are propagated through independent sound output channels. The high-frequency performance of the MEMS unit is used to improve high-frequency sound quality, and the ear canal pressure is quickly released through the vent.
It achieves full-frequency coverage of the headphones, with excellent sound effects, avoiding interference between sound waves of different frequency bands and discomfort caused by ear canal pressure, thus improving the sound quality and wearing comfort of the headphones.
Smart Images

Figure CN116419109B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of audio equipment, in particular to an earphone and a terminal device. BACKGROUND
[0002] In life, an earphone is a conversion unit that can convert received electrical signals into audible audio signals. Because the earphone is convenient to carry and can enable a user to listen to audio alone without affecting others, the earphone is deeply loved by users. Nowadays, as people's life quality is continuously improved, users have higher requirements for the sound quality of earphones. The sound quality is an important indicator for measuring the quality of an earphone, and an important factor that determines the sound quality is the design of a sound generating unit.
[0003] Generally, a sound generating unit is arranged in a front cavity space of an earphone, and the sound generating unit is a moving coil unit or a moving iron unit. However, a single moving coil unit or a single moving iron unit cannot meet the requirement of music on the entire frequency range 20Hz-20kHz, and usually has the shortcoming of insufficient response at high frequencies. In order to solve this problem, one or more mid-high frequency units are usually added to the existing moving coil unit to supplement the mid-high frequency response. However, in addition to the need to arrange acoustic devices in a wireless earphone, feedback microphones, batteries, circuit boards and other devices also need to be arranged inside the earphone. Due to the limitation of the appearance of the wireless earphone, the internal space of the wireless earphone is limited. If multiple mid-high frequency units are arranged inside the earphone, the battery and other devices will have no installation space, and therefore the scheme of multiple sound generating units cannot be applied to the wireless earphone. SUMMARY
[0004] The present application provides an earphone and a terminal device, which can fully guarantee the output bandwidth of the earphone, achieve a better full-band coverage effect, and have better sound effects.
[0005] The first aspect of the embodiment of the present application provides an earphone, which comprises a shell, the shell has a cavity structure inside, and the shell is provided with a sound outlet communicating with the cavity structure; the cavity structure is provided with a first sound generating unit, a second sound generating unit and a third sound generating unit, wherein the sound generating frequency of the second sound generating unit is greater than the sound generating frequency of the third sound generating unit and less than the sound generating frequency of the first sound generating unit; the third sound generating unit is a micro-electro-mechanical system unit, and the third sound generating unit is located between the first sound generating unit and the sound outlet.
[0006] The earphone provided by the embodiments of the present application can fully ensure the output bandwidth of the earphone, realize better full-band coverage effect, and have better sound quality by arranging the first sound generating unit, the second sound generating unit and the micro-electro-mechanical system unit in the cavity structure.
[0007] In a possible implementation, the sound generating frequency of the first sound generating unit is less than or equal to 1 kHz; the sound generating frequency of the second sound generating unit is between 1 kHz and 6 kHz; and the sound generating frequency of the third sound generating unit is greater than 6 kHz.
[0008] In a possible implementation, one side of the first sound generating unit facing the sound outlet forms a front cavity with part of the inner wall of the cavity structure, and the other side of the first sound generating unit away from the sound outlet forms a rear cavity separated from the front cavity with part of the inner wall of the cavity structure.
[0009] The micro-electro-mechanical system unit is arranged in the front cavity, and one side of the micro-electro-mechanical system unit facing the sound outlet forms a first sound outlet channel with part of the inner wall of the front cavity, part of the inner wall of the front cavity, the other side of the micro-electro-mechanical system unit away from the sound outlet, and one side of the first sound generating unit facing the sound outlet jointly form a middle cavity, and the first sound outlet channel and the middle cavity are in communication.
[0010] The earphone provided by the embodiments of the present application can make the high-frequency sound waves generated by the micro-electro-mechanical system unit propagate to the outside of the sound outlet by arranging the first sound outlet channel. The low-frequency sound waves emitted by the first sound generating unit can propagate to the outside of the sound outlet through the middle cavity and the first sound outlet channel by arranging the middle cavity and arranging the first sound outlet channel in communication with the middle cavity.
[0011] In a possible implementation, part of the inner wall of the front cavity and part of the outer wall of the shell are provided with a second sound outlet channel, one end of the second sound outlet channel is in communication with the sound outlet, and the second sound outlet channel is arranged separately and independently from the first sound outlet channel; the cavity structure has a first accommodating space for accommodating the second sound generating unit, and the first accommodating space is in communication with the rear cavity and the other end of the second sound outlet channel, and the sound emitting surface of the second sound generating unit faces the second sound outlet channel.
[0012] The earphone provided by the embodiment of the present application can avoid the interference between the middle frequency sound waves emitted by the second sound emitting unit and the high frequency sound waves emitted by the third sound emitting unit by arranging the second sound emitting channel separately and independently from the first sound emitting channel.
[0013] In a possible implementation, the first sound emitting channel comprises a high frequency sound emitting channel and a low frequency sound emitting channel, the high frequency sound emitting channel is arranged separately and independently from the low frequency sound emitting channel; and the middle cavity is in communication with the low frequency sound emitting channel.
[0014] The earphone provided by the embodiment of the present application can avoid the interference between the low frequency sound waves emitted by the first sound emitting unit and the high frequency sound waves emitted by the third sound emitting unit by arranging the high frequency sound emitting channel separately and independently from the low frequency sound emitting channel.
[0015] In a possible implementation, a pipe support is arranged in the first sound emitting channel, one end of the pipe support is in sealing connection with the micro-electro-mechanical system unit, the other end of the pipe support extends towards the direction close to the sound emitting port; a pipe in the pipe support forms the high frequency sound emitting channel; and part of the outer wall of the pipe support and part of the inner wall of the first sound emitting channel enclose the low frequency sound emitting channel.
[0016] The earphone provided by the embodiment of the present application can fix the micro-electro-mechanical system unit on the pipe support, thereby facilitating the assembly of the micro-electro-mechanical system unit in the cavity structure and facilitating the arrangement of the high frequency sound emitting channel separately from the low frequency sound emitting channel.
[0017] In a possible implementation, a feedback microphone is further arranged, the feedback microphone is arranged in the first sound emitting channel and close to the sound emitting port.
[0018] In a possible implementation, a positioning part is arranged on the outer wall of the pipe support, the feedback microphone is fixed on the positioning part, and the sound pickup port of the feedback microphone is in communication with the low frequency sound emitting channel.
[0019] The earphone provided by the embodiment of the present application can have the noise reduction function by arranging the feedback microphone. In addition, the feedback microphone can be arranged close to the sound emitting port, thereby facilitating the pickup of the noise by the feedback microphone, so that the noise reduction performance of the feedback microphone can be maximized.
[0020] In a possible implementation, the part of the inner wall of the front cavity and the outer edge of one end of the micro-electro-mechanical system unit have a third sound emitting channel, and the middle cavity is in communication with the first sound emitting channel through the third sound emitting channel.
[0021] In a possible implementation, the second sound generating unit is arranged in the first sound outlet channel, and the second sound generating unit is located between the sound outlet and the micro-electro-mechanical system unit.
[0022] The earphone provided in the application can reduce the distance between the second sound generating unit and the sound outlet, and can reduce the sound quality in front of the second sound generating unit, and can optimize the medium frequency effect of the earphone and enhance the sound effect.
[0023] In a possible implementation, a sound pickup channel is arranged between part of the inner wall of the front cavity and the outer wall of the shell, one end of the sound pickup channel is communicated with the sound outlet; the cavity structure has a second accommodating space, the second accommodating space is communicated with the rear cavity and the other end of the sound pickup channel; and a feedback microphone is arranged in the second accommodating space, and a sound pickup opening of the feedback microphone faces the other end of the sound pickup channel.
[0024] The earphone provided in the application can have the noise reduction function by arranging the feedback microphone. In addition, the feedback microphone can be arranged close to the sound outlet, so that the feedback microphone can easily pick up the sound inside or outside the earphone, and the noise reduction performance of the feedback microphone can be maximized.
[0025] In a possible implementation, the shell comprises a front shell assembly and a rear shell assembly, the front shell assembly is connected with the rear shell assembly; and one end of the front shell assembly has an outwardly protruding sound outlet nozzle, and one end of the sound outlet nozzle defines the sound outlet.
[0026] In a possible implementation, the front shell assembly comprises an inner shell and an outer shell, the outer shell is sleeved on the inner shell, and one end of the inner shell protrudes outward from one end of the outer shell to form the sound outlet nozzle; the outer shell is connected with the rear shell assembly; and one end of the inner shell, which is away from the sound outlet nozzle, is connected with the first sound generating unit.
[0027] In a possible implementation, a channel is arranged in one side of the inner shell, the channel serves as a sound pickup channel of the feedback microphone, or the channel serves as a sound outlet channel of the second sound generating unit.
[0028] The earphone provided in the application can facilitate assembling the first sound generating unit, the second sound generating unit and the micro-electro-mechanical system unit into the earphone by arranging the shell to comprise the front shell assembly and the rear shell assembly.
[0029] In a possible implementation, the front shell assembly is provided with a front air release hole, the front air release hole is in communication with the front cavity, so that a front air release channel is formed between the front air release hole and the front cavity.
[0030] The earphone provided in the embodiments of the present application can communicate the front cavity with the ambient environment (i.e., the external environment) by providing the front air release hole and communicating the front air release hole with the front cavity, so that when the earphone is worn, the air in the ear canal and the front cavity enters the front air release channel, and then enters the external environment through the front air release hole, so that the air flow in the front cavity is quickly released, thereby quickly balancing the pressure in the ear canal, avoiding the discomfort problem caused by the earphone during wearing, and further avoiding the problem of damaging the eardrum of the user.
[0031] In a possible implementation, the front shell assembly is further provided with a rear air release hole, the rear air release hole is in communication with the rear cavity, so that a rear air release channel is formed between the rear air release hole and the rear cavity. The earphone provided in the embodiments of the present application can communicate the rear cavity with the ambient environment (i.e., the external environment) by providing the rear air release hole and communicating the rear air release hole with the rear cavity, so that when the earphone is worn, the air in the ear canal and the rear cavity enters the rear air release channel, and then enters the external environment through the rear air release hole, so that the air flow in the rear cavity is quickly released, thereby quickly balancing the pressure in the ear canal, avoiding the discomfort problem caused by the earphone during wearing, and further avoiding the problem of damaging the eardrum of the user.
[0032] In a possible implementation, the second sound generating unit is a planar diaphragm or a moving iron unit.
[0033] In a possible implementation, the first sound generating unit is a moving coil unit.
[0034] In a possible implementation, the earphone is a wireless Bluetooth earphone.
[0035] The second aspect of the embodiments of the present application provides a terminal device including the earphone as described above.
[0036] The terminal device provided in the present application can fully guarantee the output bandwidth of the earphone by providing the earphone as described above, so as to achieve a better full-band coverage effect and better sound quality. In addition, the micro-electromechanical system unit is used as the third sound generating unit, and the micro-electromechanical system unit has good transient vibration characteristics and high vibration frequency, so compared with the traditional moving coil unit or moving iron unit, the micro-electromechanical system unit has better high-frequency performance, thereby greatly improving the sound quality of the earphone in the high frequency band. BRIEF DESCRIPTION OF DRAWINGS
[0037] Figure 1Ais a structural schematic diagram of an earphone provided by an embodiment of the present application;
[0038] Figure 1B is a structural schematic diagram of an earphone provided by an embodiment of the present application;
[0039] Figure 1C is a structural schematic diagram of an earphone provided by an embodiment of the present application;
[0040] Figure 1D is a structural schematic diagram of an earphone provided by an embodiment of the present application;
[0041] Figure 2 is Figure 1A is a structural schematic diagram of an earphone provided by an embodiment of the present application;
[0042] Figure 3 is Figure 1A is an exploded view of the earphone;
[0043] Figure 4A is Figure 2 is a schematic diagram of a shell part in an A-A direction cross-sectional view of the earphone;
[0044] Figure 4B is Figure 2 is a schematic diagram of a shell and a first sound production unit part in an A-A direction cross-sectional view of the earphone;
[0045] Figure 4C is Figure 2 is an A-A cross-sectional view of the earphone;
[0046] Figure 4D is Figure 2 is a B-B cross-sectional view of the earphone;
[0047] Figure 5 is Figure 2 is another A-A cross-sectional view of the earphone;
[0048] Figure 6 is a schematic diagram of frequency response curves of three sound production units of an earphone provided by an embodiment of the present application and a frequency response curve of the three sound production units as a whole;
[0049] Figure 7 is a structural schematic diagram of another earphone provided by an embodiment of the present application;
[0050] Figure 8 is Figure 7 is an exploded view of the earphone;
[0051] Figure 9 is Figure 7 is a C-C cross-sectional view of the earphone;
[0052] Figure 10is a frequency response curve of the three sound generating units of the earphone and a frequency response curve of the three sound generating units as a whole according to an embodiment of the present application;
[0053] Figure 11 is a structural schematic diagram of a terminal device according to an embodiment of the present application;
[0054] Figure 12 is Figure 11 an exploded view;
[0055] Figure 13 is a use state schematic diagram of a terminal device according to an embodiment of the present application;
[0056] Figure 14 is another use state schematic diagram of a terminal device according to an embodiment of the present application;
[0057] Figure 15 is still another use state schematic diagram of a terminal device according to an embodiment of the present application.
[0058] Legend of reference signs:
[0059] 100 - earphone;
[0060] 110 - shell; 120 - cavity structure; 130 - first sound generating unit; 140 - second sound generating unit; 150 - micro-electro-mechanical system unit; 150a - third sound generating unit;
[0061] 160 - pipe support; 170 - feedback microphone;
[0062] 111 - sound outlet; 112 - front shell assembly; 1121 - sound outlet nozzle; 1122 - inner shell; 1122a - passage; 1123 - outer shell;
[0063] 1123a - first end of outer shell; 1123b - second end of outer shell; 1124 - stand;
[0064] 113 - rear shell assembly; 1131 - base; 1132 - rear cover; 1133 - hollow structure;
[0065] 114 - front air vent; 115 - rear air vent;
[0066] 121 - front cavity; 1211 - first sound outlet passage; 1211a - high-frequency sound outlet passage; 1211b - low-frequency sound outlet passage;
[0067] 1212 - third sound outlet passage;
[0068] 122 - rear cavity; 1221 - second sound outlet passage; 1222 - first accommodating space; 1223 - sound pickup passage;
[0069] 1224 - second accommodating space;
[0070] 123 - middle cavity; 171 - sound pickup port;
[0071] 200 - smart bracelet; 210 - wristband; 220 - wrist support; 230 - device body; 231 - display screen. DETAILED DESCRIPTION
[0072] The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.
[0073] Unless otherwise required by context, the term "comprise" and its other forms such as "comprises" and "comprising" are to be construed as open, inclusive, meaning that "comprising" means "including, but not limited to." In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", or "some examples" and the like are intended to mean that the specific features, structures, materials or characteristics associated with that embodiment or example include in at least one embodiment or example of the present disclosure. The illustrative representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics can be included in any one or more embodiments or examples in any appropriate manner.
[0074] In addition, in the present application, the orientation terms such as "front", "back" and the like are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.
[0075] In the embodiments of the present application, "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship.
[0076] Embodiments of the present application provide an earphone which can be used as an accessory of a terminal device in a call scenario. The terminal device includes, but is not limited to, a handheld device, a vehicle-mounted device, a wearable device, a computing device, or other processing devices connected to a wireless modem. The terminal device can include a cellular phone, a smartphone, a personal digital assistant (PDA) computer, a tablet computer, a laptop computer, a vehicle-mounted computer, a smart watch, a smart wristband, a pedometer, and other terminal devices with call functions. The terminal device in embodiments of the present application can also be referred to as a terminal. The call scenario includes, but is not limited to, an indoor call scenario, an outdoor call scenario, and a vehicle-mounted call scenario. The call scenario can include a quiet call scenario, a noisy call scenario (such as a street, a shopping mall, an airport, a station, a construction site, in the rain, watching a game, a concert, and the like), a riding call scenario, an outdoor windy call scenario, a single-ear call scenario, a double-ear call scenario, and other scenarios that can be used for calls. An earphone (also referred to as a headphone, a headset, or an earpiece) can be a pair of conversion units for receiving an electrical signal from a media player or a receiver and converting it into audible sound waves using a speaker close to the ear.
[0077] An earphone can be generally divided into a wired earphone and a wireless earphone. The wired earphone has two earphones and a connecting line, and the left and right earphones are connected by the connecting line. The wired earphone can be inconvenient to wear and needs to be connected to a terminal device through an earphone jack, and consumes the power of the terminal device during work. The wireless earphone can communicate with a terminal device by using a wireless communication technology (such as Bluetooth technology, infrared radio frequency technology, 2.4G wireless technology, ultrasonic waves, and the like), and is more convenient to use than the wired earphone, and thus has been rapidly developed. The left earphone of the wireless earphone can be connected to the right earphone by Bluetooth.
[0078] A true wireless Bluetooth earphone, also known as a true wireless stereo (TWS) earphone, completely abandons the wired connection mode and includes two earphones (for example, a master earphone and a slave earphone). For example, when in use, a terminal device (which can also be referred to as a transmitting device, such as a mobile phone, a tablet, a music player with a Bluetooth output, or the like) is wirelessly connected to the master earphone, and the master earphone is wirelessly connected to the slave earphone through Bluetooth, so that the true wireless separation of left and right channels of Bluetooth can be achieved. The left and right earphones of the TWS earphone can form a stereo system through Bluetooth, and the listening, calling, and wearing performance are all improved. In addition, either of the two earphones can also work independently, for example, in the case where the master earphone is not connected to the slave earphone, the master earphone can return to single-channel sound quality. Due to the physical connection-free characteristic of the left and right earphones of the TWS earphone, almost all TWS earphones are equipped with a charging box that has charging and storage functions.
[0079] Due to the limitation of the appearance of the TWS earphone, the internal space of the TWS earphone is limited, and compared with a wired earphone, in addition to the need to arrange acoustic devices, the TWS earphone also needs to arrange a feedback microphone, a battery, a circuit board and other devices, so that in some technologies, the acoustic devices of the TWS earphone are mostly a low-frequency moving coil unit or a moving iron unit. However, a single moving coil unit or a moving iron unit is difficult to meet the requirement of music on the entire frequency range of 20Hz-20kHz, thereby causing the technical problem of poor sound quality of the TWS earphone.
[0080] To solve the above problems, an embodiment of the present application provides an earphone that can cover the entire frequency band. In the following examples, the earphone of the following scheme can also be a wired earphone and the like.
[0081] Figure 1A A structural schematic diagram of an earphone provided by an embodiment of the present application is shown in Figure 2 Figure 1A A structural schematic diagram of the earphone from another angle is shown in Figure 3 Figure 1A An exploded view of the earphone is shown in
[0082] As shown in Figure 1A , Figure 2 and Figure 3 , an embodiment of the present application provides an earphone 100, which includes a shell 110, the shell 110 includes a front shell assembly 112 and a rear shell assembly 113, and the front shell assembly 112 is connected to the rear shell assembly 113. One end of the front shell assembly 112 has an outwardly protruding sound outlet 1121, and one end of the sound outlet 1121 defines a sound outlet 111. Referring to Figure 3 As shown, a first sound-emitting unit 130, a second sound-emitting unit 140, a third sound-emitting unit 150a, a feedback microphone 170, and a pipe support 160 are arranged within the space enclosed by the front shell assembly 112 and the rear shell assembly 113. Among them, the third sound-emitting unit 150a is a micro-electro-mechanical system (MEMS) unit 150.
[0083] In this embodiment, the first sound-emitting unit 130 has a sound frequency less than or equal to 1 kHz. Because of its low frequency, sound signals within this frequency range can be referred to as low-frequency sound signals. The second sound-emitting unit 140 has a sound frequency between 1 kHz and 6 kHz, falling between low and high frequencies; therefore, sound signals within this frequency range can be referred to as mid-frequency sound signals. The third sound-emitting unit 150a has a sound frequency greater than 6 kHz. Because of its high frequency, sound signals within this frequency range can be referred to as high-frequency sound signals. Therefore, in this embodiment, the sound frequency of the third sound-emitting unit 150a > the sound frequency of the second sound-emitting unit 140 > the sound frequency of the first sound-emitting unit 130.
[0084] Understandably, the shape of the Headphone 100 can be... Figure 1A The structure shown can also be other structures; for example, it can also be... Figure 1B The structure shown Figure 1C The structure shown Figure 1D The shape of the earphone 100 is not specifically limited in this embodiment of the application, whether it is the structure shown or other suitable structures.
[0085] like Figure 3 As shown, the rear shell assembly 113 includes a base 1131 and a rear cover 1132. The base 1131 is disposed near the front shell assembly 112, and a baffle 1131a is provided at one end of the base 1131 near the front shell assembly 112. A through hole 1131b is provided on the baffle 1131a, which connects the two sides of the baffle 1131a. The rear cover 1132 is disposed at the end of the base 1131 away from the front shell assembly 112 and is fixedly connected to the base 1131. The end of the base 1131 near the front shell assembly 112 can be fixedly connected to the front shell assembly 112, and a hollow structure 1133 is formed between the base 1131 and the rear cover 1132.
[0086] It should be noted that the end of the sound outlet 1121 that is away from the rear shell assembly 113 is the sound outlet 111.
[0087] Figure 4A yes Figure 2 A schematic diagram of the shell portion in the cross-sectional view along the AA direction. Figure 4B yesFigure 2 A-A direction cross-sectional view of the housing and the first sound unit part, Figure 4C is Figure 2 A-A cross-sectional view. As shown in Figure 4A , the housing 110 has a cavity structure 120, which can be a cavity structure 120 enclosed between the inner wall of the front shell assembly 112 and the inner wall of the rear shell assembly 113, which communicates with the sound outlet 111. The front shell assembly 112 can include an inner shell 1122 and an outer shell 1123, as shown in Figure 4C , the inner shell 1122 can be used to accommodate the first sound unit 130, the second sound unit 140, and the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a), and the outer shell 1123 is used to wrap the inner shell 1122, which can make the appearance of the earphone 100 more beautiful on the one hand, and can also enclose the cavity structure 120 together with the inner shell 1122 and the rear shell assembly 113 on the other hand.
[0088] Referring again to Figure 4A , the cavity structure 120 can be a cavity structure 120 enclosed between the inner wall of the inner shell 1122, the inner wall of part of the outer shell 1123, and the inner wall of the rear shell assembly 113. The first end 1123a of the outer shell 1123 is provided with a first through hole (not shown) connected to the inner shell 1122, and the second end 1123b of the outer shell 1123 is provided with a second through hole (not shown) connected to the rear shell assembly 113. The outer shell 1123 is sleeved on the inner shell 1122, and the end of the inner shell 1122 away from the rear shell assembly 113 protrudes outward from the first through hole of the outer shell 1123 to form a sound outlet 1121. The second through hole of the outer shell 1123 is connected to the rear shell assembly 113, and the end of the inner shell 1122 away from the sound outlet 1121 can be connected to the first sound unit 130 (see Figure 4B ).
[0089] It should be noted that the outer shell 1123 and the inner shell 1122 can be connected by interference fit, i.e. the inner shell 1122 is inserted into the first through hole of the outer shell 1123, and the outer wall of the inner shell 1122 is interference fit connected with the inner wall of the first through hole, so that the outer shell 1123 and the inner shell 1122 are fixedly connected; the outer shell 1123 and the inner shell 1122 can also be fixedly connected by adhesion. The outer shell 1123 and the rear shell assembly 113 can be fixedly connected by clamping or adhesion, so the connection mode between the outer shell 1123 and the inner shell 1122, and the connection mode between the outer shell 1123 and the rear shell assembly 113 are not limited by the protection scope of the technical scheme of the present application, as long as the outer shell 1123 and the inner shell 1122 are fixedly connected, and the outer shell 1123 and the rear shell assembly 113 are fixedly connected.
[0090] As Figure 4BAs shown, the first sound unit 130 is arranged at one end of the cavity structure 120 close to the rear shell assembly 113, and the side of the first sound unit 130 facing the sound outlet 111 forms a front cavity 121 with part of the inner wall of the inner shell 1122 of the front shell assembly 112.
[0091] In combination Figure 3 and Figure 4B As shown, the side of the first sound unit 130 facing away from the sound outlet 111 forms a rear cavity 122 separated from the front cavity 121 with part of the inner wall of the rear shell assembly 113 (i.e. the baffle 1131a of the base 1131) and part of the inner wall of the outer shell 1123, wherein the rear cavity 122 is in communication with the hollow structure 1133 of the rear cover 1132 assembly due to the through hole 1131b arranged on the baffle 1131a of the base 1131. The rear cavity 122 can provide space for the vibration of the first sound unit 130, and the inside of the hollow structure 1133 can be used to arrange other devices of the earphone 100.
[0092] As shown, Figure 4C the side of the inner shell 1122 facing away from the sound outlet 111, the side of the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a) facing away from the sound outlet 111, and the side of the first sound unit 130 facing the sound outlet 111 jointly form a middle cavity 123. The middle cavity 123 can be used as a space for the vibration of the first sound unit 130 and the third sound unit 150a, and can also be used for transmitting the sound wave signals emitted by the first sound unit 130.
[0093] It should be noted that the frequency of the first sound unit 130 is low, and the vibration amplitude is large. The frequency of the third sound unit 150a is high, and the vibration amplitude is small.
[0094] Figure 4D As shown, Figure 2 the cross-sectional view in the direction of B-B. In combination Figure 4C and Figure 4D As shown, the first sound unit 130, the second sound unit 140, the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a), the feedback microphone 170, and the pipe support 160 are all arranged in the cavity structure 120, and the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a) is arranged between the first sound unit 130 and the sound outlet 111.
[0095] The microelectromechanical system unit 150 (i.e., the third sound-emitting unit 150a) is located inside the front cavity 121. The side of the microelectromechanical system unit 150 (i.e., the third sound-emitting unit 150a) facing the sound outlet 111 and part of the inner wall of the inner shell 1122 of the front shell assembly 112 form a first sound outlet channel 1211 that communicates with the sound outlet 111. The first sound outlet channel 1211 is located between the sound outlet 111 and the microelectromechanical system unit 150 (i.e., the third sound-emitting unit 150a), and the first sound outlet channel 1211 communicates with the middle cavity 123. A channel 1122a is opened in one side of the inner shell 1122. This channel 1122a serves as the sound outlet channel of the second sound-emitting unit 140, i.e., the second sound outlet channel 1221. One end of the second sound outlet channel 1221 communicates with the sound outlet 111, and the second sound outlet channel 1221 is separated from the first sound outlet channel 1211 and is independently arranged. The cavity structure 120 has a first receiving space 1222 for accommodating the second sound-emitting unit 140. The first receiving space 1222 is connected to the rear cavity 122 and the other end of the second sound outlet channel 1221. The sound outlet surface of the second sound-emitting unit 140 faces the second sound outlet channel 1221. A third sound outlet channel 1212 is formed between a portion of the inner wall of the front cavity 121 (i.e., a portion of the inner wall of the inner shell 1122) and the outer edge of one end of the microelectromechanical system unit 150 (i.e., the third sound-emitting unit 150a). The middle cavity 123 is connected to the first sound outlet channel 1211 through the third sound outlet channel 1212.
[0096] It should be noted that the second sound outlet channel 1221 includes, but is not limited to, being located on one side of the inner shell 1122. It can be understood that when the shell 110 is an integral structure, the inner wall of the shell 110 can form a front cavity 121, and a second sound outlet channel 1221 is provided between a portion of the inner wall of the front cavity 121 and a portion of the outer wall of the shell 110.
[0097] like Figure 4C and Figure 4D As shown, the first sound output channel 1211 may include a high-frequency sound output channel 1211a and a low-frequency sound output channel 1211b. The high-frequency sound output channel 1211a and the low-frequency sound output channel 1211b may be separated and set independently of each other, and the middle cavity 123, the third sound output channel 1212 and the low-frequency sound output channel 1211b are all connected.
[0098] In use, the sound wave signal emitted by the first sound emitting unit 130 enters the third sound outlet channel 1212 through the middle cavity 123, and then is transmitted out of the sound outlet 111 of the earphone 100 through the low-frequency sound outlet channel 1211b to the ear of the user; the sound wave signal emitted by the micro-electro-mechanical system unit 150 (i.e. the third sound emitting unit 150a) directly enters the ear of the user through the high-frequency sound outlet channel 1211a, and the sound wave signal emitted by the second sound emitting unit 140 directly enters the ear of the user through the second sound outlet channel 1221 (i.e. the middle-frequency sound outlet channel). That is, the first sound emitting unit 130, the second sound emitting unit 140 and the micro-electro-mechanical system unit 150 (i.e. the third sound emitting unit 150a) respectively transmit sound wave signals into the ear of the user through independent sound outlet channels, so that interference between sound wave signals of different frequency bands can be avoided, and the sound quality is improved.
[0099] In addition, as shown in FIG. 1, Figure 4A and Figure 4D The shell 110 of the earphone 100 in the embodiment of the present application is provided with a front air vent 114 and a rear air vent 115. Specifically, the front shell assembly 112 is provided with the front air vent 114, which is in communication with the front cavity 121 to form a front air vent channel between the front air vent 114 and the front cavity 121. In the embodiment, the front air vent channel is in communication with the low-frequency sound outlet channel 1211b and the middle cavity 123. The front shell assembly 112 is also provided with the rear air vent 115, which is in communication with the rear cavity 122 to form a rear air vent channel between the rear air vent 115 and the rear cavity 122. In the embodiment, the rear air vent channel is in communication with the first accommodating space 1222.
[0100] It should be noted that, since the first sound emitting unit 130 is arranged in the front cavity 122 and the sound emitting frequency of the first sound emitting unit 130 is low, the amplitude is large. When the first sound emitting unit 130 works, the vibration of the first sound emitting unit 130 will push the air in the front cavity 121 to vibrate, so that the air pressure in the front cavity 121 becomes large. When the user wears the earphone 100 on the ear, the ear canal will be in communication with the front cavity 121, and the gas in the front cavity 121 will enter the ear canal. Therefore, the air pressure in the ear canal will also become large, which will cause discomfort of the ear, and even damage the eardrum of the ear.
[0101] Therefore, the front air vent 114 and the rear air vent 115 are arranged to perform air exhaust on the first sound unit 130 and the second sound unit 140, and in addition, the third sound unit 150a is arranged on the side close to the first sound unit 130 and is provided with the middle cavity 123, the middle cavity 123 is communicated with the front cavity 122 and the front air vent 114, so that the third sound unit 150a can share the front air vent 114 with the first sound unit 130, and it is not necessary to arrange an air vent separately.
[0102] The earphone 100 provided by the embodiment of the present application is arranged with the front air vent 114, and the front air vent 114 is communicated with the front cavity 121, so that the front cavity 121 is communicated with the surrounding environment (i.e. external environment), when the earphone 100 is worn, the air in the ear canal and the front cavity 121 enters the front air vent 114, and then enters the external environment, so that the air flow in the front cavity 121 is exhausted quickly, and the pressure in the ear canal is reduced quickly, and the discomfort caused by the earphone 100 during wearing is avoided, and the damage to the eardrum of the user is further avoided.
[0103] The earphone 100 provided by the embodiment of the present application is arranged with the rear air vent 115, and the rear air vent 115 is communicated with the rear cavity 122, so that the rear cavity 122 is communicated with the surrounding environment (i.e. external environment), when the earphone 100 is worn, the air in the ear canal and the rear cavity enters the rear air vent 115, and then enters the external environment, so that the air flow in the rear cavity 122 is exhausted quickly, and the pressure in the ear canal is reduced quickly, and the discomfort caused by the earphone 100 during wearing is avoided, and the damage to the eardrum of the user is further avoided.
[0104] It should be noted that, Figure 4C and Figure 4D The direction of the arrow of the dashed line with the arrow in the above figures represents the propagation direction of the sound wave signal.
[0105] In the embodiment, the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a) is arranged close to the sound outlet 111, so that the length of the high-frequency sound outlet channel 1211a is short, and thus the acoustic mass between the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a) and the sound outlet 111 is reduced, and the attenuation of the high-frequency sound during propagation is further reduced.
[0106] It should be noted that the acoustic mass is the resistance overcome during sound propagation, the greater the acoustic mass, the greater the attenuation of the sound during propagation, and the smaller the acoustic mass, the smaller the attenuation of the sound during propagation.
[0107] In the embodiment, as shown in Figure 4C the first sound outlet channel 1211 is provided with a pipe support 160, one end of the pipe support 160 is sealingly connected with the micro-electro-mechanical system unit 150 (i.e. the third sound production unit 150a), and the other end of the pipe support 160 extends towards the direction close to the sound outlet 111. In the embodiment, the other end of the pipe support 160 is located at the sound outlet 111, and the pipe inside the pipe support 160 forms a high-frequency sound outlet channel 1211a; part of the outer wall of the pipe support 160 and part of the inner wall of the first sound outlet channel 1211 enclose a low-frequency sound outlet channel 1211b.
[0108] In the embodiment, the pipe support 160 is provided to separate the low-frequency sound outlet channel 1211b and the high-frequency sound outlet channel 1211a, so as to simplify the structure of the inner shell 1122.
[0109] It should be noted that in the embodiment in which the pipe support 160 is provided, part of the outer wall of the pipe support 160, part of the outer wall of the micro-electro-mechanical system unit 150 (i.e. the third sound production unit 150a), and part of the inner wall of the front cavity 121 (i.e. part of the inner wall of the inner shell 1122) enclose a third sound outlet channel 1212. In addition, the shape of the pipe support 160 includes but is not limited to the shape shown in Figure 4C The shape of the pipe support 160 can be designed according to the specific shape of the shell 110, which is mainly used to fix the micro-electro-mechanical system unit 150 (i.e. the third sound production unit 150a) and set the high-frequency sound outlet channel 1211a, and separate the high-frequency sound outlet channel 1211a and the low-frequency sound outlet channel 1211b. Therefore, as long as the structure meets the function of the pipe support 160, it belongs to the protection scope of the technical scheme of the present application.
[0110] It should be noted that the length of the outer wall of the pipe support 160 does not constitute a limitation to the protection scope of the technical scheme of the present application. For example, in some embodiments, one end of the pipe support 160 is sealingly connected with the micro-electro-mechanical system unit 150 (i.e. the third sound production unit 150a), and the other end of the pipe support 160 can be located at the sound outlet 111. In some other embodiments, one end of the pipe support 160 is sealingly connected with the micro-electro-mechanical system unit 150 (i.e. the third sound production unit 150a), and the other end of the pipe support 160 can be located between the sound outlet 111 and the micro-electro-mechanical system unit 150 (i.e. the third sound production unit 150a), which can shorten the length of the outer wall of the pipe support 160, thereby reducing the sound resistance caused by the long pipe feature, and reducing the attenuation of the sound signal of the micro-electro-mechanical system unit 150 (i.e. the third sound production unit 150a). It should be noted that the length of the outer wall of the pipe support 160 can be set according to specific needs.
[0111] ReferenceFigure 4D As shown, the earphone 100 in the embodiment further comprises a feedback microphone 170, which is arranged in the first sound outlet channel 1211 and close to the sound outlet 111. The outer wall of the pipe support 160 is provided with a positioning portion (not shown), and the feedback microphone 170 is fixed to the positioning portion, which can be a groove or a buckle. The sound pickup port 171 of the feedback microphone 170 is in communication with the low-frequency sound outlet channel 1211b.
[0112] In the embodiment, the feedback microphone 170 is arranged, so that the earphone 100 has a noise reduction function. In addition, by arranging the feedback microphone 170 close to the sound outlet 111, the feedback microphone 170 can conveniently pick up noise, so that the noise reduction performance of the feedback microphone 170 can be maximized.
[0113] It should be noted that the position of the positioning portion is not limited to the scope of the technical solution of the present application. The positioning portion can be arranged on the outer wall of the pipe support 160, or on the inner shell at the first sound outlet channel 1211. The feedback microphone 170 is fixed in the first sound outlet channel 1211 through the positioning portion, and the feedback microphone 170 faces the first sound outlet channel 1211, so as to ensure that the feedback microphone 170 picks up noise.
[0114] In the embodiment, the cavity structure 120 of the earphone 100 is provided with a first sound generating unit 130, a second sound generating unit 140, and a micro-electro-mechanical system unit 150 (i.e. a third sound generating unit 150a), and the low-frequency sound outlet channel 1211b, the medium-frequency sound outlet channel, and the high-frequency sound outlet channel 1211a are independently arranged. That is, the first sound generating unit 130 corresponds to the low-frequency sound outlet channel 1211b, the second sound generating unit 140 corresponds to the second sound generating unit 140, and the micro-electro-mechanical system unit 150 (i.e. the third sound generating unit 150a) corresponds to the high-frequency sound outlet channel 1211a. In this way, the sound signals of the three frequencies can be prevented from interfering with each other during transmission, so that the sound effect of the earphone 100 can be improved.
[0115] In addition, in the embodiment, the second sound generating unit 140 can be a planar diaphragm or a moving iron unit, the first sound generating unit 130 can be a moving coil unit, and the third sound generating unit 150a is a micro-electro-mechanical system unit 150.
[0116] It should be noted that in the above embodiment, the pipe support 160 is arranged, so that the first sound outlet channel 1211 is divided into the high-frequency sound outlet channel 1211a and the low-frequency sound outlet channel 1211b. In some embodiments, the pipe support can also not be arranged, for example, Figure 5As shown, the side of the first sound unit 130 facing the sound outlet 111 and the part of the inner shell 1122 of the front shell assembly 112 form a front cavity 121. The side of the first sound unit 130 facing away from the sound outlet 111 and the part of the inner shell 1122 of the rear shell assembly 113 form a rear cavity 122 separated from the front cavity 121, wherein the rear cavity 122 communicates with the hollow structure 1133 of the rear cover assembly 1132. The part of the inner shell 1122, the side of the micro-electro-mechanical system unit 150 (i.e., the third sound unit 150a) facing away from the sound outlet 111, and the side of the first sound unit 130 facing the sound outlet 111 together enclose a middle cavity 123.
[0117] The first sound unit 130 and the micro-electro-mechanical system unit 150 (i.e., the third sound unit 150a) are both arranged in the front cavity 121, and the micro-electro-mechanical system unit 150 (i.e., the third sound unit 150a) is arranged between the first sound unit 130 and the sound outlet 111. The side of the micro-electro-mechanical system unit 150 (i.e., the third sound unit 150a) facing the sound outlet 111 and the part of the inner shell 1122 of the front shell assembly 112 enclose a first sound outlet channel 1211 communicating with the sound outlet 111, and the first sound outlet channel 1211 is located between the sound outlet 111 and the micro-electro-mechanical system unit 150 (i.e., the third sound unit 150a) and communicates with the middle cavity 123. The first sound outlet channel 1211 can include a high-frequency sound outlet channel 1211a and a low-frequency sound outlet channel 1211b, which communicate with each other and merge at the first sound outlet channel 1211.
[0118] The cavity structure 120 has a first accommodating space 1222 for accommodating the second sound unit 140, and the first accommodating space 1222 communicates with the rear cavity 122 and the other end of the second sound outlet channel 1221, and the sound emitting surface of the second sound unit 140 faces the second sound outlet channel 1221. A channel 1122a is formed in one side of the inner shell 1122, which serves as the second sound outlet channel 1221, one end of the second sound outlet channel 1221 communicates with the sound outlet 111, and the second sound outlet channel 1221 is arranged separately and independently from the first sound outlet channel 1211.
[0119] In use, the sound wave signals emitted by the first sound unit 130 enter the third sound outlet channel 1212 through the middle cavity 123, then pass through the first sound outlet channel 1211 to the sound outlet 111 of the earphone 100 and then to the user's ear. The sound wave signals emitted by the micro-electro-mechanical system unit 150 (i.e., the third sound unit 150a) directly enter the user's ear through the first sound outlet channel 1211, and the sound wave signals emitted by the second sound unit 140 directly enter the user's ear through the second sound outlet channel 1221.
[0120] In this embodiment, by separating and independently arranging the second sound outlet channel 1221 and the first sound outlet channel 1211, the interference between the second sound unit and the third sound unit 150a can be reduced. By arranging the micro-electro-mechanical system unit 150 (i.e., the third sound unit 150a) close to the sound outlet 111, the length of the high-frequency sound outlet channel 1211a is short, which can reduce the sound quality between the micro-electro-mechanical system unit 150 (i.e., the third sound unit 150a) and the sound outlet 111, and further reduce the attenuation of high-frequency sound in the propagation process.
[0121] It should be noted that in this embodiment, a feedback microphone is also included, which can be arranged on the inner shell and close to the sound outlet, and the pickup port of the feedback microphone faces the first sound outlet channel. In this way, the feedback microphone can easily pick up the sound inside the earphone.
[0122] The micro-electro-mechanical system unit 150 can convert an electrical signal into a sound wave signal, and thus can be used as a sound generating device. The micro-electro-mechanical system unit 150 uses the inverse piezoelectric effect, and a voltage is applied to the piezoelectric crystal to cause corresponding mechanical deformation, thereby driving the diaphragm of the micro-electro-mechanical system unit 150 to vibrate and emit sound waves. The piezoelectric crystal of the micro-electro-mechanical system unit 150 has very good transient vibration characteristics and a high vibration frequency. Therefore, compared with a traditional moving coil unit or a moving iron unit, the micro-electro-mechanical system unit 150 has better high-frequency performance. Therefore, by using the micro-electro-mechanical system unit 150 as the third sound unit and the moving coil unit as the first sound unit 130, the sound quality of the earphone 100 in the medium and high frequency bands can be greatly improved.
[0123] The sound wave emitted by the first sound unit 130 has a low frequency and a large wavelength, and requires a large amplitude and an effective vibration area to push the air. The diaphragm of the moving coil unit has good elasticity, and the design of the diaphragm itself with a large amplitude can ensure good low-frequency performance. Therefore, by designing the first sound unit 130 as a moving coil unit, the low-frequency sound quality of the earphone 100 can be improved.
[0124] The planar membrane or the moving iron unit and the micro-electro-mechanical system are limited by the design principle of the device body and cannot realize a large-amplitude scheme. The planar membrane or the moving iron unit can also be used as the third sound unit 115a, but the micro-electro-mechanical system unit 150 has better transient performance than the planar membrane and the moving iron unit. Therefore, the planar membrane or the moving iron unit is designed as the second sound unit 140.
[0125] As Figure 6As shown, the frequency response curves of the first sound generating unit 130, the second sound generating unit 140 and the third sound generating unit 150a (i.e. the micro-electro-mechanical system unit 150) are tested separately, the curve of the first sound generating unit 130 is L1, the curve of the second sound generating unit 140 is L2, the curve of the third sound generating unit 150a is L3, and the curve of the three sound generating units as a whole is L4.
[0126] As an explanation, in the embodiment, the low frequency band can be a part of the frequency band less than 1 kHz, the medium frequency band can be a part of the frequency band between 1 kHz and 6 kHz, and the high frequency band can be a part of the frequency band greater than 6 kHz. The above frequency relationship can also be expressed as: low frequency band < medium frequency band < high frequency band. Since the frequency band corresponding to the first sound generating unit 130 is the low frequency band, the frequency band corresponding to the second sound generating unit 140 is the medium frequency band, and the frequency band corresponding to the third sound generating unit 150a is the high frequency band, the relationship of the sound generating frequencies corresponding to the first sound generating unit 130, the second sound generating unit 140 and the third sound generating unit 150a can be expressed as: first sound generating unit 130 < second sound generating unit 140 < third sound generating unit 150a.
[0127] In some embodiments, for example, the sound generating frequency of the first sound generating unit 130 can be between 30 Hz and 1000 Hz, and the sound generating frequency of the first sound generating unit 130 can be specifically 30 Hz, 50 Hz, 100 Hz, 200 Hz, 300 Hz, 500 Hz, 800 Hz, etc. Suitable values; the sound generating frequency of the second sound generating unit 140 can be between 1 kHz and 6 kHz, and the sound generating frequency of the second sound generating unit 140 can be specifically 1500 Hz, 2000 Hz, 2500 Hz, 3000 Hz, 3500 Hz, 4000 Hz, 5000 Hz, etc. Suitable values; the sound generating frequency of the third sound generating unit 150a can be between 6 kHz and 20 kHz, and the sound generating frequency of the third sound generating unit 150a can be specifically 6000 Hz, 6500 Hz, 7000 Hz, 8000 Hz, 9000 Hz, 10000 Hz, 15000 Hz, etc. Suitable values; it can be understood that the first sound generating unit 130, the second sound generating unit 140 and the third sound generating unit 150a are all corresponding to a certain frequency, and the first sound generating unit 130, the second sound generating unit 140 and the third sound generating unit 150a can emit any frequency sound within this frequency range, therefore, in the embodiment, the specific sound generating frequency of the first sound generating unit 130, the second sound generating unit 140 and the third sound generating unit 150a will not be listed one by one. Figure 6It can be observed that L1 has a stable waveform and good frequency response in the low-frequency range. However, when entering the mid-frequency range, the L1 curve shows a significant downward trend, indicating a poor frequency response. L2 has a poor frequency response in the low-frequency range. As the frequency increases, L2 gradually rises, and the frequency response gradually improves. After entering the mid-frequency range, the frequency response gradually reaches an even better effect. After entering the high-frequency range, the L2 curve gradually declines, and the frequency response gradually deteriorates. L3's curve gradually rises in the mid-frequency range, and the frequency response gradually improves. After entering the high-frequency range, it exhibits a stable toggle state. L4 has a stable waveform across the entire frequency response curve from the low-frequency range to the high-frequency range, and its frequency response is good.
[0128] In summary, when the three sound-generating units are used individually or in combination, there is always a period of poor frequency response. For example, when low and high frequencies are combined, the frequency response in the mid-frequency range is poor, and when low and mid frequencies are combined, the frequency response in the high-frequency range is poor. However, the headphones 100 provided in this embodiment are equipped with a first sound-generating unit 130, a second sound-generating unit 140, and a third sound-generating unit 150a (i.e., a microelectromechanical system unit 150). Therefore, the headphones 100 of this embodiment have a better frequency response across the entire frequency band, thereby effectively improving the sound quality of the headphones 100. As can be seen from the above curves, the headphones 100 of this embodiment, by setting up the first sound-generating unit 130, the second sound-generating unit 140, and the microelectromechanical system unit 150 (i.e., the third sound-generating unit 150a), and by independently separating and setting the low-frequency output channel 1211b, the mid-frequency output channel, and the high-frequency output channel 1211a, can ensure that the headphones 100 can cover the entire frequency band and ensure better sound effects.
[0129] Additionally, it should be noted that the earphone 100 in this embodiment may also include a soft earplug 232 (not shown in the figure), wherein the earplug 232 is disposed on the outside of the sound outlet 1121, and the earplug 232 can be inserted into the user's ear when worn, so that the earphone 100 can be worn on the user's ear.
[0130] In addition, in this embodiment, the high-frequency output channel 1211a is disposed within the pipe support 160, and the pipe support 160 separates the high-frequency output channel 1211a from the low-frequency output channel 1211b. It should be noted that in some embodiments, the pipe support 160 may not be provided, such as... Figure 9 As shown, the microelectromechanical system unit 150 (i.e., the third sound-generating unit 150a) can be directly fixedly connected to the side wall of the inner shell 1122, and the microelectromechanical system unit 150 (i.e., the third sound-generating unit 150a) is positioned close to the sound outlet 111. The high-frequency sound output channel 1211a and the low-frequency sound output channel 1211b converge at the first sound output channel 1211.
[0131] Figure 7 is a structural schematic diagram of another earphone provided in an embodiment of the present application, Figure 8 is Figure 7 is an exploded view of the earphone 100. As shown in Figure 7 and Figure 8 , the present embodiment provides an earphone 100, which comprises a housing 110, the housing 110 comprising a front shell assembly 112 and a rear shell assembly 113, the front shell assembly 112 being connected with the rear shell assembly 113; and one end of the front shell assembly 112 has an outwardly protruding sound outlet nozzle 1121, one end of the sound outlet nozzle 1121 defining a sound outlet 111. And a first sound generating unit 130, a third sound generating unit 150a, a feedback microphone 170 are arranged between the front shell assembly 110 and the rear shell assembly 110, and a second sound generating unit 140 is arranged in the sound outlet nozzle 1121, wherein the third sound generating unit 150a is a micro-electro-mechanical system unit 150.
[0132] It should be noted that the end of the sound outlet nozzle 1121 away from the rear shell assembly 113 is the sound outlet 111.
[0133] The rear shell assembly 113 comprises a base 1131 and a rear cover 1132, wherein the base 1131 is arranged close to the front shell assembly 112, and one end of the base 1131 close to the front shell assembly 112 is provided with a baffle 1131a, and the baffle 1131a is provided with a through hole 1131b, the through hole 1131b connecting both sides of the baffle 1131a. The rear cover 1132 is arranged at the end of the base 1131 away from the front shell assembly 112 and is fixedly connected with the base 1131, wherein the end of the base 1131 close to the front shell assembly 112 can be fixedly connected with the front shell assembly 112, and a hollow structure 1133 is formed between the base 1131 and the rear cover 1132.
[0134] It should be noted that the cavity structure 120 in the present embodiment is basically the same in shape as the cavity structure 120 in Figure 4A and Figure 4B , so the description of this part of the structure can continue to refer to Figure 4A and Figure 4B .
[0135] Figure 9 is Figure 7 , as shown in Figure 4A , the housing 110 has a cavity structure 120 (see Figure 4A ) therein, which can be a cavity structure 120 enclosed between the inner wall of the front shell assembly 112 and the inner wall of the rear shell assembly 113. As shown in Figure 9As shown, the cavity structure 120 is in communication with the sound outlet 111, the first sound unit 130, the second sound unit 140, the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a) and the feedback microphone 170 are all assembled in the cavity structure 120, and the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a) is arranged between the first sound unit 130 and the sound outlet 111, the second sound unit 140 is arranged in the sound outlet nozzle 1121, and the second sound unit 140 is located between the sound outlet 111 and the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a).
[0136] Continuing to refer to Figure 4A As shown, the front shell assembly 112 can include an inner shell 1122 and an outer shell 1123, and the cavity structure 120 can be a cavity structure surrounded by the inner wall of the inner shell 1122, the inner wall of part of the outer shell 1123, and the inner wall surrounded by the rear shell assembly 113. The first end 1123a of the outer shell is provided with a first through hole connected with the inner shell 1122, the second end 1123b of the outer shell is provided with a second through hole connected with the rear shell assembly 113, and the outer shell 1123 is sleeved on the inner shell 1122.
[0137] Referring to Figure 9 As shown, the end of the inner shell 1122 away from the rear shell assembly 113 protrudes outward from the first through hole of the outer shell 1123 to form a sound outlet nozzle 1121, and a column 1124 protruding outward is arranged on the inner side of the sound outlet nozzle 1121, and the second sound unit 140 is in interference fit with the column 1124 to fix the second sound unit 140 in the sound outlet nozzle 1121. The second through hole of the outer shell 1123 is connected with the rear shell assembly 113, and the end of the inner shell 1122 away from the sound outlet nozzle 1121 is connected with the first sound unit 130.
[0138] Continuing to refer to Figure 4B As shown, the side of the first sound unit 130 facing the sound outlet 111 forms a front cavity 121 with part of the inner wall of the inner shell 1122 of the front shell assembly 112; the side of the first sound unit 130 away from the sound outlet 111 forms a rear cavity 122 separated from the front cavity 121 with part of the inner wall of the rear shell assembly 113 (i.e. the baffle 1131a of the base 1131) and part of the inner wall of the outer shell 1123, wherein the rear cavity 122 is in communication with the hollow structure 1133 of the rear shell assembly 113 due to the through hole 1131b arranged on the baffle 1131a of the base 1131; the rear cavity 122 can provide space for the vibration of the first sound unit 130, and the inside of the hollow structure 1133 can be used to arrange other devices of the earphone. Figure 10 As shown, part of the inner wall of the inner shell 1122, the side of the micro-electro-mechanical system unit 150 (i.e. the third sound unit 150a) away from the sound outlet 111, and the side of the first sound unit 130 facing the sound outlet 111 jointly form a middle cavity 123.
[0139] The front vent hole 114 is arranged on the front shell assembly 112 and communicates with the front cavity 121, so that a front vent passage is formed between the front vent hole 114 and the front cavity 121. In this embodiment, the front vent passage communicates with the low-frequency sound outlet passage 1211b and the middle cavity 123, because the low-frequency sound outlet passage 1211b and the middle cavity 123 are located in the front cavity 121. The first sound generating unit 130, the second sound generating unit 140 and the third sound generating unit 150a are all arranged in the front cavity 122, so that the three sound generating units can share one front vent hole 114. The specific principle can be referred to the description in the above embodiment, which will not be described here.
[0140] The side of the micro-electro-mechanical system unit 150 (i.e. the third sound generating unit 150a) facing the sound outlet 111 and the part of the inner shell 1122 of the front shell assembly 112 form a first sound outlet passage 1211 communicating with the sound outlet 111. The first sound outlet passage 1211 is located between the sound outlet 111 and the micro-electro-mechanical system unit 150 (i.e. the third sound generating unit 150a), and the first sound outlet passage 1211 communicates with the middle cavity 123. A passage 1122a can also be arranged on one side of the inner shell 1122, which can be used as a sound pickup passage 1223 of the feedback microphone 170. One end of the sound pickup passage 1223 communicates with the sound outlet 111. The cavity structure 120 has a second accommodating space 1224, which communicates with the rear cavity 122 and the other end of the sound pickup passage 1223. The feedback microphone 170 is arranged in the second accommodating space 1224, and the sound pickup port 171 of the feedback microphone 170 faces the other end of the sound pickup passage 1223. The part of the inner wall of the front cavity 121 (i.e. the part of the inner wall of the inner shell 1122) and the outer edge of one end of the micro-electro-mechanical system unit 150 (i.e. the third sound generating unit 150a) have a third sound outlet passage 1212, and the middle cavity 123 communicates with the first sound outlet passage 1211 through the third sound outlet passage 1212.
[0141] In addition, the rear vent hole 115 is arranged on the front shell assembly 112 and communicates with the rear cavity 122 to form a rear vent passage between the rear vent hole 115 and the rear cavity 122. In the embodiment, the rear vent passage communicates with the second accommodating space 1224 and the sound pickup passage 1223. Therefore, the rear vent hole 115 can provide an additional path for residual noise to the feedback microphone 170, improve the coherence of the noise received by the feedback microphone 170, and facilitate the noise reduction processing of the earphone, so that the noise reduction effect is better. It should be noted that the sound pickup passage 1223 of the feedback microphone 170 includes but is not limited to being arranged on one side of the inner shell 1122, as long as the sound pickup passage 1223 of the feedback microphone 170 is arranged between the part of the inner wall of the front cavity 121 and the part of the outer wall of the shell 110.
[0142] As shown in Figure 9 , the second sound generating unit 140 is arranged in the first sound outlet passage 1211 and located between the micro-electro-mechanical system unit 150 (i.e., the third sound generating unit 150a) and the sound outlet 111. The first sound outlet passage 1211 can include a high-frequency sound outlet passage 1211a, a medium-frequency sound outlet passage, and a low-frequency sound outlet passage 1211b. The medium-frequency sound outlet passage is located in the high-frequency sound outlet passage 1211a and arranged close to the sound outlet 111. The low-frequency sound outlet passage 1211b is located on one side of the high-frequency sound outlet passage 1211a, and the high-frequency sound outlet passage 1211a and the low-frequency sound outlet passage 1211b converge at the first sound outlet passage 1211.
[0143] In use, the sound wave signal emitted by the first sound generating unit 130 enters the third sound outlet passage 1212 through the middle cavity 123, and then is transmitted out of the sound outlet 111 of the earphone 100 through the low-frequency sound outlet passage 1211b (i.e., part of the first sound outlet passage 1211) to the ear of the user; the sound wave signal emitted by the micro-electro-mechanical system unit 150 (i.e., the third sound generating unit 150a) directly enters the ear of the user through the high-frequency sound outlet passage 1211a (i.e., part of the first sound outlet passage 1211), and the sound wave signal emitted by the second sound generating unit 140 directly enters the ear of the user through the first sound outlet passage 1211. That is, the first sound generating unit 130, the second sound generating unit 140, and the micro-electro-mechanical system unit 150 (i.e., the third sound generating unit 150a) all transmit sound wave signals into the ear of the user through the first sound outlet passage 1211.
[0144] It should be noted that the direction of the arrow of the dashed line with an arrow in Figure 9 represents the propagation direction of the sound wave signal, and the direction of the arrow of the dashed line with an arrow in the sound pickup passage 1223 represents the propagation direction of the sound signal collected by the feedback microphone.
[0145] In the above embodiments, the second sound-generating unit 140 can be a planar diaphragm or a moving iron unit, the first sound-generating unit 130 can be a moving coil unit, and the third sound-generating unit 150a is a microelectromechanical system unit 150.
[0146] It should be noted that mid-frequency and high-frequency sounds are easily lost during propagation. Therefore, the second sound unit 140 and the microelectromechanical system unit 150 (i.e., the third sound unit 150a) can be placed closer to the sound outlet 111. This can reduce the sound quality between the second sound unit 140 and the microelectromechanical system unit 150 (i.e., the third sound unit 150a) and the sound outlet 111, thereby reducing the attenuation of the second sound unit 140 and high-frequency sounds during propagation.
[0147] Since both the planar diaphragm and the moving iron unit are cuboid in shape, the cuboid structure can extend into the sound outlet 1121. However, the microelectromechanical system unit 150 (i.e., the third sound-emitting unit 150a) is cylindrical and cannot extend into the sound outlet 1121. Therefore, in this embodiment, the second sound-emitting unit 140 is disposed inside the sound outlet 1121, the microelectromechanical system unit 150 (i.e., the third sound-emitting unit 150a) is disposed below the second sound-emitting unit 140, and the first sound-emitting unit 130 is disposed below the microelectromechanical system unit 150 (i.e., the third sound-emitting unit 150a). In this way, the distance between the second sound-emitting unit 140 and the sound outlet 111 is very small, which can optimize the mid-frequency effect of the headphone 100 and enhance the sound effect. The distance between the microelectromechanical system unit 150 (i.e., the third sound-emitting unit 150a) and the sound outlet 111 is also relatively small, and the frontal sound quality is also relatively small, thus also enhancing the sound effect.
[0148] like Figure 10 As shown, the frequency response curves of the first sound unit 130, the second sound unit 140, and the third sound unit (i.e., the microelectromechanical system unit 150) are tested individually. The curve of the first sound unit 130 is L1, the curve of the second sound unit 140 is L2, the curve of the third sound unit 150a is L3, and the curve of the three sound units as a whole is L4.
[0149] observe Figure 10It can be found that L1 is stable in the low frequency band and has good frequency response, the curve L1 has a downward trend in the medium frequency band, and the frequency response is poor; L2 has poor frequency response in the low frequency band, gradually increases with the increase of frequency, and the frequency response gradually becomes good, and gradually reaches a better effect after entering the medium frequency band, and the curve of L2 gradually declines after entering the high frequency band, and the frequency response gradually becomes poor; L3 gradually increases with the increase of frequency in the medium frequency band, and the frequency response gradually becomes good, and is in a stable state after entering the high frequency band; L4 is stable in the frequency response curve waveform region from the low frequency band to the high frequency band, and has good frequency response.
[0150] In summary, when the three sound generating units are applied alone or two of them are combined together, the frequency response is poor in a certain frequency band, for example, the low frequency and the high frequency are combined, the frequency response is poor in the medium frequency band, the low frequency and the medium frequency are combined, and the frequency response is poor in the high frequency band. In the earphone 100 provided in the embodiment, the first sound generating unit 130, the second sound generating unit 140 and the third sound generating unit 150a (i.e. the micro-electro-mechanical system unit 150) are arranged, so that the earphone 100 in the embodiment has good frequency response in the entire frequency band, thereby effectively improving the sound quality of the earphone 100.
[0151] It should be noted that the earphone 100 in the embodiment includes but is not limited to the TWS earphone described above, and in some embodiments, it can also be a common wireless Bluetooth earphone or a wired earphone.
[0152] In the embodiment, the first sound generating unit 130, the second sound generating unit 140 and the micro-electro-mechanical system unit 150 (i.e. the third sound generating unit 150a) are arranged in the earphone 100, so that the output bandwidth of the earphone 100 can be fully guaranteed, the full-band coverage effect is good, and the sound effect is better. In addition, the micro-electro-mechanical system unit 150 (i.e. the third sound generating unit 150a) is used as the third sound generating unit 150a, and the micro-electro-mechanical system unit 150 has good transient vibration characteristics and high vibration frequency, so compared with the traditional moving coil unit or moving iron unit, the micro-electro-mechanical system unit 150 has better high frequency performance, thereby greatly improving the sound quality of the earphone 100 in the high frequency band.
[0153] It should be noted that the shape of the earphone 100 in the above embodiment does not constitute a limitation on the protection scope of the technical solution of the present application, as long as the first sound generating unit 130, the second sound generating unit 140 and the third sound generating unit 150a are arranged inside the earphone 100, and the micro-electro-mechanical system unit 150 is used as the third sound generating unit 150a, which belongs to the protection scope of the technical solution of the present application.
[0154] The second aspect of the embodiment provides a terminal device including the earphone 100 in the above embodiment.
[0155] The following explanation uses the smart bracelet 200 as the terminal device.
[0156] Figure 11 This is a schematic diagram of the structure of a terminal device provided in one embodiment of this application. Figure 12 for Figure 11 Exploded view. (e.g.) Figure 11 and Figure 12 As shown, the smart bracelet 200 includes a wristband 210, a wrist rest 220, and a device body 230. The wristband 210 is located on both sides of the wrist rest 220, allowing the user to wear the smart bracelet 200 on their wrist. The device body 230 is detachably connected to the wrist rest 220 and includes the earphone 100 described in the above embodiment, thus enabling the device body 230 to function as a Bluetooth earphone. Furthermore, a display screen 231 is provided on the outer side of the device body 230, integrating display functionality into the Bluetooth earphone.
[0157] Figure 13 This is a schematic diagram illustrating a usage state of a terminal device according to an embodiment of this application. For example... Figure 13 As shown, the user can wear the smart bracelet 200 on their wrist via the wristband 210, thereby enabling the device body 230 to monitor various indicators of the user's body. The smart bracelet 200 in this embodiment has a voice call function; when the smart bracelet 200 needs to make a voice call, the device body 230 can be detached from the wrist rest 220 (see...). Figure 14 Then, the main body of the device 230 is worn on the user's ears via the earphone 100 (e.g., Figure 15 (As shown).
[0158] The earphone 100 provided in the first aspect of this application is integrated on the device body 230 of the smart bracelet 200 in this embodiment. A first sound-emitting unit 130, a second sound-emitting unit 140, and a third sound-emitting unit 150a (i.e., a microelectromechanical system unit 150) can be disposed inside the device body 230. The specific stacking arrangement of the first sound-emitting unit 130, the second sound-emitting unit 140, and the third sound-emitting unit 150a can be found in the description of the embodiment of the earphone 100 provided in the first aspect of this application, and will not be repeated here.
[0159] The terminal device provided in this application, by integrating the earphones provided in the first aspect of the embodiments of this application into the terminal device, can improve the sound quality when the terminal device is used as an earphone, while ensuring other performance of the terminal.
[0160] In the description of the embodiments of the present application, it should be noted that unless specifically stated and limited otherwise, the terms "mount", "connect", "connection" should be understood broadly, for example, can be fixed connection, can also be indirect connection through an intermediate medium, can be the internal communication of two elements or the interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0161] The terms "first", "second", "third", "fourth" and the like (if any) in the description of the embodiments of the present application and the claims and the above drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence.
Claims
1. An earphone, characterized by comprising: The earphone is a wireless Bluetooth earphone, comprising a shell with a cavity structure inside, and an audio outlet communicating with the cavity structure is arranged on the shell; The cavity structure is provided with a first sound generating unit, a second sound generating unit, a third sound generating unit and a feedback microphone, wherein the sound generating frequency of the second sound generating unit is greater than that of the first sound generating unit and less than that of the third sound generating unit; The third sound generating unit is a micro-electro-mechanical system unit, and the third sound generating unit is located between the first sound generating unit and the audio outlet and is arranged close to the audio outlet; One side of the first sound generating unit facing the audio outlet forms a front cavity with part of the inner wall of the cavity structure, and the other side of the first sound generating unit away from the audio outlet forms a rear cavity separated from the front cavity with part of the inner wall of the cavity structure; the third sound generating unit is arranged in the front cavity, and one side of the third sound generating unit facing the audio outlet forms a first audio outlet channel communicating with the audio outlet with part of the inner wall of the front cavity; The feedback microphone is arranged in the first audio outlet channel and close to the audio outlet.
2. The earphone of claim 1, wherein, The sound generating frequency of the first sound generating unit is less than or equal to 1 kHz; The sound generating frequency of the second sound generating unit is between 1 kHz and 6 kHz; The sound generating frequency of the third sound generating unit is greater than 6 kHz.
3. The earphone of claim 2, wherein Part of the inner wall of the front cavity, one side of the micro-electro-mechanical system unit away from the audio outlet, and one side of the first sound generating unit facing the audio outlet jointly form a middle cavity; And the first audio outlet channel communicates with the middle cavity.
4. The earphone of claim 3, wherein A second audio outlet channel is arranged between part of the inner wall of the front cavity and part of the outer wall of the shell, one end of the second audio outlet channel communicates with the audio outlet, and the second audio outlet channel is separated from the first audio outlet channel and arranged independently; The cavity structure has a first accommodating space for accommodating the second sound generating unit, and the first accommodating space communicates with the rear cavity and the other end of the second audio outlet channel, and the sound emitting surface of the second sound generating unit faces the second audio outlet channel.
5. The earphone according to claim 3 or 4, characterized in that, The first audio outlet channel comprises a high-frequency audio outlet channel and a low-frequency audio outlet channel, and the high-frequency audio outlet channel and the low-frequency audio outlet channel are separated and arranged independently; The middle cavity communicates with the low-frequency audio outlet channel.
6. The earphone of claim 5, wherein A pipe support is arranged in the first audio outlet channel, one end of the pipe support is sealingly connected with the third sound generating unit, and the other end of the pipe support extends towards the direction close to the audio outlet; And the pipe inside the pipe support forms the high-frequency audio outlet channel; Part of the outer wall of the pipe support and part of the inner wall of the first audio outlet channel form the low-frequency audio outlet channel.
7. The earphone of claim 6, wherein A positioning portion is arranged on the outer wall of the pipe support, the feedback microphone is fixed on the positioning portion, and the sound pickup port of the feedback microphone communicates with the low-frequency audio outlet channel.
8. The earphone according to any one of claims 3-7, characterized in that Part of the inner wall of the front cavity and one end of the third sound generating unit form a third audio outlet channel, and the middle cavity communicates with the first audio outlet channel through the third audio outlet channel.
9. An earphone, characterized by The earphone is a wireless Bluetooth earphone, comprising a shell having a cavity structure therein, and an audio outlet is arranged on the shell and communicates with the cavity structure; The cavity structure is provided with a first sound generating unit, a second sound generating unit, a third sound generating unit and a feedback microphone, wherein the sound generating frequency of the second sound generating unit is greater than that of the first sound generating unit and less than that of the third sound generating unit; The third sound generating unit is a micro-electro-mechanical system unit, and the third sound generating unit is located between the first sound generating unit and the audio outlet and is arranged close to the audio outlet; One side of the first sound generating unit facing the audio outlet forms a front cavity with part of the inner wall of the cavity structure, and the other side of the first sound generating unit away from the audio outlet forms a rear cavity separated from the front cavity with part of the inner wall of the cavity structure; the third sound generating unit is arranged in the front cavity, and one side of the third sound generating unit facing the audio outlet forms a first audio outlet channel with part of the inner wall of the front cavity and the audio outlet. Part of the inner wall of the front cavity and the outer wall of the shell are provided with a sound pickup channel, one end of the sound pickup channel communicates with the audio outlet; the cavity structure has a second accommodating space, the second accommodating space communicates with the rear cavity and the other end of the sound pickup channel, and the second accommodating space is provided with a feedback microphone, and the sound pickup port of the feedback microphone faces the other end of the sound pickup channel.
10. The earphone of claim 9, wherein, The sound generating frequency of the first sound generating unit is less than or equal to 1 kHz; The sound generating frequency of the second sound generating unit is between 1 kHz and 6 kHz; The sound generating frequency of the third sound generating unit is greater than 6 kHz.
11. The earphone of claim 10, wherein, Part of the inner wall of the front cavity, one side of the micro-electro-mechanical system unit away from the audio outlet, and one side of the first sound generating unit facing the audio outlet jointly form a middle cavity; And the first audio outlet channel communicates with the middle cavity.
12. The earphone of claim 11, wherein, The second sound generating unit is arranged in the first audio outlet channel, and the second sound generating unit is located between the audio outlet and the third sound generating unit.
13. The earphone according to any one of claims 3-12, wherein, The shell comprises a front shell assembly and a rear shell assembly, and the front shell assembly is connected with the rear shell assembly; And one end of the front shell assembly has an outwardly protruding audio outlet nozzle, and one end of the audio outlet nozzle defines the audio outlet.
14. The earphone of claim 13, wherein, The front shell assembly comprises an inner shell and an outer shell, the outer shell is sleeved on the inner shell, and one end of the inner shell protrudes outward from one end of the outer shell to form the audio outlet nozzle; The outer shell is connected with the rear shell assembly; And one end of the inner shell away from the audio outlet nozzle is connected with the first sound generating unit.
15. The earphone of claim 14, wherein, A channel is formed in one side of the inner shell, which serves as a sound pickup channel of a feedback microphone, or the channel serves as an audio outlet channel of the second sound generating unit.
16. The earphone according to claim 14 or 15, characterized in that, A front air vent is arranged on the front shell assembly, and the front air vent communicates with the front cavity to form a front air vent channel between the front air vent and the front cavity.
17. The earphone of claim 16, wherein, A rear air vent is also arranged on the front shell assembly, and the rear air vent communicates with the rear cavity to form a rear air vent channel between the rear air vent and the rear cavity.
18. The earphone of any one of claims 1-17, wherein, The second sound generating unit is a planar membrane or a moving iron unit.
19. The earphone of any one of claims 1-18, wherein, The first sound generating unit is a moving coil unit.
20. A terminal device, comprising: An earphone comprising the earphone according to any one of claims 1-19.
Citation Information
Patent Citations
Earphone
CN106231462A
Earphone
JP2013143735A
Cited By
Earphone and terminal device
WO2023124917A1