Resampling with tdi sensor

Abstract

Apparatus for inspecting a circuit includes a scanner including at least one multiline time delay integration (TDI) sensor having a plurality of parallel lines of sensor pixels separated from one another by a separation distance along a scan axis, each of the sensor pixels having a sensor pixel size along the scan axis, a linear shifter providing mutual displacement of the TDI sensor and a circuit to be inspected along the scan axis, and a scan optic directing light reflected from the circuit to the sensor pixels, the scan optic defining a projection of each sensor pixel onto the circuit, the projection defining an area on the circuit from which light reaches each sensor pixel, each projection having a sensor pixel projection size along the scan axis, and an image generator constructing an image from composite output pixels of the TDI sensor.

Description

[0001] Cross-citation of related applications

[0002] Reference is made to the following U.S. patents assigned to the assignee, the entire contents of which are incorporated herein by reference: U.S. Patent No. 7,417,243, issued August 26, 2008; U.S. Patent No. 7,129,509, issued October 31, 2006; and U.S. Patent No. 7,009,163, issued March 7, 2006. Technical Field

[0003] This invention mainly relates to the automatic testing of circuits. Background Technology

[0004] Various types of automated testing equipment and methods for machine testing of circuits are known.

[0005] It is generally desirable to inspect circuits as quickly as possible to maximize the throughput of the inspection machine. The time required for a machine using a line sensor to inspect a given circuit is limited by two factors: the minimum line acquisition time of the line sensor and the maximum pixel size. The shorter the acquisition time and the larger the pixel size, the faster the scan.

[0006] Minimum line acquisition time is an inherent characteristic of the line sensor used.

[0007] Pixel size is controlled by the machine's optics and represents the degree of magnification; smaller pixel sizes correspond to higher magnification. The smaller the feature to be inspected, the smaller the maximum pixel size required to inspect that feature. The smaller the maximum pixel size, the slower the inspection.

[0008] Therefore, for each given inspection task, it is desirable to select the maximum pixel size that will be able to inspect the smallest feature that must be inspected.

[0009] The wider the range of selectable pixel sizes, the greater the complexity and cost of the optical components in the testing machine. Summary of the Invention

[0010] The present invention seeks to provide an improved apparatus and method for testing circuits with an enhanced range of selectable pixel sizes without the complexity and cost of accompanying selectable magnification optics.

[0011] The device and method aim to optimize the throughput of each inspection task by employing a time delay integration (TDI) inspection circuit at a selectable spatial resolution, without requiring changes to the optical magnification.

[0012] Therefore, according to embodiments of the present invention, an apparatus for inspecting a circuit is provided, comprising: a scanner including: at least one multi-line time delay integration (TDI) sensor having a plurality of parallel lines of sensor pixels, each extending along a line axis, the plurality of lines of the sensor pixels being separated from each other by a separation distance along a scan axis perpendicular to the line axis, each of the sensor pixels having a sensor pixel size along the scan axis; a linear shifter providing mutual displacement of the multi-line TDI sensor and the circuit to be inspected along the scan axis; and scanning optics guiding light reflected from the circuit to the sensor pixels, the scanning optics defining the projection of each sensor pixel onto the circuit. The projection defines the area from which light reaches the circuitry of each sensor pixel, each projection having a sensor pixel projection size along the scan axis, the TDI sensor and the linear shifter being operable such that the distance of mutual displacement of the multi-line TDI sensor and the circuitry to be tested along the scan axis during acquisition of each of their lines is greater than the sensor pixel projection size along the scan axis; and an image generator constructs an image from the composite output pixels of the multi-line TDI sensor, the image comprising a plurality of composite output pixels, each having a composite image collection contour along the scan axis, the composite image collection contour having a size along the scan axis greater than the sensor pixel projection size.

[0013] Each of the composite output pixels may comprise a plurality of partially overlapping output pixels acquired from a plurality of sensor pixels located at different lines of the TDI sensor, each of the output pixels acquired by each of the plurality of sensor pixels comprising at least one identical feature of the circuit. Furthermore, each of the plurality of partially overlapping output pixels has an output pixel projection size along the scan axis, which includes the sensor pixel projection size combined with the mutual displacement of the multi-line TDI sensor and the circuit to be examined along the scan axis during acquisition of each of the plurality of parallel lines exceeding the range of the sensor pixel projection size.

[0014] According to an embodiment of the present invention, the separation distance between the plurality of parallel lines of the sensor pixel is equal to an integer multiple of the sensor pixel size. Alternatively, the separation distance between the plurality of parallel lines of the sensor pixel is equal to zero.

[0015] According to an embodiment of the present invention, the linear shifter is a bidirectional linear shifter.

[0016] The distance by which the multi-line TDI sensor and the circuit to be tested are mutually displaced along the scan axis during the acquisition of each of their lines can exceed the sensor pixel projection size along the scan axis to a range selectable by the operator.

[0017] According to an embodiment of the invention, the device further includes an operator-selectable mutual displacement selector, the selector being operator-selected by the distance of mutual displacement along the scan axis configured for the multi-line TDI sensor and the circuit to be tested during acquisition of each of its lines.

[0018] According to another embodiment of the present invention, a method for testing a circuit is also provided, the method comprising: providing a scanner comprising at least one multi-line time delay integration (TDI) sensor having a plurality of parallel lines of sensor pixels, each extending along a line axis, the plurality of lines of the sensor pixels being separated from each other by a separation distance along a scan axis perpendicular to the line axis, each of the sensor pixels having a sensor pixel size along the scan axis; defining a mutual displacement distance along the scan axis between the multi-line TDI sensor and the circuit to be tested during acquisition of each line of the multi-line TDI sensor; displacing the multi-line TDI sensor and the circuit to be tested relative to each other along the scan axis by the mutual displacement distance; and causing... A scanning optics device guides light reflected from the circuit to the sensor pixel, the scanning optics device defining a projection of each sensor pixel onto the circuit, the projection defining the area on the circuit from which light reaches each sensor pixel, each projection having a sensor pixel projection size along the scanning axis, the mutual displacement distance being greater than the sensor pixel projection size along the scanning axis; and an image is constructed from the composite output pixels of the multi-line TDI sensor, the image comprising a plurality of composite output pixels, each of the composite output pixels having a composite image collection profile along the scanning axis, the composite image collection profile having a composite image collection profile size along the scanning axis that is greater than the sensor pixel projection size.

[0019] The constructed image may include, for each of the composite output pixels, obtaining a plurality of partially overlapping output pixels from a plurality of sensor pixels located at different lines of the TDI sensor, wherein each of the output pixels obtained by each of the plurality of sensor pixels contains at least one identical feature of the circuit and the plurality of partially overlapping output pixels are combined into the composite output pixel.

[0020] According to an embodiment of the present invention, defining the mutual displacement distance includes the operator selecting the mutual displacement distance from a plurality of possible displacement distances.

[0021] The method may further include generating a square pixel from the output pixel, the generation of the square pixel comprising generating an interpolated output pixel by interpolating the output pixel in the direction of the linear axis and resizing the interpolated output pixel to a size along the linear axis equal to the mutual displacement distance. Attached Figure Description

[0022] The invention will be more fully understood and appreciated from the following detailed description taken in conjunction with the accompanying drawings, wherein:

[0023] Figure 1 This is a simplified partial illustration and partial conceptual description of an automatic circuit testing device according to an embodiment of the present invention;

[0024] Figure 2 is a composite diagram illustrating the structure and functionality of an automatic testing device for circuits operated according to the prior art;

[0025] Figure 3 This is a composite diagram illustrating the structure and functionality of an automatic testing device for a circuit operating according to an embodiment of the present invention;

[0026] Figure 4A and 4B These are, respectively, time delay integral (TDI) interconnect diagrams and composite diagrams illustrating the structure and functionality of an automatic circuit testing device according to embodiments of the present invention;

[0027] Figure 5A and 5B These are a TDI interconnect diagram and a composite diagram illustrating the structure and functionality of an automatic circuit testing device according to another embodiment of the present invention;

[0028] Figure 6A and 6B These are a TDI interconnect diagram and a composite diagram illustrating the structure and functionality of an automatic circuit testing device according to another embodiment of the present invention;

[0029] Figure 7A and 7B These are, respectively, a TDI interconnect diagram and a composite diagram illustrating the structure and functionality of an apparatus for automatic circuit testing according to another embodiment of the present invention; and

[0030] Figure 8 This indicates that it can be implemented. Figures 4A to 7B TDI interconnect diagram of any of the optional TDI arrangements in the embodiments. Detailed Implementation

[0031] This invention seeks to provide an apparatus and method for automated inspection using a circuit employing a time-delay integration (TDI) sensor, capable of achieving enhanced automated inspection processing at various inspection resolutions without altering optical magnification. References are made below. Figures 1 to 8 Detailed description of the equipment. As described in detail below and illustrated in the figures, the equipment used for testing the circuit employs a scanner 100, which includes:

[0032] At least one multi-line TDI sensor 110 has at least two lines 120 and a plurality of parallel lines 120 of sensor pixels 130 extending along a line axis 140, the plurality of lines 120 of the sensor pixels 130 being separated from each other along a scan axis 150 perpendicular to the line axis 140, and each of the sensor pixels 130 having a sensor pixel size 160 along the scan axis 150.

[0033] Linear shifter 170 provides mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150.

[0034] A scanning optics 190 guides light reflected from circuitry 180 to sensor pixels 130. The scanning optics 190 defines a projection 200 of each sensor pixel 130 onto circuitry 180, the projection 200 defining the area on circuitry 180 from which light reaches each sensor pixel 130. Each projection has a sensor pixel projection size 210 along the scanning axis 150. The TDI sensor 110 and linear shifter 170 are operable such that the distance 220 of the relative displacement of the multi-line TDI sensor 110 and the circuitry 180 to be inspected along the scanning axis 150 during the acquisition of each of its lines is larger than the sensor pixel projection size 210 along the scanning axis 150 by a selectable range 222.

[0035] Image generator 230, which may be implemented in computer software or dedicated hardware, constructs an image by generating composite output pixels from the output of multi-line TDI sensor 110.

[0036] Image generator 230 is coupled to scanner 100. Image generator 230 typically includes or operates using a programmable processor, which is programmed in software and / or firmware to implement the functions described herein, along with suitable digital and / or analog interfaces for connection to other components of scanner 100. Alternatively or additionally, image generator 230 includes hardwired and / or programmable hardware logic circuitry that implements at least some of the functions of image generator 230. Although for simplicity, image generator 230 is described in... Figure 1While shown as a single unit, image generator 230 may actually include multiple interconnected units having suitable interfaces for receiving and outputting signals illustrated in the figures and described in the text. Program code or instructions for image generator 230 to implement the various methods and functions disclosed herein may be stored in a readable storage medium.

[0037] It should be understood that, although in the illustrated embodiment shown, the separation distance along the scan axis 150 between the plurality of lines 120 of the sensor pixel 130 of the multi-line TDI sensor 110 is equal to the sensor pixel size 160, the separation distance may be any integer value including zero multiplied by the sensor pixel size 160.

[0038] For details, please refer to the following: Figure 1 The scanner 100 may include one or more optical heads 232 spaced apart from the stage 234 supported thereon relative to the circuitry 180. One of these optical heads 232 is located in... Figure 1 The image shows and may include a multi-line TDI sensor 110. An example of the multi-line TDI sensor 110 is the Piranha XL CMOS TDI sensor, which is available from Teledyne DALSA of Waterloo, Ontario, Canada.

[0039] For example, circuit 180 can be a printed circuit, a chip or chip die, an assembled PCB, a flat panel display, and a solar cell.

[0040] It should be understood that continuous relative movement of circuit 180 relative to optical head 232 can be achieved by movement of optical head 232 along scanning axis 150 while circuit 180 remains stationary. Alternatively, this continuous relative movement can be achieved by movement of circuit 180 relative to fixed optical head 232 or by movement of both circuit 180 and optical head 232 relative to each other. It should be understood that although the operation of the inspection system will be described below with respect to movement of optical head 232 along scanning axis 150 relative to fixed circuit 180, the operating principles can be correspondingly applied to other relative movement modes therein. It should also be understood that relative movement of circuit 180 relative to optical head 232 can occur in either direction along scanning axis 150 and typically alternates between directions during different sections of scanning circuit 180.

[0041] Each optical head 232 may include a scanning optics 190 that guides light reflected from circuit 180 to sensor pixel 130. The scanning optics 190 defines a projection 200 of each sensor pixel 130 onto circuit 180. The projection 200 defines the area on circuit 180 from which light reaches each sensor pixel 130. Each projection has a sensor pixel projection size 210 along scanning axis 150.

[0042] A specific feature of embodiments of the present invention is that the TDI sensor 110 and the linear shifter 170 are operable to perform continuous scanning of the circuit 180 in such a manner that the distance of mutual displacement (also referred to as the output pixel projection size 220) of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each of its lines is greater than the sensor pixel projection size 210 along the scan axis 150.

[0043] Image generator 230 generates composite output pixels 250 from the output of multi-line TDI sensor 110 and constructs an image (not shown).

[0044] For further reference Figure 3 , 4B 5B, 6B, and 7B, each of the composite output pixels 250 has a composite image collection profile, the combination of which corresponds to multiple partially overlapping output pixels 252 of multiple sensor pixels 130 located at different lines 120 of the TDI sensor 110. (See below for reference...) Figures 4A to 7B In the described embodiment, each of the output pixels 252 includes at least one of the same features of the circuit 180.

[0045] Each of the multiple partially overlapping output pixels 252 may have an output pixel projection size 220 along the scan axis 150, the output pixel projection size 220 including the sensor pixel projection size 210 combined with the mutual displacement along the scan axis 150 exceeding the range 222 of the sensor pixel projection size 210 during the acquisition of the multi-line TDI sensor and the circuit to be tested in each of the multiple parallel lines.

[0046] It should be understood that selecting a relative displacement larger than the sensor pixel projection size 210 typically produces a rectangular output pixel having a length along the scan axis 150 equal to the output pixel projection size 220 and a width along the line axis equal to the sensor pixel projection size 210. It should be understood that although the output pixel is a rectangular output pixel in the illustrated embodiment (not drawn to scale), a square pixel can be produced by interpolating the output pixel along the line axis and resizing it according to an appropriate ratio to have a size along the line axis equal to the output pixel projection size 220.

[0047] Each of the composite output pixels 250 has an output pixel composite image collection profile size along the scan axis 150, which is larger than the sensor pixel projection size 210.

[0048] To clearly illustrate the differences between the embodiments of the present invention and the prior art, reference is now made to FIG2 (which is a composite diagram illustrating the structure and functionality of an automatic inspection circuit according to the prior art), wherein the output pixel composite image collection contour size 280 along the scanning axis 150 is equal to the sensor pixel projection size 210.

[0049] Turning to Figure 2, a simplified cross-sectional view of the multi-line TDI sensor 110 can be seen at point I, which shows the lines L1, L2, L3 and L4 of the prior art multi-line TDI sensor 110.

[0050] At point II, for each of stages A, B, C, and D, the following is shown:

[0051] i. A simplified cross-sectional view of the multi-line TDI sensor 110 is reproduced, with bold outline 336 indicating which sensor pixel 130's output is included in the image data at the stage;

[0052] ii. Description of the sensor pixel projection size 210 of the collected sensor pixels 130, which is included in the image data at this stage. It should be noted that pixels from every other frame are included in the image data;

[0053] iii. Description of the image data collection contour 340 of the stage, wherein the width of the collection contour 340 represents the output pixel composite image collection contour size 280 and the height of the composite image collection contour 340 is proportional to the number of sensor pixels 130 that contribute to the composite image data of the stage.

[0054] It should be noted that the composite image has a composite image collection contour size 280 along the scan axis 150, which is equal to the sensor pixel projection size 210 and exhibits relatively low blur. As will be understood below, Figures 3 to 7B The various embodiments of the invention described herein illustrate composite image collection contour sizes larger than the sensor pixel projection size 210 and Figure 7A and 7B The embodiments of the present invention described herein illustrate a composite image collection contour size that is the same as the output pixel projection size 220.

[0055] For reference Figure 3 It is a composite diagram illustrating the structure and functionality of an automatic testing device for operating a circuit according to an embodiment of the present invention.

[0056] like Figure 3As seen in the diagram, a simplified cross-sectional view of the multi-line TDI sensor 110 is shown at point I, which illustrates the lines of the multi-line TDI sensor 110 designated by names L1, L2, L3, and L4, respectively.

[0057] For each of lines L1 to L4, it is also shown that the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line exceeds a range 352 of the sensor pixel projection size 210 along the scan axis 150. In this embodiment, the range 352 of the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line 120 exceeds 50% of the sensor pixel projection size 210.

[0058] At point II, for each of stages A, B, C, and D, the following is shown:

[0059] i. A simplified cross-sectional view of the multi-line TDI sensor 110 is reproduced, with the output pixels 252 corresponding to the sensor pixels 130 included in the image data at the said stage indicated by bold outline 354. It should be noted that each of the output pixels 252 here has an output pixel projection size 356, which includes the sensor pixel projection size 210 combined with the relative displacement of the multi-line TDI sensor 110 and the circuit 180 to be examined along the scan axis 150 during the acquisition of each line 120, exceeding the range 352 of the sensor pixel projection size 210.

[0060] ii. Explanation of the output pixel projection size 356 of the sensor pixel 130 included in the image data at the stage described above. It can be seen that pixels from every other frame are included in the image data.

[0061] iii. Description of the composite image collection contour 360 of the image data of the stage, wherein the width of the composite image collection contour 360 represents the composite image collection contour size 370 and the height of the composite image collection contour 360 indicates the number of sensor pixels 130 that contribute to the image data of the stage.

[0062] The resulting image is characterized by having a relatively large pixel size, which is attributed to the width of the composite image collection contour 360 (i.e., the composite image collection contour size 370), which is larger than the pixel size provided by the prior art TDI arrangement shown in FIG2, which exhibits relatively high blur (greater than the blur in the image produced by the prior art TDI arrangement illustrated in FIG2).

[0063] Comparing Figures 2 and 3, it should be understood that, Figure 3In this embodiment, image data from every other frame is included in the composite image, similar to the conventional TDI image construction described above with reference to FIG2. Unlike the prior art TDI arrangement illustrated in FIG2, the composite image collection contour size 370 is 4.5 times the sensor pixel projection size 210.

[0064] An additional measure of imaging performance is the line sensor percentage, which is the percentage of line sensors contributing to the collection of image data at any given location along the composite image collection contour 360, measured at a location indicated by reference numeral 380 and having an area located at the center of the composite image collection contour 360, having a width equal to the output pixel projection size 356 and a height equal to the number of lines 120 on the multi-line TDI sensor 110. Therefore, the line sensor percentage measured at location 380 is a percentage of the area of ​​the composite image collection contour 360 within location 380 to the total area of ​​location 380.

[0065] exist Figure 3 In the embodiment shown, the percentage of line sensors is 33%.

[0066] For reference Figure 4A and 4B These are, respectively, a TDI interconnect diagram and a composite diagram illustrating the structure and functionality of an automatic inspection circuit for operation according to an embodiment of the present invention. In this embodiment, the distance by which the multi-line TDI sensor 110 and the circuit 180 to be inspected are displaced relative to each other along the scan axis 150 during the acquisition of each of their lines 120 is 1.5 times the sensor pixel projection size 210 along the scan axis 150.

[0067] like Figure 4A As seen in stage A, line 4 of frame M of the multi-line TDI sensor 110 is supplied to a 1-frame FIFO line delay circuit 410. The delayed output of line 4 designated as frame M-1 from the FIFO line delay circuit 410 is supplied to adder 412, which adds it to line 3 of frame M. In stage B, the summed output of adder 412 is supplied to another 1-frame FIFO line delay circuit 420. The delayed output of line 3 designated as frame M-1 + line 4 of frame M-2 from the FIFO line delay circuit 420 is supplied to an additional 1-frame FIFO line delay circuit 430 in stage C. The delayed output of line 3 designated as frame M-2 + line 4 of frame M-3 from the FIFO line delay circuit 430 is supplied to an additional adder 432, which adds it to line 2 of frame M.

[0068] In stage D, the summed output of adder 432 is supplied to another 1-frame FIFO line delay circuit 440. The delayed output from FIFO line delay circuit 440 of line 2 designated as frame M-1 + line 3 designated as frame M-3 + line 4 designated as frame M-4 is supplied to a further adder 442 that adds it to line 1 of frame M.

[0069] In stage E, the summation output of adder 442, designated as line 1 of frame M + line 2 of frame M-1 + line 3 of frame M-3 + line 4 of frame M-4, is supplied as TDI output.

[0070] Now transferred to Figure 4B A simplified cross-sectional representation of the multi-line TDI sensor 110 can be seen at point I, showing lines 1, 2, 3 and 4 of the multi-line TDI sensor 110, designated by names L1, L2, L3 and L4 respectively.

[0071] For each of lines L1 to L4, it is also shown that the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line exceeds a range 452 of the sensor pixel projection size 210 of each line along the scan axis 150. In this embodiment, the range 452 of the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line 120 exceeds 50% of the sensor pixel projection size 210.

[0072] At point II, for each of stages A, B, C, D, and E, the following is shown:

[0073] i. A simplified cross-sectional view of the multi-line TDI sensor 110 is reproduced, with bold outline 454 indicating the output pixels 252 corresponding to the sensor pixels 130 included in the image data at the stage. It should be noted that in this embodiment, each of the output pixels 252 has an output pixel projection size 456, which includes the sensor pixel projection size 210 combined with the relative displacement of the multi-line TDI sensor 110 and the circuit 180 to be examined along the scan axis 150 during the acquisition of each line 120, exceeding the range 452 of the sensor pixel projection size 210.

[0074] ii. Description of the output pixel projection size 456 of the sensor pixel 130 included in the image data at the stage.

[0075] iii. Description of the composite image collection contour 458 of the image data of the stage, wherein the width of the composite image collection contour 458 represents the composite image collection contour size 460 and the height of the composite image collection contour 458 indicates the number of sensor pixels 130 that contribute to the image data of the stage.

[0076] The resulting composite image collection profile 458 is characterized by having a relatively small composite image pixel collection profile size 460, which is larger than the size provided by the prior art TDI arrangement shown in FIG2 and smaller than that provided by the prior art TDI arrangement shown in FIG2. Figure 3 The dimensions provided by the TDI arrangement in the embodiments are due to the fact that, compared to Figure 3 The composite image collection outline size of the embodiment is 370. Figure 4A and 4B The embodiment of the composite image collection outline size 460 has a relatively small width, showing a larger size than that of the image collected by the composite image collection outline size 460. Figure 3 The TDI arrangement described herein produces images with relatively low blur.

[0077] Comparing Figures 2, 3, and 4B, it should be understood that, Figure 4B In this embodiment, image data from all frames is not included in the composite image. Specifically, in the illustrated embodiment, image data from frame M-2 of stage E is not used because only image data from four frames can be used and image data from frame M-2 (relative to image data from any of the other frames) is eliminated, resulting in the narrowest composite image collection profile size.

[0078] Specifically, comparison Figure 3 and 4B It should be understood that, in Figure 3 In one embodiment, image data from every other frame is included in the image; however, in Figure 4B In this context, only image data from selected frames is included in the image. Only output pixels 252 containing at least one identical feature of all components of circuitry 180 are included. Specifically, in... Figure 4A and 4B In the illustrated embodiment, image data from frame M-2 of stage E is not used because using this image data would make the composite image collection outline 458 appear wider and result in greater blurriness.

[0079] Quantitatively, Figure 3 The composite image collection contour size of 370 is equal to 4.5 times the sensor pixel projection size of 210, and also equal to 3 times the output pixel projection size of 356. Figure 4A and 4BIn one embodiment, the width of the composite image collection contour 458 (i.e., the composite image collection contour size 460) is 2.5 times the sensor pixel projection size 210 or 1.66 times the output pixel projection size 456.

[0080] The height of the composite image collection contour 458 at each given image location represents the number of times that image location appears in the pixels contained within the composite image collection contour. In the illustrated embodiment where the multi-line TDI sensor 110 includes four lines 120 of sensor pixel 130, this number can be between 1 and 4. "1" means that only one line 120 of pixel 130 contains this image location, and "4" means that the image location appears in all four lines 120 of pixel 130.

[0081] It should be understood that the multi-line TDI sensor 110 may contain fewer or more lines 120 than the four lines 120 of the sensor pixel 130, and in the embodiment described, the maximum height value of the composite image is the number of lines 120 of the sensor pixel 130. It should be further understood that although in the illustrated embodiment shown, output pixels 252 from each of the lines 120 are included in the composite image, not all lines 120 of the sensor pixel 130 of the multi-line TDI sensor 110 are necessarily included in the composite image. Additionally, it should be understood that although in the illustrated embodiment shown, the number of output pixels 252 selected for inclusion in the composite image is equal to the number of lines 120, the composite image may contain fewer or more output pixels 252.

[0082] exist Figure 3 In the illustrated embodiment, the height of the composite image collection contour 360 does not exceed 2, meaning that each image location is sampled at most twice within the composite image collection contour 360. The composite image collection contour size 370 is equal to 4.5 times the sensor pixel projection size 160 and also equal to 3 times the output pixel projection size 356. Figure 4B The maximum height of the composite image collection contour 458 in the image is 4, which means that there is at least one image location that is obtained by all 4 pixels.

[0083] Figure 4A and 4B The composite image collection contour 458 of the embodiment is also greater than Figure 3 The composite image collection contour 360 of the embodiment is more concise, having a composite image collection contour size 460 that is only 2.5 times the sensor pixel projection size 210. Figure 3 The comparable composite image collection contour size of the embodiment is 0.56 (5 / 9) of 370.

[0084] An additional measure of imaging performance is the line sensor percentage, which is the percentage of line sensors contributing to the collection of image data at any given location along the composite image collection contour 458, measured at a location indicated by reference numeral 480, having an area located at the center of the composite image collection contour 458, having a width equal to the output pixel projection size 456 and a height equal to the number of lines 120 on the multi-line TDI sensor 110. Therefore, the line sensor percentage measured at location 480 is a percentage of the area of ​​the composite image collection contour 458 within location 480 to the total area of ​​location 480.

[0085] In the prior art shown in Figure 2, where the sensor pixel projection size 210 is equal to the output pixel projection size 220 and equal to the composite image collection profile size 280, the line sensor percentage is 100%, the height of the composite image collection profile is a constant 4, and the composite image collection profile size 280 is small.

[0086] exist Figure 4A and 4B In the embodiment, the percentage of line sensors is 83%, and as described above, in Figure 3 In the embodiment, the percentage of line sensors is 33%, proving that Figure 4A and 4B The advantages of the embodiments are superior Figure 3 The method.

[0087] For reference Figure 5A and 5B These are, respectively, TDI interconnect diagrams and composite diagrams illustrating the structure and functionality of an automatic inspection circuit for operation according to another embodiment of the present invention. In this embodiment, the distance by which the multi-line TDI sensor 110 and the circuit 180 to be inspected are displaced relative to each other along the scan axis 150 during the acquisition of each of their lines 120 is 1.25 times the sensor pixel projection size 210 along the scan axis 150.

[0088] like Figure 5AAs seen in stage A, line 4 of frame M of the multi-line TDI sensor 110 is supplied to a 1-frame FIFO line delay circuit 510. In stage B, the delayed output of line 4 designated as frame M-1 from the FIFO line delay circuit 510 is supplied to another 1-frame FIFO line delay circuit 512. The output of line 4 designated as frame M-2 from the 1-frame FIFO line delay circuit 512 is supplied to an adder 514 that adds it to line 3 of frame M. In stage C, the summed output of adder 514 is supplied to another 1-frame FIFO line delay circuit 520. The delayed output of line 3 designated as frame M-1 + line 4 designated as frame M-3 from the FIFO line delay circuit 520 is supplied to adder 522. In stage D, the output of adder 522 is supplied to an additional 1-frame FIFO line delay circuit 530. The delayed output from the FIFO line delay circuit 530 of line 2 designated as frame M-1 + line 3 of frame M-2 + line 4 of frame M-4 is supplied to another 1-frame FIFO line delay circuit 532 in stage E. The output of the 1-frame FIFO line delay circuit 532 is supplied to an additional adder 542 that adds it to line 1 of frame M.

[0089] In stage F, the summation output of adder 542, designated as line 1 of frame M + line 2 of frame M-2 + line 3 of frame M-3 + line 4 of frame M-5, is supplied as TDI output.

[0090] Now transferred to Figure 5B A simplified cross-sectional representation of the multi-line TDI sensor 110 can be seen at point I, showing lines 1, 2, 3 and 4 of the multi-line TDI sensor 110, designated by names L1, L2, L3 and L4 respectively.

[0091] For each of lines L1 to L4, it is also shown that the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line exceeds a range 552 of the sensor pixel projection size 210 of each line along the scan axis 150. In this embodiment, the range 552 of the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line 120 exceeds the sensor pixel projection size 210 by 25%.

[0092] At point II, for each of stages A, B, C, D, E, and F, the following is shown:

[0093] i. A simplified cross-sectional view of the multi-line TDI sensor 110 is reproduced, with the output pixels 252 corresponding to the sensor pixels 130 included in the image data at the said stage indicated by bold outline 554. It should be noted that each of the output pixels 252 has an output pixel projection size 556, which includes the sensor pixel projection size 210 combined with the relative displacement of the multi-line TDI sensor 110 and the circuit 180 to be examined along the scan axis 150 during the acquisition of each line 120, exceeding the range 552 of the sensor pixel projection size 210.

[0094] ii. Description of the output pixel projection size 556 of the sensor pixel 130 included in the image data in the stage.

[0095] iii. Description of the composite image collection contour 558 of the image data of the stage, wherein the width of the composite image collection contour 558 represents the composite image collection contour size 560 and the height of the composite image collection contour 558 indicates the number of sensor pixels 130 that contribute to the image data of the stage.

[0096] The obtained composite image pixel collection profile size 560 can be compared with the composite image collection profile size 280 of the prior art TDI arrangement shown in Figure 2, and by using Figure 3 The method (i.e., where a composite image generated every other frame is used to collect contour dimensions, combined with an image equal to...) Figure 5A and 5B The output pixel projection size is 556 (which is 1.25 times the sensor pixel projection size of 210).

[0097] Figure 5A and 5B The composite image collection profile 558 of the embodiment is characterized by having a relatively small composite image pixel collection profile size 560, which is larger than the size provided by the prior art TDI arrangement shown in FIG2, but smaller than that provided by... Figure 3 The dimensions provided by the TDI arrangement in the embodiment of the method are due to the fact that, compared to a ratio of 1.25 of the output pixel projection size to the sensor pixel projection size, then... Figure 3 The composite image collection outline size of the embodiment is 370. Figure 5A and 5B The relatively small composite image collection outline size 560 of the embodiment shows a greater display than that of the embodiment made by Figure 3 The TDI arrangement described herein produces images with relatively low blur.

[0098] Comparing Figures 2, 3, and 5B, it should be understood that, Figure 5BIn this embodiment, image data from all frames is not included in the image. Specifically, in the illustrated embodiment, image data from frames M-1 and M-4 from stage F is not used because only image data from four frames can be used and image data from frames M-1 and M-4 (relative to image data from any of the other frames) is eliminated, resulting in the narrowest composite image collection profile size 560.

[0099] Specifically, comparison Figure 3 and 5B It should be understood that, in Figure 3 In one embodiment, image data from every other frame is included in the image; however, in Figure 5B In this context, only image data from selected frames is included in the image. Only output pixels containing at least one identical feature of circuitry 180 are included. Specifically, in... Figure 5A and 5B In the illustrated embodiment, image data from frames M-1 and M-4 are not used because using this image data would make the composite image collection outline 558 appear wider and cause it to be more blurred.

[0100] Quantitatively, this is achieved by using a ratio of 1.25 of the output pixel projection size to the sensor pixel projection size (rather than...). Figure 3 This is achieved by using a ratio of 1.5 between the output pixel projection size and the sensor pixel projection size. Figure 3 In this embodiment, the composite image collection contour size 370 is 2.75 times the sensor pixel projection size 210, or 2.2 times the output pixel projection size 556. Figure 5A and 5B In one embodiment, the width of the composite image collection contour 558 (i.e., the composite image collection contour size 560) is twice the sensor pixel projection size 210 or 1.6 times the output pixel projection size 556.

[0101] The height of the composite image collection contour 558 at each given image location represents the number of times that image location appears in the pixels contained within the composite image collection contour. In this context, the multi-line TDI sensor 110 contains four lines 120 of sensor pixels 130. Figure 5B In the illustrated embodiment, this number can be between 1 and 4. "1" means that only one line 120 of pixel 130 contains this image location, and "4" means that the image location appears in all four lines 120 of pixel 130.

[0102] use Figure 3The method and the ratio of the output pixel projection size to the sensor pixel projection size are 1.25, with a height not exceeding 3, which means that each image position is sampled a maximum of 3 times in the composite image collection contour 360. Each composite image collection contour 360 has a width of 2.75 sensor pixels or 2.2 output pixels. Figure 5B The maximum height of the composite image collection contour 558 is 4, which means that there is at least one image location that is obtained by all 4 pixels.

[0103] Figure 5A and 5B The composite image collection contour 558 of the embodiment is also greater than Figure 3 The composite image collection contour 360 of the embodiment is more concise, having a composite image collection contour size 560 that is only twice the sensor pixel projection size 210, which is more efficient if using... Figure 3 The method and the ratio of the output pixel projection to the sensor pixel projection of 1.25 will achieve a comparable composite image collection contour size of 0.73 (8 / 11) times 370.

[0104] An additional metric for imaging performance is the line sensor percentage, measured at a location indicated by reference digit 580, which has an area located at the center of a composite image collection contour 558, representing the percentage of line sensors contributing to the collection of image data at any given location along the composite image collection contour 558, which has a width equal to the output pixel projection size 556 and a height equal to the number of lines 120 on the multi-line TDI sensor 110. Therefore, the line sensor percentage measured at location 580 is a percentage of the area of ​​the composite image collection contour 558 within location 580 to the total area of ​​location 580.

[0105] In the prior art shown in Figure 2, the line sensor percentage is 100%, the height of the composite image collection profile is a constant 4, but the composite image collection profile size is small at 280.

[0106] exist Figure 4A and 4B In the embodiments, with Figure 3 Compared to the 33% line sensor percentage, the line sensor percentage is 83%, and the composite image collection contour size of 460 is larger than that in the prior art but smaller than that in the prior art. Figure 3 The dimensions in the embodiments demonstrate Figure 4A and 4B The advantages of the embodiments are superior Figure 3 The method.

[0107] exist Figure 5A and 5BIn this embodiment, the line sensor percentage is 80% (relative to a 60% line sensor percentage, which has been adopted). Figure 3 The method and the ratio of output pixel projection to sensor pixel projection are 1.25, and the composite image collection contour size of 560 is larger than that in the prior art but smaller than that using... Figure 3 The method and the composite image collection contour size with a ratio of 1.25 between the output pixel projection and the sensor pixel projection are demonstrated. Figure 5A and 5B The advantages of the embodiments are superior Figure 3 The method.

[0108] For reference Figure 6A and 6B These are, respectively, TDI interconnect diagrams and composite diagrams illustrating the structure and functionality of an automatic inspection circuit for operation according to another embodiment of the present invention. In this embodiment, the distance by which the multi-line TDI sensor 110 and the circuit 180 to be inspected are displaced relative to each other along the scan axis 150 during the acquisition of each of their lines 120 is 1.75 times the sensor pixel projection size 210 along the scan axis 150.

[0109] like Figure 6A As seen in stage A, line 4 of frame M of the multi-line TDI sensor 110 is supplied to a 1-frame FIFO line delay circuit 610. The delayed output of line 4 designated as frame M-1 from the FIFO line delay circuit 610 is supplied to adder 614, which adds it to line 3 of frame M. In stage B, the summed output of adder 614 is supplied to another 1-frame FIFO line delay circuit 620. The delayed output of line 3 designated as frame M-1 + line 4 designated as frame M-2 from the FIFO line delay circuit 620 is supplied to adder 622, which adds it to line 2 of frame M. In stage C, the output of adder 622 is supplied to an additional 1-frame FIFO line delay circuit 630. The delayed output of line 2 designated as frame M-1 + line 3 designated as frame M-2 + line 4 designated as frame M-3 from the FIFO line delay circuit 630 is supplied to adder 632, which adds it to line 1 of frame M. In stage D, the summation output of adder 632, which is designated as line 1 of frame M + line 2 of frame M-1 + line 3 of frame M-2 + line 4 of frame M-3, is supplied as TDI output.

[0110] Now transferred to Figure 6B A simplified cross-sectional representation of the multi-line TDI sensor 110 can be seen at point I, showing lines 1, 2, 3 and 4 of the multi-line TDI sensor 110, designated by names L1, L2, L3 and L4 respectively.

[0111] For each of lines L1 to L4, it is also shown that the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line exceeds a range 652 of the sensor pixel projection size 210 of each line along the scan axis 150. In this embodiment, the range 652 of the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line 120 exceeds 75% of the sensor pixel projection size 210 in this embodiment.

[0112] At point II, for each of stages A, B, C, and D, the following is shown:

[0113] i. A simplified cross-sectional view of the multi-line TDI sensor 110 is reproduced, with the output pixels 252 corresponding to the sensor pixels 130 included in the image data at the said stage indicated by bold outline 654. It should be noted that each of the output pixels 252 has an output pixel projection size 656, which includes the sensor pixel projection size 210 combined with the relative displacement of the multi-line TDI sensor 110 and the circuit 180 to be examined along the scan axis 150 during the acquisition of each line 120, exceeding the range 652 of the sensor pixel projection size 210.

[0114] ii. Description of the output pixel projection size 656 of the sensor pixel 130 included in the image data at the stage.

[0115] iii. Description of the composite image collection contour 658 of the image data of the stage, wherein the width of the composite image collection contour 658 represents the composite image collection contour size 660 and the height of the composite image collection contour 658 indicates the number of sensor pixels 130 that contribute to the image data of the stage.

[0116] The resulting composite image pixel collection profile size 660 can be compared with the composite image pixel collection profile size 280 of the prior art TDI arrangement shown in Figure 2, and by using... Figure 3 The method (i.e., where a composite image generated every other frame is used to collect contour dimensions, combined with an image equal to...) Figure 6A and 6B The output pixel projection size is 656 (which is 1.75 times the sensor pixel projection size of 210).

[0117] Figure 6A and 6B The composite image collection profile 658 of the embodiment is characterized by having a relatively small composite image pixel collection profile size 660, which is larger than the size provided by the prior art TDI arrangement shown in FIG2, but smaller than that provided by... Figure 3The dimensions provided by the TDI arrangement in the embodiment of the method are due to the fact that, compared to a ratio of 1.75 of the output pixel projection size to the sensor pixel projection size, the dimensions are already... Figure 3 The composite image collection outline size of the embodiment is 370. Figure 6A and 6B The relatively small composite image collection outline size 660 of the embodiment shows a greater display than that of the embodiment made by Figure 3 The TDI arrangement described herein produces images with relatively low blur.

[0118] Comparing Figures 2, 3, and 6B, it should be understood that, Figure 6B In one embodiment, image data from all frames is included in the image.

[0119] Quantitatively, this is achieved by using a ratio of 1.75 of the output pixel projection size to the sensor pixel projection size (rather than...). Figure 3 This is achieved by using a ratio of 1.5 between the output pixel projection size and the sensor pixel projection size. Figure 3 In the embodiment, the composite image collection contour size 370 is 6.25 times the sensor pixel projection size 210, or 3.57 (25 / 7) times the output pixel projection size 656. Figure 6A and 6B In one embodiment, the width of the composite image collection contour 658 (i.e., the composite image collection contour size 660) is 2.5 times the sensor pixel projection size 210, or 1.43 (10 / 7) times the output pixel projection size 656.

[0120] As described above, the height of the composite image collection contour 658 at each given image location represents the number of times that image location appears in the pixels contained within the composite image collection contour. In this context, the multi-line TDI sensor 110 includes four lines 120 of sensor pixels 130. Figure 6B In the illustrated embodiment, this number can be between 1 and 4. "1" means that only one line 120 of pixel 130 contains this image location, and "4" means that the image location appears in all four lines 120 of pixel 130.

[0121] use Figure 3 The method and the ratio of the output pixel projection size to the sensor pixel projection size are 1.75, with a height not exceeding 2, which means that each image location is sampled at most twice in the composite image collection contour 360. Each comparable composite image collection contour 360 has a width of 6.25 sensor pixels or 3.57 output pixels. Figure 6B The maximum height of the composite image collection contour 658 in the image is 4, which means that there is at least one image location that is obtained by all 4 pixels.

[0122] Figure 6A and 6B The composite image collection contour 658 of the embodiment is also greater than Figure 3 The composite image collection contour 360 of the embodiment is more concise, having a composite image collection contour size 660 that is only 2.5 times the sensor pixel projection size 210, which is more efficient if using... Figure 3 The method and the ratio of the output pixel projection to the sensor pixel projection of 1.75 will enable the realization of a comparable composite image collection contour size of 370 of 0.4 (2 / 5).

[0123] An additional measure of imaging performance is the line sensor percentage, which is the percentage of line sensors contributing to the collection of image data at any given location along the composite image collection contour 658, measured at a location indicated by reference numeral 680, having an area located at the center of the composite image collection contour 658, the composite image collection contour 658 having a width equal to the output pixel projection size 656 and a height equal to the number of lines 120 on the multi-line TDI sensor 110. Therefore, the line sensor percentage measured at location 680 is a percentage of the area of ​​the composite image collection contour 658 within location 680 to the total area of ​​location 680.

[0124] In the prior art shown in Figure 2, the line sensor percentage is 100%, the height of the composite image collection profile is a constant 4, but the composite image collection profile size is small at 280.

[0125] exist Figure 4A and 4B In the embodiments, with Figure 3 Compared to the 33% line sensor percentage, the line sensor percentage is 83%, and the composite image collection contour size of 460 is larger than that in the prior art but smaller than that in the prior art. Figure 3 The dimensions in the embodiments demonstrate Figure 4A and 4B The advantages of the embodiments are superior Figure 3 The method.

[0126] exist Figure 5A and 5B In this embodiment, the line sensor percentage is 80% (relative to a 60% line sensor percentage, which has been adopted). Figure 3 The method and the ratio of output pixel projection to sensor pixel projection are 1.25, and the composite image collection contour size of 560 is larger than that in the prior art but smaller than that using... Figure 3 The method and the composite image collection contour size with a ratio of 1.25 between the output pixel projection and the sensor pixel projection are demonstrated. Figure 5A and 5B The advantages of the embodiments are superior Figure 3 The method.

[0127] exist Figure 6A and 6B In this embodiment, the line sensor percentage is 86% (compared to 29% of the line sensor percentage, which has been adopted). Figure 3 The method and the ratio of output pixel projection to sensor pixel projection are 1.75, and the composite image collection contour size of 660 is larger than that in the prior art but smaller than that using... Figure 3 The method and the composite image collection contour size with a ratio of 1.75 between the output pixel projection and the sensor pixel projection are used to demonstrate... Figure 6A and 6B The advantages of the embodiments are superior Figure 3 The method.

[0128] For reference Figure 7A and 7B These are, respectively, a TDI interconnect diagram and a composite diagram illustrating the structure and functionality of an automatic inspection circuit for operation according to another embodiment of the present invention. In this embodiment, the distance by which the multi-line TDI sensor 110 and the circuit 180 to be inspected are displaced relative to each other along the scan axis 150 during the acquisition of each of their lines 120 is twice the sensor pixel projection size 210 along the scan axis 150.

[0129] like Figure 7A As seen in stage A, line 4 of frame M of the multi-line TDI sensor 110 is supplied to a 1-frame FIFO line delay circuit 710. The delayed output of line 4 designated as frame M-1 from the FIFO line delay circuit 710 is supplied to adder 714, which adds it to line 3 of frame M. In stage B, the summed output of adder 714 is supplied to another 1-frame FIFO line delay circuit 720. The delayed output of line 3 designated as frame M-1 + line 4 designated as frame M-2 from the FIFO line delay circuit 720 is supplied to adder 722, which adds it to line 2 of frame M. In stage C, the output of adder 722 is supplied to an additional 1-frame FIFO line delay circuit 730. The delayed output of line 2 designated as frame M-1 + line 3 designated as frame M-2 + line 4 designated as frame M-3 from the FIFO line delay circuit 730 is supplied to adder 732, which adds it to line 1 of frame M. In stage D, the summation output of adder 732, which is designated as line 1 of frame M + line 2 of frame M-1 + line 3 of frame M-2 + line 4 of frame M-3, is supplied as TDI output.

[0130] Now transferred to Figure 7B A simplified cross-sectional representation of the multi-line TDI sensor 110 can be seen at point I, showing lines 1, 2, 3 and 4 of the multi-line TDI sensor 110, designated by names L1, L2, L3 and L4 respectively.

[0131] For each of lines L1 to L4, it is also shown that the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line exceeds a range 752 of the sensor pixel projection size 210 of each line along the scan axis 150. In this embodiment, the range 752 of the mutual displacement of the multi-line TDI sensor 110 and the circuit 180 to be tested along the scan axis 150 during the acquisition of each line 120 exceeds 100% of the sensor pixel projection size 210.

[0132] At point II, for each of stages A, B, C, and D, the following is shown:

[0133] i. A simplified cross-sectional view of the multi-line TDI sensor 110 is reproduced, with the output pixels 252 corresponding to the sensor pixels 130 included in the image data at the said stage indicated by bold outline 754. It should be noted that each of the output pixels 252 has an output pixel projection size 756, which includes the sensor pixel projection size 210 combined with the relative displacement of the multi-line TDI sensor 110 and the circuit 180 to be examined along the scan axis 150 during the acquisition of each line 120, exceeding the range 752 of the sensor pixel projection size 210.

[0134] ii. Description of the output pixel projection size 756 of the sensor pixel 130 included in the image data in the stage.

[0135] iii. Description of the composite image collection contour 758 of the image data of the stage, wherein the width of the composite image collection contour 758 represents the composite image collection contour size 760 and the height of the composite image collection contour 758 indicates the number of sensor pixels 130 that contribute to the image data of the stage.

[0136] The obtained composite image pixel collection outline size 760 can be compared with the composite image pixel collection outline size 280 of the prior art TDI arrangement shown in Figure 2, and by using Figure 3 The method (i.e., where the composite image pixels generated every other frame are used to collect the contour size, and) Figure 7A and 7B The output pixel projection size is 756 (which is 2.00 times the sensor pixel projection size of 210).

[0137] Figure 7A and 7BThe composite image collection profile 758 of the embodiment is characterized by having a relatively small composite image pixel collection profile size 760, which is larger than the size provided by the prior art TDI arrangement shown in FIG2, but smaller than that provided by... Figure 3 The dimensions provided by the TDI arrangement in the embodiment of the method are due to the fact that, compared to a ratio of 2.00 between the output pixel projection size and the sensor pixel projection size, then... Figure 3 The composite image collection outline size of the embodiment is 370. Figure 7A and 7B The relatively small composite image collection outline size 760 of the embodiment shows a greater display than that of the embodiment made by Figure 3 The TDI arrangement described herein produces images with relatively low blur.

[0138] Comparing Figures 2, 3, and 7B, it should be understood that, Figure 7B In one embodiment, image data from all frames is included in the image.

[0139] Quantitatively, this is achieved by using a ratio of 2.00 between the output pixel projection size and the sensor pixel projection size (rather than...). Figure 3 This is achieved by using a ratio of 1.5 between the output pixel projection size and the sensor pixel projection size. Figure 3 In this embodiment, the composite image collection contour size 370 is 8 times the sensor pixel projection size 210, or 4 times the output pixel projection size 756. Figure 7A and 7B In one embodiment, the width of the composite image collection contour 758 (i.e., the composite image collection contour size 760) is twice the sensor pixel projection size 210, or equal to the output pixel projection size 756.

[0140] As described above, the height of the composite image collection contour 758 at each given image location represents the number of times that image location appears in the pixels contained within the composite image collection contour. In this context, the multi-line TDI sensor 110 includes four lines 120 of sensor pixels 130. Figure 7B In the illustrated embodiment, this number can be between 1 and 4. "1" means that only one line 120 of pixel 130 contains this image location, and "4" means that the image location appears in all four lines 120 of pixel 130.

[0141] use Figure 3 The method and the ratio of the output pixel projection size to the sensor pixel projection size are 2.00, with a height not exceeding 1, which means that each image location is sampled at most once in the composite image collection contour 360. Each comparable composite image collection contour 360 has a width of 8 sensor pixels or 4 output pixels. Figure 7BThe maximum height of the composite image collection contour 758 is 4, which means that there is at least one image location obtained by all 4 pixels.

[0142] Figure 7A and 7B The composite image collection contour 758 of the embodiment is also greater than Figure 3 The composite image collection contour 360 of the embodiment is more concise, having a composite image collection contour size 760 that is only twice the sensor pixel projection size 210, which is more efficient if using... Figure 3 The method and the ratio of the output pixel projection to the sensor pixel projection of 2.00 will achieve a comparable composite image collection contour size of 0.25 (1 / 4) times 370.

[0143] An additional measure of imaging performance is the line sensor percentage, which is the percentage of line sensors contributing to the collection of image data at any given location along the composite image collection contour 758, measured at a location indicated by reference digit 780, having an area located at the center of the composite image collection contour 758, the composite image collection contour 758 having a width equal to the output pixel projection size 756 and a height equal to the number of lines 120 on the multi-line TDI sensor 110. Therefore, the line sensor percentage measured at location 780 is a percentage of the area of ​​the composite image collection contour 758 within location 780 to the total area of ​​location 780.

[0144] In the prior art shown in Figure 2, the line sensor percentage is 100%, the height of the composite image collection profile is a constant 4, but the composite image collection profile size is small at 280.

[0145] exist Figure 4A and 4B In this embodiment, the line sensor percentage is 83%, and the composite image collection contour size 460 is larger than that in the prior art but smaller than that in the present invention. Figure 3 The dimensions in the embodiments demonstrate Figure 4A and 4B The advantages of the embodiments are superior Figure 3 The method.

[0146] exist Figure 5A and 5B In this embodiment, the line sensor percentage is 80%, and the composite image collection contour size 560 is larger than that in the prior art but smaller than that in the present invention. Figure 3 The dimensions in the embodiments demonstrate Figure 5A and 5B The advantages of the embodiments are superior Figure 3 The method.

[0147] exist Figure 6A and6B In this embodiment, the line sensor percentage is 86%, and the composite image collection contour size 560 is larger than that in the prior art but smaller than that in the present invention. Figure 3 The dimensions in the embodiments demonstrate Figure 6A and 6B The advantages of the embodiments are superior Figure 3 The method.

[0148] exist Figure 7A and 7B In this embodiment, the line sensor percentage is 100%, the same as the line percentage in the prior art shown in Figure 2 (as opposed to a 25% line sensor percentage, which has been adopted). Figure 3 The method and the ratio of the output pixel projection to the sensor pixel projection are 2.00), and the composite image collection contour size 760 is the same as the output pixel projection size (which is 1.0 in the prior art and in Figure 7A and 7B In the embodiments, it is 2.0), and significantly smaller than Figure 3 The composite image collection contour size of the embodiment is 370, which proves Figure 7A and 7B The advantages of the embodiments are superior Figure 3 The method.

[0149] It should be understood that in all cases, Figure 4A and 4B , Figures 5A to 5B , Figures 6A to 6B and Figures 7A to 7B The embodiments are superior Figure 3 Examples of implementations.

[0150] Figure 4A and 4B , Figures 5A to 5B , Figures 6A to 6B and Figures 7A to 7B The choice between the embodiment and other possible embodiments with different ratios of output pixel projection size to sensor pixel projection size is usually based on the job requirements, i.e., the maximum pixel size that can be used for a given inspection task.

[0151] Please refer to the following text. Figure 8 The described arrangement effectively implements this choice.

[0152] Figure 3 , Figure 4A and 4B , Figures 5A to 5B , Figures 6A to 6B and Figures 7A to 7B A summary comparison of the embodiments is shown in Table 1 below:

[0153] Table 1

[0154]

[0155]

[0156] For reference Figure 8 This is to explain why it can be implemented. Figures 4A to 7B The TDI interconnect diagram of any of the optional TDI arrangements in the embodiments. In this embodiment, the distance of mutual displacement along the scan axis 150 of the multi-line TDI sensor 110 and the circuit 180 to be tested during the acquisition of each of its lines 120 can be selected by the operator as 1.25 times, 1.5 times, 1.75 times, or 2 times the sensor pixel projection size 210 along the scan axis 150. It should be understood that modifications can also be made. Figure 8 The arrangement shown in the image can achieve other ratios. Further understanding of the available options is necessary. Figure 8 The arrangement shown in the diagram can achieve any ratio between 1.00 and 2.00.

[0157] like Figure 8 As seen in stage A, line 4 of frame M of the multi-line TDI sensor 110 is supplied to a 1-frame FIFO line delay circuit 810. The delayed output from the FIFO line delay circuit 810 is supplied to an operator-selectable switch 812, which controls whether the output from the FIFO line delay circuit 810 is supplied to an additional FIFO line delay circuit 820 in stage B, the delayed output of which is supplied to an adder 824, or directly to an adder 824 that adds it to line 3 of frame M.

[0158] In stage C, the summation output of adder 824 (which includes the output of either FIFO line delay circuit 810 or additional FIFO line delay circuit 820) is supplied to another 1-frame FIFO line delay circuit 830.

[0159] The delayed output from the FIFO line delay circuit 830 is supplied to an operator selectable switch 832, which controls whether the output from the FIFO line delay circuit 830 is supplied to an additional FIFO line delay circuit 840 in stage D. The delayed output of the additional FIFO line delay circuit 840 is supplied to an adder 844, or directly to an adder 844 that adds it to line 2 of frame M.

[0160] In stage E, the output of adder 844 is supplied to an additional 1-frame FIFO line delay circuit 850. The delayed output from FIFO line delay circuit 850 is supplied to an operator-selectable switch 852, which controls whether the output from FIFO line delay circuit 850 is supplied to an additional FIFO line delay circuit 860 in stage F, the delayed output of which is supplied to adder 864, or directly to adder 864 that adds it to line 1 of frame M. In stage G, the summing output of adder 864 is supplied as a TDI output.

[0161] It should be understood that by adopting Figure 8 The arrangement of the multi-line TDI sensor 110 and the circuit 180 to be tested, with their relative displacements along the scan axis 150 during the acquisition of each of their lines 120, can be selected by the operator as 1.25 times the sensor pixel projection size 210 along the scan axis 150 by setting switch 812 to yes, switch 832 to no, and switch 852 to yes. Figure 5A and 5B As shown in the image.

[0162] Similarly, it should be understood that by adopting Figure 8 The arrangement of the multi-line TDI sensor 110 and the circuit 180 to be tested, with their relative displacements along the scan axis 150 during the acquisition of each of their lines 120, can be selected by the operator as 1.5 times the sensor pixel projection size 210 along the scan axis 150 by setting switch 812 to No, switch 832 to Yes, and switch 852 to No. Figure 4A and 4B As shown in the image.

[0163] Further understanding is needed regarding the adoption of... Figure 8 The arrangement of the multi-line TDI sensor 110 and the circuit 180 to be tested, with their relative displacements along the scan axis 150 during the acquisition of each of their lines 120, can be selected by the operator as 1.75 times the sensor pixel projection size 210 along the scan axis 150 by setting switch 812 to no, switch 832 to no, and switch 852 to no. Figure 6A and 6B As shown in the image.

[0164] Similarly, it should be understood that by adopting Figure 8The arrangement of the multi-line TDI sensor 110 and the circuit 180 to be tested, during the acquisition of each of their lines 120, along the scan axis 150, allows the operator to select a distance 2.00 times the sensor pixel projection size 210 along the scan axis 150 by setting switch 812 to no, switch 832 to no, and switch 852 to no. Figure 7A and 7B As shown in the image.

[0165] Those skilled in the art will understand that this invention is not limited to the specific embodiments described above. Rather, the scope of this invention includes combinations and sub-combinations of the various features described herein, as well as modifications and variations that will come to mind for those skilled in the art upon reading the foregoing.

Claims

1. An apparatus for testing circuits, comprising: The scanner includes: At least one multi-line time delay integration (TDI) sensor has a plurality of parallel lines of sensor pixels, each of the parallel lines extending along a line axis, the plurality of lines of the sensor pixels being separated from each other by a separation distance along a scan axis perpendicular to the line axis, each of the sensor pixels having a sensor pixel size along the scan axis; A linear shifter that provides mutual displacement of the multi-line TDI sensor and the circuit to be tested along the scan axis; and A scanning optics device guides light reflected from the circuit to the sensor pixels, the scanning optics device defining a projection of each of the sensor pixels onto the circuit, wherein the projection defines the area of ​​the circuit from which light reaches each of the sensor pixels, the projection having a sensor pixel projection size along the scanning axis; The multi-line TDI sensor and the linear shifter are operable such that the distance of mutual displacement of the multi-line TDI sensor and the circuit to be tested along the scan axis during the acquisition of each of their lines is greater than the sensor pixel projection size along the scan axis. An image generator configured to construct an image from composite output pixels of the multi-line TDI sensor, wherein the image comprises a plurality of composite output pixels, each having a composite image collection profile along the scan axis, the composite image collection profile having a size along the scan axis larger than the sensor pixel projection size.

2. The apparatus for testing a circuit according to claim 1, wherein each of the composite output pixels comprises a plurality of partially overlapping output pixels obtained from a plurality of sensor pixels located at different lines of the multi-line TDI sensor, and each of the output pixels obtained by each of the plurality of sensor pixels contains at least one identical feature of the circuit.

3. The apparatus for testing a circuit according to claim 2, wherein each of the plurality of partially overlapping output pixels has an output pixel projection size along the scan axis, the output pixel projection size including the sensor pixel projection size in combination with the multi-line TDI sensor and the range by which the mutual displacement along the scan axis during acquisition of each of the plurality of parallel lines exceeds the sensor pixel projection size.

4. The apparatus for testing circuits according to claim 1, wherein the separation distance between the plurality of parallel lines of the sensor pixel is equal to an integer multiple of the sensor pixel size.

5. The apparatus for testing circuits according to claim 1, wherein the separation distance between the plurality of parallel lines of the sensor pixel is equal to zero.

6. The apparatus for testing circuits according to claim 1, wherein the linear shifter is a bidirectional linear shifter.

7. The apparatus for testing a circuit according to claim 1, wherein the distance by which the multi-line TDI sensor and the circuit to be tested are mutually displaced along the scan axis during the acquisition of each of their lines exceeds the sensor pixel projection size along the scan axis to a range selectable by the operator.

8. The apparatus for testing circuits according to claim 1, further comprising an operator-selectable mutual displacement selector configured for the distance of mutual displacement along the scan axis of the multi-line TDI sensor and the circuit to be tested during acquisition of each of its lines.

9. A method for testing a circuit, the method comprising: A scanner is provided that includes at least one multi-line time delay integration (TDI) sensor comprising a plurality of parallel lines having sensor pixels, each of the parallel lines extending along a line axis, the plurality of lines of the sensor pixels being separated from each other by a separation distance along a scan axis perpendicular to the line axis, each of the sensor pixels having a sensor pixel size along the scan axis. Define the relative displacement distance along the scan axis of the multi-line TDI sensor and the circuit to be tested during the acquisition of each of the plurality of lines of the multi-line TDI sensor. The multi-line TDI sensor and the circuit to be tested are shifted relative to each other along the scanning axis by the specified mutual displacement distance. A scanning optics device guides light reflected from the circuit to the sensor pixels, the scanning optics device defining the projection of each of the sensor pixels onto the circuit, wherein the projection defines the area of ​​the circuit from which light reaches each of the sensor pixels, each projection having a sensor pixel projection size along the scanning axis, the mutual displacement distance being greater than the sensor pixel projection size along the scanning axis, and An image is constructed from the composite output pixels of the multi-line TDI sensor, the image including a plurality of the composite output pixels, each of the composite output pixels having a composite image collection profile along the scan axis, the composite image collection profile having a composite image collection profile size along the scan axis that is larger than the sensor pixel projection size.

10. The method for testing a circuit according to claim 9, wherein the constructed image comprises: For each of the composite output pixels: Multiple partially overlapping output pixels are obtained from multiple sensor pixels located at different lines of the multi-line TDI sensor, and each of the output pixels obtained by each of the multiple sensor pixels contains at least one of the same features of the circuit. and The multiple partially overlapping output pixels are combined into the composite output pixel.

11. The method for testing a circuit according to claim 9, wherein defining the mutual displacement distance includes the operator selecting the mutual displacement distance from a plurality of possible displacement distances.

12. The method for testing a circuit according to claim 9, further comprising generating a square pixel from the output pixel, the generating the square pixel comprising: Interpolated output pixels are generated by interpolating the output pixels in the direction of the spool; and The interpolated output pixel is resized to a size along the linear axis equal to the mutual displacement distance.

Images