A power module

Abstract

The application relates to a power module, comprising an upper bridge arm module, a lower bridge arm module, an electrode layer module, a substrate module and a fixing module, the upper bridge arm module is connected with the electrode layer module through the fixing module, the lower bridge arm module is connected with the electrode layer module, and the upper bridge arm module, the lower bridge arm module, the electrode layer module and the fixing module are all arranged on the substrate module. The application can reduce loop parasitic inductance, improve the thermal performance of the module, optimize the internal structure of the module and ensure reliable work of the power module.

Description

Technical Field

[0001] This invention relates to the field of electronic technology, and in particular to a power module. Background Technology

[0002] With the rapid development of modern transportation, aerospace and other fields, power electronic power modules (hereinafter referred to as power modules) have been widely used, and higher requirements have been put forward for the performance of power modules.

[0003] To improve the efficiency of power modules, higher switching frequencies are required. However, traditional power module layouts have high parasitic inductance, and the power chips are subjected to high overvoltages during switching, increasing the risk of overvoltage breakdown. Higher switching frequencies also lead to greater heat loss.

[0004] Therefore, in high-frequency, high-power applications, parasitic inductance and the thermal performance of the module are challenges that power modules need to overcome. It is necessary to reduce parasitic inductance, improve thermal performance, and optimize the design layout to ensure the reliable operation of the power module. Summary of the Invention

[0005] The purpose of this invention is to provide a power module that reduces parasitic inductance, improves thermal performance, and promotes the optimization of the internal structure of the power module.

[0006] To achieve the above objectives, the present invention provides the following solution:

[0007] A power module includes: an upper bridge arm module, a lower bridge arm module, an electrode layer module, a substrate module, and a fixing module. The upper bridge arm module is connected to the electrode layer module through the fixing module, and the lower bridge arm module is connected to the electrode layer module. The upper bridge arm module, the lower bridge arm module, the electrode layer module, and the fixing module are all disposed on the substrate module.

[0008] Furthermore, the upper bridge arm module includes a plurality of upper bridge arm chips, a plurality of upper bridge arm chip pads, and an upper bridge arm driving flexible PCB board, wherein the upper bridge arm chips are disposed on the upper bridge arm chip pads;

[0009] The lower bridge arm module includes several lower bridge arm chips, several lower bridge arm chip pads, and a lower bridge arm driving flexible PCB board, wherein the lower bridge arm chips are disposed on the lower bridge arm chip pads.

[0010] The electrode layer module includes a positive electrode layer, a negative electrode layer, a first AC side electrode layer, and a second AC side electrode layer; the substrate module includes a first substrate and a second substrate; and the fixing module includes a central copper pillar.

[0011] The positive electrode layer and the second AC side electrode layer are disposed on the first substrate in the same layer, and the upper bridge arm chip pad is disposed on the side of the positive electrode layer away from the first substrate; the negative electrode layer and the first AC side electrode layer are disposed on the second substrate in the same layer, and the lower bridge arm chip pad is disposed on the side of the second AC side electrode layer away from the first substrate.

[0012] Furthermore, the upper bridge arm chip includes a first control terminal, a first input terminal, and a first output terminal. The upper bridge arm chip pad is electrically connected to the first input terminal of the upper bridge arm chip and the positive electrode layer, respectively. The upper bridge arm driving flexible PCB board is electrically connected to the first control terminal of the upper bridge arm chip and the first AC side electrode layer, respectively. The positive electrode layer is electrically connected to the upper bridge arm chip pad. The first AC side electrode layer is connected to the first output terminal of the upper bridge arm chip, the intermediate copper pillar, and the upper bridge arm driving flexible PCB board, respectively. The intermediate copper pillar is connected to the second AC side electrode layer.

[0013] Furthermore, the lower bridge arm chip includes a second control terminal, a second input terminal, and a second output terminal. The lower bridge arm chip pad is electrically connected to the second input terminal and the second AC side electrode layer of the lower bridge arm chip, respectively. The lower bridge arm driving flexible PCB board is electrically connected to the second control terminal and the negative electrode layer of the lower bridge arm chip, respectively. The second AC side electrode layer is connected to the lower bridge arm chip pad, and the negative electrode layer is connected to the second output terminal and the lower bridge arm driving flexible PCB board, respectively.

[0014] Furthermore, the upper bridge arm driving flexible PCB board includes: a driving signal input terminal and a driving signal output terminal. The driving signal input terminal is disposed on one side of the first substrate along a first direction, and the driving signal output terminal is arranged along a second direction of the first substrate, and is respectively connected to the first control terminal and the first AC side electrode layer of the upper bridge arm chip.

[0015] Furthermore, the lower bridge arm driving flexible PCB board includes: a driving signal input terminal and a driving signal output terminal. The driving signal input terminal is disposed on one side of the first substrate along a first direction, and the driving signal output terminal is arranged along a second direction of the first substrate and is respectively connected to the second control terminal of the lower bridge arm chip and the negative electrode layer. The second direction is perpendicular to the first direction.

[0016] Furthermore, the positive electrode layer includes: a plurality of positive electrode current paths and positive electrode lead-out terminals, which surround the second AC side electrode layer to form a parallel power loop, and the positive electrode lead-out terminals are symmetrically distributed about the centerline of the first direction of the first substrate; the negative electrode lead-out terminals of the negative electrode layer are disposed at the edge of the negative electrode layer and are symmetrically distributed about the centerline of the first direction of the second substrate; the AC lead-out terminals of the first AC side electrode layer are disposed at the edge of the first AC side electrode layer and are symmetrically distributed about the centerline of the first direction of the second substrate.

[0017] Furthermore, the power module also includes a terminal block module, which is disposed on the substrate module.

[0018] Furthermore, the terminal module includes: a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, and a sixth terminal;

[0019] Wherein, one end of the first terminal is electrically connected to the lead-out terminal on one side of the positive electrode layer, one end of the second terminal is electrically connected to the lead-out terminal on the other side of the positive electrode layer, one end of the third terminal is electrically connected to the lead-out terminal on one side of the negative electrode layer, one end of the fourth terminal is electrically connected to the AC lead-out terminal of the first AC side electrode layer, one end of the fifth terminal is electrically connected to the drive signal input terminal of the lower bridge arm driving flexible PCB board, and one end of the sixth terminal is electrically connected to the drive signal input terminal of the upper bridge arm driving flexible PCB board; the other ends of the first terminal, the second terminal, the third terminal, the fourth terminal, the fifth terminal, and the sixth terminal all extend outward from the outer side of the first substrate.

[0020] Furthermore, the first AC side electrode layer includes: a first hollowed-out frame, a second hollowed-out frame, and a third hollowed-out frame, wherein the first hollowed-out frame, the second hollowed-out frame, and the third hollowed-out frame are used to prevent the upper bridge arm driving flexible PCB board from contacting the first AC side electrode layer.

[0021] The negative electrode layer includes a fourth hollowed-out frame, a fifth hollowed-out frame, and a sixth hollowed-out frame. The fourth hollowed-out frame, the fifth hollowed-out frame, and the sixth hollowed-out frame are used to prevent the lower bridge arm drive flexible PCB board from contacting the negative electrode layer.

[0022] The beneficial effects of this invention are as follows:

[0023] The power module proposed in this invention has two positive electrode current paths and two sets of positive electrode terminal leads on its positive electrode layer, which surrounds the second AC side electrode layer, forming two parallel power loops and a dual-loop structure. This structure helps reduce parasitic inductance, thereby reducing switching losses and voltage spikes during switching. A pad is placed at the bottom of the upper bridge arm chip to connect the positive electrode layer to the first input terminal of the upper bridge arm chip, and another pad is placed at the bottom of the lower bridge arm chip to connect the second AC side electrode layer to the second input terminal of the lower bridge arm chip. This facilitates heat dissipation of the power chip, significantly improving the thermal performance of the power module, optimizing the working environment of the power chip, and extending its service life. The traditional DBC layout of the drive circuit is abandoned in favor of a flexible PCB board to construct the drive circuit, separating the upper and lower bridge arm drive circuits from the DBC substrate. This simplifies the DBC substrate layout and graphic design, and improves the switching performance of the power module. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a partial internal structure diagram of the power module according to an embodiment of the present invention;

[0026] Figure 2 This is a partial internal structure diagram of the power module according to an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the external structure of the power module according to an embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of the structure of the first and second terminal components in the power module of this invention.

[0029] Figure 5 This is a schematic diagram of the negative electrode layer and the third terminal component in the power module of this invention.

[0030] Figure 6 This is a schematic diagram of the structure of the first AC side electrode layer and the fourth terminal component in the power module of this invention.

[0031] Figure 7 This is a schematic diagram of the fifth and sixth terminal components in the power module of this invention.

[0032] Wherein, 1-lower bridge arm chip, 2-lead-out terminal of positive electrode layer, 3-drive signal output terminal of lower bridge arm driving flexible PCB board, 4-upper bridge arm chip pad, 5-lower bridge arm driving flexible PCB board, 6-drive signal input terminal of lower bridge arm driving flexible PCB board, 7-drive signal output terminal of upper bridge arm driving flexible PCB board, 8-middle copper pillar, 9-upper bridge arm chip, 10-drive signal input terminal of upper bridge arm driving flexible PCB board, 11-upper bridge arm driving flexible PCB board, 12-lower bridge arm chip pad, 13-positive electrode layer, 14-lead-out terminal of positive electrode layer, 15-first substrate, 16-second AC side power supply Electrode layer, 17-negative electrode layer, 18a-first terminal piece, 18b-second terminal piece, 19-fifth terminal piece, 20-first AC side electrode layer, 21-sixth terminal piece, 22-metal plate, 23-second substrate, 171-third terminal piece, 172-fourth hollowed-out frame, 173-fifth hollowed-out frame, 174-sixth hollowed-out frame, 181a-one end of the first terminal piece, 181b-one end of the second terminal piece, 191-one end of the fifth terminal piece, 201-first hollowed-out frame, 202-second hollowed-out frame, 203-third hollowed-out frame, 204-fourth terminal piece, 211-one end of the sixth terminal piece. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0035] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0037] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] This embodiment provides a power module, such as Figure 1-3 As shown, it includes: an upper bridge arm module, a lower bridge arm module, an electrode layer module, a substrate module, a fixing module, and a terminal module. The upper bridge arm module is connected to the electrode layer module through the fixing module, and the lower bridge arm module is connected to the electrode layer module. The upper bridge arm module, the lower bridge arm module, the electrode layer module, the fixing module, and the terminal module are all mounted on the substrate module.

[0039] The upper bridge arm module includes multiple upper bridge arm chips 9, multiple upper bridge arm chip pads 4, and an upper bridge arm driving flexible PCB board 11; the lower bridge arm module includes multiple lower bridge arm chips 1, multiple lower bridge arm chip pads 12, and a lower bridge arm driving flexible PCB board 5; the electrode layer module includes a positive electrode layer 13, a second AC side electrode layer 16, a negative electrode layer 17, and a first AC side electrode layer 20; the substrate module includes a first substrate 15 and a second substrate 23; and the fixing module includes a central copper pillar 8.

[0040] Furthermore, the upper bridge arm chip 9 is provided with a first control terminal, a first input terminal, and a first output terminal; the upper bridge arm driving flexible PCB board 11 is provided with a drive signal input terminal 10 and a drive signal output terminal 7. The upper bridge arm driving flexible PCB board 11 is connected to the first control terminal of the upper bridge arm chip 9, and the drive signal output terminal 7 is connected to the first AC side electrode layer 20; the positive electrode layer 13 is connected to the upper bridge arm chip pad 4; the upper bridge arm chip pad 4 is connected to the first input terminal of the upper bridge arm chip 9; the first terminal 18a is connected to the lead-out terminal 14 of the positive electrode layer 13, and the second terminal 18b is connected to the lead-out terminal 2 of the positive electrode layer 13; the lower bridge arm chip 1 is provided with a second control terminal, a second input terminal, and a second output terminal; the lower bridge arm driving flexible PCB board 5 is provided with a drive signal input terminal 6. Drive signal output terminal 3, the lower bridge arm drive flexible PCB board 5 is connected to the second control terminal of the lower bridge arm chip 1, and drive signal output terminal 3 of the lower bridge arm drive flexible PCB board 5 is connected to the negative electrode layer 17; the second AC side electrode layer 16 is connected to the lower bridge arm chip pad 12; the lower bridge arm chip pad 12 is connected to the second input terminal of the lower bridge arm chip 1; the negative electrode layer 17 is connected to the second output terminal of the lower bridge arm chip 1 and the drive signal output terminal 3 of the lower bridge arm drive flexible PCB board 5; the third terminal piece 171 is connected to the negative electrode layer 17 through a metal pillar; the first AC side electrode layer 20 is connected to the first output terminal of the upper bridge arm chip 9, the intermediate copper pillar 8 and the drive signal output terminal 7 of the upper bridge arm drive flexible PCB board 11; the intermediate copper pillar 8 is connected to the second AC side electrode layer 16;

[0041] like Figure 2-3 As shown, the second AC-side electrode layer 16 and the positive electrode layer 13 are both disposed on the first substrate 15, and the second AC-side electrode layer 16 and the positive electrode layer 13 are disposed in the same layer; the negative electrode layer 17 and the first AC-side electrode layer 20 are both disposed on the second substrate 23, and the negative electrode layer 17 and the first AC-side electrode layer 20 are disposed in the same layer; as Figure 6 As shown, the fourth terminal 204 is connected to the first AC side electrode layer 20 via a metal pillar; as Figure 1 , Figure 7 As shown, the fifth terminal 19 is connected to the drive signal input terminal 6 of the lower bridge arm drive flexible PCB board 5, and the sixth terminal 21 is connected to the drive signal input terminal 10 of the upper bridge arm drive flexible PCB board 11.

[0042] The commutation circuit corresponding to the upper bridge arm chip 9 is: positive electrode lead-out terminal 14 (or positive electrode lead-out terminal 2) - positive electrode layer 13 - upper bridge arm chip pad 4 - upper bridge arm chip 9 - first AC side electrode layer 20 (or reverse).

[0043] The commutation circuit corresponding to the lower bridge arm chip 1 is as follows: first AC side electrode layer 20 - middle copper pillar 8 - second AC side electrode layer 16 - lower bridge arm chip pad 12 - lower bridge arm chip 1 - negative electrode layer 17 (or in reverse).

[0044] Therefore, the positive electrode layer 13 is provided with two positive electrode current paths (positive electrode lead-out terminal 14 - positive electrode layer 13; positive electrode lead-out terminal 2 - positive electrode layer 13) and two sets of positive electrode terminals (positive electrode lead-out terminal 14; positive electrode lead-out terminal 2) at the lead-out points, which surround the second AC side electrode layer 16, forming two parallel power loops and creating a dual-loop structure. This helps reduce parasitic inductance in the loops, thereby reducing switching losses and voltage spikes during switching. The upper bridge arm chip pad 4 is placed at the bottom of the upper bridge arm chip 9 to complete the connection between the positive electrode layer 13 and the first input terminal of the upper bridge arm chip 9. The connection is made by placing the lower bridge arm chip pad 12 at the bottom of the lower bridge arm chip 1 to complete the connection between the second AC side electrode layer 16 and the second input terminal of the lower bridge arm chip 1. This makes the heat dissipation of the power chip smoother, greatly improves the thermal performance of the power module, optimizes the working environment of the power chip, and extends its service life. The traditional DBC layout of the drive circuit is abandoned, and the upper bridge arm drive flexible PCB board 11 and the lower bridge arm drive flexible PCB board 5 are used to form the drive circuit. The upper and lower bridge arm drive circuits are separated from the DBC substrate, which simplifies the DBC substrate layout and graphic design and improves the switching performance of the power module.

[0045] Specifically, in this embodiment, the upper bridge arm chip 9 may include an IGBT device, whose gate electrode serves as the first control terminal of the upper bridge arm chip 9 and is electrically connected to the upper bridge arm driving flexible PCB board 11; its source electrode serves as the first output terminal of the upper bridge arm chip 9 and is electrically connected to the drive signal output terminal 7 of the upper bridge arm driving flexible PCB board 11 and the first AC side electrode layer 20; and its drain electrode serves as the first input terminal of the upper bridge arm chip 9 and is electrically connected to the upper bridge arm chip pad 4. The lower bridge arm chip 1 may include an IGBT device, whose gate electrode serves as the second control terminal of the lower bridge arm chip 1; its source electrode serves as the second output terminal of the lower bridge arm chip 1 and is electrically connected to the lower bridge arm driving flexible PCB board 5 and the negative electrode layer 17; and its drain electrode serves as the second input terminal of the lower bridge arm chip 1 and is electrically connected to the second AC side electrode layer 16.

[0046] The upper bridge arm chip 9 may also include a diode to protect it from sudden voltage or current changes. Other switching transistors, such as bipolar transistors or MOSFETs, can also be used instead of IGBT devices.

[0047] Specifically, the power module in this embodiment is a half-bridge power module.

[0048] The first AC side electrode layer 20 has three hollowed-out squares, namely the first hollowed-out square 201, the second hollowed-out square 202, and the third hollowed-out square 203. The purpose is to prevent the upper bridge arm drive flexible PCB board 11 from contacting the first AC side electrode layer 20 without changing the overall thickness of the power module. The first AC side electrode layer 20 is electrically connected to the fourth terminal 204, and the fourth terminal 204 is disposed on the first direction central axis of the second substrate 23. The fourth terminal 204 can be connected to an external AC circuit.

[0049] The negative electrode layer 17 has three cutout frames, namely the fourth cutout frame 172, the fifth cutout frame 173, and the sixth cutout frame 174. The purpose is to prevent the lower bridge arm drive flexible PCB board 5 from contacting the negative electrode layer 17 without changing the overall thickness of the power module. The negative electrode layer 17 is electrically connected to the third terminal 171, and the third terminal 171 is located on the first direction central axis of the second substrate 23. The third terminal 171 can be connected to an external DC negative electrode.

[0050] The second AC side electrode layer 16 and the positive electrode layer 13 are arranged adjacent to each other along the first direction of the first substrate 15; the negative electrode layer 17 and the first AC side electrode layer 20 are arranged adjacent to each other along the first direction of the second substrate 23; the three intermediate copper pillars 8, the three upper bridge arm chip pads 4, the three upper bridge arm chips 9, the three lower bridge arm chip pads 12, and the three lower bridge arm chips 1 are all arranged along the second direction of the first substrate 15.

[0051] The upper bridge arm drive circuit is located in the upper bridge arm drive flexible PCB board 11, and the lower bridge arm drive circuit is located in the lower bridge arm drive flexible PCB board 5. Specifically, the upper bridge arm drive flexible PCB board 11 is connected to the first control terminal of the upper bridge arm chip 9 through metal pillars, and is connected to the first AC side electrode layer 20 through the drive signal output terminal 7 of the upper bridge arm drive flexible PCB board 11. The lower bridge arm drive flexible PCB board 5 is connected to the second control terminal of the lower bridge arm chip 1 through metal pillars, and is connected to the negative electrode layer 17 through the drive signal output terminal 3 of the lower bridge arm drive flexible PCB board 5. The flexible PCB board allows the drive circuit to be separated from the traditional DBC substrate, which will not interfere with the main power circuit of the power module and simplifies the layout and graphic design of the DBC substrate.

[0052] Multiple upper bridge arm chip pads 4 are disposed on the side of the positive electrode layer 13 away from the first substrate 15 and arranged along the second direction; multiple lower bridge arm chip pads 12 are disposed on the side of the positive electrode layer 13 away from the first substrate 15 and arranged along the second direction, which makes the heat dissipation of the power chip smoother, greatly improves the thermal performance of the power module, optimizes the working environment of the power chip, and extends its service life.

[0053] The positive electrode layer 13 is provided with two positive electrode lead-out terminals 2 and 14, which are symmetrical about the central axis of the first direction of the first substrate 15. The two sets of positive electrode lead-out terminals (positive electrode lead-out terminal 14; positive electrode lead-out terminal 2) are surrounded by the second AC side electrode layer 16, which can form two parallel power loops and form a dual-loop structure. This is beneficial to reduce the parasitic inductance of the loop, thereby reducing the switching loss and voltage spikes during switching.

[0054] The second substrate 23 is located above and connected to the negative electrode layer 17 and the first AC side electrode layer 20; above the second substrate 23 is a metal plate 22, which can be selectively connected to an external heat sink to reduce the heat inside the power module.

[0055] The power module in this embodiment also includes, for example, Figure 4-7 As shown, one end 181a of the first terminal 18a is electrically connected to the lead-out terminal 14 of the positive electrode layer, and one end 181b of the second terminal 18b is electrically connected to the lead-out terminal 2 of the positive electrode layer. The other ends of both the first terminal 18a and the second terminal 18b extend beyond the outer side of the first substrate 15, enabling the positive electrode lead-out terminal to access a positive voltage from outside the power module. One end of the third terminal 171 is electrically connected to the negative electrode layer 17, and the other end of the third terminal 171 extends beyond the outer side of the first substrate 15, enabling the negative electrode lead-out terminal to access a negative voltage or ground from outside the power module. One end of the fourth terminal 204 is electrically connected to the first AC side electrode layer 20. The other end of the fourth terminal 204 extends out of the outer side of the first substrate 15, and is used to realize that the AC side electrode lead-out terminal is connected to the AC voltage from the inside of the power module; one end 191 of the fifth terminal 19 is electrically connected to the lower bridge arm drive flexible PCB board 5, and the other end of the fifth terminal 19 extends out of the outer side of the first substrate 15, and is used to realize that the second control terminal of the lower bridge arm chip 1 is connected to the drive signal from the outside of the power module; one end 211 of the sixth terminal 21 is electrically connected to the upper bridge arm drive flexible PCB board 11, and the other end of the sixth terminal 21 extends out of the outer side of the first substrate 15, and is used to realize that the first control terminal of the upper bridge arm chip 9 is connected to the drive signal from the outside of the power module.

[0056] The first terminal 18a, the second terminal 18b, and the third terminal 171 are led out from the parallel surface of the first substrate 15 and are disposed on the same side of the first substrate 15, so as to facilitate connection with the positive and negative terminals of the same power supply device, shorten the connection path, and shorten the connection path between the two.

[0057] The fourth terminal 204, the fifth terminal 19 and the sixth terminal 21 are led out from the parallel plane of the first substrate 15 and are disposed on the same side of the first substrate 15 (opposite to the side of the first, second terminal 18 and third terminal 171), which facilitates the connection of the power module to the circuit board carrying the power module.

[0058] The fifth terminal 19 includes two insulated terminal posts 191, which are electrically connected to the two sub-metal layers 6 of the lower bridge arm drive flexible PCB board 5, respectively, to provide the drive signal of the second control terminal of the lower bridge arm chip 1 and the drive signal of the negative electrode layer 17.

[0059] The sixth terminal component 21 includes two insulated terminal posts 211, which are electrically connected to the two sub-metal layers 10 of the upper bridge arm drive flexible PCB board 11, respectively, for providing the drive signal of the first control terminal of the upper bridge arm chip 9 and the drive signal of the first AC side electrode layer 20.

[0060] The aforementioned connectors are metal connectors, such as copper connectors or copper-aluminum alloy connectors.

[0061] The power module provided by this invention has two positive electrode current paths and two sets of positive electrode terminal leads on its positive electrode layer, which surrounds the second AC side electrode layer, forming two parallel power loops and a dual-loop structure. This helps reduce parasitic inductance, thereby reducing switching losses and voltage spikes during switching. A pad is placed at the bottom of the upper bridge arm chip to connect the positive electrode layer to the first input terminal of the upper bridge arm chip, and a pad is placed at the bottom of the lower bridge arm chip to connect the second AC side electrode layer to the second input terminal of the lower bridge arm chip. This facilitates heat dissipation of the power chip, significantly improving the thermal performance of the power module, optimizing the working environment of the power chip, and extending its service life. The traditional DBC layout of the drive circuit is abandoned in favor of a flexible PCB board to construct the drive circuit, separating the upper and lower bridge arm drive circuits from the DBC substrate. This simplifies the DBC substrate layout and graphic design, and improves the switching performance of the power module.

[0062] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A power module, characterized in that, include: The system comprises an upper bridge arm module, a lower bridge arm module, an electrode layer module, a substrate module, and a fixing module. The upper bridge arm module is connected to the electrode layer module through the fixing module, and the lower bridge arm module is connected to the electrode layer module. The upper bridge arm module, the lower bridge arm module, the electrode layer module, and the fixing module are all disposed on the substrate module. The upper bridge arm module includes several upper bridge arm chips (9), several upper bridge arm chip pads (4), and an upper bridge arm drive flexible PCB board (11). The upper bridge arm chips (9) are disposed on the upper bridge arm chip pads (4). The lower bridge arm module includes several lower bridge arm chips (1), several lower bridge arm chip pads (12), and a lower bridge arm driving flexible PCB board (5). The lower bridge arm chips (1) are disposed on the lower bridge arm chip pads (12). The electrode layer module includes a positive electrode layer (13), a negative electrode layer (17), a first AC side electrode layer (20), and a second AC side electrode layer (16); the substrate module includes a first substrate (15) and a second substrate (23); and the fixing module includes a central copper pillar (8). The positive electrode layer (13) and the second AC side electrode layer (16) are disposed on the same layer on the first substrate (15), and the upper bridge arm chip pad (4) is disposed on the side of the positive electrode layer (13) away from the first substrate (15); the negative electrode layer (17) and the first AC side electrode layer (20) are disposed on the same layer on the second substrate (23), and the lower bridge arm chip pad (12) is disposed on the side of the second AC side electrode layer (16) away from the first substrate (15); The positive electrode layer (13) includes several positive electrode current paths and positive electrode lead-out endpoints, which surround the second AC side electrode layer (16) to form a parallel power loop. The positive electrode lead-out endpoints are symmetrically distributed about the first direction centerline of the first substrate (15). The negative electrode lead-out endpoints of the negative electrode layer (17) are disposed at the edge of the negative electrode layer and are symmetrically distributed about the first direction centerline of the second substrate (23). The AC lead-out endpoints of the first AC side electrode layer (20) are disposed at the edge of the first AC side electrode layer (20) and are symmetrically distributed about the first direction centerline of the second substrate (23). The first AC side electrode layer (20) includes: a first hollow frame (201), a second hollow frame (202) and a third hollow frame (203), the first hollow frame (201), the second hollow frame (202) and the third hollow frame (203) are used to prevent the upper bridge arm driving flexible PCB board (11) from contacting the first AC side electrode layer (20); The negative electrode layer (17) includes a fourth hollowed-out frame (172), a fifth hollowed-out frame (173), and a sixth hollowed-out frame (174). The fourth hollowed-out frame (172), the fifth hollowed-out frame (173), and the sixth hollowed-out frame (174) are used to prevent the lower bridge arm drive flexible PCB board (5) from contacting the negative electrode layer (17).

2. The power module according to claim 1, characterized in that, The upper bridge arm chip (9) includes a first control terminal, a first input terminal and a first output terminal. The upper bridge arm chip pad (4) is electrically connected to the first input terminal of the upper bridge arm chip (9) and the positive electrode layer (13) respectively. The upper bridge arm driving flexible PCB board (11) is electrically connected to the first control terminal of the upper bridge arm chip (9) and the first AC side electrode layer (20) respectively. The positive electrode layer (13) is electrically connected to the upper bridge arm chip pad (4). The first AC side electrode layer (20) is connected to the first output terminal of the upper bridge arm chip (9), the intermediate copper pillar (8) and the upper bridge arm driving flexible PCB board (11) respectively. The intermediate copper pillar (8) is connected to the second AC side electrode layer (16).

3. The power module according to claim 1, characterized in that, The lower bridge arm chip (1) includes a second control terminal, a second input terminal and a second output terminal. The lower bridge arm chip pad (12) is electrically connected to the second input terminal and the second AC side electrode layer (16) of the lower bridge arm chip (1) respectively. The lower bridge arm driving flexible PCB board (5) is electrically connected to the second control terminal and the negative electrode layer (17) of the lower bridge arm chip (1) respectively. The second AC side electrode layer (16) is connected to the lower bridge arm chip pad (12). The negative electrode layer (17) is connected to the second output terminal and the lower bridge arm driving flexible PCB board (5) of the lower bridge arm chip (1) respectively.

4. The power module according to claim 1, characterized in that, The upper bridge arm driving flexible PCB board (11) includes: a driving signal input terminal (10) of the upper bridge arm driving flexible PCB board and a driving signal output terminal (7) of the upper bridge arm driving flexible PCB board. The driving signal input terminal (10) of the upper bridge arm driving flexible PCB board is disposed on one side of the first substrate (15) along the first direction. The driving signal output terminal (7) of the upper bridge arm driving flexible PCB board is arranged along the second direction of the first substrate (15) and is respectively connected to the first control terminal of the upper bridge arm chip (9) and the first AC side electrode layer (20).

5. The power module according to claim 1, characterized in that, The lower bridge arm driving flexible PCB board (5) includes: a driving signal input terminal (6) of the lower bridge arm driving flexible PCB board and a driving signal output terminal (3) of the lower bridge arm driving flexible PCB board. The driving signal input terminal (6) of the lower bridge arm driving flexible PCB board is disposed on one side of the first substrate (15) along the first direction. The driving signal output terminal (3) of the lower bridge arm driving flexible PCB board is arranged along the second direction of the first substrate (15) and is connected to the second control terminal of the lower bridge arm chip (1) and the negative electrode layer (17) respectively. The second direction is perpendicular to the first direction.

6. The power module according to claim 1, characterized in that, The power module further includes a terminal block module, which is disposed on the substrate module.

7. The power module according to claim 6, characterized in that, The terminal module includes: a first terminal (18a), a second terminal (18b), a third terminal (171), a fourth terminal (204), a fifth terminal (19), and a sixth terminal (21). Wherein, one end of the first terminal (18a) is electrically connected to the lead-out terminal on one side of the positive electrode layer (13), one end of the second terminal (18b) is electrically connected to the lead-out terminal on the other side of the positive electrode layer (13), one end of the third terminal (171) is electrically connected to the lead-out terminal on one side of the negative electrode layer (17), one end of the fourth terminal (204) is electrically connected to the AC lead-out terminal of the first AC side electrode layer (20), one end of the fifth terminal (19) is electrically connected to the drive signal input terminal (6) of the lower bridge arm driving flexible PCB board, and one end of the sixth terminal (21) is electrically connected to the drive signal input terminal (10) of the upper bridge arm driving flexible PCB board; the other ends of the first terminal (18a), the second terminal (18b), the third terminal (171), the fourth terminal (204), the fifth terminal (19) and the sixth terminal (21) all extend out of the outer side of the first substrate (15).

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