Electroplating device for composite copper current collector

Abstract

The application relates to the electroplating technical field of composite current collectors, and particularly discloses an electroplating device for composite copper current collectors, which comprises an electrolytic cell, four groups of water injection openings and water discharge openings are sequentially arranged on one end to the other end of the front outer side of the electrolytic cell, and a flattening and wrinkle-removing roller shaft, a stainless steel cathode roller piece, a copper oxide ball adding device, a rectifier conducting assembly, a base film stretching roller assembly and an anode titanium blue double-layer plate are sequentially arranged on one end to the other end in the electrolytic cell; the structure of the copper oxide ball adding device is adopted; in the cathode roller and anode titanium blue copper layer plating mode, the soluble anode titanium blue is used to add copper oxide balls into electrolyte to adjust the copper ion concentration; the area of the copper balls in contact with the electrolyte is uniformly distributed through the ball net, and the position of the consumed copper balls from the base film is regulated through the hydraulic cylinder, so that the functions of uniform copper ion concentration in the electrolyte and uniform base film copper layer plating are realized, and the electroplating efficiency is improved.

Description

An electroplating apparatus for a composite copper current collector Technical Field

[0001] This invention relates to the field of electroplating technology for composite current collectors, and more specifically to an electroplating apparatus for a composite copper current collector. Background Technology

[0002] Composite copper current collectors are formed by dissolving copper ions in an electrolyte and then using electroplating technology to uniformly plate a copper layer onto both the upper and lower surfaces of an intermediate base film. Currently, two methods are used for plating the copper layer onto the base film: clamp plating and cathode roller plating. With clamp plating, the base film is deformed due to the clamping force on its edges. During roller transmission, this can easily cause deviations, leading to wrinkles and cracks in the base film. Furthermore, clamp plating results in a large number of conductive points and numerous connectors for the power supply wires. There are problems of wasted conductive power and high manufacturing costs; the latter is composed of a cathode roller and an insoluble anode titanium blue. When the power is turned on, the anode and cathode are subjected to electric field force. Without external force, the cathode roller cannot rotate. Therefore, the cathode roller in the electrolyte is subject to copper ion adhesion during electroplating, and the copper layer of the base film is easily damaged by friction. Even when the cathode roller is driven by an external servo motor, there are still problems of wrinkles in the base film caused by liquid pressure and the length of the electroplating tank.

[0003] Therefore, after comparing the two existing methods of clip plating and cathode roller plating, cathode roller plating has the advantages of saving energy, convenient power supply, reduced manufacturing cost, saving raw materials and eliminating the need for stripping compared to clip plating. In this plating technology, the cathode roller has an insoluble anode, which requires the continuous addition of copper ions into the electrolyte. However, the uneven concentration of copper ions added to the electrolyte causes uneven copper plating layer. In addition, the anode and cathode under the action of electric field force cannot rotate on their own to transmit the base film, making it difficult for the base film to pass through the electrolyte at a uniform speed, and thus cannot ensure the uniform thickness of the copper plating layer. Summary of the Invention

[0004] The purpose of this invention is to provide an electroplating apparatus for a composite copper current collector to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention discloses an electroplating apparatus for a composite copper current collector, comprising an electrolytic cell. From one end to the other on the outer side of the electrolytic cell, a plurality of sets of water inlets and outlets are sequentially arranged. From one end to the other inside the electrolytic cell, a flattening and wrinkle-removing roller shaft, a stainless steel cathode roller, a copper oxide ball adding device, a rectifier conductive assembly, a base film stretching roller assembly, and an anode titanium blue double-layer plate are sequentially arranged. The rectifier conductive assembly and the base film stretching roller assembly are arranged in an alternating configuration. The rectifier conductive assembly is fixedly connected to the anode titanium blue double-layer plate, and the copper oxide ball adding device and the anode titanium blue double-layer plate are movably connected.

[0006] The base film stretching roller assembly includes a conductive column, a motor, a gear, a rotating shaft, and a conveying wheel. The conductive column has a machine compartment inside, and the motor is located inside the machine compartment. The top of the motor is fixedly connected to the side of the gear, the other side of the gear is fixedly connected to the bottom of the rotating shaft, and the side of the rotating shaft is fixedly connected to the inner wall of the conveying wheel.

[0007] Optionally, the copper oxide ball adding device includes a gravity sensor plate, a handle, a copper ball mesh frame, a hydraulic cylinder, and ball meshes. The middle part of the upper surface of the gravity sensor plate and the middle part of the lower surface of the upper end of the copper ball mesh frame are connected by transmission through the upper and lower bottom surfaces of the hydraulic cylinder. The middle part of the side of the gravity sensor plate is fixedly connected to the end face of the handle. Several ball meshes are fixedly connected to the bottom of the copper ball mesh frame, and several liquid passage holes are opened on the side of the copper ball mesh frame.

[0008] Optionally, the anode titanium blue double-layer plate includes a titanium blue plate, and the interior of the titanium blue plate has a groove for placing copper balls.

[0009] Optionally, the flattening and wrinkle-removing roller includes a fixed roller frame, a central shaft, and rollers. The inner sides of the fixed roller frame are fixedly connected to the bottom surface of the central shaft, and the sides of the central shaft are movably connected to the inner wall of the rollers.

[0010] Optionally, the stainless steel cathode roller includes a set of fixed roller blocks, and a cathode roller shaft is disposed inside the fixed roller blocks.

[0011] Optionally, the lower surface shape of the rectifier conductive component is the same as the upper surface shape of the base film stretching roller component, and both are arc-shaped to prevent scratching the base film; there are two anode titanium blue double-layer plates, which are placed on the upper and lower sides of the base film respectively, and the distance from the base film surface is 2-3cm. The wall thickness of the anode titanium blue double-layer plate is 2-5mm, which is used as a soluble anode. Copper balls are added and dissolved in the electrolyte to diffuse copper ions in the solution for electroplating the upper and lower surfaces of the base film.

[0012] Optionally, the extension height of the hydraulic cylinder is 3-6cm, used to adjust the height of the copper ball mesh frame from the surface of the gravity sensor plate and to control the height of the copper balls inside the mesh from the base film in the electrolyte. When the copper balls inside the mesh frame are consumed and reduced during continuous electrolysis, their copper ion concentration and height from the base film change, which is used to improve electroplating efficiency. The shape of the mesh is hemispherical, and its diameter is d<6cm, which is used to uniformly add the concentration of copper ions in the electrolyte and increase the dissolution surface area. During the electroplating process, the copper plating layer thickness is 900-1150nm.

[0013] Optionally, the copper oxide ball adding device is connected to an electrolyte detection module, which includes a copper ion detector. The copper ion detector detects the concentration of dissolved copper ions in the copper balls placed inside the copper ball mesh frame in real time after contacting the electrolyte, and transmits the detection signal to the electrolyte detection module to determine the copper ion concentration value in the electrolyte. Based on the decrease in the mass of the dissolved copper balls during electrolysis, the hydraulic cylinder is raised to adjust the copper ball mesh frame according to the pressure sensing of the gravity sensor plate, and the height of the copper ions in the electrolyte from the base film is continuously fine-tuned.

[0014] The base film stretching roller assembly is connected to a servo motor synchronous drive module, which includes a uniform speed control unit. The uniform speed control unit controls several pairs of motors inside the machine chamber to perform synchronous drive at the same frequency and speed. Under uniform speed, the conveyor wheel uses constant force to convey both sides of the base film in the electrolyte, so that it is uniformly electroplated during the electroplating process, without wrinkles, and will not be torn or broken due to uneven force.

[0015] Optionally, the stainless steel cathode roller, the rectifier conductive component, and the anode titanium blue double-layer plate are all connected to an anode and cathode conductive rectifier module. The anode and cathode conductive rectifier module includes a rectifier parameter display and control unit. The parameters of the rectifier parameter display and control unit include current density, electric field strength, and current magnitude. The rectifier parameter display and control unit adjusts the parameters of the stainless steel cathode roller and the anode titanium blue double-layer plate according to the required copper layer thickness in the electrolyte after the rectifier conductive component is connected, for uniform copper plating. The current density in the electroplating electrolyte is proportional to the electric field strength of the stainless steel cathode roller and the anode titanium blue double-layer plate, satisfying the formula... In the formula, D k Current density, in A / m 2 I is the current intensity; S is the total area of ​​the positive and negative electrodes; and D is the current intensity. k =γ×E, where D k Current density, in A / m 2 γ is conductivity, in units of S / m; E is electric field strength, in units of V / m.

[0016] Optionally, the following operation steps may be included:

[0017] Step 1: Inside the electrolytic cell injected with electrolyte, start the servo motor synchronous drive module in the base film stretching roller assembly, and use the uniform speed control unit to control the constant force transmission speed of the base film in the electrolyte by the conveyor wheel.

[0018] Step 2: At the same time, copper oxide balls are added using a copper oxide ball adding device and placed inside the anode titanium blue double-layer plate. They are dissolved in the electrolyte in the electrolytic cell. The copper ion concentration in the electrolyte is detected by a copper ion detector through an electrolyte detection module. Based on the consumption of copper balls in the electroplated copper layer, the hydraulic cylinder is adjusted to raise and lower the position of the copper balls in the ball net from the base film.

[0019] Step 3: The current is connected to the stainless steel cathode roller and the titanium blue anode double-layer plate through the rectifier conductive component to form the anode and cathode of the electroplating. Copper ions in the electrolyte are deposited onto the upper and lower surfaces of the base film by the electric field force. During the electroplating process, as the base film is subjected to constant force transmission speed, the parameters of the rectification parameter display and control unit in the anode and cathode conductive rectifier module are adjusted. Specifically, the current magnitude is controlled to ensure the electroplating speed, and the current density is controlled to prevent ions from charging and breaking down the base film.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] 1. This invention employs a copper oxide ball addition device. By adding copper oxide balls to the soluble anode titanium blue in the copper plating process of the cathode roller and anode titanium blue, the copper ion concentration is adjusted by dissolving them in the electrolyte. The copper balls are evenly distributed in the electrolyte by the ball mesh, and the position of the copper balls from the base film is controlled by the hydraulic cylinder. This achieves the function of uniform copper ion concentration in the electrolyte and uniform copper plating of the base film, thereby improving the plating efficiency and achieving a uniform coating effect.

[0022] 2. This invention employs a base film stretching roller assembly structure, utilizing a conductive column with a built-in motor connected to a servo motor synchronous drive module for synchronized operation. This allows the uniform speed control unit to maintain a constant force on the base film's transmission speed. The electroplating base film is conveyed via a set of conveyor wheels rotating clockwise and counterclockwise, achieving constant force transmission and preventing uneven stress that could lead to tearing or breakage of the base film. This also reduces the tension of the base film during operation in the electrolyte, resulting in stable base film operation and a stable electroplated copper layer.

[0023] 3. This invention employs a system of modules including an electrolyte detection module, an anode and cathode conductive rectification module, and a servo motor synchronous drive module. Through systematic intelligent control, it collects copper ion concentration signals, controls the speed of base film transmission, and regulates the magnitude and density of the current during electroplating. This achieves the function of a high-precision electroplated composite copper current collector, resulting in precision, efficiency, and stability of the electroplated copper layer. Attached Figure Description

[0024] Figure 1 is a front view of the electroplating device structure of the composite copper current collector of the present invention.

[0025] Figure 2 is a side view of the electroplating device structure of the composite copper current collector of the present invention.

[0026] Figure 3 is a schematic diagram of the copper oxide ball adding device and the double-layer plate structure of the anode titanium blue of the present invention.

[0027] Figure 4 is a longitudinal cross-sectional view of the base film stretching roller assembly structure of the present invention.

[0028] Figure 5 is an exploded view of the base film stretching roller assembly structure of the present invention.

[0029] Figure 6 is a longitudinal cross-sectional view of the electroplating device structure of the composite copper current collector of the present invention.

[0030] Figure 7 is a flowchart of the electroplating apparatus for the composite copper current collector of the present invention.

[0031] The attached diagram is labeled as follows: 1. Electrolytic cell; 2. Water inlet; 3. Drain outlet;

[0032] 4. Flattening and wrinkle-removing roller shaft; 401. Fixed roller frame; 402. Central shaft; 403. Roller;

[0033] 5. Stainless steel cathode roller components; 501. Fixed roller block; 502. Cathode roller shaft;

[0034] 6. Copper oxide ball adding device; 601. Gravity sensor plate; 602. Handle; 603. Copper ball mesh frame; 604. Hydraulic cylinder; 605. Liquid passage hole; 606. Ball mesh; 7. Rectifier conductive component;

[0035] 8. Base film stretching roller assembly; 801. Conductive column; 802. Machine housing; 803. Motor; 804. Gear; 805. Rotating shaft; 806. Conveyor wheel;

[0036] 9. Anode titanium blue double-layer plate; 901. Titanium blue plate; 902. Copper ball groove;

[0037] 10. Electrolyte copper ion detection module; 1001. Copper ion detector;

[0038] 11. Anode and cathode conductive rectifier module; 1101. Rectifier parameter display and control unit;

[0039] 12. Servo motor synchronous drive module; 1201. Uniform speed control unit. Detailed Implementation

[0040] The technical solution of the present invention will be described in detail below through specific embodiments.

[0041] Example 1

[0042] Referring to Figures 1-6, the present invention provides an electroplating apparatus for a composite copper current collector, comprising an electrolytic cell 1. From one end to the other end of the front side of the electrolytic cell 1, a plurality of sets of water inlets 2 and drain outlets 3 are sequentially arranged. From one end to the other end inside the electrolytic cell 1, a flattening and wrinkle-removing roller shaft 4, a stainless steel cathode roller 5, a copper oxide ball adding device 6, a rectifier conductive component 7, a base film stretching roller assembly 8, and an anode titanium blue double-layer plate 9 are sequentially arranged. The rectifier conductive component 7 and the base film stretching roller assembly 8 are arranged in an alternating combination. The rectifier conductive component 7 and the anode titanium blue double-layer plate 9 are fixedly connected. The copper oxide ball adding device 6 and the anode titanium blue double-layer plate 9 are movably connected.

[0043] The base film stretching roller assembly 8 includes a conductive post 801, a motor 803, a gear 804, a rotating shaft 805, and a conveyor wheel 806. The conductive post 801 has a machine compartment 802 inside. The motor 803 is located inside the machine compartment 802. The top of the motor 803 is fixedly connected to the side of the gear 804. The other side of the gear 804 is fixedly connected to the bottom of the rotating shaft 805. The side of the rotating shaft 805 is fixedly connected to the inner wall of the conveyor wheel 806.

[0044] In a preferred embodiment, the copper oxide ball adding device 6 specifically includes a gravity sensor plate 601, a handle 602, a copper ball mesh frame 603, a hydraulic cylinder 604, and ball meshes 606. The middle part of the upper surface of the gravity sensor plate 601 and the middle part of the lower surface of the upper end of the copper ball mesh frame 603 are connected by transmission through the upper and lower bottom surfaces of the hydraulic cylinder 604. The middle part of the side of the gravity sensor plate 601 is fixedly connected to the end face of the handle 602. Several ball meshes 606 are fixedly connected to the bottom of the copper ball mesh frame 603. Several liquid passage holes 605 are opened on the side of the copper ball mesh frame 603.

[0045] In a preferred embodiment, the anode titanium blue double-layer plate 9 specifically includes a titanium blue plate 901, and a copper ball groove 902 is formed inside the titanium blue plate 901.

[0046] In a preferred embodiment, the flattening and wrinkle-removing roller 4 specifically includes a fixed roller frame 401, a central shaft 402, and a roller 403. The inner side of the fixed roller frame 401 is fixedly connected to the bottom surface of the central shaft 402, and the side of the central shaft 402 is movably connected to the inner wall of the roller 403.

[0047] In a preferred embodiment, the stainless steel cathode roller 5 specifically includes a set of fixed roller blocks 501, and a cathode roller shaft 502 is disposed inside the fixed roller blocks 501.

[0048] In a preferred embodiment, the lower surface shape of the rectifier conductive component 7 is the same as the upper surface shape of the base film stretching roller component 8, and both are arc-shaped to prevent scratching the base film. There are two anode titanium blue double-layer plates 9, which are placed on the upper and lower sides of the base film respectively, and the distance from the base film surface is 2-3 cm. The wall thickness of the anode titanium blue double-layer plate 9 is 2-5 mm, which is used as a soluble anode. Copper balls are added and dissolved in the electrolyte to diffuse copper ions in the solution to electroplate the upper and lower surfaces of the base film.

[0049] In a preferred embodiment, the extension height of the hydraulic cylinder 604 is 3-6 cm, which is used to adjust the height of the copper ball mesh frame 603 from the surface of the gravity sensor plate 601 and to control the height of the copper balls in the mesh 606 from the base film in the electrolyte. When the copper balls inside the mesh frame 603 are consumed and reduced during continuous electrolysis, their copper ion concentration and height from the base film change, which is used to improve electroplating efficiency. The mesh 606 is hemispherical in shape with a diameter of d < 6 cm, which is used to uniformly add copper ions to the electrolyte and increase the dissolved surface area. During the electroplating process, the copper plating layer thickness is 900-1150 nm.

[0050] Example 2

[0051] Referring to Figure 7, the present invention provides an electroplating apparatus for a composite copper current collector, including a copper oxide ball adding device 6 connected to an electrolyte detection module 10. The electrolyte detection module 10 includes a copper ion detector 1001. The copper ion detector 1001 detects in real time the concentration of dissolved copper ions in the copper balls placed inside the copper ball grid 603 after contacting the electrolyte, and transmits the detection signal to the electrolyte detection module 10 to determine the copper ion concentration value of the electrolyte. Based on the decrease in the mass of the dissolved copper balls during the electrolysis process, the hydraulic cylinder 604 is adjusted to lift the copper ball grid 603 according to the pressure sensing of the gravity sensor plate 601, and the height of the copper ions in the electrolyte from the base film is continuously fine-tuned.

[0052] The base film stretching roller assembly 8 is connected to a servo motor synchronous drive module 12. The servo motor synchronous drive module 12 includes a uniform speed control unit 1201. The uniform speed control unit 1201 controls several pairs of motors 803 inside the machine compartment 802 to perform synchronous drive at the same frequency and speed. Under uniform speed, the conveyor wheel 806 uses constant force to convey both sides of the base film in the electrolyte, so that it is uniformly electroplated during the electroplating process, without wrinkles, and without tearing or cracking due to uneven force.

[0053] In a preferred embodiment, the stainless steel cathode roller 5, the rectifier conductive component 7, and the anode titanium blue double-layer plate 9 are all connected to an anode and cathode conductive rectifier module 11. The anode and cathode conductive rectifier module 11 includes a rectification parameter display and control unit 1101. The parameters of the rectification parameter display and control unit 1101 include current density, electric field strength, and current magnitude. The rectification parameter display and control unit 1101 adjusts the parameters of the stainless steel cathode roller 5 and the anode titanium blue double-layer plate 9 according to the requirements of the copper plating layer thickness in the electrolyte after the rectifier conductive component 7 is connected, for uniform copper plating. The current density in the plating electrolyte is proportional to the electric field strength of the stainless steel cathode roller 5 and the anode titanium blue double-layer plate 9, satisfying the formula... In the formula, D k Current density, in A / m 2 I is the current intensity; S is the total area of ​​the positive and negative electrodes; and D is the current intensity. k =γ×E, where D k Current density, in A / m 2 γ is conductivity, in units of S / m; E is electric field strength, in units of V / m.

[0054] In a preferred embodiment, the following operational steps are specifically described:

[0055] Step 1: Inside the electrolytic cell 1 injected with electrolyte, the servo motor synchronous drive module 12 in the base film stretching roller assembly 8 is started, and the constant force transmission speed of the base film in the electrolyte is controlled by the uniform speed control unit 1201.

[0056] Step 2: Simultaneously, copper oxide balls are added using the copper oxide ball adding device 6 and placed inside the anode titanium blue double-layer plate 9, dissolving into the electrolyte in the electrolytic cell 1. The copper ion concentration in the electrolyte is received by the detection module 10 of the electrolyte and detected by the copper ion detector 1001. Based on the consumption of copper balls in the electroplated copper layer, the hydraulic cylinder 604 is adjusted to raise and lower, thereby adjusting the position of the copper balls in the ball mesh 606 from the base film.

[0057] Step 3: The current is connected to the stainless steel cathode roller 5 and the anode titanium blue double-layer plate 9 through the rectifier conductive component 7 to form the anode and cathode of electroplating. Copper ions in the electrolyte are deposited onto the upper and lower surfaces of the base film by the electric field force. During the electroplating process, as the base film is subjected to constant force transmission speed, the parameters of the rectification parameter display and control unit 1101 in the anode and cathode conductive rectifier module 11 are adjusted. Specifically, the current magnitude is controlled to ensure the electroplating speed, and the current density is controlled to prevent ions from charging and breaking down the base film.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the invention. Any modifications, equivalent substitutions, improvements, etc., made within the design concept of the present invention should be included within the protection scope of the present invention.

Claims

1. An electroplating apparatus for a composite copper current collector, characterized in that: The electrolytic cell includes several sets of water inlets and outlets arranged sequentially from one end to the other on the outer side of the front of the electrolytic cell. Inside the electrolytic cell, from one end to the other, are arranged sequentially a flattening and wrinkle-removing roller shaft, a stainless steel cathode roller, a copper oxide ball adding device, a rectifier conductive assembly, a base film stretching roller assembly, and an anode titanium blue double-layer plate. The rectifier conductive assembly and the base film stretching roller assembly are arranged alternately. The rectifier conductive assembly is fixedly connected to the anode titanium blue double-layer plate, and the copper oxide ball adding device is movably connected to the anode titanium blue double-layer plate. The copper oxide ball adding device includes a gravity sensor plate, a handle, a copper ball mesh frame, a hydraulic cylinder, and a ball mesh. The middle of the upper surface of the gravity sensor plate and the middle of the lower surface of the upper end of the copper ball mesh frame are connected by the upper and lower bottom surfaces of the hydraulic cylinder. The system is dynamically connected, with the ball net being hemispherical in shape and a diameter d < 6 cm; the anode titanium blue double-layer plate includes a titanium blue plate, the interior of which has a groove for placing copper balls, the distance between the anode titanium blue double-layer plate and the surface of the base film is 2-3 cm, and the wall thickness is 2-5 mm; the base film stretching roller assembly includes a conductive column, a motor, a gear, a rotating shaft, and a conveying wheel, the conductive column having a machine compartment inside, the motor being located inside the machine compartment, the top of the motor being fixedly sleeved with the side of the gear, the other side of the gear being fixedly connected with the bottom of the rotating shaft, and the side of the rotating shaft being fixedly sleeved with the inner wall of the conveying wheel; the base film stretching roller assembly is connected to a servo motor synchronous drive module, the servo motor synchronous drive module including a uniform speed control unit.

2. The electroplating apparatus for a composite copper current collector according to claim 1, characterized in that: The middle part of the side of the gravity sensor plate is fixedly connected to the end face of the handle, and several ball nets are fixedly connected to the bottom of the copper ball net frame. Several liquid passage holes are opened on the side of the copper ball net frame.

3. The electroplating apparatus for a composite copper current collector according to claim 1, characterized in that: The flattening and wrinkle-removing roller shaft includes a fixed roller frame, a central shaft, and rollers. The inner side surfaces of the fixed roller frame are fixedly connected to the bottom surface of the central shaft, and the side surfaces of the central shaft are movably connected to the inner wall of the rollers.

4. The electroplating apparatus for a composite copper current collector according to claim 1, characterized in that: The stainless steel cathode roller includes a set of fixed roller blocks, and a cathode roller shaft is arranged inside the fixed roller blocks.

5. The electroplating apparatus for a composite copper current collector according to claim 1, characterized in that: The lower surface shape of the rectifier conductive component is the same as the upper surface shape of the base film stretching roller component. There are two anode titanium blue double-layer plates, which are placed on the upper and lower sides of the base film respectively, and are used as soluble anodes.

6. The electroplating apparatus for a composite copper current collector according to claim 2, characterized in that: The extension / retraction height of the hydraulic cylinder is 3-6cm.

7. The electroplating apparatus for a composite copper current collector according to claim 1, characterized in that: The copper oxide ball adding device is connected to an electrolyte detection module, which includes a copper ion detector.

8. The electroplating apparatus for a composite copper current collector according to claim 1, characterized in that: The stainless steel cathode roller, the rectifier conductive component, and the anode titanium blue double-layer plate are all connected to a cathode and anode conductive rectifier modules. The cathode and anode conductive rectifier modules include a rectifier parameter display and control unit. The parameters of the rectifier parameter display and control unit include current density, electric field strength, and current magnitude.

9. The electroplating apparatus for a composite copper current collector according to claim 1, characterized in that: The operation includes the following steps: Step 1, inside the electrolytic cell filled with electrolyte, the servo motor synchronous drive module in the base film stretching roller assembly is activated, and the constant force transmission speed of the base film in the electrolyte is controlled by the uniform speed control unit; Step 2, simultaneously, copper oxide balls are added using the copper oxide ball adding device, placed inside the anode titanium blue double-layer plate, and dissolved into the electrolyte in the electrolytic cell. The copper ion concentration in the electrolyte is detected by the copper ion detector through the electrolyte detection module, and the copper plating layer is then adjusted accordingly. The copper balls are consumed, and the position of the copper balls in the ball net relative to the base film is adjusted by regulating the lifting and lowering of the hydraulic cylinder; in the third step, the current of the stainless steel cathode roller and the anode titanium blue double-layer plate is connected through the rectifier conductive component to form the anode and cathode of electroplating, so that the copper ions in the electrolyte are plated onto the upper and lower surfaces of the base film by the electric field force. During the electroplating process, as the base film is subjected to constant force transmission speed, the parameters of the rectification parameter display and control unit in the anode and cathode conductive rectifier module are adjusted, specifically to control the current magnitude to ensure the electroplating speed and to control the current density to prevent the ions from charging and breaking down the base film.

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