Camera module and optical device comprising the same

Abstract

A camera module according to an embodiment includes a circuit board, a protrusion disposed above the circuit board, an adhesive member disposed above the circuit board and including an opening overlapping the protrusion in a vertical direction, and a sensor base disposed on the adhesive member and including a recessed portion overlapping the protrusion in the vertical direction, wherein the protrusion is inserted into the recessed portion of the sensor base, and wherein the adhesive member has a closed loop shape surrounding an edge region of an upper surface of the circuit board.

Description

Technical Field

[0001] The implementation relates to a camera module and an optical device including the camera module. Background Technology

[0002] With the widespread adoption of various portable terminals and the commercialization of wireless internet services, consumer demand related to portable terminals has diversified, and various types of add-ons have been installed in portable terminals.

[0003] As a representative embodiment, a camera module has photos or videos of the subject being photographed.

[0004] Recently, due to the need for high-performance lenses in camera modules, the diameter of lenses and lens barrels has tended to increase.

[0005] Furthermore, as the lenses and lens barrels become larger, the sensor base also tends to increase in size accordingly. The sensor base is positioned between the lens drive unit and the circuit board, and therefore includes a mounting portion on which a filter is disposed.

[0006] On the other hand, due to various recent issues, there is a trend to remove support components (such as protrusions formed on the sensor base). Therefore, the sensor base and circuit board can be connected by using adhesives such as epoxy resin.

[0007] However, if the sensor base does not include a support section, it moves in the up, down, left, and right directions due to the use of a pressing clamp when the adhesive component cures. Furthermore, when the sensor base moves, the black masking area of ​​the infrared filter on the sensor base covers the effective pixel area of ​​the image sensor, contributing to various optical problems such as glare and overlap.

[0008] Therefore, recently, when attaching a sensor base that does not include a support, pressing clamps are not used to solve the above problems.

[0009] However, when the pressing clamp is not used, it is difficult to ensure active alignment between the sensor base and the lens drive, and the filter is damaged due to contact with the lens module during drop tests, roll tests and residual impact reliability tests due to uncontrolled height.

[0010] In addition, there is a problem that when the sensor base is pressed onto the adhesive component, the sensor base separates from the circuit board because the adhesive component has not cured. Summary of the Invention

[0011] Technical issues

[0012] The embodiment provides a camera module capable of increasing the bonding force between a circuit board and a sensor base, as well as an optical device including the camera module.

[0013] Furthermore, the embodiments provide a camera module capable of improving alignment between a circuit board and a sensor base, as well as an optical device including the camera module.

[0014] The technical problems to be solved by the proposed embodiments are not limited to those described above, and those skilled in the art to which the embodiments described below pertain can clearly understand other technical problems not mentioned.

[0015] Technical solution

[0016] The camera module according to an embodiment includes: a circuit board; a protrusion disposed on the circuit board; an adhesive member disposed on the circuit board and including an opening that vertically overlaps with the protrusion; and a sensor base disposed on the adhesive member and including a recess that vertically overlaps with the protrusion, wherein the protrusion is inserted into the recess of the sensor base, and wherein the adhesive member has a closed-loop shape surrounding an edge region of an upper surface of the circuit board.

[0017] In addition, the protrusions include solder balls.

[0018] In addition, the recessed portion includes a recessed portion that extends from the lower surface of the sensor base toward the upper surface of the sensor base.

[0019] In addition, the protrusion includes: a first protrusion disposed in a first corner region on the upper surface of the circuit board; and a second protrusion disposed in a second corner region on the upper surface of the circuit board, the second corner region being located in a direction diagonally opposite to the first corner region.

[0020] In addition, the recessed portion includes a first recessed portion disposed in the region where it overlaps with the first protrusion on the lower surface of the sensor base in the vertical direction; and a second recessed portion disposed in the region where it overlaps with the second protrusion on the lower surface of the sensor base in the vertical direction.

[0021] In addition, the adhesive component is arranged around the outer surface of the protrusion inserted into the opening.

[0022] In addition, the upper surface of the protrusion is positioned above the upper surface of the adhesive component.

[0023] In addition, the lower surface of the sensor base is positioned below the upper surface of the protrusion.

[0024] In addition, the camera module includes an image sensor mounted on a circuit board; and the adhesive members do not overlap with the image sensor in the vertical direction and are arranged around the image sensor.

[0025] On the other hand, the optical device according to the embodiment includes: a body; a camera module disposed on the body and capturing an image of an object; and a display unit disposed on the body and outputting the image captured by the camera module, wherein the camera module includes: a circuit board; a protrusion disposed on the circuit board; an adhesive member disposed on the circuit board and including an opening overlapping the protrusion in the vertical direction; and a sensor base disposed on the adhesive member and including a recessed portion overlapping the protrusion in the vertical direction, wherein the protrusion is inserted into the recessed portion of the sensor base, and wherein the adhesive member has a closed-loop shape surrounding an edge region of the upper surface of the circuit board.

[0026] Invention Effects

[0027] This embodiment allows the solder balls to be fitted into the recessed portion when attaching the sensor base by placing solder balls on the upper surface of the circuit board and providing a recessed portion on the lower surface of the sensor base. According to this embodiment, when the sensor base is attached to the circuit board, the solder balls can solve the problem of sensor base misalignment even when using a pressing clamp, and reliability can be improved by preventing the effective area of ​​the image sensor from being covered by the black mask of the filter.

[0028] Furthermore, when connecting the sensor base, this embodiment can increase the connection force of the sensor base by using a pressing clamp, thus ensuring a constant bonding layer thickness (BLT) height.

[0029] Furthermore, this embodiment uses an adhesive member surrounding the area where the sensor base is to be mounted, allowing the camera module to be cleaned while the sensor base is attached. Specifically, when cleaning the camera module without the adhesive member, moisture or water seeps into the sensor base, causing a dampness defect. Conversely, this embodiment prevents moisture or water from penetrating through the adhesive member, thereby solving the dampness defect. Attached Figure Description

[0030] Figure 1 This is a perspective view of the camera module according to the implementation method.

[0031] Figure 2 This is an exploded perspective view of the camera module according to the implementation method.

[0032] Figure 3 This is a cross-sectional view of the camera module according to an embodiment.

[0033] Figure 4 yes Figure 3 A magnified partial cross-sectional view.

[0034] Figure 5This is a plan view of the circuit board viewed from above, according to the embodiment.

[0035] Figure 6 It is an adhesive component connected to Figure 5 A plan view of the circuit board's state.

[0036] Figure 7 This is a perspective view of the sensor base of the camera module according to the embodiment.

[0037] Figure 8 This is a bottom-view perspective view of the sensor base of the camera module according to the embodiment.

[0038] Figure 9 This is a perspective view of the sensor base of a camera module according to a variant embodiment of the implementation.

[0039] Figure 10 This is a perspective view of the optical device according to the embodiment. Detailed Implementation

[0040] In the following, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0041] However, the spirit and scope of the invention are not limited to the portion of the described embodiments, and may be implemented in various other forms. Furthermore, one or more elements in the embodiments may be selectively combined and substituted within the spirit and scope of the invention.

[0042] Furthermore, unless otherwise explicitly defined and described, the terms used in embodiments of the present invention (including technical and scientific terms) may be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and terms such as those defined in common dictionaries may be interpreted as having a meaning consistent with their meaning in the context of the relevant field.

[0043] Furthermore, the terminology used in the embodiments of this invention is for the purpose of describing the embodiments and not for limiting the invention. In this specification, the singular form may also include the plural form unless specifically stated in the phrase, and when described in “at least one (or more) of A, B and C”, it may include at least one of all combinations that can be combined among A, B and C.

[0044] Furthermore, in describing the elements of embodiments of the present invention, terms such as first, second, A, B, (A), and (b) may be used. These terms are used only to distinguish an element from other elements, and these terms are not limited to the nature, order, or sequence of the elements. Moreover, when an element is described as being “connected,” “linked,” or “in contact” with another element, this can include not only when the element is directly “connected,” “linked,” or “in contact” with other elements, but also when the element is “connected,” “linked,” or “in contact” through another element between the element and other elements.

[0045] Furthermore, when described as being formed or disposed "above" or "below" each element, "above" or "below" can include not only cases where two elements are directly connected to each other, but also cases where one or more other elements are formed or disposed between the two elements. Moreover, when expressed as "above" or "below," it can include not only the upward direction based on a single element, but also the downward direction based on a single element.

[0046] The optical axis direction used below is defined as the optical axis direction of the camera actuator and lens connected to the camera module. The vertical direction can be defined as the direction perpendicular to the optical axis.

[0047] The "autofocus function" used below is defined as a function that automatically adjusts the focus on the object by adjusting the distance from the image sensor and moving the lens along the optical axis according to the distance to the object, thereby obtaining a sharp image of the object on the image sensor. "Autofocus" can be used interchangeably with "AF".

[0048] The "shake correction function" used below is defined as the function of moving or tilting the lens module in a direction perpendicular to the optical axis to counteract vibrations (movements) caused by external forces in the image sensor. "Shake correction" can be used interchangeably with "OIS (Optical Image Stabilization)".

[0049] In the following text, "lens drive unit" can be used interchangeably with "voice coil motor (VCM)".

[0050] In the following description, the construction of the camera module according to this embodiment will be described with reference to the accompanying drawings.

[0051] Figure 1 This is a perspective view of the camera module according to the implementation method. Figure 2 This is an exploded perspective view of the camera module according to the implementation method. Figure 3 This is a cross-sectional view of the camera module according to the embodiment. Figure 4 yes Figure 3 A partially enlarged sectional view. Figure 5 This is a plan view of the circuit board viewed from above, according to the embodiment. Figure 6 It is an adhesive component connected to Figure 5 A plan view of the circuit board's state. Figure 7 This is a perspective view of the sensor base of the camera module according to the embodiment. Figure 8 This is a bottom-view perspective view of the sensor base of the camera module according to the embodiment.

[0052] The camera module may include a lens drive unit 10, a lens module 20, a sensor base 30, a filter 40, an image sensor 50, a circuit board 60, a connector 70, an adhesive 80, a protective member 90, and a controller (not shown). However, in the camera module, any one or more of the lens drive unit 10, lens module 20, sensor base 30, filter 40, image sensor 50, circuit board 60, connector 70, adhesive 80, protective member 90, and controller may be omitted or changed.

[0053] Meanwhile, an adhesive member 65 is disposed between the sensor base 30 and the circuit board 60. The adhesive member can provide adhesive force between the sensor base 30 and the circuit board 60. Therefore, the sensor base 30 can be firmly attached to the circuit board 60. In this case, the adhesive member 65 can be formed on the circuit board 60 in a closed-loop shape. Simultaneously, a protrusion 62 is formed on the circuit board 60. The protrusion 62 can be, for example, a solder ball. Hereinafter, the protrusion will be described as a solder ball.

[0054] Solder balls 62 can be formed in the corner areas of the circuit board 60. Specifically, multiple solder balls 62 can be formed on the circuit board 60. For example, the solder balls 62 can include multiple solder balls, each formed in multiple corner areas of the circuit board 60. That is, the solder balls 62 can be formed in two corner areas of the circuit board 60 located in opposite directions. The solder balls 62 can overlap with the sensor base 30 in the optical axis direction. That is, the solder balls 62 can be formed in the corner area of ​​the circuit board 60 where the sensor base 30 is to be mounted.

[0055] In addition, the adhesive member 65 can be formed on the upper surface of the circuit board 60 in the area where the sensor base 30 is to be disposed.

[0056] The adhesive member 65 may have an opening that allows solder balls 62 disposed on the upper surface of the circuit board 60 to pass through. Furthermore, the solder balls 62 may protrude through the opening of the adhesive member 65. Specifically, the solder balls 62 may protrude above the upper surface of the adhesive member 65. For example, the upper surface of the solder balls 62 may be positioned higher than the upper surface of the adhesive member 65. The solder balls 62 are inserted into the opening of the adhesive member 65 such that at least a portion of their outer surface may be surrounded by the adhesive member 65. This will be described in more detail below.

[0057] Before explaining the construction of the present invention, the active alignment module is mounted on the sensor base by the steps of coating the upper surface of the sensor base 30 with epoxy resin after assembling the image sensor 50, the circuit board 60 and the sensor base 30, and the steps of actively aligning (autofocusing) the components of the lens drive device 10 and the lens module 20.

[0058] Due to the recent trend towards higher lens performance, the diameter of the lens module 20 has been increasing. However, given the limited size of the relatively compact lens drive unit 10, the increased diameter of the lens module 20 reduces the adhesion area between the sensor base 30 and the lens drive unit 10.

[0059] Correspondingly, the adhesive area between the circuit board 60 and the sensor base 30 is also reduced. Therefore, when the sensor base 30 is attached to the circuit board 60 without using a pressing clamp, the adhesive force of the sensor base 30 is reduced. In this embodiment, after assembling the image sensor 50, the printed circuit board 10, and the sensor base 30, epoxy resin is applied to the upper surface of the sensor base 30. In this case, active alignment epoxy resin must be applied to the recessed structure. Afterward, the module can be completed after mounting the lens drive device 10 via active alignment.

[0060] The characteristic of this embodiment is that the recessed structure is applied to the upper surface of the sensor base 30. In this embodiment, when the recessed structure is applied to the surface coated with active alignment epoxy resin, the epoxy resin flows into the recessed portion, and the adhesive strength of the active alignment epoxy resin can be increased by increasing the adhesive area with the lens drive device 10. In this case, due to the increased adhesive strength, separation of the lens drive device 10 after drop and tumble tests can be prevented. Furthermore, when the recessed structure is not applied, the external epoxy resin additional sealing process of the lens drive device 10, which is used as a method to prevent separation of the lens drive device 10, can be omitted. In addition, the phenomenon of active alignment epoxy resin being introduced into the filter 40 due to over-coating can be prevented.

[0061] In other words, this embodiment increases the connection force between the sensor base 30 and the circuit board 60 by changing the connection structure between the sensor base 30 and the circuit board 60, as well as the connection structure between the sensor base 30 and the lens driving device 10, thereby improving reliability.

[0062] The lens driving device 10 can be connected to the sensor base 30. The lens driving device 10 can be disposed on the upper surface of the sensor base 30. The lens driving device 10 may include a substrate 730 disposed on the side surface of the lens driving device 10. The lens driving device 10 can be connected to the lens module 20. The lens driving device 10 can move the connected lens module 20.

[0063] Lens module 20 may include at least one lens. Lens module 20 may include a lens and a lens barrel.

[0064] Lens module 20 may include a lens barrel and at least one lens housed within the lens barrel. However, one configuration of lens module 20 is not limited to a lens barrel, and any retainer structure capable of supporting one or more lenses may be used. Lens module 20 may be coupled to the interior of lens drive unit 10. Lens module 20 may be coupled to bracket 210 of lens drive unit 10. Lens module 20 may be integrally movable with bracket 210. Lens module 20 may be coupled to bracket 210 by adhesive (not shown). For example, lens module 20 may be threaded onto bracket 210. Meanwhile, light passing through lens module 20 may illuminate image sensor 50.

[0065] The sensor base 30 can be disposed on the upper surface of the circuit board 60. The sensor base 30 can be disposed below the lens driving device 10. The sensor base 30 can be disposed between the circuit board 60 and the lens driving device 10. The sensor base 30 can house the image sensor 50. The sensor base 30 can be formed of an injection-molded material. The sensor base 30 can be formed of an insulating material.

[0066] The sensor base 30 may include a body portion 31 and a support portion 32. However, any one or more of the body portion 31 and the support portion 32 in the sensor base 30 may be omitted or changed. The sensor base 30 may include a body portion 31 having a through hole 31a disposed above the image sensor 50. The sensor base 30 may include a support portion 32 extending downward from the outer periphery of the body portion 31 and disposed on the upper surface of the circuit board 60.

[0067] The body portion 31 can be disposed above the image sensor 50. A through hole 31a can be formed in the body portion 31. A support portion 32 can be formed on the outer periphery of the body portion 31. The lens driving device 10 can be disposed on the upper surface of the body portion 31.

[0068] The support portion 32 can extend downward from the outer periphery of the body portion 31. The support portion 32 can be disposed on the upper surface of the circuit board 60. Preferably, the adhesive member 65 can be disposed between the support portion 32 of the sensor base 30 and the upper surface of the circuit board 60. Furthermore, the support portion 32 of the sensor base 30 can be attached to the upper surface of the circuit board 60 by means of the adhesive member 65.

[0069] The support portion 32 can support the body portion 31 relative to the circuit board 60. Thus, the body portion 31 can be spaced apart from the upper surface of the circuit board 60 and the image sensor 50.

[0070] Simultaneously, a recessed portion may be formed in the support portion 32. For example, the recessed portion may be a portion that is recessed in the direction from the lower surface of the support portion to the upper surface of the support portion. Hereinafter, the recessed portion will be described as a recessed recess.

[0071] Multiple first recessed recesses 32a and 32b can be formed on the lower surface of the support portion 32.

[0072] In other words, a plurality of first recessed portions 32a, 32b can be formed on the lower surface of the sensor base 30. For example, the first recessed portions 32a, 32b can be formed on each of two corner regions located in opposite directions on the lower surface of the sensor base 30.

[0073] The first recesses 32a and 32b can be recessed inward from the lower surface of the support portion 32. The first recesses 32a and 32b can be formed to guide the connection with the circuit board 60. That is, the first recesses 32a and 32b can correspond to the solder balls 62 formed on the circuit board 60.

[0074] Specifically, the first recessed portions 32a and 32b may have a shape and size corresponding to the solder balls 62 formed on the circuit board 60. That is, when the sensor base 30 is connected to the circuit board 60, the solder balls 62 disposed on the upper surface of the circuit board 60 can be inserted into the first recessed portions 32a and 32b of the sensor base 30. Furthermore, the third recessed portion 37 may be recessedly disposed on the lower surface of the sensor base 30 via the support portion 32.

[0075] The sensor base 30 may include a second recess 33, which is recessed on the upper surface of the sensor base 30 and accommodates at least a portion of the adhesive 80.

[0076] The second recess 33 may be recessed into the upper surface of the sensor base 30. The second recess 33 may accommodate at least a portion of the adhesive 80 for attachment to the sensor drive device. The adhesive 80 may be applied along the second recess 33. The second recess 33 may be spaced apart from the filter receiving portion 34. The second recess 33 may be recessed to a depth of 0.05 mm from the upper surface of the sensor base 30. The second recess 33 may be recessed to a depth of 0.03 mm to 0.05 mm from the upper surface of the sensor base 30. The second recess 33 may be formed to have a width of 0.2 mm. The second recess 33 may have a width of 0.2 mm to 0.3 mm.

[0077] The second recessed portion 33 may include a first recessed portion 33a and a second recessed portion 33b. The second recessed portion 33 may include a first recessed portion 33a and a second recessed portion 33b formed between the filter receiving portion 34 and the outer surface of the sensor base 30 and spaced apart from each other.

[0078] A first recess 33a and a second recess 33b may be formed between the filter housing 34 and the outer surface of the sensor base 30. The first recess 33a and the second recess 33b may be spaced apart from each other. Based on the filter housing 34, the first recess 33a may be parallel to the second recess 33b and located on the opposite side of the second recess 33b. The first recess 33a and the second recess 33b may be spaced apart from the outer surface of the sensor base 30. Each of the first recess 33a and the second recess 33b may extend straight along an imaginary straight line. The extension length of the first recess 33a and the second recess 33b may be longer than its length in the direction corresponding to the filter housing 34.

[0079] A first recessed portion 33a may be formed between the filter receiving portion 34 and the outer surface of the sensor base 30. The first recessed portion 33a may be spaced apart from a second recessed portion 33b. The first recessed portion 33a may be spaced apart from the outer surface of the sensor base 30. The distance between the first recessed portion 33a and the outer surface of the sensor base 30 may correspond to the distance between the first recessed portion 33a and the filter receiving portion 34. The first recessed portion 33a may extend straight along an imaginary straight line. The extension length of the first recessed portion 33a is shown below. Figure 9 A) can be compared to the length in the direction corresponding to the filter housing 34 (see Figure 9 B) is longer.

[0080] The second recessed portion 33b can be formed between the filter receiving portion 34 and the outer surface of the sensor base 30. The second recessed portion 33b can be spaced apart from the first recessed portion 33a. The second recessed portion 33b can be spaced apart from the outer surface of the sensor base 30. The distance between the second recessed portion 33b and the outer surface of the sensor base 30 can correspond to the distance between the second recessed portion 33b and the filter receiving portion 34. The second recessed portion 33b can extend straight along an imaginary straight line. The extension length of the second recessed portion 33b (see...) Figure 9 A) can be compared to the length in the direction corresponding to the filter housing 34 (see Figure 9 B) is longer.

[0081] Optionally, the second recess 33 may not extend in a straight line, but rather in a zigzag pattern. Furthermore, the second recess 33 may extend to have curvature. Multiple second recesses 33 may be spaced apart and arranged in a straight line. Multiple second recesses 33 may be arranged parallel to the upper surface of the sensor base 30 in an inclined direction.

[0082] Optionally, the second recess 33 may be formed on the lower surface of the lens driving device 10, rather than on the upper surface of the sensor base 30. Alternatively, the second recess 33 may be formed on the upper surface of the sensor base 30 and the lower surface of the lens driving device 10, respectively. In this case, the second recess 33 of the sensor base 30 and the second recess 33 of the lens driving device 10 may be formed with shapes corresponding to their respective positions.

[0083] The sensor base 30 may include a through hole 31a formed at a position corresponding to the image sensor 50. The sensor base 30 may include a filter receiving portion 34, wherein a portion of the upper surface of the sensor base 30 corresponding to the periphery of the through hole 31a is recessed and a filter 40 is disposed thereon.

[0084] The filter receiving portion 34 may be recessed into a portion of the upper surface of the sensor base 30. The filter receiving portion 34 may be formed around the through hole 31a. At least a portion of the filter 40 may be received in the filter receiving portion 34. The filter receiving portion 34 may have a shape corresponding to the shape of the filter 40.

[0085] The sensor base 30 may include a first recessed portion 35 and a second recessed portion 36. The first recessed portion 35 may be configured such that the side surface of the sensor base 30 is recessed. The first recessed portion 35 may accommodate the terminal 733 of the substrate 730 of the lens driving device 10. That is, the terminal 733 of the substrate 730 of the lens driving device 10 may be disposed on the first recessed portion 35. The second recessed portion 36 may be configured such that the side surface of the sensor base 30 is recessed. The second recessed portion 36 may be formed on the opposite side of the first recessed portion 37. The width of the second recessed portion 36 may be narrower than the width of the first recessed portion 37. The second recessed portion 36 may include a recessed surface and an inclined surface, the inclined surface connecting the recessed surface and the side surface of the sensor base 30 at a certain angle.

[0086] The sensor base 30 may include a third recessed portion 37. The third recessed portion 37 may be recessed into a portion of the lower surface of the sensor base 30. The third recessed portion 37 provides space between the body portion 31 of the sensor base 30 and the circuit board 60, and the image sensor 50 may be disposed in this space.

[0087] The filter 40 can be positioned corresponding to the through-hole 31a. The filter 40 can be disposed within a filter housing 34, which is recessed into a portion of the upper surface of the sensor base 30. The filter 40 can block infrared light from incident onto the image sensor 50. The filter 40 can be disposed between the lens module 20 and the image sensor 50. The filter 40 can be disposed on the sensor base 30. Alternatively, the filter 40 can be disposed on the base 500 of the lens driving device 10.

[0088] The filter 40 can be formed of a thin film material or a glass material. The filter 40 can be formed by coating an infrared blocking coating material onto a flat optical filter (e.g., a cover glass or cover plate used to protect an imaging surface). For example, the filter 40 can be an infrared absorbing filter that absorbs infrared light. As another embodiment, the filter 40 can be an infrared reflecting filter that reflects infrared light.

[0089] Image sensor 50 can be disposed on circuit board 60. Image sensor 50 can be disposed on the upper surface of circuit board 60. Image sensor 50 can be electrically connected to circuit board 60. For example, image sensor 50 can be connected to circuit board 60 via surface mount technology (SMT). As another embodiment, image sensor 50 can be connected to circuit board 60 using flip chip technology. Image sensor 50 can be configured such that its optical axis coincides with lens module 20. That is, the optical axis of image sensor 50 and the optical axis of lens module 20 can be aligned. Thus, image sensor 50 can capture light passing through lens module 20. Image sensor 50 can convert light incident on its effective image area into an electrical signal. Image sensor 50 can be any of charge-connected device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID. However, the type of image sensor 50 is not limited to these, and image sensor 50 can include any construction capable of converting incident light into an electrical signal. Image sensor 50 can be electrically connected to circuit board 60 via wires.

[0090] The sensor base 30 can be disposed on the upper surface of the circuit board 60.

[0091] Specifically, the adhesive member 65 can be disposed on the upper surface of the circuit board 60. Furthermore, the sensor base 30 can be disposed on the adhesive member 65.

[0092] Circuit board 60 can be connected to lens driving device 10. Image sensor 50 can be disposed on circuit board 60. Circuit board 60 can be electrically connected to image sensor 50. Sensor base 30 can be disposed between circuit board 60 and lens driving device 10. In this case, image sensor 50 can be housed inside sensor base 30. With this structure, light passing through lens module 20 connected to lens driving device 10 can illuminate image sensor 50 disposed on circuit board 60. Circuit board 60 can supply power (current) to lens driving device 10. At the same time, a controller for controlling lens driving device 10 can be disposed on circuit board 60. Circuit board 60 may include FPCB 61.

[0093] The circuit board 60 may include a rigid PCB and a flexible PCB (FPCB). The image sensor 50 is mounted on the rigid PCB, and the flexible PCB (FPCB) connects the connector 70 to the rigid PCB. The connector 70 can be used to electrically connect the camera module 3 to external components.

[0094] Adhesive 80 may be disposed between sensor base 30 and lens drive device 10. Adhesive 80 may be disposed on the lower surface of lens drive device 10 and the upper surface of sensor base 30. Adhesive 80 may be disposed in the second recess 33 of sensor base 30. Adhesive 80 may be applied to the second recess 33 of sensor base 30. Adhesive 80 may be epoxy resin.

[0095] The protective member 80 can be applied to the terminals 733 of the substrate 730 and the circuit board 60. The protective member 80 can prevent the terminals 733 of the substrate 730 from being exposed to the outside. The protective member 80 can be made of epoxy resin.

[0096] The adhesive member 65 can be disposed on the upper surface of the circuit board 60. The adhesive member 65 can be disposed on the lower surface of the sensor base 30. The adhesive member 65 can be disposed on the lower surface of the support portion 32 constituting the sensor base 30. The width of the adhesive member 65 can be equal to or greater than the width of the lower surface of the sensor base 30. The adhesive member 65 can have a shape corresponding to the lower surface of the sensor base 30. The adhesive member 65 can be disposed in a closed-loop shape on the edge region of the upper surface of the circuit board 60. The adhesive member 65 can be disposed around the image sensor 50 disposed on the circuit board 60.

[0097] The adhesive member 65 may have an opening 65a that exposes the solder balls 62 disposed on the upper surface of the circuit board 60. The opening 65a may have a shape corresponding to the solder balls 62. The opening 65a may have a size corresponding to the solder balls 62. However, this embodiment is not limited to this, and the opening 65a may have a larger size than the solder balls 62.

[0098] Therefore, the solder ball 62 can protrude from the upper surface of the circuit board 60 through the opening 65a of the adhesive member 65. The opening 65a can have a closed-loop shape. Therefore, the adhesive member 65 can be configured to surround the outside of the solder ball 62.

[0099] The sensor base 30 can be bonded to solder balls 62. For example, the solder balls 62 can be bonded to first recesses 32a and 32b provided on the lower surface of the support portion 32 of the sensor base 30. In this case, the solder balls 62 can be melted while being bonded to the first recesses 32a and 32b of the sensor base 30. Therefore, when the solder balls 62 are bonded to the first recesses 32a and 32b, the attachment position of the sensor base 30 can be guided, and the sensor base 30 can be fixed to the circuit board 60 by melting the solder balls 62. Furthermore, the sensor base 30 can be fixed by pressing with a pressing clamp while it is set on the adhesive member 65.

[0100] According to this embodiment, when the sensor base 30 is attached to the circuit board, even when using a pressing clamp, the positional offset problem of the sensor base 30 can be solved by the solder balls 62, and the reliability can be improved by preventing the effective area of ​​the image sensor from being covered by the black mask of the filter.

[0101] Furthermore, when connecting the sensor base 30, this embodiment can increase the connection force of the sensor base 30 by using a pressing clamp, thus ensuring a constant bonding layer thickness (BLT) height.

[0102] Furthermore, this embodiment allows the sensor base 30 to be connected via the adhesive member 65 and the solder ball 62, thus further improving the connection force of the sensor base 30.

[0103] Furthermore, this embodiment, by having the adhesive member 65 surrounding the area where the sensor base 30 is mounted, allows the camera module to be cleaned while the sensor base 30 is attached. Specifically, when cleaning the camera module without the adhesive member 65, moisture or water seeps into the sensor base 30, causing a dampness defect. Conversely, this embodiment prevents moisture or water from penetrating through the adhesive member 65, thereby solving the dampness defect.

[0104] In the following description, a sensor base according to a variant embodiment will be described with reference to the accompanying drawings.

[0105] Figure 9 This is a perspective view of the sensor base of a camera module according to a variant embodiment of the implementation.

[0106] In a variant embodiment of this implementation, the sensor base 30 may additionally include a third recessed portion 38 compared to this implementation.

[0107] The third recess 38 may be recessed into the upper surface of the sensor base 30. The third recess 38 may receive at least a portion of the adhesive 80. The adhesive 80 may be applied along the third recess 38. The third recess 38 may be formed to be spaced apart from the filter receiving portion 34.

[0108] The third recess 38 may be formed to be spaced apart from the second recess 33. The third recess 38 and the second recess 33 may be alternately arranged around the filter receiving portion 34. The third recess 38 may extend with a wider width than the second recess 33.

[0109] The third recess 38 may include a third recess and a fourth recess. The third and fourth recesses may be formed between the filter housing 34 and the outer surface of the sensor base 30. The third and fourth recesses may be spaced apart from each other. Based on the filter housing 34, the third recess may be positioned parallel to the fourth recess, located on the opposite side of the fourth recess. The third and fourth recesses may be spaced apart from the outer surface of the sensor base 30. Each of the third and fourth recesses may extend straight along an imaginary straight line. The extension length of the third and fourth recesses (see...) Figure 9 C) in this context can correspond to the length in the direction corresponding to the filter housing 34 (see...). Figure 9 (C in the middle).

[0110] In the following description, the construction of the optical device according to this embodiment will be described with reference to the accompanying drawings.

[0111] Figure 10 This is a perspective view of the optical device according to the embodiment.

[0112] An optical device can be any of a mobile phone, cell phone, smartphone, portable smart device, digital camera, laptop computer, digital broadcasting terminal, personal digital assistant (PDA), portable multimedia player (PMP), and navigation device. However, the types of optical devices are not limited to these, and any device used to capture video or photographs can be called an optical device.

[0113] The optical device may include a main body 1, a display unit 2, and a camera module 3. However, in the optical device, any one or more of the main body 1, the display unit 2, and the camera module 3 may be omitted or changed.

[0114] The main body 1 can take on the appearance of an optical device. For example, the main body 1 may include a rectangular parallelepiped shape. As another embodiment, the main body 1 may be at least partially circular. The main body 1 can accommodate a camera module 3. A display unit 2 may be disposed on one surface of the main body 1. For example, the display unit 2 and the camera module 3 may be disposed on one surface of the main body 1, and the camera module 3 may be additionally disposed on another surface of the main body 1 (a surface located on the opposite side of the first surface).

[0115] Display unit 2 can be disposed on the main body 1. Display unit 2 can be disposed on one surface of the main body 1. That is, display unit 2 can be disposed on the same surface as camera module 3. Optionally, display unit 2 can be disposed on another surface of the main body 1. Display unit 2 can be disposed on a surface of the main body 1 opposite to the surface on which camera module 3 is disposed. Display unit 2 can output images captured by camera module 3.

[0116] Camera module 3 can be disposed on body 1. Camera module 3 can be disposed on one surface of body 1. At least a portion of camera module 3 can be accommodated inside body 1. Multiple camera modules 3 can be provided. Multiple camera modules 3 can be disposed on one surface and another surface of body 1, respectively. Camera module 3 can capture images of an object.

[0117] The above description merely illustrates the technical spirit of the present invention, and those skilled in the art can make various modifications and variations without departing from the essential characteristics of the invention. Therefore, the embodiments disclosed in this invention are not intended to limit the technical spirit of the invention, but are for illustrative purposes, and the scope of the technical spirit of the invention is not limited by these embodiments. The scope of protection of this invention should be interpreted by the following claims, and all technical spirit within the equivalent scope should be interpreted as included within the scope of this invention.

Claims

1. A camera module comprising: a circuit board; an image sensor disposed above the circuit board; an adhesive member disposed above the circuit board to surround a side of the image sensor and including an opening; a protrusion disposed in the opening of the adhesive member above the circuit board; and a sensor base disposed on the adhesive member, wherein the sensor base includes a recessed portion overlapping the protrusion in a vertical direction, wherein the protrusion is inserted into the recessed portion of the sensor base, wherein the adhesive member has a closed loop shape surrounding an edge region of an upper surface of the circuit board at a predetermined distance from the side of the image sensor, wherein the opening has a shape corresponding to the protrusion, wherein the adhesive member is disposed around an outer surface of the protrusion inserted into the opening, and wherein a width of the adhesive member is greater than a width of a lower surface of the sensor base. The protrusion includes a solder ball.

2. The camera module of claim 1, wherein, The recessed portion includes a recessed recess recessed from a lower surface of the sensor base toward an upper surface of the sensor base.

3. The camera module of claim 1, wherein, The upper surface of the circuit board includes a plurality of corner regions, 4. The camera module of claim 1, wherein, wherein the protrusion includes: a first protrusion disposed in a first corner region of the upper surface of the circuit board, and a second protrusion disposed in a second corner region of the upper surface of the circuit board, the second corner region being in a diagonal direction from the first corner region. The recessed portion includes:

5. The camera module of claim 4, wherein, a first recessed portion disposed in a region on a lower surface of the sensor base overlapping the first protrusion in a vertical direction; a second recessed portion disposed in a region on the lower surface of the sensor base overlapping the second protrusion in the vertical direction. The solder ball protrudes from the upper surface of the circuit board through the opening of the adhesive member.

6. The camera module of claim 2, wherein, An upper surface of the protrusion is positioned higher than an upper surface of the adhesive member.

7. The camera module of claim 1, wherein, A lower surface of the sensor base is positioned lower than an upper surface of the protrusion.

8. The camera module of claim 1, wherein, The opening of the adhesive member overlaps the protrusion in a vertical direction.

9. The camera module of claim 1, wherein, The opening of the adhesive member has a shape and a size corresponding to the solder ball.

10. The camera module of claim 6, wherein, The opening of the adhesive member has a size greater than the solder ball.

11. The camera module of claim 6, wherein, The sensor base includes a body portion and a support portion extending downward from an outer periphery of the body portion, and 12. The camera module of claim 1, wherein, wherein the recessed portion is disposed on a lower surface of the support portion. The lower surface of the sensor base is in direct contact with the upper surface of the adhesive member.

13. The camera module of claim 8, wherein, 14.An optical device comprising: a main body; a camera module disposed in the main body and capturing an image of an object; and a display unit disposed in the main body and outputting the image captured by the camera module, wherein the camera module includes: a circuit board; an image sensor disposed above the circuit board; an adhesive member disposed above the circuit board to surround a side of the image sensor and including an opening; a protrusion disposed in the opening of the adhesive member above the circuit board; and a sensor base disposed on the adhesive member, wherein the sensor base includes a recessed portion overlapping the protrusion in a vertical direction, wherein the protrusion is inserted into the recessed portion of the sensor base, wherein the adhesive member has a closed loop shape surrounding an edge region of an upper surface of the circuit board, at a predetermined distance from one side of the image sensor, wherein an upper surface of the protrusion is positioned higher than an upper surface of the adhesive member, wherein a lower surface of the sensor base is in direct contact with the adhesive member while being positioned lower than the upper surface of the protrusion, wherein the opening has a shape corresponding to the protrusion, wherein the adhesive member is disposed around an outer surface of the protrusion inserted into the opening, and wherein a width of the adhesive member is greater than a width of the lower surface of the sensor base.

15. The optical device of claim 14, wherein, The protrusion includes a solder ball.

16. The optical device of claim 14, wherein, The sensor base includes a body portion and a support portion extending downward from an outer periphery of the body portion, wherein the recessed portion is provided on a lower surface of the support portion.

Images