Ultrasound transducer system, device comprising the system and method of providing the system

Abstract

An ultrasonic transducer system is provided. The ultrasonic transducer system includes a transducer mounting structure, a transducer including at least one mounting flange for coupling the transducer to the transducer mounting structure, and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated in at least one of the transducer mounting structure and the at least one mounting flange.

Description

[0001] This application is a divisional application of the application patent application with the application date of February 14, 2018, the application number of 201810151403.4, and the invention name of "Ultrasound transducer system including tuned resonator, device including the system, and method of providing the system".

[0002] Cross Reference to Related Applications

[0003] This application claims the benefit of U.S. Provisional Application No. 62 / 460,793, filed February 18, 2017, the contents of which are incorporated by reference into this application. TECHNICAL FIELD

[0004] The present invention relates to ultrasound transducer systems, and more particularly, to improved ultrasound transducer systems including tuned resonators, and to devices including such ultrasound transducer systems and methods of using such systems. BACKGROUND

[0005] Ultrasound transducers are used in a variety of applications. For example, such ultrasound transducers are widely used in semiconductor packaging equipment, such as automatic wire bonding machines (e.g., ball bond wire bonding machines, flat bond wire bonding machines, ribbon bond wire bonding machines, etc.) and next generation packaging machines (e.g., flip chip bonding machines such as thermal compression bonding machines, etc.).

[0006] An exemplary conventional wire bonding process includes: (1) forming a loop bond on a bond site of a first semiconductor element (such as a semiconductor wafer) using a wire bonding tool; (2) continuing a length of wire material that is continuous with the loop bond from the first semiconductor element to a second semiconductor element (or a substrate, such as a lead frame, that supports the first semiconductor element); (3) bonding the wire material to a bond site of the second semiconductor element (or substrate) using the bonding tool to form a second loop bond of the wire loop; and (4) severing the wire material from a wire supply, thereby forming the wire loop. Ultrasound energy provided by an ultrasound transducer is utilized when forming the bond between (a) each end of the wire loop and (b) each bond site.

[0007] An exemplary flip chip bonding process includes: (1) aligning a first conductive structure of a first semiconductor element (such as a semiconductor wafer) with a second conductive structure of a second semiconductor element; (2) bonding the first semiconductor element to the second semiconductor element using ultrasound bonding energy (and possibly with the aid of heat and / or force) such that respective pairs of the first conductive structure and the second conductive structure are joined together (where the interconnection between the first conductive structure and the second conductive structure can include solder).

[0008] U.S. Patent Nos. 5,595,328 (entitled “SELF ISOLATING ULTRASONIC TRANSDUCER”); 5,699,953 (entitled “MULTI RESONANCE UNIBODY ULTRASONIC TRANSDUCER”); 5,884,834 (entitled “MULTI-FREQUENCY ULTRASONIC WIRE BONDER AND METHOD”); 7,137,543 (entitled “INTEGRATED FLEXURE MOUNT SCHEME FOR DYNAMIC ISOLATION OF ULTRASONIC TRANSDUCERS”); 8,251,275 (entitled “ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE BONDS USING ULTRASONIC TRANSDUCERS”); and 9,136,240 (entitled “SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS”) relate to ultrasonic transducers, and they are incorporated by reference in their entirety into the present application. Ultrasonic bonding energy is typically applied using an ultrasonic transducer, with a bonding tool attached to the transducer. The transducer typically includes a driver, such as a stack of piezoelectric elements (e.g., piezoelectric crystals, piezoelectric ceramics, etc.). Electrical energy is applied to the driver, and the electrical energy is converted to mechanical energy, thereby moving the bonding tool head in a scraping motion.

[0009] In using such transducers, challenges exist in cases where the resonant frequency of the mounting structure coincides (or is close to) the operating mode of the transducer. Such challenges are particularly difficult in the context of ultrasonic transducers configured to operate at multiple frequencies. That is, while a certain transducer can operate optimally at a first operating mode (e.g., a high frequency mode), the transducer can have problems with respect to impedance stability in a second operating mode (e.g., a low frequency mode). For example, a high impedance can be induced in the second operating mode, which in turn leads to various field problems (e.g., ultrasonic tuning failures).

[0010] Accordingly, it is desirable to provide improved ultrasonic transducers for use in conjunction with various applications, such as semiconductor packaging equipment (e.g., automatic wire bonder, next generation package machine, etc.). SUMMARY

[0011] According to an exemplary embodiment of the present application, an ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated in at least one of the transducer mounting structure and the at least one mounting flange.

[0012] According to another exemplary embodiment of the present application, a wire bonder is provided. The wire bonder includes: a support structure for supporting a workpiece configured to receive a wire bond during a wire bonding operation; a wire bonding tool configured to form a wire bond on the workpiece; and an ultrasonic transducer system, such as those described herein (which can be considered to include the bonding tool), or other ultrasonic transducer systems within the scope of the present application.

[0013] According to another exemplary embodiment of the present application, a flip chip bonder is provided. The flip chip bonder includes: a support structure for supporting a workpiece configured to receive a semiconductor element during a flip chip bonding operation; a bonding tool configured to bond the semiconductor element to a substrate; and an ultrasonic transducer system, such as those described herein (which can be considered to include the bonding tool), or other ultrasonic transducer systems within the scope of the present application.

[0014] According to other exemplary embodiments of the present application, methods of providing (e.g., using) an ultrasonic transducer system, such as those disclosed and claimed herein, are provided. An exemplary method of providing an ultrasonic transducer system includes the steps of: (i) providing a transducer and a transducer mounting structure; (ii) coupling the transducer to the transducer mounting structure with at least one mounting flange of the transducer; and (iii) integrating a tuned resonator having a desired resonant frequency in at least one of the transducer mounting structure and the at least one mounting flange. BRIEF DESCRIPTION OF DRAWINGS

[0015] The present application can best be understood by reading the following detailed description in conjunction with the accompanying drawings, in which:

[0016] Figure 1A is a perspective view of an ultrasonic transducer system according to an exemplary embodiment of the present application;

[0017] Figure 1B is a side view of the ultrasonic transducer system in Figure 1A

[0018] Figure 1C is a perspective view of an ultrasonic transducer system according to an exemplary embodiment of the present application; Figure 1A ​Top view of the ultrasonic transducer system in the image;

[0019] Figure 2 It is a graph showing how the resonant frequency of the mounting structure is shifted away from the operating frequency of the ultrasonic transducer according to an exemplary embodiment of the present invention, so that the transducer can operate in a manner that does not substantially interact with the mounting structure.

[0020] Figure 3 This is a block diagram of a spring-mass system according to an exemplary embodiment of the present invention;

[0021] Figure 4 This is according to an exemplary embodiment of the present invention. Figures 1A-1C A diagram of a tuned resonator in an ultrasonic transducer system;

[0022] Figure 5A This is a perspective view of another ultrasonic transducer system according to another exemplary embodiment of the present invention;

[0023] Figure 5B yes Figure 5A Side view of the ultrasonic transducer system in the image;

[0024] Figure 5C yes Figure 5A Top view of the ultrasonic transducer system in the image;

[0025] Figure 6A This is a perspective view of yet another ultrasonic transducer system according to another exemplary embodiment of the present invention;

[0026] Figure 6B yes Figure 6A Side view of the ultrasonic transducer system in the image;

[0027] Figure 6C yes Figure 6A Top view of the ultrasonic transducer system in the image;

[0028] Figure 7A This is a perspective view of yet another ultrasonic transducer system according to another exemplary embodiment of the present invention;

[0029] Figure 7B yes Figure 7A Side view of the ultrasonic transducer system in the image;

[0030] Figure 7C yes Figure 7A Top view of the ultrasonic transducer system in the image;

[0031] Figure 8 This is a block diagram of a wire bonding machine including an ultrasonic transducer system according to an exemplary embodiment of the present invention;

[0032] Figure 9is a block diagram of a flip chip bonder including an ultrasonic transducer system according to an exemplary embodiment of the present application; and

[0033] Figures 10-13 are perspective views of various ultrasonic transducer systems for flip chip bonder according to various exemplary embodiments of the present application. DETAILED DESCRIPTION

[0034] As used herein, reference to a "semiconductor element" is intended to refer to any structure that includes (or is configured to include in a subsequent step) a semiconductor die or wafer. Exemplary semiconductor elements include a semiconductor die, a semiconductor wafer on a substrate / workpiece (e.g., a lead frame, a PCB, a carrier, etc.), a packaged semiconductor device, a flip chip semiconductor device, a wafer embedded in a substrate, a stack of semiconductor wafers, and the like. Additionally, a semiconductor element can include an element configured to be bonded or otherwise included in a semiconductor package (e.g., a spacer, a substrate, etc. that will be bonded in a stacked wafer configuration).

[0035] According to various exemplary embodiments of the present application, one or more mechanically resonant elements tuned to the operating frequency of the ultrasonic transducer act as vibration absorbers to provide dynamic isolation of the ultrasonic transducer when mounted. That is, according to the present application, the dynamic interaction or "coupling" between the ultrasonic transducer and the mounting structure of the ultrasonic transducer is reduced through active vibration absorption. Reducing the coupling between the transducer and the mounting structure can provide better dynamic isolation, resulting in lower operating impedance, less heat generation, more consistent motion, and thus overall improved operating efficiency and performance of the transducer. Various aspects of the present application can be applied as a retrofit to existing equipment (e.g., an existing semiconductor packaging machine) or to new equipment (e.g., a newly designed semiconductor packaging machine).

[0036] Thus, the use of one or more actively tuned mechanical resonators (where a tuned resonator can be considered to include multiple tuned resonators or tuned resonator elements, where a tuned resonator can be integrated into the transducer system by removing material from one or more elements of the system, etc.) to absorb vibrations at the ultrasonic frequency provides dynamic isolation between the ultrasonic transducer and the mounting structure regardless of the inherent resonances in the mounting structure. This is in stark contrast to various attempts in the prior art that have focused on passive methods such as adding damping elements (e.g., rubber O-rings) to attempt to achieve dynamic isolation.

[0037] Dynamic isolation between an ultrasonic transducer and a mounting structure is a significant challenge, for example, due to the many unpredictable (e.g., via finite element analysis, FEA) structural resonances at ultrasonic frequencies that the mounting structure typically has. Such structural resonances can vary due to allowable tolerances, and boundary condition variations, such as caused by mounting and demounting the transducer. By tuning a mechanical resonator to the operating frequency of the transducer, active vibration absorption and isolation can be provided by continuously "pushing away" any structural resonances that can intrude (randomly or constantly) on the operating frequency of the transducer. This allows the transducer designer greater freedom in designing the mounting structure, and consideration of dynamic coupling factors can be reduced.

[0038] Impedance variability in an ultrasonic transducer can be caused by dynamic interaction between the transducer and the transducer mounting structure (e.g., z-axis link, etc.). The operating mode of the transducer (e.g., low frequency mode of a multi-frequency transducer) can have a coupling that presents a creep mode, for example, which can cause radial "excitation" of the mounting flange (e.g., mounting ear) used to couple the transducer to the transducer mounting structure. Such coupling tends to excite several modes in the transducer mounting structure that coincide with (or near) the operating mode of the transducer.

[0039] According to exemplary aspects of the present application, a tuned resonator is used to shift the creep resonance mode away from the operating mode of the transducer. That is, by providing a bias mass at the structural mode frequency, the tuned resonator (e.g., where the resonator is mounted to the transducer, mounted to the transducer mounting structure, formed in the transducer or mounting structure, etc.) causes the vibration to be absorbed. The resonator is tuned, for example, using FEA analysis.

[0040] Referring now to the drawings, Figures 1A-1C is an ultrasonic transducer system 100 according to an exemplary embodiment of the present application. The ultrasonic transducer system 100 includes a transducer 102 coupled to a transducer mounting structure 104. The transducer 102 includes a mounting flange 102a for fastening the transducer 102 to the transducer mounting structure 104. Fasteners 108 are used to couple the transducer 102 to the transducer mounting structure 104 via the mounting flange 102a. The transducer 102 includes a driver 102b (e.g., a stack of piezoelectric elements) and an operating end 102c. The operating end 102c defines an aperture 102cl configured to receive a wire bonding tool 110.

[0041] The ultrasonic transducer system 100 also includes a number of tuned resonators 106 (which can also be referred to as tuned resonator elements), with one tuned resonator 106 provided at each interface (i.e., junction) between the transducer 102 and the transducer mounting structure 104. Each tuned resonator 106 has a desired resonant frequency, and is integrated into the mounting flange 102a to prevent dynamic interaction or "coupling" into the mounting structure 104. In Figures 1A-1C In the example shown, the tuned resonators 106 are in the form of mounting washers that are interposed beneath fasteners (e.g., screws) 108 that are used to secure the transducer 102 to the transducer mounting structure 104. The tuned resonators 106 (e.g., in the form of the mounting washers shown) can be coupled directly or indirectly to the transducer mounting structure 104.

[0042] Figure 2 is a graph that illustrates shifting the mounting structure resonant frequency away from the operating frequency of the ultrasonic transducer (52 kHz) so that the transducer no longer interacts with the mounting structure operating at its resonant frequency. More specifically, x20 represents the initial configuration of the mounting structure, which exhibits a resonant frequency that coincides with the transducer operating frequency (e.g., 52 kHz in this example). x2 indicates shifting (and splitting) of the mounting structure resonant frequency away from the transducer operating frequency, resulting in an amplitude node at the transducer operating frequency. xi represents the amplitude of the resonator(s) relative to the mounting structure, providing a biasing dynamic mass for shifting the mounting structure resonant frequency away from the transducer operating frequency. In this example, the mounting structure resonant frequency is shifted using a tuned resonator mass mi and a structural mass m2. Figures 1A-1C With the tuned resonator 106 shown in

[0043] Figure 3 is a block diagram of a spring-mass system that illustrates a structural mass m2, and an added tuned resonator mass mi. As Figure 3 the spring-mass model in Figure 2 and the graph in

[0044] Figure 4 shows the tuned resonator 106 (taken from Figures 1A-1C ) shown as being in a bending operation through FEA modeling. The tuned resonator 106 includes a fixed portion 106a (configured to be coupled to the transducer mounting structure 104 via the mounting flange 102a using the fastener 108) (corresponding to the structure m2 in Figure 3 ), a tuned mass 106b (corresponding to the structure mi in Figure 3 ), and a spring portion 106c (defining a hole or opening 106cl) (corresponding to the spring portion 106c inFigure 3 spring k1) in the spring constant k1) of the spring k1).

[0045] While Figures 1A-1C While the tuning mode resonator 106 is shown provided in the form of a "washer" that is engaged at the mounting flange 102a of the transducer 102, it is understood that other alternative tuning mode resonators are contemplated. For example, see Figures 5A-5C , Figures 6A-6C , and Figures 7A-7C .

[0046] With particular reference to Figures 5A-5C , an ultrasonic transducer system 500 is provided. The ultrasonic transducer system 500 includes a transducer 502 coupled to a transducer mounting structure 504. The transducer 502 includes a mounting flange 502a for fastening the transducer 502 to the transducer mounting structure 504. Fasteners 508 are used to couple the transducer 502 to the transducer mounting structure 504 via the mounting flange 502a. The transducer 502 includes a driver 502b (e.g., a stack of piezoelectric elements) and a working end 502c. The working end 502c defines an aperture 502cl configured to receive a wire bonding tool 510. The ultrasonic transducer system 500 also includes tuning mode resonators 506 that are integrated into the transducer mounting structure 504 by removing material from the transducer mounting structure 504 (e.g., by EDM, laser machining, etc.) such that a space 504a is defined around various portions of the tuning mode resonators 506. Each of the tuning mode resonators 506 has a desired resonant frequency and is integrated into the transducer mounting structure 504 to prevent dynamic interaction or "coupling" from occurring in the mounting structure 504.

[0047] With particular reference to Figures 6A-6C , an ultrasonic transducer system 600 is provided. The ultrasonic transducer system 600 includes a transducer 602 coupled to a transducer mounting structure 604. The transducer 602 includes a mounting flange 602a for fastening the transducer 602 to the transducer mounting structure 604. Fasteners 608 are used to couple the transducer 602 to the transducer mounting structure 604 via the mounting flange 602a. The transducer 602 includes a driver 602b (e.g., a stack of piezoelectric elements) and a working end 602c. The working end 602c defines an aperture 602cl configured to receive a wire bonding tool 610. The ultrasonic transducer system 600 also includes tuning mode resonators 606 that are integrated into the transducer mounting structure 604 by fastening the tuning mode resonators 606 to the transducer mounting structure 604 (wherein the tuning mode resonator elements 606 can be directly or indirectly coupled to the transducer mounting structure 604 using fasteners 612). Each of the tuning mode resonators 606 has a desired resonant frequency and is integrated into the transducer mounting structure 604 to prevent dynamic interaction or "coupling" from occurring in the mounting structure 604.

[0048] With particular reference to Figures 7A-7C , an ultrasonic transducer system 700 is provided. The ultrasonic transducer system 700 includes a transducer 702 coupled to a transducer mounting structure 704. The transducer 702 includes a mounting flange 702a for securing the transducer 702 to the transducer mounting structure 704. Fasteners 708 are used to couple the transducer 702 to the transducer mounting structure 704 via the mounting flange 702a. The transducer 702 includes a driver 702b (e.g., a stack of piezoelectric elements) and a working end 702c. The working end 702c defines an aperture 702cl configured to receive a wire bonding tool 710. The ultrasonic transducer system 700 also includes tuned mode resonators 706 integrated in the mounting flange 702a by removing material from the mounting flange 702a (e.g., by EDM, laser machining, etc.) such that a space 702al is defined around each of the tuned mode resonators 706. Each of the tuned mode resonators 706 has a desired resonant frequency and is integrated in the mounting flange 702a to prevent dynamic interaction or "coupling" from occurring in the mounting structure 704.

[0049] Figure 8 is a block diagram of a wire bonder 800 according to an exemplary embodiment of the present application that includes an ultrasonic transducer system 810 carried by a bond head assembly 808. The ultrasonic transducer system 812 can correspond to any of the ultrasonic transducer systems within the scope of the present application, such as the ultrasonic transducer system 100 (see Figures 1A-1C ), the ultrasonic transducer system 500 (see Figures 5A-5C ), the ultrasonic transducer system 600 (see Figures 6A-6C ), or the ultrasonic transducer system 700 (see Figures 7A-7C ). The wire bonder 800 also includes a support structure 802 that supports a semiconductor element 804 (or substrate 804, such as a lead frame). A semiconductor element 806 is supported by the semiconductor element 804. A wire loop is formed between the semiconductor element 806 and the semiconductor element 804. The wire loop 814 includes a bond portion that is bonded to a bond site on the semiconductor element 806 (using the wire bonding tool 810), a length of wire extending from the bond portion, and a second bond portion that includes a bond portion that is bonded to a bond site on the semiconductor element 804. The wire bonding tool 810 (of the ultrasonic transducer system 812) is carried by a transducer of the ultrasonic transducer system 812 (the transducer is not specifically shown in Figure 8 , but can be seen in the transducers 102, 502, 602, and 702 of Figures 1A-1C , Figures 5A-5C , Figures 6A-6C , and Figures 7A-7C , respectively).

[0050] Figure 9is a block diagram of a flip chip bonder 900 according to an exemplary embodiment of the present application, which includes an ultrasonic transducer system 912. Although the ultrasonic transducer system 912 is part of a flip chip bonder (as opposed to a wire bonder as shown in Figure 8 , Figures 1A-1C , Figures 5A-5C , Figures 6A-6C , Figures 7A-7C and Figure 9 , various aspects of the present application can be used in a variety of applications, such as flip chip bonders and the like. Thus, in a flip chip bonder (such as that in Figures 1A-1C , Figures 5A-5C , Figures 6A-6C and Figures 7A-7C , a tuned resonator can be provided (e.g., by integrating a tuned resonator, which is accomplished by adding elements or removing material, as described in connection with various embodiments of the present application, such as in connection with

[0051] The flip chip bonder 900 includes a support structure 902, which supports a semiconductor element 904, which includes conductive structures 904a (only two conductive structures 904a are shown, but it is understood that many conductive structures can be provided). A bonding tool 910 (carried by a transducer included in the ultrasonic transducer system 912) is part of a bonding head assembly 908. The bonding tool 910 carries a semiconductor element 906, which includes conductive structures 906a (only two conductive structures 904a are shown, but it is understood that many conductive structures can be provided). Prior to bonding the semiconductor element 906 to the semiconductor element 904 using the bonding tool 910 (using ultrasonic bonding energy provided by the transducer), the conductive structures 906a are aligned with the conductive structures 904a.

[0052] The ultrasonic transducer system 912 includes: (a) a transducer mounting structure, (b) a transducer, which includes at least one mounting flange for coupling the transducer to the transducer mounting structure, and (c) a tuned resonator, which has a desired resonant frequency. Although these individual elements are not shown in Figure 9 , Figures 1A-1C , Figures 5A-5C , Figures 6A-6C and Figures 7A-7Cthose shown, except that the specific application methods differ (e.g., wire bonding vs. flip chip bonding). The tuning-type resonators are integrated into at least one of the transducer mounting structure and the at least one mounting flange, with the same functional objectives as described herein in connection with the various exemplary embodiments of the present application (e.g., where each tuning-type resonator has a desired resonant frequency, and is integrated into the transducer mounting structure and / or mounting flange(s) to prevent dynamic interaction or "coupling" from occurring in the transducer mounting structure).

[0053] Figures 10-13 Ultrasonic transducer systems 1000, 1100, 1200, and 1300 for flip chip bonder machines in accordance with various exemplary embodiments of the present application are shown. More specifically, Figure 9 The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figures 10-13 The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figure 10 The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figure 1A The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figure 11 The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figure 5A The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figure 12 The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figure 6A The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figure 13 The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figure 7A The ultrasonic transducer system 912 in FIG. 12 can have any number of configurations, including those shown in connection with the ultrasonic transducer systems 1000, 1100, 1200, and 1300. For simplicity and ease of explanation: Figures 10-13 Each of the respective transducers 102, 502, 602, 702 is shown in FIGS. 1, 5, 6, and 7, respectively, with a working end 102c, 502c, 602c, 702c. Each of these working ends 102c, 502c, 602c, 702c holds a flip chip bonder tool 1002, which includes a shaft portion 1002a and a base portion 1002b. The base portion 1002b holds a semiconductor element 1004 (e.g., by vacuum suction through the bonder tool 1002 or the like), and is configured to bond (e.g., where the bonding process includes ultrasonic bonding) the semiconductor element 1004 in connection with a flip chip bonding operation.

[0054] Although the present application is described primarily in connection with ultrasonic transducer systems used in conjunction with semiconductor packaging machines (e.g., wire bonder, flip chip bonder, wafer level bonder), the present application is not so limited. The teachings of the present application can be applied to various other applications of ultrasonic transducer systems outside the field of semiconductor packaging.

[0055] While the application is described primarily with respect to a tuned resonator (or multiple tuned resonators) tuned to an operating frequency of the transducer, it is contemplated that each of the multiple tuned resonators can be tuned to one of multiple operating frequencies of the transducer. For example, Figures 1A-1C In the example of FIG. 1, two different tuned resonators 106 are exhibited. Each of the tuned resonators 106 can be tuned to the same operating frequency of the transducer, or each of the tuned resonators 106 can be tuned to a different operating frequency of the transducer. In addition, each tuned resonator 106 can be tuned to multiple operating frequencies of the transducer.

[0056] While the application is illustrated and described herein with reference to specific embodiments, the application is not intended to be limited to the details shown. Rather, various modifications can be made in the details within the scope and range of equivalents of the claims and without departing from the application.

Claims

1. An ultrasonic transducer system comprising: a transducer mounting structure; a transducer comprising at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated in at least one of the transducer mounting structure and the at least one mounting flange; wherein the tuned resonator is configured to shift a resonant frequency of the transducer mounting structure away from an operating frequency of the transducer. the desired resonant frequency is the operating frequency of the transducer.

2. The ultrasound transducer system of claim 1, wherein, the tuned resonator is configured to absorb vibrations from the transducer mounting structure.

3. The ultrasonic transducer system of claim 1, wherein, the tuned resonator is coupled to the transducer mounting structure.

4. The ultrasonic transducer system of claim 1, wherein, the tuned resonator is indirectly coupled to the transducer mounting structure through at least one intermediate structure.

5. The ultrasonic transducer system of claim 1, wherein, the tuned resonator comprises a plurality of tuned resonator elements coupled to the transducer mounting structure.

6. The ultrasound transducer system of claim 1, wherein, the tuned resonator is coupled to the mounting flange.

7. The ultrasound transducer system of claim 1, wherein, the tuned resonator is indirectly coupled to the mounting flange through at least one intermediate structure.

8. The ultrasound transducer system of claim 1, wherein, the transducer comprises a plurality of mounting flanges, and the tuned resonator comprises a plurality of tuned resonator elements, each of the plurality of tuned resonator elements being coupled to a respective one of the plurality of mounting flanges.

9. The ultrasonic transducer system of claim 1, wherein, the tuned resonator can be modeled as comprising a mass and a spring, the spring having a resonant frequency tuned to a desired frequency.

10. The ultrasound transducer system of claim 1, wherein, the spring has a resonant frequency tuned to a transducer operating frequency.

11. The ultrasonic transducer system of claim 10, wherein, the tuned resonator is integrated in the transducer mounting structure by removing material from the transducer mounting structure.

12. The ultrasound transducer system of claim 1, wherein, the tuned resonator is integrated in the at least one mounting flange by removing material from the at least one mounting flange.

13. The ultrasound transducer system of claim 1, wherein, 14. A wire bonder comprising: a support structure for supporting a workpiece, the workpiece being configured to receive a wire bond during a wire bonding operation; a wire bonding tool configured to form a wire bond on a workpiece; and an ultrasonic transducer system for carrying the wire bonding tool, the ultrasonic transducer system comprising: (a) a transducer mounting structure, (b) a transducer comprising at least one mounting flange for coupling the transducer to the transducer mounting structure, and (c) a tuned resonator having a desired resonant frequency, the tuned resonator being integrated in at least one of the transducer mounting structure and the at least one mounting flange; wherein the tuned resonator is configured to shift a resonant frequency of the transducer mounting structure away from an operating frequency of the transducer.

15. A flip chip bonder comprising: a support structure for supporting a workpiece, the workpiece being configured to receive a semiconductor element during a flip chip bonding operation; a bonding tool configured to bond a semiconductor element to a substrate; and ​ An ultrasonic transducer system for carrying the bonding tool, the ultrasonic transducer system comprising: (a) a transducer mounting structure, (b) a transducer comprising at least one mounting flange for coupling the transducer to the transducer mounting structure, and (c) a tuned resonator having a desired resonant frequency, the tuned resonator being integrated in at least one of the transducer mounting structure and the at least one mounting flange; wherein the tuned resonator is configured to shift a resonant frequency of the transducer mounting structure away from an operating frequency of the transducer.

16. A method of providing an ultrasonic transducer system, the method comprising the steps of: (a) providing a transducer and a transducer mounting structure; (b) coupling the transducer to the transducer mounting structure using at least one mounting flange of the transducer; and (c) integrating a tuned resonator having a desired resonant frequency in at least one of the transducer mounting structure and the at least one mounting flange; wherein Step (c) includes integrating the tuned resonator to shift a resonant frequency of the transducer mounting structure away from an operating frequency of the transducer.

17. The method of claim 16, wherein, Step (c) includes coupling the tuned resonator to the transducer mounting structure.

18. The method of claim 16, wherein, Step (c) includes coupling the tuned resonator to the mounting flange.

19. The method of claim 16, wherein, The tuned resonator comprises a plurality of tuned resonator elements.

20. The method of claim 16, wherein, Step (c) includes removing material from the transducer mounting structure.

21. An ultrasonic transducer system comprising: a transducer mounting structure; a transducer comprising one or more mounting flanges for coupling the transducer to the transducer mounting structure; and a first tuned resonator integrated in at least one of the transducer mounting structure and at least one of the mounting flanges, the first tuned resonator being tuned to a first operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude into the first operating frequency; and a second tuned resonator integrated in at least one of the transducer mounting structure and at least one of the mounting flanges, the second tuned resonator being tuned to a second operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude into the second operating frequency; wherein the first operating frequency and the second operating frequency are different from each other.

22. The ultrasonic transducer system of claim 21, wherein, The first tuned resonator is also tuned to the second operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude into the second operating frequency.

23. The ultrasonic transducer system of claim 21, wherein, Each of the first and second tuned resonators is configured to absorb vibrations from the transducer mounting structure.

24. The ultrasonic transducer system of claim 21, wherein, The first tuned resonator is configured to shift a first resonant frequency of the transducer mounting structure away from the first operating frequency; the second tuned resonator is configured to shift a second resonant frequency of the transducer mounting structure away from the second operating frequency.

25. The ultrasonic transducer system of claim 21, wherein, Each of the first and second tuned mode resonators is coupled to the transducer mounting structure.

26. The ultrasonic transducer system of claim 21, wherein, Each of the first and second tuned mode resonators is indirectly coupled to the transducer mounting structure through at least one intervening structure.

27. The ultrasonic transducer system of claim 21, wherein, Each of the first and second tuned mode resonators includes a plurality of tuned mode resonator elements coupled to the transducer mounting structure.

28. The ultrasonic transducer system of claim 21, wherein, Each of the first and second tuned mode resonators is coupled to at least one of the one or more mounting flanges.

29. The ultrasonic transducer system of claim 21, wherein, Each of the first and second tuned mode resonators is indirectly coupled to at least one of the one or more mounting flanges through at least one intervening structure.

30. The ultrasonic transducer system of claim 21, wherein, The transducer includes a plurality of mounting flanges, and each of the first and second tuned mode resonators is coupled to a respective one of the plurality of mounting flanges.

31. The ultrasonic transducer system of claim 21, wherein, Each of the first and second tuned mode resonators is modeled as including a respective mass and a respective spring having a respective resonant frequency tuned to a respective intended frequency.

32. The ultrasonic transducer system of claim 21, wherein each of the first and second tuned mode resonators is integrated into the transducer mounting structure by removing material from the transducer mounting structure.

33. The ultrasonic transducer system of claim 21, wherein, Each of the first and second tuned mode resonators is integrated into at least one of the one or more mounting flanges by removing material from the at least one of the one or more mounting flanges.

34. A wire bonder, comprising: a support structure to support a workpiece configured to receive a wire bond during a wire bonding operation; a wire bonding tool configured to form a wire bond on a workpiece; and an ultrasonic transducer system to carry the wire bonding tool, the ultrasonic transducer system comprising: (a) a transducer mounting structure, (b) a transducer comprising one or more mounting flanges to couple the transducer to the transducer mounting structure, (c) a first tuned mode resonator integrated into at least one of the transducer mounting structure and the at least one mounting flange, the first tuned mode resonator tuned to a first operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude on the first operating frequency; and (d) a second tuned mode resonator integrated into at least one of the transducer mounting structure and the at least one mounting flange, the second tuned mode resonator tuned to a second operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude on the second operating frequency; wherein the first operating frequency and the second operating frequency are different from each other.

35. A flip chip bonder, comprising: a support structure to support a workpiece configured to receive a semiconductor element during a flip chip bonding operation; a bonding tool configured to bond a semiconductor element to a substrate; and an ultrasonic transducer system to carry the bonding tool, the ultrasonic transducer system comprising: (a) a transducer mounting structure, (b) a transducer comprising one or more mounting flanges to couple the transducer to the transducer mounting structure, (c) a first tuned mode resonator integrated into at least one of the transducer mounting structure and the at least one mounting flange, the first tuned mode resonator tuned to a first operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude on the first operating frequency; and (d) a second tuned mode resonator integrated into at least one of the transducer mounting structure and the at least one mounting flange, the second tuned mode resonator tuned to a second operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude on the second operating frequency; wherein the first operating frequency and the second operating frequency are different from each other. An ultrasonic transducer system for carrying the bonding tool, the ultrasonic transducer system comprising: (a) a transducer mounting structure, (b) a transducer comprising one or more mounting flanges for coupling the transducer to the transducer mounting structure, (c) a first tuned mode resonator integrated in at least one of the transducer mounting structure and at least one of the mounting flanges, the first tuned mode resonator tuned to a first operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude into the first operating frequency; and (d) a second tuned mode resonator integrated in at least one of the transducer mounting structure and at least one of the mounting flanges, the second tuned mode resonator tuned to a second operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude into the second operating frequency; wherein the first operating frequency and the second operating frequency are different from each other.

36. A method of providing an ultrasonic transducer system, the method comprising the steps of: (a) providing a transducer and a transducer mounting structure; (b) coupling the transducer to the transducer mounting structure using one or more mounting flanges of the transducer; (d) integrating a first tuned mode resonator in at least one of the transducer mounting structure and at least one of the mounting flanges, the first tuned mode resonator tuned to a first operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude into the first operating frequency; and (d) integrating a second tuned mode resonator in at least one of the transducer mounting structure and at least one of the mounting flanges, the second tuned mode resonator tuned to a second operating frequency of the transducer to provide active vibration absorption and isolation by continuously pushing away structural resonances that would intrude into the second operating frequency; wherein the first operating frequency and the second operating frequency are different from each other. Step (c) includes integrating the first tuned mode resonator to shift a resonant frequency of the transducer mounting structure away from the first operating frequency.

37. The method of claim 36, wherein, Step (c) includes coupling the first and second tuned mode resonators to the transducer mounting structure.

38. The method of claim 36, wherein, Step (c) includes coupling each of the first and second tuned mode resonators to at least one of the one or more mounting flanges.

39. The method of claim 36, wherein, Each of the first and second tuned mode resonators includes a respective plurality of tuned mode resonator elements.

40. The method of claim 36, wherein, Step (c) includes removing material from the transducer mounting structure.

41. The method of claim 36, wherein, ​

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