Electroplating apparatus and process

Abstract

The application relates to an electroplating device which comprises an electroplating tank, a partition plate is arranged in the electroplating tank, the partition plate divides the electroplating tank into an electroplating groove for electroplating pipes and a circulating groove for circulating electroplating liquid, overflow ports which are communicated with the circulating groove are arranged on the side wall of the electroplating groove close to the partition plate; a lifting plate is arranged in the electroplating groove, the lifting plate is used for placing the pipes on the plate surface; a liquid spraying cavity is arranged in the lifting plate, a plurality of first liquid spraying holes which are communicated with the liquid spraying cavity are arranged on the plate surface of the lifting plate close to the groove opening of the electroplating groove, and a first circulating member for conveying the electroplating liquid in the circulating groove to the liquid spraying cavity is arranged between the circulating groove and the lifting plate. The electroplating device can improve the electroplating quality of the pipes. The application also relates to an electroplating process.

Description

Technical Field

[0001] This application relates to the technical field of electroplating processes, and in particular to an electroplating apparatus and process thereof. Background Technology

[0002] Electroplating is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, which serves to prevent metal oxidation, improve wear resistance, conductivity, corrosion resistance, and enhance aesthetics. In the chemical industry, an anti-corrosion coating is often electroplated on the outer or inner wall of pipelines to improve their corrosion resistance.

[0003] In the existing technology, during pipe electroplating, the pipe is placed on a hanger for electroplating. Since the pipe is placed on the hanger, there is a contact point between the outer or inner wall of the pipe and the hanger. However, during electroplating, this contact point is often blocked by the hanger, so it is often not electroplated or the electroplating is incomplete, which affects the electroplating quality of the pipe. Therefore, further improvement is needed. Summary of the Invention

[0004] To improve the electroplating quality of pipes, this application provides an electroplating apparatus and process.

[0005] Firstly, the electroplating apparatus provided in this application adopts the following technical solution:

[0006] An electroplating apparatus includes an electroplating tank with a partition plate inside, the partition plate dividing the electroplating tank into an electroplating tank for electroplating pipes and a circulation tank for circulating electroplating solution. An overflow port communicating with the circulation tank is provided on the side wall of the partition plate near the electroplating tank. A support plate is provided inside the electroplating tank for placing pipes on its surface. A spray chamber is provided inside the support plate, and multiple first spray holes communicating with the spray chamber are provided on the surface of the support plate near the opening of the electroplating tank. A first circulation element is provided between the circulation tank and the support plate for transporting the electroplating solution in the circulation tank to the spray chamber.

[0007] By adopting the above technical solution, through the setting of the spray chamber and the first spray hole, when electroplating the pipe, the pipe is placed on the upper surface of the support plate, and then the first circulation component is activated to transport the electroplating solution in the circulation tank to the spray chamber. The electroplating solution can be sprayed outward through the first spray hole and generate a driving force. The driving force of this part of the electroplating solution can push the pipe to be electroplated. By controlling the spray speed of the electroplating solution, the driving force of the electroplating solution can overcome the gravity of the pipe and make the pipe suspend. This reduces the possibility of contact between the peripheral wall of the pipe and the wall of the electroplating tank, increases the contact area between the electroplating solution and the pipe, and thus improves the electroplating effect on the pipe.

[0008] Optionally, the two opposite sidewalls of the support plate are respectively provided with extension plates. Each extension plate has multiple second spray holes connected to the spray chamber on its surface near the opening of the electroplating tank. The spray direction of all the second spray holes is vertical, and the second spray holes of the two extension plates are used to spray symmetrically to both sides of the pipeline radially.

[0009] By adopting the above technical solution, through the setting of the extension plate, the electroplating liquid in the spray chamber is sprayed outward through the second spray hole of the extension plate on both sides of the support plate. The second spray hole sprays the electroplating liquid vertically upward, thereby accelerating the flow velocity of the electroplating liquid on both sides of the pipeline. According to Bernoulli's principle, the greater the flow velocity of the electroplating liquid on both sides of the pipeline, the lower the pressure. The hydraulic pressure of the electroplating liquid in the electroplating tank makes it difficult for the pipeline to move left and right along its radial direction, thereby improving the stability of the pipeline suspension and reducing the possibility of the pipeline moving and detaching from the support plate.

[0010] Optionally, the lifting plate and the extension plate are respectively provided with first spray pipes on their adjacent sides. Each first spray pipe is connected to the spray chamber. The side wall of the first spray pipe near the opening of the electroplating tank is provided with a plurality of third spray holes connected to the inside of the first spray pipe. The spraying direction of all the third spray holes is vertically arranged, and the third spray holes of the two first spray pipes are used to spray symmetrically to both sides of the pipe axis.

[0011] By adopting the above technical solution, the electroplating solution in the spray chamber is sprayed outward through the third spray hole by the first spray pipe. The third spray hole sprays the electroplating solution vertically upward, thereby accelerating the flow velocity of the electroplating solution on both sides of the pipe axis. According to Bernoulli's principle, the greater the flow velocity of the electroplating solution on both sides of the pipe axis, the lower the pressure. The electroplating solution in the electroplating tank is hydraulically compressed, making it difficult for the pipe to move left or right along its axis. In conjunction with the second spray hole of the extension plate, it restricts the pipe in four directions, greatly improving the stability of the pipe suspension and further reducing the possibility of the pipe moving and detaching from the support plate.

[0012] Optionally, each of the first spray pipes is slidably mounted on the side wall of the electroplating tank, and the side wall of the electroplating tank is provided with a drive assembly for driving the two first spray pipes to move closer to or further away from each other.

[0013] By adopting the above technical solution and by setting the driving component, the two first spray pipes are driven to move closer or further apart to adjust the distance between the two first spray pipes, so that the two first spray pipes can limit the axial movement of pipes of different lengths, thereby improving the adaptability of the overall structure.

[0014] Optionally, the drive assembly includes a first lead screw, a second lead screw, and a drive motor. The first lead screw is rotatably connected to the side wall of the electroplating tank, and the second lead screw is coaxially connected to the end face of the first lead screw. The first lead screw and the second lead screw pass through and are threadedly connected to different spray pipes. The thread direction of the first lead screw is opposite to that of the second lead screw. The drive motor is fixed to the outer wall of the electroplating tank, and the output shaft of the drive motor passes through the side wall of the electroplating tank and is coaxially connected to the first lead screw.

[0015] By adopting the above technical solution, through the arrangement of the first lead screw, the second lead screw and the drive motor, the drive motor drives the first lead screw to rotate, so that the first lead screw and the second lead screw rotate synchronously. The thread direction of the first lead screw is set opposite to the thread direction of the second lead screw, thereby driving the two first liquid spray pipes to move closer to each other or further away from each other.

[0016] Optionally, the partition plate has a sliding groove connected to the circulation tank on its side wall near the electroplating tank. A second spray pipe is slidably installed in the sliding groove for coaxial insertion into the pipe. The second spray pipe is provided with a sliding component for driving the second spray pipe closer to or away from the electroplating tank. The outer peripheral wall of the second spray pipe has a plurality of fourth spray holes connected to the second spray pipe. A second circulation component is provided between the second spray pipe and the circulation tank for transporting the electroplating solution in the circulation tank to the second spray pipe.

[0017] By adopting the above technical solution, through the setting of the second spray pipe, during the process of the pipe to be electroplated entering the electroplating solution surface of the electroplating tank, external air is easily attached to the inner wall of the pipe and is not discharged in time, thus forming tiny bubbles attached to the inner wall of the pipe. After the pipe is placed in the electroplating tank, the sliding component drives the second spray pipe to move towards the side closer to the electroplating tank and forces the second spray pipe to be coaxially inserted into the pipe. However, the second circulation component transports the electroplating solution in the circulation tank to the second spray pipe. This part of the electroplating solution can be sprayed outward through the fourth spray hole to impact the inner wall of the pipe, thereby breaking the bubbles on the inner wall of the pipe and reducing the possibility that the inner wall of the pipe will be reduced due to the presence of bubbles during the process of the pipe being placed in the electroplating tank.

[0018] Optionally, the fourth spray hole includes a vertical portion and a bent portion. The inlet end of the vertical portion is connected to the inside of the second spray pipe, and the spray direction of the vertical portion is perpendicular to the outer peripheral wall of the second spray pipe. The inlet end of the bent portion is connected to the outlet end of the vertical portion, and there is an angle between the spray direction of the bent portion and the spray direction of the vertical portion.

[0019] By adopting the above technical solution, through the setting of the vertical part and the bending part, the electroplating liquid sprayed from the second spray pipe changes the spray angle through the bending part, so that the action direction of this part of the electroplating liquid has an angle with the inner wall of the pipe, thereby improving the destructive effect of this part of the electroplating liquid on bubbles; on the other hand, the action direction of this part of the electroplating liquid has an angle with the inner wall of the pipe, so that the electroplating liquid can push the inner wall of the pipe and force the pipe to rotate around the second spray pipe. The rotating pipe and the electroplating liquid have sufficient contact and exchange, thereby improving the uniformity of the pipe coating.

[0020] Optionally, each of the extension plates can be detachably connected to the support plate.

[0021] By adopting the above technical solution, the extension plate can be detachably installed on the support plate, and extension plates of different sizes can be replaced according to the pipe diameter, thereby improving the adaptability of the overall structure.

[0022] Optionally, the lifting plate has an arc surface near the opening of the electroplating tank for pipe contact, the lifting plate is slidably installed on the inner wall of the electroplating tank, and the lifting plate is provided with a lifting component for driving the lifting plate closer to or away from the opening of the electroplating tank.

[0023] By adopting the above technical solution, through the setting of the arc surface and the lifting component, the lifting component forces the lifting plate to move towards the opening of the electroplating tank, so that the lifting plate is exposed on the surface of the electroplating solution in the electroplating tank. Then, the pipe to be electroplated is placed on the arc surface of the lifting plate, and the outer wall of the pipe abuts against the arc surface of the lifting plate. The arc surface can limit and support the outer wall of the pipe, reducing the possibility of the pipe rolling freely and falling out of the lifting plate. Then, the lifting component forces the lifting plate to move away from the opening of the electroplating tank to bring the pipe into the electroplating tank for electroplating. After the electroplating is completed, the lifting component forces the lifting plate to rise again to facilitate the removal of the electroplated pipe.

[0024] Secondly, the electroplating process provided in this application adopts the following technical solution:

[0025] An electroplating process includes the following steps:

[0026] S1. Pipe installation: Place the pipe to be electroplated above the support plate;

[0027] S2. Lowering of the lifting plate: The lifting plate is moved away from the opening of the electroplating tank by the lifting component, so as to bring the pipe into the electroplating tank;

[0028] S3. Start-up of the first circulation component: The electroplating solution in the circulation tank is transported to the electroplating tank through the first circulation component;

[0029] S4. Insertion of the second spray pipe: The sliding assembly drives the second spray pipe to slide towards the side closer to the electroplating tank and forces the second spray pipe to slide and insert into the pipe.

[0030] S5. Start-up of the second circulation component: The electroplating solution in the circulation tank is transported to the second spray pipe through the second circulation component;

[0031] S6. Sliding out of the second spray pipe: The sliding assembly drives the second spray pipe to slide away from the electroplating tank and forces the second spray pipe out of the pipe.

[0032] S7. Lifting of the lifting plate: The lifting plate is moved toward the opening of the electroplating tank by the lifting component.

[0033] In summary, this application includes at least one of the following beneficial technical effects:

[0034] 1. By setting up the spray chamber and the first spray hole, when electroplating the pipe, the pipe is placed on the upper surface of the support plate, and then the first circulation component is activated to transport the electroplating solution in the circulation tank to the spray chamber. The electroplating solution can be sprayed outward through the first spray hole and generate a driving force. The driving force of this part of the electroplating solution can push the pipe to be electroplated. By controlling the spray speed of the electroplating solution, the driving force of the electroplating solution can overcome the gravity of the pipe and make the pipe suspend. This reduces the possibility of contact between the peripheral wall of the pipe and the wall of the electroplating tank, increases the contact area between the electroplating solution and the pipe, and thus improves the electroplating effect on the pipe.

[0035] 2. With the first spray pipe, the electroplating solution in the spray chamber is sprayed outward through the third spray hole. The third spray hole sprays the electroplating solution vertically upward, thereby accelerating the flow velocity of the electroplating solution on both sides of the pipe axis. According to Bernoulli's principle, the greater the flow velocity of the electroplating solution on both sides of the pipe axis, the lower the pressure. The electroplating solution in the electroplating tank is hydraulically compressed, making it difficult for the pipe to move left or right along its axis. In conjunction with the second spray hole of the extension plate, it restricts the pipe in four directions, greatly improving the stability of the pipe suspension and further reducing the possibility of the pipe moving and detaching from the support plate.

[0036] 3. With the second spray pipe, during the process of the pipe to be electroplated entering the electroplating solution in the electroplating tank, external air easily adheres to the inner wall of the pipe and is not discharged in time, thus forming tiny bubbles attached to the inner wall of the pipe. After the pipe is placed in the electroplating tank, the sliding component drives the second spray pipe to move towards the side closer to the electroplating tank and forces the second spray pipe to be coaxially inserted into the pipe. Then, the second circulation component transports the electroplating solution in the circulation tank to the second spray pipe. This part of the electroplating solution can be sprayed outward through the fourth spray hole to impact the inner wall of the pipe, thereby breaking the bubbles on the inner wall of the pipe and reducing the possibility that the inner wall of the pipe will be reduced due to the presence of bubbles during the process of the pipe being placed in the electroplating tank. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the overall structure of Example 1;

[0038] Figure 2 This is a partial cross-sectional view of the support plate in Embodiment 1;

[0039] Figure 3 This is a partial cross-sectional view of the extension plate in Embodiment 1;

[0040] Figure 4 This is a partial cross-sectional view of the first spray pipe in Embodiment 1;

[0041] Figure 5 This is a partial cross-sectional view of the fourth spray hole in Example 2.

[0042] Explanation of reference numerals in the attached drawings: 1. Electroplating tank; 11. Divider plate; 111. Overflow port; 112. Sliding trough; 12. Electroplating tank; 121. Moving trough; 13. Circulation tank; 14. Support leg; 15. Lifting cylinder; 16. Liquid pump; 17. Liquid inlet pipe; 18. Liquid outlet pipe; 2. Lifting plate; 21. Spray chamber; 22. First spray hole; 23. Arc surface; 24. First circulation pipe; 3. Extension plate; 31. Second spray hole; 3 2. Extension cavity; 4. First spray pipe; 41. Third spray hole; 42. Connecting pipe; 5. Drive assembly; 51. First lead screw; 52. Second lead screw; 53. Drive motor; 6. Second spray pipe; 61. Fourth spray hole; 611. Vertical part; 612. Bending part; 62. Second circulation pipe; 63. Extension bar; 7. Sliding assembly; 71. Drive sprocket; 72. Driven sprocket; 73. Chain; 74. Rotation motor. Detailed Implementation

[0043] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0044] Example 1:

[0045] This application discloses an electroplating apparatus.

[0046] Reference Figure 1 , Figure 2 An electroplating apparatus includes an electroplating tank 1. In this embodiment, the electroplating tank 1 is a rectangular tank structure with an open top. Multiple support legs 14 are fixedly installed on the bottom wall of the electroplating tank 1, and the electroplating tank 1 is supported on the ground by the multiple support legs 14.

[0047] Reference Figure 1 , Figure 2 The inner wall of the electroplating tank 1 is equipped with a partition plate 11. In this embodiment, the partition plate 11 is vertically arranged, and the partition plate 11 forms an electroplating tank 12 and a circulation tank 13 inside the electroplating tank 1. An overflow port 111 is opened on the side wall of the partition plate 11 near the electroplating tank 12. The overflow port 111 passes through the partition plate 11 and is connected to the circulation tank 13. The electroplating tank 12 is used for electroplating pipes, and the circulation tank 13 is used for circulating electroplating solution.

[0048] Reference Figure 1 , Figure 2 A lifting plate 2 is slidably installed inside the electroplating tank 12. The lifting plate 2 is horizontally positioned and is used to place pipes on its upper surface. The lifting plate 2 is equipped with a lifting component for driving the lifting plate 2 closer to or away from the opening of the electroplating tank 12. In this embodiment, the lifting component is a lifting cylinder 15. The cylinder body of the lifting cylinder 15 is fixedly installed on the bottom wall of the electroplating tank 1, and the piston rod of the lifting cylinder 15 penetrates through the bottom wall of the electroplating tank 1 and is fixedly installed on the lower surface of the lifting plate 2.

[0049] Reference Figure 2 , Figure 3 The lifting plate 2, located away from the lifting cylinder 15, has an arc surface 23 for placing and contacting the pipe. The slots at both ends of the arc surface 23 penetrate the two opposite side walls along the length of the lifting plate 2. With this design, during pipe electroplating, the lifting cylinder 15 moves the lifting plate 2 toward the opening of the electroplating tank 12, causing the lifting plate 2 to move out of the electroplating solution surface of the electroplating tank 12. Then, the pipe is placed on the arc surface 23 of the lifting plate 2. Next, the lifting cylinder 15 retracts, causing the lifting plate 2 to sink into the electroplating tank 12, thereby bringing the pipe into the electroplating tank 12 for electroplating. It should be noted that during the process of the lifting plate 2 bringing the pipe into the electroplating tank 12, the retraction speed of the lifting cylinder 15 is controlled to slowly and uniformly bring the pipe into the electroplating tank 12, thereby reducing the possibility that the pipe will bring outside air into the electroplating solution when it enters the electroplating solution surface, causing this air to adhere to the inner wall of the pipe and form bubbles.

[0050] Reference Figure 2 , Figure 3The lifting plate 2 has a spray chamber 21. The surface of the lifting plate 2 away from the lifting cylinder 15 has a plurality of first spray holes 22. All the first spray holes 22 are evenly distributed along the surface of the lifting plate 2. Each first spray hole 22 penetrates the surface of the lifting plate 2 and is connected to the spray chamber 21. In this embodiment, the spray direction of all the first spray holes 22 is vertical. A first circulation component is installed between the circulation tank 13 and the lifting plate 2. The first circulation component is used to transport the electroplating liquid in the circulation tank 13 to the spray chamber 21.

[0051] With this design, after the lifting plate 2 brings the pipe into the electroplating tank 12, the electroplating solution in the circulation tank 13 is transported to the spray chamber 21 through the first circulation component. This part of the electroplating solution is sprayed outward through the first spray hole 22, which can push the pipe on the lifting plate 2, so that the pipe can overcome its own weight and float in the surface of the electroplating solution, increase the contact area between the pipe and the electroplating solution, reduce the possibility of the outer wall of the pipe pressing against the lifting plate 2 and creating an electroplating blind zone, and thus improve the electroplating effect of the pipe. The electroplating solution in the electroplating tank 12 can flow back to the circulation tank 13 through the overflow port 111 to form an electroplating solution circulation.

[0052] Reference Figure 1 , Figure 2 , Figure 3 A liquid pump 16 is installed at the opening of the circulation tank 13. The input end of the liquid pump 16 is connected to an inlet pipe 17, and the inlet end of the inlet pipe 17 extends into the circulation tank 13. The output end of the liquid pump 16 is connected to an outlet pipe 18, and the outlet end of the outlet pipe 18 passes through the partition plate 11 and extends into the electroplating tank 12. In this embodiment, the first circulation component is set as a first circulation pipe 24, which is a flexible hose. The inlet end of the first circulation pipe 24 is fixedly connected to the outer peripheral wall of the outlet pipe 18 and communicates with the inside of the outlet pipe 18. The outlet end of the first circulation pipe 24 is fixedly connected to the lower surface of the support plate 2 and communicates with the spray chamber 21. When the liquid pump 16 is started, the electrolyte in the circulation tank 13 can be transported to the spray chamber 21 in sequence through the inlet pipe 17, the outlet pipe 18 and the first circulation pipe 24, and sprayed outward through the first spray hole 22 to push out the pipe and force the pipe to suspend.

[0053] Reference Figure 2 , Figure 3An extension plate 3 is installed on each of the two opposite sidewalls of the lifting plate 2. In this embodiment, each extension plate 3 is detachably connected to the lifting plate 2 by bolts (not shown in the figure). Both ends of each extension plate 3 extend along the length of the pipe. An extension cavity 32 is opened inside the extension plate 3, which is connected to the spraying cavity 21. A plurality of second spraying holes 31 are opened on the plate surface of the extension plate 3 near the opening of the electroplating tank 12. All the second spraying holes 31 are spaced apart along the length of the extension plate 3. Each second spraying hole 31 All are connected to the extension cavity 32, and the spraying direction of all the second spray holes 31 is vertically set; the second spray holes 31 of the two extension plates 3 are used to spray symmetrically to both sides of the radial direction of the pipe to be electroplated; with this design, the electroplating liquid in the spray cavity 21 can be sprayed upward through the second spray holes 31, thereby accelerating the flow rate of the electroplating liquid on both sides of the radial direction of the pipe. According to Bernoulli's principle, the greater the flow rate of the electroplating liquid on both sides of the radial direction of the pipe, the lower the pressure. The electroplating liquid in the electroplating tank 12 is hydraulically compressed, making it difficult for the pipe to move left and right along its radial direction, thereby improving the stability of the pipe suspension.

[0054] Reference Figure 2 , Figure 4 The electroplating tank 12 has two opposite sidewalls with movable grooves 121 respectively. A first spray pipe 4 is slidably installed between the two movable grooves 121. In this embodiment, the first spray pipe 4 is a rectangular tubular structure with closed ends. The length direction of the first spray pipe 4 is perpendicular to the length direction of the pipe. There are two first spray pipes 4, and the two first spray pipes 4 are symmetrically distributed on both sides of the length direction of the support plate 2. A connecting pipe 42 is fixedly connected to the bottom wall of the first spray pipe 4. The connecting pipe 42 is a flexible tube. The inlet end of the connecting pipe 42 is fixedly connected to the outer peripheral wall of the outlet pipe 18 and connects to the inside of the outlet pipe 18. The outlet end of the connecting pipe 42 is fixedly connected to the bottom wall of the first spray pipe 4 and connects to the inside of the first spray pipe 4. A plurality of first and third spray holes 41 are opened on the sidewall of the first spray pipe 4 near the opening of the electroplating tank 12. All third spray holes 41 are spaced apart along the length direction of the first spray pipe 4. Each third spray hole 41 penetrates the first spray pipe 4 and connects to the inside of the first spray pipe 4.

[0055] Reference Figure 2 , Figure 4 All the third spray holes 41 are set vertically, and the third spray holes 41 of the two first spray pipes 4 are used to spray symmetrically to both sides of the pipe axis. With this design, the electroplating solution of the outlet pipe 18 can enter the first spray pipe 4 through the connecting pipe 42 and be sprayed upward through the second spray hole 31, thereby accelerating the flow rate of the electroplating solution on both sides of the pipe axis. According to Bernoulli's principle, the greater the flow rate of the electroplating solution on both sides of the pipe axis, the lower the pressure. The electroplating solution in the electroplating tank 12 is hydraulically compressed, making it difficult for the pipe to move left and right along its axis, further improving the stability of the pipe suspension.

[0056] Reference Figure 1 , Figure 2 In this embodiment, a drive assembly 5 for driving two first spray pipes 4 to move closer or further apart is installed on the side wall of the electroplating tank 12. The drive assembly 5 includes a first lead screw 51, a second lead screw 52, ​​and a drive motor 53. One end of the first lead screw 51 is rotatably connected to the side wall of the electroplating tank 12, and the other end of the first lead screw 51 is fixedly connected to the second lead screw 52. The second lead screw 52 and the first lead screw 51 are coaxially arranged. The first lead screw 51 and the second lead screw 52 are threaded through and connected to different spray pipes and are threaded to the corresponding spray pipes. In this embodiment, the thread direction of the first lead screw 51 and the thread direction of the second lead screw 52 are set to be opposite.

[0057] Reference Figure 1 , Figure 2 The drive motor 53 is fixedly installed on the outer wall of the electroplating tank 1. The output shaft of the drive motor 53 passes through the side wall of the electroplating tank 1 and is coaxially connected to the first lead screw 51. With this design, starting the drive motor 53 can drive the first lead screw 51 and the second lead screw 52 to rotate synchronously, so that the two first spray pipes 4 can move closer or further away from each other, thereby adjusting the distance between the two first spray pipes 4, so that the two first spray pipes 4 can limit the axial ends of pipes of different lengths, improving the adaptability of the overall structure.

[0058] Reference Figure 2 , Figure 4 The partition plate 11 has a sliding groove 112 on its side wall near the electroplating tank 12. In this embodiment, the sliding groove 112 is a through groove that penetrates the two opposite side walls of the partition plate 11. The second spray pipe 6 is slidably installed in the sliding groove 112. When the lifting plate 2 forces the pipe to suspend, the second spray pipe 6 is coaxially arranged with the pipe. The outer peripheral wall of the second spray pipe 6 has a plurality of fourth spray holes 61. All the fourth spray holes 61 are spaced around the outer peripheral wall of the second spray pipe 6, and all the fourth spray holes 61 are spaced along the axial direction of the second spray pipe 6. Each fourth spray hole 61 is connected to the inside of the second spray pipe 6. In this embodiment, the spray direction of all the fourth spray holes 61 is perpendicular to the outer peripheral wall of the second spray pipe 6.

[0059] Reference Figure 2 , Figure 4A second circulation component is installed between the second spray pipe 6 and the circulation tank 13 to transport the electroplating solution in the circulation tank 13 to the second spray pipe 6. In this embodiment, the second circulation component is a second circulation pipe 62, which is a flexible hose. The inlet end of the second circulation pipe 62 is fixedly connected to the outer peripheral wall of the outlet pipe 18 and communicates with the inside of the outlet pipe 18. The outlet end of the second circulation pipe 62 is fixedly connected to the end face of the second spray pipe 6 away from the electroplating tank 12 and communicates with the inside of the second spray pipe 6. The second circulation pipe 62 is equipped with a device for starting... Close the opening and closing valve of the second circulation pipe 62 (not shown in the figure); start the liquid pump 16, and the electrolyte in the circulation tank 13 can be transported to the second spray pipe 6 through the inlet pipe 17, the outlet pipe 18 and the second circulation pipe 62 in sequence, and sprayed outward through the fourth spray hole 61. This part of the electroplating solution can be used to impact the inner wall of the pipe to destroy the air bubbles attached to the inner wall of the pipe, reduce the possibility that the pipe will bring outside air into the electrolyte when it enters the electroplating solution, and cause air bubbles to attach to the inner wall of the pipe, and improve the electroplating effect of the electroplating solution on the inner wall of the pipe.

[0060] Reference Figure 1 , Figure 2 The second spray pipe 6 is equipped with a sliding component 7 for driving the second spray pipe 6 closer to or away from the electroplating tank 12. It should be noted that the second spray pipe 6 is coaxially inserted into the pipe to be electroplated. Specifically, after the electroplating liquid in the spray chamber 21 suspends the pipe, the sliding component 7 drives the second spray pipe 6 to slide and insert into the pipe. Then, the electroplating liquid is delivered to the second spray pipe 6 through the second circulation pipe 62, so that the electroplating liquid can act on the inner wall of the pipe, thereby destroying the bubbles formed on the inner wall of the pipe.

[0061] Reference Figure 1 , Figure 2 An extension bar 63 is fixedly installed on the outer peripheral wall of the end of the second spray pipe 6 away from the electroplating tank 12. The side of the extension bar 63 away from the second spray pipe 6 extends out of the electroplating liquid surface of the circulation tank 13. The sliding assembly 7 includes a drive sprocket 71, a driven sprocket 72, a chain 73, and a rotating motor 74. The drive sprocket 71 is rotatably installed on the outer wall of the electroplating tank 1, the driven sprocket 72 is rotatably installed on the inner wall of the circulation tank 13, the chain 73 is wound between the drive sprocket 71 and the driven sprocket 72, and the side of the extension bar 63 away from the second spray pipe 6 is fixedly installed on the chain 73. The rotating motor 74 is fixedly installed on the outer wall of the electroplating tank 1, and the output shaft of the rotating motor 74 is coaxially connected to the drive sprocket 71. The rotating motor 74 drives the drive sprocket 71 to rotate, and the extension bar 63 can move closer to or away from the electroplating tank 12 under the action of the chain 73, thereby enabling the second spray pipe 6 to move closer to or away from the electroplating tank 12, so that the second spray pipe 6 can be inserted into or removed from the pipe.

[0062] The electroplating process in Embodiment 1 of this application is as follows:

[0063] S1. Pipe installation: Extend the lifting cylinder 15 to move the lifting plate 2 toward the side close to the opening of the electroplating tank 12 and force the lifting plate 2 to rise above the surface of the electroplating liquid in the electroplating tank 12. Then place the pipe to be electroplated on the arc surface 23 of the lifting plate 2.

[0064] S2. Lowering of lifting plate 2: The lifting cylinder 15 makes the lifting plate 2 lower slowly and evenly away from the opening of the electroplating tank 12, so as to bring the pipe to be electroplated into the electroplating tank 12; the pipe lowered slowly and evenly can discharge as much air as possible from the pipe wall, reducing the possibility of air entering the electroplating solution with the pipe and forming bubbles on the pipe wall.

[0065] S3. Start-up of the first circulation component: Start the liquid pump 16 to spray the electroplating solution in the circulation tank 13 outward through the first spray hole 22, the second spray hole 31 and the third spray hole 41 respectively. The electroplating solution sprayed outward along the first spray hole 22 can force the pipe to float above the support plate 2, so that the pipe is suspended in the surface of the electroplating solution, increasing the contact area between the pipe and the electroplating solution, thereby improving the electroplating effect on the pipe. The electroplating solution sprayed outward along the second spray hole 31 and the third spray hole 41 can increase the flow rate of the electroplating solution around the pipe. Utilizing Bernoulli's principle, the electroplating solution in the electroplating tank 12 can hydraulically confine the pipe to the position directly above the support plate 2, improving the suspension stability of the pipe.

[0066] S4. Insertion of the second spray pipe 6: The sliding component 7 drives the second spray pipe 6 to slide towards the side closer to the electroplating tank 12 and forces the second spray pipe 6 to slide and be inserted into the pipe.

[0067] S5. Start-up of the second circulation component: The electroplating solution in the circulation tank 13 is transported to the second spray pipe 6 through the second circulation pipe 62 and sprayed out through the fourth spray hole 61. This part of the electroplating solution can be used to impact the inner wall of the pipe to break the bubbles formed on the inner wall of the pipe, thereby reducing the reduction of the electroplating effect on the pipe when the pipe enters the surface of the electroplating solution and air adheres to the inner wall of the pipe to form bubbles.

[0068] S6. Sliding out of the second spray pipe 6: After electroplating is completed, the sliding component 7 drives the second spray pipe 6 to slide away from the electroplating tank 12 and forces the second spray pipe 6 out of the pipe so as to facilitate the removal of the pipe after electroplating.

[0069] S7. Lifting of lifting plate 2: The lifting cylinder 15 moves the lifting plate 2 toward the opening of the electroplating tank 12 to push the pipe outward and remove the electroplated pipe.

[0070] Example 2:

[0071] This application discloses an electroplating apparatus.

[0072] Reference Figure 5 The electroplating apparatus disclosed in this application differs from that in Embodiment 1 in that:

[0073] In this embodiment, the fourth spray hole 61 includes a vertical portion 611 and a bent portion 612. The spray direction of the vertical portion 611 is perpendicular to the peripheral wall of the second spray pipe 6. The inlet end of the vertical portion 611 is connected to the interior of the second spray pipe 6, and the inlet end of the bent portion 612 is connected to the outlet end of the vertical portion 611. The outlet end of the bent portion 612 passes through the outer peripheral wall of the second spray pipe 6. There is an angle between the spray direction of the bent portion 612 and the spray direction of the vertical portion 611. Specifically, the angle between the spray direction of the bent portion 612 and the spray direction of the vertical portion 611 is set to 120 degrees.

[0074] The implementation principle of Embodiment 2 of this application is as follows: With the setting of the vertical part 611 and the bending part 612, when the second spray pipe 6 sprays the electroplating liquid outward, the electroplating liquid changes the spray angle after passing through the bending part 612. When this part of the electroplating liquid acts on the inner peripheral wall of the pipe, it forms a pushing force on the inner peripheral wall of the pipe, thereby driving the pipe to rotate around the axial direction of the second spray pipe 6. The electroplating liquid continuously scours and fully contacts and exchanges with the peripheral wall of the pipe to improve the uniformity of the pipe coating, thereby improving the electroplating effect of the pipe.

[0075] The above are preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made to the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An electroplating apparatus, characterized in that: The system includes an electroplating tank (1), which is equipped with a partition plate (11) to divide the electroplating tank (1) into an electroplating tank (12) for electroplating pipes and a circulation tank (13) for circulating electroplating solution. The partition plate (11) has an overflow port (111) connected to the circulation tank (13) on its side wall near the electroplating tank (12). The electroplating tank (12) is equipped with a support plate (2) for placing pipes on its surface. The support plate (2) is equipped with a spray chamber (21), and the support plate (2) has multiple spray chambers on its surface near the opening of the electroplating tank (12). A first spray hole (22) is connected to the spray chamber (21). A first circulation component is provided between the circulation tank (13) and the support plate (2) to transport the electroplating solution in the circulation tank (13) to the spray chamber (21). The two opposite side walls of the support plate (2) are respectively provided with extension plates (3). Each extension plate (3) has multiple second spray holes (31) connected to the spray chamber (21) on its surface near the opening of the electroplating tank (12). The spraying direction of all the second spray holes (31) is vertical. The second spray holes (31) of the two extension plates (3) are used to spray symmetrically. On both sides of the radial direction of the pipe; the lifting plate (2) and the extension plate (3) are respectively provided with first spray pipes (4), each of the first spray pipes (4) is connected to the spray chamber (21), and the side wall of the first spray pipe (4) near the opening of the electroplating tank (12) is provided with a plurality of third spray holes (41) connected to the inside of the first spray pipe (4), and the spraying direction of all the third spray holes (41) is vertically arranged, and the third spray holes (41) of the two first spray pipes (4) are used to spray symmetrically to both sides of the axial direction of the pipe; the partition plate (11) is near the side wall of the electroplating tank (12). A sliding groove (112) is provided in connection with the circulation tank (13). A second spray pipe (6) is slidably installed in the sliding groove (112) for coaxial insertion into the pipe. The second spray pipe (6) is provided with a sliding component (7) for driving the second spray pipe (6) closer to or away from the electroplating tank (12). A plurality of fourth spray holes (61) are provided on the outer peripheral wall of the second spray pipe (6) in connection with the second spray pipe (6). A second circulation component is provided between the second spray pipe (6) and the circulation tank (13) for transporting the electroplating liquid in the circulation tank (13) to the second spray pipe (6).

2. The electroplating apparatus according to claim 1, characterized in that: Each of the first spray pipes (4) is slidably mounted on the side wall of the electroplating tank (12), and the side wall of the electroplating tank (12) is provided with a drive assembly (5) for driving the two first spray pipes (4) to move closer or further apart from each other.

3. The electroplating apparatus according to claim 2, characterized in that: The drive assembly (5) includes a first lead screw (51), a second lead screw (52), and a drive motor (53). The first lead screw (51) is rotatably connected to the side wall of the electroplating tank (12), and the second lead screw (52) is coaxially connected to the end face of the first lead screw (51). The first lead screw (51) and the second lead screw (52) are connected through different spray pipes and threadedly connected to the corresponding spray pipes. The thread direction of the first lead screw (51) is opposite to that of the thread direction of the second lead screw (52). The drive motor (53) is fixed to the outer wall of the electroplating tank (1), and the output shaft of the drive motor (53) passes through the side wall of the electroplating tank (1) and is coaxially connected to the first lead screw (51).

4. The electroplating apparatus according to claim 1, characterized in that: The fourth spray hole (61) includes a vertical part (611) and a bent part (612). The inlet end of the vertical part (611) is connected to the inside of the second spray pipe (6), and the spray direction of the vertical part (611) is perpendicular to the outer peripheral wall of the second spray pipe (6). The inlet end of the bent part (612) is connected to the outlet end of the vertical part (611), and there is an angle between the spray direction of the bent part (612) and the spray direction of the vertical part (611).

5. The electroplating apparatus according to claim 1, characterized in that: Each of the extension plates (3) is detachably connected to the support plate (2).

6. The electroplating apparatus according to claim 1, characterized in that: The lifting plate (2) has an arc surface (23) on the plate surface near the opening of the electroplating tank (12) for pipe contact. The lifting plate (2) is slidably installed on the inner wall of the electroplating tank (12). The lifting plate (2) is provided with a lifting component for driving the lifting plate (2) closer to or away from the opening of the electroplating tank (12).

7. An electroplating process, based on an electroplating apparatus according to any one of claims 1-6, comprising the following steps: S1. Installation of the pipe: Place the pipe to be electroplated above the support plate (2); S2, Sinking of the lifting plate (2): Move the lifting plate (2) away from the opening of the electroplating tank (12) to bring the pipe into the electroplating tank (12); S3. Start-up of the first circulation component: The electroplating solution in the circulation tank (13) is transported to the electroplating tank (12) through the first circulation component; S4. Insertion of the second spray pipe (6): The second spray pipe (6) is driven by the sliding assembly (7) to slide towards the side closer to the electroplating tank (12) and forced to slide and insert the second spray pipe (6) into the pipe. S5. Start-up of the second circulation component: The electroplating solution in the circulation tank (13) is transported to the second spray pipe (6) through the second circulation component; S6. Sliding out of the second spray pipe (6): The second spray pipe (6) is driven to slide away from the electroplating tank (12) by the sliding assembly (7) and forced to move out of the pipe; S7. Lifting of the lifting plate (2): The lifting plate (2) is moved toward the opening of the electroplating tank (12) by means of the lifting component.

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