A thermal management device, energy storage device and control method

Abstract

This application relates to a thermal management device, energy storage equipment, and control method. In the thermal management device, a first heat dissipation circuit includes a first heat exchange device and a first cooling component; a second heat dissipation circuit includes a dry cooler and a second cooling component; a refrigeration circuit shares the first heat exchange device with the first heat dissipation circuit for heat exchange; the second heat exchange device includes a first heat exchange side and a second heat exchange side, wherein the first heat exchange side can be connected to the first cooling component to form a circuit; the second heat exchange side can be connected to the second cooling component to form a circuit, and the cooling medium flowing to the first heat exchange side can exchange heat with the cooling medium flowing to the second heat exchange side. This arrangement allows the cooling medium that has undergone heat exchange with the dry cooler and the cooling medium that has undergone heat exchange with the second heat exchange device to mix before dissipating heat from the heat dissipation device, solving the problems of poor cooling effect of the dry cooler on the cooling medium under high-temperature conditions and easy over-cooling under low-temperature conditions.

Description

Technical Field

[0001] This application relates to the field of thermal management device technology, and in particular to a thermal management device, energy storage device and control method. Background Technology

[0002] A dry cooler is a heat exchange device that uses only dry air as the heat exchange medium and employs an air agitation device to achieve strong convection for heat exchange. As a component of a thermal management system, the dry cooler is used to cool the coolant within the thermal management system. The cooled coolant is then used to dissipate heat from the device being cooled. For example, if the device being cooled is an inverter in an energy storage power station, the coolant is cooled by the dry cooler, and the cooled coolant then dissipates heat from the inverter.

[0003] In the process of realizing this invention, the inventors discovered at least the following problems in the prior art:

[0004] Under high-temperature conditions, the dry cooler is prone to insufficient cooling capacity of the coolant, while under low-temperature conditions, it is prone to overcooling of the coolant. Summary of the Invention

[0005] This application provides a thermal management device, energy storage equipment, and control method to solve the problems in the prior art where dry coolers have poor cooling effect on coolant under high-temperature conditions and are prone to overcooling under low-temperature conditions.

[0006] This application provides a thermal management device, comprising: a first heat dissipation circuit with a first heat exchange device for dissipating heat to a first device to be cooled, the first heat dissipation circuit being provided with the first heat exchange device and a first cooling component; a second heat dissipation circuit for dissipating heat to a second device to be cooled, the second heat dissipation circuit being provided with a dry cooler and a second cooling component, wherein the first device to be cooled and the second device to be cooled have a large temperature difference; a refrigeration circuit sharing the first heat exchange device with the first heat dissipation circuit for heat exchange with the first heat dissipation circuit; the second heat exchange device including a first heat exchange side and a second heat exchange side, wherein the first heat exchange side can be connected to the first cooling component to form a circuit; the second heat exchange side can be connected to the second cooling component to form a circuit, and the cooling medium flowing to the first heat exchange side can exchange heat with the cooling medium flowing to the second heat exchange side.

[0007] Optionally, the thermal management device further includes: a first regulating valve, through which the first heat exchange side is connected to the first cooling component to form a loop; and a second regulating valve, through which the second heat exchange side is connected to the second cooling component to form a loop.

[0008] Optionally, the first regulating valve is a two-way valve, and the first cooling component is connected to the second heat exchange device through the two-way valve; the second regulating valve is a three-way valve, which has a main line and a branch line, and the second cooling component is connected to the dry cooler through the main line and to the second heat exchange device through the branch line.

[0009] Optionally, the first heat dissipation circuit and the second heat dissipation circuit are respectively provided with at least one temperature sensor and / or at least one pressure sensor.

[0010] Optionally, the temperature of the first heat dissipation device is lower than the temperature of the second heat dissipation device. The thermal management device also includes a heater, which is disposed at the liquid inlet end of the first cooling component and is used to heat the cooling medium entering the first cooling component.

[0011] Optionally, the thermal management device also includes an expansion tank and two circulation pumps, one circulation pump being installed in the first heat dissipation circuit and the other circulation pump being installed in the second heat dissipation circuit, with the expansion tank connected to both circulation pumps respectively.

[0012] Optionally, the dry cooler is equipped with a speed-regulating fan.

[0013] Optionally, filters are provided in both the first and second heat dissipation circuits.

[0014] A second aspect of this application provides an energy storage device, including the thermal management device described above.

[0015] A third aspect of this application provides a control method applied to the thermal management device provided in the first aspect of this application or the energy storage device provided in the second aspect of this application. The control method includes:

[0016] S1: Determine the temperature range in which the ambient temperature of the thermal management device falls, and the temperature range shall include at least a high temperature range and a low temperature range;

[0017] S2: When the ambient temperature falls into the high temperature range, control the first heat exchange side to connect with the first cooling component to form a loop, and control the second heat exchange side to connect with the second cooling component to form a loop.

[0018] S3: When the ambient temperature falls into the low temperature range, the first heat exchange side is disconnected from the first cooling component, and the second heat exchange side is connected to the second cooling component to form a loop.

[0019] Optionally, the control method further includes:

[0020] S101: Determine the temperature range in which the ambient temperature of the thermal management device falls, and the temperature range shall include at least a high temperature range, a low temperature range, and a medium temperature range;

[0021] S102: When the ambient temperature falls into the high temperature range, open the two-way valve to connect the first heat exchange side with the first cooling component to form a circuit, and open the branch of the three-way valve to connect the second heat exchange side with the second cooling component to form a circuit;

[0022] S103: When the ambient temperature falls into the medium temperature range, close the two-way valve to disconnect the first heat exchange side from the first cooling component, and close the branch of the three-way valve to disconnect the second heat exchange side from the second cooling component;

[0023] S104: When the ambient temperature falls into the low temperature range, close the two-way valve to disconnect the first heat exchange side from the first cooling component, and open the branch of the three-way valve to connect the second heat exchange side with the second cooling component to form a loop.

[0024] This application has at least the following beneficial effects:

[0025] The thermal management device, energy storage device, and control method provided in this application, through a second heat exchange device, enable one part of the cooling medium in the second heat dissipation circuit to exchange heat through a dry cooler, and the other part of the cooling medium to exchange heat through the second heat exchange device. Moreover, these two parts of the cooling medium can be mixed before dissipating heat to the second device to be cooled, so that the cooling medium dissipating heat to the second device to be cooled can be kept within a preset temperature range. This allows the cooling medium of the second heat dissipation circuit to exchange heat without relying solely on the dry cooler, solving the problems of poor cooling effect of the dry cooler on the cooling medium under high temperature conditions and easy overcooling under low temperature conditions. This improves the heat dissipation effect of the second heat dissipation circuit on the second device to be cooled and ensures the stable operation of the second device to be cooled. Furthermore, compared with the technical solution of increasing the volume of the dry cooler to improve heat dissipation efficiency, this embodiment uses the method of mixing the cooling medium to improve heat dissipation efficiency, thereby eliminating the need to increase the volume of the dry cooler and saving costs.

[0026] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the thermal management device provided in this application in one specific embodiment;

[0028] Figure 2 A flowchart illustrating the steps of the control method provided in this application.

[0029] Figure label:

[0030] 10-Refrigeration circuit;

[0031] 11-Compressor;

[0032] 12-Condenser;

[0033] 13-Throttle valve;

[0034] 201-First heat dissipation circuit;

[0035] 202 - Second heat dissipation circuit;

[0036] 211 - First heat exchanger;

[0037] 212 - Second heat exchanger;

[0038] 212a - First heat exchange side;

[0039] 212b - Second heat exchange side;

[0040] 213-Dry cooler;

[0041] 22-Second regulating valve;

[0042] 221 - Liquid Inlet;

[0043] 222 - First liquid outlet;

[0044] 223 - Second liquid outlet;

[0045] 23-First regulating valve;

[0046] 241 - First cooling component;

[0047] 242 - Second cooling component;

[0048] 251 - Temperature sensor;

[0049] 252 - Pressure sensor;

[0050] 26 - Heater;

[0051] 271 - Circulation pump;

[0052] 272 - Expansion tank;

[0053] 28-Filter;

[0054] 29-Speed-regulating fan;

[0055] 31-First inlet pipe;

[0056] 32-First outlet pipe;

[0057] 33 - Second inlet pipe;

[0058] 34 - Second outlet pipe.

[0059] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0060] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0061] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0062] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0063] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0064] It should be noted that the directional terms such as "upper," "lower," "left," and "right" described in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0065] This application provides a thermal management device, such as... Figure 1As shown, the thermal management device includes a first heat dissipation circuit 201, a second heat dissipation circuit 202, a refrigeration circuit 10, and a second heat exchanger 212. The first heat dissipation circuit 201 is used to dissipate heat from a first device to be cooled, and is equipped with a first heat exchanger 211 and a first cooling component 241. The second heat dissipation circuit 202 is used to dissipate heat from a second device to be cooled, and is equipped with a dry cooler 213 and a second cooling component 242. The temperature difference between the first and second devices to be cooled is large. The refrigeration circuit 10 shares the first heat exchange device 211 with the first heat dissipation circuit 201 to exchange heat with the first heat dissipation circuit 201; the second heat exchange device 212 includes a first heat exchange side 212a and a second heat exchange side 212b, wherein the first heat exchange side 212a can be connected to the first cooling component 241 to form a circuit; the second heat exchange side 212b can be connected to the second cooling component 242 to form a circuit, and the cooling medium flowing to the first heat exchange side 212a can exchange heat with the cooling medium flowing to the second heat exchange side 212b.

[0066] Cooling media flow in the first heat dissipation circuit 201 and the second heat dissipation circuit 202, respectively, while refrigerant flows in the refrigeration circuit 10. In the first heat dissipation circuit 201, the cooling media can flow into the first heat exchange device 211 and exchange heat with the refrigerant in the refrigeration circuit 10. After heat exchange, the cooling media flows into the first cooling component 241 to dissipate heat from the first device to be cooled. In the second heat dissipation circuit 202, the cooling media can flow into the dry cooler 213 and exchange heat there. After heat exchange, the cooling media flows into the second cooling component 242 to dissipate heat from the second device to be cooled.

[0067] When the second heat exchange side 212b of the second heat exchange device 212 is connected to the second cooling component 242 to form a circuit, a portion of the cooling medium in the second heat dissipation circuit 202 flows into the dry cooler 213 for heat exchange, and another portion of the cooling medium flows into the second heat exchange side 212b for heat exchange. At this time, the cooling medium exchanges heat on the second heat exchange side 212b by natural cooling. The cooling medium that has exchanged heat through the dry cooler 213 and the cooling medium that has passed through the second heat exchange side 212b are mixed and then flow into the second cooling component 241.

[0068] When the first heat exchange side 212a of the second heat exchange device 212 is connected to the first cooling component 241 to form a circuit, and the second heat exchange side 212b of the second heat exchange device 212 is connected to the second cooling component 242 to form a circuit, a portion of the cooling medium in the second heat dissipation circuit 202 flows into the dry cooler 213 for heat exchange, and another portion of the cooling medium flows into the second heat exchange side 212b for heat exchange. A portion of the cooling medium in the first heat dissipation circuit 201 flows into the first heat exchange device 211 for heat exchange, and another portion of the cooling medium flows into the first heat exchange side 212a for heat exchange. The cooling medium flowing into the second heat exchange side 212b exchanges heat with the cooling medium flowing into the first heat exchange side 212a. The cooling medium flowing out from the second heat exchange side 212b mixes with the cooling medium flowing out from the dry cooler 213 and flows into the second cooling component 242. The cooling medium flowing out from the first heat exchange side 212a mixes with the cooling medium flowing out from the first heat exchange device 211 and flows into the first cooling component 241.

[0069] In low-temperature conditions, such as an ambient temperature of -30℃ to 10℃, to avoid the risk of overcooling when the cooling medium of the second heat dissipation circuit 202 relies solely on the dry cooler 213 for heat exchange, the second heat exchange side 212b can be connected to the second cooling component 242 to form a circuit. This allows a portion of the cooling medium to flow into the dry cooler 213 for heat exchange, while another portion flows into the second heat exchange side 212b for natural cooling. Then, these two portions of cooling medium are mixed, and the temperature of the mixed cooling medium is maintained within a preset temperature range to dissipate heat from the inverter.

[0070] Under high-temperature conditions, such as an ambient temperature of 45℃ to 55℃, to avoid the risk of poor cooling effect of the cooling medium when relying solely on the dry cooler 213 for heat exchange, the first heat exchange side 212a can be connected to the first cooling component 241 to form a circuit, and the second heat exchange side 212b can be connected to the second cooling component 242 to form a circuit. This allows a portion of the cooling medium to flow into the dry cooler 213 for heat exchange, while another portion flows into the second heat exchange side 212b and exchanges heat with the cooling medium in the first heat exchange circuit 201 flowing into the first heat exchange side 212a. Then, these two portions of cooling medium are mixed, and the temperature of the mixed cooling medium is maintained within a preset temperature range to dissipate heat from the inverter.

[0071] Specifically, the first cooling component 241 and the second cooling component 242 can be liquid cooling plates or other forms of cooling components.

[0072] Refrigerant is the medium through which energy conversion is accomplished in various heat engines. It absorbs heat from the object being cooled at low temperatures and then transfers it to cooling water or air at higher temperatures. Specific refrigerants can be ammonia (code: R717), Freon-12 (code: R12), tetrafluoroethane (code: R134a), etc.

[0073] The cooling medium can be water or oil, etc.

[0074] In this embodiment, through the second heat exchange device 212, a portion of the cooling medium in the second heat dissipation circuit 202 can exchange heat through the dry cooler 213, and another portion of the cooling medium can exchange heat through the second heat exchange device 212. Moreover, these two portions of cooling medium can be mixed before dissipating heat to the second device to be cooled, so that the cooling medium dissipating heat to the second device to be cooled can be kept within a preset temperature range. This allows the cooling medium of the second heat dissipation circuit 202 to exchange heat without relying solely on the dry cooler 213, solving the problems of poor cooling effect of the dry cooler 213 on the cooling medium under high temperature conditions and easy overcooling under low temperature conditions. This improves the heat dissipation effect of the second heat dissipation circuit 202 on the second device to be cooled and ensures the stable operation of the second device to be cooled. Moreover, compared with the technical solution of increasing the volume of the dry cooler 213 to improve heat dissipation efficiency, this embodiment adopts the method of mixing cooling media to improve heat dissipation efficiency without increasing the volume of the dry cooler 213, which is beneficial to saving costs.

[0075] The thermal management device provided in this embodiment can simultaneously dissipate heat from the power battery and inverter of the energy storage power station. Compared with the power battery, the inverter can withstand higher temperatures, so the temperature difference between the inverter and the power battery is large when they are working.

[0076] Since the cooling medium of the first heat dissipation circuit 201 exchanges heat with the refrigerant of the refrigeration circuit 10, the temperature of the cooling medium of the first heat dissipation circuit 201 can be relatively low. Therefore, the first heat dissipation circuit 201 can be configured to dissipate heat from the power battery, and the second heat dissipation circuit 202 can be configured to dissipate heat from the inverter. That is, the first device to be cooled is the power battery, and the second device to be cooled is the inverter.

[0077] In low-temperature conditions, such as an ambient temperature of -30℃ to 10℃, to avoid the risk of overcooling when the cooling medium of the second heat dissipation circuit 202 relies solely on the dry cooler 213 for heat exchange, a portion of the cooling medium can flow into the dry cooler 213 for heat exchange, while another portion flows into the second heat exchange device 212 for heat exchange through natural cooling. Then, the two portions of cooling medium are mixed, and the temperature of the mixed cooling medium is maintained within a preset temperature range to dissipate heat from the inverter.

[0078] Under medium-temperature conditions, such as an ambient temperature of 10℃ to 45℃, the cooling medium of the second heat dissipation circuit 202 can rely solely on the dry cooler 213 for heat exchange, which can keep the temperature of the cooling medium within the preset temperature range to dissipate heat from the inverter.

[0079] Under high-temperature conditions, such as an ambient temperature of 45℃~55℃, in order to avoid the risk of poor cooling effect of the cooling medium in the second heat dissipation circuit 202 when relying solely on the dry cooler 213 for heat exchange, a portion of the cooling medium can flow into the dry cooler 213 for heat exchange, while another portion flows into the second heat exchange device 212 and exchanges heat with the cooling medium of the first heat dissipation circuit 201 flowing through the second heat exchange device 212. Then, the two portions of cooling medium are mixed, and the temperature of the mixed cooling medium is maintained within a preset temperature range to dissipate heat from the inverter.

[0080] The thermal management device provided in this embodiment can simultaneously dissipate heat from the power battery and inverter of the energy storage power station. It can meet the temperature control requirements of the power battery and inverter under different ambient temperatures, thereby improving the overall operational reliability of the energy storage power station.

[0081] The dry cooler 213 is equipped with a speed-regulating fan 29. The speed-regulating fan 29 can draw air from the environment, causing air to flow into the dry cooler 213 through the air inlet and exchange heat with the cooling medium in the dry cooler 213. It can also discharge the heat-exchanged air back to the outside through the air outlet of the dry cooler 213. By adjusting the speed of the speed-regulating fan 29, the heat exchange of the cooling medium in the dry cooler 213 can be adjusted. For example, under medium-temperature conditions, when the actual ambient temperature of the thermal management device is 10℃~45℃, the heat exchange of the dry cooler 213 can be adjusted by the speed-regulating fan 29, so that the actual temperature of the cooling medium used by the second heat dissipation circuit 202 for dissipating heat from the second heat dissipation device is maintained within its preset temperature range.

[0082] Specifically, the refrigeration circuit 10 is also equipped with a compressor 11, a condenser 12 and a throttle valve 13. The compressor 11 can drive the refrigerant to flow in the refrigeration circuit 10. The high-temperature and high-pressure refrigerant flows out from the compressor 11 and then flows into the condenser 12. In the condenser 12, the high-temperature and high-pressure refrigerant condenses into a medium-temperature and high-pressure refrigerant. The medium-temperature and high-pressure refrigerant flows into the first heat exchange device 211 after being throttled and depressurized by the throttle valve 13.

[0083] Furthermore, both the first heat exchanger 211 and the second heat exchanger 212 can be plate heat exchangers. Plate heat exchangers have the characteristics of high heat exchange efficiency, low heat loss, compact structure, and long service life.

[0084] In one specific embodiment, the thermal management device further includes a first regulating valve 23 and a second regulating valve 22. The first heat exchange side 212a is connected to the first cooling component 241 through the first regulating valve 23 to form a loop; the second heat exchange side 212b is connected to the second cooling component 242 through the second regulating valve 22 to form a loop.

[0085] In the first heat dissipation circuit 201, under the control of the first regulating valve 23, all the cooling medium in the first heat dissipation circuit 201 can be heat exchanged through the first heat exchange device 211, and the cooled medium after heat exchange flows into the first cooling component 241; it can also be that a part of the cooling medium in the first heat dissipation circuit 201 is heat exchanged through the first heat exchange device 211, and another part of the cooling medium is heat exchanged through the second heat exchange device 212, and the two parts of the cooling medium are mixed and then flow into the first cooling component 241.

[0086] In the second heat dissipation circuit 202, under the control of the second regulating valve 22, all the cooling medium in the second heat dissipation circuit 202 can be heat exchanged through the dry cooler 213, and the cooled medium after heat exchange flows into the second cooling component 242; it is also possible to make a part of the cooling medium in the second heat dissipation circuit 202 heat exchanged through the dry cooler 213, and another part of the cooling medium heat exchanged through the second heat exchange device 212, and the two parts of the cooling medium are mixed and flow into the second cooling component 241.

[0087] Specifically, the first regulating valve 23 is a two-way valve, and the first cooling component 241 is connected to the second heat exchange device 212 through the two-way valve; the second regulating valve 22 is a three-way valve, which has a main line and a branch line. The second cooling component 242 is connected to the dry cooler 213 through the main line, and the second cooling component 242 is connected to the second heat exchange device 212 through the branch line.

[0088] The three-way valve can distribute the flow rate of the cooling medium entering the dry cooler 213 and the second heat exchange device 212 in the second heat dissipation circuit 202, respectively. The two-way valve can adjust the flow rate of the cooling medium passing through the second heat exchange device 212 in the first heat dissipation circuit 201, so as to improve the efficiency of the cooling medium in the second heat dissipation circuit 202 to reach the target temperature after mixing.

[0089] For example, under high-temperature conditions, when it is necessary to rapidly reduce the cooling medium in the second heat dissipation circuit 202 to a lower temperature, the three-way valve can be adjusted to reduce the flow rate of the cooling medium flowing into the dry cooler 213 in the second heat dissipation circuit 202 and increase the flow rate of the cooling medium flowing into the second heat exchange device 212. The two-way valve can also be adjusted to increase the flow rate of the cooling medium flowing into the second heat exchange device 212 from the first heat dissipation circuit 201. This increases the heat exchange capacity of the second heat dissipation circuit 202 in the second heat exchange device 212, so that the cooling medium formed after the cooling medium that has undergone heat exchange in the dry cooler 213 and the cooling medium that has undergone heat exchange in the second heat exchange device 212 can rapidly reduce to a lower temperature.

[0090] Specifically, such as Figure 1 As shown, the three-way valve has an inlet 221, a first outlet 222, and a second outlet 223. The inlet 221 is connected to the outlet of the second cooling component 242, the first outlet 222 is connected to the inlet of the dry cooler 213, and the second outlet 223 is connected to the inlet of the second heat exchange side 212b of the second heat exchange device 212.

[0091] The three-way valve can be an electrically operated three-way valve for easy control.

[0092] like Figure 1 As shown, the two-way valve can be connected to the outlet of the first cooling component 241 and the inlet of the first heat exchange side 212a of the second heat exchange device 212. Alternatively, in other embodiments, the two-way valve can be connected to both the outlet of the first heat exchange side 212a of the second heat exchange device 212 and the inlet of the first cooling component 241. Specifically, the two-way valve can be an electrically operated two-way valve for ease of control.

[0093] In order to detect the cooling medium temperature of the first heat dissipation circuit 201 and the cooling medium temperature of the second heat dissipation circuit 202, at least one temperature sensor 251 is provided in the first heat dissipation circuit 201 and the second heat dissipation circuit 202 respectively.

[0094] Specifically, such as Figure 1 As shown, the first cooling component 241 is connected to the first heat exchange device 211 and the first heat exchange side 212a of the second heat exchange device 212 through the first liquid inlet pipe 31 and the first liquid outlet pipe 32; the second cooling component 242 is connected to the dry cooler 213 and the second heat exchange side 212b of the second heat exchange device 212 through the second liquid inlet pipe 33 and the second liquid outlet pipe 34; a temperature sensor 251 is respectively provided on the first liquid inlet pipe 31, the first liquid outlet pipe 32, the second liquid inlet pipe 33 and the second liquid outlet pipe 34.

[0095] By setting the temperature sensor 251, the actual temperature of the cooling medium before entering the first cooling component 241 and the actual temperature of the cooling medium after flowing out of the first cooling component 241, as well as the actual temperature of the cooling medium before entering the second cooling component 242 and the actual temperature of the cooling medium after flowing out of the second cooling component 242, can be detected and transmitted to the control system. The control system compares the actual value with the preset range value to check whether the cooling temperature of the cooling medium meets the standard.

[0096] To detect the cooling medium pressure of the first heat dissipation circuit 201 and the second heat dissipation circuit 202, at least one temperature sensor 251 is provided in each of the first heat dissipation circuit 201 and the second heat dissipation circuit 202.

[0097] Specifically, a pressure sensor 252 is provided in each of the first liquid outlet pipe 32, the first liquid inlet pipe 31, the second liquid outlet pipe 34, and the second liquid inlet pipe 33.

[0098] By setting pressure sensor 252, the actual pressure of the cooling medium before entering the first cooling component 241 and the actual pressure of the cooling medium after flowing out of the first cooling component 241, as well as the actual pressure of the cooling medium before entering the second cooling component 242 and the actual pressure of the cooling medium after flowing out of the second cooling component 242, can be detected. The detected actual values ​​are transmitted to the control system. The control system compares the actual values ​​with the preset range values ​​to check whether the pressure of the cooling medium meets the standard, so as to prevent the pipeline from being blocked or even burst due to excessive pressure.

[0099] In one specific embodiment, the temperature of the first heat dissipation device is lower than the temperature of the second heat dissipation device. In order to prevent the cooling medium from freezing in the pipe of the first heat dissipation circuit 201 when the temperature is too low, the thermal management device further includes a heater 26. The heater 26 is disposed at the liquid inlet end of the first cooling component 241 and is used to heat the cooling medium entering the first cooling component 241.

[0100] Because the temperature of the first heat dissipation device is lower than that of the second heat dissipation device, the temperature of the cooling medium in the first heat dissipation circuit 201 is lower than that of the cooling medium in the second heat dissipation circuit 202. Therefore, the cooling medium in the first heat dissipation circuit 201 is more prone to excessively low temperature. In this case, the heater 26 can be turned on to heat the cooling medium, allowing it to heat up quickly and preventing it from freezing in the pipes when the temperature is too low. When the cooling medium temperature is within the preset range, the heater 26 can be turned off, and the heater 26 will not heat the cooling medium after being turned off.

[0101] To improve the safety and reliability of the operation of the first heat dissipation circuit 201 and the second heat dissipation circuit 202, the thermal management device also includes an expansion tank 272 and two circulation pumps 271. One circulation pump 271 is installed in the first heat dissipation circuit 201, and the other circulation pump 271 is installed in the second heat dissipation circuit 202. The expansion tank 272 is connected to the two circulation pumps 271 respectively.

[0102] Among them, the circulating pump 271 is a driving element used to drive the cooling medium to flow in the first heat dissipation circuit 201 and the second heat dissipation circuit 202.

[0103] By setting up an expansion tank 272, the cooling medium pressure of the first heat dissipation circuit 201 can be stabilized, and the circulation pump 271 in the first heat dissipation circuit 201 can operate reliably. At the same time, the cooling medium pressure of the second heat dissipation circuit 202 can be stabilized, and the circulation pump 271 in the second heat dissipation circuit 202 can operate reliably. Moreover, the first heat dissipation circuit 201 and the second heat dissipation circuit 202 can be replenished with liquid.

[0104] The following example illustrates the principle by which the expansion tank 272 achieves constant pressure: Due to the thermal expansion and contraction of water, when the hot water heats up, the water volume in the circulation loop increases. When there is nowhere to accommodate this expansion, the water pressure in the circulation loop increases, which will affect normal operation. At this time, the expansion tank 272 can accommodate the water expansion in the circulation loop, which can reduce the water pressure fluctuation caused by the expansion of water and improve the safety and reliability of the circulation loop operation.

[0105] In order to reduce the impurity content of the cooling medium in the first heat dissipation circuit 201 and the second heat dissipation circuit 202, filters 28 are respectively provided in the first heat dissipation circuit 201 and the second heat dissipation circuit 202.

[0106] For example, filter 28 can be installed at the inlet end of circulating pump 271 to filter the cooling medium entering circulating pump 271.

[0107] A second aspect of this application also provides an energy storage device, which includes the thermal management device in any of the above embodiments.

[0108] Energy storage equipment can specifically be energy storage power stations or energy storage cabinets, etc. It can be applied in power construction, petrochemicals, hotels, etc., storing electricity to power other equipment and facilities. The first and second heat dissipation devices are two components of the energy storage equipment. Using the aforementioned thermal management device, the temperature control requirements of both devices can be simultaneously met under different ambient temperatures. This solves the problem of poor cooling effect of the dry cooler 213 in the second heat dissipation circuit 202 at high temperatures and overcooling at low temperatures, improving the heat dissipation efficiency of both devices and thus enhancing the operational reliability of the energy storage equipment.

[0109] A third aspect of this application also provides a control method, applied to the thermal management device provided in the first aspect of this application or the energy storage device provided in the second aspect of this application, such as... Figure 2 As shown, the control methods include:

[0110] S1: Determine the temperature range in which the ambient temperature of the thermal management device falls. The temperature range includes at least a high temperature range and a low temperature range.

[0111] S2: When the ambient temperature falls into the high temperature range, control the first heat exchange side 212a to connect with the first cooling component 241 to form a loop, and control the second heat exchange side 212b to connect with the second cooling component 242 to form a loop;

[0112] S3: When the ambient temperature falls into the low temperature range, the first heat exchange side 212a is disconnected from the first cooling component 241, and the second heat exchange side 212b is connected to the second cooling component 242 to form a loop.

[0113] When the ambient temperature falls into the high-temperature range, for example, when the ambient temperature is 45℃~55℃, the first part of the cooling medium in the second heat dissipation circuit 202 is controlled to enter the dry cooler 213 for heat exchange, and the second part of the cooling medium in the second heat dissipation circuit 202 is controlled to enter the second heat exchange side 212b of the second heat exchanger 212 for heat exchange and then mix with the first part of the cooling medium. During this process, a part of the cooling medium in the first heat dissipation circuit 201 will flow into the first heat exchange side 212a and exchange heat with the second part of the cooling medium flowing into the second heat exchange side 212b, so as to increase the heat exchange capacity of the second part of the cooling medium and increase the cooling rate of the second part of the cooling medium, so that the first part of the cooling medium and the second part of the cooling medium will cool down rapidly after mixing.

[0114] When the ambient temperature falls into the low temperature range, for example, when the ambient temperature is -30℃ to 10℃, the first part of the cooling medium in the second heat dissipation circuit 202 is controlled to enter the dry cooler 213 for heat exchange, and the second part of the cooling medium in the second heat dissipation circuit 202 is controlled to mix with the first part of the cooling medium after passing through the second heat exchange side 212b of the second heat exchanger 212. During this process, the second part of the cooling medium exchanges heat in the second heat exchanger 212 by natural cooling.

[0115] Furthermore, since the cooling medium in the first heat dissipation circuit 201 achieves cooling by exchanging heat with the refrigerant in the first heat exchange device 211, adjusting the frequency of the compressor 11 and the opening of the throttle valve 13 in the refrigeration circuit 10 can keep the actual temperature of the cooling medium entering the first cooling component 241 within a preset temperature range.

[0116] In this embodiment, to address the issues of poor cooling effect of the dry cooler 213 on the cooling medium under high-temperature conditions and easy overcooling under low-temperature conditions, a control method is used to ensure that a portion of the cooling medium in the second heat dissipation circuit 202 undergoes heat exchange through the dry cooler 213, while another portion undergoes heat exchange through the second heat exchange device 212. These two portions of cooling medium are then mixed before being used to dissipate heat to the second heat dissipation device. This ensures that the cooling medium dissipating heat to the second heat dissipation device remains within a preset temperature range, allowing the cooling medium in the second heat dissipation circuit 202 to operate without relying solely on the dry cooler 213 for heat exchange. This improves the heat dissipation effect of the second heat dissipation circuit 202 on the second heat dissipation device and guarantees the stable operation of the second heat dissipation device.

[0117] In addition, the thermal management device also includes a three-way valve and a two-way valve. The first cooling component 241 is connected to the second heat exchanger 212 through the two-way valve. The second cooling component 242 is connected to the dry cooler 213 through the main path of the three-way valve, and the second cooling component 242 is connected to the second heat exchanger 212 through a branch path of the three-way valve. The control method also includes:

[0118] S101: Determine the temperature range in which the ambient temperature of the thermal management device falls, and the temperature range shall include at least a high temperature range, a low temperature range, and a medium temperature range;

[0119] S102: When the ambient temperature falls into the high temperature range, open the two-way valve to control the first heat exchange side 212a to connect with the first cooling component 241 to form a circuit, and open the branch of the three-way valve to control the second heat exchange side 212b to connect with the second cooling component 242 to form a circuit;

[0120] S103: When the ambient temperature falls into the medium temperature range, close the two-way valve to disconnect the first heat exchange side 212a from the first cooling component 241, and close the branch of the three-way valve to disconnect the second heat exchange side 212b from the second cooling component 242;

[0121] S104: When the ambient temperature falls into the low temperature range, close the two-way valve to disconnect the first heat exchange side 212a from the first cooling component 241, and open the branch of the three-way valve to connect the second heat exchange side 212b with the second cooling component 242 to form a loop.

[0122] When the ambient temperature falls within the medium temperature range, for example, between 10℃ and 45℃, the two-way valve is closed, disconnecting the first heat exchange side 212a from the first cooling component 241. Simultaneously, the branch of the three-way valve is closed, disconnecting the second heat exchange side 212b from the second cooling component 242. At this time, the cooling medium in the second heat dissipation circuit 202 relies entirely on the dry cooler 213 for heat exchange. Specifically, the heat exchange capacity of the dry cooler 213 can be adjusted by the speed-regulating fan 29, ensuring that the actual temperature of the cooling medium used for heat dissipation of the second heat dissipation device in the second heat dissipation circuit 202 remains within its preset temperature range.

[0123] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A thermal management device, characterized by, The heat management device comprises: A first heat dissipation circuit (201) for dissipating heat for a first device to be cooled, the first heat dissipation circuit being provided with a first heat exchange device (211) and a first cooling component (241); A second heat dissipation circuit (202) for dissipating heat for a second device to be cooled, the second heat dissipation circuit (202) being provided with a dry cooler (213) and a second cooling component (242), wherein the temperature of the first device to be cooled is lower than the temperature of the second device to be cooled; A refrigeration circuit (10) sharing the first heat exchange device (211) with the first heat dissipation circuit (201) to exchange heat with the first heat dissipation circuit (201); A second heat exchange device (212) comprising a first heat exchange side (212a) and a second heat exchange side (212b), wherein the first heat exchange side (212a) can be in communication with the first cooling component (241) to form a circuit; the second heat exchange side (212b) can be in communication with the second cooling component (242) to form a circuit, and the cooling medium flowing to the first heat exchange side (212a) can exchange heat with the cooling medium flowing to the second heat exchange side (212b); When the heat management system is in a high-temperature working condition, the first heat exchange side (212a) is in communication with the first cooling component (241) to form a circuit, and the second heat exchange side (212b) is in communication with the second cooling component (242) to form a circuit; When the heat management system is in a low-temperature working condition, the first heat exchange side (212a) is disconnected from the first cooling component (241), and the second heat exchange side (212b) is in communication with the second cooling component (242) to form a circuit.

2. The thermal management device of claim 1, wherein, The heat management device further comprises: A first regulating valve (23), the first heat exchange side (212a) is in communication with the first cooling component (241) to form a circuit through the first regulating valve (23); A second regulating valve (22), the second heat exchange side (212b) is in communication with the second cooling component (242) to form a circuit through the second regulating valve (22).

3. The thermal management device of claim 2, wherein, The first regulating valve (23) is a two-way valve, and the first cooling component (241) is in communication with the second heat exchange device (212) through the two-way valve; The second regulating valve (22) is a three-way valve, the three-way valve has a main path and a branch path, the second cooling component (242) is in communication with the dry cooler (213) through the main path, and the second cooling component (242) is in communication with the second heat exchange device (212) through the branch path.

4. The thermal management device of claim 1, wherein, The first heat dissipation circuit (201) and the second heat dissipation circuit (202) are respectively provided with at least one temperature sensor (251) and / or at least one pressure sensor (252).

5. The thermal management device of claim 2, wherein, The heat management device further comprises a heater (26) arranged at the liquid inlet end of the first cooling component (241) for heating the cooling medium entering the first cooling component (241).

6. The thermal management device of claim 1, wherein, The heat management device further comprises an expansion water tank (272) and two circulating pumps (271), one of which is arranged in the first heat dissipation circuit (201), and the other of which is arranged in the second heat dissipation circuit (202); The expansion water tank (272) is in communication with the two circulating pumps (271) respectively.

7. The thermal management device of claim 1, wherein, The dry cooler (213) is provided with a speed-regulated fan (29).

8. An energy storage device, characterized by, The heat management device according to any one of claims 1-7.

9. A control method applied to the thermal management device of any one of claims 1-7 or to the energy storage device of claim 8, characterized in that, The control method comprises: S1: judging a temperature interval in which an ambient temperature of the heat management device falls, the temperature interval comprising at least a high-temperature interval and a low-temperature interval; S2: when the ambient temperature falls in the high-temperature interval, controlling the first heat exchange side (212a) to be in communication with the first cooling component (241) to form a circuit, and controlling the second heat exchange side (212b) to be in communication with the second cooling component (242) to form a circuit; S3: when the ambient temperature falls in the low-temperature interval, controlling the first heat exchange side (212a) to be disconnected from the first cooling component (241), and controlling the second heat exchange side (212b) to be in communication with the second cooling component (242) to form a circuit.

10. The control method according to claim 9, characterized by, The control method further comprises: S101: judging a temperature interval in which an ambient temperature of the heat management device falls, the temperature interval comprising at least a high-temperature interval, a low-temperature interval and a medium-temperature interval; S102: when the ambient temperature falls in the high-temperature interval, opening the two-way valve, controlling the first heat exchange side (212a) to be in communication with the first cooling component (241) to form a circuit, and opening a branch of the three-way valve, controlling the second heat exchange side (212b) to be in communication with the second cooling component (242) to form a circuit; S103: when the ambient temperature falls in the medium-temperature interval, closing the two-way valve, controlling the first heat exchange side (212a) to be disconnected from the first cooling component (241), and closing a branch of the three-way valve, controlling the second heat exchange side (212b) to be disconnected from the second cooling component (242); S104: when the ambient temperature falls in the low-temperature interval, closing the two-way valve, controlling the first heat exchange side (212a) to be disconnected from the first cooling component (241), and opening a branch of the three-way valve, controlling the second heat exchange side (212b) to be in communication with the second cooling component (242) to form a circuit.

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