A microscopic device for wafer macro defect detection

Abstract

The present invention provides a microscopic device for wafer macro-defect detection, comprising an illumination unit, an infinite imaging unit, and a camera unit. The illumination unit includes a light source, with a first lens, an adjustable aperture, a second lens, and a filter wheel sequentially arranged along the optical path from the light source to the target product. The infinite imaging unit includes an imaging tube lens and an infinite microscope objective lens, with the infinite microscope objective lens and the imaging tube lens sequentially arranged along the optical path from the target product to the camera unit. The present invention enables rapid, non-contact scanning of wafer surfaces, identifying surface defects such as cracks, scratches, spots, and bubbles through high-resolution image analysis, thereby improving the detection rate and accuracy of wafer macro-defects.

Description

Technical Field

[0001] The present invention relates to the technical field of microscopic detection devices, and in particular to a microscopic device for detecting macroscopic defects of wafers. Background Art

[0002] Wafer macro-defect inspection technology is a typical automated optical inspection (AOI) method based on optical principles. Its main method is to illuminate the object being measured through a designed lighting system, which can be divided into different lighting modes such as brightfield, darkfield, and transmitted field. The imaging system captures the image of the object being measured, and the sensor converts the collected optical information of the object into a digital signal, which is then passed to a computer for further processing. This requires precise positioning and motion control of the instrument platform, as well as the selection of lighting sources, optical machine lenses, and image acquisition detectors. Industrial cameras, optical machine lenses, and lighting sources can be flexibly combined according to actual needs.

[0003] Wafer macro-defect inspection equipment primarily detects defects that appear on the wafer's surface, including graphic defects such as damage and scratches, as well as optical size defects. According to market data for wafer inspection equipment, wafer macro-defect inspection equipment accounts for two-thirds of the market share, and the market demand for wafer macro-defect inspection is very high. Foreign wafer macro-defect inspection equipment technology is not publicly available and is highly monopolized, resulting in high prices. Domestic research on this technology is still immature, and the localization rate of wafer macro-inspection equipment on the market is relatively low. No device has yet been found that can rapidly scan the wafer surface without contact and identify surface defects, including cracks, scratches, spots, and bubbles, using high-resolution image analysis technology. Summary of the Invention

[0004] The technical problems to be solved by the present invention are: improving the detection rate and accuracy of macro defects of wafers; and how to quickly scan the wafer surface in a non-contact manner and identify defects on the wafer surface, including cracks, scratches, spots, bubbles, etc., through high-resolution image analysis technology.

[0005] The technical solution of the present invention to solve the above technical problems is as follows:

[0006] The present invention provides a microscopic device for wafer macro-defect detection, comprising an illumination unit, an infinite imaging unit, and a camera unit. The illumination unit is arranged corresponding to a target product for detection and irradiates light onto the target product. The infinite imaging unit is arranged between the camera unit and the target product. Light reflected from the target product passes through the infinite imaging unit and is imaged by the camera unit.

[0007] The lighting unit includes a light source, and a first lens, an adjustable aperture, a second lens and a filter wheel are sequentially arranged in the light path direction from the light source to the target product to be detected;

[0008] The infinity imaging unit includes an imaging tube lens and an infinity microscope objective lens, which are sequentially arranged on the optical path from the inspection target product to the camera unit.

[0009] The beneficial effects of the present invention are:

[0010] The present invention can quickly scan the wafer surface without contact, and identify defects on the wafer surface, including cracks, scratches, spots, bubbles, etc., through high-resolution image analysis, thereby improving the detection rate and accuracy of wafer macro defects.

[0011] On the basis of the above technical solution, the present invention can also be improved as follows.

[0012] Furthermore, a first polarizer is provided on the optical path from the filter wheel to the target product for detection or on the optical path from the target product for detection to the infinity microscope objective lens, a second polarizer is provided on the optical path from the infinity microscope objective lens to the imaging tube lens, the first polarizer and the second polarizer are orthogonal to each other, and a differential interference prism is provided on the optical path between the first polarizer and the second polarizer.

[0013] It can observe high-resolution details of the sample, observe different features of the sample without staining, and show the concave and convex hierarchical relationship of the object.

[0014] Furthermore, it also includes an autofocus sensor, a dichroic mirror and a vertical motion mechanism. The dichroic mirror is located between the differential interference prism and the imaging tube lens, and the autofocus sensor is facing the reflected light path of the dichroic mirror; the autofocus sensor is connected to the vertical motion mechanism signal and can control the vertical motion mechanism along the light path direction of the infinity microscope objective lens, and the infinity microscope objective lens is installed on the vertical motion mechanism.

[0015] The autofocus sensor can calculate and precisely control the distance between the infinity microscope objective and the target product in real time, enabling the infinity microscope objective to focus quickly and accurately while avoiding image blur and defocusing, thereby improving image quality and shooting efficiency.

[0016] Furthermore, the first polarizer is arranged on the optical path from the filter wheel to the target product to be detected.

[0017] Furthermore, a first beam splitter is provided on the optical path from the filter wheel to the target product to be detected, the infinity microscope objective lens is provided on the optical path of the light source and the light is reflected from the first beam splitter to the target product to be detected, and the imaging tube lens is provided on the optical path of the light from the target product to be detected and transmitted through the first beam splitter to the camera unit.

[0018] The light emitted by the light source becomes parallel light after passing through the infinity microscope objective and illuminates the target product for inspection. Finally, the image is formed at the light entrance of the imaging tube lens to achieve the Köhler illumination effect, and the loss of its reflected light is small; the two adjustable diaphragms are the aperture diaphragm and the field diaphragm. The aperture diaphragm has a certain brightness adjustment function, and its main function is to change the NA value of the lens by adjusting the aperture size; the field diaphragm can change the size of the field of view, that is, the size of the illuminated area; the illumination unit and the infinity imaging unit share an infinity microscope objective, and the structure is compact.

[0019] Furthermore, the camera unit includes a linear motion mechanism, a black and white camera and a color camera, and the black and white camera and the color camera are arranged on the side of the linear motion mechanism away from the imaging tube lens; the movement direction of the linear motion mechanism is perpendicular to the optical path direction of the imaging tube lens, and the moving end of the linear motion mechanism includes three workstations along its own movement direction, wherein the first workstation is vacant, the second workstation is equipped with a second beam splitter, and the third workstation is equipped with a first reflector; when the second workstation is facing the imaging tube lens, either the black and white camera or the color camera is facing the optical path of the imaging tube lens, and the other is facing the reflected optical path of the second beam splitter and the first reflector.

[0020] The linear motion mechanism can be controlled to select one of the three stations facing the imaging tube mirror, so as to control the images of the target products to enter different cameras separately, so as to achieve the purpose of obtaining black and white / color images separately or simultaneously, thereby improving the detection rate and accuracy.

[0021] Furthermore, the black and white camera and the color camera are CMOS cameras.

[0022] Furthermore, it also includes an off-axis light source, the light path of the off-axis light source is directed toward the target product to be inspected, and the angle between the light path of the off-axis light source and the light path from the infinity microscope objective lens to the target product to be inspected is an acute angle.

[0023] The off-axis light source provides dark field light directly for the inspection target product.

[0024] Furthermore, two adjustable irises are arranged along the optical path from the first lens to the second lens; and a second reflecting mirror is provided on the optical path between the two adjustable irises.

[0025] The two adjustable diaphragms are the aperture diaphragm and the field diaphragm. The aperture diaphragm has a certain brightness adjustment function, and its main function is to change the NA value of the lens by adjusting the aperture size; the field diaphragm can change the field of view size, that is, the size of the illuminated area.

[0026] Furthermore, the filter wheel includes red, green and blue filters.

[0027] This allows for switching between different wavelengths of light for defect detection on different wafers. It can also include a space for white light. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of the structure of the lighting unit of the present invention.

[0029] Figure 2 Schematic diagram of the structure of the infinite imaging unit of the present invention.

[0030] Figure 3 Schematic diagram of the structure of the camera unit of the present invention.

[0031] Figure 4 Schematic diagram of the structure of an embodiment of the present invention.

[0032] In the accompanying drawings, the technical features represented by the reference numerals are as follows:

[0033] 1-illumination unit; 11-light source; 12-first lens; 13-adjustable iris; 14-second lens; 15-filter wheel; 16-second reflector;

[0034] 2-infinity imaging unit; 21-infinity microscope objective; 22-imaging tube lens; 23-first polarizer; 24-second polarizer; 25-differential interference prism; 26-first beam splitter; 27-dichroic mirror; 28-autofocus sensor;

[0035] 3-camera unit; 31-linear motion mechanism; 32-black and white camera; 33-color camera; 34-second beam splitter; 35-first reflector;

[0036] 4-Detect target product; 5-Off-axis light source. DETAILED DESCRIPTION

[0037] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0038] The present invention refers to Figure 1-4 .

[0039] The present invention provides a microscopic device for wafer macro-defect detection, comprising an illumination unit 1, an infinite imaging unit 2, and a camera unit 3. The illumination unit 1 is arranged corresponding to a detection target product 4 and irradiates light onto the detection target product 4. The infinite imaging unit 2 is arranged between the camera unit 3 and the detection target product 4. Light reflected by the detection target product 4 passes through the infinite imaging unit 2 and is imaged by the camera unit 3.

[0040] The lighting unit 1 includes a light source 11, and a first lens 12, an adjustable aperture 13, a second lens 14 and a filter wheel 15 are sequentially provided in the light path from the light source 11 to the detection target product 4;

[0041] The infinity imaging unit 2 includes an imaging tube lens 22 and an infinity microscope objective lens 21 , which are sequentially arranged on the optical path from the inspection target product 4 to the camera unit 3 .

[0042] principle:

[0043] The light emitted from the light source 11 passes through the first lens 12, the adjustable aperture 13, the second lens 14, and the filter wheel 15 in sequence and shines on the target product 4. The adjustable aperture 13 can adjust the amount of light passing through, and the filter wheel 15 can switch different filters to control light of different wavelengths for illumination, so as to facilitate the detection of defects of different sizes and types.

[0044] Light reflected from the target product 4 is converted to parallel light by the infinity microscope objective 21. It then passes through the imaging tube lens 22 and forms an image on the camera unit 3. The camera unit 3 can utilize a CMOS camera, facilitating the detection of defects of varying sizes and types. The optical path between the infinity microscope objective 21 and the imaging tube lens 22 is parallel, allowing for variable distance between them. This allows for the insertion of additional optical components to manipulate the optical path as needed without affecting the parallel state, enabling the observation of high-resolution details on the target product 4 and displaying the relationship between the concave and convex layers of the target product 4.

[0045] In summary, the present invention can quickly scan the wafer surface without contact, and identify defects on the wafer surface, including cracks, scratches, spots, bubbles, etc., through high-resolution image analysis, thereby improving the detection rate and accuracy of wafer macro defects.

[0046] Further, such as Figure 2 、 Figure 4As shown: a first polarizer 23 is provided on the optical path from the filter wheel 15 to the target product 4 or the optical path from the target product 4 to the infinity microscope objective 21, a second polarizer 24 is provided on the optical path from the infinity microscope objective 21 to the imaging tube lens 22, the first polarizer 23 and the second polarizer 24 are orthogonal to each other, and a differential interference prism 25 is provided on the optical path between the first polarizer 23 and the second polarizer 24.

[0047] Note: A differential interference prism 25 is provided on the optical path between the first polarizer 23 and the second polarizer 24 so that light passes through the differential interference prism 25 on the path between the first polarizer 23 and the second polarizer 24. Therefore, the specific location of the differential interference prism 25 can be anywhere on the outgoing light side of the first polarizer 23 and anywhere on the incident light side of the second polarizer 24, for example, between the second polarizer 24 and the infinity microscope objective 21, between the infinity microscope objective 21 and the dichroic mirror 27, etc.

[0048] It is possible to observe high-resolution details of the sample, observe different features of the sample without staining, and display the concave and convex hierarchical relationships of the object. Light passes through the differential interference prism 25 between the first polarizer 23 and the second polarizer 24, generating O light and e light with a slight angle. Then, it passes through the orthogonal analyzer (second polarizer 24). The vibration directions of the O light and e light coincide, forming a coherent beam that is actually darker than when no polarizer is added. At the same time, the image can produce a pseudo-3D effect, appearing three-dimensional, and can also observe transparent objects such as water droplets and bubbles. The infinity microscope objective 21 and the imaging tube lens 22 have parallel optical paths, so the distance between them can be changed. Therefore, the differential interference prism 25, the first polarizer 23, and the second polarizer 24 can be added.

[0049] Further, such as Figure 2 、 Figure 4 As shown: it also includes an autofocus sensor 28, a dichroic mirror 27 and a vertical motion mechanism. The dichroic mirror 27 is located between the differential interference prism 25 and the imaging tube lens 22. The autofocus sensor 28 is directly opposite the reflected light path of the dichroic mirror 27; the autofocus sensor 28 is connected to the vertical motion mechanism signal and can control the vertical motion mechanism along the light path direction of the infinity microscope objective lens 21. The infinity microscope objective lens 21 is installed on the vertical motion mechanism.

[0050] The autofocus sensor 28 can calculate and accurately control the distance between the infinite microscope objective lens 21 and the detection target product 4 in real time, so that the infinite microscope objective lens 21 can focus quickly and accurately, while avoiding problems such as image blur and virtualization, thereby achieving the purpose of improving image quality and improving shooting efficiency.

[0051] Note: The vertical motion mechanism can utilize a lead screw, slider, or guide rail assembly, with a servo motor driving the lead screw or slider. The autofocus sensor 28 can be connected to the servo motor signal. This is prior art. The autofocus sensor 28 is an existing product. While the technical principles, dimensions, and appearance vary from manufacturer to manufacturer, the functionality is generally the same. For example, products from Canadian company WDI are available. Domestic distributors can be found at http: / / www.cinv.cn / cinv_ChiClass_3962933_1.html. Different models can be selected based on different application scenarios.

[0052] Further, such as Figure 4 As shown: the first polarizer 23 is arranged on the optical path from the filter wheel 15 to the detection target product 4.

[0053] Further, such as Figure 4 As shown: a first beam splitter 26 is further provided on the optical path from the filter wheel 15 to the target product 4 for inspection; the infinity microscope objective lens 21 is provided on the optical path from the light source 11 to the target product 4 for inspection through the first beam splitter 26; and the imaging tube lens 22 is provided on the optical path from the light source 11 to the target product 4 for inspection through the first beam splitter 26.

[0054] The light emitted by the light source 11 becomes parallel light after passing through the infinite microscope objective lens 21 and illuminates the target product 4 for inspection, and finally forms an image at the light entrance of the imaging tube lens 22 to achieve the Köhler illumination effect, and the loss of its reflected light is small; the two adjustable diaphragms 13 are respectively the aperture diaphragm and the field diaphragm, among which the aperture diaphragm has a certain brightness adjustment function, and its main function is to change the NA value of the lens by adjusting the aperture size; the field diaphragm can change the size of the field of view, that is, the size of the illumination area; the lighting unit 1 and the infinite imaging unit 2 share an infinite microscope objective lens, and the structure is compact.

[0055] Further, such as Figure 3 、 Figure 4 As shown: the camera unit 3 includes a linear motion mechanism 31, a black and white camera 32 and a color camera 33. The black and white camera 32 and the color camera 33 are arranged on the side of the linear motion mechanism 31 away from the imaging tube lens 22; the movement direction of the linear motion mechanism 31 is perpendicular to the optical path direction of the imaging tube lens 22, and the moving end of the linear motion mechanism 31 includes three stations along its own movement direction, among which the first station is vacant, the second station is equipped with a second beam splitter 34, and the third station is equipped with a first reflector 35; when the second station is facing the imaging tube lens 22, any one of the black and white camera 32 and the color camera 33 is facing the optical path of the imaging tube lens 22, and the other is facing the reflected optical path of the second beam splitter 34 and the first reflector 35.

[0056] The linear motion mechanism 31 is controlled to select one of the three workstations facing the imaging tube lens 22, facilitating separate control of the image of the target product 4 entering different cameras. This allows for separate or simultaneous black and white / color imaging, thereby improving inspection speed and accuracy. Taking the optical path of a black and white camera 32 facing the imaging tube lens 22 as an example: when the first workstation faces the imaging tube lens 22, light passes through the imaging tube lens 22 and directly reaches the black and white camera 32, facilitating the capture of a black and white image of the product. When the second workstation faces the imaging tube lens 22, part of the light is transmitted through the second beam splitter 34 to the black and white camera 32, while the remaining part is reflected by the second beam splitter 34 to the color camera 33, facilitating the simultaneous capture of both black and white and color images of the product.

[0057] Note: Figure 3 、 Figure 4 The optical path diagram does not limit the positional relationship between the black and white camera 32 and the color camera 33. The positional relationship should be understood in conjunction with the text. The linear motion mechanism 31 can be made of a telescopic rod, a screw rod pair, a guide rail pair, etc.

[0058] Furthermore, the black and white camera 32 and the color camera 33 are CMOS cameras.

[0059] Further, such as Figure 4 As shown: it also includes an off-axis light source 5, the light path of the off-axis light source 5 is directed toward the detection target product 4, and the angle between the light path of the off-axis light source 5 and the light path from the infinite microscope objective lens 21 to the detection target product 4 is an acute angle.

[0060] The off-axis light source 5 directly provides a dark field light source for the inspection target product 4 .

[0061] Further, such as Figure 1 、 Figure 4 As shown, two adjustable irises 13 are arranged along the optical path from the first lens 12 to the second lens 14 ; a second reflecting mirror 16 is provided on the optical path between the two adjustable irises 13 .

[0062] The two adjustable diaphragms 13 are the aperture diaphragm and the field diaphragm. The aperture diaphragm has a certain brightness adjustment function, its main function is to change the lens's NA value by adjusting the aperture size; the field diaphragm can change the field of view, that is, the size of the illuminated area. The two adjustable diaphragms 13 can be the same product, achieving different functions.

[0063] Furthermore, the filter wheel 15 includes red, green and blue filters.

[0064] This allows for switching between different wavelengths of light for defect detection on different wafers. It can also include a space for white light.

[0065] In the description of the present invention, it should be understood that if there appear descriptive terms indicating orientation, direction or positional relationship, such as: "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated in this specification is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of understanding the present invention and simplifying the description, and does not indicate or imply that the part, element or whole referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0066] In addition, if there are order description terms, such as "first", "second", etc., their purpose in this specification is to facilitate understanding or simplify the description. For example, in order to distinguish multiple technical features with the same type or function, but they have to be mentioned separately, this specification may use prefix or suffix order description terms to distinguish them. Therefore, it cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0067] In the present invention, if terms describing the relative functional relationship of structures are used, such as "install", "connect", "connect", "fix", etc., they should be understood in a broad sense unless otherwise clearly specified and limited. For example, "install", "connect", "connect", etc. can be fixed connections, detachable connections, or integrated; can be mechanical connections or electrical connections; can be direct connections or indirect connections through an intermediate medium, can be internal connections between two elements or an interactive relationship between two elements; "fix" can be an integrated fixation or a detachable fixation through fasteners; can be a direct fixation or a fixation through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above-mentioned descriptive terms in the present invention can be understood according to the specific circumstances, the context, the coherence of the preceding and following texts, etc.

[0068] In the present invention, if descriptive terms with subsidiary or connecting meanings appear, for example, a first feature is "on" or "below" a second feature, unless otherwise clearly specified and limited, they should not be understood in a restrictive manner. For example, "on" or "below" can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. For those skilled in the art, the specific meanings of the above descriptive terms in the present invention can be understood based on the specific circumstances, the context, the coherence of the preceding and following texts, etc.

[0069] Furthermore, when a first feature is “above,” “above,” or “above” a second feature, it may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is “below,” “below,” or “below” a second feature, it may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine the different embodiments, examples and features of different embodiments and examples described in this specification, unless there is any contradiction, and these combinations or combinations should all fall within the scope of the present invention.

[0071] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limiting the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of information available through public channels and in combination with the technical inspiration provided by the present application documents.

Claims

1. A microscopic device for wafer macro-defect detection, characterized by: The invention comprises an illumination unit (1), an infinite imaging unit (2) and a camera unit (3), wherein the illumination unit (1) is arranged corresponding to the detection target product (4) and irradiates light onto the detection target product (4), the infinite imaging unit (2) is arranged between the camera unit (3) and the detection target product (4), and the light reflected by the detection target product (4) passes through the infinite imaging unit (2) and is imaged on the camera unit (3); The lighting unit (1) comprises a light source (11), and a first lens (12), an adjustable aperture (13), a second lens (14) and a filter wheel (15) are sequentially provided in the direction of the light path from the light source (11) to the detection target product (4); The infinity imaging unit (2) comprises an imaging tube lens (22) and an infinity microscope objective lens (21), and the infinity microscope objective lens (21) and the imaging tube lens (22) are sequentially arranged on the optical path from the inspection target product (4) to the camera unit (3); A first polarizer (23) is provided on the optical path from the filter wheel (15) to the detection target product (4) or the optical path from the detection target product (4) to the infinite microscope objective lens (21), a second polarizer (24) is provided on the optical path from the infinite microscope objective lens (21) to the imaging tube lens (22), the first polarizer (23) and the second polarizer (24) are orthogonal to each other, and a differential interference prism (25) is provided on the optical path between the first polarizer (23) and the second polarizer (24); The camera unit (3) comprises a linear motion mechanism (31), a black and white camera (32) and a color camera (33), wherein the black and white camera (32) and the color camera (33) are arranged on a side of the linear motion mechanism (31) away from the imaging tube lens (22); the motion direction of the linear motion mechanism (31) is perpendicular to the optical path direction of the imaging tube lens (22); the movable end of the linear motion mechanism (31) comprises three stations along its own motion direction, wherein the first station is vacant, the second station is equipped with a second beam splitter (34), and the third station is equipped with a first reflector (35); when the second station faces the imaging tube lens (22), any one of the black and white camera (32) and the color camera (33) faces the optical path of the imaging tube lens (22), and the other faces the reflected optical path of the second beam splitter (34) and the first reflector (35).

2. The microscopic device for wafer macro defect detection according to claim 1, characterized in that: The invention also includes an autofocus sensor (28) and a dichroic mirror (27), wherein the dichroic mirror (27) is located between the differential interference prism (25) and the imaging tube lens (22), and the autofocus sensor (28) is directly opposite to the reflected light path of the dichroic mirror (27); the autofocus sensor (28) is connected to the vertical motion mechanism signal and can control the vertical motion mechanism to move along the light path direction of the infinite microscope objective lens (21), and the infinite microscope objective lens (21) is installed on the vertical motion mechanism.

3. The microscopic device for wafer macro defect detection according to claim 1, characterized in that: The first polarizer (23) is arranged on a light path from the filter wheel (15) to the detection target product (4).

4. A microscopic device for wafer macro defect detection according to claim 1 or 3, characterized in that: A first beam splitter (26) is further provided on the optical path from the filter wheel (15) to the detection target product (4); the infinite microscope objective lens (21) is provided on the optical path from the light source (11) to the detection target product (4) via the first beam splitter (26); and the imaging tube lens (22) is provided on the optical path from the detection target product (4) to the camera unit (3) via the first beam splitter (26).

5. The microscopic device for wafer macro defect detection according to claim 1, characterized in that: The black and white camera (32) and the color camera (33) are CMOS cameras.

6. The microscopic device for wafer macro defect detection according to claim 1, characterized in that: It also includes an off-axis light source (5), the light path of the off-axis light source (5) is directed toward the detection target product (4), and the angle between the light path of the off-axis light source (5) and the light path from the infinite microscope objective lens (21) to the detection target product (4) is an acute angle.

7. The microscopic device for wafer macro defect detection according to claim 1, characterized in that: Two adjustable diaphragms (13) are arranged along the optical path from the first lens (12) to the second lens (14); a second reflecting mirror (16) is provided on the optical path between the two adjustable diaphragms (13).

8. The microscopic device for wafer macro defect detection according to claim 1, characterized in that: The filter wheel (15) includes red, green and blue filters.

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