An intramedullary nail hole positioning device and method based on eddy current thermography

Abstract

The application discloses a kind of intramedullary nail hole positioning device and method based on eddy current thermal imaging, and positioning device includes heat sensor and inductive coil;Wherein, the inductive coil is used to carry out in-vitro excitation to the intramedullary nail being placed into medullary cavity, and vortex effect is generated in intramedullary nail hole;The heat sensor can be axially moved along the intramedullary nail being placed into the medullary cavity, and the temperature of the outer surface of intramedullary nail hole is scanned, so that the three-dimensional heat distribution of intramedullary nail hole is obtained, and the positioning of intramedullary nail hole can be realized according to three-dimensional heat distribution.The application uses pulse eddy current thermal imaging detection technology to realize the technology of intramedullary nail positioning, which can effectively solve the problem of difficult positioning due to intramedullary nail deviation and achieve the purpose of accurate locking.

Description

Technical Field

[0001] This invention belongs to the field of intramedullary nail positioning technology, specifically relating to an intramedullary nail hole positioning device and method based on eddy current thermal imaging. Background Technology

[0002] Intramedullary nails are orthopedic internal fixation devices, and intramedullary nailing is the preferred surgical method for fixing long bone fractures of the limbs. Intramedullary nails can also be used for other surgeries such as bone transport. Traditional intramedullary nails have a nail shaft with a proximal locking screw hole and a distal locking screw hole. During use, to prevent rotation of the two fractured parts, several screws are used to lock the nail transversely through the bone shaft and the intramedullary nail. Before inserting the nail into the medullary cavity, the surgeon attaches a drill guide to the nail. Theoretically, the guide hole of the guide should align with the locking screw hole of the nail, allowing the drill bit to pass through the guide hole and drill directly into the locking screw hole. However, because the shape of the long bone often causes the intramedullary nail to shift after insertion into the medullary cavity, the drill bit cannot always be aligned with the screw hole, leading to difficulties in locking the nail. This results in longer surgery times, more bleeding, longer anesthesia times, and is detrimental to patient recovery.

[0003] Currently, intramedullary nailing surgery is usually performed under X-ray fluoroscopy or by using a mechanical aiming device. However, using X-ray fluoroscopy for intramedullary nailing surgery exposes the human body to X-rays for a long time, which may cause damage. Using a mechanical aiming device for intramedullary nailing requires professional aiming and positioning, and is subject to human influence, so the accuracy of positioning cannot be guaranteed.

[0004] In summary, existing intramedullary nail hole localization techniques have shortcomings such as long processing time, high radiation levels, and poor positioning accuracy, which pose significant risks to the health of medical staff and are detrimental to patient recovery. A faster and more accurate intramedullary nail localization method is still needed. Summary of the Invention

[0005] To address the issues of poor safety or accuracy in existing intramedullary nail hole localization methods, this invention provides an intramedullary nail hole localization device based on eddy current thermal imaging. This invention utilizes pulsed eddy current thermal imaging detection technology to achieve precise nail locking.

[0006] This invention is achieved through the following technical solution:

[0007] An intramedullary nail hole localization device based on eddy current thermal imaging includes a thermal sensor and an induction coil;

[0008] The induction coil is used to externally excite the intramedullary nail placed in the medullary cavity and generate an eddy current effect in the intramedullary nail hole;

[0009] The thermal sensor can move along the axial direction of the intramedullary nail inserted into the medullary cavity, scan and obtain the temperature of the outer surface of the intramedullary nail hole, thereby obtaining the three-dimensional heat distribution of the intramedullary nail hole, and the location of the intramedullary nail hole can be realized based on the three-dimensional heat distribution.

[0010] Currently, intramedullary nailing surgery using X-ray fluoroscopy exposes the patient to high-intensity, prolonged X-ray exposure, which can cause damage. Installing the intramedullary nail using a robotic arm aiming device requires professional operation and is susceptible to human error, resulting in low positioning accuracy. The positioning device proposed in this invention utilizes eddy current thermal imaging technology to obtain the heat distribution of the intramedullary nail hole. The nail hole can be accurately located directly based on this heat distribution, eliminating the need for X-rays and professional operation, significantly improving safety and reliability, increasing implantation efficiency, and reducing surgical risks.

[0011] Preferably, the positioning device of the present invention is used in conjunction with an intramedullary nail implantation tool;

[0012] The intramedullary nail implantation tool includes a handle, one end of which is the intramedullary nail connection end, and the other end of which is a fixed guide arm;

[0013] The free end of the fixed guide arm is connected to the adjustable guide arm, and the adjustable guide arm can move axially along the intramedullary nail placed in the medullary cavity. The free end of the adjustable guide arm is provided with a guide hole for installing a drilling tool arm. The front end of the drilling tool arm faces the intramedullary nail and is used for hole positioning and drilling.

[0014] The thermal sensor is mounted on the front end of the drilling tool arm.

[0015] The positioning device in this embodiment can be used directly with the intramedullary nail implantation tool without the need for additional auxiliary facilities, making it easy to implement.

[0016] Preferably, the thermal sensor of the present invention is an infrared thermal imager.

[0017] Preferably, the positioning device of the present invention further includes an electromagnetic induction heating device;

[0018] The electromagnetic induction heating device is used to input alternating high-frequency current into the induction coil for excitation induction.

[0019] Preferably, the positioning device of the present invention further includes an information processing device, which is used to acquire and process the temperature information obtained by the thermal sensor to obtain the three-dimensional heat distribution of the intramedullary nail hole.

[0020] Preferably, the information processing device of the present invention is a PC.

[0021] Secondly, the present invention proposes a method for locating intramedullary nail holes based on eddy current thermal imaging, as described above, comprising:

[0022] The induction coil is used to externally excite the intramedullary nail placed in the medullary cavity, causing eddy currents to be generated in the intramedullary nail hole.

[0023] The thermal sensor acquires the outer surface temperature of the intramedullary nail hole in real time and sends it to the information processing device for processing to obtain the three-dimensional heat distribution of the intramedullary nail hole.

[0024] The intramedullary nail hole is located directly based on the three-dimensional heat distribution of the intramedullary nail hole.

[0025] Preferably, the real-time acquisition of the outer surface temperature of the intramedullary nail hole by the thermal sensor in this invention specifically includes:

[0026] First, the thermal sensor is moved along the axial direction of the intramedullary nail to determine the position of the intramedullary nail hole, and then the thermal sensor is moved to that position.

[0027] Then, the thermal sensor is moved along the radial surface of the intramedullary nail to scan the outer surface temperature of the intramedullary nail hole.

[0028] Thirdly, the present invention proposes an intramedullary nail implantation device, which uses the positioning device described above to locate the intramedullary nail hole.

[0029] Fourthly, the present invention proposes an intramedullary nail implantation method, which uses the method described above to locate the intramedullary nail hole.

[0030] The present invention has the following advantages and beneficial effects:

[0031] This invention employs pulsed eddy current thermal imaging detection technology to locate intramedullary nail holes, which can effectively solve the problem of difficulty in locating intramedullary nails due to displacement and achieve the goal of precise nail locking.

[0032] Compared to existing technologies, this invention avoids high-intensity, long-term exposure of the human body to X-rays, thus improving safety; moreover, the aiming and positioning of this invention does not require professional personnel, and improves implantation efficiency and reduces surgical risks through image positioning; and it reduces interference from subjective human factors, thereby improving the accuracy and reliability of positioning. Attached Figure Description

[0033] The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0034] Figure 1 This is a schematic diagram of the positioning device structure according to an embodiment of the present invention.

[0035] Figure 2 This is a schematic diagram of pulsed eddy current thermal imaging according to an embodiment of the present invention.

[0036] Figure 3 This is a positioning diagram according to an embodiment of the present invention.

[0037] Figure 4 This is a schematic diagram of the control process according to an embodiment of the present invention.

[0038] Figure 5 This is a three-dimensional heat distribution diagram according to an embodiment of the present invention.

[0039] The attached diagram shows the markings and corresponding component names:

[0040] 1-Locking screw, 2-Angle encoder, 3-Fixed guide arm, 4-Locking screw, 5-Angle encoder, 6-Adjustable guide arm, 7-Locking screw, 8-Drilling tool arm, 9-Infrared thermal imager, 10-Induction coil, 11-Intramedullary nail, 12-Intramedullary nail hole, 13-Medullary cavity. Detailed Implementation

[0041] In the following, the terms “comprising” or “may include” as used in various embodiments of the invention indicate the presence of an inventive function, operation, or element, and do not limit the addition of one or more functions, operations, or elements. Furthermore, as used in various embodiments of the invention, the terms “comprising,” “having,” and their cognates are intended only to indicate a specific feature, number, step, operation, element, component, or combination of the foregoing, and should not be construed as primarily excluding the presence of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing, or adding one or more combinations of the foregoing.

[0042] In various embodiments of the invention, the expression "or" or "at least one of A and / or B" includes any combination or all combinations of the words listed simultaneously. For example, the expression "A or B" or "at least one of A and / or B" may include A, may include B, or may include both A and B.

[0043] The expressions used in the various embodiments of the present invention (such as "first," "second," etc.) may modify various constituent elements in the various embodiments, but do not limit the corresponding constituent elements. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used for the purpose of distinguishing one element from other elements. For example, a first user device and a second user device refer to different user devices, although both are user devices. For example, a first element may be referred to as a second element without departing from the scope of the various embodiments of the present invention, and similarly, a second element may also be referred to as a first element.

[0044] It should be noted that if a description is made of "connecting" one component to another, then the first component can be directly connected to the second component, and a third component can be "connected" between the first and second components. Conversely, when a component is "directly connected" to another component, it can be understood that there is no third component between the first and second components.

[0045] The terminology used in the various embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to limit the various embodiments of the invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of the invention pertain. The terms (such as those defined in a generally used dictionary) are to be interpreted as having the same meaning as in the context of the relevant technical field and are not to be interpreted as having an idealized or overly formal meaning, unless clearly defined in the various embodiments of the invention.

[0046] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0047] Example

[0048] This embodiment provides an intramedullary nail hole localization device based on eddy current thermal imaging.

[0049] Intramedullary nails are inserted into the upper part of long tubular bones using an intramedullary nailing tool. Due to the shape of long tubular bones, the medullary cavity is not cylindrical. Therefore, after the intramedullary nail is inserted into the medullary cavity, its insertion end will change with the shape of the medullary cavity. This can cause the direction and position of the intramedullary nail hole to be inconsistent with the direction and position of the drilling tool arm (the amount of displacement varies due to individual differences). This can lead to the drilling tool arm failing to accurately position the intramedullary nail hole, requiring the drilling tool arm to re-drill holes in the bone until the two holes are aligned and the bolt can pass through. This prolongs the operation time, increases the patient's wound area, and increases the probability of complications. The positioning device in this embodiment utilizes pulsed eddy current thermal imaging detection technology to achieve precise positioning of the intramedullary nail. Pulsed eddy current thermal imaging detection is based on the principle of multi-physics field coupling effect. It has the advantages of infrared thermal imaging technology and pulsed eddy current detection technology, which can effectively solve the problem of difficult positioning due to intramedullary nail displacement, reduce surgical risks, and improve safety.

[0050] like Figure 1 As shown, the positioning device in this embodiment includes an induction coil 10 and a thermal sensor 9. The induction coil 10 is used to externally excite the intramedullary nail 11 inserted into the medullary cavity 13, generating an eddy current effect around the intramedullary nail hole 12. This eddy current effect causes the temperature field distribution around the intramedullary nail hole to be significantly higher than in other areas. The thermal sensor 9 acquires the temperature of the outer surface of the intramedullary nail hole 12 in real time, thereby obtaining the heat distribution around the intramedullary nail hole 12, which allows for accurate positioning of the intramedullary nail hole 12.

[0051] In this embodiment, the positioning device is used in conjunction with an intramedullary nail implantation tool. The intramedullary nail implantation tool includes a handle, one end of which is the intramedullary nail connection end, and the other end of which is a fixed guide arm 3. The free end of the fixed guide arm 3 is connected to an adjustable guide arm 6, and the adjustable guide arm 6 can move along the axis of the intramedullary nail (i.e., the X direction). The free end of the adjustable guide arm 6 is provided with a guide hole for installing a drilling tool arm 8. The front end of the drilling tool arm 8 faces the intramedullary nail 11 and is used for positioning and drilling the intramedullary nail hole. In this embodiment, a thermal sensor is installed at the front end of the drilling tool arm 8.

[0052] like Figure 2 As shown, the induction coil 10 in this embodiment is used in conjunction with an electromagnetic induction heating device. The information processing device issues a control command to control the electromagnetic induction heating device to input an alternating high-frequency current into the induction coil for excitation induction. The thermal sensor 9 in this embodiment is, but is not limited to, an infrared thermal imager. It obtains the surface temperature information of the object based on the infrared radiation of the object and transmits it to the information processing device for processing, thereby obtaining a three-dimensional thermal distribution map of the intramedullary nail. The information processing device in this embodiment is an electronic device with built-in image algorithms, such as a PC.

[0053] like Figure 3-5As shown, the specific working process of the positioning device in this embodiment is as follows:

[0054] The intramedullary nail 11 was placed into the medullary cavity 13 using an intramedullary nail implantation tool.

[0055] External excitation of the intramedullary nail 11 inserted into the medullary cavity 13 induces eddy currents around the nail hole 12. This eddy current effect generates heat around the nail hole 12, which is then transferred from the surface inwards. If the eddy currents reach the edge of the nail hole 12, their direction changes, resulting in a higher eddy current density at the edge. Higher density eddy currents generate more heat. Therefore, after eddy currents are generated by excitation, more heat is produced at the edge of the nail hole 12. An infrared thermal imager then acquires the temperature around the nail hole 12 in real time and sends it to a PC for processing, resulting in a heat distribution map around the nail hole 12. Figure 5 As shown.

[0056] At this point, by moving the adjustable guide arm 6, the infrared thermal imager on the drilling tool arm 8 is moved along the X-direction outside the medullary cavity 2 to scan the vicinity of the intramedullary nail hole 12. This allows direct observation of the real-time heat distribution map on the PC for accurate positioning of the intramedullary nail hole 12. In the X-direction, the heat distribution map shows a relatively obvious heating area, allowing the approximate location of the intramedullary nail hole to be determined in the X-direction. Moving the infrared thermal imager to this position and rotating the fixed guide arm 3, the specific location of the intramedullary nail hole is measured on the YOZ plane. Based on the heat distribution display on the PC, accurate positioning can then be achieved.

[0057] This embodiment avoids inaccurate drilling due to deformation, preventing the installation of fixing screws. It also avoids high-intensity, prolonged exposure of the human body to X-rays and eliminates the need for professional personnel, enabling rapid and accurate positioning and greatly improving surgical efficiency and safety.

[0058] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An intramedullary nail hole positioning device based on eddy current thermal imaging, characterized in that, Includes a thermal sensor (9) and an induction coil (10); The induction coil (10) is used to externally excite the intramedullary nail (11) placed in the medullary cavity (13) and generate an eddy current effect in the intramedullary nail hole (12); The thermal sensor (9) can move along the axial direction of the intramedullary nail (11) placed in the medullary cavity (13) to scan and obtain the temperature of the outer surface of the intramedullary nail hole (12), thereby obtaining the three-dimensional heat distribution of the intramedullary nail hole (12). The positioning of the intramedullary nail hole (12) can be achieved based on the three-dimensional heat distribution. This positioning device is used in conjunction with the intramedullary nail implantation tool. The intramedullary nail implantation tool includes a handle, one end of which is the intramedullary nail connection end, and the other end of which is a fixed guide arm (3). The free end of the fixed guide arm (3) is connected to the adjustable guide arm (6), and the adjustable guide arm (6) can move axially along the intramedullary nail (11) placed in the medullary cavity (13). The free end of the adjustable guide arm (6) is provided with a guide hole for installing a drilling tool arm (8). The front end of the drilling tool arm (8) faces the intramedullary nail (11) and is used for hole positioning and drilling. The thermal sensor is installed at the front end of the punching tool arm (8).

2. The intramedullary nail hole positioning device based on eddy current thermal imaging according to claim 1, characterized in that, The thermal sensor (9) is an infrared thermal imager.

3. The intramedullary nail hole positioning device based on eddy current thermal imaging according to claim 1, characterized in that, It also includes electromagnetic induction heating devices; The electromagnetic induction heating device is used to input alternating high-frequency current into the induction coil for excitation induction.

4. The intramedullary nail hole positioning device based on eddy current thermal imaging according to claim 3, characterized in that, It also includes an information processing device, which is used to acquire and process the temperature information obtained by the thermal sensor to obtain the three-dimensional heat distribution of the intramedullary nail hole (12).

5. The intramedullary nail hole positioning device based on eddy current thermal imaging according to claim 4, characterized in that, The information processing equipment is a PC.

6. A method for eddy current thermal imaging-based intramedullary nail hole localization as described in any one of claims 1-5, characterized in that, include: The intramedullary nail (11) placed in the medullary cavity (13) is externally excited by the induction coil (10), so that eddy currents are generated in the intramedullary nail hole (12); The thermal sensor (9) acquires the outer surface temperature of the intramedullary nail hole (12) in real time and sends it to the information processing device for processing to obtain the three-dimensional heat distribution of the intramedullary nail hole (12); The intramedullary nail hole (12) is located directly based on the three-dimensional heat distribution of the intramedullary nail hole (12).

7. The method according to claim 6, characterized in that, The real-time acquisition of the outer surface temperature of the intramedullary nail hole (12) by the thermal sensor (9) specifically includes: First, the thermal sensor is moved along the axial direction of the intramedullary nail (11) to determine the position of the intramedullary nail hole (12), and the thermal sensor is moved to that position. Then, the thermal sensor is moved along the radial surface of the intramedullary nail (11) to scan the outer surface temperature of the intramedullary nail hole (12).

8. An intramedullary nail implantation device, characterized in that, The intramedullary nail hole (12) is located using the positioning device according to any one of claims 1-5.

9. A method for locating an intramedullary nail foramen, characterized in that, The intramedullary nail hole (12) is located using the method described in claim 6 or 7.

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