Method and device for determining machining precision, storage medium and laser equipment

Abstract

The embodiment of the present application provides a kind of machining precision determination method, device, storage medium and the technical scheme of laser equipment, and the method comprises: laser equipment is according to the first drawing information obtained in processing plate and is radiated with multiple first shape pattern and multiple target;Laser equipment generates the target information of multiple targets according to the first image of the processing plate obtained;Laser equipment generates deviation factor information according to the target information of multiple targets and the first drawing information;Laser equipment is radiated with multiple second shape pattern according to deviation factor information and the second drawing information obtained in processing plate by the target information of multiple targets;Measuring equipment is based on the second image of processing plate, obtains the first actual information of multiple first shape pattern and the second actual information of multiple second shape pattern, and according to the theoretical deviation value obtained, multiple first actual information and multiple second actual information generate processing precision value, to provide a kind of scheme of verifying the processing precision of laser equipment.

Description

[0001] The embodiment of the present application relates to the technical field of laser processing equipment, in particular to a processing precision determination method and device, a storage medium, laser equipment and measuring equipment.

[0002] The laser processing equipment has been widely applied to industrial production, and the precision of the laser processing equipment is directly related to the success of the processed workpiece. Each laser processing equipment needs to verify the equipment precision before processing the workpiece (the workpiece can be a printed circuit board (PCB)) to confirm the precision state of the laser processing equipment before processing, and to better guarantee the quality of the processed workpiece. However, there is no scheme for verifying the processing precision of the laser processing equipment.

[0003] Therefore, the embodiment of the present application provides a processing precision determination method and device, a storage medium, laser equipment and measuring equipment to solve the problem that there is no scheme for verifying the processing precision of the laser processing equipment in the prior art.

[0004] In a first aspect, the embodiment of the present application provides a processing precision determination method, which comprises the following steps:

[0005] The laser equipment radiates a plurality of first shape patterns and a plurality of targets on the processing plate according to the obtained first drawing information;

[0006] The laser equipment generates target grabbing information of the plurality of targets according to the obtained first image of the processing plate, and the first image comprises the plurality of first shape patterns and the plurality of targets;

[0007] The laser equipment generates deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information;

[0008] The laser equipment radiates a plurality of second shape patterns on the processing plate according to the deviation factor information and the obtained second drawing information through the target grabbing information of the plurality of targets;

[0009] The measuring equipment obtains first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the processing plate, and generates a processing precision value according to the obtained theoretical deviation value, the plurality of first actual information and the plurality of second actual information, and the second image comprises the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns.

[0010] ​​​In a possible implementation, the deviation factor information comprises a rotation angle and / or a scaling ratio, and the first drawing information comprises a plurality of target theoretical information; the laser equipment generates the deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information, comprising:

[0011] The laser equipment generates the rotation angle and / or the scaling ratio according to the target grabbing information of the plurality of targets and the plurality of target theoretical information.

[0012] In a possible implementation, the second drawing information comprises a plurality of first theoretical information of a plurality of second shape patterns; the laser equipment generates, according to the deviation factor information and the acquired second drawing information, a plurality of second shape patterns on the processing board through the target grabbing information of the plurality of targets, comprising:

[0013] The laser equipment generates, according to the deviation factor information and the plurality of first theoretical information, first laser information corresponding to each of the second shape patterns;

[0014] The laser equipment generates, according to the plurality of first laser information, a plurality of second shape patterns on the processing board through the plurality of target grabbing information.

[0015] In a possible implementation, the deviation factor information comprises a rotation angle and / or a scaling ratio, the first theoretical information comprises a first theoretical coordinate and a first theoretical side length value, and the first laser information comprises a third theoretical coordinate and a third theoretical side length value; the laser equipment generates, according to the deviation factor information and the plurality of first theoretical information, first laser information corresponding to each of the second shape patterns, comprising:

[0016] The laser equipment calculates the third theoretical coordinate according to the first theoretical coordinate, the rotation angle and the scaling ratio;

[0017] The laser equipment calculates the third theoretical side length value according to the first theoretical side length value and the scaling ratio.

[0018] In a possible implementation, the first drawing information comprises a plurality of second theoretical coordinates of a plurality of first shape patterns; the second drawing information comprises a plurality of first theoretical coordinates of a plurality of second shape patterns corresponding to the plurality of first shape patterns; the first theoretical coordinate is the same as the second theoretical coordinate corresponding to the first theoretical coordinate.

[0019] In a second aspect, an embodiment of the present application provides a processing precision determination method, the method being applied to a laser equipment, and the method comprising:

[0020] According to the acquired first drawing information, a plurality of first shape patterns and a plurality of targets are laser processed on a processing board.

[0021] According to the first image of the processing board, target information of the plurality of targets is generated, and the first image includes the plurality of first shape patterns and the plurality of targets;

[0022] According to the target information of the plurality of targets and the first drawing information, deviation factor information is generated;

[0023] According to the deviation factor information and the second drawing information obtained by the target information of the plurality of targets, a plurality of second shape patterns are lasered on the processing board, so that a measuring device obtains first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the processing board, and generates a processing precision value according to the obtained theoretical deviation value, the plurality of first actual information and the plurality of second actual information, and the second image includes the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns.

[0024] In a possible implementation, the processing board includes a printed circuit board.

[0025] In a third aspect, an embodiment of the present application provides a processing precision determination device, which comprises:

[0026] A first laser module is configured to laser a plurality of first shape patterns and a plurality of targets on a processing board according to first drawing information obtained;

[0027] A first generation module is configured to generate target information of the plurality of targets according to a first image of the processing board, and the first image includes the plurality of first shape patterns and the plurality of targets;

[0028] A second generation module is configured to generate deviation factor information according to the target information of the plurality of targets and the first drawing information;

[0029] A second laser module is configured to laser a plurality of second shape patterns on the processing board according to the deviation factor information and second drawing information obtained by the target information of the plurality of targets, so that a measuring device obtains first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the processing board, and generates a processing precision value according to the obtained theoretical deviation value, the plurality of first actual information and the plurality of second actual information, and the second image includes the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns.

[0030] In a fourth aspect, an embodiment of the present application provides a processing precision determination device, which comprises:

[0031] The first acquisition module is configured to acquire a second image of a processing plate, the processing plate comprising a plurality of first shape patterns and a plurality of targets which are laser-engraved on the processing plate by a laser-engraving device according to acquired first drawing information, and a plurality of second shape patterns which are laser-engraved on the processing plate by the laser-engraving device according to acquired second drawing information and deviation factor information generated according to the acquired grabbing information of the plurality of targets and the first drawing information.

[0032] The third generation module is configured to acquire first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on the second image, and generate a processing precision value according to the acquired theoretical deviation value, the first actual information and the second actual information.

[0033] In a fifth aspect, an embodiment of the present application provides a storage medium, the storage medium comprising a stored program, wherein the program controls a device where the storage medium is located to perform the processing precision determination method in the first aspect or any possible implementation manner of the first aspect or the second aspect when the program is running.

[0034] In a sixth aspect, an embodiment of the present application provides a laser-engraving device, comprising a memory and a processor, the memory being configured to store information comprising program instructions, and the processor being configured to control execution of the program instructions, the program instructions being loaded and executed by the processor to implement the steps of the processing precision determination method in the first aspect or any possible implementation manner of the first aspect or the second aspect.

[0035] In a seventh aspect, an embodiment of the present application provides a measuring device, comprising a memory and a processor, the memory being configured to store information comprising program instructions, and the processor being configured to control execution of the program instructions, the program instructions being loaded and executed by the processor to implement the steps of the processing precision determination method in the first aspect or any possible implementation manner of the first aspect or the second aspect.

[0036] The technical scheme of the method and device for determining machining precision, the storage medium and the laser equipment provided by the embodiment of the application comprises the following steps: the laser equipment radiates a plurality of first shape patterns and a plurality of targets on a machining plate according to acquired first drawing information; the laser equipment generates target grabbing information of the plurality of targets according to a first image of the machining plate, and the first image comprises the plurality of first shape patterns and the plurality of targets; the laser equipment generates deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information; the laser equipment radiates a plurality of second shape patterns on the machining plate according to the deviation factor information and acquired second drawing information through the target grabbing information of the plurality of targets; a measuring device acquires first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the machining plate, and generates a machining precision value according to an acquired theoretical deviation value, the first actual information and the second actual information, and the second image comprises the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns, so that a scheme capable of simulating the machining of the laser equipment and verifying the machining precision of the laser equipment is provided, the scheme is simple to operate, the machining materials required by the scheme are easy to acquire, the scheme can be used in large-scale batch mode, and the quality of a machined workpiece is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical scheme of the embodiments of the application, the drawings required in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0038] Figure 1 The flowchart of the method for determining machining precision provided by the embodiment of the application is shown in FIG. 1.

[0039] Figure 2 The schematic diagram of the first drawing image provided by the embodiment of the application is shown in FIG. 2.

[0040] Figure 3 The schematic diagram of the second drawing image provided by the embodiment of the application is shown in FIG. 3.

[0041] Figure 4 The schematic diagram of the second image provided by the embodiment of the application is shown in FIG. 4.

[0042] Figure 5 The deviation center schematic diagram of the second image provided by the embodiment of the application is shown in FIG. 5.

[0043] Figure 6 The partial schematic diagram of the second image provided by the embodiment of the application is shown in FIG. 6.

[0044] Figure 7A flowchart illustrating the laser engraving of multiple second-shape patterns is provided as an embodiment of the present invention;

[0045] Figure 8 A flowchart for generating first laser information corresponding to each second shape graphic is provided in an embodiment of the present invention;

[0046] Figure 9 A flowchart illustrating another method for determining machining accuracy provided in an embodiment of the present invention;

[0047] Figure 10 A schematic diagram of a device for determining machining accuracy provided in an embodiment of the present invention;

[0048] Figure 11 A schematic diagram of another processing accuracy determination device provided in an embodiment of the present invention;

[0049] Figure 12 A schematic diagram of a laser device provided in an embodiment of the present invention;

[0050] Figure 13 This is a schematic diagram of a measuring device provided in an embodiment of the present invention.

Detailed Implementation Methods

[0051] To better understand the technical solution of the present invention, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0052] It should be understood that the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0053] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0054] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0055] It should be understood that, although the terms first, second, third, etc. can be employed in describing various elements, components, regions, layers and / or sections in the present application, these elements should not be limited to these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present application.

[0056] The word "if" can be interpreted to mean "when" or "upon" or "in response to determining," or "in response to detecting," depending on the context, as used herein. Similarly, the phrase "if it is determined" or "if (a stated condition or event) is detected" can be interpreted to mean "upon determining" or "in response to determining" or "upon detecting (the stated condition or event)" or "in response to detecting (the stated condition or event)," depending on the context.

[0057] Figure 1 A flowchart of a method for determining a machining precision according to an embodiment of the present application is shown in FIG. 1, which includes the following steps. Figure 1

[0058] In step 101, a laser equipment marks a plurality of first shape patterns and a plurality of targets on a machining board according to acquired first drawing information.

[0059] In the embodiment, the laser equipment includes a laser marking equipment, which can be an IC (Integrated Circuit) carrier plate laser marking equipment. The machining board includes a printed circuit board. The first drawing information is usually information of patterns to be marked by the laser equipment set by a worker, and includes a first shape pattern number, a target number, second theoretical information of the plurality of first shape patterns, and target theoretical information of the plurality of targets. The second theoretical information includes a second theoretical coordinate and a second theoretical side length value, and the target theoretical information includes a target theoretical coordinate and a target theoretical side length value. For example, the first shape pattern is a circle, the second theoretical coordinate is a center coordinate, and the second theoretical side length value is a radius. However, the first shape pattern or the target can also be a circle, a square, a sector, an irregular pattern, etc., and the shape of the first shape pattern or the target is not limited in the embodiment.

[0060] The information of the first drawing image is the first drawing information, Figure 2 A schematic diagram of a first drawing image according to an embodiment of the present application is shown in FIG. 2. Figure 2 ​As shown, the IC substrate laser marking equipment performs targetless positioning laser marking on the processing board according to the first drawing image. Multiple first-shape graphics and four targets are laser-marked, where the first-shape graphics are square and the targets are circular. The first drawing image includes 23*26 squares and four targets. The target in the upper left corner is defined as target 1, the target in the upper right corner as target 2, the target in the lower left corner as target 3, and the target in the lower right corner as target 4. To make the laser marks visible, the processing board is usually black. The second theoretical coordinates are the coordinates of the center of the square, and the second theoretical side length is the value of the side length of the square; the target theoretical coordinates are the coordinates of the center of the circle, and the target theoretical side length is the value of the radius of the circle. The laser equipment laser-marks multiple first-shape graphics and multiple targets on the processing board according to the first drawing image.

[0061] Before step 101, the process also includes: adjusting the laser equipment's laser precision to a preset range. The preset range is the processing precision range required by the laser equipment when processing the processing board. Before step 101, the operator adjusts the laser equipment's precision to ensure it is within the required processing range.

[0062] Step 102: The laser equipment generates target information for multiple targets based on the first image of the processing plate. The first image includes multiple first shape graphics and multiple targets.

[0063] In this embodiment of the invention, the laser equipment further includes a target-grabbing camera. The target-grabbing camera acquires an image of the processing board after the first laser treatment, and the laser equipment defines this image as the first image. The target-grabbing information includes the actual coordinates and actual side length of the target. The amount of target-grabbing information should be greater than or equal to a target threshold; for example, if the target threshold is 2, the amount of target-grabbing information should be greater than or equal to 2.

[0064] Will Figure 2 The first drawing image shown is used as the first image of the processing board, such as Figure 2 As shown, the laser device captures multiple targets shown in the first image, defining the identifiable targets as capture targets. The laser device captures at least two targets based on the first image and determines the actual coordinates and radius values ​​of these targets. For example, the laser device captures targets 1, 2, 3, and 4 in the first image, and captures targets 1, 2, and 3. Targets 1, 2, and 3 can be defined as capture targets 1, 2, and 3, respectively. The laser device acquires capture information for target 1, target 2, and target 3. The number of capture information is 3, which is greater than the target threshold of 2.

[0065] Step 103: The laser equipment generates deviation factor information based on the target capture information of multiple targets and the information in the first drawing.

[0066] In the embodiment of the present application, the deviation factor information includes a rotation angle and / or a scaling ratio. The rotation angle is an angle deviation of a laser pattern calculated by the laser equipment according to a theoretical laser condition and an actual laser condition. For example, if there is no deviation in the placement position of the processing plate in the laser equipment during processing of the processing plate, the rotation angle is 0; if there is a deviation in the placement position of the processing plate, the angle of the laser equipment on the processing plate will be deviated, and then the rotation angle is not 0. The scaling ratio is a scaling deviation of the laser pattern calculated by the laser equipment according to the theoretical laser condition and the actual laser condition. For example, during the laser process, if the processing plate is affected by the laser operation of the laser equipment, the material scaling condition appears, which causes the scaling deviation of the laser position, and then the scaling ratio is not 0.

[0067] In step 104, the laser equipment irradiates a plurality of second shape patterns on the processing plate according to the deviation factor information and the obtained second drawing information through the target grabbing information of the plurality of targets.

[0068] In the embodiment of the present application, the second drawing information includes the number of second shape patterns, the number of targets, the first theoretical information of the plurality of second shape patterns, and the target theoretical information of the plurality of targets. The number of targets and the target theoretical information of the plurality of targets in the second drawing information are the same as the number of targets and the target theoretical information of the plurality of targets in the first drawing information. The first theoretical information includes the first theoretical coordinates and the first theoretical side length value. The first theoretical coordinates of the second shape pattern are the same as the second theoretical coordinates of the first shape pattern corresponding to the second shape pattern.

[0069] The information of the second drawing image is the second drawing information, Figure 3 A schematic diagram of a second drawing image provided by the embodiment of the present application is shown as Figure 3 as shown, Figure 3 23*26 second shape patterns and 4 targets are shown, Figure 3 The target theoretical information of the 4 targets shown is the same as the target theoretical information of the 4 targets shown in Figure 2 The second shape pattern is a circle, the first theoretical coordinates are the center coordinates, and the first theoretical side length value is the radius. The laser equipment irradiates a plurality of second shape patterns on the processing plate according to the second drawing image through target grabbing positioning of the irradiated targets. However, the second shape pattern can also be a circle, a square, a sector, an irregular shape, etc., and the shape of the second shape pattern is not limited in the embodiment of the present application.

[0070] In step 201, the measuring device obtains first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on the second image of the processed plate, and generates the processing precision value according to the obtained theoretical deviation value, the plurality of first actual information and the plurality of second actual information, wherein the second image comprises the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns.

[0071] In the embodiment of the present application, the second image is an image of the processed plate after the laser equipment processes the plurality of second shape patterns on the processed plate. If the first theoretical coordinates of the second shape pattern are the same as the second theoretical coordinates of the first shape pattern, the second shape pattern corresponds to the first shape pattern corresponding to the second theoretical coordinates equal to the first theoretical coordinates of the second shape pattern.

[0072] The first actual information comprises the first actual coordinates and the first actual side length value of the first shape pattern. The second actual information comprises the second actual coordinates and the second actual side length value of the second shape pattern. Figure 4 A schematic diagram of the second image provided by the embodiment of the present application is shown in FIG. 2, wherein the second image comprises a plurality of first shape patterns, a plurality of second shape patterns and four targets; each first shape pattern corresponds to one second shape pattern, the second theoretical coordinates of the first shape pattern are the same as the first theoretical coordinates of the second shape pattern corresponding to the first shape pattern, that is, each square corresponds to one inscribed circle. Figure 4

[0073] The theoretical deviation value is a theoretical deviation value of the first shape pattern and the second shape pattern, and the value of the theoretical deviation value is affected by the deviation factor information. For example, if the values of the rotation angle and the expansion ratio are both 0, the plurality of first shape patterns processed on the processed plate by the laser equipment all meet the laser precision, and the theoretical deviation value is 0. If the values of the rotation angle and / or the expansion ratio are not 0, the measuring device can calculate the theoretical deviation value according to the rotation angle and the expansion ratio.

[0074] In step 201, the measuring device can calculate the deviation center according to the actual coordinates of the plurality of targets, calculate the theoretical deviation value corresponding to each second shape pattern according to the deviation center, the rotation angle and the expansion ratio, calculate the actual deviation value corresponding to each second shape pattern according to the first actual information of the plurality of first shape patterns and the second actual information of the second shape pattern corresponding to each first shape pattern, and calculate the processing precision value according to the actual deviation value corresponding to each second shape pattern and the theoretical deviation value corresponding to each second shape pattern.

[0075] Figure 5 A schematic diagram of the deviation center of the second image provided by the embodiment of the present application is shown in FIG. 3, wherein the deviation center is the center of the four targets. Figure 5 ​As shown, the center of the circle of target 1 is connected with the center of the circle of target 3; the center of the circle of target 2 is connected with the center of the circle of target 4, and the intersection point a of the connecting lines is the deviation center a; the measuring device calculates the theoretical deviation value corresponding to each second shape pattern according to the deviation center a, the rotation angle and the expansion and contraction ratio. Figure 6 A part of a second image provided by the embodiment of the present application is shown in the following figure. Figure 6 As shown, Figure 6 The image shown in the figure can be Figure 4 The display image after the part of the image shown in the figure is enlarged by a fixed multiple. Figure 6 The horizontal deviation value of the first shape pattern and the second shape pattern in the dashed box 6A in the figure is 10.57 microns, and the vertical deviation value is 11.70 microns; Figure 6 The horizontal deviation value of the first shape pattern and the second shape pattern in the dashed box 6B in the figure is 0 microns, and the vertical deviation value is 11.62 microns; Figure 6 The horizontal deviation value of the first shape pattern and the second shape pattern in the dashed box 6C in the figure is 0 microns, and the vertical deviation value is 0 microns, wherein the horizontal deviation value and the vertical deviation value shown in the dashed box 6A, the dashed box 6B and the dashed box 6C are all actual deviation values.

[0076] The embodiment of the present application provides a method for determining the machining precision. A laser equipment radiates a plurality of first shape patterns and a plurality of targets on a machining plate according to the obtained first drawing information. The laser equipment generates target grabbing information of the plurality of targets according to a first image of the machining plate, and the first image includes the plurality of first shape patterns and the plurality of targets. The laser equipment generates deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information. The laser equipment radiates a plurality of second shape patterns on the machining plate according to the deviation factor information and the obtained second drawing information through the target grabbing information of the plurality of targets. A measuring device obtains first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the machining plate, and generates a machining precision value according to the obtained theoretical deviation value, the first actual information and the second actual information, and the second image includes the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns, thereby providing a scheme capable of simulating the machining condition of the laser equipment and verifying the machining precision of the laser equipment, which is simple to operate, and the machining material required by the scheme is easy to obtain, can be used in large scale and batch, and ensures the quality of the machined workpiece.

[0077] In a possible implementation, the deviation factor information includes a rotation angle and / or an expansion and contraction ratio, and the first drawing information includes a plurality of target theoretical information; and step 103 specifically includes: the laser equipment generates the rotation angle and / or the expansion and contraction ratio according to the target grabbing information of the plurality of targets and the plurality of target theoretical information.

[0078] In the embodiment of the present application, the laser equipment generates at least one theoretical target distance value according to the plurality of target theoretical information; generates the actual target distance value corresponding to each theoretical target distance value according to the plurality of target grabbing information; generates the expansion and contraction ratio according to the at least one theoretical target distance value and the actual target distance value corresponding to each theoretical target distance value; and generates the rotation angle according to the plurality of target theoretical information, the plurality of target grabbing information, the at least one theoretical target distance value and the actual target distance value corresponding to each theoretical target distance value. The target grabbing information includes the actual target coordinates of the target grabbed by the target grabbing. The target theoretical information includes the target theoretical coordinates and the target theoretical side length value.

[0079] As shown in Figure 2 , the laser equipment calculates the theoretical target distance values of target 1 and target 2, target 2 and target 3, target 3 and target 4, and target 4 and target 1 respectively according to the plurality of target theoretical coordinates; calculates the actual target distance values of target 1 and target 2, target 2 and target 3, target 3 and target 4, and target 4 and target 1 respectively according to the plurality of target grabbing information; wherein, the theoretical target distance value of target 1 and target 2 corresponds to the actual target distance value; the theoretical target distance value of target 2 and target 3 corresponds to the actual target distance value; the theoretical target distance value of target 3 and target 4 corresponds to the actual target distance value; and the theoretical target distance value of target 4 and target 1 corresponds to the actual target distance value. The expansion and contraction ratio can be calculated by the ratio of at least one actual target distance value and the theoretical target distance value corresponding to the actual target distance value, for example, the laser equipment takes the ratio of the actual target distance value and the theoretical target distance value of target 1 and target 2 as the first ratio; takes the ratio of the actual target distance value and the theoretical target distance value of target 2 and target 3 as the second ratio; takes the ratio of the actual target distance value and the theoretical target distance value of target 3 and target 4 as the third ratio; and takes the ratio of the actual target distance value and the theoretical target distance value of target 4 and target 1 as the fourth ratio; the laser equipment can take the maximum value of the first ratio, the second ratio, the third ratio and the fourth ratio as the expansion and contraction ratio; or take the average value of the first ratio, the second ratio, the third ratio and the fourth ratio as the expansion and contraction ratio, etc. The generation process of the expansion and contraction ratio is not limited in the embodiment of the present application.

[0080] In a possible implementation manner, the second drawing information includes the first theoretical information of the plurality of second shape graphics; Figure 7 A flow chart for laser processing the plurality of second shape graphics provided by the embodiment of the present application is shown in Figure 7 , and step 104 can specifically include:

[0081] Step 1041, the laser equipment generates the first laser information corresponding to each second shape graphic according to the deviation factor information and the plurality of first theoretical information.

[0082] In the embodiment of the present application, the deviation factor information includes a rotation angle and / or a stretching ratio, the first theoretical information includes first theoretical coordinates and a first theoretical side length value, the first laser information includes third theoretical coordinates and a third theoretical side length value, and the processing board includes a printed circuit board. Figure 8 A flowchart for generating first laser information corresponding to each second shape pattern is provided in the embodiment of the present application, as shown in Figure 8 Step 1041 can specifically include the following steps.

[0083] Step 1041A: The laser equipment calculates the third theoretical coordinates according to the first theoretical coordinates, the rotation angle and the stretching ratio.

[0084] In the embodiment of the present application, the laser equipment adjusts the first theoretical coordinates according to the rotation angle and the stretching ratio, and defines the adjusted first theoretical coordinates as the third theoretical coordinates, so that the third theoretical coordinates can reduce the deviation of the laser position caused by the rotation angle and / or the stretching ratio, and further improve the processing precision. The printed circuit board includes a flexible circuit board. As shown in Figure 3 The laser equipment adjusts the first theoretical coordinates of the plurality of second shape patterns, so that the adjusted first theoretical coordinates can reduce the deviation caused by the placement position of the processing board, the stretching of the material of the processing board and the like.

[0085] Step 1041B: The laser equipment calculates the third theoretical side length value according to the first theoretical side length value and the stretching ratio.

[0086] In the embodiment of the present application, the laser equipment adjusts the first theoretical side length value according to the stretching ratio, and defines the adjusted first theoretical side length value as the third theoretical side length value, so that the deviation of the laser shape caused by the stretching ratio can be reduced, and the third theoretical side length value has better laser effect on the processing board. For example, as shown in Figure 3 The laser equipment adjusts the radius of the second shape pattern according to the stretching ratio, and generates the radius of the adjusted second shape pattern.

[0087] Step 1042: The laser equipment performs laser processing on the plurality of second shape patterns on the processing board according to the plurality of first laser information through the plurality of grabbing target information.

[0088] In the embodiment of the present application, the laser equipment performs laser processing on the plurality of second shape patterns on the processing board according to the third theoretical coordinates and the third theoretical side length value of the plurality of second shape patterns calculated through the grabbing target information of the grabbing target.

[0089] The embodiment of the present application provides a machining precision determination method, a laser equipment radiates a plurality of first shape patterns and a plurality of targets on a machining plate according to obtained first drawing information; the laser equipment generates target grabbing information of the plurality of targets according to a first image of the machining plate, and the first image comprises the plurality of first shape patterns and the plurality of targets; the laser equipment generates deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information; the laser equipment radiates a plurality of second shape patterns on the machining plate according to the deviation factor information and obtained second drawing information through the target grabbing information of the plurality of targets; a measuring equipment obtains first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the machining plate, and generates a machining precision value according to obtained theoretical deviation values, the first actual information and the second actual information, and the second image comprises the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns, so that a scheme capable of simulating machining of the laser equipment and verifying machining precision of the laser equipment is provided, the scheme is simple to operate, and machining materials required by the scheme are easy to obtain and can be used in large-scale batches.

[0090] Figure 9 The flow chart of another machining precision determination method provided by the embodiment of the present application is shown in Figure 9 The method comprises the following steps.

[0091] In step 301, the laser equipment radiates a plurality of first shape patterns and a plurality of targets on a machining plate according to obtained first drawing information.

[0092] In step 302, the laser equipment generates target grabbing information of the plurality of targets according to a first image of the machining plate, and the first image comprises the plurality of first shape patterns and the plurality of targets.

[0093] In step 303, the laser equipment generates deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information.

[0094] In step 304, the laser equipment radiates a plurality of second shape patterns on the machining plate according to the deviation factor information and obtained second drawing information through the target grabbing information of the plurality of targets, so that a measuring equipment obtains first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the machining plate, and generates a machining precision value according to obtained theoretical deviation values, the first actual information and the second actual information, and the second image comprises the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns.

[0095] In the embodiment of the present application, steps 301 to 304 can refer to steps 101 to 201 shown in Figure 1

[0096] In a possible implementation manner, the machining plate comprises a printed circuit board.​

[0097] In a possible implementation, the deviation factor information includes a rotation angle and / or a scaling ratio, and the first drawing information includes a plurality of target theoretical information; and the step 303 specifically can include: the laser equipment generating the rotation angle and / or the scaling ratio according to the grabbing target information of the plurality of targets and the plurality of target theoretical information.

[0098] In a possible implementation, the second drawing information includes a plurality of first theoretical information of a plurality of second shape patterns; and the step 304 specifically can include: the laser equipment generating, according to the deviation factor information and the plurality of first theoretical information, first laser information corresponding to each second shape pattern; and the laser equipment laser processing, according to the plurality of first laser information and the plurality of grabbing target information, the plurality of second shape patterns on the processing board.

[0099] In the embodiment of the application, the deviation factor information includes a rotation angle and / or a scaling ratio, the first theoretical information includes first theoretical coordinates and a first theoretical side length value, and the first laser information includes third theoretical coordinates and a third theoretical side length value; the laser equipment generates, according to the deviation factor information and the plurality of first theoretical information, first laser information corresponding to each second shape pattern, including: the laser equipment calculating the third theoretical coordinates according to the first theoretical coordinates, the rotation angle and the scaling ratio; and the laser equipment calculating the third theoretical side length value according to the first theoretical side length value and the scaling ratio. For example, the printed circuit board includes a flexible circuit board.

[0100] In a possible implementation, the first drawing information includes a plurality of second theoretical coordinates of a plurality of first shape patterns; the second drawing information includes a plurality of first theoretical coordinates of a plurality of second shape patterns corresponding to the plurality of first shape patterns; and the first theoretical coordinates are the same as the second theoretical coordinates corresponding to the first theoretical coordinates.

[0101] The embodiment of the present application provides a machining precision determination method, a laser equipment radiates a plurality of first shape patterns and a plurality of targets on a machining plate according to acquired first drawing information; the laser equipment generates target grabbing information of the plurality of targets according to a first image of the machining plate, the first image comprises the plurality of first shape patterns and the plurality of targets; the laser equipment generates deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information; the laser equipment radiates a plurality of second shape patterns on the machining plate according to the target grabbing information of the plurality of targets, the deviation factor information and acquired second drawing information, so that a measuring equipment acquires first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the machining plate, and generates a machining precision value according to an acquired theoretical deviation value, the first actual information and the second actual information, the second image comprises the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns, thereby providing a scheme capable of simulating machining of the laser equipment and verifying machining precision of the laser equipment, the scheme is simple to operate, and machining materials required by the scheme are easy to acquire, the scheme can be used in large-scale batch mode, and the quality of a machining workpiece is ensured.

[0102] Figure 10 A structural schematic diagram of a machining precision determination device provided by the embodiment of the present application is shown in the figure, the device comprises a first laser module 11, a first generation module 12, a second generation module 13 and a second laser module 14. Figure 10 The first laser module 11 is connected with the first generation module 12, the first generation module 12 is connected with the second generation module 13, and the second generation module 13 is connected with the second laser module 14.

[0103] The first laser module 11 is used for radiating a plurality of first shape patterns and a plurality of targets on a machining plate according to acquired first drawing information; the first generation module 12 is used for generating target grabbing information of the plurality of targets according to a first image of the machining plate, the first image comprises the plurality of first shape patterns and the plurality of targets; the second generation module 13 is used for generating deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information; and the second laser module 14 is used for radiating a plurality of second shape patterns on the machining plate according to the target grabbing information of the plurality of targets, the deviation factor information and acquired second drawing information, so that a measuring equipment acquires first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the machining plate, and generates a machining precision value according to an acquired theoretical deviation value, the first actual information and the second actual information, the second image comprises the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns.

[0104] In a possible implementation, the deviation factor information comprises a rotation angle and / or a scaling ratio, and the first drawing information comprises a plurality of target theoretical information; the second generation module 13 is specifically configured to generate the rotation angle and / or the scaling ratio according to the grabbing target information of the plurality of targets and the plurality of target theoretical information.

[0105] In a possible implementation, the second drawing information comprises a plurality of first theoretical information of a plurality of second shape patterns; the second laser module 14 is specifically configured to generate first laser information corresponding to each second shape pattern according to the deviation factor information and the plurality of first theoretical information, and laser the plurality of second shape patterns on the processing board according to the plurality of first laser information and the plurality of grabbing target information.

[0106] In a possible implementation, the deviation factor information comprises a rotation angle and / or a scaling ratio, the first theoretical information comprises a first theoretical coordinate and a first theoretical side length value, and the first laser information comprises a third theoretical coordinate and a third theoretical side length value; the second laser module 14 is specifically configured to calculate the third theoretical coordinate according to the first theoretical coordinate, the rotation angle and the scaling ratio, and calculate the third theoretical side length value according to the first theoretical side length value and the scaling ratio.

[0107] In a possible implementation, the first drawing information comprises a plurality of second theoretical coordinates of a plurality of first shape patterns; the second drawing information comprises a plurality of first theoretical coordinates of a plurality of second shape patterns corresponding to the plurality of first shape patterns; the first theoretical coordinate is the same as the second theoretical coordinate corresponding to the first theoretical coordinate.

[0108] In a possible implementation, the processing board comprises a printed circuit board.

[0109] The device for determining the processing precision provided by the embodiment of the present application comprises: a laser equipment which is configured to laser a plurality of first shape patterns and a plurality of targets on a processing board according to acquired first drawing information; a measuring equipment which is configured to generate grabbing target information of the plurality of targets according to an acquired first image of the processing board, the first image comprising the plurality of first shape patterns and the plurality of targets; a second generation module which is configured to generate deviation factor information according to the grabbing target information of the plurality of targets and the first drawing information; and a second laser module which is configured to laser a plurality of second shape patterns on the processing board according to the deviation factor information and acquired second drawing information through the grabbing target information of the plurality of targets, so that the measuring equipment acquires first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on a second image of the processing board, and generates a processing precision value according to an acquired theoretical deviation value, the first actual information and the second actual information, the second image comprising the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns. Thus, a scheme capable of simulating the processing of the laser equipment and verifying the processing precision of the laser equipment is provided, the scheme is simple to operate, and the processing material required by the scheme is easy to acquire, can be used in large scale, and ensures the quality of the processed workpiece.

[0110] Figure 11 Another structure diagram of the processing precision determination device provided by the embodiment of the present application is shown in the figure, which comprises a first acquisition module 21 and a third generation module 22. Figure 11 The first acquisition module 21 is connected with the third generation module 22.

[0111] The first acquisition module 21 is used to acquire a second image of a processing board, the processing board comprising a plurality of first shape patterns and a plurality of targets which are radiated on the processing board by a laser equipment according to acquired first drawing information, and a plurality of second shape patterns which are radiated on the processing board by the laser equipment according to acquired second drawing information and deviation factor information generated by the laser equipment according to the target grabbing information of the plurality of targets and the first drawing information, the second image comprising the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns; the third generation module 22 is used to acquire first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on the second image, and generate a processing precision value according to the acquired theoretical deviation value, the plurality of first actual information and the plurality of second actual information.

[0112] In a possible implementation, the first drawing information comprises second theoretical coordinates of the plurality of first shape patterns; the second drawing information comprises first theoretical coordinates of the second shape patterns corresponding to the plurality of first shape patterns; the first theoretical coordinates are the same as the second theoretical coordinates corresponding to the first theoretical coordinates.

[0113] In a possible implementation, the processing board comprises a printed circuit board.

[0114] The processing precision determination device provided by the embodiment of the present application, the measuring equipment acquires a second image of a processing board, the processing board comprising a plurality of first shape patterns and a plurality of targets which are radiated on the processing board by a laser equipment according to acquired first drawing information, and a plurality of second shape patterns which are radiated on the processing board by the laser equipment according to acquired second drawing information and deviation factor information generated by the laser equipment according to the target grabbing information of the plurality of targets and the first drawing information, the second image comprising the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns; based on the second image, first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns are acquired, and a processing precision value is generated according to the acquired theoretical deviation value, the plurality of first actual information and the plurality of second actual information, thereby providing a scheme capable of simulating the processing condition of the laser equipment and verifying the processing precision of the laser equipment, which is simple to operate, and the processing material required by the scheme is easy to acquire, can be used in large scale and batch, and the quality of the processed workpiece is ensured.

[0115] The embodiment of the present application provides a storage medium, the storage medium comprises a stored program, wherein, when the program is running, the device where the storage medium is located is controlled to perform each step of the embodiment of the machining precision determination method, and specific description can be referred to the embodiment of the machining precision determination method.

[0116] The embodiment of the present application provides a laser equipment, comprising a memory and a processor, the memory is used for storing information comprising program instructions, the processor is used for controlling the execution of the program instructions, the program instructions are loaded and executed by the processor, and each step of the embodiment of the machining precision determination method is realized, and specific description can be referred to the embodiment of the machining precision determination method.

[0117] Figure 12 A schematic diagram of the laser equipment provided by the embodiment of the present application is shown. Figure 12 As shown in the figure, the laser equipment 30 of the embodiment comprises a processor 31, a memory 32 and a computer program 33 stored in the memory 32 and executable on the processor 31, the computer program 33 is executed by the processor 31 to realize the application of the machining precision determination method in the embodiment, to avoid repetition, details are not described here. Alternatively, the computer program is executed by the processor 31 to realize the function of each model / unit in the machining precision determination device in the embodiment, to avoid repetition, details are not described here.

[0118] The laser equipment 30 comprises, but is not limited to, the processor 31 and the memory 32. Figure 12 Only the laser equipment 30 is an example, and does not constitute a limitation to the laser equipment 30, can comprise more or less components than the figure, or combine certain components, or different components, for example, the laser equipment 30 can also comprise an input / output device, a network access device, a bus and the like.

[0119] The processor 31 can be a central processing unit (CPU), and can also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), field programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components and the like. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor and the like.

[0120] The storage 32 can be an internal storage unit of the laser device 30, such as a hard disk or a memory of the laser device 30. The storage 32 can also be an external storage device of the laser device 30, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the laser device 30. Further, the storage 32 can include both the internal storage unit and the external storage device of the laser device 30. The storage 32 is used to store computer programs and other programs and data required by the laser device 30. The storage 32 can also be used to temporarily store data that has been output or is to be output.

[0121] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described system, device and unit can refer to the corresponding processes in the foregoing method embodiments, which will not be repeated here.

[0122] In several embodiments provided by the present application, it should be understood that the disclosed system, device and method can be implemented by other ways. For example, the device embodiments described above are merely schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units or components shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.

[0123] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e. can be located in one place or can be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

[0124] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of hardware plus software functional unit.

[0125] The integrated unit in the form of software function unit can be stored in a computer readable storage medium. The software function unit is stored in a storage medium, and includes instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute part of steps of the method according to the embodiments of the present application. The storage medium includes a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various storage medium capable of storing program codes.

[0126] The embodiment of the present application provides a measuring device, including a memory and a processor, the memory is used for storing information including program instructions, the processor is used for controlling execution of the program instructions, the program instructions are loaded and executed by the processor to realize each step of the embodiment of the machining precision determination method, and specific description can be referred to the embodiment of the machining precision determination method.

[0127] Figure 13 A schematic diagram of a measuring device provided by the embodiment of the present application is shown in the figure. Figure 13 As shown in the figure, the measuring device 40 of the embodiment includes a processor 41, a memory 42, and a computer program 43 stored in the memory 42 and executable on the processor 41, the computer program 43 is executed by the processor 41 to realize the machining precision determination method in the embodiment, to avoid repetition, details are not described here. Alternatively, the computer program is executed by the processor 41 to realize the function of each model / unit in the machining precision determination device in the embodiment, to avoid repetition, details are not described here.

[0128] The measuring device 40 includes, but is not limited to, the processor 41 and the memory 42. Figure 13 The measuring device 40 is only an example and does not constitute a limitation on the measuring device 40, can include more or fewer components than the figure, or combine certain components, or different components, for example, the measuring device 40 can also include an input / output device, a network access device, a bus, etc.

[0129] The processor 41 can be a central processing unit (CPU), and can also be other general-purpose processors, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware component, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor.

[0130] The memory 42 can be an internal storage unit of the measuring device 40, such as a hard disk or a memory of the measuring device 40. The memory 42 can also be an external storage device of the measuring device 40, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. Further, the memory 42 can include both the internal storage unit and the external storage device of the measuring device 40. The memory 42 is used to store computer programs and other programs and data required by the measuring device 40. The memory 42 can also be used to temporarily store data that has been output or will be output.

[0131] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described system, device and unit can refer to the corresponding processes in the foregoing method embodiments, which will not be described here.

[0132] In several embodiments provided by the present application, it should be understood that the disclosed system, device and method can be implemented by other ways. For example, the device embodiments described above are merely schematic, for example, the division of the units is merely a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units or components shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.

[0133] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0134] In addition, each functional unit in each embodiment of the application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of hardware plus software functional unit.

[0135] The integrated unit realized in the form of software functional unit can be stored in a computer readable storage medium. The software functional unit stored in a storage medium includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute part of the steps of the method described in each embodiment of the application. The foregoing storage medium includes a variety of storage media that can store program codes, such as a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0136] The above only describes the preferred embodiments of the application and is not intended to limit the application. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the application shall be included in the protection scope of the application.

Claims

1. A method of determining machining accuracy, characterized by, The method comprises the following steps: a laser equipment radiates a plurality of first shape patterns and a plurality of targets on a processing plate according to acquired first drawing information; the laser equipment generates target grabbing information of the plurality of targets according to acquired first images of the processing plate, the first images comprising the plurality of first shape patterns and the plurality of targets; the laser equipment generates deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information; the laser equipment radiates a plurality of second shape patterns on the processing plate according to the deviation factor information and acquired second drawing information through the target grabbing information of the plurality of targets; a measuring equipment acquires first actual information of the plurality of first shape patterns and second actual information of the plurality of second shape patterns based on second images of the processing plate, the second images comprising the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns, and generates a processing precision value according to acquired theoretical deviation values, the first actual information and the second actual information.

2. The method of claim 1, wherein, the deviation factor information comprises a rotation angle and / or a scaling ratio, and the first drawing information comprises target theoretical information; the laser equipment generates the deviation factor information according to the target grabbing information of the plurality of targets and the first drawing information, which comprises: the laser equipment generates the rotation angle and / or the scaling ratio according to the target grabbing information of the plurality of targets and the target theoretical information.

3. The method of claim 1, wherein, the second drawing information comprises first theoretical information of a plurality of second shape patterns; the laser equipment radiates a plurality of second shape patterns on the processing plate according to the deviation factor information and acquired second drawing information through the target grabbing information of the plurality of targets, which comprises: the laser equipment generates first laser information corresponding to each of the second shape patterns according to the deviation factor information and the first theoretical information; the laser equipment radiates a plurality of second shape patterns on the processing plate according to the first laser information through the target grabbing information.

4. The method of claim 3, wherein, the deviation factor information comprises a rotation angle and / or a scaling ratio, the first theoretical information comprises first theoretical coordinates and a first theoretical side length value, and the first laser information comprises third theoretical coordinates and a third theoretical side length value; the laser equipment generates first laser information corresponding to each of the second shape patterns according to the deviation factor information and the first theoretical information, which comprises: the laser equipment calculates the third theoretical coordinates according to the first theoretical coordinates, the rotation angle and the scaling ratio; the laser equipment calculates the third theoretical side length value according to the first theoretical side length value and the scaling ratio.

5. The method of claim 1, wherein, the first drawing information comprises second theoretical coordinates of a plurality of first shape patterns; the second drawing information comprises first theoretical coordinates of second shape patterns corresponding to the plurality of first shape patterns; and the first theoretical coordinates are the same as the second theoretical coordinates corresponding to the first theoretical coordinates.

6. A method of determining machining accuracy, characterized by, The method is applied to a laser equipment, and the method comprises the following steps: radiating a plurality of first shape patterns and a plurality of targets on a processing plate according to acquired first drawing information; According to the first image of the processing board, the target information of the plurality of targets is generated, and the first image includes the plurality of first shape patterns and the plurality of targets; According to the target information of the plurality of targets and the first paper information, the deviation factor information is generated; According to the deviation factor information and the second paper information obtained by the target information of the plurality of targets, the second shape patterns are lasered on the processing board, so that the first actual information of the plurality of first shape patterns and the second actual information of the plurality of second shape patterns are obtained based on the second image of the processing board, and the processing precision value is generated according to the theoretical deviation value, the plurality of first actual information and the plurality of second actual information, and the second image includes the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns.

7. The method according to any one of claims 1 to 5 or claim 6, characterized in that, The processing board includes a printed circuit board.

8. A machining accuracy determining device, characterized by Comprising: The first laser module is used for laser the plurality of first shape patterns and the plurality of targets on the processing board according to the first paper information obtained; The first generation module is used for generating the target information of the plurality of targets according to the first image of the processing board, and the first image includes the plurality of first shape patterns and the plurality of targets; The second generation module is used for generating the deviation factor information according to the target information of the plurality of targets and the first paper information; The second laser module is used for laser the plurality of second shape patterns on the processing board according to the deviation factor information and the second paper information obtained by the target information of the plurality of targets, so that the first actual information of the plurality of first shape patterns and the second actual information of the plurality of second shape patterns are obtained based on the second image of the processing board, and the processing precision value is generated according to the theoretical deviation value, the plurality of first actual information and the plurality of second actual information, and the second image includes the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns.

9. A machining accuracy determining device, characterized by Comprising: The first acquisition module is used for acquiring the second image of the processing board, the processing board includes the plurality of first shape patterns and the plurality of targets lasered on the processing board by the laser equipment according to the first paper information obtained, and the plurality of second shape patterns lasered on the processing board by the laser equipment according to the deviation factor information generated by the target information of the plurality of targets and the first paper information and the second paper information obtained through the target information of the plurality of targets on the processing board, and the second image includes the plurality of first shape patterns, the plurality of targets and the plurality of second shape patterns; The third generation module is used for obtaining the first actual information of the plurality of first shape patterns and the second actual information of the plurality of second shape patterns based on the second image, and generating the processing precision value according to the theoretical deviation value, the plurality of first actual information and the plurality of second actual information.

10. A storage medium, characterized by The storage medium includes a stored program, wherein when the program runs, the device where the storage medium is located executes the processing precision determination method in any one of claims 1 to 5 or claim 6.

11. A laser apparatus comprising a memory for storing information including program instructions, and a processor for controlling execution of the program instructions, characterized in that, The program instructions, when loaded and executed by the processor, implement the processing precision determination method steps of any one of claims 1 to 5 or claim 6 or claim 7.

12. A measuring device comprising a memory for storing information including program instructions and a processor for controlling execution of the program instructions, characterized in that, The program instructions, when loaded and executed by the processor, implement the processing precision determination method steps of any one of claims 1 to 5 or claim 6 or claim 7.

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