A filter type flexible display device composed of a double-sided glass thin film substrate and a manufacturing method thereof

Abstract

A filter type flexible display device composed of double-sided glass film substrates and a method for manufacturing the same are disclosed. The device is composed of double-sided glass film substrates, each of which has at least one glass film. The inner sides of the two glass film substrates are attached with films, and a display material is provided between the two glass film substrates. The outer edge of a peripheral sealing portion is not more than the outer edge of the smaller glass film substrate. On the outside of the peripheral sealing portion, one of the glass film substrates is attached with an electrode lead and an insulating film. Before forming independent display devices, a plurality of display devices are formed in an array, the arrays share the same mother substrate, and then the independent display devices are formed by dividing and binding ICs. Each display device is connected to a driving or control IC through the electrode lead. An isolation layer is provided between the inner side of the cut substrate and the lead adjacent to the intersection of the cutting line and the electrode lead. The device manufacturing method is applicable to an ultra-thin glass film substrate having a thickness of several micrometers.

Description

Technical Field

[0001] This invention relates to a filter-type flexible display device composed of double-sided glass thin film substrates and its manufacturing method, particularly a low-cost liquid crystal flexible display device. Background Technology

[0002] With the development of the Internet of Things (IoT), IoT technology enables isolated devices to connect to the internet. Flexible display devices are an important component in the IoT field, adaptable to various display installation environments and offering broader application possibilities for electronic devices. The decreasing cost of flexible display devices can drive their wider application, such as in devices like mobile phones, tablets, laptops, and monitors, bringing better visual experiences and more convenient installation and seamless mobility. As display technology continues to evolve, particularly in the thinning, lightweighting, and flexibility of display screens, new substrate materials are becoming increasingly important for overall device design. Flexible and impact-resistant display devices are becoming increasingly indispensable in mobile devices that demand realistic large curved displays and prioritize portability, convenience, and security. The IoT world, where multiple devices are integrated, continues to increase the demand for low-cost, lightweight, and flexible display devices.

[0003] In current technologies, organic light-emitting display devices and electrophoretic electronic paper are rapidly achieving lightweighting and flexibility. In large-scale commercial flexible displays, plastic substrates are primarily used to achieve good bending performance. However, due to significant differences in materials and processes compared to traditional methods, the manufactured display devices are expensive and have inherent defects that are difficult to overcome. For example, they are easily scratched, prone to creases when bent, and have poor water and oxygen barrier properties. Therefore, attention has turned to glass materials. If flexible functionality can be imparted to glass substrates to achieve flexible displays, these defects can be overcome. It is possible to make the substrate bendable by reducing its thickness. In particular, when the total thickness of the glass thin-film substrate is less than or equal to 100 μm, the glass thin-film substrate exhibits the characteristics of a bendable thin-film substrate. As the thickness of the glass thin film decreases, reaching the order of several micrometers, a bendability similar to that of plastic substrate films can be achieved. However, the thinner the glass thin film, the weaker its impact resistance, making it more prone to breakage and defects. In the manufacturing process of displays, glass film substrates are prone to breakage and are also prone to breakage during use. In particular, sudden excessive bending can cause latent defects in the glass film to surface, resulting in cracking during processing and use.

[0004] If the substrate contains a double-layer glass film material, to achieve bending performance, the thickness of the single-layer glass film material needs to be reduced to below 50 μm, or even several micrometers. Ultrathin glass made in this way exhibits good bending characteristics, high light transmittance, and also good thermal stability and chemical resistance, with minimal impact on its barrier properties against water vapor and oxygen. Furthermore, ultrathin glass materials also possess high surface flatness, making them the most ideal display insulating substrate material and an ideal substrate material for flexible display devices.

[0005] Compared to plastic substrates, ultrathin glass substrates offer the following advantages. First, ultrathin glass boasts high light transmittance, optical isotropy, and no phase retardation. With a refractive index of around 1.5 and a transmittance exceeding 90%, it is suitable for use as a substrate in liquid crystal displays. In the visible light spectrum, its transmittance is exceptionally high, far surpassing that of plastic substrates such as PET, PEN, and PI, and even approaching that of quartz glass. Second, ultrathin glass exhibits high temperature stability, dimensional stability, and a low temperature elongation coefficient, showing significantly better stress-strain characteristics than PET, PEN, and PI, demonstrating excellent thermal and dimensional stability. Using glass film materials with minimal thermal shrinkage helps reduce material costs and improve production efficiency, thereby enhancing the performance of the display device. Third, ultrathin glass possesses high chemical resistance and strong barrier properties against water vapor and oxygen, effectively resisting the erosion and penetration of various chemical components. Finally, ultrathin glass exhibits strong scratch resistance, washability, and high hardness, ensuring precision and purity during the production process and contributing to a longer lifespan for the display device.

[0006] As mentioned earlier, ultrathin glass film materials have some drawbacks, such as poor toughness, high brittleness, and susceptibility to cracks and fractures, making them more sensitive to microcrack defects. Furthermore, the application of ultrathin glass film materials is somewhat limited due to their low flexural and tensile strength. Mechanical strength tests show that the breakage rate of glass film materials depends not only on surface damage but also on damage to the substrate edges. The edges of ultrathin glass film materials are more prone to microcrack defects during cutting operations, and nearly 90% of glass breakage is caused by edge damage.

[0007] To reduce the breakage rate of glass film materials, various methods are available, including annealing, tempering, surface coating, microcrystallization, and composite materials. Some of these methods can increase the flexural strength of glass by several times or even ten times. Therefore, these factors need to be considered when manufacturing and applying ultrathin glass film materials, and appropriate measures should be taken according to specific circumstances. Surface coating has two advantages in improving the strength of glass film materials: ① Surface coating can protect the glass surface from damage and reduce the probability of microcracks. ② Surface coating forms compressive stress on the surface of the glass film material, preventing or delaying the occurrence of microcracks. Specific surface coating technologies for ultrathin glass film materials used in display devices include: ① Plastic film coating. ② Thin coating (plasma deposition hard coating). ③ Thick coating (polymer). The purpose of surface coating is to combine the advantages of both glass film and coating in ultrathin glass film materials, thereby leveraging the excellent anti-permeability and dimensional stability of glass film materials while possessing the scratch resistance of plastic. Reinforcing ultrathin glass with polysiloxane can improve its brittleness and increase its flexibility. Using specialized glass materials is one way to fundamentally address the shortcomings of ultra-thin glass films. For example, lithium aluminum silicate (LAS) and aluminosilicate (AS) glass have excellent bending properties, while lithium aluminum borosilicate (LABS) glass offers superior scratch and impact resistance. To fully utilize the advantages of thin glass films, such as low cost, scratch resistance, crease-free bending, and water and oxygen barrier properties, further solutions are needed for laser-cut glass. Traditional mechanical cutting methods cannot meet the requirements of high-performance flexible display devices, so laser cutting is commonly used; however, this method also has many problems.

[0008] Laser cutting methods for thin glass films can be broadly categorized into two types based on their principles: fusion (evaporation) cutting and crack control cutting. Fusion cutting utilizes the good plasticity and ductility of glass at its softening temperature. A focused CO2 laser or ultraviolet laser is used to irradiate the softened glass surface. The high energy density of the laser causes the glass to melt, and then a gas stream blows away the molten glass, creating grooves and thus achieving the fusion cutting of the glass. Crack control cutting is a commonly used laser cutting method. First, the glass surface is heated by laser. The energy is absorbed by a 15μm absorption layer on the glass surface, so the high energy of laser cutting causes a rapid temperature increase in this area, generating significant compressive stress, but this stress does not cause the glass to crack. Second, this area is rapidly cooled, typically using cooling gas or liquid. The rapid cooling creates a large temperature gradient and tensile stress on the glass surface. This tensile stress causes the glass surface to crack along the predetermined scribe line, achieving the glass cutting.

[0009] Laser cutting of glass offers significant advantages such as high processing speed, high precision, and simple parameter settings, making it a preferred choice for mass production. Because lasers are non-contact tools, there is no wear, ensuring consistently uniform cutting thickness and edge quality. The average roughness is less than 0.5μm. Laser cutting avoids side cracks, enhancing not only edge impact resistance but also overall component strength, typically increasing it by 80%, thus significantly improving the component's resistance to damage—something difficult to achieve with mechanical cutting methods like wheel cutters. Using glass laser cutting technology can significantly improve the component's resistance to damage, something unattainable with mechanical cutting. Increased material strength reduces the likelihood of damage and loss, lowering the risk of on-site failures due to potential product defects—a significant advantage in product design. Designers can use lighter, thinner materials without affecting product lifespan. Glass laser cutting is already applied in display devices, mobile phones, tablets, and other fields. In glass cutting, the display industry uses ultraviolet lasers more often than CO2 lasers compared to other industries. Currently, cutting single-layer glass substrates is no longer problematic and has been resolved. However, when cutting flexible display substrate motherboards, the problem of short circuits caused by melting metal leads or flying debris remains. The inventors proposed a method for cutting from the back of metal leads, which avoids contact between the laser and the metal leads by controlling the laser energy, thus preventing the metal leads from melting and debris from flying everywhere. This method is applicable to single-layer glass substrate films with a thickness of 50 μm or more, but not to glass film substrates with a thickness of less than 50 μm or double-layer glass film substrates. In particular, the problem of damaging or short-circuiting the electrode leads of the other substrate when cutting one layer remains difficult to solve. Summary of the Invention

[0010] To address the persistent technical problem in existing flexible display devices where cutting one substrate layer can damage or short-circuit the electrode leads of another, the following issues remain unresolved:

[0011] The manufacturing method for flexible display devices has the following technical problems: the method of cutting from the back of the metal leads is not applicable to glass thin film substrates or double-layer glass thin film substrates with a thickness of less than 50μm. In particular, the problem of damaging or short-circuiting the electrode leads of the other substrate when cutting one layer of the substrate is still difficult to solve.

[0012] This invention provides the following technical solution:

[0013] A filter-type flexible display device composed of double-sided glass thin film substrates includes: two glass thin film substrates disposed opposite to each other;

[0014] Each glass film substrate has at least one layer of glass film;

[0015] A functional film is attached to the inner side of the two glass film substrates, and there is a display material between the two glass film substrates. The outer edge of the sealing portion around the display material does not exceed the outer edge of the smaller glass film substrate.

[0016] Outside the sealed portion, electrode leads and an insulating film are attached to one side of the glass thin film substrate.

[0017] Connect the driver IC or control IC sequentially via electrode leads;

[0018] An isolation layer is provided between the inner side of the glass thin film substrate and the electrode leads.

[0019] Furthermore: the glass thin film material is located inside the two opposing glass thin film substrates;

[0020] A plastic film is attached to the outside of the glass film material;

[0021] The glass film material on each side consists of multiple layers, with plastic film layered between the layers.

[0022] Furthermore, the total thickness of the glass film material is less than 50 μm.

[0023] Furthermore, the material used for the surrounding sealing portion is epoxy resin or silicone.

[0024] Furthermore: the isolation layer is composed of one or more thin films; the thin film materials are composed of, in order: BM film, R filter film, G filter film, B filter film and PS spacer film.

[0025] Furthermore, the display device is a liquid crystal display device with a filter.

[0026] A method for manufacturing a filter-type flexible display device composed of double-sided glass thin film substrates, characterized by comprising the following steps:

[0027] S1: A display panel is formed by a front mother substrate and a rear mother substrate, and the display panel contains multiple display modules:

[0028] The plurality of display modules have functional films attached to the inner sides of two oppositely arranged glass film substrates, and display material is placed between the two glass film substrates. The outer edge of the sealing portion around the display material does not exceed the outer edge of the smaller glass film substrate. Each glass film substrate has at least one layer of glass film. Outside the sealing portion, one side of the glass film substrate is attached with electrode leads and an insulating film. An isolation layer is provided at the intersection of the display module cutting line and the electrode lead, and on the inner side of the substrate being cut and between the lead and the electrode lead.

[0029] S2: Form and pattern a thin film for manufacturing an array on a front substrate or a back substrate, including BM, insulating film, metal electrode, transparent electrode, PS and other functional materials. The metal electrode or transparent electrode is also used to manufacture leads extending from the display area. Form and pattern a color filter film on the front substrate or the back substrate.

[0030] The printed or photolithographically sealed area is filled with display material, and the patterned sides of the front and rear mother substrates are bonded together inwards.

[0031] S3: Before forming an independent display device, multiple sub-display modules form an array, which shares the same mother substrate, and then are divided into independent display devices, and then ICs are bonded; each display module is connected to a driver IC or a control IC in sequence through electrode leads;

[0032] S4: The display module array formed by the bonded mother substrate is laser-cut to obtain a flexible display device of the required size; the laser cutting trajectory is of arbitrary shape; the trajectory of the mother substrate before cutting intersects the vertical projection of the lead wire in the mother substrate after cutting, and the trajectory of the mother substrate after cutting intersects the vertical projection of the lead wire in the mother substrate before cutting.

[0033] Furthermore: When cutting the front or rear mother substrate, both sides can be cut simultaneously or cut in a single layer, but at least one side needs to be cut in a single layer.

[0034] Furthermore, the cutting is achieved by laser cutting, and the dividing line passes through or is adjacent to the isolation layer, so it is necessary to ensure that the part of the cut substrate remaining in the display device does not have any residual isolation layer.

[0035] Furthermore, the isolation layer is provided by setting a region near the intersection of the vertical projection of the rear mother substrate or the front mother substrate, the edge of the region coincides with or is separated from the laser cutting line by a distance of less than two millimeters, and the thickness of the isolation layer is more than 5 μm.

[0036] The filter-type flexible display device composed of double-sided glass film substrates and its manufacturing method provided by this invention have many advantages. First, it uses a double-layer glass film substrate, and the laser cutting method avoids damage to other films during the cutting of the glass film substrate, thereby improving drop resistance and impact resistance. Second, through the laser cutting method of this invention, the transverse crack length of the glass film substrate is reduced to within 0.5 μm, which is more than ten times shorter than that of the blade cutting method, effectively avoiding edge defects. This simplifies the manufacturing process of this invention, provides excellent flexibility, and avoids glass film breakage or cracking caused by mechanical and thermal shock. Furthermore, this invention does not require additional high-cost materials and complex processes, enabling low-cost manufacturing of flexible display devices. Compared with plastic films, it has advantages such as high cost-effectiveness, simplified processes, increased efficiency, and cost advantages. The cutting method provided by this invention can also produce flexible display devices without increasing the number of processes or equipment precision, possessing both practical and economic value. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the cutting of the double-sided glass thin film substrate of the present invention.

[0038] Figure 2 This is a schematic diagram of the cutting structure of the double-sided glass thin film substrate of the present invention;

[0039] Figure 3 This is a schematic diagram of the thin film structure at the cutting trajectory involved in the embodiments of the present invention;

[0040] In the figure: 1. Upper glass thin film substrate, 2. Lower glass thin film substrate, 3. Electrode lead, 4. Cutting trajectory, 5. Separator layer, 6. BM film, 7. R filter film, 8. G filter film, 9. B filter film, 10. PS spacer film. Detailed Implementation

[0041] This invention employs a double-sided glass thin-film substrate, with each side containing at least one layer of glass thin-film material. In addition to the advantages mentioned above, no changes are required to traditional processes during liquid crystal display (LCD) manufacturing; simply using an appropriate display mode, such as IPS, can achieve high-performance flexible displays. Even with other display modes, their flexibility can be significantly improved. When the thickness of the glass thin-film substrate is reduced to 5 μm, the performance of the LCD will offer advantages such as lightweight, flexibility, long lifespan, and low cost compared to current single-glass substrates with a thickness exceeding 100 μm.

[0042] A filter-type flexible display device composed of double-sided glass thin film substrates includes: two glass thin film substrates disposed opposite to each other; including an upper glass thin film substrate 1 and a lower glass thin film substrate 2;

[0043] Each glass film substrate has at least one layer of glass film;

[0044] A functional film is attached to the inner side of the two glass film substrates, and there is a display material between the two glass film substrates. The outer edge of the sealing portion around the display material does not exceed the outer edge of the smaller glass film substrate.

[0045] Outside the sealed portion, on one side of the glass thin film substrate, electrode leads 3 and an insulating film are attached;

[0046] The drive IC or control IC is connected sequentially via electrode lead 3;

[0047] An isolation layer 5 is provided between the inner side of the glass thin film substrate and the electrode lead 3.

[0048] TN display mode liquid crystal displays can be divided into passive and active categories. In passive displays, applications with color filters are less common, but products with internal silkscreen printing can use the same method. In active displays, TN display mode liquid crystal displays typically have color filters. STN display mode liquid crystal displays are generally passive, with many applications having and not having color filters. STN display modes without color filters are not suitable for the method of this invention, except for products with internal silkscreen printing. PDLC, passive VA, and passive FLC liquid crystal cells with or without color filters are all suitable for this invention. Active products are usually equipped with color filters and are therefore suitable for this invention; in these display modes, displays without color filters in certain applications are not suitable for the solution of this invention.

[0049] This article describes the structure and manufacturing method of a display device.

[0050] In the sealed area, a display electrode, an insulating film, and a display function film are attached to one side of the glass thin film substrate.

[0051] On the other side, a glass thin film substrate is attached with a filter, BM film 6, functional film and common electrode film.

[0052] Display material is placed between two glass thin-film substrates. A thin film is attached to the inner sides of both glass thin-film substrates, and the outer edge of the sealed portion surrounding the display material does not exceed the outer edge of the smaller glass thin-film substrate. Electrode leads 3 and an insulating film are attached to one side of the first glass thin-film substrate.

[0053] The display device uses at least two glass thin-film substrates, with electrodes between the two glass thin-film substrates.

[0054] When cutting the glass thin film substrate, the vertical projection line of the cutting trajectory 4 intersects with the electrode line.

[0055] When manufacturing this display device, laser cutting of a single glass film substrate may cause problems such as melting of conductive materials and short circuits or open circuits, especially when the thickness of the glass film substrate is less than 15 μm.

[0056] Before forming an independent display device, multiple display devices are arranged in an array. These arrays share the same mother substrate, and then they are divided and ICs are bonded together to form an independent display device.

[0057] For thicker substrates, this cutting is relatively easy. When the thickness of a single substrate is less than 50 μm, mechanical cutting can cause many adverse consequences. Laser cutting is usually better, mainly because when cutting one substrate, laser energy radiates to and affects the other substrate. In this invention, it is necessary to eliminate the influence of cutting only one substrate on the other to prevent this effect. To solve this problem, a special isolation layer 5 can be provided, which uses the materials and processes from the manufacturing process to avoid increasing costs. Each display device is connected to a drive or control IC via electrode leads 3. Isolation layers 5 are provided at the intersection of the projection of the cutting line and the electrode lead 3, as well as between the inner side of the substrate being cut and another glass film substrate with the electrode lead 3 attached.

[0058] These isolation layers 5 can be combinations of various filter film materials, electrode materials, patterns, and positions to minimize laser radiation from reaching other substrates and damaging the various thin film layers on the substrates. The isolation layers 5 must not affect various parameters of the liquid crystal cell, such as its thickness and flatness, or the rigidity, toughness, and flexibility of the glass substrate. After cutting, the isolation layers 5 must not remain on the substrate. By fully utilizing the advantages of laser cutting and avoiding the disadvantages of glass thin film substrates, the performance and lifespan of the display can be improved. A filter-type flexible display device is described, consisting of double-sided glass thin film substrates, each substrate having at least one layer of glass thin film, and these films are located on the inner sides of the two opposing substrates.

[0059] Each substrate can have multiple layers of glass film, with plastic films stacked between them. The glass film is located on the innermost side of the entire substrate, utilizing its flatness, while the outer PI film or other plastic films improve its flexibility and shock resistance. This type of flexible liquid crystal display device typically includes color filters such as BM6 film, R filter 7, G filter 8, B filter 9, and PS spacer layers. The color filter (CF) includes a black matrix (BM6), color resists (CR), and photo spacers (PS). It also includes an overcoater (OC), an ITO film, and photo spacers (PS).

[0060] The black matrix serves to block stray light from the liquid crystal layer, preventing color mixing between subpixels and preventing ambient light from reaching the TFT channel (TFT-type liquid crystal display devices). The color photoresist absorbs a portion of the spectrum of natural light, allowing only the matching monochromatic spectrum to pass through, forming the primary colors in a color display. The planarization layer forms a flat plane between BM6 and the R / G / B step differences, improving the alignment uniformity of the liquid crystal and isolating heavy metal impurities in the R filter 7 / G filter 8 / B filter 9 from contacting the alignment layer and contaminating the liquid crystal. The columnar spacers maintain the thickness of the liquid crystal cell; there are generally two types: main PS and auxiliary PS. The thickness of the liquid crystal cell is approximately equal to the height of the columnar spacers. The ITO layer acts as a common electrode in active TN and VA modes, and is connected to the ground line on the circuit board in FFS and IPS modes, used to shield external electric fields and release static electricity. To achieve better flexibility, the thickness of the glass substrate is usually minimized. The thickness of the glass film can be as small as a few micrometers or submicrometers. Liquid crystal display devices made by combining such glass films with plastic films exhibit excellent flexibility. The total thickness of the glass films contained in a single substrate must be less than 50 μm to achieve a certain degree of flexibility.

[0061] This invention relates to a filter-type flexible display device composed of double-sided glass film substrates, with the surrounding sealing portion made of epoxy resin or silicone. The sealing material not only seals the liquid crystal but also maintains uniform thickness of the liquid crystal cell. To ensure the uniformity of the liquid crystal cell, this invention uses an isolation layer 5. The spacing between the isolation layer 5 and the two adjacent substrates is higher than other parts, requiring sufficient adhesion of the sealing portion. Before the substrates are cut, the adhesive strength of the sealing material must be ensured to withstand the peel stress caused by substrate deformation, thereby ensuring effective bonding between the two substrates. After one side of the substrate is cut, the sealing portion restores the original deformed height of the substrate to match the interior of the liquid crystal cell. To achieve optimal results, the thickness of the sealing portion, the sealant, the glass film, and the distance between the isolation layer 5 and the sealing portion all need to be optimized. Although the glass film is bent, it can return to straight after cutting, without causing changes in the thickness of the liquid crystal cell.

[0062] The filter-type flexible display device composed of double-sided glass thin-film substrates typically has an isolation layer 5 consisting of one or more thin films, with the following material composition in sequence: BM film 6, R filter film 7, G filter film 8, B filter film 9, and PS spacer film 10. This order may vary depending on the manufacturing line process. The production sequence of the thin films is consistent with that of the color filters. The shapes of the thin films are formed using photolithography, and they are stacked sequentially to form an isolation layer 5 that is several times higher than the internal CF height of the liquid crystal cell. If the production process of forming the isolation layer 5 separately is incompatible with that of the CF, using different types of materials or different sequences of photolithography processes will result in a significant reduction in production efficiency and a sharp increase in cost.

[0063] In fabricating filter-type flexible display devices composed of double-sided glass thin-film substrates, laser cutting is typically used to divide the substrates, with the dividing lines passing through or adjacent to the insulating layer 5. This ensures that no insulating layer 5 material remains on the display device portion of the divided substrate. Compared to other processing methods, laser cutting has significant advantages in dividing glass thin films because it not only minimizes edge defects but also leaves no residual mechanical stress on the substrate. Only thermal expansion has a temporary effect on the substrate, and this expansion effect disappears as the temperature decreases.

[0064] The manufacturing method of the present invention is used to produce a filter-type flexible display device composed of double-sided glass thin film substrates, and includes the following steps:

[0065] S1: A display panel is formed by a front mother substrate and a rear mother substrate, and the display panel contains multiple display modules:

[0066] The plurality of display modules have functional films attached to the inner sides of two oppositely arranged glass film substrates, and display material is placed between the two glass film substrates. The outer edge of the sealing portion around the display material does not exceed the outer edge of the smaller glass film substrate. Each glass film substrate has at least one layer of glass film. Outside the sealing portion, one side of the glass film substrate is attached with electrode leads 3 and an insulating film. An isolation layer 5 is provided at the intersection of the display module cutting line and the electrode lead 3, and near the inner side of the substrate being cut and between the lead and the electrode lead.

[0067] S2: Form and pattern a thin film for manufacturing an array on a front substrate or a back substrate, including BM, insulating film, metal electrode, transparent electrode, PS and other functional materials. The metal electrode or transparent electrode is also used to manufacture leads extending from the display area. Form and pattern a color filter film on the front substrate or the back substrate.

[0068] The printed or photolithographically sealed area is filled with display material, and the patterned sides of the front and rear mother substrates are bonded together inwards.

[0069] S3: Before forming an independent display device, multiple sub-display modules form an array, which shares the same mother substrate, and then are divided into independent display devices, and then ICs are bonded; each display module is connected to a driver IC or a control IC in sequence through electrode leads 3; in areas without leads, the laser intensity is sufficient as long as it does not damage the surface of the substrate.

[0070] S4: The display module array formed by the bonded mother substrate is laser-cut to obtain a flexible display device of the required size; the laser cutting trajectory is of arbitrary shape; the trajectory of the mother substrate before cutting intersects the vertical projection of the lead wire in the mother substrate after cutting, and the trajectory of the mother substrate after cutting intersects the vertical projection of the lead wire in the mother substrate before cutting.

[0071] S1 Form an array thin film and appropriate pattern on the front or rear mother substrate; The metal electrode film or transparent electrode film has leads extending from the display area and connected to the IC; Form a CF thin film and appropriate pattern on the rear (or front) mother substrate; S2 Print or photolithographically seal the part, fill the display material, and bond the mother substrate; S3 Perform laser cutting on the bonded mother substrate to obtain a single display device of the required size, and the laser cutting trajectory 4 can be of any shape.

[0072] When cutting the front or rear motherboard, both sides can be cut simultaneously or cut in a single layer, but at least one side needs to be cut in a single layer.

[0073] The cutting is achieved by laser cutting, and the dividing line passes through or is adjacent to the isolation layer 5. It is necessary to ensure that the part of the cut substrate remaining in the display device does not have any residual isolation layer 5.

[0074] The isolation layer 5 is formed by creating a region near the intersection of the vertical projections of the rear or front mother substrate. The edge of this region coincides with or is less than two millimeters away from the laser cutting line, and the thickness of the isolation layer 5 is greater than 5 μm. The edge of this region should intersect with or be separated from the laser cutting line by a certain distance, and no substrate residue should remain on the display device after cutting. The isolation layer 5 should be set in this region, and its thickness should be greater than or equal to 5 μm. The thickness of the isolation layer 5 should be greater than the thickness of the liquid crystal cell, and this isolation area must not remain on the substrate of the display device after cutting. The main purpose of this is to prevent the material of the isolation layer 5 from corroding the substrate over time, or for its stress to affect the strength of the substrate. The thickness of the isolation layer 5 should also not affect the bonding strength of the sealing ring, and the plate bending caused by the isolation layer 5 must allow the substrate to return to a flat state after the isolation layer 5 disappears.

[0075] The display device described in this invention is a liquid crystal display device with a light filter. While it is possible to form an isolation layer 5 for a liquid crystal display device without a light filter, this would increase costs significantly, making it difficult to implement in practical applications and generally impractical.

[0076] The manufacturing process of this invention is simple, possesses excellent mechanical strength, and is low in cost. Because the thickness and shape of the isolation layer 5 are easily adjustable, it exhibits high compatibility with various generations or types of production lines. Therefore, it easily reduces the production and material costs of filter-type flexible display devices composed of double-sided glass film substrates. Utilizing the excellent water and gas barrier properties, scratch resistance, and abrasion resistance of the glass film, the lifespan of the flexible display device is significantly improved.

[0077] The above description is merely the preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be included within the scope of protection of the present invention.

Claims

1. A method for manufacturing a filter-type flexible display device composed of double-sided glass thin film substrates, characterized in that: include: Two glass thin-film substrates arranged opposite each other; Each glass film substrate has at least one layer of glass film; A functional film is attached to the inner side of the two glass film substrates, and there is a display material between the two glass film substrates. The outer edge of the sealing portion around the display material does not exceed the outer edge of the smaller glass film substrate. Outside the sealed portion, electrode leads and an insulating film are attached to one side of the glass thin film substrate. Connect the driver IC or control IC sequentially via electrode leads; An isolation layer is provided between the inner side of the glass thin film substrate and the electrode leads; The isolation layer is composed of one or more thin films; the thin film materials are composed of, in order: BM film, R filter film, G filter film, B filter film and PS spacer film; A method for manufacturing a filter-type flexible display device composed of double-sided glass thin film substrates includes the following steps: S1: A display panel is formed by a front mother substrate and a rear mother substrate, and the display panel contains multiple display modules: The plurality of display modules have functional films attached to the inner sides of two oppositely arranged glass film substrates, and display material is placed between the two glass film substrates. The outer edge of the sealing portion around the display material does not exceed the outer edge of the smaller glass film substrate. Each glass film substrate has at least one layer of glass film. Outside the sealing portion, one side of the glass film substrate is attached with electrode leads and an insulating film. An isolation layer is provided at the intersection of the display module cutting line and the electrode lead, and on the inner side of the substrate being cut and between the lead and the electrode lead. S2: Form and pattern a thin film for manufacturing an array on a front substrate or a back substrate, including BM, insulating film, metal electrode, transparent electrode, PS and other functional materials. The metal electrode or transparent electrode is also used to manufacture leads extending from the display area. Form and pattern a color filter film on the front substrate or the back substrate. The printed or photolithographically sealed area is filled with display material, and the patterned sides of the front and rear mother substrates are bonded together inwards. S3: Before forming an independent display device, multiple sub-display modules form an array, which shares the same mother substrate, and then are divided into independent display devices, and then ICs are bonded; each display module is connected to a driver IC or a control IC in sequence through electrode leads; S4: The display module array formed by the bonded mother substrate is laser-cut to obtain a flexible display device of the required size; the laser cutting trajectory is of arbitrary shape; the trajectory of the mother substrate before cutting intersects the vertical projection of the lead wire in the mother substrate after cutting, and the trajectory of the mother substrate after cutting intersects the vertical projection of the lead wire in the mother substrate before cutting. When cutting the front or rear motherboard, both sides can be cut simultaneously or cut in a single layer, but at least one side needs to be cut in a single layer. The isolation layer is set by creating a region near the intersection of the vertical projection of the rear mother substrate or the front mother substrate, with the edge of the region coinciding with or being less than two millimeters apart from the laser cutting line, and the thickness of the isolation layer being 5 μm or more.

2. The method for manufacturing a filter-type flexible display device composed of double-sided glass thin film substrates according to claim 1, characterized in that: The total thickness of the glass film material is less than 50 μm.

3. The method for manufacturing a filter-type flexible display device composed of double-sided glass thin film substrates according to claim 1, characterized in that: The cutting is achieved by laser cutting, and the dividing line passes through or is adjacent to the isolation layer. It is necessary to ensure that the part of the cut substrate remaining in the display device does not have any residual isolation layer.

Images