Formation and bonding of glass components for portable electronic devices

Abstract

Techniques for manufacturing glass components for electronic devices are disclosed. The techniques disclosed herein can be used to modify a glass workpiece to form a three-dimensional glass component, such as a glass cover member. These techniques can include reshaping the glass workpiece, fusing glass layers of the workpiece, or a combination of these operations. Glass components and electronic devices including these components are also disclosed.

Description

[0001] Cross Reference to Related Applications

[0002] This Patent Cooperation Treaty patent application claims priority to U.S. Provisional Patent Application No. 63 / 154,205, filed February 26, 2021, and entitled “Forming and Bonding of Glass Components for Portable Electronic Devices,” and U.S. Provisional Patent Application No. 63 / 126,880, filed December 17, 2020, and entitled “Forming and Bonding of Glass Components for Portable Electronic Devices,” the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0003] The described embodiments relate generally to techniques for forming and bonding glass components of electronic devices. More specifically, the present embodiments relate to techniques that allow for the rapid shaping and / or bonding of glass workpieces. BACKGROUND

[0004] Conventional electronic devices include glass components, such as cover sheets and the like. Some glasses used for cover sheets are hard and scratch resistant. However, these glasses can also have relatively high molding and / or fusion temperatures. As a result, mechanical techniques, such as grinding and polishing, have traditionally been used to shape cover sheets formed from these glasses. SUMMARY

[0005] Techniques for manufacturing glass components for electronic devices are disclosed herein. In embodiments, the techniques disclosed herein can be used to modify a glass workpiece to form a three-dimensional glass component, such as a glass cover member. These techniques can include reshaping the glass workpiece, fusing the glass layers of the workpiece, or a combination of these operations. The present disclosure also relates to glass components and housings, as well as electronic devices including the glass components.

[0006] In some cases, a shaping technique is used to modify the shape of a glass workpiece. By way of example, a first portion of the glass workpiece, which can be a central portion of the glass workpiece, is heated and then shaped between two mold members. The peripheral portions of the workpiece are supported by a frame that is configured to expose the first portion of the glass workpiece. The frame can also help control the movement of the glass workpiece during the molding operation. The mold members can be at a lower temperature than the first portion of the glass workpiece, such that the shaping technique is a non-isothermal shaping technique.

[0007] In contrast to isothermal forming techniques, which gradually bring the glass workpiece and the mold members to the same temperature, this non-isothermal forming technique can produce molded glass parts more quickly. The non-isothermal forming techniques described herein are particularly useful for molding glasses that only become soft enough to be molded at relatively high temperatures. For example, the forming techniques disclosed herein can be used for aluminosilicate glasses and borosilicate glasses.

[0008] In additional cases, a glass workpiece is modified using a bonding technique. By way of example, at least a portion of a workpiece comprising an assembly of glass layers is heated and then pressed between a first tool piece and a second tool piece to fuse the glass layers. The peripheral portions of the workpiece are supported by an open frame configured to allow the first tool piece and the second tool piece to contact the workpiece. The tool pieces can be at a lower temperature than the heated portion of the glass workpiece, such that the bonding technique is a non-isothermal bonding technique. In contrast to isothermal bonding techniques, which gradually bring the glass workpiece and the mold tool pieces to the same temperature, this non-isothermal bonding technique can produce fused glass parts more quickly. Thus, the non-isothermal bonding techniques described herein are particularly useful for bonding glasses that only become fusible at relatively high temperatures.

[0009] The present disclosure provides a method for manufacturing a glass part for an electronic device. The method includes mounting a glass workpiece to an open frame, the glass workpiece being held in the open frame by peripheral portions of the glass workpiece when the glass workpiece is mounted in the open frame and having an exposed first surface and an exposed second surface opposite the exposed first surface. The method also includes heating the glass workpiece to a temperature greater than or equal to a softening point of the glass workpiece and less than or equal to a working point of the glass workpiece. The method further includes hot forming a first portion of the glass workpiece between a cavity mold contacting the exposed first surface and a core mold contacting the exposed second surface to produce a molded glass workpiece, each of the cavity mold and the core mold being heated to a temperature lower than the temperature of the glass workpiece. The method also includes cooling the molded glass workpiece to a temperature lower than a glass transition temperature of the glass workpiece, removing the molded glass workpiece from the open frame, and at least partially removing a second portion of the molded glass workpiece to form the glass part, the second portion including at least some of the peripheral portions.

[0010] The present disclosure also provides a method for manufacturing a glass component for an electronic device, the method comprising placing a workpiece in an open frame, the workpiece comprising an assembly of glass layers. The method further comprises heating at least a portion of the workpiece to a temperature greater than or equal to an annealing point of the glass layers of the assembly and less than or equal to a softening point of the glass layers of the assembly. The method further comprises fusing the assembly of glass layers by pressing the workpiece between a first tooling piece and a second tooling piece, each of the first tooling piece and the second tooling piece being heated to a temperature lower than the temperature of the workpiece, to form a glass component. The method further comprises cooling the glass component to a temperature lower than or equal to a glass transition temperature of the glass component, and removing the glass component from the open frame.

[0011] Additionally, the present disclosure provides an electronic device comprising a housing comprising a back glass cover member, and a sensor assembly coupled to an interior surface of the back glass cover member and comprising a sensor. The back glass cover member comprises a first glass layer defining a base region of an exterior surface of the back glass cover member, and a second glass layer fused to the first glass layer and defining at least a portion of a protruding feature, the portion defining a plateau region of the protruding feature. BRIEF DESCRIPTION OF DRAWINGS

[0012] The present disclosure will become more fully understood from the detailed description given herein below, taken in conjunction with the accompanying drawings, wherein like elements are represented by like reference numerals, and in which:

[0013] Figure 1A An example electronic device comprising a glass component is depicted.

[0014] Figure 1B Another example electronic device is depicted.

[0015] Figure 2 A simplified cross-sectional view of an example glass component manufactured using a forming technique is shown.

[0016] Figure 3A A simplified partial cross-sectional view of another example glass component is shown.

[0017] Figure 3B A simplified partial cross-sectional view of another example glass component is shown.

[0018] Figure 4 A flowchart of a forming process for manufacturing a glass component is shown.

[0019] Figure 5 A series of stages in a process for forming a glass component is schematically shown.

[0020] Figure 6AAn example of an operation to heat a glass workpiece is schematically illustrated.

[0021] Figure 6B Another example of an operation to heat a glass workpiece is schematically illustrated.

[0022] Figure 7A An example heating pattern for a glass workpiece is schematically illustrated.

[0023] Figure 7B Another example heating pattern for a glass workpiece is schematically illustrated.

[0024] Figure 8 An exploded view of a frame supporting a glass workpiece and a core and cavity mold is shown.

[0025] Figure 9 A partial cross-sectional view of an example glass component manufactured using a bonding technique is shown.

[0026] Figure 10 A partial cross-sectional view of another example glass component manufactured using a bonding technique is shown.

[0027] Figure 11 A flowchart of a bonding process for manufacturing a glass component is shown.

[0028] Figure 12A An example of a glass layer for forming a workpiece is shown, and Figure 12B A glass layer assembled to form a workpiece is shown.

[0029] Figure 12C A workpiece placed into an open frame is shown. Figure 12B

[0030] Figure 13A An additional example of a glass layer for forming a workpiece is shown, and Figure 13B A glass layer assembled to form a workpiece is shown.

[0031] Figure 13C A workpiece placed into an open frame is shown. Figure 13B

[0032] Figure 14A , Figure 14B and Figure 14C An example of a heating pattern for heating a workpiece comprising an assembly of glass layers is shown.

[0033] Figure 15 An example of an operation to fuse a workpiece comprising an assembly of glass layers is shown.

[0034] Figure 16 An example heating pattern for a process combining a bonding technique with a forming technique is shown.​​

[0035] Figure 17 A block diagram of a sample electronic device that can incorporate a glass component is shown.

[0036] The use of cross-hatching or shading in the drawings is generally provided to illustrate the boundaries and junctions of the elements of the figure. The presence or absence of cross-hatching or shading therefore does not indicate or mean any preference or requirement for particular material, material properties, element proportions, element dimensions, commonality of like elements, or any other characteristic, attribute, or property of any element shown in the figures.

[0037] Additionally, it is to be understood that the relative and absolute proportions and sizes of the various features and elements (and collections and groupings thereof) and the interposed relationships therebetween, as presented in the drawings, are provided in the drawings merely to facilitate understanding of the various embodiments described herein and as such can not necessarily be presented or shown to scale and are not intended to indicate any preference or requirement for the embodiments shown. DETAILED DESCRIPTION

[0038] Reference will now be made in detail to representative embodiments illustrated in the drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred construction. On the contrary, the intention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the disclosure as defined by the appended claims.

[0039] The following disclosure relates to techniques for manufacturing glass components for electronic devices. In embodiments, the techniques disclosed herein can be used to modify a glass workpiece to form a three-dimensional glass component, such as a glass cover member. These techniques can include reshaping the glass workpiece, fusing glass layers of the workpiece, or a combination of these operations.

[0040] In some cases, the shape of the glass workpiece is modified using a shaping technique, which can also be referred to herein as a thermal shaping technique, a molding technique, a reshaping technique, a hot stamping technique, or a (re)shaping technique. By way of example, a first portion of the glass workpiece, which can be a central portion of the glass workpiece, is heated and subsequently shaped between two mold members. A second portion of the glass workpiece, such as a peripheral portion, is supported by a frame that is configured to expose the first portion of the glass workpiece. The frame can also help control the movement of the glass workpiece during the shaping operation. The mold members can be at a lower temperature than the first portion of the glass workpiece, such that the shaping technique is a non-isothermal shaping technique.

[0041] In additional cases, a glass workpiece is modified using a bonding technique. By way of example, at least a portion of a workpiece comprising an assembly of glass layers is heated and then pressed between a first tool piece and a second tool piece to bond the glass layers. The peripheral portion of the workpiece is supported by an open frame configured to allow the first tool piece and the second tool piece to contact the workpiece. The tool pieces can be at a lower temperature than the heated portion of the glass workpiece, such that the bonding technique is a non-isothermal bonding technique.

[0042] The non-isothermal forming and / or bonding techniques described herein can produce glass components more quickly than isothermal forming and bonding techniques, which bring the glass workpiece and the mold members and / or tool pieces to the same temperature gradually. The non-isothermal forming techniques and / or bonding techniques described herein are particularly useful for forming glasses that only become soft enough to be molded at relatively high temperatures. For example, the techniques disclosed herein can be used for aluminosilicate glasses and borosilicate glasses.

[0043] The present disclosure also relates to glass components and housings and electronic devices comprising these glass components. Although the following description provides examples of glass components that can be used as cover members for electronic devices, in additional examples, the techniques described herein can be used to produce other types of glass components, such as other types of glass housing components.

[0044] These and other embodiments are discussed below with reference to the following drawings. Figures 1A-17 However, those skilled in the art will readily recognize that the detailed description given herein with respect to these figures is for explanatory purposes only and should not be construed as limiting.

[0045] Figure 1A An example electronic device 100 is depicted. In embodiments, the electronic device 100 has a housing 110 that includes a glass cover member or other glass component produced by techniques as described herein. In some embodiments, the electronic device 100 can be a digital media player, a portable media player, and / or a home control device. In additional embodiments, the electronic device 100 can be a computing device (e.g., a desktop, notebook, laptop, or tablet computing device), a mobile phone (also known as a cellular phone), an input device, or another type of portable electronic device. As shown in Figure 1A The form factor of the electronic device 100 is shown in the example to be exemplary and not limiting, and in additional examples, the height can be less than the width and / or length, the width and length of the top surface can be different, or both. Figure 1A The form factor shown in the example of FIG. 1A is exemplary and not limiting, and in additional examples, the height can be less than the width and / or length, the width and length of the top surface can be different, or both.

[0046] AsFigure 1A As shown, the electronic device 100 includes a housing 110, which includes a housing component 112 and a cover 122. The cover 122 may define at least a portion of the front surface 102 of the electronic device and may be referred to as the front cover. In some examples, the housing also includes another cover that defines at least a portion of the rear surface 104 of the electronic device and may be referred to as the rear cover. In embodiments, the cover 122 includes a glass component manufactured using the techniques described herein. In additional examples, the cover may define another outer surface of the electronic device, such as the rear surface, side surface, or two or more of the front, rear, and side surfaces.

[0047] In some embodiments, the cover of the electronic device 100 (such as cover 122) is three-dimensional (e.g., non-planar) or defines an undulating profile. For example, cover 122 may define a peripheral portion that is not coplanar with respect to a central portion. Figure 2 The diagram illustrates an example of the three-dimensional shape of a central portion defining a generally planar surface and a peripheral portion extending from the plane defined by the central portion. The peripheral portion may, for example, define a sidewall of an electronic device housing, while the central portion defines a front surface (which may define a transparent window covering a display). As an additional example, a cover may define a surface protrusion (examples of which are shown in...). Figure 1B (as shown in the diagram), surface recesses and / or one or more curved surfaces. Glass components such as glass cover member 132 can be shaped similarly to their corresponding covers.

[0048] exist Figure 1A In one example, cover 122 is positioned above a display 144 that is at least partially enclosed or surrounded by housing component 112 of housing 110. Cover 122 may define a transparent area for viewing the display. Alternatively or additionally, cover 122 may be integrated with or coupled to a touch sensor configured to detect or estimate the position of a touch portion along the outer surface of cover 122. The touch sensor may include an array of capacitive electrodes positioned beneath cover 122 and, in some cases, may be integrated with the display. In additional examples, cover 122 may be integrated with or coupled to an electronic component that provides alternative or additional functional characteristics. Capacitive and / or other functional characteristics may be associated with planar and / or non-planar areas of cover 122. Figure 17 Additional descriptions of the displays and sensors provided are generally applicable to this document and will not be repeated here.

[0049] Cover 122 includes a cover member 132, which can be referred to as a front cover member. Cover member 132 can extend laterally across cover 122, such as substantially across the width and length of cover 122. Cover member 132 can have a thickness of about 0.3 mm to about 0.75 mm, or about 0.5 mm to about 1 mm. In some embodiments, cover member 132 is a glass component (glass cover member) that can be produced by techniques as described herein. Additional descriptions of glass components provided herein, including descriptions provided for Figure 2 , Figure 3A , Figure 3B , Figure 9 and Figure 10 provided herein generally apply. In additional embodiments, cover member 132 can be formed of one or more materials other than glass, and in some cases can be a glass-ceramic cover member. In some embodiments, cover 122 can define one or more apertures extending through its thickness, with the aperture positioned over another device component, such as a microphone, speaker, optical camera, or sensor component, among others.

[0050] Cover 122 can include one or more coatings applied to the cover member. For example, an anti-reflective and / or anti-fouling coating can be applied to an exterior surface of the cover member. As an additional example, a coating designed to produce a visual effect, such as an opaque masking coating, can be applied to an interior surface of the cover member. In another example, cover 122 can include a laminated material (e.g., in the form of a sheet) applied along an interior surface of cover 122 to provide structural support / reinforcement, electrical functionality, thermal functionality, and / or a visual effect. The laminated material can conform to three-dimensional portions of the cover.

[0051] As shown in Figure 1A , housing 110 also includes a housing member 112, which can also be referred to herein simply as an outer shell. Cover 122 can be coupled to housing member 112. For example, cover 122 can be coupled to housing member using an adhesive, fastener, engagement feature, or a combination thereof.

[0052] In embodiments, housing member 112 at least partially defines side surface 106 of electronic device 100. In the example of Figure 1A , housing member 112 defines all four side surfaces of electronic device 100. Figure 1A Housing member 112 of Figure 1AA vertical line is included to indicate the approximate boundary of the corner region 108. One or more of the corner regions can define a compound curvature. In additional embodiments, the housing member 112 can be positioned inside the electronic device 100, and one or more of the front cover 122 or the back cover can define all or most of the side surfaces of the electronic device. In Figure 1A In examples, the electronic device 100 includes an input device 152, which can be a button or any other input device described herein. The housing component 112 can define an opening for housing the input device. In additional examples, the housing component can define one or more openings in the side surfaces to allow for input or output (audio) from device components such as microphones or speakers, to provide a window for transmission and / or reception of wireless signals, and / or to house electrical ports or connections. Figure 17

[0053] In some embodiments, the housing component 112 can be formed from a single material, and can be a monolithic component. For example, the housing component 112 can be formed from a glass material, a metal material, a ceramic material, a glass-ceramic material, or a polymeric material. In some cases, the housing component is a glass component as described herein. In additional embodiments, the housing component can include multiple members. For example, the housing component can include one or more metal members, one or more glass members, or one or more glass-ceramic members. In some cases, one or more of the glass members can be a glass component as described herein. In some cases, the housing member is formed from a series of metal segments separated by dielectric segments that provide electrical isolation between adjacent metal segments. For example, a dielectric segment can be disposed between a pair of adjacent metal segments. One or more of the metal segments can be coupled to internal circuitry of the electronic device 100 and can function as an antenna for transmitting and receiving wireless communications. The dielectric segments can be formed from one or more dielectric materials such as polymeric, glass, or ceramic materials. As referred to herein, a component or member formed from a particular material such as a glass or metal material can also include a relatively thin coating of a different material along one or more surfaces, such as an anodization layer, a physical vapor deposition coating, a paint coating, a primer coating (which can include a coupling agent), and the like.

[0054] In addition to the display and / or touch screen, the electronic device 100 can include additional components. These additional components can include one or more of a processing unit, control circuitry, memory, input / output devices, a power source (e.g., a battery), a charging assembly (e.g., a wireless charging assembly), a network communication interface, an accessory, a sensor, or another component that is part of a wireless communication system (e.g., an antenna, a transmitter, a receiver, a transceiver, etc.). The components of a sample electronic device are discussed in more detail below with respect to Figure 17 The components of a sample electronic device are discussed in more detail below with respect to​Figure 17 The description provided is applicable in general to the herein.

[0055] Figure 1B Another example of an electronic device 101 is shown. In embodiments, the electronic device 101 has a housing 111 that includes a glass cover member or other glass component produced by techniques as described herein. The electronic device 101 can be any of the electronic devices previously described for electronic device 100, and can have any of the form factors previously described for that device.

[0056] As Figure 1B shown in FIG. 1 1 1, the housing 1 1 1 includes a cover 123. The cover 123 includes a cover member 133. The cover member 133 can define at least a portion of the front surface 103 of the electronic device, and can be referred to as a front cover member. The cover member 133 can extend laterally across the cover 123, such as substantially across the width and length of the cover 123. In some embodiments, the cover member 133 is a glass component (glass cover member) that can be produced by techniques as described herein. In additional embodiments, the cover member 133 can be formed of one or more materials other than glass, and in some cases can be a glass-ceramic cover member. The glass cover member 133 can be shaped similarly to the cover 123.

[0057] In Figure 1B the example of FIG. 1 1 1, the cover 123 defines a raised portion 127 that is raised relative to another portion 126 of the cover. The raised portion 127 can also be referred to herein as a raised feature or simply a feature. More generally, a glass component, such as the cover member 133, can define one or more features that vary in height relative to an adjacent portion or region of the glass component. In some embodiments, a feature formed to a different height than an adjacent portion of the glass component can define a raised or recessed portion. In some cases, a device component, such as a sensor assembly, camera assembly, or the like, can be disposed under a raised feature. The size of the raised portion 127 can depend at least in part on the size of the device component underneath the raised feature. In some embodiments, the lateral dimension (e.g., width) of the raised feature can be from about 2 mm to about 10 mm, from about 5 mm to about 30 mm, from about 10 mm to about 20 mm, or from about 15 mm to 30 mm.

[0058] In Figure 1B the example of FIG. 1 1 1, the raised feature 127 is shown as a generally curved or rounded shape. However, this example is not limiting, and in other examples (e.g., Figure 3BIn the case of the cover, the protruding feature may define a top that is substantially platform-shaped. The platform-shaped top may be substantially parallel to the outer surface defined by the adjacent portion of the cover. The amount of protrusion or offset between the top of the protruding portion 127 and the outer surface of the adjacent portion of the cover may be from about 0.5 mm to about 1.5 mm or from about 0.75 mm to about 2 mm.

[0059] When the glass covering member 133 is formed similarly to the cover 123, the glass covering member 133 may also define a protruding feature. Figure 3A , Figure 3B , Figure 9 and Figure 10 A non-limiting example of a glass covering member defining the protruding features is shown in the cross-sectional view.

[0060] In some examples, the cover member 133 defining the protruding feature has substantially the same thickness as the adjacent portion of the cover member. In some cases, the cover member 133 is produced by reshaping a glass workpiece of substantially uniform thickness to form the protruding feature. Figure 3A and Figure 3B As shown in the cross-sectional view, the resulting protruding features may be convex on the exterior of the cover member and concave on the interior of the cover member. In the example, the thickness of the cover member may be greater than about 0.3 mm and less than about 0.75 mm in both portions 127 and 126 of the cover 123, or greater than about 0.5 mm and less than about 1 mm.

[0061] In the additional example, the thickness variation of the covering member 133 is shown. For example... Figure 9 and Figure 10 As shown in the cross-sectional view, the cover member 133 may have a greater thickness in the protruding portion than in the adjacent portion. In some cases, such as Figures 12A-12C As shown in the example, the cover member 133 is at least partially formed by bonding multiple glass layers, and the difference in the number of glass layers results in a difference in the thickness of the cover member 133. In an embodiment, the cover member 133 may have a thickness in the protrusion portion 127 that is at least 10%, 25%, or 50%, and up to about 250%, greater than the thickness of the cover member in the portion 126 of the cover 123. In some cases, the thickness of the thicker portion of the cover 123 (including the protrusion feature) is greater than about 1 mm and less than or equal to about 2 mm or about 2.5 mm. The thickness of the portion 126 of the cover 123 may be greater than about 0.3 mm and less than about 0.75 mm, or greater than about 0.5 mm and less than about 1 mm.

[0062] In some embodiments, the cover 123 can define one or more holes extending through its thickness, also referred to herein as through-holes. The one or more holes can facilitate positioning of one or more device components, such as a speaker or a camera assembly or an optical module of a sensor assembly. In some cases, the holes can be formed into the protruding features 127, and the device components can extend at least partially into the holes in the protruding features. By way of example, the electronic device can include one or more optical modules selected from among a camera module, an optical sensor module, an illumination module, and a (non-optical) sensor. In some examples, a window can be disposed over the hole to protect the underlying device component. When the glass cover member 133 is similarly shaped as the cover 123, the glass cover member can also define one or more through-holes, non-limiting examples of which are shown in the examples of FIGS. 1 15, 1 16, and 1 17. Figure 3B 、 Figure 9 and Figure 10 .

[0063] In some cases, the cover 123 can be integrated with or coupled to a touch sensor or another electronic device component that provides a functional property to the cover. The cover 123 can include one or more coatings applied to the cover member, and these coatings can be similar to the coatings described previously for the cover 122. In some examples, the cover 123 can include a laminated material applied along the interior surface of the cover 123 in a similar manner as described for the cover 122. Figure 1A

[0064] The housing 111 of the electronic device 101 also includes a housing member 113. The housing member 113 can at least partially define the side surface 107 of the electronic device 100. In the example of FIG. 1 13, the housing member 113 defines all four side surfaces of the electronic device 101. Figure 1B Figure 1B The housing member 113 of FIG. 1 13 also defines the corner regions 109. The housing member can be similar in construction and materials to the housing member 112, and those details are not repeated here.

[0065] In addition to the display and the camera assembly, the electronic device 101 can also include additional components. For example, the electronic device can include one or more sensor assemblies and / or camera assemblies. As additional examples, the electronic device can include one or more of a processing unit, a control circuit, a memory, an input / output device, a power source (e.g., a battery), a charging assembly (e.g., a wireless charging assembly), a network communication interface, an accessory, and a sensor. The components of the sample electronic device are discussed in more detail below with respect to FIG. 1 18, and the description provided with respect to FIG. 1 18 generally applies herein. Figure 17 Figure 17

[0066] Figure 2 ​​​​A simplified cross-sectional view of example glass component 232 is shown. Glass component 232 defines a three-dimensional shape and can be... Figure 1A Example of covering member 132. A cross-sectional view can be taken along... Figure 1A The three-dimensional shape of glass component 232 can be described as a "dish" shape.

[0067] Glass component 232 can be described as defining a central portion of a generally flat plane and a peripheral portion extending from the central portion of the generally flat plane. For example... Figure 2 As shown, the glass component 232 includes a central portion 292 and a peripheral portion 294 extending from the plane defined by the central portion 292. The central portion 292 and the peripheral portion 294 are continuous. Figure 2 The peripheral portion 294 shown defines an angle relative to the generally planar center portion 292 (as seen in the cross-sectional view). The peripheral portion 294 may therefore be referred to herein as the angled portion. Figure 2 In the example, the peripheral portion 294 defines an obtuse angle relative to the central portion of the generally flat plane, but this example is not limiting, and in some embodiments, the peripheral portion may define a ninety-degree angle or an acute angle relative to the central portion. Figure 2 The three-dimensional shapes shown are exemplary and not limiting, and the techniques described herein can be used to produce a variety of three-dimensional shapes, including those in which the central portion is curved rather than planar.

[0068] exist Figure 2 In the example, glass component 232 defines inner and outer surfaces (242, 244) that are generally planar in the central portion 292 of the cover and curved in the peripheral portion 294 of the cover. As shown, the inner and outer surfaces in the peripheral portion are curved generally toward the interior of the electronic device. In other words, the curvature defined by the inner and outer surfaces in the peripheral portion is concave relative to the interior of the electronic device. Figure 2 As shown, the central portion 292 includes a central outer surface 244a and a central inner surface 242a. The peripheral portion 294 includes a peripheral outer surface 244b, a transition inner surface 242b, and a peripheral inner surface 242c. The peripheral inner surface 242c is offset from the central inner surface 242a; the transition inner surface 242b provides a transition between the peripheral inner surface 242c and the central inner surface 242a. The curvature and / or bending length of the peripheral outer surface 244b and the transition inner surface 242b are not limited to... Figure 2 Examples are provided, and the curvature and / or bending length may be greater than or less than the curvature and / or bending length shown.

[0069] In some cases, glass components have smooth surfaces. When the roughness of the glass component is proportional to the arithmetic mean height (e.g., R...), the surface roughness is significantly reduced. a or S a When measuring, one or more surfaces of the glass component may have a surface roughness greater than zero and less than about 250 nm, 150 nm, 100 nm, 50 nm, 25 nm, or 10 nm. The glass component may also have sufficiently high transmittance and sharpness to ensure that the high-resolution graphics produced by the display are not distorted.

[0070] Typically, glass components are formed from silica-based glass materials. The glass material may have a network structure, such as a silicate-based network structure. As mentioned herein, “glass covering component,” “glass component,” “glass workpiece,” “glass sheet,” “glass layer,” and / or “glass piece” may contain relatively small amounts of impurities or crystalline material, such as 1% or less, 2% or less, or 5% or less by weight of the component.

[0071] In some embodiments, the glass material includes aluminosilicate glass. As used herein, aluminosilicate glass includes the elements aluminum, silicon, and oxygen, but may also include other elements. Typically, the glass material includes ion-exchangeable glass materials, such as alkali metal aluminosilicate glasses (e.g., lithium aluminosilicate glasses). Ion-exchangeable aluminosilicate glasses may contain monovalent or divalent ions that compensate for the charge resulting from the substitution of silicon ions by aluminum ions. Suitable monovalent ions include, but are not limited to, alkali metal ions, such as Li. + Na + Or K + Suitable divalent ions include alkaline earth ions, such as Ca2+. 2+ or Mg 2+ In some implementations, the glass material includes crystallizable glass.

[0072] Figure 3A A simplified partial cross-sectional view of an example glass component 333 is shown. Glass component 333 defines a three-dimensional shape including the protruding feature 327. Glass component 333 may be designed for… Figure 1B An example of the glass covering member 133 is described, and the cross-sectional view can be viewed along... Figure 1B BB in the middle. Figure 3A The shapes of the protruding features shown are exemplary and not limiting, and the techniques described herein can be used to produce a variety of three-dimensional shapes.

[0073] The protrusion 327 protrudes relative to the adjacent portion 326 of the glass component 333. For example... Figure 3AAs shown in FIG. 3, the protruding portion 327 defines a top portion 346. Each of the outer surface 344 and the inner surface 342 of the glass component 333 define a curved profile at the protruding portion 327. At the protruding portion 327, the outer surface 344 is convexly curved and the inner surface 342 is concavely curved.

[0074] In Figure 3A In examples, the protruding portion 327 has about the same thickness as the adjacent portion 326 of the glass component. Figure 3A Examples are not limiting, and in additional examples, the protruding portion can be thicker or thinner than the adjacent portion of the glass component. Figure 9 and Figure 10 An example of a glass component having a thicker protruding portion is shown.

[0075] Figure 3B A simplified partial cross-sectional view of another example glass component 334 is shown. The glass component 334 defines a three-dimensional shape that includes a protruding feature 336. The glass component 334 can be Figure 1B an example of the cover member 133 of FIG. 1, and the cross-sectional view can be taken along Figure 1B B-B in FIG. 1. For simplicity, Figure 3B only one through hole 362 is shown in FIG. 3, but the protruding feature can include additional through holes as previously described with respect to Figure 1B FIG. 2. Figure 3B The shape of the protruding feature shown in FIG. 3 is exemplary and not limiting, and the techniques described herein can be used to produce a variety of three-dimensional shapes.

[0076] The glass component 334 defines an outer surface 344 and an inner surface 342. The glass component also includes a base portion 339 that defines a base region 349 of the outer surface 344. The glass component 334 also defines a protruding feature 336 that protrudes relative to the base region 349, and defines a top region 347 and a side region 348 of the protruding feature 336. As Figure 3B As shown in the cross-sectional view of FIG. 3, the protruding feature 336 defines a convex outer surface and a concave inner surface. The thickness of the base portion 339 of the glass component 334 is about the same as the thickness of the protruding feature 336. In embodiments, the cover member 334 is produced by reshaping a glass workpiece of substantially uniform thickness to form the protruding feature 336.

[0077] As previously discussed, the present disclosure provides shaping techniques that can be non-isothermal shaping techniques. Figure 4 A flowchart of an example process 400 for manufacturing a glass component by forming a glass workpiece is shown. The process 400 can be performed at several stations, such as Figure 5The time spent at each station can be limited to produce the glass part more quickly. For example, the time spent at each station can be 30 seconds or less, 20 seconds or less, 2 to 30 seconds, or 5 to 20 seconds.

[0078] In some cases, the glass workpiece (which can also be referred to herein as a blank or preform) can be a glass sheet that is substantially flat and has a substantially uniform thickness. In some examples, the glass workpiece can have a thickness of about 300 microns to about 2 mm, about 300 microns to about 1 mm, about 0.3 mm to about 0.75 mm, about 0.5 mm to about 1 mm, or about 0.5 mm to about 1.5 mm. In additional cases, the glass workpiece can have a non-uniform thickness, and / or can have a shape other than a flat shape. For example, the shape of the glass workpiece can be engineered to facilitate the forming process. The glass workpiece can have a lateral dimension that is greater than a lateral dimension of the glass part to facilitate placement of the glass workpiece in a frame, as described in more detail below. The glass workpiece can be formed from any of the glass materials described previously for the glass part. Figure 2 The glass workpiece can be cleaned prior to placement in the frame, and / or can be treated using one or more surface treatments such as etching and plasma treatment, in some examples. The glass workpiece can have a smooth surface finish to provide good contact between the glass workpiece and the mold surface and / or to minimize polishing in the finishing operation 412. As an example, the glass workpiece can have a surface roughness (e.g., R a or S a ) of greater than zero and less than about 250 nm, 150 nm, 100 nm, 50 nm, 25 nm, or 10 nm.

[0079] The process 400 includes an operation 402 of placing the glass workpiece in a frame. As shown in Figure 8 , the frame generally contours around a peripheral portion of the glass workpiece and is open over a central portion of the glass workpiece. The frame can be open over both faces of the central portion of the glass workpiece and thus can be referred to herein as an open frame. The open frame can expose a portion of the glass workpiece to be molded, which can also be referred to herein as the central portion of the glass workpiece. The frame generally supports the peripheral portion of the glass workpiece. As shown schematically in Figure 5 , the frame carries the glass workpiece through the operations of the process 400.

[0080] In some cases, the frame includes two parts, and the glass workpiece is placed between the two parts, as shown in Figure 6A , Figure 6B and Figure 8frame in the example shown in FIG. 1. This type of frame can also be referred to herein as a sandwich frame. In additional cases, the frame can be formed from a single member that forms a tray that supports the glass workpiece. The portion of the frame or frame member that faces the glass workpiece can also be referred to herein as the face of the frame or frame member.

[0081] When the glass workpiece is held horizontally, the frame can include an upper frame member and a lower frame member. In some embodiments, the sandwich frame constrains movement of the peripheral portion of the glass workpiece. This movement (e.g., float) can be in directions parallel to the face of the frame (referred to as x and y directions) and / or in a direction perpendicular to the face of the frame (referred to as a z direction). In some cases where the glass workpiece moves within the frame during the forming process, some of the peripheral portions that are positioned within the frame prior to the forming process can be drawn into contact with the cavity mold and the core mold during the forming process. Thus, the size of the exposed central portion and the size of the peripheral portion within the frame can change during the forming process. As an example, the frame can control the movement of the glass workpiece due to the weight of the upper frame member located on the glass and / or due to the application of pressure to compress the two frame members against the glass workpiece. The pressure can be applied by mechanical elements such as springs, cam locks, clamping bolts at a specified torque, etc. Additional compressive forces can be generated by the expansion of the frame and / or the glass material during heating.

[0082] The frame is typically constructed to withstand elevated temperatures. In cases where the frame experiences significant heating during the process 400, the members of the frame can be formed from one or more materials such as high purity chromium (e.g., purity of at least 99.95%), a noble metal (e.g., Pt, Rd, Ir, or alloys thereof such as Pt-Ir), or a ceramic material such as tungsten carbide, alumina, zirconia, etc. For example, the members of the frame can be formed from bulk chromium or a ceramic material. In some cases, a noble metal or ceramic coating can be applied to these bulk chromium or ceramic members, or to members made from a metal or alloy that is less temperature sensitive. In other cases where the frame is somewhat shielded from heating during the process 400, the members of the frame can be formed from other materials such as nickel-based superalloys such as or alloys.

[0083] The process 400 also includes an operation 404 of heating the glass workpiece. The operation 404 can include one or more heating stages. The number of heating stages can depend on the composition and / or shape of the glass part. Figure 5The process schematically illustrates a series of heating stages (504, 506, and 508) preceding the forming operation. In some embodiments, at least a portion of the glass workpiece is heated to a sufficiently high temperature to soften it for forming operation 406. Operation 404 can be performed in an air atmosphere or in a vacuum or inert gas atmosphere (e.g., nitrogen, argon, and mixtures of these gases).

[0084] Glass workpieces can be heated in a variety of ways. In some cases, glass workpieces can be heated by radiation and / or heat conduction. In some examples, a pair of heaters can be used to heat a horizontal glass workpiece from above and below, such as... Figure 6A and Figure 6B The image is shown schematically. The heater may be an infrared heater. In some cases, the heater may include an induction heating sensor. In additional examples, the glass workpiece may be heated using a laser, a direct flame, or a combination of one or more heating methods.

[0085] Operation 404 can heat the entire glass workpiece or heat a specific area of ​​it. In some cases, the entire central portion of the glass workpiece can be heated, such as... Figure 6A The diagram is schematically shown. In additional cases, heating can be concentrated on the portion of the glass workpiece where the greatest deformation and / or reshaping will occur. Figure 6B An example of a heated area confined to the periphery of a central region is shown.

[0086] For silicate glasses, viscosity versus temperature graphs can be used to identify temperatures associated with glass deformation. For example, the strain point (viscosity approximately 10) 14.5 Annealing temperature (poise) is the temperature at which the internal stress of glass is reduced, measured in hours. Annealing point (viscosity approximately 10) 13.2 Park to 10 13.4 Poisson's temperature is the temperature at which internal stress in glass is reduced, measured in minutes. The glass transition temperature (when viscosity is approximately 10⁻⁶) is the temperature at which internal stress in glass is reduced. 12 Park to 10 13 Poisson's temperature is the temperature at which glass transitions from a supercooled liquid to a glassy state. The softening point increases from approximately 10°C. 9 Park to 10 11 The viscosity of Poisson is limited, while the softening point of Littleton is approximately 10. 7.6 The viscosity of the poise is limited; the term "softening point" as used herein may refer to any of these temperatures. The operating point is approximately 10... 4 The viscosity is limited by poise. The melting range can be from approximately 10. 1.5 berth to about 10 2.5 Viscosity limitation of Poisson.

[0087] In some cases, at operation 404, at least a portion of the glass workpiece can be heated to a temperature range from a softening point of the glass workpiece to a working point of the glass workpiece. In additional cases, at operation 404, at least a portion of the glass workpiece can be heated to a temperature range from a working point of the glass workpiece to a melting point. In some cases, the glass workpiece can be heated to a temperature of about 800 °C to about 1000 °C. The temperature can be controlled such that the glass workpiece does not sag excessively before reaching a mold of a forming process. As an example, an alumino-silicate glass, such as an alkali alumino-silicate glass, can have a strain point of about 525 °C to about 575 °C; an annealing point of the alumino-silicate glass can be about 600 °C to about 650 °C, and a working point can be greater than 1000 °C, such as about 1100 °C to about 1300 °C. A glass transition temperature can be about 575 °C to about 625 °C. As an additional example, an alumino-silicate glass can be configured to have a lower working temperature and glass transition temperature, such as a working temperature of about 900 °C to about 1100 °C, a glass transition temperature of about 500 °C to about 550 °C. In some cases, the (maximum) temperature to which the glass workpiece is heated prior to forming can be referred to as a first temperature.

[0088] The process 400 also includes an operation 406 of forming a portion of the glass workpiece to form a molded glass workpiece. Operation 406 can also be referred to herein as a hot forming operation, a molding operation, a re-shaping operation, a hot stamping operation, or a forming operation, and the molded glass workpiece can also be referred to herein as a re-shaped or re-shaped glass workpiece, or simply a molded, re-shaped, or re-shaped glass workpiece. In some embodiments, at least a portion of the glass workpiece is deformed between a plurality of mold members to produce the molded glass workpiece. For example, the portion of the glass workpiece can be deformed between a cavity mold and a core mold, examples of which are shown in Figure 8 The glass workpiece can be deformed by bending, stretching, flowing, or in some cases a combination of these. The formed portion of the glass workpiece can also be referred to as a first portion of the glass workpiece, and the formed portion of the molded glass workpiece can also be referred to as a first portion of the molded glass workpiece.

[0089] A pressure can be applied between the mold members, such as a cavity mold and a core mold. For example, the pressure can be applied in a press or other forming device. In some embodiments, additional energy can be supplied to the glass workpiece during the forming operation to promote glass flow and / or formability. For example, in some cases, operation 406 can be assisted by using ultrasonic vibrations. The forming process can be completed in 10 seconds or less, such as in a time of about 2 seconds to about 7 seconds, or about 3 seconds to about 5 seconds. Operation 406 can be performed in an air atmosphere or in a vacuum or inert gas atmosphere.

[0090] When the glass workpiece begins the shaping operation 406, at least a portion of the glass workpiece is at a temperature at which the glass is deformable. In some cases, this portion of the glass workpiece can be at a temperature from the softening point of the glass workpiece to the working point of the glass workpiece. When the shape change during shaping of the glass workpiece is achieved primarily through bending, a temperature about equal to the softening point of the glass workpiece can be useful. When the shape change during shaping of the glass workpiece is achieved primarily through stretching but the glass workpiece maintains a substantially uniform thickness, a temperature about equal to the working point of the glass workpiece can be useful. When the shape change during shaping of the glass workpiece is achieved primarily at least in part through flow of the glass material of the glass workpiece, a temperature in a range from the working point to the melting point of the glass workpiece can be useful. In cases where high shear rates cause shear thinning, sufficient viscous flow can occur at a lower temperature than other possible temperatures.

[0091] Each of the mold members can be heated to a temperature lower than the temperature of the glass workpiece. For example, each of the cavity mold and the core mold can be heated to a temperature within about 75 °C, 50 °C, or 25 °C of the glass transition temperature for the glass workpiece. In some cases, the cavity mold and the core mold can be heated to a temperature of 500 °C to 600 °C. In some embodiments, the mold temperatures can not be uniform, such as when one or more mold temperatures are configured to locally control the viscosity to facilitate and / or limit deformation of the glass workpiece. Thus, during the shaping operation, contact between the glass workpiece and the cooler cavity mold and core mold can begin to cool the glass workpiece to help maintain the shape change from the shaping operation. The cooling of the glass workpiece within the mold can be rapid compared to the rate of cooling in a subsequent cooling operation. The molded glass workpiece can be cooled to a temperature within about 50 °C or 25 °C of the glass transition temperature for the glass workpiece before the molded glass workpiece (in the frame) is removed from the mold. In some cases, the (maximum) temperature to which the mold members are heated prior to shaping can be referred to as a second temperature.

[0092] In some cases, during the shaping operation, the peripheral portion of the glass workpiece can tend to move within the frame. In embodiments, the movement of the peripheral portion of the glass workpiece within the frame is controlled by the weight of the frame components located on the glass, and / or due to the application of pressure to compress the two frame components against the glass workpiece. Pressure can be applied to compress the two frame components against the glass workpiece, as previously discussed with respect to operation 402. The peripheral portion of the glass workpiece can define a peripheral portion of the molded glass workpiece, which is also referred to herein as a flange of the molded glass workpiece.

[0093] In some cases, the cavity of the cavity mold defines surfaces having different orientations. In some examples, the cavity of the cavity mold can be defined by a substantially planar recessed surface and a wall surface extending from the planar recessed surface.Figure 8 An example of this shape is shown. A first region of the glass workpiece can be molded against a recessed surface of a flat surface, and a second region of the glass workpiece can be molded against a wall surface. The first and second regions can be located within the central portion of the glass workpiece.

[0094] The first region of the glass workpiece can constitute a first part of the glass component, such as the central portion 292 of glass component 232 or the platform of the protruding portion 336 of glass component 334. The second region of the glass workpiece can constitute a second part of the glass component extending from the first part, such as... Figure 2 The peripheral portion 294 of the glass component 232 in the middle Figure 3B The side of the protruding feature 336 in the middle.

[0095] Cavity molds and core molds are typically constructed to withstand elevated temperatures. In some cases, these molds can be formed from one or more materials, such as high-purity chromium (e.g., with a purity of at least 99.95%), noble metals (e.g., Pt, Rd, Ir, or alloys thereof, such as Pt-Ir), or ceramic materials, such as tungsten carbide, alumina, zirconium oxide, etc. Ceramic materials can have finer grains. For example, these molds can be formed from bulk chromium or ceramic materials having a noble metal coating, a noble metal alloy coating, or a ceramic coating on the core and cavity surfaces. Examples of suitable coatings include, but are not limited to, coatings of one or more of noble metals and noble metal alloys (such as Pt-Ir), oxides (such as alumina), nitrides (such as titanium nitride or titanium aluminum nitride), carbonitrides (such as titanium carbonitride), etc.

[0096] In some cases, the surfaces of the mold and / or glass workpiece can be modified to help control the movement of the glass workpiece against the mold. Modifications can include one or more of temporary or permanent coatings, textures, gas cushions / sliding planes, etc. For example, a coating can be applied to all or part of the glass workpiece surface to reduce friction between the glass workpiece surface and the mold surface. Suitable coatings include, but are not limited to, graphite or boron nitride powder coatings, or evaporable coatings that create a gas cushion between the glass workpiece surface and the mold surface. As an additional example, the mold surface can be coated to reduce friction or textured to increase friction between the mold surface and the glass workpiece.

[0097] Process 400 includes an operation 408 that cools the molded glass workpiece after operation 406 and before operation 410, which removes the molded glass workpiece from the frame. Operation 408 may cool the molded glass workpiece to ambient temperature (e.g., room temperature, about 25°C), an ambient temperature range, or a temperature range sufficiently below the glass component's transition temperature (e.g., strain point or glass transition point). Operation 408 may include, for example, Figure 5 The diagram illustrates several stages.

[0098] Process 400 can include additional operations to produce the glass component from the molded glass workpiece. For example, process 400 can include one or more finishing operations 412. In some cases, the one or more finishing operations include a trimming operation. In the trimming operation, a portion (e.g., a second portion) of the molded glass workpiece can be at least partially removed or trimmed from another portion (e.g., a first portion) of the molded glass workpiece. For example, at least some of the peripheral portions of the molded glass workpiece can be removed to obtain a desired shape of the glass component. As a particular example, the peripheral portions (e.g., flanges) of the molded glass workpiece formed using a mold similar to the mold shown in FIG. 2A can be removed to produce a glass component having a shape similar to the shape shown in FIG. 2B. The first portion (for the trimming operation) of the molded glass workpiece can define a central portion of the glass component (e.g., central portion 292 of glass component 232) and a peripheral portion of the glass component (e.g., peripheral portion 294 of glass component 232 in FIG. 2B). Any suitable separation technique can be used during the trimming operation, such as a laser separation process, a mechanical separation process, or a combination thereof. Figure 8 Figure 2 Figure 2

[0099] The one or more finishing operations 412 can optionally include an operation to form one or more through holes (e.g., through holes 362 in FIG. 3B) through the glass component. The operation to form the through holes can employ any suitable process, such as a mechanical process, a laser-based process, or a combination thereof. In additional examples, the one or more finishing operations 412 can include one or more cleaning, polishing, and / or texturing operations. Figure 3B

[0100] In some embodiments, process 400 can also include an annealing operation to relieve residual thermal stresses from the heating and shaping operations. The annealing operation can be performed while the molded glass workpiece is in the frame or after the molded glass workpiece is removed from the frame.

[0101] In additional examples, process 400 can include a chemical strengthening operation. The glass component can be chemically strengthened by one or more ion exchange operations. During the ion exchange operations, ions present in the glass component can be exchanged with larger ions in a region extending from a surface of the glass component. This ion exchange can form a compressive stress layer (or region) extending from the surface of the glass component. In some embodiments, a compressive stress layer is formed at each of the outer and inner surfaces of the glass component. A tensile stress layer can be formed between these compressive stress layers.

[0102] Figure 5 ​​​​A series of stages in a process 500 for forming a glass component is schematically illustrated. Figure 5 The process 500 illustrated in FIG. 5 can be for forming a glass component as described above in connection with Figure 4 The process 400 described above. The glass workpiece 552 and the frame 572 can be transferred from one stage to another by automated equipment to reduce the overall time of the process 500.

[0103] As described above in connection with Figure 5 In stage 502, the glass workpiece 552 is placed into the frame 572. Stage 502 can correspond to the operation 402 of Figure 4 The glass workpiece 552 and the frame 572 can be any of the glass workpieces and frames described above in connection with Figure 4 In some cases, the glass workpiece 552 and the frame 572 can be placed into the cell prior to the next stage in the process 500. Figure 5 Figure 6A and Figure 6B In some cases, the glass workpiece 552 and the frame 572 can be placed into the cell prior to the next stage in the process 500.

[0104] The glass workpiece 552 is heated in stages 504, 506, and 508 while the glass workpiece 552 is in the frame 572. Stages 504, 506, and 508 can correspond to the operation 404 of Figure 4 As discussed previously in connection with Figure 4 The number of heating stages can depend on the composition and / or shape of the glass component, and is not limited to the number of stages illustrated in FIG. 5. Generally, at least a portion of the glass workpiece 552 is heated to a higher temperature in stage 506 than in stage 504, and is heated to a higher temperature in stage 508 than in stage 506. The glass workpiece can be heated as described above in connection with Figure 5 and is not repeated here. Figure 4

[0105] The glass workpiece 552 is shaped during stage 510 while the glass workpiece 552 is in the frame 572. Stage 510 can correspond to the operation 406 of Figure 4 As described previously in connection with Figure 4 The glass workpiece 552 can be shaped between a cavity mold and a core mold, and the shaping operation can be performed in a press. The mold in which the glass workpiece 552 is shaped can be cooler than the heated glass workpiece, allowing the shaping and cooling of the glass workpiece to occur simultaneously within the mold. The cooling of the glass workpiece within the mold can be rapid compared to the subsequent cooling stage 512.

[0106] ​​After stage 510, the molded glass workpiece is allowed to cool during stages 512 and 514. Stages 512 and 514 can correspond to operations 408 of Figure 4 The number of cooling stages is not limited to the number of stages shown in Figure 5 and in additional examples, more or fewer cooling stages can be used. The molded glass workpiece can be cooled as described for Figure 4 and that description is not repeated here.

[0107] After stage 514, the molded glass workpiece 562 is removed from the frame 572 in stage 516. Stage 516 can correspond to operation 410 of Figure 4 As previously described for example 4, the molded glass workpiece 562 can be subjected to one or more of a finishing operation, an annealing operation, and a chemical strengthening operation.

[0108] Figure 6A A cross-sectional view of an operation to heat a glass workpiece is schematically illustrated. Figure 6A The glass workpiece 652 is horizontally held in a frame 672 that exposes a first surface 654 and a second surface 655 of the glass workpiece. In particular, the frame 672 holds a peripheral portion 694 of the glass workpiece 652 and exposes a central portion 692.

[0109] In the example of Figure 6A a pair of heaters 682 are used to heat the glass workpiece 652 from above and below. The heaters 682 and the frame 672 are sized such that a surface of each of the heaters that faces the glass workpiece fits within an opening defined by the frame 672 (see opening 875 of Figure 8 The heaters 682 can be configured to generate a heated region that includes the entire central portion of the glass workpiece, as schematically illustrated in Figure 7A In the example of Figure 6A each of the heaters 682 includes an internal heating element 683.

[0110] Figure 6B A cross-sectional view of another operation to heat a glass workpiece is schematically illustrated. Figure 6B The glass workpiece 652 is horizontally held in a frame 672 that exposes a first surface 654 and a second surface 655 of the glass workpiece. As previously described for Figure 6A the frame 672 holds a peripheral portion 694 of the glass workpiece 652 and exposes a central portion 692. In Figure 6BIn the example, a pair of heaters 684 are used to heat the glass workpiece 652 from above and below. The heaters 684 and the frame 672 are sized such that the surface of each heater facing the glass workpiece fits within an opening defined by the frame 672. The heaters 684 can be configured to create a heated area confined to the periphery of the central portion of the glass workpiece, such as... Figure 7B It is illustrated schematically. Figure 6B In the example, each heater in heater 684 includes an internal heating element 685.

[0111] Figure 7A The diagram schematically illustrates localized heating of the entire central portion of the glass workpiece 752. Shading indicates the heated area 762 of the glass workpiece. Figure 7A As shown, the heated area 762 extends over the entire central portion 756 of the glass component. Figure 7A This could be an example of localized heating during operation 404 of process 400. The heated region 762 can define the heating mode for the glass workpiece. In some examples, maximum deformation and / or reshaping occurs near the dashed line 742. In some cases, the dashed line may also indicate the periphery of the glass component. During at least a portion of the process cycle for thermoforming the glass workpiece, the peripheral portion 754 of the glass workpiece can be actively cooled or heated to a lesser extent than the central portion.

[0112] Figure 7B The diagram schematically illustrates localized heating of a portion of the glass workpiece 752 smaller than its entire center. Shading indicates the heated area 764 of the glass workpiece. Figure 7B In the example, the heated region 764 is confined to the periphery of the central portion 756 of the glass workpiece and around the dashed line 742. The heated region 764 can roughly correspond to a localized deformation region of the glass workpiece. When the glass component has... Figure 2 When the glass component 232 has a similar shape, the heated area 764 can correspond to the peripheral area 294. The heated area 764 can define the heating mode for the glass workpiece.

[0113] Figure 8 An exploded view of a frame 870 supporting a glass workpiece 852, as well as a core mold 892 and a cavity mold 896, is shown. The core mold 892 and cavity mold 896 can be used in forming operations (such as...) Figure 4 Used during operation 406).

[0114] like Figure 8As shown, the glass workpiece 852 is horizontally oriented and positioned between two frame members 872a and 872b of the frame 870. Frame member 872b supports the glass workpiece 852. Frame members 872a and 872b define a central opening 875 that exposes the central portion 882 of the glass workpiece. An exposed first surface on the underside of the glass workpiece 852 contacts the cavity mold 892 during the forming operation. An exposed second surface 855 of the glass workpiece 852 contacts the core mold 896 during the forming operation. The frame 870, as well as the cavity mold and core mold (892, 896), are sized such that the surface of each of the cavity mold and core mold fits within the central opening 875. The glass workpiece 852 and the frame 870 can be similarly designed for... Figure 4 The glass workpiece and frame are described, and those details will not be repeated here.

[0115] Cavity mold 892 defines cavity 893, and core mold 896 defines protruding feature 897. Typically, protruding feature 897 is complementary in shape to at least a portion of cavity 893. Figure 8 In the example, the cavity 893 of the cavity mold 892 defines a substantially planar recessed surface 894 and a wall surface 895 extending from the planar recessed surface. A first region of the glass workpiece 852 can be molded against the substantially planar recessed surface 894 to produce a substantially planar region of the molded glass workpiece. A second region of the glass workpiece can be molded against the wall surface 895 to produce an angled region of the molded glass workpiece. The first and second regions can be regions of the central portion 882 of the glass workpiece. The cavity mold 892 and the core mold 896 can be similar to those for... Figure 4 The mold is described, and those details will not be repeated here. Figure 8 The mold shape shown is not intended to be restrictive, and in additional examples, the recessed surface need not be planar but can be curved. In further examples, the shape and orientation of the surface extending from this recessed surface can be curved and / or in relation to... Figure 8 The different angles shown, as previously addressed Figure 2 As described.

[0116] As previously discussed, this disclosure also provides an adhesive technique that can be a non-isothermal adhesive technique. Figure 9 A partial cross-sectional view of an example glass component 934 produced using an bonding technique is shown. Component 934 may be... Figure 1B An example of the covering member 133, and the cross-sectional view can be along... Figure 1B BB in the middle. For simplicity, Figure 9 Only one through-hole 962 is shown. More generally, the glass component 934 may be defined as previously described for... Figure 1B The described additional through-hole.

[0117] like Figure 9 As shown, the glass component 934 includes a first component 999 and a second component 996. Figure 9 In the example, the first component 999 is bonded to the second component 996. The first component 999 is located below the second component 996, and the second component 996 typically has at least one smaller lateral dimension (e.g., W1) than the lateral dimension of the first component 999.

[0118] Glass component 934 may be a glass covering member, first component 999 may be a first glass component, and second component 996 may be a second glass component. In additional cases, glass component 934 may be a composite member. As an example, first component 999 may be a first glass component, and second component 996 may be a glass-ceramic component or a ceramic component. The first component (such as first component 999) may also be referred to herein as a first part, or in some cases as a first layer or a first piece. The second component (such as second component 996) may also be referred to herein as a second part, or in some cases as a second layer or a second piece.

[0119] The first component 999 includes or defines a portion 939 of the glass component 934, also referred to herein as a base portion 939. The base portion 939 defines a base region 949 of the outer surface 944. The first component 999 also includes a portion 935 located below a protruding feature 936. The protruding feature 936 protrudes from or is at least partially offset relative to the base portion. Protruding features of a component (such as protruding feature 936) may also be generally referred to herein as features.

[0120] The second component 996 of the glass component may at least partially define the protruding feature 936 of the glass component 934. Figure 9 In one example, the second component 996 completely defines the protruding feature 936. However, in other examples, the second component 996 may partially define the protruding feature. For example, a finishing operation that removes a portion of the base region 949 of the outer surface of the bonded workpiece may cause the first component to define a portion of the protruding feature.

[0121] The protruding feature 936 defines a raised region 947 on the outer surface 944. The raised region 947 also defines a top surface of the protruding feature. The raised region 947 may define a platform (a substantially planar surface area). Figure 9In the example of FIG. 9A, the raised region 947 of the outer surface is offset from the base region 949 of the outer surface by a distance H1. The raised feature 936 also defines a side region 948 and a width W1, which extends between the raised region 947 and the base region 949 of the outer surface 944.

[0122] Dashed line 995 schematically indicates a boundary region between the first constituent part 999 and the second constituent part 996. The boundary region can join the first constituent part to the second constituent part. In some cases, such as when the first constituent part 999 is a first glass constituent part and the second constituent part 996 is a second glass constituent part, the first constituent part 999 can be fused to the second constituent part 996. When the first constituent part 999 is fused to the second constituent part 996, the boundary region can also be referred to herein as a fusion zone. In some embodiments, the fusion between the first constituent part 999 and the second constituent part 996 is substantially complete. For example, the boundary or fusion zone between the first constituent part 999 and the second constituent part 996 can include few, if any, voids, and any voids that are present can be small relative to the thickness of the first and second constituent parts.

[0123] The first constituent part 999 of the glass part 936 can be formed from a first glass layer or a first glass piece, and the second constituent part 996 of the glass part can be formed from a second glass layer or a second glass piece. The dashed line 995 can correspond to a boundary between the first glass layer or first glass piece and the second glass layer or second glass piece. In some cases, a distinct boundary region can be observed between the first constituent part 999 and the second constituent part 996. In other cases, a distinct boundary region between the first constituent part 999 and the second constituent part 996 can not be detectable by the naked eye.

[0124] For example, when the first glass layer has a composition that is substantially similar to the composition of the second glass layer and the fusion between the first glass constituent part and the second glass constituent part is substantially complete, the different fusion zone can not be detectable by the naked eye. In some cases, one or more fusion artifacts, such as a zone of incomplete fusion, voids, graphite, or other impurity particles resulting from the bonding process, etc., can be detected in the fusion zone. The size of any fusion artifacts can be sufficiently small such that the glass part has a desired strength. In some cases, the boundary region and / or the fusion artifacts can be observed by sectioning the glass part 934 and / or using non-destructive techniques. Suitable techniques for observing the boundary region and / or the fusion artifacts include, but are not limited to, microscopy, elemental analysis, optical interference detection, ultrasonic detection, etc.

[0125] As Figure 9As shown, the glass component 934 also defines a through-hole, such as a through-hole 962. The through-hole 962 extends through the protruding feature 936 and the lower portion 935 of the glass component 934. A first component 999 of the glass component 934 may define a lower portion or a first portion of the through-hole 962, and a second component 996 of the glass component may define an upper portion or a second portion of the through-hole 962.

[0126] Through-hole 962 allows input to device components (such as those previously targeted) Figure 1B The optical module described herein, output from and / or placed within the device component. The protruding feature 936 may also define an opening 967 of a through-hole, wherein the opening 967 is located within the protruding region 947. In some cases, the glass component 934 may define a set of through-holes and openings arranged, arrayed, or extending through the protruding portion 936. For example, the glass component 934 may define any number of through-holes and openings, such as one, two, three, four, or five.

[0127] exist Figure 9 In the example, the raised region 947 on the outer surface is offset by a distance H1 from the base region 949 on the outer surface. The thickness T2 (the distance between the inner surface 942 and the raised region 947) is greater than the thickness T1 (the distance between the inner surface 942 and the base region 949 on the outer surface). For example, the ratio T2 / T1 can be from about 1.25 to about 3 or from about 1.5 to about 2. In some cases, the raised feature 936 has a thickness greater than about 1 mm and less than or equal to about 2.5 mm, and the base portion 939 has a thickness greater than about 0.5 mm and less than about 1 mm. The amount of protrusion or offset between the raised region 947 and the base region 949 can be from about 0.5 mm to about 1.5 mm or from about 0.75 mm to about 2 mm.

[0128] In some cases, both the base region 949 and the raised region 947 can define corresponding textured regions (also referred to herein as textured surface regions) of the outer surface 944. For example, the raised region 947 can define a first texture, and the base region 949 can define a second texture different from the first texture. Different textures can be formed by one or more finishing processes.

[0129] Figure 10 A partial cross-sectional view of another example glass component 1034 produced using an bonding technique is shown. Component 1034 may be... Figure 1B An example of the covering member 133, and the cross-sectional view can be along... Figure 1B BB in the middle. For simplicity, Figure 10 Only one through-hole 1062 is shown. More generally, the glass component 1034 may be defined as previously described for...Figure 1B The additional through-hole described. The greater width of the first portion 1063a of the through-hole 1062 can be sized to accommodate one or more internal components of an electronic device.

[0130] like Figure 10 As shown, the glass component 1034 includes a first component 1099 and a second component 1096. The first component 1099 is bonded to the second component 1096 along a boundary region schematically indicated by the dashed line 1095. The first component 1099 is located below the second component 1096, and the second component 1096 generally has at least one smaller lateral dimension (e.g., W2) than the lateral dimension of the first component 1099. As previously stated... Figure 9 As described, the first component 1099 may be formed of a first glass layer or a first glass element, and the second component 1096 may be formed of a second glass layer or a second glass element. The dashed line 1095 may correspond to the boundary between the first glass layer or the first glass element and the second glass layer or the second glass element. Figure 10 In the example, the boundary region 1095 extends around the periphery of the second constituent portion 1096. The width of the boundary region 1095 is limited by the overlap between the first and second constituent portions, which in turn is limited by the through-hole 1062 (and hole portions 1063a and 1063b). Therefore, the boundary region 1095 may be referred to herein as a peripheral boundary region or a peripheral fusion zone.

[0131] The first component 1099 includes or defines a portion 1039 of the glass component 1034, also referred to herein as a base portion 1039. The base portion 1039 defines a base region 1049 of the outer surface 1044. The first component 1099 also includes a portion 1035 located below the protruding feature 1036. The protruding feature 1036 protrudes from the base portion 1039 or is at least partially offset relative to the base portion. Protruding features of components (such as protruding feature 1036) may also be generally referred to herein as features.

[0132] The second component 1096 of the glass component may at least partially define the protruding feature 1036 of the glass component 1034. Figure 10 In one example, the second component 1096 completely defines the protruding feature 1036. However, in other examples, the second component 1096 may partially define the protruding feature. For example, a finishing operation that removes a portion of the base region 1049 of the outer surface of the bonded workpiece may cause the first component to define a portion of the protruding feature.

[0133] like Figure 10As shown in FIG. 10A, the glass part 1034 also defines a through-hole 1062. The through-hole 1062 extends through the protruding feature 1036 and the lower portion 1035 of the glass part 1034. A first constituent portion 1099 of the glass part 1034 can define a lower portion or first portion 1063a of the through-hole 1062, and a second constituent portion 1096 of the glass part can define an upper portion or second portion 1063b of the through-hole 1062. As shown in FIG. 10A, the first portion 1063a has a lateral dimension W3 that is greater than a lateral dimension W4 of the second portion 1063b of the through-hole 1062. In some cases, the shape of the through-hole 1062 can be achieved by forming a through-hole through a glass layer that will become the first constituent portion of the glass part 1034, as shown in the example of FIG. 10B. Figure 10 As shown in FIG. 10A, the first portion 1063a has a lateral dimension W3 that is greater than a lateral dimension W4 of the second portion 1063b of the through-hole 1062. In some cases, the shape of the through-hole 1062 can be achieved by forming a through-hole through a glass layer that will become the first constituent portion of the glass part 1034, as shown in the example of FIG. 10B. Figure 13A As shown in FIG. 10A, the first portion 1063a has a lateral dimension W3 that is greater than a lateral dimension W4 of the second portion 1063b of the through-hole 1062. In some cases, the shape of the through-hole 1062 can be achieved by forming a through-hole through a glass layer that will become the first constituent portion of the glass part 1034, as shown in the example of FIG. 10B.

[0134] The through-hole 1062 can allow input to, output from, or placement of one or more device components. For example, the second portion 1063b of the through-hole 1062 can allow placement of an optical module as previously described with respect to FIGS. 9A-9B and 10A-10B. The first portion 1063a can house the optical module and also house one or more additional components of the electronic device. Figure 1B As shown in FIG. 10A, the first portion 1063a has a lateral dimension W3 that is greater than a lateral dimension W4 of the second portion 1063b of the through-hole 1062. In some cases, the shape of the through-hole 1062 can be achieved by forming a through-hole through a glass layer that will become the first constituent portion of the glass part 1034, as shown in the example of FIG. 10B. Figure 9 As shown in FIG. 10A, the first portion 1063a has a lateral dimension W3 that is greater than a lateral dimension W4 of the second portion 1063b of the through-hole 1062. In some cases, the shape of the through-hole 1062 can be achieved by forming a through-hole through a glass layer that will become the first constituent portion of the glass part 1034, as shown in the example of FIG. 10B.

[0135] The protruding feature 1036 defines a raised region 1047 of the exterior surface 1044. The raised region 1047 also defines a top surface of the protruding feature. The raised region 1047 can define a plateau (a substantially planar surface region). In the example of FIG. 10A, the raised region 1047 of the exterior surface is offset from a base region 1049 of the exterior surface by a distance H2. The protruding feature 1036 also defines a side region 1048 that extends between the raised region 1047 and the base region 1049 of the exterior surface 1044, and a width W2. The raised region 1047 of the exterior surface is offset from the interior surface 1042 by a distance T4, and the base region 1049 of the exterior surface is offset from the interior surface 1042 by a distance T3. The raised region 1047 also defines an opening 1067 of the through-hole 1062. The values of distances H2, T3, and T4 can be similar to the values of H1, T1, and T2 described with respect to FIGS. 9A-9B. Figure 10 As shown in FIG. 10A, the first portion 1063a has a lateral dimension W3 that is greater than a lateral dimension W4 of the second portion 1063b of the through-hole 1062. In some cases, the shape of the through-hole 1062 can be achieved by forming a through-hole through a glass layer that will become the first constituent portion of the glass part 1034, as shown in the example of FIG. 10B. Figure 9 As shown in FIG. 10A, the first portion 1063a has a lateral dimension W3 that is greater than a lateral dimension W4 of the second portion 1063b of the through-hole 1062. In some cases, the shape of the through-hole 1062 can be achieved by forming a through-hole through a glass layer that will become the first constituent portion of the glass part 1034, as shown in the example of FIG. 10B.

[0136] Figure 11A flowchart showing an example process 1100 for manufacturing a glass component by bonding glass layers of a workpiece together is shown. The description provided below for the bonding of glass layers also applies more generally to the bonding of glass pieces. Process 1100 can be performed at several stations, as previously described for process 400. The time spent at each station can be limited to produce the glass component more quickly. For example, the time spent at each station can be 20 seconds or less, about 2 seconds to about 20 seconds, or about 5 seconds to about 20 seconds.

[0137] As shown in Figure 11 Process 1100 includes placing a workpiece including an assembly of glass layers into a frame at operation 1102. The layers of the assembly can be precisely aligned with each other. In some cases, the layers can be assembled simply by bringing them into contact with each other. In additional cases, the glass layers of the assembly can be at least partially bonded to maintain the position of the layers during a fusion operation. For example, laser bonding, electrostatic adhesion, optical bonding, or the like can be used to at least partially bond the layers. Separate fixtures or stations can be used to assemble the layers. Figure 12B and Figure 13B An example of positioning an upper glass layer to a lower glass layer is shown. Assembly can be performed under clean conditions to limit the introduction of foreign matter between the glass layers. Figures 12A-12C and Figures 13A-13C Assembly of the workpiece and placement of the workpiece into a frame is shown schematically. The frame can be any of the frames previously described for Figure 4 and the description of such is not repeated here for the sake of brevity.

[0138] The glass layers used to form the workpiece can be shaped prior to assembling the glass layers. For example, the glass layers can be shaped by machining to a desired shape and size. In some embodiments, as shown in Figure 13A In additional examples, the surfaces of the glass layers can be finished such that the adjacent layers can be in close contact with each other. In some cases, the surfaces of the adjacent glass layers are substantially flat and smooth. In some examples, one or more of the glass layers can be cleaned prior to assembly and / or can be treated using one or more surface treatments, such as etching and plasma treatment. The glass layers can be in direct contact with each other, or in some embodiments, an intermediate layer can be provided to enhance the bonding between the glass layers. The glass layers need not have the same lateral dimensions, as shown in the examples of Figures 12A-12C and Figures 13A-13C

[0139] ​In some cases, each glass layer has a substantially similar composition. In additional cases, the glass layers can differ in composition. In some examples, the first glass layer forming a first portion or lower portion of the glass component has a thickness of 0.5 mm to 1.0 mm or 0.75 mm to 1.5 mm, and the glass layer forming an upper portion of the glass component has a thickness of 0.75 mm to 1.5 mm or 1.0 mm to 2 mm. The composition of each of the glass layers can be as previously described for Figure 2 and that description is not repeated here.

[0140] Process 1100 also includes an operation 1104 of heating the workpiece. As an example, at least a portion of the workpiece can be heated to a temperature between a glass transition temperature and a softening point of each of the glass layers, to a temperature between an annealing point and a softening point of each of the glass layers, or to a temperature between a strain point and a softening point of each of the glass layers. Operation 1104 can be performed in an air atmosphere or in a vacuum or inert gas atmosphere.

[0141] In some embodiments, operation 1104 can locally heat the workpiece, as schematically shown in Figure 14A , Figure 14B and Figure 14C In some cases, the upper layer of the workpiece can be heated over its entire upper surface, while the lower layer is heated to a lesser extent, as schematically shown in Figure 14A In additional cases, the heating can be localized around a perimeter of the upper layer, as schematically shown in Figure 14B and Figure 14C Local heating can create one or more temperature gradients, as schematically shown in Figure 14C For example, the temperature gradient can be configured to “feather” a heat-affected zone in the workpiece. Alternatively, the workpiece can be globally heated, rather than locally heated.

[0142] Process 1100 also includes an operation 1106 of bonding the glass layers to form a bonded assembly (which can also be referred to herein as a bonded workpiece). Operation 1106 can include fusing the glass layers to bond them together, and the bonded assembly can be a fused assembly. In embodiments, the fusing operation includes applying pressure to at least the upper layer of the assembly. The pressure can be applied between two tool pieces, and a press or similar device can be used to apply the pressure. In some cases, each of the first tool piece and the second tool piece defines a planar region. In some cases, one tool piece supports the assembly of glass layers, while the other tool piece (such as a plunger, piston, or the like) contacts the upper layer of the assembly, as schematically shown in Figure 15A tool piece can be used to form the integral bonded assembly. In some embodiments, the tool piece can be a press head. Operation 1106 can be performed in an air atmosphere or in a vacuum or inert gas atmosphere.

[0143] As previously discussed, the assembly of glass layers can be preheated to a temperature between the glass transition temperature and the softening point of each of the glass layers, to a temperature between the annealing point and the softening point of each of the glass layers, or to a temperature between the strain point and the softening point of each of the glass layers. In some cases, additional energy can be supplied to the glass workpiece during the bonding operation to facilitate fusion of the glass layers. For example, operation 1106 can be ultrasonically assisted and / or additional heating can be provided by the tool piece. As a specific example, the tool piece can include a susceptor. In additional examples, the tool piece can be at a lower temperature than the assembly of glass layers. For example, the tool piece can be at a temperature previously described for the mold of process 400.

[0144] Operation 1106 forms an integral bonded assembly, which can be a fused assembly. In some cases, one or more portions of the bonded assembly are produced from a greater number of layers than other portions of the bonded assembly. The one or more portions of the bonded assembly produced by bonding a greater number of layers can be thicker than other portions of the bonded assembly. For example, a portion of the bonded assembly produced by bonding multiple glass layers can have a greater thickness than a portion of the bonded assembly produced from a single glass layer, as shown in the examples of Figures 12A-12C and Figures 13A-13C In some cases, at least a portion of the boundary region between the glass layers can be detectable by the naked eye or using other techniques after the operation of fusing the glass layers, as previously discussed with respect to Figure 9

[0145] The one or more portions of the bonded assembly produced by bonding a greater number of glass layers can protrude relative to other portions of the bonded assembly. For example, a portion of the bonded assembly produced by bonding multiple glass layers can protrude relative to an adjacent portion produced from a single glass layer. In particular, a thicker portion of the bonded assembly can protrude from an adjacent thinner portion of the bonded assembly. As shown in the examples of Figure 9 and Figure 10 The protruding feature of the glass part can be located within the thicker portion, while a base portion of the glass part can be located within the adjacent thinner portion, as shown in the examples of

[0146] In some embodiments, operation 1106 of bonding the glass layers can be combined with operations of forming one or more of the glass layers. For example, the heating pattern shown in Figure 16 may be used to locally heat the glass workpiece for combined shaping and bonding operations.

[0147] ​Process 1100 includes an operation 1108 of cooling the bonded assembly, which follows operation 1106. Operation 1108 may cool the bonded assembly to ambient temperature (e.g., room temperature), an ambient temperature range, or a temperature range sufficiently below the transition temperature of the glass component (e.g., strain point or glass transition point). Operation 1108 may include multiple stages. After operation 1108, process 1100 includes an operation 1110 of removing the bonded assembly from the frame. As previously discussed, the bonded assembly may be a fused assembly.

[0148] In some embodiments, after operation 1108, the bonded assembly can be prepared for use as a glass component. In additional embodiments, process 1100 includes additional operations to produce a glass component from the bonded assembly. For example, process 1100 may include one or more finishing operations. In some cases, the peripheral portion of the bonded assembly is trimmed to achieve the desired shape of the glass component, and / or one or more through-holes may be formed and / or enlarged (e.g., by machining). In additional examples, the bonded assembly may be cleaned, textured, and / or polished. As an additional example, the process may include an annealing operation to alleviate residual thermal stress from the heating and bonding operations. The annealing operation may be performed while the bonded assembly is in the frame or after the bonded assembly has been removed from the frame. In additional examples, the glass component may be chemically strengthened by one or more ion exchange operations. These operations may be similar to those for... Figure 4 The operations described in process 400 are not repeated here for the sake of brevity.

[0149] Figure 12A , Figure 12B and Figure 12C The illustration shows an example of assembling the workpiece and placing it into the frame. Figure 12A A first glass layer 1249 and a second glass layer 1246 are shown. The second glass layer has a smaller lateral dimension (e.g., width) than the lateral dimension of the first glass layer 1249. The first glass layer 1249 and the second glass layer 1246 may have the same lateral dimensions as previously described. Figure 11 The thickness, composition, and / or other properties of the glass layer are described herein, and this description will not be repeated here. Dashed line 1242 may schematically indicate the perimeter of the glass component. Figure 12A The position of the dashed line 1242 shown is not limiting, and in some embodiments, the periphery of the glass component may more closely correspond to the periphery of the glass workpiece 1252.

[0150] like Figure 12BAs shown, the first glass layer 1249 and the second glass layer 1246 have been assembled to form the workpiece 1252. Feature 1292 schematically illustrates partial adhesion of the first glass layer 1249 and the second glass layer 1246. For example, feature 1292 can be formed by laser positioning welding. Figure 12B The positioning of the second glass layer 1246 relative to the first glass layer 1249 depicted is exemplary and not limiting, and in additional examples, the second glass layer 1246 may be placed in the central portion of the first glass layer 1249 or in any other suitable location, such as above a specific electronic component of an electronic device. Figure 11 Any of the other methods described can be used to at least partially bond the first glass layer 1249 and the second glass layer 1246.

[0151] Figure 12C The workpiece 1252 is shown after being placed in frame 1270. Figure 12C In the example, layer 1249 is placed within and fixed to frame 1270, while layer 1246 is positioned within an opening 1275 defined by the frame. This frame may be a previously designed... Figure 4 Any frame described herein, and that description will not be repeated here. In an additional embodiment, the first glass layer may be placed in the frame before it is assembled with the second glass layer.

[0152] Figure 13A , Figure 13B and Figure 13C The illustration schematically shows the assembly of the workpiece and an additional example of placing the workpiece into the frame. Figure 13A A first glass layer 1349 and a second glass layer 1346 are shown. The second glass layer has a smaller lateral dimension (e.g., width) than the first glass layer 1349. Additionally, the first glass layer 1349 includes a through-hole 1361, which has a smaller lateral dimension than the second glass layer. Therefore, the second glass layer 1346 overlaps with the first glass layer 1349 around the through-hole 1361, and this overlap allows the first glass layer 1349 to bond to the second glass layer 1346 (e.g., ...). Figure 13B (As shown in the diagram). The lateral dimensions of the through-hole 1361 and the second glass layer 1346 are exemplary and not limited to those shown in the diagram. Figure 13A The dimensions shown are shown. The first glass layer 1349 and the second glass layer 1346 can have the dimensions previously specified. Figure 11 The thickness, composition, and / or other properties of the glass layer are described herein, and this description will not be repeated here. Dashed line 1342 may schematically indicate the perimeter of the glass component. Figure 13AThe position of the dashed line 1342 shown is not limiting, and in some embodiments, the periphery of the glass component may more closely correspond to the periphery of the glass workpiece 1352.

[0153] like Figure 13B As shown, the first glass layer 1349 and the second glass layer 1346 have been assembled to form the workpiece 1352. (As previously stated...) Figure 13A As described, the first glass layer 1349 includes a through-hole 1361 having a smaller lateral dimension than the second glass layer 1346. Therefore, the second glass layer 1346 can overlap the first glass layer 1349, such that the second glass layer 1346 covers... Figure 13A The through-hole 1361 is shown. Feature 1392 schematically shows partial adhesion of the first glass layer 1349 and the second glass layer 1346. For example, feature 1392 can be formed by laser positioning welding. Figure 13B The positioning of the second glass layer 1346 relative to the first glass layer 1349 depicted is exemplary and not limiting, and in additional examples, the second glass layer 1346 may be placed in the central portion of the first glass layer 1349 or in any other suitable location, such as above a specific electronic component of an electronic device. Figure 11 Any of the other methods described can be used to at least partially bond the first glass layer 1349 and the second glass layer 1346.

[0154] Figure 13C The image shows workpiece 1352 after it has been placed in frame 1370. Figure 13C In the example, layer 1349 is placed within and fixed to frame 1370, while layer 1346 is positioned within an opening 1375 defined by the frame. This frame may be a previously designed... Figure 4 Any frame described herein, and that description will not be repeated here. In an additional embodiment, the first glass layer may be placed in the frame before it is assembled with the second glass layer.

[0155] Figure 14A , Figure 14B and Figure 14C An example of localized heating of a workpiece used for bonding operations is illustrated schematically. Figure 14A , Figure 14B and Figure 14C The example can be used in operation 1104 of process 1100. Workpiece 1452 includes an upper layer 1446 and a lower layer 1449. The workpiece is placed in frame 1470. Frame 1470 can be a previously designed... Figure 4 Any frame described within that framework, and that description will not be repeated here. As previously stated for... Figure 12B and Figures 14A-14CDescribed, Figure 14A The relative positioning of the layers 1446 and 1449 depicted is exemplary and not limiting.

[0156] In Figure 14B In the example of FIG. 14A, the upper layer 1446 of the workpiece 1452 is heated over its entire upper surface, while the lower layer 1449 is heated to a lesser extent. The heated region 1462 extends over the upper layer 1446 and over a portion of the lower layer 1449. Another portion of the lower layer 1449 surrounding the upper layer 1446 and surrounding the lower portion of the lower layer 1449 is not included in the heated region. In some cases, the upper layer 1446 and the lower portion of the lower layer 1449 are heated to a higher temperature than this surrounding portion. The heated region 1462 can be uniformly heated, or can include one or more temperature gradients to manage the heated-affected zone of the workpiece 1452. For example, the temperature at the periphery of the heated region 1462 can be less than the temperature at the periphery of the upper layer 1446. The heated region 1462 can define a heating pattern for the workpiece.

[0157] In additional cases, as Figure 14C and Figure 14B schematically illustrate, the heating can be localized around the periphery of the upper layer 1446. In Figure 14C In the example of FIG. 14B, the heated region 1464 is localized around the periphery of the upper layer 1446 and is substantially uniform. In Figure 14B In the example of FIG. 14C, the heated region 1466 is localized around the periphery of the upper layer 1446 and forms one or more temperature gradients. For example, the temperature at the periphery of the heated region 1466 can be less than the temperature inward of this periphery. As another example, the temperature can vary around the periphery of the heated region 1466. The heated regions 1464 and 1466 can define an alternating heating pattern for the workpiece. In Figure 14C and Figure 14A In the example of FIG. 14D, the heated regions 1464 and 1446 extend over a portion of the lower layer 1449. Another portion of the lower layer 1449 surrounding the upper layer 1446 and surrounding the lower portion of the lower layer 1449 is not included in the heated regions 1464 and 1446. In some cases, the upper layer 1446 and the lower portion of the lower layer 1449 are heated to a higher temperature than this surrounding portion.

[0158] Figure 14B 、 Figure 14C and Figure 14A The dashed line 1442 in FIGS. 14A-14D can schematically illustrate the periphery of the glass component. Figure 14B 、 Figure 14C and Figure 15 The position of the dashed line 1442 shown in FIGS. 14A-14D is not limiting, and in some embodiments, the periphery of the glass component can more closely correspond to the periphery of the glass workpiece 1452.Figure 15 Applying pressure P to the workpiece 1552 to fuse the assembled glass layers 1546 and 1549 is schematically illustrated. In Figure 15 In an example, the assembly 1552 includes an upper layer 1546 and a lower layer 1549. The upper layer 1546 contacts an upper surface 1519 of the lower layer 1549, and a boundary between these layers defines an interface 1515. Figure 12C The vertical dashed lines in indicate the lateral dimensions of the upper layer 1546 schematically. The glass layers 1546 and 1549 can be positioned in a frame, an example of which was previously shown in Figure 13C , Figures 14A-14C and Figure 15 .

[0159] As shown in Figure 15 , the lateral surface 1518 of the upper layer 1546 defines a rounded shape. Figure 15 The example of is not limiting, and the lateral surface 1518 can define any of a variety of shapes, including a substantially planar shape or a substantially planar shape having a chamfer or a fillet.

[0160] The tooling 1525 is used to apply pressure to the upper surface 1517 of the upper layer 1546 during the fusing operation. In additional embodiments, pressure is applied by both the tooling 1525 and the tooling 1510. As shown in Figure 15 , the tooling 1525 can have the form of a plunger with a flat bottom. Figure 8 The shape of the tooling shown in Figure 16 is not limiting, and in additional examples the tooling 1525 can define a planar area, and in some cases can include one or more non-planar areas. In additional examples, the tooling 1510 can define a planar area, or in some cases can include one or more non-planar areas. For example, one of these toolings can define a planar area, and the other can define a cavity. Generally, the upper layer 1546, the lower layer 1549, the tooling 1525, and the tooling 1510 are at an elevated temperature during the fusing operation. The tooling can be made of similar materials as previously described for the cavity and core molds of

[0161] Figure 16 An example of partial heating of a workpiece 1656 for a process that combines a bonding technique with a forming technique is shown. The workpiece 1656 can include a lower glass layer 1649 and an upper glass layer 1646. In Figure 4In the example depicted in FIG. 16B, the heated region 1662 is confined around the dashed line 1642, and can generally correspond to a local deformation region of the workpiece during a forming technique. The heated region 1664 is confined around the perimeter of the layer 1646, and heat is applied for a bonding technique. The workpiece 1656 includes a perimeter portion 1649, which can be supported by a frame as previously described for Figure 11 and Figure 12B As previously described for Figure 13B and Figure 16 As previously described for Figure 17 The relative positioning of the layers 1646 and 1649 depicted in FIG. 16B is exemplary and not limiting.

[0162] Figure 17 A block diagram of a sample electronic device that can incorporate a glass component such as a three-dimensional glass cover member as described herein is shown. Figures 1A-16 The schematic diagram depicted in FIG. 16B can correspond to the components of the device as described above. Figure 17 However, Figure 17 Other types of electronic devices having a cover assembly as described herein can also be more generally represented.

[0163] In embodiments, the electronic device 1700 can include a sensor 1720 to provide information about the configuration and / or orientation of the electronic device in order to control the output of the display. For example, when all or a portion of the viewable area of the display 1708 is blocked or substantially obscured, a portion of the display 1708 can be turned off, disabled, or placed in a low energy state. As another example, the display 1708 is adapted to rotate the display of graphical output in response to the device 1700 rotating based on a change in orientation of the device 1700 (e.g., 90 degrees or 180 degrees).

[0164] The electronic device 1700 also includes a processor 1706 operatively connected to the computer readable memory 1702. The processor 1706 can be operatively connected to the memory 1702 components via an electronic bus or bridge. The processor 1706 can be implemented as one or more computer processors or microcontrollers configured to perform operations in response to computer readable instructions. The processor 1706 can include a central processing unit (CPU) of the device 1700. Additionally and / or alternatively, the processor 1706 can include other electronic circuitry located within the device 1700, including application specific integrated chips (ASICs) and other microcontroller devices. The processor 1706 can be configured to perform the functions described in the examples above.

[0165] Memory 1702 may include various types of non-transitory computer-readable storage media, including, for example, read-access memory (RAM), read-only memory (ROM), erasable programmable memory (e.g., EPROM and EEPROM), or flash memory. Memory 1702 is configured to store computer-readable instructions, sensor values, and other persistent software elements.

[0166] Electronic device 1700 may include control circuitry 1710. Control circuitry 1710 may be implemented in a single control unit and need not be implemented as a separate circuit element. As used herein, "control unit" will be used synonymously with "control circuitry". Control circuitry 1710 may receive signals from processor 1706 or from other elements of electronic device 1700.

[0167] like Figure 1B As shown, electronic device 1700 includes a battery 1714 configured to provide power to components of electronic device 1700. Battery 1714 may include one or more power storage units connected together to provide an internal power supply. Battery 1714 may be operatively connected to power management circuitry configured to provide appropriate voltage and power levels to various components or groups of components within electronic device 1700. Battery 1714 may be configured via the power management circuitry to receive power from an external source, such as an AC power outlet. Battery 1714 may store the received power, allowing electronic device 1700 to operate for extended periods, ranging from several hours to several days, without connection to an external power source.

[0168] In some embodiments, electronic device 1700 includes one or more input devices 1718. Input device 1718 is a device configured to receive input from a user or environment. Input device 1718 may include, for example, a push-button, a touch-activated button, a capacitive touch sensor, a touchscreen (e.g., a touch-sensitive display or force-sensitive display), a capacitive touch button, a dial pad, a crown, etc. In some embodiments, input device 1718 may provide dedicated or primary functions, including, for example, a power button, volume buttons, a home button, a scroll wheel, and a camera button.

[0169] Device 1700 may also include one or more sensors or sensor modules 1720, such as force sensors, capacitive sensors, accelerometers, barometers, gyroscopes, proximity sensors, light sensors, etc. In some cases, device 1700 includes a sensor array (also called a sensing array) that includes multiple sensors 1720. For example, a sensor array associated with a protruding feature of a covering member may include an ambient light sensor, a lidar sensor, and a microphone. As previously mentioned relative to... ​As discussed, one or more camera modules may also be associated with the protruding feature. Sensor 1720 may be operatively coupled to processing circuitry. In some embodiments, sensor 1720 may detect deformation and / or configurational changes of the electronic device and is operatively coupled to processing circuitry that controls the display based on sensor signals. In some specific implementations, the output from sensor 1720 is used to reconfigure the display output to correspond to the device's orientation or folded / unfolded configuration or state. Example sensors 1720 used for this purpose include accelerometers, gyroscopes, magnetometers, and other similar types of positioning / orientation sensing devices. In additional examples, sensor 1720 may include microphones, acoustic sensors, light sensors (including ambient light, infrared (IR) light, and / or ultraviolet (UV) light), optical facial recognition sensors, depth measurement sensors (e.g., time-of-flight sensors), health monitoring sensors (e.g., electrocardiogram (ERG) sensors, heart rate sensors, photoplethysmography (PPG) sensors, and / or pulse oximeters), biometric sensors (e.g., fingerprint sensors), or other types of sensing devices.

[0170] In some embodiments, electronic device 1700 includes one or more output devices 1704 configured to provide output to a user. Output device 1704 may include a display 1708 that presents visual information generated by processor 1706. Output device 1704 may also include one or more speakers to provide audio output. Output device 1704 may also include one or more tactile devices configured to generate tactile or perceptual outputs along an external surface of device 1700.

[0171] Display 1708 may include a liquid crystal display (LCD), a light-emitting diode (LED) display, an LED-backlit LCD display, an organic light-emitting diode (OLED) display, an active-layer organic light-emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, etc. If display 1708 is a liquid crystal display or an electrophoretic ink display, it may also include a backlight component controllable to provide a variable display brightness level. If display 1708 is an organic light-emitting diode or organic electroluminescent display, the brightness of display 1708 can be controlled by modifying the electrical signals provided to the display elements. In additional examples, information about the configuration and / or orientation of the electronic device may be used to control the output of the display, as described for input device 1718. In some cases, the display is integrated with a touch sensor and / or force sensor to detect touch and / or force applied along the external surface of device 1700.

[0172] The electronic device 1700 can also include a communication port 1712 configured to transmit and / or receive signals or electrical communication from external devices or separate devices. The communication port 1712 can be configured to couple to external devices via a cable, adapter, or other type of electrical connector. In some embodiments, the communication port 1712 can be used to couple the electronic device 1700 to a host computer.

[0173] The electronic device 1700 can also include at least one accessory 1716, such as a camera, a flash for a camera, or other such devices. The camera can be part of a camera assembly that is connectable to other portions of the electronic device 1700, such as the control circuit 1710.

[0174] As used herein, the terms “about,” “approximately,” “substantially,” “roughly,” “similar,” and the like are used to explain a relatively small variation, such as + / - 10%, + / - 5%, + / - 2%, or + / - 1%. Additionally, the term “about” in reference to an endpoint of a range can mean + / - 10%, + / - 5%, + / - 2%, or + / - 1% of the endpoint value. Furthermore, a range in which at least one endpoint is described as “about” a particular value includes a range in which the endpoint is equal to the particular value.

[0175] As used herein, the phrase “one or more of’ following a series of items in which the terms “and” or “or” separate any of the items is used to modify the list as a whole rather than to modify each member of the list. The phrase “one or more of’ does not require selection of at least one of each item listed; rather, the phrase allows for the inclusion of a minimum of one of any of the items and / or a minimum of one of any combination of the items and / or a minimum of one of each of the items. By way of example, the phrases “one or more of A, B, and C” or “one or more of A, B, or C” each refer to only A, only B, or only C; any combination of A, B, and C; and / or one or more of each of A, B, and C. Furthermore, as used herein, the phrase “one or more” preceding a series of items in which the terms “and” or “or” separate the items does not require selection of one of each item listed; rather, the phrase allows for the inclusion of a minimum of one of any of the items and / or a minimum of one of any combination of the items and / or a minimum of one of each of the items. Similarly, it should be understood that the order of elements presented with respect to a list or separate lists provided herein should not be construed as limiting the present disclosure to only the order provided.

[0176] The following discussion applies to electronic devices described herein that are capable of obtaining personal identifiable information data. It is well understood that the use of personal identifiable information should follow privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining the privacy of users. In particular, personal identifiable information data should be managed and handled in a manner that allows unauthorized access or use of the data to be reasonably minimized, and that user authorization should be obtained prior to collection, use or disclosure of the personal identifiable information data.

[0177] For the purposes of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, the specific nomenclature should not be construed to limit the described embodiments, but rather to provide clarity for the present description. Thus, to the extent the following description uses specific nomenclature, it should be understood that the specific nomenclature is merely used for the purposes of providing a thorough and complete description, and the specific nomenclature should not be construed to limit the embodiments. Accordingly, the description is not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. As such, many modifications and variations are possible in light of the above teaching.

Claims

1. A method for manufacturing a glass component for an electronic device, the method comprising: mounting a glass workpiece to an open frame, the open frame comprising an upper frame component and a lower frame component, the glass workpiece being a sheet and having a second portion positioned between the upper and lower frame components, and the glass workpiece being held in the open frame, a first portion of the glass workpiece having an exposed first surface and an exposed second surface opposite the exposed first surface; transferring the glass workpiece held within the open frame to a heating station; heating the glass workpiece at the heating station to a temperature greater than or equal to a softening point of the glass workpiece and less than or equal to a working point of the glass workpiece; transferring the glass workpiece held within the open frame to a molding station; thermoforming the first portion of the glass workpiece at the molding station between a cavity mold contacting the exposed first surface and a core mold contacting the exposed second surface to produce a molded glass workpiece, each of the cavity mold and the core mold being heated to a temperature lower than the temperature of the glass workpiece; cooling the molded glass workpiece to a temperature lower than a glass transition temperature of the glass workpiece; removing the molded glass workpiece from the open frame; and removing a peripheral portion of the molded glass workpiece to form the glass component, the peripheral portion including at least some of the second portion of the glass workpiece.

2. The method of claim 1, wherein: the glass workpiece is an aluminosilicate glass sheet; and the sheet has a thickness of 300 microns to 2 mm.

3. The method of claim 2, wherein: the cavity mold defines: a planar recessed surface; and a wall surface extending from the planar recessed surface, the wall surface and the planar recessed surface together defining a cavity of the cavity mold; a first region of the first portion of the glass workpiece contacts the wall surface during the thermoforming; and a second region of the first portion of the glass workpiece contacts the planar recessed surface during the thermoforming. the first region of the glass workpiece is at a higher temperature than the second region of the glass workpiece.

5. The method of claim 3, wherein:

4. The method of claim 3, wherein, the second portion of the glass workpiece is cooled during at least a portion of a process cycle in which the glass workpiece is thermoformed.

6. The method of claim 1, wherein: the glass workpiece is clamped between the upper frame component and the lower frame component. the glass component is a glass cover and defines an outer surface of the electronic device. a mechanical element clamps the glass workpiece between the upper frame component and the lower frame component.

7. The method of claim 1, wherein, the core mold defines a protruding feature.

8. The method of claim 6, wherein, a second portion of the glass workpiece moves within the open frame during the operation to produce the molded glass workpiece; and a region of the second portion of the glass workpiece is heat shaped during the operation to produce the molded glass workpiece.

9. The method of claim 1, wherein, ​ 10. The method of claim 1, wherein, ​

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