Display module and display device

Abstract

The display module and the display device are disclosed, including a display panel, a printed circuit board, a flexible circuit board, including a flexible substrate, a trace layer arranged on one side of the flexible substrate, a protective layer arranged on a side of the trace layer away from the flexible substrate, and a reinforcing layer arranged on a side of the flexible substrate away from the trace layer; the flexible substrate includes a first region, a second region, and a third region arranged in sequence, the trace layer is arranged in the first region, the second region, and the third region, the protective layer covers the second region in the orthographic projection of the flexible substrate, the orthographic projection of the protective layer on the flexible substrate does not overlap the first region and the third region, and the reinforcing layer covers the third region in the orthographic projection of the flexible substrate; the trace layer of the first region is connected to a bonding area, and the trace layer of the third region is connected to the printed circuit board.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to display modules and display devices. Background Technology

[0002] Displays such as Liquid Crystal Displays (LCDs) and Organic Light-Emitting Diodes (OLEDs) typically include multiple pixel units. Each pixel unit can include multiple subpixels. By controlling the brightness of each subpixel, the desired colors are mixed to display a color image. Summary of the Invention

[0003] This disclosure provides a display module, including:

[0004] A display panel includes: an array substrate, the array substrate including a bonding area;

[0005] A printed circuit board is disposed on the backlight side of the display panel;

[0006] A flexible circuit board includes: a flexible substrate, a wiring layer disposed on one side of the flexible substrate, a protective layer disposed on the side of the wiring layer opposite to the flexible substrate, and a reinforcing layer disposed on the side of the flexible substrate opposite to the wiring layer; the flexible substrate includes a first region, a second region, and a third region disposed sequentially, the wiring layer is disposed in the first region, the second region, and the third region, the protective layer covers the second region in its orthographic projection on the flexible substrate, and the orthographic projection of the protective layer on the flexible substrate does not overlap with the first region and the third region, the reinforcing layer covers the third region in its orthographic projection on the flexible substrate; and the wiring layer in the first region is connected to the bonding area, and the wiring layer in the third region is connected to the printed circuit board.

[0007] The protective layer has a first boundary on the side of the orthographic projection of the flexible substrate closer to the first region, and the reinforcing layer has a second boundary on the side of the orthographic projection of the flexible substrate closer to the first boundary, and the distance between the first boundary and the second boundary is greater than 0.

[0008] In some examples, the reinforcing layer includes a first reinforcing layer that, in its orthographic projection onto the flexible substrate, covers the third region and the edge portion of the second region near the third region;

[0009] The first reinforcing layer is positioned on the side of the flexible substrate closest to the first boundary as the second boundary.

[0010] In some examples, the reinforcing layer includes a first reinforcing layer and a second reinforcing layer, wherein the first reinforcing layer, in its orthographic projection onto the flexible substrate, covers the third region and the edge portion of the second region near the third region; and the second reinforcing layer, in its orthographic projection onto the flexible substrate, is disposed within the first region.

[0011] The second reinforcing layer is defined as the boundary of the side of the flexible substrate closest to the first boundary in the orthographic projection of the second reinforcing layer.

[0012] In some examples, the distance between the first boundary and the second boundary is not less than 0.4 mm.

[0013] In some examples, the protective layer is in direct contact with the flexible substrate;

[0014] Alternatively, the protective layer may be attached to the flexible substrate using an adhesive.

[0015] In some examples, the material of the protective layer is less flexible than the material of the flexible substrate.

[0016] In some examples, the material of the flexible substrate includes polyimide; and / or,

[0017] The material of the protective layer includes ink.

[0018] In some examples, the thickness of the flexible substrate is 15 μm to 25 μm.

[0019] In some examples, the thickness of the flexible circuit board corresponding to the second region is 50 μm to 65 μm.

[0020] In some examples, the display panel further includes: a counter substrate disposed opposite to the array substrate, the array substrate further including a functional area, the functional area including a display area and a non-display area surrounding the display area; the orthographic projection of the counter substrate onto the flexible substrate covers the functional area, and the orthographic projection of the counter substrate onto the flexible substrate does not overlap with the bonding area;

[0021] The display module further includes a back plate, which is disposed on the backlight side of the display panel, and the printed circuit board is attached to the side of the back plate away from the display panel.

[0022] In some examples, the display panel further includes a bezel covering the flexible circuit board between the display panel and the backplate;

[0023] The frame has a groove, and the flexible circuit board is disposed in the groove.

[0024] In some examples, the depth of the groove is 0.3 mm to 0.6 mm.

[0025] In some examples, the display module further includes: edge-sealing tape; a first end of the edge-sealing tape is bonded to a portion of the surface of the opposing substrate on the side opposite to the array substrate corresponding to the non-display area, and a second end of the edge-sealing tape is bonded to the side of the back plate on the side opposite to the display panel away from the printed circuit board, and the edge-sealing tape wraps around the flexible circuit board and the printed circuit board.

[0026] In some examples, the binding tape is provided with at least two crease lines spaced apart, each of the at least two crease lines being configured to create an edge when the binding tape is bent.

[0027] In some examples, the at least two indentation line structures include a first indentation line structure and a second indentation line structure, wherein the first indentation line structure is closer to the display panel than the second indentation line structure;

[0028] The distance between the plane containing the first indentation line structure and the first surface of the array substrate facing the opposing substrate is 0.3 μm to 0.5 μm, and the plane containing the first indentation line structure is parallel to the first surface; and / or,

[0029] The distance between the plane containing the second indentation line structure and the second surface of the back plate on the side opposite to the display panel is 0.3μm to 0.5μm, and the plane containing the second indentation line structure is parallel to the second surface.

[0030] In some examples, the indentation line structure includes a plurality of through holes penetrating the binding tape, the plurality of through holes being spaced apart and arranged in a straight line.

[0031] In some examples, the shapes of the plurality of through holes include one or a combination of rectangles, squares, circles, and ellipses.

[0032] In some examples, the edge-sealing tape includes: a tape substrate, a black ink layer disposed on one side of the tape substrate, a metal layer disposed on the side of the tape substrate opposite to the black ink layer, and an adhesive layer disposed on the side of the metal layer opposite to the tape substrate; the thickness of the tape substrate is 10μm to 15μm.

[0033] In some examples, the back panel has a first alignment mark group and a second alignment mark group; the first alignment mark group includes: a first right-angle mark and at least two first strip-shaped marks arranged in parallel, and the second alignment mark group includes: a second right-angle mark and at least two second strip-shaped marks arranged in parallel, wherein the at least two first strip-shaped marks correspond one-to-one with the at least two second strip-shaped marks, and the corresponding first strip-shaped marks and second strip-shaped marks extend on the same straight line;

[0034] The printed circuit board has a first side and a second side arranged opposite to each other; a first corner on the first side corresponds to a first right-angle mark, a second corner on the first side corresponds to a second right-angle mark, a third corner on the second side corresponds to at least two first strip marks, and a fourth corner on the second side corresponds to at least two second strip marks. The first strip marks and a portion of the second strip marks are correspondingly arranged on the front projection of the printed circuit board on the back plate, and the front projection of the printed circuit board on the back plate does not overlap with another portion of the first and second strip marks.

[0035] In some examples, the backplate also has a third alignment mark group; the third alignment mark group includes: at least two third strip marks, wherein the at least two first strip marks, the at least two second strip marks and the at least two third strip marks correspond one-to-one, and the corresponding first strip marks, second strip marks and third strip marks extend on the same straight line;

[0036] The orthographic projection of the printed circuit board onto the back panel covers the third strip mark corresponding to the portion of the first strip mark, and the orthographic projection of the printed circuit board onto the back panel does not overlap with the third strip mark corresponding to the other portion of the first strip mark.

[0037] In some examples, the backplate also has a fourth alignment mark group and a fifth alignment mark group; the fourth alignment mark group includes at least two fourth strip-shaped marks arranged in parallel, and the fifth alignment mark group includes at least two fifth strip-shaped marks arranged in parallel, wherein the at least two fourth strip-shaped marks correspond one-to-one with the at least two fifth strip-shaped marks, and the corresponding fourth strip-shaped marks and fifth strip-shaped marks extend on the same straight line;

[0038] The fourth and fifth strip marks are correspondingly provided on the orthographic projection of the edging tape on the back plate, and the orthographic projection of the printed circuit board on the back plate does not overlap with another part of the third strip mark.

[0039] In some examples, the backplate also has a sixth pair of alignment marks; the sixth pair of alignment marks includes: at least two sixth strip marks, the at least two fourth strip marks, the at least two fifth strip marks and the at least two sixth strip marks are in one-to-one correspondence, and the corresponding fourth strip marks, fifth strip marks and sixth strip marks extend on the same straight line;

[0040] The orthographic projection of the edging tape on the back panel covers the sixth strip mark corresponding to the portion of the fourth strip mark, and the orthographic projection of the edging tape on the back panel does not overlap with the sixth strip mark corresponding to the other portion of the fourth strip mark.

[0041] In some examples, the display module further includes: a plurality of driving chips arranged along a first direction, the plurality of driving chips being disposed in a bonding area of ​​the array substrate;

[0042] There are multiple flexible circuit boards, and each of the multiple flexible circuit boards is connected to at least two of the multiple driver chips.

[0043] The bonding area includes a plurality of first sub-bonding areas arranged sequentially along the first direction. Each of the plurality of first sub-bonding areas corresponds one-to-one with the plurality of flexible circuit boards. Each of the plurality of first sub-bonding areas has a first chip bonding area, a circuit bonding area, and a second chip bonding area arranged sequentially along the first direction. The flexible circuit board is connected to the corresponding circuit bonding area. The first chip bonding area is provided with a portion of the driver chips of the at least two driver chips corresponding to the flexible circuit board. The second chip bonding area is provided with another portion of the driver chips of the at least two driver chips corresponding to the flexible circuit board.

[0044] This disclosure also provides a display device, including the display module described above. Attached Figure Description

[0045] Figure 1 This is a schematic diagram of the structure of the display module in an embodiment of this disclosure;

[0046] Figure 2 These are some structural schematic diagrams of the flexible circuit board in the embodiments of this disclosure;

[0047] Figure 3 These are further structural schematic diagrams of the flexible circuit board in the embodiments of this disclosure;

[0048] Figure 4 These are further structural schematic diagrams of the flexible circuit board in the embodiments of this disclosure;

[0049] Figure 5These are some top view structural schematic diagrams of the edge-binding tape in the embodiments of this disclosure;

[0050] Figure 6 These are some cross-sectional structural schematic diagrams of the edge-binding tape in the embodiments of this disclosure;

[0051] Figure 7 These are some structural schematic diagrams of the backplate in the embodiments of this disclosure;

[0052] Figure 8 These are some structural schematic diagrams of the backplane and printed circuit board in the embodiments of this disclosure;

[0053] Figure 9 These are some structural schematic diagrams of the back plate and edge binding tape in the embodiments of this disclosure;

[0054] Figure 10 These are schematic diagrams of some partial structures of the display panel in the embodiments of this disclosure;

[0055] Figure 11 These are some structural schematic diagrams of the flexible circuit board and driver chip in the embodiments of this disclosure. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0057] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0058] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0059] like Figure 1 As shown, this embodiment of the disclosure provides a display module, including: a display panel 100, a printed circuit board (PCB) 300, a flexible printed circuit board (FPC) 200, and a backplate 400. The PCB 300 is connected to the display panel 100 via the FPC 200, so that drive signals generated by the PCB 300 are transmitted to the display panel 100 through the FPC 200 to drive the display panel 100 to operate. Furthermore, the backplate 400 is attached to the backlight side of the display panel 100 using panel spacers, and the PCB 300 is attached to the side of the backplate 400 away from the display panel 100 using adhesive material (e.g., double-sided tape), thus positioning the PCB 300 on the backlight side of the display panel 100. This arrangement not only reduces the border of the display panel 100 and lowers its bezel width, but also reduces the number of openings in the backplate 400 and increases its strength.

[0060] For example, such as Figure 1 As shown, the display panel 100 includes: an array substrate 110, a counter substrate 120 disposed opposite to the array substrate 110, and a polarizer 130 disposed on the side of the counter substrate 120 facing away from the array substrate 110. The array substrate 110 includes a bonding area and a functional area, the functional area including a display area and a non-display area surrounding the display area. The orthographic projection of the counter substrate 120 onto the flexible substrate covers the functional area, and the orthographic projection of the counter substrate 120 onto the flexible substrate does not overlap with the bonding area. Similarly, the orthographic projection of the polarizer 130 onto the flexible substrate covers the display area, and the orthographic projection of the polarizer 130 onto the flexible substrate does not overlap with the bonding area.

[0061] For example, such as Figure 1 As shown, the display module also includes a plurality of driver chips 600 (e.g., source driver chips), which are disposed in the bonding area of ​​the array substrate 110. For example, the plurality of driver chips 600 are bonded in the bonding area of ​​the array substrate 110, and the flexible circuit board 200 is bonded to the bonding area of ​​the plurality of driver chips 600 on the side away from the display area.

[0062] For example, such as Figure 1As shown, the display module also includes: edge-sealing tape 500; the first end of the edge-sealing tape 500 is bonded to the portion of the non-display area on the surface of the opposing substrate 120 away from the array substrate 110, and the second end of the edge-sealing tape 500 is bonded to the side of the back plate 400 away from the display panel 100 away from the printed circuit board 300. This arrangement allows the edge-sealing tape 500 to wrap around the flexible circuit board 200 and the printed circuit board 300, thus protecting them.

[0063] The display panel in this embodiment can be a liquid crystal display panel. Of course, other display panels can also be used, and this is not limited thereto.

[0064] Because of the difference in the coefficients of thermal expansion between the driver chip and the array substrate (e.g., a glass substrate), and because the temperature experienced by the driver chip during bonding is higher than that experienced by the array substrate, when the driver chip and the array substrate recover after bonding, the shrinkage distance of the driver chip is greater than that of the array substrate. This causes deformation of the array substrate at the corners of the driver chip, resulting in changes in birefringence and liquid crystal azimuth at the deformed location, manifested as COG (Chip On Glass) Mura. However, during the bending process of the FPC, the springback stress of the FPC pulls on the endpoints of its contact points. There is no obvious change on the backplane side, but the stress on the side connecting to the array substrate will cause deformation of the array substrate. This, combined with the COG Mura of the driver chip, exacerbates the COGMura.

[0065] Based on this, embodiments of the present disclosure provide an improved flexible circuit board for improving COG Mura.

[0066] For example, such as Figures 2 to 4 As shown, the flexible circuit board 200 may include: a flexible substrate 210, a wiring layer 220 disposed on one side of the flexible substrate 210, a protective layer 230 disposed on the side of the wiring layer 220 opposite to the flexible substrate 210, and a reinforcing layer (e.g., 241, 242) disposed on the side of the flexible substrate 210 opposite to the wiring layer 220. The flexible substrate 210 includes a first region Q1, a second region Q2, and a third region Q3 disposed sequentially. The wiring layer 220 is disposed in the first region Q1, the second region Q2, and the third region Q3. Furthermore, the orthographic projection of the protective layer 230 onto the flexible substrate 210 covers the second region Q2, and the orthographic projection of the protective layer 230 onto the flexible substrate 210 does not overlap with the first region Q1 and the third region Q3. The orthographic projection of the reinforcing layer onto the flexible substrate covers the third region Q3.

[0067] Combination Figures 1 to 4As shown, the trace layer 220 (e.g., bonding) of the first region Q1 is connected to the bonding area, and the trace layer 220 of the third region Q3 is connected to the printed circuit board 300. That is, the side of the flexible circuit board 200 with the trace layer 220 is close to the backplane 400, and the side of the flexible circuit board 200 with the reinforcement layer is away from the backplane 400.

[0068] For example, such as Figures 2 to 4 As shown, the protective layer 230 has a first boundary S1 on the side of the orthographic projection of the flexible substrate 210 near the first region Q1, and the reinforcing layer has a second boundary S2 on the side of the orthographic projection of the flexible substrate 210 near the first boundary S1. The distance h1 between the first boundary S1 and the second boundary S2 is greater than 0. This configuration can reduce the resilience of the flexible circuit board 200 and reduce the deformation of the array substrate 110 substrate.

[0069] In some examples, such as Figure 2 As shown, the reinforcing layer includes a first reinforcing layer 241, whose orthographic projection on the flexible substrate covers the third region Q3 and the edge portion of the second region Q2 near the third region Q3. Furthermore, the side boundary of the first reinforcing layer 241 near the first boundary S1 in the orthographic projection on the flexible substrate 210 can be designated as the second boundary S2. With this configuration, no reinforcing layer is provided in the remaining areas of the second region Q2 and in the first region Q1, thereby further reducing the resilience of the flexible circuit board 200 and minimizing substrate deformation of the array substrate 110.

[0070] In some other examples, such as Figure 3 and Figure 4 As shown, the reinforcing layer includes a first reinforcing layer 241 and a second reinforcing layer 242. The first reinforcing layer 241, in its orthographic projection onto the flexible substrate 210, covers the third region Q3 and the edge portion of the second region Q2 near the third region Q3. The second reinforcing layer 242, in its orthographic projection onto the flexible substrate 210, is disposed within the first region Q1. Furthermore, the side boundary of the second reinforcing layer 242 in its orthographic projection onto the flexible substrate 210 closest to the first boundary S1 serves as the second boundary S2. This configuration eliminates the need for reinforcing layers in the remaining areas of the second region Q2, and by indenting the reinforcing layer in the first region Q1, the resilience of the flexible circuit board 200 can be further reduced, thereby minimizing substrate deformation of the array substrate 110.

[0071] In this embodiment, the distance h1 between the first boundary S1 and the second boundary S2 can be not less than 0.4 mm. This setting prevents the second reinforcing layer 242 and the protective layer 230 from contacting in a direction perpendicular to the flexible substrate 210, reducing the risk of breakage. Optionally, the distance h1 can be set to 0.4 mm, 0.5 mm, 0.6 mm, etc., and is not limited thereto.

[0072] In some examples, such as Figure 2 and Figure 3 As shown, the protective layer 230 can be in direct contact with the flexible substrate 210.

[0073] In some other examples, such as Figure 4 As shown, the protective layer 230 can also be attached to the flexible substrate 210 by means of an adhesive.

[0074] In this embodiment, the material of the protective layer 230 can be made less flexible than the material of the flexible substrate 210, thereby further reducing the rebound force and reducing the deformation of the array substrate 110 substrate.

[0075] For example, the material of the flexible substrate 210 includes, but is not limited to, polyimide, which can further reduce the resilience and reduce the deformation of the array substrate 110 substrate.

[0076] For example, the thickness of the flexible substrate 210 is set to 15-25 μm, which can further reduce the rebound force and reduce the deformation of the array substrate 110. Optionally, the thickness of the flexible substrate 210 can be set to 15 μm, 17 μm, 20 μm, 22 μm, 24 μm, 25 μm, etc., and is not limited here.

[0077] For example, the material of the protective layer 230 includes, but is not limited to, ink (e.g., green ink), which can further reduce the resilience and reduce the deformation of the array substrate 110 substrate.

[0078] For example, the material of the wiring layer 220 can be a metallic material, such as Cu, etc., without limitation.

[0079] For example, the thickness of the flexible circuit board 200 corresponding to the second region Q2 can be 50μm to 65μm, which can further reduce the springback force and reduce the deformation of the array substrate 110. Optionally, the thickness of the flexible circuit board 200 corresponding to the second region Q2 can be set to 50μm, 52μm, 55μm, 58μm, 60μm, 63μm, 65μm, etc., which is not limited here.

[0080] In practical applications, the binding tape also exhibits springback force during bending. This springback stress pulls on the endpoints of the contact area, with no significant change on the backplate side. However, the stress on the side connecting to the array substrate will cause deformation of the array substrate. Simultaneously, the COG Mura of the superimposed driver chip also exacerbates the COG Mura. Therefore, the binding tape can be provided with at least two spaced-apart indentation lines. Each of the at least two indentation lines is configured to create an edge when the binding tape is bent, thereby shaping the binding tape during bending and preventing springback.

[0081] For example, such as Figure 1 and Figure 5 As shown, the edge-binding tape 500 is provided with two crease line structures spaced apart: a first crease line structure 501 and a second crease line structure 502. The first crease line structure 501 is closer to the display panel 100 than the second crease line structure 502. The first crease line structure 501 is configured to create an edge R1 when the edge-binding tape 500 is bent, and the second crease line structure 502 is configured to create an edge R2 when the edge-binding tape 500 is bent, thereby shaping the edge-binding tape 500 when bent and preventing it from springing back.

[0082] This disclosure uses two indentation line structures as an example for illustration only. In practical applications, three, four or more indentation line structures can also be set, and no limitation is made here.

[0083] For example, such as Figure 1 and Figure 5 As shown, the distance h21 between the plane containing the first indentation line structure 501 and the first surface of the array substrate 110 facing the opposite substrate 120 is 0.3μm to 0.5μm, and the plane containing the first indentation line structure 501 is parallel to the first surface. This configuration reduces the possibility of FPC compression caused by the stretching tape 500 while fixing the bending. Setting the distance h21 to 0.3μm to 0.5μm provides a tolerance allowance for the adhesion of the stretching tape 500 on both sides, thereby improving performance and enhancing factory operability.

[0084] Optionally, the distance h21 can be set to 0.3μm, 0.35μm, 0.4μm, 0.45μm, 0.5μm, etc., without limitation.

[0085] For example, such as Figure 1 and Figure 5 As shown, the distance h22 between the plane containing the second indentation line structure 502 and the second surface of the back panel 400 on the side opposite to the display panel 100 is 0.3μm to 0.5μm, and the plane containing the second indentation line structure 502 is parallel to the second surface. This design, while fixing the bending, also reduces the possibility of the edge-binding tape 500 pulling and squeezing the FPC. Setting the distance h22 to 0.3μm to 0.5μm provides a tolerance allowance for the edge-binding tape 500 on both sides, thereby improving performance and enhancing factory operability.

[0086] Optionally, the distance h22 can be set to 0.3μm, 0.35μm, 0.4μm, 0.45μm, 0.5μm, etc., without limitation.

[0087] For example, distances h21 and h22 can be the same or different, without limitation.

[0088] In this embodiment of the disclosure, each indentation line structure may include a plurality of through holes GK penetrating the edge-binding tape 500, the plurality of through holes GK being spaced apart and arranged in a straight line. For example, as shown... Figure 6 As shown, the edge-binding tape 500 includes: a tape substrate 510, a black ink layer 520 disposed on one side of the tape substrate 510, a metal layer 530 disposed on the side of the tape substrate 510 opposite to the black ink layer 520, and an adhesive layer 540 disposed on the side of the metal layer 530 opposite to the tape substrate 510. That is, the plurality of through holes GK penetrate the tape substrate 510, the black ink layer 520, the metal layer 530, and the adhesive layer 540.

[0089] For example, the shape of the multiple through holes GK may include one or a combination of rectangles, squares, circles, and ovals. Of course, the shape of the through holes GK can also be set to other shapes, which are not limited here.

[0090] For example, the thickness of the tape substrate 510 can be 10μm to 15μm, which is lower than the 25μm set in the prior art. This reduces the overall resilience of the edge-wrapping tape 500 and further reduces the deformation of the array substrate 110 substrate.

[0091] For example, the material of the metal layer 530 is a metallic material, such as Al, etc., which is not limited here.

[0092] In this embodiment of the disclosure, such as Figures 7 to 9 As shown, the back panel 400 has a first alignment mark group 410 and a second alignment mark group 420; the first alignment mark group 410 includes: a first right-angle mark 411 and at least two first strip marks 412 arranged in parallel; the second alignment mark group 420 includes: a second right-angle mark 421 and at least two second strip marks 422 arranged in parallel; the at least two first strip marks 412 correspond one-to-one with the at least two second strip marks 422, and the corresponding first strip marks 412 and second strip marks 422 extend on the same straight line.

[0093] In this embodiment of the disclosure, such as Figures 7 to 9As shown, the printed circuit board 300 has a first side S1 and a second side S2 arranged opposite to each other; the flexible circuit board 200 is connected to the second side S2 of the printed circuit board 300. Specifically, the first corner of the first side S1 corresponds to a first right-angle mark 411, the second corner of the first side S1 corresponds to a second right-angle mark 421, the third corner of the second side S2 corresponds to at least two first strip-shaped marks 412, and the fourth corner of the second side S2 corresponds to at least two second strip-shaped marks 422. Furthermore, the first strip-shaped marks 412 and a portion of the second strip-shaped marks 422 corresponding to the orthographic projection of the printed circuit board 300 onto the back plate 400 do not overlap with the other portion of the corresponding first strip-shaped marks 412 and second strip-shaped marks 422. This arrangement ensures the attachment accuracy of the printed circuit board 300 and avoids pulling in the middle.

[0094] For example, the first right-angle mark 411 and the second right-angle mark 421 may be, but are not limited to, L-shaped, etc., without limitation.

[0095] For example, the distance between two adjacent first bar marks 412 can be set to 0.6mm to 1.2mm. Specifically, the distance between two adjacent first bar marks 412 can be set to 0.6mm to 0.8mm. Alternatively, the distance between two adjacent first bar marks 412 can be set to 0.8mm to 1.2mm. Or, the distance between two adjacent first bar marks 412 can be set to 0.7mm to 1.0mm.

[0096] For example, the distance between two adjacent second bar marks 422 can be set to 0.6mm to 1.2mm. Specifically, the distance between two adjacent second bar marks 422 can be set to 0.6mm to 0.8mm. Alternatively, the distance between two adjacent second bar marks 422 can be set to 0.8mm to 1.2mm. Or, the distance between two adjacent second bar marks 422 can be set to 0.7mm to 1.0mm.

[0097] In this embodiment of the disclosure, such as Figures 7 to 9As shown, the backplate 400 also has a third alignment mark group 430; the third alignment mark group 430 includes: at least two third strip marks 431, at least two first strip marks 412, at least two second strip marks 422, and at least two third strip marks 431 corresponding one-to-one, and the corresponding first strip marks 412, second strip marks 422, and third strip marks 431 extend on the same straight line. Furthermore, the orthographic projection of the printed circuit board 300 on the backplate 400 covers a portion of the third strip marks 431 corresponding to the first strip marks 412, and the orthographic projection of the printed circuit board 300 on the backplate 400 does not overlap with another portion of the third strip marks 431 corresponding to the first strip marks 412, further ensuring the attachment accuracy of the printed circuit board 300 and avoiding intermediate pulling.

[0098] In this embodiment of the disclosure, such as Figures 7 to 9 As shown, the backplate 400 also has a fourth alignment mark group 440 and a fifth alignment mark group 450. The fourth alignment mark group 440 includes at least two parallel fourth strip-shaped marks 441, and the fifth alignment mark group 450 includes at least two parallel fifth strip-shaped marks 451. The at least two fourth strip-shaped marks 441 and the at least two fifth strip-shaped marks 451 correspond one-to-one, and the corresponding fourth strip-shaped marks 441 and fifth strip-shaped marks 451 extend along the same straight line. Furthermore, the fourth strip-shaped marks 441 and fifth strip-shaped marks 451 corresponding to the orthographic projection of the edge-sealing tape 500 on the backplate 400 do not overlap with another portion of the third strip-shaped marks 431. This arrangement ensures the adhesion accuracy of the edge-sealing tape 500 and avoids pulling in the middle.

[0099] For example, the distance between two adjacent fourth bar marks 441 can be set to 0.6mm to 1.2mm. Specifically, the distance between two adjacent fourth bar marks 441 can be set to 0.6mm to 0.8mm. Alternatively, the distance between two adjacent fourth bar marks 441 can be set to 0.8mm to 1.2mm. Or, the distance between two adjacent fourth bar marks 441 can be set to 0.7mm to 1.0mm.

[0100] For example, the distance between two adjacent fifth bar marks 451 can be set to 0.6mm to 1.2mm. Specifically, the distance between two adjacent fifth bar marks 451 can be set to 0.6mm to 0.8mm. Alternatively, the distance between two adjacent fifth bar marks 451 can be set to 0.8mm to 1.2mm. Or, the distance between two adjacent fifth bar marks 451 can be set to 0.7mm to 1.0mm.

[0101] In this embodiment of the disclosure, such as Figures 7 to 9 As shown, the back panel 400 also has a sixth alignment mark group 460; the sixth alignment mark group 460 includes: at least two sixth strip marks 461, at least two fourth strip marks 441, at least two fifth strip marks 451, and at least two sixth strip marks 461 corresponding one-to-one, and the corresponding fourth strip marks 441, fifth strip marks 451, and sixth strip marks 461 extend along the same straight line. Furthermore, the orthographic projection of the edge-binding tape 500 on the back panel 400 covers a portion of the sixth strip marks 461 corresponding to the fourth strip marks 441, and the orthographic projection of the edge-binding tape 500 on the back panel 400 does not overlap with another portion of the sixth strip marks 461 corresponding to the fourth strip marks 441, thereby ensuring the adhesion accuracy of the edge-binding tape 500 and avoiding pulling in the middle.

[0102] To further reduce the squeezing effect of the edge-sealing tape 500 on the FPC, in the embodiments of this disclosure, such as Figure 10 As shown, the display panel 100 also includes a frame that covers the flexible circuit board 200 between the display panel 100 and the back plate 400. The frame has a groove in which the flexible circuit board 200 is disposed. This arrangement allows the FPC to be placed within the groove, ensuring that the FPC is not subjected to external pressure and reducing tension.

[0103] For example, such as Figure 10 As shown, the depth d1 of the groove can be set to 0.3mm to 0.6mm to further ensure that the FPC will not be squeezed by external forces in the groove and reduce pulling.

[0104] Optionally, the depth d1 can be set to 0.3mm, 0.4mm, 0.5mm, 0.6mm, etc., and is not limited here.

[0105] To further reduce the load on the COG Mura caused by FPC tension, in this embodiment of the disclosure, as follows: Figure 11As shown, multiple driver chips 600 can be arranged along a first direction F1 (e.g., the pixel row direction of the display area). There are multiple flexible circuit boards 200, and each of the multiple flexible circuit boards 200 is connected to at least two of the multiple driver chips 600, that is, one flexible circuit board 200 is connected to two or more driver chips 600. Furthermore, the bonding area BD includes a plurality of first sub-bonding areas BDS arranged sequentially along the first direction F1. Each of the plurality of first sub-bonding areas BDS corresponds one-to-one with a plurality of flexible circuit boards 200. Each of the plurality of first sub-bonding areas BDS has a first chip bonding area BDC1, a circuit bonding area BDL, and a second chip bonding area BDC2 arranged sequentially along the first direction F1. The flexible circuit board 200 is connected to the corresponding circuit bonding area BDL. The first chip bonding area BDC1 is provided with a portion of the driver chips 600 of at least two driver chips 600 corresponding to the flexible circuit board 200. The second chip bonding area BDC2 is provided with another portion of the driver chips 600 of at least two driver chips 600 corresponding to the flexible circuit board 200.

[0106] Taking a flexible circuit board 200 connected to two driver chips 600 as an example, such as Figure 11 As shown, multiple driver chips 600 are arranged along a first direction F1. A flexible circuit board 200 is connected to a corresponding circuit bonding area BDL. A first chip bonding area BDC1 is provided with one driver chip 600 corresponding to the flexible circuit board 200, and a second chip bonding area BDC2 is provided with another driver chip 600 corresponding to the flexible circuit board 200. Furthermore, the flexible circuit board 200 can be connected to the driver chip 600 via side traces. Compared to a method where one flexible circuit board 200 is connected to one driver chip 600, this embodiment of the present disclosure achieves a narrow bezel and reduces the impact of FPC stretching on the driver chip 600 during bending.

[0107] Based on the same disclosed concept, this disclosure also provides a display device, including the display module described above. The principle by which this display device solves the problem is similar to that of the aforementioned display module; therefore, the implementation of this display device can refer to the implementation of the aforementioned display module, and the repetitions will not be repeated here.

[0108] In specific implementations, in the embodiments of this disclosure, the display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of the display device are those that should be understood by those skilled in the art, and will not be described in detail here, nor should they be construed as limiting this disclosure.

[0109] The display module and display device provided in this disclosure can reduce the deformation of the array substrate and improve COG Mura by reducing the springback force of the flexible circuit board.

[0110] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0111] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, if these modifications and variations to the embodiments of this disclosure fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include these modifications and variations.

Claims

1. A display module, comprising: A display panel includes: an array substrate, the array substrate including a bonding area; A printed circuit board is disposed on the backlight side of the display panel; A flexible circuit board includes: a flexible substrate, a wiring layer disposed on one side of the flexible substrate, a protective layer disposed on the side of the wiring layer opposite to the flexible substrate, and a reinforcing layer disposed on the side of the flexible substrate opposite to the wiring layer; the flexible substrate includes a first region, a second region, and a third region disposed sequentially, the wiring layer is disposed in the first region, the second region, and the third region, the protective layer covers the second region in its orthographic projection on the flexible substrate, and the orthographic projection of the protective layer on the flexible substrate does not overlap with the first region and the third region, the reinforcing layer covers the third region in its orthographic projection on the flexible substrate; and the wiring layer in the first region is connected to the bonding area, and the wiring layer in the third region is connected to the printed circuit board. The protective layer has a first boundary on the side of the flexible substrate that is closer to the first region when projected onto the flexible substrate, and the reinforcing layer has a second boundary on the side of the flexible substrate that is closer to the first boundary when projected onto the flexible substrate, and the distance between the first boundary and the second boundary is not less than 0.4 mm. The reinforcing layer includes a first reinforcing layer and a second reinforcing layer. The first reinforcing layer covers the third region and the edge portion of the second region near the third region in the orthographic projection of the flexible substrate. The second reinforcing layer is disposed in the first region in the orthographic projection of the flexible substrate. The second reinforcing layer is defined as the boundary of the side of the flexible substrate closest to the first boundary in the orthographic projection of the second reinforcing layer.

2. The display module as described in claim 1, wherein, The protective layer is in direct contact with the flexible substrate; Alternatively, the protective layer may be attached to the flexible substrate using an adhesive.

3. The display module as described in claim 1 or 2, wherein, The material of the protective layer is less flexible than the material of the flexible substrate.

4. The display module as described in claim 3, wherein, The flexible substrate is made of polyimide; and / or, The material of the protective layer includes ink.

5. The display module as described in claim 1 or 2, wherein, The thickness of the flexible substrate is 15μm~25μm.

6. The display module as described in claim 1 or 2, wherein, The thickness of the flexible circuit board corresponding to the second region is 50μm~65μm.

7. The display module as described in claim 1, wherein, The display panel further includes: a counter substrate disposed opposite to the array substrate, the array substrate further including a functional area, the functional area including a display area and a non-display area surrounding the display area; the orthographic projection of the counter substrate on the flexible substrate covers the functional area, and the orthographic projection of the counter substrate on the flexible substrate does not overlap with the bonding area. The display module further includes a back plate, which is disposed on the backlight side of the display panel, and the printed circuit board is attached to the side of the back plate away from the display panel.

8. The display module as described in claim 7, wherein, The display panel further includes: a frame, which covers the space between the flexible circuit board and the display panel and the back plate; The frame has a groove, and the flexible circuit board is disposed in the groove.

9. The display module as described in claim 8, wherein, The depth of the groove is 0.3mm to 0.6mm.

10. The display module as claimed in claim 9, wherein, The display module further includes: edge-sealing tape; a first end of the edge-sealing tape is bonded to a portion of the non-display area on the surface of the opposing substrate away from the array substrate, and a second end of the edge-sealing tape is bonded to the side of the back plate away from the display panel away from the printed circuit board, and the edge-sealing tape wraps around the flexible circuit board and the printed circuit board.

11. The display module as claimed in claim 10, wherein, The binding tape is provided with at least two crease lines spaced apart, each of the at least two crease lines being configured to create an edge when the binding tape is bent.

12. The display module as claimed in claim 11, wherein, The at least two indentation line structures include a first indentation line structure and a second indentation line structure, wherein the first indentation line structure is closer to the display panel than the second indentation line structure; The distance between the plane containing the first indentation line structure and the first surface of the array substrate facing the opposing substrate is 0.3 μm to 0.5 μm, and the plane containing the first indentation line structure is parallel to the first surface. And / or, The distance between the plane containing the second indentation line structure and the second surface of the back plate on the side opposite to the display panel is 0.3μm to 0.5μm, and the plane containing the second indentation line structure is parallel to the second surface.

13. The display module as described in claim 11 or 12, wherein, The embossing line structure includes multiple through holes penetrating the edge-binding tape, and the multiple through holes are spaced apart and arranged in a straight line.

14. The display module as described in claim 13, wherein, The shapes of the plurality of through holes include one or a combination of rectangles, squares, circles, and ellipses.

15. The display module as described in any one of claims 10-12, wherein, The edge-binding tape includes: a tape substrate, a black ink layer disposed on one side of the tape substrate, a metal layer disposed on the side of the tape substrate opposite to the black ink layer, and an adhesive layer disposed on the side of the metal layer opposite to the tape substrate; the thickness of the tape substrate is 10μm~15μm.

16. The display module as described in any one of claims 10-12, wherein, The back plate has a first alignment mark group and a second alignment mark group; The first alignment mark group includes: a first right-angle mark and at least two first strip marks arranged in parallel; the second alignment mark group includes: a second right-angle mark and at least two second strip marks arranged in parallel; the at least two first strip marks correspond one-to-one with the at least two second strip marks, and the corresponding first strip marks and second strip marks extend on the same straight line. The printed circuit board has a first side and a second side arranged opposite to each other; a first corner on the first side corresponds to a first right-angle mark, a second corner on the first side corresponds to a second right-angle mark, a third corner on the second side corresponds to at least two first strip marks, and a fourth corner on the second side corresponds to at least two second strip marks. The first strip marks and a portion of the second strip marks are correspondingly arranged on the front projection of the printed circuit board on the back plate, and the front projection of the printed circuit board on the back plate does not overlap with another portion of the first and second strip marks.

17. The display module as claimed in claim 16, wherein, The back panel also has a third alignment mark group; the third alignment mark group includes: at least two third strip marks, the at least two first strip marks, the at least two second strip marks and the at least two third strip marks correspond one-to-one, and the corresponding first strip marks, second strip marks and third strip marks extend on the same straight line; The orthographic projection of the printed circuit board onto the back panel covers the third strip mark corresponding to the portion of the first strip mark, and the orthographic projection of the printed circuit board onto the back panel does not overlap with the third strip mark corresponding to the other portion of the first strip mark.

18. The display module as claimed in claim 17, wherein, The backplate also has a fourth alignment mark group and a fifth alignment mark group; The fourth alignment mark group includes at least two fourth strip-shaped marks arranged in parallel, and the fifth alignment mark group includes at least two fifth strip-shaped marks arranged in parallel, wherein the at least two fourth strip-shaped marks correspond one-to-one with the at least two fifth strip-shaped marks, and the corresponding fourth strip-shaped marks and fifth strip-shaped marks extend on the same straight line. The fourth and fifth strip marks are correspondingly provided on the orthographic projection of the edging tape on the back plate, and the orthographic projection of the printed circuit board on the back plate does not overlap with another part of the third strip mark.

19. The display module as claimed in claim 18, wherein, The back panel also has a sixth pair of alignment marks; the sixth pair of alignment marks includes: at least two sixth strip marks, the at least two fourth strip marks, the at least two fifth strip marks and the at least two sixth strip marks correspond one-to-one, and the corresponding fourth strip marks, fifth marks and sixth marks extend on the same straight line; The orthographic projection of the edging tape on the back panel covers the sixth strip mark corresponding to the portion of the fourth strip mark, and the orthographic projection of the edging tape on the back panel does not overlap with the sixth strip mark corresponding to the other portion of the fourth strip mark.

20. The display module as described in any one of claims 1-2 and 7-12, wherein, The display module further includes: a plurality of driving chips arranged along a first direction, the plurality of driving chips being disposed in the bonding area of ​​the array substrate; There are multiple flexible circuit boards, and each of the multiple flexible circuit boards is connected to at least two of the multiple driver chips. The bonding area includes a plurality of first sub-bonding areas arranged sequentially along the first direction. Each of the plurality of first sub-bonding areas corresponds one-to-one with the plurality of flexible circuit boards. Each of the plurality of first sub-bonding areas has a first chip bonding area, a circuit bonding area, and a second chip bonding area arranged sequentially along the first direction. The flexible circuit board is connected to the corresponding circuit bonding area. The first chip bonding area is provided with a portion of the driver chips of the at least two driver chips corresponding to the flexible circuit board. The second chip bonding area is provided with another portion of the driver chips of the at least two driver chips corresponding to the flexible circuit board.

21. A display device, wherein, Includes the display module as described in any one of claims 1-20.

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