Camera module chip and lens focusing anti-shake structure

Abstract

The application discloses a camera module chip and lens focusing anti-shake structure, which comprises a shell, a frame arranged in the shell and capable of sliding up and down, a PCB assembly arranged at the lower end of the frame, and a lens arranged at the upper end of the frame. The PCB assembly comprises a square frame-shaped peripheral hard circuit board, a flexible circuit board mounted on the inner side of the peripheral hard circuit board, a center hard circuit board arranged in the middle of the flexible circuit board and capable of moving relative to the peripheral hard circuit board through the flexible circuit board, and an imaging chip arranged on the center hard circuit board. A plurality of SMA wires are arranged between the periphery of the center hard circuit board and the peripheral hard circuit board and are used for X / Y axis direction anti-shake. The peripheral hard circuit board is provided with a coil, the bottom of the shell is provided with a magnetic sheet, and the induced magnetic field generated after the coil is electrified and the magnetic sheet generate mutual repulsion or mutual attraction, so as to drive the lens to move relative to the imaging chip in the Z axis direction, and realize Z axis direction anti-shake and / or automatic focusing.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of cameras, in particular to a camera module chip and lens focusing anti-shake structure. BACKGROUND

[0002] With the increasingly wide application of cameras in mobile terminals, the camera has become a hot selling point of mobile terminals. The image blurs due to the shaking when the camera is handheld or moved during shooting and recording, and the imaging quality is greatly reduced. In the 5G era, the creation and sharing of videos will usher in a new round of explosion, and people's requirements for video shooting equipment are becoming higher and higher. Therefore, the mobile camera needs to have good anti-shake performance to compensate for the image offset caused by shaking and provide stability and clarity of the picture.

[0003] The present inventor has proposed a Chinese invention patent with the patent number CN202220996594.6, which discloses an SMA camera module platform, which comprises a shell, a seat body arranged in the shell, a PCB assembly arranged in the seat body, a lens arranged above the seat body, the upper end of the lens extending out of the upper end surface of the shell, and the interface of the PCB assembly extending out of the shell; a plurality of elastic supporting members are arranged between the lower end surface of the seat body and the bottom surface of the shell; a middle frame is further arranged in the shell, the middle frame is arranged between the seat body and the lens, and a first SMA wire for realizing zoom is arranged between the upper end surface of the middle frame and the peripheral surface of the lower end surface of the lens; a second SMA wire for anti-shake is arranged between the lower end surface of the middle frame and the peripheral surface of the upper end surface of the seat body, and the second SMA wire is correspondingly distributed with the elastic supporting members; a sensing device for detecting and feeding back the balance / flatness of the seat body is further arranged in the shell; the first SMA wire, the second SMA wire and the sensing device are all electrically connected with the PCB assembly. The present application has the advantages of simple structure, small size, low manufacturing cost and high anti-shake performance, and is convenient for realizing a small anti-shake camera system.

[0004] In the specific implementation process, the present inventor installs four vertically distributed first SMA wires between the upper end surface of the middle frame and the peripheral surface of the lower end surface of the lens, and also installs four vertically distributed second SMA wires between the lower end surface of the middle frame and the peripheral surface of the upper end surface of the seat body. In the small camera module, four first SMA wires with smaller volume and four second SMA wires with smaller volume are installed, which is extremely inconvenient to install. In addition, the first SMA wires and the second SMA wires are vertically distributed, which is more difficult to install, and it takes a lot of time and is not efficient. In addition, the four first SMA wires drive the lens to move up and down to realize zoom, and the stroke is limited, and the zoom effect is not ideal.

[0005] The present inventor has continuously developed and experimented, and proposes the following technical scheme to solve the above technical problems. SUMMARY

[0006] The application aims at overcoming the defects of the prior art and providing a camera module chip and lens focusing anti-shake structure.

[0007] In order to solve the above technical problems, the application adopts the following technical scheme: the camera module chip and lens focusing anti-shake structure comprises a shell, a frame arranged in the shell and capable of sliding up and down, a PCB assembly arranged at the lower end of the frame, and a lens arranged at the upper end of the frame, the upper end of the lens extending out of the upper end surface of the shell, and the connector of the PCB assembly extending out of the shell; the PCB assembly comprises a square-shaped peripheral hard circuit board, a flexible circuit board mounted on the inner side of the peripheral hard circuit board, a central hard circuit board arranged in the middle of the flexible circuit board and capable of moving relative to the peripheral hard circuit board through the flexible circuit board, and an imaging chip arranged on the central hard circuit board, and a plurality of SMA wires distributed horizontally and used for X / Y axis direction anti-shake are arranged between the periphery of the central hard circuit board and the peripheral hard circuit board; the peripheral hard circuit board is provided with a coil, the bottom of the shell is provided with a magnetic sheet, and the induced magnetic field generated after the coil is electrified and the magnetic sheet generate mutual repulsion or mutual attraction to drive the lens to move relative to the imaging chip in the Z axis direction, so as to realize Z axis direction anti-shake and / or automatic focusing.

[0008] Further, in the above technical scheme, the upper and lower ends of the flexible circuit board are respectively provided with a first connecting bridge and a second connecting bridge, the flexible circuit board is connected to the inner side of the peripheral hard circuit board through the first connecting bridge and the second connecting bridge, and a gap is formed between the flexible circuit board and the peripheral hard circuit board.

[0009] Further, in the above technical scheme, the number of SMA wires is four, one end of each of the four SMA wires is connected to four corner portions of the peripheral hard circuit board, the first SMA wire and the second SMA wire are both connected to the middle of the upper end edge of the central hard circuit board, and the third SMA wire and the fourth SMA wire are both connected to the middle of the lower end edge of the central hard circuit board.

[0010] Further, in the above technical scheme, the four SMA wires are all curved in shape.

[0011] Further, in the above technical scheme, the central hard circuit board is provided with a Hall element for detecting and feeding back the balance / flatness of the imaging chip, and the Hall element is adaptively mounted with the magnetic sheet.

[0012] Further, in the above technical scheme, the coil is a line printed on the peripheral hard circuit board.

[0013] Further, in the above technical scheme, the magnetic sheet is fixed to the bottom of the shell by inlaying.

[0014] Further, in the technical scheme, the shell comprises a bottom plate and an upper cover, the magnetic sheet is fixed in the bottom plate by inlaying, the upper cover has a first window at the upper end, and the lens extends out of the upper end of the upper cover through the first window.

[0015] Further, in the technical scheme, the frame is further provided with a seat body, the seat body is provided with a second window penetrating through upper and lower end surfaces and matching the size of the imaging chip, and the imaging chip is exposed in the second window.

[0016] Further, in the technical scheme, a stepped groove is arranged at the upper end of the second window of the seat body, and an infrared filter is further arranged in the stepped groove and above the imaging chip.

[0017] After the technical scheme is adopted, the present application has the following beneficial effects compared with the prior art: the present application adopts a soft and hard combined PCB board composed of a peripheral hard circuit board, a flexible circuit board and a center hard circuit board, the center hard circuit board can move relative to the peripheral hard circuit board through the flexible circuit board, a plurality of SMA wires are arranged between the periphery of the center hard circuit board and the peripheral hard circuit board, the SMA wires are stretched and deformed by heating through power supply, so as to drive the center hard circuit board and the imaging chip to offset relative to the peripheral hard circuit board through the flexible circuit board, thereby realizing the function of optical anti-shake; in addition, the peripheral hard circuit board is provided with a coil, the shell bottom is provided with a magnetic sheet, and the induced magnetic field generated after the coil is powered on and the magnetic sheet generate mutual repulsion or mutual attraction, so as to drive the lens to move relative to the imaging chip in the Z-axis direction, realize Z-axis direction anti-shake and / or automatic focusing, the stroke is relatively large, the zooming effect is ideal, and different control requirements can be met. The present application only uses a plurality of SMA wires to realize the optical anti-shake function of the imaging chip, the number of SMA wires is small, and all the SMA wires are installed horizontally, which is relatively more convenient to install, thereby improving the assembly efficiency of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a perspective exploded view of the present application;

[0019] Figure 2 is a structure diagram of the PCB board assembly in the present application;

[0020] Figure 3 is an exploded view of Figure 2 ;

[0021] Figure 4 is a structure diagram of the anti-shake state of the PCB board assembly in the present application;

[0022] Figure 5 is a first state diagram of anti-shake / focusing of the present application;

[0023] Figure 6 is a second state diagram of the anti-shake / focus of the present application. DETAILED DESCRIPTION

[0024] The present application is further illustrated below in conjunction with specific embodiments and the accompanying drawings.

[0025] See Figures 1-6 As shown in the drawings, it is a kind of camera module chip and lens focusing anti-shake structure, it includes shell 1, frame 2, PCB board assembly 3, lens 4, wherein, the frame 2 is set in shell 1 and can slide up and down, PCB board assembly 3 is located at the lower end of the frame 2, lens 4 is set at the upper end of the frame 2, and the upper end of the lens 4 is out of the upper end surface of the shell 1, the connector 30 of PCB board assembly 3 is out of the shell 1.

[0026] Specifically, the PCB board assembly 3 includes: a square frame-shaped peripheral hard circuit board 31, a flexible circuit board 32 mounted on the inner side of the peripheral hard circuit board 31, a central hard circuit board 33 disposed in the middle of the flexible circuit board 32 and movable relative to the peripheral hard circuit board 31 through the flexible circuit board 32, and an imaging chip 34 disposed on the central hard circuit board 33, a plurality of SMA wires 35 distributed transversely and used for X / Y axis direction anti-shake are further provided between the periphery of the central hard circuit board 33 and the peripheral hard circuit board 31; the peripheral hard circuit board 31 is provided with a coil 311, the bottom of the shell 1 is provided with a magnetic sheet 11, and the induced magnetic field generated after the coil 311 is energized and the magnetic sheet generate mutual repulsion or mutual attraction to drive the lens 4 to move relative to the imaging chip 34 in the Z axis direction, realize Z axis direction anti-shake and / or automatic focusing. That is, the present application adopts the peripheral hard circuit board 31, the flexible circuit board 32 and the central hard circuit board 33 to form a soft and hard combined circuit board, and the central hard circuit board 33 is movable relative to the peripheral hard circuit board 31 through the flexible circuit board 32, a plurality of SMA wires 35 distributed transversely are further provided between the periphery of the central hard circuit board 33 and the peripheral hard circuit board 31, the SMA wires 35 are stretched and deformed by energized heating to drive the central hard circuit board 33 and the imaging chip 34 to offset relative to the peripheral hard circuit board 31 through the flexible circuit board 32, thereby realizing the function of optical anti-shake; in addition, the peripheral hard circuit board 31 is provided with a coil 311, the bottom of the shell 1 is provided with a magnetic sheet 11, and the induced magnetic field generated after the coil 311 is energized and the magnetic sheet generate mutual repulsion or mutual attraction to drive the lens 4 to move relative to the imaging chip 34 in the Z axis direction, realize Z axis direction anti-shake and / or automatic focusing, its stroke is relatively large, and the zooming effect is ideal, which can meet different control requirements. The present application only uses a plurality of SMA wires 35 to realize the optical anti-shake function of the imaging chip 34, the number of SMA wires 35 is small, and all SMA wires 35 are transversely installed, which is relatively more convenient to install, thereby improving the assembly efficiency of the present application.

[0027] The peripheral rigid circuit board 31, the flexible circuit board 32 and the central rigid circuit board 33 are electrically connected with each other, and the imaging chip 34 is electrically connected with the central rigid circuit board 33, and the SMA wire 35 is electrically connected with the peripheral rigid circuit board 31 and the central rigid circuit board 33.

[0028] The flexible circuit board 32 has a first connecting bridge 321 and a second connecting bridge 322 at the upper and lower ends respectively, and the flexible circuit board 32 is connected with the inner side of the peripheral rigid circuit board 31 through the first connecting bridge 321 and the second connecting bridge 322 respectively, and a gap is formed between the flexible circuit board 32 and the peripheral rigid circuit board 31, so that the central rigid circuit board 33 can move relative to the peripheral rigid circuit board 31 through the flexible circuit board 32, and can move or deviate in the X / Y / Z direction. The thickness and width of the first connecting bridge 321 and the second connecting bridge 322 are relatively small, so that the central rigid circuit board 33 can move relative to the peripheral rigid circuit board 31 through the first connecting bridge 321 and the second connecting bridge 322, and the movement is relatively convenient.

[0029] The SMA wire 35 is a wire-shaped shape memory alloy. The shape memory alloy is further described as follows: shape memory alloy (SMA) is a material composed of two or more metal elements that has shape memory effect (SME) through thermal elasticity and martensitic transformation and its inverse transformation. Shape memory alloy is the best material among shape memory materials in terms of shape memory performance. For example, a spring made of shape memory alloy is placed in hot water, and the length of the spring immediately elongates, and then it is placed in cold water, and it will immediately return to its original state. The shape memory alloy spring can be used to control the water temperature of the bathroom water pipe: when the hot water temperature is too high, the "memory" function is used to adjust or close the water supply pipeline to avoid scalding. It can also be made into a fire alarm device and a safety device for electrical equipment. When a fire occurs, the spring made of shape memory alloy deforms, activates the fire alarm device, and achieves the purpose of alarm. The spring made of shape memory alloy can also be placed in the valve of a heating device to maintain the temperature of the heating room, and when the temperature is too low or too high, the valve of the heating device is automatically opened or closed. The shape memory effect of shape memory alloy is also widely used in various temperature sensor triggers.

[0030] SMA(shape memory alloys, shape memory alloy) material has the characteristics of contraction after heating, and is set as another possible actuator, and can meet the requirements of miniaturization, and the SMA material as a small-sized camera lens module actuator also has the following advantages: providing linear, high power per unit mass. That is, the SMA wire 35 set as an actuator can provide linear, high power per unit mass to achieve precise anti-shake action on the PCB assembly 3.

[0031] The number of SMA wires 35 is four, wherein one end of the four SMA wires 35 is connected to the four corners of the peripheral hard circuit board 31, the first SMA wire 35 and the second SMA wire 35 are connected to the middle of the upper end edge of the center hard circuit board 33, and the third SMA wire 35 and the fourth SMA wire 35 are connected to the middle of the lower end edge of the center hard circuit board 33. In operation, in combination with Figure 2 and Figure 4 As shown, by energizing the four SMA wires 35, the energized SMA wires 35 will heat up, and the length of the SMA wires 35 will be controlled by adjusting the temperature of the SMA wires 35, the length of the second SMA wire 35 and the fourth SMA wire 35 will increase, and the length of the first SMA wire 35 and the third SMA wire 35 will decrease, to achieve the movement of the chip area, i.e. to drive the imaging chip 34 to move, so that the movement of the imaging chip 34 can be quickly realized by adjusting the temperature of the SMA wire 35 (the size of the current controls the size of the temperature), and the whole chip area (the center hard circuit board 33 and the imaging chip 34) is rotating during the anti-shake process, so that the lens 4 and the imaging chip 34 can keep the relative position unchanged, thereby greatly reducing the edge degradation of the imaging quality.

[0032] The four SMA wires 35 are all curved in shape.

[0033] The center hard circuit board 33 is provided with a Hall element for detecting and feeding back the balance / flatness of the imaging chip 34, and the Hall element is adapted to be installed with the magnetic sheet 11.

[0034] The coil 311 is a line printed on the peripheral hard circuit board 31, that is, the coil 311 is directly formed as part of the peripheral hard circuit board 31 when the peripheral hard circuit board 31 is manufactured, which can reduce the thickness of additional external coils, and the structure and process are simple, without the need for external coils, the processing procedure is reduced, the overall structure is more compact, and the cost is lower.

[0035] In combination with Figures 5-6As shown, the coil 311 generates an induced magnetic field after energization and the magnetic sheet generates mutual repulsion or attraction, and the repulsion and attraction drive the frame and the lens 4 carried on the frame to move in the Z-axis direction, achieving the effect of automatic focusing of the camera module.

[0036] The magnetic sheet 11 is fixed to the bottom of the shell 1 by inlaying, and the assembly structure is stable. Specifically, the shell 1 comprises a bottom plate 12 and an upper cover 13, the magnetic sheet 11 is fixed in the bottom plate 12 by inlaying, the upper end of the upper cover 13 has a first window 131, and the lens 4 extends out of the upper end of the upper cover 13 through the first window 131. The frame 2 is further provided with a seat body 5, the seat body 5 is provided with a second window 51 penetrating the upper and lower end faces and matching the size of the imaging chip 34, and the imaging chip 34 is exposed in the second window 51. The second window 51 of the seat body 5 is provided with a stepped groove 52 at the upper end, and an infrared filter 6 is further arranged in the stepped groove 52, and the infrared filter 6 is arranged above the imaging chip 34. The infrared filter 6 filters red light and infrared into the imaging chip 34, preventing color deviation of the image.

[0037] In summary, the peripheral hard circuit board 31, the flexible circuit board 32 and the center hard circuit board 33 are combined to form a soft and hard combined PCB board, the center hard circuit board 33 can move relative to the peripheral hard circuit board 31 through the flexible circuit board 32, and a plurality of SMA wires 35 are arranged between the center hard circuit board 33 and the peripheral hard circuit board 31 in a transverse direction. The SMA wire 35 is stretched and deformed by energization and heating, so as to drive the center hard circuit board 33 and the imaging chip 34 to offset relative to the peripheral hard circuit board 31 through the flexible circuit board 32, thereby realizing the function of optical anti-shake. In addition, the peripheral hard circuit board 31 is provided with a coil 311, and the bottom of the shell 1 is provided with a magnetic sheet 11. The induced magnetic field generated by the coil 311 after energization and the magnetic sheet generate mutual repulsion or mutual attraction, so as to drive the lens 4 to move relative to the imaging chip 34 in the Z-axis direction, realize Z-axis direction anti-shake and / or automatic focusing, the stroke is relatively large, the zooming effect is ideal, and different control requirements can be met. The present application only uses a plurality of SMA wires 35 to realize the optical anti-shake function of the imaging chip 34, the number of SMA wires 35 is small, and all the SMA wires 35 are installed in a transverse direction, which is relatively convenient to install, and improves the assembly efficiency of the present application.

[0038] In addition, the present application also achieves the following effects:

[0039] 1. The function of the present application is enhanced, the structure is compact, an integrated anti-shake mode is adopted, the movement of the lens and the imaging chip can be realized at the same time, the space occupation is small, which is beneficial to the stacking design of the whole machine structure, and a small-sized anti-shake camera system can be realized.

[0040] 2. The application has simple structure and process, does not need to use external copper coil, reduces processing procedures (omits copper coil and motor FPC), has more compact overall structure, adopts integrated design of circuit board, and is lower in cost.

[0041] 3. The application has performance promotion, and can realize rapid and accurate deformation by a small amount of current due to the temperature-sensitive characteristics of the SMA wire. Compared with the traditional motor anti-shake module, the application is power-saving, large in thrust, small in size, can realize small driving force to provide large anti-shake angle, has better effect than the traditional lens anti-shake process, and is more excellent in energy consumption control.

[0042] 4. The application has reliability promotion, and since a linear motor is not needed, the SMA type OIS (Optical Image Stabilizer) does not need to consider magnetic interference.

[0043] Of course, the above only describes specific embodiments of the application and does not limit the application implementation range. Equivalent changes or modifications made according to the structure, features and principles described in the application patent range should be included in the application patent range.

Claims

1. A camera module chip and lens focusing and image stabilization structure, characterized in that: It includes a housing (1), a frame (2) disposed inside the housing (1) and capable of sliding up and down, a PCB board assembly (3) disposed at the lower end of the frame (2), and a lens (4) disposed at the upper end of the frame (2). The upper end of the lens (4) extends out of the upper surface of the housing (1), and the connector (30) of the PCB board assembly (3) extends out of the housing (1). The PCB assembly (3) includes: a rigid peripheral circuit board (31) in the shape of a square frame, a flexible circuit board (32) installed inside the rigid peripheral circuit board (31), a central rigid circuit board (33) located in the middle of the flexible circuit board (32) and movable relative to the rigid peripheral circuit board (31) through the flexible circuit board (32), and an imaging chip (34) disposed on the central rigid circuit board (33). Several horizontally distributed SMA lines (35) for X / Y axis stabilization are also disposed between the periphery of the central rigid circuit board (33) and the rigid peripheral circuit board (31). The rigid peripheral circuit board (31) is provided with a coil (311), and a magnetic sheet (11) is provided at the bottom of the housing (1). The induced magnetic field generated by the coil (311) after being energized repels or attracts the magnetic sheet to drive the lens (4) to move relative to the imaging chip (34) in the Z axis direction, thereby realizing Z axis stabilization and / or autofocus. The flexible circuit board (32) has a first connecting bridge (321) and a second connecting bridge (322) at its upper and lower ends, respectively. The flexible circuit board (32) is connected to the inner side of the outer rigid circuit board (31) through the first connecting bridge (321) and the second connecting bridge (322), respectively, and a gap is formed between the flexible circuit board (32) and the outer rigid circuit board (31). The number of SMA lines (35) is four. One end of each of the four SMA lines (35) is connected to the four corners of the outer rigid circuit board (31). The first SMA line (35) and the second SMA line (35) are both connected to the middle of the upper edge of the central rigid circuit board (33). The third SMA line (35) and the fourth SMA line (35) are both connected to the middle of the lower edge of the central rigid circuit board (33). The magnetic sheet (11) is fixed to the bottom of the outer shell (1) by embedding.

2. The camera module chip and lens focusing and image stabilization structure according to claim 1, characterized in that: All four SMA lines (35) are curved.

3. The camera module chip and lens focusing and image stabilization structure according to claim 1, characterized in that: The central rigid circuit board (33) is provided with a Hall element for detecting and feeding back the balance / flatness of the imaging chip (34), which is adapted to the magnetic sheet (11).

4. The camera module chip and lens focusing and image stabilization structure according to claim 1, characterized in that: The coil (311) is a line printed on the peripheral rigid circuit board (31).

5. The camera module chip and lens focusing and image stabilization structure according to claim 1, characterized in that: The outer casing (1) includes a base plate (12) and a top cover (13). The magnetic sheet (11) is fixed inside the base plate (12) by embedding. The top cover (13) has a first window (131) at its upper end. The lens (4) extends out of the top end of the top cover (13) through the first window (131).

6. The camera module chip and lens focusing and image stabilization structure according to claim 1, characterized in that: The frame (2) is also provided with a base (5), which has a second window (51) that runs through the upper and lower end surfaces and is adapted to the size of the imaging chip (34). The imaging chip (34) is exposed in the second window (51).

7. The camera module chip and lens focusing and image stabilization structure according to claim 6, characterized in that: The upper opening of the second window (51) of the seat (5) is provided with a stepped groove (52), and an infrared filter (6) is also provided in the stepped groove (52), which is placed above the imaging chip (34).

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