Methods for preparing thermosetting resin compositions and electronic component devices

CN116724394BActive Publication Date: 2026-07-03RESONAC CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
RESONAC CORP
Filing Date
2022-01-06
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Existing technologies struggle to achieve uniform dispersion and high filler content of inorganic fillers in thermosetting resin compositions, especially in cases of high-density and small-diameter components, leading to problems of gelation and poor dispersibility.

Method used

By controlling the temperature and adding a hardening accelerator in the desolventizing and mixing processes, and using a screw mixer for mixing, the inorganic filler is ensured to be uniformly dispersed, avoiding gelation and achieving high filler content.

Benefits of technology

This method achieves high filling and uniform dispersion of inorganic fillers in thermosetting resin compositions, thereby improving the sealing performance and reliability of electronic components.

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Abstract

A method for manufacturing a thermosetting resin composition includes: a desolventizing step, wherein a first mixture comprising a thermosetting resin, a curing agent, and an inorganic filler and a solvent is removed at a first desolventizing temperature to obtain a second mixture; and a mixing step, wherein a curing accelerator is added to the second mixture, and the second mixture containing the curing accelerator is mixed at a first mixing temperature lower than the first desolventizing temperature.
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