Support member and portable communication device comprising the same

Abstract

Disclosed is a case and a portable communication device including the same, the case including a support member including at least one antenna portion functionally connected to a communication circuit, and an injection member surrounding at least a portion of the at least one antenna portion, wherein the support member includes a main body, at least one pin connecting the at least one antenna portion to the main body, and at least one groove for position control formed in a region in which the at least one pin and the injection member are arranged to abut each other.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to support components for portable communication devices. Background Technology

[0002] Portable communication devices, such as smartphones, can offer a variety of functions, including conversation, motion picture playback, and internet searching, depending on the application. These devices can embed various components, such as printed circuit boards (PCBs) and batteries, that integrate multiple electronic elements. To protect these components from external environmental influences, support members with specific rigidity can be used. These support members can be at least partially made of metal, and one side of the support member can be provided with a structure for housing various components through an injection molding process. Summary of the Invention

[0003] Technical issues

[0004] In the above injection molding process, a specific pressure is applied when the injection material is injected into the mold. When pressure is applied to one side of the support member, at least a portion of the support member may bend or break in shape.

[0005] Therefore, a method and apparatus are needed to eliminate deformation or breakage of support members (or support plates).

[0006] This disclosure addresses at least the problems and / or disadvantages described above and provides at least the following advantages.

[0007] Various embodiments of this disclosure provide a support member and a portable communication device including the support member, wherein a groove is provided in one side of the support member to prevent the support member from deforming or breaking during the injection molding process, and a protrusion is provided to the mold to prevent the support member from wobbling through the groove, thereby preventing the support member from deforming or breaking.

[0008] Technical solution

[0009] According to various embodiments of this disclosure, a portable communication device (or electronic device, portable electronic device, foldable electronic device, or foldable electronic device with communication functionality) may include a housing and a printed circuit board disposed within the housing and on which communication circuitry is mounted. The housing may include: a support member including at least one antenna element operatively connected to the communication circuitry; and an injection-molded member surrounding at least a portion of the at least one antenna element. The support member may include a body in which at least a portion of the printed circuit board is disposed, and at least one pin connecting the at least one antenna element to the body. Furthermore, the support member may include at least one position adjustment groove formed at the location where the at least one pin contacts the injection-molded member.

[0010] According to this disclosure, the housing may include a support member and an injection-molded member, the support member including at least one antenna element operatively connected to a communication circuit, the injection-molded member surrounding at least a portion of the at least one antenna element. The support member may include a body, the at least one antenna element, at least one pin connecting the at least one antenna element to the body, and at least one position adjustment groove formed in a contact region between the at least one pin and the injection-molded member.

[0011] Beneficial effects

[0012] The support member according to various embodiments and the portable communication device including the support member can prevent the support member from deforming or breaking.

[0013] Furthermore, various purposes and effects will become apparent from the detailed description of the embodiments regarding the support member according to various embodiments and the portable communication device including the support member. Attached Figure Description

[0014] The above and other aspects, features and advantages of this disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0015] Figure 1 This is a view illustrating a portable communication device according to various embodiments.

[0016] Figure 2 A support member and housing of a portable communication device according to an embodiment of the present disclosure are shown.

[0017] Figure 3 It is shown as follows Figure 2 status <203> A view of a partial area of ​​the housing shown.

[0018] Figure 4 This is a view illustrating the injection molding process associated with the housing according to various embodiments.

[0019] Figure 5 This is a view showing the assembled state of the mold and the arrangement state of the resin in a resin injection process according to various embodiments.

[0020] Figure 6 This is a view showing a first type of position adjustment slot according to various embodiments.

[0021] Figure 7 This is a view showing a second type of position adjustment slot according to various embodiments.

[0022] Figure 8 This is a view showing a third type of position adjustment slot according to various embodiments.

[0023] Figure 9 This is a view showing a fourth type of position adjustment slot according to various embodiments.

[0024] Figure 10 This is a view showing a fifth type of position adjustment slot according to various embodiments.

[0025] Figure 11 This is a block diagram illustrating an electronic device 1101 in a network environment 1100 according to various embodiments. Detailed Implementation

[0026] Various embodiments of the present disclosure will be described below with reference to the accompanying drawings. However, those skilled in the art will understand that the present disclosure is not limited to the specific embodiments, and various modifications, equivalents, and / or substitutions can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Regarding the description of the drawings, similar parts may be assigned similar reference numerals.

[0027] In this disclosure, it will also be understood that the terms “having,” “may have,” “comprising,” and / or “may include,” when used herein, specify the presence of the said feature (e.g., an element such as a number, function, operation, or part), but do not exclude the presence or addition of one or more other features.

[0028] In this disclosure, the expressions “A or B”, “at least one of A and / or B”, and “one or more of A and / or B” can include all possible combinations of one or more of the associated listed items. For example, “A or B”, “at least one of A and B” or “at least one of A or B” includes all of the following: (1) at least one A, (2) at least one B, or (3) at least one “A” and at least one “B”.

[0029] The terms used herein (such as "first," "second," etc.) may refer to various components regardless of their order and / or priority, and may be used to distinguish one component from another without limiting the elements. For example, a first user device and a second user device may simply refer to user devices that are different from each other, regardless of their order and / or priority. For example, a first component discussed below may be referred to as a second component without departing from the technical scope of this disclosure. Similarly, a second component may be referred to as a first component.

[0030] It will be understood that when a component (e.g., the first component) is referred to as being "(operably or communicatively) coupled" or "connected" to another component (e.g., the second component), the component may be directly coupled to or directly connected to the other component, or an intermediary component (e.g., a third component) may exist therein. Furthermore, it will be understood that when a component (e.g., the first component) is referred to as being directly coupled to or directly "connected" to another component (e.g., the second component), there may be no intermediary component (e.g., a third component) between the component and the other component.

[0031] The expression “~configured as” used herein may be used interchangeably with, for example, “suitable for,” “capable of,” “designed for,” “suitable for,” “made of,” or “capable of,” depending on the context. The expression “~configured as” does not mean that it is inherently “specifically designed for” in hardware. In certain contexts, the expression “device configured as…” may indicate that the device is “capable” of operating with another device or other component. For example, “processor configured (or suitable for) performing A, B, and C” may refer to a dedicated processor (e.g., an embedded processor) or a general-purpose processor (e.g., a central processing unit (CPU) or application processor) for performing the respective operations, which can perform the corresponding operations by executing one or more software programs stored in a storage device.

[0032] The terminology used herein is for specific embodiments only, and the scope of other embodiments is not limited thereto. Unless otherwise stated, singular terms may include plural forms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Such terms used herein (as defined in commonly used dictionaries) are to be construed as having the same meaning as in the context of the relevant technical field and are not to be construed as having an ideal or overly formal meaning unless explicitly defined as having such a meaning in this disclosure. Even though these terms are defined in this disclosure, they should not be construed as excluding embodiments of this disclosure if necessary.

[0033] According to various embodiments of this disclosure, electronic devices may include at least one of, for example, smartphones, tablet PCs, mobile phones, video phones and e-book readers, desktop PCs, laptop PCs, netbooks, workstations, servers, personal digital assistants (PDAs), portable multimedia players (PMPs), MP3 players, mobile medical devices, cameras, or wearable devices. According to various embodiments, wearable devices may include at least one of accessory-type devices (e.g., watches, rings, bracelets, anklets, necklaces, glasses, contact lenses, or head-mounted devices (HMDs)), single-piece fabric or clothing-type devices (e.g., electronic clothing), body-attached type devices (e.g., skin pads or tattoos), or bio-implantable circuitry.

[0034] Regarding the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the singular form of a noun corresponding to an item may include one or more things, unless the relevant context clearly indicates otherwise.

[0035] In the following description, electronic devices according to various embodiments will be described with reference to the accompanying drawings. In this disclosure, the term "user" as used herein may refer to a person using the electronic device or to a device using the electronic device (e.g., an artificial intelligence electronic device).

[0036] Figure 1 Portable communication devices according to various embodiments are shown. For example, Figure 1 Reference numeral 100a shows the front surface of the portable communication device 100. Figure 1 Reference numeral 100b shows the rear surface of the portable communication device 100.

[0037] Reference Figure 1 The portable communication device 100 may include a housing comprising a first surface 110A (or front surface), a second surface 110B (or rear surface), and a side surface 110C surrounding the space between the first surface 110A and the second surface 110B. Optionally, the housing may be referred to as including Figure 1The structure includes a first surface 110A, a second surface 110B, and a side surface 110C. The first surface 110A may include a front panel 102 (e.g., a glass or polymer panel with various coatings), which is substantially transparent in at least a portion thereof. The second surface 110B may include a substantially opaque back panel 111. The back panel 111 may include coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 110C may include a side frame structure (or side member) 118 connecting the front panel 102 and the back panel 111, and may include metal and / or polymer. The back panel 111 and the side frame structure 118 may be integrally formed with each other and may include the same material (e.g., a metallic material such as aluminum).

[0038] According to some embodiments, the portable communication device 100 may include at least one of a display 101, sensor modules 113 and 119, camera modules 105 and 112, or key input device 117. The portable communication device 100 may omit at least one of these components, or may additionally include other components. The portable communication device 100 may also include an audio module and a connector port.

[0039] Display 101 may be exposed, for example, through a large portion of front panel 102. In some embodiments, at least a portion of display 101 may be exposed through front panel 102 forming a first surface 110A. In some embodiments, the edges of display 101 may be formed to be substantially the same shape as the adjacent outer shape of front panel 102. In other embodiments (not shown), to increase the area for exposing display 101, the distance between the outer edge of display 101 and the outer edge of front panel 102 may be formed substantially uniformly.

[0040] In other embodiments, a recess or opening is formed in a portion of the screen display area of ​​the display 101. Furthermore, at least one of an audio module, sensor module, or camera module 105 aligned with the recess or opening may be included in said portion of the screen display area of ​​the display 101. At least one of the audio module, sensor module, camera module 105, or fingerprint sensor may be included in the rear surface of the screen display area of ​​the display 101. The display 101 may be coupled to, or disposed near, touch sensing circuitry, a pressure sensor measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a stylus using an electromagnetic scheme. At least a portion of sensor modules 113 and 119 and / or at least a portion of key input device 117 may be disposed in some areas having the first surface 110A of the display 101.

[0041] Sensor modules 113 and 119 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the portable communication device 100. Sensor modules 113 and 119 may include a first sensor module (such as a proximity sensor) and / or a second sensor module (such as a fingerprint sensor) disposed on a first surface 110A of the housing, and / or a third sensor module 113 and a fourth sensor module 119 (such as a heart rate monitor (HRM) sensor and a fingerprint sensor) disposed on a second surface 110B of the housing. The fingerprint sensor may be disposed on both the second surface 110B and the first surface 110A of the housing. The portable communication device 100 may also include at least one of a gesture sensor, gyroscope sensor, barometric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared sensor, biosensor, temperature sensor, humidity sensor, or illuminance sensor.

[0042] Camera modules 105 and 112 may include a first camera device 105 disposed on a first surface 110A of the portable communication device 100 and a second camera device 112 disposed on a second surface 110B of the portable communication device 100. Camera devices 105 and 112 may include one or more lenses, image sensors and / or image signal processors. Two or more lenses (infrared cameras, wide-angle lenses and telephoto lenses) and image sensors may be disposed on one side of the portable communication device 100.

[0043] The key input device 117 may be disposed on the side surface 110C of the housing 110. Optionally, the portable communication device 100 may not include some or all of the key input device 117, which may be implemented in another form, such as soft keys on the display 101. Optionally, the key input device 117 may include a sensor module disposed on the second surface 110B of the housing 110.

[0044] Figure 2 A support member and housing of a portable communication device according to an embodiment of the present disclosure are shown. Figure 2 State 201 shows the housing of the portable communication device. Figure 2 State 203 shows the support member of the portable communication device. In this case, housing 310 may correspond to the one already referenced. Figure 1 The described component is a housing comprising a first surface 110A, a second surface 110B, and a side surface 110C.

[0045] Reference Figure 2In state 201, the housing 310 may include a support plate 311 (or support member) and an injection-molded member 312. In state 203, the support plate 311 includes a body 311_21 and at least one antenna element 311a, 311b, 311c, and 311d, various components disposed within the body 311_21, the at least one antenna element 311a, 311b, 311c, and 311d serving as an antenna associated with the communication function of the portable communication device 100. At least a portion of the body 311_21 may serve as a grounding area for the at least one antenna element 311a, 311b, 311c, or 311d.

[0046] The main body 311_21 may include space for housing a battery, at least one camera module, at least one sensor, at least one PCB (which has at least one communication chip or communication circuit), a connection hole, a speaker, a microphone, a display, or at least one key input device.

[0047] The at least one antenna element 311a, 311b, 311c, or 311d may include at least one antenna to support communication schemes such as third-generation (3G) or fourth-generation (4G). When viewed from the illustrated figures, the at least one antenna element 311a, 311b, 311c, or 311d may include a first antenna element 311a located in the upper left corner, a second antenna element 311b located in the upper right corner, a third antenna element 311c located in the lower left corner, and a fourth antenna element 311d located in the lower right corner. The at least one antenna element 311a, 311b, 311c, or 311d may also include at least one antenna element formed on the side surface of the portable communication device and an antenna element supporting a Wi-Fi (WiFi) communication scheme. Furthermore, the at least one antenna element 311a, 311b, 311c, or 311d may participate in signal transmission of a fifth-generation (5G) communication module or communication chip.

[0048] According to various embodiments, the at least one antenna element 311a, 311b, 311c, or 311d may be L-shaped and may be configured to correspond to the shape of a corner of the portable communication device 100. The at least one antenna element 311a, 311b, 311c, or 311d may be configured to be spaced at a specific distance from the corner of the body 311_21 and may be connected to the corner of the body 311_21 via at least one pin. In this respect, the at least one antenna element 311a, 311b, 311c, or 311d may include at least one pin connected to the body 311_21. Although the at least one pin has been described as a component of the at least one antenna element 311a, 311b, 311c, or 311d, the at least one pin may be a separate component connecting the at least one antenna element 311a, 311b, 311c, or 311d to the body 311_21.

[0049] According to various embodiments, the fourth antenna element 311d may include a first pin 311_1 and a second pin 311_2 connected to the body 311_21. The first pin 311_1, the second pin 311_2, and the fourth antenna element 311d may be formed in a machining process that forms a body. For example, the support plate 311 may be provided as a metal plate in the form of a rectangular panel of a specific thickness and may be machined by computer numerical control (CNC) to have a structure including at least one antenna element 311a, 311b, 311c, or 311d and at least one pin (e.g., the first pin 311_1 and the second pin 311_2). Optionally, at least one of the first pin 311_1 or the second pin 311_2 may be directly connected to the body 311_21 via a separate bonding process, and the fourth antenna element 311d may be connected to the body 311_21 via at least one of the first pin 311_1 or the second pin 311_2.

[0050] The injection-molded component 312 can at least partially constitute the appearance of the portable communication device 100. For example, the injection-molded component 312 can be formed at the edge portion of the support plate 311 by a specific injection molding process in which a non-metallic material is injected during the molding process. The injection-molded component 312 can be formed at the four corners of the housing 310 (which include at least one antenna element 311a, 311b, 311c or 311d of the support plate 311), can have a specific width and a specific thickness, and can constitute the side surface of the portable communication device 100 (or at least a portion of the side surface and the front surface and at least a portion of the rear surface). When the injection-molded component 312 is formed, a structure for fixing the support plate 311 can be applied in the injection molding process to prevent the support plate 311 from shaking. The structure for fixing the support plate 311 in the injection molding process can be at least partially formed in at least one of the first pin 311_1 and the second pin 311_2 adjacent to the at least one antenna element 311a, 311b, 311c or 311d. Optionally, a structure for preventing the support plate 311 from swaying can be applied to the corner region of the housing 310. The corner region of the housing 310 where a fourth antenna element 311d is disposed will be described below by way of example. However, this disclosure is not limited thereto. For example, a structure for preventing the support plate 311 from swaying can even be provided at the corner region of the housing 310 where another antenna element 311a, 311b, or 311c is disposed.

[0051] Figure 3 As shown Figure 2 The partial area of ​​the shell shown in state 203.

[0052] Reference Figure 2 and Figure 3 At least a portion of the housing 310 may include a support plate 311 and an injection-molded component (or molding structure) 312. The support plate 311 may include at least one of a first pin 311_1 and a second pin 311_2 to connect the body 311_21 to the fourth antenna element 311d. Although Figure 2 and Figure 3 The diagram shows a structure in which two pins connect the fourth antenna element 311d to the body 311_21, but this disclosure is not limited thereto. For example, the housing 310 of the portable communication device 100 may include one pin or at least three pins between the antenna element and the body 311_21.

[0053] One edge of the body 311_21 (e.g., the lower right corner) can connect one side of the first pin 311_1 extending in the x-axis direction to one side of the second pin 311_2 extending in the -y-axis direction. One side of the body 311_21 may include at least one recess for accommodating various components of the portable communication device 100 and at least one hole formed through the body 311_21 in the z-axis and -z-axis directions.

[0054] One side of the first pin 311_1 can be connected to a corner of the main body 311_21, and the opposite side of the first pin 311_1 can be connected to the fourth antenna element 311d. One side of the second pin 311_2 can be spaced at a specific distance from the first pin 311_1 and connected to a corner of the main body 311_21, and the opposite side of the second pin 311_2 can be connected to the fourth antenna element 311d. The first pin 311_1 can be arranged parallel to the x-axis direction between the corner of the main body 311_21 and the fourth antenna element 311d, and the second pin 311_2 can be arranged parallel to the y-axis direction between the corner of the main body 311_21 and the fourth antenna element 311d. Although Figure 2 and Figure 3 The diagram shows first pin 311_1 and second pin 311_2 extending from the corner of body 311_21 in the direction of fourth antenna element 311d, while forming different angles (e.g., 90°) between first pin 311_1 and second pin 311_2, but this disclosure is not limited thereto. For example, multiple pins may extend along the same x-axis or y-axis direction while being spaced apart from each other by a specific distance, such that the pins are physically or electrically connected to the fourth antenna element 311d.

[0055] According to various embodiments, an empty space formed by a groove or hole can be formed in at least a portion of the peripheral portion of at least one pin formed in the support plate 311. According to one embodiment, the empty space can be formed between the first pin 311_1 and the second pin 311_2. Optionally, all (or at least a portion) of the peripheral portion of at least one of the first pin 311_1 and the second pin 311_2 can form an empty space, except for the fourth antenna portion 311d. Optionally, another component (e.g., side surface 110C) of the support plate 311 of the portable communication device 100 can be disposed at the peripheral portion of at least one of the first pin 311_1 and the second pin 311_2. An injection-molded member 312 can be disposed in the empty space provided in at least a portion of the peripheral portion of the first pin 311_1 or the second pin 311_2 by an injection molding process.

[0056] According to one embodiment, a first pin injection-molded component 312_1 may be disposed in the empty space formed in the y-axis direction of the first pin 311_1, a second pin injection-molded component 312_2 may be disposed in the empty space between the first pin 311_1 and the second pin 311_2, and a third pin injection-molded component 312_3 may be disposed in the empty space formed in the x-axis direction of the second pin 311_2. At least a portion of the injection-molded component 312 may be formed to surround the surface of the fourth antenna element 311d (e.g., from the edge of the body 311_21 to one side of the fourth antenna element 311d in the outward direction in the xy plane).

[0057] According to various embodiments, the housing 310 may include at least a first position adjustment groove 410 and a second position adjustment groove 420 to prevent the support plate 311 from wobbling. The first position adjustment groove 410 may include: a first portion 410a (or a first partial groove, or a first part) formed in at least a portion of the first pin 311_1 to connect the fourth antenna element 311d to a corner of the body 311_21; and a second portion 410b (or a second partial groove, or a second part) formed in the empty space of the first pin 311_1, which is formed in the y-axis direction by injection molding, adjacent to the first pin 311_1 and corresponding to a portion of the first pin injection molded portion 312-1. The first portion 410a may be formed by a specific grooving process of the support plate 311. The second portion 410b may be formed by injection molding.

[0058] According to various embodiments, a first portion 410a of the first position adjustment groove 410 may be formed of a first metallic material corresponding to the material of the support plate 311, and may include a structure having inclined angles and sidewalls formed from some edges of the bottom surface in the x-axis, -x-axis, and -y-axis directions. Similarly, a second portion 410b of the first position adjustment groove 410 may be formed of a non-metallic material corresponding to the material of the injection-molded member 312, and may include a structure having inclined angles and sidewalls formed from another portion of the bottom surface in the x-axis, -x-axis, and y-axis directions. The portion of the bottom surface of the first portion 410a formed in the y-axis direction and the other portion of the bottom surface of the second portion 410b formed in the -y-axis direction may engage with each other. The portion of the bottom surface of the first portion 410a and the other portion of the bottom surface of the second portion 410b may have substantially the same height in the z-axis direction. After the mold ribs for fixing the first pin 311_1 are installed, the first position adjustment groove 410 can be supported in the x-axis direction, -x-axis direction, -y-axis direction and -z-axis direction by the mold ribs that contact the sidewall of the first part 410a.

[0059] According to various embodiments, the first position adjustment slot 410 may be formed only in the upper part of the first pin 311_1, without extending through one side of the first pin 311_1. However, when the structure associated with the fourth antenna element 311d is disposed in the first pin 311_1, the first portion 410a of the first position adjustment slot 410 may be formed at the edge of the first pin 311_1 in the y-axis direction to ensure space. Therefore, the groove structure of the first portion 410a may have an open structure in both the y-axis and z-axis directions.

[0060] Although it has been described that the first portion 410a of the first position adjustment groove 410 is formed at the edge of the first pin 311_1 in the y-axis direction, this disclosure is not limited thereto. For example, the first portion 410a of the first position adjustment groove 410 may be formed at the edge of the first pin 311_1 in the -y-axis direction. In this case, the second portion 410b of the first position adjustment groove 410 may be formed in the injection-molded portion 312_2 of the second pin, which is disposed in the empty space between the first pin 311_1 and the second pin 311_2 and may be disposed adjacent to the first portion 410a.

[0061] According to various embodiments, the first position adjustment groove 410 can be formed at various locations on the upper part of the first pin 311_1. Since the injection-molded member 312 associated with the edge forming the portable communication device 100 is formed to cover the fourth antenna element 311d and the portion of the first pin 311_1 adjacent to the fourth antenna element 311d, at least a portion of the first position adjustment groove 410 can be formed in the portion of the first pin 311_1 adjacent to the corner of the body 311_21 (or at a location closer to the corner of the body 311_21 between the body 311_21 and the fourth antenna element 311d). The position of the first position adjustment groove 410 can vary depending on the shape of the corner of the injection-molded member 312. For example, at least a first portion 410a of the first position adjustment groove 410 can be formed between the fourth antenna element 311d and the body 311_21 in the portion of the first pin 311_1 closer to the fourth antenna element 311d.

[0062] According to various embodiments, at least a portion of the second position adjustment groove 420 may be disposed in the second pin 311_2 or in a region adjacent to the second pin 311_2. The portion of the second position adjustment groove 420 formed in the second pin 311_2 may have a structure including two sidewalls in the x-axis and y-axis directions and open in the -x-axis and -y-axis directions. The remaining portion of the second position adjustment groove 420 may be formed in the second pin injection molding portion 312_2 between the first pin 311_1 and the second pin 311_2, adjacent to the portion of the second position adjustment groove 420 formed in the region adjacent to (or in) the second pin 311_2. Since the portion of the second position adjustment groove 420 formed in the second pin 311_2 includes two sidewalls formed in two directions, when the mold rib of the mold is inserted into the second position adjustment groove 420, the sidewalls of the second position adjustment groove 420 in both directions, the bottom surface of the second position adjustment groove 420, and the mold rib cooperate with each other to support the second pin 311_2 in three directions.

[0063] Although a structure in which a groove is formed in a pin that is open in at least two directions and corresponds to at least a portion of a position adjustment groove has been described, this disclosure is not limited thereto. For example, at least one position adjustment groove or a partial groove corresponding to a portion of a position adjustment groove may be formed in at least one pin of the support plate 311. As described above, based on the at least one position adjustment groove formed in the pin, the support plate 311 can be coupled to the mold in the injection molding process, thereby preventing the support plate 311 from wobbling. Furthermore, pressure can be applied to the mold and mold ribs such that the support plate 311 can withstand the applied pressure when injection material (e.g., polymer material or plastic material) is injected into the mold in the injection molding process. Thus, breakage and deformation of at least one pin connecting at least one antenna element to the body are prevented, and the shape of the injection-molded component is stably formed.

[0064] As described above, by using a mold to support the four surfaces of the support plate 311, deformation of the support plate 311 in the horizontal direction is prevented. To this end, grooves are provided in the pins where deformation prevention is needed to support two or three surfaces, thereby preventing deformation of the support plate 311. It also prevents the support plate 311 from wobbling to the left or right. Therefore, antenna performance can be ensured in at least a portion used as an antenna, and the support plate 311 can be prevented from cracking or protruding to the extent of observable protrusion when passing through the injection molding member 312. Furthermore, a position adjustment groove can be added to prevent wobbling in the horizontal direction, thus preventing deformation of the support plate 311 in the horizontal direction due to injection pressure. Therefore, the product yield and hardware performance can be improved.

[0065] Figure 4An injection molding process associated with a housing is shown according to one embodiment. Figure 5 The diagram illustrates the assembled state of the mold and the arrangement state of the resin in a resin injection process according to one embodiment.

[0066] Reference Figures 2 to 4 The lower mold 510 may be configured in association with the injection molding process as shown in state 401. The lower mold 510 may include a shape corresponding to at least a portion of either the first or second surface of the housing 310. Optionally, at least a portion of the lower mold 510 may include a shape corresponding to either the first or second surface of the support plate 311. The overall size of the lower mold 510 may be equal to or greater than the overall size of the support plate 311 or the size of either the first or second surface of the housing 310. The lower mold 510 may have a structure including shapes corresponding to the shape of the first or second surface of the support plate 311 and the shape of the first or second surface of the housing 310 corresponding to the injection-molded member 312 other than the support plate 311. The lower mold 510 may be formed of a metallic material having a melting point higher than that of the injection material (e.g., resin). The lower mold 510 may include a space corresponding to the shape of the injection-molded member 312 to cover at least a portion of the at least one antenna element 311a, 311b, 311c, or 311d.

[0067] According to various embodiments, the lower mold 510 may include a mold rib 511. The mold rib 511 may include a shape corresponding to a protrusion (or protrusion, engraving, roughening portion) of the first position adjustment groove 410 or the second position adjustment groove 420. According to one embodiment, at least a portion of the upper end of the mold rib 511 projecting in the z-axis direction has a shape that gradually decreases upward in thickness and width in the z-axis direction. Optionally, the cross-section of the mold rib 511 corresponding to the xy-plane may have a polygonal elliptical shape including a circular shape. The mold rib 511 may be provided with a shape that gradually decreases upward from the bottom surface of the mold rib 511 in the region of the cross-section corresponding to the xy-plane. According to one embodiment, the upper end of the mold rib 511 may have a flat region. The cross-section of the mold rib 511 corresponding to the zy-plane or the zx-plane may include a trapezoidal shape.

[0068] As shown in state 403, the support plate 311 can be aligned and disposed on the lower mold 510. During this process, at least one of the first pin 311_1 or the second pin 311_2 connecting at least the fourth antenna element 311d of the support plate 311 to the body 311_21, and the mold rib 511 can be aligned in the z-axis direction. Although the first pin 311_1 and the mold rib 511 are shown aligned with each other, this disclosure is not limited thereto. For example, the lower mold 510 described with reference to state 401 may include a mold rib 511 aligned in the z-axis direction with a portion of the first pin 311_1, and may also include a mold rib aligned in the z-axis direction with a portion of the second pin 311_2. Additionally or optionally, the lower mold 510 may also include at least one mold rib disposed at a position aligned with at least one pin, which connects the first antenna element 311a, the second antenna element 311b, and the third antenna element 311c to the body 311_21 in the z-axis direction.

[0069] After the support plate 311 is mounted on the lower mold 510, the side surface of the lower mold 510 on which the support plate 311 is mounted can be closed by using at least the first slider 531 and / or the second slider 532, as shown in state 405. Although the first slider 531 and the second slider 532 are shown as being configured to surround the side of the lower mold 510, since only a portion of the lower mold 510 is shown, four sliders can be provided to surround the side surface of the support plate 311 mounted on the lower mold 510 in four directions. Therefore, four sliders can be configured to surround the side surface of the lower mold 510 on which the support plate 311 is mounted in four directions. Since the four sliders surround the side surface of the lower mold 510, an opening having a size corresponding to the size of the housing 310 can be formed in the upper part of the lower mold 510 on which the support plate 311 is mounted.

[0070] As shown in state 407, when multiple sliders surround the side of the lower mold 510, the upper mold 520 can be configured to cover the area that opens upward in the z-axis direction. The upper mold 520 may include a structure corresponding to at least a portion of the second surface or the first surface of the support plate 311. Optionally, the upper mold 520 may include a structure corresponding to at least a portion of the second surface or the first surface of the housing 310. The upper mold 520 may have an injection hole into which injection material 499 (or resin) can be injected.

[0071] Reference Figure 4 and Figure 5As shown in states 501 and 503, the upper mold 520 may include an injection hole 521 through which injection material 499 (or resin) is injected. A support plate 311 may be disposed between the lower mold 510 and the upper mold 520, and an empty space for injecting the injection material may be formed between the lower mold 510 and the upper mold 520. This empty space may be formed between the support plates 311. The injection material 499 may be introduced through the injection hole 521, injected in the direction of the arrow shown in the figures, and fill the empty space formed between the support plates 311. The injection material 499 may be injected to surround at least a portion of the fourth antenna element 311d to form at least a portion of the injection-molded member 312. Optionally, the injection material 499 may be injected into at least a portion of the empty space adjacent to the first pin 311_1, the empty space between the first pin 311_1 and the second pin 311_2, and the empty space adjacent to the second pin 311_2. As injection material 499 is injected, at least a first pin injection molding portion 312_1, a second pin injection molding portion 312_2, and a third pin injection molding portion 312_3 can be formed. Injection material 499 is injected into the contact area between the mold rib 511 of the lower mold 510 and a portion of the first pin 311_1, thereby forming a first position adjustment groove 410 including a partial groove of the first pin 311_1 and a portion of the first pin injection molding portion 312_1.

[0072] Figure 6 A first type of position adjustment groove is shown according to one embodiment.

[0073] Reference Figure 6 As shown in state 601, at least a portion of the housing 310 may include a portion of a support plate 311 and a portion of an injection-molded member 312. For example, the support plate 311 may include a first pin 311_1 connected to at least one antenna element, and the injection-molded member 312 may include a first pin injection-molded portion 312_1 formed adjacent to the first pin 311_1. The housing 310 may include a first-type position adjustment groove 411, which includes one side of the first pin 311_1 and one side of the first pin injection-molded portion 312_1. The first-type position adjustment groove 411 includes a first portion 411_1 and a second portion 411_2, the first portion 411_1 being formed on the side of the first pin 311_1, and the second portion 411_2 being at least partially connected to the first portion 411_1 and formed in the first pin injection-molded portion 312_1.

[0074] Referring to state 603, a portion of the aforementioned groove formed in the first pin 311_1 can be provided prior to the injection molding process, such that a portion of the first type mold rib 511_1 of the lower mold 510 is mounted and aligned. The groove portion formed in the first pin injection molding portion 312_1 of the first type mold rib 511_1 can be provided during the injection molding process. The first type mold rib 511_1 can be formed to protrude from the top surface of the lower mold 510 facing the z-axis direction above the peripheral portion of the first type mold rib 511_1. The first type mold rib 511_1 may include a body portion 511a and a head 511b, the body portion 511a having a longer length in the z-axis direction or -z-axis direction than in the other direction and being provided in a polygonal columnar shape, and the head 511b being formed at the end of the first type mold rib 511_1 in the -z-axis direction and at least partially inserted into the first type position adjustment groove 411. The head 511b of the first type mold rib 511_1 having a polygonal columnar shape can be provided as having a shape in which the width in the x-axis direction gradually decreases from a specific position toward the edge in the -z-axis direction. At least a portion of the head 511b of the first type mold rib 511_1 can be inserted into the first part 411_1 of the first type position adjustment groove 411 to fit into the bottom surface and sidewall of the first part 411_1.

[0075] State 605 shows a cross-sectional view taken along line B1-B1' of State 601. Referring to State 605, the upper mold 520 can be configured to cover one surface of the support plate 311 in the z-axis direction and cover the empty space without the support plate 311 in the -z-axis direction. The first type position adjustment groove 411 may include a first sidewall 411a having an inclination angle greater than 0 degrees (°) and less than 90° in the -x-axis direction. That is, the inclination angle is provided in the range of 60° to 70° relative to a line extending in the -x-axis direction from the flat bottom surface 411s of the first type position adjustment groove 411 (optionally, the first sidewall 411a has an inclination angle in the range of 20° to 30° relative to a line extending in the direction from a surface (on which the upper mold 520 fits to the support plate 311) of the flat bottom surface 411s of the first type position adjustment groove 411). The first type of position adjustment groove 411 may include a second sidewall 411b having an inclination angle equal to that of the first sidewall 411a, formed relative to a line extending in the -x-axis direction from the flat bottom surface 411s. When viewed from the bottom surface 411s, the first sidewall 411a and the second sidewall 411b may be positioned facing each other. A portion of the first sidewall 411a in the -y-axis direction may be included in a first portion 411_1, and a portion of the first sidewall 411a in the y-axis direction may be included in a second portion 411_2. Therefore, this portion of the first sidewall 411a may include a metallic material, and another portion of the first sidewall 411a may include a non-metallic material or a structure formed by curing resin for injection. Similarly, a portion of the second sidewall 411b in the -y-axis direction may be included in the first portion 411_1, and a portion of the second sidewall 411b in the y-axis direction may be included in the second portion 411_2. Therefore, this portion of the second sidewall 411b may include a metallic material, and another portion of the second sidewall 411b may include a non-metallic material or a structure formed by curing resin for injection.

[0076] State 607 shows a cross-sectional view taken along line B2-B2' of state 601. Referring to state 607, the first type of position adjustment groove 411 may include a third sidewall 411c and a fourth sidewall 411d, which are formed in a z-axis direction perpendicular to the bottom surface 411s. When viewed from the bottom surface 411s, the third sidewall 411c and the fourth sidewall 411d may be positioned facing each other.

[0077] According to various embodiments, the third sidewall 411c and the fourth sidewall 411d may be configured as inclined surfaces having an inclination angle of at least 20° relative to a line extending from the top surface of the support plate 311 in the -z-axis direction, and the first sidewall 411a and the second sidewall 411b may be configured as sidewalls formed in the z-axis direction perpendicular to the bottom surface 411s.

[0078] As described above, in the injection molding process of housing 310, the connecting surface between the first type mold rib 511_1 and support plate 311 can be designed to be inclined. Therefore, the mold can transfer the normally downward applied force to the inclined surface to ensure a proper mating surface. Furthermore, in the injection molding process, resin or injection material spillage or introduction between support plate 311 and first type mold rib 511_1 can be prevented. Optionally, edge breakage in support plate 311 and mold core (or mold rib) can be improved, and a position adjustment groove can be used as a guide to correct the position of support plate 311. Furthermore, the first type position adjustment groove 411 can fix support plate 311 through the mold based on the shape of the mating inclined surface, thereby preventing support plate 311 from wobbling left or right due to injection pressure. As described above, the first type mold rib 511_1 is provided in the mold to prevent support plate 311 from wobbling left or right in two areas including support plate 311 and injection molding member 312. Furthermore, the contact surface between the first type of mold rib 511_1, used to prevent mold wobbling, and the support plate 311 is provided as an inclined surface for mating, thereby preventing resin overflow. Thus, when the upper and lower molds press the support plate 311 vertically, it prevents the injection material (or injection resin, or resin itself) from overflowing into unintended areas.

[0079] Figure 7 A second type of position adjustment groove is shown according to one embodiment.

[0080] exist Figure 7In the diagram, state 701 shows a portion of housing 310 in which the second type of position adjustment groove 412 is provided; state 703 shows at least a portion of a cross-sectional view taken along line C1-C1' in state 701; and state 705 shows at least a portion of a cross-sectional view taken along line C2-C2' in state 701. Referring to state 701, at least a portion of housing 310 may include a portion of support plate 311 and a portion of injection-molded member 310. Support plate 311 may include at least a first pin 311_1, and injection-molded member 312 may include a first pin injection-molded portion 312_1. The second type of position adjustment groove 412 includes a first portion 412_1 formed in the first pin 311_1 and a second portion 411_2 formed in the first pin injection-molded portion 312_1. The first part 412_1 may have sidewalls formed at some edges of the bottom surface 412s in the -x-axis, x-axis, and -y-axis directions (see state 703), and may be provided in the form of a recess open in the y-axis and z-axis directions. The second part 412_2 may have sidewalls formed at some other edges of the bottom surface 412s in the -x-axis, x-axis, and y-axis directions, and may be provided in the form of a recess open in the -y-axis and z-axis directions. The opening in the y-axis direction of the first part 412_1 may connect with the opening in the -y-axis direction of the second part 412_2. The first part 412_1 and the second part 412_2 are open in the z-axis direction to fully form the second type of position adjustment groove 412.

[0081] Referring to state 703, the second type of position adjustment groove 412 may include a bottom surface 412s, a first sidewall 412a, and a second sidewall 412b. The first sidewall 412a has an angle greater than 0° relative to a line extending in the z-axis direction from a first side edge provided in the -x-axis direction based on the center of the bottom surface 412s. The second sidewall 412b has an inclination angle greater than 0° relative to a line extending in the z-axis direction from a second side edge of the bottom surface 412s facing the first side edge and is positioned in the x-axis direction from the center of the bottom surface 412s.

[0082] Referring to states 701 and 703, a portion of the first sidewall 412a and a portion of the second sidewall 412b are included in the first portion 412_1, and another portion of the first sidewall 412a and another portion of the second sidewall 412d can be included in the second portion 412_2. The portion of the first sidewall 412a corresponding to the first portion 412_1 and including the first material can be joined to the other portion of the first sidewall 412a corresponding to the second portion 412_2 and including the second material. Similarly, the portion of the second sidewall 412b corresponding to the first portion 412_1 and including the first material can be joined to the other portion of the second sidewall 412b corresponding to the second portion 412_2 and including the second material.

[0083] Referring to state 705, the second type of position adjustment groove 412 may include a bottom surface 412s, a third sidewall 412c, and a fourth sidewall 412d. The third sidewall 412c has a third side edge provided from the center of the bottom surface 412s in the -y-axis direction at an angle greater than 0° relative to a line extending in the z-axis direction. The fourth sidewall 412d has a fourth side edge of the bottom surface 412s facing the third side edge at an angle greater than 0° relative to the line extending in the z-axis direction and is positioned from the center of the bottom surface 412s in the y-axis direction. The third sidewall 412c may be included in a first portion 412_1, and the fourth sidewall 412d may be included in a second portion 412_2. The third side edge provided from the center of the bottom surface 412s in the -y-axis direction may be interposed between the first and second side edges of the bottom surface 412s, and the fourth side edge may be positioned facing the third side edge. A portion of the bottom surface 412s may be located in the first portion 412_1, and another portion of the bottom surface 412s may be located in the second portion 412_2. Therefore, the bottom surface 412s can be formed by bonding two layers comprising metallic and non-metallic materials.

[0084] Since the aforementioned second-type position adjustment groove 412 is formed by four sidewalls 412a, 412b, 412c, and 412d with specific angles based on the bottom surface 412s, the friction between the edge of the second-type mold rib 512 and the first pin 311_1 can be minimized when the second-type mold rib 512 of the upper mold 520 is placed in the second-type position adjustment groove 412, thereby reducing wear and breakage of the second-type mold rib 512. Furthermore, since the mating surface of the second-type mold rib 512 matches the mating surface of the second-type position adjustment groove 412, stable and uniform pressure is applied to the second-type position adjustment groove 412 through the second-type mold rib 512. Therefore, the second pin 311_2 can be more securely positioned and prevented from shaking.

[0085] According to one embodiment, the mating side surface (or the side surface of the mold rib) of the rectangular mold may not be able to adequately receive the mold opening force, and therefore may be weak when resin overflows. Consequently, the inclination angle from the top surface of the support plate 311 toward the bottom surface 412s of at least one sidewall is formed to be 20° or 30° or greater, thereby expanding the mating area of ​​the side surface and preventing resin overflow. Furthermore, an inclined surface is formed on one side of the mold rib to prevent mold wobbling, thereby preventing the mold from breaking at corners and ensuring durability. The width of one side of the mold rib (or the unidirectional length of the upper part of the opening of the second type position adjustment groove 412 (e.g., the opening located on the top surface and parallel surface of the support member 311) can be from about 0.6 mm to 1.0 mm, and the shape can be polygonal, such as rhombus or ellipse. The depth of the second type position adjustment groove 412 can be in the range of about 0.3 mm to 0.5 mm. Furthermore, as the depth of the second type position adjustment groove 412 increases, the mold or mold rib may be more prone to breakage. Therefore, the dimensions of the support plate 311 can be adjusted. The second type of position adjustment groove 412 can have an inclination angle or slope from the bottom surface 412s in the z-axis direction, or an inclination from the top surface of the support plate 311 toward the bottom surface 412s, within the range of 20° to 30°. Since the mold clamping force is distributed to the inclined surface, in the injection molding process, the inclined surface can prevent the support plate 311 from wobbling to the left or right, improve the fit between the injected resin and the support plate 311, and can serve as an assembly guide when the support plate 311 is inserted into the mold.

[0086] Figure 8 A third type of position adjustment groove is shown according to one embodiment.

[0087] exist Figure 8In the diagram, state 801 shows a portion of housing 310 in which a third-type position adjustment groove 413 is provided, state 803 shows at least a portion of a cross-section taken along line D1-D1' in state 801, and state 805 shows at least a portion of a cross-section taken along line D2-D2' in state 801. Referring to state 801, at least a portion of housing 310 may include a portion of support plate 311 and a portion of injection-molded member 312. Support plate 311 may include at least a first pin 311_1, and injection-molded member 312 may include a first pin injection-molded portion 312_1. The third-type position adjustment groove 413 includes a first portion 413_1 formed in the first pin 311_1 and a second portion 413_2 formed in the first pin injection-molded portion 312_1. The first portion 413_1 may have sidewalls formed at some edges of bottom surface 413s in the -x-axis direction, x-axis direction, and -y-axis direction, and may be provided in the form of a groove open in the y-axis direction and z-axis direction. The second part 413_2 may have sidewalls formed at some other edges of the bottom surface 413s in the -x-axis direction, x-axis direction, and y-axis direction, and may be provided in the form of a groove open in the -y-axis direction and z-axis direction. The opening in the y-axis direction of the first part 413_1 may connect with the opening in the -y-axis direction of the second part 413_2. The first part 413_1 and the second part 413_2 are open in the z-axis direction to fully form the third type of position adjustment groove 413.

[0088] Referring to state 803, the third type of position adjustment groove 413 may include a bottom surface 413s, a first sidewall 413a extending perpendicularly in the z-axis direction from a first side edge provided based on the center of the bottom surface 413s in the -x-axis direction, and a second sidewall 413b extending perpendicularly in the z-axis direction from a second side edge of the bottom surface 413s facing the first side edge and positioned in the x-axis direction from the center of the bottom surface 413s. A portion of the first sidewall 413a and a portion of the second sidewall 413b are included in a first portion 413_1, and another portion of the first sidewall 413a and another portion of the second sidewall 413b may be included in a second portion 413_2. The portion of the first sidewall 413a comprising a first material (e.g., a metallic material) may be joined to another portion of the first sidewall 413a comprising a second material (e.g., a non-metallic material or a structure obtained by curing a resin for injection). Similarly, a portion of the first sidewall 413b comprising a first material (e.g., a metallic material) may be joined to another portion of the second sidewall 413b comprising a second material (e.g., a non-metallic material or a structure obtained by curing a resin for injection).

[0089] Referring to state 805, the third type of position adjustment groove 413 may include a bottom surface 413s, a third sidewall 413c extending perpendicularly in the z-axis direction from a third side edge provided based on the center of the bottom surface 413s in the -y-axis direction, and a fourth sidewall 413d extending perpendicularly in the z-axis direction from a fourth side edge of the bottom surface 413s facing the third side edge and positioned in the y-axis direction from the center of the bottom surface 413s. The third sidewall 413c may be included in a first portion 413_1, and the fourth sidewall 413d may be included in a second portion 413_2. The third side edge provided based on the center of the bottom surface 413s in the -y-axis direction may be interposed between the first and second side edges of the bottom surface 413s. A portion of the bottom surface 413s may be located in the first portion 413_1, and another portion of the bottom surface 413s may be located in the second portion 413_2. Therefore, the bottom surface 413s may be formed by joining two layers comprising mutually different materials (e.g., metallic and non-metallic materials). At least a portion of the third type of position adjustment groove 413 can form an open rectangular empty space in the z-axis direction.

[0090] Because the third type position adjustment groove 413 has four sidewalls 413a, 413b, 413c, and 413d formed perpendicular to the bottom surface 413s, when viewed in the z-axis direction, the dimension of a cross-section of the third type mold rib 513 in the xy plane corresponding to the upper mold 520 is less than or equal to the size of the opening of the third type position adjustment groove 413. As described above, the third type mold rib 513 can be configured to span the area between the support plate 311 and the injection molding member 312, thereby reducing the phenomenon of resin for injection being directly introduced between the support plate 311 and the mold.

[0091] Figure 9 A fourth type of position adjustment groove is shown according to one embodiment.

[0092] exist Figure 9In the diagram, state 901 shows a portion of housing 310 in which a fourth type position adjustment groove 414 is provided, and state 903 shows at least a portion of a cross-section taken along line E-E' of state 901. Referring to state 901, at least a portion of housing 310 may include a portion of support plate 311 and a portion of injection-molded member 312. Support plate 311 may include at least a first pin 311_1, and injection-molded member 312 may include a first pin injection-molded portion 312_1. The fourth type position adjustment groove 414 includes a first portion 414_1 formed in the first pin 311_1 and a second portion 414_2 formed in the first pin injection-molded portion 312_1. The first portion 414_1 may constitute a portion of a hemisphere having a specific curvature in the -z-axis direction and engraved in both the -z-axis and -y-axis directions. The second portion 414_2 may constitute another portion of a hemisphere having a specific curvature in the -z-axis direction and engraved in both the -z-axis and -y-axis directions. The recessed surface of the first portion 414_1 in the -z-axis direction can form part of the fourth type position adjustment groove 414, and the recessed surface of the second portion 414_2 in the -z-axis direction can form another part of the fourth type position adjustment groove 414. The recessed surfaces of the first portion 414_1 and the second portion 414_2 are connected to each other and can form a hemispherical groove. The space corresponding to the first portion 414_1 and the space corresponding to the second portion 414_2 can be open in the z-axis direction and communicate with each other. At the contact portion between the first pin 311_1 and the first pin injection molding member 312, the fourth type position adjustment groove 414 can have the shape of a hemispherical groove engraved in the -z-axis direction. In this respect, at least the end of the edge of the fourth type mold rib 514 of the upper mold 520 in the -z-axis direction can be provided to be hemispherical.

[0093] Referring to state 903, the top surface of the first pin 311_1 and the top surface of the first pin injection molding portion 312_1 are aligned with each other in the z-axis direction, and a sidewall of the first pin 311_1 and a sidewall of the first pin injection molding portion 312_1 can be joined together. A fourth type mold rib 514 can be located at the boundary between the first pin 311_1 and the first pin injection molding portion 312_1. Before performing the injection molding process, a first portion 414_1 can be formed in the first pin 311_1, which serves to accommodate a portion of the end of the edge of the fourth type mold rib 514. When the material for injection is injected and hardened by the injection molding process and when the fourth type mold rib 514 is engaged with the first portion 414_1, a second portion 414_2 can be formed in the space adjacent to the first pin 311_1.

[0094] The curved first portion 414_1 of the hemispherical fourth-type position adjustment groove 414 can provide a uniform mating surface relative to the hemispherical fourth-type mold rib 514. Optionally, since one end of the fourth-type mold rib 514 is provided in a hemispherical shape, friction between the fourth-type mold rib 514 and the fourth-type position adjustment groove 414 can be reduced when the fourth-type mold rib 514 is engaged with the fourth-type position adjustment groove 414, thereby preventing breakage or wear of the fourth-type mold rib 514.

[0095] Figure 10 A fifth type of position adjustment groove is shown according to one embodiment.

[0096] exist Figure 10 In the diagram, state 1001 shows a portion of housing 310 in which a fifth-type position adjustment groove 415 is provided, and state 1003 shows at least a portion of a cross-section taken along line F-F' of state 1001. Referring to state 1001, at least a portion of housing 310 may include a portion of support plate 311 and a portion of injection-molded member 312. Support plate 311 may include at least a first pin 311_1, and injection-molded member 312 may include a first pin injection-molded portion 312_1. The fifth-type position adjustment groove 415 includes a first portion 415_1 formed in the first pin 311_1 and a second portion 415_2 formed in the first pin injection-molded portion 312_1. The first portion 415_1 may have stepped sidewalls in the -x-axis direction, x-axis direction, and -y-axis direction at some other edges of the bottom surface 415s, and may be provided in the form of an open groove in the y-axis direction and z-axis direction. The second part 415_2 may have stepped sidewalls in the -x-axis direction, x-axis direction, and y-axis direction, and may be provided in the form of an open groove in the -y-axis direction and z-axis direction. The opening in the y-axis direction of the first part 415_1 may connect with the opening in the -y-axis direction of the second part 415_2. The first part 415_1 and the second part 415_2 are open in the z-axis direction to fully form the fifth type position adjustment groove 415.

[0097] Referring to state 1003, the first sidewall of the fifth type position adjustment groove 415 may include a first inclined surface 415a and a first curved surface 415e. The first inclined surface 415a has an angle greater than 0° relative to a line extending in the z-axis direction from the first side edge of the bottom surface 415s and is positioned in the -x-axis direction from the center of the bottom surface 415s. The first curved surface 415e extends from the z-axis-facing end of the first inclined surface 415a toward the z-axis-facing top surface of the first pin 311_1 and is etched (or recessed) in the -z-axis direction. For example, the first curved surface 415e may include a surface inserted between the top surface of the support plate 311 (or the first pin 311_1) and the z-axis-facing upper end of the first inclined surface 415a, and has a specific curvature in the -z-axis direction. The second sidewall may include a second inclined surface 415b and a second curved surface 415f. The second inclined surface 415b has an inclination angle greater than 0° formed from the second side edge facing the first side edge relative to a line extending in the z-axis direction and is positioned in the x-axis direction from the center of the bottom surface 415s. The second curved surface 415f extends from the z-axis-facing end of the second inclined surface 415b toward the z-axis-facing top surface of the first pin 311_1 and is etched (or bent) in the -z-axis direction. For example, the second curved surface 415f may include a surface inserted between the top surface of the support plate 311 (or the first pin 311_1) and the z-axis-facing upper end of the second inclined surface 415b, and has a specific curvature in the -z-axis direction. Additionally or optionally, the fifth type position adjustment slot 415 may include four sidewalls, as shown in state 1001. For example, a third and fourth sidewall are formed between the first sidewalls 415a and 415e and the second sidewalls 415b and 415f, while facing each other. At least one of the third and fourth sidewalls may have the same or similar shape as the first sidewalls 415a and 415e or the second sidewalls 415b and 415f.

[0098] At least a portion of the fifth type mold rib 515 of the upper mold 520 (which corresponds to the fifth type position adjustment groove 415) may have a structure for placement in the fifth type position adjustment groove 415. For example, the fifth type mold rib 515 may include an end corresponding to the bottom surface 415s, a side surface connected to the end and corresponding to the inclined surface (e.g., at least the first inclined surface 415a and the second inclined surface 415b) of the fifth type position adjustment groove 415, and a curved portion extending from the end of the side surface, having a specific curvature and a raised shape. Therefore, the internal rigidity of the support plate 311 can be maintained, and the degradation of the antenna performance of the housing 310 can be mitigated.

[0099] Despite the above references Figure 10The fifth type of position adjustment groove 415 described includes four sidewalls with the same structure as an example, but this disclosure is not limited thereto. For example, the third and fourth sidewalls may have shapes different from the shapes of the first sidewalls 415a and 415e and the second sidewalls 415b and 415f. For example, the third and fourth sidewalls may be formed perpendicularly from the edge of the bottom surface 415s toward the top surface of the phase support plate 311 in the z-axis direction, such as... Figure 6 As shown. Optionally, the third and fourth sidewalls can form an inclined surface having an inclination angle equal to or greater than 20° and less than 90°, the inclination angle being formed relative to a line extending in the z-axis direction from the edge of the bottom surface 415s toward the top surface of the support plate 311, as shown. Figure 7 As shown.

[0100] As mentioned above, it has been referred to Figures 6 to 10 Various types of position adjustment slots are described in the boundary between the first pin 311_1 of the support plate 311 and the first pin injection molding member 312_1 of the injection molding member 312, but this disclosure is not limited thereto. For example, various types of position adjustment slots can be similarly applied to various locations of the support plate 311, such as the boundary between at least one pin for connecting the first antenna unit 311a and the body 311_21 and an adjacent injection molding member, the boundary between at least one pin for connecting the second antenna unit 311b and the body 311_21 and an adjacent injection molding member, and the boundary between at least one pin for connecting the third antenna unit 311c and the body 311_21 and an adjacent injection molding member. Optionally, although the shape of the position adjustment slots in this disclosure can be uniform, as shown in reference to Figure 7 The second type of position adjustment slot 412 is described, but various types of position adjustment slots can be applied depending on the position or shape of the pin.

[0101] As described above, the housing of a portable electronic device may include an injection-molded component at least partially exposed to the outside, a support plate (stand) located inside the injection-molded component and at least partially serving as an antenna, and communication circuitry. The housing of the portable electronic device can be electrically connected to the communication circuitry via an antenna grounding portion. A groove for adjusting the position via a mold can be formed in the peripheral portion of the antenna grounding portion, spanning both the support plate and the injection-molded component. The side surface of the position adjustment groove can have an inclination angle of at least 20°.

[0102] According to the various embodiments described above, a portable communication device may include a housing and a PCB disposed within the housing and in which communication circuitry is mounted. The housing may include: a support plate including at least one antenna element operatively connected to the communication circuitry; and an injection-molded member surrounding at least a portion of the at least one antenna element. The support plate may include a body in which at least a portion of the PCB is disposed, and at least one pin connecting the at least one antenna element to the body. Furthermore, the support plate may include at least one position adjustment groove formed at the location where the at least one pin contacts the injection-molded member.

[0103] According to various embodiments, the at least one position adjustment groove includes a first portion formed by engraving a portion of a support plate and a second portion formed by engraving a portion of an injection-molded component and connected to the first portion.

[0104] According to various embodiments, the bottom surface of the first portion and the bottom surface of the second portion are connected to each other to form a single bottom surface. The bottom surfaces of the first portion and the second portion are located on the same plane.

[0105] According to various embodiments, since the bottom of the first part and the bottom of the second part are connected to each other to form a bottom surface, the at least one position adjustment groove includes a plurality of sidewalls having an inclination angle greater than 0° relative to a line extending from the top surface of the support plate to the bottom surface.

[0106] According to various embodiments, the tilt angle is formed to be 20° or greater.

[0107] According to various embodiments, the plurality of sidewalls includes a first sidewall and a second sidewall, the first sidewall having a portion included in a first portion and another portion included in a second portion, and the second sidewall having a portion included in the first portion and another portion included in the second portion and positioned opposite to the first sidewall.

[0108] According to various embodiments, the plurality of sidewalls includes a third sidewall and a fourth sidewall, the third sidewall being inserted between the first sidewall and the second sidewall and comprising a first material, and the fourth sidewall being inserted between the first sidewall and the second sidewall, provided opposite to the third sidewall and comprising a second material.

[0109] According to various embodiments, the portable electronic device further includes: a third sidewall, inserted between the first and second sidewalls, comprising a first material and formed perpendicularly from one edge of the bottom surface; and a fourth sidewall, inserted between the first and second sidewalls, provided opposite to the third sidewall, comprising a second material and formed perpendicularly from opposite edges of the bottom surface.

[0110] According to various embodiments, the plurality of sidewalls includes: a first sidewall included in a first portion and comprising a first material; and a second sidewall included in a second portion, comprising a second material and positioned opposite to the first sidewall.

[0111] According to various embodiments, the portable electronic device further includes: a third sidewall, inserted between the first and second sidewalls, comprising a portion containing a first material and another portion containing a second material, and formed perpendicularly from one edge of the bottom surface; and a fourth sidewall, inserted between the first and second sidewalls, provided opposite to the third sidewall, comprising a portion containing a first material and another portion containing a second material, and formed perpendicularly from opposite edges of the bottom surface.

[0112] According to various embodiments, the at least one position adjustment groove includes a sculpted curved surface having a hemispherical shape.

[0113] According to various embodiments, the at least one position adjustment groove includes: a first portion corresponding to a portion of a curved surface, wherein the portion of the curved surface includes a first material; and a second portion corresponding to another portion of the curved surface, wherein the other portion of the curved surface includes a second material.

[0114] According to various embodiments, the at least one position adjustment groove has a stepped shape.

[0115] According to various embodiments, the at least one position adjustment groove includes a bottom surface and a first sidewall and a second sidewall formed from the edge of the bottom surface toward the top surface of the support plate. The first sidewall has a first inclined surface and a first curved surface, the first inclined surface being formed at an angle greater than 0° relative to a line extending from the first side edge of the bottom surface of the support plate toward the top surface of the support plate, and the first curved surface being stepped at the upper end of the first inclined surface and formed toward the top surface of the support plate. The second sidewall includes a second inclined surface and a second curved surface, the second inclined surface being formed at an angle greater than 0° relative to a line extending from a second side edge of the bottom surface opposite to the first side edge toward the top surface of the support plate, and the second curved surface being stepped at the upper end of the second inclined surface, formed toward the top surface of the second inclined surface, and positioned opposite to the first curved surface.

[0116] According to various embodiments, the position adjustment slot is positioned closer to the main body than to the at least one antenna element.

[0117] According to various embodiments, at least one pin may include a first pin positioned between the body and the first antenna element in a first direction and a second pin positioned between the body and the first antenna element in a second direction.

[0118] According to various embodiments, the at least one position adjustment slot includes a first position adjustment slot and a second position adjustment slot, the first position adjustment slot having a portion formed in a first pin and the second position adjustment slot having a portion formed in a second pin.

[0119] According to one of the various embodiments described above, the housing includes: a support plate including at least one antenna element operatively connected to a communication circuit; and an injection-molded member surrounding at least a portion of the at least one antenna element. The support plate includes a body, at least one pin connecting the at least one antenna element to the body, and at least one position adjustment groove formed at a location where the at least one pin contacts the injection-molded member.

[0120] According to various embodiments, the at least one position adjustment groove includes a first portion formed by engraving a portion of a support plate and a second portion formed by engraving a portion of an injection-molded component and connected to the first portion. The at least one position adjustment groove may include one of the following: a structure having at least one sidewall with an inclination angle greater than 0°; a structure having an engraved curved surface with a hemispherical shape; and a stepped structure.

[0121] Figure 11 This is a block diagram illustrating an electronic device 1101 in a network environment 1100 according to an embodiment. (See reference...) Figure 11 In network environment 1100, electronic device 1101 can communicate with electronic device 1102 via a first network 1198 (e.g., a short-range wireless communication network), or with at least one of electronic device 1104 or server 1108 via a second network 1199 (e.g., a long-range wireless communication network). Electronic device 1101 can communicate with electronic device 1104 via server 1108. Electronic device 1101 may include processor 1120, memory 1130, input module 1150, sound output module 1155, display module 1160, audio module 1170, sensor module 1176, interface 1177, connection terminal 1178, haptic module 1179, camera module 1180, power management module 1188, battery 1189, communication module 1190, user identification module (SIM) card 1196, or antenna module 1197. At least one of the aforementioned components may be omitted from electronic device 1101, or one or more other components may be added to electronic device 1101. Some of the aforementioned components may be implemented as a single integrated component.

[0122] Processor 1120 can run program 1140 to control at least one hardware or software component of electronic device 1101 connected to processor 1120, and can perform various data processing or calculations. As at least part of the data processing or calculations, processor 1120 can store commands or data received from sensor module 1176 or communication module 1190 into volatile memory 1132, process the commands or data stored in volatile memory 1132, and store the result data in non-volatile memory 1134. Processor 1120 may include main processor 1121 (e.g., central processing unit (CPU) or application processor (AP)) or auxiliary processor 1123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with main processor 1121. For example, when electronic device 1101 includes a main processor 1121 and an auxiliary processor 1123, the auxiliary processor 1123 may be adapted to consume less power than the main processor 1121, or may be adapted to be dedicated to a specific function. The auxiliary processor 1123 may be implemented separately from the main processor 1121, or may be implemented as part of the main processor 1121.

[0123] When the main processor 1121 is inactive (e.g., in a sleep state), the auxiliary processor 1123 (other than the main processor 1121) can control at least some of the functions or states associated with at least one of the components of the electronic device 1101, or when the main processor 1121 is active, the auxiliary processor 1123 can work with the main processor 1121 to control at least some of the functions or states associated with at least one of the components of the electronic device 1101 (e.g., display module 1160, sensor module 1176, or communication module 1190). The auxiliary processor 1123 may be implemented as part of a camera module 1180 or communication module 1190 functionally associated with the auxiliary processor 1123. The auxiliary processor 1123 (e.g., a neural processing unit) may include hardware architectures dedicated to processing artificial intelligence models. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via the electronic device 1101 where artificial intelligence is performed or via a separate server 1108. Learning algorithms may include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. Artificial intelligence models may include multiple layers of artificial neural networks. These artificial neural networks may be deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), or deep Q-networks, or combinations of two or more thereof, but are not limited thereto. Additionally or optionally, artificial intelligence models may include software structures in addition to hardware structures.

[0124] The memory 1130 may store various data used by at least one component of the electronic device 1101. The various data may include program 1140 and input or output data for commands associated with it. The memory 1130 may include volatile memory 1132 or non-volatile memory 1134.

[0125] The program 1140 may be stored as software in the memory 1130, and the program 1140 may include an operating system (OS) 1142, middleware 1144, or application 1146.

[0126] Input module 1150 can receive commands or data from the user of electronic device 1101 that will be used by processor 1120 of electronic device 1101. Input module 1150 may include a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0127] The sound output module 1155 can output sound signals to the outside of the electronic device 1101. The sound output module 1155 may include a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. The receiver can be implemented separately from the speaker or as part of the speaker.

[0128] Display module 1160 can visually provide information to the user of electronic device 1101. Display device 1160 may include a display, holographic device, or projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. Display module 1160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0129] Audio module 1170 can convert sound into electrical signals and vice versa. Audio module 1170 can obtain sound via input module 1150, or output sound via sound output module 1155 or headphones of an external electronic device (e.g., electronic device 1102) that is directly (e.g., wired) or wirelessly connected to electronic device 1101.

[0130] Sensor module 1176 can detect the operating state of electronic device 1101 (e.g., power or temperature) or the environmental state outside electronic device 1101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. Sensor module 1176 may include a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0131] Interface 1177 may support one or more specific protocols used to enable electronic device 1101 to connect directly (e.g., wired) or wirelessly to external electronic device (e.g., electronic device 1102). Interface 1177 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0132] Connection 1178 may include a connector, through which electronic device 1101 can be physically connected to an external electronic device (e.g., electronic device 1102). Connection 1178 may include an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0133] The haptic module 1179 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. The haptic module 1179 may include a motor, a piezoelectric element, or an electrical stimulator.

[0134] Camera module 1180 can capture still or moving images. Camera module 1180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0135] The power management module 1188 manages the power supply to the electronic device 1101. The power management module 1188 can be implemented as at least part of a power management integrated circuit (PMIC).

[0136] Battery 1189 may power at least one component of electronic device 1101. Battery 1189 may include a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0137] Communication module 1190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 1101 and external electronic devices (e.g., electronic device 1102, electronic device 1104, or server 1108), and perform communication via the established communication channel. Communication module 1190 may include one or more communication processors capable of operating independently of processor 1120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. Communication module 1190 may include wireless communication module 1192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 1194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 1198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 1199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 1192 can identify and verify the electronic device 1101 in the communication network (such as the first network 1198 or the second network 1199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1196.

[0138] Wireless communication module 1192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 1192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 1192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 1192 can support various requirements specified in electronic device 1101, external electronic device (e.g., electronic device 1104), or network system (e.g., second network 1199). The wireless communication module 1192 can support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane delay (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0139] Antenna module 1197 can transmit or receive signals or power to or from external electronic devices of electronic device 1101. Antenna module 1197 may include an antenna comprising a radiating element formed of conductive material or conductive patterns formed in or on a PCB. Antenna module 1197 may include an array antenna. In this case, wireless communication module 1192 can select at least one antenna from the plurality of antennas suitable for a communication scheme used in a communication network (such as a first network 1198 or a second network 1199). Signals or power can then be transmitted or received between communication module 1190 and external electronic devices via the selected at least one antenna. Additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 1197.

[0140] According to various embodiments, antenna module 1197 can form a millimeter-wave antenna module. The millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0141] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0142] Commands or data can be sent or received between electronic device 1101 and external electronic device 1104 via server 1108 connected to the second network 1199. Each of electronic device 1102 or electronic device 1104 may be of the same type as electronic device 1101 or a different type. All or some operations that would run on electronic device 1101 may run on one or more of external electronic devices 1102, external electronic device 1104, or server 1108. For example, if electronic device 1101 is required to automatically perform a function or service or should perform a function or service in response to a request from a user or another device, electronic device 1101 may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 1101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 1101. Electronic device 1101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 1101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 1104 may include an Internet of Things (IoT) device. Server 1108 may be an intelligent server using machine learning and / or neural networks. External electronic device 1104 or server 1108 may be included in a second network 1199. Electronic device 1101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0143] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0144] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0145] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0146] The various embodiments set forth herein can be implemented as software comprising one or more instructions readable by a machine (e.g., electronic device 1101) stored in a storage medium (e.g., internal memory 1136 or external memory 1138). For example, under the control of a processor (e.g., processor 1120), the processor of the machine (e.g., electronic device 1101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media, wherein non-transitory storage media indicates that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves). However, this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0147] The method according to the embodiments may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0148] Each of the aforementioned components (e.g., a module or program) may comprise a single entity or multiple entities, and some of these entities may be separately located in different components. According to various embodiments, one or more of the aforementioned components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component performed one or more functions prior to integration. The operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. A portable communication device, comprising: case; A printed circuit board is housed in the housing and mounted to the communication circuitry; as well as At least one position adjustment slot, The housing includes a support plate having at least one antenna element operatively connected to the communication circuit, and an injection-molded member surrounding at least a portion of the at least one antenna element. The support plate includes a body in which at least a portion of the printed circuit board is disposed, and at least one pin connecting the at least one antenna element to the body. The at least one position adjustment groove is formed at the position where the at least one pin contacts the injection-molded component. The at least one position adjustment slot includes: The first part is formed in a portion of the support plate; and The second part is formed in a portion of the injection-molded component and connected to the first part.

2. The portable communication device according to claim 1, The bottom surface of the first part and the bottom surface of the second part are connected to each other to form a single bottom surface. The bottom surface of the first part and the bottom surface of the second part are located on the same plane.

3. The portable communication device according to claim 1, wherein the at least one position adjustment slot comprises, The bottom of the first part and the bottom of the second part are connected to each other to form a bottom surface, and Multiple sidewalls, based on lines extending from the top surface of the support plate toward the bottom surface with an inclination angle greater than 0 degrees.

4. The portable communication device according to claim 3, The tilt angle is at least 20 degrees.

5. The portable communication device of claim 3, wherein the plurality of sidewalls comprises: The first sidewall has a portion included in the first part and another portion included in the second part; and The second sidewall has a portion included in the first part and another portion included in the second part, and is positioned relative to the first sidewall.

6. The portable communication device according to claim 5, wherein the plurality of sidewalls further comprises: The third sidewall is inserted between the first sidewall and the second sidewall and includes the first material; and A fourth sidewall, inserted between the first and second sidewalls, provided opposite to the third sidewall, and comprising a second material.

7. The portable communication device of claim 5, wherein the plurality of sidewalls further comprises: A third sidewall is inserted between the first sidewall and the second sidewall, the third sidewall comprising a first material and formed perpendicularly from one edge of the bottom surface; and A fourth sidewall is inserted between the first sidewall and the second sidewall, the fourth sidewall being provided opposite to the third sidewall, comprising a second material and formed perpendicularly from the opposite edge of the bottom surface.

8. The portable communication device of claim 3, wherein the plurality of sidewalls comprises: The first sidewall is included in the first portion and comprises the first material; and A second sidewall is included in the second portion, the second sidewall comprising a second material and positioned opposite the first sidewall.

9. The portable communication device according to claim 8, further comprising: A third sidewall is inserted between the first sidewall and the second sidewall, the third sidewall comprising a portion containing the first material and another portion containing the second material, and is formed perpendicularly from one edge of the bottom surface; and A fourth sidewall, inserted between the first sidewall and the second sidewall, is provided opposite to the third sidewall, comprising a portion containing the first material and another portion containing the second material, and is formed perpendicularly from opposite edges of the bottom surface.

10. The portable communication device according to claim 1, wherein the at least one position adjustment slot comprises: The curved surface is sculpted and has a hemispherical shape. The first portion corresponds to a portion of the curved surface, wherein the portion of the curved surface comprises a first material, and The second part corresponds to another part of the curved surface, wherein the other part of the curved surface comprises a second material.

11. The portable communication device according to claim 1, The at least one position adjustment groove includes a stepped shape.

12. The portable communication device of claim 11, wherein the at least one position adjustment slot comprises: Bottom surface; and The first and second sidewalls are formed from the edge of the bottom surface toward the top surface of the support plate. The first sidewall includes: A first inclined surface is formed at an angle greater than 0 degrees relative to a line extending from the first side edge of the bottom surface toward the top surface of the support plate. A first curved surface, which is stepped at the upper end of the first inclined surface and forms towards the top surface of the support plate, and The second sidewall includes: The second inclined surface is formed at an angle greater than 0 degrees relative to a line extending from the second side edge of the bottom surface opposite to the first side edge toward the top surface of the support plate. The second curved surface is stepped at the upper end of the second inclined surface, and the second curved surface is formed toward the top surface of the second inclined surface and positioned opposite the first curved surface.

13. The portable communication device according to claim 1, The position adjustment slot is positioned closer to the main body than to the at least one antenna element.

14. The portable communication device of claim 1, wherein the at least one pin comprises: A first pin is positioned in a first direction between the body and a first antenna element in the at least one antenna element; and The second pin is positioned in a second direction between the main body and the first antenna unit. The at least one position adjustment slot includes: A first position adjustment slot has a portion formed in the first pin; and The second position adjustment slot has a portion formed in the second pin.

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