Component mounting machine

Abstract

The component mounting machine includes a substrate conveyance unit, a component supply unit, a component mounting unit, and a control unit. The component supply unit includes a plurality of trays each of which is movable between a storage position and a component pickup position. The component mounting unit picks up components from the trays moved to the component pickup position and mounts the components on a substrate at a component mounting position. The control unit controls the substrate conveyance unit, the component supply unit, and the component mounting unit. The control unit alternately performs a first mounting process and a second mounting process on a plurality of substrates conveyed to the component mounting position. In the first mounting process, components housed in the trays are mounted on the substrate in ascending order from a first layer tray to an n-th layer tray. In the second mounting process, components housed in the trays are mounted on the substrate in descending order from the n-th layer tray to the first layer tray.

Description

Technical Field

[0001] This specification relates to a component mounting machine for mounting components onto a substrate. Background Technology

[0002] In component mounting machines that mount components onto a substrate, tray-type component supply units are sometimes used. An example of a component mounting machine equipped with a tray-type component supply unit is disclosed in Japanese Patent Application Publication No. 2001-85889. The tray-type component supply unit includes multiple trays for holding components and a storage container for holding the multiple trays. Each of the multiple trays contains components of the same type and can move between a storage position and a component removal position. When mounting components onto a substrate, firstly, a substrate transport unit moves the substrate into the component assembly position within the mounting machine. Then, the tray containing the first type of component to be assembled (hereinafter, sometimes referred to as the first tray) moves vertically within the storage container to a storage position, and is subsequently pulled out from the storage position to a component removal position. Next, the component mounting unit absorbs components from the tray pulled out to the component removal position and mounts the absorbed components onto the substrate. If the components are mounted on the substrate, the first tray pulled out to the component removal position moves to the storage position. Next, the tray containing the second type of component (hereinafter sometimes referred to as the second tray) moves vertically within the storage container to the storage position, and is then pulled out from the storage position to the component removal position. If the second tray is pulled out to the component removal position, the second type of component is mounted onto the substrate using the component mounting unit, similar to the first type of component. The same steps are then repeated to mount the components onto the substrate until the last type of component is mounted. Once all components are mounted, the substrate transport unit removes the substrate from the component assembly position to outside the component mounting machine. Summary of the Invention

[0003] The problem that the invention aims to solve

[0004] As described above, in this component mounting machine, from the end of substrate production until the start of production of the next substrate, it is necessary to store the tray containing the last type of component to be mounted (hereinafter, sometimes referred to as the last tray) in a storage position, move the first tray to the storage position, and then pull it out from the storage position to the component removal position. Typically, the storage unit stores the first tray to the last tray in the mounting sequence. Therefore, from the state where the last tray is stored in the storage position until the state where the first tray is moved to the storage position, the distance the first tray travels within the storage unit becomes longer. As a result, time is required until the first tray is pulled out to the component removal position, sometimes resulting in a waiting time for the component mounting unit.

[0005] This specification discloses a technique for suppressing the waiting time generated by the component mounting unit when starting the production of the next substrate from the end of the substrate production.

[0006] Technical solutions for solving the problem

[0007] The component mounting machine disclosed in this specification is a component mounting machine for mounting components onto a substrate, and includes a substrate transport unit, a component supply unit, a component mounting unit, and a control unit. The substrate transport unit moves the substrate into the component assembly position and removes the substrate from the component assembly position. The component supply unit includes a tray hopper with multiple trays for storing components, each tray being configured to move between a storage position and a component removal position. The component mounting unit, while a tray is moving from the storage position to the component removal position, picks up a component from the tray that has moved to the component removal position and mounts the picked-up component onto the substrate moved into the component assembly position. The control unit controls the substrate transport unit, the component supply unit, and the component mounting unit. The control unit is configured to alternately perform a first mounting process and a second mounting process on the multiple substrates moved into the component assembly position. Here, in the first mounting process, components stored in trays from the first to the nth layer (n is an integer of 2 or more) of the tray hopper are mounted onto the substrate, and the components stored in each tray are mounted onto the substrate in ascending order from the first layer tray to the nth layer tray. In the second mounting process, components housed in trays from the first to the nth layers of the tray hopper, where components were supplied in the first mounting process, are mounted onto the substrate. Components housed in each tray are mounted onto the substrate in descending order from the nth layer tray to the first layer tray. Furthermore, alternating between the first and second mounting processes means that if the first mounting process is performed, the second mounting process is performed before the next first mounting process, and vice versa. Therefore, the first and second mounting processes do not need to be performed consecutively; other mounting processes can be performed between the first and the next second mounting process, or between the second and the next first mounting process. Attached Figure Description

[0008] Figure 1 This is a side view schematically illustrating the structure of the component mounting machine of an embodiment.

[0009] Figure 2 This is a block diagram illustrating the structure of the control system of the component mounting machine in the embodiment.

[0010] Figure 3 This is a schematic diagram illustrating the steps of mounting components onto a substrate using a component mounting machine according to embodiments and existing examples.

[0011] Figure 4 This is a schematic diagram illustrating the steps of mounting components onto a substrate using a component mounting machine according to embodiments and existing examples.

[0012] Figure 5 This is a schematic diagram illustrating the structure of a component supply unit with two pallet hoppers.

[0013] Figure 6 Opposite substrate mounting from Figure 5 The diagram illustrates the steps of supplying components to the component supply unit. Detailed Implementation

[0014] In the component mounting machine disclosed in this specification, a first mounting process and a second mounting process are alternately performed on multiple substrates that are moved to the component assembly position. Therefore, for example, if the first mounting process is performed on the first substrate, the second mounting process is performed on the second substrate, and so on, the first mounting process and the second mounting process are performed alternately. Therefore, it is possible to start the production of the next substrate without changing the tray that has been pulled out to the component removal position when the production of the next substrate ends. Therefore, it is possible to suppress the situation where the component mounting unit waits when starting the production of the next substrate after the production of the previous substrate has ended.

[0015] Furthermore, in the component mounting machine disclosed in this specification, by sequentially arranging the first layer tray to the nth layer tray, the switching time from the preceding tray to the next tray can be shortened in both the first mounting process and the second mounting process, and the waiting time generated by the component mounting unit can be suppressed.

[0016] Alternatively, the component mounting machine disclosed in this specification may also include: an input unit for inputting a first installation program for causing the control unit to perform a first installation process; and a processing unit for generating a second installation program for causing the control unit to perform a second installation process based on the input first installation program when the first installation program is input from the input unit. With this structure, if the first installation program is input, the second installation program is automatically generated. Therefore, the operator is not required to perform the operation of generating the second installation program.

[0017] Alternatively, in the component mounting machine disclosed in this specification, the first mounting process may include a specific first mounting process for mounting two or more specific components to the same location on the substrate. The mounting order of the two or more specific components to the substrate may also be preset. Alternatively, in this case, when a first installation procedure for causing the control unit to execute the specific first mounting process is input to the input unit, the arithmetic unit output may fail to generate a second installation procedure for causing the control unit to execute a second mounting process corresponding to the specific first mounting process. In substrates produced by the component mounting machine, sometimes multiple components are mounted to the same location on the substrate, and the mounting order of these multiple components is preset. For example, sometimes electronic components are mounted on the substrate, and a shield is assembled onto the substrate to cover the electronic components. In such cases, the electronic components must be mounted first, followed by the shield. In the case of a first mounting process including such a process (i.e., a specific first mounting process), if the mounting order to the substrate is simply reversed, the substrate cannot be produced. In the aforementioned component mounting machine, when the first installation procedure for executing the specific first mounting process is input to the input unit, the arithmetic unit determines that it cannot execute the second mounting process corresponding to the specific first mounting process, and outputs that it cannot generate a second installation procedure. This prevents the automatic execution of a second installation process that corresponds to a specific first installation process.

[0018] Example 1

[0019] Hereinafter, the component mounting machine 10 according to the embodiment will be described with reference to the accompanying drawings. The component mounting machine 10 is an apparatus for mounting predetermined components 4 to predetermined positions on a substrate 2. The component mounting machine 10 is also referred to as a surface mount machine, a chip mounter, etc. The component mounting machine 10 is arranged side-by-side with a solder printer, other component mounting machines, and a substrate inspection machine, forming a series of mounting lines. Figure 1 As shown, the component mounting machine 10 includes a substrate handling unit 20, a component supply unit 30, a component mounting unit 40, and a control device 50.

[0020] The substrate transport unit 20 moves the substrate 2, which is supplied to the transport inlet of the component mounting machine 10, along the X direction ( Figure 1 The substrate 2 is moved (vertically) to the component assembly position P3. Furthermore, the substrate transport unit 20 removes the component-assembled substrate 2 from the component assembly position P3 and moves it to the delivery outlet of the component mounting machine 10. The component-assembled substrate 2, transported to the delivery outlet, is shipped as a final product or as a semi-finished product to a subsequent process. The substrate transport unit 20 can employ a conventionally known structure. For example, a unit including a pair of conveyor belts and a substrate holding portion mounted on the conveyor belts and supporting the substrate 2 from below can be used, but it is not limited to this.

[0021] The component supply unit 30 is a so-called tray-type feeder (tray-type component supply unit). The component supply unit 30 has a housing 32 with a tray station 38 extending on one side. The upper surface area of ​​the tray station 38 communicates with the internal space of the housing 32 through an opening 36 provided in the housing 32. The housing 32 has multiple trays TR (TR1, TR2, TR3...) and a storage container 34 for accommodating the multiple trays TR (an example of a tray hopper as described in the technical solution). Multiple slots 35 are formed in the storage container 34. Each slot 35 accommodates one tray TR in a horizontal manner. The multiple trays TR accommodate components CH (CH1, CH2, CH3...) of the same type inside. For example, the first tray TR1 accommodates the first assembled component CH (CH1), the second tray TR2 accommodates the second assembled component CH (CH2), the third tray TR3 accommodates the third assembled component CH (CH3), and the nth tray TRn accommodates the nth assembled component CH.

[0022] The component supply unit 30 has multiple trays TR that are movable between a storage position P1 and a component retrieval position P2. The storage position P1 is located within the interior space of the housing 32 at the height of the opening 36. The component retrieval position P2 is located on the upper surface side of the tray station 38. The component supply unit 30 includes a tray handling device (not shown) that moves the trays TR horizontally between the storage position P1 and the component retrieval position P2. Figure 1 The component supply unit 30 moves the reservoir 34 in the vertical direction (Y direction). Furthermore, the component supply unit 30 has the function of causing the reservoir 34 to move in the vertical direction (Y direction). Figure 1 A lifting device (not shown) that moves in the Z direction. The lifting device moves the slot 35 containing the tray TR vertically to the storage position P1 so that a specific tray TR in the storage unit 34 can be pulled out. Additionally, in Figure 1 In the case of the component supply unit 30 shown, both the housing 32 and the tray station 38 are disposed inside the component mounting machine 10, but it is also possible to only dispose of the tray station 38 inside and the housing 32 outside.

[0023] The component mounting unit 40 adsorbs the component CH from the tray TR, which has moved to the component removal position P2, while the tray TR has moved from the storage position P1 to the component removal position P2. Furthermore, the component mounting unit 40 mounts the adsorbed component CH onto the substrate 2, which has been moved to the component assembly position P3. The component mounting unit 40 includes a moving device 42, a head unit 44, and a suction nozzle 46. The moving device 42 moves the head unit 44 along the X and Y directions. The moving device 42 consists of a guide rail for guiding the head unit 44, a moving mechanism for moving the head unit 44 along the guide rail, and a motor for driving the moving mechanism. The moving device 42 is positioned above the component supply unit 30 and the substrate 2. The head unit 44 moves in the space above the component supply unit 30 and above the substrate 2 via the moving device 42. The head unit 44 can be fitted with a suction nozzle 46 of a shape and size corresponding to the type of component CH, and the fitted suction nozzle 46 can be moved along the Z direction. The nozzle 46 adsorbs the element CH at its front end and releases the element CH at a predetermined position on the substrate 2.

[0024] Figure 2 The structure of the control system of the component mounting machine 10 according to the embodiment is shown. The control device 50 is configured using a computer equipped with a CPU, ROM, and RAM. The control device 50, the substrate handling unit 20, the component supply unit 30, the component mounting unit 40, and the touch panel 54 are all included. Figure 1 (See diagram) and transceiver circuit 58 are communicatively connected. Touch panel 54 is a display device providing various information about the component mounting machine 10 to the operator, and also an input device for receiving instructions and information from the operator. Transceiver circuit 58 is connected to production management computer 52 (which manages the component mounting machine 10). Figure 1 (As shown in the diagram) They can be communicatively connected. The transceiver circuit 58 functions as an input / output interface sandwiched between the production management computer 52 and the control device 50. The transceiver circuit 58 receives the production program sent from the production management computer 52 and retrieves it into the control device 50. The retrieved production program is stored in the RAM of the control device 50 and can be read from there as needed. In addition, the number of component mounting machines 10 managed by the production management computer 52 is usually multiple, and the number is not particularly limited.

[0025] The control device 50 controls the operation of each part of the component mounting machine 10 based on the production process, and is able to mount the component CH onto the substrate 2. That is, the control device 50 functions as a control unit for controlling the substrate handling unit 20, the component supply unit 30, the component mounting unit 40, etc.

[0026] Next, the component mounting process performed by the control device 50 will be described. The control device 50 is configured to alternately perform a first mounting process and a second mounting process on a plurality of substrates 2 that are moved into the component assembly position P3.

[0027] The first installation process is performed based on the first installation program. The first installation process is the process of installing the components CH housed in each tray TR of the first layer to the nth layer (n is an integer greater than 2) onto the substrate 2. In the first installation process, the components CH housed in each tray TR are installed onto the substrate 2 in ascending order from the first layer tray TR1 to the nth layer tray TRn. The first installation program is one of the aforementioned production programs sent from the production management computer 52, and is a program used to cause the control unit to execute the first installation process. The first installation program is acquired by the transceiver circuit 58, which serves as an input unit, and is stored in the control device 50. The control device 50, which functions as the control unit, reads the first installation program from RAM and executes the first installation process based on the first installation program.

[0028] The second installation process is performed based on the second installation program. The second installation process is the process of installing the components CH housed in each tray TR of the first layer to the nth layer onto the substrate 2. In the second installation process, the components CH housed in each tray TR are installed onto the substrate 2 in descending order from the nth layer tray TRn to the first layer tray TR1. The second installation program is a program used to cause the control unit to execute the second installation process, but it is not included in the production program sent from the production management computer 52. When the first installation program is input to the control device 50 from the transceiver circuit 58, which is an input unit, the control device 50, which also functions as a processing unit, generates the second installation program based on the input first installation program. Similar to the first installation program, the generated second installation program is stored in the RAM of the control device 50.

[0029] The following is based on Figure 3 , Figure 4 A specific example of the component mounting process of the component mounting machine 10 in this embodiment will be described. In this example, no more than two specific components (e.g., a component and a cover covering the component) are mounted at the same location on the substrate 2. Therefore, the first mounting process does not include the specific first mounting process of mounting two or more specific components at the same location on the substrate 2. Therefore, in this example, a normal first installation procedure that does not perform the specific first mounting process is input to the input unit. Based on this input, the arithmetic unit determines that a second mounting process corresponding to the normal first mounting process can be performed. Furthermore, the control device 50, which is the arithmetic unit, automatically generates the second installation procedure and outputs the fact that a second installation procedure has been generated to the touch panel 54. Thus, the touch panel 54 displays the fact that a second installation procedure has been generated. According to this structure, the second installation procedure is automatically generated, therefore, the operator does not need to perform the operation of generating the second installation procedure.

[0030] If the start button of the component mounting machine 10 is pressed, the first mounting process is executed based on the first installation procedure, and component mounting begins for the first substrate 2. At this time, firstly, the substrate transport unit 20 moves the substrate 2 into the component assembly position P3 within the component mounting machine 10. This drives the storage container 34 of the component supply unit 30, and the first layer slot 35 begins to move towards the storage position P1 (see reference). Figure 3 (a) and (b)). If the first layer slot 35 containing the first tray TR1 reaches the storage position P1, the first tray TR1 is pulled out from the storage position P1 and placed on the component removal position P2 on the tray station 38 (see reference). Figure 3 (c)). Next, the component mounting unit 40 adsorbs the component CH (CH1) from the first tray TR1 that has been pulled out to the component removal position P2 and mounts the adsorbed component CH (CH1) onto the substrate 2. If the component CH (CH1) is mounted on the substrate 2, the first tray TR1 that has been pulled out to the component removal position P2 is stored again in the storage position P1 (see reference). Figure 3 (d)

[0031] Next, the storage unit 34 of the component supply unit 30 is activated, and the second-layer slot 35, which houses the second tray TR2, moves to the storage position P1 (see reference). Figure 3 (e)). Subsequently, the second tray TR2 is pulled out from storage position P1 and placed on tray station 38 at component removal position P2 (see reference). Figure 3 (f)). The component mounting unit 40 adsorbs the component CH (CH2) from the second tray TR2 that has been pulled out to the component removal position P2, and mounts the adsorbed component CH (CH2) onto the substrate 2. If the component CH (CH2) is mounted on the substrate 2, the second tray TR2 that has been pulled out to the component removal position P2 is stored again in the storage position P1 (see reference). Figure 3 (g)

[0032] Next, the storage unit 34 of the component supply unit 30 is activated, and the slot 35 of the third layer containing the third tray TR3 moves to the storage position P1 (see reference). Figure 3 (h)). Subsequently, the third tray TR3 is pulled out from storage position P1 and placed on the component removal position P2 on tray station 38 (see reference). Figure 4(a)). The component mounting unit 40 adsorbs the component CH (CH3) from the third tray TR3, which has been pulled out to the component removal position P2, and mounts the adsorbed component CH (CH3) onto the substrate 2. By performing the above steps, all components CH (CH1, CH2, CH3) are mounted in the order of "CH1→CH2→CH3". That is, in this example, the components CH (CH1, CH2, CH3) contained in each tray TR1, TR2, TR3 are mounted onto the substrate 2 in ascending order from the first tray TR1 to the third tray TR3. When the component mounting for the first substrate 2 is completed, the substrate transport unit 20 removes the first substrate 2 with the component mounted from the component assembly position P3 and moves the second substrate 2 into the component assembly position P3. In addition, the series of steps up to this point are common in the embodiments and existing examples.

[0033] Figure 4 (b) to (d) illustrate the component mounting steps for the second substrate 2 of the component mounting machine 10 based on the embodiment. At the end of the production of the first substrate 2, the third tray TR3, as the final tray, is still placed at the component removal position P2 (see reference). Figure 4 (a)). In this embodiment, without replacing the third tray TR3 that has been pulled out to the component removal position P2, the second installation process is performed based on the second installation procedure, and component installation begins based on the second substrate 2. First, the component mounting unit 40 adsorbs the component CH (CH3) from the third tray TR3 that has been pulled out to the component removal position P2 and installs the adsorbed component CH (CH3) onto the substrate 2. If the component CH (CH3) is installed on the substrate 2, the third tray TR3 that has been pulled out to the component removal position P2 is stored again in the storage position P1 (see reference). Figure 4 (b)

[0034] Next, the storage unit 34 of the component supply unit 30 is activated, and the second-layer slot 35, which houses the second tray TR2, moves to the storage position P1 (see reference). Figure 4 (c)). Subsequently, the second tray TR2 is pulled out from storage position P1 and placed on the component removal position P2 on tray station 38 (see reference). Figure 4(d)). The component mounting unit 40 adsorbs the component CH (CH2) from the second tray TR2, which has been pulled out to the component removal position P2, and mounts the adsorbed component CH (CH2) onto the substrate 2. If the component CH (CH2) is mounted on the substrate 2, the second tray TR2, which has been pulled out to the component removal position P2, is stored again in the storage position P1. Thereafter, the same steps are performed for pulling out the first tray TR1, adsorbing the component CH (CH1), and mounting. By performing the above steps, all components CH (CH3, CH2, CH1) are mounted in the order of "CH3→CH2→CH1". That is, in this example, the components CH (CH3, CH2, CH1) contained in each tray TR3, TR2, TR1 are mounted on the substrate 2 in descending order from the third tray TR3 to the first tray TR1. As a result, the component mounting for the second substrate 2 is completed. In addition, similar to the first substrate 2 described above, the odd-numbered substrate 2 is produced by performing a first mounting process based on the first mounting procedure. Similar to the second substrate 2 mentioned above, the even-numbered substrate 2 is produced by performing a second installation process based on the second installation procedure.

[0035] In contrast, Figure 4 (e) to (g) illustrate the component mounting steps for the second substrate 2 of the component mounting machine 10 based on the conventional example. In the conventional example, for the second and subsequent substrates 2, a first mounting process is also performed based on the first installation procedure to mount the component CH. At the moment when the production of the first substrate 2 is completed, the third tray TR3, as the last tray, is still pulled out to the component removal position P2. Therefore, before component mounting is performed on the second substrate 2, the third tray TR3, which is at the component removal position P2, is stored in the storage position P1 (see reference). Figure 4 (e)). Next, the storage unit 34 of the component supply unit 30 is driven, and the first layer slot 35 moves to the storage position P1 (see reference). Figure 4 (f) Thus, the first tray TR1 is pulled out from the storage position P1 and placed in the component removal position P2 (see reference). Figure 4 (g) Next, after the adsorption and installation of element CH (CH1), the first tray TR1 is stored. Thereafter, by performing the same steps, all elements CH (CH1, CH2, CH3) are installed in the order of "CH1→CH2→CH3".

[0036] Next, we will describe a specific first mounting process that includes mounting two or more specific components at the same location on the substrate 2. In the component mounting machine 10 of this embodiment, sometimes a first installation procedure for performing a specific first mounting process is input to the control device 50 via a transceiver circuit 58, which serves as an input unit. At this time, the control device 50 determines that it cannot perform a second mounting process corresponding to the specific first mounting process. Furthermore, the control device 50 does not generate the second installation procedure and outputs a message to the touch panel 54 indicating that the second installation procedure cannot be generated. Thus, the touch panel 54 displays a message indicating that the second installation procedure cannot be generated. Through this display, it is possible to identify that the operator has not performed the second mounting process.

[0037] As detailed above, in the component mounting machine 10 of this embodiment, a first mounting process and a second mounting process are alternately performed on a plurality of substrates 2 that have been moved to the component assembly position P3. Therefore, for example, if the first mounting process is performed on the first substrate 2, the second mounting process is performed on the second substrate 2, and so on, the first mounting process and the second mounting process are performed alternately. Therefore, the production of the next substrate 2 can be started quickly without replacing the tray TR that was pulled out to the component removal position P2 at the end of substrate 2 production. Therefore, the situation where the component mounting unit 40 waits when starting the production of the next substrate 2 after the end of substrate 2 production can be suppressed. Incidentally, in this embodiment, the components... Figure 4 The step of enclosing the component with double-dotted lines can, correspondingly, shorten the production time required for one substrate 2. Furthermore, it can reduce vertical and horizontal movements in the component supply unit 30. Therefore, it can extend the lifespan of the component supply unit 30.

[0038] Furthermore, this embodiment describes a so-called single-channel component mounting machine 10 equipped with only one substrate handling unit 20, but the technology disclosed in this specification can also be applied to a so-called dual-channel component mounting machine 10 equipped with two substrate handling units 20. In the case of the dual-channel component mounting machine 10, while a component 2 is being mounted in one channel, the substrate 2 can be moved in and out in the other channel. In such a case, if the technology disclosed in this specification is also used, the first mounting process and the second mounting process are alternately performed on the multiple substrates 2 that are moved to the component assembly position P3. Therefore, it is possible to effectively suppress the situation where the component mounting unit 40 waits when starting the production of the next substrate 2 after the production of the previous substrate 2 has ended.

[0039] Furthermore, in the above embodiments, an example of mounting three types of components CH (CH1, CH2, CH3) onto the substrate 2 was described, but the types of components mounted onto the substrate 2 are not limited to three. For example, it is also possible to use the method of mounting four types of components CH (CH1, CH2, CH3, CH4) onto the substrate 2. In this case, components are mounted onto the first substrate 2 in the order of CH1→CH2→CH3→CH4, and components are mounted onto the second substrate 2 in the order of CH4→CH3→CH2→CH1. According to this method, since the type CH4 of the first last mounted component is the same as the type CH4 of the second first mounted component, the time from the end of substrate production to the start of production of the next substrate can be shortened. In addition, when mounting components CH onto the first substrate 2, the reservoir 34 rises and the tray TR is pulled out sequentially from the adjacent slot 35; when mounting components CH onto the second substrate 2, the reservoir 34 descends and the tray TR is pulled out sequentially from the adjacent slot 35. Therefore, by reducing the amount of movement of the storage unit 35 between components, the time from the storage tray TR to the pulling out of the next tray TR can be shortened.

[0040] Furthermore, the above embodiment is an example of a component supply unit 30 having one storage container 34, but the technology disclosed in this specification can also be applied to a structure where the component supply unit has multiple storage containers. For example, as Figure 5 As shown, the component supply unit 60 may also include a first storage unit 62 (an example of a first pallet hopper as described in the technical solution) and a second storage unit 64 (an example of a second pallet hopper as described in the technical solution) housed within the housing 66.

[0041] The first storage container 62 has multiple slots, each slot horizontally accommodating a tray 62a-62c. The trays 62a-62c contain components of the same type. For example, the first tray 62a accommodates components of a first type, the second tray 62b accommodates components of a second type, and the third tray 62c accommodates components of a third type.

[0042] Similar to the first storage unit 62, the second storage unit 64 also has multiple layers of slots, each slot horizontally accommodating a tray 64a-64c. The trays 64a-64c, in the same order as the first storage unit 62, sequentially accommodate components of the same type from the first layer to the next. For example, the first tray 64a accommodates components of the first type to be assembled, the second tray 64b accommodates components of the second type to be assembled, and the third tray 64c accommodates components of the third type to be assembled. Furthermore, Figure 5The diagram shows that each storage unit 62 and 64 has only three trays 62a-62c and 64a-64c, but the number of trays 62 and 64 is not limited to three and can be any number.

[0043] A tray station 68 is provided on the side of the housing 66. A component removal position is provided on the upper surface of the tray station 68. Figure 5 Although not shown in the diagram, a storage position is provided within the housing 66, and this storage position is set at approximately the same height as the component removal position (the upper surface of the tray station 68). Each tray 62a-62c and 64a-64c of each of the storage units 62 and 64 can move from the storage position within the housing 66 to the component removal position on the upper surface of the tray station 68. That is, the first storage unit 62 can move vertically within the housing 66, and can be positioned where trays 62a-62c can be removed to the component removal position, and where trays 62a-62c cannot be removed to the component removal position. Figure 5 The first storage unit 62 can move between the position of the upper end of the housing shown. By moving the first storage unit 62 vertically in such a way that each tray 62a-62c is in a storage position, each tray 62a-62c can be moved to the component removal position on the upper surface of the tray station 68. The second storage unit 64 can also move vertically within the housing 66, and can be moved between a position where the trays 64a-64c can be removed to the component removal position and a retracted position where the trays 64a-64c cannot be removed to the component removal position. Figure 5 The second storage unit 64 can be moved between the positions of the lower end of the housing 66 shown. By moving the second storage unit 64 in the vertical direction so that each tray 64a to 64c is in a storage position, each tray 64a to 64c can be moved to the component removal position on the upper surface of the tray station 68.

[0044] Furthermore, the height position of the pallet station 68 is set to be midway between the position of the first storage unit 62 in the retracted position and the position of the second storage unit 64 in the retracted position. Therefore, in the component installation process described later, the amount of movement of each storage unit 62, 64 can be reduced when the third layer pallet 62c of the first storage unit 62 in the retracted position is moved to the storage position, and when the first layer pallet 64a of the second storage unit 64 in the retracted position is moved to the storage position. For example, the time from storing the third layer pallet 62c of the first storage unit 62 to pulling out the first layer pallet 64a of the second storage unit 64 can be shortened.

[0045] based on Figure 6 A specific example of the component mounting process using the aforementioned component supply unit 60 will be described. For example... Figure 6 As shown in (a), both the first reservoir 62 and the second reservoir 64 are in the retracted position at the start of the component mounting process. First, as... Figure 6As shown in (b), the first storage unit 62 descends, positioning the first layer tray 62a of the first storage unit 62 in a storage position. Next, components are assembled onto the substrate in ascending order from those housed in the first layer tray 62a of the first storage unit 62 to those housed in the third layer tray 62c. Figure 6 (b)→ Figure 6 (c)). Thus, the mounting of the components onto the first substrate is complete.

[0046] If the component mounting to the first substrate is complete, then the first storage unit 62 moves to the retracted position, while the first tray 64a of the second storage unit 64 moves to the storage position. Figure 6 (d)). Next, components are assembled onto the substrate in ascending order from the components housed in the first tray 64a of the second storage container 64 to the components in the third tray 64c. Figure 6 (d)→ Figure 6 (e)). Thus, the mounting of the component to the second substrate is complete.

[0047] If the component mounting to the second substrate is completed, then the components housed in the third tray 64c of the second storage unit 64 are then assembled onto the substrate in descending order until the components in the first tray 64a are assembled. Figure 6 (e) → Figure 6 (f)). Thus, the mounting of the component to the third substrate is complete.

[0048] Once the component mounting to the third substrate is complete, the second storage unit 64 moves to the retracted position, simultaneously causing the third tray 62c of the first storage unit 62 to move to the storage position. Figure 6 (g)). Next, the components housed in the third tray 62c of the first storage container 62 are assembled onto the substrate in descending order until the components in the first tray 62a are assembled. Figure 6 (g)→ Figure 6 (h)). Thus, the mounting of the component to the fourth substrate is complete. The following process is repeated from... Figure 6 (b) to Figure 6 The mounting process continues up to (h). Through this example, since the last component mounted on the substrate is the same type of component as the component initially mounted on the next substrate, tray replacement can be eliminated during substrate changeovers. This allows for efficient production of multiple substrates.

[0049] Furthermore, in the above example, in each tray 62a-62c of the first storage unit 62 and each tray 64a-64c of the second storage unit 64, components are stored in the same order from the first layer to the third layer, but this is not a limited example. For example, it is also possible that in the first storage unit 62, the first tray 62a contains components of a first type of assembly, the second tray 62b contains components of a second type of assembly, and the third tray 62c contains components of a third type of assembly; on the other hand, in the second storage unit 64, the first tray 62a contains components of a third type of assembly, the second tray 64b contains components of a second type of assembly, and the third tray 64c contains components of a first type of assembly. In this case, for example, in Figure 6 In the case of producing a second substrate ( Figure 6 (d)→ Figure 6 (e) Components are assembled in ascending order from the first tray 64a to the third tray 64c, so that components assembled from the third to the first are sequentially assembled on the substrate. In this manner, the same effect as in the example above can be achieved.

[0050] The above description provides detailed examples of the technology disclosed in this specification, but these are merely illustrative and not intended to limit the scope of the claims. The technology described in the claims includes various modifications and alterations to the specific examples described above. Furthermore, the technical elements described in this specification or drawings, individually or in various combinations, contribute to the practicality of the technology and are not limited to the combinations described in the claims at the time of application. Moreover, the technology illustrated in this specification or drawings may simultaneously achieve multiple objectives, and achieving even one of these objectives is itself a practical application of the technology.

[0051] Explanation of reference numerals in the attached figures

[0052] 2...Substrate

[0053] 4, 4A, 4B, 4C... components

[0054] 10... Component Mounting Machine

[0055] 20...Substrate handling unit

[0056] 30... Component Supply Unit

[0057] 40... Component mounting unit

[0058] 50...A control device that functions as both a control unit and a processing unit.

[0059] 52... Transceiver circuit as input unit

[0060] P1... Storage location

[0061] P2... Component removal location

[0062] P3... Component assembly location

[0063] TR, TR1, TR2, TR3... Tray

Claims

1. A component mounting machine for mounting components onto a substrate, wherein, The component mounting machine includes: A substrate transport unit moves a substrate into a component assembly position and moves the substrate out of the component assembly position. The component supply unit includes a pallet hopper with multiple pallets for receiving components, each of the multiple pallets being configured to move between a storage position and a component retrieval position; The component mounting unit, in the state that the tray has moved from the storage position to the component removal position, adsorbs the component from the tray that has moved to the component removal position, and mounts the adsorbed component onto the substrate that has been moved into the component assembly position; and The control unit controls the substrate handling unit, the component supply unit, and the component mounting unit, and is configured to alternately perform the following processes on multiple substrates moved to the component assembly position: (1) A first mounting process, wherein components housed in trays from the first to the nth layer of the tray hopper are mounted onto the substrate, wherein the components housed in each tray are mounted onto the substrate in ascending order from the first layer tray to the nth layer tray, where n is an integer greater than or equal to 2; and (2) A second mounting process in which the components housed in the first to nth layers of the pallet hopper in the first mounting process are mounted to the substrate, wherein the components housed in each pallet are mounted to the substrate in descending order from the nth layer pallet to the first layer pallet.

2. The component mounting machine according to claim 1, wherein, The component mounting machine also features: An input unit is provided for inputting a first installation program that causes the control unit to execute the first installation process. and When the first installation program is input from the input unit, the processing unit generates a second installation program based on the input first installation program to enable the control unit to perform the second installation process.

3. The component mounting machine according to claim 2, wherein, The first mounting process includes mounting two or more components at the same location on the substrate. The mounting sequence of the two or more components onto the substrate is preset. When the input unit is given a first installation procedure for causing the control unit to perform the first installation process of mounting two or more components at the same location on the substrate, the arithmetic unit outputs a situation where it is impossible to generate a second installation procedure for causing the control unit to perform the second installation process corresponding to the first installation process of mounting two or more components at the same location on the substrate.

4. The component mounting machine according to claim 1, wherein, The component supply unit comprises: a first pallet hopper having multiple pallets for storing components; and a second pallet hopper having multiple pallets for storing components. The storage location and the component retrieval location are positioned between the first pallet hopper in the retracted position and the second pallet hopper in the retracted position. The multiple pallets in the first pallet hopper and the second pallet hopper are respectively configured to be movable between the storage location and the component retrieval location. In the first pallet hopper, which is in the retracted position, the nth pallet is located closer to the component removal position than the first pallet. In the second pallet hopper, which is in the retracted position, the first pallet layer is located closer to the component removal position than the nth pallet layer. The control unit is configured to repeatedly execute the following installation processes in the order of first installation process, second installation process, third installation process, fourth installation process, and second installation process: (1) The first mounting process is a mounting process of mounting the components housed in the first to nth layers of the first pallet bin onto the substrate. In the first mounting process, the components housed in each pallet are mounted onto the substrate in ascending order from the first layer pallet to the nth layer pallet, where n is an integer greater than or equal to 2. (2) The second mounting process is a mounting process of mounting the components of each of the first to nth layers of the first pallet hopper to the substrate. In the second mounting process, the components of each pallet are mounted to the substrate in descending order from the nth layer pallet to the first layer pallet. (3) The third mounting process is a mounting process of mounting the components housed in the first to nth layers of the second pallet bin onto the substrate. In the third mounting process, the components housed in each pallet are mounted onto the substrate in ascending order from the first layer pallet to the nth layer pallet, where n is an integer greater than or equal to 2. (4) The fourth installation process is an installation process of installing the components of each of the first to nth layers of the second pallet hopper into the substrate. In the fourth installation process, the components of each pallet are installed into the substrate in descending order from the nth layer pallet to the first layer pallet.

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