Dual polarized magneto-electric antenna array

Abstract

A package structure is provided that includes a planar core structure including a first side and a second side opposite the first side. The package structure also includes an antenna structure disposed on the first side of the planar core structure. The antenna structure includes a plurality of first stacks, each first stack including a first patterned conductive layer formed on a first insulating layer, an antenna formed on one or more first patterned conductive layers of the first stack, the antenna including at least one L-shaped structure. The package structure also includes an interface structure disposed on the second side of the planar core structure, and an antenna feed structure formed in the interface structure and the planar core structure and routed through the interface structure and the planar core structure, wherein the antenna feed structure is not connected to the planar antenna.

Description

Background Technology

[0001] This disclosure generally relates to wireless communication packaging structures, and more specifically to techniques for packaging antenna structures and semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio / wireless communication systems for millimeter-wave (mm-wave) applications. Specifically, this disclosure relates to a dual-polarized magnetoelectric antenna array structure for RFIC packaging applications.

[0002] When constructing wireless communication packages with integrated antennas, it may be desirable to achieve a package design that provides appropriate antenna characteristics (e.g., high efficiency, wide bandwidth, good radiation characteristics, etc.) while offering a low-cost and reliable packaging solution. Integration processes require high-precision manufacturing techniques to achieve fine features within the package structure. Traditional solutions typically employ complex and expensive packaging techniques that are lossy and / or utilize high-dielectric-constant materials. For consumer applications, high-performance package designs with integrated antennas are generally not required. However, for industrial applications (e.g., 5G cell tower applications), high-performance antenna packages are needed, often requiring large phased array antennas. The ability to design high-performance packages with phased array antennas is not insignificant for millimeter-wave operating frequencies and higher.

[0003] One type of antenna design is called a magnetoelectric dipole (MED) antenna. Generally, a MED antenna consists of both a magnetic dipole and an electric dipole. By simultaneously exciting complementary dipoles with appropriate amplitude and phase, the antenna can produce good radiation characteristics over a wide frequency band. MED antennas are suitable for certain mobile cellular networks.

[0004] Some antenna designs do not take into account the RFIC package environment, such as those with many metal layers and any metal-fill requirements. Furthermore, some phased array applications may require λ / 2 wavelength spacing. In some examples, antenna performance may degrade in an antenna-in-package (AiP) environment. Summary of the Invention

[0005] Embodiments of this disclosure relate to a packaging structure including a planar core structure comprising a first side and a second side opposite to the first side. The packaging structure also includes an antenna structure disposed on the first side of the planar core structure. The antenna structure includes a plurality of first stacks, each first stack including a first patterned conductive layer formed on a first insulating layer, and an antenna formed on one or more of the first patterned conductive layers of the first stacks, the antenna including at least one L-shaped structure. The packaging structure also includes an interface structure disposed on the second side of the planar core structure, and an antenna feed structure formed in and routed through the interface structure and the planar core structure, wherein the antenna feed structure is not connected to the planar antenna. This allows for the design of high-performance phased array antennas with wide bandwidth, high horizontal and vertical port isolation, and stable gain.

[0006] In some embodiments, the antenna comprises four L-shaped structures. This allows for tuning of high-performance phased array antenna designs by varying certain dimensions of the L-shaped structures.

[0007] In some embodiments, the L-shaped structures are arranged symmetrically, with the corners of the L-shaped structures facing inwards. This also allows for tuning high-performance phased array antenna designs by changing certain dimensions of the L-shaped structures.

[0008] In some embodiments, the packaging structure further includes a cage wall structure within the antenna structure, the cage wall surrounding the antenna. In some embodiments, the cage wall structure is electrically connected to the L-shaped structure via a first ground plane layer of the core structure. In some embodiments, the cage wall structure includes multiple conductive ground loops extending vertically through the antenna structure. The cage wall structure (or grounded cage wall) can enable enhanced antenna performance in many high-precision packaging processes.

[0009] In some embodiments, an apparatus is provided that includes a package structure comprising a planar core structure including a first side and a second side opposite to the first side. The package structure also includes an antenna structure disposed on the first side of the planar core structure. The antenna structure includes a plurality of first stacks, each first stack including a first patterned conductive layer formed on a first insulating layer; and an antenna formed on one or more of the first patterned conductive layers of the first stacks, the antenna including at least one L-shaped structure. The package structure also includes an interface structure disposed on the second side of the planar core structure, and an antenna feed structure formed in and routed through the interface structure and the planar core structure, wherein the antenna feed structure is not connected to the planar antenna. This allows for the design of high-performance phased array antennas with wide bandwidth, high horizontal and vertical port isolation, and stable gain. The apparatus also includes an RFIC (Radio Frequency Integrated Circuit) chip including a semiconductor substrate having an active surface and a passive surface, and a BEOL (Back-End Process) structure formed on the active surface of the semiconductor substrate, wherein the RFIC chip is mounted to the package structure by connecting the BEOL structure of the RFIC chip to contact pads of the interface structure. This allows for the design of high-performance phased array antennas with wide bandwidth, high horizontal and vertical port isolation, and stable gain.

[0010] In some embodiments, the antenna of the device includes four L-shaped structures. This allows for tuning of high-performance phased array antenna designs by varying certain dimensions of the L-shaped structures.

[0011] In some embodiments of this device, the L-shaped structures are arranged symmetrically, with the corners of the L-shaped structures facing inwards. This also allows for tuning of high-performance phased array antenna designs by changing certain dimensions of the L-shaped structures.

[0012] In some embodiments of the device, the packaging structure further includes a cage wall structure within the antenna structure, the cage wall surrounding the antenna. In some embodiments, the cage wall structure is electrically connected to the L-shaped structure via a first ground plane layer of the core structure. In some embodiments, the cage wall structure includes multiple conductive ground loops extending vertically through the antenna structure. The cage wall structure (or grounded cage wall) can enable enhanced antenna performance in many high-precision packaging processes.

[0013] Embodiments of this disclosure relate to a method of manufacturing a package structure, the method comprising forming a planar core structure including a first side and a second side opposite to the first side. The method further comprises forming an antenna structure on the first side of the planar core structure, the antenna structure including a plurality of first stacks, each first stack including a first patterned conductive layer formed on a first insulating layer; and an antenna formed on one or more of the first patterned conductive layers of the first stacks, the antenna including at least one L-shaped structure. The method further comprises forming an interface structure on the second side of the planar core structure. The method further comprises forming an antenna feed structure in the interface structure and the planar core structure, and the antenna feed structure being routed through the interface structure and the planar core structure, wherein the antenna feed structure is not connected to the planar antenna. This allows for the design of high-performance phased array antennas with wide bandwidth, high horizontal and vertical port isolation, and stable gain.

[0014] In some embodiments of the method for manufacturing the package structure, the antenna of the device includes four L-shaped structures. This allows for tuning of high-performance phased array antenna designs by varying certain dimensions of the L-shaped structures.

[0015] In some embodiments of the method for manufacturing the packaging structure, the L-shaped structures are arranged symmetrically, with the corners of the L-shaped structures facing inwards. This also allows for tuning high-performance phased array antenna designs by changing certain dimensions of the L-shaped structures.

[0016] In some embodiments of the method of manufacturing the package structure, the package structure further includes a cage wall structure in the antenna structure, the cage wall surrounding the antenna. In some embodiments, the cage wall structure is electrically connected to the L-shaped structure through a first ground plane layer of the core structure. In some embodiments, the cage wall structure includes multiple conductive ground rings extending vertically through the antenna structure. The cage wall structure (or grounded cage wall) can enable enhanced antenna performance in many high-precision packaging processes.

[0017] It should be noted that exemplary embodiments have been described with reference to different subjects. In particular, some embodiments are described with reference to method-type claims, while others are described with reference to apparatus-type claims. However, those skilled in the art will understand from the above and below description that, unless otherwise indicated, any combination of features related to different subjects, in particular any combination of features between features of method-type claims and features of apparatus-type claims, is also considered to be described herein, except for any combination of features belonging to one type of subject matter.

[0018] These and other features and advantages will become apparent from the following detailed description of illustrative embodiments of the invention, which is read in conjunction with the accompanying drawings.

[0019] The above description is not intended to depict every illustrated embodiment or every implementation of this disclosure. Attached Figure Description

[0020] The accompanying drawings included in this application are incorporated in and form a part of this specification. They illustrate embodiments of the present disclosure and, together with the specification, explain the principles of the disclosure. The drawings are merely illustrative of certain embodiments and are not intended to limit the scope of the disclosure.

[0021] Figure 1 This is a schematic cross-sectional side view of an example of a wireless communication package according to certain embodiments.

[0022] Figure 2 According to certain embodiments Figure 1 A schematic plan view of a wireless communication package.

[0023] Figure 3 According to certain embodiments Figure 1 A perspective view of a wireless communication package.

[0024] Figure 4 According to certain embodiments Figure 1 A schematic plan view of a wireless communication package, which illustrates some of the operating principles of the device.

[0025] Figure 5 According to certain embodiments Figure 1 A schematic plan view of an array of wireless communication packages.

[0026] Figure 6 It is a graph depicting antenna impedance matching and port coupling for wireless communication packaging according to certain embodiments.

[0027] Figure 7 It is a graph depicting the antenna frequencies of several different wireless communication packages according to certain embodiments, each wireless communication package having a different geometry.

[0028] Figure 8 This is a schematic diagram illustrating a feeder design for impedance matching and routing in a wireless communication package according to certain embodiments. Detailed Implementation

[0029] Embodiments will now be discussed in further detail regarding wireless communication packaging structures, and more specifically, regarding techniques for packaging antenna structures and semiconductor RFIC chips to form compact integrated radio / wireless communication systems with high-performance integrated antenna systems (e.g., phased array antenna systems).

[0030] This embodiment provides an antenna array for a packaged implementation of a magneto-electric dipole (MED) antenna. Embodiments of the invention may also include one or more of the following features: an L-shaped patch structure for antenna performance and tunability; an antenna cavity to reduce antenna coupling and manufacturability; and antenna feed technology for antenna impedance matching and feed routines, which can facilitate array applications.

[0031] The phased array antenna design in this embodiment can be based on the magnetoelectric dipole (MED) antenna concept. These embodiments can improve antenna performance, such as providing wide bandwidth, high port isolation, and stable gain. This embodiment is particularly suitable for antenna-in-package (AiP) applications that fully utilize the package environment. This embodiment can be used for high-performance and low-cost phased arrays in a packaged environment.

[0032] It should be understood that the various layers and / or components shown in the accompanying drawings are not drawn to scale, and one or more layers and / or components of the type typically used in constructing wireless communication packages with integrated antennas and RFIC chips may not be explicitly shown in a given drawing. This does not mean that layers and / or components not explicitly shown have been omitted from the actual package structure. Furthermore, the same or similar reference numerals used in all drawings are used to denote the same or similar features, elements, or structures; therefore, detailed explanations of the same or similar features, elements, or structures will not be repeated for each drawing.

[0033] Figure 1 This is a schematic cross-sectional side view of a wireless communication package 100 according to certain embodiments. The wireless communication package 100 includes an RFIC chip 102 and an antenna package 110 coupled to the RFIC chip 102. The antenna package 110 includes a multilayer package substrate, which includes a central core layer 120, an interface layer 130, and an antenna layer 140.

[0034] RFIC chip 102 includes a metallization pattern (not specifically shown) formed on the active surface (front side) of RFIC chip 102. This metallization pattern includes multiple bonding / contact pads, such as ground pads, DC power pads, input / output pads, control signal pads, associated wiring, etc., which are formed as part of the BEOL (back-end process) wiring structure of RFIC chip 102. RFIC chip 102 is electrically and mechanically connected to antenna package 110 by flip-chip mounting the active (front side) surface of RFIC chip 102 to a second side (e.g., bottom side) of antenna package 110 using, for example, a solder ball controlled collapse chip interconnect (C4) array (not shown) or other known techniques. Depending on the application, RFIC chip 102 includes RFIC circuitry and electronic components formed on the active side, including, for example, receiver, transmitter, or transceiver circuitry, and other active or passive circuitry typically used to implement wireless RFIC chips. In some embodiments, the RFIC chip 102 includes a semiconductor substrate having an active surface and a passive surface, and a BEOL (back-end process) structure formed on the active surface of the semiconductor substrate, wherein the RFIC chip is mounted to the package structure by connecting the BEOL structure of the RFIC chip to the contact pads (not shown) of the interface structure.

[0035] In some embodiments, such as Figure 1 As shown, the antenna package 110 includes a multilayer structure that can be constructed using known manufacturing techniques, such as SLC (Surface Mount Technology), HDI (High Density Interconnect), or other techniques capable of forming organic-based multilayer circuit boards with high integration density. Using these circuit board manufacturing techniques, the antenna package 110 can be formed by stacking alternating layers of metallization and dielectric / insulating materials, wherein the metallization layers are separated from the upper and / or lower metallization layers by corresponding dielectric / insulating material layers. The metallization layers may be formed of copper, while the dielectric / insulating layers may be formed of an industry-standard FR4 insulating material composed of glass fiber epoxy resin. Other types of materials can be used for the metallization and insulating layers. Furthermore, these techniques enable the formation of small conductive vias (e.g., portions between adjacent metallization layers or buried vias) using techniques such as laser ablation, photoimaging, etching, or electroplating, allowing for the formation of high-density wiring and interconnect structures within the antenna package 110.

[0036] exist Figure 1In some embodiments, a central core layer 120 provides a robust layer on which an interface layer 130 and an antenna layer 140 are constructed on opposite sides. In some instances, the core layer 120 may have a thickness of approximately 500 micrometers to 1000 micrometers. In one embodiment, the core layer 120 includes a substrate layer 122 having a first ground plane (i.e., a metallization layer BC1, where BC may refer to a back conductor or bottom conductor) formed on the bottom side of the substrate layer 122 and a second ground plane FC1 (where FC may refer to a front conductor) formed on the top side of the substrate layer 122. The substrate layer 122 may be formed of standard FR4 material or other standard materials typically used to construct standard printed circuit boards. The substrate layer 122 may be formed of other materials having mechanical and electrical properties similar to FR4, thereby providing a relatively rigid substrate structure that provides structural support for the antenna package 110.

[0037] Interface layer 130 includes multiple stacks L1, L2, L3, L4, L5, L6, wherein each stack L1, L2, L3, L4, L5, L6 includes corresponding patterned metallization layers BC2, BC3, BC4, BC5, BC6, and BC7 formed on corresponding dielectric / insulating layers D1, D2, D3, D4, D5, D6. In some embodiments, metallization layer BC1 is an antenna ground plane, metallization layer BC3 is a ground plane, metallization layer BC4 is a power layer, metallization layer BC5 is a low-frequency (or low-F) layer, and metallization layer BC6 is a ground plane. The various metallization layers can be made of, for example, Cu. Similarly, antenna layer 140 includes multiple stacks L1, L2, L3, L4, L5, L6, wherein each stack L1, L2, L3, L4, L5, L6 includes corresponding patterned metallization layers FC2, FC3, FC4, FC5, FC6, and FC7 (where FC may refer to the front conductor) formed on corresponding dielectric / insulating layers D1, D2, D3, D4, D5, D6 of various components forming antenna layer 140. Likewise... Figure 1 As shown, metallization layer FC7 corresponds to V-polarized feed, and layer FC5 corresponds to H-polarized feed. Metallization layer FC6 includes the antenna structure (i.e., the L-shaped structure 115, which is described in further detail below). In some embodiments, metal plating can be used in surface thin-layer circuit (SLC) processes for the assembly layers in interface layer 130 and antenna layer 140.

[0038] As described above, in one embodiment, the stacks L1, L2, L3, L4, L5, and L6 of the interface layer 130 and antenna layer 140 can be formed using existing manufacturing techniques such as SLC or similar technologies, which can meet the necessary tolerances and design rules required for high-frequency applications such as millimeter-wave applications. Using the SLC process, each stack is individually formed with a patterned metallization layer, wherein the first layer L1 of the interface layer 130 and antenna layer 140 is bonded to the core layer 120, and wherein the remaining stacks L2, L3, L4, L5, and L6 (of the respective interface layer 130 and antenna layer 140) are sequentially bonded together using any suitable bonding technique (e.g., using adhesives or epoxy materials). In some embodiments, conventional PCB processes can be used where bonding materials are employed. However, for SLC, HDI, and LTCC, no bonding materials are used. In these cases, the laminate / dielectric is directly bonded together under heat / pressure.

[0039] like Figure 1 As further shown, conductive vias are formed through the core layer 120 and through the dielectric / insulating layers D1, D2, D3, D4, D5, and D6 of the interface layer 130 and the antenna layer 140. The conductive vias formed through the given dielectric / insulating layers are connected to via pads patterned from metallization layers disposed on each side of the given dielectric / insulating layer. In some examples, the thickness of metallization layers FC1 and BC1 may be approximately 36 micrometers or any other suitable thickness. In some examples, the thickness of metallization layers FC2, FC3, and FC4 may be, for example, approximately 15 μm or any other suitable thickness.

[0040] Various metallization layers BC1, BC2, BC3, BC4, BC5, BC6, BC7, FC1, FC2, FC3, FC4, FC5, FC6, and FC7, as well as vertical conductive vias, are patterned and interconnected within and through the various layers of antenna package 110 (core layer 120, interface layer 130, and antenna layer 140) to achieve various features required for the target wireless communication application. These features include, for example, antenna feed lines, ground planes, RF shielding and isolation structures, power planes for routing power to RFIC chip 102 (and other RFICs or chips that may be included in wireless communication package 100), signal lines for routing IF (intermediate frequency) signals, LO (local oscillator) signals, and other low-frequency I / O (input / output) baseband signals, etc.

[0041] In particular, such as Figure 1As shown in the exemplary embodiment, the antenna package 110 includes a first antenna feed 112 (represented by a dashed line) and a second antenna feed 114 (represented by a dashed line), which are routed through an interface layer 130, a core layer 120, and an antenna layer 140. The first and second antenna feeds 112 and 114 include a series of interconnected metal traces and conductive vias, which are part of the metallization and dielectric layers of the interface layer 130, core layer 120, and antenna layer 140 of the antenna package 110. Figure 1 As shown, the first and second antenna feed lines 112 and 114 are placed between the L-shaped structure 115 (discussed in further detail below). Furthermore, the first antenna feed line 112 and the second antenna feed line 114 are not connected to the L-shaped structure 115 or the grounding cage wall 116 (discussed in further detail below).

[0042] In one embodiment, the first antenna feed 112 and the second antenna feed 114 (as well as all other antenna feeds formed within the antenna package 110) are designed to have equal lengths to optimize antenna operation. For example, in a phased array implementation, forming all antenna feeds with the same or substantially the same length within the antenna package 110 facilitates phase adjustment of the RF signals fed to the patch antenna elements of the antenna array, prevents phased array beam skew, reduces angular scanning errors, and effectively increases the operating bandwidth of the antenna elements.

[0043] exist Figure 1 In an example embodiment, the lengths of the vertical portions of the antenna feed lines 112 and 114 extending through the interface layer 130, core layer 120, and antenna layer 140 are fixed in length based on the thickness of each layer of the antenna package 110. However, the lateral distance between the patch antenna elements and the RFIC chip 102 will vary depending on the horizontal / lateral position of the L-shaped structure 115 of the antenna array relative to the corresponding antenna feed ports (i.e., V-port 105 and H-port 107) of the RFIC chip 102. In this regard, to ensure that each antenna feed line has the same length (or substantially the same length) overall, in one embodiment, the lateral wiring of the antenna feed lines 112 and 114 within the antenna package 110 is implemented using transmission lines formed in the same metallization layer of the multilayer package substrate. For example, in Figure 1 In the illustrated embodiment, the lengths of the antenna feed lines 112 and 114 are adjusted in the first layer L1 of the interface layer 130 by extending or shortening the wiring of the lateral portions of the antenna feed lines 112 and 114 patterned from the metallization layer BC2 of the interface layer 130.

[0044] More specifically, in Figure 1In this embodiment, the horizontal portions 112-2 and 114-2 of the first and second antenna feeds 112 and 114 are patterned from the first metallization layer BC2 of the interface layer 130. The lengths of the horizontal portions 112-2 and 114-2 of the first and second antenna feeds 112 and 114 are extended or shortened to compensate for differences in the lateral and / or vertical positions of other portions of the antenna feeds 112 and 114 that route through the interface layer 130, core layer 120, and antenna layer 140.

[0045] Interface layer 130 includes wiring to distribute power to RFIC chip 102 and route signals between two or more RFIC chips flip-chip mounted to antenna package 110. For example, in one embodiment, metallization layers BC4 and BC5 of interface layer 130 serve as power planes to connect power plane metal to contact pads on RFIC chip 102 using horizontal traces patterned on metallization layers BC4 and BC5 and vertical via structures formed through layers L4, L5, and L6, distributing power voltage from an application board (not shown) to RFIC chip 102.

[0046] In some embodiments, the metallization layer BC6 of interface layer 130 is patterned to form signal lines (e.g., microstrip transmission lines) for transmitting control signals, baseband signals, and other low-frequency signals between the application board and RFIC chip 102 (or between multiple RFIC chips attached to antenna package 110). In this embodiment, the metallization layer BC7 of interface layer 130 can be used as a ground plane for the microstrip transmission lines of metallization layer BC6.

[0047] It should also be noted that, Figure 1 In an example embodiment, interface layer 130 includes a ground plane for providing shielding purposes and provides grounding elements for microstrip or stripline transmission lines, such as transmission lines formed by horizontal traces. For example, the metallization layer BC1 of interface layer 120 includes a ground plane that serves as RF shielding to protect the RFIC chip 102 from exposure to incident electromagnetic radiation (EM) captured by the patch antenna.

[0048] Furthermore, the ground plane of the metallization layer BC1 of interface layer 130 is configured, for example (i) to provide shielding between horizontal signal traces formed in adjacent metallization layers, (ii) to serve as a ground plane for, for example, microstrip or stripline transmission lines formed by the horizontal signal traces, and (iii) to provide grounding for a vertical shielding structure 133 formed by a series of vertically connected ground vias formed between metallization layers BC3 and BC7 through layers L3 to L6, and for example around portions of antenna feed lines 112 and 114 extending through interface layer 130 (e.g., the vertical portions of antenna feed lines 112 and 114 adjacent to the vertical shielding structure 133). For very high frequency applications, the implementation of stripline transmission lines and ground shielding can help reduce interference from other packaged components such as power planes, low-frequency control signal lines, and other transmission lines.

[0049] exist Figure 1 In an example embodiment, the combination of the vertical shielding structure 133 and the vertical portions of the antenna feeds 112 and 114 adjacent to the vertical shielding structure 133 (i.e., in the interface layer 130) essentially forms a transmission line structure similar to a coaxial transmission line, wherein the surrounding vertical shielding structure 133 serves as the outer (shielding) conductor, while the vertical portion (i.e., the antenna feed 112 or 114) serves as the center (signal) conductor. Figure 1 As schematically shown, a coaxial transmission line configuration can be implemented for the extension of antenna feeds 112 and 114 through the core layer 120 and other vertical portions of antenna layer 140.

[0050] Furthermore, the metallization layer BC7 of the interface layer 130 serves as a ground plane to isolate the antenna package 110 from the RFIC chip 102 to enhance EM shielding. The metallization layer BC7 of the interface layer 130 includes via openings to provide contact ports for connections between the package feed lines, signal lines, and power lines of the RFIC chip 102 and the antenna package 110.

[0051] Similarly, Figure 1 As shown, antenna layer 140 includes a grounding cage wall 116 that extends vertically through layers L1 to L6 of antenna layer 140. The grounding cage wall 116 surrounds L-shaped structure 115 and is connected to L-shaped structure 115 via metallization layer BC1 of core layer 120. Therefore, L-shaped structure 115 is a ground plane structure that is not electrically connected to antenna feed lines 112 and 114. Post 113 also grounds L-shaped structure 115. Post 113 extends downward from the bottom surface of L-shaped structure 115, downward through layers L5-L1 and through substrate layer 122 to reach metallization layer BC1 of core layer 120. In one example, post 113 has a vertical length of approximately λ / 4.

[0052] Now for reference Figure 2 The figure illustrates certain embodiments. Figure 1 A schematic plan view of a wireless communication package. (See attached diagram.) Figure 2 As shown, the grounding cage wall 116 surrounds the entire perimeter of the wireless communication package 100. In some embodiments, the structural elements of the grounding cage wall 116 have a semi-circular shape (i.e., semi-circular when viewed in a plan view). Thus, as will be described in detail below, this allows multiple wireless communication packages 100 to be combined into an array, and then the semi-circular structural elements of the grounding cage wall 116 of adjacent packages meet at the edge of the wireless communication package 100 to form a complete circular structure.

[0053] like Figure 2 As shown, the wireless communication package 100 includes an antenna structure comprising a plurality of L-shaped structures 115. In this example, there are four L-shaped structures 115, wherein the corners of each L-shaped structure 115 point towards the center of the wireless communication package 100. (As mentioned above regarding...) Figure 1 The posts 113 discussed (in this example, five posts 113 are associated with each L-shaped structure 115, although any suitable number may be possible) extend downward from the bottom surface of the L-shaped structure 115 to the first ground plane (i.e., the metallization layer BC1). In this way, the posts 113 and the metallization layer BC1 connect the L-shaped structure 115 to the grounding cage wall 116.

[0054] like Figure 2 As shown, the wireless communication package 100 includes a connection to the H feed line at the metallization layer BC7 (i.e., as shown). Figure 1 The second antenna feed 114 is shown with its H-port 107. The horizontal portion 114-2 of the second antenna feed 114 is shown traversing from the H-port 107 to the center of the wireless communication package 100 (i.e., the central portion between the four L-shaped structures 115) on the level of the metallization layer BC2. At the end of the horizontal portion 114-2 of the second antenna feed 114 closest to the center of the wireless communication package 100 is an H-structure 136, which extends vertically from the metallization layer BC2 (as shown). Figure 1 (As shown in the cross-section) to metallization layer FC6. This is the region where signals are applied to the antenna. For the second antenna feed 114, there are third and fourth portions of metallization layers FC6-3 and FC6-4 connected by H-bridge 137. H-bridge 137 is formed at metallization layer FC5.

[0055] Similarly, Figure 2 As shown, the wireless communication package 100 includes a connection to the V feed line at the metallization layer BC7 (i.e., as shown in the diagram). Figure 1The first antenna feed 112 is shown at its V-port 105. The horizontal portion 112-2 of the first antenna feed 112 is shown extending from the V-port 105 to the center of the wireless communication package 100 at the layer of the metallization layer BC2. At the end of the horizontal portion 112-2 of the first antenna feed 112 closest to the center of the wireless communication package 100, it extends vertically from the metallization layer BC2 (e.g., ...). Figure 1 (As shown in the cross-section) to the V-structure 134 of the metallization layer FC6. This is also the area where the antenna signal is applied. For the first antenna feed 112, there are first and second portions of the metallization layers FC6-1 and FC6-2 connected by a V-bridge 135. The V-bridge 135 (or the second bridge) is formed at the metallization layer FC7. It should be understood that because the V-bridge 135 is formed at the metallization layer FC7, while the H-bridge 137 (or the first bridge) is formed at the metallization layer FC5, they have different heights. Therefore, when they are in the middle of the wireless communication package (i.e., in the...) Figure 2 When they intersect (in the plan view), they do not touch each other. In other words, V-bridge 135 spans H-bridge 137. Specifically, for V-bridge 135 to avoid bridging (i.e., to avoid H and V feeds intersecting each other on layer FC6), H-bridge 137 has a portion on metallization layer FC6, one portion descending to metallization layer FC5 and the other portion rising to metallization layer FC6. V-bridge 135 has a portion on metallization layer FC6, one portion rising to metallization layer FC7 and the other portion descending to metallization layer FC6. Furthermore, it should be understood that L-shaped structure 115 and the first, second, third, and fourth portions of metallization layers FC6-1, FC6-2, FC6-3, and FC6-4 are at the same metallization layer level (i.e., metallization layer FC6).

[0056] Now for reference Figure 3 The figure illustrates certain embodiments. Figure 1 A schematic plan view of a wireless communication package. Figure 3 The elements in correspond to Figure 2 The same elements are present in [the text], therefore their description will not be repeated here. However, as [the text continues with further details about other elements]. Figure 3 As shown, in some examples, the conductive portion of the grounding cage wall 116 in the central core layer 120 can have a larger diameter than the portion in the antenna layer 140. Similarly, as... Figure 3 As shown, the number of conductive portions in the grounding cage wall 116 of the antenna layer 140 can be greater than the number of conductive portions in the core layer 120. This feature can also be... Figure 2 As seen in the plan view. However, it should be understood that any other suitable diameter or number of conductive portions can be used for the grounding cage wall 116.

[0057] Now for reference Figure 4 The diagram shows Figure 1A schematic plan view of a wireless communication package 100 illustrates certain operating principles of a device according to some embodiments. Figure 4 As shown, depending on the dimensions, the antenna structure can have one or two resonant frequencies. In the case of two resonant frequencies, the high resonant frequency is primarily determined by the height or vertical distance between the metallization layers FC6 and BC1 and the substrate layer 122, and the dielectric constant of the building layers. The low resonant frequency is determined by the parameters PWxc (i.e., the distance between the third side 115-3 and the fourth side 115-4 of the L-shaped structure 115) and PWyc (i.e., the distance between the first side 115-1 and the second side 115-2 of the L-shaped structure 115) (assuming PWx and Pwy are fixed). Decreasing the values ​​of these parameters will decrease the low resonant frequency. It will also slightly increase the high resonant frequency. As a result, the antenna bandwidth widens.

[0058] The low resonant frequency is also determined by parameters PWx (i.e., the distance between the sixth side 115-6 and the fourth side 115-4 of the L-shaped structure 115) and Pwy (i.e., the distance between the fifth side 115-5 and the second side 115-2 of the L-shaped structure 115). Increasing the values ​​of these parameters will lower the low resonant frequency. It will also push the high resonant frequency slightly lower. Another possible geometric parameter is portHF, which... Figure 4 As shown in the diagram. Another possible geometric parameter is the ring width, which... Figure 4 As shown, it represents the width of the grounding cage wall 116 region.

[0059] Bandwidth and impedance matching also need to be changed Figure 4 Optimization is achieved using one or more parameters shown (i.e., PWx, PWy, PWyc, PWxc, portHF, and ring width). The reflection coefficient curve (see...) Figure 6 S11 and S22) have a "W" shape. Widening the bandwidth means that the center tip of the "W" moves upward. The width RW of the ground loop of post 113 may also affect the antenna performance if it is too wide. The ground loop of post 113 can not only enhance antenna performance, but may also be required in some high-precision packaging processes. Therefore, according to some embodiments, the ground loop of post 113 can also be considered as part of the antenna structure of the wireless communication package 100.

[0060] Now for reference Figure 5 The figure is based on certain embodiments. Figure 1 A schematic plan view of an array of wireless communication packages 100. In this example, there are 2x2 arrays of wireless communication packages 100-1, 100-2, 100-3, and 100-4. (See above regarding...) Figure 2Briefly discussed, in some embodiments, the structural elements of the ground cage wall 116 have a semi-circular shape (i.e., semi-circular when viewed in a plan view). This allows multiple wireless communication packages 100-1, 100-2, 100-3, and 100-4 to be combined into an array, and then the semi-circular structural elements of the ground cage wall 116 of adjacent packages meet at the edge of the wireless communication package 100 to form a complete circular structure. Thus, the ground cage walls 116 (or ground cage structures) can be adjacent to each other. This effect can include: (1) the ground cage walls 116 can help meet metal density requirements; (2) they can provide isolation between the antenna structures of the different wireless communication packages 100-1, 100-2, 100-3, and 100-4; and (3) they can contribute to scalability. Although regarding... Figure 5 A 2x2 array is shown, but it should be understood that any array of suitable size can be used (e.g., an 8x8 array with sixty-four antennas). In some examples, the spacing between the respective centers of the different antennas in the arrays of adjacent wireless communication packages 100 can be λ / 2 wavelengths. It should also be understood that the underlying RFIC chip 102 is shown corresponding to one of the wireless communication packages (e.g., as shown in...). Figure 1 (As shown). It should also be understood that the grounding cage wall 116 can help isolate antennas in different wireless communication packages 100 within the array. The grounding cage wall 116 can also assist in the manufacturing process, and they can reduce antenna bandwidth and detune impedance matching. Moreover, antenna bandwidth and impedance matching can also be improved by adjusting the dimensions of the L-shaped structure 115.

[0061] Figure 6 This is a graph depicting antenna impedance matching and port coupling for wireless communication packaging, according to certain embodiments. As mentioned above, antenna bandwidth and impedance matching also need to be adjusted... Figure 4 Optimization is achieved using one or more parameters shown (i.e., PWx, PWy, PWyc, PWxc, portHF, and ring width). The reflection coefficient curve (see...) Figure 6 S11 and S22) have a “W” shape. Widening the bandwidth means that the center tip of the “W” moves upward. In some examples, the layout of the L-shaped structure 115 is symmetrical, where PSy and PSx are the same size, PWyc and PWxc are the same size, and PWy and PWx are the same size.

[0062] Figure 7 It is a graph depicting the antenna frequencies of several different wireless communication packages 100, each with different geometries, according to certain embodiments. Specifically, Figure 7 It shows when in Figure 2The simulation performance comparison shown is between the actual L-shape and more standard square patches when the geometry of the L-shaped structure 115 discussed in this paper is changed. If PWxc = PWyc = 0, the L-shaped structure becomes a square patch (see also...). Figure 4 Reducing PWxc and PWyc will widen the antenna bandwidth (by separating the two resonant frequencies). Changing PWx and PWy can also shift the two resonant frequencies. In some embodiments, antenna performance can be optimized by adjusting PWx, PWy, PWxc, and PWyc. Furthermore, changing the PWxc and PWyc parameters can provide additional design freedom. Figure 7 As shown, curves PWxc = PWyc = 0.55 mm and PWxc = PWyc = 0.90 mm have a "W" shape, which allows for two resonant frequencies. Furthermore, given that both curves have a "W" shape, it can be seen that curve PWxc = PWyc = 0.90 mm has a narrower bandwidth (i.e., the horizontal distance between the two base points of the "W") than curve PWxc = PWyc = 0.55 mm. Therefore, it can be seen that the antenna performance characteristics can be tuned or optimized by changing the physical dimensions of the L-shaped structure 115.

[0063] Figure 8 This is a schematic diagram illustrating a feeder design for impedance matching and routing in a wireless communication package according to certain embodiments. Typically, the antenna impedance at the bottom of the antenna ground plane at metallization layer BC1 is mismatched with the RFIC transceiver impedance ZL (typically 50 ohms) at metallization layer BC7. A vertical transition from metallization layer BC7 to metallization layer BC3 transforms the impedance from ZL to Z1. In array designs, the distance from the antenna to the transceiver port will vary. Since the antenna feeder needs to be routed in the antenna package design, it may be necessary to set Z1 = Zs so that changing the routing line length does not affect the impedance at the transceiver port. If adjusting the length and width of the line portion with impedance Z3 cannot ensure Zs = Z2, a quarter-wavelength converter with line impedance Zt may be required.

[0064] Those skilled in the art will readily understand the various effects associated with the integrated chip / antenna package structure according to this embodiment. For example, the package structure can be easily fabricated using known manufacturing and packaging techniques to create an antenna structure and package it together with a semiconductor RFIC chip to form a compact integrated radio / wireless communication system configured to operate at millimeter-wave frequencies and higher frequencies. Furthermore, the integrated chip package according to the embodiments allows the antenna to be integrated into a package with an IC chip such as a transceiver chip, providing a compact design with very low loss between the transceiver and the antenna. Moreover, the use of the integrated antenna / IC chip package according to the embodiments discussed herein saves significant space, size, cost, and weight, which is additional for virtually any commercial or military application.

[0065] It should be understood that this embodiment will be described based on the given illustrative architecture; however, other architectures, structures, substrate materials, and process steps / blocks may vary within the scope of this disclosure. It should be noted that for clarity, certain features may not be shown in all figures. This should not be construed as limiting the scope of any particular embodiment, illustration, or claim.

[0066] It should also be understood that when a component, such as a layer, region, or substrate, is referred to as being "on" or "above" another component, it may be directly on the other component, or there may be intermediate components. Conversely, when a component is referred to as being "directly on" or "directly above" another component, there are no intermediate components. It will also be understood that when a component is referred to as being "connected" or "coupled" to another component, it may be directly connected or coupled to the other component, or there may be intermediate components. Conversely, when a component is referred to as being "directly connected" or "directly coupled" to another component, there are no intermediate components.

[0067] References to "one embodiment" or "embodiment" and other variations in the specification mean that a particular feature, structure, characteristic, etc., described in connection with that embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in various places throughout the specification, as well as any other variations, do not necessarily refer to the same embodiment.

[0068] It should be understood that, for example, in the cases of “A / B,” “A and / or B,” and “at least one of A and B,” the use of any of the following “ / ,” “and / or,” and “at least one of” is intended to cover the selection of only the first listed option (A), or only the selection of only the second listed option (B), or the selection of both options (A and B). As a further example, in the cases of “A, B, and / or C” and “at least one of A, B, and C,” such wording is intended to include selecting only the first listed option (A), or only the second listed option (B), or only the third listed option (C), or only the first and second listed options (A and B), or only the first and third listed options (A and C), or only the second and third listed options (B and C), or selecting all three options (A, B, and C). This can be extended to many of the listed items, as will be apparent to those skilled in the art and related fields.

[0069] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the terms “comprising,” “including,” and / or “containing” as used herein specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0070] For ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship between one element or feature and another, as shown in the figures. It should be understood that spatial relative terms are intended to include different orientations of the device in use or operation other than those shown in the figures; for example, if the device in the figures is flipped, an element described as being “below” or “under” other elements or features would be oriented “above” other elements or features. Therefore, the term “below” can include both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein may be interpreted accordingly. Furthermore, it will be understood that when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or there may be one or more intermediate layers.

[0071] It should be understood that although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Therefore, without departing from the scope of this concept, the first element discussed below may be referred to as the second element.

[0072] Various embodiments have been described for illustrative purposes and are not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the described embodiments. The terminology used herein has been chosen to best explain the principles of the embodiments, their practical application, or technical improvements to existing technologies on the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A packaging structure, comprising: A planar core structure, comprising a first side and a second side opposite to the first side; An antenna structure, disposed on the first side of the planar core structure, the antenna structure comprising... Multiple first stacks, each first stack including a first patterned conductive layer formed on a first insulating layer. An antenna is formed on one or more first patterned conductive layers of the first stack, the antenna including at least one L-shaped structure; An interface structure disposed on the second side of the planar core structure; as well as An antenna feed structure is formed in the interface structure and the planar core structure, and is routed through the interface structure and the planar core structure, wherein the antenna feed structure is not connected to the antenna; The antenna includes four L-shaped structures arranged symmetrically, wherein the corners of the L-shaped structures face inward.

2. The packaging structure according to claim 1, wherein, The planar core structure includes a core substrate formed of insulating material.

3. The packaging structure as described in claim 1, wherein, The interface structure includes multiple second stacks, each second stack including a second patterned conductive layer formed on a second insulating layer.

4. The packaging structure as described in claim 1, The interface structure includes multiple second stacks, each second stack including a second patterned conductive layer, the second patterned conductive layer being formed on a second insulating layer, and... in, Power planes, ground planes, signal lines, and contact pads are formed on one or more patterned second conductive layers of the plurality of second stacks of the interface structure.

5. The packaging structure as claimed in claim 1, further comprising a cage wall structure in the antenna structure, the cage wall surrounding the antenna.

6. The packaging structure according to claim 5, wherein, The cage wall structure is electrically connected to the L-shaped structure through the first ground plane layer of the core structure.

7. The packaging structure as described in claim 5, wherein, The cage wall structure includes multiple conductive grounding rings that extend vertically through the antenna structure.

8. The packaging structure as described in claim 1, further comprising: First antenna feed structure and second antenna feed structure; A first bridge is formed on one of the one or more first patterned conductive layers and connected to the first antenna feed structure; as well as The second bridge is formed on one of the one or more first patterned conductive layers and is connected to the second antenna feed structure. The first bridge and the second bridge intersect each other in the central portion of the encapsulation structure.

9. An apparatus comprising: Packaging structure, including A planar core structure, comprising a first side and a second side opposite to the first side. An antenna structure, disposed on the first side of the planar core structure, the antenna structure comprising... Multiple first stacks, each first stack including a first patterned conductive layer formed on a first insulating layer. An antenna, formed on one or more first patterned conductive layers of the first stack, includes at least one L-shaped structure. The interface structure disposed on the second side of the planar core structure, and An antenna feed structure is formed in the interface structure and the planar core structure, and wiring passes through the interface structure and the planar core structure, wherein the antenna feed structure is not connected to the antenna, wherein the antenna includes four L-shaped structures arranged symmetrically, wherein the corners of the L-shaped structures face inward; and An RFIC (Radio Frequency Integrated Circuit) chip includes a semiconductor substrate having an active surface and a passive surface, and a BEOL (Back-End Process) structure formed on the active surface of the semiconductor substrate, wherein the RFIC chip is mounted to the package structure by connecting the BEOL structure of the RFIC chip to the contact pads of the interface structure.

10. The apparatus according to claim 9, wherein, The planar core structure includes a core substrate formed of insulating material.

11. The apparatus of claim 9, wherein, The interface structure includes a plurality of second stacks, each second stack including a second patterned conductive layer formed on a second insulating layer.

12. The apparatus according to claim 9, in, The interface structure includes multiple second stacks, each second stack including a second patterned conductive layer, the second patterned conductive layer being formed on a second insulating layer, and... The power plane, ground plane, signal lines, and contact pads are formed on one or more patterned second conductive layers in the plurality of second stacks of the interface structure.

13. The apparatus of claim 9, further comprising a cage wall structure in the antenna structure, the cage wall surrounding the antenna.

14. The apparatus according to claim 13, wherein, The cage wall structure is electrically connected to the L-shaped structure through the first ground plane layer of the core structure.

15. The apparatus according to claim 13, wherein, The cage wall structure includes multiple conductive grounding rings that extend vertically through the antenna structure.

16. The apparatus of claim 9, further comprising: First antenna feed structure and second antenna feed structure; A first bridge is formed on one of the one or more first patterned conductive layers and connected to the first antenna feed structure; as well as The second bridge is formed on one of the one or more first patterned conductive layers and is connected to the second antenna feed structure. The first bridge and the second bridge intersect each other in the central portion of the encapsulation structure.

17. A method for manufacturing a package structure, the method comprising: A planar core structure is formed, including a first side and a second side opposite to the first side; An antenna structure is formed on the first side of the planar core structure, the antenna structure comprising... Multiple first stacks, each first stack including a first patterned conductive layer formed on a first insulating layer. An antenna is formed on one or more first patterned conductive layers of the first stack, the antenna including at least one L-shaped structure; An interface structure is formed on the second side of the planar core structure; as well as An antenna feed structure is formed in the interface structure and the planar core structure, and the antenna feed structure is wired through the interface structure and the planar core structure, wherein the antenna feed structure is not connected to the antenna; The antenna includes four L-shaped structures arranged symmetrically, wherein the corners of the L-shaped structures face inward.

18. The method of claim 17, further comprising forming a cage wall structure in the antenna structure, the cage wall surrounding the antenna.

19. The method according to claim 18, wherein, The cage wall structure is electrically connected to the L-shaped structure through the first ground plane layer of the core structure.

Images