A manufacturing method of a v-band package antenna

Abstract

The present application relates to the technical field of communication system electronic function component manufacturing, and particularly relates to a manufacturing method of a V-band packaged antenna, comprising the following steps: (1) manufacturing a slotted metal core; (2) manufacturing a V-band microstrip antenna board with stepped blind grooves and a metal core by combining the metal core in (1) with a PCB process; (3) completing the interconnection of a transceiver chip and the microstrip antenna board; and (4) installing a waveguide connector. The method effectively solves the problems of parasitic effects caused by bonding, narrow bandwidth of a planar antenna, secondary assembly of a microstrip antenna with a metal structural component, low assembly precision, difficult operation, low reliability of an embedded air cavity, easy high-temperature delamination and the like, and provides a solution for miniaturization, high integration and low cost of a V-band communication antenna assembly, can realize a bandwidth of 57-65GHz, the gain can reach >=12dBi, and the loss is <=0.5dB. Compared with a traditional antenna, the size of the packaged antenna is reduced by more than 50%, can meet temperature cycling of 100 times at-45 DEG C to 75 DEG C, has good processability and reliability, and breaks through the key technical bottleneck for V-band communication.

Description

Technical Field

[0001] This invention relates to the field of electronic functional component manufacturing technology for communication systems, and specifically to a method for manufacturing a V-band packaged antenna. Background Technology

[0002] With the increasing demands for higher frequency, miniaturization, integration, and lower power consumption in antenna systems from fields such as communications and radar, traditional operating frequency bands and antenna design methods are no longer sufficient to meet these new requirements. V-band high-speed communication, characterized by strong anti-interference capabilities, high security, abundant spectrum resources, high transmission rates, and high integration, is suitable for short-range wireless communication and is a key research direction for next-generation communication development. However, the V-band wavelength in a vacuum is only 5mm, requiring antenna designs with even higher integration. Compared to traditional microstrip antennas, packaged antennas integrate multiple functional chips and the antenna into a single package, achieving optimized performance within a small volume—a novel solution that has become a popular research area for V-band antennas.

[0003] Currently, V-band packaged antennas mainly use LTCC (Low-Temperature Ceramic Capacitor) technology, which suffers from problems such as brittleness, inability to manufacture large-area products, high cost, and low production efficiency. Printed circuit boards (PCBs) are widely used in antennas and transceiver components as a low-cost alternative to LTCC. However, traditional PCB fabrication methods for V-band packaged antennas present the following challenges:

[0004] (1) The compact structure of the packaged antenna has relatively high dielectric and conductor loss, large surface wave loss, and serious spatial radiation loss, which fundamentally limits the antenna performance. It is necessary to introduce an air cavity to improve the performance, but it is difficult to fabricate an air cavity in a miniaturized microstrip board.

[0005] (2) Currently, most packaged antennas are fabricated using silicon-based CMOS or BiCMOS processes, integrating transceiver chips with microstrip antennas. However, the high dielectric constant (≈11.9) and low resistivity (≈10Ω·cm) of silicon substrates further limit the gain and efficiency of packaged antennas. CMOS chips generally require bonding processes, and the length and position of the bonding wires can generate parasitic parameters, which can also affect antenna performance.

[0006] (3) Due to the small wavelength and high integration of the V band, 2-channel or 4-channel packaged antenna designs are often used. Therefore, it is difficult to achieve vertical interconnection between the packaged antenna and the connector in the multi-channel array, which makes it difficult to use the packaged antenna in the integrated design and hinders its use in the antenna system.

[0007] (4) The packaged antenna needs to be grounded. The microwave ground layer on the back of the antenna needs to be in close contact with the metal structure. Grounding requires screwing, welding or conductive adhesive bonding. Screwing reduces the integration density, while welding and conductive adhesive bonding must create a temperature gradient with the chip interconnection, otherwise it will affect the reliability of the chip.

[0008] In view of the above-mentioned defects, the inventors of this invention have finally obtained this invention after a long period of research and practice. Summary of the Invention

[0009] The purpose of this invention is to solve the problems of parasitic effects introduced by bonding, narrow bandwidth of planar antennas, and complex assembly process and low reliability, and to provide a manufacturing method for V-band packaged antennas.

[0010] To achieve the above objectives, this invention discloses a method for manufacturing a V-band packaged antenna, comprising the following steps:

[0011] S1, a metal plate containing blind slots and low-dielectric filler material, wherein the low-dielectric filler material is flush with the surface of the metal plate;

[0012] S2, use the metal plate from step S1 combined with PCB process to manufacture a V-band packaged antenna with stepped blind slots and a metal base plate.

[0013] S3 completes the interconnection between the transceiver chip and the microstrip antenna board, making the top layer of the chip flush with the top layer of the antenna;

[0014] S4, Install the connector and test the antenna performance.

[0015] In step S1, the metal plate is made of any one of copper, aluminum alloy, silicon / aluminum composite material, or Kovar alloy. The air cavity blind groove is manufactured by mechanical deep milling of the metal plate. To ensure the accuracy of the cavity, the burrs on the groove wall are polished and specially inspected. At the same time, a through groove for installing the connector is made. The through groove is a stepped type with a smaller top and a larger bottom.

[0016] In step S1, the air cavity is filled with a material of low dielectric constant, with a thickness flush with the top surface of the metal plate. The material can be any one of rigid polymethacrylamide (PMI) foam, polyurethane (PUR) foam, cross-linked rigid polyvinyl chloride (PVC) foam, phenolic (PF) foam, polymer aerogel, or silicone aerogel. The thickness and tolerance of the filling material are completely consistent with the thickness and tolerance of the blind groove in the metal plate. During filling, an adhesive process is used to prepare the filling material to the dimensions of the air cavity. A structural adhesive film is then embedded into the cavity using a vacuum bagging process. This adhesive film only bonds the filling material and the metal plate to the vertical walls of the blind groove; there is no adhesive film at the bottom of the blind groove in the metal plate. The dielectric constant of the filling material is ≤1.2, and the density is ≤50 kg / m³. 3 The curing temperature of the adhesive film is 100-130℃, and the thickness is ≤0.1mm. Through step S1, a special structure with a complete and smooth top surface and a low dielectric constant in the groove is obtained, which also meets the processing requirements of multilayer microstrip boards.

[0017] In step S2, the V-band packaged antenna includes a microstrip antenna layer and a feed layer. A blind slot is formed in the middle of the antenna layer for chip bonding. The height of the blind slot is the sum of the chip height and the interconnect material height. The microstrip antenna is a PTFE-based system. The antenna layer dielectric is selected from PTFE / glass fiber cloth, PTFE / microglass fiber system, or PTFE / ceramic filler with a dielectric constant ≤2.20. The feed network dielectric is selected from hydrocarbon resin / glass fiber cloth / ceramic powder system. The feed network dielectric of the V-band microstrip antenna board is a hydrocarbon resin / glass fiber cloth / ceramic powder system. The copper foil on the top layer of the dielectric is any one of rolled copper foil, electrolytic copper foil, reverse copper foil, or low profile copper foil, with a copper foil thickness of 18μm or 35μm. The dielectric thickness is 0.254mm.

[0018] In step S2, the antenna layer and feed layer of the V-band microstrip antenna board are fabricated using traditional microwave PCB manufacturing processes. These processes are divided into inner layer fabrication and multi-layer fabrication. Inner layer fabrication includes drilling, electroplating, via plugging, patterning, and browning / blackening. Multi-layer fabrication includes lamination, drilling, electroplating, via plugging, and patterning. The multi-layer fabrication of the integrated antenna layer and feed layer of the V-band microstrip antenna board includes lamination, patterning, electroplating, and surface coating. The adhesive used for the composite of the feed layer and multi-layer microstrip board is a microwave adhesive sheet. The adhesive used for the composite of the antenna layer and feed layer multi-layer microstrip board is also a microwave adhesive sheet.

[0019] In step S2, the blind slots in the antenna layer are prefabricated before lamination using CCD mechanical milling to remove burrs from the slot walls. The positional accuracy of the fabricated blind slots is 0 to +0.06 mm. During multi-layer lamination, PTFE plugs are inserted inside the blind slots to prevent adhesive material from overflowing onto the pattern at the bottom of the blind slots. The dimensional accuracy of the PTFE plugs is -0.08 to 0 mm. During lamination, a three-in-one buffer material, kraft paper, and copper foil are laminated together.

[0020] In step S2, the welding positions of the multilayer microstrip board in the V-band microstrip antenna board are coated with any one of gold plating, electroless gold plating, or nickel-gold plating. The nickel thickness of the nickel-gold plating layer is 3-5 μm, and the gold thickness is 0.13-0.45 μm. The metal plate and the multilayer microstrip board in the V-band microstrip antenna board are laminated together and finally the outer shape is processed. The adhesive material used for the bonding between the metal core board and the multilayer microstrip board is microwave adhesive sheet.

[0021] In step S3, the specific process is as follows: the transceiver chip is bonded to the feed layer in the blind slot of the packaged antenna microstrip board. The height of the adhesive dots is controlled by dispensing or the thickness of the adhesive film is stacked so that the height of the chip after the conductive adhesive is bonded is flush with the height of the antenna feed layer. The chip and the adhesive material are cured in an oven. The chip and the antenna feed layer are interconnected by bonding.

[0022] The conductive adhesive has a curing temperature below 150℃ and a volume resistivity below 5*10⁻⁶. -4 Conductive adhesive film with an Ω·cm resistance and a thickness of 0.05mm / 0.1mm, or a curing temperature below 150℃ and a volume resistivity below 5*10 Ω·cm. -4 The conductive adhesive has a strength of Ω·cm; the bonding process uses gold or aluminum wire, and the bonding technology is selected from any one of thermo-press bonding, ultrasonic bonding, and thermo-ultrasonic bonding.

[0023] In step S4, the specific process is as follows: the WR15 waveguide to SMA connector is screwed onto the bottom of the metal plate, and the electrical interconnection between the inner conductor of the SMA connector and the top layer pattern of the multilayer microstrip board is completed by manual soldering. The overall performance of the antenna is tested by the WR15 waveguide.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0025] 1. The V-band packaged antenna prepared in this invention reduces parasitic effects by introducing an air cavity design and adjusting the thickness of the chip and the antenna feed layer, enabling the antenna gain to reach ≥12dBi and the loss to ≤0.5dB, exhibiting superior performance compared to existing packaged antennas.

[0026] 2. The V-band packaged antenna prepared in this invention integrates the microstrip antenna and metal plate, which originally required secondary assembly, into one unit through PCB technology, thereby improving the integration and assembly accuracy and solving the existing technical problems of easy warping of microstrip antenna, low alignment accuracy with metal structural components, and poor bonding and grounding effect with chip.

[0027] 3. The V-band packaged antenna prepared in this invention improves antenna reliability without affecting microwave performance due to the addition of a low dielectric constant filler in the air cavity. It can meet the typical environmental test requirements of 100 temperature cycles from -45℃ to +75℃ and has passed vibration and shock tests in airborne environments, demonstrating good reliability and environmental adaptability. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of a V-band packaged antenna using an existing process route, as shown in the comparative example.

[0029] Figures 2-4 The comparative example shows the process flow diagram of an existing V-band packaged antenna, where:

[0030] Figure 2 This is a process flow diagram for antenna feed microstrip boards.

[0031] Figure 3 This is a process flow diagram for the power-fed microstrip board.

[0032] Figure 4This is a flowchart of the overall assembly process for packaged antennas.

[0033] Figure 5 This is a schematic diagram of the V-band packaged antenna in Example 1;

[0034] Figures 6-7 This is a process flow diagram of the V-band packaged antenna in Example 1, wherein:

[0035] Figure 6 This is a process flow diagram for microstrip boards with metal plates.

[0036] Figure 7 This is a flowchart of the overall assembly process for packaged antennas.

[0037] Figure 8 This is a schematic diagram of the V-band packaged antenna in Example 2;

[0038] Figures 9-10 This is a process flow diagram of the V-band packaged antenna in Example 2, wherein:

[0039] Figure 9 This is a process flow diagram for microstrip boards with metal plates.

[0040] Figure 10 This is a flowchart of the overall assembly process for packaged antennas.

[0041] The numbers in the diagram represent:

[0042] 1-Short-circuit top layer pressure block; 2-Solder joint; 3-Aluminum wire; 4-Transceiver chip; 5-H2OE conductive adhesive; 6-Top layer pattern; 7-Surface mount pattern; 8-Dielectric; 9-Three-layer dielectric; 10-Aluminum alloy structural component; 11-Metallized hole wall; 12-Plug hole; 13-Blind slot air cavity in metal layer; 14-Air slot; 15-Two layers of RO4450F adhesive material; 16-Inner layer pattern; 17-Mounting screw; 18-Waveguide WR15; 19-Outer conductor; 20-Screw; 21-Side wall; 22-Through hole; 23-Inner conductor; 24-FastRise28 prepreg; 25-25N; 26-Screw; 27-Polyurethane aerogel; 28-Flexible probe; 29-Flexible coaxial connector. Detailed Implementation

[0043] The above-mentioned and other technical features and advantages of the present invention will be described in more detail below with reference to the accompanying drawings.

[0044] Comparative Example

[0045] See the comparative V-band packaged antenna structure design. Figure 1 The comparative example contains 5 independent structures, namely:

[0046] (1) Antenna feed microstrip board (dielectric 8, patch pattern 7) based on RT5880 (thickness 0.254mm, copper foil 17μm), including blind slots;

[0047] (2) A 6-layer fed microstrip board based on RO4350B (thickness 0.254mm, copper foil 17μm) (including three layers of dielectric 9, two layers of RO4450F adhesive material 15, top layer pattern 6, inner layer pattern 16, blind via (metallized hole wall 11 and plug hole 12), and through hole 22).

[0048] (3) An aluminum alloy structural component 10 containing an air groove 14 (including a side wall 21 and a short-circuit top layer pressure block 1);

[0049] (4) Waveguide WR15 18 with SMA coaxial connector (outer conductor 19, inner conductor 23) (including mounting screw 17);

[0050] (5) Silicon-based CMOS transceiver chip 4.

[0051] First, a metal plate is fabricated. The metal plate processing flow is as follows: mechanical drilling, mechanical deep milling, grinding, tapping, and CNC milling of the outer shape, including through slots and blind slots for mounting the RF connector. The small ring on the through slot is used to mount the connector outer conductor 19, and the large ring below the through slot is used to mount the connector flange 18.

[0052] Then, double-sided antenna feed microstrip boards and multi-layer feed microstrip boards were fabricated respectively.

[0053] The processing flow of the double-sided antenna feed microstrip board is as follows: pattern making, surface coating, and shape processing.

[0054] The processing flow of multilayer fed microstrip board is as follows: drilling, electroplating, hole plugging, pattern making, browning and blackening, lamination, drilling, electroplating, hole plugging, pattern making, surface coating, and shape processing.

[0055] The final assembly process is as follows: First, the antenna microstrip board, feed microstrip board, and aluminum alloy structural component are screwed together and pressed tightly with screws 20, ensuring close contact with the aluminum alloy structural component 10 and sidewall 21, with the patch pattern positioned directly above the air slot 14. H20E conductive adhesive 5 is cured at 120℃ for 30 minutes on the top layer pattern 6 of the feed layer, and the silicon-based transceiver chip 4 is then bonded to the feed microstrip board. Interconnection is then achieved between the transceiver chip 4 and the antenna feed layer via aluminum wire 3. The SMA-WR15 is screwed onto the aluminum alloy structural component, and screws 17 are tightened for fixation. Solder joints 2 are formed by manual soldering, and then the short-circuit top layer pressure block 1 is pressed tightly against the antenna feed microstrip board with screws. The specific process flow is as follows: Figure 2 As shown.

[0056] The problem with Comparative Example 1 is that, because the antenna microstrip board, feed microstrip board, and aluminum alloy structural components are tightly fixed together with screws, grounding discontinuities are unavoidable. This limits the overall performance of the packaged antenna, achieving a gain of ≥8dBi and a loss of ≤0.8dB in the 57–65 GHz bandwidth. Due to the inability to precisely position the screw holes, the assembly accuracy between the feed layer and the connector is only ±0.08mm. To ensure electrical continuity and structural reliability, the screw holes are evenly distributed, resulting in a relatively large size.

[0057] Example 1

[0058] The V-band packaged antenna structure design in Example 1 is shown below. Figure 3 Except for the newly added number, all other numbers are the same as Figure 1 With the same meaning, Example 1 contains 4 independent structures, namely:

[0059] (1) Multilayer microstrip board with metal plate, the antenna feed layer still uses RT5880 (thickness 0.254mm, copper foil 17μm) as the dielectric base, the power supply layer still uses RO4350B (thickness 0.254mm, copper foil 17μm) as the dielectric base, and RO4450F first completes the lamination of 6 inner layer boards, as well as the copper plate 10 containing air cavity;

[0060] (2) Short-circuit top layer pressure block;

[0061] (3) Waveguide WR15 with SMA coaxial connector;

[0062] (4) Silicon-based CMOS transceiver chip.

[0063] The process flow of the V-band packaged antenna in Example 1 is as follows: Figure 4 As shown, where:

[0064] The fabrication of the air cavity in the metal plate was the same as in the comparative example, but polyurethane aerogel 26 from the Petrochemical Research Institute of the Heilongjiang Academy of Sciences was added inside the air cavity. The aerogel has a dielectric constant of 1.05. The air cavity wall and the polyurethane aerogel were bonded together using J-333 adhesive film, and the vacuum pressure temperature was 120℃. The local flatness of the prepared polyurethane aerogel was ±0.05 mm.

[0065] The processing flow of the multilayer microstrip board with metal plate is as follows: mechanical milling, drilling, electroplating, hole plugging, pattern making, browning and blackening, three-stage lamination, surface coating, and shape processing. In addition to the first lamination of the feed layer, the second lamination uses CFB278F prepreg to complete the lamination of the antenna and feed layers. Finally, the third lamination of the 8-layer microstrip board and metal plate is completed using RLP30 adhesive material 25. At the positions corresponding to the through-slots in the metal plate, the adhesive material is pre-removed to form holes 27 that are 0.1–0.25 mm larger than the outer edge of the through-slots. Simultaneously, the gaps 24 between the multilayer board and the metal plate are filled through the gaps. Since Example 1 uses a 4-to-1 panelization pattern, during the third lamination, because the metal plate shape has already been processed, PTFE gaskets must be placed in the non-metallic areas during alignment and stacking to ensure consistent pressure during lamination and achieve the high flatness requirement of the finished multilayer board.

[0066] The final assembly process is as follows: The thickness of the chip is adjusted using J-423 conductive adhesive from the Petrochemical Research Institute of the Heilongjiang Academy of Sciences on the top layer pattern of the feed layer, ensuring it is flush with the top layer of the antenna. After curing at 120℃ for 30 minutes, the silicon-based transceiver chip is bonded to the blind slot of the feed layer. Interconnection between the transceiver chip and the antenna feed layer is then achieved using aluminum wire bonding. The SMA-WR15 is then screwed onto the copper plate, and the screws are tightened for fixation. Solder joints are formed by manual soldering. Finally, the short-circuit top layer pressure block is attached to the multilayer board via screw 28 through the sidewall, connecting it to the metal plate.

[0067] Compared to the comparative example, this packaged antenna assembly improves the assembly accuracy between the feed layer and the connector from ±0.08mm to ±0.05mm, achieving a bandwidth of 57–65GHz, a gain of ≥12dBi, and a loss of ≤0.5dB. This packaged antenna is more than 50% smaller than traditional antennas, can withstand 100 temperature cycles from -45℃ to 75℃, and exhibits excellent electrical performance, convenient operation, and high reliability.

[0068] Example 2

[0069] The V-band packaged antenna structure design in Example 2 is shown below. Figure 5 Except for the newly added number, all other numbers are the same as Figure 1 With the same corresponding meaning, Example 2 includes 3 independent structures, namely:

[0070] (1) Multilayer microstrip board with metal plate, the antenna feed layer uses CF200 (thickness 0.254mm, copper foil 17μm) from the 46th Research Institute of China Electronics Technology Group Corporation as the dielectric base, the power feed layer uses CT-350 (thickness 0.254mm, copper foil 17μm) from Taizhou Wangling Company as the dielectric base, and the CT-300P from Taizhou Wangling Company first completes the lamination of 6 inner layer boards, as well as the copper plate (boss 31 embedded in the antenna feed layer and power feed layer);

[0071] (2) Waveguide WR15 of flexible coaxial connector 29;

[0072] (3) Silicon-based CMOS transceiver chip.

[0073] The process flow of the V-band packaged antenna in Example 2 is as follows: Figure 6 As shown, where:

[0074] An additional hole 32 is drilled inside the metal plate, and polyurethane aerogel 28 is added into the air cavity of the metal plate. The plate is then vacuum-pressed for 2.5 hours at 120°C and 0.1 MPa through an epoxy film. The remaining steps are the same as in Example 1.

[0075] The processing flow of the multilayer microstrip board with metal plate is as follows: mechanical milling, drilling, electroplating, hole plugging, pattern making, browning / blackening, three-stage lamination, surface coating, and shape processing. After the third lamination, resin plugging is first performed in the holes 32 of the copper bosses 31 embedded in the microstrip board. After the plugging resin cures, drilling is performed on the resin, the hole walls are metallized 33, and the holes are plugged again 34 and cured. Electroplating is performed at the hole openings, and then the antenna layer pattern is made. The remaining steps are the same as in Example 1.

[0076] The final assembly process is as follows: A 0.1mm layer of CF3350 conductive adhesive film is applied to the top layer pattern of the feed layer and cured at 130℃ for 3 hours. The silicon-based transceiver chip is then bonded to the blind slot of the feed layer. Interconnection between the transceiver chip and the antenna feed layer is then achieved via aluminum wire bonding. The coaxial connector-WR15 with elastic probe 29 is screwed onto the copper plate, and the screws are tightened to complete the fixation, thus completing the vertical interconnection of the microwave signals.

[0077] Compared to the comparative example, this packaged antenna assembly has a 15% reduced cross-sectional thickness, and the assembly accuracy between the feed layer and the connector has been improved from ±0.08mm to ±0.04mm. It can achieve a bandwidth of 57–65GHz, a gain of ≥12dBi, and a loss of ≤0.5dB. Compared to traditional antennas, this packaged antenna is more than 50% smaller, can withstand 300 temperature cycles from -45℃ to 75℃, and features excellent electrical performance, convenient operation, and high reliability.

[0078] The above description is merely a preferred embodiment of the present invention and is illustrative rather than restrictive. Those skilled in the art will understand that many changes, modifications, and even equivalents can be made within the spirit and scope defined by the claims of the present invention, all of which will fall within the protection scope of the present invention.

Claims

1. A method for manufacturing a V-band packaged antenna, characterized in that, Includes the following steps: S1, a metal plate containing blind slots and low-dielectric filler material, wherein the low-dielectric filler material is flush with the surface of the metal plate; S2, use the metal plate from step S1 combined with PCB process to manufacture a V-band packaged antenna with stepped blind slots and a metal base plate. S3 completes the interconnection between the transceiver chip and the microstrip antenna board, making the top layer of the chip flush with the top layer of the antenna; S4, Install the connector and test antenna performance; In step S2, the antenna layer and feed layer microstrip boards in the V-band microstrip antenna board are fabricated using traditional microwave PCB manufacturing processes. Traditional microwave PCB manufacturing processes are divided into inner layer fabrication and multi-layer fabrication. The inner layer fabrication includes drilling, electroplating, via plugging, patterning, and browning / blackening. The multi-layer fabrication includes lamination, drilling, electroplating, via plugging, and patterning. The multi-layer fabrication of the integrated antenna layer and feed layer multi-layer microstrip board in the V-band microstrip antenna board includes lamination, patterning, electroplating, and surface coating. The adhesive material used for the composite of the feed layer multi-layer microstrip board is a microwave adhesive sheet. The adhesive material used for the composite of the antenna / feed layer and the feed layer multi-layer microstrip board is also a microwave adhesive sheet. In step S3, the specific process is as follows: the transceiver chip is bonded to the feed layer of the packaged antenna microstrip board. The height of the adhesive dots is controlled by dispensing or the thickness of the adhesive film is stacked so that the height of the chip after the conductive adhesive is bonded is flush with the height of the antenna feed layer. The chip and the adhesive material are cured in an oven. The chip and the antenna feed layer are interconnected by bonding. In step S4, the specific process is as follows: the WR15 waveguide to SMA connector is screwed onto the bottom of the metal plate, and the electrical interconnection between the inner conductor of the SMA connector and the top layer pattern of the multilayer microstrip board is completed by manual soldering. The overall performance of the antenna is tested by the WR15 waveguide.

2. The manufacturing method of a V-band packaged antenna as described in claim 1, characterized in that, In step S1, the metal plate is made of any one of copper, aluminum alloy, silicon / aluminum composite material, or Kovar alloy. The air cavity blind groove is manufactured by mechanical deep milling of the metal plate. To ensure the accuracy of the cavity, the burrs on the groove wall are polished and specially inspected. At the same time, a through groove for installing the connector is made. The through groove is a stepped type with a smaller top and a larger bottom.

3. The manufacturing method of a V-band packaged antenna as described in claim 1, characterized in that, In step S1, the air cavity is filled with a material of low dielectric constant, with a thickness flush with the top surface of the metal plate. The material can be any one of rigid polymethacrylamide foam, polyurethane foam, cross-linked rigid polyvinyl chloride foam, phenolic foam, polymer aerogel, or silicone aerogel. The thickness and tolerance of this filling material are the same as the thickness of the blind groove in the metal plate. During filling, an adhesive process is used to prepare the filling material to the dimensions of the air cavity. A structural adhesive film is then embedded into the cavity using a vacuum bagging process. This adhesive film only bonds the filling material and the metal plate to the vertical walls of the blind groove; there is no adhesive film at the bottom of the blind groove in the metal plate. The dielectric constant of the filling material is ≤1.2, and the density is ≤50 kg / m³. 3 The curing temperature of the adhesive film is 100~130℃ and the thickness is ≤0.1mm.

4. The manufacturing method of a V-band packaged antenna as described in claim 1, characterized in that, In step S2, the V-band packaged antenna includes a microstrip antenna layer and a feed layer. A blind slot is formed in the middle of the antenna layer, and the height of the blind slot is the sum of the chip height and the interconnect material height. The microstrip antenna is based on PTFE. The antenna layer dielectric is selected from PTFE / glass fiber cloth, PTFE / microglass fiber system, or PTFE / ceramic filler with a dielectric constant ≤2.

20. The feed network dielectric is selected from hydrocarbon resin / glass fiber cloth / ceramic powder system. The feed network dielectric of the V-band microstrip antenna board is hydrocarbon resin / glass fiber cloth / ceramic powder system. The copper foil on the top layer of the dielectric is any one of rolled copper foil, electrolytic copper foil, reverse copper foil, and low profile copper foil, and the copper foil thickness is 18µm or 35µm. The dielectric thickness is 0.254mm.

5. The manufacturing method of a V-band packaged antenna as described in claim 1, characterized in that, In step S2, the blind groove is prefabricated before pressing using CCD mechanical milling to remove burrs from the groove wall. The positional accuracy of the blind groove after fabrication is 0~+0.06mm. During multi-layer pressing, PTFE plugs are added inside the blind groove to prevent adhesive material from overflowing onto the pattern at the bottom of the blind groove. The dimensional accuracy of the PTFE plugs is -0.08~0mm. During pressing, a three-in-one buffer material, kraft paper, and copper foil are laminated together.

6. The manufacturing method of a V-band packaged antenna as described in claim 1, characterized in that, In step S2, the welding positions of the multilayer microstrip board in the V-band microstrip antenna board are coated with any one of gold plating, electroless gold plating, or nickel-gold plating. The nickel thickness of the nickel-gold plating layer is 3~5μm, and the gold thickness is 0.13~0.45μm. The metal plate and the multilayer microstrip board in the V-band microstrip antenna board are laminated together and finally the outer shape is processed. The adhesive material used for the bonding between the metal core board and the multilayer microstrip board is microwave adhesive sheet.

7. The manufacturing method of a V-band packaged antenna as described in claim 1, characterized in that, The conductive adhesive has a curing temperature below 150℃ and a volume resistivity below [missing value]. Conductive adhesive film with a thickness of 0.05mm / 0.1mm, or solid... Cooling temperature below 150℃, volume resistivity below The conductive adhesive is used for bonding; gold or aluminum wire is used for bonding, and the bonding process is selected from any one of thermo-press bonding, ultrasonic bonding, and thermo-ultrasonic bonding.

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