A low temperature control circuit and a low temperature control system

Abstract

This application provides a cryogenic control circuit and a cryogenic control system. The cryogenic control circuit includes a first control circuit, a second control circuit, and a heating circuit. The first terminal of the first control circuit and the first terminal of the heating circuit are respectively connected to an external power supply. The second terminals of the first and second control circuits are respectively connected to a chip circuit. The first terminal of the second control circuit is connected to the second terminal of the heating circuit. In a cryogenic environment, the chip circuit is not activated. When the external power supply is turned on, the second control circuit controls the heating circuit to heat the environment around the chip circuit. When the first control circuit senses that the ambient temperature has risen to a preset temperature, it can control the chip circuit to start. The activated chip circuit outputs a voltage to the second control circuit to disconnect the second control circuit, thereby stopping the heating circuit. The heating circuit can be controlled with a simple control circuit, reducing the cost of heating control.

Description

Technical Field

[0001] This application belongs to the field of electrical technology, specifically relating to a cryogenic control circuit and a cryogenic control system. Background Technology

[0002] Chips / chip modules in consumer electronics devices may fail to start or become unstable at low temperatures (such as -40°C), causing consumer electronics products to malfunction in low-temperature environments.

[0003] In related technologies, heating circuits can be placed around the chip / chip module, and the heating circuit can be controlled by a main control chip to increase the temperature around the chip / chip module, thus enabling the chip / chip module to start normally. However, since the heating circuit is controlled by the main control chip, the cost of heating control is relatively high. Summary of the Invention

[0004] This application relates to a cryogenic control circuit and a cryogenic control system, which solves the technical problem of high cost in existing heating control systems.

[0005] In a first aspect, embodiments of this application provide a low-temperature control circuit, including a first control circuit, a second control circuit, and a heating circuit, wherein...

[0006] The first terminal of the first control circuit and the first terminal of the heating circuit are respectively connected to an external power supply. The second terminal of the first control circuit and the second terminal of the second control circuit are respectively connected to a chip circuit. The first terminal of the second control circuit is connected to the second terminal of the heating circuit.

[0007] The first control circuit is used to control the chip circuit to start, and the second control circuit is used to control the heating circuit to heat up.

[0008] In one possible implementation, the first control circuit includes a first metal-oxide-semiconductor (MOSFET) and a temperature sensing circuit, wherein...

[0009] The source of the first MOS transistor and the first terminal of the temperature sensing circuit are respectively connected to the external power supply, the drain of the first MOS transistor is connected to the chip circuit, and the gate of the first MOS transistor is connected to the other end of the temperature sensing circuit.

[0010] The temperature sensing circuit is used to control the first MOS transistor to be turned on or off.

[0011] In one possible implementation, the temperature sensing circuit includes a negative temperature coefficient NTC thermistor, a comparator integrated circuit, and a first resistor, wherein,

[0012] The first end of the first resistor and the first end of the NTC thermistor are respectively connected to the external power supply. The second end of the first resistor is connected to the first non-inverting input pin of the comparator integrated circuit. The second end of the NTC thermistor is connected to the first inverting input pin of the comparator integrated circuit. The first output pin of the comparator integrated circuit is connected to the gate of the first MOS transistor.

[0013] In one possible implementation, the temperature sensing circuit further includes a second resistor and a third resistor, wherein,

[0014] The first end of the second resistor is connected to the second end of the first resistor and the first non-inverting input pin of the comparator integrated circuit. The first end of the third resistor is connected to the second end of the NTC thermistor and the first non-inverting input pin of the comparator integrated circuit. The second ends of the second resistor and the second ends of the third resistor are grounded.

[0015] In one possible implementation, the first control circuit further includes at least one fourth resistor.

[0016] In one possible implementation, the second control circuit includes a second MOSFET and a third MOSFET, wherein,

[0017] The gate of the second MOS transistor is connected to the chip circuit, the drain of the second MOS transistor and the gate of the third MOS transistor are respectively connected to the external power supply, the source of the second MOS transistor and the source of the third MOS transistor are grounded, and the drain of the third MOS transistor is connected to the second terminal of the heating circuit.

[0018] In one possible implementation, the second MOSFET is specifically used for:

[0019] The gate of the second MOSFET receives a high voltage sent by the chip circuit to control the third MOSFET to turn off.

[0020] In one possible implementation, the second control circuit further includes a plurality of fifth resistors.

[0021] In one possible implementation, the heating circuit includes a plurality of power resistors connected in parallel, with a first end of each power resistor connected to the drain of the third MOS transistor and a second end of each power resistor connected to the external power supply.

[0022] Secondly, embodiments of this application provide a low-temperature control system, including the low-temperature control circuit and the chip circuit described in the first aspect, wherein the low-temperature control circuit is connected to the chip circuit.

[0023] This application provides a cryogenic control circuit and a cryogenic control system. The cryogenic control circuit includes a first control circuit, a second control circuit, and a heating circuit. The first terminals of the first control circuit and the heating circuit are respectively connected to an external power supply. The second terminals of the first and second control circuits are respectively connected to a chip circuit. The first terminal of the second control circuit is connected to the second terminal of the heating circuit. In a cryogenic environment, the chip circuit is not activated. When the external power supply is turned on, the second control circuit controls the heating circuit to heat the environment around the chip circuit. When the first control circuit senses that the ambient temperature has risen to a preset temperature, it can control the chip circuit to start. The activated chip circuit outputs a voltage to the second control circuit to disconnect it, thereby stopping the heating circuit. The heating circuit can be controlled with a simple control circuit, eliminating the need for a main control chip and reducing the cost of heating control. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a cryogenic control circuit provided in an embodiment of this application;

[0025] Figure 2 This is a schematic diagram of the structure of a first control circuit provided in an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of another first control circuit provided in an embodiment of this application;

[0027] Figure 4 This is a schematic diagram of another first control circuit provided in an embodiment of the present application;

[0028] Figure 5 This is a schematic diagram of the structure of a second control circuit provided in an embodiment of this application;

[0029] Figure 6 This is a schematic diagram of another second control circuit provided in an embodiment of this application;

[0030] Figure 7 This is a schematic diagram of another cryogenic control circuit provided in an embodiment of this application;

[0031] Figure 8 This is a schematic diagram of a cryogenic control system provided in an embodiment of this application.

[0032] 100: Low-temperature control circuit;

[0033] 110: First control circuit;

[0034] 111: First MOSFET;

[0035] 112: Temperature sensing circuit;

[0036] RT1: NTC thermistor;

[0037] R1: First resistor;

[0038] R2: Second resistor;

[0039] R3: Third resistor;

[0040] R4: Fourth resistor;

[0041] U1: Comparator integrated circuit;

[0042] 120: Heating circuit;

[0043] 130: Second control circuit;

[0044] 131: Second MOSFET;

[0045] 132: Third MOSFET;

[0046] R5: Fifth resistor;

[0047] R6: Fifth resistor;

[0048] 200: Chip circuit;

[0049] 300: External power supply. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] The use of terms like "first" and "second" in this application is for illustrative purposes and to distinguish the objects being described. There is no particular order between them, nor does it imply a specific limitation on the number of objects in the embodiments of this application, and it cannot constitute any limitation on the embodiments of this application. For example, using terms like "first resistor" and "second resistor" is merely to distinguish different resistors, and does not indicate a difference in priority or importance between the two resistors.

[0052] In this application, "at least one" means one or more, and "multiple" means two or more.

[0053] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0054] In this application, terms such as "exemplary," "in some embodiments," and "in other embodiments" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Rather, the term "exemplary" is used to present the concept in a specific manner.

[0055] The application scenario of this application can be how to start up consumer electronic device chips / chip modules in low-temperature environments (such as -40℃). It should be noted that the low-temperature control circuit provided in this application can be applied not only to the aforementioned consumer electronic devices, but also to other electronic devices used in low-temperature environments. The devices to which the low-temperature control circuit provided in this application is applicable include, but are not limited to, the aforementioned consumer electronic devices.

[0056] Consumer electronic devices can refer to audio and video products used by individuals and households related to broadcasting and television, mainly including: televisions, DVD players, VCRs, camcorders, radios, tape recorders, stereo systems, record players, and laser disc players. Telephones, personal computers, home office equipment, home electronic healthcare devices, and automotive electronics can also be included in the category of consumer electronic devices. With technological advancements and the emergence of new products and applications, digital cameras, mobile phones, and tablet computers are also becoming emerging consumer electronic devices.

[0057] In related technologies, heating circuits can be placed around the chip / chip module, and the heating circuit can be controlled by a main control chip to increase the temperature around the chip / chip module, thus enabling the chip / chip module to start normally. However, since the heating circuit is controlled by the main control chip, the heating control cost is relatively high and the control logic is relatively complex.

[0058] To address the aforementioned technical problems, this application provides a simple low-temperature control circuit, including a first control circuit, a second control circuit, and a heating circuit. In a low-temperature environment, the chip / chip module is not activated. When an external power source is connected, the second control circuit controls the heating circuit to heat the environment surrounding the chip / chip module. When the first control circuit senses that the ambient temperature has risen to a preset temperature, it can control the chip / chip module to activate. The activated chip / chip module outputs a voltage to the second control circuit to disconnect it, thereby stopping the heating circuit. The heating circuit can be controlled by a simple control circuit, eliminating the need for a main control chip, reducing the cost of heating control, and the control logic is simple.

[0059] It should be noted that, in the embodiments of this application, "chip circuit" can refer to the circuitry of a chip or the circuitry of a chip module. That is, "chip circuit" represents a chip / chip module.

[0060] The technical solutions shown in this application will now be described in detail through specific embodiments. It should be noted that the following embodiments may exist independently or in combination with each other; identical or identical content will not be repeated in different embodiments.

[0061] Figure 1 This is a schematic diagram of a cryogenic control circuit provided in an embodiment of this application. Please refer to [link / reference]. Figure 1 The low-temperature control circuit 100 includes a first control circuit 110, a heating circuit 120, and a second control circuit 130.

[0062] The first terminal of the first control circuit 110 and the first terminal of the heating circuit 120 are respectively connected to the external power supply 300, the second terminal of the first control circuit 110 and the second terminal of the second control circuit 130 are respectively connected to the chip circuit 200, and the first terminal of the second control circuit 130 is connected to the second terminal of the heating circuit 120.

[0063] The first control circuit 110 can be used to start the control chip circuit 200.

[0064] The heating circuit 120 can be used to heat the environment around the chip circuit 200.

[0065] The heating circuit 120 can be arranged around or behind the chip circuit 200 to heat the environment around the chip circuit 200.

[0066] The second control circuit 130 can be used to control the heating circuit 120 to heat.

[0067] In low-temperature environments, the circuit between the first control circuit 110 and the chip circuit 200 is not conductive, and the chip circuit 200 is not activated. When the external power supply 300 is turned on, the second control circuit 130 controls the heating circuit 120 to heat the environment around the chip circuit 200. When the first control circuit 110 senses that the ambient temperature has risen to a preset temperature, it connects the circuit between the first control circuit 110 and the chip circuit 200, thereby controlling the chip circuit 200 to start. The activated chip circuit 200 outputs voltage to the second control circuit 130 to disconnect the second control circuit 130, thus stopping the heating circuit 120 from heating. The heating circuit can be controlled with a simple control circuit, eliminating the need for a main control chip and reducing the cost of heating control.

[0068] In one possible implementation, such as Figure 2 As shown, the first control circuit 110 includes a first metal-oxide-semiconductor field-effect transistor (MOS transistor) 111 and a temperature sensing circuit 112.

[0069] The source of the first MOS transistor 111 and the first end of the temperature sensing circuit 112 are respectively connected to the external power supply 300, the drain of the first MOS transistor 111 is connected to the chip circuit 200, and the gate of the first MOS transistor 111 is connected to the other end of the temperature sensing circuit 112.

[0070] The first MOSFET 111 can be used to control the startup of the chip circuit.

[0071] The first MOSFET 111 can be a P-channel MOSFET.

[0072] For example, the first MOSFET 111 can be a P-channel enhancement-mode MOSFET.

[0073] The temperature sensing circuit 112 can be used to control the first MOSFET 111 to be turned on or off.

[0074] In a low-temperature environment, the temperature sensing circuit 112 senses the ambient temperature and outputs a high level to the gate of the first MOSFET 111, so that the first MOSFET 111 is turned off, no voltage is input to the chip circuit, and the chip circuit is not started.

[0075] When the ambient temperature rises, the temperature sensing circuit 112 senses the ambient temperature and outputs a low level to the gate of the first MOSFET 111, so that the first MOSFET 111 is turned on, so that there is voltage input to the chip circuit and the chip circuit is started.

[0076] In one possible implementation, such as Figure 3As shown, the temperature sensing circuit 112 includes a negative temperature coefficient (NTC) thermistor RT1, a comparator integrated circuit U1, and a first resistor R1.

[0077] The first end of the first resistor R1 and the first end of the NTC thermistor RT1 are respectively connected to the external power supply 300. The second end of the first resistor R1 is connected to the first non-inverting input pin of the comparator integrated circuit U1. The second end of the NTC thermistor RT1 is connected to the first inverting input pin of the comparator integrated circuit U1. The first output pin of the comparator integrated circuit U1 is connected to the gate of the first MOS transistor 111.

[0078] The comparator integrated circuit U1 has 8 pins, including pin 1, pin 2, pin 3, pin 4, pin 5, pin 6, pin 7 and pin 8. Among them, pin 1 is the first output pin, pin 2 is the first inverting input pin (INA-), pin 3 is the first non-inverting input pin (INA+), pin 4 is the ground pin (GND), pin 5 is the second non-inverting input pin (INB+), pin 6 is the second inverting input pin (INB-), pin 7 is the second output pin, and pin 8 is the positive power supply input pin (VCC).

[0079] In low-temperature environments, the resistance value of the NTC thermistor RT1 is relatively large. Therefore, the voltage of the first non-inverting input pin of the comparator integrated circuit U1 is higher than that of the first inverting input pin of the comparator integrated circuit U1. The first output pin of the comparator integrated circuit U1 outputs a high level to control the first MOSFET 111 to be turned off.

[0080] When the ambient temperature rises, the resistance value of the NTC thermistor RT1 is lower. As a result, the voltage at the first non-inverting input pin of the comparator integrated circuit U1 is lower than that at the first inverting input pin of the comparator integrated circuit U1. The first output pin of the comparator integrated circuit U1 outputs a low level to control the first MOS transistor 111 to turn on.

[0081] In one possible implementation, such as Figure 4 As shown, the temperature sensing circuit 112 also includes a second resistor R2 and a third resistor R3.

[0082] The first end of the second resistor R2 is connected to the second end of the first resistor R1 and the first non-inverting input pin of the comparator integrated circuit U1. The first end of the third resistor R3 is connected to the second end of the NTC thermistor RT1 and the first non-inverting input pin of the comparator integrated circuit U1. The second ends of the second resistor R2 and the second ends of the third resistor R3 are grounded.

[0083] By adjusting the resistance values ​​of the first resistor R1, the second resistor R2, and the third resistor R3, and in conjunction with the NTC thermistor RT1, the voltage levels of the first non-inverting input pin and the first direction input pin of the comparator integrated circuit U1 can be adjusted, allowing the first MOSFET 111 to conduct at different temperatures. The voltage is input to the chip circuit 200, which then starts up. Once started, the chip circuit 200 can turn off the second control circuit 130, thereby stopping the heating circuit 120 from heating. In other words, by adjusting the resistance values ​​of the first resistor R1, the second resistor R2, and the third resistor R3, the heating circuit 120 can be controlled to stop heating at different temperatures.

[0084] In one possible implementation, such as Figure 4 As shown, the first control circuit 110 may also include at least one fourth resistor R4.

[0085] The first end of the fourth resistor R4 can be connected to the external power supply 300, and the second end of the fourth resistor R4 can be connected to the first output pin of the comparator integrated circuit U1 and the gate of the first MOS transistor 111.

[0086] In one possible implementation, such as Figure 5 As shown, the second control circuit 130 includes a second MOSFET 131 and a third MOSFET 132.

[0087] The gate of the second MOSFET 131 is connected to the chip circuit 200, the drain of the second MOSFET 131 and the gate of the third MOSFET 132 are respectively connected to the external power supply 300, the source of the second MOSFET 131 and the source of the third MOSFET 132 are grounded, and the drain of the third MOSFET 132 is connected to the second terminal of the heating circuit 120.

[0088] The second MOSFET 131 can be an N-channel MOSFET.

[0089] For example, the second MOSFET 131 can be an N-channel depletion-type MOSFET.

[0090] The third MOSFET 132 can be an N-channel MOSFET.

[0091] For example, the third MOSFET 132 can be an N-channel enhancement-mode MOSFET.

[0092] The gate of the second MOSFET 131 can receive a high voltage sent by the chip circuit 200 to control the third MOSFET 132 to be turned off.

[0093] In a low-temperature environment, the chip circuit 200 is not started, the second MOSFET 131 is cut off, and after the external power supply 300 is powered on, the gate voltage of the third MOSFET 132 increases, causing the third MOSFET 132 to conduct. At this time, the heating circuit 120 can perform heating.

[0094] When the heating circuit brings the ambient temperature around the chip circuit 200 to the preset temperature, the first control circuit 110 controls the chip circuit 200 to start. After starting, the chip circuit 200 outputs a voltage to the gate of the second MOSFET 131, causing the second MOSFET 131 to conduct. At this time, the gate voltage of the third MOSFET 132 decreases, the third MOSFET 132 is turned off, and the heating circuit 120 stops heating.

[0095] In one possible implementation, the second control circuit 130 further includes multiple fifth resistors, such as... Figure 6 As shown, the multiple fifth resistors are R5 and R6.

[0096] In this circuit, the first terminal of R5 is connected to the external power supply 300, the second terminal of R5 is connected to the first terminal of R6 and the gate of the third MOSFET 132, and the second terminal of R6 is connected to the drain of the second MOSFET 131.

[0097] In one possible implementation, such as Figure 7 As shown, the heating circuit 120 includes multiple power resistors connected in parallel.

[0098] The first end of each power resistor is connected to the drain of the third MOSFET 132, and the second end of each power resistor is connected to the external power supply 300.

[0099] Power resistors have a simple structure and good heating effect, and using power resistors can effectively reduce costs.

[0100] like Figure 7 As shown, when the external power supply 300 is turned on, in a low-temperature environment, due to the large resistance value of the NTC thermistor RT1, the comparator integrated circuit U1 outputs a high level, the first MOSFET 111 is cut off, and there is no voltage input to the chip circuit 200; the third MOSFET 132 is turned on, and the heating circuit 120 starts heating.

[0101] When heated to the preset temperature, the resistance value of the NTC thermistor RT1 is small, causing the comparator integrated circuit U1 to output a low level, the first MOSFET 111 turns on, and the voltage input chip circuit 200 is activated. After activation, the chip circuit 200 inputs a high voltage to the second MOSFET 131, causing the second MOSFET 131 to turn on and the third MOSFET 132 to turn off, thereby causing the heating circuit 120 to stop heating.

[0102] Figure 8This is a schematic diagram of a cryogenic control system provided in an embodiment of this application. Please refer to... Figure 8 The cryogenic control system includes the cryogenic control circuit 100 and chip circuit 200 described in any of the above embodiments.

[0103] The cryogenic control circuit 100 is connected to the chip circuit 200. The cryogenic control circuit 100 can heat the environment surrounding the chip circuit 200, thereby enabling the chip circuit 200 to start normally, and can also shut off the heating after the chip circuit 200 starts.

[0104] The cryogenic control system provided in this application embodiment can execute the technical solution shown in the above-described cryogenic control circuit embodiment. Its implementation principle and beneficial effects are similar, and will not be described again here.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention, and are not intended to limit them. Although the embodiments of the present invention have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the embodiments of the present invention.

Claims

1. A low temperature control circuit, characterized by, It includes a first control circuit, a second control circuit, and a heating circuit, wherein, The first terminal of the first control circuit and the first terminal of the heating circuit are respectively connected to an external power supply. The second terminal of the first control circuit and the second terminal of the second control circuit are respectively connected to a chip circuit. The first terminal of the second control circuit is connected to the second terminal of the heating circuit. The first control circuit is used to control the chip circuit to start, and the second control circuit is used to control the heating circuit to heat up; The first control circuit includes a first MOSFET and a temperature sensing circuit, wherein, The source of the first MOS transistor and the first terminal of the temperature sensing circuit are respectively connected to the external power supply, the drain of the first MOS transistor is connected to the chip circuit, and the gate of the first MOS transistor is connected to the other end of the temperature sensing circuit. The temperature sensing circuit is used to control the first MOS transistor to be turned on or off. The second control circuit includes a second MOSFET and a third MOSFET, wherein, The gate of the second MOS transistor is connected to the chip circuit, the drain of the second MOS transistor and the gate of the third MOS transistor are respectively connected to the external power supply, the source of the second MOS transistor and the source of the third MOS transistor are grounded, and the drain of the third MOS transistor is connected to the second terminal of the heating circuit.

2. The circuit of claim 1, wherein, The temperature sensing circuit includes a negative temperature coefficient NTC thermistor, a comparator integrated circuit, and a first resistor, wherein... The first end of the first resistor and the first end of the NTC thermistor are respectively connected to the external power supply. The second end of the first resistor is connected to the first non-inverting input pin of the comparator integrated circuit. The second end of the NTC thermistor is connected to the first inverting input pin of the comparator integrated circuit. The first output pin of the comparator integrated circuit is connected to the gate of the first MOS transistor.

3. The circuit according to claim 2, characterized in that, The temperature sensing circuit further includes a second resistor and a third resistor, wherein, The first end of the second resistor is connected to the second end of the first resistor and the first non-inverting input pin of the comparator integrated circuit. The first end of the third resistor is connected to the second end of the NTC thermistor and the first non-inverting input pin of the comparator integrated circuit. The second ends of the second resistor and the second ends of the third resistor are grounded.

4. The circuit of claim 1, wherein, The first control circuit also includes at least one fourth resistor.

5. The circuit of claim 1, wherein, The second MOSFET is specifically used for: The gate of the second MOSFET receives a high voltage sent by the chip circuit to control the third MOSFET to turn off.

6. The circuit of claim 1, wherein, The second control circuit also includes multiple fifth resistors.

7. The circuit according to any one of claims 1 to 6, characterized in that The heating circuit includes multiple power resistors connected in parallel. The first end of each power resistor is connected to the drain of the third MOS transistor, and the second end of each power resistor is connected to the external power supply.

8. A cryogenic control system characterized by, It includes the low-temperature control circuit and the chip circuit as described in claim 1, wherein the low-temperature control circuit is connected to the chip circuit.

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