Substrate structure and method of making the same

Abstract

A substrate structure includes a core plate, a first circuit substrate, a second circuit substrate and a metal block. The first circuit substrate includes a first substrate and a first conductive pattern layer, and the second circuit substrate includes a second substrate. The first substrate and the second substrate are respectively bonded to opposite sides of the core plate through adhesive sheets. The first conductive pattern layer includes a first conductor layer and a second conductor layer which are stacked. The first conductor layer is in contact with the first substrate. The substrate structure is provided with an opening which penetrates the first substrate, the first conductor layer, the core plate and the adhesive sheet. The second substrate is partially exposed in the opening. The metal block is accommodated in the opening and covered by the second conductor layer. The pin of the metal block is fixedly inserted into the second substrate. The substrate structure is provided with a cavity which penetrates the metal block and the second conductor layer. The connector is accommodated in the cavity and welded to the metal block and the second conductor layer. The application further provides a manufacturing method of the substrate structure.

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