Processing device and manufacturing method of processed product

Abstract

The processing device of the present application, and the processing product manufacturing method using the same to manufacture a processing product automatically replaces a holding plate used to hold a processing target, including: a processing mechanism (4) that processes a sealed substrate (W); a plate storage portion (24) that stores a holding plate (M1) used to hold the sealed substrate (W); a holding base (M2) to which the holding plate (M1) is detachably attached, and which holds the sealed substrate (W) using the holding plate (M1); and a plate conveying mechanism (25) that conveys the holding plate (M1) between the plate storage portion (24) and the holding base (M2), the plate conveying mechanism (25) conveying the holding plate (M1) detached from the holding base (M2) to the plate storage portion (24), and conveying the holding plate (M1) located in the plate storage portion (24) to the holding base (M2).

Description

Technical Field

[0001] This invention relates to a processing apparatus and a method for manufacturing processed articles. Background Technology

[0002] Previously, as shown in Patent Document 1, in a cutting device for manufacturing multiple monolithically produced products by cutting the object to be cut, it was conceived to construct it in a manner in which an adsorption clamp that can be attached and detached from the cutting table is used.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-040060

[0006] However, in the aforementioned cutting device, the suction clamp is only made detachable for the cutting table, requiring operator intervention when changing the suction clamp. Therefore, this not only incurs labor costs for the operator but also results in uneven installation. Furthermore, the time-consuming changeover reduces the productivity of the cutting device. Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] Therefore, the present invention was made to solve the aforementioned problems, and its main objective is to automatically replace the holding plate used to hold the workpiece.

[0009] Technical means to solve the problem

[0010] That is, the processing apparatus of the present invention includes: a processing mechanism for processing a workpiece; a plate receiving portion for receiving a holding plate for holding the workpiece; a holding base for detachably mounting the holding plate and using the holding plate to hold the workpiece; and a plate conveying mechanism for conveying the plate between the plate receiving portion and the holding base, wherein the plate conveying mechanism conveys the holding plate removed from the holding base to the plate receiving portion and conveys the holding plate located in the plate receiving portion to the holding base.

[0011] The method for manufacturing processed articles of the present invention uses the aforementioned processing apparatus to manufacture processed articles.

[0012] The effects of the invention

[0013] According to the present invention configured in this way, the holding plate used to hold the workpiece can be automatically replaced. Attached Figure Description

[0014] Figure 1 This diagram schematically illustrates the structure of the cutting device according to the first embodiment of the present invention.

[0015] Figure 2 This is a perspective view schematically illustrating the cutting platform and its surrounding structure in the described embodiment.

[0016] Figure 3 This is a plan view (view from the Z direction) schematically illustrating the structure of the cutting platform and its surrounding structure according to the described embodiment.

[0017] Figure 4 This is a front view (viewed from the Y direction) schematically illustrating the structure of the cutting platform and its surrounding structure according to the embodiment.

[0018] Figure 5 A front view (viewed from the Y direction) schematically illustrating the structure of the first holding mechanism and the conveying moving mechanism of the described embodiment.

[0019] Figure 6 A side view (view from the X direction) schematically illustrating the structure of the first holding mechanism and the conveying moving mechanism of the described embodiment.

[0020] Figure 7 A cross-sectional view schematically illustrating the structure of the rack and pinion mechanism of the described embodiment.

[0021] Figure 8 A front view (viewed from the Y direction) schematically illustrating the structure of the second holding mechanism and the conveying moving mechanism of the described embodiment.

[0022] Figure 9 This is a schematic diagram illustrating the operation of the cutting device according to the described embodiment.

[0023] Figure 10 This is a schematic diagram illustrating the structure of the retaining plate and retaining base in the described embodiment.

[0024] Figure 11 This is a perspective view showing the first conveying mechanism (pallet conveying mechanism) and the pallet receiving part of the embodiment described above.

[0025] Figure 12 A cross-sectional view schematically illustrating the structure of the fixing mechanism of the described embodiment.

[0026] Figure 13 This is a perspective view showing the holding base of the second holding mechanism in the embodiment described above.

[0027] Figure 14 This diagram illustrates the replacement operation of the retaining plate in the described embodiment.

[0028] Figure 15 This diagram illustrates the replacement operation of the retaining plate in the described embodiment.

[0029] Figure 16 To schematically illustrate the structure of a modified example of the plate conveying mechanism of the first embodiment, Figure 16 (a) A partial view (partial plan view) viewed from the Z direction. Figure 16 (b) A partial view (partial side view) viewed from the X direction, and Figure 16 (c) A partial view (partial front view) viewed from the Y direction.

[0030] Figure 17 This diagram schematically illustrates the structure of the cutting device according to the second embodiment of the present invention.

[0031] Figure 18 A plan view (view from the Z direction) schematically showing the positions of the transfer stage and the mounting stage of the embodiment.

[0032] Figure 19 A front view (viewed from the Y direction) schematically illustrating the structure of the transfer platform, placement platform, and attachment conveying mechanism of the described embodiment.

[0033] Figure 20 To schematically illustrate the structure of the attachment member in the described embodiment Figure 20 (a) Plan view Figure 20 (b) cross-sectional view, and Figure 20 (c) A partially enlarged cross-sectional view.

[0034] Figure 21 This is a front view (viewed from the Y direction) schematically illustrating the structure of the mounting platform, the attachment component receiving section, and the attachment component conveying mechanism of the embodiment described above.

[0035] Figure 22 This is a perspective view showing the first conveying mechanism (plate conveying mechanism) and the plate receiving part of the embodiment described above.

[0036] Figure 23 For the implementation method Figure 23 (a) shows the positional relationship between the attachment component receiving part and the plate receiving part when the attachment component is removed or placed in the receiving part. Figure 23 (b) shows the positional relationship between the attachment component housing and the plate housing when the plate housing is removed or the holding plate is inserted.

[0037] Figure 24 This diagram illustrates the replacement operation of the retaining plate in the described embodiment.

[0038] Figure 25This diagram illustrates the replacement operation of the retaining plate in the described embodiment.

[0039] Figure 26 For modified implementation methods Figure 26 (a) is a schematic diagram (front view) showing the structure of the mounting platform, the attachment component receiving section, and the attachment component conveying mechanism viewed from the Y direction. Figure 26 (b) is a schematic diagram showing the widened spacing of the upper guide rails. Figure 26 (c) represents a schematic diagram showing the narrowing of the spacing between the upper guide rails.

[0040] Figure 27 This diagram schematically illustrates the structure of the cutting device according to the third embodiment of the present invention.

[0041] Figure 28 This is a plan view (view from the Z direction) schematically illustrating the peripheral structure of the drying table and housing box of the described embodiment.

[0042] Figure 29 A front view (viewed from the Y direction) schematically illustrating the peripheral structure of the drying table and housing box of the described embodiment.

[0043] Figure 30 This is a schematic diagram illustrating the operation of the cutting device according to the described embodiment.

[0044] Figure 31 This is a perspective view showing the plate conveying mechanism and plate receiving part of the embodiment described above.

[0045] Figure 32 This diagram illustrates the replacement operation of the retaining plate in the described embodiment.

[0046] Figure 33 This diagram schematically illustrates the structure of the cutting device according to the fourth embodiment of the present invention.

[0047] Figure 34 To schematically illustrate the structure of the cylindrical container of the described embodiment Figure 34 (a) 3D diagram and Figure 34 (b) Cross-sectional view.

[0048] Figure 35 A front view (viewed from the Y direction) schematically illustrating the structure of the transfer platform and conveying and receiving mechanism of the described embodiment.

[0049] Figure 36 This diagram illustrates the replacement operation of the retaining plate in the described embodiment.

[0050] Explanation of symbols

[0051] 100: Cutting device (processing device)

[0052] W: Sealed substrate (object to be processed)

[0053] P: Product (Processed Goods)

[0054] 2A, 2B: Cutting table (processing table)

[0055] 4: Cutting mechanism (processing mechanism)

[0056] 5: Transfer stage

[0057] 6: Second holding mechanism (transfer holding mechanism, second transfer mechanism)

[0058] 7: Moving mechanism for transporting goods (secondary transport mechanism)

[0059] 141: Holding table (inspection table)

[0060] 24: Board Reception Department

[0061] M2: Maintain base

[0062] M1: Holding board

[0063] 25: Plate conveying mechanism

[0064] 21: Pallet

[0065] 22: Pallet conveying mechanism (first conveying mechanism)

[0066] 261: Insertion hole for fixing

[0067] 262: Fixed cylindrical part

[0068] 262a: Cylindrical body

[0069] 262b: Movable component

[0070] 262c: Elastomer

[0071] 27: Temporary storage area

[0072] 281: Holding hole for transportation

[0073] 282: Conveying cylindrical section

[0074] 29: Inspection agency

[0075] 29a: Inspection flow path

[0076] 101: Attached components

[0077] 102: Platform

[0078] 106: Attached component receiving section

[0079] 107: Attached component conveying mechanism

[0080] 1071: Third Holding Mechanism (First Transport Mechanism)

[0081] 111: Container

[0082] 112: Drying table

[0083] 116: Cylindrical container

[0084] 116x: ​​Open at one end

[0085] 117: Container Setup Department

[0086] 118: Transfer to shelter

[0087] 119: Intermediate Platform

[0088] 120: First Product Transport Mechanism

[0089] 121: Second Product Transport Mechanism Detailed Implementation

[0090] The invention will then be described in more detail by way of examples. However, the invention is not limited to the following description.

[0091] As described above, the processing apparatus of the present invention includes: a processing mechanism for processing a workpiece; a plate receiving portion for receiving a holding plate for holding the workpiece; a holding base for detachably mounting the holding plate and using the holding plate to hold the workpiece; and a plate conveying mechanism for conveying the plate between the plate receiving portion and the holding base, wherein the plate conveying mechanism conveys the holding plate removed from the holding base to the plate receiving portion and conveys the holding plate located in the plate receiving portion to the holding base.

[0092] If the processing apparatus is as described, it includes a plate conveying mechanism that transports the retaining plate removed from the retaining base to the plate receiving section and then transports the retaining plate located in the plate receiving section to the retaining base, thus enabling automatic replacement of the retaining plate at the retaining base. As a result, labor costs for replacing the retaining plate can be reduced. Furthermore, because the retaining plate is automatically replaced, inconsistencies in the installation state of the retaining plate relative to the retaining base can be reduced. Moreover, because the retaining plate is automatically replaced, the replacement time for the retaining plate can be shortened, thereby improving the productivity of the processing apparatus.

[0093] Ideally, the plate conveying mechanism should raise and convey the plate.

[0094] If the structure described above is used, interference between the holding plate and other components can be avoided when transporting the holding plate, making it easy to transport the holding plate.

[0095] The plate conveying mechanism is preferably for conveying at least one of the following holding plates: a holding plate for a processing table for processing the workpiece; a holding plate for a drying table for drying the processed workpiece after processing by the processing mechanism; a holding plate for an inspection table for inspecting the processed workpiece; a holding plate for a transfer table for placing the processed workpiece before sorting; or a holding plate for a conveying holding mechanism for holding the processed workpiece.

[0096] If the structure described above is used, the retaining plates of the processing table, inspection table, transfer table, and conveying retaining mechanism can be automatically replaced.

[0097] The processing apparatus of the present invention further includes: a processing object conveying mechanism for conveying the processing object.

[0098] In the aforementioned structure, to enable automatic replacement of the holding plate and to simplify the device structure and reduce device costs, the plate conveying mechanism is ideally configured to use the workpiece conveying mechanism. That is, the plate conveying mechanism is a structure that functions to convey the workpiece.

[0099] The processing apparatus of the present invention can be configured such that the processed workpiece can be contained in a pallet (also referred to as "pallet containment"). The processing apparatus further includes a pallet conveying mechanism for conveying pallets that classify the processed workpiece.

[0100] In the aforementioned structure, to enable automatic replacement of the holding plates and to simplify the device structure and reduce device costs, the plate conveying mechanism is ideally configured using the pallet conveying mechanism. That is, the plate conveying mechanism is a structure that functions to convey pallets that classify the processed objects.

[0101] Ideally, the plate conveying mechanism includes: a first conveying mechanism for conveying the holding plate between the plate receiving portion and the temporary placement portion; and a second conveying mechanism for conveying the holding plate between the temporary placement portion and the holding base.

[0102] If the structure is as described, the holding plate is transported via a temporary placement section through a first transport mechanism and a second transport mechanism. Therefore, compared with the case where a single transport mechanism constitutes the plate transport mechanism, the degree of freedom in the destination of the holding plate can be increased.

[0103] When the plate conveying mechanism is composed of a first conveying mechanism and a second conveying mechanism, it is preferable that the first conveying mechanism conveys the attaching component to the mounting platform, and the second conveying mechanism conveys the monolithized processing object.

[0104] If the structure described above is used, the retaining plate can be replaced automatically, simplifying the device structure and reducing device costs.

[0105] The processing apparatus of the present invention can be configured such that a monolithically processed object can be attached to and housed (also referred to as "chain housing") an attachment member having an adhesive surface. The processing apparatus further includes a stage for holding the attachment member, the attachment member having an adhesive surface for attaching the monolithically processed object to the processing mechanism.

[0106] In the aforementioned structure, the plate conveying mechanism is ideally configured to convey the attaching component to the mounting platform.

[0107] If it is the aforementioned processing apparatus, the board conveying mechanism can transport the attachment component to the mounting table, thus eliminating the need for a separate conveying mechanism for the attachment component, which is independent of the board conveying mechanism. This simplifies the apparatus structure for attaching and housing the monolithically processed object to the adhesive surface. Furthermore, it also reduces apparatus costs. In addition, when performing subsequent processes such as sputtering or encapsulation on the monolithically processed object, operation is easy as simply moving the attachment component with the monolithically processed object attached.

[0108] Ideally, the plate conveying mechanism includes: a first conveying mechanism for conveying the holding plate between the plate receiving portion and the temporary placement portion; and a second conveying mechanism for conveying the holding plate between the temporary placement portion and the holding base.

[0109] If the structure is as described, the holding plate is transported via a temporary placement section through a first transport mechanism and a second transport mechanism. Therefore, compared with the case where a single transport mechanism constitutes the plate transport mechanism, the degree of freedom in the destination of the holding plate can be increased.

[0110] When the plate conveying mechanism is composed of a first conveying mechanism and a second conveying mechanism, it is preferable that the first conveying mechanism conveys the attaching component to the mounting platform, and the second conveying mechanism conveys the monolithized processing object.

[0111] If the structure described above is used, the retaining plate can be replaced automatically, simplifying the device structure and reducing device costs.

[0112] As a specific embodiment for simplifying the device structure, the processing apparatus of the present invention preferably further includes: a first holding mechanism for holding the workpiece to be processed on the processing table; a second holding mechanism for holding the monolithized workpiece to be processed from the processing table; a third holding mechanism for holding the attaching member to be attached on the mounting table; and a transfer mechanism having a common transmission shaft for moving the first holding mechanism, the second holding mechanism, and the third holding mechanism.

[0113] In the aforementioned structure, in order to enable automatic replacement of the holding plate and simplify the device structure and reduce device costs, it is ideal for the first conveying mechanism to be constructed using the third holding mechanism and the conveying moving mechanism, and for the second conveying mechanism to be constructed using the second holding mechanism and the conveying moving mechanism.

[0114] The processing apparatus of the present invention further includes: an attachment component receiving portion for receiving the attachment component.

[0115] In the aforementioned structure, in order to minimize the footprint of the processing device, it is ideal for the plate receiving portion and the attachment component receiving portion to be arranged vertically relative to each other.

[0116] The processing apparatus of the present invention can be configured such that the processed object, which has been pieced together, can be contained in a discrete state (also referred to as "block containment"). The processing apparatus further includes a containment box for receiving the processed object, which has been pieced together by the processing mechanism, when it falls.

[0117] In the aforementioned structure, the plate conveying mechanism is ideally configured to convey the monolithized processed object to the receiving box.

[0118] If it is the aforementioned processing device, the plate conveying mechanism can transport the individually pieced processing object to the receiving box. Therefore, there is no need to set up a separate conveying mechanism independent of the plate conveying mechanism, which simplifies the device structure of the processing device that drops and receives the individually pieced processing object. Furthermore, the device cost can also be reduced. In addition, by dropping the individually pieced processing object into the receiving box for storage, the storage space can be reduced compared to the previous pallet storage structure. This also reduces the area occupied by the processing device.

[0119] Furthermore, the processing apparatus of the present invention can be configured such that the monolithized workpiece can be housed in a cylindrical container (also called a "tube container"). The cylindrical container is sometimes also referred to as a tube, magazinestick, stick magazine, or stick. The processing apparatus further includes: a container housing section equipped with the cylindrical container, the cylindrical container housing the monolithized workpiece from one open end; and a conveying and housing mechanism for conveying the monolithized workpiece to the cylindrical container provided in the container housing section and housing it.

[0120] As a specific embodiment for simplifying the structure of the processing apparatus for block or tube containment, the processing apparatus of the present invention preferably further includes: a first holding mechanism for holding the workpiece to be processed in order to transfer the workpiece to the processing table; a second holding mechanism for holding the workpiece after being monolithized to be transferred from the processing table; and a transfer moving mechanism having a common transmission shaft for moving the first holding mechanism and the second holding mechanism, wherein the plate transfer mechanism is configured using the second holding mechanism and the transfer moving mechanism.

[0121] To automatically check whether the retaining plate has been accurately fixed, the processing apparatus of the present invention preferably further includes: an inspection mechanism for checking the installation status of the retaining plate on the retaining base.

[0122] As a specific implementation of the inspection mechanism, it is preferable that the inspection mechanism includes: an inspection flow path with an opening on the mounting surface on which the holding plate is mounted; and a detection sensor disposed in the inspection flow path to detect leakage of fluid from the opening. Here, the detection sensor detects leakage of fluid from the opening by measuring the pressure or flow rate of the fluid.

[0123] To simplify the fixing structure of the retaining plate to the retaining base, it is preferable that the retaining base has: a fixing cylindrical portion inserted into a fixing insertion hole formed in the retaining plate; the fixing cylindrical portion having: a cylindrical body inserted into the fixing insertion hole; a movable member provided in a manner that allows it to be moved to a position protruding from the outer circumferential surface of the cylindrical body and a position submerged; and an elastic body that applies force to the movable member in a position protruding relative to the cylindrical body. When the fixing cylindrical portion is inserted into the fixing insertion hole, the movable member is in a protruding position, thereby fixing the retaining plate to the retaining base.

[0124] Furthermore, to simplify the loading and unloading structure of the plate-carrying mechanism, it is preferable that the plate-carrying mechanism includes: a conveying cylindrical portion inserted into a conveying retaining hole formed in the plate; the conveying cylindrical portion having: a cylindrical body inserted into the conveying retaining hole; a movable member provided to be movable to a position protruding from the outer circumferential surface of the cylindrical body and a position submerged therein; and an elastic body that applies force to the movable member in a position protruding relative to the cylindrical body. When the conveying cylindrical portion is inserted into the conveying insertion hole, the movable member is in a protruding position, thereby holding the plate in the plate-carrying mechanism.

[0125] In addition, the method of manufacturing the processed article using the aforementioned processing apparatus is also an embodiment of the present invention.

[0126] <Variations of the Invention>

[0127] Hereinafter, various embodiments of the processing apparatus of the present invention will be described with reference to the accompanying drawings. Furthermore, all figures shown below are schematic depictions that have been appropriately omitted or exaggerated for ease of understanding. Identical structural components are labeled with the same symbols, and descriptions have been appropriately omitted.

[0128] <First Implementation>

[0129] <Overall Structure of the Processing Equipment>

[0130] The processing apparatus 100 in this embodiment is a cutting device, which cuts the sealed substrate W, which is the object to be processed, thereby monolithically dividing it into multiple products P, which are processed products.

[0131] Here, the term "sealed substrate W" refers to a substrate that houses electronic components such as semiconductor chips, resistors, and capacitors, and is formed by resin molding in a manner that at least seals the electronic components with resin. The substrate constituting the sealed substrate W can be a lead frame, a printed circuit board, or, in addition, a semiconductor substrate (including silicon wafers), a metal substrate, a ceramic substrate, a glass substrate, or a resin substrate. Furthermore, the substrate constituting the sealed substrate W may or may not have wiring.

[0132] Furthermore, in the sealed substrate W and the product P of this embodiment, one of its surfaces becomes the encapsulation surface for subsequent encapsulation. In the description of this embodiment, one of the surfaces for subsequent encapsulation is referred to as the "encapsulation surface," and the surface on the opposite side is referred to as the "marking surface."

[0133] Specifically, such as Figure 1As shown, the cutting device 100 includes: two cutting tables (processing tables) 2A and 2B for holding a sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W to transfer it to the cutting tables 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B; a transfer table 5 for moving a plurality of products P; a second holding mechanism 6 for holding the plurality of products P to transfer them from the cutting tables 2A and 2B to the transfer table 5; a transfer moving mechanism 7 having a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting moving mechanism (processing moving mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B. In addition, a conveying mechanism (loader) for conveying the sealed substrate W is composed of a first holding mechanism 3 and a conveying moving mechanism 7, and a conveying mechanism (unloader) for conveying multiple products P is composed of a second holding mechanism 6 and a conveying moving mechanism 7.

[0134] In the following description, mutually orthogonal directions along the plane (horizontal plane) of the upper surfaces of cutting table 2A and cutting table 2B are respectively designated as the X direction (first direction) and the Y direction (second direction), and the vertical direction orthogonal to the X and Y directions is designated as the Z direction. Specifically, Figure 1 The left-right direction is defined as the X direction, and the up-down direction as the Y direction. Although described later, the X direction is the direction of movement of the support 812. Additionally, it is the direction orthogonal to the length direction (the direction of beam extension) of the beam (crossbeam) that supports the pair of legs of the portal support 812 (see reference). Figure 2 and Figure 3 ).

[0135] <Cutting table 2A, Cutting table 2B>

[0136] Two cutting tables 2A and 2B are fixedly installed in the X, Y, and Z directions, respectively. Furthermore, cutting table 2A can be rotated in the θ direction by a rotating mechanism 9A located beneath it. Similarly, cutting table 2B can be rotated in the θ direction by a rotating mechanism 9B located beneath it.

[0137] These two cutting tables 2A and 2B are arranged along the X direction on a horizontal plane. Specifically, the two cutting tables 2A and 2B are configured such that their upper surfaces are on the same horizontal plane (at the same height in the Z direction) (see reference). Figure 4 ), and are arranged such that the centers of these upper surfaces (specifically, the rotation centers based on rotation mechanisms 9A and 9B) lie on the same straight line extending along the X direction (see reference). Figure 2 and Figure 3 ).

[0138] In addition, the two cutting platforms 2A and 2B adsorb and hold the sealed substrate W, such as Figure 1 As shown, two vacuum pumps 10A and 10B for adsorption and holding are configured corresponding to the two cutting platforms 2A and 2B. Each vacuum pump 10A and 10B is, for example, a water-sealed vacuum pump.

[0139] Here, the cutting platforms 2A and 2B are fixed in the XYZ directions, thus shortening the piping (not shown) connecting the vacuum pumps 10A and 10B to the cutting platforms 2A and 2B. This reduces pressure loss in the piping and prevents a decrease in adsorption force. As a result, even extremely small packages, such as those less than 1 mm square, can be reliably adsorbed onto the cutting platforms 2A and 2B. Furthermore, the reduction in adsorption force due to pressure loss in the piping is prevented, allowing for a reduction in the capacity of the vacuum pumps 10A and 10B, leading to miniaturization or cost reduction.

[0140] <First Holding Agency 3>

[0141] like Figure 1 As shown, the first holding mechanism 3 holds the sealed substrate W in order to transport it from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B. Figure 5 and Figure 6 As shown, the first holding mechanism 3 includes: an adsorption head 31 with multiple adsorption portions 311 for adsorbing and holding the sealed substrate W; and a vacuum pump or vacuum ejector (not shown) connected to the adsorption portions 311 of the adsorption head 31. Furthermore, the sealed substrate W is moved to the desired position by the adsorption head 31 via the transport mechanism 7 (described later), thereby transporting it from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B.

[0142] like Figure 1 As shown, the substrate supply mechanism 11 includes: a substrate receiving section 11a for receiving a plurality of sealed substrates W from the outside; and a substrate supply section 11b for moving the sealed substrates W received in the substrate receiving section 11a to a holding position RP held by the first holding mechanism 3. The holding position RP is set in the X direction in a parallel configuration with the two cutting stages 2A and 2B. Furthermore, the substrate supply mechanism 11 may also include a heating section 11c for simultaneously heating and pressing the sealed substrates W held by the first holding mechanism 3 to ensure flatness.

[0143] <Cutting Mechanism 4>

[0144] like Figure 1 , Figure 2 and Figure 3As shown, the cutting mechanism 4 has two rotating tools 40 comprising blades 41A and 41B and two spindle portions 42A and 42B. The two spindle portions 42A and 42B are arranged with their rotation axes along the Y direction, and the blades 41A and 41B mounted on these spindle portions are arranged facing each other (see reference). Figure 3 The blades 41A and 41B of the spindle section 42A and spindle section 42B, by rotating in a plane including the X and Z directions, cut the sealed substrate W held on each cutting table 2A, 2B. Furthermore, in the cutting device 100 of this embodiment, such as... Figure 4 As shown, a liquid supply mechanism 12 is provided to suppress the frictional heat generated by the cutting blades 41A and 41B. The liquid supply mechanism 12 has a spray nozzle 12a for spraying cutting water (machining fluid). The spray nozzle 12a is supported, for example, on the Z-direction moving part 83 described later.

[0145] <Transfer Platform 5>

[0146] like Figure 1 As shown, the transfer table 5 in this embodiment is a table for moving multiple products P that have been inspected by the inspection unit 13 (described later). This transfer table 5, referred to as an indexing table, temporarily holds the multiple products P before classifying them into various trays 21. Furthermore, the transfer table 5 is arranged in a row with two cutting tables 2A and 2B along the X direction on a horizontal plane. The transfer table 5 can also move back and forth along the Y direction, reaching the classification mechanism 20. The multiple products P placed on the transfer table 5 are classified into various trays 21 by the classification mechanism 20 according to the inspection results (good products, defective products, etc.) obtained from the inspection unit 13.

[0147] Furthermore, various pallets 21 are transported to the required positions by a pallet conveying mechanism 22 that moves along the transfer axis 71, carrying the products P classified by the sorting mechanism 20. After classification, the various pallets 21 are received by the pallet conveying mechanism 22 into the pallet receiving section 23. In this embodiment, three types of pallets are configured to be received in the pallet receiving section 23: for example, pallets 21 before receiving products P, pallets 21 containing good products P, and pallets 21 containing defective products P that need to be reworked.

[0148] <Inspection Department 13>

[0149] Here, the inspection department 13, as shown Figure 1As shown, a plurality of products P held in the second holding mechanism 6 are inspected between the cutting table 2A, the cutting table 2B and the transfer table 5. The inspection unit 13 of this embodiment has a first inspection unit 131 for inspecting the marking surface of the product P and a second inspection unit 132 for inspecting the packaging surface of the product P. The first inspection unit 131 is a camera with an optical system for inspecting the marking surface, and the second inspection unit 132 is a camera with an optical system for inspecting the packaging surface. Alternatively, the first inspection unit 131 and the second inspection unit 132 can be shared.

[0150] In addition, in order to inspect both sides of the multiple products P through the inspection section 13, a reversing mechanism 14 is provided to reverse the multiple products P (see reference). Figure 1 The reversing mechanism 14 includes a holding table 141 for holding multiple products P and a reversing part 142 such as a motor for reversing the holding table 141 in a manner that makes the front and back sides reverse.

[0151] When the second holding mechanism 6 holds multiple products P from the cutting table 2A and the cutting table 2B, the marking surface of the products P faces downwards. In this state, during the transfer of the multiple products P from the cutting table 2A and the cutting table 2B to the reversing mechanism 14, the marking surface of the products P is inspected by the first inspection unit 131. Then, the multiple products P held in the second holding mechanism 6 are reversed by the reversing mechanism 14, and then the reversing mechanism 14 moves to the position of the transfer table 5. During this movement, the packaging surface of the products P facing downwards is inspected by the second inspection unit 132. Afterwards, the products P are transferred to the transfer table 5.

[0152] <Second Maintenance Agency 6>

[0153] like Figure 1 As shown, the second holding mechanism 6 holds multiple products P to transport them from the cutting table 2A and the cutting table 2B to the reversing mechanism 14. Figure 8 As shown, the second holding mechanism 6 includes: an adsorption head 61 with multiple adsorption sections 611 for adsorbing and holding multiple products P; and a vacuum pump or vacuum ejector (not shown) connected to the adsorption sections 611 of the adsorption head 61. Then, the adsorption head 61 is moved to the desired position by a conveying mechanism 7 (described later), thereby conveying multiple products P from the cutting table 2A and the cutting table 2B to the holding table 141.

[0154] <Transfer and Moving Mechanism 7>

[0155] like Figure 1As shown, the conveying moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting table 2A and the cutting table 2B, and moves the second holding mechanism 6 at least between the cutting table 2A, the cutting table 2B and the holding table 141.

[0156] Moreover, such as Figure 1 As shown, the conveying moving mechanism 7 has a common transfer shaft 71 that extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5, for moving the first holding mechanism 3 and the second holding mechanism 6.

[0157] The transfer shaft 71 is positioned such that the first holding mechanism 3 is movable above the substrate supply section 11b of the substrate supply mechanism 11, and the second holding mechanism 6 is movable above the transfer stage 5 (see reference). Figure 1 Furthermore, the first holding mechanism 3, the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the transfer table 5 are located on the same side (near the front) relative to the transfer shaft 71. Additionally, the inspection unit 13, the reversing mechanism 14, various trays 21, the tray conveying mechanism 22, the tray receiving unit 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 (described later), and the recycling container 172 are also located on the same side (near the front) relative to the transfer shaft 71.

[0158] Furthermore, such as Figure 5 , Figure 6 and Figure 8 As shown, the conveying moving mechanism 7 includes: a main moving mechanism 72 for moving the first holding mechanism 3 and the second holding mechanism 6 along the transfer shaft 71 in the X direction; a lifting moving mechanism 73 for moving the first holding mechanism 3 and the second holding mechanism 6 in the Z direction relative to the transfer shaft 71; and a horizontal moving mechanism 74 for moving the first holding mechanism 3 and the second holding mechanism 6 horizontally relative to the transfer shaft 71 in the Y direction.

[0159] like Figures 5-8 As shown, the main moving mechanism 72 has: a common guide rail 721, provided on the transmission shaft 71, guiding the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, which moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

[0160] The guide rail 721 extends linearly along the transfer axis 71 in the X direction and is positioned within the same range as the transfer axis 71, such that the first holding mechanism 3 is movable above the substrate supply section 11b of the substrate supply mechanism 11, and the second holding mechanism 6 is movable above the transfer stage 5. A sliding member 723 is slidably provided on the guide rail 721, and the first holding mechanism 3 and the second holding mechanism 6 are provided via a lifting mechanism 73 and a horizontal movement mechanism 74. Here, the guide rail 721 is shared by the first holding mechanism 3 and the second holding mechanism 6, but the lifting mechanism 73, the horizontal movement mechanism 74, and the sliding member 723 are provided separately for each of the first holding mechanism 3 and the second holding mechanism 6.

[0161] The rack and pinion mechanism 722 includes: a cam rack 722a, shared by the first retaining mechanism 3 and the second retaining mechanism 6; and a pinion 722b, respectively disposed in the first retaining mechanism 3 and the second retaining mechanism 6, and rotated by an actuator (not shown). The cam rack 722a is disposed on a common transmission shaft 71, and can be varied in length by connecting multiple cam rack components. Additionally, the pinion 722b is disposed on a sliding member 723 and is referred to as a roller pinion, such as... Figure 7 As shown, it includes: a pair of roller bodies 722b1 that rotate together with the rotating shaft of the motor; and a plurality of roller pins 722b2 that are equally spaced in the circumferential direction between the pair of roller bodies 722b1 and are arranged in a manner that allows them to roll relative to the roller bodies 722b1. The rack and pinion mechanism 722 of this embodiment uses the roller pinion, so that two or more roller pins 722b2 contact the cam rack 722a, and no backlash is generated in either direction, resulting in good positioning accuracy when the first holding mechanism 3 and the second holding mechanism 6 move in the X direction.

[0162] like Figure 5 and Figure 8 As shown, the lifting and moving mechanism 73 is respectively provided corresponding to the first holding mechanism 3 and the second holding mechanism 6. Figure 5 and Figure 6 As shown, the lifting and moving mechanism 73 of the first holding mechanism 3 is disposed between the transmission shaft 71 (specifically the main moving mechanism 72) and the first holding mechanism 3, and includes: a Z-direction guide rail 73a disposed along the Z-direction; and an actuator 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. Furthermore, the actuator 73b may be, for example, a ball screw mechanism, a cylinder, or a linear motor. Additionally, as... Figure 8 As shown, the structure of the lifting and moving mechanism 73 of the second holding mechanism 6 is the same as that of the lifting and moving mechanism 73 of the first holding mechanism 3.

[0163] like Figure 5 , Figure 6 and Figure 8 As shown, the horizontal moving mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively. Figure 5 and Figure 6 As shown, the horizontal movement mechanism 74 of the first holding mechanism 3 is disposed between the transmission shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, and includes: a Y-direction guide rail 74a disposed along the Y-direction; an elastic body 74b that applies force to one side of the first holding mechanism 3 toward the Y-direction guide rail 74a; and a cam mechanism 74c that moves the first holding mechanism 3 toward the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and by using an actuator such as a motor to rotate the eccentric cam, the amount of movement of the first holding mechanism 3 in the Y-direction can be adjusted.

[0164] In addition, such as Figure 8 As shown, the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the lifting movement mechanism 73 of the first holding mechanism 3. Alternatively, it can be configured such that the second holding mechanism 6 does not have a horizontal movement mechanism 74, or that neither the first holding mechanism 3 nor the second holding mechanism 6 has a horizontal movement mechanism 74. Furthermore, similar to the lifting movement mechanism 73, the horizontal movement mechanism 74 can be made without a cam mechanism 74c, or it can use, for example, a ball screw mechanism, a cylinder, or a linear motor.

[0165] <Cutting moving mechanism (processing moving mechanism)>

[0166] The cutting moving mechanism 8 causes the two spindle parts 42A and 42B to move linearly in the X, Y and Z directions, respectively.

[0167] Specifically, such as Figures 2-4 As shown, the cutting moving mechanism 8 includes: an X-direction moving part 81 that moves the spindle parts 42A and 42B linearly in the X direction; a Y-direction moving part 82 that moves the spindle parts 42A and 42B linearly in the Y direction; and a Z-direction moving part 83 that moves the spindle parts 42A and 42B linearly in the Z direction.

[0168] The X-direction moving part 81 is shared by two cutting stations 2A and 2B, especially as Figure 2 and Figure 3As shown, the device includes: a pair of X-direction guide rails 811 that clamp two cutting tables 2A and 2B along the X-direction; and a support body 812 that moves along the pair of X-direction guide rails 811 and supports spindle portions 42A and 42B via a Y-direction moving portion 82 and a Z-direction moving portion 83. The pair of X-direction guide rails 811 are located to the sides of the two cutting tables 2A and 2B that are arranged along the X-direction. Furthermore, the support body 812 is, for example, gate-shaped, having a shape extending along the Y-direction. Specifically, the support body 812 has a pair of legs extending upward from the pair of X-direction guide rails 811, and a beam portion (crossbeam portion) supported on the pair of legs, the beam portion extending along the Y-direction.

[0169] Furthermore, the support 812 can move linearly along the X direction on a pair of X-direction guide rails 811, for example, via a ball screw mechanism 813 extending along the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 812 can also be configured to move linearly via other linear mechanisms such as a linear motor.

[0170] Especially Figure 3 As shown, the Y-direction moving part 82 includes: a Y-direction guide rail 821, which is disposed in the support body 812 along the Y-direction; and a Y-direction slider 822, which moves along the Y-direction guide rail 821. The Y-direction slider 822 is driven, for example, by a linear motor 823, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle parts 42A and 42B. Thus, the two spindle parts 42A and 42B can move independently in the Y-direction. Alternatively, the Y-direction slider 822 can also be configured to move back and forth using other linear mechanisms using ball screw mechanisms.

[0171] like Figures 2-4 As shown, the Z-direction moving part 83 includes: a Z-direction guide rail 831, which is arranged along the Z-direction in each Y-direction slider 822; and a Z-direction slider 832, which moves along the Z-direction guide rail 831 and supports the spindle portions 42A and 42B. That is, the Z-direction moving part 83 is arranged corresponding to each spindle portion 42A and 42B. The Z-direction slider 832 is driven, for example, by an eccentric cam mechanism (not shown), and moves linearly back and forth on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 can also be configured to move back and forth by other linear mechanisms such as a ball screw mechanism.

[0172] Regarding the positional relationship between the cutting moving mechanism 8 and the transmission shaft 71, as follows: Figure 1 and Figure 4As shown, the transmission shaft 71 is arranged to pass through the cutting moving mechanism 8 above it. Specifically, the transmission shaft 71 is arranged to pass through the support body 812 above it, and the transmission shaft 71 and the support body 812 are in a mutually intersecting positional relationship.

[0173] <Processing chip receiving section 17>

[0174] In addition, such as Figure 1 As shown, the cutting device 100 of this embodiment also includes a chip collection section 17, which collects the chip S, such as end material, generated by the cutting of the sealed substrate W.

[0175] like Figures 2-4 As shown, the chip collection section 17 is located below the cutting tables 2A and 2B, and includes: a guide chute 171 with an upper opening 171X that surrounds the cutting tables 2A and 2B in plan view; and a recovery container 172 for recovering the chip S guided by the guide chute 171. By placing the chip collection section 17 below the cutting tables 2A and 2B, the recovery rate of the chip S can be improved.

[0176] The guide chute 171 guides the machining chips S scattered or falling from the cutting table 2A and cutting table 2B to the recovery container 172. In this embodiment, the guide chute 171 is configured such that the upper opening 171X surrounds the cutting table 2A and cutting table 2B (see reference). Figure 3 Therefore, it is less likely to miss machining chips S, which can further improve the recovery rate of machining chips S. In addition, the guide chute 171 is provided in such a way that it surrounds the rotating mechanism 9A and rotating mechanism 9B located below the cutting table 2A and the cutting table 2B (see reference). Figure 4 It is configured to protect the rotating mechanism 9A and rotating mechanism 9B from machining chips S and cutting water.

[0177] In this embodiment, the chip receiving section 17 is shared by the two cutting tables 2A and 2B, but it can also be provided corresponding to the cutting tables 2A and 2B respectively.

[0178] The recycling container 172 collects the machining chips S that pass through the guide chute 171 due to their own weight. In this embodiment, for example... Figure 4As shown, the two cutting tables 2A and 2B are respectively provided. Furthermore, two recovery containers 172 are positioned near the front of the transfer shaft, configured to be independently detachable from the front of the cutting device 100. This structure improves maintainability regarding the disposal of processing chips S. Moreover, the recovery containers 172 can be provided as a single unit under all cutting tables, taking into account factors such as the size of the sealed substrate W, the size and quantity of processing chips S, and workability; or they can be provided in three or more units.

[0179] In addition, such as Figure 4 As shown, the machining chip receiving section 17 has a separation section 173 that separates the cutting water from the machining chips. As a structure for the separation section 173, it is conceivable, for example, to provide a filter such as a perforated plate through which the cutting water passes on the bottom surface of the recovery container 172. Through the separation section 173, the machining chips S can be recovered without accumulating cutting water in the recovery container 172.

[0180] <First Cleaning Agency 18>

[0181] In addition, such as Figure 1 and Figure 5 As shown, the cutting device 100 of this embodiment further includes a first cleaning mechanism 18, which cleans the upper surface (encapsulation surface) of a plurality of products P held on the cutting table 2A and the cutting table 2B. The first cleaning mechanism 18 uses a spray nozzle 18a (see reference) to spray cleaning liquid and / or compressed air onto the upper surface of the plurality of products P held on the cutting table 2A and the cutting table 2B. Figure 5 ), to clean the upper surface (encapsulation surface) of product P.

[0182] like Figure 5 As shown, the first cleaning mechanism 18 is configured to move along the transmission shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is mounted on a sliding member 723, which slides on a guide rail 721 provided on the transmission shaft 71. Here, a lifting and moving mechanism 181 is provided between the first cleaning mechanism 18 and the sliding member 723 to allow the first cleaning mechanism 18 to move vertically in the Z direction. For example, a rack and pinion mechanism, a ball screw mechanism, or a cylinder can be used for the lifting and moving mechanism 181.

[0183] <Second Cleaning Agency 19>

[0184] Furthermore, such as Figure 1As shown, the cutting device 100 of the present invention further includes a second cleaning mechanism 19, which cleans the lower surface (marking surface) of the plurality of products P held in the second holding mechanism 6. The second cleaning mechanism 19 is disposed between the cutting table 2B and the inspection section 13, and cleans the lower surface (marking surface) of the products P by spraying cleaning fluid and / or compressed air onto the lower surface of the plurality of products P held in the second holding mechanism 6. That is, the second cleaning mechanism 19 cleans the lower surface (marking surface) of the products P midway along the transfer shaft 71 of the second holding mechanism 6.

[0185] <An example of the operation of the cutting device 100>

[0186] Next, an example of the operation of the cutting device 100 will be described. Figure 9 In the diagram, the movement paths of the first holding mechanism 3 and the second holding mechanism 6 are indicated during the operation of the cutting device 10. Furthermore, in this embodiment, all operations or controls of the cutting device 100, such as the transport of the sealed substrate W, the cutting of the sealed substrate W, the inspection of the product P, and the replacement of the holding plate M1 (described later), are controlled by the control unit CTL (see reference ). Figure 1 )conduct.

[0187] The substrate supply section 11b of the substrate supply mechanism 11 moves the sealed substrate W housed in the substrate housing section 11a toward the holding position RP held by the first holding mechanism 3.

[0188] Subsequently, the transport mechanism 7 moves the first holding mechanism 3 to the holding position RP, whereby the first holding mechanism 3 holds the sealed substrate W. Afterward, the transport mechanism 7 moves the first holding mechanism 3, holding the sealed substrate W, to the cutting tables 2A and 2B, whereby the first holding mechanism 3 releases its hold, and the sealed substrate W is placed on the cutting tables 2A and 2B. At this time, the position of the sealed substrate W in the X direction is adjusted by the main moving mechanism 72, and the position of the sealed substrate W in the Y direction is adjusted by the horizontal moving mechanism 74. Furthermore, the cutting tables 2A and 2B hold the sealed substrate W.

[0189] Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, the lifting and moving mechanism 73 raises the first holding mechanism 3 to a position where it does not physically interfere with the cutting moving mechanism 8 (support 812). Furthermore, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, and the support 812 is retracted from the cutting stage 2B towards the transfer stage 5, it is not necessary to raise and lower the first holding mechanism 3 as described above.

[0190] In the stated state, the cutting moving mechanism 8 moves the two spindle portions 42A and 42B sequentially in the X and Y directions, and the cutting stage 2A and cutting stage 2B rotate, thereby cutting the sealed substrate W into a grid shape and making it monolithic.

[0191] After cutting, the conveying mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface (encapsulation surface) of the multiple products P held on the cutting table 2A and the cutting table 2B. After cleaning, the conveying mechanism 7 moves the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.

[0192] Subsequently, the conveying mechanism 7 moves the second holding mechanism 6 to the cutting table 2A and cutting table 2B after cutting, where the second holding mechanism 6 holds multiple products P. Then, the conveying mechanism 7 moves the second holding mechanism 6, holding the multiple products P, to the second cleaning mechanism 19. Thereby, the second cleaning mechanism 19 cleans the lower surface (marking surface) of the multiple products P held in the second holding mechanism 6.

[0193] After cleaning, the multiple products P held in the second holding mechanism 6 are inspected on their lower surface (marking surface) by the inspection unit 131, and then transferred to the reversing mechanism 14, where the marking surface is held and the product is reversed. After reversal, the reversing mechanism 14 moves, and the inspection unit 132 inspects the packaging surface of the product P. After this two-sided inspection, the product P is transferred from the reversing mechanism 14 to the transfer table 5. The multiple products P placed on the transfer table 5 are classified into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) obtained by the inspection unit 13.

[0194] <Maintain the automatic replacement function of board M1>

[0195] Furthermore, the cutting device 100 of this embodiment has the function of automatically replacing the holding plate M1 used to hold the sealed substrate W or product P.

[0196] In this embodiment, such as Figure 10 As shown, the cutting table 2A and 2B for cutting the sealed substrate W, the inspection table (holding table 141) for inspecting the product P, the transfer table 5 for placing the product P before sorting, and the conveying holding mechanism (second holding mechanism 6) for holding the product P for transporting it have: a replaceable holding plate M1; and a holding base M2, on which the holding plate M1 is detachably mounted, using the holding plate M1 to hold the sealed substrate W or the product P. Furthermore, Figure 10 In the example shown, the holding plate M1 and the holding base M2 of the cutting table 2A and the cutting table 2B are representative, but the holding table 141, the transfer table 5 and the second holding mechanism 6 also have the same structure with the holding plate M1 and the holding base M2.

[0197] Specifically, such as Figure 1 and Figure 11 As shown, the cutting device 100 includes: a plate receiving section 24 for receiving and holding a plate M1; and a plate conveying mechanism 25 for conveying the plate M1 between the plate receiving section 24 and the holding base M2.

[0198] The retaining plate M1 has an adsorption portion (adsorption hole), not shown, for adsorbing the sealed substrate W or product P. By being mounted on the retaining base M2, the sealed substrate W or product P is adsorbed via the adsorption flow path M21 provided in the retaining base M2 (see reference). Figure 10 Furthermore, regarding the holding plate M1, the shape and structure of the adsorption portion of the holding plate M1 used in cutting tables 2A and 2B, the holding plate M1 used in holding table 141, the holding plate M1 used in transfer table 5, and the holding plate M1 used in the second holding mechanism 6 may differ. Alternatively, the shape and structure of the adsorption portion of the holding plate M1 may be common and identical. Moreover, the various holding plates M1 differ in shape and structure of the adsorption portion depending on whether the substrate W or the product P is sealed, and are selected according to the sealed substrate W or the product P.

[0199] In addition, such as Figure 10 As shown, the cutting device 100 is provided with a fixing mechanism 26, which is configured to allow the retaining plate M1 to be attached and detached from the retaining base M2. Specifically, the fixing mechanism 26 has: a fixing insertion hole 261 formed in the retaining plate M1; and a fixing cylindrical portion 262 provided in the retaining base M2, which is inserted into the fixing insertion hole 261 formed in the retaining plate M1.

[0200] The fixed cylindrical part 262 is called a chuck cylinder, such as... Figure 12 As shown, it includes: a cylindrical body 262a, inserted into a fixing insertion hole 261; a spherical movable member 262b, movable to a position protruding from the outer circumferential surface of the cylindrical body 262a and a position submerged; and an elastic body 262c, which applies force to the movable member 262b in a position protruding relative to the cylindrical body 262a, so that the movable member 262b is in the protruding position by supplying compressed air ( Figure 12 (a) and the submerged position ( Figure 12 (b)) The switching method constitutes the process.

[0201] Furthermore, the fixing cylindrical portion 262 has a piston portion 262d. The piston portion 262d is located inside the cylindrical body 262a, between the movable member 262b and the elastic body 262c, and moves inside the cylindrical body 262a by compressed air, thereby switching the movable member 262b between a protruding position and a submerged position. When compressed air is supplied, the piston portion 262d moves inside the cylindrical body 262a against the force borne by the elastic body 262c, causing the movable member 262b to move to the submerged position. Figure 12 If the supply of compressed air is stopped, the movable member 262b moves to the protruding position due to the force borne by the self-elastic body 262c moving inside the cylindrical body 262a. Figure 12 (a)

[0202] In addition, such as Figure 12 As shown, the fixing insertion hole 261 formed in the retaining plate M1 has a protrusion 261a that, when the retaining cylindrical portion 262 is inserted and the movable member 262b is in a protruding position, locks the movable member 262b, preventing the retaining cylindrical portion 262 from falling off. The protrusion 261a locks the movable member 262b in the protruding position but does not lock the movable member 262b in the submerged position. Therefore, by setting the movable member 262b in the protruding position while the retaining cylindrical portion 262 is inserted into the fixing insertion hole 261, the retaining plate M1 (see reference) is fixed to the retaining base M2. Figure 12 (a)). On the other hand, by setting the movable member 262b to the recessed position with the fixing cylindrical part 262 inserted into the fixing insertion hole 261, the fixing of the retaining plate M1 to the retaining base M2 is released (see reference). Figure 12 (b)

[0203] Plate housing section 24 houses the retaining plate M1 before and after replacement (before and after use), such as Figure 11 As shown, a sliding frame portion 241 is provided for holding each retaining plate M1. In this embodiment, the upper multi-segment sliding frame portion 241 is used to hold a new retaining plate M1 before replacement, and the lower multi-segment sliding frame portion 241 is used to hold an old retaining plate M1 after replacement. The plate receiving portion 24 slides the target sliding frame portion 241 forward using a plate conveying mechanism 25, thereby placing an old retaining plate M1 after use on the sliding frame portion 241 or removing a new retaining plate M1 before use. Furthermore, a protrusion 241a is provided at the front of the sliding frame portion 241 for extraction.

[0204] The plate conveying mechanism 25 conveys the retaining plate M1, which has been removed from the retaining base M2, to the plate receiving section 24, and then conveys the retaining plate M1 located in the plate receiving section 24 back to the retaining base M2. Furthermore, the plate conveying mechanism 25 can raise the retaining plate M1 during conveying. More specifically, the plate conveying mechanism 25 can convey the retaining plate M1 horizontally from a raised position, where it is held from above and raised. Here, "raised position" refers to a position where the retaining plate M1 is raised further than its position on the retaining base M2 of the replacement object, or the lowest position of the retaining plate M1 that can be taken during conveying.

[0205] Specifically, such as Figure 1 As shown, the plate conveying mechanism 25 includes: a first conveying mechanism 25a, which conveys the holding plate M1 between the plate receiving section 24 and the temporary placement section 27; and a second conveying mechanism 25b, which conveys the holding plate M1 between the temporary placement section 27 and the holding base M2. In this embodiment, the temporary placement section 27 is the holding table 141 of the reversing mechanism 14. Alternatively, the transfer table 5 may be provided as the temporary placement section 27, or the temporary placement section 27 may be provided separately from the holding table 141 and the transfer table 5.

[0206] The first conveying mechanism 25a is configured using a pallet conveying mechanism 22, and can convey pallets 21 that classify the processed workpieces W (products P). The second conveying mechanism 25b is configured using a second holding mechanism 6 and a conveying moving mechanism 7 (workpiece conveying mechanism), and can convey the workpieces W. That is, the plate conveying mechanisms 25 (first conveying mechanism 25a and second conveying mechanism 25b) are configured to move in the X direction via the common transfer shaft 71. In addition, the plate conveying mechanisms 25 are located on the same side (near the front side) relative to the transfer shaft 71 in planar view.

[0207] Here, in the pallet conveying mechanism 22 that becomes the first conveying mechanism 25a, such as Figure 11 As shown, the pallet holding mechanism 221 for holding the pallet 21 includes a pallet holding part 221a, such as a holding claw, for holding the pallet 21, and a plate holding part 221b, such as a holding claw, for holding the plate M1. Here, the pallet holding part 221a is provided on a pair of opposing sides, and the plate holding part 221b is provided on a pair of opposing sides opposite to it. In addition, the plate holding part 221b may also be configured to use the clamp structure described above. The pallet conveying mechanism 22 is configured to allow the plate holding part 221b to be raised and lowered, and can convey the plate M1 in a raised position with the plate holding part 221b holding the plate M1 raised.

[0208] In addition, the pallet conveying mechanism 22 has the same structure as the conveying moving mechanism 7 of the first holding mechanism 3 and the second holding mechanism 6. That is, as Figure 11 As shown, the pallet conveying mechanism 22 includes: a main moving mechanism 72 that moves the pallet holding mechanism 221 along the transfer shaft 71 in the X direction; a lifting moving mechanism 75 that moves the pallet holding mechanism 221 up and down relative to the transfer shaft 71 in the Z direction; and a horizontal moving mechanism 76 that moves the pallet holding mechanism 221 horizontally relative to the transfer shaft 71 in the Y direction. Furthermore, the lifting moving mechanism 75 and the horizontal moving mechanism 76 are configured, for example, to reciprocate using a linear mechanism such as a rack and pinion mechanism, a ball screw mechanism, a linear motor mechanism, or a cylinder mechanism.

[0209] In addition, such as Figure 13 As shown, the second holding mechanism 6, which becomes the second conveying mechanism 25b, has: a conveying cylindrical portion 282, which is inserted into a conveying holding hole 281 formed in the holding plate M1 (see reference). Figure 10 In this embodiment, the conveying cylindrical portion 282 is constructed using the fixing cylindrical portion 262 of the holding base M2 of the second holding mechanism 6. The conveying holding hole 281 has the same structure as the fixing insertion hole 261 of the fixing mechanism 26 described above. Furthermore, the conveying holding hole 281 and the fixing insertion hole 261 have an up-down opposite structure. In addition, the second holding mechanism 6 may replace the conveying cylindrical portion 282 with a holding claw that holds the edge of the holding plate M1. The second holding mechanism 6 is configured such that the portion holding the holding plate M1 can be raised and lowered, and the holding plate M1 can be conveyed in a raised position with the portion holding the holding plate M1 raised.

[0210] <Inspection mechanism 29 for retaining plate M1>

[0211] like Figure 10 and Figure 13 As shown, the cutting device 100 of this embodiment also includes an inspection mechanism 29 for inspecting the installation status of the holding plate M1 on the holding base M2.

[0212] The inspection mechanism 29 includes: an inspection flow path 29a with an opening in the mounting surface M22 on which the retaining plate M1 is mounted; and a detection sensor (not shown) provided in the inspection flow path 29a to detect fluid leakage from the opening. The inspection flow path 29a has an opening formed in the mounting surface M22 of the retaining base M2 and is supplied with compressed air. Furthermore, the detection sensor detects compressed air leakage from the opening by detecting the pressure or flow rate of the compressed air flowing in the inspection flow path 29a. The inspection mechanism 29 determines whether the retaining plate M1 is tightly fixed to the mounting surface M22 of the retaining base M2. If, according to the inspection mechanism 29, the retaining plate M1 is not tightly fixed to the mounting surface M22 of the retaining base M2, the fixing mechanism 26 can be used to release the fixation and reinstall the retaining plate M1.

[0213] <Maintaining the replacement operation of board M1>

[0214] Then, referring to Figure 14 and Figure 15 The replacement operation of the holding plate M1 performed by the plate conveying mechanism 25 in this embodiment will be explained.

[0215] Furthermore, in the following replacement operation, the identification of the holding plate M1 when it is taken out from the plate receiving section 24 is performed by reading the radio frequency identification (RFID) identifier on the holding plate M1 by using an identifier reader (not shown) provided on the first conveying mechanism 25a (pallet conveying mechanism 22).

[0216] (1) The replacement operation of the holding plates of transfer table 5 and holding table 141 (refer to) Figure 14 )

[0217] The holding plate M1 of the holding platform 141 is removed, and the holding plate M1 is raised by the first conveying mechanism 25a (pallet conveying mechanism 22), and then conveyed to the plate receiving part 24 in the raised position. In addition, when the holding plate M1 of the holding platform 141 is removed, compressed air is supplied to the fixing cylindrical part 262 to set the movable part 262b to the submerged position, and the fixing mechanism 26 is released.

[0218] Subsequently, the first conveying mechanism 25a (pallet conveying mechanism 22) takes out a new holding plate M1 from the holding table 141 from the plate receiving part 24, and conveys it to the holding base M2 of the holding table 141 in the raised position, causing the holding plate M1 to descend and be placed. In this state, if compressed air is supplied to the fixing cylinder part 262 and the movable member 262b is set to the submerged position, the holding plate M1 descends, the fixing cylinder part 262 enters the fixing insertion hole 261 of the holding plate M1, and then if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the holding table 141.

[0219] Additionally, the holding plate M1 of the transfer platform 5 is removed, and the holding plate M1 is raised by the first conveying mechanism 25a (pallet conveying mechanism 22), and then conveyed to the plate receiving section 24 in the raised position. Furthermore, when removing the holding plate M1 of the transfer platform 5, compressed air is supplied to the fixing cylindrical section 262 to set the movable member 262b to the submerged position, thereby releasing the fixation of the fixing mechanism 26.

[0220] Subsequently, the first conveying mechanism 25a (pallet conveying mechanism 22) takes out a new holding plate M1 from the plate receiving section 24 and conveys it to the holding base M2 of the transfer platform 5 in the raised position, causing the holding plate M1 to descend and be placed. In this state, if compressed air is supplied to the fixing cylinder section 262 and the movable member 262b is set to the submerged position, the holding plate M1 descends, the fixing cylinder section 262 enters the fixing insertion hole 261 of the holding plate M1, and then if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the transfer platform 5.

[0221] Furthermore, the order of replacing the holding plate M1 of the holding platform 141 and the holding plate M1 of the transfer platform 5 is not limited to that described above. It can also be the opposite. Alternatively, after removing the holding plates M1 of the holding platform 141 and the transfer platform 5, new holding plates M1 can be installed on the holding platform 141 and the transfer platform 5 respectively.

[0222] (2) The replacement operation of the holding plate of the cutting table 2A, the cutting table 2B and the second holding mechanism 6 (refer to) Figure 15 )

[0223] The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are raised by the second conveying mechanism 25b (the conveying moving mechanism 7 and the second holding mechanism 6). While in the raised position, the plates are conveyed to the holding table 141, which serves as the temporary placement section 27, where they are lowered and placed. Furthermore, when removing the holding plates M1 of the cutting tables 2A and 2B, compressed air is supplied to the fixing cylindrical section 262 to place the movable member 262b in the submerged position, releasing the fixing mechanism 26. Here, when the holding table 141 is used as the temporary placement section 27, it is preferable to remove the holding table 141 beforehand.

[0224] In addition, the first conveying mechanism 25a (pallet conveying mechanism 22) conveys the plate to the plate receiving section 24 in a raised position, while the holding plate M1 of the cutting table 2A and the cutting table 2B placed on the holding table 141 is raised, so that the holding plate M1 is lowered and received.

[0225] Subsequently, the first conveying mechanism 25a (pallet conveying mechanism 22) takes out the new holding plate M1 from the cutting table 2A and the cutting table 2B from the plate receiving section 24, and conveys it to the holding table 141, which serves as the temporary placement section 27, while it is in the raised position, so that the holding plate M1 is lowered and placed.

[0226] Subsequently, the second conveying mechanism 25b (conveyor moving mechanism 7 and second holding mechanism 6) conveys the new holding plate M1 placed on the holding table 141 to the holding base M2 of the cutting table 2A and the cutting table 2B in the raised position, causing the holding plate M1 to descend and be placed. In this state, if compressed air is supplied to the fixing cylinder 262 and the movable member 262b is set to the submerged position, the fixing cylinder 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the cutting table 2A and the cutting table 2B.

[0227] When replacing the retaining plate M1 of the second retaining mechanism 6, the second retaining mechanism 6 is moved to the retaining platform 141, which serves as a temporary placement section 27, by the conveying moving mechanism 7, and the retaining plate M1 is lowered and removed, and placed on the retaining platform 141, which serves as a temporary placement section 27. Furthermore, when removing the retaining plate M1 of the second retaining mechanism 6, compressed air is supplied to the fixing cylindrical section 262 to set the movable member 262b to the submerged position, releasing the fixation of the fixing mechanism 26.

[0228] Subsequently, the first conveying mechanism 25a (pallet conveying mechanism 22) raises the holding plate M1 of the second holding mechanism 6 placed on the holding table 141, and conveys it to the plate receiving section 24 in the raised position, so that the holding plate M1 is lowered and received. Here, when the holding table 141 is set as the temporary placement section 27, it is preferable to remove the holding plate M1 of the holding table 141 in advance.

[0229] Subsequently, the first conveying mechanism 25a (pallet conveying mechanism 22) takes out the new holding plate M1 of the second holding mechanism 6 from the plate receiving section 24, and conveys it to the holding table 141, which serves as a temporary placement section 27, in the raised position, so that the holding plate M1 is lowered and placed.

[0230] Subsequently, the second holding mechanism 6 is moved to the holding platform 141 by the conveying moving mechanism 7, causing the holding base M2 to descend and a new holding plate M1 placed on the holding platform 141 to be installed. Here, the fixing cylindrical portion 262 of the holding base M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the conveying moving mechanism 7. In this state, if compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262b is set to the submerged position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the second holding mechanism 6.

[0231] Furthermore, when replacing the holding plate M1 of the cutting table 2A and the cutting table 2B, it is preferable to remove the holding plate M1, which will become the holding mechanism 6 of the second conveying mechanism 25b, in advance.

[0232] Alternatively, the replacement of the transfer table 5, holding table 141, cutting table 2A, cutting table 2B, and the holding plate M1 of the second holding mechanism 6 can be performed as a series of actions. For example, it is conceivable to sequentially remove the holding plates M1 of the transfer table 5, holding table 141, second holding mechanism 6, and cutting table 2A and cutting table 2B, and then sequentially install the holding plates M1 of the cutting table 2A, cutting table 2B, second holding mechanism 6, holding table 141, and transfer table 5.

[0233] <Effects of this implementation method>

[0234] The cutting device 100 according to this embodiment includes a plate conveying mechanism 25 that conveys the retaining plate M1, which has been removed from the retaining base M2, to the plate receiving section 24 and then conveys the retaining plate M1 located in the plate receiving section 24 to the retaining base M2. Therefore, the retaining plate M1 can be automatically replaced on the retaining base M2. As a result, the labor costs for replacing the retaining plate M1 can be reduced. Furthermore, because the retaining plate M1 is automatically replaced, the replacement time of the retaining plate M1 can be shortened, improving the productivity of the cutting device 100. Moreover, the unevenness of the installation state of the retaining plate M1 on the retaining base M2 can be reduced.

[0235] Furthermore, the plate conveying mechanism 25 includes a first conveying mechanism 25a that conveys the holding plate M1 between the plate receiving section 24 and the temporary placement section 27; and a second conveying mechanism 25b that conveys the holding plate M1 between the temporary placement section 27 and the holding base M2. Therefore, compared to using a single conveying mechanism to construct the plate conveying mechanism 25, the degree of freedom in determining the destination of the holding plate M1 can be increased. Here, the first conveying mechanism 25a is constructed using a pallet conveying mechanism 22, thus simplifying the device structure and reducing device costs. Furthermore, the second conveying mechanism 25b is constructed using a second holding mechanism 6 and a conveying moving mechanism 7, thus simplifying the device structure and reducing device costs.

[0236] In addition, in this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting table 2A, the cutting table 2B, and the transfer table 5. The cutting mechanism 4 is moved horizontally in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction by the cutting moving mechanism 8. Therefore, the sealed substrate W can be processed without moving the cutting table 2A and the cutting table 2B in the X and Y directions. Thus, the cutting table 2A and the cutting table 2B can be moved without the ball screw mechanism, and the pleated member for protecting the ball screw mechanism and the cover member for protecting the pleated member are unnecessary. As a result, the device structure of the cutting device 100 can be simplified. Furthermore, by providing a structure that prevents the cutting table 2A and the cutting table 2B from moving in the X and Y directions, the area occupied by the cutting device 100 can be reduced.

[0237] <Modifications of the First Embodiment>

[0238] For example, in the first embodiment, the structure is to automatically change the holding plate M1 of each of the cutting table 2A, cutting table 2B, inspection table (holding table 141), transfer table 5 and conveying holding mechanism (second holding mechanism 6). However, it can also be configured to automatically change at least one of the cutting table 2A, cutting table 2B, inspection table (holding table 141), transfer table 5 and conveying holding mechanism (second holding mechanism 6).

[0239] The plate conveying mechanism 25 of the first embodiment has a structure having a first conveying mechanism 25a and a second conveying mechanism 25b, but it can also be configured to have a single conveying mechanism. In addition, the plate conveying mechanism 25 can also be configured to not use the pallet conveying mechanism 22, or it can be configured to not use the second holding mechanism 6 and the conveying moving mechanism 7 (processing object conveying mechanism).

[0240] As an example of a structure where the pallet conveying mechanism 25 does not use a pallet conveying mechanism, one could conceive of, for example... Figure 16 The structure shown is as follows. The cutting device 100 does not have a pallet conveying mechanism 22, and is configured such that various pallets 21 move below the board receiving section 24 via a pallet moving mechanism TM, thereby moving to a sorting position where the product P is sorted by the sorting mechanism 20. Furthermore, the pallet moving mechanism TM includes: a conveying track TM1 extending along the Y direction; a moving mechanism (not shown) that moves the pallets 21 on the conveying track TM1; a moving mechanism TM2 that moves various pallets 21 in the X direction; and a moving mechanism TM3, provided for each type of pallet 21, that moves each type of pallet 21 in the Z direction. In the cutting device 100, the board conveying mechanism 25 can be configured using a second holding mechanism 6 and a conveying moving mechanism 7.

[0241] In addition, the plate receiving section 24 of the first embodiment receives the holding plates M1 of the cutting table 2A, the cutting table 2B, the inspection table (holding table 141), the transfer table 5 and the conveying holding mechanism (second holding mechanism 6), but it may also be configured to provide multiple dedicated plate receiving sections 24 according to the type of holding plate M1.

[0242] In addition, the transfer table 5 in the first embodiment is an index table temporarily placed before being sorted to various trays 21, but the transfer table 5 may also be set as the holding table 141 of the reversing mechanism 14.

[0243] Furthermore, in the structure of the first embodiment, it is also possible to configure the structure such that the sealed substrate is not cut in the cutting table 2A and the cutting table 2B, but instead a groove is formed. In this case, for example, it is also possible to configure the structure such that the sealed substrate W, after the groove processing is performed in the cutting table 2A and the cutting table 2B, returns to the substrate supply section 11b via the first holding mechanism 3 and the conveying moving mechanism 7. Alternatively, it is also possible to configure the structure such that the sealed substrate W that has returned to the substrate supply section 11b is housed in the substrate receiving section 11a.

[0244] <Second Embodiment of the Invention>

[0245] Next, the second embodiment of the present invention will be described.

[0246] The cutting device 100 of the second embodiment differs from the tray storage of the first embodiment in that it is configured to attach and store multiple articles P to an attachment member 101 having an adhesive surface 101x (also referred to as "chain storage").

[0247] Specifically, such as Figure 17 As shown, the cutting device 100 includes: two cutting tables (processing tables) 2A and 2B for holding a sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W to transfer it to the cutting tables 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B; a transfer table 5 for moving a plurality of products P; a second holding mechanism 6 for holding the plurality of products P to transfer them from the cutting tables 2A and 2B to the transfer table 5; a transfer moving mechanism 7 having a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting moving mechanism (processing moving mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B.

[0248] The following mainly describes the structure that differs from the first embodiment.

[0249] In the second embodiment, the transfer stage 5 temporarily holds multiple products P before attaching them to the attachment member 101 described later. Additionally, as... Figure 17 and Figure 18 As shown, the transfer table 5 is movably arranged along the Y direction, moving between a transfer position X1 where multiple products P are placed by the second holding mechanism 6, and a removal position X2 where multiple products P are transported by the attachment conveying mechanism 103. Furthermore, the transfer position X1 is set closer to the front than the transfer shaft 71, and is positioned in a row with the two cutting tables 2A and 2B along the X direction on a horizontal plane; the removal position X2 is set further inward than the transfer shaft 71.

[0250] Furthermore, in addition to the range where the first holding mechanism 3 can move above the substrate supply section 11b of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer stage 5, the transfer shaft 71 of the conveying mechanism 7 extends to the range where the attachment component conveying mechanism 107 (described later) can move between the attachment component conveying position X3 and the guide rail 108. Moreover, relative to the transfer shaft 71, the placement stage 102, the attachment component receiving section 106, and the attachment component conveying mechanism 107 (described later) are also located on the same side (near the front side).

[0251] <The specific structure of chain containment>

[0252] Then, as Figures 17-19 As shown, the cutting device 100 of the second embodiment includes: a mounting platform 102, a mounting attachment member 101 having an adhesive surface 101x for attaching a plurality of products P; and a mounting conveying mechanism 103 for conveying a plurality of products P from a transfer platform 5 to the mounting attachment member 101 mounted on the mounting platform 102.

[0253] In this embodiment, two mounting platforms 102 are provided along the X direction (see reference). Figure 17 Each mounting platform 102 has an attachment member 101 placed on it. Specifically, the two mounting platforms 102 are arranged such that their upper surfaces are on the same horizontal plane (at the same height in the Z direction).

[0254] In addition, such as Figure 17 and Figure 18 As shown, two mounting platforms 102 are movably arranged along the Y direction, moving between the attachment member transport position X3, where the attachment member 101 is transported by the attachment member transport mechanism 107, and the attachment position X4, where multiple articles P are transported by the attachment transport mechanism 103. The two mounting platforms 102 move independently between the attachment member transport position X3 and the attachment position X4. Furthermore, the attachment member transport position X3 is set closer to the front than the transfer axis 71, and the attachment position X4 is set further inward than the transfer axis 71. Additionally, the mounting platform 102 located at the attachment position X4 and the transfer platform 5 located at the removal position X2 are arranged along the X direction (see reference). Figure 17 ).

[0255] Here, as Figure 20 As shown, the attachment member 101 includes: a frame-shaped member 101a, which is, for example, circular or rectangular; and a resin sheet 101b having an adhesive surface 101x disposed on the inner side of the frame-shaped member 101a. The frame-shaped member 101a is made of metal, such as stainless steel. The resin sheet 101b includes, for example, a resin-made sheet substrate 101b1 and an adhesive layer 101b2 containing an adhesive coated on the upper surface of the sheet substrate 101b1. Furthermore, the upper surface of the adhesive layer 101b2 serves as the adhesive surface 101x.

[0256] The attachment conveying mechanism 103 transports multiple products P from the transfer table 5, which is moved to the take-out position X2, to the attachment component 101, which is moved to the attachment position X4.

[0257] Specifically, such as Figure 17 and Figure 18As shown, the attachment conveying mechanism 103 includes: a product adsorption mechanism 1031, which adsorbs multiple products P held on the transfer stage 5 in, for example, a row; and an adsorption moving mechanism 1032, which moves the product adsorption mechanism 1031 along the X direction. In this embodiment, there are two attachment conveying mechanisms 103, configured such that each attachment conveying mechanism 103 is driven independently of the others.

[0258] like Figure 19 As shown, the product adsorption mechanism 1031 includes: an adsorption head 1031A with multiple adsorption sections 1031a for adsorbing and holding multiple products P respectively; and a vacuum pump or vacuum ejector (not shown) connected to the adsorption sections 1031a of the adsorption head 1031A. The product adsorption mechanism 1031 is configured such that each adsorption section 1031a adsorbs one product P. Furthermore, the multiple adsorption sections 1031a are configured to move independently up and down, allowing each adsorption section 1031a to adsorb a product P separately as it descends.

[0259] like Figure 19 As shown, the adsorption moving mechanism 1032 includes: an X-direction moving part 1032a for moving the product adsorption mechanism 1031 in the X direction; and a Z-direction moving part 1032b for moving the product adsorption mechanism 1031 in the Z direction. Furthermore, the adsorption moving mechanism 1032 may also have a Y-direction moving part for moving the product adsorption mechanism 1031 in the Y direction.

[0260] The X-direction moving part 1032a includes: an X-direction guide rail 1032a1, disposed along the X-direction on the inner side of the transmission shaft 71; and a support body 1032a2, which moves along the X-direction guide rail 1032a1 and supports the product adsorption mechanism 1031 via the Z-direction moving part 1032b. Furthermore, the support body 1032a2 moves linearly back and forth along the X-direction guide rail 1032a1 on the X-direction guide rail 1032a1, for example, via a ball screw mechanism (not shown) extending along the X-direction. The ball screw mechanism is driven by a drive source (not shown) such as a servo motor. Alternatively, the support body 1032a2 may also be configured to move back and forth via other linear mechanisms such as a linear motor.

[0261] like Figure 19As shown, the Z-direction moving part 1032b includes: a Z-direction guide rail 1032b1, which is disposed in the support body 1032a2 along the Z-direction; and a Z-direction slider 1032b2, which moves along the Z-direction guide rail 1032b1 and supports the product adsorption mechanism 1031. Furthermore, the Z-direction slider 1032b2 moves linearly back and forth along the Z-direction guide rail 1032b1 in the Z-direction direction, for example, via a ball screw mechanism (not shown) extending in the Z-direction. Alternatively, the Z-direction slider 1032b2 can also be configured to move back and forth via other linear mechanisms such as a linear motor.

[0262] In addition, for the product P adsorbed and held on the attachment conveying mechanism 103, the first camera unit 201 (see reference) Figure 17 The position of the product P in the attachment conveying mechanism 103 is confirmed by the camera unit 201. The first camera unit 201 is a camera that captures images from below of the product adsorption mechanism 1031 of the attachment conveying mechanism 103, and captures the lower surface (marking surface) of the product P. In addition, the first camera unit 201 is provided so that it can move in the front-back direction (Y direction). Thus, it is configured in a way that the position of the product P adsorbed and held in the two attachment conveying mechanisms 103 can be confirmed.

[0263] Furthermore, in each attached conveyor mechanism 103, such as Figure 17 As shown, a second camera unit 202 is provided to confirm the position of the product P attached to the attachment member 101. The second camera unit 202 is a camera that takes pictures of the attachment member 101 located on the mounting platform 102 at the attachment position X4 from above, and captures the upper surface (adhesive surface 101x) of the attachment member 101. Furthermore, based on the image data obtained by the first camera unit 201 and the image data obtained by the second camera unit 202, the product P is aligned with the attachment member 101, and the attachment conveying mechanism 103 attaches the product P to the adhesive surface 101x of the attachment member 101. In addition, the alignment of the product P can be performed by the adsorption moving mechanism 1032 of the attachment conveying mechanism 103, or a rotating mechanism (not shown) provided in the attachment conveying mechanism 103, or a moving mechanism (not shown) provided in the mounting platform 102, or a rotating mechanism (not shown) provided in the mounting platform 102.

[0264] In addition, such as Figure 21 As shown, the cutting device 100 of this embodiment includes: an attachment member receiving section 106 for receiving an attachment member 101; and an attachment member conveying mechanism 107 for conveying the attachment member 101 between the platform 102 and the attachment member receiving section 106.

[0265] The attachment component receiving section 106 receives an empty attachment component 101 without the product P attached, and receives an attachment component 101 with the product P attached. The attachment component receiving section 106 is arranged in a row along the X direction with the mounting platform 102 located at the attachment component transport position X3 (see reference). Figure 17 ).

[0266] Additionally, at the opening of the attachment component receiving section 106, such as Figure 17 and Figure 21 As shown, a pair of guide rails 108 are provided for taking out or placing the attachment member 101 into the attachment member receiving portion 106. The pair of guide rails 108 support the attachment member 101 and are arranged in the X direction in front of the opening of the attachment member receiving portion 106.

[0267] The attachment component conveying mechanism 107 conveys the attachment component 101 between the mounting platform 102 located at the attachment component conveying position X3 and the attachment component receiving section 106. Specifically, as follows Figure 21 As shown, the attachment component conveying mechanism 107 includes: a third holding mechanism 1071, which adsorbs and holds the frame-shaped component 101a of the attachment component 101; and a moving mechanism 1072, which moves the third holding mechanism 1071 at least in the X and Z directions.

[0268] The third holding mechanism 1071 includes: an adsorption head 1071A with a plurality of adsorption portions 1071a for adsorbing and holding the attachment member 101; and a vacuum pump or vacuum ejector (not shown) connected to the adsorption portions 1071a of the adsorption head 1071A. Furthermore, the moving mechanism 1072 is configured using the main moving mechanism 72 of the conveying moving mechanism 7, and the third holding mechanism 1071 moves along a common transmission shaft 71. Moreover, the moving mechanism 1072 has a lifting moving mechanism 1072a similar to the lifting moving mechanism 73 of the conveying moving mechanism 7. Additionally, the moving mechanism 1072 may also have a Y-direction moving mechanism for moving the third holding mechanism 1071 in the Y-direction.

[0269] <An example of the operation of the cutting device 100>

[0270] Then, referring to Figure 9 , Figures 17-19 and Figure 21 An example of the operation of the cutting device 100 in the second embodiment will be described. In this embodiment, all operations or controls of the cutting device 100, such as the transport of the sealed substrate W, the cutting of the sealed substrate W, the inspection of the product P, the cleaning of the product P, and the continuous storage of the product P, are controlled by the control unit CTL (see reference). Figure 17 )conduct.

[0271] In the operation of the cutting device 100 of this embodiment, the operations up to the conveying of the sealed substrate W, the cutting of the sealed substrate W, the cleaning of the product P, and the inspection of the product P are the same as in the first embodiment (see reference). Figure 9 ).

[0272] Following a two-sided inspection, product P is transferred from the reversing mechanism 14 to the transfer table 5. The transfer table 5, which holds multiple products P, moves to the removal position X2 (see reference). Figure 17 , Figure 18 and Figure 19 ).

[0273] On the other hand, at the mounting platform 102 located at the mounting component transport position X3, an empty mounting component 101 is transported from the mounting component receiving section 106 by the mounting component transport mechanism 107. Then, the mounting platform 102 carrying the empty mounting component 101 moves to the mounting position X4 (see reference). Figure 18 and Figure 19 ).

[0274] In the stated state, such as Figure 19 As shown, the attachment conveying mechanism 103 picks up and holds the product P from the transfer stage 5 located at the take-out position X2. Then, it moves above the first camera unit 201. Here, the position of the product P in the attachment conveying mechanism 103 is confirmed by the first camera unit 201. Furthermore, the attachment conveying mechanism 103 is moved, and the position of the product P to be attached in the attachment member 101 on the mounting stage 102 located at the attachment position X4 is confirmed by the second camera unit 202. Then, the attachment conveying mechanism 103 attaches the held product P to the attachment member 101. This operation is repeated multiple times until a permissible number of products P that can be attached to the attachment member 101 are attached, or until all the products P located on the transfer stage 5 are attached.

[0275] Then, as Figure 18 and Figure 21 As shown, the mounting platform 102 moves to the attachment component transport position X3. Then, the attachment component transport mechanism 107 transports the attached component 101, which has been attached, from the mounting platform 102 to the attachment component receiving section 106. Specifically, the attachment component transport mechanism 107 places the attached component 101 onto a pair of guide rails 108 provided in the attachment component receiving section 106, and pushes the attached component 101 placed on the pair of guide rails 108, thereby receiving the attached component 101 in the attachment component receiving section 106.

[0276] Subsequently, when an empty attachment member 101 is removed from the attachment member receiving section 106, the attachment member conveying mechanism 107 extracts the attachment member 101 from the attachment member receiving section 106, places it on a pair of guide rails 108, holds the empty attachment member 101 placed on the pair of guide rails 108, and conveys it to the placement stage 102 located at the attachment member conveying position X3.

[0277] <Maintain the automatic replacement function of board M1>

[0278] Furthermore, the cutting device 100 of the second embodiment, like that of the first embodiment, has the function of automatically replacing the holding plate M1 used to hold the sealed substrate W or product P. In addition, in this embodiment, similar to the first embodiment, the cutting table 2A, cutting table 2B, holding table 141, transfer table 5, and second holding mechanism 6 all have the holding plate M1 and the holding base M2. Furthermore, the specific structures of the holding plate M1 and the holding base M2 are the same as in the first embodiment.

[0279] Specifically, such as Figure 17 and Figure 22 As shown, the cutting device 100 includes: a plate receiving portion 24 for receiving and holding a plate M1; and a plate conveying mechanism 25 for conveying the plate holding plate M1 between the plate receiving portion 24 and the holding base M2. Furthermore, the cutting device 100 in the second embodiment, like the first embodiment, is provided with a fixing mechanism 26 and an inspection mechanism 29.

[0280] The plate housing 24 in this embodiment has the same structure as in the first embodiment, but as... Figure 23 As shown, the board receiving portion 24 and the attachment member receiving portion 106 are arranged vertically relative to each other. In this embodiment, the board receiving portion 24 is located above the attachment member receiving portion 106. Furthermore, the board receiving portion 24 and the attachment member receiving portion 106 are configured to move vertically (Z-direction). Here, a lifting and moving portion 109 for moving the board receiving portion 24 vertically and a lifting and moving portion 110 for moving the attachment member receiving portion 106 vertically are provided, and the board receiving portion 24 and the attachment member receiving portion 106 are configured to move vertically and vertically independently. In addition, the lifting and moving portion 109 and the lifting and moving portion 110 can be, for example, a ball screw mechanism, a cylinder, or a linear motor. Alternatively, the board receiving portion 24 and the attachment member receiving portion 106 can also be configured to move vertically and vertically as a single unit using a shared lifting and moving mechanism.

[0281] When removing or inserting the attachment member 101 into the attachment member receiving section 106, such as Figure 23As shown in (a), the plate receiving part 24 is retracted upward by the lifting moving part 109, the attaching component receiving part 106 is positioned at the required height position H1 by the lifting moving part 110, and the attaching component 101 is taken out or put into the attaching component receiving part 106 by the attaching component conveying mechanism 107.

[0282] On the other hand, when the plate receiving section 24 is removed or the holding plate M1 is inserted, such as Figure 23 As shown in (b), the attachment component receiving section 106 retracts downward via the lifting and moving section 110, and the plate receiving section 24 is positioned at the desired height position H2 via the lifting and moving section 109. The plate conveying mechanism 25 takes out or puts in the holding plate M1 for the plate receiving section 24. Here, the height position H2 of the plate receiving section 24 is set to a higher position than the height position H1 of the attachment component receiving section 106, so that the attachment component conveying mechanism 107 does not interfere with the guide rail 108.

[0283] like Figure 17 As shown, the plate conveying mechanism 25 of this embodiment includes: a first conveying mechanism 25a, which conveys the holding plate M1 between the plate receiving portion 24 and the temporary placement portion 27; and a second conveying mechanism 25b, which conveys the holding plate M1 between the temporary placement portion 27 and the holding base M2. In this embodiment, the temporary placement portion 27 is the holding table 141 of the reversing mechanism 14. Alternatively, the transfer table 5 may be provided as the temporary placement portion 27, or the temporary placement portion 27 may be provided separately from the holding table 141 and the transfer table 5.

[0284] The first conveying mechanism 25a of the second embodiment differs from that of the first embodiment in that it is constructed using an attachment member conveying mechanism 107 (a third holding mechanism 1071 and a moving mechanism 1072). That is, the first conveying mechanism 25a of the second embodiment can convey the attachment member 101 for the workpiece W (product P) after attachment processing. The second conveying mechanism 25b, similar to that of the first embodiment, is constructed using a second holding mechanism 6 and a conveying moving mechanism 7, and can convey the workpiece W. That is, the plate conveying mechanism 25 (first conveying mechanism 25a and second conveying mechanism 25b) is configured to move in the X direction via the shared transfer shaft 71. Furthermore, the plate conveying mechanism 25 is positioned on the same side (near the front side) relative to the transfer shaft 71 in planar view.

[0285] Here, in the attachment component conveying mechanism 107, which becomes the first conveying mechanism 25a, such as Figure 21As shown, in addition to the multiple adsorption portions 1071a used to adsorb and hold the attachment member 101, there is also a conveying cylindrical portion 1071b using the clamp described above. The attachment member conveying mechanism 107 is configured such that the portion holding the holding plate M1 can be raised and lowered, and the holding plate M1 can be conveyed in a raised position with the portion holding the holding plate M1 raised.

[0286] <Maintaining the replacement operation of board M1>

[0287] Then, referring to Figure 24 and Figure 25 The replacement operation of the holding plate M1 performed by the plate conveying mechanism 25 in this embodiment will be explained.

[0288] Furthermore, in the following replacement operation, the identification of the holding plate M1 when it is removed from the plate receiving section 24 is performed by reading the RFID or other identifier provided on the holding plate M1 using an identifier reader (not shown) provided on the first conveying mechanism 25a (plate conveying mechanism 25). Additionally, in the replacement operation, as... Figure 23 As shown in (b), the attachment component receiving part 106 is retracted downward by the lifting moving part 110, the plate receiving part 24 is positioned at the required height position H2 by the lifting moving part 109, and the plate carrying mechanism 25 takes out or puts in the holding plate M1 for the plate receiving part 24.

[0289] (1) The replacement operation of the holding plate M1 of the transfer table 5 and the holding table 141 (refer to) Figure 24 )

[0290] The holding plate M1 of the holding platform 141 is removed, and the holding plate M1 is raised by the first conveying mechanism 25a (attachment component conveying mechanism 107) and conveyed to the plate receiving part 24 from the raised position. In addition, when the holding plate M1 of the holding platform 141 is removed, compressed air is supplied to the fixing cylindrical part 262 to set the movable part 262b to the embedded position and release the fixation of the fixing mechanism 26.

[0291] Subsequently, the first conveying mechanism 25a (attachment component conveying mechanism 107) takes out a new holding plate M1 from the holding table 141 from the plate receiving part 24, and conveys it to the holding base M2 of the holding table 141 in the raised position, causing the holding plate M1 to descend and be placed. In this state, if compressed air is supplied to the fixing cylinder part 262 and the movable member 262b is set to the submerged position, the holding plate M1 descends, the fixing cylinder part 262 enters the fixing insertion hole 261 of the holding plate M1, and then if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the holding table 141.

[0292] Additionally, the holding plate M1 of the transfer platform 5 is removed, and the holding plate M1 is raised by the first conveying mechanism 25a (attachment component conveying mechanism 107), and conveyed to the plate receiving part 24 in the raised position. Furthermore, when removing the holding plate M1 of the transfer platform 5, compressed air is supplied to the fixing cylindrical part 262 to set the movable part 262b to the submerged position, and the fixing mechanism 26 is released.

[0293] Subsequently, the first conveying mechanism 25a (attachment component conveying mechanism 107) takes out a new holding plate M1 from the plate receiving section 24 and conveys it to the holding base M2 of the transfer platform 5 in the raised position, causing the holding plate M1 to descend and be placed. In this state, if compressed air is supplied to the fixing cylinder section 262 and the movable member 262b is set to the submerged position, the holding plate M1 descends, the fixing cylinder section 262 enters the fixing insertion hole 261 of the holding plate M1, and then if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the transfer platform 5.

[0294] Furthermore, the order of replacing the holding plate M1 of the holding platform 141 and the holding plate M1 of the transfer platform 5 is not limited to that described above. It can also be the opposite. Alternatively, after removing the holding plates M1 of the holding platform 141 and the transfer platform 5, new holding plates M1 can be installed on the holding platform 141 and the transfer platform 5 respectively.

[0295] (2) The replacement operation of the holding plate M1 of the cutting table 2A, the cutting table 2B and the second holding mechanism 6 (refer to) Figure 25 )

[0296] The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are raised by the second conveying mechanism 25b (the conveying moving mechanism 7 and the second holding mechanism 6). While in the raised position, the plates are conveyed to the holding table 141, which serves as the temporary placement section 27, where they are lowered and placed. Furthermore, when removing the holding plates M1 of the cutting tables 2A and 2B, compressed air is supplied to the fixing cylindrical section 262 to place the movable member 262b in the submerged position, releasing the fixing mechanism 26. Here, when the holding table 141 is used as the temporary placement section 27, it is preferable to remove the holding plates M1 of the holding table 141 beforehand.

[0297] In addition, the first conveying mechanism 25a (attachment component conveying mechanism 107) raises the holding plate M1 of the cutting table 2A and the cutting table 2B placed on the holding table 141, and conveys it to the plate receiving section 24 in the raised position, so that the holding plate M1 is lowered and received.

[0298] Subsequently, the first conveying mechanism 25a (attachment component conveying mechanism 107) takes out the new holding plate M1 of the cutting table 2A and the cutting table 2B from the plate receiving section 24, and conveys it to the holding table 141, which serves as the temporary placement section 27, in the state of being set to the rising position, so that the holding plate M1 is lowered and placed.

[0299] Subsequently, the second conveying mechanism 25b (conveyor moving mechanism 7 and second holding mechanism 6) conveys the new holding plate M1 placed on the holding table 141 to the holding base M2 of the cutting table 2A and the cutting table 2B in the raised position, causing the holding plate M1 to descend and be placed. In this state, if compressed air is supplied to the fixing cylinder 262 and the movable member 262b is set to the submerged position, the fixing cylinder 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the cutting table 2A and the cutting table 2B.

[0300] When replacing the retaining plate M1 of the second retaining mechanism 6, the second retaining mechanism 6 is moved to the retaining platform 141, which serves as a temporary placement section 27, by the conveying moving mechanism 7, and the retaining plate M1 is lowered and removed, and placed on the retaining platform 141, which serves as a temporary placement section 27. Furthermore, when removing the retaining plate M1 of the second retaining mechanism 6, compressed air is supplied to the fixing cylindrical section 262 to set the movable member 262b to the submerged position, thereby releasing the fixation of the fixing mechanism 26.

[0301] Subsequently, the first conveying mechanism 25a (attachment component conveying mechanism 107) raises the holding plate M1 of the second holding mechanism 6 placed on the holding table 141, and conveys it to the plate receiving section 24 in the raised position, so that the holding plate M1 is lowered and received.

[0302] Subsequently, the first conveying mechanism 25a (attachment component conveying mechanism 107) takes out the new holding plate M1 of the second holding mechanism 6 from the plate receiving section 24, and conveys it to the holding table 141, which serves as a temporary placement section 27, in the state of being set to the rising position, so that the holding plate M1 is lowered and placed.

[0303] Subsequently, the second holding mechanism 6 is moved to the holding platform 141 by the conveying moving mechanism 7, causing the holding base M2 to descend and a new holding plate M1 placed on the holding platform 141 to be installed. Here, the fixing cylindrical portion 262 of the holding base M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the conveying moving mechanism 7. In this state, if compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262b is set to the submerged position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the second holding mechanism 6.

[0304] Furthermore, when replacing the holding plate M1 of the cutting table 2A and the cutting table 2B, the holding plate M1 of the second holding mechanism 6, which becomes the second conveying mechanism 25b, and the holding plate M1 of the holding table 141 are removed beforehand. Additionally, when replacing the holding plate M1 of the second holding mechanism 6, the holding plate M1 of the holding table 141 is removed beforehand.

[0305] Alternatively, the replacement of the transfer table 5, holding table 141, cutting table 2A, cutting table 2B, and the holding plate M1 of the second holding mechanism 6 can be performed as a series of actions. For example, it is conceivable to sequentially remove the holding plates M1 of the transfer table 5, holding table 141, second holding mechanism 6, and cutting table 2A and cutting table 2B, and then sequentially install the holding plates M1 of the cutting table 2A, cutting table 2B, second holding mechanism 6, holding table 141, and transfer table 5.

[0306] <Effects of the Second Implementation>

[0307] The cutting device 100 according to the second embodiment, like the first embodiment, includes a plate conveying mechanism 25 that conveys the retaining plate M1 removed from the retaining base M2 to the plate receiving section 24 and then conveys the retaining plate M1 located in the plate receiving section 24 to the retaining base M2. Therefore, the retaining plate M1 can be automatically replaced on the retaining base M2. As a result, the labor costs for replacing the retaining plate M1 can be reduced. Furthermore, because the retaining plate M1 is automatically replaced, the replacement time of the retaining plate M1 can be shortened, improving the productivity of the cutting device 100. Moreover, the unevenness of the installation state of the retaining plate M1 on the retaining base M2 can be reduced. In addition, the second embodiment produces the same effects as the first embodiment through the same structure.

[0308] In particular, in the second embodiment, the plate conveying mechanism 25 conveys the attachment member 101 to the mounting table 102. Therefore, there is no need to provide a separate conveying mechanism for the attachment member that is independent of the plate conveying mechanism 25, which simplifies the device structure of the cutting device 100 for chain containment. Furthermore, device costs can also be reduced. In addition, when performing subsequent processes such as sputtering or encapsulation processes on multiple products P, it is only necessary to move the attachment member 101 on which multiple products P are attached, making operation easy.

[0309] Furthermore, the plate conveying mechanism 25 includes: a first conveying mechanism 25a, which conveys the holding plate M1 between the plate receiving portion 24 and the temporary placement portion 27; and a second conveying mechanism 25b, which conveys the holding plate M1 between the temporary placement portion 27 and the holding base M2. Therefore, compared to the case where the plate conveying mechanism 25 is composed of a single conveying mechanism, the degree of freedom in the destination of the holding plate M1 can be increased. Here, the first conveying mechanism 25a is composed of the attachment member conveying mechanism 107 (the third holding mechanism 1071 and the moving mechanism 1072), which simplifies the device structure and reduces the device cost. In addition, the second conveying mechanism 25b is composed of the second holding mechanism 6 and the conveying moving mechanism 7, which simplifies the device structure and reduces the device cost.

[0310] <Modifications of the Second Embodiment>

[0311] For example, in the second embodiment, the structure is to automatically replace the holding plates M1 of each of the cutting table 2A, cutting table 2B, inspection table (holding table 141), transfer table 5 and conveying holding mechanism (second holding mechanism 6). However, it may also be a structure to automatically replace at least one of the cutting table 2A, cutting table 2B, inspection table (holding table 141), transfer table 5 and conveying holding mechanism (second holding mechanism 6).

[0312] The plate conveying mechanism 25 of the second embodiment has a structure having a first conveying mechanism 25a and a second conveying mechanism 25b, but it can also be configured to have a single conveying mechanism. In addition, the plate conveying mechanism 25 can also be configured to not use the attachment member conveying mechanism 107, or it can be configured to not use the second holding mechanism 6 and the conveying moving mechanism 7 (processing object conveying mechanism).

[0313] When the plate conveying mechanism 25 is configured without using the attachment member conveying mechanism 107, the plate receiving part 24 is positioned in a location accessible to the second holding mechanism 6 (e.g., between the transfer table 5 (index table) and the placement table 102 of the attachment member 101), thereby enabling the plate conveying mechanism 25 to be configured without using the attachment member conveying mechanism 107, using only the second holding mechanism 6 and the conveying moving mechanism 7.

[0314] In addition, the plate receiving section 24 of the second embodiment receives the holding plates M1 of the cutting table 2A, the cutting table 2B, the inspection table (holding table 141), the transfer table 5 and the second holding mechanism 6, but it can also be configured to provide multiple dedicated plate receiving sections 24 according to the type of holding plate M1.

[0315] For example, the second embodiment describes a structure with multiple (specifically two) mounting platforms 102, but as... Figure 26 As shown in (a), the mounting platform 102 can also be a single unit. In this case, two guide rails 108A and 108B can be provided at the opening of the attachment member receiving portion 106, one above the other. In this structure, the upper guide rail 108A can be configured to expand and contract at intervals between each other using an expansion and contraction mechanism (not shown).

[0316] The operation of guide rails 108A and 108B, which have the above-mentioned upper and lower two-section structure, is as follows.

[0317] First, the spacing of the upper guide rail 108A is widened by an expansion and contraction mechanism (see reference). Figure 26 (b) Then, the attachment component conveying mechanism 107 descends between the upper guide rails 108A, extracts the empty attachment component 101 from the attachment component receiving section 106, and temporarily places it on the lower guide rail 108B. Then, the attachment component conveying mechanism 107 moves to the placement platform 102 located at the attachment component conveying position X3 to receive the attachment component 101 after it has been attached.

[0318] Subsequently, the spacing of the upper guide rail 108A is narrowed by the expansion and contraction mechanism (see reference). Figure 26 (c) Then, the attaching component conveying mechanism 107 places the attached component 101 on the upper guide rail 108A and pushes the attached component 101 into the attaching component receiving part 106.

[0319] Then, the spacing of the upper guide rails 108A is widened by the expansion and contraction mechanism. Subsequently, the attachment component conveying mechanism 107 descends between the upper guide rails 108A, receives the empty attachment component 101 placed on the lower guide rail 108B, and conveys it to the placement platform 102.

[0320] In addition, the second embodiment has a structure with two attachment conveying mechanisms 103, but it can also be configured to have a structure with one attachment conveying mechanism 103.

[0321] Furthermore, the first camera unit 201 is shared by the two attachment conveying mechanisms 103, but the first camera unit 201 can also be provided corresponding to each of the two attachment conveying mechanisms 103.

[0322] Alternatively, the transfer platform 5 in the second embodiment is an index platform temporarily placed before being attached to the attachment member 101, or the transfer platform 5 can be set as the holding platform 141 of the reversing mechanism 14.

[0323] <Third Embodiment of the Invention>

[0324] Next, the third embodiment of the present invention will be described.

[0325] The cutting device 100 of the third embodiment differs from the tray storage of the first embodiment and the chain storage of the second embodiment in that it is configured to store multiple products P in a scattered state (also known as "block storage").

[0326] Specifically, such as Figure 27 As shown, the cutting device 100 includes: two cutting tables (processing tables) 2A and 2B for holding the sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W to transport the sealed substrate W to the cutting tables 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B; a second holding mechanism 6 for holding multiple products P to transport multiple products P from the cutting tables 2A and 2B to the housing 111; a transport moving mechanism 7 having a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting moving mechanism (processing moving mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B.

[0327] The following mainly describes the structure that differs from the first and second embodiments.

[0328] like Figure 27 As shown, the second holding mechanism 6 of the third embodiment holds multiple products P to transport them from the cutting table 2A and the cutting table 2B to the drying table 112 or the storage box 111. Figure 8 As shown, the second holding mechanism 6 has the same structure as the first embodiment and the second embodiment. Moreover, by moving the suction head 61 to the desired position by the conveying moving mechanism 7, etc., as described later, multiple products P are conveyed from the cutting table 2A and the cutting table 2B to the drying table 112, and from the drying table 112 to the storage box 111.

[0329] like Figure 27 As shown, the conveying moving mechanism 7 of the third embodiment moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting table 2A and the cutting table 2B, and moves the second holding mechanism 6 at least between the cutting table 2A, the cutting table 2B and the receiving box 111.

[0330] Additionally, the transfer shaft 71 is positioned such that the first holding mechanism 3 is movable above the substrate supply section 11b of the substrate supply mechanism 11, and the second holding mechanism 6 is movable above the receiving box 111 (see reference). Figure 27 In addition, relative to the transfer shaft 71, the housing 111 and the drying table 112, which will be described later, are also located on the same side (near the front side) in plan view.

[0331] Furthermore, the guide rail 721 of the main moving mechanism 72 extends in a straight line along the transmission shaft 71 in the X direction, and is located within the range where the first holding mechanism 3 can be moved above the substrate supply section 11b of the substrate supply mechanism 11, and the second holding mechanism 6 can be moved above the receiving box 111.

[0332] <Drying function of cutting device 100>

[0333] The cutting device 100 of the third embodiment has the function of further drying the plurality of products P that have been cleaned by the second cleaning mechanism 19. Specifically, as Figures 27-29 As shown, the cutting device 100 includes: a drying table 112 for drying a plurality of products P; a drying mechanism 113 for drying the plurality of products P placed on the drying table 112; and a drying moving mechanism 114 for moving the drying mechanism 113 along the drying table 112.

[0334] The drying table 112 transports and places multiple products P via a second holding mechanism 6 and a conveying moving mechanism 7. The drying table 112 adsorbs and holds the multiple products P. Furthermore, the drying table 112 is arranged in a row with two cutting tables 2A and 2B along the X direction on a horizontal plane. In this embodiment, the drying table 112 is rectangular in plan view, but it can also be of other shapes.

[0335] The drying mechanism 113 sprays compressed air as a gas from above the drying table 112 to dry the plurality of products P adsorbed and held on the drying table 112. The drying mechanism 113 has a spray nozzle 113a that sprays compressed air into the plurality of products P held on the drying table 112. In this embodiment, the spray nozzle 113a has a slit-shaped opening extending linearly toward the drying table 112 (see reference). Figure 28 However, it may also have multiple openings intermittently arranged along the X direction.

[0336] In this embodiment, the drying mechanism 113 is configured to inject compressed air into the moving direction of the drying moving mechanism 114 (see reference). Figure 28That is, it is configured such that the direction of the compressed air injected by the injection nozzle 113a is toward the moving direction of the drying moving mechanism 114 (here, from the near front side to the inward side in the Y direction).

[0337] In addition, such as Figure 28 As shown, the spray nozzles 113a of the drying mechanism 113 are arranged at an angle of less than 30 degrees relative to the arrangement direction along the X direction of the plurality of products P held on the drying table 112. Here, on the drying table 112, the plurality of products P are arranged in a matrix in the X and Y directions, and the spray nozzles 113a of the drying mechanism 113 spray compressed air at an angle relative to one side of each product P along the X direction. This facilitates the blowing away of moisture accumulated between adjacent products P. This promotes the drying of the plurality of products P. Alternatively, the slit-shaped opening of the spray nozzles 113a of the drying mechanism 113 can be provided at a slight angle toward the drying table 112, so that the compressed air is blown toward the moving direction of the drying mechanism 113.

[0338] The drying moving mechanism 114 moves the drying mechanism 113 above the drying table 112 in the Y direction. In this embodiment, the drying moving mechanism 114 causes the drying mechanism 113 to reciprocate relative to the drying table 112 in the Y direction. Specifically, as... Figure 28 and Figure 29 As shown, the drying moving mechanism 114 includes: a Y-direction guide rail 1141 extending along the Y direction; a sliding member 1142 that moves along the Y-direction guide rail 1141 and holds the drying mechanism 113; and a drive unit (not shown) that moves the sliding member 1142 along the Y-direction guide rail 1141. Furthermore, the drive unit can be, for example, a ball screw mechanism, a cylinder, or a linear motor.

[0339] <An example of a drying process>

[0340] Next, the drying operation performed by the drying mechanism 113 and the drying moving mechanism 114 will be described.

[0341] Before multiple products P are placed on the drying table 112, the drying moving mechanism 114 retracts the drying mechanism 113 to one side (e.g., the front side) in the Y direction of the drying table 112 to avoid obstructing the placement of the multiple products P. Furthermore, if multiple products P are placed and held on the drying table 112, the drying mechanism 113 begins to inject compressed air, and the drying moving mechanism 114 moves the drying mechanism 113 to the other side (e.g., the inner side) in the Y direction. Thus, the drying of the multiple products P held on the drying table 112 is performed. Moreover, when the drying moving mechanism 114 moves the drying mechanism 113 from the other side (inner side) in the Y direction to one side (near the front side) in the Y direction, the drying mechanism 113 stops injecting gas. Alternatively, the drying mechanism 113 may be configured to inject compressed air not only in the forward path but also in the return path.

[0342] <Specific structure of the block containment (containment box 111 and dusting component 115)>

[0343] like Figures 27-29 As shown, the housing 111 contains multiple products P in a scattered state (so-called block housing). Furthermore, the housing 111 is arranged in a row with two cutting tables 2A and 2B along the X direction on a horizontal plane. The housing 111 also includes a dusting member 115 for dusting multiple products P from the second holding mechanism 6.

[0344] The containment box 111 has a rectangular upper opening 111X in plan view (see reference). Figure 28 Furthermore, the dusting member 115 is fixed to one side of the upper opening 111X of the receiving box 111. By moving the second holding mechanism 6 relative to the dusting member 115 in the X direction, the product P is dusted off and falls into the receiving box 111.

[0345] Furthermore, in this embodiment, the receiving box 111 is disposed in the X direction between the drying table 112 and the plate receiving portion 24 of the receiving and holding plate M1 described later, and the dusting member 115 is disposed on one side of the upper opening 111X of the receiving box 111 on the drying table 112 side. Thus, it is designed so that the second holding mechanism 6 does not interfere with the structure of the plate receiving portion 24 when dusting the product P.

[0346] The dusting component 115 extends upward from one side of the drying table 112 at the upper opening 111X (see reference). Figure 29 In addition, the dusting member 115 can be made of resin such as polyetheretherketone (PEEK) material, as long as it can dust off the product P that has not left the second holding mechanism 6 after adsorption is released. It can be in the shape of a brush or a flat plate.

[0347] In this embodiment, the receiving box 111 is disposed near the front side of the transmission shaft 71, and a handle 1111 is provided on the outer surface of the near front side of the receiving box 111 (see reference). Figure 28 The housing 111 is configured to be removed from the front side of the cutting device 100. This structure improves the maintainability of the product P for removal, recycling, etc. Furthermore, the removal direction of the housing 111 is not limited to the front side; for example, it can be configured to be removed from the side of the cutting device 100 or from the inside.

[0348] <An example of the operation of the cutting device 100>

[0349] Then, referring to Figure 30 An example of the operation of the cutting device 100 in the third embodiment will be described. Figure 30 In the diagram, the movement paths of the first holding mechanism 3 and the second holding mechanism 6 are shown during the operation of the cutting device 100. Furthermore, in this embodiment, all operations or controls of the cutting device 100, such as the transport of the sealed substrate W, the cutting of the sealed substrate W, the cleaning of the product P, the drying of the product P, and the dusting of the product P, are controlled by the control unit CTL (see reference). Figure 27 )conduct.

[0350] In the operation of the cutting device 100 in this embodiment, the operations of conveying the sealed substrate W, cutting the sealed substrate W, and cleaning the product P are the same as in the first embodiment.

[0351] Subsequently, after the product P is cleaned, the transfer mechanism 7 moves the second holding mechanism 6 to the drying table 112, the second holding mechanism 6 releases its adsorption holding, and multiple products P are placed on the drying table 112. Then, the drying table 112 adsorbs and holds the sealed substrate W. At this time, the transfer mechanism 7 retracts the second holding mechanism 6 to a position that does not obstruct the movement of the drying mechanism 113.

[0352] In this state, the drying moving mechanism 114 causes the drying mechanism 113 to move back and forth in the Y direction, and the drying mechanism 113 sprays compressed air, thereby drying multiple products P. Furthermore, the number of times the drying moving mechanism 114 causes the drying mechanism 113 to move back and forth can be appropriately set, either once or multiple times.

[0353] After drying, the conveying mechanism 7 moves the second holding mechanism 6 to the drying table 112, where the second holding mechanism 6 holds multiple products P. Then, the conveying mechanism 7 moves the second holding mechanism 6, which holds the multiple products P, to the receiving box 111.

[0354] Subsequently, the second holding mechanism 6 releases the adsorption and holding of multiple products P above the upper opening 111X of the receiving box 111. Then, the transfer moving mechanism 7 moves the second holding mechanism 6 relative to the dusting member 115 toward the drying table 112 so that the dusting member 115 touches the products P that have not fallen from the second holding mechanism 6 and remain in the second holding mechanism 6. In this embodiment, in order to reliably dust off the products P, the second holding mechanism 6 is moved relative to the dusting member 115 so that the dusting member 115 contacts the lower surface of the second holding mechanism 6, which is the adsorption surface. As a result, multiple products P fall off and are received in the receiving box 111.

[0355] <Maintain the automatic replacement function of board M1>

[0356] Furthermore, the cutting device 100 of the third embodiment, like the first and second embodiments, has the function of automatically replacing the holding plate M1 used to hold the sealed substrate W or product P. In addition, in this embodiment, the cutting table 2A, cutting table 2B, drying table 112, and second holding mechanism 6 all have the holding plate M1 and the holding base M2. Furthermore, the specific structures of the holding plate M1 and the holding base M2 are the same as in the first embodiment.

[0357] Specifically, such as Figure 27 and Figure 31 As shown, the cutting device 100 includes: a plate receiving portion 24 for receiving and holding a plate M1; and a plate conveying mechanism 25 for conveying the plate holding plate M1 between the plate receiving portion 24 and the holding base M2. Furthermore, the cutting device 100 in the second embodiment, like the first embodiment, is provided with a fixing mechanism 26 and an inspection mechanism 29.

[0358] The plate conveying mechanism 25 of the third embodiment is configured using a second holding mechanism 6 and a conveying moving mechanism 7, and can convey multiple products P. In other words, the second holding mechanism 6 and the conveying moving mechanism 7 have the function of conveying and holding plate M1. The plate conveying mechanism 25 is configured to move in the X direction via the common transfer shaft 71. In addition, the plate conveying mechanism 25 is located on the same side (near the front side) relative to the transfer shaft 71 in plan view. Here, the second holding mechanism 6 constituting the plate conveying mechanism 25, like in the first embodiment, has a conveying cylindrical portion 282 (see reference 282). Figure 13 The conveying cylindrical portion 282 is inserted into the conveying retaining hole 281 formed in the retaining plate M1 (see reference). Figure 10 ).

[0359] <Maintaining the replacement operation of board M1>

[0360] Then, referring to Figure 32The replacement operation of the holding plate M1 performed by the plate conveying mechanism 25 in this embodiment will be explained.

[0361] Furthermore, in the following replacement operation, the identification of the holding plate M1 when it is taken out from the plate receiving section 24 is performed by reading the RFID or other identifiers provided on the holding plate M1 through the identifier reader (not shown) provided on the plate conveying mechanism 25 (second holding mechanism 6).

[0362] (1) The removal action of the retaining plate M1 of the second retaining mechanism 6 (refer to) Figure 32 (a)

[0363] First, the retaining plate M1 of the second retaining mechanism 6 is removed. Specifically, the second retaining mechanism 6 is moved to the plate receiving portion 24 by the conveying moving mechanism 7, and the second retaining mechanism 6 is lowered to remove the retaining plate M1, which is then placed and received in the sliding frame portion 241. Furthermore, when removing the retaining plate M1 of the second retaining mechanism 6, compressed air is supplied to the fixing cylindrical portion 262 to set the movable member 262b to the submerged position, thereby releasing the fixation of the fixing mechanism 26.

[0364] Using the second holding mechanism 6, which has removed the holding plate M1, the holding plate of the cutting table 2A, the cutting table 2B, or the drying table 112 is replaced.

[0365] (2) The replacement operation of the holding plate M1 of the cutting table 2A and the cutting table 2B (refer to) Figure 32 (b)

[0366] The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are raised by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6). While in the raised position, the plates are conveyed to the plate receiving section 24, and then lowered and placed and received in the sliding frame section 241. Furthermore, when removing the holding plates M1 of the cutting tables 2A and 2B, compressed air is supplied to the fixing cylinder section 262 to set the movable member 262b to the submerged position, releasing the fixation of the fixing mechanism 26.

[0367] Subsequently, the plate conveying mechanism 25 (conveyor moving mechanism 7 and second holding mechanism 6) takes out a new holding plate M1 from the plate receiving part 24 for the cutting table 2A and the cutting table 2B, and conveys it to the holding base M2 of the cutting table 2A and the cutting table 2B in the raised position, so that the holding plate M1 is lowered and placed. In this state, if compressed air is supplied to the fixing cylinder part 262 and the movable member 262b is set to the submerged position, the fixing cylinder part 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, and the holding plate M1 is fixed to the holding base M2 of the cutting table 2A and the cutting table 2B.

[0368] (3) The replacement operation of the retaining plate M1 of the drying table 112 (refer to) Figure 32 (b)

[0369] The holding plate M1 of the drying table 112 is removed, and the holding plate M1 is raised by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6). In the raised position, it is conveyed to the plate receiving part 24, and the holding plate M1 is lowered and placed and received in the sliding frame part 241 that slides forward. In addition, when removing the holding plate M1 of the drying table 112, compressed air is supplied to the fixing cylinder part 262 to set the movable part 262b to the submerged position, and the fixing mechanism 26 is released.

[0370] Subsequently, the plate conveying mechanism 25 (conveyor moving mechanism 7 and second holding mechanism 6) takes out a new holding plate M1 from the drying table 112 from the plate receiving part 24, and conveys it to the holding base M2 of the drying table 112 in the raised position, causing the holding plate M1 to descend and be placed. In this state, if compressed air is supplied to the fixing cylinder part 262 and the movable member 262b is set to the submerged position, the fixing cylinder part 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the drying table 112.

[0371] (4) Installation of the retaining plate M1 of the second retaining mechanism 6 (refer to) Figure 32 (c)

[0372] As described above, after replacing the holding plates M1 of the cutting table 2A, cutting table 2B, and drying table 112, the second holding mechanism 6 is moved to the plate receiving section 24 by the conveying moving mechanism 7, causing the second holding mechanism 6 to descend and a new holding plate M1 placed on the sliding frame section 241 is installed. Here, the fixing cylindrical part 262 of the holding base M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the conveying moving mechanism 7. In this state, if compressed air is supplied to the fixing cylindrical part 262 and the movable member 262b is set to the submerged position, the fixing cylindrical part 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the second holding mechanism 6.

[0373] Furthermore, the replacement of the retaining plate M1 of the cutting table 2A and the cutting table 2B, and the replacement of the retaining plate M1 of the drying table 112, can be performed either first. Alternatively, the retaining plate M1 can be removed from the retaining base M2 of the cutting table 2A, the cutting table 2B, and the drying table 112, and then a new retaining plate M1 can be installed on the retaining base M2 of the cutting table 2A, the cutting table 2B, and the drying table 112.

[0374] Furthermore, as described above, the replacement of the holding plate M1 of the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the drying table 112 is presented as a series of actions. However, the replacement of the holding plate M1 of at least one of the second holding mechanism 6, the cutting table 2A, the cutting table 2B, or the drying table 112 can also be performed separately. In this case, when replacing the holding plate M1 of the cutting table 2A, the cutting table 2B, or the drying table 112, it is conceivable to remove the holding plate M1 of the second holding mechanism 6 constituting the plate conveying mechanism 25 beforehand.

[0375] <Effects of the Third Implementation>

[0376] The cutting device 100 according to the third embodiment, like the first and second embodiments, includes a plate conveying mechanism 25 that conveys the retaining plate M1, which is removed from the retaining base M2, to the plate receiving section 24, and then conveys the retaining plate M1 located in the plate receiving section 24 to the retaining base M2. Therefore, the retaining plate M1 can be automatically replaced on the retaining base M2. As a result, the labor costs for replacing the retaining plate M1 can be reduced. Furthermore, because the retaining plate M1 is automatically replaced, the replacement time of the retaining plate M1 can be shortened, improving the productivity of the cutting device 100. Moreover, the unevenness of the installation state of the retaining plate M1 on the retaining base M2 can be reduced. In addition, the third embodiment produces the same effects as the first and second embodiments through the same structure.

[0377] In particular, in the third embodiment, the plate conveying mechanism 25 can transport multiple products P to the receiving box 111, thus eliminating the need for a separate product conveying mechanism independent of the plate conveying mechanism 25, and simplifying the structure of the cutting device 100 for block receiving. Furthermore, device costs can be reduced. In addition, by dropping and receiving multiple products P into the receiving box 111, the receiving space can be miniaturized compared to the previous pallet receiving structure. This also reduces the area occupied by the cutting device 100.

[0378] <Modifications of the Third Embodiment>

[0379] For example, in the third embodiment, the structure is to automatically replace the holding plate M1 of each of the cutting table 2A, the cutting table 2B, the drying table 112 and the holding mechanism (second holding mechanism 6). However, it can also be configured to automatically replace at least one of the cutting table 2A, the cutting table 2B, the drying table 112 and the holding mechanism (second holding mechanism 6).

[0380] The plate conveying mechanism 25 of the third embodiment can also be configured to not use the second holding mechanism 6 and the conveying moving mechanism 7.

[0381] In addition, the plate receiving section 24 of the third embodiment receives the holding plates M1 of the cutting table 2A, the cutting table 2B, the drying table 112 and the holding mechanism (second holding mechanism 6), but it may also be configured to provide multiple dedicated plate receiving sections 24 according to the type of holding plate M1.

[0382] Alternatively, the structure can be configured such that: without the dusting member 115, after the adsorption and holding are released by the second holding mechanism 6, multiple products P are dropped by spraying gas from the second holding mechanism 6.

[0383] Furthermore, in addition to the structure of fixing the dusting member 115 to the housing box 111, it can also be fixed to other components, or it can be configured as follows: the dusting member 115 is configured in a movable manner, and multiple products P are dusted off by moving the dusting member 115 relative to the second holding mechanism 6.

[0384] <Fourth Embodiment of the Invention>

[0385] Next, the fourth embodiment of the present invention will be described.

[0386] The cutting device 100 of the fourth embodiment differs from the tray housing of the first embodiment, the chain housing of the second embodiment, and the block housing of the third embodiment in that it is configured to house multiple articles P in a cylindrical container 116 (also referred to as a "tube housing"). Furthermore, the cylindrical container 116 is sometimes also referred to as a tube, box rod, rod box, rod, etc.

[0387] Specifically, such as Figure 33 As shown, the cutting device 100 includes: two cutting tables (processing tables) 2A and 2B for holding a sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W to transfer it to the cutting tables 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B; a transfer table 5 for moving a plurality of products P; a second holding mechanism 6 for holding the plurality of products P to transfer them from the cutting tables 2A and 2B to the transfer table 5; a transfer moving mechanism 7 having a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting moving mechanism (processing moving mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B.

[0388] The following mainly describes the structures that differ from the first to third embodiments.

[0389] In this embodiment, the transfer stage 5 temporarily holds multiple articles P before housing them in the cylindrical container 116 described later. Additionally, as... Figure 33 As shown, the transfer table 5 is movable along the Y direction, moving between a transfer position X1 where multiple products P are placed via the second holding mechanism 6 and a removal position X2 where multiple products P are transported via the transfer receiving mechanism 118. Furthermore, the transfer position X1 is set closer to the front than the transfer shaft 71, and is positioned in a row with the two cutting tables 2A and 2B along the X direction on a horizontal plane; the removal position X2 is set further inward than the transfer shaft 71.

[0390] <Specific Structure of the Storage System>

[0391] Then, as Figures 33-35 As shown, the cutting device 100 of this embodiment includes: a container setting section 117, on which a cylindrical container 116 is provided, wherein the cylindrical container 116 receives a plurality of products P from an opening 116x at one end; and a conveying and receiving mechanism 118, which conveys the plurality of products P from the transfer table 5 to the cylindrical container 116 provided in the container setting section 117 and receives them.

[0392] The container setting section 117 is provided with an empty cylindrical container 116 that does not contain the product P. The product P is inserted into the cylindrical container 116 through one end opening 116x by the conveying and receiving mechanism 118.

[0393] like Figure 33As shown, the container setting unit 117 of this embodiment includes: an empty container receiving unit 117a, which receives an empty cylindrical container 116; an insertion position setting unit 117b, which is provided at an insertion position where an empty cylindrical container 116 is sent out from the empty container receiving unit 117a and a product P is inserted into the empty cylindrical container 116 from one end opening 116x; and a receiving container receiving unit 117c, which receives a receiving cylindrical container 116 that is fully loaded with product P or contains a required number of product P.

[0394] Here, as Figure 34 As shown, the cylindrical container 116 houses multiple articles P arranged in a row. Specifically, the cylindrical container 116 has a straight, extending shape and has internal space for housing the articles P. Furthermore, the cross-sectional shape of the cylindrical container 116, orthogonal to its length, corresponds to the cross-sectional shape of the articles P. Figure 34 The cylindrical container 116 shown has an open structure where a portion of its sidewall extends along its length, but it can also have a closed structure. Furthermore, the cylindrical container 116 can accommodate multiple articles P arranged in a single row, or it can accommodate multiple articles P arranged in multiple rows. Moreover, the cylindrical container 116 can be made of resin or metal. Figure 34 In this context, "P" indicates a product with leads, but it can also be a leadless type such as Quad Flat No-lead (QFN).

[0395] like Figure 33 and Figure 35 As shown, the transport and containment mechanism 118 includes: an intermediate platform 119 for temporarily holding multiple products P; a first product transport mechanism 120 for transporting multiple products P from the transfer platform 5 located at the take-out position X2 to the intermediate platform 119; and a second product transport mechanism 121 for transporting multiple products P from the intermediate platform 119 to the cylindrical container 116 provided in the insertion position setting part 117b of the container setting part 117 and containing them.

[0396] The intermediate platform 119 is temporarily placed by the first product transfer mechanism 120, which transfers the product P from the transfer platform 5 located at the take-out position X2. Additionally, the product P temporarily placed on the intermediate platform 119 is transferred by the second product transfer mechanism 121 to the cylindrical container 116 provided in the container placement section 117. In this embodiment, the intermediate platform 119 is fixed in both the X and Y directions, but it can also be configured to be movable.

[0397] The first product conveying mechanism 120 moves from the transfer table 5 at the take-out position X2 to the intermediate table 119, conveying multiple products P in a predetermined number (e.g., one) to the intermediate table 119.

[0398] Specifically, such as Figure 35 As shown, the first product conveying mechanism 120 includes: a product adsorption mechanism 1201, which adsorbs a plurality of products P held on the transfer stage 5 in a predetermined number (e.g., one) unit; and an adsorption moving mechanism 1202, which moves the product adsorption mechanism 1201 along the X direction.

[0399] like Figure 35 As shown, the product adsorption mechanism 1201 includes: an adsorption head 1201A, with adsorption sections 1201a for adsorbing and holding multiple products P; and a vacuum pump or vacuum ejector (not shown) connected to the adsorption section 1201a of the adsorption head 1201A. The product adsorption mechanism 1201 is configured such that each adsorption section 1201a adsorbs one product P. Furthermore, the multiple adsorption sections 1201a are configured to move independently up and down, allowing each adsorption section 1201a to adsorb products P individually as it descends. Additionally, a camera 203 is provided at the lower part of the first product conveying mechanism 120 for confirming the state of the adsorbed products P.

[0400] like Figure 35 As shown, the adsorption moving mechanism 1202 includes: an X-direction moving part 1202a for moving the product adsorption mechanism 1201 in the X direction; and a Z-direction moving part 1202b for moving the product adsorption mechanism 1201 in the Z direction. Alternatively, the adsorption moving mechanism 1202 may also have a Y-direction moving part for moving the product adsorption mechanism 1201 in the Y direction.

[0401] The X-direction moving part 1202a includes: an X-direction guide rail 1202a1, disposed along the X-direction on the inner side of the transmission shaft 71; and a support body 1202a2, which moves along the X-direction guide rail 1202a1 and supports the product adsorption mechanism 1201 via the Z-direction moving part 1202b. Furthermore, the support body 1202a2 moves linearly back and forth along the X-direction on the X-direction guide rail 1202a1, for example, via a ball screw mechanism (not shown) extending along the X-direction. The ball screw mechanism is driven by a drive source (not shown) such as a servo motor. Alternatively, the support body 1202a2 may also be configured to move back and forth via other linear mechanisms such as a linear motor.

[0402] The Z-direction moving part 1202b includes: a Z-direction guide rail 1202b1, which is disposed in the support body 1202a2 along the Z-direction; and a Z-direction slider 1202b2, which moves along the Z-direction guide rail 1202b1 and supports the article adsorption mechanism 1201. Furthermore, the Z-direction slider 1202b2 moves linearly back and forth along the Z-direction guide rail 1202b1 in the Z-direction direction, for example, via a ball screw mechanism (not shown) extending in the Z-direction. Alternatively, the Z-direction slider 1202b2 can also be configured to move back and forth via other linear mechanisms such as a linear motor.

[0403] like Figure 33 and Figure 35 As shown, the second product conveying mechanism 121 conveys the product P placed on the intermediate table 119 to the cylindrical container 116 provided in the insertion position setting part 117b of the container setting part 117, and inserts and receives the product P from one end opening 116x of the cylindrical container 116.

[0404] Specifically, such as Figure 35 As shown, the second product conveying mechanism 121 includes: a pushing member 121a that pushes the product P placed on the intermediate table 119; and a driving unit 121b that moves the pushing member 121a along the Y direction. Furthermore, the driving unit 121b can be, for example, a ball screw mechanism, a cylinder, or a linear motor. Additionally, the second product conveying mechanism 121 may also have a product guide portion that guides the product P to one end opening 116x of the cylindrical container 116. Furthermore, it may also have a mechanism for raising and lowering the pushing member 121a.

[0405] <An example of the operation of a cutting device>

[0406] Then, referring to Figure 9 , Figure 33 and Figure 35 An example of the operation of the cutting device 100 will be described. In this embodiment, all operations or controls of the cutting device 100, such as the transport of the sealed substrate W, the cutting of the sealed substrate W, the inspection of the product P, the cleaning of the product P, and the tube reception of the product P, are controlled by the control unit CTL (see reference). Figure 33 )conduct.

[0407] In this embodiment, the operation of the cutting device 100, including the conveying of the sealed substrate W, the cutting of the sealed substrate W, the cleaning of the product P, and the inspection of the product P, is the same as in the first embodiment.

[0408] Following a two-sided inspection, product P is transferred from the reversing mechanism 14 to the transfer table 5. The transfer table 5, which holds multiple products P, moves to the removal position X2 (see reference). Figure 33 and Figure 35On the other hand, an empty cylindrical container 116 is provided in the insertion position setting part 117b of the container setting part 117 (see reference). Figure 32 and Figure 34 ).

[0409] In the stated state, such as Figure 35 As shown, the first product transfer mechanism 120 holds product P from the transfer stage 5 located at the take-out position X2. Then, the first product transfer mechanism 120 moves product P to the intermediate stage 119, releases the adsorption of product P, and places product P on the intermediate stage 119. Product P placed on the intermediate stage 119 is inserted by the second product transfer mechanism 121 and housed inside the cylindrical container 116.

[0410] When the cylindrical container 116 is fully loaded, or when the cylindrical container 116 contains the required number of products P, the cylindrical container 116 that has been filled in the insertion position setting part 117b moves to the filled container receiving part 117c, and an empty cylindrical container 116 is sent out from the empty container receiving part 117a and placed in the insertion position setting part 117b.

[0411] <Maintain the automatic replacement function of board M1>

[0412] Furthermore, the cutting device 100 of the fourth embodiment, like that of the first embodiment, has the function of automatically replacing the holding plate M1 used to hold the sealed substrate W or product P. In addition, in this embodiment, similar to the first embodiment, the cutting table 2A, cutting table 2B, holding table 141, transfer table 5, and second holding mechanism 6 all have a holding plate M1 and a holding base M2. Furthermore, the specific structures of the holding plate M1 and the holding base M2 are the same as in the first embodiment.

[0413] Specifically, the cutting device 100 is similar to that in the third embodiment, such as... Figure 33 and Figure 36 As shown, it includes: a plate receiving section 24 for receiving and holding a plate M1; and a plate conveying mechanism 25 for conveying the plate M1 between the plate receiving section 24 and the holding base M2. Furthermore, the cutting device 100 in the second embodiment, like the first embodiment, is provided with a fixing mechanism 26 and an inspection mechanism 29.

[0414] The plate conveying mechanism 25 of the fourth embodiment is configured using a second holding mechanism 6 and a conveying moving mechanism 7, and can convey multiple products P. In other words, the second holding mechanism 6 and the conveying moving mechanism 7 have the function of conveying and holding plate M1. The plate conveying mechanism 25 is configured to move in the X direction via the common transfer shaft 71. In addition, the plate conveying mechanism 25 is located on the same side (near the front side) relative to the transfer shaft 71 in plan view. Here, the second holding mechanism 6 constituting the plate conveying mechanism 25, like in the first embodiment, has a conveying cylindrical portion 282 (see reference 282). Figure 13 The conveying cylindrical portion 282 is inserted into the conveying retaining hole 281 formed in the retaining plate M1 (see reference). Figure 10 ).

[0415] <Maintaining the replacement operation of board M1>

[0416] Then, referring to Figure 36 The replacement operation of the holding plate M1 performed by the plate conveying mechanism 25 in this embodiment will be explained.

[0417] Furthermore, in the following replacement operation, the identification of the holding plate M1 when it is taken out from the plate receiving section 24 is performed by reading the RFID or other identifiers provided on the holding plate M1 through the identifier reader (not shown) provided on the plate conveying mechanism 25 (second holding mechanism 6).

[0418] (1) The removal action of the retaining plate M1 of the second retaining mechanism 6 (refer to) Figure 36 (a)

[0419] First, the retaining plate M1 of the second retaining mechanism 6 is removed. Specifically, the second retaining mechanism 6 is moved to the plate receiving section 24 by the conveying moving mechanism 7, and the second retaining mechanism 6 is lowered to remove the retaining plate M1. The retaining plate M1 is then placed and received in the sliding frame section 241. Furthermore, when removing the retaining plate M1 of the second retaining mechanism 6, compressed air is supplied to the fixing cylindrical section 262 to set the movable member 262b to the submerged position, thereby releasing the fixation of the fixing mechanism 26.

[0420] Using the second holding mechanism 6, which has removed the holding plate M1, the holding plate of the cutting table 2A, the cutting table 2B, or the holding table 141 is replaced.

[0421] (2) The replacement operation of the holding plate M1 of the cutting table 2A and the cutting table 2B (refer to) Figure 36 (b)

[0422] The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are raised by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6). While in the raised position, the plates are conveyed to the plate receiving section 24, and then lowered and placed and received in the sliding frame section 241. Furthermore, when removing the holding plates M1 of the cutting tables 2A and 2B, compressed air is supplied to the fixing cylinder section 262 to set the movable member 262b to the submerged position, releasing the fixation of the fixing mechanism 26.

[0423] Subsequently, the plate conveying mechanism 25 (conveyor moving mechanism 7 and second holding mechanism 6) takes out a new holding plate M1 from the plate receiving part 24 for the cutting table 2A and the cutting table 2B, and conveys it to the holding base M2 of the cutting table 2A and the cutting table 2B in the raised position, so that the holding plate M1 is lowered and placed. In this state, if compressed air is supplied to the fixing cylinder part 262 and the movable member 262b is set to the submerged position, the fixing cylinder part 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, and the holding plate M1 is fixed to the holding base M2 of the cutting table 2A and the cutting table 2B.

[0424] (3) The replacement operation of the holding plate M1 of the holding table 141 (refer to) Figure 36 (b)

[0425] The holding plate M1 of the holding platform 141 is removed, and the holding plate M1 is raised by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6). In the raised position, it is conveyed to the plate receiving part 24, and the holding plate M1 is lowered and placed and received in the sliding frame part 241 that has slid forward. In addition, when removing the holding plate M1 of the holding platform 141, compressed air is supplied to the fixing cylinder part 262 to set the movable member 262b to the submerged position, and the fixing mechanism 26 is released.

[0426] Subsequently, the plate conveying mechanism 25 (conveyor moving mechanism 7 and second holding mechanism 6) takes out a new holding plate M1 from the holding table 141 from the plate receiving part 24, and conveys it to the holding base M2 of the holding table 141 in the raised position, causing the holding plate M1 to descend and be placed. In this state, if compressed air is supplied to the fixing cylinder part 262 and the movable member 262b is set to the submerged position, the fixing cylinder part 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the holding table 141.

[0427] (4) The replacement operation of the holding plate of the transfer platform 5 (refer to) Figure 36(b)

[0428] The holding plate M1 of the transfer platform 5 is removed, and the holding plate M1 is raised by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6). In the raised position, it is conveyed to the plate receiving part 24, and the holding plate M1 is lowered and placed and received in the sliding frame part 241 that slides forward. In addition, when removing the holding plate M1 of the transfer platform 5, compressed air is supplied to the fixing cylinder part 262 to set the movable member 262b to the submerged position, and the fixing mechanism 26 is released.

[0429] Subsequently, the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6) takes out a new holding plate M1 from the plate receiving part 24 and conveys it to the holding base M2 of the transfer platform 5 in the raised position, causing the holding plate M1 to descend and be placed. In this state, if compressed air is supplied to the fixing cylinder part 262 and the movable member 262b is set to the submerged position, the fixing cylinder part 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, fixing the holding plate M1 to the holding base M2 of the transfer platform 5.

[0430] (5) Installation of the retaining plate M1 of the second retaining mechanism 6 (refer to) Figure 36 (c)

[0431] As described above, after replacing the holding plate M1 of the cutting table 2A, cutting table 2B, holding table 141, and transfer table 5, the second holding mechanism 6 is moved to the plate receiving portion 24 by the transport moving mechanism 7, and the second holding mechanism 6 is lowered to install the new holding plate M1 placed on the sliding frame portion 241. Here, the fixing cylindrical portion 262 of the holding base M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transport moving mechanism 7. In this state, if compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262b is set to the submerged position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1. Then, if the supply of compressed air is stopped, the movable member 262b becomes the protruding position, and the holding plate M1 is fixed to the holding base M2 of the second holding mechanism 6.

[0432] Furthermore, the sequence of replacing the holding plate M1 of cutting table 2A, cutting table 2B, holding table 141, and transfer table 5 can be appropriately changed. Alternatively, the holding plate M1 can be removed from the holding base M2 of cutting table 2A, cutting table 2B, holding table 141, and transfer table 5, and then a new holding plate M1 can be installed on the holding base M2 of cutting table 2A, cutting table 2B, holding table 141, and transfer table 5.

[0433] Furthermore, as described above, the replacement of the holding plate M1 of the second holding mechanism 6, the cutting table 2A, the cutting table 2B, the holding table 141, and the transfer table 5 is presented as a series of actions. However, the replacement of the holding plate M1 of at least one of the second holding mechanism 6, the cutting table 2A, the cutting table 2B, the holding table 141, or the transfer table 5 can also be performed separately. In this case, when replacing the holding plate M1 of the cutting table 2A, the cutting table 2B, the holding table 141, or the transfer table 5, it is conceivable to remove the holding plate M1 of the second holding mechanism 6 constituting the plate conveying mechanism 25 beforehand.

[0434] <Effects of the Fourth Implementation>

[0435] The cutting device 100 according to this embodiment, like the first to third embodiments, includes a plate conveying mechanism 25 that conveys the retaining plate M1 removed from the retaining base M2 to the plate receiving section 24 and then conveys the retaining plate M1 located in the plate receiving section 24 to the retaining base M2. Therefore, the retaining plate M1 can be automatically replaced on the retaining base M2. As a result, the labor costs for replacing the retaining plate M1 can be reduced. Furthermore, because the retaining plate M1 is automatically replaced, the replacement time of the retaining plate M1 can be shortened, improving the productivity of the cutting device 100. Moreover, the unevenness of the installation state of the retaining plate M1 on the retaining base M2 can be reduced. In addition, the fourth embodiment produces the same effects as the first to third embodiments using the same structure.

[0436] In particular, if it is the cutting device 100 of the fourth embodiment, multiple products P can be transported from the transfer platform 5 to the cylindrical container 116 provided in the container setting section 117 by the transfer and receiving mechanism 118, and multiple products P can be received from one end opening 116x of the cylindrical container 116.

[0437] In addition, in the cutting device 100 for tube containment, the plate conveying mechanism 25 is constructed using the second holding mechanism 6 and the conveying moving mechanism 7, which simplifies the device structure and reduces the device cost.

[0438] <Modifications of the Fourth Embodiment>

[0439] For example, in the fourth embodiment, the container setting part 117 is located on the inner side of the transmission shaft 71, but it may also be located on the front side of the transmission shaft 71.

[0440] In addition, the cylindrical container 116 provided in the container setting section 117 can be provided along the Y direction or other directions, in addition to the structure provided along the X direction.

[0441] <Other variations and implementations>

[0442] In the various embodiments described, a cutting device with a dual-cutting table and a dual-mandrel structure has been described, but it is not limited thereto. It may also be a cutting device with a single-cutting table and a single-mandrel structure, or a cutting device with a single-cutting table and a dual-mandrel structure, etc.

[0443] Furthermore, the cam rack components constituting the transmission shaft 71 can be configured in multiple interconnected configurations, thus allowing the cutting device (processing device) 100 to be configured as a modular structure that can be detached and connected (removably mounted) between the second cleaning mechanism 19 and the inspection section 13 or the drying table 112. In this case, for example, modules for performing inspections different from those performed in the inspection section 13 can be added between the modules on the second cleaning mechanism 19 side, the modules on the inspection section 13 side, or the modules on the drying table 112 side. In addition to the structures illustrated here, the cutting device (processing device) 100 can also be configured as a modular structure that can be detached and connected (removably mounted) at a certain point, and the added modules can be modules with various functions other than inspection.

[0444] In addition, the processing apparatus of the present invention can also perform processing other than cutting, such as cutting or grinding.

[0445] In addition, the present invention is not limited to the described embodiments, and various modifications can be made without departing from its spirit.

[0446] Industrial availability

[0447] According to the present invention, a processing apparatus is provided that automatically replaces a holding plate used to hold the workpiece.

Claims

1. A processing apparatus, comprising: A processing mechanism is used to process objects. A plate receiving section, which houses a holding plate for holding the workpiece being processed; The base is equipped with a retaining plate that can be detachably mounted, and the retaining plate is used to hold the workpiece being processed. A plate conveying mechanism conveys the holding plate between the plate receiving portion and the holding base; and The inspection agency inspects the installation status of the retaining plate on the retaining base. The plate receiving section has a multi-segment sliding frame section for mounting the holding plate. A protrusion is provided at the front of the sliding frame section, so that the plate conveying mechanism can use the protrusion to pull the sliding frame section outward. The plate conveying mechanism conveys the holding plate removed from the holding base to the plate receiving part and places it on the sliding frame part that slides to the outside. It then removes the holding plate from the sliding frame part that slides to the outside of the plate receiving part and conveys it back to the holding base. The retaining base has a fixing cylindrical portion that is inserted into a fixing insertion hole formed in the retaining plate; the fixing cylindrical portion has a cylindrical body, a movable member, and an elastic body, and when the fixing cylindrical portion is inserted into the fixing insertion hole, the movable member is in a protruding state, thereby fixing the retaining plate to the retaining base.

2. The processing apparatus according to claim 1, wherein the inspection mechanism comprises: The flow path is inspected, with an opening on the mounting surface of the retaining plate; and A detection sensor is provided in the inspection flow path to detect fluid leakage from the opening.

3. The processing apparatus according to claim 2, wherein the inspection flow path is supplied with compressed air. The detection sensor detects leakage of compressed air from the opening by detecting the pressure or flow rate of the compressed air flowing in the inspection path.

4. The processing apparatus according to claim 1, wherein the cylindrical body is inserted into the fixing insertion hole; the movable member is provided in a manner that allows it to move to a position protruding from the outer circumferential surface of the cylindrical body and to a position that is submerged; and the elastic body applies force in a manner that causes the movable member to be in a position protruding relative to the cylindrical body.

5. The processing apparatus according to claim 4, wherein when the inspection mechanism determines that the retaining plate is not in close contact with the mounting surface of the retaining base, the fixing cylindrical portion releases the retaining plate from its fixation and reinstalls the retaining plate.

6. The processing apparatus according to claim 1, wherein the plate conveying mechanism comprises: a conveying cylindrical portion inserted into a conveying retaining hole formed in the retaining plate, The conveying cylindrical section includes: a cylindrical body inserted into the conveying retaining hole; a movable member configured to move to a position protruding from the outer circumferential surface of the cylindrical body and a position submerged therein; and an elastic body that applies force to the movable member in a position protruding relative to the cylindrical body. With the conveying cylindrical part inserted into the conveying insertion hole, the movable member protrudes, thereby holding the holding plate in the plate conveying mechanism.

7. The processing apparatus according to claim 1, wherein the plate conveying mechanism raises and conveys the holding plate.

8. The processing apparatus according to claim 1, wherein the plate conveying mechanism conveys at least one of the following holding plates: A holding plate for processing a processing table used to process the workpiece; A holding plate for drying a drying table used to dry the processed object after it has been processed by the processing mechanism; A holding plate for inspecting the processed workpiece after processing; A holding plate for a transfer stage on which the processed workpiece is placed before classification; or A holding plate of a conveying holding mechanism for holding the processed object after it has been processed.

9. The processing apparatus according to claim 1, wherein the plate conveying mechanism is capable of conveying the processed object.

10. The processing apparatus according to claim 1, wherein the plate conveying mechanism is capable of conveying a pallet for classifying the processed objects.

11. The processing apparatus according to claim 1, wherein the plate conveying mechanism comprises: A first conveying mechanism conveys the holding plate between the plate receiving section and the temporary placement section; and The second conveying mechanism conveys the holding plate between the temporary placement section and the holding base.

12. The processing apparatus according to claim 11, wherein the first conveying mechanism is capable of conveying a pallet for classifying the processed objects.

13. The processing apparatus according to claim 11, wherein the second conveying mechanism is capable of conveying the processed object.

14. The processing apparatus according to claim 1, further comprising: A mounting platform holds an attachment member having an adhesive surface for attaching the workpiece, which has been monolithically processed by the processing mechanism. The plate conveying mechanism can convey the attached component to the mounting platform.

15. The processing apparatus according to claim 14, wherein the plate conveying mechanism comprises: A first conveying mechanism conveys the holding plate between the plate receiving section and the temporary placement section; and The second conveying mechanism conveys the holding plate between the temporary placement section and the holding base.

16. The processing apparatus of claim 15, wherein the first conveying mechanism is capable of conveying the attaching member to the mounting table.

17. The processing apparatus according to claim 15, wherein the second conveying mechanism is capable of conveying the monolithized processing object.

18. The processing apparatus according to claim 15, further comprising: The first holding mechanism holds the workpiece for transporting it to the processing table. The second holding mechanism holds the monolithized workpiece for transferring it from the processing table. A third holding mechanism holds the attaching member in order to transport the attaching member to the mounting platform; and The conveying mechanism has a common transmission shaft for moving the first holding mechanism, the second holding mechanism, and the third holding mechanism. The first conveying mechanism is constructed using the third holding mechanism and the conveying moving mechanism. The second conveying mechanism is configured using the second holding mechanism and the conveying moving mechanism.

19. The processing apparatus according to claim 15, further comprising: The attachment component receiving part houses the attachment component. The plate receiving part and the attachment component receiving part are arranged vertically to each other.

20. The processing apparatus according to claim 1, further comprising: A containment box is provided to hold any workpiece that has been pieced together by the processing mechanism and subsequently dropped. The plate conveying mechanism is capable of conveying the processed object, which has been monolithized, to the receiving box.

21. The processing apparatus according to claim 1, further comprising: The container setting section is provided with a cylindrical container, which receives the workpiece, which has been monolithized by the processing mechanism, from one end opening. as well as The transport and containment mechanism transports and contains the processed object, which has been monolithized, into the cylindrical container provided in the container setting section.

22. The processing apparatus according to claim 15, further comprising: The first holding mechanism holds the workpiece for transporting it to the processing table. The second holding mechanism holds the monolithized workpiece for transporting it from the processing table; and The conveying mechanism has a common transmission shaft for moving the first holding mechanism and the second holding mechanism. The plate conveying mechanism is configured using the second holding mechanism and the conveying moving mechanism.

23. A method for manufacturing a processed article, wherein the processed article is manufactured using the processing apparatus as described in any one of claims 1 to 22.

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