Light emitting device, display and method for manufacturing a light emitting device

Abstract

The application discloses a light-emitting device, a display and a preparation method of the light-emitting device. The light-emitting device comprises a substrate, the substrate comprises a first surface and a second surface, and a through hole penetrating through the substrate is arranged in the substrate. A light-emitting element is arranged on the first surface of the substrate and corresponds to the through hole on the substrate. A heat-conducting structure fills the through hole in the substrate, one end of the heat-conducting structure extends from the through hole to closely contact the light-emitting element, and the other end of the heat-conducting structure extends from the through hole to be flush with the second surface of the substrate or cover the second surface of the substrate. Thus, the light-emitting device can conduct the heat generated by the light-emitting element during operation through the heat-conducting structure arranged below the light-emitting element in the substrate, thereby improving the heat dissipation efficiency of the light-emitting device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and more specifically to a light-emitting device, a display, and a method for fabricating the light-emitting device. Background Technology

[0002] LED displays offer advantages such as rich colors, easy splicing, good uniformity, and low power consumption, making them widely used in conference venues, military command centers, security displays, and commercial displays. However, LED displays contain numerous LED chips. Because these chips are housed within a sealed space formed by the circuit board and the display panel, the heat generated during operation is difficult to dissipate and accumulates, making the chips prone to overheating and damage, thus affecting the display's brightness and lifespan.

[0003] In existing technologies, the heat generated by the LED chips in a display screen during operation is generally conducted through the circuit board and then dissipated naturally through the circuit board or the display screen casing. However, the thermal conductivity of existing circuit boards is very low, which cannot effectively conduct the heat generated by the LED chips, severely affecting the heat dissipation performance of the display screen. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a light-emitting device, a display, and a method for preparing the light-emitting device.

[0005] To achieve the above and other related objectives, the present invention provides a light-emitting device, comprising:

[0006] The substrate includes a first surface and a second surface disposed opposite to each other, and the substrate has a through hole penetrating the substrate;

[0007] A light-emitting element is disposed on the first surface of the substrate and is disposed corresponding to a through hole;

[0008] A thermally conductive structure is provided, which fills a through-hole. One end of the thermally conductive structure extends from the through-hole to be in close contact with the light-emitting element, and the other end extends to be flush with or cover the second surface of the substrate.

[0009] Optionally, the thermally conductive structure is formed as a thermally conductive pillar filling the through hole, with one end of the thermally conductive pillar extending from the through hole to be in close contact with the light-emitting element, and the other end being flush with the second surface of the substrate.

[0010] Optionally, it also includes:

[0011] The heat dissipation structure is attached to the second surface of the substrate and is in close contact with the heat-conducting pillars.

[0012] Optionally, the material forming the heat-conducting pillar includes either a thermally conductive metal or a thermally conductive silicone grease.

[0013] Optionally, the thermally conductive structure includes:

[0014] Thermally conductive pillars, filling the through-holes; and

[0015] A thermally conductive metal layer covers the second surface of the substrate.

[0016] Optionally, the thermally conductive metal layer has an uneven structure on the side away from the substrate.

[0017] Optionally, the thermally conductive structure includes:

[0018] A first thermally conductive metal layer covers the inner wall of the through-hole and the second surface of the substrate; and

[0019] A second thermally conductive metal layer covers the first thermally conductive metal layer and fills the through-hole.

[0020] Optionally, the thermally conductive structure includes:

[0021] A first thermally conductive metal layer covers the inner wall of the through hole and the second surface of the substrate;

[0022] A second thermally conductive metal layer is located above the first thermally conductive metal layer and forms a hollow structure therebetween; the second thermally conductive metal layer forms a continuous structure with the first thermally conductive metal layer at both ends; and

[0023] Cooling medium, filling hollow structures and through holes.

[0024] Optionally, the second thermally conductive metal layer of the thermally conductive structure forms an uneven structure on the side away from the substrate.

[0025] Optionally, the light-emitting element includes an electrode structure and a light-emitting structure, the electrode structure being bonded to a first surface of the substrate, the light-emitting structure corresponding to a through-hole on the substrate, and one end of the heat-conducting structure extending to the through-hole to be in close contact with the light-emitting structure.

[0026] Optionally, when the thermally conductive structure is formed of a thermally conductive metal material, an insulating layer is further provided between the thermally conductive structure and the electrode structure.

[0027] This invention also provides a method for fabricating a light-emitting device, comprising the following steps:

[0028] A substrate is provided, the substrate including a first surface and a second surface disposed opposite to each other, and a through hole is formed in the substrate;

[0029] The light-emitting element is transferred to the first surface of the substrate so that the position of the light-emitting element corresponds to that of the through hole;

[0030] A thermally conductive structure is formed by filling the through hole with thermally conductive material, and one end of the thermally conductive structure extends from the through hole to connect with the light-emitting element, while the other end extends to be flush with or cover the second surface of the substrate.

[0031] Optionally, filling the through-hole with thermally conductive material to form a thermally conductive structure further includes:

[0032] A heat-conducting pillar is formed in the through-hole by vapor deposition or sputtering, such that one end of the heat-conducting pillar is in close contact with the light-emitting device and the other end extends to be flush with the second surface of the substrate; or a heat-conducting pillar is formed in the through-hole, such that one end of the heat-conducting pillar is in close contact with the light-emitting device and the other end extends to be flush with the second surface of the substrate.

[0033] Optionally, it also includes:

[0034] Provide a heat dissipation structure;

[0035] The heat dissipation structure is tightly attached to the second surface of the substrate and the heat-conducting pillars flush with the second surface of the substrate.

[0036] Optionally, a thermally conductive structure is formed by filling the through-hole with a thermally conductive material, including:

[0037] A heat-conducting column is formed on the inner wall of the through hole by vapor deposition or sputtering.

[0038] A thermally conductive metal layer is formed on the second surface of the substrate and on the surface of the thermally conductive pillar flush with the second surface of the substrate by chemical vapor deposition.

[0039] The thermally conductive metal layer is etched to create a textured structure on the side of the thermally conductive metal layer away from the substrate.

[0040] Optionally, a thermally conductive structure is formed by filling the through-hole with a thermally conductive material, including:

[0041] A first thermally conductive metal layer is formed on the second surface of the substrate and the inner wall of the through hole by vapor deposition or sputtering.

[0042] A second thermally conductive metal layer is formed on the surface of the first thermally conductive metal layer by chemical vapor deposition, and the second thermally conductive metal layer fills the through-hole.

[0043] Optionally, a thermally conductive structure is formed by filling the through-hole with a thermally conductive material, including:

[0044] A first thermally conductive metal layer is formed on the second surface of the substrate and the inner wall of the through hole by vapor deposition or sputtering.

[0045] Provide a graphic template;

[0046] A second thermally conductive metal layer with a preset morphology is formed on the surface of the graphic template;

[0047] A second thermally conductive metal layer is bonded to both ends of the first thermally conductive metal layer to form a hollow structure between the first thermally conductive metal layer and the second thermally conductive metal layer.

[0048] A cooling medium is injected into the hollow structure.

[0049] Optionally, the second thermally conductive metal layer of the thermally conductive structure is formed as an uneven structure on the side away from the substrate.

[0050] The present invention also provides a display comprising any of the light-emitting devices described above.

[0051] Compared with the prior art, the light-emitting device, display, and method for preparing the light-emitting device described in this invention have at least the following beneficial effects:

[0052] The light-emitting device of this invention includes a substrate with a first surface and a second surface disposed opposite to each other. The substrate has through-holes. A light-emitting element is disposed on the first surface of the substrate, corresponding to the through-hole. A thermally conductive structure fills the through-hole in the substrate, with one end extending from the through-hole to be in close contact with the light-emitting element, and the other end extending to be flush with or covering the second surface of the substrate. The thermally conductive structure is made of a material with high thermal conductivity, which can directly transfer the heat generated by the light-emitting element to the heat dissipation structure, shortening the heat dissipation path and reducing the heat transferred from the substrate itself. Simultaneously, the thermally conductive structure is in direct contact with the light-emitting element, maximizing the contact area and increasing the heat conduction area. This achieves efficient heat dissipation of the light-emitting device, reduces the temperature of the light-emitting element, and improves the lifespan of the light-emitting element.

[0053] Furthermore, the thermal conductive structure of this application can have various configurations, allowing for different structures to be configured according to the type of substrate. Simultaneously, the thermal conductive material forming the structure can be selected from various options based on specific circumstances, thereby increasing the applicability of the thermal conductive structure and enabling it to be used in light-emitting devices with different substrate types, thus improving the heat dissipation effect and lifespan of various light-emitting devices.

[0054] The methods for preparing the display and the light-emitting device described in this invention both include the above-mentioned methods for preparing the light-emitting device, and can achieve the above-mentioned technical effects. Attached Figure Description

[0055] Figure 1 This is a schematic diagram of the structure of the light-emitting device described in Embodiment 1 of the present invention;

[0056] Figure 2 This is a schematic diagram of the structure of the light-emitting device described in Embodiment 2 of the present invention;

[0057] Figure 3This is a schematic diagram of the structure of the light-emitting device described in Embodiment 3 of the present invention;

[0058] Figure 4 This is a schematic diagram of the structure of the light-emitting device described in Embodiment 4 of the present invention;

[0059] Figure 5 This is a schematic diagram of the structure formed by the through holes on the substrate in Embodiment 5 of the present invention;

[0060] Figure 6 This is a schematic diagram of the structure formed by the through holes on the substrate in Embodiment 6 of the present invention;

[0061] Figure 7a This is a schematic diagram of the structure in Embodiment 7 of the present invention, showing the bonding of the light-emitting element to the first surface of the substrate;

[0062] Figure 7b This is a schematic diagram of the structure in Embodiment 7 of the present invention, in which the through hole is formed into a trapezoidal hole;

[0063] Figure 7c This is a schematic diagram of the structure of Embodiment 7 of the present invention, in which a first thermally conductive metal layer is formed on the second surface of the substrate and the inner wall of the through hole;

[0064] Figure 7d This is a schematic diagram of the structure in Embodiment 7 of the present invention in which the second thermally conductive metal layer is formed on the first thermally conductive metal layer;

[0065] Figure 8a This is a schematic diagram of the structure in Embodiment 8 of the present invention in which an insulating layer is formed on the inner wall of the electrode structure of the light-emitting element corresponding to the through hole;

[0066] Figure 8b This is a schematic diagram of the structure in Embodiment 8 of the present invention, in which a first thermally conductive metal layer is formed on the second surface of the substrate and the inner wall of the through hole;

[0067] Figure 8c This is a schematic diagram of the structure of the graphic template provided in Embodiment 8 of the present invention;

[0068] Figure 8d This is a schematic diagram of the structure in Embodiment 8 of the present invention in which a second thermally conductive metal layer is formed on the surface of a graphic template;

[0069] Figure 8e In embodiment 8 of the present invention, Figure 8b and Figure 8d A schematic diagram of a structure formed by phase bonding to create a hollow structure between the first and second thermally conductive metal layers.

[0070] List of reference numerals in the attached diagram:

[0071] 100 substrates

[0072] 101 Through Hole

[0073] 110 First Surface

[0074] 120 Second Surface

[0075] 200 light-emitting elements

[0076] 201 Electrode Structure

[0077] 202 Light-emitting structure

[0078] 300 thermally conductive structure

[0079] 310 heat-conducting column

[0080] 320 thermally conductive metal layer

[0081] 321 First thermally conductive metal layer

[0082] 322 Second thermally conductive metal layer

[0083] 323 Hollow Structure

[0084] 324 Cooling medium

[0085] 400 heat dissipation structure

[0086] 401 heat sink

[0087] 402 heat sink fins

[0088] 500 insulation layer

[0089] 600 photoresist mask

[0090] 601 Opening

[0091] 700 graphic templates Detailed Implementation

[0092] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.

[0093] It should be understood that the illustrations provided in the embodiments of this invention are merely schematic representations of the basic concept of the invention. Although the illustrations only show components relevant to the invention and are not drawn according to the actual number, shape, and size of components in implementation, the shape, quantity, and proportion of each component can be arbitrarily changed in actual implementation, and the component layout may also be more complex. The structures, proportions, sizes, etc., shown in the accompanying drawings are only used to complement the content disclosed in the specification for those skilled in the art to understand and read, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the invention can produce, should still fall within the scope of the technical content disclosed in this application.

[0094] Example 1

[0095] This embodiment provides a light-emitting device, which includes a substrate, a light-emitting element, and a heat-conducting structure. The substrate has a first surface and a second surface disposed opposite to each other, and a through-hole is formed through the substrate, connecting the first and second surfaces. The light-emitting element is disposed on the first surface of the substrate and corresponds to the through-hole. One end of the heat-conducting structure extends from the through-hole to be in close contact with the light-emitting element, and the other end extends to be flush with or cover the second surface of the substrate. Therefore, the heat generated by the light-emitting element during operation can be conducted to the second surface of the substrate through the heat-conducting structure, thereby improving the brightness and lifespan of the light-emitting device.

[0096] Specifically, refer to Figure 1 The substrate 100 includes a driving circuit for electrically connecting the light-emitting element 200 and controlling the on / off state of the light-emitting element 200. Optionally, the substrate 100 can be one of a PCB substrate, a TFT substrate, and a flexible PI substrate. In this embodiment, the substrate 100 is described using a TFT (Thin Film Transistor) substrate as an example.

[0097] The light-emitting element 200, serving as the light source of the light-emitting device, is disposed on the first surface 110 of the substrate 100 and corresponds to the through-hole 101 on the substrate 100. In this embodiment, the light-emitting element 200 includes a light-emitting structure 202 and an electrode structure 201. The two electrode structures 202 of the light-emitting element 200 are bonded to the first surface 110 of the substrate 100. The light-emitting structure 202 of the light-emitting element 200 corresponds to the through-hole 101 of the substrate 100 and can serve as the bottom wall of the through-hole 101 for subsequent direct growth of thermally conductive materials. Optionally, the light-emitting element 200 is an LED chip or a micro LED chip, such as a micro red LED chip, a micro blue LED chip, or a micro green LED chip. It should be noted that in this invention, the number of light-emitting elements 200 is several. This embodiment only uses the example of a single light-emitting element 200 disposed on the substrate 100 and should not be considered as a limitation of the invention.

[0098] The thermally conductive structure 300 fills the through-hole 101, with one end extending from the through-hole 101 to be in close contact with the light-emitting structure 202 of the light-emitting element 200, and the other end extending from the through-hole 101 to be flush with the second surface 120 of the substrate 100. In this embodiment, the thermally conductive structures 300 are all formed within the through-hole 101 corresponding to the surface of the light-emitting structure 202 of the light-emitting element 200. Therefore, when forming the thermally conductive structure within the through-hole 101, the thermally conductive structure 300 can be directly grown on the surface of the light-emitting structure 202, achieving direct contact between the thermally conductive structure 300 and the light-emitting structure of the light-emitting element 200, further improving heat dissipation efficiency. It should be noted that the thermal conductivity of the material of the thermally conductive structure 300 must be greater than that of the material of the substrate 100 to improve the heat transfer efficiency of the substrate 100 to the light-emitting element 200. In this embodiment, the thermally conductive structure 300 includes a first portion filling the through-hole 101 and a second portion covering the second surface 120 of the substrate 100. The first portion is formed as a thermally conductive pillar 310, and the second portion is formed as a thermally conductive metal layer 320. The first and second portions are formed as an integral structure, both made of thermally conductive metals, such as titanium or copper. An insulating layer 500 is also provided between the thermally conductive pillar 310 and the electrode structure 201 of the light-emitting element 200 to electrically isolate the electrode structure 201 from the thermally conductive metal.

[0099] In this embodiment, a heat dissipation structure 400 is further provided on the side of the thermally conductive metal layer 320 away from the substrate 100. This heat dissipation structure 400 is formed with an uneven structure, which increases the contact area between the heat sink and the ambient air, thus improving the heat dissipation efficiency of the light-emitting device. In other embodiments, this heat dissipation structure can also be an independent heat sink, which can be tightly fitted with the thermally conductive structure for heat dissipation. For example, the heat dissipation structure 400 can be as follows: Figure 2The finned heat sink shown includes a heat dissipation base plate 401 and heat dissipation fins 402 on the side away from the base plate 100. The heat dissipation base plate 401 and Figure 1 The thermally conductive metal layer 320 is tightly bonded to the heat dissipation substrate 401, making it fit snugly against the heat dissipation substrate 401. Figure 1 The heat-conducting structure 300 forms a tight connection, and conducts heat to the heat dissipation fins 402 through the heat dissipation substrate 401 for heat dissipation.

[0100] In this embodiment, both the heat-conducting pillar 310 and the heat-conducting metal layer 320 are grown by vacuum evaporation or chemical evaporation. This growth method enables the heat-conducting pillar 310 and the light-emitting element 200 to grow together, achieving seamless connection and avoiding the problem that the light-emitting element 200 and the heat-conducting pillar 310 cannot form effective contact, resulting in a reduction in the heat-conducting area.

[0101] Example 2

[0102] This embodiment provides a light-emitting device, which also includes a substrate, a light-emitting element, and a heat-conducting structure. The substrate has a first surface and a second surface disposed opposite to each other, and a through-hole is formed through the substrate, connecting the first surface and the second surface. The light-emitting element is disposed on the first surface of the substrate and corresponds to the through-hole. One end of the heat-conducting structure extends from the through-hole to be in close contact with the light-emitting element, and the other end extends to be flush with the second surface of the substrate. The similarities with Embodiment 1 will not be repeated here; the differences are as follows:

[0103] Reference Figure 2 In this embodiment, the thermally conductive structure 300 is a thermally conductive pillar 310 formed within the through-hole 101, and the material of the thermally conductive pillar 310 is thermally conductive silicone grease. Furthermore, a heat dissipation structure 400 is formed on the second surface 120 of the substrate 100, and this heat dissipation structure 400 is in contact with the second surface 120 of the substrate 100 and the thermally conductive silicone grease flush with the second surface 120 of the substrate 100. In this embodiment, the heat dissipation structure 400 is a finned heat sink, which includes a heat dissipation substrate 401 and heat dissipation fins 402 on the side away from the substrate 100. These heat dissipation fins 402 can further dissipate the heat generated by the light-emitting element 200, which is beneficial to improving the heat dissipation efficiency of the light-emitting element 200.

[0104] Example 3

[0105] This embodiment provides a light-emitting device, which also includes a substrate, a light-emitting element, and a heat-conducting structure. The substrate has a first surface and a second surface disposed opposite to each other, and a through-hole is formed through the substrate, connecting the first surface and the second surface. The light-emitting element is disposed on the first surface of the substrate and corresponds to the through-hole. One end of the heat-conducting structure extends from the through-hole to be in close contact with the light-emitting element, and the other end extends and covers the second surface of the substrate. The similarities and differences with Embodiment 1 will not be repeated here; the main differences are:

[0106] Reference Figure 3 In this embodiment, the substrate 100 is a flexible PI substrate, and the thermally conductive structure 300 includes a first thermally conductive metal layer 321 and a second thermally conductive metal layer 322. The first thermally conductive metal layer 321 covers the second surface 120 of the substrate 100 and the inner wall of the through hole 101. The first thermally conductive metal layer 321 is formed by vapor deposition or sputtering, so that the first thermally conductive metal layer 321 and the bottom of the light-emitting element 200 exposed in the through hole 101 are tightly connected. Optionally, the thickness of the first thermally conductive metal layer 321 is less than 1 μm. In this embodiment, an insulating layer 500 is also provided between the first thermally conductive metal layer 321 and the electrode structure 201 of the light-emitting element 200 to electrically isolate the electrode structure 201 from the thermally conductive metal.

[0107] The second thermally conductive metal layer 322 covers the first thermally conductive metal layer 321 and fills the through hole 101. The second thermally conductive metal layer 322 forms a heat dissipation structure 400 on the side away from the substrate 100. The heat dissipation structure 400 is a concave-convex structure, which can increase the contact area between the second thermally conductive metal layer 322 and the outside world, and increase the heat conduction or heat dissipation effect.

[0108] Example 4

[0109] This embodiment provides a light-emitting device, which also includes a substrate, a light-emitting element, and a heat-conducting structure. The substrate has a first surface and a second surface disposed opposite to each other, and a through-hole is formed through the substrate, connecting the first surface and the second surface. The light-emitting element is disposed on the first surface of the substrate and corresponds to the through-hole. One end of the heat-conducting structure extends from the through-hole to be in close contact with the light-emitting element, and the other end extends and covers the second surface of the substrate. The similarities with Embodiment 1 will not be repeated here; the differences are as follows:

[0110] Reference Figure 4In this embodiment, the thermally conductive structure 300 includes a first thermally conductive metal layer 321, a second thermally conductive metal layer 322, and a cooling medium 324. The first thermally conductive metal layer 321 covers the inner wall of the through-hole 101 and the second surface 120 of the substrate 100. The second thermally conductive metal layer 322 is located above the first thermally conductive metal layer 321 and forms a hollow structure 323 with it. The second thermally conductive metal layer 322 forms a continuous structure with the first thermally conductive metal layer 321 at both ends of the first thermally conductive metal layer 322. The cooling medium 324 fills the hollow structure 323 and the through-hole 101. In this embodiment, an insulating layer 500 is also provided between the first thermally conductive metal layer 321 and the electrode structure 201 of the light-emitting element 200 to electrically isolate the electrode structure 201 from the thermally conductive metal. Optionally, the cooling medium 324 can be water, oil, or air. In this embodiment, the cooling medium 324 is oil. The oil achieves faster heat conduction and improves heat dissipation efficiency through the molecular motion of heated oil.

[0111] Example 5

[0112] This embodiment provides a method for fabricating a light-emitting device, including the following steps:

[0113] S101: A substrate is provided, the substrate including a first surface and a second surface disposed opposite to each other, and a through hole is formed in the substrate;

[0114] Reference Figure 5 A substrate 100 is provided, having a first surface 110 and a second surface 120 disposed opposite to each other. A through-hole 101 is formed on the substrate 100 using a laser. In other embodiments, a through-hole 101 can also be formed on the substrate 100 by forming a photoresist mask 600 above the substrate 100, forming an opening 601 on the photoresist mask 600, and etching along the opening 601. Figure 6 As shown.

[0115] S102: Transfer the light-emitting element to the first surface of the substrate so that the position of the light-emitting element corresponds to the position of the through hole;

[0116] Reference Figure 7a The light-emitting element 200 is transferred and bonded to the first surface 110 of the substrate 100, so that the position of the light-emitting element 200 corresponds to the through hole 101, and the light-emitting structure 202 of the light-emitting element 200 covers the through hole 101.

[0117] S103: A thermally conductive structure is formed by filling the through hole with thermally conductive material, and one end of the thermally conductive structure extends from the through hole to connect with the light-emitting element, and the other end extends and covers the second surface of the substrate.

[0118] In this embodiment, refer to Figure 1A thermally conductive metal material is vapor-deposited into the through-hole 101 of the second surface 120 of the substrate 100, thereby filling the through-hole 101 to form a thermally conductive pillar 310. Further chemical vapor deposition of the thermally conductive metal material is then performed to form a thermally conductive metal layer 320 on the second surface 120 of the substrate 100. The thermally conductive pillar 310 and the thermally conductive metal layer 320 are integrally formed. Since the material formed within the through-hole 101 in this embodiment is a thermally conductive metal material, to ensure electrical insulation between the thermally conductive metal material and the electrode structure 201 of the light-emitting element 200, this embodiment further includes forming an insulating layer 500 between the electrode structure 201 of the light-emitting element 200 and the thermally conductive metal material before forming the thermally conductive metal layer 320. Specifically, before depositing a thermally conductive metal material within the through-hole 101 of the second surface 120 of the substrate 100, a thin insulating layer can be deposited through the through-hole 101. The insulating layer deposited on the inner wall of the through-hole 101 and on the surface of the light-emitting structure 202 through the through-hole 101 can then be etched away to obtain… Figure 1 An insulating layer 500 is formed on the surface of the electrode structure 201 through a through hole 101.

[0119] The thermally conductive metal layer 320 is etched to form a heat dissipation structure 400 on the side of the thermally conductive metal layer 320 away from the substrate 100. The heat dissipation structure 400 is formed as a concave-convex structure to increase the contact area between the thermally conductive metal layer 320 and the outside world and increase the heat dissipation effect.

[0120] Example 6

[0121] This embodiment provides a method for fabricating a light-emitting device, which is similar to that of Embodiment 5 and will not be repeated here. The difference is that:

[0122] S103: A thermally conductive structure is formed by filling the through hole with thermally conductive material, and one end of the thermally conductive structure extends from the through hole to connect with the light-emitting element, and the other end extends to be flush with the second surface of the substrate.

[0123] In this embodiment, refer to Figure 2 Thermal grease is formed in the through hole 101 by spin coating or spraying. Due to the insulating properties of thermal grease, it is not necessary to form an insulating layer 500 before filling the through hole 101 with thermal grease, which simplifies the preparation steps and saves the manufacturing cost of the light-emitting device.

[0124] After forming the thermal grease, the method further includes: providing a finned heat sink, which includes a heat sink substrate 401 and heat sink fins 402 disposed on one side of the heat sink substrate, so that the second surface 120 of the substrate 100 is attached to the surface of the heat sink substrate 401, so that the thermal grease is tightly attached to the heat sink substrate 401, and the heat generated by the light-emitting element 200 is conducted to the heat sink substrate 401 through the thermal grease, and the heat dissipation effect is further increased through the heat sink fins 402.

[0125] Example 7

[0126] This embodiment provides a method for fabricating a light-emitting device, which is similar to that of Embodiment 5 and will not be repeated here. The difference is that:

[0127] S101: A substrate is provided, the substrate including a first surface and a second surface disposed opposite to each other, and a through hole is formed in the substrate;

[0128] Reference Figure 6 A substrate 100 is provided, having a first surface 110 and a second surface 120 disposed opposite to each other. In this embodiment, the substrate 100 is a flexible PI substrate. A photoresist mask 600 is formed on the flexible PI substrate, and an opening 601 is formed on the photoresist mask 600. The substrate 100 is etched along the opening 601 to form a through hole 101 on the substrate 100.

[0129] S103: A thermally conductive structure is formed by filling the through hole with thermally conductive material, and one end of the thermally conductive structure extends from the through hole to connect with the light-emitting element, and the other end extends and covers the second surface of the substrate.

[0130] Reference Figure 7b An insulating layer is deposited through the via 101, and the insulating layer located on the inner wall of the via 101 and deposited on the surface of the light-emitting structure 202 through the via 101 is etched away to obtain the insulating layer 500 deposited on the surface of the electrode structure 201 through the via 101.

[0131] To facilitate the deposition of thermally conductive material on the inner wall of the through-hole 101 or on the insulating layer 500, this embodiment further includes pre-processing the through-hole 101 and the insulating layer 500 on the surface of the electrode structure 201 after the insulating layer 500 is formed, so that the through-hole 101 and the insulating layer 500 on the surface of the electrode structure 201 are formed into a trapezoidal hole. Specifically, the trapezoidal hole can be formed by simultaneously etching the inner wall of the through-hole 101 and the insulating layer 500 on the surface of the electrode structure 201.

[0132] Reference Figure 7c A first thermally conductive metal layer 321 is formed on the second surface 120 of the substrate 100 and on the inner wall of the trapezoidal hole by sputtering or vapor deposition.

[0133] Reference Figure 7d A second thermally conductive metal layer 322 is formed on the surface of the first thermally conductive metal layer 321 by chemical vapor deposition.

[0134] Reference Figure 3The second thermally conductive metal layer 322 is etched so that a heat dissipation structure 400 is formed on the side of the second surface 120 away from the substrate 100. The heat dissipation structure 400 is formed as a concave-convex structure, which can increase the contact area with the outside world and increase the heat dissipation effect.

[0135] Example 8

[0136] This embodiment provides a method for fabricating a light-emitting device, which is similar to that of Embodiment 5 and will not be repeated here. The difference is that:

[0137] S103: A thermally conductive structure is formed by filling the through hole with thermally conductive material, and one end of the thermally conductive structure extends from the through hole to connect with the light-emitting element, and the other end extends and covers the second surface of the substrate.

[0138] Reference Figure 8a An insulating layer 500 is formed on the sidewall of the electrode structure 201 of the light-emitting element 200 corresponding to the through hole 101 to ensure that the electrode structure 201 is electrically insulated from the subsequently formed thermally conductive metal layer 320.

[0139] Reference Figure 8b A first thermally conductive metal layer 321 is formed on the second surface 120 of the substrate 100 and the inner wall of the through hole 101 by sputtering or vapor deposition.

[0140] Reference Figure 8c A graphic template 700 is provided, the surface of which has a pre-defined concave-convex structure.

[0141] Reference Figure 8d A second thermally conductive metal layer 322 is formed by chemical vapor deposition in the uneven structure on the surface of the graphic template 700.

[0142] Reference Figure 8e ,Will Figure 8d The graphic template 700 with the second thermally conductive metal layer 322 and Figure 8b The first thermally conductive metal layer 321 is bonded to the second thermally conductive metal layer 322, forming a hollow structure 323 between the first thermally conductive metal layer 321 and the second thermally conductive metal layer 322. The second thermally conductive metal layer 322 forms a continuous structure with the first thermally conductive metal layer 321 at both ends. An opening is made in the hollow structure 323, and the coolant is injected into the hollow structure 323 through the opening. After it is completely filled, the hollow structure 323 is welded and sealed. At the same time, the pattern template 700 is removed by wet etching to form the thermally conductive structure 300. In this embodiment, oil is used as the coolant 324. The molecular movement of the heated oil achieves a faster heat conduction effect, which can further enhance the heat dissipation effect of the light-emitting device.

[0143] Example 9

[0144] This embodiment provides a display that includes any of the light-emitting devices described in embodiments 1 to 4. Similarly, this embodiment uses a heat-conducting structure 300 located in the substrate 100 below the light-emitting element 200 to conduct the heat generated when the light-emitting element 200 is working, which can effectively improve the heat dissipation efficiency of the light-emitting device and the display.

[0145] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A light-emitting device, characterized in that, include: A substrate includes a first surface and a second surface disposed opposite to each other, the substrate has a through hole penetrating the substrate, and the substrate includes a driving circuit. A light-emitting element is disposed on the first surface of the substrate and corresponding to the through hole. The light-emitting element includes a light-emitting structure and an electrode structure. The light-emitting structure corresponds to the through hole of the substrate. The two electrode structures of the light-emitting element are bonded to the first surface of the substrate. A thermally conductive structure fills the through-hole, the thermally conductive structure is electrically insulated from the electrode structure, and one end of the thermally conductive structure extends from the through-hole to be in close contact with the light-emitting element. The thermally conductive structure includes a first thermally conductive metal layer, a second thermally conductive metal layer and a cold medium. The first thermally conductive metal layer covers the inner wall of the through-hole and the second surface of the substrate. The second thermally conductive metal layer is located above the first thermally conductive metal layer and forms a hollow structure with the first thermally conductive metal layer. The second thermally conductive metal layer forms a continuous structure with the first thermally conductive metal layer at both ends. The cooling medium fills the hollow structure and the through hole; the thermally conductive structure is formed in the through hole and directly contacts the light-emitting structure of the light-emitting element after the light-emitting element is attached to the substrate.

2. The light-emitting device according to claim 1, characterized in that, The second thermally conductive metal layer of the thermally conductive structure has an uneven structure on the side away from the substrate.

3. The light-emitting device according to claim 1, characterized in that, An insulating layer is also provided between the heat-conducting structure and the electrode structure.

4. A method for fabricating a light-emitting device, characterized in that, Includes the following steps: A substrate is provided, the substrate including a driving circuit, the substrate including a first surface and a second surface disposed opposite to each other, and a through hole is formed in the substrate; The light-emitting element is transferred to the first surface of the substrate, so that the position of the light-emitting element corresponds to the position of the through hole; the light-emitting element includes a light-emitting structure and an electrode structure, the light-emitting structure corresponds to the through hole of the substrate, and the two electrode structures of the light-emitting element are bonded to the first surface of the substrate; A thermally conductive structure is formed by filling the through-hole with a thermally conductive material. The thermally conductive structure is electrically insulated from the electrode structure. One end of the thermally conductive structure extends from the through-hole to connect with the light-emitting element. The thermally conductive structure includes a first thermally conductive metal layer, a second thermally conductive metal layer, and a cold medium. The first thermally conductive metal layer covers the inner wall of the through-hole and the second surface of the substrate. The second thermally conductive metal layer is located above the first thermally conductive metal layer and forms a hollow structure with the first thermally conductive metal layer. The second thermally conductive metal layer forms a continuous structure with the first thermally conductive metal layer at both ends. The cooling medium fills the hollow structure and the through holes.

5. The method for fabricating a light-emitting device according to claim 4, characterized in that, A thermally conductive structure is formed by filling the through-hole with a thermally conductive material, including: A first thermally conductive metal layer is formed on the second surface of the substrate and the inner wall of the through hole by vapor deposition or sputtering. Provide a graphic template; A second thermally conductive metal layer with a preset morphology is formed on the surface of the graphic template; The first thermally conductive metal layer is bonded to the second thermally conductive metal layer at both ends to form a hollow structure between the first thermally conductive metal layer and the second thermally conductive metal layer. A cooling medium is injected into the hollow structure.

6. The method for fabricating a light-emitting device according to claim 5, characterized in that, The second thermally conductive metal layer of the thermally conductive structure is formed in a concave-convex structure on the side away from the substrate.

7. A display, characterized in that, Includes the light-emitting device as described in any one of claims 1 to 6.

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