A cleaning method for a glass substrate used in inkjet printing

Abstract

The application relates to a cleaning method for a glass substrate for inkjet printing, comprising the following steps: continuously injecting a cleaning gas into a cleaning chamber, maintaining the air pressure in the cleaning chamber at a preset standard air pressure; obtaining a substrate and feeding the substrate into the cleaning chamber below a cleaning assembly; obtaining the position of the substrate, determining a cleaning starting point and planning a cleaning path; driving the relative movement of the cleaning assembly and / or the substrate according to the cleaning path, so that the cleaning assembly scans the surface of the substrate row by row. The application injects a cleaning gas into the cleaning chamber to ensure that the substrate is not easily repeatedly contaminated during and after cleaning, and the cleaning path is planned according to the position of the substrate. The substrate is cleaned row by row by the cleaning assembly, ensuring that the substrate is fully cleaned, improving the cleaning quality and efficiency of the substrate, and ensuring the inkjet printing processing quality of the subsequent substrate.

Description

Technical Field

[0001] This application relates to the field of display panel processing technology, and in particular to a cleaning method for glass substrates used in inkjet printing. Background Technology

[0002] OLED displays are displays made using organic light-emitting diodes. Due to their superior characteristics, such as not requiring a backlight, high contrast, thinness, wide viewing angle, fast response speed, applicability to flexible panels, wide operating temperature range, and simpler construction and manufacturing process, they are considered to be the next generation of emerging application technology for flat panel displays.

[0003] OLED device cathodes are typically fabricated using vacuum evaporation, which involves expensive evaporation equipment and photomasks. Inkjet printing technology can significantly reduce costs for cathode fabrication, but the biggest challenge lies in achieving large-area uniform film deposition. In research on OLED display fabrication using an all-printing process, the key lies in the development of printable cathode inks and the realization of large-area film deposition technology. The main difficulties are: first, ensuring the affinity between the cathode material and the organic functional layer to guarantee stable film deposition of the printed cathode; second, ensuring the precision of the printed pattern to guarantee high-resolution displayed images; third, avoiding damage to the underlying layer from the cathode paste; and fourth, ensuring effective carrier injection to guarantee high brightness and high-efficiency display performance.

[0004] In related technologies, to ensure stable ink film formation on the substrate, the substrate needs to be cleaned before inkjet printing. Generally, wet cleaning methods such as high-pressure rinsing or brushing can be used, or dry cleaning methods such as ultrasonic cleaning or plasma cleaning can be used. During dry cleaning, the substrate is transported along the cleaning direction, and the cleaning unit cleans the surface of the substrate.

[0005] However, due to the size limitations of the cleaning unit, its cleaning range cannot cover the width of medium to large-sized substrates. After cleaning, uncleaned areas remain on the substrate surface, severely impacting the inkjet printing quality of subsequent substrates. Furthermore, even after the substrate has moved through the cleaning unit, external particles may still adhere to the cleaned substrate surface, contaminating it and resulting in poor substrate cleaning, further affecting the inkjet printing quality of subsequent substrates. Summary of the Invention

[0006] This application provides a method for cleaning glass substrates for inkjet printing, in order to solve the technical problems in related technologies such as incomplete substrate cleaning, the substrate still being contaminated after cleaning, poor substrate cleaning effect, and the impact on the quality of subsequent inkjet printing processing of the substrate.

[0007] In a first aspect, a method for cleaning a glass substrate for inkjet printing is provided, comprising the following steps:

[0008] Clean gas is continuously injected into the cleaning chamber to maintain the air pressure in the cleaning chamber at the preset standard air pressure;

[0009] Obtain the substrate and load it into the cleaning chamber, placing it below the cleaning assembly;

[0010] The location of the substrate is determined, the cleaning starting point is identified, and the cleaning path is planned.

[0011] According to the cleaning path, drive the relative movement of the cleaning components and / or substrate, so that the cleaning components scan and clean the substrate surface line by line.

[0012] In some embodiments, the relative movement of the driving cleaning assembly and / or substrate includes:

[0013] The drive substrate moves relative to the cleaning assembly in the X-axis direction to clean the substrate;

[0014] The drive cleaning component moves relative to the substrate in the Y-axis direction to change the cleaning position on the substrate.

[0015] In some embodiments, obtaining the location of the substrate, determining the cleaning starting point, and planning the cleaning path includes:

[0016] Obtain the position information at the four corners of the substrate;

[0017] Based on the position information at the four corners of the substrate, the areas to be cleaned are set along the X-axis and Y-axis directions of the adjacent two side lines, respectively, and the areas to be cleaned completely cover the substrate.

[0018] Set one corner of the area to be cleaned as the starting point for cleaning;

[0019] Obtain the unit cleaning length of the cleaning range of the cleaning component in the Y-axis direction;

[0020] The number of times to clean row by row is obtained based on the length of the area to be cleaned in the Y-axis direction and the unit cleaning length;

[0021] The cleaning path is planned based on the number of times each row is cleaned and the starting point of the cleaning process.

[0022] In some embodiments, the step of planning the cleaning path based on the number of line-by-line cleaning cycles and the cleaning starting point includes:

[0023] Each cleaning area overlaps with the previous cleaning area, and the width of the overlapping area is a preset overlap width.

[0024] In some embodiments, after loading the substrate into the cleaning chamber, the method further includes: a correction substrate, the correction substrate comprising:

[0025] Obtain the position information of any two measurement points on one side of the substrate;

[0026] Rotate the substrate so that the direction of the line connecting the two measurement points on the substrate is set along the X-axis or Y-axis.

[0027] In some embodiments, after the substrate is loaded into the cleaning chamber and positioned below the cleaning assembly, the method further includes:

[0028] Based on the substrate cleaning process, select the cleaning unit of the cleaning assembly for substrate cleaning.

[0029] In some embodiments, after the cleaning component scans and cleans the substrate surface line by line, the method further includes: substrate surface cleanliness detection; if the substrate surface cleanliness detection is qualified, the substrate cleaning is completed; otherwise, the substrate is cleaned again.

[0030] In some embodiments, the substrate surface cleanliness detection includes particle quantity detection and contact angle detection;

[0031] The particle count detection includes: obtaining the number of particles on the substrate surface; if the number of particles on the substrate surface is less than or equal to a preset standard particle count, the detection is qualified.

[0032] The contact angle detection includes: obtaining the contact angle of water droplets on the substrate surface; if the contact angle of water droplets on the substrate surface is less than or equal to the preset standard contact angle of water droplets, the detection is qualified.

[0033] In some embodiments, maintaining the air pressure within the cleaning chamber at a preset standard air pressure includes:

[0034] Obtain clean gas flow information;

[0035] Obtain the chamber temperature information within the cleaning chamber;

[0036] The airflow of the cleaning gas is adjusted based on feedback from the chamber temperature and gas flow information to maintain the air pressure in the cleaning chamber at the preset standard pressure.

[0037] In some embodiments, after loading the substrate into the cleaning chamber and placing it below the cleaning assembly, the method further includes:

[0038] Adjust the height of the cleaning component relative to the substrate to the preset standard height.

[0039] In some embodiments, after the cleaning assembly scans and cleans the substrate surface line by line, the method further includes:

[0040] The substrate is subjected to static electricity removal treatment.

[0041] The beneficial effects of the technical solution provided in this application include:

[0042] This application provides a method for cleaning glass substrates used in inkjet printing. During substrate cleaning, cleaning gas is continuously injected into the cleaning chamber. This process expels the original gas from the chamber, removing suspended dust and other particulate impurities, maintaining a clean atmosphere. Furthermore, the clean airflow maintains the pressure within the cleaning chamber at standard levels, creating a slightly positive pressure that prevents external impurities from entering. Therefore, the substrate is less prone to re-contamination during cleaning, improving cleaning quality. Additionally, based on a predetermined cleaning path, the cleaning assembly uses a line-by-line scanning method to clean the substrate surface, enabling the cleaning of medium to large-sized substrates. This ensures thorough cleaning, guarantees substrate quality, and the path-based cleaning process increases efficiency. This, in turn, ensures the quality of subsequent inkjet printing processing on the substrate. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 A flowchart illustrating a method for cleaning a glass substrate for inkjet printing, provided in an embodiment of this application.

[0045] Figure 2 This is a schematic diagram of the substrate and the area to be cleaned provided in an embodiment of this application;

[0046] Figure 3 This is a schematic diagram of the substrate after correction provided in an embodiment of this application;

[0047] Figure 4 A schematic diagram of the cleaning assembly performing line-changing cleaning according to an embodiment of this application;

[0048] Figure 5 This is a schematic diagram showing the substrate after cleaning, as provided in an embodiment of this application.

[0049] In the figure: a, substrate; b, area to be cleaned; c, overlapping area; d, cleaning assembly. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] This application provides a cleaning method for glass substrates used in inkjet printing. This method injects cleaning gas into a cleaning chamber to ensure the substrate is not easily re-contaminated during and after cleaning. The cleaning path is planned according to the substrate's position, and a cleaning assembly scans the substrate line by line to ensure thorough cleaning. This improves the cleaning quality and efficiency, thus ensuring the quality of subsequent inkjet printing. This application solves the technical problems in related technologies where incomplete substrate cleaning and the possibility of continued contamination after cleaning result in poor substrate cleaning and negatively impacts the quality of subsequent inkjet printing.

[0052] Reference Figure 1 A method for cleaning a glass substrate for inkjet printing includes the following steps S100-S900: Wherein:

[0053] S100: Continuously inject clean gas into the cleaning chamber to maintain the air pressure in the cleaning chamber at the preset standard air pressure.

[0054] S200: Obtain substrate a and load substrate a into the cleaning chamber, and place it below the cleaning assembly d.

[0055] S300, correction substrate a.

[0056] S400, Adjust the height of the cleaning component d relative to the substrate a to the preset standard height.

[0057] S500: Obtain the position of substrate a, determine the cleaning starting point, and plan the cleaning path.

[0058] S600. Based on the cleaning process of substrate a, select the cleaning unit of cleaning component d for cleaning substrate a.

[0059] S700. According to the cleaning path, drive the cleaning component d and / or substrate a to move relative to each other, so that the cleaning component d scans and cleans the surface of substrate a line by line.

[0060] S800, Perform static electricity removal treatment on substrate a.

[0061] S900, surface cleanliness test of substrate a.

[0062] Step S100 involves continuously injecting cleaning gas into the cleaning chamber to maintain the air pressure within the cleaning chamber at a preset standard pressure. This specifically includes steps S110 and S120.

[0063] S110. Continuously inject cleaning gas into the cleaning chamber.

[0064] S120. Maintain the air pressure in the cleaning chamber at the preset standard air pressure.

[0065] Specifically, in step S110, a cleaning gas, including nitrogen, is continuously injected into the cleaning chamber via a fan to remove moisture and maintain a clean atmosphere. Additionally, the fan supplies cleaning gas to the cleaning chamber from top to bottom to ensure complete filling. During the cleaning process of substrate a, cleaning gas is continuously injected into the cleaning chamber.

[0066] Specifically, step S120 includes steps S121-S123.

[0067] S121. Obtain clean gas flow information.

[0068] S122. Obtain the chamber temperature information inside the cleaning chamber.

[0069] S123. Adjust the airflow of the cleaning gas according to the feedback of the chamber temperature and gas flow information to maintain the air pressure in the cleaning chamber at the preset standard air pressure.

[0070] S121, Obtain clean gas flow information. Specifically:

[0071] The airflow rate of clean gas is monitored using a gas flow monitoring device.

[0072] S122. Obtain the chamber temperature information within the cleaning chamber. Specifically:

[0073] The temperature inside the cleaning chamber is detected by a temperature sensor. Furthermore, multiple temperature sensors can be distributed throughout the cleaning chamber to obtain the temperature at multiple points inside the cleaning chamber. The average value is then taken as the measured temperature, thereby reducing the temperature measurement error.

[0074] Specifically, S123 adjusts the airflow of the cleaning gas based on feedback from chamber temperature and gas flow information to maintain the air pressure within the cleaning chamber at a preset standard pressure.

[0075] The power of the fan is controlled by a motion controller (PLC), which in turn controls the air volume output by the fan. The output air velocity W is obtained according to Equation 1. Equation 1:

[0076] W = (D in -D0)×(Am -A0) / (D m -D0)+A0

[0077] Where W: output wind speed; D in D0: Analog input value after A / D conversion (obtained by gas flow monitoring device), unit: m / s; D0: Lower limit value of analog quantity after A / D conversion, unit: m / s; D m : Upper limit of analog quantity after A / D conversion, in m / s; A m A0: Standard signal upper limit; A1: Standard signal lower limit.

[0078] Furthermore, the temperature compensation coefficient and flow rate analog quantity are input into the PLC to adjust the clean gas flow rate based on feedback. The adjusted flow rate is calculated using Equation 2, with units of m / s. Equation 2:

[0079] W v =1 / T r ×[(D in -D0)×(A m -A0) / (D m -D0)+A0]+(F c -F c0 ) / 10

[0080] Among them, T r Temperature compensation coefficient; F c : Analog input value for flow rate; F c0 : Standard flow rate input value. Specifically, F c0 0.4 m / s is acceptable.

[0081] Specifically: T r =(T in -25) / (T m -T0)

[0082] Among them, T in : Analog temperature input (obtained from a temperature sensor), in degrees Celsius; 25: Reference temperature, in degrees Celsius; T m T0: Upper limit of temperature during cleaning, in degrees Celsius; T0: Reference ambient temperature, in degrees Celsius.

[0083] Specifically: F c =(A in -A0)×(D m -D0) / (A m -A0)+D0

[0084] This setup allows for precise adjustment of the injected airflow of the cleaning gas by combining the gas flow rate and the temperature inside the cleaning chamber. This makes the airflow adjustment of the cleaning gas entering the cleaning chamber more sensitive and accurate, and facilitates the maintenance of stable air pressure inside the cleaning chamber.

[0085] The preset standard air pressure is a slightly positive pressure state; in this embodiment, the standard air pressure is between 1200-1400 Pa. By precisely adjusting the airflow of the cleaning gas through temperature and gas flow rate, it is easier to maintain the air pressure in the cleaning chamber at the standard air pressure, thereby improving the cleaning effect.

[0086] If the air pressure inside the cleaning chamber is higher than the standard air pressure, it will affect the stability of the substrate placement and adversely interfere with the subsequent cleaning process. If the air pressure inside the cleaning chamber is lower than the standard air pressure, impurities from the external environment can easily enter the cleaning chamber and contaminate substrate a.

[0087] In step S200, substrate a is obtained and loaded into the cleaning chamber, positioned below the cleaning assembly d. Specifically:

[0088] The substrate a to be cleaned is loaded into the cleaning chamber by manual labor or a robotic arm, and the substrate a is placed on the cleaning stage below the cleaning assembly d so that the cleaning assembly d can clean the surface of the substrate a.

[0089] Step S500 involves obtaining the position of substrate a, determining the cleaning starting point, and planning the cleaning path. Specifically, this includes steps S510-S560.

[0090] S510: Obtain the position information of the four corners of substrate a.

[0091] S520. Based on the position information of the four corners of substrate a, the cleaning areas b are set along the X-axis and Y-axis directions of the adjacent two side lines respectively, and the cleaning areas b completely cover substrate a.

[0092] S530, Set one corner of the area to be cleaned b as the starting point for cleaning.

[0093] S540. Obtain the unit cleaning length of the cleaning range of the cleaning component d in the Y-axis direction.

[0094] S550. Based on the length of the area to be cleaned b in the Y-axis direction and the unit cleaning length, the number of cleaning cycles is obtained.

[0095] S560. Plan the cleaning path based on the number of cleaning cycles and the starting point of the cleaning process.

[0096] In step S510, the position information of the four corners of substrate a is obtained. Specifically:

[0097] A coordinate system can be established based on the relative movement directions of the cleaning stage used to support substrate a and the cleaning assembly d. In this embodiment, the cleaning stage and the cleaning assembly d can move relative to the X-axis and Y-axis directions, where the X-axis direction is the left-right direction and the Y-axis direction is the front-back direction. For ease of understanding, X and Y in the figure refer to the X-axis direction and the Y-axis direction, respectively. A calibration point can be preset as the reference origin of the coordinate system.

[0098] The position information of the four corners of substrate a includes coordinate information. By using the coordinate information of the four corners of substrate a, the position of the positioning substrate a can be determined.

[0099] In step S520, based on the position information of the four corners of substrate a, cleaning areas b are obtained, which are set along the X-axis and Y-axis directions of adjacent side lines, respectively, and the cleaning areas b completely cover substrate a. Specifically:

[0100] Reference Figure 2 The area to be cleaned, b, is a square region with adjacent sides along the X-axis and Y-axis, respectively. The relative movement of the substrate a and the cleaning component d along the X-axis and Y-axis enables complete cleaning of area b. Since substrate a is located within area b, it is cleaned along with area b. It is important to note that area b is a virtual location, custom-generated based on the size and position of substrate a, and it moves synchronously with the substrate a.

[0101] Furthermore, the four corners of substrate a all fall on the edge of the area to be cleaned b, so as to fully reduce the area of ​​the area to be cleaned b and improve the cleaning efficiency.

[0102] In step S530, a corner of the area to be cleaned, b, is set as the starting point for cleaning. Specifically:

[0103] Reference Figure 2 and Figure 3 The cleaning starting point is set at one corner of the area to be cleaned, specifically the upper left corner. Substrate a then moves to the left relative to the cleaning assembly d to clean it. Using a corner as the starting point facilitates subsequent cleaning path planning and minimizes the cleaning path length.

[0104] Furthermore, the center of the cleaning surface of the cleaning component d is the position determination point of the cleaning component d. That is, the center of the cleaning surface of the cleaning component d moves to the cleaning starting point to start the cleaning work. This ensures that the entire area b to be cleaned is cleaned.

[0105] Specifically, step S540 involves obtaining the unit cleaning length of the cleaning range of the cleaning component d in the Y-axis direction.

[0106] The cleaning range of cleaning component d is the area cleaned when cleaning component d is working. The cleaning range of cleaning component d can be square or circular, etc. When selecting cleaning component d, its cleaning parameters, including the cleaning range, are also known. Furthermore, the cleaning length per unit distance along the Y-axis of the cleaning range can be determined by the installation state of cleaning component d.

[0107] In step S550, the number of row-by-row cleaning operations is obtained based on the length of the area to be cleaned b in the Y-axis direction and the unit cleaning length. Specifically:

[0108] Based on the length of the area to be cleaned b in the Y-axis direction and the unit cleaning length of the cleaning component d, the sum of the unit cleaning lengths of multiple cleaning components d must be greater than or equal to the length of the area to be cleaned b in the Y-axis direction to calculate the number of row-by-row cleaning cycles. In this embodiment, the sum of the unit cleaning lengths of multiple cleaning components d must be greater than the length of the area to be cleaned b in the Y-axis direction to ensure comprehensive cleaning of the area to be cleaned b.

[0109] In step S560, the cleaning path is planned based on the number of row-by-row cleaning cycles and the starting point of the cleaning process. Specifically:

[0110] Reference Figure 3 and Figure 4 After determining the number of cleaning cycles and the starting point, the number of times the cleaning component d moves relative to the area b to be cleaned along the X-axis can be determined, which in turn determines the number of times it moves relative to the area b along the Y-axis. This information is used to plan the cleaning path. Specifically, the cleaning component d first moves relative to the area b along the X-axis to clean one row within the area b. Then, it moves relative to the area b along the Y-axis to change its cleaning position relative to the area b along the X-axis. Subsequently, it continues moving relative to the area b along the X-axis to continue cleaning until the area b is completely cleaned.

[0111] This setup, by planning the cleaning path, ensures that substrate a within the cleaning area b is thoroughly cleaned, guaranteeing cleaning quality. Furthermore, by customizing different cleaning areas b based on the size and placement of substrate a, and automatically planning the cleaning path, the cleaning efficiency of substrate a is improved.

[0112] In step S700, according to the cleaning path, the cleaning component d and / or substrate a are driven to move relative to each other, so that the cleaning component d scans and cleans the surface of substrate a line by line. Specifically:

[0113] In this embodiment, the drive substrate a moves relative to the cleaning component d in the X-axis direction to clean the substrate a. The drive cleaning component d moves relative to the substrate a in the Y-axis direction to change the cleaning position of the substrate a. It can be understood that when the substrate a moves, the cleaning component d cleans the substrate a; when the cleaning component d moves, it changes the cleaning position of the substrate a.

[0114] In this embodiment, the cleaning table for carrying substrate a moves in the X-axis direction via a linear motor or a lead screw mechanism. Therefore, after substrate a is cleaned, the cleaning table can transfer substrate a to the unloading point without the need for an additional mechanism for transferring substrate a. The cleaning assembly d is placed above the cleaning table via a gantry frame and can move in the Y-axis direction via a lead screw mechanism or a linear motor.

[0115] Reference Figure 4 and Figure 5 Furthermore, when the cleaning component d cleans the substrate a, each row of cleaning areas overlaps with the previous row of cleaning areas by a region c, the width of which is a preset overlap width. The preset overlap width is 10-30mm. By setting the overlap region c, any potential missed cleaning between rows of cleaning areas is eliminated, ensuring the cleaning quality of the substrate a.

[0116] In this embodiment, after step S200, where substrate a is loaded into the cleaning chamber and positioned below the cleaning assembly d, the method further includes step S300, which involves correcting the alignment of substrate a. Specifically, correcting substrate a includes steps S310-S320.

[0117] S310. Obtain the position information of any two measurement points on one side line of substrate a.

[0118] S320. Rotate substrate a so that the direction of the line connecting the two measurement points on substrate a is set along the X-axis or Y-axis.

[0119] Specifically, step S310 involves obtaining the position information of any two measurement points on one side line of substrate a.

[0120] The imaging module acquires the position information of any two measurement points on one side of substrate a, which can be coordinate information. Preferably, the position information of the two endpoints of one side of substrate a is acquired.

[0121] Step S320: Rotate substrate a so that the direction of the line connecting the two measurement points on substrate a is set along the X-axis or Y-axis. Specifically:

[0122] By rotating the cleaning table, the substrate a is rotated, so that the direction of the line connecting the two measurement points on the substrate a is set along the X-axis or Y-axis. Preferably, the two measurement points are the two ends of one side line along the length of the substrate a, and the substrate a is rotated so that the line connecting the two measurement points is set along the X-axis. In this embodiment, the coordinate information of the two measurement points can be used to determine whether the line connecting the two measurement points is set along the X-axis.

[0123] With this configuration, since the cleaning component d cleans the substrate a when the substrate a moves along the X-axis, setting the length direction of the substrate a along the X-axis can increase the length of the substrate a cleaned each time, thereby improving the cleaning efficiency.

[0124] In some embodiments, the correction substrate a may further include:

[0125] A reference wall is preset, and the positioning surface of the reference wall is set along the X-axis or Y-axis.

[0126] When placing substrate a, one side of substrate a is placed against the reference wall to correct the deviation of substrate a.

[0127] Reference Figure 3 and Figure 4 By correcting the alignment of substrate a, the length and width directions of substrate a are aligned with the X-axis and Y-axis, respectively. At this point, the four corners of substrate a fall precisely at the four corners of the area to be cleaned, b, making the area to be cleaned coincide with substrate a. When cleaning component d cleans area b, the area of ​​area b is reduced, and the movement of cleaning component d relative to substrate a is minimized. Since cleaning of substrate a always involves cleaning the surface of substrate a, cleaning efficiency is improved.

[0128] The procedure includes step S200, where substrate a is loaded into the cleaning chamber and positioned below cleaning assembly d, followed by step S400, where the height of cleaning assembly d relative to substrate a is adjusted to a preset standard height. Step S400 specifically includes steps S410 and S420.

[0129] S410, preset standard height.

[0130] S420. Adjust the height of the cleaning component d relative to the substrate a to the standard height.

[0131] Among them, S410 is the preset standard height. Specifically:

[0132] The cleaning component d includes an ultrasonic cleaning unit and a plasma cleaning unit. The ultrasonic cleaning unit converts the acoustic energy of a high-power ultrasonic source into mechanical vibrations, breaking down the adhesion between contaminants and the substrate a surface, causing fatigue damage to the contaminant layer and removing it. The vibration of gas bubbles then scrubs the solid surface. The plasma cleaning unit acts on the material surface, inducing a series of physical and chemical changes. Utilizing the active particles and high-energy rays contained within, it reacts and collides with surface organic contaminant molecules, forming small volatile molecules that are removed from the surface, achieving a cleaning effect.

[0133] The standard height of the ultrasonic cleaning unit is 2-5mm. If the height of the ultrasonic cleaning unit relative to the substrate a is lower than the standard height, the substrate a is easily attracted by the ultrasonic cleaning unit and there may be a possibility of impact on the substrate a. If the height of the ultrasonic cleaning unit relative to the substrate a is higher than the standard height, the cleaning effect will be poor.

[0134] The standard height of the plasma cleaning unit is 5-15mm. If the height of the plasma cleaning unit relative to substrate a is lower than the standard height, the cleaning range of the plasma cleaning unit will be smaller, affecting the cleaning efficiency; if the height of the plasma cleaning unit relative to substrate a is higher than the standard height, the cleaning effect will be poor.

[0135] Specifically, in step S420, the height of the cleaning component d relative to the substrate a is adjusted to the standard height.

[0136] The height of the cleaning assembly d is adjusted via a lead screw mechanism to bring the height of the cleaning assembly d relative to the substrate a to a standard height. Furthermore, the standard height is selected according to the chosen cleaning unit.

[0137] This configuration, by controlling the height of the cleaning component d relative to the substrate a, ensures cleaning effectiveness while improving cleaning efficiency.

[0138] The process includes step S200, where substrate a is loaded into the cleaning chamber and positioned below cleaning assembly d, followed by step S600, where a cleaning unit of cleaning assembly d is selected for cleaning substrate a according to the cleaning process of substrate a. Specifically:

[0139] The cleaning process for substrate a includes at least one of inorganic cleaning and organic cleaning. If only inorganic cleaning is required for substrate a, an ultrasonic cleaning unit is used; if only organic cleaning is required for substrate a, a plasma cleaning unit is used; if both inorganic and organic cleaning are required for substrate a, an ultrasonic cleaning unit and a plasma cleaning unit are used sequentially to clean substrate a.

[0140] This setup ensures that substrate a is thoroughly cleaned.

[0141] It should be noted that in this embodiment, steps S300-S600 are not limited in order; steps S300-S600 can be performed simultaneously or sequentially.

[0142] The process includes step S700, where the cleaning component d scans and cleans the surface of substrate a line by line, followed by step S800, where the substrate a undergoes an anti-static treatment. Specifically:

[0143] An ion bar is used to remove static electricity from substrate a. The ion bar generates a large number of positively and negatively charged air masses, which can neutralize the charge on objects passing through its ion radiation zone. When the object surface carries a negative charge, it attracts positive charges in the radiation zone; when the object surface carries a positive charge, it attracts negative charges in the radiation zone. This neutralizes the static electricity on the object surface, achieving the purpose of eliminating static electricity.

[0144] In step S700, after the cleaning component d scans and cleans the surface of substrate a line by line, step S900 is also included: the cleanliness of the substrate a surface is detected. If the cleanliness of the substrate a surface is qualified, the cleaning of substrate a is completed; otherwise, substrate a is cleaned again.

[0145] Specifically, if the surface cleanliness of substrate a is detected, step S200 is repeated to place substrate a back into the cleaning chamber.

[0146] Specifically, the surface cleanliness test of substrate a includes S910, particle quantity detection and S920, contact angle detection.

[0147] S910, Particle Quantity Detection. Specifically: The number of particles on the surface of substrate a is obtained. If the number of particles on the surface of substrate a is less than or equal to the preset standard particle quantity, the detection is qualified.

[0148] After the ultrasonic cleaning unit cleans substrate a, particle count is used to test the cleanliness of the substrate a surface. In this embodiment, the standard particle count is 1 particle per 0.01 square meters of area; that is, when the area of ​​substrate a is 0.04 square meters, the standard particle count is 4. The surface of substrate a is imaged using an imaging module to obtain the number of particles on the surface of substrate a, and it is determined whether the number of particles on the surface is less than or equal to the standard particle count. If the number of particles on the surface of substrate a is less than or equal to the standard particle count, the cleanliness test is qualified.

[0149] Among them, S920 is the contact angle detection. Specifically, the contact angle of water droplets on the surface of substrate a is obtained. If the contact angle of water droplets on the surface of substrate a is less than or equal to the preset standard contact angle of water droplets, the detection is qualified.

[0150] After the plasma cleaning unit cleans the substrate a, when detecting the cleanliness of the surface of the substrate a, contact angle detection is adopted. By detecting the contact angle of the water droplet on the substrate a, the size of the contact angle measures the removal of organic substances on the substrate a. The smaller the contact angle, the less organic substances there are, the higher the cleaning degree, and the better the water droplet infiltration, thereby reflecting the cleanliness of the substrate a. In this embodiment, the standard water droplet contact angle is 7 degrees, that is, when the water droplet contact angle on the surface of the substrate a is less than or equal to 7 degrees, the cleanliness detection is qualified.

[0151] By setting like this, the cleanliness of the cleaned substrate a is detected to ensure that the substrate a enters the inkjet printing station in a state meeting the inkjet printing requirements, so as to ensure the inkjet printing quality on the substrate a.

[0152] In addition, according to the result of the cleanliness detection, the movement speed of the substrate a in the X-axis direction can be adaptively adjusted. By slowing down the movement speed of the substrate a, the cleaning time is increased, and the cleaning effect is improved.

[0153] In this embodiment, when the ultrasonic cleaning unit is used to clean the substrate a, the movement speed of the substrate a in the X-axis direction is 30 - 50 mm / s; when the plasma cleaning unit is used to clean the substrate a, the movement speed of the substrate a in the X-axis direction is 30 - 100 mm / s. To ensure the cleaning quality on the premise of ensuring the cleaning efficiency. If the movement speed of the substrate a in the X-axis direction is too slow, the cleaning efficiency will be affected; if the movement speed of the substrate a in the X-axis direction is too fast, the cleaning effect will be affected.

[0154] In this embodiment, during the batch cleaning process of the substrate a, the substrate a can be extracted for surface cleanliness detection to ensure the cleaning efficiency of the batch of substrate a.

[0155] In addition, before the batch cleaning of the substrate a, a certain number of substrate a, such as 1 - 3 substrate a, can be pre-cleaned, and the surface cleanliness of the substrate a is detected. If the detection is qualified, it can reflect that the cleaning process can meet the cleaning requirements of this batch of substrate a, and subsequently, the surface cleanliness of the substrate a can be detected by sampling inspection.

[0156] It should be noted that there is no order limit for step S900 and step S800, but when batch cleaning the substrate a and the substrate a is not subjected to surface cleanliness detection, after the substrate a undergoes static elimination treatment, the cleaning can be completed.

[0157] This application provides a cleaning method for glass substrates used in inkjet printing. During substrate a, cleaning gas is continuously injected into the cleaning chamber. This process expels the original gas from the cleaning chamber, removing suspended dust and other particulate impurities, maintaining a clean atmosphere. Furthermore, the clean airflow keeps the pressure within the cleaning chamber at standard pressure, creating a slightly positive pressure environment that prevents external impurities from entering. Therefore, substrate a is less prone to re-contamination during cleaning, improving cleaning quality. Additionally, based on a predetermined cleaning path for substrate a, the cleaning component d performs line-by-line scanning to clean the surface of substrate a, enabling the cleaning of medium to large-sized substrates. This ensures thorough cleaning of the substrate a surface, guaranteeing cleaning quality, and the cleaning efficiency is higher when performed according to the cleaning path. This ensures the quality of subsequent inkjet printing processing on substrate a.

[0158] In the description of this application, it should be understood that in the accompanying drawings, the positive direction of "X" represents the right, and correspondingly, the negative direction of "X" represents the left; the positive direction of "Y" represents the front, and correspondingly, the negative direction of "Y" represents the rear; the terms "X", "Y", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Moreover, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0159] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0160] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0161] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for cleaning glass substrates used in inkjet printing, characterized in that, Includes the following steps: Clean gas is continuously injected into the cleaning chamber to maintain the air pressure in the cleaning chamber at the preset standard air pressure; The standard air pressure is between 1200-1400 Pa; maintaining the air pressure in the cleaning chamber at the preset standard air pressure includes: acquiring cleaning gas flow information; acquiring chamber temperature information in the cleaning chamber; and adjusting the air volume of the cleaning gas according to the chamber temperature information and gas flow information to maintain the air pressure in the cleaning chamber at the preset standard air pressure. Obtain the substrate and load it into the cleaning chamber, placing it below the cleaning assembly; The location of the substrate is determined, the cleaning starting point is identified, and the cleaning path is planned. According to the cleaning path, drive the relative movement of the cleaning components and / or the substrate, so that the cleaning components scan the substrate surface line by line. The process of obtaining the chamber temperature information within the cleaning chamber includes: detecting the temperature within the chamber using a temperature sensor, distributing multiple temperature sensors within the cleaning chamber to obtain the temperature at multiple locations within the cleaning chamber, and finally taking the average value as the measured temperature. The temperature compensation coefficient and flow rate analog quantity are input into the PLC to provide feedback and adjust the airflow of the clean gas, using the formula... Calculate the air volume after feedback adjustment, W v : Feedback-adjusted airflow; D in D0: Analog input value after A / D conversion; D1: Lower limit value of analog input after A / D conversion; D2: ... m : Upper limit of analog quantity after A / D conversion; A m A0: Standard signal upper limit; A0: Standard signal lower limit; T r Temperature compensation coefficient; F c : Analog input value for flow rate; F c0 : Standard flow rate input value; where, ;T in : Temperature analog input value; 25: Reference temperature; T m T0: Upper limit of temperature during cleaning process; T0: Reference ambient temperature; 。 2. The cleaning method for glass substrates used in inkjet printing according to claim 1, characterized in that, The relative movement of the driving cleaning assembly and / or substrate includes: The drive substrate moves relative to the cleaning assembly in the X-axis direction to clean the substrate; The drive cleaning component moves relative to the substrate in the Y-axis direction to change the cleaning position on the substrate.

3. The cleaning method for glass substrates used in inkjet printing according to claim 2, characterized in that, The steps of obtaining the location of the substrate, determining the cleaning starting point, and planning the cleaning path include: Obtain the position information at the four corners of the substrate; Based on the position information at the four corners of the substrate, the areas to be cleaned are set along the X-axis and Y-axis directions of the adjacent two side lines, respectively, and the areas to be cleaned completely cover the substrate. Set one corner of the area to be cleaned as the starting point for cleaning; Obtain the unit cleaning length of the cleaning range of the cleaning component in the Y-axis direction; The number of times to clean row by row is obtained based on the length of the area to be cleaned in the Y-axis direction and the unit cleaning length; The cleaning path is planned based on the number of times each row is cleaned and the starting point of the cleaning process.

4. The cleaning method for glass substrates used in inkjet printing according to claim 3, characterized in that, The step of planning the cleaning path based on the number of line-by-line cleaning cycles and the starting point of the cleaning process includes: Each cleaning area overlaps with the previous cleaning area, and the width of the overlapping area is a preset overlap width.

5. The cleaning method for a glass substrate used for inkjet printing according to any one of claims 1 to 4, characterized in that, After loading the substrate into the cleaning chamber, the method further includes: a correction substrate, the correction substrate comprising: Obtain the position information of any two measurement points on one side of the substrate; Rotate the substrate so that the direction of the line connecting the two measurement points on the substrate is set along the X-axis or Y-axis.

6. The cleaning method for glass substrates used in inkjet printing according to claim 1, characterized in that, After the substrate is loaded into the cleaning chamber and positioned below the cleaning assembly, the method further includes: Based on the substrate cleaning process, select the cleaning unit of the cleaning assembly for substrate cleaning.

7. The cleaning method for a glass substrate used in inkjet printing according to claim 1 or 6, characterized in that, After the cleaning component scans and cleans the substrate surface line by line, the process further includes: substrate surface cleanliness detection. If the substrate surface cleanliness detection is qualified, the substrate cleaning is completed; otherwise, the substrate is cleaned again.

8. The cleaning method for a glass substrate used in inkjet printing according to claim 7, characterized in that, The substrate surface cleanliness detection includes particle quantity detection and contact angle detection; The particle count detection includes: obtaining the number of particles on the substrate surface; if the number of particles on the substrate surface is less than or equal to a preset standard particle count, the detection is qualified. The contact angle detection includes: obtaining the contact angle of water droplets on the substrate surface; if the contact angle of water droplets on the substrate surface is less than or equal to the preset standard contact angle of water droplets, the detection is qualified.

9. The cleaning method for glass substrates used in inkjet printing according to claim 1, characterized in that, After loading the substrate into the cleaning chamber and placing it below the cleaning assembly, the process further includes: Adjust the height of the cleaning component relative to the substrate to the preset standard height.

10. The cleaning method for a glass substrate used in inkjet printing according to claim 1, characterized in that, After the cleaning assembly scans and cleans the substrate surface line by line, the method further includes: The substrate is subjected to static electricity removal treatment.

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