A method and apparatus for laser cutting of large size grown diamond material

Abstract

The application discloses a laser cutting method and device for large-size cultured diamond material, and belongs to the field of laser cutting, which comprises a laser, a beam expander for expanding the diameter of a light beam, a focusing optical element for focusing the light beam to form a laser spot, an optical scanning device for moving the laser spot along a preset track, a moving carrier, and the optical scanning device controls the laser spot to form a sharp separation line or surface on the cutting track; the separation line or surface extends along a longitudinal direction; the preset track is tangent to the longitudinal direction so that the separation line or surface forms a cutting surface on the diamond material to be cut; the diamond material to be cut can be rotated or turned at a preset angle, and the light beam is layer by layer downward in the direction perpendicular to the surface of the diamond material to be cut; during the rotation process, uniform layer-by-layer material removal in all directions is obtained, the maximum cutting depth of the sample is more than doubled in the unidirectional cutting, and the cutting speed under the condition of large cutting depth is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of laser cutting, and more specifically, to a method and apparatus for laser cutting large-size cultured diamond materials. Background Technology

[0002] As a synthetic superhard material, artificial diamond possesses excellent properties including high compressive strength, high wear resistance, excellent thermal conductivity, low coefficient of thermal expansion, and good chemical stability. The technology and industrialization of artificially grown diamond production are maturing, leading to a strong demand for processing grown diamond materials. Due to its superior hardness and strength, artificial diamond is more difficult to process and shape, rendering traditional grinding and milling methods unsuitable. Therefore, developing industrialized processing methods for artificial diamond is both necessary and urgent. Currently, effective cutting methods include wire electrical discharge machining (EDM), waterjet cutting, and laser cutting. Conventional long-pulse laser cutting can effectively cut artificial diamond; however, the carbon powder layer generated during the cutting process disrupts the cutting microenvironment with increasing cutting depth, affecting the diamond's surface morphology and properties.

[0003] Therefore, improving the quality of laser cutting without complicating the process is of great significance for the application of laser cutting in diamond materials. Summary of the Invention

[0004] The purpose of this invention is to provide a laser cutting method and apparatus for large-size cultured diamond materials, so as to solve one or more technical problems existing in the prior art, and at least provide a beneficial option or create conditions.

[0005] To achieve the above-mentioned objectives, the present invention employs the following technical solution:

[0006] This invention provides a laser cutting device for large-size cultured diamond materials, characterized by comprising: a laser for outputting a beam with a pulse width of less than 500 ps, ​​the beam propagating in the form of rays and forming a laser optical path; a focusing optical element for focusing the beam to form a laser spot; an optical scanning device for controlling the spatial scanning position and trajectory of the beam so that the laser spot moves along the cutting trajectory; and a moving carrier for moving the diamond material to be cut along a preset trajectory.

[0007] In this process, the optical scanning device controls the laser spot to form a sharp dividing line or surface on the cutting trajectory; the dividing line or surface extends along the longitudinal direction; the preset trajectory is tangent to the longitudinal direction so that the dividing line or surface forms a cutting surface on the diamond material to be cut.

[0008] Furthermore, the diamond material to be cut is mounted on the mobile carrier by a fixing mechanism; the fixing mechanism is used to fix the two sides of the diamond material to be cut.

[0009] Furthermore, the two sides of the diamond material are perpendicular to the surface of the diamond to be cut; the fixing mechanism fixes the two sides of the diamond material to be cut by vacuum adsorption.

[0010] Furthermore, the movement of the diamond material to be cut along a preset trajectory is the rotation of the diamond material to be cut around a movable axis.

[0011] Furthermore, the movable axis coincides with the centerline of the diamond material to be cut.

[0012] Furthermore, the laser spot is a dot with a diameter of less than 10 micrometers.

[0013] Furthermore, the laser cutting device for diamond materials also includes a beam expander, which is used to increase the diameter of the beam.

[0014] Furthermore, the laser cutting device for diamond materials also includes: a reflector; the laser, the beam expander, the reflector, the focusing optical element, and the optical scanning device are arranged sequentially along the laser optical path.

[0015] A laser cutting method for large-size cultured diamond material, employing the aforementioned laser cutting apparatus for large-size cultured diamond material, the method comprising:

[0016] The laser spot formed by focusing the laser through the optical scanning device and focusing optical element is located on the surface of the diamond to be cut.

[0017] By controlling the spatial scanning position and trajectory of the laser beam through an optical scanning device, the laser spot forms sharp dividing lines or surfaces on the cutting trajectory.

[0018] The moving carrier moves along a preset trajectory until the dividing line or surface forms a cut surface on the moving carrier.

[0019] The diamond material to be cut is separated to form a cutting surface, thus completing the cutting process.

[0020] Furthermore, methods for separating the diamond material to be cut include: separating the diamond material to be cut by using an external driving force perpendicular to the cutting surface.

[0021] This invention provides a laser cutting method for large-size cultured diamond materials, employing the aforementioned laser cutting device for large-size cultured diamond materials. The method includes: using an optical scanning device and a focusing optical element to focus a laser beam into a laser spot on the surface of the diamond to be cut; controlling the spatial scanning position and trajectory of the laser beam using an optical scanning device to move the laser spot from a first position to a second position along a preset trajectory, so that the movement trajectory of the laser spot forms a dividing line or surface; further controlling the spatial scanning position and trajectory of the laser beam using the optical scanning device to move the laser spot along the preset trajectory until the movement trajectory of the laser spot forms a cutting surface; separating the diamond material to be cut with the cut surface formed, thus completing the cutting.

[0022] Furthermore, methods for separating the diamond material to be cut include: separating the diamond material to be cut by using an external driving force perpendicular to the cutting surface.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] This invention provides a laser cutting method and apparatus for large-size cultured diamonds. While the laser scans and cuts, the sample rotates or turns at a preset angle, with the laser beam descending layer by layer in a direction perpendicular to the surface of the diamond material to be cut. During rotation, the sample achieves uniform, layer-by-layer material removal in all directions, thereby obtaining a maximum cutting depth more than twice that of the sample in unidirectional cutting, significantly increasing the cutting speed under high cutting depth conditions, and ensuring a carbon-free cut surface with submicron-level surface roughness. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a laser cutting device for large-size cultured diamond materials according to the present invention;

[0026] Figure 2 This is a flowchart of a laser cutting method for large-size grown diamond materials according to the present invention;

[0027] Figure 3 This is a schematic diagram of the fixing mechanism in a laser cutting method for large-size cultured diamond materials according to the present invention;

[0028] Figure 4 This is a schematic diagram of the structure of the first suction cup assembly in a laser cutting method for large-size grown diamond materials according to the present invention;

[0029] Figure 5 This invention relates to a laser cutting method for large-size cultured diamond materials. Figure 4 The structure after cross-section.

[0030] Explanation of the labels in the diagram:

[0031] 1. Laser; 2. Beam expander; 3. Optical scanning device; 4. Focusing optics; 5. Worktable; 6. Clamping mechanism; 7. Fixing mechanism; 8. Reflector; 71. First support device; 72. Second support device; 73. First suction cup assembly; 74. Second suction cup assembly; 75. Driving component; 731. Connecting plate; 732. Air pump; 733. Flexible water bag; 734. Flexible air tube; 735. Delivery tube; 736. Flexible nozzle; 737. Water pump. Detailed Implementation

[0032] Please see Figure 1 , 3 -5;

[0033] A laser cutting device for large-size cultured diamond materials includes: a laser 1, a beam expander 2, a focusing optical element, an optical scanning device 3, a moving carrier, and a reflector 8. The laser beam output by the laser 1 has a wavelength range of 1.9-2.2 μm and is pulsed, with a pulse width of less than 500 ps. The laser beam output by the laser 1 propagates in the form of rays, forming a laser optical path. A worktable 5 is used to hold and fix the diamond material to be cut. The laser 1, the beam expander 2, the focusing optical element, and the optical scanning device 3 are arranged sequentially along the laser optical path. The beam expander 2 is used to enlarge the diameter of the beam. The focusing optical element is used to focus the beam to form a laser spot. The optical scanning device 3 is used to control the spatial scanning position and trajectory of the beam, causing the laser spot to move along a preset trajectory. The optical scanning device 3 controls the laser spot to form a sharp dividing line or surface on the cutting trajectory; the dividing line or surface extends along the longitudinal direction; the preset trajectory is tangent to the longitudinal direction so that the dividing line or surface forms a cutting surface on the diamond material to be cut.

[0034] In this embodiment, the laser 1 is one of a fiber laser 1, a solid-state laser 1, and an ultrafast laser 1. The focusing optical element is a focusing lens.

[0035] In some embodiments, the moving carrier is used to move the diamond material to be cut along a preset trajectory. In this embodiment, the preset trajectory is preferably one that allows the diamond material to be cut to rotate about a movable axis. If the dividing line or surface extends longitudinally, it will penetrate into the diamond material to be cut. As the diamond material rotates about the movable axis, the dividing line or surface will form a ring on the diamond material to be cut. Then, the dividing line or surface can extend longitudinally or move longitudinally, moving to different positions and forming rings at different positions on the diamond material to be cut. Repeating this process multiple times will form multiple rings, which overlap to form a circular cutting surface, thereby achieving the cutting of the diamond material.

[0036] In some embodiments, the moving carrier includes a worktable 5 and a clamping mechanism 6, wherein the clamping mechanism 6 is used to control the rotation of the diamond material to be cut at any angle along the clamping axis, so that the diamond material to be cut is rotated and cut in space, thereby improving the cutting depth, efficiency and quality of the diamond sample. The clamping axis coincides with the movable axis. The worktable 5 is a three-axis electric displacement platform, and the worktable 5 drives the clamping mechanism 6 to move, so the clamping axis is the movable axis.

[0037] Specifically, the centerline of the diamond material to be cut coincides with the movable axis.

[0038] In this embodiment, more precisely, the dividing line is a short line segment. The diamond material to be cut rotates around a movable axis, and the dividing line cuts the diamond material to form an annular cut surface. Then, the position of the dividing line moves along the longitudinal direction of the diamond material to be cut, cutting another annular cut surface. This process is repeated multiple times until multiple annular cut surfaces overlap to form a circular cut surface, thus achieving the separation of the diamond material to be cut. Initially, the dividing line is a laser spot that irradiates the surface of the diamond material to be cut. The diamond material to be cut then rotates around a movable axis, and the laser spot moves on the surface of the diamond material to be cut. The trajectory of the laser spot forms an annular line. Then, the laser spot moves longitudinally, forming an annular line at the starting position and another annular line at the ending position. The two annular lines connect to form an annular surface. Then, the laser spot continues to penetrate deeper along the longitudinal direction of the diamond material to be cut until the annular surfaces formed by multiple annular lines overlap to form a circular surface, thus separating the diamond material to be cut.

[0039] In some other cutting methods in this embodiment, the diamond material to be cut can be rotated around a movable axis, and then the laser spot forms an annular cutting surface on the diamond material to be cut. Then the laser spot moves to form multiple annular cutting surfaces, and the multiple annular cutting surfaces overlap to form a cutting surface.

[0040] In some embodiments, the diamond material to be cut is mounted on the worktable 5 by a fixing mechanism 7; the fixing mechanism 7 is used to fix the two sides of the diamond material to be cut. Preferably, the two sides of the diamond material are perpendicular to the surface of the diamond to be cut; the fixing mechanism 7 fixes the two sides of the diamond material to be cut by vacuum adsorption.

[0041] In some embodiments, the laser cutting device for diamond materials further includes a beam expander 2 and a reflector 8; the laser 1, the beam expander 2, the reflector 8, the focusing optical element, and the optical scanning device 3 are arranged sequentially along the laser beam path. Two reflectors 8 are provided, and the two reflectors 8 cause the laser beam path to be reflected twice at 45°, allowing the laser beam path to pass through the optical scanning device 3.

[0042] In some embodiments, the diamond material to be cut is mounted on the worktable 5 by a fixing mechanism 7; the fixing mechanism 7 is used to fix the two sides of the diamond material to be cut. Preferably, the two sides of the diamond material are perpendicular to the surface of the diamond to be cut; the fixing mechanism 7 fixes the two sides of the diamond material to be cut by vacuum adsorption.

[0043] In some embodiments, the fixing mechanism 7 includes: a first support device 71, a second support device 72, and a driving member 75; the first support device 71 is provided with a first suction cup assembly 73, and the second support device 72 is provided with a second suction cup assembly 74; the first suction cup assembly 73 is used to approach the diamond material to be cut at one end until it abuts against the diamond material; the second suction cup assembly 74 is used to approach the diamond material to be cut at the other end until it abuts against the diamond material; the driving member 75 is used to drive the first support device 71 and the second support device 72 to move closer to each other or further away from each other.

[0044] Both the first suction cup assembly 73 and the second suction cup assembly 74 are used to hold and press down the diamond material to be cut.

[0045] In this embodiment, the driving component 75 is a double-slider electric cylinder, which has two driving sliders that can move closer to or further away from each other. A first support device 71 is fixed to one of the driving sliders, and a second support device 72 is fixed to the other driving slider. This allows the first support device 71 and the second support device 72 to move closer to or further away from each other.

[0046] The first suction cup assembly 73 and the second suction cup assembly 74 have the same structure. The first suction cup assembly 73 includes: a connecting plate 731, an air pump 732, a flexible water bag 733, a flexible air tube 734, a delivery tube 735, a flexible nozzle 736, and a water pump 737. The connecting plate 731 is fixedly connected to the first support device 71. Both the air pump 732 and the water pump 737 are fixedly mounted on the connecting plate 731. The flexible water bag 733 is fixedly connected to the connecting plate 731, and the water pump 737 is connected to the flexible water bag 733, used to inflate or contract the flexible water bag 733. The delivery tube 735 is fixedly connected to the flexible air tube 734, and the delivery tube 735 is also elastic and can be compressed and stretched. The delivery tube is connected to the flexible air tube 734, and the flexible nozzle 736 is fixedly connected to the flexible air tube 734. The first support device 71 and the second support device 72 approach each other, causing the flexible nozzle 736 on the flexible air tube 734 to contact the outer surface of the diamond material to be cut. Since the diamond material may have an irregular shape, conventional fixing methods are insufficient. Therefore, the flexible nozzle 736 contacts the diamond material, and the first support device 71 continues to approach the material. The flexible air tube 734 then adheres to the outer surface of the diamond material. The flexible water bag 733, with water pressure regulated by the water pump 737, applies pressure to the flexible air tube 734, ensuring a tight fit between the flexible air tube 734 and the diamond material, thus fixing the outer surface of the diamond material. Then, the air pump 732 draws in air, creating a negative pressure in the flexible air tube 734, causing it to adhere to the outer surface of the diamond material, thereby fixing the diamond material to be cut.

[0047] Reference Figure 2 A laser cutting method for large-size grown diamond materials, comprising:

[0048] The laser spot formed by focusing the laser through the optical scanning device and focusing optical element is located on the surface of the diamond to be cut.

[0049] The optical scanning device 3 controls the spatial scanning position and trajectory of the beam, so that the laser spot moves from the first position to the second position along the preset trajectory, and the movement trajectory of the laser spot forms a dividing line or surface.

[0050] The optical scanning device 3 controls the spatial scanning position and trajectory of the beam, and then moves the laser spot along the preset trajectory until the movement trajectory of the laser spot forms a cutting surface.

[0051] The diamond material to be cut is separated to form a cutting surface, thus completing the cutting process.

[0052] Methods for separating diamond materials to be cut include: separating the diamond materials to be cut by using an external driving force perpendicular to the cutting surface.

Claims

1. A laser cutting apparatus for large size grown diamond material, characterized by: include A laser is used to output a beam with a pulse width of less than 500 ps. The beam propagates in the form of rays and forms a laser optical path. Focusing optical elements are used to focus a light beam to form a laser spot; An optical scanning device is used to control the spatial scanning position and trajectory of the laser beam so that the laser spot moves along the cutting trajectory; A moving carrier is used to move the diamond material to be cut along a preset trajectory. The optical scanning device controls the laser spot to form a sharp dividing line or surface on the cutting trajectory; the dividing line or surface extends along the longitudinal direction; the preset trajectory is tangent to the longitudinal direction so that the dividing line or surface forms a cutting surface on the diamond material to be cut. The diamond material to be cut is mounted on the mobile carrier by a fixing mechanism; the fixing mechanism is used to fix the two sides of the diamond material to be cut. The fixing mechanism includes: a first support device, a second support device, and a driving component; the first support device is provided with a first suction cup assembly, and the second support device is provided with a second suction cup assembly; Both the first and second suction cup assemblies are used to hold and press the diamond material to be cut. The first suction cup assembly and the second suction cup assembly have the same structure. The first suction cup assembly includes: a connecting plate, an air pump, a flexible water bag, a flexible air tube, a delivery tube, a flexible nozzle, and a water pump. The connecting plate is fixedly connected to the first support device; both the air pump and the water pump are fixedly installed on the connecting plate; the flexible water bag is fixedly connected to the connecting plate, and the water pump is connected to the flexible water bag. The water pump is used to expand or contract the flexible water bag; the delivery pipe is fixedly connected to the flexible air tube, wherein the delivery pipe is also elastic and can be compressed and stretched; the delivery pipe is connected to the flexible air tube, and the flexible nozzle is fixedly connected to the flexible air tube. The first and second support devices approach each other, causing the flexible nozzle on the flexible air tube to contact the outer surface of the diamond material to be cut. Since the diamond material may have an irregular shape, conventional fixing methods are insufficient. Therefore, the flexible nozzle contacts the diamond material, and the first support device continues to approach it. The flexible air tube then adheres to the outer surface of the diamond material. A flexible water bag, pressurized by a water pump, applies pressure to the flexible air tube, ensuring it fits tightly against the diamond material and thus fixing its outer surface. The air pump then draws in air, creating a negative pressure within the flexible air tube, which in turn sucks in the diamond material, securing it to the outer surface and thus fixing it in place. The movement of the diamond material to be cut along a preset trajectory is the rotation of the diamond material to be cut around a movable axis. The movable axis coincides with the centerline of the diamond material to be cut.

2. A laser cutting apparatus for large size grown diamond material as claimed in claim 1, wherein: The two sides of the diamond material are perpendicular to the surface of the diamond to be cut; the fixing mechanism fixes the two sides of the diamond material to be cut by vacuum adsorption.

3. The laser cutting device for large-size cultured diamond materials according to claim 1, characterized in that: The laser spot is a dot with a diameter of less than 10 micrometers.

4. The laser cutting device for large-size cultured diamond materials according to claim 3, characterized in that: Laser cutting equipment for diamond materials also includes a beam expander, which is used to increase the diameter of the laser beam.

5. The laser cutting device for large-size cultured diamond materials according to claim 4, characterized in that: The laser cutting device for diamond materials also includes: a reflector; the laser, the beam expander, the reflector, the focusing optical element, and the optical scanning device are arranged sequentially along the laser optical path.

6. A laser cutting method for large-size grown diamond materials, characterized in that: The method employs a laser cutting apparatus for large-size cultured diamond material as described in any one of claims 1-5, the method comprising: The laser spot formed by focusing the laser through the optical scanning device and focusing optical element is located on the surface of the diamond to be cut. By controlling the spatial scanning position and trajectory of the laser beam through an optical scanning device, the laser spot forms sharp dividing lines or surfaces on the cutting trajectory. The moving carrier moves along a preset trajectory until the dividing line or surface forms a cut surface on the moving carrier. The diamond material to be cut is separated to form a cutting surface, thus completing the cutting process.

7. The laser cutting method for grown diamond material according to claim 6, characterized in that: Methods for separating diamond materials to be cut include: separating the diamond materials to be cut by using an external driving force perpendicular to the cutting surface.

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