Optoelectronic functional film and light-transmitting assembly

Abstract

The application relates to a photoelectric functional film and a light-transmitting assembly, which comprises a functional layer, at least one substrate body and a flexible circuit board. Each substrate body is arranged in a laminated mode with the functional layer, a conductive layer is arranged on a surface of at least one substrate body which faces the functional layer or a surface of at least one substrate body which faces away from the functional layer, and at least one substrate body further comprises an extension part which extends out of the conductive layer. An electrode of the flexible circuit board is electrically connected with at least one conductive layer, and a circuit board substrate of the flexible circuit board is limited on the extension part. The extension part is used as a bearing structure of the flexible circuit board, so that the pulling force borne by the electrode and the electrically connected conductive layer is reduced, the probability of electrode falling off from the conductive layer is reduced, and the photoelectric functional film can reliably maintain the regulation function.

Description

Technical Field

[0001] This application relates to the field of electronic control technology, and in particular to optoelectronic functional films and light-transmitting components. Background Technology

[0002] With the development of the glass manufacturing industry, glass functions are becoming increasingly diversified, such as light-transmitting components that can adjust light transmittance and photochromic glass that can change color. These types of functionally unique glass incorporate photoelectric functional films, which are electronically controlled devices that can exhibit different states when the electric field changes. Flexible circuit boards are an important component of these electronically controlled devices. Light-transmitting components also include dimming films, which can change their light transmittance under the influence of an electric field; for example, they are opaque when power is off and transparent when power is on. However, in actual use, the adjustable functions of glass are susceptible to failure. Summary of the Invention

[0003] Based on this, it is necessary to provide a photoelectric functional film and a light-transmitting component to address the potential failure of the control function. The extended portion serves as a support structure for the flexible circuit board, thereby reducing the tensile force at the electrical connection between the electrodes and the conductive layer of the flexible circuit board, reducing the probability of the electrodes detaching from the conductive layer, and thus enabling the photoelectric functional film to reliably retain its control function.

[0004] A photoelectric functional film, comprising:

[0005] A functional layer that can exhibit different states when its external electric field changes;

[0006] At least one substrate body, each substrate body being stacked with the functional layer, at least one substrate body having a conductive layer on a surface facing the functional layer or a surface facing away from the functional layer, and at least one substrate body further including an outwardly extending portion beyond the conductive layer; and

[0007] A flexible circuit board, wherein the electrodes of the flexible circuit board are electrically connected to at least one of the conductive layers, and the circuit board substrate of the flexible circuit board is limited on the outward expansion portion.

[0008] In one embodiment, the direction in which the outward extension extends outward from the conductive layer is the width direction of the outward extension, the width direction of the circuit board substrate is consistent with the width direction of the outward extension, and the width of the outward extension is not less than 1 / 3 of the width of the circuit board substrate.

[0009] In one embodiment, the extension includes an insulating member.

[0010] In one embodiment, the outer expansion portion is provided with a plurality of spaced wire-passing notches, each of the wire-passing notches penetrating both main sides of the substrate body, and the circuit board substrate is arranged on the outer expansion portion in a wave-like path by passing through each of the wire-passing notches in sequence.

[0011] In one embodiment, the conductive layer electrically connected to the electrodes of the flexible circuit board has multiple control regions, each control region being insulated from the others. The flexible circuit board has multiple electrodes, and each control region is electrically connected to one of the electrodes. The control regions correspond one-to-one with the electrodes.

[0012] The spacing direction of the multiple wire-threading notches arranged sequentially is consistent with the direction of the multiple control areas arranged sequentially. Among the multiple wire-threading notches located between two adjacent electrodes, the one closest to the electrode is a turning notch, and the others are fixed notches. In the fixed notch, the circuit board substrate passes from the side where the conductive layer is provided to the other side. In the turning notch, the circuit board substrate passes from the other side to the side where the conductive layer is provided.

[0013] In one embodiment, the width of the fixed notch is greater than the width of the turning notch.

[0014] In one embodiment, the width of the fixing notch is 2mm to 5mm, and the width of the turning notch is no more than 2mm.

[0015] In one embodiment, the distance between two fixed notches located between two adjacent electrodes and adjacent to each other is 50 mm to 250 mm, and the distance between the turning notch and the nearest electrode is 15 mm to 75 mm.

[0016] In one embodiment, the plurality of said control regions are separated by a dividing line provided on the conductive layer, and at least one of said fixed notches located between two adjacent said electrodes is arranged on the extension line of the dividing line;

[0017] The edge of the conductive layer is provided with a silver paste layer for hot pressing and electrical connection of the electrode. The fixed notch located on the extension line of the dividing line extends into the silver paste layer, and the silver paste layers corresponding to different control regions are separated by the fixed notch.

[0018] In one embodiment, a plurality of electrodes are arranged sequentially at intervals along the long side of the circuit board substrate. A plurality of conductive lines are disposed in the circuit board substrate, and the conductive lines are electrically connected to the electrodes one by one. Each conductive line runs along the length direction of the circuit board substrate, and the conductive lines are arranged at intervals in the width direction of the circuit board substrate.

[0019] Each of the aforementioned wire-passing notches is arranged sequentially at intervals along the length of the circuit board substrate.

[0020] In one embodiment, each electrode electrically connected to the control region is a partition electrode, the flexible circuit board also has a common electrode, the conductive layer is provided on both sides of the functional layer, the conductive layer on one side of the functional layer has multiple control regions, each partition electrode is connected to each control region in a one-to-one correspondence; the common electrode is connected to the conductive layer on the other side of the functional layer.

[0021] In one embodiment, the photoelectric functional film includes two substrate bodies, which are respectively stacked on both sides of the functional layer, and the conductive layer is provided on both substrate bodies;

[0022] The conductive layer disposed on the substrate body having the extended portion has a plurality of control regions. The conductive layer is located on the side of the substrate body facing the functional layer and is in direct contact with the functional layer.

[0023] In one embodiment, the photoelectric functional film further includes an edge-sealing adhesive disposed on the outer peripheral surface of the functional layer.

[0024] In one embodiment, the expansion portion includes a PET component, a PC component, or a PVC component;

[0025] And / or, the circuit board substrate includes a PI substrate or a PE substrate;

[0026] And / or, the circuit board substrate is bonded or snapped to the outward expansion portion.

[0027] A photoelectric functional film, comprising:

[0028] A functional layer that can exhibit different states when its external electric field changes;

[0029] At least one conductive substrate is stacked with the functional layer. Each conductive substrate includes a substrate body and a conductive layer disposed on the substrate body facing the functional layer or on the surface away from the functional layer. The at least one conductive layer is divided into a conductive region and an epitaxial region that are insulated from each other. The conductive region is located between the functional layer and the corresponding substrate body. The epitaxial region extends outside the functional layer. The portion of the substrate body covered by the epitaxial region and the epitaxial region together constitute an extension portion.

[0030] A flexible circuit board, wherein the electrodes of the flexible circuit board are electrically connected to at least one region of the conductive layer facing the functional layer, and the circuit board substrate of the flexible circuit board is limited on the outward expansion.

[0031] In one embodiment, the electrodes of the flexible circuit board are electrically connected to the conductive region, and the conductive region and the extended region belonging to the outer expansion portion belong to the same conductive layer. The outer expansion portion is provided with a plurality of wire-passing notches, each of the wire-passing notches penetrating the substrate body and the extended region of the conductive layer along the thickness direction of the conductive substrate. The circuit board substrate passes through each of the wire-passing notches in sequence and is arranged on the outer expansion portion in a wavy path.

[0032] A light-transmitting component, comprising:

[0033] First light-transmitting plate;

[0034] Second light-transmitting panel;

[0035] In the aforementioned photoelectric functional film, the first light-transmitting plate and the second light-transmitting plate are stacked on both sides of the photoelectric functional film through an adhesive film layer, and the functional layer is a dimming layer.

[0036] The above solution provides a photoelectric functional film and a light-transmitting component. The outward expansion portion can serve as a support structure for the flexible circuit board, thereby reducing the tensile force at the electrical connection between the electrodes and the conductive layer of the flexible circuit board, and reducing the probability of the electrodes detaching from the conductive layer. This allows the photoelectric functional film to reliably maintain its control function. Furthermore, because the light-transmitting component utilizes the photoelectric functional film, the probability of its control function failing is also greatly reduced. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of the photoelectric functional film described in this embodiment.

[0038] Figure 2 for Figure 1 Sectional view along the AA direction.

[0039] Figure 3 for Figure 1 Sectional view along the BB direction.

[0040] Figure 4 This is a cross-sectional view of the photoelectric functional film in another embodiment.

[0041] Figure 5 for Figure 4 A magnified view of a section at point C.

[0042] Explanation of reference numerals in the attached figures:

[0043] 10. Photoelectric functional film; 11. Functional layer; 12. Substrate body; 121. Outward expansion; 122. Threading notch; 1221. Fixing notch; 1222. Turning notch; 123. Conductive layer; 1231. Control area; 1232. Common electrode area; 1233. Separating electrode area; 1234. Conductive area; 1235. Epitaxial area; 124. Partition notch; 13. Flexible circuit board; 131. Circuit board substrate; 132. Partition electrode; 133. Conductive line; 134. Common electrode; 14. Silver paste layer; 15. Edge patching film; 16. Groove. Detailed Implementation

[0044] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0045] like Figure 1 and Figure 2 As shown, the photoelectric functional film 10 is relatively thin, so it generally uses a flexible circuit board 13, a type of electronic control device with high wiring density, light weight, thinness, and easy bending. The photoelectric functional film 10 includes a functional layer 11, which can exhibit different states when the external electric field changes. The flexible circuit board 13 can be used to regulate the external electric field of the functional layer 11. For example, a conductive layer 123 can be provided on at least one side of the functional layer 11, and a silver paste layer 14 for electrode electrical connection can be provided on the conductive layer 123. The electrodes of the flexible circuit board 13 are electrically connected to the silver paste layer 14. Then, the control unit in the flexible circuit board 13 or other external controllers can control the AC voltage applied to the conductive layer, thereby regulating the external electric field of the functional layer 11.

[0046] The electrodes of the flexible circuit board 13 and the silver paste 14 can be electrically connected by thermoforming. However, this connection is relatively fragile; when the flexible circuit board 13 is subjected to sufficient tensile force, the electrodes can easily detach from the silver paste 14. Especially with the development of the glass manufacturing industry, zoned control is becoming increasingly common, requiring individual control of different areas. Each area needs to be equipped with corresponding electrodes, increasing the number of electrodes in the flexible circuit board 13 and consequently increasing the amount of wiring. Figure 1As shown, when the number of wirings in the flexible circuit board 13 increases, the width of the flexible circuit board 13 (the left and right directions are the width directions under the angle shown in the figure) will increase. The portion of the flexible circuit board 13 that is suspended outside the substrate body 12 is larger. Therefore, the position where the electrodes of the flexible circuit board 13 are connected to the silver paste layer 14 by thermo-piezoelectric connection is subjected to a large tensile force. The electrodes are easy to fall off during handling or assembly, which may lead to the failure of the control function of the glass.

[0047] The electrodes of the flexible circuit board 13 can also be bonded to the conductive layer 13. However, the bonding area between the two is limited, and the connection position is weak, making it easy to fall off when subjected to sufficient tensile force.

[0048] Based on this, in some embodiments of this application, such as Figures 1 to 3 As shown, an optoelectronic functional film 10 is provided, including a functional layer 11, at least one substrate body 12, and a flexible circuit board 13.

[0049] The functional layer 11 can exhibit different states when the external electric field it is in changes. The functional layer 11 can be a dimming layer, exhibiting different light transmittances when the external electric field changes. The functional layer 11 can also be an electrochromic layer, exhibiting different colors when the external electric field changes.

[0050] Each substrate body 12 is stacked with a functional layer, such as Figure 2 As shown, when the photoelectric functional film 10 includes two substrate bodies, the two substrate bodies 12 are respectively stacked on both sides of the functional layer 11.

[0051] At least one substrate body 12 has a conductive layer 123 on its surface facing the functional layer 11 or on its surface facing away from the functional layer 11. In other words, such as Figure 2 As shown, the conductive layer 123 can be located between the substrate body 12 and the functional layer 11. Optionally, the conductive layer 123 can also be located on the side of the substrate body 12 facing away from the functional layer. The conductive layer 123 can be provided on only a portion of the substrate body 12, or the conductive layer can be provided on all substrate bodies 12.

[0052] This can be understood as follows: as long as a portion of the conductive layer 123 faces the functional layer 11, and the conductive layer 123 can change the external electric field of the functional layer 11 when electrically connected to an AC voltage, it is sufficient. In addition, the conductive layer 123 and the functional layer 11 can be in direct contact, or an intermediate layer can be provided between them. The intermediate layer can be a conductive structural layer or an insulating structural layer.

[0053] Alternatively, conductive layers 123 may exist on both sides of the functional layer 11, or conductive layers 123 may be arranged on only one side of the functional layer 11. As long as the existing conductive layers 123 can control the external electric field of the functional layer 11, it is acceptable.

[0054] At least one substrate body 12 also includes an extension portion 121 extending beyond the conductive layer 123. The electrodes of the flexible circuit board 13 are electrically connected to at least one conductive layer 123, and the circuit board substrate 131 of the flexible circuit board 13 is confined on the extension portion 121.

[0055] The flexible circuit board 13 includes electrodes and a circuit board substrate 131. Conductive lines 133 for electrical connection with the electrodes can be configured in the circuit board substrate 131, and the electrodes are located outside the circuit board substrate 131. The weight of the circuit board substrate 131 and other electrical interfaces disposed on it constitute the majority of the weight of the flexible circuit board 13. After the circuit board substrate 131 is positioned on the outward expansion portion 121, the outward expansion portion 121 effectively restricts the position of the circuit board substrate 131. The outward expansion portion 121 bears the weight of the circuit board substrate 131, thus the position where the electrodes are electrically connected to the conductive layer 123 does not bear excessive tensile force, thereby greatly reducing the probability of electrode detachment. This ensures the reliability of the photoelectric functional film 10 and reduces the probability of the photoelectric functional film 10's control function failing.

[0056] like Figure 2 As shown, in the above embodiment, the outer expansion portion 121 is formed by expanding the substrate body 12. At this time, the outer expansion portion 121 does not include the conductive layer 123. During manufacturing, the outer periphery size of the outer expansion portion 121 can be designed to be larger than that of the conductive layer 123.

[0057] It should be noted that the substrate body 12 can extend outward from one side of the conductive layer 123, while the other sides of the substrate body 12 can remain flush with the conductive layer 123. For example, both the substrate body 12 and the conductive layer 123 are rectangular thin sheets. The length of the substrate body 12 is greater than the length of the conductive layer 123, and the width of the substrate body 12 is the same as the width of the conductive layer 123. The two long sides of the substrate body 12 are flush with the two long sides of the conductive layer 123, but the long side of the substrate body 12 is longer than the long side of the conductive layer 123. One short side of the substrate body 12 is flush with the conductive layer 123, and the other short side of the substrate body 12 is located outside the conductive layer 123. This short side located outside the conductive layer 123 is the outward extension 121.

[0058] Optionally, the substrate body 12 extends outward relative to the conductive layer 123 in multiple directions. For example, both the substrate body 12 and the conductive layer 123 are rectangular sheets, the length of the substrate body 12 is greater than the length of the conductive layer 123, the width of the substrate body 12 is greater than the width of the conductive layer 123, and the projection of the conductive layer 123 along the thickness direction of the photoelectric functional film 10 onto the substrate body 12 is entirely located inside the substrate body 12. A portion of the substrate body 12 extends outward from the conductive layer 123 on all four sides.

[0059] In other cases, such as Figure 4As shown, the outer extension 121 may also include a portion of the conductive layer 123. For example, in some other embodiments, such as Figure 4 and Figure 5 As shown, the optoelectronic functional film 10 includes a functional layer 11, at least one conductive substrate, and a flexible circuit board 13. The functional layer 11 can exhibit different states when its external electric field changes. The conductive substrate is stacked with the functional layer 11. Each conductive substrate includes a substrate body 12 and a conductive layer 123 disposed on the surface of the substrate body 12 facing the functional layer 11 or on the surface facing away from the functional layer 11. The at least one conductive layer 123 is divided into a conductive region 1234 and an epitaxial region 1235 that are insulated from each other. The conductive region is located between the functional layer 11 and the corresponding substrate body 12, and the epitaxial region extends outside the functional layer 11. The portion of the substrate body 12 covered with the epitaxial region 1235, together with the epitaxial region 1235, constitutes an extension portion 121. The electrodes of the flexible circuit board 13 are electrically connected to the region of the at least one conductive layer 123 facing the functional layer 11, and the circuit board substrate 131 of the flexible circuit board 13 is confined on the extension portion 121.

[0060] like Figure 4 and Figure 5 As shown, in this embodiment, the expansion portion 121 includes a part of the substrate body 12 and a part of the conductive layer 123 (i.e., the epitaxial region 1235). However, the part of the conductive layer 123 belonging to the expansion portion 121 (i.e., the epitaxial region 1235) is insulated from the conductive region 1234. Therefore, the expansion portion 121 is also a component that is insulated from the conductive region 1234. The expansion portion 121 is mainly used to support the weight of the circuit board substrate 131.

[0061] During manufacturing, a conductive layer 123 can first be deposited on the entire surface of the substrate 12 facing the functional layer 11. Then, separation lines are created on the conductive layer 123 through processes such as etching, separating the conductive region 1234 from the epitaxial region 1235, thereby forming a conductive region 1234 and an epitaxial region 1235 that are insulated from each other. Figure 5 As shown, there is a narrow gap between the conductive region 1234 and the epitaxial region 1235. The specific way in which this narrow gap is formed is varied, and it ultimately separates the conductive region 1234 and the epitaxial region 1235.

[0062] The conductive layer 123 in an embodiment where the extension 121 includes only a portion of the substrate body 12 is similar to the conductive region in an embodiment where the extension 121 includes both a portion of the substrate body 12 and the epitaxial region 1235.

[0063] If the photoelectric functional film 10 includes two substrate bodies 12, the substrate body 12 containing the conductive layer 123 for electrical connection with the electrodes of the flexible circuit board 13, and a portion of the substrate body 12 belonging to the outer expansion portion 121 can be the same substrate body 12 or two different substrate bodies 12.

[0064] In one embodiment, such as Figure 4 and Figure 5 As shown, the portion of the substrate body 12 covered with the epitaxial region 1235 together with the epitaxial region 1235 constitutes the expansion portion 121, and the electrodes of the flexible circuit board 13 are electrically connected to the conductive region 1234, and the conductive region 1234 and the epitaxial region 1235 belonging to the expansion portion 121 both belong to the same conductive layer 123.

[0065] Furthermore, in some embodiments, such as Figure 1 and Figure 2 As shown, the conductive layer 123, electrically connected to the electrodes of the flexible circuit board 13, has multiple mutually insulated control regions 1231. The flexible circuit board 13 has multiple electrodes, and each control region 1231 is electrically connected to one electrode, with each control region 1231 corresponding to one electrode. Figure 1 As shown, each electrode electrically connected to the control region 1231 is a partition electrode 132. Each control region 1231 can be controlled independently, so each control region 1231 needs to be configured with its own corresponding electrode. When the number of electrodes increases, the number of conductive lines 133 corresponding to the electrodes in the circuit board substrate 131 increases, thereby increasing the volume and weight of the circuit board substrate 131. In this case, the necessity of providing the expansion portion 121 to support the circuit board substrate 131 is further enhanced.

[0066] Specifically, in some embodiments, when the outward extension 121 extends from the substrate body 12 outward from the conductive layer 123, the conductive layer 123 on the substrate body 12 with the outward extension 121 has multiple control regions 1231. Each control region 1231 is insulated from each other, and the flexible circuit board 13 has multiple electrodes. Each control region 1231 is electrically connected to an electrode, and the control region 1231 corresponds one-to-one with the electrode.

[0067] The substrate body 12 on which the conductive layer 123, which is electrically connected to the flexible circuit board 13, is located, and the substrate body 12 including the expansion portion 121 for limiting the circuit board substrate 131, are the same substrate body 12. Therefore, the electrodes of the flexible circuit board 13 and the circuit board substrate 131 are basically on the same substrate body 12, and the electrodes and the circuit board substrate 131 can basically remain on the same plane. Thus, the electrical connection between the electrodes and the conductive layer 123 is more reliable. In particular, when multiple partition electrodes 132 are electrically connected to multiple control areas 1231 in a one-to-one correspondence, the conductive layer 123 provided on the substrate body 12 with the expansion portion 121 has multiple control areas 1231. Each partition electrode 132 and the circuit board substrate 131 are basically arranged on the same substrate body 12. When the circuit board substrate 131 is arranged in a wavy path through each wire-passing notch 122, the height difference between the partition electrodes 132 and the control areas 1231 is small, thus the electrical connection between the partition electrodes 132 and the control areas 1231 is more reliable.

[0068] Similarly, in other embodiments, when the expansion portion 121 includes a portion of the substrate body 12 and a portion of the conductive layer 123 (i.e., the epitaxial region 1235), the conductive region 1234 has multiple control regions 1231. The control regions 1231 are insulated from each other. The flexible circuit board 13 has multiple electrodes, and each control region 1231 is electrically connected to an electrode, with each control region 1231 corresponding to a specific electrode. The conductive region including the multiple control regions 1231 and the epitaxial region belonging to the expansion portion 121 belong to the same conductive layer 123.

[0069] The circuit board substrate 131 and the outer expansion portion 121 can be bonded, snapped together, or otherwise limited together.

[0070] For example, in some embodiments, such as Figures 1 to 3 As shown, the extended portion 121 has a plurality of spaced-apart wire-passing notches 122. When the extended portion 121 extends outward from the substrate body 12 toward the conductive layer 123, each wire-passing notch 122 penetrates both main side surfaces of the substrate body 12; when the extended portion 121 includes a portion of the substrate body 12 and the extended region 1235 of the conductive layer 123, each wire-passing notch 122 penetrates both the substrate body 12 and the extended region of the conductive layer 123 along the thickness direction of the conductive substrate. Then, as... Figure 1 and Figure 3 As shown, the circuit board substrate 131 is arranged on the outer expansion portion 121 in a wavy path, passing through each wire-passing notch 122 in sequence.

[0071] The circuit board substrate 131 is bound to the outer expansion portion 121 along a wavy path. The relative positions between the circuit board substrate 131 and the outer expansion portion 121 are basically fixed. The tensile force required at the position where the electrode and the conductive layer 123 are electrically connected is small, and the electrical connection between the two is highly reliable. Moreover, the overall thickness of the circuit board substrate 131 passing through the outer expansion portion 121 is small, and the structure is compact.

[0072] Furthermore, in some embodiments, such as Figure 1 and Figure 2 As shown, when the extended portion 121 is formed by extending outward from the substrate body 12 toward the conductive layer 123, the direction in which the extended portion 121 extends outward toward the conductive layer 123 is the width direction of the extended portion 121. When the extended portion 121 includes a portion of the substrate body 12 and the extended region 1235 of the conductive layer 123, the direction in which the extended portion 121 extends outward toward the conductive layer 123 is the width direction of the extended portion 121.

[0073] like Figure 2 As shown, the width direction of the circuit board substrate 131 is consistent with the width direction of the outward expansion portion 121. The width L2 of the outward expansion portion 121 is not less than 1 / 3 of the width L1 of the circuit board substrate 131. Only in this way can the outward expansion portion 121 provide a strong support for the circuit board substrate 131.

[0074] In some embodiments, such as Figure 1 and Figure 2 As shown, the extended portion 121 is an insulating component. When the extended portion 121 extends outward from the substrate body 12 towards the conductive layer 123, the material of the extended portion 121 is the same as the material of the substrate body 12, both being insulating materials. It should be noted that the insulating component mentioned here refers to the surface layer of the component that is at least in contact with the circuit board substrate 131 being an insulating material; whether or not conductive material is arranged inside it is not limited.

[0075] When the extended portion 121 includes a part of the substrate body 12 and the epitaxial region 1235 of the conductive layer 123, although it includes the epitaxial region 1235 of the conductive layer 123, this region is insulated from the conductive region 1234. Therefore, in this case, the extended portion 121 will not conduct electricity when the conductive region 1234 is energized.

[0076] In some embodiments, such as Figure 1As shown, multiple electrodes are arranged sequentially at intervals along the long side of the circuit board substrate 131. Multiple conductive lines 133 are disposed within the circuit board substrate 131, each conductive line 133 being electrically connected to a corresponding electrode. Each conductive line 133 runs along the length of the circuit board substrate 131, and the conductive lines 133 are arranged at intervals along the width of the circuit board substrate 131. The increase in the number of conductive lines 133 increases the width of the circuit board substrate 131. Various through-holes 122 are arranged sequentially at intervals along the length of the circuit board substrate 131. When the circuit board substrate 131 passes through the various through-holes 122, the electrodes located on the long side are electrically connected to the corresponding conductive layer 123.

[0077] Furthermore, such as Figure 1 and Figure 3 As shown, in some embodiments, the spacing direction of the plurality of wire-through notches 122 arranged sequentially is consistent with the direction of the plurality of control regions 1231 arranged sequentially. Among the plurality of wire-through notches 122 located between two adjacent electrodes, the one closest to the electrode is a turning notch 1222, and the others are fixed notches 1221. In the fixed notch 1221, the circuit board substrate 131 passes from the side where the conductive layer 123 is provided to the other side, and in the turning notch 1222, the circuit board substrate 131 passes from the other side to the side where the conductive layer 123 is provided. Regardless of how many wire-through notches 122 are arranged between two adjacent electrodes, the circuit board substrate 131 can eventually pass through the turning notch 1222 to the side where the conductive layer 123 is located, so that the electrodes of the flexible circuit board 13 are electrically connected to the conductive layer 123.

[0078] Furthermore, in some embodiments, the width of the fixed notch 1221 is greater than the width of the turning notch 1222. For example... Figure 1 and Figure 3 As shown, each of the threading notches 122 is a long strip notch. The fixing notch 1221 is mainly used to guide the circuit board substrate 131 to be arranged along a wavy path, so its width is set to be relatively large to facilitate the insertion of the circuit board substrate 131. The turning notch 1222 is mainly used to change the orientation of the circuit board substrate 131, so that the circuit board substrate 131 passes through to the side where the conductive layer 123 is located, so its width is set to be relatively small, just enough for the circuit board substrate 131 to pass through.

[0079] Additionally, in some embodiments, such as Figure 1 As shown, each control region 1231 is separated by a dividing line provided on the conductive layer 123. At least one fixed notch 1221 located between two adjacent electrodes is arranged on the extension line of the dividing line.

[0080] The edge of the conductive layer 123 is provided with a silver paste layer 14 for hot pressing and electrical connection of electrodes. The fixing notch 1221 located on the extension line of the dividing line extends into the silver paste layer 14, and the silver paste layers 14 corresponding to different control regions 1231 are separated by the fixing notch 1221. The relatively wide fixing notch 1221 ensures reliable insulation between the silver paste layers 14 corresponding to the two control regions 1231, avoiding accidental contact between the silver paste layers 14 corresponding to different control regions 1231.

[0081] In some specific embodiments, the dividing lines are parallel to each other. For example... Figure 1 As shown, each control region 1231 is a rectangle.

[0082] In some embodiments, the width of the fixed notch 1221 is 2mm to 5mm, and the width of the steering notch 1222 is no greater than 2mm. For example, the width of the steering notch 1222 can be 1mm.

[0083] Furthermore, in some embodiments, the spacing between two adjacent fixing notches 1221 located between two adjacent electrodes is 50mm to 250mm, which ensures that the circuit board substrate 131 passing through each fixing notch 1221 is locked or positioned. The spacing between the turning notch 1222 and the nearest electrode is 15mm to 75mm, ensuring that the electrode on the circuit board substrate 131 passing through the turning notch 1222 can be electrically connected to the conductive layer 123 at close range.

[0084] In one specific embodiment, the distance between two fixed notches located between two adjacent electrodes and adjacent to each other is 100mm to 200mm, and the distance between the turning notch and the nearest electrode is 20mm to 50mm.

[0085] In some embodiments, such as Figure 1 As shown, each electrode electrically connected to the control region 1231 is a partition electrode 132, and the flexible circuit board 13 also has a common electrode 134. Conductive layers 123 are provided on both sides of the functional layer 11. The conductive layer 123 on one side of the functional layer 11 has multiple control regions 1231. Each partition electrode 132 is connected to each control region 1231 in a one-to-one correspondence. The common electrode is connected to the conductive layer 123 on the other side of the functional layer 11. The area on the conductive layer 123 used for electrical connection with each partition electrode 132 is a partition region 1233, and the area on the conductive layer 123 used for electrical connection with the common electrode is a common region 1232. Each partition electrode 132 is independently controlled, thereby enabling each control region 1231 to be independently controlled by partition.

[0086] like Figure 1 and Figure 2As shown, in some embodiments, the silver paste layer 14 is provided on the polarization region 1233, and each partition electrode 132 is electrically connected to the silver paste layer 14 corresponding to each control region 1231. The polarization region 1233 is an edge region of the conductive layer, and in some cases, the polarization region 1233 is an elongated region.

[0087] The polarization region 1233 and the common polarization region 1232 belong to different conductive layers 123. If the common polarization region 1232 is distributed on the side where the expansion portion 121 is located, in order to further ensure that the silver paste layers 14 on the two regions do not come into contact, in some cases a separation notch 124 can be provided on the expansion portion. The separation notch 124 is located at the junction of the polarization region 1233 and the common polarization region 1232, so that the silver paste layers 14 on the two regions are separated.

[0088] In other embodiments, when the functional layer 11 has a conductive layer 123 on only one side, multiple control regions 1231 belong to the conductive layer 123.

[0089] Furthermore, such as Figure 2 As shown, in some embodiments, the photoelectric functional film 10 also includes an edge sealing adhesive (not shown in the figure). The edge sealing adhesive is disposed on the outer peripheral surface of the functional layer 11, protecting the functional layer 11 on the inner side. When the film is laminated, the photoelectric functional film 10 is sandwiched between two glass sheets. An adhesive film is disposed between the glass and the substrate body 12. At the same time, the area in the space between the two glass sheets that is not filled by the photoelectric functional film 10 can also be filled with an adhesive film. In this case, the edge sealing adhesive can prevent the adhesive film from contacting the functional layer 11.

[0090] like Figure 2 and Figure 3 As shown, in some embodiments, the silver paste layer 14 and the functional layer 11 are spaced apart to form a groove 16, and the sealing adhesive fills this groove 16. A portion of the adhesive film located between the two glass panes abuts against the two glass panes; this portion of the adhesive film is a patching adhesive film 15. The difference between the thickness of the patching adhesive film 15 and the thickness of the photoelectric functional film 10 is no greater than 100 micrometers, to prevent the glass from cracking due to the height difference between the two during high-voltage lamination. The adhesive film can be a PVB component, an EVA component, or a TPU component, or any combination thereof.

[0091] The sealing film 15 is arranged around the periphery of the laminated structure formed by the substrate body 12 and the functional layer 11. The upper and lower surfaces of the sealing film 15 are flush with the opposing main sides of the two substrate bodies 12, and are positioned close to the edge of the outward extension 121. The substrate body 12 extends outward relative to the functional layer 11. In order to make the thickness of the outer edge of the optoelectronic functional film 10 approximately the same as the thickness of the middle part, the sealing film 15 is further provided. At the same time, it can also prevent the electronic control devices on the optoelectronic functional film 10 from being crushed during lamination.

[0092] Specifically, in some embodiments, the outer extension 121 includes, but is not limited to, PET components, PC components, or PVC components.

[0093] The circuit board substrate 131 includes, but is not limited to, PI substrate or PE substrate.

[0094] Furthermore, in some embodiments of this application, a light-transmitting component is provided, including a first light-transmitting plate, a second light-transmitting plate, and the aforementioned photoelectric functional film 10. Both the first and second light-transmitting plates can be glass components. The first and second light-transmitting plates are stacked on both sides of the photoelectric functional film 10, and the functional layer 11 is a dimming layer. Specifically, the first and second light-transmitting plates can be bonded to the photoelectric functional film 10 via an adhesive film.

[0095] The light-transmitting component provided by the above solution uses a photoelectric functional film 10, thus greatly reducing the probability of its control function failing. Specifically, the outward expansion portion 121 can serve as a support structure for the flexible circuit board 13, thereby reducing the tensile force at the electrical connection between the electrodes and the conductive layer 123 of the flexible circuit board 13, reducing the probability of the electrodes detaching from the conductive layer 123, and thus enabling the photoelectric functional film 10 to reliably maintain its control function.

[0096] In the description of this application, it should be understood that if terms such as "length", "width", "thickness", "outer" appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0097] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0098] In this application, unless otherwise expressly specified and limited, the terms "connection" and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0099] In this application, unless otherwise expressly specified and limited, if a description such as "above" or "below" the second feature appears, it means that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0100] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A photoelectric functional film, characterized in that, include: A functional layer that can exhibit different states when its external electric field changes; At least one substrate body, each substrate body being stacked with the functional layer, at least one substrate body having a conductive layer on a surface facing the functional layer or a surface facing away from the functional layer, and at least one substrate body further including an outwardly extending portion beyond the conductive layer; and A flexible circuit board, wherein the electrodes of the flexible circuit board are electrically connected to at least one of the conductive layers, and the circuit board substrate of the flexible circuit board is limited on the outward expansion portion; Wherein, the direction in which the outward expansion extends outward from the conductive layer is the width direction of the outward expansion, the width direction of the circuit board substrate is consistent with the width direction of the outward expansion, and the width of the outward expansion is not less than 1 / 3 of the width of the circuit board substrate; The outer expansion portion is provided with multiple spaced wire-passing notches, each of which penetrates both main sides of the substrate body. The circuit board substrate passes through each wire-passing notch in sequence and is arranged on the outer expansion portion in a wave-like path. The conductive layer electrically connected to the electrodes of the flexible circuit board has multiple control regions, each control region being insulated from the others. The flexible circuit board has multiple electrodes, and each control region is electrically connected to one of the electrodes. The control regions correspond one-to-one with the electrodes. The spacing direction of the multiple wire-threading notches arranged sequentially is consistent with the direction of the multiple control areas arranged sequentially. Among the multiple wire-threading notches located between two adjacent electrodes, the one closest to the electrode is a turning notch, and the others are fixed notches. In the fixed notch, the circuit board substrate passes from the side where the conductive layer is provided to the other side. In the turning notch, the circuit board substrate passes from the other side to the side where the conductive layer is provided.

2. The photoelectric functional film according to claim 1, characterized in that, The outer expansion includes insulating components.

3. The photoelectric functional film according to claim 1, characterized in that, The width of the fixed notch is greater than the width of the turning notch.

4. The photoelectric functional film according to claim 3, characterized in that, The width of the fixed notch is 2mm to 5mm, and the width of the turning notch is no more than 2mm.

5. The photoelectric functional film according to claim 1, characterized in that, The distance between two fixed notches located between two adjacent electrodes and adjacent to each other is 50mm to 250mm, and the distance between the turning notch and the nearest electrode is 15mm to 75mm.

6. The photoelectric functional film according to claim 1, characterized in that, The plurality of said control regions are separated by dividing lines provided on the conductive layer, and at least one of said fixed notches located between two adjacent said electrodes is arranged on the extension line of the dividing line; The edge of the conductive layer is provided with a silver paste layer for hot pressing and electrical connection of the electrode. The fixed notch located on the extension line of the dividing line extends into the silver paste layer, and the silver paste layers corresponding to different control regions are separated by the fixed notch.

7. The photoelectric functional film according to claim 1, characterized in that, Multiple electrodes are arranged sequentially at intervals along the long side of the circuit board substrate. Multiple conductive lines are disposed in the circuit board substrate. Each conductive line is electrically connected to one of the electrodes. Each conductive line runs along the length direction of the circuit board substrate. The conductive lines are arranged at intervals along the width direction of the circuit board substrate. Each of the aforementioned wire-passing notches is arranged sequentially at intervals along the length of the circuit board substrate.

8. The photoelectric functional film according to claim 1, characterized in that, Each electrode electrically connected to the control region is a partition electrode. The flexible circuit board also has a common electrode. The conductive layer is provided on both sides of the functional layer. The conductive layer on one side of the functional layer has multiple control regions. Each partition electrode is connected to each control region in a one-to-one correspondence. The common electrode is connected to the conductive layer on the other side of the functional layer.

9. The photoelectric functional film according to claim 8, characterized in that, The photoelectric functional film includes two substrate bodies, which are respectively stacked on both sides of the functional layer, and the conductive layer is provided on both substrate bodies; The conductive layer disposed on the substrate body having the extended portion has a plurality of control regions. The conductive layer is located on the side of the substrate body facing the functional layer and is in direct contact with the functional layer.

10. The photoelectric functional film according to any one of claims 1 to 9, characterized in that, The photoelectric functional film also includes an edge-sealing adhesive, which is disposed on the outer peripheral surface of the functional layer.

11. The photoelectric functional film according to any one of claims 1 to 9, characterized in that, The outer expansion portion includes a PET component, a PC component, or a PVC component; And / or, the circuit board substrate includes a PI substrate or a PE substrate; And / or, the circuit board substrate is bonded or snapped to the outward expansion portion.

12. A photoelectric functional film, characterized in that, include: A functional layer that can exhibit different states when its external electric field changes; At least one conductive substrate is stacked with the functional layer. Each conductive substrate includes a substrate body and a conductive layer disposed on the substrate body facing the functional layer or on the surface away from the functional layer. The at least one conductive layer is divided into a conductive region and an epitaxial region that are insulated from each other. The conductive region is located between the functional layer and the corresponding substrate body. The epitaxial region extends outside the functional layer. The portion of the substrate body covered by the epitaxial region and the epitaxial region together constitute an extension portion. A flexible circuit board, wherein the electrodes of the flexible circuit board are electrically connected to at least one region of the conductive layer facing the functional layer, and the circuit board substrate of the flexible circuit board is limited on the outward expansion portion; Wherein, the direction in which the outward expansion extends outward from the conductive layer is the width direction of the outward expansion, the width direction of the circuit board substrate is consistent with the width direction of the outward expansion, and the width of the outward expansion is not less than 1 / 3 of the width of the circuit board substrate; The electrodes of the flexible circuit board are electrically connected to the conductive area, and the conductive area and the extended area belonging to the outer expansion portion belong to the same conductive layer. The outer expansion portion is provided with multiple wire-passing notches. Each wire-passing notch penetrates the substrate body and the extended area of ​​the conductive layer along the thickness direction of the conductive substrate. The circuit board substrate passes through each wire-passing notch in sequence and is arranged on the outer expansion portion in a wavy path. The conductive layer electrically connected to the electrodes of the flexible circuit board has multiple control regions, each control region being insulated from the others. The flexible circuit board has multiple electrodes, and each control region is electrically connected to one of the electrodes. The control regions correspond one-to-one with the electrodes. The spacing direction of the multiple wire-threading notches arranged sequentially is consistent with the direction of the multiple control areas arranged sequentially. Among the multiple wire-threading notches located between two adjacent electrodes, the one closest to the electrode is a turning notch, and the others are fixed notches. In the fixed notch, the circuit board substrate passes from the side where the conductive layer is provided to the other side. In the turning notch, the circuit board substrate passes from the other side to the side where the conductive layer is provided.

13. A light-transmitting component, characterized in that, include: First light-transmitting plate; Second light-transmitting panel; According to any one of claims 1 to 12, the first light-transmitting plate and the second light-transmitting plate are stacked on both sides of the photoelectric functional film through an adhesive film, and the functional layer is a dimming layer.

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