Wafer ultrasonic double-side cleaning device

Abstract

The ultrasonic double-side cleaning device for wafer is characterized in that: the nozzle mounting plate of the cleaning mechanism is connected between the suction cover and the suction cavity; the driving member is connected to the suction cavity; the pneumatic slip ring passes through the center hole of the driving member; the tail of the ultrasonic nozzle is connected to the nozzle mounting plate; the head of the ultrasonic nozzle is located in the interior of the suction cover; the tail of the ultrasonic nozzle and the air inlet hole of the suction cavity are communicated through the hose; the air inlet hole of the suction cavity and the compressed air inlet of the pneumatic slip ring are communicated; the suction hole of the suction cavity and the negative pressure vacuum outlet of the pneumatic slip ring are communicated; the interior of the suction cover and the suction cavity are communicated through the through hole on the nozzle mounting plate; the ultrasonic nozzle cleans the surface of the wafer object in the wafer containing gap; the suction cover covers the surface of the wafer object in the wafer containing gap; the suction cover sucks the dust generated in the cleaning of the surface of the wafer object into the suction cavity. The application improves the cleaning range of the conventional dry ultrasonic nozzle and meets the cleaning precision requirement of the wafer.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of wafer cleaning, and particularly relates to an ultrasonic double-sided cleaning device for wafers. BACKGROUND

[0002] At present, the existing wafer cleaning methods mainly include the following two kinds:

[0003] The first kind is to reduce the cleaning precision requirement and adopt dry ultrasonic cleaning. The existing dry ultrasonic cleaning head has straight-line type cleaning gas spout seams, which can effectively clean the particles of 1.6 um and above, but cannot effectively clean the particles below 1.6 um. The conventional cleaning precision of the panel industry is 1.6 um, but the wafer of the semiconductor industry requires 0.1 um cleaning precision, and the existing dry ultrasonic cleaning head cannot meet the cleaning requirement of the wafer.

[0004] The second kind is to adopt wet cleaning. This kind of cleaning method can effectively clean the particles with a diameter of 0.1-1.6 um, but this cleaning method needs a large amount of pure water, chemical solvents, drying and cooling devices, and subsequent waste water treatment, etc., and needs more equipment and consumable expenditure, and has high cost and large occupation.

[0005] In summary, a new wafer cleaning technology is needed. SUMMARY

[0006] Therefore, the application provides an ultrasonic double-sided cleaning device for wafers, which solves the problem that the conventional technology cannot effectively clean the wafer at low cost and without pollution.

[0007] In order to achieve the above purpose, the application provides the following technical scheme: an ultrasonic double-sided cleaning device for wafers, comprising cleaning mechanisms arranged symmetrically upward and downward, and a wafer containing gap formed between the symmetrically upward and downward arranged cleaning mechanisms;

[0008] The cleaning mechanism comprises an air suction cover, a spray head mounting plate, an air suction cavity, a driving piece, a pneumatic slip ring and an ultrasonic spray head. The spray head mounting plate is connected between the air suction cover and the air suction cavity, the driving piece is connected to the air suction cavity, the pneumatic slip ring passes through the center hole of the driving piece, the tail of the ultrasonic spray head is connected to the spray head mounting plate, and the head of the ultrasonic spray head is located in the interior of the air suction cover.

[0009] The tail of the ultrasonic spray head and the air inlet hole of the air suction cavity are communicated through a hose, the air inlet hole of the air suction cavity and the compressed air inlet of the pneumatic slip ring are communicated, and the air suction hole of the air suction cavity and the negative pressure vacuum outlet of the pneumatic slip ring are communicated. The interior region of the air suction cover is communicated with the air suction cavity through the through hole on the spray head mounting plate.

[0010] The ultrasonic nozzle cleans the wafer object surface in the wafer accommodating gap, the air suction cover covers the wafer object surface in the wafer accommodating gap, and the air suction cover sucks the dust generated by cleaning the wafer object surface into the air suction cavity.

[0011] As a preferred solution of the ultrasonic double-sided cleaning device for wafers, the ultrasonic nozzle is provided with two rows on the nozzle mounting plate, and the two rows of ultrasonic nozzles are distributed in staggered positions.

[0012] The number of the first row of ultrasonic nozzles and the second row of ultrasonic nozzles is different by one.

[0013] The trajectories of the two rows of ultrasonic nozzles when rotating cover the entire surface of the wafer object.

[0014] As a preferred solution of the ultrasonic double-sided cleaning device for wafers, the through holes on the nozzle mounting plate are distributed on the outside of the ultrasonic nozzles, and the through holes are arranged in a ring shape at the edge of the nozzle mounting plate.

[0015] As a preferred solution of the ultrasonic double-sided cleaning device for wafers, a dust passage is formed between the ultrasonic nozzle and the inner wall of the air suction cover, and the dust generated by cleaning the wafer object surface is sequentially sucked into the air suction cavity through the dust passage and the through hole.

[0016] As a preferred solution of the ultrasonic double-sided cleaning device for wafers, the ultrasonic nozzle includes a lock nut, an adapter rod, a nozzle core, and a nozzle shell; the lock nut is connected to the adapter rod, the adapter rod is connected to the nozzle shell, the nozzle core is inside the nozzle shell, and the end of the nozzle core is connected to the adapter rod.

[0017] A ring-shaped circular air outlet slot is formed between the nozzle core and the inner wall of the nozzle shell.

[0018] As a preferred solution of the ultrasonic double-sided cleaning device for wafers, a main air flow hole is formed in the center of the adapter rod, a flow dispersion hole is formed in the inside of the nozzle core, the main air flow hole is connected to the flow dispersion hole, the flow dispersion hole is connected to the circular air outlet slot, and the circular air outlet slot sprays cleaning gas from the head of the nozzle core and the nozzle shell to the wafer object surface.

[0019] As a preferred solution of the ultrasonic double-sided cleaning device for wafers, the adapter rod of the ultrasonic nozzle is connected to the nozzle mounting plate, and the lock nut locks the ultrasonic nozzle on the nozzle mounting plate.

[0020] As a preferred solution of the ultrasonic double-sided cleaning device for wafers, the air inlet holes of the air suction cavity are arranged in a ring shape around the air suction holes of the air suction cavity.

[0021] As the preferred solution of the ultrasonic double-side cleaning device for wafers, the wafer object in the wafer accommodating gap is arranged with a wafer clamp.

[0022] As the preferred solution of the ultrasonic double-side cleaning device for wafers, the dust sucked into the suction cavity is put into the negative pressure vacuum outlet through the pneumatic slip ring for recycling.

[0023] The present application has the following advantages: the cleaning mechanism arranged symmetrically upwards and downwards is provided, and the wafer accommodating gap is formed between the cleaning mechanisms arranged symmetrically upwards and downwards; the cleaning mechanism comprises a suction cover, a spray head mounting plate, a suction cavity, a driving member, a pneumatic slip ring and an ultrasonic spray head; the spray head mounting plate is connected between the suction cover and the suction cavity, the driving member is connected to the suction cavity, the pneumatic slip ring passes through the center hole of the driving member, the tail of the ultrasonic spray head is connected to the spray head mounting plate, and the head of the ultrasonic spray head is located in the interior of the suction cover; the tail of the ultrasonic spray head and the air inlet hole of the suction cavity are communicated through a hose, the air inlet hole of the suction cavity and the compressed air inlet of the pneumatic slip ring are communicated, and the suction hole of the suction cavity and the negative pressure vacuum outlet of the pneumatic slip ring are communicated; the interior region of the suction cover is communicated with the suction cavity through the through hole on the spray head mounting plate; the ultrasonic spray head cleans the surface of the wafer object in the wafer accommodating gap, the suction cover covers the surface of the wafer object in the wafer accommodating gap, and the suction cover sucks the dust generated by cleaning the surface of the wafer object into the suction cavity. The present application improves the cleaning range of the conventional dry ultrasonic cleaning head, so that the dry ultrasonic cleaning machine is applicable to cleaning the dust from 1.6 um to 0.1 um, meets the cleaning precision requirement of the wafers in the semiconductor industry, and makes the wafers in the semiconductor industry not need to use wet cleaning, thereby saving a large amount of equipment and consumable expenditure; the gas carrying dust particles after cleaning can be sucked and recycled, so that environmental pollution caused by the escape of the gas into the environment is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only exemplary, and for those skilled in the art, other drawings can be obtained from the provided drawings without creative labor.

[0025] Figure 1 The structure schematic diagram of the ultrasonic double-side cleaning device for wafers provided in the embodiments of the present application is shown in the figure.

[0026] Figure 2 The exploded schematic diagram of the ultrasonic double-side cleaning device for wafers provided in the embodiments of the present application is shown in the figure.

[0027] Figure 3A single cleaning mechanism exploded view of the ultrasonic double-sided cleaning device for wafers provided in the embodiments of the present application;

[0028] Figure 4 A single cleaning mechanism cross-sectional view of the ultrasonic double-sided cleaning device for wafers provided in the embodiments of the present application;

[0029] Figure 5 An ultrasonic nozzle structure view of the ultrasonic double-sided cleaning device for wafers provided in the embodiments of the present application.

[0030] In the figure, 1, cleaning mechanism; 2, wafer containing gap; 3, suction cover; 4, nozzle mounting plate; 5, suction cavity; 6, driving piece; 7, pneumatic slip ring; 8, ultrasonic nozzle; 9, air inlet hole; 10, hose; 11, compressed air inlet; 12, negative pressure vacuum outlet; 13, through hole; 14, wafer object; 15, dust channel; 16, lock nut; 17, adapter rod; 18, nozzle core; 19, nozzle shell; 20, circular air outlet slot; 21, air flow main hole; 22, air flow dispersion hole; 23, suction hole; 24, wafer clamp. DETAILED DESCRIPTION

[0031] The embodiments of the present application will be described in detail by specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. Obviously, the described embodiments are part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0032] In the related art, the cleaning principle of ordinary air knife cleaning is mainly to use compressed air to blow off the dust on the surface of the workpiece. After the compressed air acts on the surface of the workpiece, it will flow at high speed to both sides. At this time, due to the high-speed flow of compressed air, a fluid layer will be formed at a short distance from the workpiece surface, and a protective film will be formed on the workpiece surface, which is not conducive to the cleaning of the dust in the fluid layer. The distance from the fluid layer to the workpiece surface is h, and the dust with a diameter greater than h is easily cleaned by the air knife, and the dust with a diameter less than h is not easily cleaned by the air knife. According to the laboratory measurement of the effective cleaning particle diameter of the air knife, the minimum effective cleaning particle diameter of the air knife is 75um.

[0033] In the related art, the cleaning principle of the dry ultrasonic cleaning is mainly to clean the workpiece surface by using compressed air and ultrasonic waves. After the compressed air reaches the workpiece surface, a fluid layer is formed. When the diameter of the dust is smaller than the distance from the fluid layer to the workpiece surface, the dust is not easy to be cleaned. At this time, the ultrasonic wave penetrates the fluid layer and directly acts on the workpiece surface, so that the dust on the workpiece surface is vibrated and separated from the workpiece surface, and then cleaned by the compressed air. According to the measurement of the effective cleaning particle diameter of the dry ultrasonic cleaning head in the laboratory, the minimum effective cleaning particle diameter of the conventional dry ultrasonic cleaning head is 1.6 um.

[0034] The existing dry ultrasonic cleaning head has a straight-line type cleaning gas ejection slot, which can effectively clean particles of 1.6 um and above, but cannot effectively clean particles below 1.6 um. The conventional cleaning precision of the panel industry is 1.6 um, but the wafer in the semiconductor industry requires a cleaning precision of 0.1 um. The existing dry ultrasonic cleaning head cannot meet the cleaning requirements of the wafer. The cleaning precision of wet cleaning can reach 0.1 um, but this cleaning method requires a large amount of pure water, chemical solvents, drying and cooling devices, and subsequent wastewater treatment, etc., which requires more equipment and consumable expenditure, and has high cost and inconvenience.

[0035] Therefore, the embodiment of the present application provides an ultrasonic double-sided cleaning device for wafers, which can perform dry ultrasonic cleaning on the surface of the wafer, two dry ultrasonic cleaning heads are combined and installed, and the upper and lower surfaces of the wafer can be cleaned by dry ultrasonic cleaning at one time. The device can effectively clean particles above 0.1 um, and the cleaned gas can be recycled, so that the particles will not escape into the environment and pollute the cleaning environment. The specific content of the embodiment of the present application is as follows.

[0036] Referring to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , the embodiment of the present application provides an ultrasonic double-sided cleaning device for wafers, which includes cleaning mechanisms 1 arranged symmetrically upward and downward, a wafer containing gap 2 formed between the upward and downward symmetrically arranged cleaning mechanisms 1, and a wafer object 14 in the wafer containing gap 2, which is provided with a wafer clamp 24;

[0037] The cleaning mechanism 1 includes an air suction cover 3, a nozzle mounting plate 4, an air suction cavity 5, a driving member 6, a pneumatic slip ring 7, and an ultrasonic nozzle 8. The nozzle mounting plate 4 is connected between the air suction cover 3 and the air suction cavity 5, the driving member 6 is connected to the air suction cavity 5, the pneumatic slip ring 7 passes through the center hole of the driving member 6, the tail of the ultrasonic nozzle 8 is connected to the nozzle mounting plate 4, and the head of the ultrasonic nozzle 8 is located inside the air suction cover 3;

[0038] The tail of the ultrasonic nozzle 8 and the air inlet hole 9 of the air suction cavity 5 are connected through the hose 10, the air inlet hole 9 of the air suction cavity 5 and the compressed air inlet 11 of the air slide ring 7 are connected, and the air suction hole 23 of the air suction cavity 5 and the negative pressure vacuum outlet 12 of the air slide ring 7 are connected; the inner region of the air suction cover 3 is connected with the air suction cavity 5 through the through hole 13 on the nozzle mounting plate 4;

[0039] The ultrasonic nozzle 8 is used for cleaning the surface of the wafer object 14 in the wafer containing gap 2, the air suction cover 3 covers the surface of the wafer object 14 in the wafer containing gap 2, and the air suction cover 3 sucks the dust generated by cleaning the surface of the wafer object 14 into the air suction cavity 5.

[0040] In the embodiment, the driving member 6 is preferably a torque motor, which drives the cleaning head mechanism to rotate around the center of the wafer object 14. The driving member 6 can also be used in other ways to make the cleaning mechanism 1 rotate around the wafer object 14. For example, a hollow rotating platform is driven by a servo motor, or a vortex worm structure is driven by other motors.

[0041] In the embodiment, the ultrasonic nozzle 8 is provided with two rows on the nozzle mounting plate 4, and the two rows of ultrasonic nozzles 8 are distributed in staggered positions. The number of the first row of ultrasonic nozzles 8 and the second row of ultrasonic nozzles 8 is different by one. The trajectories of the two rows of ultrasonic nozzles 8 when rotating cover the entire surface of the wafer object 14.

[0042] Specifically, since the wafer itself is disc-shaped, in order to achieve full coverage cleaning of the wafer surface, the ultrasonic nozzle 8 is configured with two rows, and the two rows of ultrasonic nozzles 8 are distributed in staggered positions and differ in number by one. This can ensure that when the driving member 6 drives the entire nozzle mounting plate 4 and the ultrasonic nozzle 8 to rotate, the ultrasonic nozzle 8 covers the wafer surface to achieve omnidirectional and thorough cleaning.

[0043] The rotation of each ultrasonic nozzle 8 can clean the annular region of the wafer object 14, and multiple ultrasonic nozzles 8 can form a large circular cleaning range.

[0044] In the embodiment, the through holes 13 on the nozzle mounting plate 4 are distributed on the outside of the ultrasonic nozzle 8, and the through holes 13 are arranged in a ring shape on the edge of the nozzle mounting plate 4. The dust channel 15 is formed between the ultrasonic nozzle 8 and the inner wall of the air suction cover 3. The dust generated by cleaning the surface of the wafer object 14 is sequentially sucked into the air suction cavity 5 through the dust channel 15 and the through hole 13. The dust sucked into the air suction cavity 5 is discharged through the air slide ring 7 and recovered through the negative pressure vacuum outlet 12.

[0045] Specifically, during the suction process of the suction hood 3, the airflow carrying dust enters the suction cavity 5 through the through hole 13, and is finally recycled from the negative pressure vacuum outlet 12 through the pneumatic slip ring 7, thereby realizing the dust recycling effect generated by the surface cleaning of the wafer object 14 and avoiding environmental pollution caused by escaping into the environment.

[0046] The suction cavity 5 can also be designed as a multi-chamber structure, and each ultrasonic nozzle 8 is installed in a separate chamber, which also achieves the recycling effect. The air inlet holes 9 of the suction cavity 5 are annularly distributed around the suction holes 23 of the suction cavity 5, and one air inlet hole 9 can be configured for each ultrasonic nozzle 8 to avoid interference between the hoses 10.

[0047] Auxiliary Figure 5 In this embodiment, the ultrasonic nozzle 8 includes a lock nut 16, an adapter rod 17, a nozzle core 18, and a nozzle shell 19. The lock nut 16 is connected to the adapter rod 17, the adapter rod 17 is connected to the nozzle shell 19, the nozzle core 18 is inside the nozzle shell 19, and the end of the nozzle core 18 is in communication with the adapter rod 17. An annular circular air outlet slot 20 is formed between the nozzle core 18 and the inner wall of the nozzle shell 19. A main airflow hole 21 is formed in the center of the adapter rod 17, and a airflow dispersion hole 22 is formed in the inside of the nozzle core 18. The main airflow hole 21 is in communication with the airflow dispersion hole 22, the airflow dispersion hole 22 is in communication with the circular air outlet slot 20, and the circular air outlet slot 20 sprays cleaning gas from the head of the nozzle core 18 and the nozzle shell 19 to the surface of the wafer object 14. The adapter rod 17 of the ultrasonic nozzle 8 is connected to the nozzle mounting plate 4, and the lock nut 16 locks the ultrasonic nozzle 8 to the nozzle mounting plate 4.

[0048] Specifically, compressed air enters the pneumatic slip ring 7, passes through the hose 10 in the suction cavity 5, enters the tail of the ultrasonic nozzle 8, passes through the cavity structure (also called ultrasonic generator) inside the ultrasonic nozzle 8, and generates high-frequency sound waves due to the cavity flow-induced oscillation principle. After the compressed air passes through the cavity structure inside the ultrasonic nozzle 8, it is sprayed from the circular air outlet slot 20, and finally the compressed air and the ultrasonic waves are sprayed together from the circular air outlet slot 20 to the wafer object 14. Under the combined action of compressed gas and ultrasonic waves, small dust particles on the surface of the wafer object 14 can be cleaned. The cleaned gas and dust particles enter the suction cavity 5 through the through hole 13 structure around the nozzle mounting plate 4 due to the negative pressure environment inside the suction hood 3, and are finally recycled from the negative pressure vacuum outlet 12 through the pneumatic slip ring 7.

[0049] The circular air outlet slot 20 can make the sprayed ultrasonic waves form focusing effect, improve the oscillation of the ultrasonic waves on the micro dust inside the circumference, and make smaller micro dust oscillate away from the surface of the wafer object 14. Compared with the conventional dry ultrasonic cleaning head, the structure of the circular air outlet slot 20 can suck away part of the gas inside the circumference due to the high-speed flow of the cleaning gas to the outside of the circumference, form a certain negative pressure area inside the circumference, and will not produce a fluid layer. The micro dust oscillated away from the surface of the wafer object 14 by the ultrasonic waves will also be sucked away due to the high-speed flow of the cleaning gas. According to the measurement of the effective cleaning particle diameter of the circular dry ultrasonic nozzle 8 in the laboratory, the effective cleaning particle diameter of the circular dry ultrasonic nozzle 8 is 0.1 um at least.

[0050] Referring to Table 1, the cleaning rates of the conventional dry ultrasonic cleaning head and the cleaning technology of the embodiment are compared by laboratory measurement.

[0051]

[0052] It can be seen that the technology of the embodiment of the present application improves the cleaning range of the conventional dry ultrasonic cleaning head, so that the dry ultrasonic cleaning machine is suitable for cleaning the range from 1.6 um micro dust to 0.1 um, which meets the cleaning precision requirements of the semiconductor industry wafer, so that the semiconductor industry wafer cleaning does not need to use wet cleaning any more, and a large amount of equipment and consumable expenditure is saved.

[0053] In summary, the application is provided with the cleaning mechanism 1 arranged symmetrically up and down, and the wafer accommodating gap 2 is formed between the cleaning mechanism 1 arranged symmetrically up and down; the cleaning mechanism 1 comprises the air suction cover 3, the spray head mounting plate 4, the air suction cavity 5, the driving piece 6, the pneumatic slip ring 7 and the ultrasonic spray head 8; the spray head mounting plate 4 is connected between the air suction cover 3 and the air suction cavity 5, the driving piece 6 is connected to the air suction cavity 5, the pneumatic slip ring 7 passes through the center hole of the driving piece 6, the tail of the ultrasonic spray head 8 is connected to the spray head mounting plate 4, and the head of the ultrasonic spray head 8 is in the inside of the air suction cover 3; the tail of the ultrasonic spray head 8 and the air inlet hole 9 of the air suction cavity 5 are communicated through the hose 10, the air inlet hole 9 of the air suction cavity 5 and the compressed air inlet 11 of the pneumatic slip ring 7 are communicated, the air suction hole 23 of the air suction cavity 5 and the negative pressure vacuum outlet 12 of the pneumatic slip ring 7 are communicated; the inside area of the air suction cover 3 is communicated with the air suction cavity 5 through the through hole 13 on the spray head mounting plate 4; the ultrasonic spray head 8 cleans the surface of the wafer object 14 in the wafer accommodating gap 2, the air suction cover 3 covers the surface of the wafer object 14 in the wafer accommodating gap 2, and the air suction cover 3 sucks the dust generated by cleaning the surface of the wafer object 14 into the air suction cavity 5. The compressed air enters the pneumatic slip ring 7, passes through the hose 10 in the air suction cavity 5, enters the tail of the ultrasonic spray head 8, passes through the cavity structure (also called ultrasonic generator) in the inside of the ultrasonic spray head 8, and generates high-frequency sound waves due to the cavity flow-induced oscillation principle. The compressed air is sprayed from the circular air outlet slot 20 after passing through the cavity structure in the inside of the ultrasonic spray head 8, and finally the compressed air and the ultrasonic wave are sprayed from the circular air outlet slot 20 to the wafer object 14. Under the joint action of the compressed gas and the ultrasonic wave, the small dust particles on the surface of the wafer object 14 can be cleaned. The cleaned gas and dust particles enter the air suction cavity 5 through the through hole 13 structure around the spray head mounting plate 4 due to the negative pressure environment in the inside of the air suction cover 3, and are finally recycled from the negative pressure vacuum outlet 12 through the pneumatic slip ring 7. The design of the circular air outlet slot 20 can make the sprayed ultrasonic wave form a focusing effect, improve the oscillation of the ultrasonic wave to the dust inside the circle, and make smaller dust oscillate away from the surface of the wafer object 14. Compared with the conventional dry ultrasonic cleaning head, the structure of the circular air outlet slot 20 can suck away part of the gas inside the circle due to the high-speed flow of the cleaning gas to the outside of the circle, so that a certain negative pressure area is formed inside the circle and no fluid layer is generated. The dust oscillated away from the surface of the wafer object 14 by the ultrasonic wave will also be sucked away due to the high-speed flow of the cleaning gas. According to the measurement of the effective cleaning particle diameter of the circular dry ultrasonic spray head 8 in the laboratory, the minimum effective cleaning particle diameter of the circular dry ultrasonic spray head 8 is 0.1 um. The application meets the cleaning precision requirements of the wafer in the semiconductor industry, so that the wet cleaning is not necessary for the wafer cleaning in the semiconductor industry, and a large amount of equipment and consumable expenditure is saved; the gas carrying dust particles after cleaning can be sucked and recycled, so that environmental pollution caused by the escape of the gas into the environment is avoided.

[0054] Although the present application has been described in detail with general description and specific embodiments above, it is obvious to those skilled in the art that some modifications or improvements can be made on the basis of the present application. Therefore, these modifications or improvements made on the basis of not deviating from the spirit of the present application, all belong to the scope of protection claimed by the present application.

Claims

1. An ultrasonic double-sided cleaning device for wafers, characterized in that: It comprises cleaning mechanisms (1) arranged symmetrically up and down, with a wafer accommodating gap (2) formed between the cleaning mechanisms (1) arranged symmetrically up and down; The cleaning mechanism (1) comprises an air suction hood (3), a nozzle mounting plate (4), an air suction chamber (5), a driving member (6), a pneumatic slip ring (7) and an ultrasonic nozzle (8); the nozzle mounting plate (4) is connected between the air suction hood (3) and the air suction chamber (5), the driving member (6) is connected to the air suction chamber (5), the pneumatic slip ring (7) passes through the center hole of the driving member (6), the tail of the ultrasonic nozzle (8) is connected to the nozzle mounting plate (4), and the head of the ultrasonic nozzle (8) is located inside the air suction hood (3); The tail of the ultrasonic nozzle (8) and the air inlet (9) of the air suction chamber (5) are communicated with each other via a hose (10); the air inlet (9) of the air suction chamber (5) is communicated with the compressed air inlet (11) of the pneumatic slip ring (7); the air suction hole (23) of the air suction chamber (5) is communicated with the negative pressure vacuum outlet (12) of the pneumatic slip ring (7); the inner area of ​​the air suction hood (3) is communicated with the air suction chamber (5) via a through hole (13) on the nozzle mounting plate (4); The ultrasonic nozzle (8) cleans the surface of the wafer object (14) in the wafer accommodating gap (2), the suction hood (3) covers the surface of the wafer object (14) in the wafer accommodating gap (2), and the suction hood (3) sucks dust generated by cleaning the surface of the wafer object (14) into the suction cavity (5); The ultrasonic nozzles (8) are arranged in two rows on the nozzle mounting plate (4), and the ultrasonic nozzles (8) in the two rows are staggered. The number of the ultrasonic nozzles (8) in the first column and the number of the ultrasonic nozzles (8) in the second column differ by one; The trajectories of the two rows of ultrasonic nozzles (8) during rotation cover the entire surface of the wafer object (14); The ultrasonic nozzle (8) comprises a lock nut (16), a transfer rod (17), a nozzle core (18) and a nozzle shell (19); the lock nut (16) is connected to the transfer rod (17), the transfer rod (17) is connected to the nozzle shell (19), the nozzle core (18) is located inside the nozzle shell (19), and the end of the nozzle core (18) is connected to the transfer rod (17); An annular circular air outlet gap (20) is formed between the nozzle core (18) and the inner wall of the nozzle shell (19); A main airflow hole (21) is formed at the center of the transfer rod (17), and an airflow dispersion hole (22) is formed inside the nozzle core (18). The main airflow hole (21) is connected to the airflow dispersion hole (22), and the airflow dispersion hole (22) is connected to the circular air outlet slit (20). The circular air outlet slit (20) sprays the cleaning gas from the nozzle core (18) and the head of the nozzle shell (19) to the surface of the wafer object (14).

2. The ultrasonic double-sided cleaning device for wafers according to claim 1, characterized in that: The through holes (13) on the nozzle mounting plate (4) are distributed outside the ultrasonic nozzle (8), and the through holes (13) are arranged in a ring shape at the edge of the nozzle mounting plate (4).

3. The ultrasonic double-sided cleaning device for wafers according to claim 2, characterized in that: A dust passage (15) is formed between the ultrasonic nozzle (8) and the inner wall of the suction hood (3), and the suction hood (3) sucks the dust generated by cleaning the surface of the wafer object (14) into the suction cavity (5) through the dust passage (15) and the through hole (13) in sequence.

4. The ultrasonic double-sided cleaning device for wafers according to claim 1, characterized in that: The transfer rod (17) of the ultrasonic nozzle (8) is connected to the nozzle mounting plate (4), and the lock nut (16) locks the ultrasonic nozzle (8) on the nozzle mounting plate (4).

5. The ultrasonic double-sided cleaning device for wafers according to claim 1, characterized in that: The air inlet holes (9) of the air suction cavity (5) are distributed in a ring shape around the air suction hole (23) of the air suction cavity (5).

6. The ultrasonic double-sided cleaning device for wafers according to claim 1, characterized in that: The wafer object (14) in the wafer receiving gap (2) is configured with a wafer clamp (24).

7. The ultrasonic double-side cleaning device for wafers according to claim 1, characterized in that: The dust sucked into the air suction chamber (5) is put into the negative pressure vacuum outlet (12) through the pneumatic slip ring (7) for recovery.

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